WO2015162010A1 - Circuit de détection connecté sur une grille de connexion par l'intermédiaire d'une carte de circuits imprimés - Google Patents

Circuit de détection connecté sur une grille de connexion par l'intermédiaire d'une carte de circuits imprimés Download PDF

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Publication number
WO2015162010A1
WO2015162010A1 PCT/EP2015/057660 EP2015057660W WO2015162010A1 WO 2015162010 A1 WO2015162010 A1 WO 2015162010A1 EP 2015057660 W EP2015057660 W EP 2015057660W WO 2015162010 A1 WO2015162010 A1 WO 2015162010A1
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WO
WIPO (PCT)
Prior art keywords
sensor
wiring
wiring substrate
sensor circuit
circuit
Prior art date
Application number
PCT/EP2015/057660
Other languages
German (de)
English (en)
Inventor
Michael SCHULMEISTER
Stefan GÜNTHNER
Roland Burghardt
Jakob Schillinger
Karl-Friedrich Becker
Harald PÖTTER
Tina Thomas
Original Assignee
Continental Teves Ag & Co. Ohg
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves Ag & Co. Ohg, Continental Automotive Gmbh filed Critical Continental Teves Ag & Co. Ohg
Publication of WO2015162010A1 publication Critical patent/WO2015162010A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device
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Definitions

  • the invention relates to a method for producing a sensor and the sensor.
  • a sensor with an encapsulated sensor circuit is known, which is held on a substrate in the form of a printed circuit board with an electrical circuit and connected via bond wires to the electrical circuit.
  • a method for producing a sensor that is configured to measure a physi ⁇ cal size based on a dependent of the physical size encoder field, the steps interconnecting a sensor circuit for detecting the encoder field and for outputting a dependent of the encoder field Sensor signal on a first wiring substrate, interconnecting the first wiring substrate on a second wiring substrate and encapsulating the second wiring substrate and the first Ver ⁇ carried wiring carrier with the sensor circuit in a protective ground.
  • the procedure given is based on the consideration that the encapsulation in the protection measures necessary to protect the Sen ⁇ sorscrien from external influences, weathering phenomena can cause to the sensor circuit, which in turn affect the functioning of the sensor circuit. This limits the life of the sensor circuit, which affects the maintenance of the systems, such as vehicles, in which the sensor is used with the sensor circuit. ⁇
  • a very high packing density of the sensor circuit is achieved using a printed circuit board compared to other wiring substrates, such as the leadframe, and the wiring of the sensor circuit can be flexibly adapted to the intended use with further components such as passive components, further integrated circuits and / or other electronic components become.
  • the sensor circuit In order to obtain this high packing density and flexibility, it is proposed within the scope of the specified method to design the sensor circuit on a first wiring carrier which should allow both properties, ie high packing density and high flexibility in the wiring, as far as possible.
  • This first wiring carrier is then connected to a second wiring carrier whose properties can be adapted to the mechanical stresses in the encapsulation in the protective ground.
  • the two wiring carriers can be decoupled from one another, so that on the one hand a space-saving, flexible sensor can be realized, which nevertheless can be encapsulated with cost-effective standard processes in the protective compound.
  • the first wiring carrier is preferably one mentioned above
  • a leadframe can be selected, which is mechanically extremely robust and thus can be clamped in the context of a standard process for encapsulating the sensor in the protective mass in a tool for holding the sensor during Verkapseins.
  • Such electronic components may be, for example, antennas or Abschmirmbleche.
  • the interface for outputting the sensor signal and / or further signals can also be formed on the leadframe.
  • This interface can be, for example, a plug to which a data cable can be connected.
  • the data cable could be connected to the interface also fixed, for example, by soldering, gluing or jamming.
  • the specified method comprises the step of enveloping at least a part of the sensor circuit in a mechanical decoupling material, before wrapping in a protective compound. This decoupling mass decouples the sensor circuit from the protective ground in which the sensor circuit is encapsulated, mechanically, so that the protective ground can not falsify the measurement results obtained with the sensor circuit.
  • the mechanical decoupling material is rheologically thixotropic, whereby the mechanical decoupling material can be applied in a simple manner to the first wiring substrate and the sensor circuit can be encapsulated without the mechanical decoupling material running away or flowing away during the production of the sensor.
  • the entire sensor can finally be encased in a further protective mass, which can also be adjusted so that it keeps cherriesausdehungs- and other on the sensor circuit mechanical stresses causing effects of the entire sensor.
  • a sensor for measuring a physical quantity based on a physical size-dependent encoder field, a sensor circuit for detecting the encoder field and outputting a sensor field-dependent sensor signal, a first wiring substrate, on which the sensor circuit is connected, a second wiring substrate on which the first wiring substrate is connected to the sensor circuit and a protective ground in which the sensor circuit, the first wiring substrate and the second wiring substrate are encapsulated.
  • the mentioned sensor can be preferably produced by a given method at ⁇ .
  • the indicated sensor may be for example a wheel speed sensor, an inertial sensor, an airbag acceleration sensor.
  • Such sensors are used, for example, to detect the feedback variables in vehicle control systems, such as in the airbag, in the chassis control, in the electronic stability program, ESP, in roll-over detection, in front and side impact detection.
  • a vehicle comprises a specified sensor, in particular for the detection of
  • Vehicle dynamics data such as the lateral acceleration and the yaw rate of the vehicle.
  • 1 is a schematic view of a vehicle with a vehicle dynamics control
  • Fig. 2 is a schematic view of an inertial sensor of Fig. 1, and
  • FIG. 3 shows a schematic view of an inertial sensor from FIG. 1.
  • the same technical elements are provided with the same reference numerals and described only once.
  • FIG. 1 shows a schematic view of a vehicle 2 with a per se known vehicle dynamics control. Details of this driving dynamics control can be found for example in DE 10 2011 080 789 AI.
  • the vehicle 2 comprises a chassis 4 and four wheels 6. Each wheel 6 can be slowed down relative to the chassis 4 via a brake 8 fastened fixedly to the chassis 4 in order to slow down a movement of the vehicle 2 on a road (not shown).
  • the Fahrdynamilves 16 of the vehicle 2 detects from which, for example, a pitch rate, a roll rate, a yaw rate, a lateral acceleration, a Leksbeschleu ⁇ nist and / or a vertical acceleration can be output in a manner known to those skilled in the art.
  • a controller 18 can determine in a manner known to those skilled, whether the vehicle 2 slips on the road or even deviates from the above-mentioned predetermined trajectory and respond with a known controller output signal 20 to respond.
  • the regulator output signal 20 can then be used by an actuator 22 to control actuators 24, such as the brakes 8, to respond to slippage and deviation from the given trajectory in a manner known per se by means of actuating signals.
  • the controller 18 may, for example, in a known per se
  • controller 18 and the actuator 22 as a common Control device formed and optionally be integrated into the aforementioned engine control.
  • the inertial sensor 14 is shown as an external device outside the controller 18. In such a case, one speaks of a trained as a satellite inertial sensor 14, which will be explained in more detail in the context of FIG. 3 later. In the context of FIG. 2, however, the inertial sensor 14 is embodied as an electronic component which can be integrated into a housing of the controller 18, for example.
  • the inertial sensor 14 comprises at least one microelectromechanical system 26, termed MEMS 26, as sensor.
  • MEMS 26 microelectromechanical system 26
  • two sensors are present, in a conventional manner dependent on the vehicle dynamics data 16, not further shown signal via bonding wires 28 to a signal evaluation circuit 30 in the form of an application-specific integrated circuit 30, ASIC 30 (English: application-specific integrated circuit). That is, the ASIC 30 generates the vehicle dynamics data 16 based on the received signals dependent on the vehicle dynamics data 16.
  • the MEMSs 26 and the ASIC 30 are supported on a board circuit board 32 as so-called bare dies and electrically contacted with various electrical leads 34 formed on the board circuit board 32.
  • the above-mentioned bonding wires 28 can be used throughout for electrical connection to the lines.
  • the mechanical fixation and at least part of the electrical connection to the lines 34 Of the lines 34, only a single line 34 can be seen in section in FIG.
  • the contacting can be done directly, for example via a known flip-chip connection or, as shown in Fig. 2, via a bonding wire 28.
  • the MEMSs 26 and ASIC 30 may also be enveloped by a mechanical decoupling material 36, which in turn may be encapsulated together with the MEMSs 26 and the ASIC 30 in a molding material 38, such as an epoxy 38.
  • the decoupling material 36 may be mechanical stresses, which can be be ⁇ dingt for example, by thermal expansion of the epoxy resin 38 kept away from the MEMSs 26, because this may affect the detection of the driving dynamics data sixteenth For a simple processing of the decoupling material 36 in the manufacture of the sensor 14, this can be adjusted rheologically thixotropic.
  • the injection molding material 38 could thus already serve alone as a housing of the inertial sensor 14 and the therein
  • PCB board 32 held on a leadframe 40 and electronically interconnected.
  • the interconnection can be done by gluing, soldering, welding and / or wire bonding.
  • the leadframe 40 thus contacts the board circuit board 32 and binds it electronically to an interface 42, via which the vehicle dynamics data 16 acquired with the inertial sensor 14 can be output to a higher processing level, such as the controller 18.
  • the sensor circuit 44 is interconnected from the MEMSs 26 and the ASIC 30 on one side of the board circuit board 32, on which the board circuit board 32 is connected to the leadframe 40.
  • the inertial sensor 14 is designed as a satellite and can be arranged independently of the controller 18 in the vehicle 2 at any point.
  • the interface 42 is enclosed on the leadframe 40 in a plug housing 48.
  • a not shown connector of a data cable can be positively received, which recorded the Vehicle dynamics data 16 to next higher processing level, in this case, the controller 18 passes.
  • the leadframe 40 optionally includes a shield plate 50, which could also be formed in the inertial sensor 14 of FIG. 2.
  • this shielding is particularly favorable, because it keeps away electromagnetic radiation from the sensor circuit 44, which can not be damped by another housing.
  • inertial sensor 14 is still housed in an additional protection mass 52, which protects the sensor from environmental ⁇ influences, such as weathering.
  • these additional components 54 can also be installed with the same advantage in the inertial sensor 14 of FIG. 2 designed as an electronic component.

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  • Geometry (AREA)
  • Gyroscopes (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)

Abstract

L'invention concerne un procédé permettant de produire un capteur (14), qui est mis au point pour mesurer une grandeur physique sur la base d'un champ de détection dépendant de la grandeur physique. Ledit procédé consiste à : - connecter un circuit de détection (44) destiné à détecter le champ de transmission et à émettre un signal de détection (16) dépendant du champ de détection sur un premier support de câblage (32) ; - connecter le premier support de câblage (32) sur un deuxième support de câblage (40) ; et - encapsuler dans une masse de protection (38) le deuxième support de câblage (40) et le premier support de câblage (32), porté sur ce dernier et comprenant le circuit de détection (44).
PCT/EP2015/057660 2014-04-24 2015-04-09 Circuit de détection connecté sur une grille de connexion par l'intermédiaire d'une carte de circuits imprimés WO2015162010A1 (fr)

Applications Claiming Priority (2)

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DE102014207758 2014-04-24
DE102014207758.3 2014-04-24

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WO2015162010A1 true WO2015162010A1 (fr) 2015-10-29

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DE (1) DE102015206299B4 (fr)
WO (1) WO2015162010A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017198573A1 (fr) * 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Procédé pour enrober une unité électrique et composant électrique

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020031672A1 (en) * 2000-09-04 2002-03-14 Shuji Eguchi Packaging structure and method for automotive components
US20040055783A1 (en) * 2002-09-03 2004-03-25 Hitachi, Ltd. Automotive electronic control unit
US20110205706A1 (en) * 2010-02-25 2011-08-25 Mitsubishi Electric Corporation Resin-sealed electronic control device and method of fabricating the same
DE102013202212A1 (de) * 2012-02-10 2013-08-14 Continental Teves Ag & Co. Ohg Zweistufig gemoldeter Sensor
US20140042568A1 (en) * 2012-08-10 2014-02-13 Kabushiki Kaisha Toshiba Nonvolatile semiconductor memory device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007060931A1 (de) 2006-12-21 2008-08-28 Continental Teves Ag & Co. Ohg Verkapselungsmodul, Verfahren zu dessen Herstellung und Verwendung
DE102011080789B4 (de) 2010-08-10 2022-11-10 Continental Automotive Technologies GmbH Verfahren und System zur Regelung der Fahrstabilität

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020031672A1 (en) * 2000-09-04 2002-03-14 Shuji Eguchi Packaging structure and method for automotive components
US20040055783A1 (en) * 2002-09-03 2004-03-25 Hitachi, Ltd. Automotive electronic control unit
US20110205706A1 (en) * 2010-02-25 2011-08-25 Mitsubishi Electric Corporation Resin-sealed electronic control device and method of fabricating the same
DE102013202212A1 (de) * 2012-02-10 2013-08-14 Continental Teves Ag & Co. Ohg Zweistufig gemoldeter Sensor
US20140042568A1 (en) * 2012-08-10 2014-02-13 Kabushiki Kaisha Toshiba Nonvolatile semiconductor memory device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017198573A1 (fr) * 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Procédé pour enrober une unité électrique et composant électrique

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DE102015206299B4 (de) 2023-08-31
DE102015206299A1 (de) 2015-10-29

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