WO2015161598A1

WO2015161598A1 - Heat-dissipation device

Info

Publication number: WO2015161598A1
Application number: PCT/CN2014/085064
Authority: WO
Inventors: 姚向卫
Original assignee: 中兴通讯股份有限公司
Priority date: 2014-04-21
Filing date: 2014-08-22
Publication date: 2015-10-29
Also published as: CN203934235U

Abstract

Disclosed is a heat-dissipation device comprising: an air flow acceleration device (12) and a flow-guide device (13). The flow-guide device (13) is provided above a chip (11), the flow-guide device (13) is provided with an air outlet (133) and air inlets (131, 132), and the air outlet (133) cooperates with the air inlets (131, 132) so that an air flow channel is formed above the chip (11). The air flow acceleration device (12) is provided between the chip (11) and the flow-guide device (13), and the air flow acceleration device (12) generates an accelerated air flow directly towards the air outlet (133), accelerating air flowing in the air flow channel. In the heat-dissipation device of the present invention, by means of the air flow channel formed above the chip (11), the air flow acceleration device (12) is used to increase the speed of air flowing in the air flow channel, thereby impelling accelerated flow of air above the chip (11), achieving the aim of rapid heat-dissipation for the chip (11), which can solve the problems of complex heat-dissipation structures for chips, poor effects, and relatively difficult application in the prior art.

Description

一种散热装置技术领域本实用新型涉及集成芯片领域，尤其涉及一种散热装置。背景技术目前芯片几乎应用在所有的终端中，但是芯片在工作过程中产生大量热量会导致终端发热，影响到终端内其他元件的工作；当热量在终端内部积累过多的情况下甚至会损坏终端和其他电子元件；所以如何对芯片进行散热的问题已经被芯片或者终端制造商越来越关注。现有技术中提出了在便携式设备中应用机械风扇，以达到辅助散热的目的；例如苹果公司正在研究如何在移动终端中设备风散来对芯片进行散热。该公司的一项发明名称为 "移动电子设备的冷却***" 的专利文件显示，可以利用马达来驱动风扇和报警器两个组件的平台。但是此***比较复杂，而且体积较大，手机应用比较困难。所以在芯片领域中急需一种结构简单，散热效果好的，能够被广泛应用的散热结构。实用新型内容本实用新型提供了一种散热装置，能够至少解决现有技术中芯片散热结构复杂、效果不佳、应用比较困难的问题。为解决上述技术问题，本实用新型实施例提供一种散热装置，包括：气流加速装置和导流装置；所述导流装置设置在芯片上方，所述导流装置设有出气口和进气口，所述出气口与所述进气口相配合在所述芯片上方形成气流通道；所述气流加速装置设置在所述芯片和所述导流装置之间，所述气流装置产生正对所述出气口方向的加速气流加速所述气流通道内的空气流动。进一步地，所述导流装置包括：导流罩，所述导流罩与所述芯片连接并罩在所述芯片的上方；所述导流罩的侧面设有进气口，所述导流罩的顶部设有出气口，所述气流加速装置位于所述导流罩内并产生正对所述出气口方向的加速气流。进一步地，所述导流罩的顶部设有一个出气口，所述腔室的顶部设有一个出气口；或者所述导流罩的顶部设有两个出气口，所述导流罩侧面设有至少一个进气口。进一步地，所述导流罩顶部的中心设有一出气口。进一步地，所述气流加速装置与所述芯片连接，接收所述芯片提供的电信号并根据所述电信号产生正对所述出气口方向的加速气流加速所述气流通道内的空气流动。进一步地，所述气流加速装置包括：能量转换元件和气流生成结构；所述能量元件将所述芯片提供的电信号的电能转换为机械能并利用所述机械能驱动所述气流生成结构输出至少一个加速气流，所述加速气流的数量小于等于所述出气口的数量。进一步地，所述能量转换元件包括：压电元件；所述压电元件一面与所述气流生成结构连接，另一面与所述气流生成结构连接，所述压电元件根据所述芯片传输的电信号产生机械谐振，并且利用机械谐振的机械能驱动所述气流生成结构输出至少一个加速气流。进一步地，所述气流生成结构包括：底部为隔膜的腔室，所述压电元件一面与所述芯片连接、另一面与所述隔膜的连接，所述腔室的顶部设有至少一个出口，一个所述出口对应一个所述出气口并且正对所述出气口，所述出口的数量小于等于所述出气口的数量；所述压电元件根据所述芯片传输的电信号产生机械谐振，并且带动所述隔膜一起振动使得从所述腔室的一个所述出口输出一个加速气流。进一步地，所述压电元件由压电陶瓷片和金属电极层组成，所述金属电极层设置在所述压电陶瓷片的一面上与所述芯片连接，所述压电陶瓷片的另一面与所述隔膜连接。进一步地，所述金属电极层与所述芯片焊接。本实用新型的有益效果是：本实用新型提供了一种散热装置，能够解决现有技术中芯片散热结构复杂、效果不佳、应用比较困难的问题。本实用新型的散热装置包括：气流加速装置和导流装置；所述导流装置设置在芯片上方，所述导流装置设有出气口和进气口，所述出气口与所述进气口相配合在所述芯片上方形成气流通道；所述气流加速装置设置在所述芯片和所述导流装置之间，所述气流装置产生正对所述出气口方向的加速气流加速所述气流通道内的空气流动；本实用新型的散热装置通过在芯片上方形成气流通道，然后使用气流加速装置使气流通道内的空气流动加快，从而促使芯片上方的气流加速流动达到给芯片快速散热的目的，与现有技术相比，本实用新型的散热装置结构简单，体积小，散热效果更佳，能够广泛地应用到移动终端中改善移动终端的发热问题。附图说明图 1为本实用新型实施例提供的第一种芯片散热***横截面的结构示意图；图 2为本实用新型实施例提供的第二种芯片散热***横截面的结构示意图；图 3为本实用新型实施例提供的第三种芯片散热***横截面的结构示意图；图 4为本实用新型实施例提供的第四种芯片散热***横截面的结构示意图；图 5为本实用新型实施例提供的第五种芯片散热***横截面的结构示意图；图 6为本实用新型实施例提供的第六种芯片散热***横截面的结构示意图。具体实施方式下面通过具体实施方式结合附图对本实用新型作进一步详细说明。本实施例提供了一种散热装置，包括：气流加速装置和导流装置；所述导流装置设置在芯片上方，所述导流装置设有出气口和进气口，所述出气口与所述进气口相配合在所述芯片上方形成气流通道；所述气流加速装置设置在所述芯片和所述导流装置之间，所述气流装置产生正对所述出气口方向的加速气流加速所述气流通道内的空气流动。本实施例散热的核心思想是：在芯片上方形成气流通道，加速芯片上方气流通道的气流流动从而达到给芯片快速散热的效果。与现有技术相比，本实施例的散热装置结构简单，体积小，散热效果更佳，能够广泛地应用到移动终端中改善移动终端的发热问题。优选地，本实施例中导流装置包括：导流罩，所述导流罩与所述芯片连接并罩在所述芯片的上方；所述导流罩的侧面设有进气口，所述导流罩的顶部设有出气口，所述气流加速装置位于所述导流罩内并产生正对所述出气口方向的加速气流。本实施例中导流罩上设置进气口和出气口的数量不受限制，可以视情况而定，例如可以在导流罩侧面设有 4个进气口，在导流罩顶部设有 2个出气口，或者在侧面设置 3个进气口，在顶部设置 3个出气口；本实施例中气流加速装置产生加速气流的数量是与出气口的数量相关联的，其小于等于出气口的数量，优选地，等于出气口的数 TECHNICAL FIELD The present invention relates to the field of integrated chips, and in particular, to a heat sink. BACKGROUND At present, a chip is used in almost all terminals, but a large amount of heat generated by a chip during operation may cause heat generation of the terminal, affecting the operation of other components in the terminal; and even damage the terminal when heat is accumulated excessively inside the terminal. And other electronic components; so the issue of how to heat the chip has been increasingly concerned by chip or terminal manufacturers. In the prior art, the application of a mechanical fan in a portable device is proposed to achieve the purpose of assisting heat dissipation; for example, Apple is studying how to dissipate heat from the device in the mobile terminal. A patent document entitled "The Cooling System for Mobile Electronic Devices" of the company shows that a motor can be used to drive the platform of the two components of the fan and the alarm. However, this system is more complicated and bulky, and mobile phone applications are more difficult. Therefore, in the field of chips, there is an urgent need for a heat dissipation structure that has a simple structure, a good heat dissipation effect, and can be widely applied. SUMMARY OF THE INVENTION The present invention provides a heat dissipating device that can at least solve the problems of the prior art chip heat dissipation structure being complicated, the effect is poor, and the application is difficult. In order to solve the above technical problem, an embodiment of the present invention provides a heat dissipation device, including: an airflow acceleration device and a flow guiding device; the flow guiding device is disposed above a chip, and the flow guiding device is provided with an air outlet and an air inlet The air outlet cooperates with the air inlet to form an air flow passage above the chip; the air flow acceleration device is disposed between the chip and the flow guiding device, and the air flow device generates the opposite The accelerated airflow in the direction of the air outlet accelerates the flow of air within the airflow passage. Further, the flow guiding device includes: a flow guiding cover connected to the chip and covering the chip; the side surface of the air guiding cover is provided with an air inlet, the guiding current The top of the cover is provided with an air outlet, and the air flow acceleration device is located in the air flow guide and generates an accelerated air flow in a direction opposite to the air outlet. Further, the top of the shroud is provided with an air outlet, and the top of the chamber is provided with an air outlet; Or the top of the shroud is provided with two air outlets, and the side of the air deflector is provided with at least one air inlet. Further, an air outlet is disposed at a center of the top of the shroud. Further, the airflow acceleration device is connected to the chip, receives an electrical signal provided by the chip, and generates an accelerated airflow in the direction of the air outlet to accelerate air flow in the airflow channel according to the electrical signal. Further, the airflow acceleration device includes: an energy conversion element and an airflow generation structure; the energy component converts electrical energy of the electrical signal provided by the chip into mechanical energy and uses the mechanical energy to drive the airflow generation structure to output at least one acceleration The airflow, the number of the accelerated airflow is less than or equal to the number of the air outlets. Further, the energy conversion element includes: a piezoelectric element; the piezoelectric element is connected to the airflow generating structure on one side, and the airflow generating structure is connected to the other side, and the piezoelectric element transmits electricity according to the chip. The signal produces a mechanical resonance and the mechanical energy generated by the mechanical resonance drives the airflow generating structure to output at least one accelerated airflow. Further, the airflow generating structure includes: a chamber having a diaphragm at the bottom, the piezoelectric element is connected to the chip on one side, and the diaphragm is connected to the other side, and at least one outlet is disposed at a top of the chamber. One of the outlets corresponds to one of the air outlets and is opposite to the air outlet, the number of the outlets being less than or equal to the number of the air outlets; the piezoelectric element generates mechanical resonance according to an electrical signal transmitted by the chip, and The diaphragm is caused to vibrate together to output an accelerated gas flow from one of the outlets of the chamber. Further, the piezoelectric element is composed of a piezoelectric ceramic sheet and a metal electrode layer, and the metal electrode layer is disposed on one side of the piezoelectric ceramic sheet and connected to the chip, and the other surface of the piezoelectric ceramic sheet Connected to the diaphragm. Further, the metal electrode layer is soldered to the chip. The utility model has the beneficial effects that the utility model provides a heat dissipating device, which can solve the problems that the heat dissipating structure of the chip in the prior art is complicated, the effect is poor, and the application is difficult. The heat dissipation device of the present invention comprises: an airflow acceleration device and a flow guiding device; the flow guiding device is disposed above the chip, the flow guiding device is provided with an air outlet and an air inlet, the air outlet and the air inlet Cooperating to form an air flow passage above the chip; the air flow acceleration device is disposed between the chip and the flow guiding device, and the air flow device generates an acceleration airflow in a direction of the air outlet to accelerate the airflow passage Air flow inside; the heat sink of the present invention forms an air flow passage above the chip, After that, the airflow accelerating device is used to accelerate the air flow in the airflow passage, thereby accelerating the flow of air above the chip to achieve rapid heat dissipation of the chip. Compared with the prior art, the heat dissipating device of the present invention has a simple structure, small volume, and heat dissipation. The effect is better, and can be widely applied to mobile terminals to improve the heating problem of the mobile terminal. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic structural view showing a cross section of a first chip heat dissipation system according to an embodiment of the present invention; FIG. 2 is a schematic structural view showing a cross section of a second chip heat dissipation system according to an embodiment of the present invention; FIG. 4 is a schematic structural view of a cross section of a fourth chip heat dissipation system according to an embodiment of the present invention; FIG. 5 is a schematic structural view of a fourth chip heat dissipation system according to an embodiment of the present invention; A schematic diagram of a cross section of a fifth chip heat dissipation system; FIG. 6 is a schematic structural view of a cross section of a sixth chip heat dissipation system according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be further described in detail below with reference to the accompanying drawings. The embodiment provides a heat dissipation device, including: an airflow acceleration device and a flow guiding device; the flow guiding device is disposed above the chip, and the flow guiding device is provided with an air outlet and an air inlet, and the air outlet and the air outlet The air inlet cooperates to form an air flow passage above the chip; the air flow acceleration device is disposed between the chip and the flow guiding device, and the air flow device generates an accelerated airflow acceleration in a direction opposite to the air outlet The air within the airflow passage flows. The core idea of heat dissipation in this embodiment is: forming an air flow channel above the chip to accelerate the airflow of the airflow channel above the chip to achieve rapid heat dissipation of the chip. Compared with the prior art, the heat dissipating device of the embodiment has the advantages of simple structure, small volume, better heat dissipation effect, and can be widely applied to the mobile terminal to improve the heat generation problem of the mobile terminal. Preferably, the flow guiding device in the embodiment includes: a flow guiding cover connected to the chip and covering the chip; the side surface of the air guiding cover is provided with an air inlet, The top of the shroud is provided with an air outlet, and the airflow accelerating device is located in the shroud and generates an accelerating airflow in a direction opposite to the air outlet. In this embodiment, the number of the air inlet and the air outlet on the air guiding cover is not limited, and may be determined according to the situation. For example, four air inlets may be provided on the side of the air guiding cover, and the top of the air guiding cover is provided with 2 The air outlets are provided with three air inlets on the side and three air outlets on the top; in this embodiment, the amount of the accelerated airflow generated by the airflow acceleration device is associated with the number of air outlets, which is less than or equal to the air outlet. Quantity, preferably, equal to the number of outlets

优选地，本实施例中所述导流罩的顶部设有一个出气口，所述腔室的顶部设有一个出气口；此时，气流加速装置产生一个加速气流或者所述导流罩的顶部设有两个出气口，所述导流罩侧面设有至少一个进气口；此时气流加速装置可以产生一个或者两个加速气流。优先地，本实施例中导流罩可以在其中心位置设置一出气口下面以芯片散热***详细介绍应用本实施例中散热装置的散热过程，下面所示图中的芯片散热***均是通过横截面来展示，下图中横截面均是从导流罩顶部中心线剖开的横截面，并且进气口与出气口在同一个横截面上：如图 1所示的芯片散热***，包括：芯片 11和散热装置，图中该散热装置由气流加速装置 12和导流罩 13构成，其中导流罩 13 的侧面设有两个进气口分别为进气口 131、进气口 132，顶部中心设有出气口 133，气流从分别从进气口 131和进气口 132 进入，由于出气口 133流出，进气口 131、 132与出气口 133配合形成芯片上方的气流通道，导流 13罩的底边固定在所述芯片 11的侧边上；气流加速装置 12产生一个正对出气口 133方向的加速气流，从而加速导流罩 13内部即芯片 11上方的气流流动，达到给芯片 11快速散热的效果。图 1中气流加速装置 12可以与芯片 11固定连接，也可以与导流罩 13固定连接。应当理解的是，本实施例不限于在导流罩相对的两个侧面设置进气口，还可以在一个侧面或者相邻两侧面或者四个侧面设置进气口，并且进气口与出气口不在同一个平面上。如图 2所示的芯片散热***，包括：芯片 21和散热装置，图中该散热装置由气流加速装置 22和导流罩 23构成，其中导流罩 23的侧面设有三个进气口分别为进气口 231、进气口 232、进气口 233，顶部设有出气口 234、 235 , 气流从分别从进气口 231、进气口 232、进气口 233进入，由于出气口 234、 235流出，进气口 231、 232、 233与出气口 234、 235配合形成芯片上方的气流通道；导流罩 23的底边固定在所述芯片 21的侧边上；气流加速装置 22分别产生两个正对出气口 234和出气口 235方向的加速气流，从而加速导流罩 23内部即芯片 21上方的气流流动，达到给芯片 21快速散热的效果。另外，在图 2中气流加速装置 22也可以产生一个加速气流，对应出气口 234或出气口 235，与图 1中气流加速装置加速气流流动的方式类似。如图 3所示的芯片散热***，包括：芯片 31和散热装置，图中该散热装置由气流加速装置 32和导流罩 33构成，其中导流罩 33 的侧面设有三个进气口分别为进气口 331、进气口 332、进气口 333，顶部中心设有出气口 334、位于顶部中心线上其他位置设有出气口 335和出气口 336，气流从分别从进气口 331、进气口 332、进气口 333 进入，由于出气口 334、 335、 336流出，进气口 331、 332、 333分别与出气口 334、 335、 336配合形成三个芯片上方的气流通道；导流罩 33的底边 330与芯片 31的侧边 310固定连接，导流罩 33恰好罩住整个芯片 31的上方；气流加速装置 32分别产生三个分别正对出气口 334、出气口 335、出气口 336方向的加速气流，从而加速导流罩 33内部即芯片 31上方的气流流动，达到给芯片 31快速散热的效果。图 3中气流加速装置 32可以固定在芯片 31上表面或者导流罩 33内侧。在本实施例中，优先地，所述气流加速装置与所述芯片连接，接收所述芯片提供的电信号并根据所述电信号产生正对所述出气口方向的加速气流加速所述气流通道内的空气流动。该气流加速装置利用电能产生加速气流。在本实施例中，气流加速装置可以由一个能量转换元件和气流生成结构构成，能量转换元件将芯片输出的电能转换为机械能，利用机械能驱动机械结构产生加速气流。如图 4所示，芯片散热***包括：芯片 41和散热装置，图中该散热装置由气流加速装置 42和导流罩 43构成，其中导流罩 43的侧面设有两个进气口分别为进气口 431、进气口 432，顶部中心设有出气口 433，气流从分别从进气口 431和进气口 432进入，由于出气口 433流出，进气口 431、 432与出气口 433配合形成芯片上方的气流通道；导流 43罩的底边固定在所述芯片 41的侧边上；气流加速装置 42由能转换元件 421和气流生成结构 422构成，能量转换元件 421与芯片 41电连接，气流生成结构 422与能转换元件 421连接；能量转换元件 421将所述芯片 41提供的电信号的电能转换为机械能并利用所述机械能驱动所述气流生成结构 422输出一个正对出气口 433方向的加速气流，从而加速导流罩 43内部即芯片 41上方的气流流动，达到给芯片 41快速散热的效果。优先地，本实施例中能量转换元件包括：压电元件；所述压电元件一面与所述气流生成结构连接，另一面与所述气流生成结构连接，所述压电元件根据所述芯片传输的电信号产生机械谐振，并且利用机械谐振的机械能驱动所述气流生成结构输出至少一个加速气流。在能量转换元件为压电元件的情况下，本实施例中气流生成结构可以包括：底部为隔膜的腔室，所述压电元件一面与所述芯片连接、另一面与所述隔膜的连接，所述腔室的顶部设有至少一个出口，一个所述出口对应一个所述出气口并且正对所述出气口，所述出口的数量小于等于所述出气口的数量；所述压电元件根据所述芯片传输的电信号产生机械谐振，并且带动所述隔膜一起振动使得从所述腔室的一个所述出口输出一个加速气流。如图 5所示，芯片散热***包括：芯片 51和散热装置，图中该散热装置由气流加速装置 52和导流罩 53构成，其中导流罩 53的侧面设有两个进气口分别为进气口 531、进气口 532，顶部中心设有出气口 533，气流从分别从进气口 531和进气口 532进入，由于出气口 533流出，进气口 531、 532与出气口 533配合形成芯片上方的气流通道；导流 53罩的底边固定在所述芯片 51的侧边上；气流加速装置 52由压电元件 521和腔室 522构成，压电元件 521的一面与芯片 51电连接，另一面与腔室 522的底部连接；腔室 522底部为隔膜 5220，顶部设有一个针对出气口 533的出口 5221 ; 压电元件 521 将所述芯片 51提供的电信号的电能转换自身的机械谐振，并带动腔室 522的隔膜 5220 一起振动使得从所述腔室 522的出口 5221输出一个加速气流，从而加速导流罩 53内部即芯片 51上方的气流流动，达到给芯片 51快速散热的效果。应当理解的是，在导流罩顶部设有多个出气口时，在腔室顶部可以对应设置多个出口，各个出口分别正对一个出气口，出口的数量可以小于或等于出气口的数量。优先地，本实施例中所述压电元件由压电陶瓷片和金属电极层组成，所述金属电极层设置在所述压电陶瓷片的一面上与所述芯片连接，所述压电陶瓷片的另一面与所述隔膜连接。如图 6所示，芯片散热***包括：芯片 61和散热装置，图中该散热装置由气流加速装置 62和导流罩 63构成，其中导流罩 63的侧面设有两个进气口分别为进气口 631、进气口 632，顶部中心设有出气口 633，气流从分别从进气口 631和进气口 632进入，由于出气口 633流出，进气口 631、 632与出气口 633配合形成芯片上方的气流通道；导流 63罩的底边固定在所述芯片 61的侧边上；气流加速装置 62由压电元件 621和腔室 622构成，压电元件 621由于压电陶瓷片 6210和金属电极层 6211构成，所述金属电极层 6211设置所述压电陶瓷片 6210的一面上与所述芯片 61连接，所述压电陶瓷片的另一面与所述隔膜 6220连接；腔室 622底部为隔膜 6220，顶部设有一个针对出气口 633的出口 6221 ; 压电陶瓷片 6210通过金属电极层 6211接收所述芯片 61提供的电信号的电能转换自身的机械谐振，并带动腔室 622的隔膜 6220—起振动使得从所述腔室 622的出口 6221输出一个加速气流，从而加速导流罩 63内部即芯片 61上方的气流流动，达到给芯片 61快速散热的效果。在本实施例中，优先地，所述金属电极层与所述芯片焊接，可以焊在芯片的焊盘上；压电陶瓷片与隔膜粘接。本实施例中均是以导流罩为长方体导流罩为例来说明散热的过程的，应当理解的是本实施例中导流罩形状不受限制，其可以为本领域技术人员所熟知的罩体形状，例如正方体，或者半球形等等。其可以根据芯片的具体形状来制作。上述图 1-6均是在导流罩两个侧面分别设置一个进气口在顶面设置一个出气口，两个出气口和进气口在同一个平面上的横截面示意图，应当理解的是，本实施例中的散热装置中进气口和出气口的设置方式不仅限于上述的图 1-6的设置方式，例如可以在导流罩的一个侧面设置若干进气口，在顶部设置若干出气口，并且进气口和出气口不在同一个横截面上；或者在相邻的侧面设置进气口，进气口与出气口不在同一个横截面上。本实施例的散热装置可以利用压电元件的特性将芯片提供的信号转换为自身的机械谐振，并且通过与隔膜连接带动隔膜一起振动使得在腔室从其顶部出口不断地产生加速气流来加快气流流动，达到快速散热的效果。本实施例的散热装置具有结构简单，体积小等特点，可以广泛应用在智能终端中，改善智能发热的问题。 Preferably, in the embodiment, the top of the shroud is provided with an air outlet, and the top of the chamber is provided with an air outlet; at this time, the airflow acceleration device generates an acceleration airflow or the top of the airflow cover. There are two air outlets, and at least one air inlet is arranged on the side of the air deflector; at this time, the airflow acceleration device can generate one or two acceleration airflows. Preferably, in the embodiment, the shroud can be disposed under the air outlet at a central position thereof, and the heat dissipation process of the heat dissipating device in the embodiment is applied in detail in the chip heat dissipating system. The chip heat dissipating system in the following figure passes through the horizontal The cross section is shown in the following figure, the cross section is the cross section taken from the center line of the top of the shroud, and the air inlet and the air outlet are on the same cross section: The chip cooling system shown in Figure 1 includes: The chip 11 and the heat dissipating device are formed by the airflow accelerating device 12 and the shroud 13 in the figure, wherein the side of the shroud 13 is provided with two air inlets respectively, an air inlet 131 and an air inlet 132. The center is provided with an air outlet 133, and the airflow enters from the air inlet 131 and the air inlet 132 respectively. Since the air outlet 133 flows out, the air inlets 131, 132 and the air outlet 133 cooperate to form an air flow passage above the chip, and the air flow guide 13 The bottom edge is fixed on the side of the chip 11; the airflow accelerating device 12 generates an accelerating airflow in the direction of the air outlet 133, thereby accelerating the flow of air inside the shroud 13 or above the chip 11, To the effect of quickly dissipating heat to the chip 11. The airflow acceleration device 12 of FIG. 1 may be fixedly coupled to the chip 11, or may be fixedly coupled to the shroud 13. It should be understood that the embodiment is not limited to providing air inlets on opposite sides of the shroud, and air inlets, air inlets and air outlets may be provided on one side or adjacent sides or four sides. Not on the same plane. The chip heat dissipation system shown in FIG. 2 includes: a chip 21 and a heat sink. The heat sink is composed of a gas flow acceleration device 22 and a flow guide 23, wherein three air inlets are respectively provided on the side of the flow guide 23 The air inlet 231, the air inlet 232, the air inlet 233, the top is provided with air outlets 234, 235, and the airflow enters from the air inlet 231, the air inlet 232, and the air inlet 233, respectively, due to the air outlets 234, 235 Outflow, air inlets 231, 232, 233 cooperates with the air outlets 234, 235 to form an air flow channel above the chip; the bottom edge of the shroud 23 is fixed on the side of the chip 21; the airflow acceleration device 22 generates two opposite air outlets 234 and an air outlet 235, respectively. The direction of the accelerating airflow accelerates the flow of airflow inside the shroud 23, that is, above the chip 21, to achieve rapid heat dissipation of the chip 21. In addition, in FIG. 2, the airflow accelerating device 22 can also generate an accelerating airflow corresponding to the air outlet 234 or the air outlet 235, similar to the manner in which the airflow accelerating device of FIG. 1 accelerates the airflow. The chip heat dissipation system shown in FIG. 3 includes: a chip 31 and a heat sink. The heat sink is composed of an airflow accelerating device 32 and a shroud 33, wherein three sides of the shroud 33 are provided with three air inlets respectively. The air inlet 331 , the air inlet 332 , the air inlet 333 , the top center is provided with an air outlet 334 , and the other positions on the top center line are provided with an air outlet 335 and an air outlet 336 , and the air flow is respectively from the air inlet 331 The air inlet 332 and the air inlet 333 enter, and the air outlets 334, 335, and 333 respectively cooperate with the air outlets 334, 335, and 336 to form an air flow passage above the three chips; the flow guide The bottom edge 330 of the 33 is fixedly connected to the side 310 of the chip 31, and the shroud 33 just covers the entire chip 31; the airflow accelerating device 32 respectively generates three opposite air outlets 334, an air outlet 335, and an air outlet 336. The direction of the accelerating airflow accelerates the flow of airflow inside the shroud 33, that is, above the chip 31, to achieve rapid heat dissipation of the chip 31. The airflow accelerating device 32 of Fig. 3 may be fixed to the upper surface of the chip 31 or to the inside of the shroud 33. In this embodiment, preferentially, the airflow acceleration device is connected to the chip, receives an electrical signal provided by the chip, and generates an accelerated airflow in a direction of the air outlet according to the electrical signal to accelerate the airflow channel. The air inside flows. The airflow acceleration device utilizes electrical energy to generate an accelerated airflow. In this embodiment, the airflow acceleration device may be constituted by an energy conversion element that converts electrical energy output by the chip into mechanical energy and mechanical energy to drive the mechanical structure to generate an accelerated airflow. As shown in FIG. 4, the chip heat dissipation system includes: a chip 41 and a heat dissipating device. The heat dissipating device is composed of an airflow accelerating device 42 and a shroud 43. The side of the shroud 43 is provided with two air inlets respectively. The air inlet 431 and the air inlet 432 are provided with an air outlet 433 at the top center. The airflow enters from the air inlet 431 and the air inlet 432 respectively. Since the air outlet 433 flows out, the air inlets 431 and 432 cooperate with the air outlet 433. Forming an air flow passage above the chip; a bottom edge of the cover 43 is fixed on a side of the chip 41; the air flow acceleration device 42 is composed of a conversion element 421 and an air flow generation structure 422, and the energy conversion element 421 is electrically connected to the chip 41. The airflow generating structure 422 is coupled to the energy converting element 421; the energy converting component 421 converts the electrical energy of the electrical signal provided by the chip 41 into mechanical energy and uses the mechanical energy to drive the airflow generating structure 422 to output a direction opposite to the air outlet 433. The accelerating airflow accelerates the flow of airflow inside the shroud 43 or above the chip 41 to achieve rapid heat dissipation of the chip 41. Preferably, the energy conversion element in this embodiment comprises: a piezoelectric element; the piezoelectric element is connected to the airflow generating structure on one side, and the airflow generating structure is connected on the other side, and the piezoelectric element is transmitted according to the chip The electrical signal produces a mechanical resonance and utilizes the mechanical energy of the mechanical resonance to drive the airflow generating structure to output at least one accelerated gas flow. In the case where the energy conversion element is a piezoelectric element, the airflow generating structure in this embodiment may include: a chamber having a diaphragm at the bottom, the piezoelectric element being connected to the chip on one side and the diaphragm on the other side, The top of the chamber is provided with at least one outlet, one of the outlets corresponding to one of the air outlets and facing the air outlet, the number of the outlets being less than or equal to the number of the air outlets; The electrical signals transmitted by the chip create a mechanical resonance and cause the diaphragm to vibrate together such that an accelerated flow of gas is output from one of the outlets of the chamber. As shown in FIG. 5, the chip heat dissipation system includes: a chip 51 and a heat dissipating device. The heat dissipating device is composed of an airflow accelerating device 52 and a shroud 53. The side of the shroud 53 is provided with two air inlets respectively. The air inlet 531 and the air inlet 532 are provided with an air outlet 533 at the top center. The airflow enters from the air inlet 531 and the air inlet 532 respectively. Since the air outlet 533 flows out, the air inlets 531 and 532 cooperate with the air outlet 533. Forming an air flow passage above the chip; a bottom edge of the cover 53 is fixed on a side of the chip 51; the air flow acceleration device 52 is composed of a piezoelectric element 521 and a chamber 522, and one side of the piezoelectric element 521 is electrically connected to the chip 51 The other side is connected to the bottom of the chamber 522; the bottom of the chamber 522 is a diaphragm 5220, and the top is provided with an outlet 5221 for the air outlet 533; the piezoelectric element 521 converts the electrical energy of the electrical signal provided by the chip 51 into its own Mechanically resonating, and driving the diaphragm 5220 of the chamber 522 to vibrate together to output an accelerating airflow from the outlet 5221 of the chamber 522, thereby accelerating the flow of air inside the shroud 53 or above the chip 51, reaching the chip 51 quickly Thermal effect. It should be understood that when a plurality of air outlets are provided at the top of the shroud, a plurality of outlets may be correspondingly arranged at the top of the chamber, and each outlet is opposite to an air outlet, and the number of outlets may be less than or equal to the number of air outlets. Preferably, the piezoelectric element in the embodiment is composed of a piezoelectric ceramic sheet and a metal electrode layer, and the metal electrode layer is disposed on one side of the piezoelectric ceramic sheet and connected to the chip, the piezoelectric ceramic The other side of the sheet is attached to the diaphragm. As shown in FIG. 6, the chip heat dissipation system includes: a chip 61 and a heat dissipating device. The heat dissipating device is composed of an airflow accelerating device 62 and a shroud 63. The side of the shroud 63 is provided with two air inlets respectively. The air inlet 631 and the air inlet 632 are provided with an air outlet 633 at the top center. The airflow enters from the air inlet 631 and the air inlet 632 respectively. Since the air outlet 633 flows out, the air inlets 631 and 632 cooperate with the air outlet 633. Forming an air flow passage above the chip; a bottom edge of the cover 63 is fixed on a side of the chip 61; the air flow acceleration device 62 is composed of a piezoelectric element 621 and a chamber 622, and the piezoelectric element 621 is a piezoelectric ceramic piece 6210. The metal electrode layer 6211 is disposed on one surface of the piezoelectric ceramic sheet 6210 and connected to the chip 61. The other surface of the piezoelectric ceramic sheet is connected to the diaphragm 6220. The chamber 622 The bottom is the diaphragm 6220, and the top is provided with a gas outlet. The outlet 6221 of the port 633; the piezoelectric ceramic piece 6210 receives the electrical resonance of the electrical energy of the electrical signal provided by the chip 61 through the metal electrode layer 6211, and drives the diaphragm 6220 of the chamber 622 to vibrate from the chamber. The outlet 6221 of the 622 outputs an accelerating airflow, thereby accelerating the flow of airflow inside the shroud 63, that is, above the chip 61, to achieve rapid heat dissipation of the chip 61. In this embodiment, preferentially, the metal electrode layer is soldered to the chip, and may be soldered on the pad of the chip; and the piezoelectric ceramic piece is bonded to the separator. In this embodiment, the process of dissipating heat is illustrated by taking the shroud as a rectangular parallelepipe as an example. It should be understood that the shape of the shroud in this embodiment is not limited, and it can be well known to those skilled in the art. The shape of the cover, such as a cube, or a hemisphere, and the like. It can be made according to the specific shape of the chip. Figure 1-6 shows a cross-sectional view of an air inlet on the top side of the shroud, and an air outlet on the top surface. The two air outlets and the air inlet are on the same plane. It should be understood that The arrangement of the air inlet and the air outlet in the heat dissipating device in this embodiment is not limited to the above-mentioned setting manners of FIGS. 1-6. For example, a plurality of air inlets may be disposed on one side of the air guiding cover, and a plurality of air outlets may be disposed at the top. The air port, and the air inlet and the air outlet are not in the same cross section; or the air inlet is provided on the adjacent side, and the air inlet and the air outlet are not in the same cross section. The heat dissipating device of the embodiment can utilize the characteristics of the piezoelectric element to convert the signal provided by the chip into its own mechanical resonance, and vibrate together with the diaphragm to drive the diaphragm to continuously generate an accelerating airflow from the top outlet of the chamber to accelerate the airflow. Flows for fast heat dissipation. The heat dissipating device of the embodiment has the characteristics of simple structure, small volume, and the like, and can be widely applied in the intelligent terminal to improve the problem of intelligent heating.

以上内容是结合具体的实施方式对本实用新型所作的进一步详细说明，不能认定本实用新型的具体实施只局限于这些说明。对于本实用新型所属技术领域的普通技术人员来说，在不脱离本实用新型构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本实用新型的保护范围。工业实用性如上所述，本实用新型实施例提供的一种散热装置，具有以下有益效果：本实用新型提供了一种散热装置，能够解决现有技术中芯片散热结构复杂、效果不佳、应用比较困难的问题。本实用新型的散热装置包括：气流加速装置和导流装置；所述导流装置设置在芯片上方，所述导流装置设有出气口和进气口，所述出气口与所述进气口相配合在所述芯片上方形成气流通道；所述气流加速装置设置在所述芯片和所述导流装置之间，所述气流装置产生正对所述出气口方向的加速气流加速所述气流通道内的空气流动；本实用新型的散热装置通过在芯片上方形成气流通道，然后使用气流加速装置使气流通道内的空气流动加快，从而促使芯片上方的气流加速流动达到给芯片快速散热的目的，与现有技术相比，本实用新型的散热装置结构简单，体积小，散热效果更佳，能够广泛地应用到移动终端中改善移动终端的发热问题。 The above content is a further detailed description of the present invention in conjunction with the specific embodiments, and the specific implementation of the present invention is not limited to the description. For those skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit of the invention. INDUSTRIAL APPLICABILITY As described above, a heat dissipating device provided by an embodiment of the present invention has the following beneficial effects: The present invention provides a heat dissipating device, which can solve the complicated heat dissipation structure of the chip in the prior art, and has poor effects and applications. More difficult problems. The heat dissipation device of the present invention comprises: an air flow acceleration device and a flow guiding device; the flow guiding device is disposed above the chip, the flow guiding device is provided with an air outlet and an air inlet, and the air outlet and the air outlet The air inlet cooperates to form an air flow passage above the chip; the air flow acceleration device is disposed between the chip and the flow guiding device, and the air flow device generates an accelerated airflow acceleration in a direction opposite to the air outlet The air flow in the air flow passage; the heat dissipating device of the present invention forms an air flow passage above the chip, and then uses the air flow acceleration device to accelerate the air flow in the air flow passage, thereby accelerating the flow of air above the chip to achieve rapid heat dissipation of the chip. The heat dissipation device of the utility model has the advantages of simple structure, small volume and better heat dissipation effect, and can be widely applied to the mobile terminal to improve the heat generation problem of the mobile terminal.

Claims

权利要求书 Claim

1. 一种散热装置，包括：气流加速装置和导流装置； A heat sink comprising: an airflow acceleration device and a flow guiding device;

所述导流装置设置在芯片上方，所述导流装置设有出气口和进气口，所述出气口与所述进气口相配合在所述芯片上方形成气流通道；所述气流加速装置设置在所述芯片和所述导流装置之间，所述气流装置产生正对所述出气口方向的加速气流加速所述气流通道内的空气流动。 The flow guiding device is disposed above the chip, the flow guiding device is provided with an air outlet and an air inlet, and the air outlet cooperates with the air inlet to form an air flow channel above the chip; Provided between the chip and the flow guiding device, the air flow device generates an accelerated airflow in the direction of the air outlet to accelerate air flow in the air flow passage.

2. 如权利要求 1所述的散热装置，其中，所述导流装置包括：导流罩，所述导流罩与所述芯片连接并罩在所述芯片的上方；所述导流罩的侧面设有进气口，所述导流罩的顶部设有出气口，所述气流加速装置位于所述导流罩内并产生正对所述出气口方向的加速气流。 2. The heat sink according to claim 1, wherein: the flow guiding device comprises: a shroud connected to the chip and covering the chip; the shroud An air inlet is disposed at a side, and an air outlet is disposed at a top of the airflow hood, and the airflow acceleration device is located in the airflow hood and generates an accelerated airflow in a direction opposite to the air outlet.

3. 如权利要求 2所述的散热装置，其中，所述导流罩的顶部设有一个出气口，所述腔室的顶部设有一个出气口；或者 3. The heat sink according to claim 2, wherein a top of the shroud is provided with an air outlet, and an air outlet is provided at a top of the chamber; or

所述导流罩的顶部设有两个出气口，所述导流罩侧面设有至少一个进气口。 The top of the shroud is provided with two air outlets, and the side of the air deflector is provided with at least one air inlet.

4. 如权利要求 3所述的散热装置，其中，所述导流罩顶部的中心设有一出气口。 4. The heat sink according to claim 3, wherein an air outlet is provided at a center of the top of the shroud.

5. 如权利要求 1-4任一项所述的散热装置，其中，所述气流加速装置与所述芯片连接，接收所述芯片提供的电信号并根据所述电信号产生正对所述出气口方向的加速气流加速所述气流通道内的空气流动。 The heat dissipating device according to any one of claims 1 to 4, wherein the airflow accelerating device is connected to the chip, receives an electrical signal provided by the chip, and generates a facing pair according to the electrical signal The accelerated airflow in the direction of the port accelerates the flow of air within the airflow passage.

6. 如权利要求 5所述的散热装置，其中，所述气流加速装置包括：能量转换元件和气流生成结构；所述能量元件将所述芯片提供的电信号的电能转换为机械能并利用所述机械能驱动所述气流生成结构输出至少一个加速气流，所述加速气流的数量小于等于所述出气口的数量。 6. The heat sink according to claim 5, wherein the airflow acceleration device comprises: an energy conversion element and an airflow generation structure; the energy component converts electrical energy of an electrical signal provided by the chip into mechanical energy and utilizes the The mechanical energy drives the airflow generating structure to output at least one accelerated airflow, the number of the accelerated airflow being less than or equal to the number of the air outlets.

7. 如权利要求 6所述的散热装置，其中，所述能量转换元件包括：压电元件；所述压电元件一面与所述气流生成结构连接，另一面与所述气流生成结构连接，所述压电元件根据所述芯片传输的电信号产生机械谐振，并且利用机械谐振的机械能驱动所述气流生成结构输出至少一个加速气流。如权利要求 7所述的散热装置，其中，所述气流生成结构包括：底部为隔膜的腔室，所述压电元件一面与所述芯片连接、另一面与所述隔膜的连接，所述腔室的顶部设有至少一个出口，一个所述出口对应一个所述出气口并且正对所述出气口，所述出口的数量小于等于所述出气口的数量；所述压电元件根据所述芯片传输的电信号产生机械谐振，并且带动所述隔膜一起振动使得从所述腔室的一个所述出口输出一个加速气流。如权利要求 8所述的散热装置，其中，所述压电元件由压电陶瓷片和金属电极层组成，所述金属电极层设置在所述压电陶瓷片的一面上与所述芯片连接，所述压电陶瓷片的另一面与所述隔膜连接。如权利要求 9所述的散热装置，其中，所述金属电极层与所述芯片焊接。 7. The heat sink according to claim 6, wherein the energy conversion element comprises: a piezoelectric element; the piezoelectric element is connected to the airflow generating structure on one side, and the airflow generating structure is connected to the other side. The piezoelectric element generates mechanical resonance based on an electrical signal transmitted by the chip, and utilizes mechanical energy of mechanical resonance to drive the airflow generating structure to output at least one accelerated gas flow. The heat dissipation device according to claim 7, wherein the airflow generating structure comprises: a chamber having a diaphragm at the bottom, the piezoelectric element is connected to the chip on one side, and the diaphragm is connected to the other side, the cavity The top of the chamber is provided with at least one outlet, one of the outlets corresponding to one of the air outlets and facing the air outlet, the number of the outlets being less than or equal to the number of the air outlets; The transmitted electrical signal produces a mechanical resonance and causes the diaphragm to vibrate together such that an accelerated flow of gas is output from one of the outlets of the chamber. The heat sink according to claim 8, wherein the piezoelectric element is composed of a piezoelectric ceramic sheet and a metal electrode layer, and the metal electrode layer is disposed on one side of the piezoelectric ceramic sheet to be connected to the chip. The other side of the piezoelectric ceramic sheet is connected to the diaphragm. The heat sink according to claim 9, wherein the metal electrode layer is welded to the chip.