WO2015156593A1 - Back sheet for connecting junction box for solar module and method for forming same - Google Patents

Back sheet for connecting junction box for solar module and method for forming same Download PDF

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Publication number
WO2015156593A1
WO2015156593A1 PCT/KR2015/003503 KR2015003503W WO2015156593A1 WO 2015156593 A1 WO2015156593 A1 WO 2015156593A1 KR 2015003503 W KR2015003503 W KR 2015003503W WO 2015156593 A1 WO2015156593 A1 WO 2015156593A1
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WO
WIPO (PCT)
Prior art keywords
hole
backsheet
forming
back sheet
solar module
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PCT/KR2015/003503
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French (fr)
Korean (ko)
Inventor
김민혁
Original Assignee
(주)에너먼트
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Publication of WO2015156593A1 publication Critical patent/WO2015156593A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a backsheet for connecting a junction box for a photovoltaic module and a method of forming the same, and more particularly, to a backsheet including at least one hole filled with a filler or an adhesive for connecting the junction box. to be.
  • the photovoltaic device includes a photovoltaic module composed of a glass cell in which sunlight is incident from the outside and a solar cell disposed under the glass and generating solar light incident thereon, and the photovoltaic module is attached to the bottom surface of the photovoltaic module.
  • a junction box electrically connected with the backsheet for protection and the solar module is included. At this time, the junction box is perforated through a part of the backsheet, and is connected by protruding a ribbon wire (ribbon wire) connected to the bus bar of the solar module to the outside of the backsheet.
  • the conventional backsheet 110 has a plurality of layers 121, 122, and 123 constituting the solar module 120 by penetration of moisture and air through the perforated region 111. And there is a problem that the backsheet 110 is peeled off.
  • the existing backsheet 110-when the existing backsheet includes a metal or similar electrically conductive member-in the backsheet 110 in the region 111 is the electrical current flows through the ribbon wire 130. There is a disadvantage that may be leaked through the metal layer 112 which is a thermally conductive member included.
  • the present specification proposes a back sheet and a method of forming the same for solving the peeling problem and the short-circuit problem of the photovoltaic device.
  • Embodiments of the present invention provide a backsheet and a method of forming the same, which solves the problem of peeling and leakage of the solar device by filling at least one hole and filling the filler or adhesive into the formed at least one hole. .
  • embodiments of the present invention solves the problem of peeling and short-circuit of the photovoltaic device by forming at least one hole in the backsheet formed in the pocket type, by filling a filler or adhesive into the at least one hole formed. .
  • the backsheet when the backsheet includes a thermally conductive member, by forming at least one hole in the backsheet including the thermally conductive member, by filling a filler or adhesive into at least one hole formed To solve the problem of peeling and leakage of the solar device.
  • embodiments of the present invention provides a method of using a liquid filler or a hot melt adhesive in the process of filling the filler or adhesive in the at least one hole formed in the backsheet.
  • embodiments of the present invention provide a junction box and a method of connecting the same using at least one hole is formed, the backsheet filled with a filler or adhesive is injected into the at least one hole formed.
  • a method of forming a back sheet for connecting a junction box for a solar module includes a ribbon wire connected to a bus bar of a solar module. forming at least one hole in the backsheet attached to the bottom surface of the solar module based on the position of the wire; And filling at least one hole by injecting at least one of a filler or an adhesive into at least one hole formed in the backsheet.
  • Forming at least one hole in the backsheet may include forming the at least one hole in the thermally conductive member included in the backsheet when the backsheet includes a thermally conductive member. .
  • Filling the at least one hole may include applying a liquid filler to at least one hole formed in the backsheet.
  • the filling of the at least one hole may include at least one of a hot melt adhesive, a liquid curable thermoplastic, a tape having a cushion, a thermosetting adhesive, a heat seal film, a silicone, or an EVA in at least one hole formed in the backsheet.
  • Injecting or adding may comprise performing a heat compression process.
  • Forming at least one hole in the backsheet may include forming the at least one hole by removing or penetrating a portion of the backsheet based on a position of the ribbon wire.
  • Forming at least one hole in the backsheet may include generating at least one stack included in the backsheet based on the position of the ribbon wire; And stacking the generated at least one stack to generate the backsheet having the at least one hole formed therein.
  • a back sheet for connecting a junction box for a photovoltaic module may be at least based on a position of a ribbon wire connected to a bus bar of the photovoltaic module.
  • Method for connecting a junction box (junction box) for a solar module is at least formed based on the position of the ribbon wire (ribbon wire) is connected to the bus bar of the solar module (bus bar) Attaching a back sheet including one hole to a bottom surface of the solar module; And perforating a portion of at least one hole formed in the backsheet to protrude the ribbon wire to the outside of the backsheet, wherein the at least one hole formed in the backsheet comprises at least one of a filler or an adhesive. It is injected and filled.
  • the at least one hole may be formed in the thermally conductive member included in the backsheet when the backsheet includes the thermally conductive member.
  • At least one hole formed in the back sheet may be filled with a liquid filler is applied.
  • the at least one hole formed in the backsheet is injected or added with at least one of a hot melt adhesive, a liquid curable thermoplastic, a tape with a cushion, a thermosetting adhesive, a heat fusion film, a silicone, or an EVA to perform a heat compression process. By doing so, it can be filled.
  • Photovoltaic device is a solar module; A back sheet including at least one hole formed based on a position of a ribbon wire connected to a bus bar of the solar module and attached to a bottom surface of the solar module; And a junction box through which the ribbon wire protrudes outwardly from the backsheet through the at least one hole, wherein at least one hole formed in the backsheet is injected with at least one of a filler or an adhesive. Is filled.
  • Embodiments of the present invention are to provide a back sheet and a method of forming a backsheet that solves the problem of peeling and leakage of the solar device by at least one hole is formed, the filler or adhesive is injected into the at least one hole formed. Can be.
  • embodiments of the present invention can solve the peeling problem and the short-circuit problem of the photovoltaic device by forming at least one hole in the backsheet formed in the pocket type, by filling a filler or adhesive into the at least one hole formed. have.
  • the backsheet when the backsheet includes a thermally conductive member, by forming at least one hole in the backsheet including the thermally conductive member, by filling a filler or adhesive into at least one hole formed It can solve the problem of peeling and leakage of the solar device.
  • embodiments of the present invention may provide a method using a liquid filler or a hot melt adhesive in the process of filling the filler or adhesive in the at least one hole formed in the back sheet.
  • embodiments of the present invention can provide a junction box and a method of connecting the same using at least one hole is formed, the backsheet filled with a filler or adhesive is injected into the at least one hole formed.
  • FIG. 1 is a side cross-sectional view showing a conventional photovoltaic device.
  • FIG. 2 is a view showing a solar device according to an embodiment of the present invention.
  • FIG. 3 is a view showing a backsheet according to an embodiment of the present invention.
  • Figure 4 is a side cross-sectional view showing a back sheet according to another embodiment of the present invention.
  • FIG. 5 is a view showing a process of forming a back sheet according to an embodiment of the present invention.
  • FIG. 6 is a flowchart illustrating a method of forming a backsheet according to an embodiment of the present invention.
  • FIG. 7 is a flowchart illustrating a method of connecting a junction box according to an embodiment of the present invention.
  • FIG. 8 is a view showing an insulating film included in the back sheet according to an embodiment of the present invention.
  • FIG. 9 is a view showing at least one hole formed in the back sheet according to an embodiment of the present invention.
  • FIG. 2 is a view showing a solar device according to an embodiment of the present invention.
  • the photovoltaic device includes a photovoltaic module 210, a backsheet 220 mounted on a rear surface of the photovoltaic module 210, and a junction box 230.
  • the photovoltaic module 210 may be composed of a glass in which sunlight is incident from the outside, a solar cell disposed under the glass and generating the incident sunlight, and a frame supporting the glass and the solar cell.
  • the solar cell may be disposed to be closest to the backsheet 220 in the solar module 210.
  • each part of the solar module 210 is the same as the conventional solar module, a detailed description thereof will be omitted.
  • At least one hole 221 is formed in the back sheet 220 based on the position of the ribbon wire 211 connected to the bus bar 211 of the solar module 210.
  • the at least one hole 221 is filled by injecting at least one of a filler or an adhesive.
  • the meaning of filling the at least one hole 221 includes filling the at least one hole 221 fully or partially, and disposing the taping material in the at least one hole 221. Include.
  • the backsheet 220 may include at least one stack.
  • the at least one stack may include a thermally conductive member having a heat dissipation function. Detailed description thereof will be described with reference to FIGS. 3 and 5.
  • the junction box 230 may be perforated with a portion of the at least one hole 221 filled with at least one of filler or adhesive, and thus the ribbon wire 211 may protrude to the outside of the backsheet 210 to be connected.
  • the remaining areas 222 of the at least one hole 221 except for the partial area through which the ribbon wire 211 passes may be filled with at least one of a filler or an adhesive. Therefore, the backsheet 220 according to an embodiment of the present invention, in the process of protruding the ribbon wire 211 to the outside of the backsheet 220, the external moisture or air is the solar module 210 and the backsheet It is possible to prevent the penetration into the inside of the 220.
  • the backsheet 220 is present with at least one hole 221 filled with at least one of a filler or an adhesive, and the ribbon wire 211 is disposed to pass through the center of the at least one hole 221, Electricity flowing through the ribbon wire 211 may be prevented from being shorted through the metal layer, which is a thermally conductive member included in the back sheet 220.
  • At least one hole 221 is shown in four, but the number, location, and size of the at least one hole 221 may be different from the junction box 230 by protruding the ribbon wire 211 to the outside of the backsheet 220. ) Can be adaptively adjusted according to the process of connecting
  • the at least one hole 221 may be formed in a size such that all four ribbon wires 211 can be passed through a single hole, and one ribbon wire 211 may be passed through each of the four holes. It may be formed to a size that can be.
  • the backsheet 220 may be generated in a pocket type. Detailed description thereof will be described with reference to FIG. 4.
  • FIG. 3 is a view showing a backsheet according to an embodiment of the present invention.
  • the backsheet 310 may include at least one stack in which at least one hole 311 is formed based on a position of a ribbon wire connected to a bus bar of a solar module. Include.
  • the at least one stack may include a thermally conductive member 312.
  • at least one stack having at least one hole 311 may include a thermal conductive member 312 and a surface layer 313 having at least one hole 311 formed therein.
  • the at least one hole 311 may be processed so that the ribbon wire passing through the at least one hole and the at least one hole 311 is spaced apart.
  • the at least one hole 311 is filled with at least one of filler or adhesive injected.
  • the filler or adhesive filling the at least one hole 311 may be made of a material excellent in weatherability or insulation. More specifically, for example, the at least one hole 311 may be filled with a liquid filler.
  • the wire close to the edge of the hole 311 should be spaced apart a certain distance from the edge of the hole 311.
  • the present invention aligns and fixes the wires passing through the at least one hole 311 so that the wire close to the edge of the hole 311 can maintain a gap between the edges of the hole 311.
  • the minimum required spacing between the wire close to the edge of the hole 311 and the edge of the hole 311 may depend on the Dielectric strength (MV / m) of the material being filled in the hole 311. That is, as the dielectric strength (MV / m) of the material filled in the hole 311 increases, the minimum required distance between the wire close to the edge of the hole 311 and the edge of the hole 311 may increase.
  • the dielectric strength (MV / m) of helium is 0.15
  • the dielectric strength (MV / m) of alumina is 13.4
  • the hole 311 is alumina.
  • the minimum required interval may be maximum.
  • the at least one hole 311 may be injected or added with at least one of a hot melt adhesive, a liquid curable thermoplastic, a tape with a cushion, a thermosetting adhesive, a heat fusion film, a silicone, or an EVA to perform a heat compression process. By doing so, it can be filled. More specifically, for example, the at least one hole 311 may be filled with silicon or EVA and the like by gravure coating.
  • the tape having a cushion may be made of at least one material of acrylic, PE, urethane, or EPE, and may be compressed at both inlets of the at least one hole 311, thereby filling the at least one hole 311.
  • the at least one hole 311 may be formed to have various shapes. Detailed description thereof will be described with reference to FIG. 9.
  • the backsheet 310 having the at least one hole 311 is formed in a pocket type, heat dissipation performance and durability may be improved. If the backsheet 310 is generated in the pocket type, the process of forming the at least one hole 311 may be performed after the backsheet 310 is generated in the pocket type.
  • Figure 4 is a cross-sectional view showing a back sheet according to another embodiment of the present invention.
  • a backsheet according to another embodiment of the present invention may be generated in a pocket type.
  • the backsheet includes a thermally conductive member for heat dissipation therein, and after the pocket is closed with the outside, at least one hole for exposing the ribbon wire may be formed.
  • the pocket-type back sheet will be described by dividing it into (a) which does not include the insulating film and (b) which includes the insulating film.
  • At least one stack included in the back sheet may include a fluorine layer 410 and a thermally conductive member 420.
  • the backsheet is in contact with both surfaces of the thermal conductive member 420, the fluorine layer 410 having at least one function of thermal conductivity, radiation or weather resistance, the opening of the fluorine layer 410 is sealed and sealed
  • the portion 411 it can be created by forming a pocket closed with the outside. Accordingly, the backsheet having the pocket closed with the outside is not exposed to the outside of the laminated materials, and thus, peeling due to inflow of moisture, dust, or foreign matter can be prevented.
  • the fluorine layer 410 is formed in a larger size than the thermally conductive member 420, and is bonded to both surfaces of the thermally conductive member 420 by the thermoplastic adhesive 430, and the opening of the fluorine layer 410 is formed.
  • the backsheet may be formed by pressing the fluorine layer 410 up and down by using a heating roller to seal and form the sealing part 411.
  • the thermally conductive member 420 is made of at least one material of aluminum, gold, silver, copper, zinc, tin, nickel, tungsten, iron, stainless steel or graphite, fluorine to have an emissivity of 0.8 to 0.95
  • the backsheet may maximize heat radiation efficiency.
  • At least one stack included in the back sheet may include a fluorine layer 410, an insulating film 440 and the thermal conductive member 420.
  • the insulating film 440 may be glass.
  • the back sheet has a fluorine layer 410 having at least one function of thermal conductivity, radiation, or weather resistance is formed on the insulating film 440, and the insulating film 440 on which the fluorine layer 410 is formed is thermoelectric.
  • the opening of the insulating film 440 is sealed to form a sealing portion 411, it can be generated by forming a pocket closed with the outside.
  • the backsheet having the pocket closed with the outside is not exposed to the outside of the laminated materials, and thus, peeling due to inflow of moisture, dust, or foreign matter can be prevented.
  • the insulating film 440 on which the fluorine layer 410 is formed is formed to have a larger size in the horizontal direction than the thermal conductive member 420, so that the thermoplastic- or thermosetting adhesive 430 is formed on both surfaces of the thermal conductive member 420.
  • Back sheet is formed by pressing the insulating film up and down by using a heating roller to bond the opening of the insulating film 440 on which the fluorine layer 410 is formed to seal the sealing 411. Can be.
  • the insulating film 440 covers all of the thermal conductive members 420 or partially covers the thermal conductive members 420 so that the horizontal length or the vertical length of the insulating film 440 is longer than the horizontal length or the vertical length of the thermal conductive members 420. Can be. Detailed description thereof will be described with reference to FIG. 8.
  • the thermally conductive member 420 is made of at least one material of aluminum, gold, silver, copper, zinc, tin, nickel, tungsten, iron, stainless steel or graphite, fluorine to have an emissivity between 0.8 and 0.95
  • the backsheet may maximize heat radiation efficiency.
  • Insulation film 440 is made of at least one material of PET, PI PP, PE, BOPP, OPP, PVF, PVDF, TPE, ETFE, PBT, PA, PK, aramid film or nylon to ensure insulation performance It may be manufactured in a thin film form. Therefore, the insulating film 440 may have excellent withstand voltage, and durability may be improved.
  • At least one hole 450 may be formed in the backsheet generated as a pocket type based on the position of the ribbon wire connected to the bus bar of the solar module. In this case, at least one of the holes 450 may be filled with at least one of filler or adhesive. Detailed description thereof will be described with reference to FIG. 5.
  • FIG. 5 is a view showing a process of forming a back sheet according to an embodiment of the present invention.
  • the process of forming the backsheet 510 including the at least one hole 511 described above is not limited to, but is not limited to, the backsheet 510 generated as a pocket type.
  • the sheet 510 can also be applied.
  • the process of forming the backsheet 510 is as follows. First, the system for forming the backsheet 510 forms at least one hole 511 in the backsheet 510 attached to the bottom surface of the solar module based on the position of the ribbon wire connected to the busbar of the solar module. do. In this case, forming at least one hole 511 in the back sheet 510 may mean forming at least one hole 511 in at least one stack included in the back sheet 510. Thus, when the at least one stack included in the backsheet 510 includes a thermally conductive member, the system for forming the backsheet 510 may form at least one hole 511 in the thermally conductive member. .
  • the system for forming the backsheet 510 may form at least one hole 511 by removing or penetrating a part of the region 512 of the backsheet 510 based on the position of the ribbon wire.
  • the system for forming the backsheet 510 may remove or penetrate some regions of each of the at least one stack A, B, and C included in the backsheet 510 in consideration of the location of the ribbon wire, thereby at least One hole 511 may be formed in the back sheet 510.
  • the system for forming the backsheet 510 includes a partial region of each of the at least one stack A, B, and C included in the backsheet 510 after the at least one stack A, B, and C are stacked. It may be removed or penetrated, or may be removed or penetrated prior to lamination.
  • the system for forming the backsheet 510 may include at least one stack in consideration of the position of the ribbon wire in the process of stacking at least one stack included in the backsheet 510.
  • the backsheet 510 having at least one hole 511 may be formed.
  • the system for forming the backsheet 510 generates and stacks at least one stack A, B, and C to include at least one groove in consideration of the position of the ribbon wire, thereby stacking at least one hole 511. ) May form the backsheet 510.
  • the system for forming the backsheet 510 then fills the backsheet 510 by filling the at least one hole 511 by injecting at least one of the fillers or adhesives 513 into the at least one hole 511.
  • a system for forming the backsheet 510 may fill the at least one hole 511 by applying a liquid filler to at least one hole 511 formed in the backsheet 510.
  • the system for forming the backsheet 510 may include a hot melt adhesive, a liquid curable thermoplastic, a tape having a cushion, a thermosetting adhesive, a heat seal film, a silicone, or an EVA in at least one hole 511 formed in the backsheet 510.
  • At least one hole 511 may be filled by performing a hot pressing process by injecting or adding at least one.
  • the back sheet 510 formed through the above process exists in a state in which at least one hole 511 is filled in the process of connecting the junction box, it prevents the inflow of external moisture or air, thereby solving the peeling problem. Can be.
  • the backsheet 510 is present in a state in which at least one hole 511 is filled in the process of connecting the junction box, and the ribbon wire is disposed to pass through the center of the at least one hole 511.
  • the back sheet 510 is attached to the lower surface of the solar module.
  • At least one hole 511 formed in the back sheet 510 is drilled to protrude the ribbon wire to the outside of the back sheet 510, thereby connecting the junction box.
  • at least one of the fillers or the adhesives 513 is filled with the remaining portion except for the portion of the at least one hole 511, which is a passage through which the ribbon wire protrudes out of the back sheet 510.
  • FIG. 6 is a flowchart illustrating a method of forming a backsheet according to an embodiment of the present invention.
  • a system for forming a backsheet is based on a position of a ribbon wire connected to a bus bar of a solar module based on a position of a ribbon wire. At least one hole is formed in the backsheet attached to the 610.
  • the system for forming the backsheet may form at least one hole in the thermally conductive member included in the backsheet when the backsheet includes the thermally conductive member.
  • the system for forming the backsheet may form at least one hole by removing or penetrating a portion of the backsheet based on the position of the ribbon wire.
  • the system for forming the backsheet generates at least one stack included in the ribbon wire based on the position of the ribbon wire, and stacks the generated at least one stack to produce a backsheet with at least one hole formed therein. can do.
  • the system for forming the backsheet then fills at least one hole by injecting at least one of a filler or an adhesive into at least one hole formed in the backsheet (620).
  • the system for forming the backsheet may fill the at least one hole by applying a liquid filler to at least one hole formed in the backsheet.
  • the system for forming the backsheet injects at least one of a hot melt adhesive, a liquid curable thermoplastic, a tape with a cushion, a thermosetting adhesive, a heat seal film, a silicone or an EVA in at least one hole formed in the backsheet.
  • at least one hole may be filled.
  • FIG. 7 is a flowchart illustrating a method of connecting a junction box according to an embodiment of the present invention.
  • a system for connecting a junction box includes at least one hole formed based on a position of a ribbon wire connected to a bus bar of a solar module. It may form a backsheet comprising a (710). At this time, at least one hole is filled with at least one of filler or adhesive, as described with reference to FIG. 6.
  • the system for connecting the junction box then attaches 720 the backsheet to the bottom surface of the solar module.
  • the system for connecting the junction box then drills a portion of the at least one hole formed in the backsheet to project the ribbon wire out of the backsheet (730). At this time, the remaining area of the at least one hole except for the partial area through which the ribbon wire passes may be filled with at least one of a filler or an adhesive.
  • FIG. 8 is a view showing an insulating film included in the back sheet according to an embodiment of the present invention.
  • the insulating film 810 covers all of the thermal conductive members 820 or horizontally longer than the horizontal length or the vertical length of the thermal conductive members 820 to partially cover the thermal conductive members 820. It may have a length or a length.
  • the insulating film 810 may be formed in a larger size than the thermal conductive member 820 so as to cover all of the thermal conductive members 820 and may be bonded to both surfaces of the thermal conductive member 820.
  • the insulating film 810 has a size larger than that of the thermal conductive member 820 so as to partially cover only four corners of the thermal conductive member 820, and is formed with the center portion drilled therein. It may be adhered to both sides of the conductive member 820. In this case, the insulating film 810 adhered to partially cover only four corners of the thermal conductive member 820 may be sealed only at four corners.
  • the insulating film 810 is formed to have a longitudinal length longer than that of the thermal conductive member 810 so as to partially cover only two vertical edges of the thermal conductive member 820 and thus the thermal conductive member 820. It can be bonded to both sides of the. In this case, only two vertical edges of the insulating film 810 bonded to partially cover two vertical edges of the thermal conductive member 820 may be sealed.
  • the insulating film 810 is formed to have a horizontal length longer than that of the thermal conductive member 810 so as to partially cover only two horizontal edges of the thermal conductive member 820 and thus the thermal conductive member 820. It can be bonded to both sides of the. In this case, only two horizontal edges of the insulating film 810 bonded to partially cover two horizontal edges of the thermal conductive member 820 may be sealed.
  • FIG. 9 is a view showing at least one hole formed in the back sheet according to an embodiment of the present invention.
  • At least one hole 910 may be formed in the backsheet 920 to have various shapes.
  • at least one hole 910 may be formed in the backsheet 920 in the form of a horizontally long square, as in the case (a).
  • at least one hole 910 may be formed in the backsheet 920 in the form of a vertically long square, as in the case (b).
  • at least one hole 910 is formed in the backsheet 920 in the form of an ellipse, as in the case of (c), or (d) is formed in the backsheet 920 in the form of a circle, as in the case of (d). Can be.
  • the at least one hole 910 is not limited or limited to the case illustrated in the drawings, and may be formed in the backsheet 920 to have various shapes.
  • the apparatus described above may be implemented as a hardware component, a software component, and / or a combination of hardware components and software components.
  • the devices and components described in the embodiments may be, for example, processors, controllers, arithmetic logic units (ALUs), digital signal processors, microcomputers, field programmable arrays (FPAs), It may be implemented using one or more general purpose or special purpose computers, such as a programmable logic unit (PLU), microprocessor, or any other device capable of executing and responding to instructions.
  • the processing device may execute an operating system (OS) and one or more software applications running on the operating system.
  • the processing device may also access, store, manipulate, process, and generate data in response to the execution of the software.
  • OS operating system
  • the processing device may also access, store, manipulate, process, and generate data in response to the execution of the software.
  • processing device includes a plurality of processing elements and / or a plurality of types of processing elements. It can be seen that it may include.
  • the processing device may include a plurality of processors or one processor and one controller.
  • other processing configurations are possible, such as parallel processors.
  • the software may include a computer program, code, instructions, or a combination of one or more of the above, and configure the processing device to operate as desired, or process it independently or collectively. You can command the device.
  • Software and / or data may be any type of machine, component, physical device, virtual equipment, computer storage medium or device in order to be interpreted by or to provide instructions or data to the processing device. Or may be permanently or temporarily embodied in a signal wave to be transmitted.
  • the software may be distributed over networked computer systems so that they may be stored or executed in a distributed manner.
  • Software and data may be stored on one or more computer readable recording media.
  • the method according to the embodiment may be embodied in the form of program instructions that can be executed by various computer means and recorded in a computer readable medium.
  • the computer readable medium may include program instructions, data files, data structures, etc. alone or in combination.
  • the program instructions recorded on the media may be those specially designed and constructed for the purposes of the embodiments, or they may be of the kind well-known and available to those having skill in the computer software arts.
  • Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tape, optical media such as CD-ROMs, DVDs, and magnetic disks, such as floppy disks.
  • Examples of program instructions include not only machine code generated by a compiler, but also high-level language code that can be executed by a computer using an interpreter or the like.
  • the hardware device described above may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.

Abstract

A method for forming a back sheet for connecting a junction box for a solar module comprises the steps of: forming at least one hole on the back sheet attached to the lower surface of the solar module on the basis of a location of a ribbon wire connected to a bus bar of the solar module; and filling the at least one hole by injecting at least one of a filler and an adhesive into the at least one hole formed on the back sheet.

Description

태양광 모듈용 정션 박스를 연결하기 위한 백시트 및 그 형성 방법Backsheet for connecting junction box for photovoltaic module and its formation method
본 발명은 태양광 모듈용 정션 박스를 연결하기 위한 백시트 및 그 형성 방법에 관한 것으로, 보다 구체적으로, 정션 박스를 연결하기 위하여 충진제 또는 접착제로 채워진 적어도 하나의 구멍을 포함하는 백시트에 대한 기술이다.The present invention relates to a backsheet for connecting a junction box for a photovoltaic module and a method of forming the same, and more particularly, to a backsheet including at least one hole filled with a filler or an adhesive for connecting the junction box. to be.
태양광 장치에는 외부로부터 태양광이 입사되는 글래스 및 글래스 하부에 배치되어 입사된 태양광으로 발전하는 솔라셀(solar cell)로 구성되는 태양광 모듈, 태양광 모듈의 하면에 부착되어 태양광 모듈을 보호하는 백시트 및 태양광 모듈과 전기적으로 연결되는 정션 박스가 포함된다. 이 때, 정션 박스는 백시트의 일부를 타공하여, 태양광 모듈의 버스바(bus bar)와 연결되는 리본와이어(ribbon wire)를 백시트의 외부로 돌출시킴으로써 연결된다.The photovoltaic device includes a photovoltaic module composed of a glass cell in which sunlight is incident from the outside and a solar cell disposed under the glass and generating solar light incident thereon, and the photovoltaic module is attached to the bottom surface of the photovoltaic module. A junction box electrically connected with the backsheet for protection and the solar module is included. At this time, the junction box is perforated through a part of the backsheet, and is connected by protruding a ribbon wire (ribbon wire) connected to the bus bar of the solar module to the outside of the backsheet.
기존의 백시트는 리본와이어를 백시트의 외부로 돌출시키는 과정에서, 타공된 구멍을 통하여 태양광 모듈 및 백시트 내부로 수분 및 공기가 침투하여 태양광 모듈을 구성하는 복수의 층들 및 백시트가 박리되는 문제점이 있다. 예를 들어, 도 1을 살펴보면, 기존의 백시트(110)는 타공된 영역(111)을 통하여 수분 및 공기가 침투하여 태양광 모듈(120)을 구성하는 복수의 층들(121, 122, 123) 및 백시트(110)가 박리되는 문제점이 발생한다. 또한, 기존의 백시트(110)는 -기존의 백시트가 금속 또는 이와 유사한 전기전도성 부재를 포함할 때- 리본와이어(130)에 흐르는 전기가 타공된 영역(111)에서 백시트(110)에 포함되는 열전도성부재인 금속층(112)을 통하여 누전될 수 있는 단점이 있다.Existing backsheet has a plurality of layers and the backsheet to form the solar module by the moisture and air penetrates into the solar module and the backsheet through the perforated hole in the process of protruding the ribbon wire to the outside of the backsheet There is a problem of peeling. For example, referring to FIG. 1, the conventional backsheet 110 has a plurality of layers 121, 122, and 123 constituting the solar module 120 by penetration of moisture and air through the perforated region 111. And there is a problem that the backsheet 110 is peeled off. In addition, the existing backsheet 110-when the existing backsheet includes a metal or similar electrically conductive member-in the backsheet 110 in the region 111 is the electrical current flows through the ribbon wire 130. There is a disadvantage that may be leaked through the metal layer 112 which is a thermally conductive member included.
이에, 본 명세서에서는 태양광장치의 박리 문제 및 누전 문제를 해결하기 위한 백시트 및 그 형성 방법을 제안한다.Accordingly, the present specification proposes a back sheet and a method of forming the same for solving the peeling problem and the short-circuit problem of the photovoltaic device.
본 발명의 실시예들은 적어도 하나의 구멍이 형성되고, 형성된 적어도 하나의 구멍에 충진제 또는 접착제가 주입되어 채워짐으로써, 태양광 장치의 박리 문제 및 누전 문제를 해결한 백시트 및 그 형성 방법을 제공한다.Embodiments of the present invention provide a backsheet and a method of forming the same, which solves the problem of peeling and leakage of the solar device by filling at least one hole and filling the filler or adhesive into the formed at least one hole. .
또한, 본 발명의 실시예들은 포켓 타입으로 형성된 백시트에 적어도 하나의 구멍을 형성하고, 형성된 적어도 하나의 구멍에 충진제 또는 접착제를 주입하여 채움으로써, 태양광 장치의 박리 문제 및 누전 문제를 해결한다.In addition, embodiments of the present invention solves the problem of peeling and short-circuit of the photovoltaic device by forming at least one hole in the backsheet formed in the pocket type, by filling a filler or adhesive into the at least one hole formed. .
특히, 본 발명의 실시예들은 백시트가 열전도성부재를 포함하는 경우, 열전도성부재를 포함하는 백시트에 적어도 하나의 구멍을 형성하고, 형성된 적어도 하나의 구멍에 충진제 또는 접착제를 주입하여 채움으로써, 태양광 장치의 박리 문제 및 누전 문제를 해결한다.In particular, embodiments of the present invention, when the backsheet includes a thermally conductive member, by forming at least one hole in the backsheet including the thermally conductive member, by filling a filler or adhesive into at least one hole formed To solve the problem of peeling and leakage of the solar device.
또한, 본 발명의 실시예들은 백시트에 형성된 적어도 하나의 구멍에 충진제 또는 접착제를 주입하여 채우는 과정에서, 액상 충진제 또는 핫멜트 접착제를 이용하는 방법을 제공한다.In addition, embodiments of the present invention provides a method of using a liquid filler or a hot melt adhesive in the process of filling the filler or adhesive in the at least one hole formed in the backsheet.
또한, 본 발명의 실시예들은 적어도 하나의 구멍이 형성되고, 형성된 적어도 하나의 구멍에 충진제 또는 접착제가 주입되어 채워진 백시트를 이용하여 연결된 정션 박스 및 그 연결 방법을 제공한다.In addition, embodiments of the present invention provide a junction box and a method of connecting the same using at least one hole is formed, the backsheet filled with a filler or adhesive is injected into the at least one hole formed.
본 발명의 일실시예에 따른 태양광 모듈용 정션 박스(junction box)를 연결하기 위한 백시트(back sheet)를 형성하는 방법은 태양광 모듈의 버스바(bus bar)와 연결되는 리본와이어(ribbon wire)의 위치에 기초하여 상기 태양광 모듈의 하면에 부착되는 백시트에 적어도 하나의 구멍을 형성하는 단계; 및 상기 백시트에 형성된 적어도 하나의 구멍에 충진제 또는 접착제 중 적어도 하나를 주입하여 상기 적어도 하나의 구멍을 채우는 단계를 포함한다.A method of forming a back sheet for connecting a junction box for a solar module according to an embodiment of the present invention includes a ribbon wire connected to a bus bar of a solar module. forming at least one hole in the backsheet attached to the bottom surface of the solar module based on the position of the wire; And filling at least one hole by injecting at least one of a filler or an adhesive into at least one hole formed in the backsheet.
상기 백시트에 적어도 하나의 구멍을 형성하는 단계는 상기 백시트가 열전도성부재를 포함하는 경우, 상기 백시트에 포함되는 상기 열전도성부재에 상기 적어도 하나의 구멍을 형성하는 단계를 포함할 수 있다.Forming at least one hole in the backsheet may include forming the at least one hole in the thermally conductive member included in the backsheet when the backsheet includes a thermally conductive member. .
상기 적어도 하나의 구멍을 채우는 단계는 상기 백시트에 형성된 적어도 하나의 구멍에 액상 충진제를 도포하는 단계를 포함할 수 있다.Filling the at least one hole may include applying a liquid filler to at least one hole formed in the backsheet.
상기 적어도 하나의 구멍을 채우는 단계는 상기 백시트에 형성된 적어도 하나의 구멍에 핫멜트 접착제(hot melt adhesive), 액상 경화형 열가소성, 쿠션을 갖는 테이프, 열경화성 접착제, 열융착 필름, 실리콘 또는 EVA 중 적어도 하나를 주입 또는 추가하여 가열 압착 공정을 수행하는 단계를 포함할 수 있다.The filling of the at least one hole may include at least one of a hot melt adhesive, a liquid curable thermoplastic, a tape having a cushion, a thermosetting adhesive, a heat seal film, a silicone, or an EVA in at least one hole formed in the backsheet. Injecting or adding may comprise performing a heat compression process.
상기 백시트에 적어도 하나의 구멍을 형성하는 단계는 상기 리본와이어의 위치에 기초하여 상기 백시트의 일부 영역을 제거하거나 관통함으로써, 상기 적어도 하나의 구멍을 형성하는 단계를 포함할 수 있다.Forming at least one hole in the backsheet may include forming the at least one hole by removing or penetrating a portion of the backsheet based on a position of the ribbon wire.
상기 백시트에 적어도 하나의 구멍을 형성하는 단계는 상기 백시트에 포함되는 적어도 하나의 적층물을 상기 리본와이어의 위치에 기초하여 생성하는 단계; 및 상기 생성된 적어도 하나의 적층물을 적층하여 상기 적어도 하나의 구멍이 형성된 상기 백시트를 생성하는 단계를 포함할 수 있다.Forming at least one hole in the backsheet may include generating at least one stack included in the backsheet based on the position of the ribbon wire; And stacking the generated at least one stack to generate the backsheet having the at least one hole formed therein.
본 발명의 일실시예에 따른 태양광 모듈용 정션 박스를 연결하기 위한 백시트(back sheet)는 태양광 모듈의 버스바(bus bar)와 연결되는 리본와이어(ribbon wire)의 위치에 기초하여 적어도 하나의 구멍이 형성된 적어도 하나의 적층물을 포함하고, 상기 적어도 하나의 적층물에 형성된 적어도 하나의 구멍은 충진제 또는 접착제 중 적어도 하나가 주입되어 채워진다.A back sheet for connecting a junction box for a photovoltaic module according to an embodiment of the present invention may be at least based on a position of a ribbon wire connected to a bus bar of the photovoltaic module. At least one stack having one hole formed therein, wherein the at least one hole formed in the at least one stack is filled with at least one of filler or adhesive injected.
본 발명의 일실시예에 따른 태양광 모듈용 정션 박스(junction box)를 연결하는 방법은 상기 태양광 모듈의 버스바(bus bar)와 연결되는 리본와이어(ribbon wire)의 위치에 기초하여 형성된 적어도 하나의 구멍을 포함하는 백시트(back sheet)를 상기 태양광 모듈의 하면에 부착하는 단계; 및 상기 백시트에 형성된 적어도 하나의 구멍의 일부를 타공하여, 상기 리본와이어를 상기 백시트의 외부로 돌출시키는 단계를 포함하고, 상기 백시트에 형성된 적어도 하나의 구멍은 충진제 또는 접착제 중 적어도 하나가 주입되어 채워져 있다.Method for connecting a junction box (junction box) for a solar module according to an embodiment of the present invention is at least formed based on the position of the ribbon wire (ribbon wire) is connected to the bus bar of the solar module (bus bar) Attaching a back sheet including one hole to a bottom surface of the solar module; And perforating a portion of at least one hole formed in the backsheet to protrude the ribbon wire to the outside of the backsheet, wherein the at least one hole formed in the backsheet comprises at least one of a filler or an adhesive. It is injected and filled.
상기 적어도 하나의 구멍은 상기 백시트가 열전도성부재를 포함하는 경우, 상기 백시트에 포함되는 상기 열전도성부재에 형성될 수 있다.The at least one hole may be formed in the thermally conductive member included in the backsheet when the backsheet includes the thermally conductive member.
상기 백시트에 형성된 적어도 하나의 구멍은 액상 충진제가 도포되어 채워져 있을 수 있다.At least one hole formed in the back sheet may be filled with a liquid filler is applied.
상기 백시트에 형성된 적어도 하나의 구멍은 핫멜트 접착제(hot melt adhesive), 액상 경화형 열가소성, 쿠션을 갖는 테이프, 열경화성 접착제, 열융착 필름, 실리콘 또는 EVA 중 적어도 하나가 주입 또는 추가되어 가열 압착 공정이 수행됨으로써, 채워져 있을 수 있다.The at least one hole formed in the backsheet is injected or added with at least one of a hot melt adhesive, a liquid curable thermoplastic, a tape with a cushion, a thermosetting adhesive, a heat fusion film, a silicone, or an EVA to perform a heat compression process. By doing so, it can be filled.
본 발명의 일실시예에 따른 태양광 장치는 태양광 모듈; 상기 태양광 모듈의 버스바(bus bar)와 연결되는 리본와이어(ribbon wire)의 위치에 기초하여 형성된 적어도 하나의 구멍을 포함하고, 상기 태양광 모듈의 하면에 부착되는 백시트(back sheet); 및 상기 리본와이어가 상기 적어도 하나의 구멍을 통하여 상기 백시트의 외부로 돌출되어 연결되는 정션 박스(junction box)를 포함하고, 상기 백시트에 형성된 적어도 하나의 구멍은 충진제 또는 접착제 중 적어도 하나가 주입되어 채워진다.Photovoltaic device according to an embodiment of the present invention is a solar module; A back sheet including at least one hole formed based on a position of a ribbon wire connected to a bus bar of the solar module and attached to a bottom surface of the solar module; And a junction box through which the ribbon wire protrudes outwardly from the backsheet through the at least one hole, wherein at least one hole formed in the backsheet is injected with at least one of a filler or an adhesive. Is filled.
본 발명의 실시예들은 적어도 하나의 구멍이 형성되고, 형성된 적어도 하나의 구멍에 충진제 또는 접착제가 주입되어 채워짐으로써, 태양광 장치의 박리 문제 및 누전 문제를 해결한 백시트 및 그 형성 방법을 제공할 수 있다.Embodiments of the present invention are to provide a back sheet and a method of forming a backsheet that solves the problem of peeling and leakage of the solar device by at least one hole is formed, the filler or adhesive is injected into the at least one hole formed. Can be.
또한, 본 발명의 실시예들은 포켓 타입으로 형성된 백시트에 적어도 하나의 구멍을 형성하고, 형성된 적어도 하나의 구멍에 충진제 또는 접착제를 주입하여 채움으로써, 태양광 장치의 박리 문제 및 누전 문제를 해결할 수 있다.In addition, embodiments of the present invention can solve the peeling problem and the short-circuit problem of the photovoltaic device by forming at least one hole in the backsheet formed in the pocket type, by filling a filler or adhesive into the at least one hole formed. have.
특히, 본 발명의 실시예들은 백시트가 열전도성부재를 포함하는 경우, 열전도성부재를 포함하는 백시트에 적어도 하나의 구멍을 형성하고, 형성된 적어도 하나의 구멍에 충진제 또는 접착제를 주입하여 채움으로써, 태양광 장치의 박리 문제 및 누전 문제를 해결할 수 있다.In particular, embodiments of the present invention, when the backsheet includes a thermally conductive member, by forming at least one hole in the backsheet including the thermally conductive member, by filling a filler or adhesive into at least one hole formed It can solve the problem of peeling and leakage of the solar device.
또한, 본 발명의 실시예들은 백시트에 형성된 적어도 하나의 구멍에 충진제 또는 접착제를 주입하여 채우는 과정에서, 액상 충진제 또는 핫멜트 접착제를 이용하는 방법을 제공할 수 있다.In addition, embodiments of the present invention may provide a method using a liquid filler or a hot melt adhesive in the process of filling the filler or adhesive in the at least one hole formed in the back sheet.
또한, 본 발명의 실시예들은 적어도 하나의 구멍이 형성되고, 형성된 적어도 하나의 구멍에 충진제 또는 접착제가 주입되어 채워진 백시트를 이용하여 연결된 정션 박스 및 그 연결 방법을 제공할 수 있다.In addition, embodiments of the present invention can provide a junction box and a method of connecting the same using at least one hole is formed, the backsheet filled with a filler or adhesive is injected into the at least one hole formed.
도 1은 기존의 태양광 장치를 나타낸 측면 단면도이다.1 is a side cross-sectional view showing a conventional photovoltaic device.
도 2는 본 발명의 일실시예에 따른 태양광 장치를 나타낸 도면이다.2 is a view showing a solar device according to an embodiment of the present invention.
도 3은 본 발명의 일실시예에 따른 백시트를 나타낸 도면이다.3 is a view showing a backsheet according to an embodiment of the present invention.
도 4는 본 발명의 또 다른 일실시예에 따른 백시트를 나타낸 측면 단면도이다.Figure 4 is a side cross-sectional view showing a back sheet according to another embodiment of the present invention.
도 5는 본 발명의 일실시예에 따른 백시트를 형성하는 과정을 나타낸 도면이다.5 is a view showing a process of forming a back sheet according to an embodiment of the present invention.
도 6은 본 발명의 일실시예에 따른 백시트를 형성하는 방법을 나타낸 플로우 차트이다.6 is a flowchart illustrating a method of forming a backsheet according to an embodiment of the present invention.
도 7은 본 발명의 일실시예에 따른 정션 박스를 연결하는 방법을 나타낸 플로우 차트이다.7 is a flowchart illustrating a method of connecting a junction box according to an embodiment of the present invention.
도 8은 본 발명의 일실시예에 따른 백시트에 포함되는 절연필름을 나타낸 도면이다.8 is a view showing an insulating film included in the back sheet according to an embodiment of the present invention.
도 9는 본 발명의 일실시예에 따른 백시트에 형성되는 적어도 하나의 구멍을 나타낸 도면이다.9 is a view showing at least one hole formed in the back sheet according to an embodiment of the present invention.
이하, 본 발명에 따른 실시예들을 첨부된 도면을 참조하여 상세하게 설명한다. 그러나 본 발명이 실시예들에 의해 제한되거나 한정되는 것은 아니다. 또한, 각 도면에 제시된 동일한 참조 부호는 동일한 부재를 나타낸다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited or limited by the embodiments. Also, like reference numerals in the drawings denote like elements.
도 2는 본 발명의 일실시예에 따른 태양광 장치를 나타낸 도면이다.2 is a view showing a solar device according to an embodiment of the present invention.
도 2를 참조하면, 본 발명의 일실시예에 따른 태양광 장치는 태양광 모듈(210), 태양광 모듈(210)의 후면에 장착되는 백시트(220) 및 정션 박스(230)를 포함한다. 여기서, 태양광 모듈(210)은 외부로부터 태양광이 입사되는 글래스, 글래스 하부에 배치되어 입사된 태양광으로 발전하는 솔라셀 및 글래스와 솔라셀을 지지하는 프레임으로 구성될 수 있다. 이 때, 솔라셀은 태양광 모듈(210) 내에서 백시트(220)와 가장 근접하도록 배치될 수 있다.2, the photovoltaic device according to an embodiment of the present invention includes a photovoltaic module 210, a backsheet 220 mounted on a rear surface of the photovoltaic module 210, and a junction box 230. . Here, the photovoltaic module 210 may be composed of a glass in which sunlight is incident from the outside, a solar cell disposed under the glass and generating the incident sunlight, and a frame supporting the glass and the solar cell. In this case, the solar cell may be disposed to be closest to the backsheet 220 in the solar module 210.
이하, 태양광 모듈(210)의 각부는 기존의 태양광 모듈과 동일하기에 이에 대한 상세한 설명은 생략하기로 한다.Hereinafter, since each part of the solar module 210 is the same as the conventional solar module, a detailed description thereof will be omitted.
백시트(220)에는 태양광 모듈(210)의 버스바(211)와 연결되는 리본와이어(211)의 위치에 기초하여 적어도 하나의 구멍(221)이 형성된다. 여기서, 적어도 하나의 구멍(221)은 충진제 또는 접착제 중 적어도 하나가 주입되어 채워진다. 여기서, 적어도 하나의 구멍(221)을 채운다는 것의 의미는 적어도 하나의 구멍(221)을 완전히(fully) 채우거나 부분적으로 채우는 것을 포함하며, 테이핑 재료를 적어도 하나의 구멍(221)에 배치시키는 것도 포함한다.At least one hole 221 is formed in the back sheet 220 based on the position of the ribbon wire 211 connected to the bus bar 211 of the solar module 210. Here, the at least one hole 221 is filled by injecting at least one of a filler or an adhesive. Here, the meaning of filling the at least one hole 221 includes filling the at least one hole 221 fully or partially, and disposing the taping material in the at least one hole 221. Include.
이 때, 백시트(220)에는 적어도 하나의 적층물이 포함될 수 있다. 또한, 적어도 하나의 적층물은 방열 기능을 갖는 열전도성부재를 포함할 수 있다. 이에 대한 상세한 설명은 도 3 및 도 5를 참조하여 기재하기로 한다.In this case, the backsheet 220 may include at least one stack. In addition, the at least one stack may include a thermally conductive member having a heat dissipation function. Detailed description thereof will be described with reference to FIGS. 3 and 5.
정션 박스(230)는 충진제 또는 접착제 중 적어도 하나가 주입되어 채워진 적어도 하나의 구멍(221)의 일부가 타공됨으로써, 리본와이어(211)가 백시트(210)의 외부로 돌출되어 연결될 수 있다. 이 때, 리본와이어(211)가 통과하는 일부 영역을 제외한 적어도 하나의 구멍(221)의 나머지 영역(222)은 충진제 또는 접착제 중 적어도 하나로 채워진 상태로 존재할 수 있다. 따라서, 본 발명의 일실시예에 따른 백시트(220)는 리본와이어(211)를 백시트(220)의 외부로 돌출시키는 과정에서, 외부의 수분 또는 공기가 태양광 모듈(210) 및 백시트(220) 내부로 침투하는 것을 방지할 수 있다. 또한, 백시트(220)는 적어도 하나의 구멍(221)이 충진제 또는 접착제 중 적어도 하나로 채워진 상태로 존재하고, 리본와이어(211)가 적어도 하나의 구멍(221)의 중심을 통과하도록 배치되기 때문에, 리본와이어(211)에 흐르는 전기가 백시트(220)에 포함되는 열전도성부재인 금속층을 통하여 누전되는 것을 방지할 수 있다.The junction box 230 may be perforated with a portion of the at least one hole 221 filled with at least one of filler or adhesive, and thus the ribbon wire 211 may protrude to the outside of the backsheet 210 to be connected. In this case, the remaining areas 222 of the at least one hole 221 except for the partial area through which the ribbon wire 211 passes may be filled with at least one of a filler or an adhesive. Therefore, the backsheet 220 according to an embodiment of the present invention, in the process of protruding the ribbon wire 211 to the outside of the backsheet 220, the external moisture or air is the solar module 210 and the backsheet It is possible to prevent the penetration into the inside of the 220. In addition, since the backsheet 220 is present with at least one hole 221 filled with at least one of a filler or an adhesive, and the ribbon wire 211 is disposed to pass through the center of the at least one hole 221, Electricity flowing through the ribbon wire 211 may be prevented from being shorted through the metal layer, which is a thermally conductive member included in the back sheet 220.
도면에는 적어도 하나의 구멍(221)이 네 개로 도시되어 있지만, 적어도 하나의 구멍(221)의 개수, 위치 및 크기는 리본와이어(211)를 백시트(220)의 외부로 돌출시켜 정션 박스(230)를 연결하는 과정에 따라 적응적으로 조절될 수 있다. 예를 들어, 적어도 하나의 구멍(221)은 단일 구멍으로 네 개의 리본와이어(211)가 모두 통과될 수 있는 크기로 형성될 수 있고, 네 개의 구멍으로 각각 한 개의 리본와이어(211)가 통과될 수 있는 크기로 형성될 수도 있다.In the drawing, at least one hole 221 is shown in four, but the number, location, and size of the at least one hole 221 may be different from the junction box 230 by protruding the ribbon wire 211 to the outside of the backsheet 220. ) Can be adaptively adjusted according to the process of connecting For example, the at least one hole 221 may be formed in a size such that all four ribbon wires 211 can be passed through a single hole, and one ribbon wire 211 may be passed through each of the four holes. It may be formed to a size that can be.
또한, 백시트(220)는 포켓 타입으로 생성될 수도 있다. 이에 대한 상세한 설명은 도 4를 참조하여 기재하기로 한다.In addition, the backsheet 220 may be generated in a pocket type. Detailed description thereof will be described with reference to FIG. 4.
도 3은 본 발명의 일실시예에 따른 백시트를 나타낸 도면이다.3 is a view showing a backsheet according to an embodiment of the present invention.
도 3을 참조하면, 본 발명의 일실시예에 따른 백시트(310)는 태양광 모듈의 버스바와 연결되는 리본와이어의 위치에 기초하여 적어도 하나의 구멍(311)이 형성된 적어도 하나의 적층물을 포함한다. 이 때, 적어도 하나의 적층물은 열전도성부재(312)를 포함할 수 있다. 예를 들어, 적어도 하나의 구멍(311)이 형성된 적어도 하나의 적층물은 적어도 하나의 구멍(311)이 형성된 열전도성부재(312) 및 표면층(313)을 포함할 수 있다.Referring to FIG. 3, the backsheet 310 according to an embodiment of the present invention may include at least one stack in which at least one hole 311 is formed based on a position of a ribbon wire connected to a bus bar of a solar module. Include. In this case, the at least one stack may include a thermally conductive member 312. For example, at least one stack having at least one hole 311 may include a thermal conductive member 312 and a surface layer 313 having at least one hole 311 formed therein.
여기서, 적어도 하나의 구멍(311)은 적어도 하나의 구멍과 적어도 하나의 구멍(311)을 통과하는 리본 와이어가 이격되도록 가공될 수 있다. 예를 들어, 적어도 하나의 구멍(311)은 충진제 또는 접착제 중 적어도 하나가 주입되어 채워진다. 예를 들어, 적어도 하나의 구멍(311)을 채우는 충진제 또는 접착제는 내후성 또는 절연성이 뛰어난 소재로 구성될 수 있다. 더 구체적인 예를 들면, 적어도 하나의 구멍(311)은 액상 충진제가 도포되어 채워질 수 있다.Here, the at least one hole 311 may be processed so that the ribbon wire passing through the at least one hole and the at least one hole 311 is spaced apart. For example, the at least one hole 311 is filled with at least one of filler or adhesive injected. For example, the filler or adhesive filling the at least one hole 311 may be made of a material excellent in weatherability or insulation. More specifically, for example, the at least one hole 311 may be filled with a liquid filler.
또 다른 예를 들어, 적어도 하나의 구멍(311)을 통하여 하나 이상의 와이어들이 통과하는 경우에, 구멍(311)의 모서리에 가까운 와이어는 구멍(311)의 모서리로부터 특정 거리 이상 떨어지도록 이격되어야 한다. 이를 위하여, 본 발명은 적어도 하나의 구멍(311)을 관통하는 와이어들 정렬 및 고정함으로써 구멍(311)의 모서리에 가까운 와이어는 구멍(311)의 모서리 사이의 간격을 유지할 수 있다.In another example, where one or more wires pass through at least one hole 311, the wire close to the edge of the hole 311 should be spaced apart a certain distance from the edge of the hole 311. To this end, the present invention aligns and fixes the wires passing through the at least one hole 311 so that the wire close to the edge of the hole 311 can maintain a gap between the edges of the hole 311.
구멍(311)의 모서리에 가까운 와이어와 구멍(311)의 모서리 사이의 최소 요구 간격은 구멍(311)에 채워지는 물질의 Dielectric strength(MV/m)에 의존할 수 있다. 즉, 구멍(311)에 채워지는 물질의 Dielectric strength(MV/m)이 증가할수록 구멍(311)의 모서리에 가까운 와이어와 구멍(311)의 모서리 사이의 최소 요구 간격은 증가할 수 있다.The minimum required spacing between the wire close to the edge of the hole 311 and the edge of the hole 311 may depend on the Dielectric strength (MV / m) of the material being filled in the hole 311. That is, as the dielectric strength (MV / m) of the material filled in the hole 311 increases, the minimum required distance between the wire close to the edge of the hole 311 and the edge of the hole 311 may increase.
예를 들어, 헬륨의 Dielectric strength(MV/m)은 0.15, 공기의 Dielectric strength(MV/m) 3.0, 알루미나(Alumina)의 Dielectric strength(MV/m)은 13.4이며, 따라서 구멍(311)을 알루미나(Alumina)로 채우는 경우에 상기 최소 요구 간격은 최대일 수 있다.For example, the dielectric strength (MV / m) of helium is 0.15, the dielectric strength (MV / m) 3.0 of air, the dielectric strength (MV / m) of alumina is 13.4, and thus the hole 311 is alumina. In the case of filling with (Alumina), the minimum required interval may be maximum.
또한, 적어도 하나의 구멍(311)은 핫멜트 접착제(hot melt adhesive), 액상 경화형 열가소성, 쿠션을 갖는 테이프, 열경화성 접착제, 열융착 필름, 실리콘 또는 EVA 중 적어도 하나가 주입 또는 추가되어 가열 압착 공정이 수행됨으로써, 채워질 수 있다. 더 구체적인 예를 들면, 적어도 하나의 구멍(311)은 실리콘 또는 EVA 등이 주입되어 그라비아 코팅 공법에 의해 채워질 수 있다. 이 때, 쿠션을 갖는 테이프는 아크릴, PE, 우레탄 또는 EPE 중 적어도 하나의 소재로 구성되어, 적어도 하나의 구멍(311)의 양쪽 입구에 배치되어 압착됨으로써, 적어도 하나의 구멍(311)을 채울 수 있다.여기서, 적어도 하나의 구멍(311)은 다양한 형태를 갖도록 형성될 수 있다. 이에 대한 상세한 설명은 도 9를 참조하여 기재하기로 한다.In addition, the at least one hole 311 may be injected or added with at least one of a hot melt adhesive, a liquid curable thermoplastic, a tape with a cushion, a thermosetting adhesive, a heat fusion film, a silicone, or an EVA to perform a heat compression process. By doing so, it can be filled. More specifically, for example, the at least one hole 311 may be filled with silicon or EVA and the like by gravure coating. In this case, the tape having a cushion may be made of at least one material of acrylic, PE, urethane, or EPE, and may be compressed at both inlets of the at least one hole 311, thereby filling the at least one hole 311. Here, the at least one hole 311 may be formed to have various shapes. Detailed description thereof will be described with reference to FIG. 9.
또한, 적어도 하나의 구멍(311)이 형성되는 백시트(310)는 포켓 타입으로 생성됨으로써, 방열 성능 및 내구성이 향상될 수 있다. 만약, 백시트(310)가 포켓 타입으로 생성된다면, 적어도 하나의 구멍(311)이 형성되는 과정은 포켓 타입으로 백시트가(310)가 생성된 이후에 수행될 수 있다.In addition, since the backsheet 310 having the at least one hole 311 is formed in a pocket type, heat dissipation performance and durability may be improved. If the backsheet 310 is generated in the pocket type, the process of forming the at least one hole 311 may be performed after the backsheet 310 is generated in the pocket type.
도 4는 본 발명의 또 다른 일실시예에 따른 백시트를 나타낸 단면도이다.Figure 4 is a cross-sectional view showing a back sheet according to another embodiment of the present invention.
도 4를 참조하면, 본 발명의 또 다른 일실시예에 따른 백시트는 포켓 타입으로 생성될 수 있다.Referring to FIG. 4, a backsheet according to another embodiment of the present invention may be generated in a pocket type.
구체적으로, 백시트는 내부에 방열을 위한 열전도성부재를 포함하여, 외부와 폐쇄된 포켓을 생성한 이후에, 리본와이어가 노출되기 위한 적어도 하나의 구멍이 형성될 수 있다.Specifically, the backsheet includes a thermally conductive member for heat dissipation therein, and after the pocket is closed with the outside, at least one hole for exposing the ribbon wire may be formed.
이하, 포켓 타입의 백시트에 대한 상세한 설명을 절연필름을 포함하지 않는 경우인 (a)와 절연필름을 포함하는 경우인 (b)로 나누어 기재한다.Hereinafter, a detailed description of the pocket-type back sheet will be described by dividing it into (a) which does not include the insulating film and (b) which includes the insulating film.
절연필름을 포함하지 않는 경우인 (a)에서, 백시트에 포함되는 적어도 하나의 적층물은 불소층(410) 및 열전도성부재(420)를 포함할 수 있다. 이 때, 백시트는 열전도성, 복사성 또는 내후성 중 적어도 어느 하나의 기능을 갖는 불소층(410)이 열전도성부재(420)의 양면에 밀착되고, 불소층(410)의 개구부가 봉합되어 밀봉부(411)를 형성함으로써, 외부와 폐쇄된 포켓을 형성하여 생성될 수 있다. 따라서, 외부와 폐쇄된 포켓이 형성된 백시트는 적층된 소재들의 측면이 외부로 노출되지 않기 때문에, 습기, 먼지 또는 이물질 등의 유입에 의한 박리를 방지할 수 있다. 예를 들어, 불소층(410)이 열전도성부재(420)보다 큰 사이즈로 형성되어, 열전도성부재(420)의 양면에 열가소성 접착제(430)에 의해 접착되고, 불소층(410)의 개구부가 봉합되어 밀봉부(411)를 형성하도록 히팅 롤러를 이용하여 불소층(410)이 상하에서 가압되어 접착됨으로써, 백시트가 형성될 수 있다. 여기서, 열전도성부재(420)가 알루미늄, 금, 은, 구리, 아연, 주석, 니켈, 텅스텐, 철, 스테인리스 스틸 또는 흑연 중 적어도 하나의 소재로 구성되고, 0.8 내지 0.95 사이의 복사율을 가지도록 불소 또는 불소로부터 획득된 복합재료로 형성되는 불소층(410)이 공기 중에 노출됨으로써, 백시트는 방열 효율이 극대화될 수 있다.In the case of not including the insulating film (a), at least one stack included in the back sheet may include a fluorine layer 410 and a thermally conductive member 420. At this time, the backsheet is in contact with both surfaces of the thermal conductive member 420, the fluorine layer 410 having at least one function of thermal conductivity, radiation or weather resistance, the opening of the fluorine layer 410 is sealed and sealed By forming the portion 411, it can be created by forming a pocket closed with the outside. Accordingly, the backsheet having the pocket closed with the outside is not exposed to the outside of the laminated materials, and thus, peeling due to inflow of moisture, dust, or foreign matter can be prevented. For example, the fluorine layer 410 is formed in a larger size than the thermally conductive member 420, and is bonded to both surfaces of the thermally conductive member 420 by the thermoplastic adhesive 430, and the opening of the fluorine layer 410 is formed. The backsheet may be formed by pressing the fluorine layer 410 up and down by using a heating roller to seal and form the sealing part 411. Here, the thermally conductive member 420 is made of at least one material of aluminum, gold, silver, copper, zinc, tin, nickel, tungsten, iron, stainless steel or graphite, fluorine to have an emissivity of 0.8 to 0.95 Alternatively, since the fluorine layer 410 formed of a composite material obtained from fluorine is exposed to air, the backsheet may maximize heat radiation efficiency.
절연필름을 포함하는 경우인 (b)에서, 백시트에 포함되는 적어도 하나의 적층물은 불소층(410), 절연필름(440) 및 열전도성부재(420)를 포함할 수 있다. 여기서, 절연필름(440)은 글래스일 수도 있다. 이 때, 백시트는 열전도성, 복사성 또는 내후성 중 적어도 어느 하나의 기능을 갖는 불소층(410)이 절연필름(440)위에 형성되고, 불소층(410)이 형성된 절연필름(440)이 열전도성부재(420)의 양면에 밀착되어, 절연필름(440)의 개구부가 봉합되어 밀봉부(411)를 형성함으로써, 외부와 폐쇄된 포켓을 형성하여 생성될 수 있다. 따라서, 외부와 폐쇄된 포켓이 형성된 백시트는 적층된 소재들의 측면이 외부로 노출되지 않기 때문에, 습기, 먼지 또는 이물질 등의 유입에 의한 박리를 방지할 수 있다. 예를 들어, 불소층(410)이 형성된 절연필름(440)이 열전도성부재(420)보다 수평 방향으로 큰 사이즈로 형성되어, 열전도성부재(420)의 양면에 열가소성-또는 열경화성- 접착제(430)에 의해 접착되고, 불소층(410)이 형성된 절연필름(440)의 개구부가 봉합되어 밀봉부(411)를 형성하도록 히팅 롤러를 이용하여 절연필름이 상하에서 가압되어 접착됨으로써, 백시트가 형성될 수 있다. 이 때, 절연필름(440)은 열전도성부재(420)를 모두 덮거나, 부분적으로 덮도록 절연필름(440)의 가로 길이 또는 세로 길이는 열전도성부재(420)의 가로 길이 또는 세로 길이보다 길 수 있다. 이에 대한 상세한 설명은 도 8을 참조하여 기재하기로 한다.In the case of including the insulating film (b), at least one stack included in the back sheet may include a fluorine layer 410, an insulating film 440 and the thermal conductive member 420. Here, the insulating film 440 may be glass. At this time, the back sheet has a fluorine layer 410 having at least one function of thermal conductivity, radiation, or weather resistance is formed on the insulating film 440, and the insulating film 440 on which the fluorine layer 410 is formed is thermoelectric. In close contact with both surfaces of the conductive member 420, the opening of the insulating film 440 is sealed to form a sealing portion 411, it can be generated by forming a pocket closed with the outside. Accordingly, the backsheet having the pocket closed with the outside is not exposed to the outside of the laminated materials, and thus, peeling due to inflow of moisture, dust, or foreign matter can be prevented. For example, the insulating film 440 on which the fluorine layer 410 is formed is formed to have a larger size in the horizontal direction than the thermal conductive member 420, so that the thermoplastic- or thermosetting adhesive 430 is formed on both surfaces of the thermal conductive member 420. Back sheet is formed by pressing the insulating film up and down by using a heating roller to bond the opening of the insulating film 440 on which the fluorine layer 410 is formed to seal the sealing 411. Can be. In this case, the insulating film 440 covers all of the thermal conductive members 420 or partially covers the thermal conductive members 420 so that the horizontal length or the vertical length of the insulating film 440 is longer than the horizontal length or the vertical length of the thermal conductive members 420. Can be. Detailed description thereof will be described with reference to FIG. 8.
여기서, 열전도성 부재(420)가 알루미늄, 금, 은, 구리, 아연, 주석, 니켈, 텅스텐, 철, 스테인리스 스틸 또는 흑연 중 적어도 하나의 소재로 구성되고, 0.8 내지 0.95 사이의 복사율을 가지도록 불소 또는 불소로부터 획득된 복합재료로 형성되는 불소층(410)이 공기 중에 노출됨으로써, 백시트는 방열 효율이 극대화될 수 있다.Here, the thermally conductive member 420 is made of at least one material of aluminum, gold, silver, copper, zinc, tin, nickel, tungsten, iron, stainless steel or graphite, fluorine to have an emissivity between 0.8 and 0.95 Alternatively, since the fluorine layer 410 formed of a composite material obtained from fluorine is exposed to air, the backsheet may maximize heat radiation efficiency.
절연필름(440)은 절연 성능을 보장하도록, PET, PI PP, PE, BOPP, OPP, PVF, PVDF, TPE, ETFE, PBT, PA, PK, 아라미드 필름 또는 나일론 중 적어도 어느 하나의 소재로 구성되어, 박막형태로 제작될 수 있다. 따라서, 절연필름(440)은 내전압(withstanding voltage)이 우수하며, 내구성이 향상될 수 있다.Insulation film 440 is made of at least one material of PET, PI PP, PE, BOPP, OPP, PVF, PVDF, TPE, ETFE, PBT, PA, PK, aramid film or nylon to ensure insulation performance It may be manufactured in a thin film form. Therefore, the insulating film 440 may have excellent withstand voltage, and durability may be improved.
이와 같은 과정을 거쳐 포켓 타입으로 생성된 백시트에는 태양광 모듈의 버스바와 연결되는 리본와이어의 위치에 기초하여 적어도 하나의 구멍(450)이 형성될 수 있다. 이 때, 적어도 하나의 구멍(450)에는 충진제 또는 접착제 중 적어도 하나가 주입되어 채워질 수 있다. 이에 대한 상세한 설명은 도 5를 참조하여 기재하기로 한다.At least one hole 450 may be formed in the backsheet generated as a pocket type based on the position of the ribbon wire connected to the bus bar of the solar module. In this case, at least one of the holes 450 may be filled with at least one of filler or adhesive. Detailed description thereof will be described with reference to FIG. 5.
도 5는 본 발명의 일실시예에 따른 백시트를 형성하는 과정을 나타낸 도면이다.5 is a view showing a process of forming a back sheet according to an embodiment of the present invention.
이하, 상술하는 적어도 하나의 구멍(511)을 포함하는 백시트(510)를 형성하는 과정은 포켓 타입으로 생성된 백시트(510)에 제한되거나, 한정되지 않고, 일반적인 방식으로 적층되어 생성된 백시트(510)에도 적용 가능하다.Hereinafter, the process of forming the backsheet 510 including the at least one hole 511 described above is not limited to, but is not limited to, the backsheet 510 generated as a pocket type. The sheet 510 can also be applied.
도 5를 참조하면, 본 발명의 일실시예에 따른 백시트(510)를 형성하는 과정은 다음과 같다. 우선, 백시트(510)를 형성하는 시스템은 태양광 모듈의 버스바와 연결되는 리본와이어의 위치에 기초하여 태양광 모듈의 하면에 부착되는 백시트(510)에 적어도 하나의 구멍(511)을 형성한다. 이 때, 백시트(510)에 적어도 하나의 구멍(511)을 형성한다는 것은 백시트(510)에 포함되는 적어도 하나의 적층물에 적어도 하나의 구멍(511)을 형성한다는 것을 의미할 수 있다. 따라서, 백시트(510)에 포함되는 적어도 하나의 적층물이 열전도성부재를 포함하는 경우, 백시트(510)를 형성하는 시스템은 열전도성부재에 적어도 하나의 구멍(511)을 형성할 수 있다.Referring to FIG. 5, the process of forming the backsheet 510 according to an embodiment of the present invention is as follows. First, the system for forming the backsheet 510 forms at least one hole 511 in the backsheet 510 attached to the bottom surface of the solar module based on the position of the ribbon wire connected to the busbar of the solar module. do. In this case, forming at least one hole 511 in the back sheet 510 may mean forming at least one hole 511 in at least one stack included in the back sheet 510. Thus, when the at least one stack included in the backsheet 510 includes a thermally conductive member, the system for forming the backsheet 510 may form at least one hole 511 in the thermally conductive member. .
이 때, 백시트(510)를 형성하는 시스템은 리본와이어의 위치에 기초하여 백시트(510) 중 일부 영역(512)을 제거하거나 관통함으로써, 적어도 하나의 구멍(511)을 형성할 수 있다. 예를 들어, 백시트(510)를 형성하는 시스템은 리본와이어의 위치를 고려하여 백시트(510)에 포함되는 적어도 하나의 적층물 A, B 및 C 각각의 일부 영역을 제거 또는 관통함으로써, 적어도 하나의 구멍(511)을 백시트(510)에 형성할 수 있다. 여기서, 백시트(510)를 형성하는 시스템은 백시트(510)에 포함되는 적어도 하나의 적층물 A, B 및 C 각각의 일부 영역을 적어도 하나의 적층물 A, B 및 C가 적층된 이후에 제거 또는 관통할 수 있고, 적층되기 이전에 제거 또는 관통할 수도 있다.In this case, the system for forming the backsheet 510 may form at least one hole 511 by removing or penetrating a part of the region 512 of the backsheet 510 based on the position of the ribbon wire. For example, the system for forming the backsheet 510 may remove or penetrate some regions of each of the at least one stack A, B, and C included in the backsheet 510 in consideration of the location of the ribbon wire, thereby at least One hole 511 may be formed in the back sheet 510. Here, the system for forming the backsheet 510 includes a partial region of each of the at least one stack A, B, and C included in the backsheet 510 after the at least one stack A, B, and C are stacked. It may be removed or penetrated, or may be removed or penetrated prior to lamination.
또한, 도면에는 도시하지 않았지만, 백시트(510)를 형성하는 시스템은 백시트(510)에 포함되는 적어도 하나의 적층물을 적층하는 과정에서, 리본와이어의 위치를 고려하여 적어도 하나의 적층물을 생성하고 적층함으로써, 적어도 하나의 구멍(511)이 형성된 백시트(510)를 생성할 수 있다. 예를 들어, 백시트(510)를 형성하는 시스템은 적어도 하나의 적층물 A, B 및 C를 리본와이어의 위치를 고려하여 적어도 하나의 홈을 포함하도록 생성하여 적층함으로써, 적어도 하나의 구멍(511)이 형성된 백시트(510)를 생성할 수 있다.In addition, although not shown in the drawings, the system for forming the backsheet 510 may include at least one stack in consideration of the position of the ribbon wire in the process of stacking at least one stack included in the backsheet 510. By generating and stacking, the backsheet 510 having at least one hole 511 may be formed. For example, the system for forming the backsheet 510 generates and stacks at least one stack A, B, and C to include at least one groove in consideration of the position of the ribbon wire, thereby stacking at least one hole 511. ) May form the backsheet 510.
그 후, 백시트(510)를 형성하는 시스템은 적어도 하나의 구멍(511)에 충진제 또는 접착제 중 적어도 하나(513)를 주입하여 적어도 하나의 구멍(511)을 채움으로써, 백시트(510)를 형성할 수 있다. 예를 들어, 백시트(510)를 형성하는 시스템은 백시트(510)에 형성된 적어도 하나의 구멍(511)에 액상 충진제를 도포함으로써, 적어도 하나의 구멍(511)을 채울 수 있다. 또한, 백시트(510)를 형성하는 시스템은 백시트(510)에 형성된 적어도 하나의 구멍(511)에 핫멜트 접착제, 액상 경화형 열가소성, 쿠션을 갖는 테이프, 열경화성 접착제, 열융착 필름, 실리콘 또는 EVA 중 적어도 하나를 주입 또는 추가하여 가열 압착 공정을 수행함으로써, 적어도 하나의 구멍(511)을 채울 수 있다.The system for forming the backsheet 510 then fills the backsheet 510 by filling the at least one hole 511 by injecting at least one of the fillers or adhesives 513 into the at least one hole 511. Can be formed. For example, a system for forming the backsheet 510 may fill the at least one hole 511 by applying a liquid filler to at least one hole 511 formed in the backsheet 510. In addition, the system for forming the backsheet 510 may include a hot melt adhesive, a liquid curable thermoplastic, a tape having a cushion, a thermosetting adhesive, a heat seal film, a silicone, or an EVA in at least one hole 511 formed in the backsheet 510. At least one hole 511 may be filled by performing a hot pressing process by injecting or adding at least one.
이와 같은 과정을 거쳐 형성된 백시트(510)는 정션 박스를 연결하는 과정에서, 적어도 하나의 구멍(511)이 채워진 상태로 존재하기 때문에, 외부의 수분 또는 공기의 유입을 방지함으로써, 박리 문제를 해결할 수 있다. 또한, 백시트(510)는 정션 박스를 연결하는 과정에서, 적어도 하나의 구멍(511)이 채워진 상태로 존재하고, 리본와이어가 적어도 하나의 구멍(511)의 중심을 통과하도록 배치되기 때문에, 리본와이어에 흐르는 전기가 백시트(510)에 포함되는 적어도 하나의 적층물인 열전도성부재를 통하여 누전되는 것을 방지함으로써, 누전 문제를 해결할 수 있다.Since the back sheet 510 formed through the above process exists in a state in which at least one hole 511 is filled in the process of connecting the junction box, it prevents the inflow of external moisture or air, thereby solving the peeling problem. Can be. In addition, the backsheet 510 is present in a state in which at least one hole 511 is filled in the process of connecting the junction box, and the ribbon wire is disposed to pass through the center of the at least one hole 511. By preventing the electric current flowing through the wire from being leaked through the thermally conductive member, which is at least one stack included in the back sheet 510, the electric leakage problem may be solved.
위에서 상술한 과정을 거쳐 형성된 백시트(510)를 이용하여 정션 박스를 연결하는 과정은 다음과 같다.The process of connecting the junction box using the backsheet 510 formed through the above-described process is as follows.
1) 백시트(510)를 태양광 모듈의 하면에 부착한다.1) The back sheet 510 is attached to the lower surface of the solar module.
2) 백시트(510)에 형성된 적어도 하나의 구멍(511)의 일부를 타공하여, 리본와이어를 백시트(510)의 외부로 돌출시킴으로써, 정션 박스를 연결한다. 이 때, 리본 와이어가 백시트(510)의 외부로 돌출되는 통로가 되는 적어도 하나의 구멍(511)의 일부를 제외한 나머지 부분은 충진제 또는 접착제 중 적어도 하나(513)가 주입되어 채워져 있다.2) A part of at least one hole 511 formed in the back sheet 510 is drilled to protrude the ribbon wire to the outside of the back sheet 510, thereby connecting the junction box. In this case, at least one of the fillers or the adhesives 513 is filled with the remaining portion except for the portion of the at least one hole 511, which is a passage through which the ribbon wire protrudes out of the back sheet 510.
도 6은 본 발명의 일실시예에 따른 백시트를 형성하는 방법을 나타낸 플로우 차트이다.6 is a flowchart illustrating a method of forming a backsheet according to an embodiment of the present invention.
도 6을 참조하면, 본 발명의 일실시예에 따른 백시트를 형성하는 시스템은 태양광 모듈의 버스바(bus bar)와 연결되는 리본와이어(ribbon wire)의 위치에 기초하여 태양광 모듈의 하면에 부착되는 백시트에 적어도 하나의 구멍을 형성한다(610). 이 때, 백시트를 형성하는 시스템은 백시트가 열전도성부재를 포함하는 경우, 백시트에 포함되는 열전도성부재에 적어도 하나의 구멍을 형성할 수 있다.Referring to FIG. 6, a system for forming a backsheet according to an embodiment of the present invention is based on a position of a ribbon wire connected to a bus bar of a solar module based on a position of a ribbon wire. At least one hole is formed in the backsheet attached to the 610. In this case, the system for forming the backsheet may form at least one hole in the thermally conductive member included in the backsheet when the backsheet includes the thermally conductive member.
여기서, 백시트를 형성하는 시스템은 리본와이어의 위치에 기초하여 백시트의 일부 영역을 제거 또는 관통함으로써, 적어도 하나의 구멍을 형성할 수 있다. 또한, 백시트를 형성하는 시스템은 리본와이어에 포함되는 적어도 하나의 적층물을 리본와이어의 위치에 기초하여 생성하고, 생성된 적어도 하나의 적층물을 적층하여 적어도 하나의 구멍이 형성된 백시트를 생성할 수 있다.Here, the system for forming the backsheet may form at least one hole by removing or penetrating a portion of the backsheet based on the position of the ribbon wire. In addition, the system for forming the backsheet generates at least one stack included in the ribbon wire based on the position of the ribbon wire, and stacks the generated at least one stack to produce a backsheet with at least one hole formed therein. can do.
그 후, 백시트를 형성하는 시스템은 백시트에 형성된 적어도 하나의 구멍에 충진제 또는 접착제 중 적어도 하나를 주입하여 적어도 하나의 구멍을 채운다(620). 이 때, 백시트를 형성하는 시스템은 백시트에 형성된 적어도 하나의 구멍에 액상 충진제를 도포함으로써, 적어도 하나의 구멍을 채울 수 있다. 또한, 백시트를 형성하는 시스템은 백시트에 형성된 적어도 하나의 구멍에 핫멜트 접착제(hot melt adhesive), 액상 경화형 열가소성, 쿠션을 갖는 테이프, 열경화성 접착제, 열융착 필름, 실리콘 또는 EVA 중 적어도 하나를 주입 또는 추가하여 가열 압착 공정을 수행함으로써, 적어도 하나의 구멍을 채울 수 있다.The system for forming the backsheet then fills at least one hole by injecting at least one of a filler or an adhesive into at least one hole formed in the backsheet (620). At this time, the system for forming the backsheet may fill the at least one hole by applying a liquid filler to at least one hole formed in the backsheet. In addition, the system for forming the backsheet injects at least one of a hot melt adhesive, a liquid curable thermoplastic, a tape with a cushion, a thermosetting adhesive, a heat seal film, a silicone or an EVA in at least one hole formed in the backsheet. Or in addition, by performing a heat compression process, at least one hole may be filled.
도 7은 본 발명의 일실시예에 따른 정션 박스를 연결하는 방법을 나타낸 플로우 차트이다.7 is a flowchart illustrating a method of connecting a junction box according to an embodiment of the present invention.
도 7을 참조하면, 본 발명의 일실시예에 따른 정션 박스를 연결하는 시스템은 태양광 모듈의 버스바(bus bar)와 연결되는 리본와이어(ribbon wire)의 위치에 기초하여 형성된 적어도 하나의 구멍을 포함하는 백시트를 형성할 수 있다(710). 이 때, 적어도 하나의 구멍은 도 6을 참조하여 기재한 설명과 같이, 충진제 또는 접착제 중 적어도 하나가 주입되어 채워져 있다.Referring to FIG. 7, a system for connecting a junction box according to an embodiment of the present invention includes at least one hole formed based on a position of a ribbon wire connected to a bus bar of a solar module. It may form a backsheet comprising a (710). At this time, at least one hole is filled with at least one of filler or adhesive, as described with reference to FIG. 6.
이어서, 정션 박스를 연결하는 시스템은 백시트를 태양광 모듈의 하면에 부착한다(720).The system for connecting the junction box then attaches 720 the backsheet to the bottom surface of the solar module.
그 후, 정션 박스를 연결하는 시스템은 백시트에 형성된 적어도 하나의 구멍의 일부를 타공하여, 리본 와이어를 백시트의 외부로 돌출시킨다(730). 이 때, 리본와이어가 통과하는 일부 영역을 제외한 적어도 하나의 구멍의 나머지 영역은 충진제 또는 접착제 중 적어도 하나로 채워질 수 있다.The system for connecting the junction box then drills a portion of the at least one hole formed in the backsheet to project the ribbon wire out of the backsheet (730). At this time, the remaining area of the at least one hole except for the partial area through which the ribbon wire passes may be filled with at least one of a filler or an adhesive.
도 8은 본 발명의 일실시예에 따른 백시트에 포함되는 절연필름을 나타낸 도면이다.8 is a view showing an insulating film included in the back sheet according to an embodiment of the present invention.
도 8을 참조하면, 본 발명의 일실시예에 따른 절연 필름(810)은 열전도성부재(820)를 모두 덮거나, 부분적으로 덮도록 열전도성부재(820)의 가로 길이 또는 세로 길이보다 긴 가로 길이 또는 세로 길이를 가질 수 있다.Referring to FIG. 8, the insulating film 810 according to an embodiment of the present invention covers all of the thermal conductive members 820 or horizontally longer than the horizontal length or the vertical length of the thermal conductive members 820 to partially cover the thermal conductive members 820. It may have a length or a length.
(a)의 경우, 절연필름(810)은 열전도성부재(820)을 모두 덮도록 열전도성부재(820) 보다 큰 사이즈로 형성되어 열전도성부재(820)의 양면에 접착될 수 있다.In the case of (a), the insulating film 810 may be formed in a larger size than the thermal conductive member 820 so as to cover all of the thermal conductive members 820 and may be bonded to both surfaces of the thermal conductive member 820.
또한, (b)의 경우, 절연필름(810)은 열전도성부재(820)의 네 개의 모서리만 부분적으로 덮도록 열전도성부재(820) 보다 큰 사이즈를 가지면서, 가운데 부분이 뚫린 채로 형성되어 열전도성부재(820)의 양면에 접착될 수 있다. 이와 같은 경우, 열전도성부재(820)의 네 개의 모서리만 부분적으로 덮도록 접착된 절연필름(810)은 네 개의 모서리만 밀봉될 수 있다.In addition, in the case (b), the insulating film 810 has a size larger than that of the thermal conductive member 820 so as to partially cover only four corners of the thermal conductive member 820, and is formed with the center portion drilled therein. It may be adhered to both sides of the conductive member 820. In this case, the insulating film 810 adhered to partially cover only four corners of the thermal conductive member 820 may be sealed only at four corners.
또한, (c)의 경우, 절연필름(810)은 열전도성부재(820)의 세로 모서리 두 개만 부분적으로 덮도록 열전도성부재(810) 보다 긴 세로 길이를 가진 채로 형성되어 열전도성부재(820)의 양면에 접착될 수 있다. 이와 같은 경우, 열전도성부재(820)의 세로 모서리 두 개만 부분적으로 덮도록 접착된 절연필름(810)은 세로 모서리 두 개만 밀봉될 수 있다.In addition, in the case of (c), the insulating film 810 is formed to have a longitudinal length longer than that of the thermal conductive member 810 so as to partially cover only two vertical edges of the thermal conductive member 820 and thus the thermal conductive member 820. It can be bonded to both sides of the. In this case, only two vertical edges of the insulating film 810 bonded to partially cover two vertical edges of the thermal conductive member 820 may be sealed.
또한, (d)의 경우, 절연필름(810)은 열전도성부재(820)의 가로 모서리 두 개만 부분적으로 덮도록 열전도성부재(810) 보다 긴 가로 길이를 가진 채로 형성되어 열전도성부재(820)의 양면에 접착될 수 있다. 이와 같은 경우, 열전도성부재(820)의 가로 모서리 두 개만 부분적으로 덮도록 접착된 절연필름(810)은 가로 모서리 두 개만 밀봉될 수 있다.In addition, in the case of (d), the insulating film 810 is formed to have a horizontal length longer than that of the thermal conductive member 810 so as to partially cover only two horizontal edges of the thermal conductive member 820 and thus the thermal conductive member 820. It can be bonded to both sides of the. In this case, only two horizontal edges of the insulating film 810 bonded to partially cover two horizontal edges of the thermal conductive member 820 may be sealed.
도 9는 본 발명의 일실시예에 따른 백시트에 형성되는 적어도 하나의 구멍을 나타낸 도면이다.9 is a view showing at least one hole formed in the back sheet according to an embodiment of the present invention.
도 9를 참조하면, 본 발명의 일실시예에 따른 적어도 하나의 구멍(910)은 다양한 형태를 갖도록 백시트(920)에 형성될 수 있다. 예를 들어, 적어도 하나의 구멍(910)은 (a) 경우와 같이, 가로로 긴 네모의 형태로 백시트(920)에 형성될 수 있다. 다른 예를 들면, 적어도 하나의 구멍(910)은 (b) 경우와 같이, 세로로 긴 네모의 형태로 백시트(920)에 형성될 수 있다. 또 다른 예를 들면, 적어도 하나의 구멍(910)은 (c) 경우와 같이, 타원 형태로 백시트(920)에 형성되거나, (d) 경우와 같이, 원형 형태로 백시트(920)에 형성될 수 있다.Referring to FIG. 9, at least one hole 910 according to an embodiment of the present invention may be formed in the backsheet 920 to have various shapes. For example, at least one hole 910 may be formed in the backsheet 920 in the form of a horizontally long square, as in the case (a). In another example, at least one hole 910 may be formed in the backsheet 920 in the form of a vertically long square, as in the case (b). In another example, at least one hole 910 is formed in the backsheet 920 in the form of an ellipse, as in the case of (c), or (d) is formed in the backsheet 920 in the form of a circle, as in the case of (d). Can be.
여기서, 적어도 하나의 구멍(910)은 도면에 도시된 경우로 제한되거나 한정되지 않고, 다양한 형태를 갖도록 백시트(920)에 형성될 수 있다.Here, the at least one hole 910 is not limited or limited to the case illustrated in the drawings, and may be formed in the backsheet 920 to have various shapes.
이상에서 설명된 장치는 하드웨어 구성요소, 소프트웨어 구성요소, 및/또는 하드웨어 구성요소 및 소프트웨어 구성요소의 조합으로 구현될 수 있다. 예를 들어, 실시예들에서 설명된 장치 및 구성요소는, 예를 들어, 프로세서, 콘트롤러, ALU(arithmetic logic unit), 디지털 신호 프로세서(digital signal processor), 마이크로컴퓨터, FPA(field programmable array), PLU(programmable logic unit), 마이크로프로세서, 또는 명령(instruction)을 실행하고 응답할 수 있는 다른 어떠한 장치와 같이, 하나 이상의 범용 컴퓨터 또는 특수 목적 컴퓨터를 이용하여 구현될 수 있다. 처리 장치는 운영 체제(OS) 및 상기 운영 체제 상에서 수행되는 하나 이상의 소프트웨어 애플리케이션을 수행할 수 있다. 또한, 처리 장치는 소프트웨어의 실행에 응답하여, 데이터를 접근, 저장, 조작, 처리 및 생성할 수도 있다. 이해의 편의를 위하여, 처리 장치는 하나가 사용되는 것으로 설명된 경우도 있지만, 해당 기술분야에서 통상의 지식을 가진 자는, 처리 장치가 복수 개의 처리 요소(processing element) 및/또는 복수 유형의 처리 요소를 포함할 수 있음을 알 수 있다. 예를 들어, 처리 장치는 복수 개의 프로세서 또는 하나의 프로세서 및 하나의 콘트롤러를 포함할 수 있다. 또한, 병렬 프로세서(parallel processor)와 같은, 다른 처리 구성(processing configuration)도 가능하다.The apparatus described above may be implemented as a hardware component, a software component, and / or a combination of hardware components and software components. For example, the devices and components described in the embodiments may be, for example, processors, controllers, arithmetic logic units (ALUs), digital signal processors, microcomputers, field programmable arrays (FPAs), It may be implemented using one or more general purpose or special purpose computers, such as a programmable logic unit (PLU), microprocessor, or any other device capable of executing and responding to instructions. The processing device may execute an operating system (OS) and one or more software applications running on the operating system. The processing device may also access, store, manipulate, process, and generate data in response to the execution of the software. For convenience of explanation, one processing device may be described as being used, but one of ordinary skill in the art will appreciate that the processing device includes a plurality of processing elements and / or a plurality of types of processing elements. It can be seen that it may include. For example, the processing device may include a plurality of processors or one processor and one controller. In addition, other processing configurations are possible, such as parallel processors.
소프트웨어는 컴퓨터 프로그램(computer program), 코드(code), 명령(instruction), 또는 이들 중 하나 이상의 조합을 포함할 수 있으며, 원하는 대로 동작하도록 처리 장치를 구성하거나 독립적으로 또는 결합적으로(collectively) 처리 장치를 명령할 수 있다. 소프트웨어 및/또는 데이터는, 처리 장치에 의하여 해석되거나 처리 장치에 명령 또는 데이터를 제공하기 위하여, 어떤 유형의 기계, 구성요소(component), 물리적 장치, 가상 장치(virtual equipment), 컴퓨터 저장 매체 또는 장치, 또는 전송되는 신호 파(signal wave)에 영구적으로, 또는 일시적으로 구체화(embody)될 수 있다. 소프트웨어는 네트워크로 연결된 컴퓨터 시스템 상에 분산되어서, 분산된 방법으로 저장되거나 실행될 수도 있다. 소프트웨어 및 데이터는 하나 이상의 컴퓨터 판독 가능 기록 매체에 저장될 수 있다.The software may include a computer program, code, instructions, or a combination of one or more of the above, and configure the processing device to operate as desired, or process it independently or collectively. You can command the device. Software and / or data may be any type of machine, component, physical device, virtual equipment, computer storage medium or device in order to be interpreted by or to provide instructions or data to the processing device. Or may be permanently or temporarily embodied in a signal wave to be transmitted. The software may be distributed over networked computer systems so that they may be stored or executed in a distributed manner. Software and data may be stored on one or more computer readable recording media.
실시예에 따른 방법은 다양한 컴퓨터 수단을 통하여 수행될 수 있는 프로그램 명령 형태로 구현되어 컴퓨터 판독 가능 매체에 기록될 수 있다. 상기 컴퓨터 판독 가능 매체는 프로그램 명령, 데이터 파일, 데이터 구조 등을 단독으로 또는 조합하여 포함할 수 있다. 상기 매체에 기록되는 프로그램 명령은 실시예를 위하여 특별히 설계되고 구성된 것들이거나 컴퓨터 소프트웨어 당업자에게 공지되어 사용 가능한 것일 수도 있다. 컴퓨터 판독 가능 기록 매체의 예에는 하드 디스크, 플로피 디스크 및 자기 테이프와 같은 자기 매체(magnetic media), CD-ROM, DVD와 같은 광기록 매체(optical media), 플롭티컬 디스크(floptical disk)와 같은 자기-광 매체(magneto-optical media), 및 롬(ROM), 램(RAM), 플래시 메모리 등과 같은 프로그램 명령을 저장하고 수행하도록 특별히 구성된 하드웨어 장치가 포함된다. 프로그램 명령의 예에는 컴파일러에 의해 만들어지는 것과 같은 기계어 코드뿐만 아니라 인터프리터 등을 사용해서 컴퓨터에 의해서 실행될 수 있는 고급 언어 코드를 포함한다. 상기된 하드웨어 장치는 실시예의 동작을 수행하기 위해 하나 이상의 소프트웨어 모듈로서 작동하도록 구성될 수 있으며, 그 역도 마찬가지이다.The method according to the embodiment may be embodied in the form of program instructions that can be executed by various computer means and recorded in a computer readable medium. The computer readable medium may include program instructions, data files, data structures, etc. alone or in combination. The program instructions recorded on the media may be those specially designed and constructed for the purposes of the embodiments, or they may be of the kind well-known and available to those having skill in the computer software arts. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tape, optical media such as CD-ROMs, DVDs, and magnetic disks, such as floppy disks. Magneto-optical media, and hardware devices specifically configured to store and execute program instructions, such as ROM, RAM, flash memory, and the like. Examples of program instructions include not only machine code generated by a compiler, but also high-level language code that can be executed by a computer using an interpreter or the like. The hardware device described above may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.
이상과 같이 실시예들이 비록 한정된 실시예와 도면에 의해 설명되었으나, 해당 기술분야에서 통상의 지식을 가진 자라면 상기의 기재로부터 다양한 수정 및 변형이 가능하다. 예를 들어, 설명된 기술들이 설명된 방법과 다른 순서로 수행되거나, 및/또는 설명된 시스템, 구조, 장치, 회로 등의 구성요소들이 설명된 방법과 다른 형태로 결합 또는 조합되거나, 다른 구성요소 또는 균등물에 의하여 대치되거나 치환되더라도 적절한 결과가 달성될 수 있다.Although the embodiments have been described by the limited embodiments and the drawings as described above, various modifications and variations are possible to those skilled in the art from the above description. For example, the described techniques may be performed in a different order than the described method, and / or components of the described systems, structures, devices, circuits, etc. may be combined or combined in a different form than the described method, or other components. Or even if replaced or substituted by equivalents, an appropriate result can be achieved.
그러므로, 다른 구현들, 다른 실시예들 및 특허청구범위와 균등한 것들도 후술하는 특허청구범위의 범위에 속한다. Therefore, other implementations, other embodiments, and equivalents to the claims are within the scope of the claims that follow.

Claims (12)

  1. 태양광 모듈용 정션 박스(junction box)를 연결하기 위한 백시트(back sheet)를 형성하는 방법에 있어서, In the method of forming a back sheet for connecting a junction box for a solar module,
    태양광 모듈의 버스바(bus bar)와 연결되는 리본와이어(ribbon wire)의 위치에 기초하여 상기 태양광 모듈의 하면에 부착되는 백시트에 적어도 하나의 구멍을 형성하는 단계; 및 Forming at least one hole in a backsheet attached to a bottom surface of the solar module based on a position of a ribbon wire connected to a bus bar of the solar module; And
    상기 적어도 하나의 구멍을 관통하여 상기 리본 와이어를 통과시키는 단계;Passing the ribbon wire through the at least one hole;
    상기 백시트에 형성된 적어도 하나의 구멍과 상기 리본 와이어 사이의 거리를 이격시키도록 상기 적어도 하나의 구멍을 가공하는 단계Processing the at least one hole to space the distance between the at least one hole formed in the backsheet and the ribbon wire
    를 포함하는 백시트를 형성하는 방법.Forming a back sheet comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 백시트에 적어도 하나의 구멍을 형성하는 단계는 Forming at least one hole in the backsheet
    상기 백시트가 열전도성부재를 포함하는 경우, 상기 백시트에 포함되는 상기 열전도성부재에 상기 적어도 하나의 구멍을 형성하는 단계When the backsheet includes a thermally conductive member, forming the at least one hole in the thermally conductive member included in the backsheet.
    를 포함하는 백시트를 형성하는 방법.Forming a back sheet comprising a.
  3. 제1항에 있어서,The method of claim 1,
    상기 적어도 하나의 구멍을 가공하는 단계는Processing the at least one hole
    상기 적어도 하나의 구멍에 충진제 또는 접착제 중 적어도 하나를 주입하여 상기 적어도 하나의 구멍을 채우는 단계Filling at least one hole by injecting at least one of a filler or an adhesive into the at least one hole
    를 포함하고,Including,
    상기 적어도 하나의 구멍을 채우는 단계는 Filling the at least one hole
    상기 백시트에 형성된 적어도 하나의 구멍에 액상 충진제를 도포하는 단계Applying a liquid filler to at least one hole formed in the backsheet
    를 포함하는 백시트를 형성하는 방법.Forming a back sheet comprising a.
  4. 제1항에 있어서,The method of claim 1,
    상기 적어도 하나의 구멍을 가공하는 단계는Processing the at least one hole
    상기 적어도 하나의 구멍에 충진제 또는 접착제 중 적어도 하나를 주입하여 상기 적어도 하나의 구멍을 채우는 단계Filling at least one hole by injecting at least one of a filler or an adhesive into the at least one hole
    를 포함하고,Including,
    상기 적어도 하나의 구멍을 채우는 단계는 Filling the at least one hole
    상기 백시트에 형성된 적어도 하나의 구멍에 핫멜트 접착제(hot melt adhesive), 액상 경화형 열가소성, 쿠션을 갖는 테이프, 열경화성 접착제, 열융착 필름, 실리콘 또는 EVA 중 적어도 하나를 주입 또는 추가하여 가열 압착 공정을 수행하는 단계Performing a thermal compression process by injecting or adding at least one of a hot melt adhesive, a liquid curable thermoplastic, a tape with a cushion, a thermosetting adhesive, a heat fusion film, a silicone, or an EVA to at least one hole formed in the backsheet. Steps to
    를 포함하는 백시트를 형성하는 방법.Forming a back sheet comprising a.
  5. 제1항에 있어서,The method of claim 1,
    상기 백시트에 적어도 하나의 구멍을 형성하는 단계는 Forming at least one hole in the backsheet
    상기 리본와이어의 위치에 기초하여 상기 백시트의 일부 영역을 제거하거나 관통함으로써, 상기 적어도 하나의 구멍을 형성하는 단계Removing or penetrating a portion of the backsheet based on the position of the ribbon wire to form the at least one hole
    를 포함하는 백시트를 형성하는 방법.Forming a back sheet comprising a.
  6. 제1항에 있어서,The method of claim 1,
    상기 백시트에 적어도 하나의 구멍을 형성하는 단계는 Forming at least one hole in the backsheet
    상기 백시트에 포함되는 적어도 하나의 적층물을 상기 리본와이어의 위치에 기초하여 생성하는 단계; 및 Generating at least one stack included in the backsheet based on the position of the ribbon wire; And
    상기 생성된 적어도 하나의 적층물을 적층하여 상기 적어도 하나의 구멍이 형성된 상기 백시트를 생성하는 단계Stacking the generated at least one stack to produce the backsheet having the at least one hole formed therein;
    를 포함하는 백시트를 형성하는 방법.Forming a back sheet comprising a.
  7. 태양광 모듈용 정션 박스(junction box)를 연결하기 위한 백시트(back sheet)에 있어서,In a back sheet for connecting a junction box for a solar module,
    태양광 모듈의 버스바(bus bar)와 연결되는 리본와이어(ribbon wire)의 위치에 기초하여 적어도 하나의 구멍이 형성된 적어도 하나의 적층물At least one stack with at least one hole based on the position of the ribbon wire connected to the bus bar of the solar module
    을 포함하고, Including,
    상기 적어도 하나의 적층물에 형성된 적어도 하나의 구멍은At least one hole formed in the at least one stack
    충진제 또는 접착제 중 적어도 하나가 주입되어 채워지는 백시트.A backsheet in which at least one of a filler or adhesive is injected and filled.
  8. 태양광 모듈용 정션 박스(junction box)를 연결하는 방법에 있어서, In the method of connecting a junction box for a solar module,
    상기 태양광 모듈의 버스바(bus bar)와 연결되는 리본와이어(ribbon wire)의 위치에 기초하여 형성된 적어도 하나의 구멍을 포함하는 백시트(back sheet)를 상기 태양광 모듈의 하면에 부착하는 단계; 및 Attaching a back sheet to the bottom surface of the solar module, the back sheet including at least one hole formed based on a position of a ribbon wire connected to a bus bar of the solar module; ; And
    상기 백시트에 형성된 적어도 하나의 구멍의 일부를 타공하여, 상기 리본와이어를 상기 백시트의 외부로 돌출시키는 단계Perforating a portion of at least one hole formed in the backsheet to protrude the ribbon wire out of the backsheet
    를 포함하고, Including,
    상기 백시트에 형성된 적어도 하나의 구멍은At least one hole formed in the backsheet
    충진제 또는 접착제 중 적어도 하나가 주입되어 채워져 있는 정션 박스를 연결하는 방법.A method of connecting a junction box filled with at least one of filler or adhesive.
  9. 제8항에 있어서,The method of claim 8,
    상기 적어도 하나의 구멍은 The at least one hole is
    상기 백시트가 열전도성부재를 포함하는 경우, 상기 백시트에 포함되는 상기 열전도성부재에 형성되는 정션 박스를 연결하는 방법.And connecting the junction box formed on the thermally conductive member included in the backsheet when the backsheet includes the thermally conductive member.
  10. 제8항에 있어서,The method of claim 8,
    상기 백시트에 형성된 적어도 하나의 구멍은 At least one hole formed in the backsheet
    액상 충진제가 도포되어 채워져 있는 정션 박스를 연결하는 방법.A method of connecting a junction box filled with a liquid filler.
  11. 제8항에 있어서,The method of claim 8,
    상기 백시트에 형성된 적어도 하나의 구멍은 At least one hole formed in the backsheet
    핫멜트 접착제(hot melt adhesive), 액상 경화형 열가소성, 쿠션을 갖는 테이프, 열경화성 접착제, 열융착 필름, 실리콘 또는 EVA 중 적어도 하나가 주입 또는 추가되어 가열 압착 공정이 수행됨으로써, 채워져 있는 정션 박스를 연결하는 방법.A method of connecting a filled junction box by injecting or adding at least one of a hot melt adhesive, a liquid curable thermoplastic, a tape with a cushion, a thermosetting adhesive, a heat bonding film, a silicone, or an EVA to perform a hot pressing process. .
  12. 태양광 장치에 있어서, In the solar device,
    태양광 모듈; Solar modules;
    상기 태양광 모듈의 버스바(bus bar)와 연결되는 리본와이어(ribbon wire)의 위치에 기초하여 형성된 적어도 하나의 구멍을 포함하고, 상기 태양광 모듈의 하면에 부착되는 백시트(back sheet); 및 A back sheet including at least one hole formed based on a position of a ribbon wire connected to a bus bar of the solar module and attached to a bottom surface of the solar module; And
    상기 리본와이어가 상기 적어도 하나의 구멍을 통하여 상기 백시트의 외부로 돌출되어 연결되는 정션 박스(junction box)A junction box in which the ribbon wire protrudes out of the backsheet through the at least one hole and is connected to the junction box.
    를 포함하고, Including,
    상기 백시트에 형성된 적어도 하나의 구멍은 At least one hole formed in the backsheet
    충진제 또는 접착제 중 적어도 하나가 주입되어 채워지거나,At least one of a filler or adhesive is injected and filled,
    상기 적어도 하나의 구멍과 상기 리본 와이어가 이격되도록 가공되는 태양광 장치.The photovoltaic device is processed so that the at least one hole and the ribbon wire are spaced apart.
PCT/KR2015/003503 2014-04-08 2015-04-08 Back sheet for connecting junction box for solar module and method for forming same WO2015156593A1 (en)

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CN108258072B (en) * 2016-12-27 2023-10-27 阿特斯阳光电力集团股份有限公司 Photovoltaic module
KR102176445B1 (en) * 2018-08-24 2020-11-09 한국에너지기술연구원 Photovoltaic module with structure easy heat emission of bypass diode

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