WO2015144717A1 - Translucent printed circuit boards and/or heat sinks which are fitted with leds - Google Patents

Translucent printed circuit boards and/or heat sinks which are fitted with leds Download PDF

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Publication number
WO2015144717A1
WO2015144717A1 PCT/EP2015/056278 EP2015056278W WO2015144717A1 WO 2015144717 A1 WO2015144717 A1 WO 2015144717A1 EP 2015056278 W EP2015056278 W EP 2015056278W WO 2015144717 A1 WO2015144717 A1 WO 2015144717A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier body
ceramic
support body
leds
led
Prior art date
Application number
PCT/EP2015/056278
Other languages
German (de)
French (fr)
Inventor
Marco Heinrich
Anton Gschwändler
Original Assignee
Ceramtec Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec Gmbh filed Critical Ceramtec Gmbh
Priority to EP15712345.6A priority Critical patent/EP3123841A1/en
Publication of WO2015144717A1 publication Critical patent/WO2015144717A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the invention relates to a ceramic carrier body on whose surface single-sided or multi-sided sintered metallization regions are applied as conductor tracks and the carrier body is a circuit board, wherein on the carrier body at least one LED and optionally other electrical or electronic components are arranged, the connection elements are electrically connected to the conductor tracks ,
  • Such a carrier body is described in WO 2007107601 A1.
  • the invention has the object of developing a carrier body according to the preamble of claim 1 so that it emits the light of the LED ' s in all directions, in the high power range (from about 0.8 W per LED) can be used and a thermal conductivity greater than 10 W / mK.
  • Translucent glasses are not suitable as carrier bodies because their thermal conductivities are too low.
  • the ceramic support body is a translucent ceramic, it radiates the light from the LED 's in all directions from, is in the high power range used (from about 0.8 W per LED) and has a thermal conductivity greater than 10 W / mK.
  • the carrier body may be integrally connected to cooling fins or formed plate-shaped.
  • the carrier body is integrally connected with cooling fins, one speaks of a three-dimensional carrier body in contrast to a plate-shaped, two-dimensional carrier body.
  • the metallization regions preferably consist of silver-platinum.
  • the support body liquid cooled or is cooled by natural or forced convection is in a variant embodiment of the support body liquid cooled or is cooled by natural or forced convection.
  • cooling with heat pipes is advantageous.
  • a use according to the invention is characterized in that a translucent ceramic is used for a carrier body according to the invention.
  • FIG. 1 shows a carrier body 1 according to the invention made of a translucent, i. from a semi-transparent ceramic.
  • a carrier body 1 made of a translucent, i. from a semi-transparent ceramic.
  • one-sided sintered metallization regions 2 are applied as conductor tracks.
  • the support body 1 is thereby a circuit board, wherein on the support body 1 at least one LED 3 and optionally other electrical or electronic components are arranged.
  • the reference numeral 4 designates a plug which is connectable to external lead wires and which is electrically conductively connected to the metallization regions 2.
  • the heat generated by the LEDs is dissipated due to the extremely good thermal conductivity in the material of the carrier body and spread there.
  • the light of the LED ' s 3 is emitted in all spatial directions.

Abstract

The invention relates to a ceramic support body (1) on the surface of which metallization regions (2) which are sintered on one side or on several sides are fitted as conductor tracks, and the support body (1) is a printed circuit board, wherein at least one LED (3) and possibly other electrical or electronic components (4) are arranged on the support body (1). In order that the support body (1) emits the light from the LEDs (3) in all spatial directions, can be used in the high-power range (starting from approximately 0.8 W per LED) and has a thermal conductivity of greater than 10 W/mK, it is proposed that the ceramic support body (1) is a translucent ceramic.

Description

TRANSLUZENTE MIT LED BESTÜCKTE PLATINEN UND/ODER KÜHLKÖRPER  TRANSLUCENT WITH LED PLATINES AND / OR REFRIGERATED BODIES
Die Erfindung betrifft einen keramischen Trägerkörper auf dessen Oberfläche einseitig oder mehrseitig versinterte Metallisierungsbereiche als Leiterbahnen aufgebracht sind und der Trägerkörper eine Platine ist, wobei auf dem Trägerkörper zumindest eine LED und gegebenfalls andere elektrische oder elektronische Bauelemente angeordnet sind, deren Anschlusselemente mit den Leiterbahnen elektrisch verbunden sind. The invention relates to a ceramic carrier body on whose surface single-sided or multi-sided sintered metallization regions are applied as conductor tracks and the carrier body is a circuit board, wherein on the carrier body at least one LED and optionally other electrical or electronic components are arranged, the connection elements are electrically connected to the conductor tracks ,
Ein derartiger Trägerkörper ist in der WO 2007107601 A1 beschrieben. Such a carrier body is described in WO 2007107601 A1.
Der Erfindung liegt die Aufgabe zugrunde, einen Trägerkörper nach dem Oberbegriff des Anspruchs 1 so weiterzubilden, dass er das Licht der LED's in allen Raumrichtungen abstrahlt, im Hochleistungsbereich (ab etwa 0,8 W pro LED) einsetzbar ist und eine Wärmeleitfähigkeit größer als 10 W/mK aufweist. Transluzente Gläser eignen sich nicht als Trägerkörper, da deren Wärmeleitfähigkeiten zu niedrig sind. The invention has the object of developing a carrier body according to the preamble of claim 1 so that it emits the light of the LED ' s in all directions, in the high power range (from about 0.8 W per LED) can be used and a thermal conductivity greater than 10 W / mK. Translucent glasses are not suitable as carrier bodies because their thermal conductivities are too low.
Erfindungsgemäß wird diese Aufgabe durch die Merkmale des Anspruchs 1 gelöst. According to the invention, this object is solved by the features of claim 1.
Dadurch, dass der keramische Trägerkörper eine transluzente Keramik ist, strahlt er das Licht der LED's in allen Raumrichtungen ab, ist im Hochleistungsbereich (ab etwa 0,8 W pro LED) einsetzbar und weist eine Wärmeleitfähigkeit größer als 10 W/mK auf. Characterized in that the ceramic support body is a translucent ceramic, it radiates the light from the LED 's in all directions from, is in the high power range used (from about 0.8 W per LED) and has a thermal conductivity greater than 10 W / mK.
Transluzente Keramiken werden zum Beispiel beschrieben in DE 10 2013 226579 A. ln einer Ausführungsform kann der Trägerkörper einstückig mit Kühlrippen verbunden sein oder aber plattenformig ausgebildet sein. Wenn der Trägerkörper einstückig mit Kühlrippen verbunden ist, spricht man auch von einem dreidimensionalen Trägerkörper im Gegensatz zu einem plattenförmigen, zweidimensionalen Trägerkörper. Translucent ceramics are described, for example, in DE 10 2013 226579 A. In one embodiment, the carrier body may be integrally connected to cooling fins or formed plate-shaped. When the carrier body is integrally connected with cooling fins, one speaks of a three-dimensional carrier body in contrast to a plate-shaped, two-dimensional carrier body.
Bevorzugt bestehen die Metallisierungsbereiche aus Silber-Platin. The metallization regions preferably consist of silver-platinum.
Zur Abführung der von den LED's erzeugten Wärme ist in einer Ausführungsvariante der Trägerkörper flüssigkeitsgekühlt oder wird über natürliche oder erzwungene Konvektion gekühlt. So ist zum Beispiel eine Kühlung mit Heatpipes vorteilhaft. To dissipate the heat generated by the LEDs is in a variant embodiment of the support body liquid cooled or is cooled by natural or forced convection. For example, cooling with heat pipes is advantageous.
Eine erfindungsgemäße Verwendung zeichnet sich dadurch aus, dass eine transluzente Keramik für einen erfindungsgemäßen Trägerkörper verwendet wird. A use according to the invention is characterized in that a translucent ceramic is used for a carrier body according to the invention.
Die Erfindung beschreibt somit zwei- oder dreidimensionale keramische Trägerkörper, auch Boards genannt, auf Basis transluzenter Keramik (auch bekannt unter der Bezeichnung PERLUCOR). Diese können direkt einseitig oder mehrseitig metallisiert werden (z.B. mit Silber-Piatin-Leiterbahnen im Siebdruck, mit nachfolgendem Einbrand). Anschließend erfolgt die Bestückung mit elektrischen oder elektronischen Komponenten oder Bauteilen, darunter LED's. Die Boards können flüssigkeitsgekühlt oder über natürliche oder erzwungene Konvektion gekühlt sein. The invention thus describes two- or three-dimensional ceramic carrier bodies, also called boards, based on translucent ceramic (also known as PERLUCOR). These can be metallized directly on one side or on several sides (eg with silver-platinum printed conductors in screen printing, with subsequent penetration). Subsequently, the equipment is fitted with electrical or electronic components or components, including LED ' s. The boards may be liquid cooled or cooled by natural or forced convection.
Diese Boards sind natürlich für jede Leistungsklasse von LED's verwendbar. Nachfolgend wird die Erfindung anhand einer Figur weiter erläutert. These boards are of course usable for every power class of LED 's . The invention will be further explained with reference to a figure.
Figur 1 zeigt einen erfindungsgemäßen Trägerkörper 1 aus einer transluzenten, d.h. aus einer teiltransparenten Keramik. Auf der Oberfläche des Trägerkörpers 1 sind in dieser Ausführungsform einseitig versinterte Metallisierungsbereiche 2 als Leiterbahnen aufgebracht. Der Trägerkörper 1 ist dadurch eine Platine, wobei auf dem Trägerkörper 1 zumindest eine LED 3 und gegebenfalls andere elektrische oder elektronische Bauelemente angeordnet sind. Mit dem Bezugszeichen 4 ist ein Stecker bezeichnet, der mit externen Zuleitungsdrähten verbindbar ist und der mit den Metallisierungsbereichen 2 stromleitend verbunden ist. FIG. 1 shows a carrier body 1 according to the invention made of a translucent, i. from a semi-transparent ceramic. On the surface of the carrier body 1 in this embodiment, one-sided sintered metallization regions 2 are applied as conductor tracks. The support body 1 is thereby a circuit board, wherein on the support body 1 at least one LED 3 and optionally other electrical or electronic components are arranged. The reference numeral 4 designates a plug which is connectable to external lead wires and which is electrically conductively connected to the metallization regions 2.
Durch die versinterten Metallisierungsbereiche 2 wird die von den LED's erzeugte Wärme aufgrund der extrem guten thermischen Leitfähigkeit in das Material des Trägerkörpers abgeleitet und dort gespreizt. Through the sintered metallization 2, the heat generated by the LEDs is dissipated due to the extremely good thermal conductivity in the material of the carrier body and spread there.
Durch die Verwendung von transluzenter Keramik als Werkstoff für den Trägerkörper 1 wird das Licht der LED's 3 in alle Raumrichtungen abgestrahlt. By using translucent ceramic as a material for the carrier body 1, the light of the LED ' s 3 is emitted in all spatial directions.

Claims

Ansprüche claims
1 ) Keramischer Trägerkörper (1 ) auf dessen Oberfläche einseitig oder mehrseitig versinterte Metallisierungsbereiche (2) als Leiterbahnen aufgebracht sind und der Trägerkörper (1 ) eine Platine ist, wobei auf dem Trägerkörper (1 ) zumindest eine LED (3) und gegebenfalls andere elektrische oder elektronische Bauelemente angeordnet sind, deren Anschlusselemente mit den Metallisierungsbereichen (2) verbunden sind, dadurch gekennzeichnet, dass der keramische Trägerkörper (1 ) eine transluzente Keramik ist. 1) ceramic carrier body (1) on the surface of one or more sides sintered metallization regions (2) are applied as conductor tracks and the carrier body (1) is a circuit board, wherein on the carrier body (1) at least one LED (3) and optionally other electrical or electronic components are arranged, whose connection elements are connected to the metallization regions (2), characterized in that the ceramic carrier body (1) is a translucent ceramic.
2) Trägerkörper nach Anspruch 1 , dadurch gekennzeichnet, dass der Trägerkörper (1 ) einstückig mit Kühlrippen verbunden ist oder der Trägerkörper plattenförmig ausgebildet ist. 2) Carrier body according to claim 1, characterized in that the carrier body (1) is integrally connected to cooling fins or the carrier body is plate-shaped.
3) Trägerkörper nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Metallisierungsbereiche (2) aus Silber-Platin bestehen. 3) Carrier body according to claim 1 or 2, characterized in that the metallization regions (2) consist of silver-platinum.
4) Trägerkörper nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass der Trägerkörper (1 ) flüssigkeitsgekühlt oder über natürliche oder erzwungene Konvektion gekühlt ist. 4) Carrier body according to one of claims 1 to 3, characterized in that the carrier body (1) is liquid-cooled or cooled by natural or forced convection.
5) Verwendung einer transluzenten Keramik für einen Trägerkörper (1 ) nach einem der Ansprüche 1 bis 4. 5) Use of a translucent ceramic for a carrier body (1) according to one of claims 1 to 4.
PCT/EP2015/056278 2014-03-28 2015-03-24 Translucent printed circuit boards and/or heat sinks which are fitted with leds WO2015144717A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP15712345.6A EP3123841A1 (en) 2014-03-28 2015-03-24 Translucent printed circuit boards and/or heat sinks which are fitted with leds

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014205834.1 2014-03-28
DE102014205834 2014-03-28

Publications (1)

Publication Number Publication Date
WO2015144717A1 true WO2015144717A1 (en) 2015-10-01

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Country Status (4)

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EP (1) EP3123841A1 (en)
DE (1) DE102015205332A1 (en)
TW (1) TW201601264A (en)
WO (1) WO2015144717A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019135408B3 (en) 2019-12-20 2021-01-07 Audi Ag Light arrangement for a motor vehicle and motor vehicle

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1705163A1 (en) * 2005-03-24 2006-09-27 Irlbacher Blickpunkt Glas GmbH Control panel
JP2012094678A (en) * 2010-10-27 2012-05-17 Kyocera Corp Light emitting device
US20120320601A1 (en) * 2010-05-13 2012-12-20 Panasonic Corporation Mounting substrate and manufacturing method thereof, light-emitting module and illumination device
US20130147348A1 (en) * 2010-10-22 2013-06-13 Panasonic Corporation Mounting board, light emitting device and lamp

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449137B (en) 2006-03-23 2014-08-11 Ceramtec Ag Traegerkoerper fuer bauelemente oder schaltungen
JP2016500362A (en) 2012-12-19 2016-01-12 セラムテック−イーテック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｅｒａｍＴｅｃ−Ｅｔｅｃ ＧｍｂＨ Ceramic material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1705163A1 (en) * 2005-03-24 2006-09-27 Irlbacher Blickpunkt Glas GmbH Control panel
US20120320601A1 (en) * 2010-05-13 2012-12-20 Panasonic Corporation Mounting substrate and manufacturing method thereof, light-emitting module and illumination device
US20130147348A1 (en) * 2010-10-22 2013-06-13 Panasonic Corporation Mounting board, light emitting device and lamp
JP2012094678A (en) * 2010-10-27 2012-05-17 Kyocera Corp Light emitting device

Also Published As

Publication number Publication date
TW201601264A (en) 2016-01-01
EP3123841A1 (en) 2017-02-01
DE102015205332A1 (en) 2015-10-01

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