WO2015100711A1 - 高导热印刷电路板结构 - Google Patents

高导热印刷电路板结构 Download PDF

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Publication number
WO2015100711A1
WO2015100711A1 PCT/CN2014/070013 CN2014070013W WO2015100711A1 WO 2015100711 A1 WO2015100711 A1 WO 2015100711A1 CN 2014070013 W CN2014070013 W CN 2014070013W WO 2015100711 A1 WO2015100711 A1 WO 2015100711A1
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Prior art keywords
pattern layer
layer
thermally conductive
circuit board
printed circuit
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PCT/CN2014/070013
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English (en)
French (fr)
Inventor
俞宛伶
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俞宛伶
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Priority to PCT/CN2014/070013 priority Critical patent/WO2015100711A1/zh
Publication of WO2015100711A1 publication Critical patent/WO2015100711A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the thermally conductive printed circuit board structure of the first embodiment includes a thermally conductive layer 111 and a metal core 1 13 , a wiring layer 120 , and a solder resist layer 130 .
  • the metal core 113 is attached to the lower surface of the insulating and thermally conductive layer 11 1 .
  • the circuit layer 120 is formed on the upper surface of the insulating and thermally conductive layer 111, and the solder resist layer 130 covers a portion of the circuit layer 120 and the insulating thermally conductive layer.
  • the embodiment mainly utilizes the gold below.
  • the overall heat dissipation effect is compared with the general heat conductive material.
  • the circuit layer 120 and the solder resist layer 130 are formed by using a high dispersion of the ceramic plate 115. However, a circuit layer is formed on the ceramic board 115.
  • the current method usually has
  • the copper powder is incorporated into the surface of the ceramic plate, or (2) after the sintering is completed, a plating seed layer is formed on the surface by sputtering.
  • these methods are costly and time consuming, in addition, When the lines are stacked, it is sometimes necessary to drill with lasers, and the ceramics are brittle after sintering, which may cause damage due to these processes.
  • thermally conductive printed circuit board structure that is inexpensive, easy to manufacture, and has high thermal conductivity for use in high power LEDs or semiconductor wafers to maintain product performance and extend service life.
  • the main object of the present invention is to provide a high thermal conductive printed circuit board structure comprising a heat conducting plate, an insulating layer, a metal pattern layer, and a circuit pattern layer
  • the heat conducting plate can be a metal plate or a graphite plate.
  • a heat conducting glass plate, and one of the ceramic plates, the insulating layer is formed on a surface of the heat conducting plate, the metal pattern layer is formed on a part of the surface of the insulating layer, and the metal pattern layer and the insulating layer have an overlapping opening pattern.
  • a heat conducting hole is formed to expose a portion of the surface of the heat conducting plate.
  • the wiring pattern layer is formed on the wall surface and the bottom of the heat conduction hole, or fills the heat conduction hole, and is formed on the surface of the metal pattern layer, and is connected to the metal pattern layer and the heat conduction plate.
  • the heat conducting plate When the heat conducting plate is in electrical communication with the circuit pattern layer, further comprising at least one cutting gap to divide the heat conducting plate into a plurality of blocks to avoid short circuit of the metal pattern layer and the circuit pattern layer, and filling in the cutting gap Insulating glue is added to maintain the integrity and mechanical strength of the heat conducting plate. Further, it is also possible to stack the insulating layer and the metal pattern layer and to form via holes to form a second line pattern layer to be connected to the line pattern layer to form a structure in which the multilayer lines are stacked.
  • the large-area heat-conducting plate can effectively extract the heat source and improve the performance and service life of the printed circuit board. It is suitable for the use of light-emitting diodes and high-power semiconductor components.
  • ceramics and heat-conducting glass No need to use expensive and time-consuming sputtering technology, but also can be processed in advance and then bonded to achieve high thermal conductivity, while saving production costs and production time.
  • Figure iA is a cross-sectional view showing a first embodiment of a conventional thermally conductive printed circuit board structure.
  • Figure IB is a cross-sectional view showing a second embodiment of a conventional thermally conductive printed circuit board structure.
  • 2 is a cross-sectional view showing the first embodiment of the high thermal conductive printed circuit board structure of the present invention.
  • 3 is a cross-sectional view showing a second embodiment of a high thermal conductivity printed circuit board structure of the present invention.
  • the high thermal conductive printed circuit board structure 1 of the first embodiment of the present invention comprises a heat conducting plate 10, an insulating layer 20, a metal pattern layer 30, and a circuit pattern layer 40.
  • the heat conducting plate 10 is made of metal.
  • the insulating layer 20 is formed on one surface of the heat conducting plate 10, and the metal pattern layer 30 is formed on a part of the surface of the insulating layer 20, the metal pattern layer 30 and The insulating layer 20 has an overlapping opening pattern to form at least one of the heat conducting holes 25 to expose a portion of the surface of the heat conducting plate 10.
  • the wiring pattern layer 40 is formed on the wall surface and the bottom of the heat conduction hole 25, or fills the heat conduction hole 25, and is formed on the ((partial) surface of the metal pattern layer 30, together with the metal pattern layer 30 and the heat conduction.
  • the board 10 is connected, wherein the metal ring layer 30 is copper or aluminum, and the line pattern layer 40 is at least one of copper, nickel, zinc, aluminum, gold, and silver.
  • the heat conducting plate 10 is exposed on the surface of the heat conducting hole 25, and further comprises a metal seed layer 55, which is copper or zinc. Further, when the heat conducting plate 10 is in electrical communication with the metal seed layer 55, further comprising at least one cutting gap, cutting the heat conducting plate 10 into a plurality of blocks, and filling the cutting gap with the insulating rubber 50 The metal pattern layer 30 and the line pattern layer 40 are prevented from being improperly short-circuited, and the integrity and mechanical strength of the heat conducting plate 10 are maintained.
  • the high thermal conductivity printed circuit board structure 1 further includes a solder resist layer 60 partially covering the circuit pattern layer 40 to expose only a portion of the area for subsequent connection of the components.
  • the high thermal conductive printed circuit board structure 2 of the second embodiment of the present invention is basically the buildup structure of the first embodiment, the heat conductive plate 10, the insulating layer 20, the metal pattern layer 30, and the wiring pattern layer 40. It is substantially the same as the first embodiment and will not be described here.
  • Second The high thermal conductive printed circuit board structure 2 of the embodiment further includes a second insulating layer 22, a second metal pattern layer 32 and a second line pattern layer 42 covering the insulating layer 20 and the metal pattern layer.
  • the second metal pattern layer 32 is formed on a portion of the surface of the second insulating layer 22, and the two metal pattern layer 32 and the second insulating layer 22 have overlapping openings
  • the pattern forms a plurality of via holes 27.
  • the via holes 27 expose a portion of the line pattern layer 40.
  • the third line pattern layer 42 is formed at least on the bottom and the wall surface of the via hole 27, further fills the via hole 27, and is formed on the surface of the second metal pattern layer 32 while being in contact with the second metal pattern layer. 32 and the line pattern layer 40 are connected.
  • the high thermal conductive printed circuit board structure 2 of the second embodiment further includes a solder resist layer 60 partially covering the second circuit pattern layer 42 to expose only a portion of the region for subsequent connection components. Use.
  • the technical feature of the invention is that the high thermal conductive printed circuit board structure of the invention utilizes a large-area heat conducting plate, can effectively lead the heat source, and improve the performance and service life of the components on the printed circuit board, and is suitable for the light emitting diode and the high
  • the use of power semiconductor components, in addition to the use of ceramic and thermal glass, does not require the use of expensive and time-consuming sputtering technology, but also can be processed in advance, and then bonded to achieve high thermal conductivity, while saving production Cost and production time effects.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种高导热印刷电路板结构，包含导热板（10）、绝缘层（20）、金属图案层（30），及线路图案层（40），绝缘层（20）及金属图案层（30）推迭形成在导热板（10）的一表面上，且形成有导热孔（25）以曝露出导热板（10）的部份表面，线路图案层（40）至少形成在导热孔（25）的壁面及底部，及金属图案层（30）的表面上，与金属图案层（30）及导热板（10）连接，藉由此结构的设计能将热源传导至大面积的导热板来进行散热，能提升线路板上元件之效能及使用寿命，适用于发光二极体及高功率半导体元件的使用。

Description

Figure imgf000002_0001
随着半导体晶片的设计， 逐渐往高频的部份发展， 以及发光二极 体的功率提升， 承载该些元件的印刷电路板， 若是无法有良好的散热 功能， 则可能导致产品的效能下降、 易故障， 以及使用寿命缩短。
参阅图 1A， 为习用技术导热印刷电路板结构第一实施例的剖面 示意图。习用技术第一实施例的导热印刷电路板结构包含由绝缘导热 层 111及金属核 1 13、 线路层 120以及防焊层 130， 该金属核 113贴 附于该绝缘导热层 11 1的下表面， 线路层 120形成于该绝缘导热层 111的上表面， 而防焊层 130覆盖部分的线路层 120及该绝缘导热层 一实施例主要是利用下方的金
Figure imgf000002_0002
透过绝缘导热层 111， 由于绝缘材料的导热性质不佳， 即在便绝缘导 热层 111中添加导热粒子，但是整体的散热效果与一般导热材料相比 参阅图
示意图。 习
Figure imgf000002_0003
115、 线路层 120以及防焊层 130所构成， 利用陶瓷板 115的高散 * 一实施例的形式。 然而， 在陶瓷板 115上形成线路层
Figure imgf000002_0004
120 , 目前的工法通常有
Figure imgf000002_0005
使铜粉融入陶瓷板的表面， 或者 (2)在完成烧结后， 以溅镀法在表面 形成电镀种子层。然而，这些方法的成本上都较高、耗时较久，另外， 在线路堆迭时， 有时需要以雷射钻孔， 陶 烧结后质脆， 都可能因为 这些制程而造成损伤。
因此， 需要一种成本低廉、 制作容易 且具有高导热效果的导热 印刷电路板结构， 以应用于高功率的发 二极体， 或是半导体晶片， 以维持产品的使用效能及延长使用寿命。
本发明的主要目的在于提供一种高导热印刷电路板结构，该高导 热印刷电路板结构包含导热板、 绝缘层、 金属图案层， 以及线路图案 层， 该导热板可为金属板、 石墨板、 导热玻璃板， 以及陶瓷板的其中 之一， 绝缘层形成在导热板的一表面上， 金属图案层形成在绝缘层的 部份表面上， 金属图案层与该绝缘层具有重迭的开口图案， 而形成导 热孔， 而曝露出该导热板的部份表面。线路图案层形成在导热孔的壁 面及底部， 或填满该导热孔， 并形成在该金属图案层的表面上， 同时 与该金属图案层及该导热板连接。
当该导热板与线路图案层电性相通时，进一步包含至少一切割间 隙， 以将该导热板分割为复数个区块， 以避免金属图案层及线路图案 层短路， 并在该切割间隙中填入绝缘胶， 以维持该导热板的一体性及 机械强度。更进一步还可以堆迭绝缘层及金属图案层、并开设导通孔， 形成第二线路图案层来与线路图案层连接，而形成多层线路推迭的结 构。
藉由大面积的导热板， 能有效地将热源导出， 而提升印刷电路板 的效能及使用寿命， 适用于发光二极体及高功率半导体元件的使用， 另外， 当运用陶瓷及导热玻璃时， 不需运用昂贵且耗时的溅镀技术， 同时也能够预先进行加工， 再进行贴合， 而达到高导热特性， 同时具 有节省制作成本及制作时间的效果。
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面 将对实施例或现有技术描述中所需要使用的跗图作简单地介绍，显而 易见地， 下面描述中的附图仅仅是本发明的一些实施例， 对于本领域 普通技术人员来讲， 在不^出创造性劳动性的前提下， 还可以根据这 些附图获得其他的附图。
图 iA为习用技术导热印刷电路板结构第一实施例的剖面示意图。 图 IB为习用技术导热印刷电路板结构第二实施例的剖面示意图。 图 2为本发明高导热印刷电路板结构第一实施例的剖面示意图。 图 3为本发明高导热印刷电路板结构第二实施例的剖面示意图。
1 π¾导热印刷电路板结构
2 π¾导热印刷电路板结构
10导热板
20绝缘层
22第二绝缘层
25导热孔
27导通孔
30金属图案层
32第二金属图案层
40线路图案层
42第二线路图案层
50绝缘胶
55金属种子层
60防焯层
H i绝缘导热层
113金属核
115陶瓷板 的特定特征、 结构或特性至少可包含于本发明至少一个实现方式中。 在本说明书中不同地方出现的"实施例 "并非必须都指同一个实施例， 也不必须是与其他实施例互相排斥的单独或选择实施例。此外， 表示 一个或多个实施例的方法、流程图或功能框图中的模块顺序并非固定 的指代任何特定顺序， 也不构成对本发明的限制。
以下配合图式及元件符号对本发明之实施方式做更详细的说明， 俾使熟习该项技艺者在研读本说明书后能据以实施。
参阅图 2 , 本发明高导热印刷电路板结构第一实施例的剖面示意 图。如图 2所示， 本发明第一实施例的高导热印刷电路板结构 1包含 一导热板 10、一绝缘层 20、一金属图案层 30，以及一线路图案层 40， 该导热板 10为金属板、 石墨板、 导热玻璃板， 以及陶瓷板的其中之 一， 绝缘层 20形成在导热板 10的一表面上， 金属图案层 30形成在 绝缘层 20的部份表面上， 金属图案层 30与该绝缘层 20具有重迭的 开口图案， 而形成至少一导热孔 25， 而曝露出该导热板 10的部份表 面。线路图案层 40形成在导热孔 25的壁面及底部， 或填满该导热孔 25， 并形成在该金属图案层 30的（(部份)）表面上， 同时与该金属图 案层 30及该导热板 10连接， 其中该金属圈案层 30为铜或铝， 该线 路图案层 40为铜、 镍、 锌、 铝、 金、 银的至少其中之一。
进一步地， 在该导热板 10曝露于该导热孔 25的表面， 还包含一 金属种子层 55， 该金属种子层 55为铜或锌。 更进一步地， 当该导热 板 10与该金属种子层 55电性相通时， 进一步包含至少一切割间隙， 将该导热板 10切割为复数个区块，并在该切割间隙中填入绝缘胶 50 , 以避免金属图案层 30及线路图案层 40不当短路， 并维持该导热板 10的一体性及机械强度。 此外， 高导热印刷电路板结构 1还包含一 防焊层 60 ,该防焊层 60部份覆盖该线路图案层 40，仅露出部份区域， 以供后续连接元件之用。
参阅图 3， 本发明高导热印刷电路板结构第二实施例的剖面示意 图。如图 3所示， 本发明第二实施例的高导热印刷电路板结构 2基本 上为第一实施例的增层结构，导热板 10、绝缘层 20、金属图案层 30， 以及线路图案层 40实质上与第一实施例相同， 在此不在赘述。 第二 实施例的高导热印刷电路板结构 2还包含一第二绝缘层 22、 一第二 金属图案层 32及第二线路图案层 42 , 该第二绝缘层 22覆盖该绝缘 层 20、 该金属图案层 30， 以及该线路图案层 40 , 该第二金属图案层 32形成在该第二绝缘层 22的部份表面上， 该二金属图案层 32与该 第二绝缘层 22具有重迭的复数个开口图案，而形成复数个导通孔 27。 该等导通孔 27曝露出部份的该线路图案层 40。该第三线路图案层 42 至少形成在该导通孔 27的底部及壁面， 进一步填满该导通孔 27 , 并 形成在该第二金属图案层 32的表面上，同时与第二金属图案层 32及 该线路图案层 40连接。
进一步地，第二实施例的高导热印刷电路板结构 2还包含一防焊 层 60，该防焊层 60部份覆盖该第二线路图案层 42，仅露出部份区域， 以供后续连接元件之用。
本发明的技术特点在于，本发明高导热印刷电路板结构利用大面 积的导热板， 能有效地将热源导出， 而提升印刷电路板上元件的效能 及使用寿命， 适用于发光二极体及高功率半导体元件的使用， 另外， 当运用陶瓷及导热玻璃时， 不需运用昂贵且耗时的溅镀技术， 同时也 能够预先进行加工， 再进行贴合， 而达到高导热特性， 同时具有节省 制作成本及制作时间的效果。
上文对本发明进行了足够详细的具有一定特殊性的描述。所属领 域内的普通技术人员应该理解， 实施例中的描述仅仅是示例性的， 在 不偏离本发明的真实精神和范围的前提下做出所有改变都应该属于 本发明的保护范围。本发明所要求保护的范围是由所述的权利要求书 进行限定的， 而不是由实施例中的上述描述来限定的。

Claims

L 一种高导热印刷电路板结构， 包含：
一导热板；
一绝缘层， 形成在该导热板的一表面上；
一金属图案层， 形成在该绝缘层的部份表面上，且与该绝缘层具有重迭的 开口图案， 而形成至少一导热孔， 以曝露出该导热板的部份表面； 以及
一线路图案层， 形成在该至少一导热孔的壁面及底部， 或填满该至少一导 热孔， 及该金属图案层的表面上， 与该金属图案层及该导热板连接。
2, 如申请专利范围第 1项所述之该高导热印刷电路板结构， 其中该导 热板为金属板、 石墨板、 导热玻璃板， 以及陶瓷板的其中之一。
3. 如申请专利范围第 1项所述之该高导热印刷电路板结构， 其中该金 属图案层为铜或铝， 该线路图案层为铜、镍、锌、铝、金、 银的至少其中之一。
4. 如申请专利范围第 1项所述之该高导热印刷电路板结构， 其中该导 热板曝露于该等导热孔的表面，还包含一金属种子层，该金属种子层为铜或锌。
5. 如申请专利范围第 3项所述之该高导热印刷电路板结构， 当该导热 板与该金属种子层电性相通时， 该导热板进一步包含至少一切割间隙， 以将该 导热板分割为复数个区块。
6. 如申请专利范围第 4项所述之该高导热印刷电路板结构， 进一步在 至少一该切割间隙中填入一绝缘胶。
7. 如申请专利范围第 1项所述之该高导热印刷电路板结构， 进一步包 含一防焊层， 该防焊层部份覆盖该线路图案层。
8. 如申请专利范围第 1项所述之该高导热印刷电路板结构， 进一步包 含一第二绝缘层、一第二金属图案层及一第二线路图案层， 该第二绝缘层覆盖 该绝缘层、 该金属图案层， 以及该线路图案层， 该第二金属图案层形成在该第 二绝缘层的部分表面上， 并与该第二绝缘层具有重迭的复数个开口图案， 而形 成复数个导通孔， 该等导通孔曝露出部份的该线路图案层， 该第二线路图案层 形成在该第二金属圈案层的表面， 以及该等导通孔的底部及壁面， 或填满该等 导通孔， 同时与部份该线路图案层连接。
9. 如申请专利范围第 7项所述之该高导热印刷电路板结构， 进一步包 含一防焊层， 该防焊层部份覆盖该第二线路图
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JP2003046245A (ja) * 2001-07-30 2003-02-14 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法
KR20060105382A (ko) * 2005-04-04 2006-10-11 엘지전자 주식회사 인쇄회로기판의 접합구조 및 그 방법
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232755A (ja) * 1996-02-27 1997-09-05 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2003046245A (ja) * 2001-07-30 2003-02-14 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法
KR20060105382A (ko) * 2005-04-04 2006-10-11 엘지전자 주식회사 인쇄회로기판의 접합구조 및 그 방법
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