WO2015096351A1 - 有机发光二极管显示面板及其制作方法 - Google Patents
有机发光二极管显示面板及其制作方法 Download PDFInfo
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- WO2015096351A1 WO2015096351A1 PCT/CN2014/077298 CN2014077298W WO2015096351A1 WO 2015096351 A1 WO2015096351 A1 WO 2015096351A1 CN 2014077298 W CN2014077298 W CN 2014077298W WO 2015096351 A1 WO2015096351 A1 WO 2015096351A1
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- WIPO (PCT)
- Prior art keywords
- layer
- display panel
- oled display
- optical
- light
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 230000003287 optical effect Effects 0.000 claims abstract description 25
- 238000010168 coupling process Methods 0.000 claims abstract description 22
- 238000005859 coupling reaction Methods 0.000 claims abstract description 22
- 230000008878 coupling Effects 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 18
- 238000001704 evaporation Methods 0.000 claims description 6
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims 2
- 238000003475 lamination Methods 0.000 claims 2
- 238000004020 luminiscence type Methods 0.000 claims 2
- 238000002156 mixing Methods 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 description 73
- 238000000605 extraction Methods 0.000 description 8
- 238000007740 vapor deposition Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
Definitions
- Embodiments of the present invention relate to an OLED display panel and a method of fabricating the same. Background technique
- OLED Organic Light-Emitting Diode
- LCDs liquid crystal displays
- PDPs plasma display panels
- OLEDs have a wide range of applications in the field of display and illumination.
- the semiconductor light emitting element ensures high functional reliability and lower power consumption, it is necessary to improve the external quantum efficiency of the element itself (External quantum efficiency) 0
- the external quantum efficiency of the semiconductor light emitting element depends on its own Internal quantum efficiency and light extraction efficiency. The internal quantum efficiency is determined by the characteristics of the material itself. Therefore, it is particularly important to increase the light extraction efficiency of the semiconductor light-emitting component in the case where the internal quantum efficiency cannot be effectively improved. Summary of the invention
- At least one embodiment of the present invention provides a method of fabricating an OLED display panel, comprising: sequentially forming an anode, an organic light emitting layer, a cathode, and a first light coupling layer on a substrate, and in the first light bonding layer The side facing away from the cathode forms a second light-kapped layer arranged by a plurality of raised structures having a curved surface.
- the first reticle is vapor deposited on the first light-bonding layer to form the second light-coupling layer; the first reticle includes a plurality of layers for vapor deposition. An opening of the two light coupling layers, and the hole wall of the opening is perpendicular to the surface of the first mask.
- the opening on the first reticle is a slit
- the direction in which the slit is placed is perpendicular to a direction in which the slit on the second reticle on which the organic luminescent layer is formed is disposed.
- the surface formed by the vapor deposition is a semi-cylindrical shape in which the convex structure of the curved surface is a strip shape.
- the slit width on the first reticle is less than the slit width of the second reticle.
- the opening on the first mask is in the shape of a dot, and the surface formed by evaporation is an arc.
- the raised structure of the face is hemispherical.
- the aperture width of the dot-shaped opening is smaller than the width of the slit on the second mask used in forming the organic light-emitting layer.
- the sum of the thicknesses of the first light ply and second light ply layers is A / 4", A is the illuminating peak wavelength, and "is the first light ply and second The refractive index of the light-bonded layer.
- the materials of the first light ply and second light ply layers include: a mixed material of one or a mixture of ZnSe, Ti0 2 , Si0 2 , Si 3 N 4 , Alq 3 .
- At least one embodiment of the present invention also provides an OLED display panel including an anode, an organic light-emitting layer, a cathode, and a first light-bonding layer sequentially formed on a base substrate, and formed in the first light-combined layer
- the second light coupling layer is formed by a raised structure of a plurality of surfaces having a curved surface facing away from the side of the cathode.
- the raised surface having a curved surface is a strip-shaped semi-cylindrical shape.
- the diameter of the semi-cylindrical is smaller than the sub-pixel width of the display panel.
- the raised structure having a curved surface is hemispherical.
- the hemisphere has an aperture width that is less than a sub-pixel width of the display panel.
- the sum of the thicknesses of the first light ply layer and the second light ply layer is ⁇ / 4 ⁇ , which is the illuminating peak wavelength, and ⁇ is the first light ply and second light The refractive index of the layer.
- materials of the first light ply and second light ply layers include: ZnSe,
- FIG. 1 is a schematic structural view of an OLED display panel; a schematic view of a thin mask;
- Figure 3 is a cross-sectional view of the fine mask of the ordinary pixel of Figure 2 taken along the line AA; intent;; , , 1 , " Figure 5 is a cross-sectional view of the fine mask of Figure 4 taken along line BB;
- FIG. 6 is a schematic structural diagram of an OLED display panel according to an embodiment of the present invention. detailed description
- a material having a suitable thickness and a refractive index matching may be used as the cathode coating layer.
- a material having a high refractive index is usually used as an antireflection layer to increase the light extraction efficiency of the top emission device.
- the refractive index of the antireflection layer is greater than the refractive index of the air, part of the light is totally reflected when the light exits to the top end of the cathode coating. Therefore, full emission occurs on the light exiting side, which is not conducive to the removal of light and the loss of part of the light.
- An OLED display panel manufacturing method is provided by an embodiment of the present invention, and an OLED display panel as shown in FIG. 2 is manufactured.
- the method includes:
- step S1 the anode 2, the organic light-emitting layer 3, the cathode 4, and the first light-coupling layer 5 are sequentially formed on the base substrate 1.
- Each pixel of the OLED display panel includes a corresponding anode 2 and an organic light-emitting layer 3 And a cathode 4 and a first light junction layer 5.
- the anode 2, the organic light-emitting layer 3, the cathode 4, and the first light-bonding layer 5 are all fabricated using a conventional mask.
- the patterns of the corresponding anode 2, the organic light-emitting layer 3, the cathode 4, and the first light-bonding layer 5 can be sequentially vapor-deposited onto the base substrate 1 by vapor deposition.
- the step of fabricating the organic light-emitting layer 3 includes: sequentially depositing a hole injection layer and a hole transport layer on the anode 2; and vapor-depositing the sub-pixel R, G, and B light-emitting layers on the hole transport layer; The electron transport layer is vapor-deposited; and an electron injection layer is evaporated on the electron transport layer.
- FIG. 3 A schematic and cross-sectional view of a conventional mask (second mask) for vapor-depositing sub-pixel R, G, B light-emitting layers is shown in Figs. 3 and 4, respectively.
- a plurality of parallel slits 8 are present on the second mask, and R, G, and B luminescent materials are vapor-deposited through the slits 8 on the hole transport layer.
- the above description is made only by three sub-pixel light-emitting layers of R, G, and B.
- embodiments of the present invention are not limited to the light-emitting layer of the above sub-pixel, and may include other colors such as yellow or white.
- the cross section of the slit on the second mask is as shown in Fig. 3.
- the manufacturing method of the second mask is a conventional manufacturing method, and details are not described herein again.
- step S2 a second light-receiving layer 6 arranged by a plurality of convex structures having a curved surface is formed on a side of the first light-complex layer 5 facing away from the cathode 4.
- Step S2 includes: performing vapor deposition on the first light carrier layer 5 using the first mask to form a second light carrier layer 6.
- the first mask includes a plurality of openings for vapor-depositing the second light-bonding layer 6, and the aperture walls of the openings are perpendicular to the surface of the first mask. In this manner, the light-bonding layer material that is passed through the aperture is formed into a convex structure having a curved surface.
- the convex structure of the surface of the second light-trafficking layer 6 is such that the light originally on the surface of the first light-combination layer 5 is scattered, so that the light to be totally reflected can be transmitted, thereby reducing the total reflection of the light. Increases the light extraction rate and increases the external quantum efficiency of the device.
- the opening 8 on the first mask may be a slit, and the surface formed by vapor deposition is a curved semi-cylindrical structure having a convex structure.
- the direction in which the slits of the first mask are placed is perpendicular to the direction in which the slits on the second mask on which the organic light-emitting layer 5 is formed, so that the manufacturing process is simple and the semi-cylindrical can be closely arranged, further increasing The light extraction rate increases the external quantum efficiency of the device.
- the slit width on the first reticle is smaller than the slit width of the second reticle, such that the radius of the vapor-deposited semi-cylindrical is smaller than the sub-pixel width, which is more advantageous to the removal of light to some extent.
- the opening size L1 of the second mask is about 46.5 ⁇ m
- the opening size L2 of the first mask is about 3 ⁇ m
- the opening size L1 of the second mask is about 70 ⁇ m
- first The opening size L2 of the mask is about 5 ⁇ m. In this way, the radius of the semi-cylindrical is much smaller than the sub-pixel width.
- the opening 8 on the first reticle may also be in the form of a dot, and the surface formed by the vapor deposition may be a hemispherical convex structure.
- the aperture width of the dot-shaped opening is smaller than the width of the slit on the second mask used when the organic light-emitting layer 5 is formed.
- the sum of the thicknesses of the first light ply layer 5 and the second light ply layer 6 is ⁇ / 4 ⁇ , where ⁇ is the illuminating peak wavelength, “for the first light ply 5 And the refractive index of the second light-receiving layer 6. Since the material with a higher refractive index is advantageous for light extraction, in order to maximize the external quantum efficiency, "greater than or equal to 1.8.
- the materials of the first light coupling layer 5 and the second light coupling layer 6 are selected from materials having a higher refractive index, including: ZnSe, Ti0 2 , Si0 2 , Si 3 N 4 , Alq 3 (octahydroxyindole-Lin aluminum) One or a mixture of at least two.
- the spacing between two adjacent slits or two adjacent circular holes on the first reticle is brought to an appropriate distance, so that two adjacent strip-shaped semi-cylindrical or adjacent ones formed by evaporation are formed.
- the two hemispheres are in intimate contact to further increase the external quantum efficiency.
- An embodiment of the present invention further provides an OLED display panel, as shown in FIG. 2, comprising an anode 2, an organic light-emitting layer 3, a cathode 4, and a first light-bonding layer 5 which are sequentially formed on the base substrate 1.
- the display panel further includes: a second light peg layer 6 formed by a convex structure having a curved surface on a side of the first light peg layer 5 facing away from the cathode 4.
- the raised structure having a curved surface may be a strip-shaped semi-cylindrical shape.
- the diameter of the semi-cylindrical is smaller than the sub-pixel width of the display panel.
- the raised structure having a curved surface may also be hemispherical.
- the aperture width of the hemisphere is less than the sub-pixel width of the display panel.
- the sum of the thicknesses of the first light-bonding layer and the second light-complexing layer is A / 4n, where A is the illuminating peak wavelength and n is the refractive index of the first light-traveling layer and the second light-combining layer. In an embodiment, n is greater than or equal to 1.8.
- the first optical coupling layer and the second optical coupling layer select a material having a higher transmittance, including: one or at least two of ZnSe, Ti0 2 , Si0 2 , Si 3 N 4 , Alq 3 (octahydroxyquinoline aluminum) Mixed material.
- Embodiments of the present invention provide an OLED display panel and a method for fabricating the same, wherein a light-emitting structure on a surface of a first light-bonding layer is transmitted through a convex structure having a curved surface on a surface of the second light-coupling layer, thereby reducing The total reflection of light increases the extraction rate of light and increases the external amount of the device. Sub-efficiency.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/406,684 US9502691B2 (en) | 2013-12-26 | 2014-05-12 | Organic light-emitting diode display panel and manufacturing method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310738154.6A CN103715372B (zh) | 2013-12-26 | 2013-12-26 | Oled显示面板及其制作方法 |
CN201310738154.6 | 2013-12-26 |
Publications (1)
Publication Number | Publication Date |
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WO2015096351A1 true WO2015096351A1 (zh) | 2015-07-02 |
Family
ID=50408161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2014/077298 WO2015096351A1 (zh) | 2013-12-26 | 2014-05-12 | 有机发光二极管显示面板及其制作方法 |
Country Status (3)
Country | Link |
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US (1) | US9502691B2 (zh) |
CN (1) | CN103715372B (zh) |
WO (1) | WO2015096351A1 (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103715372B (zh) * | 2013-12-26 | 2017-08-25 | 京东方科技集团股份有限公司 | Oled显示面板及其制作方法 |
CN103996693B (zh) | 2014-04-24 | 2016-05-11 | 京东方科技集团股份有限公司 | Oled面板及其制备方法、显示装置 |
CN104319351A (zh) * | 2014-10-31 | 2015-01-28 | 京东方科技集团股份有限公司 | Oled阵列基板及其制备方法、显示面板、显示装置 |
CN105826354A (zh) * | 2016-04-14 | 2016-08-03 | 鄂尔多斯市源盛光电有限责任公司 | 一种阵列基板、显示面板及显示装置 |
CN109844975A (zh) * | 2016-07-20 | 2019-06-04 | 华为技术有限公司 | 有机发光显示器以及用于制造有机发光显示器的方法 |
CN107026239B (zh) * | 2016-09-22 | 2019-08-09 | 广东聚华印刷显示技术有限公司 | 有机电致发光器件及其制备方法和应用 |
CN106654029B (zh) * | 2016-12-14 | 2018-09-07 | 上海天马有机发光显示技术有限公司 | 一种有机发光显示面板及装置 |
CN106549113B (zh) * | 2017-01-16 | 2019-10-01 | 上海天马有机发光显示技术有限公司 | 一种有机发光显示面板及装置 |
CN109427845B (zh) * | 2017-08-25 | 2021-02-09 | 京东方科技集团股份有限公司 | 显示面板及其制作方法、电致发光器件、显示装置 |
CN108922984B (zh) * | 2018-07-26 | 2021-04-16 | 京东方科技集团股份有限公司 | 显示面板及其制备方法、显示设备 |
CN109148528B (zh) * | 2018-08-20 | 2021-04-02 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其制造方法、移动终端 |
CN110299462A (zh) * | 2019-06-25 | 2019-10-01 | 武汉华星光电半导体显示技术有限公司 | 有机电致发光器件及有机电致发光装置 |
US11430969B2 (en) | 2019-08-28 | 2022-08-30 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Electroluminescent component having metal layer disposed between two of optical coupling layers and display device having the same |
CN110600632A (zh) * | 2019-08-28 | 2019-12-20 | 武汉华星光电半导体显示技术有限公司 | 电致发光器件及显示装置 |
CN110729413B (zh) * | 2019-09-25 | 2021-12-03 | 武汉华星光电半导体显示技术有限公司 | 显示面板以及显示装置 |
CN111155055A (zh) * | 2020-01-06 | 2020-05-15 | 武汉华星光电半导体显示技术有限公司 | Oled面板、其蒸镀方法和其掩膜版组 |
CN113053989A (zh) * | 2021-03-31 | 2021-06-29 | 京东方科技集团股份有限公司 | 显示装置及其显示面板、oled显示器件 |
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- 2013-12-26 CN CN201310738154.6A patent/CN103715372B/zh active Active
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2014
- 2014-05-12 WO PCT/CN2014/077298 patent/WO2015096351A1/zh active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
CN103715372A (zh) | 2014-04-09 |
US9502691B2 (en) | 2016-11-22 |
CN103715372B (zh) | 2017-08-25 |
US20150372257A1 (en) | 2015-12-24 |
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