WO2015085682A1 - 通用型功率模块的散热机构 - Google Patents

通用型功率模块的散热机构 Download PDF

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Publication number
WO2015085682A1
WO2015085682A1 PCT/CN2014/074264 CN2014074264W WO2015085682A1 WO 2015085682 A1 WO2015085682 A1 WO 2015085682A1 CN 2014074264 W CN2014074264 W CN 2014074264W WO 2015085682 A1 WO2015085682 A1 WO 2015085682A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
power module
plate
base
top plate
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PCT/CN2014/074264
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English (en)
French (fr)
Inventor
张银
王晓宝
赵善麒
Original Assignee
江苏宏微科技股份有限公司
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Publication of WO2015085682A1 publication Critical patent/WO2015085682A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a heat dissipation mechanism of a general-purpose power module, and belongs to the technical field of power modules. Background technique
  • the semiconductor power module mainly includes a copper substrate, a metal-clad substrate, a semiconductor chip, and electrode terminals and a case.
  • the heat generated by the semiconductor chip can pass through the copper substrate and be transferred to the heat sink at the lower portion thereof to dissipate heat in the semiconductor chip.
  • the power of power devices is getting higher and higher, and the power consumption of semiconductor chips is gradually increasing.
  • the heat generated by semiconductor chips is also increasing, so it is necessary to dissipate heat of semiconductor chips in time.
  • the power module has a small installation space in the subsequent sequence.
  • the diversification of the power module package and the use of a large number of power modules make the density of the power module gradually increase, which also affects the external heat dissipation conditions of the power module. A higher requirement was put forward.
  • a conventional finned heat sink is used for the heat dissipation mechanism of the power module, and the heat sink is connected to the bottom of the copper substrate.
  • the height of the heat sink is high, so the mounting height of the power device is increased, so that the volume is higher. Large, for some small installation spaces, it does not apply.
  • users need to combine multiple standard power modules when using them. It is necessary to design a larger size heat sink to place multiple power modules separately, which not only occupies a large space, but also the heat sink of this structure limits the application of the power module. .
  • Another structure of the heat dissipation mechanism is to combine the fan and the heat sink.
  • the heat dissipation mechanism of this structure is also directed to a separate power module, which not only requires a large space, but also cannot be adapted to the generalization, centralization and diversity of the power module. Development trend. Summary of the invention
  • the object of the present invention is to provide a heat dissipation mechanism of a general-purpose power module which is reasonable in structure, simple in structure, good in versatility, convenient in use, convenient in assembling and dissipating a plurality of types of power modules, and having a stable heat dissipation effect.
  • a heat dissipation mechanism of a universal power module comprising a heat dissipation body, the heat dissipation body comprising a base, a top plate, and a sealing plate fixed between the base and the top plate and located in the middle portion Cooling space, at least two partitions are fixed between the base, the top plate and the sealing plate, the cooling space is divided into two or more independent cooling chambers, and the lower part of the base is provided with a lower pipe joint communicating with the respective cooling chambers, and the top plate is provided on the top plate
  • An upper pipe joint communicating with the respective cooling chambers, the front portion of each of the cooling chambers has a mounting surface of the heat dissipating body, the first power module or The adapter plate is sealed and mounted on the corresponding mounting surface, and the second power module is sealed and mounted on the adapter plate.
  • the present invention has the following features and advantages:
  • the heat dissipating body of the invention is provided with two or more independent cooling cavities, and the cooling cavities of the heat dissipating body form a mounting surface, so that two or more three-dimensional mounting faces can be formed on the heat dissipating body, and the first power module or the / adapter plate Installed on the respective mounting surfaces, and the second power module is mounted on the heat dissipation body through the adapter plate, so that various types and sizes of power modules can be collectively mounted on the heat dissipation body through the upper and lower pipe joints.
  • the external cooling medium is introduced into each cooling cavity, and the heat generated by each power mold block is forcibly dissipated by the cooling medium.
  • the structure is reasonable and simple, and the invention can not only increase the heat dissipation area of the power module, but also improve the heat dissipation area of the power module. Cooling effect, and the heat dissipation effect is stable.
  • the heat dissipation main body is designed with a plurality of mounting surfaces, and a plurality of power modules of the same size or different sizes can be installed on one heat dissipating body, and the multi-type power modules can be three-dimensionally mounted on the heat dissipating body, which has good versatility. It can greatly save installation space, increase the number and combination flexibility of power module combinations, facilitate user's subsequent installation, and adapt to the development trend of power module generalization, centralization and diversification.
  • FIG. 1 is a schematic structural view of a heat dissipation mechanism of a universal power module of the present invention.
  • Figure 2 is a schematic view of the A-direction structure of Figure 1.
  • FIG. 3 is a schematic structural view showing the heat dissipation mechanism of the universal power module of the present invention opening the first cover.
  • Fig. 4 is a schematic view showing the structure of the heat dissipating mechanism of the universal power module of the present invention for removing the second cover and the two sides and the first cover.
  • the heat dissipation mechanism of the universal power module of the present invention includes a heat dissipation body 2.
  • the heat dissipating body 2 of the present invention comprises a base 2-8, a top plate 2-3, and a sealing plate 2-4 fixed between the base 2-8 and the top plate 2_3 and located in the middle to form a cooling space, at least two partitions 2-7 It is fixed between the base 2-8, the top plate 2-3 and the sealing plate 2-4, and divides the cooling space into two or more independent cooling chambers, so that a plurality of three-dimensional cooling units can be formed on one heat dissipating body 2.
  • the base 2-8, the top plate 2-3, the sealing plate 2-4 and the partition plate 2_7 of the present invention may be integrally formed, or the base 2-8, the top plate 2-3, and the sealing plate 2-4 and the partition plate 2-7 may be separated. Installation, the bottom of the base 2_8 is provided with at least three legs 2-5, which can be fixed legs or adjustable legs.
  • the lower part of the base 2-8 of the present invention is provided with a lower pipe joint 2-10 communicating with the corresponding cooling cavity, and the upper part of the top plate 2-3 is provided with an upper pipe joint 2-1 communicating with the corresponding cooling cavity, and the cooling of the present invention
  • the unit adopts upper inlet water and lower outlet water, and each upper pipe joint 2-1 of the heat dissipation body 2 is respectively connected with a corresponding electromagnetic valve through a pipeline; each cooling unit of the present invention can also adopt a lower inlet water and an upper water outlet, and the heat dissipation body
  • the lower pipe joints 2-10 of the two are respectively connected to the corresponding solenoid valves through the pipelines, so that each cooling unit has an independent electromagnetic valve to control the water inlet, and the number of solenoid valves opened can be determined according to specific heat dissipation requirements.
  • each cooling chamber of the present invention has a mounting surface 2-11 of the heat dissipating body 2, and the first power module 1 or/and the adapter plate 5 are sealingly mounted on respective mounting surfaces 2 - 11 , the second power module 6 is sealingly mounted on the adapter plate 5 , and the heat dissipation body 2 is sealed and mounted on the other mounting faces 2-11 on which the first power module 1 or/and the adapter plate 5 are not mounted.
  • the cover 4 can maintain the overall aesthetics of the heat dissipation mechanism on the one hand, and can also indirectly cool the first power module 1 or/and the second power module 6 mounted on the adapter plate 5 by means of a cooling medium. .
  • the heat dissipating body 2 of the present invention has a prismatic shape with three or more edges, and the central portion of the prismatic shape is a through hole, and the heat dissipating body 2 is provided with 3 to 8 mounting faces 2-11, as shown in FIG. 1 and FIG.
  • the heat dissipating body 2 of the present invention has a hexagonal prism shape, and the heat dissipating body 2 is provided with six mounting faces 2-11, and a plurality of power modules can be collectively mounted on the heat dissipating body 2 and cooled.
  • three or more flow plates 2-6 are disposed on the two partition plates 2-7 of the respective cooling chambers, and the cooling chambers are separated to form a bent liquid flow path.
  • the heat energy of the power module can be fully exchanged to improve the heat dissipation efficiency.
  • the lower portion of the base 2-8 of the present invention is provided with lower connecting seats 2-12 corresponding to the respective cooling chambers
  • the upper part of the plate 2-3 is provided with an upper connecting seat 2-2 corresponding to the respective cooling chambers
  • the first front sealing groove 2-9 is provided on the mounting surface 2-11 of the heat radiating body 2, or the back surface of the first power module 1 is provided
  • There is a rear sealing groove the first sealing ring 8 is installed in the first front sealing groove 2-9 or the rear sealing groove
  • the first power module 1 is mounted on the upper connecting seat 2-2 and the lower connecting seat 2 through the fastener 3
  • the first power module 1 is hermetically mounted on the mounting surface 2-11 of the heat dissipation body 2.
  • the lower portion of the base 2-8 of the present invention is provided with a lower joint corresponding to the respective cooling chambers.
  • the upper part of the top plate 2-3 is provided with an upper connecting seat 2-2 corresponding to the respective cooling cavity
  • the adapter plate 5 is provided with at least one window
  • the adapter plate 5 is respectively provided with a transfer connecting seat on both sides of the window 5-1
  • the first front sealing groove 2-9 is disposed on the mounting surface 2-11 of the heat dissipation body 2 or the rear sealing groove is provided on the back surface of the adapter plate 5, and the first sealing ring 8 is installed in the first sealing groove In 2-8
  • the adapter plate 5 is mounted on the upper connector 2-2 and the lower connector 2-12 by fasteners 3. As shown in FIG.
  • the adapter plate 5 of the present invention is provided with 2 to 3 windows, and the adapter plate 5 is further provided with a second front sealing groove at the window, and the second sealing ring 9 is installed before the second.
  • the sealing groove the second power module 6 or/and the second cover 7 are mounted on the adapter base 5-1 by the fasteners 3, so that the adapter plate 5 is sealed and mounted on the mounting surface 2-11,
  • the second power module 6 or/and the second cover 7 are also hermetically mounted on the adapter plate 5, through which the different power modules can be mounted.
  • the adapter plate 5 of the present invention is provided with two windows, and the two second power modules 6 are sealingly mounted on the adapter plate 5; or as shown in FIG.
  • the second power module 6 on the adapter plate 5 Two windows are used to install the second power module 6, and the window of the second power module 6 is not installed to seal the second cover 7.
  • the first power module 1, the second power module 6 and more The multi-type power modules of different sizes are installed on the heat-dissipating body 2 and heat-dissipated.
  • the installation method is flexible and convenient, and can meet the installation of various types of power modules, and also leave space for installing power modules in the subsequent order.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种通用型功率模块的散热机构：散热主体（2）包括底座（2-8）、顶板（2-3）以及固定在底座（2-8）和顶板（2-3）之间内侧的封板（2-4）并构成一个冷却空间，至少两个隔板（2-7）固定在底座（2-8）、顶板（2-3）和封板（2-4）之间，将冷却空间分隔成两个以上独立的冷却腔，底底（2-8）下部设有与各自冷却腔相通的下管接头（2-10），顶板（2-3）上部设有与各自冷却腔相通的上管接头（2-1），各冷却腔的前部具有散热主体（2）的安装面（2-11），第一功率模块（1）或/和转接板（5）密封安装在各自对应的安装面（2-11）上，第二功率模块（6）密封安装在转接板（5）上。该散热机构使用灵活方便，能将多类型功率模块集中式安装和散热，且散热效果稳定，能适应功率模块通化、集中化和多样化的发展趋势。

Description

通用型功率模块的散热机构
技术领域
本发明涉及一种通用型功率模块的散热机构， 属于功率模块技术领域。 背景技术
半导体功率模块主要包括铜基板、覆金属陶瓷基板、半导体芯片以及电极端子和壳 体。在半导体功率模块在工作过程中， 半导体芯片所产生的热量能通过铜基板并传递至 其下部的散热器上， 将半导体芯片内的热量散出。但随着技术的发展， 功率器件的功率 越来越高，半导体芯片的功耗也在逐渐增加，往往半导体芯片所产生的热量也越来越大， 因此需要及时将半导体芯片的热量散出。 目前功率模块在后序的安装空间很小， 加之配 合使用的功率模块封装形式多样化以及多数量功率模块的使用，都使得功率模块的密度 逐渐在整加， 这也对功率模块的外部散热条件提出了较高的要求。
目前对于功率模块散热机构一种采用常规的翅片式的散热器，将散热器连接在铜基 板的底部，一方面散热器的高度较高，因此会增加功率器件的安装高度，使其体积较大， 对于一些狭小的安装空间， 则不能适用。尤其用户在使用时需要将多个标准的功率模块 进行组合， 需要设计较大尺寸散热器以分别放置多个功率模块， 不仅占用空间大， 而且 这种结构的散热器也限制了功率模块的应用。另一结构的散热机构是将风扇与散热器进 行组合， 但这种结构的散热机构也针对单独的功率模块， 不仅需要占用较大的空间， 而 且也不能适应功率模块通用化、 集中化和多样化的发展趋势。 发明内容
本发明的目的是提供一种结构合理、 简单， 通用性好， 使用灵活性方便， 能将多类 型的功率模块集中安装和散热， 且散热效果稳定的通用型功率模块的散热机构。
本发明为达到上述目的的技术方案是： 一种通用型功率模块的散热机构， 包括一个 散热主体， 所述散热主体包括底座、顶板以及固定在底座和顶板之间并位于中部的封板 构成一个冷却空间， 至少两个隔板固定在底座、 顶板和封板之间， 将冷却空间分隔成两 个以上独立的冷却腔， 底座下部设有与各自冷却腔相通的下管接头， 顶板上部设有与各 自冷却腔相通的上管接头， 各冷却腔的前部具有散热主体的安装面， 第一功率模块或 / 和转接板密封安装在各自对应的安装面上， 第二功率模块密封安装在转接板上。
与现有技术相比， 本发明具有以下特点和优点：
本发明的散热主体设有两个以上独立的冷却腔， 散热主体各冷却腔构成一个安装 面， 故在散热主体上能形成两个以上立体的安装面， 将第一功率模块或 /转接板安装在 各自的安装面上， 而第二功率模块通过转接板再安装在散热主体上， 因此能将不同型号 和尺寸的多类功率模块集中安装在散热主体上， 通过上、下管接头将外部的冷却介质通 入各冷却腔内， 通过冷却介质强制对各功率模热块在工作中所产生的热量进行强制散 热， 结构合理、 简单， 本发明不仅能增加功率模块的散热面积， 来提高散热效果， 而且 散热效果稳定。本发明将散热主体设计有多个安装面， 在一个散热主体上能安装尺寸相 同或尺寸不相同的多类功率模块， 可将多类功率模块立体安装在散热主体上， 具有较好 的通用性， 能大幅度节约安装空间， 也增加了功率模块组合的数量和组合的灵活性， 方 便用户的后序安装， 能适应功率模块通用化、 集中化和多样化的发展趋势。 附图说明
在此描述的附图仅用于解释目的， 而不意图以任何方式来限制本发明公开的范围。 另外， 图中的各部件的形状和比例尺寸等仅为示意性的， 用于帮助对本发明的理解， 并 不是具体限定本发明各部件的形状和比例尺寸。 本领域的技术人员在本发明的教导下， 可以根据具体情况选择各种可能的形状和比例尺寸来实施本发明。
图 1是本发明通用型功率模块的散热机构的结构示意图。
图 2是图 1的 A向结构示意图。
图 3是本发明通用型功率模块的散热机构打开第一盖板的结构示意图。
图 4是本发明通用型功率模块的散热机构拆除第二盖板及两侧和第一盖板的结构示 意图。
附图标记说明：
1—第一功率模块， 2—散热主体， 2-1—上管接头， 2-2—上连接座， 2_3—顶板，
2-4—封板， 2-5—支脚， 2-6—绕流板， 2-7—隔板， 2-8—底座， 2-9—第一前密封槽， 2-10—下管接头， 2-11—安装面， 2-12—下连接座， 3—紧固件， 4一第一盖板， 5—转 接板， 5-1—转接连接座， 6—第二功率模块， 7—第二盖板， 8—第一密封圈， 9一第二 密封圈。 具体实施方式
结合附图和本发明具体实施方式的描述，能够更加清楚地了解本发明的细节。但是， 在此描述的本发明的具体实施方式， 仅用于解释本发明的目的， 而不能以任何方式理解 成是对本发明的限制。在本发明的教导下， 技术人员可以构想基于本发明的任意可能的 变形， 这些都应被视为属于本发明的范围。
如图 1〜图 4所示， 本发明的通用型功率模块的散热机构， 包括一个散热主体 2。 本发明的散热主体 2包括底座 2-8、 顶板 2-3以及固定在底座 2-8和顶板 2_3之间并位 于中部的封板 2-4构成一个冷却空间， 至少两个隔板 2-7固定在底座 2-8、 顶板 2-3和 封板 2-4之间， 将冷却空间分隔成两个以上独立的冷却腔， 故能在一个散热主体 2上形 成多个立体的冷却单元。 本发明的底座 2-8、 顶板 2-3以及封板 2-4和隔板 2_7可整体 制作， 或底座 2-8、 顶板 2-3以及封板 2-4和隔板 2-7分体安装， 底座 2_8下部设有至 少三个支脚 2-5， 该支脚 2-5可为固定的支脚， 或为可调式的支脚。 本发明底座 2-8下 部设有与各自对应的冷却腔相通的下管接头 2-10，顶板 2-3上部设有与各自对应的冷却 腔相通的上管接头 2-1， 本发明各冷却单元采用上进水和下出水， 散热主体 2的各上管 接头 2-1分别通过管路与各自对应的电磁阀连接；本发明的各冷却单元还可采用下进水 和上出水， 散热主体 2的各下管接头 2-10分别通过管路与各自对应的电磁阀连接， 使 每个冷却单元都有独立的电磁阀控制进水，可视具体的散热要求，开通的电磁阀的数量。
如图 1〜图 4所示， 本发明各冷却腔的前部具有散热主体 2的安装面 2-11， 第一功 率模块 1或 /和转接板 5密封安装在各自对应的安装面 2-11上，第二功率模块 6密封安 装在转接板 5上， 散热主体 2在没有安装第一功率模块 1或 /和转接板 5的其它安装面 2-11上， 还密封安装有第一盖板 4， 一方面可保持散热机构的整体美观， 另一方面， 也 可以通入冷却介质而间接对第一功率模块 1或 /和安装在转接板 5上的第二功率模块 6 进行冷却。 本发明的散热主体 2呈具有三棱边以上的棱柱形， 且棱柱形的中部为通孔， 散热主体 2上设有 3〜8个安装面 2-11， 如图 1、 图 2所示， 本发明的散热主体 2呈六 棱柱形，散热主体 2上设有六个安装面 2-11，可将多个功率模块集中安装在该散热主体 2上并进行冷却。
如图 2〜图 4所示， 本发明在各冷却腔的两隔板 2-7上相错设有三个以上的绕流板 2-6， 将冷却腔相隔形成弯折形的液体流道， 通过各绕流板 2-6以延长冷却介质在各冷 却腔内的时间， 对功率模块的热量能进行充分交换， 而提高散热效率。
如图 1〜3所示， 本发明底座 2-8下部设有与各自冷却腔对应的下连接座 2-12， 顶 板 2-3上部设有与各自冷却腔对应的上连接座 2-2，散热主体 2的安装面 2-11上设有第 一前密封槽 2-9， 或第一功率模块 1的背面设有后密封槽， 第一密封圈 8安装在第一前 密封槽 2-9或后密封槽内，第一功率模块 1通过紧固件 3安装在上连接座 2-2和下连接 座 2-12上， 将第一功率模块 1密封安装在散热主体 2的安装面 2-11上。
如图 1、 图 2和图 4所示， 本发明底座 2-8下部设有与各自冷却腔对应的下连接座
2-12， 顶板 2-3上部设有与各自冷却腔对应的上连接座 2-2， 转接板 5设有至少一个窗 口，转接板 5在窗口的两侧分别设有转接连接座 5-1，散热主体 2的安装面 2-11上设有 第一前密封槽 2-9， 或转接板 5上的背面设有后密封槽， 第一密封圈 8安装在第一密封 槽 2-8内， 转接板 5通过紧固件 3安装在上连接座 2-2和下连接座 2-12上。 如图 1、 2 所示， 本发明的转接板 5上设有 2〜3个窗口， 转接板 5位于窗口处还设有第二前密封 槽， 第二密封圈 9安装在第二前密封槽内， 第二功率模块 6或 /和第二盖板 7通过紧固 件 3安装在转接连接座 5-1上， 方便将转接板 5密封安装在安装面 2-11上， 同时也将 第二功率模块 6或 /和第二盖板 7密封安装在转接板 5上， 通过转接板 5能安装不同的 功率模块。如图 1所示， 本发明的转接板 5上设有两个窗口， 两个第二功率模块 6密封 安装在转接板 5上； 或如图 2所示， 该转接板 5上的两个窗口一个用于安装第二功率模 块 6， 而没有安装第二功率模块 6的窗口则密封安装第二盖板 7， 本发明将第一功率模 块 1、 第二功率模块 6以及更多个尺寸不同的多类功率模块集中安装在散热主体 2上并 进行散热， 安装方式灵活方便， 能满足多品种的功率模块的安装， 也为后序安装功率模 块留下空间。
针对上述各实施方式的详细解释， 其目的仅在于对本发明进行解释， 以便于能够更 好地理解本发明， 但是， 这些描述不能以任何理由解释成是对本发明的限制， 特别是， 在不同的实施方式中描述的各个特征也可以相互任意组合， 从而组成其他实施方式， 除 了有明确相反的描述， 这些特征应被理解为能够应用于任何一个实施方式中， 而并不仅 局限于所描述的实施方式。

Claims

权利要求书
1、 一种通用型功率模块的散热机构， 其特征在于： 包括一个散热主体（2) ， 所述 散热主体（2)包括底座（2-8)、顶板 (2-3)以及固定在所述底座（2-8)和所述顶板 (2_3) 之间并位于中部的封板 (2-4)构成一个冷却空间， 至少两个隔板（2-7)固定在所述底座 (2-8 ) 、 所述顶板 (2-3)和所述封板 (2-4)之间， 将所述冷却空间分隔成两个以上独立 的冷却腔， 所述底座 （2-8 ) 下部设有与各自对应的冷却腔相通的下管接头 （2-10) ， 所述顶板 (2-3)上部设有与各自对应的冷却腔相通的上管接头（2-1 ) ， 各所述冷却腔的 前部具有所述散热主体（2) 的安装面（2-11 ) ， 第一功率模块（1 )或 /和转接板（5) 密封安装在各自对应的安装面（2-11 )上， 第二功率模块（6) 密封安装在所述转接板 ( 5)上。
2、 根据权利要求 1所述的通用型功率模块的散热机构， 其特征在于： 所述散热主 体（2)在没有安装所述第一功率模块（1 )或 /和转接板（5)的其它安装面（2-11 )上， 还密封安装有第一盖板（4) 。
3、 根据权利要求 1所述的通用型功率模块的散热机构， 其特征在于： 所述各冷却 腔的两隔板（2-7)上相错设有三个以上的绕流板 (2-6)， 将所述冷却腔相隔形成弯折形 的液体流道。
4、 根据权利要求 1所述的通用型功率模块的散热机构， 其特征在于： 所述的底座 (2-8)下部设有与各自冷却腔对应的下连接座（2-12) ， 所述顶板 (2-3)上部设有与各 自冷却腔对应的上连接座（2-2) ， 所述散热主体（2) 的安装面（2-11 )上设有第一前 密封槽， 或所述第一功率模块（1 ) 的背面设有后密封槽， 第一密封圈 （8)安装在第一 前密封槽（2-9) 或后密封槽内， 所述第一功率模块（1 )通过紧固件 （3) 安装在所述 上连接座 （2-2)和所述下连接座 （2-12)上。
5、 根据权利要求 1所述的通用型功率模块的散热机构， 其特征在于： 所述的底座 (2-8)下部设有与各自冷却腔对应的下连接座（2-12) ， 所述顶板 (2-3)上部设有与各 自冷却腔对应的上连接座（2-2) ， 所述的转接板（5)设有至少一个窗口， 所述转接板 ( 5)在所述窗口的两侧分别设有转接连接座 (5-1)，所述散热主体（2)的安装面（2-11 ) 上设有第一前密封槽（2-9)或所述转接板（5)上的背面设有后密封槽，第一密封圈（8) 安装在所述第一前密封槽（2-9) 内， 所述转接板（5 )通过紧固件（3 ) 安装在所述上 连接座 （2-2)和所述下连接座 （2-12)上。
6、 根据权利要求 5所述的通用型功率模块的散热机构， 其特征在于： 所述的转接 板（5)位于窗口处还设有第二前密封槽， 所述第二密封圈 （9)安装在所述第二前密封 槽内， 所述第二功率模块（6)或 /和第二盖板（7)通过紧固件（3)安装在所述转接连 接座（5-1)上。
7、 根据权利要求 1所述的通用型功率模块的散热机构， 其特征在于： 所述的散热 主体（2)呈具有三棱边以上的棱柱形， 且棱柱形的中部为通孔， 所述散热主体（2)上 设有 3〜8个安装面（2-11 ) 。
8、 根据权利要求 1所述的通用型功率模块的散热机构， 其特征在于： 所述散热主 体（2) 的各下管接头（2-10)或各上管接头（2-1 )分别通过管路与各自对应的电磁阀 连接。
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