WO2015070105A1 - Methods of manufacturing array camera modules incorporating independently aligned lens stacks - Google Patents
Methods of manufacturing array camera modules incorporating independently aligned lens stacks Download PDFInfo
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- WO2015070105A1 WO2015070105A1 PCT/US2014/064693 US2014064693W WO2015070105A1 WO 2015070105 A1 WO2015070105 A1 WO 2015070105A1 US 2014064693 W US2014064693 W US 2014064693W WO 2015070105 A1 WO2015070105 A1 WO 2015070105A1
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Definitions
- the present application relates generally to array cameras and more specifically to array cameras incorporating independently aligned lens stacks and physically discrete sensors forming an array, a single focal plane sensor utilizing a virtual array, or a monolithic sensor having multiple physical focal planes.
- Imaging devices such as cameras, can be used to capture images of portions of the electromagnetic spectrum, such as the visible light spectrum, incident upon an image sensor.
- the term light is generically used to cover radiation across the entire electromagnetic spectrum.
- light enters through an opening (aperture) at one end of the imaging device and is directed to an image sensor by one or more optical elements such as lenses.
- the image sensor includes pixels or sensor elements that generate signals upon receiving light via the optical element.
- Commonly used image sensors include charge-coupled device (CCDs) sensors and complementary metal-oxide semiconductor (CMOS) sensors.
- CCDs charge-coupled device
- CMOS complementary metal-oxide semiconductor
- Image sensors are devices capable of converting an optical image into a digital signal.
- Image sensors utilized in digital cameras are made up of an array of pixels. Each pixel in an image sensor is capable of capturing light and converting the captured light into electrical signals.
- a Bayer filter is often placed over the image sensor, filtering the incoming light into its red, blue, and green (RGB) components which are then captured by the image sensor.
- RGB red, blue, and green
- image capture utilizes a single image sensor, to capture individual images, one at a time.
- a digital camera typically combines both an image sensor and processing capabilities. When the digital camera takes a photograph, the data captured by the image sensor is provided to the processor by the image sensor. Processors are able to control aspects of a captured image by changing image capture parameters of the sensor elements or groups of sensor elements used to capture the image.
- Systems and methods in accordance with embodiments of the invention include processes for constructing array camera modules, array camera modules, and array cameras that include multiple lens stacks separately mounted to a carrier.
- One embodiment includes: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes; and mounting a module cap over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.
- forming at least one hole in at least one carrier includes forming at least one hole in a single carrier.
- mounting the single carrier relative to at least one sensor includes mounting the single carrier relative to a plurality of sensors.
- each of the plurality of sensors is mounted to a first side of the single carrier; each of the plurality of lens barrels is mounted to a second opposite side of the single carrier; and the plurality of sensors comprises a separate sensor for each of the plurality of lens barrels.
- the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
- flip chip mounting is utilized to mount the plurality of sensors to the single carrier.
- the plurality of sensors is mounted to a substrate and mounting the single carrier relative to the plurality of sensors comprises mounting the single carrier in a fixed location relative to the substrate.
- the plurality of sensors is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
- the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
- mounting the single carrier relative to at least one sensor includes mounting the single carrier relative to a single sensor.
- the single sensor is mounted to a first side of the single carrier; and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
- the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
- flip chip mounting is utilized to mount the single sensor to the single carrier.
- the single sensor is mounted to a substrate and mounting the single carrier relative to the single sensor comprises mounting the single carrier in a fixed location relative to the substrate.
- the single sensor is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
- the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
- forming at least one hole in at least one carrier comprises forming a ledge in at least one hole in the at least one carrier and mounting at least one spectral filter on the ledge.
- a yet further embodiment again also includes mounting at least one spectral filter within at least one hole in the at least one carrier.
- the at least one spectral filter is selected from the group consisting of a color filter and an IR-cut filter.
- a further additional embodiment again also includes mounting an interface device relative to the at least one carrier.
- the interface device is mounted to the carrier.
- the at least one sensor and the interface device are mounted to a substrate and mounting the at least one carrier relative to the at least one sensor comprises mounting the at least one carrier in a fixed location relative to the substrate.
- independently mounting a plurality of lens barrels to the at least one carrier comprises using active alignment to separately mount each of the lens barrels to one of the at least one carrier.
- the at least one hole in the at least one carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
- the at least one opening in the module cap are dimensioned so that the module cap is not visible within the field of view of any of the lens stacks and so that light does not reflect from the module cap into the lens stacks.
- the module cap is mounted to the at least one carrier so that a small air gap exists between the module cap and the top of the lens barrels and the method further comprises applying a small bead of adhesive to each of the lens barrels to seal the air gap between the module cap and the lens barrels.
- the carrier is constructed from a material selected from the group consisting of ceramic and glass.
- Still another further additional embodiment includes: forming a plurality of holes in carrier; mounting the carrier relative to a plurality of sensors so that light passing through each of the plurality of holes in the carrier is incident on one of a plurality of focal planes formed by the plurality of sensors; mounting at least one spectral filter within at least one of the plurality of holes in the carrier; independently mounting a plurality of lens barrels to the carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto a focal plane formed by a corresponding sensor in the plurality of sensors; and mounting a module cap over the lens barrels so that the module cap is attached to the carrier and a small air gap exists between the module cap and the top of the lens barrels, where the module cap includes a plurality of openings that each admits light into one of the plurality lens stacks contained within the plurality of lens barrels; and applying a small bead of adhesive to each of the lens barrels to seal the air gap between the
- An array camera module in accordance with an embodiment of the invention includes at least one carrier in which at least one window is formed; at least one sensor mounted relative to the at least one carrier so that light passing through the at least one window in the at least one carrier is incident on a plurality of focal planes formed by at least one array of pixels on the at least one sensor; a plurality of lens barrels mounted to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one window in the at least one carrier and focuses the light onto one of the plurality of focal planes; and a module cap mounted over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.
- the at least one carrier is a single carrier.
- each of the plurality of sensors is mounted to a first side of the single carrier; each of the plurality of lens barrels is mounted to a second opposite side of the single carrier; and the plurality of sensors comprises a separate sensor for each of the plurality of lens barrels.
- the plurality of sensors is mounted to a substrate and the single carrier is mounted in a fixed location relative to the substrate; and the plurality of sensors is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
- the at least one sensor is a single sensor.
- the single sensor is mounted to a first side of the single carrier; and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
- the single sensor is mounted to a substrate and the single carrier is mounted in a fixed location relative to the substrate; and the single sensor is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
- the at least one sensor is mounted to a substrate and each of a plurality of carriers is mounted in a fixed location relative to the substrate; and each of the plurality of lens barrels is mounted to a separate carrier.
- each lens barrel forms a separate aperture.
- each lens barrel and corresponding focal plane forms a camera; different cameras within the array camera module image different parts of the electromagnetic spectrum; and the lens stacks contained within the lens barrels differ depending upon the portion of the electromagnetic spectrum imaged by the camera to which the lens barrel belongs.
- the lens stacks contained within the lens barrels differ with respect to at least one of: the materials used to construct the lens elements within the lens stacks; the shapes of at least one surface of corresponding lens elements in the lens stacks.
- each lens stack in the lens barrels has a field of view that focuses light so that the plurality of arrays of pixels that form the focal planes sample the same object space within a scene.
- the pixel arrays of the focal planes define spatial resolutions for each pixel array; the lens stacks focus light onto the focal planes so that the plurality of arrays of pixels that form the focal planes sample the same object space within a scene with sub-pixel offsets that provide sampling diversity; and the lens stacks have modulation transfer functions that enable contrast to be resolved at a spatial frequency corresponding to a higher resolution than the spatial resolutions of the pixel arrays.
- At least one window in the at least one carrier includes a spectral filter.
- At least one window in at least one carrier comprises a ledge on which the at least one spectral filter is mounted.
- the at least one spectral filter is selected from the group consisting of a color filter and an IR-cut filter.
- at least one spectral filter is applied to an array of pixels forming a focal plane on at least one of the sensors.
- At least one lens stack includes at least one spectral filter.
- the plurality of lens barrels and the plurality of focal planes form an M x N array of cameras.
- the plurality of lens barrels and the plurality of focal planes form a 3 X 3 array of cameras.
- the M x N array of cameras comprises a 3 x 3 group of cameras including: a central reference camera; four cameras that capture image data in a first color channel located in the four corners of the 3 x 3 group of cameras; a pair of cameras that capture image data in a second color channel located on either side of the central reference camera; and a pair of cameras that capture image data in a third color channel located on either side of the central reference camera.
- the reference camera is selected from the group consisting of: a camera including a Bayer filter; and a camera that captures image data in the first color channel.
- Still another further embodiment also includes an interface device in communication with the at least one sensor, where the interface device multiplexes data received from the at least one sensor and provides an interface via which multiplexed data is read and the imaging parameters of the focal planes formed by the at least one pixel array on the at least one sensor are controlled.
- the interface device is mounted to the carrier and the carrier includes circuit traces that carry signals between the interface device and the at least one sensor; and a common clock signal coordinates the capture of image data by the at least one sensor and readout of the image data from the at least one sensor via the interface device.
- the at least one sensor and the interface device are mounted to a substrate, which includes circuit traces that carry signals between the interface device and the at least one sensor; the at least one carrier is mounted in a fixed location relative to the at least one sensor; and a common clock signal coordinates the capture of image data by the at least one sensor and readout of the image data from the at least one sensor via the interface device.
- the module cap is mounted to the at least one carrier so that a small air gap exists between the module cap and the top of the lens barrels and a small bead of adhesive seals the air gaps between the module cap and the lens barrels.
- the carrier is constructed from a material selected from the group consisting of ceramic and glass.
- Still another further embodiment again includes: a carrier in which a plurality of windows are formed; a plurality of sensors each including an array of pixels, where the plurality of sensors are mounted relative to the carrier so that light passing through the plurality of windows is incident on a plurality of focal planes formed by the arrays of pixels; a plurality of lens barrels mounted to the at least one carrier so that a lens stack in each lens barrel directs light through the at least one window in the at least one carrier and focuses the light onto one of the plurality of focal planes; and a module cap mounted over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.
- An embodiment of an array camera includes: a processor; memory containing an image capture application; an array camera module, comprising: at least one carrier in which at least one window is formed; at least one sensor mounted relative to the at least one carrier so that light passing through the at least one window in the at least one carrier is incident on a plurality of focal planes formed by at least one array of pixels on the at least one sensor; a plurality of lens barrels mounted to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one window in the at least one carrier and focuses the light onto one of the plurality of focal planes; and a module cap mounted over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.
- the image capture application directs the processor to: trigger the capture of image data by the array camera module; obtain and store image data captured by the array camera module, where the image data forms a set of images captured from different viewpoints; select a reference viewpoint relative to the viewpoints of the set of images captured from different viewpoints; normalize the set of images to increase the similarity of corresponding pixels within the set of images; determine depth estimates for pixel locations in an image from the reference viewpoint using at least a subset of the set of images, wherein generating a depth estimate for a given pixel location in the image from the reference viewpoint comprises: identifying pixels in the at least a subset of the set of images that correspond to the given pixel location in the image from the reference viewpoint based upon expected disparity at a plurality of depths; comparing the similarity of the corresponding pixels identified at each of the plurality of depths; and selecting the depth from the plurality of depths at which the identified corresponding pixels have the highest degree of similarity as a depth estimate for the given pixel location in the image from the reference
- each lens barrel forms a separate aperture.
- the lens stacks contained within the lens barrels differ with respect to at least one of: the materials used to construct the lens elements within the lens stacks; the shapes of at least one surface of corresponding lens elements in the lens stacks.
- the image capture application further directs the processor to fuse pixels from the set of images using the depth estimates to create a fused image having a resolution that is greater than the resolutions of the images in the set of images by: determining the visibility of the pixels in the set of images from the reference viewpoint by: identifying corresponding pixels in the set of images using the depth estimates; and determining that a pixel in a given image is not visible in the reference viewpoint when the pixel fails a photometric similarity criterion determined based upon a comparison of corresponding pixels; and applying scene dependent geometric shifts to the pixels from the set of images that are visible in an image from the reference viewpoint to shift the pixels into the reference viewpoint, where the scene dependent geometric shifts are determined using the current depth estimates; and fusing the shifted pixels from the set of images to create a fused image from the reference viewpoint having a resolution that is greater than the resolutions of the images in the set of images.
- the image capture application further directs the processor to synthesize an image from the reference viewpoint by performing a super- resolution process based upon the fused image from the reference viewpoint, the set of images captured from different viewpoints, the current depth estimates, and visibility information.
- the plurality of images comprises image data in multiple color channels; and the image capture application directs the processor to compare the similarity of pixels that are identified as corresponding at each of the plurality of depths by comparing the similarity of the pixels that are identified as corresponding in each of a plurality of color channels at each of the plurality of depths.
- the array camera module further comprises an interface device in communication with the at least one sensor, where the interface device multiplexes data received from the sensors and provides an interface via which the processor reads multiplexed data and via which the processor controls the imaging parameters of the focal planes formed by the plurality of pixel arrays.
- the interface device is mounted to the carrier and the carrier includes circuit traces that carry signals between the interface device and the at least one sensor; and a common clock signal coordinates the capture of image data by the at least one sensor and readout of the image data from the at least one sensor via the interface device.
- the at least one sensor and the interface device are mounted to a substrate, which includes circuit traces that carry signals between the interface device and the at least one sensor; the at least one carrier is mounted in a fixed location relative to the at least one sensor; and a common clock signal coordinates the capture of image data by the at least one sensor and readout of the image data from the at least one sensor via the interface device.
- Another further embodiment includes: a processor; memory containing an image capture application; an array camera module, comprising: a carrier in which a plurality of windows are formed; a plurality of sensors each including an array of pixels, where the plurality of sensors are mounted relative to the carrier so that light passing through the plurality of windows is incident on a plurality of focal planes formed by the arrays of pixels; a plurality of lens barrels mounted to the at least one carrier so that a lens stack in each lens barrel directs light through the at least one window in the at least one carrier and focuses the light onto one of the plurality of focal planes; and a module cap mounted over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.
- the image capture application directs the processor to: trigger the capture of image data by the array camera module; obtain and store image data captured by the array camera module, where the image data forms a set of images captured from different viewpoints; select a reference viewpoint relative to the viewpoints of the set of images captured from different viewpoints; normalize the set of images to increase the similarity of corresponding pixels within the set of images; determine depth estimates for pixel locations in an image from the reference viewpoint using at least a subset of the set of images.
- generating a depth estimate for a given pixel location in the image from the reference viewpoint includes: identifying pixels in the at least a subset of the set of images that correspond to the given pixel location in the image from the reference viewpoint based upon expected disparity at a plurality of depths; comparing the similarity of the corresponding pixels identified at each of the plurality of depths; and selecting the depth from the plurality of depths at which the identified corresponding pixels have the highest degree of similarity as a depth estimate for the given pixel location in the image from the reference viewpoint.
- the pixel arrays of the focal planes define spatial resolutions for each pixel array; the lens stacks focus light onto the focal planes so that the plurality of arrays of pixels that form the focal planes sample the same object space within a scene with sub-pixel offsets that provide sampling diversity; and the lens stacks have modulation transfer functions that enable contrast to be resolved at a spatial frequency corresponding to a higher resolution than the spatial resolutions of the pixel arrays; and the image capture application further directs the processor to fuse pixels from the set of images using the depth estimates to create a fused image having a resolution that is greater than the resolutions of the images in the set of images by: determining the visibility of the pixels in the set of images from the reference viewpoint by: identifying corresponding pixels in the set of images using the depth estimates; and determining that a pixel in a given image is not visible in the reference viewpoint when the pixel fails a photometric similarity criterion determined based upon a comparison of corresponding pixels; and applying scene dependent geometric shifts to
- FIG. 1 conceptually illustrates an array camera in accordance with an embodiment of the invention.
- FIGS. 2A - 2C schematically illustrate an array camera module in accordance with an embodiment of the invention.
- FIG. 3 is a flow chart illustrating a process for manufacturing an array camera module in accordance with an embodiment of the invention.
- FIGS. 4 and 5 conceptually illustrate the mounting of filters to a carrier during the construction of an array camera module in accordance with an embodiment of the invention.
- FIG. 6 conceptually illustrates cameras forming a ⁇ filter group in which red and blue cameras are located on either side of a central green camera that can serve as a reference camera.
- FIGS. 7 and 8 conceptually illustrate the mounting of sensors that each contain a single focal plane on a carrier during the construction of an array camera module in accordance with an embodiment of the invention.
- FIGS. 9 and 10 conceptually illustrate the mounting of lens barrels to a carrier during the construction of an array camera module in accordance with an embodiment of the invention.
- FIG. 1 1 conceptually illustrates an active alignment tool gripping a lens barrel at a 45 degree angle relative to a 2 x 2 array formed by the gripped lens barrel and three adjacent lens barrels during the construction of an array camera module in accordance with an embodiment of the invention.
- FIG. 12 conceptually illustrates attachment of a module cap to a carrier during the construction of an array camera module in accordance with an embodiment of the invention.
- FIG. 13 conceptually illustrates an array camera module including a carrier on which a 3 x 3 array of sensors and an interface device are mounted in accordance with an embodiment of the invention.
- FIG. 14 conceptually illustrates a substrate assembly that can be utilized in the construction of an array camera module in accordance with an embodiment of the invention.
- FIG. 15 conceptually illustrates an array camera module in which a single sensor is attached to a glass carrier in accordance with an embodiment of the invention.
- An array camera is an image capture device that includes multiple lens stacks or optical channels that direct light onto a corresponding number of focal planes, enabling the capture of multiple images of a scene using the focal planes.
- the light received via each of the lens stacks passes through a separate aperture and so each of the captured images constitutes a different view of the scene.
- super-resolution processes such as those described in U.S. Patent Publication No.
- focal plane can be used to describe a region on a sensor containing an array of pixel elements configured to capture an image based upon light directed onto the focal plane via a lens stack or optical channel.
- each focal plane is implemented using a separate sensor.
- array cameras are implemented using sensors that include multiple focal planes, where each focal plane receives light from a separate optical channel. As such, the sensor is configured to separately and (in many instances) independently capture and output image data from each of the focal planes.
- the array cameras disclosed in U.S. Patent Publication No. 201 1/0069189 entitled “Capturing and Processing of Images Using Monolithic Camera Array with Heterogeneous Imagers", to Venkataraman et al. include examples of array cameras in which the lens stacks of the array camera are implemented as a single lens stack array that is aligned and mounted to a sensor.
- the large number of tolerances involved in the manufacture of a lens stack array can result in the different optical channels having varying focal lengths.
- the combination of all the manufacturing process variations typically results in a deviation of the actual ("first order") lens parameters - such as focal length - from the nominal prescription.
- each optical channel can have a different axial optimum image location.
- the lens stack array typically cannot be placed a distance that corresponds with the focal length of each lens stack within an array camera module.
- these manufacturing tolerances may result in different focal lengths even as between lens stack arrays fabricated from the same manufacturing process.
- the disclosure within U.S. Patent Publication No. 201 1/0069189 regarding the implementation of different array camera architectures including monolithic array cameras, non-monolithic array cameras, and arrays of array cameras is hereby incorporated by reference herein in its entirety.
- Array cameras in accordance with embodiments of the invention are constructed by independently aligning each lens stack with respect to a corresponding focal plane. In this way, each lens stack can be optimally aligned with respect to a corresponding focal plane.
- an active alignment process is utilized to align each lens stack with respect to its corresponding focal plane.
- active alignment typically refers to a process for aligning an optical system (e.g. a lens stack array) with an imaging system (e.g. comprising a monolithic sensor) to achieve a final desirable spatial arrangement by evaluating the efficacy of the configuration as a function of the spatial relationship between the optical system and the imaging system.
- this process is implemented by using the configuration to capture and record image data (typically of a known target) in real time as the optical system is moving relative to the imaging system.
- the spatial relationship between the two changes, and the characteristics of the recorded image data also change correspondingly.
- This recorded image data may then be used to align the optical system relative to the imaging system in a desired manner.
- active alignment can generally be used to determine a spatial relationship that results in a camera that is capable of recording images that exceed a threshold image quality.
- an array camera module is constructed using a ceramic carrier in which windows through the ceramic carrier are formed.
- a single sensor or multiple sensors can be fixed to one side of the ceramic carrier to form the focal planes of the array camera module and lens barrels containing lens stacks can be affixed to the other side of the ceramic carrier so that the lens stacks direct light onto the focal planes of the one or more sensors through the openings in the ceramic carrier.
- the ceramic carrier is rigid and can have a co-efficient of thermal expansion (CTE) selected to match the CTE of the sensor.
- the ceramic carrier reduces the likelihood that mismatches in thermal expansion will result in changes in the alignment between the lens stacks and corresponding focal planes that deteriorate the quality of the images that can be synthesized using the image data captured by the focal planes.
- any of a variety of substrate materials exhibiting rigidity and low CTE can be utilized as a substitute for a ceramic carrier including (but not limited to) a transparent glass substrate.
- a variety of mounting techniques can be utilized including (but not limited to) mounting one or more sensors to a substrate and mounting the lens barrels containing the lens stacks to a carrier, or mounting individual camera modules to a substrate.
- Array cameras constructed using array camera modules incorporating independently aligned lens stacks and methods for constructing array camera modules incorporating independently aligned lens stacks are discussed further below.
- FIG. 1 An array camera including an array camera module in accordance with an embodiment of the invention is illustrated in FIG. 1 .
- the array camera 100 includes an array camera module 102 including an array of cameras 104.
- the array camera module 102 is configured to communicate with a processor 108, which can execute an image capture application stored as non-transitory machine readable instructions within a memory 1 10.
- the memory 1 10 can also be utilized to store image data captured by the array camera module.
- the array camera module 102 includes an array of focal planes on which images are formed by an array of lens stacks. Each lens stack creates an optical channel that forms an image of the scene on an array of light sensitive pixels within a corresponding focal plane. Each lens stack is independently mounted within array camera module 102 to form a single camera 104 with the corresponding focal plane on which the lens stack forms an image. In many embodiments, each lens stack can be actively aligned with respect to its corresponding focal plane to improve the quality of the image data capture by the focal plane.
- the pixels within a focal plane of a camera 104 generate image data that can be sent from the array of cameras 104 to the processor 108.
- the lens stack within each optical channel have fields of view that focus light so that pixels of each focal plane sample the same object space or region within the scene.
- the lens stacks are configured so that the pixels that sample the same object space do so with sub-pixel offsets to provide sampling diversity that can be utilized to recover increased resolution through the use of super-resolution processes.
- sampling diversity refers to the fact that the images from different viewpoints sample the same object in the scene but with slight sub-pixel offsets.
- the lens stacks are designed to have a Modulation Transfer Function (MTF) that enables contrast to be resolved at a spatial frequency corresponding to the higher resolution and not at the spatial resolution of the pixels that form a focal plane.
- MTF Modulation Transfer Function
- the cameras 104 are configured in a 3x3 array. In other embodiments, any of a variety of M x N camera array configurations can be utilized including linear arrays (i.e. 1 x N arrays). Each camera 104 in the array camera module 102 is capable of capturing an image of the scene.
- the sensor elements utilized in the focal planes of the cameras 104 can be individual light sensing elements such as, but not limited to, traditional CIS (CMOS Image Sensor) pixels, CCD (charge-coupled device) pixels, high dynamic range sensor elements, multispectral sensor elements and/or any other structure configured to generate an electrical signal indicative of light incident on the structure.
- the sensor elements of each focal plane have similar physical properties and receive light via the same optical channel and color filter (where present).
- the sensor elements have different characteristics and, in many instances, the characteristics of the sensor elements are related to the color filter applied to each sensor element.
- color filters in individual cameras can be used to pattern the camera module with ⁇ filter groups as further discussed in U.S. Patent Publication No. 2013/0293760 entitled "Camera Modules Patterned with pi Filter Groups", the disclosure from which related to filter patterns that can be utilized in the implementation of an array camera is incorporated by reference herein in its entirety.
- Any of a variety of color filter configurations can be utilized where cameras in each color channel are distributed on either side of the center of the camera. The cameras can be used to capture data with respect to different colors, or a specific portion of the spectrum.
- cameras image in the near-IR, IR, and/or far-IR spectral bands.
- color filters in many embodiments of the invention are mounted to a ceramic carrier to which one or more sensors and/or the lens stacks are mounted, or included in the lens stack. Where the sensor(s) and lens stacks are mounted to a glass substrate, the color filters can be applied to the glass substrate.
- a green color camera can include a lens stack with a green light filter that allows green light to pass through the optical channel.
- the pixels in each focal plane are the same and the light information captured by the pixels is differentiated by the color filters in the corresponding lens stack for each filter plane.
- spectral filters within array camera modules can be implemented in a variety of other ways including (but not limited to) by applying color filters to the pixels of the focal planes of the cameras similar to the manner in which color filters are applied to the pixels of a conventional color camera.
- at least one of the cameras in the camera module can include uniform color filters applied to the pixels in its focal plane.
- a Bayer filter pattern is applied to the pixels of at least one of the cameras in a camera module.
- camera modules are constructed in which color filters are utilized in both the lens stacks and on the pixels of the imager array.
- the processor 108 is configured to take the image data captured by the sensor and synthesize high resolution images. In a number of embodiments, the processor 108 is configured to measure distances to or depth of objects in the scene using the set of images captured by the array camera module. In many embodiments, the process of synthesizing high resolution images from a set of images captured by the array camera module also involves generating depth information with respect to objects visible within the field of view of the array camera.
- U.S. Patent 8,619,082 entitled "Systems and Methods for Parallax Detection and Correction in Images Captured Using Array Cameras that Contain Occlusions using Subsets of Images to Perform Depth Estimation" to Ciurea et al.
- a set of images is created using the image data captured by the cameras in the array camera module and can be considered to be a number of images of the scene captured from different viewpoints.
- the set of images can be normalized to increase the similarity of corresponding pixels within the images.
- the process of estimating depth and/or building a depth map of the scene from the reference viewpoint involves determining depth estimates for pixel locations in an image from the reference viewpoint using at least a subset of the set of images, wherein generating a depth estimate for a given pixel location in the image from the reference viewpoint includes: identifying pixels in the at least a subset of the set of images that correspond to the given pixel location in the image from the reference viewpoint based upon expected disparity at a plurality of depths; comparing the similarity of the corresponding pixels identified at each of the plurality of depths; and selecting the depth from the plurality of depths at which the identified corresponding pixels have the highest degree of similarity as a depth estimate for the given pixel location in the image from the reference viewpoint.
- the array camera module can compare the similarity of pixels that are identified as corresponding at each of the plurality of depths by comparing the similarity of the pixels that are identified as corresponding in each of the color channels at each of the plurality of depths.
- a higher resolution image is synthesized from the set of images obtained from the array camera module by fusing pixels from the set of images using the depth estimates to create a fused image having a resolution that is greater than the resolutions of the images in the set of images.
- the fusion process can include: identifying the pixels from the set of images that are visible in an image from the reference viewpoint using the at least one visibility map; applying scene dependent geometric shifts to the pixels from the set of images that are visible in an image from the reference viewpoint to shift the pixels into the reference viewpoint, where the scene dependent geometric shifts are determined using the current depth estimates; and fusing the shifted pixels from the set of images to create a fused image from the reference viewpoint having a resolution that is greater than the resolutions of the images in the set of images.
- the process of synthesizing a higher resolution image involves performing an additional super-resolution process based upon the fused image from the reference viewpoint, the set of images captured from different viewpoints, the current depth estimates, and the visibility information.
- the fusion and super-resolution processes are described in more detail in U.S. Patent Publication No. 2012/0147205 the relevant disclosure of which is incorporated by reference herein and above in its entirety.
- the processor 108 is able to synthesize an image from a virtual viewpoint.
- a virtual viewpoint is any viewpoint which is not the reference viewpoint.
- the virtual viewpoint corresponds to a viewpoint of one of the cameras 104 in the array camera module 102 that is not the reference camera.
- the processor is able to synthesize an image from a virtual viewpoint, which does not correspond to any camera 104 in the array camera module 102.
- array camera architectures are described above with respect to FIG. 1 , alternative architectures can also be utilized in accordance with embodiments of the invention.
- Array camera modules including independently aligned lens stacks in accordance with embodiments of the invention and discussed further below.
- array camera modules incorporating independently aligned lens stacks can offer a variety of benefits including (but not limited to) capturing image data using focal planes that are located at the back focal length of their corresponding lens stacks.
- array camera modules constructed in accordance with many embodiments of the invention interpose materials between sensors and lens barrels containing the lens stacks that reduce the impact of CTE mismatch between the low CTE semiconductor materials from which the sensors are fabricated and the higher CTE materials from which the lens barrels are constructed. Accordingly, array camera modules can be constructed that achieve precise alignment of optics and robustness to variations in thermal conditions.
- FIGS. 2A - 2C An array camera module incorporating independently aligned lens stacks in accordance with an embodiment of the invention is illustrated in FIGS. 2A - 2C.
- FIGS. 2B and 2C illustrate cross sections of an array camera module 102 illustrated in FIG. 2A taken along an axis 164.
- the array camera module 102 includes a carrier 300, which can be implemented using a ceramic carrier and/or any of a variety of materials possessing rigidity and low CTE that are appropriate to the requirements of a specific application.
- Windows extend from a first side 302 through to a second side 204 of the carrier 300. Windows can be holes and or transparent regions of the carrier. In the illustrated embodiment, the windows are rectangular holes and color filters and/or IR cut-off filters 305 are mounted within the opening of each hole.
- spectral filters can be located within the lens barrels and/or on the sensor elements of the focal planes.
- At least one sensor 310 is mounted on the first side 302 of the carrier so that the sensor pixels are positioned facing inward to receive light that passes through the color filter 305 mounted within the carrier 300.
- a single sensor is shown per camera.
- a single sensor can form the focal planes of multiple cameras.
- a single sensor forms the focal planes of all of the cameras in the array.
- the single sensor includes a single array of pixels that is read out to capture an image from each of the optical channels formed by the lens barrels.
- the single sensor includes a separate independently controllable array of pixels that form the focal planes of each of the cameras.
- a lens barrel 320 containing a lens stack is mounted on the second side 304 of the carrier 300.
- the lens barrel forms an aperture and each lens barrel 320 is positioned so that the outermost lens 322 of the lens stack contained within the lens barrel directs light into the lens stack.
- cameras in the array camera module image different parts of the electromagnetic spectrum and the lens stacks contained within the lens barrels differ depending upon the color channel to which the camera belongs.
- the surfaces of the lens elements, and/or the material used in the construction of the lens elements within the lens stacks differ based upon the portion of the spectrum imaged by a camera.
- a module cap 330 is fixed to the carrier 300 and extends over the lens barrels 320.
- the outermost lens 322 contained within each lens barrel 320 receives light through an opening in the module cap 330.
- the openings in the module cap 330 can be dimensioned to avoid the module cap 330 from obscuring the fields of view of the lens stacks and/or reflecting light into the lens stacks.
- the module cap can include one or more cover glasses through which the lens barrels can receive light.
- 2A - 2C utilize a separate sensor mounted to the carrier for each camera in the array camera module, a single sensor or multiple sensors incorporating more than one focal plane can be mounted to one side of carrier with a separate lens barrel for each camera mounted to the other side of the carrier.
- the sensor(s) need not be mounted to the same carrier as the lens barrels.
- the substrate to which the sensor(s) are mounted whether the carrier or a separate substrate, can include circuit traces that provide power to the sensor(s) and enable read out of data.
- the sensor(s) can be mounted to a substrate and independent carriers can be utilized to mount the lens barrels to the sensor(s).
- the sensors can communicate with another device mounted to the substrate that multiplexes data received from the sensors and provides an interface via which a processor can read out multiplexed data and control the imaging parameters of the focal planes within the array camera module. Processes for constructing array camera modules in accordance with embodiments of the invention are discussed further below.
- a variety of processes can be utilized to construct array camera modules in accordance with embodiments of the invention and the specific processes that are utilized typically depend upon the materials utilized in the construction of the array camera module and the manner in which one or more sensors and/or each camera's lens barrel is mounted.
- the process of manufacturing an array camera module includes independently actively aligning each lens barrel.
- FIGS. 3 - 13 A process for manufacturing an array camera module utilizing a carrier to which one or more sensors and camera lens barrels are independently mounted using active alignment in accordance with an embodiment of the invention is illustrated in FIGS. 3 - 13.
- the process 350 includes manufacturing (360) a carrier.
- each camera is formed around a window in the carrier that enables a lens stack contained within a lens barrel to direct light onto the focal plane of a sensor.
- a color filter and/or an IR cut-off filter can be mounted within an opening in the carrier that forms window.
- the process of manufacturing the carrier includes forming the appropriate windows, which can involve forming holes through the carrier or applying light blocking masks to a transparent carrier to define transparent windows through the carrier.
- ledges are formed within the holes to facilitate the mounting of color filters and/or IR cut-off filters within the hole.
- color filters and/or additional filters such as (but not limited to) IR cut-off filters can be mounted (362) so that light passes through the filters in order to pass from one side of the carrier through a window to the other side of the carrier.
- green 306, blue 307, and red 308 color filters are inserted along with IR cut-off filters into holes 301 formed within the carrier 300.
- the carrier is configured to be incorporated into an array camera module containing nine cameras and green color filters are incorporated within five of the cameras, two cameras incorporate blue color filters 307 and two cameras incorporate red color filters 308.
- the configuration of the cameras forms the 7 ⁇ filter group conceptually illustrated in FIG.
- red and blue cameras are located equidistant and on either side of a central green camera that can serve as a reference camera.
- any of a variety of filters applied in any of a variety of patterns can be utilized as appropriate to the requirements of specific applications.
- many applications do not involve the application of filters to the carrier.
- an array camera module that includes one or more Bayer cameras can utilize one or more sensors to which color filters are directly applied.
- the techniques described above are utilized to form a ⁇ filter group with a central Bayer camera or an array in which each camera is a Bayer camera. The specific selection of filters typically depends upon the requirements of a specific application.
- one or more sensors are mounted (364) to the carrier so that light passing through the windows in the carrier is incident on the focal planes of the sensor(s).
- the mounting of sensors that each contain a single focal plane is illustrated in FIGS. 7 and 8.
- Each sensor 310 is mounted to a first side 302 of the carrier 300.
- the color filters are mounted within or covering the opening on the second side 304 of the carrier.
- flip chip mounting is utilized to mount the one or more sensors to the carrier.
- the mounting of one or more sensors to the carrier is optional. Sensors can be mounted to another substrate that is fixed in a location relative to a carrier to which the lens barrels of the cameras are mounted at some stage during the construction of the array camera module.
- the process 350 includes independently mounting (366) each of the lens barrels of the cameras to the carrier.
- the mounting of lens barrels 320 to the second surface 304 of the carrier 300 is conceptually illustrated in FIGS. 9 and 10.
- active alignment is utilized to align each of the lens barrels to the carrier.
- the windows in the carrier which define the mounting locations of the lens barrels and the dimensions of the lens barrels are determined to enable an active alignment tool to grip the lens barrel during active alignment.
- lens barrels can be placed close together by utilizing the ability of an active alignment tool to grip a lens barrel located adjacent three other lens barrels in a 2 x 2 array at an angle relative to the rows and columns of the 2 x 2 array.
- the gripper of the active alignment tool does not need to extend through the narrowest portion of the gap between any two of the adjacent lens barrels in order to place a lens barrel. Therefore, the gap between any two adjacent lens barrels is not dependent upon the dimensions of the gripper of the active alignment tool.
- An active alignment tool gripping a lens barrel at a 45 degree angle relative to a 2 x 2 array formed by the gripped lens barrel and three adjacent lens barrels in accordance with an embodiment of the invention is illustrated in FIG. 1 1 .
- each member 370 of the gripper is greater than the spacing between adjacent lens barrels.
- the members 370 of the gripper need not extend into the narrowest portion of the gap between adjacent lens barrels (2) and (5). While the axis on which the lens barrel is gripped in the illustrated embodiment is at a 45 degree angle relative to the axes of the rows and columns of the lens barrel array, the specific angle of the axis on which the lens barrel is gripped relative to the axes of the rows and columns of the lens barrel array is largely determined based upon the dimensions of the gripper of the active alignment machine and the available spacing between adjacent lens barrels.
- the lens barrels 320 are numbered to indicate the order in which the lens barrels were placed on the carrier 300.
- the first lens barrel (1 ) placed on the carrier using the active alignment machine was placed in the center of the carrier.
- Lens barrels (2), (3), (4), and (5) were then placed in the remaining positions within a 3 x 3 array that are not corners.
- lens barrels (6), (7), (8), and (9) were placed in the corners of the 3 x 3 array.
- FIG. 1 1 Although a specific sequence is illustrated in FIG. 1 1 , alternative sequences can be utilized in which a pair of lens barrels is identified (4) and (7) and a third lens barrel (10) is placed using active alignment to form an L shape.
- a 2 x 2 array of lens barrels (4), (7), (10), and (1 1 ) can then be formed by positioning the gripper to contact the lens barrel of a fourth lens barrel (1 1 ) along an axis at an angle relative to the axis of the rows and columns of the 2 x 2 array.
- the process can then be repeated with respect to each adjacent pair of lens barrels (e.g. lens barrels 7 and 3) and/or each L shaped group of lens barrels formed by the placement of lens barrels (e.g.
- the spacing between the lens barrels can be determined in a manner that is not related to the dimensions of the gripper used to clasp the lens barrel during the active alignment process.
- a module cap can be mounted (368) over the lens barrels and attached to the carrier to protect the lens barrels. Attachment of a module cap to a carrier in accordance with an embodiment of the invention is illustrated in FIG. 12.
- the module cap 330 includes openings 332 that admit light into the lens stacks contained within the lens barrels 320. Ideally, the openings in the module cap are dimensioned so that the module cap is not visible within the field of view of any of the lens stacks and/or so that light does not reflect from the module cap into the lens stacks. In several embodiments, a small air gap exists between the module cap and the top of the lens barrels.
- the module cap is constructed from a low CTE polymer such as (but not limited to) a glass filled liquid crystal polymer. By utilizing a low CTE polymer, warping of the lens barrels due to CTE mismatch between the carrier and the module cap can be avoided.
- the module cap can be constructed from any material appropriate to the requirements of a specific application.
- Reading image data from an array camera module can involve reading image data from each of the active sensors within the array camera module.
- the process of communicating with each of the sensors in an array camera module can be simplified by utilizing a separate interface device that is responsible for multiplexing image data received from multiple sensors for output to an external device and for controlling imaging parameters of individual sensors in response to commands received from external devices.
- the substrate or carrier to which the sensors are mounted includes electrical traces that can be utilized to carry signals between the sensors and the interface device.
- FIG. 13 An array camera module including a carrier on which a 3 x 3 array of sensors and an interface device are mounted is illustrated in FIG. 13.
- the 3 x 3 array of sensors 310 and the interface device 400 are mounted to a carrier 300 on which circuit traces 402 are patterned.
- the sensors 310 communicate with the interface device 400 using low-voltage differential signaling (LVDS).
- LVDS low-voltage differential signaling
- a common clock signal coordinates the capture and readout of image data by the sensors and the interface device 400 multiplexes the captured image data received via the LVDS connections for output via an interface appropriate to a specific processor.
- the interface device 400 communicates with external devices such as processors and/or graphics processors using a MIPI CSI 2 output interface supporting four lane video read-out of video at 30 fps from the array camera module.
- the bandwidth of each lane can be optimized for the total number of pixels in the sensor(s) within the array camera module and the desired frame rate.
- any interface appropriate to the requirements of specific applications can be utilized including interfaces that enable the control of the imaging parameters of groups of focal planes by an external device in a manner similar to that described in U.S. Provisional Patent Publication No. 2014/0132810 entitled “Systems and Methods for Array Camera Focal Plane Control” to McMahon, filed November 13, 2013, the disclosure of which is incorporated by reference herein in its entirety.
- an interface device can also be mounted to the substrate.
- a substrate assembly that can be utilized in the construction of an array camera module in accordance with an embodiment of the invention is illustrated in FIG. 14.
- the substrate assembly comprises a substrate 410 to which multiple sensors 310 and an interface device 400 are attached.
- the substrate 410 is bonded to a carrier 300 to which lens barrels can be independently mounted utilizing processes similar to those outlined above.
- the substrate is bonded to the carrier and the windows through the carrier are dimensioned to provide sufficient tolerances to ensure that the focal planes of each of the sensors are positioned within the openings.
- a similar configuration can also be utilized with a single sensor that forms multiple focal planes (the imaging parameters and read-out of which may or may not be independently controlled).
- a single sensor is utilized.
- a camera module in which lens barrels and a sensor are mounted to a carrier in accordance with an embodiment of the invention is illustrated in FIG. 15.
- the camera module 1500 includes four lens barrels 1502 and a single sensor 1504 that are attached to a carrier 1506, which is constructed from a transparent glass material.
- a camera module to which lens barrels and a single sensor are attached can utilize any of a variety of carrier materials as appropriate to the requirements of specific applications in accordance with embodiments of the invention.
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Abstract
Array cameras, and array camera modules incorporating independently aligned lens stacks are disclosed. Processes for manufacturing array camera modules including independently aligned lens stacks can include: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; and independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes.
Description
Methods of Manufacturing Array Camera Modules Incorporating Independently Aligned
Lens Stacks
FIELD OF THE INVENTION
[0001] The present application relates generally to array cameras and more specifically to array cameras incorporating independently aligned lens stacks and physically discrete sensors forming an array, a single focal plane sensor utilizing a virtual array, or a monolithic sensor having multiple physical focal planes.
BACKGROUND
[0002] Imaging devices, such as cameras, can be used to capture images of portions of the electromagnetic spectrum, such as the visible light spectrum, incident upon an image sensor. For ease of discussion, the term light is generically used to cover radiation across the entire electromagnetic spectrum. In a typical imaging device, light enters through an opening (aperture) at one end of the imaging device and is directed to an image sensor by one or more optical elements such as lenses. The image sensor includes pixels or sensor elements that generate signals upon receiving light via the optical element. Commonly used image sensors include charge-coupled device (CCDs) sensors and complementary metal-oxide semiconductor (CMOS) sensors.
[0003] Image sensors are devices capable of converting an optical image into a digital signal. Image sensors utilized in digital cameras are made up of an array of pixels. Each pixel in an image sensor is capable of capturing light and converting the captured light into electrical signals. In order to separate the colors of light and capture a color image, a Bayer filter is often placed over the image sensor, filtering the incoming light into its red, blue, and green (RGB) components which are then captured by the image sensor. The RGB signal captured by the image sensor plus Bayer filter can then be processed and a color image can be created.
[0004] Generally, image capture utilizes a single image sensor, to capture individual images, one at a time. A digital camera typically combines both an image sensor and processing capabilities. When the digital camera takes a photograph, the data captured by the image sensor is provided to the processor by the image sensor. Processors are
able to control aspects of a captured image by changing image capture parameters of the sensor elements or groups of sensor elements used to capture the image.
SUMMARY OF THE INVENTION
[0005] Systems and methods in accordance with embodiments of the invention include processes for constructing array camera modules, array camera modules, and array cameras that include multiple lens stacks separately mounted to a carrier.
[0006] One embodiment includes: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes; and mounting a module cap over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.
[0007] In a further embodiment, forming at least one hole in at least one carrier includes forming at least one hole in a single carrier.
[0008] In another embodiment, mounting the single carrier relative to at least one sensor includes mounting the single carrier relative to a plurality of sensors.
[0009] In a still further embodiment, each of the plurality of sensors is mounted to a first side of the single carrier; each of the plurality of lens barrels is mounted to a second opposite side of the single carrier; and the plurality of sensors comprises a separate sensor for each of the plurality of lens barrels.
[0010] In still another embodiment, the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
[0011] In a yet further embodiment, flip chip mounting is utilized to mount the plurality of sensors to the single carrier.
[0012] In yet another embodiment, the plurality of sensors is mounted to a substrate and mounting the single carrier relative to the plurality of sensors comprises mounting the single carrier in a fixed location relative to the substrate.
[0013] In a further embodiment again, the plurality of sensors is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
[0014] In another embodiment again, the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
[0015] In a further additional embodiment, mounting the single carrier relative to at least one sensor includes mounting the single carrier relative to a single sensor.
[0016] In another additional embodiment, the single sensor is mounted to a first side of the single carrier; and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
[0017] In a still yet further embodiment, the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
[0018] In still yet another embodiment, flip chip mounting is utilized to mount the single sensor to the single carrier.
[0019] In a still further embodiment again, the single sensor is mounted to a substrate and mounting the single carrier relative to the single sensor comprises mounting the single carrier in a fixed location relative to the substrate.
[0020] In still another embodiment again, the single sensor is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
[0021] In a still further additional embodiment, the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
[0022] In still another additional embodiment, forming at least one hole in at least one carrier comprises forming a ledge in at least one hole in the at least one carrier and mounting at least one spectral filter on the ledge.
[0023] A yet further embodiment again also includes mounting at least one spectral filter within at least one hole in the at least one carrier.
[0024] In yet another embodiment again, the at least one spectral filter is selected from the group consisting of a color filter and an IR-cut filter.
[0025] A further additional embodiment again also includes mounting an interface device relative to the at least one carrier.
[0026] In another additional embodiment again, the interface device is mounted to the carrier.
[0027] In another further embodiment, the at least one sensor and the interface device are mounted to a substrate and mounting the at least one carrier relative to the at least one sensor comprises mounting the at least one carrier in a fixed location relative to the substrate.
[0028] In still another further embodiment, independently mounting a plurality of lens barrels to the at least one carrier comprises using active alignment to separately mount each of the lens barrels to one of the at least one carrier.
[0029] In yet another further embodiment, the at least one hole in the at least one carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
[0030] In another further embodiment again, the at least one opening in the module cap are dimensioned so that the module cap is not visible within the field of view of any of the lens stacks and so that light does not reflect from the module cap into the lens stacks.
[0031] In another further additional embodiment, the module cap is mounted to the at least one carrier so that a small air gap exists between the module cap and the top of the lens barrels and the method further comprises applying a small bead of adhesive to each of the lens barrels to seal the air gap between the module cap and the lens barrels.
[0032] In still another further embodiment again, the carrier is constructed from a material selected from the group consisting of ceramic and glass.
[0033] Still another further additional embodiment includes: forming a plurality of holes in carrier; mounting the carrier relative to a plurality of sensors so that light passing through each of the plurality of holes in the carrier is incident on one of a plurality of focal planes formed by the plurality of sensors; mounting at least one spectral filter within at least one of the plurality of holes in the carrier; independently mounting a plurality of lens barrels to the carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light
onto a focal plane formed by a corresponding sensor in the plurality of sensors; and mounting a module cap over the lens barrels so that the module cap is attached to the carrier and a small air gap exists between the module cap and the top of the lens barrels, where the module cap includes a plurality of openings that each admits light into one of the plurality lens stacks contained within the plurality of lens barrels; and applying a small bead of adhesive to each of the lens barrels to seal the air gap between the module cap and the lens barrels.
[0034] An array camera module in accordance with an embodiment of the invention includes at least one carrier in which at least one window is formed; at least one sensor mounted relative to the at least one carrier so that light passing through the at least one window in the at least one carrier is incident on a plurality of focal planes formed by at least one array of pixels on the at least one sensor; a plurality of lens barrels mounted to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one window in the at least one carrier and focuses the light onto one of the plurality of focal planes; and a module cap mounted over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.
[0035] In a further embodiment, the at least one carrier is a single carrier.
[0036] In another embodiment, each of the plurality of sensors is mounted to a first side of the single carrier; each of the plurality of lens barrels is mounted to a second opposite side of the single carrier; and the plurality of sensors comprises a separate sensor for each of the plurality of lens barrels.
[0037] In a still further embodiment, the plurality of sensors is mounted to a substrate and the single carrier is mounted in a fixed location relative to the substrate; and the plurality of sensors is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
[0038] In still another embodiment, the at least one sensor is a single sensor.
[0039] In a yet further embodiment, the single sensor is mounted to a first side of the single carrier; and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
[0040] In yet another embodiment, the single sensor is mounted to a substrate and the single carrier is mounted in a fixed location relative to the substrate; and the single
sensor is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
[0041] In a further embodiment again, the at least one sensor is mounted to a substrate and each of a plurality of carriers is mounted in a fixed location relative to the substrate; and each of the plurality of lens barrels is mounted to a separate carrier.
[0042] In another embodiment again, each lens barrel forms a separate aperture.
[0043] In a further additional embodiment, each lens barrel and corresponding focal plane forms a camera; different cameras within the array camera module image different parts of the electromagnetic spectrum; and the lens stacks contained within the lens barrels differ depending upon the portion of the electromagnetic spectrum imaged by the camera to which the lens barrel belongs.
[0044] In another additional embodiment, the lens stacks contained within the lens barrels differ with respect to at least one of: the materials used to construct the lens elements within the lens stacks; the shapes of at least one surface of corresponding lens elements in the lens stacks.
[0045] In a still further embodiment again, each lens stack in the lens barrels has a field of view that focuses light so that the plurality of arrays of pixels that form the focal planes sample the same object space within a scene.
[0046] In still another embodiment again, the pixel arrays of the focal planes define spatial resolutions for each pixel array; the lens stacks focus light onto the focal planes so that the plurality of arrays of pixels that form the focal planes sample the same object space within a scene with sub-pixel offsets that provide sampling diversity; and the lens stacks have modulation transfer functions that enable contrast to be resolved at a spatial frequency corresponding to a higher resolution than the spatial resolutions of the pixel arrays.
[0047] In a yet further embodiment again, at least one window in the at least one carrier includes a spectral filter.
[0048] In yet another embodiment again, at least one window in at least one carrier comprises a ledge on which the at least one spectral filter is mounted.
[0049] In a still further additional embodiment, the at least one spectral filter is selected from the group consisting of a color filter and an IR-cut filter.
[0050] In still another additional embodiment, at least one spectral filter is applied to an array of pixels forming a focal plane on at least one of the sensors.
[0051] In a yet further additional embodiment, at least one lens stack includes at least one spectral filter.
[0052] In yet another additional embodiment, the plurality of lens barrels and the plurality of focal planes form an M x N array of cameras.
[0053] In a still further additional embodiment again, the plurality of lens barrels and the plurality of focal planes form a 3 X 3 array of cameras.
[0054] In still another additional embodiment again, the M x N array of cameras comprises a 3 x 3 group of cameras including: a central reference camera; four cameras that capture image data in a first color channel located in the four corners of the 3 x 3 group of cameras; a pair of cameras that capture image data in a second color channel located on either side of the central reference camera; and a pair of cameras that capture image data in a third color channel located on either side of the central reference camera.
[0055] In another further embodiment, the reference camera is selected from the group consisting of: a camera including a Bayer filter; and a camera that captures image data in the first color channel.
[0056] Still another further embodiment also includes an interface device in communication with the at least one sensor, where the interface device multiplexes data received from the at least one sensor and provides an interface via which multiplexed data is read and the imaging parameters of the focal planes formed by the at least one pixel array on the at least one sensor are controlled.
[0057] In yet another further embodiment, the interface device is mounted to the carrier and the carrier includes circuit traces that carry signals between the interface device and the at least one sensor; and a common clock signal coordinates the capture of image data by the at least one sensor and readout of the image data from the at least one sensor via the interface device.
[0058] In another further embodiment again, the at least one sensor and the interface device are mounted to a substrate, which includes circuit traces that carry signals between the interface device and the at least one sensor; the at least one carrier is mounted in a fixed location relative to the at least one sensor; and a common
clock signal coordinates the capture of image data by the at least one sensor and readout of the image data from the at least one sensor via the interface device.
[0059] In another further additional embodiment, the module cap is mounted to the at least one carrier so that a small air gap exists between the module cap and the top of the lens barrels and a small bead of adhesive seals the air gaps between the module cap and the lens barrels.
[0060] In still yet another further embodiment, the carrier is constructed from a material selected from the group consisting of ceramic and glass.
[0061] Still another further embodiment again includes: a carrier in which a plurality of windows are formed; a plurality of sensors each including an array of pixels, where the plurality of sensors are mounted relative to the carrier so that light passing through the plurality of windows is incident on a plurality of focal planes formed by the arrays of pixels; a plurality of lens barrels mounted to the at least one carrier so that a lens stack in each lens barrel directs light through the at least one window in the at least one carrier and focuses the light onto one of the plurality of focal planes; and a module cap mounted over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.
[0062] An embodiment of an array camera includes: a processor; memory containing an image capture application; an array camera module, comprising: at least one carrier in which at least one window is formed; at least one sensor mounted relative to the at least one carrier so that light passing through the at least one window in the at least one carrier is incident on a plurality of focal planes formed by at least one array of pixels on the at least one sensor; a plurality of lens barrels mounted to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one window in the at least one carrier and focuses the light onto one of the plurality of focal planes; and a module cap mounted over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels. In addition, the image capture application directs the processor to: trigger the capture of image data by the array camera module; obtain and store image data captured by the array camera module, where the image data forms a set of images captured from different viewpoints; select a reference viewpoint relative to the viewpoints of the set of images captured from different viewpoints; normalize the set of
images to increase the similarity of corresponding pixels within the set of images; determine depth estimates for pixel locations in an image from the reference viewpoint using at least a subset of the set of images, wherein generating a depth estimate for a given pixel location in the image from the reference viewpoint comprises: identifying pixels in the at least a subset of the set of images that correspond to the given pixel location in the image from the reference viewpoint based upon expected disparity at a plurality of depths; comparing the similarity of the corresponding pixels identified at each of the plurality of depths; and selecting the depth from the plurality of depths at which the identified corresponding pixels have the highest degree of similarity as a depth estimate for the given pixel location in the image from the reference viewpoint.
[0063] In a further embodiment, each lens barrel forms a separate aperture.
[0064] In another embodiment, the lens stacks contained within the lens barrels differ with respect to at least one of: the materials used to construct the lens elements within the lens stacks; the shapes of at least one surface of corresponding lens elements in the lens stacks.
[0065] In a still further embodiment, the image capture application further directs the processor to fuse pixels from the set of images using the depth estimates to create a fused image having a resolution that is greater than the resolutions of the images in the set of images by: determining the visibility of the pixels in the set of images from the reference viewpoint by: identifying corresponding pixels in the set of images using the depth estimates; and determining that a pixel in a given image is not visible in the reference viewpoint when the pixel fails a photometric similarity criterion determined based upon a comparison of corresponding pixels; and applying scene dependent geometric shifts to the pixels from the set of images that are visible in an image from the reference viewpoint to shift the pixels into the reference viewpoint, where the scene dependent geometric shifts are determined using the current depth estimates; and fusing the shifted pixels from the set of images to create a fused image from the reference viewpoint having a resolution that is greater than the resolutions of the images in the set of images.
[0066] In a yet further embodiment, the image capture application further directs the processor to synthesize an image from the reference viewpoint by performing a super- resolution process based upon the fused image from the reference viewpoint, the set of
images captured from different viewpoints, the current depth estimates, and visibility information.
[0067] In yet another embodiment, the plurality of images comprises image data in multiple color channels; and the image capture application directs the processor to compare the similarity of pixels that are identified as corresponding at each of the plurality of depths by comparing the similarity of the pixels that are identified as corresponding in each of a plurality of color channels at each of the plurality of depths.
[0068] In a further embodiment again, the array camera module further comprises an interface device in communication with the at least one sensor, where the interface device multiplexes data received from the sensors and provides an interface via which the processor reads multiplexed data and via which the processor controls the imaging parameters of the focal planes formed by the plurality of pixel arrays.
[0069] In another embodiment again, the interface device is mounted to the carrier and the carrier includes circuit traces that carry signals between the interface device and the at least one sensor; and a common clock signal coordinates the capture of image data by the at least one sensor and readout of the image data from the at least one sensor via the interface device.
[0070] In a further embodiment again, the at least one sensor and the interface device are mounted to a substrate, which includes circuit traces that carry signals between the interface device and the at least one sensor; the at least one carrier is mounted in a fixed location relative to the at least one sensor; and a common clock signal coordinates the capture of image data by the at least one sensor and readout of the image data from the at least one sensor via the interface device.
[0071] Another further embodiment includes: a processor; memory containing an image capture application; an array camera module, comprising: a carrier in which a plurality of windows are formed; a plurality of sensors each including an array of pixels, where the plurality of sensors are mounted relative to the carrier so that light passing through the plurality of windows is incident on a plurality of focal planes formed by the arrays of pixels; a plurality of lens barrels mounted to the at least one carrier so that a lens stack in each lens barrel directs light through the at least one window in the at least one carrier and focuses the light onto one of the plurality of focal planes; and a module cap mounted over the lens barrels, where the module cap includes at least one opening
that admits light into the lens stacks contained within the plurality of lens barrels. In addition, the image capture application directs the processor to: trigger the capture of image data by the array camera module; obtain and store image data captured by the array camera module, where the image data forms a set of images captured from different viewpoints; select a reference viewpoint relative to the viewpoints of the set of images captured from different viewpoints; normalize the set of images to increase the similarity of corresponding pixels within the set of images; determine depth estimates for pixel locations in an image from the reference viewpoint using at least a subset of the set of images. Furthermore, generating a depth estimate for a given pixel location in the image from the reference viewpoint includes: identifying pixels in the at least a subset of the set of images that correspond to the given pixel location in the image from the reference viewpoint based upon expected disparity at a plurality of depths; comparing the similarity of the corresponding pixels identified at each of the plurality of depths; and selecting the depth from the plurality of depths at which the identified corresponding pixels have the highest degree of similarity as a depth estimate for the given pixel location in the image from the reference viewpoint.
[0072] In still another further embodiment, the pixel arrays of the focal planes define spatial resolutions for each pixel array; the lens stacks focus light onto the focal planes so that the plurality of arrays of pixels that form the focal planes sample the same object space within a scene with sub-pixel offsets that provide sampling diversity; and the lens stacks have modulation transfer functions that enable contrast to be resolved at a spatial frequency corresponding to a higher resolution than the spatial resolutions of the pixel arrays; and the image capture application further directs the processor to fuse pixels from the set of images using the depth estimates to create a fused image having a resolution that is greater than the resolutions of the images in the set of images by: determining the visibility of the pixels in the set of images from the reference viewpoint by: identifying corresponding pixels in the set of images using the depth estimates; and determining that a pixel in a given image is not visible in the reference viewpoint when the pixel fails a photometric similarity criterion determined based upon a comparison of corresponding pixels; and applying scene dependent geometric shifts to the pixels from the set of images that are visible in an image from the reference viewpoint to shift the pixels into the reference viewpoint, where the scene dependent geometric shifts are
determined using the current depth estimates; and fusing the shifted pixels from the set of images to create a fused image from the reference viewpoint having a resolution that is greater than the resolutions of the images in the set of images.
BRIEF DESCRIPTION OF THE DRAWINGS
[0073] FIG. 1 conceptually illustrates an array camera in accordance with an embodiment of the invention.
[0074] FIGS. 2A - 2C schematically illustrate an array camera module in accordance with an embodiment of the invention.
[0075] FIG. 3 is a flow chart illustrating a process for manufacturing an array camera module in accordance with an embodiment of the invention.
[0076] FIGS. 4 and 5 conceptually illustrate the mounting of filters to a carrier during the construction of an array camera module in accordance with an embodiment of the invention.
[0077] FIG. 6 conceptually illustrates cameras forming a π filter group in which red and blue cameras are located on either side of a central green camera that can serve as a reference camera.
[0078] FIGS. 7 and 8 conceptually illustrate the mounting of sensors that each contain a single focal plane on a carrier during the construction of an array camera module in accordance with an embodiment of the invention.
[0079] FIGS. 9 and 10 conceptually illustrate the mounting of lens barrels to a carrier during the construction of an array camera module in accordance with an embodiment of the invention.
[0080] FIG. 1 1 conceptually illustrates an active alignment tool gripping a lens barrel at a 45 degree angle relative to a 2 x 2 array formed by the gripped lens barrel and three adjacent lens barrels during the construction of an array camera module in accordance with an embodiment of the invention.
[0081] FIG. 12 conceptually illustrates attachment of a module cap to a carrier during the construction of an array camera module in accordance with an embodiment of the invention.
[0082] FIG. 13 conceptually illustrates an array camera module including a carrier on which a 3 x 3 array of sensors and an interface device are mounted in accordance with an embodiment of the invention.
[0083] FIG. 14 conceptually illustrates a substrate assembly that can be utilized in the construction of an array camera module in accordance with an embodiment of the invention.
[0084] FIG. 15 conceptually illustrates an array camera module in which a single sensor is attached to a glass carrier in accordance with an embodiment of the invention.
DETAILED DESCRIPTION
[0085] Turning now to the drawings, array camera modules incorporating independently aligned lens stacks and methods for constructing array camera modules incorporating independently aligned lens stacks are described. An array camera is an image capture device that includes multiple lens stacks or optical channels that direct light onto a corresponding number of focal planes, enabling the capture of multiple images of a scene using the focal planes. The light received via each of the lens stacks passes through a separate aperture and so each of the captured images constitutes a different view of the scene. In a number of embodiments, super-resolution processes such as those described in U.S. Patent Publication No. 2012/0147205 entitled "Systems and Methods for Synthesizing High Resolution Images Using Super-Resolution Processes", to Lelescu et al., are utilized to synthesize a higher resolution two dimensional (2D) image or a stereo pair of higher resolution 2D images from the lower resolution images in the light field captured by an array camera. The terms high or higher resolution and low or lower resolution are used here in a relative sense and not to indicate the specific resolutions of the images captured by the array camera. The disclosure within U.S. Patent Publication No. 2012/0147205 concerning processes for fusing higher resolution images from a set of images captured from different viewpoints, synthesizing higher resolution images from a set of images captured from different viewpoints using super-resolution processing, synthesizing high resolution images from virtual viewpoints, and for dynamically refocusing synthesized high resolution images is hereby incorporated by reference in its entirety.
[0086] The term focal plane can be used to describe a region on a sensor containing an array of pixel elements configured to capture an image based upon light directed onto the focal plane via a lens stack or optical channel. In many embodiments, each focal plane is implemented using a separate sensor. In a number of embodiments, array cameras are implemented using sensors that include multiple focal planes, where each focal plane receives light from a separate optical channel. As such, the sensor is configured to separately and (in many instances) independently capture and output image data from each of the focal planes.
[0087] The array cameras disclosed in U.S. Patent Publication No. 201 1/0069189 entitled "Capturing and Processing of Images Using Monolithic Camera Array with Heterogeneous Imagers", to Venkataraman et al. include examples of array cameras in which the lens stacks of the array camera are implemented as a single lens stack array that is aligned and mounted to a sensor. However, the large number of tolerances involved in the manufacture of a lens stack array can result in the different optical channels having varying focal lengths. The combination of all the manufacturing process variations typically results in a deviation of the actual ("first order") lens parameters - such as focal length - from the nominal prescription. As a result, each optical channel can have a different axial optimum image location. Consequently, the lens stack array typically cannot be placed a distance that corresponds with the focal length of each lens stack within an array camera module. Notably, these manufacturing tolerances may result in different focal lengths even as between lens stack arrays fabricated from the same manufacturing process. The disclosure within U.S. Patent Publication No. 201 1/0069189 regarding the implementation of different array camera architectures including monolithic array cameras, non-monolithic array cameras, and arrays of array cameras is hereby incorporated by reference herein in its entirety. Array cameras in accordance with embodiments of the invention are constructed by independently aligning each lens stack with respect to a corresponding focal plane. In this way, each lens stack can be optimally aligned with respect to a corresponding focal plane.
[0088] In several embodiments, an active alignment process is utilized to align each lens stack with respect to its corresponding focal plane. In the context of the manufacture of camera systems, the term active alignment typically refers to a process
for aligning an optical system (e.g. a lens stack array) with an imaging system (e.g. comprising a monolithic sensor) to achieve a final desirable spatial arrangement by evaluating the efficacy of the configuration as a function of the spatial relationship between the optical system and the imaging system. Typically, this process is implemented by using the configuration to capture and record image data (typically of a known target) in real time as the optical system is moving relative to the imaging system. As the optical system is moved relative to the imaging system, the spatial relationship between the two changes, and the characteristics of the recorded image data also change correspondingly. This recorded image data may then be used to align the optical system relative to the imaging system in a desired manner. For example, active alignment can generally be used to determine a spatial relationship that results in a camera that is capable of recording images that exceed a threshold image quality.
[0089] In several embodiments, an array camera module is constructed using a ceramic carrier in which windows through the ceramic carrier are formed. A single sensor or multiple sensors can be fixed to one side of the ceramic carrier to form the focal planes of the array camera module and lens barrels containing lens stacks can be affixed to the other side of the ceramic carrier so that the lens stacks direct light onto the focal planes of the one or more sensors through the openings in the ceramic carrier. The ceramic carrier is rigid and can have a co-efficient of thermal expansion (CTE) selected to match the CTE of the sensor. In this way, the ceramic carrier reduces the likelihood that mismatches in thermal expansion will result in changes in the alignment between the lens stacks and corresponding focal planes that deteriorate the quality of the images that can be synthesized using the image data captured by the focal planes. In other embodiments, any of a variety of substrate materials exhibiting rigidity and low CTE can be utilized as a substitute for a ceramic carrier including (but not limited to) a transparent glass substrate. Furthermore, a variety of mounting techniques can be utilized including (but not limited to) mounting one or more sensors to a substrate and mounting the lens barrels containing the lens stacks to a carrier, or mounting individual camera modules to a substrate. Array cameras constructed using array camera modules incorporating independently aligned lens stacks and methods for constructing array camera modules incorporating independently aligned lens stacks are discussed further below.
Array Cameras Including Modules Incorporating Independently Aligned Lens Stacks
[0090] An array camera including an array camera module in accordance with an embodiment of the invention is illustrated in FIG. 1 . The array camera 100 includes an array camera module 102 including an array of cameras 104. The array camera module 102 is configured to communicate with a processor 108, which can execute an image capture application stored as non-transitory machine readable instructions within a memory 1 10. The memory 1 10 can also be utilized to store image data captured by the array camera module.
[0091] The array camera module 102 includes an array of focal planes on which images are formed by an array of lens stacks. Each lens stack creates an optical channel that forms an image of the scene on an array of light sensitive pixels within a corresponding focal plane. Each lens stack is independently mounted within array camera module 102 to form a single camera 104 with the corresponding focal plane on which the lens stack forms an image. In many embodiments, each lens stack can be actively aligned with respect to its corresponding focal plane to improve the quality of the image data capture by the focal plane.
[0092] The pixels within a focal plane of a camera 104 generate image data that can be sent from the array of cameras 104 to the processor 108. In many embodiments, the lens stack within each optical channel have fields of view that focus light so that pixels of each focal plane sample the same object space or region within the scene. In several embodiments, the lens stacks are configured so that the pixels that sample the same object space do so with sub-pixel offsets to provide sampling diversity that can be utilized to recover increased resolution through the use of super-resolution processes. The term sampling diversity refers to the fact that the images from different viewpoints sample the same object in the scene but with slight sub-pixel offsets. By processing the images with sub-pixel precision, additional information encoded due to the sub-pixel offsets can be recovered when compared to simply sampling the object space with a single image. In order to enable the recovery of higher resolution information, the lens stacks are designed to have a Modulation Transfer Function (MTF) that enables contrast to be resolved at a spatial frequency corresponding to the higher resolution and not at the spatial resolution of the pixels that form a focal plane.
[0093] In the illustrated embodiment, the cameras 104 are configured in a 3x3 array. In other embodiments, any of a variety of M x N camera array configurations can be utilized including linear arrays (i.e. 1 x N arrays). Each camera 104 in the array camera module 102 is capable of capturing an image of the scene. The sensor elements utilized in the focal planes of the cameras 104 can be individual light sensing elements such as, but not limited to, traditional CIS (CMOS Image Sensor) pixels, CCD (charge-coupled device) pixels, high dynamic range sensor elements, multispectral sensor elements and/or any other structure configured to generate an electrical signal indicative of light incident on the structure. In many embodiments, the sensor elements of each focal plane have similar physical properties and receive light via the same optical channel and color filter (where present). In several embodiments, the sensor elements have different characteristics and, in many instances, the characteristics of the sensor elements are related to the color filter applied to each sensor element.
[0094] In a variety of embodiments, color filters in individual cameras can be used to pattern the camera module with π filter groups as further discussed in U.S. Patent Publication No. 2013/0293760 entitled "Camera Modules Patterned with pi Filter Groups", the disclosure from which related to filter patterns that can be utilized in the implementation of an array camera is incorporated by reference herein in its entirety. Any of a variety of color filter configurations can be utilized where cameras in each color channel are distributed on either side of the center of the camera. The cameras can be used to capture data with respect to different colors, or a specific portion of the spectrum. In a number of embodiments, cameras image in the near-IR, IR, and/or far-IR spectral bands. In contrast to applying color filters to the pixels of the camera, color filters in many embodiments of the invention are mounted to a ceramic carrier to which one or more sensors and/or the lens stacks are mounted, or included in the lens stack. Where the sensor(s) and lens stacks are mounted to a glass substrate, the color filters can be applied to the glass substrate. For example, a green color camera can include a lens stack with a green light filter that allows green light to pass through the optical channel. In many embodiments, the pixels in each focal plane are the same and the light information captured by the pixels is differentiated by the color filters in the corresponding lens stack for each filter plane. The inclusion of spectral filters within array camera modules in accordance with various embodiments of the invention can be
implemented in a variety of other ways including (but not limited to) by applying color filters to the pixels of the focal planes of the cameras similar to the manner in which color filters are applied to the pixels of a conventional color camera. In several embodiments, at least one of the cameras in the camera module can include uniform color filters applied to the pixels in its focal plane. In many embodiments, a Bayer filter pattern is applied to the pixels of at least one of the cameras in a camera module. In a number of embodiments, camera modules are constructed in which color filters are utilized in both the lens stacks and on the pixels of the imager array.
[0095] In several embodiments, the processor 108 is configured to take the image data captured by the sensor and synthesize high resolution images. In a number of embodiments, the processor 108 is configured to measure distances to or depth of objects in the scene using the set of images captured by the array camera module. In many embodiments, the process of synthesizing high resolution images from a set of images captured by the array camera module also involves generating depth information with respect to objects visible within the field of view of the array camera. U.S. Patent 8,619,082 entitled "Systems and Methods for Parallax Detection and Correction in Images Captured Using Array Cameras that Contain Occlusions using Subsets of Images to Perform Depth Estimation" to Ciurea et al. discloses techniques for estimating depth using sets of images captured from different viewpoints. The disclosure within U.S. Patent 8,619,082 concerning estimating depth and generating a depth map using multiple images of a scene and synthesizing images from different perspectives using depth information is also incorporated by reference herein in its entirety. In many embodiments of the invention, the process of estimating depth and/or synthesizing a higher resolution image of a scene from a set of images involves selection of a reference viewpoint, typically that of a reference camera.
[0096] In many embodiments, a set of images is created using the image data captured by the cameras in the array camera module and can be considered to be a number of images of the scene captured from different viewpoints. In order to assist with depth estimation and/or synthesis of higher resolution images, the set of images can be normalized to increase the similarity of corresponding pixels within the images. In several embodiments, the process of estimating depth and/or building a depth map of the scene from the reference viewpoint involves determining depth estimates for pixel
locations in an image from the reference viewpoint using at least a subset of the set of images, wherein generating a depth estimate for a given pixel location in the image from the reference viewpoint includes: identifying pixels in the at least a subset of the set of images that correspond to the given pixel location in the image from the reference viewpoint based upon expected disparity at a plurality of depths; comparing the similarity of the corresponding pixels identified at each of the plurality of depths; and selecting the depth from the plurality of depths at which the identified corresponding pixels have the highest degree of similarity as a depth estimate for the given pixel location in the image from the reference viewpoint. When the array camera module captures image data in multiple color channels, the array camera can compare the similarity of pixels that are identified as corresponding at each of the plurality of depths by comparing the similarity of the pixels that are identified as corresponding in each of the color channels at each of the plurality of depths. These processes are discussed in more detail in U.S. Patent 8,619,082, the relevant disclosure of which is incorporated by reference herein and above by reference in its entirety.
[0097] In a number of embodiments, a higher resolution image is synthesized from the set of images obtained from the array camera module by fusing pixels from the set of images using the depth estimates to create a fused image having a resolution that is greater than the resolutions of the images in the set of images. The fusion process can include: identifying the pixels from the set of images that are visible in an image from the reference viewpoint using the at least one visibility map; applying scene dependent geometric shifts to the pixels from the set of images that are visible in an image from the reference viewpoint to shift the pixels into the reference viewpoint, where the scene dependent geometric shifts are determined using the current depth estimates; and fusing the shifted pixels from the set of images to create a fused image from the reference viewpoint having a resolution that is greater than the resolutions of the images in the set of images. In several embodiments, the process of synthesizing a higher resolution image involves performing an additional super-resolution process based upon the fused image from the reference viewpoint, the set of images captured from different viewpoints, the current depth estimates, and the visibility information. The fusion and super-resolution processes are described in more detail in U.S. Patent
Publication No. 2012/0147205 the relevant disclosure of which is incorporated by reference herein and above in its entirety.
[0098] In many embodiments, the processor 108 is able to synthesize an image from a virtual viewpoint. In a number of embodiments, a virtual viewpoint is any viewpoint which is not the reference viewpoint. In several embodiments, the virtual viewpoint corresponds to a viewpoint of one of the cameras 104 in the array camera module 102 that is not the reference camera. In many embodiments, the processor is able to synthesize an image from a virtual viewpoint, which does not correspond to any camera 104 in the array camera module 102.
[0099] Although specific array camera architectures are described above with respect to FIG. 1 , alternative architectures can also be utilized in accordance with embodiments of the invention. Array camera modules including independently aligned lens stacks in accordance with embodiments of the invention and discussed further below.
Array Camera Modules
[00100] Array camera modules incorporating independently aligned lens stacks can offer a variety of benefits including (but not limited to) capturing image data using focal planes that are located at the back focal length of their corresponding lens stacks. In addition, array camera modules constructed in accordance with many embodiments of the invention interpose materials between sensors and lens barrels containing the lens stacks that reduce the impact of CTE mismatch between the low CTE semiconductor materials from which the sensors are fabricated and the higher CTE materials from which the lens barrels are constructed. Accordingly, array camera modules can be constructed that achieve precise alignment of optics and robustness to variations in thermal conditions.
[00101] An array camera module incorporating independently aligned lens stacks in accordance with an embodiment of the invention is illustrated in FIGS. 2A - 2C. FIGS. 2B and 2C illustrate cross sections of an array camera module 102 illustrated in FIG. 2A taken along an axis 164. The array camera module 102 includes a carrier 300, which can be implemented using a ceramic carrier and/or any of a variety of materials possessing rigidity and low CTE that are appropriate to the requirements of a specific
application. Windows extend from a first side 302 through to a second side 204 of the carrier 300. Windows can be holes and or transparent regions of the carrier. In the illustrated embodiment, the windows are rectangular holes and color filters and/or IR cut-off filters 305 are mounted within the opening of each hole. As discussed above, the inclusion of spectral filters in openings within the carrier is optional and spectral filters can be located within the lens barrels and/or on the sensor elements of the focal planes. At least one sensor 310 is mounted on the first side 302 of the carrier so that the sensor pixels are positioned facing inward to receive light that passes through the color filter 305 mounted within the carrier 300. In the illustrated embodiment, a single sensor is shown per camera. As noted above, a single sensor can form the focal planes of multiple cameras. In many embodiments, a single sensor forms the focal planes of all of the cameras in the array. In several embodiments, the single sensor includes a single array of pixels that is read out to capture an image from each of the optical channels formed by the lens barrels. In many embodiments, the single sensor includes a separate independently controllable array of pixels that form the focal planes of each of the cameras. A lens barrel 320 containing a lens stack is mounted on the second side 304 of the carrier 300. The lens barrel forms an aperture and each lens barrel 320 is positioned so that the outermost lens 322 of the lens stack contained within the lens barrel directs light into the lens stack. In many embodiments, cameras in the array camera module image different parts of the electromagnetic spectrum and the lens stacks contained within the lens barrels differ depending upon the color channel to which the camera belongs. In several embodiments, the surfaces of the lens elements, and/or the material used in the construction of the lens elements within the lens stacks differ based upon the portion of the spectrum imaged by a camera. A module cap 330 is fixed to the carrier 300 and extends over the lens barrels 320. In the illustrated embodiment, the outermost lens 322 contained within each lens barrel 320 receives light through an opening in the module cap 330. The openings in the module cap 330 can be dimensioned to avoid the module cap 330 from obscuring the fields of view of the lens stacks and/or reflecting light into the lens stacks. In other embodiments, the module cap can include one or more cover glasses through which the lens barrels can receive light.
[00102] Although the array camera modules discussed above with respect to FIGS. 2A - 2C utilize a separate sensor mounted to the carrier for each camera in the array camera module, a single sensor or multiple sensors incorporating more than one focal plane can be mounted to one side of carrier with a separate lens barrel for each camera mounted to the other side of the carrier. The sensor(s) need not be mounted to the same carrier as the lens barrels. The substrate to which the sensor(s) are mounted, whether the carrier or a separate substrate, can include circuit traces that provide power to the sensor(s) and enable read out of data. Furthermore, the sensor(s) can be mounted to a substrate and independent carriers can be utilized to mount the lens barrels to the sensor(s). In embodiments that utilize multiple sensors, the sensors can communicate with another device mounted to the substrate that multiplexes data received from the sensors and provides an interface via which a processor can read out multiplexed data and control the imaging parameters of the focal planes within the array camera module. Processes for constructing array camera modules in accordance with embodiments of the invention are discussed further below.
Manufacturing Array Camera Modules
[00103] A variety of processes can be utilized to construct array camera modules in accordance with embodiments of the invention and the specific processes that are utilized typically depend upon the materials utilized in the construction of the array camera module and the manner in which one or more sensors and/or each camera's lens barrel is mounted. In a number of embodiments, the process of manufacturing an array camera module includes independently actively aligning each lens barrel.
[00104] A process for manufacturing an array camera module utilizing a carrier to which one or more sensors and camera lens barrels are independently mounted using active alignment in accordance with an embodiment of the invention is illustrated in FIGS. 3 - 13. The process 350 includes manufacturing (360) a carrier. As noted above with respect to FIGS. 2A - 2C, in many embodiments each camera is formed around a window in the carrier that enables a lens stack contained within a lens barrel to direct light onto the focal plane of a sensor. Furthermore, a color filter and/or an IR cut-off filter can be mounted within an opening in the carrier that forms window. Accordingly, the process of manufacturing the carrier includes forming the appropriate windows,
which can involve forming holes through the carrier or applying light blocking masks to a transparent carrier to define transparent windows through the carrier. In several embodiments, ledges are formed within the holes to facilitate the mounting of color filters and/or IR cut-off filters within the hole.
[00105] Referring again to FIG. 3 and FIGS. 4 and 5, color filters and/or additional filters such as (but not limited to) IR cut-off filters can be mounted (362) so that light passes through the filters in order to pass from one side of the carrier through a window to the other side of the carrier. In the embodiment illustrated in FIGS. 4 and 5, green 306, blue 307, and red 308 color filters are inserted along with IR cut-off filters into holes 301 formed within the carrier 300. The carrier is configured to be incorporated into an array camera module containing nine cameras and green color filters are incorporated within five of the cameras, two cameras incorporate blue color filters 307 and two cameras incorporate red color filters 308. The configuration of the cameras forms the 7Γ filter group conceptually illustrated in FIG. 6 in which red and blue cameras are located equidistant and on either side of a central green camera that can serve as a reference camera. In other embodiments, any of a variety of filters applied in any of a variety of patterns can be utilized as appropriate to the requirements of specific applications. Furthermore, many applications do not involve the application of filters to the carrier. For example, an array camera module that includes one or more Bayer cameras can utilize one or more sensors to which color filters are directly applied. In many embodiments, the techniques described above are utilized to form a π filter group with a central Bayer camera or an array in which each camera is a Bayer camera. The specific selection of filters typically depends upon the requirements of a specific application.
[00106] Referring again to FIG. 3, one or more sensors are mounted (364) to the carrier so that light passing through the windows in the carrier is incident on the focal planes of the sensor(s). The mounting of sensors that each contain a single focal plane is illustrated in FIGS. 7 and 8. Each sensor 310 is mounted to a first side 302 of the carrier 300. In many embodiments, the color filters are mounted within or covering the opening on the second side 304 of the carrier. In many embodiments, flip chip mounting is utilized to mount the one or more sensors to the carrier. As can readily be appreciated, the mounting of one or more sensors to the carrier is optional. Sensors
can be mounted to another substrate that is fixed in a location relative to a carrier to which the lens barrels of the cameras are mounted at some stage during the construction of the array camera module.
[00107] Referring again to FIG. 3, the process 350 includes independently mounting (366) each of the lens barrels of the cameras to the carrier. The mounting of lens barrels 320 to the second surface 304 of the carrier 300 is conceptually illustrated in FIGS. 9 and 10. In many embodiments, active alignment is utilized to align each of the lens barrels to the carrier. In order to facilitate active alignment, the windows in the carrier which define the mounting locations of the lens barrels and the dimensions of the lens barrels are determined to enable an active alignment tool to grip the lens barrel during active alignment.
[00108] In several embodiments, lens barrels can be placed close together by utilizing the ability of an active alignment tool to grip a lens barrel located adjacent three other lens barrels in a 2 x 2 array at an angle relative to the rows and columns of the 2 x 2 array. In this way, the gripper of the active alignment tool does not need to extend through the narrowest portion of the gap between any two of the adjacent lens barrels in order to place a lens barrel. Therefore, the gap between any two adjacent lens barrels is not dependent upon the dimensions of the gripper of the active alignment tool. An active alignment tool gripping a lens barrel at a 45 degree angle relative to a 2 x 2 array formed by the gripped lens barrel and three adjacent lens barrels in accordance with an embodiment of the invention is illustrated in FIG. 1 1 . As can readily be appreciated the width of each member 370 of the gripper is greater than the spacing between adjacent lens barrels. By clasping the members of the gripper so that they contact lens barrel 9 at an angle relative to the rows and columns of the array of lens barrels, the members 370 of the gripper need not extend into the narrowest portion of the gap between adjacent lens barrels (2) and (5). While the axis on which the lens barrel is gripped in the illustrated embodiment is at a 45 degree angle relative to the axes of the rows and columns of the lens barrel array, the specific angle of the axis on which the lens barrel is gripped relative to the axes of the rows and columns of the lens barrel array is largely determined based upon the dimensions of the gripper of the active alignment machine and the available spacing between adjacent lens barrels. In the illustrated embodiment, the lens barrels 320 are numbered to indicate the order in which the lens barrels were
placed on the carrier 300. The first lens barrel (1 ) placed on the carrier using the active alignment machine was placed in the center of the carrier. Lens barrels (2), (3), (4), and (5) were then placed in the remaining positions within a 3 x 3 array that are not corners. Finally, lens barrels (6), (7), (8), and (9) were placed in the corners of the 3 x 3 array.
[00109] Although a specific sequence is illustrated in FIG. 1 1 , alternative sequences can be utilized in which a pair of lens barrels is identified (4) and (7) and a third lens barrel (10) is placed using active alignment to form an L shape. A 2 x 2 array of lens barrels (4), (7), (10), and (1 1 ) can then be formed by positioning the gripper to contact the lens barrel of a fourth lens barrel (1 1 ) along an axis at an angle relative to the axis of the rows and columns of the 2 x 2 array. The process can then be repeated with respect to each adjacent pair of lens barrels (e.g. lens barrels 7 and 3) and/or each L shaped group of lens barrels formed by the placement of lens barrels (e.g. lens barrels 4, 6, and 10). Provided that the active alignment tool is not required to attempt to place a lens barrel between two lens barrels to form three lens barrels aligned along an axis, the spacing between the lens barrels can be determined in a manner that is not related to the dimensions of the gripper used to clasp the lens barrel during the active alignment process.
[00110] While specific processes for independently aligning lens stacks within an array camera module are described above with respect to FIGS. 9 - 1 1 , any of a variety of techniques including passive and/or active alignment processes can be utilized as appropriate to the requirements of specific applications in accordance with embodiments of the invention.
[00111] Referring back to FIG. 3, a module cap can be mounted (368) over the lens barrels and attached to the carrier to protect the lens barrels. Attachment of a module cap to a carrier in accordance with an embodiment of the invention is illustrated in FIG. 12. As noted above, the module cap 330 includes openings 332 that admit light into the lens stacks contained within the lens barrels 320. Ideally, the openings in the module cap are dimensioned so that the module cap is not visible within the field of view of any of the lens stacks and/or so that light does not reflect from the module cap into the lens stacks. In several embodiments, a small air gap exists between the module cap and the top of the lens barrels. A small bead of adhesive can be applied to each of the lens barrels to seal the air gap between the module cap and the lens barrels. In a number of
embodiments, the module cap is constructed from a low CTE polymer such as (but not limited to) a glass filled liquid crystal polymer. By utilizing a low CTE polymer, warping of the lens barrels due to CTE mismatch between the carrier and the module cap can be avoided. In other embodiments, the module cap can be constructed from any material appropriate to the requirements of a specific application.
[00112] Although a variety of processes are described above in reference to FIGS. 3 - 12 with respect to the manufacture of array camera modules, various aspects of the processes described above can be utilized to construct any of a variety of array camera modules that incorporate an array of independently aligned lens stacks as appropriate to the requirements of specific applications in accordance with embodiments of the invention. Furthermore, not all of the components discussed above need to be mounted to the same carrier and/or additional components can be mounted to carriers in accordance with embodiments of the invention. Array camera modules that incorporate an interface device mounted within the array camera module to enable communication with a processor in accordance with embodiments of the invention are discussed further below.
Interfacing with External Devices
[00113] Reading image data from an array camera module can involve reading image data from each of the active sensors within the array camera module. The process of communicating with each of the sensors in an array camera module can be simplified by utilizing a separate interface device that is responsible for multiplexing image data received from multiple sensors for output to an external device and for controlling imaging parameters of individual sensors in response to commands received from external devices. In a number of embodiments, the substrate or carrier to which the sensors are mounted includes electrical traces that can be utilized to carry signals between the sensors and the interface device.
[00114] An array camera module including a carrier on which a 3 x 3 array of sensors and an interface device are mounted is illustrated in FIG. 13. The 3 x 3 array of sensors 310 and the interface device 400 are mounted to a carrier 300 on which circuit traces 402 are patterned. In a number of embodiments, the sensors 310 communicate with the interface device 400 using low-voltage differential signaling (LVDS). In several
embodiments, a common clock signal coordinates the capture and readout of image data by the sensors and the interface device 400 multiplexes the captured image data received via the LVDS connections for output via an interface appropriate to a specific processor. In certain embodiments, the interface device 400 communicates with external devices such as processors and/or graphics processors using a MIPI CSI 2 output interface supporting four lane video read-out of video at 30 fps from the array camera module. The bandwidth of each lane can be optimized for the total number of pixels in the sensor(s) within the array camera module and the desired frame rate. The use of various interfaces including the MIPI CSI 2 interface to transmit image data captured by an array of focal planes to an external device in accordance with embodiments of the invention is described in U.S. Patent 8,305,456 to McMahon, the disclosure of which is incorporated by reference herein in its entirety. In other embodiments, any interface appropriate to the requirements of specific applications can be utilized including interfaces that enable the control of the imaging parameters of groups of focal planes by an external device in a manner similar to that described in U.S. Provisional Patent Publication No. 2014/0132810 entitled "Systems and Methods for Array Camera Focal Plane Control" to McMahon, filed November 13, 2013, the disclosure of which is incorporated by reference herein in its entirety.
[00115] In embodiments where one or more sensors are mounted to a separate substrate to the carrier, an interface device can also be mounted to the substrate. A substrate assembly that can be utilized in the construction of an array camera module in accordance with an embodiment of the invention is illustrated in FIG. 14. The substrate assembly comprises a substrate 410 to which multiple sensors 310 and an interface device 400 are attached. The substrate 410 is bonded to a carrier 300 to which lens barrels can be independently mounted utilizing processes similar to those outlined above. In many instances the substrate is bonded to the carrier and the windows through the carrier are dimensioned to provide sufficient tolerances to ensure that the focal planes of each of the sensors are positioned within the openings. Although the illustrated embodiment includes multiple sensors, a similar configuration can also be utilized with a single sensor that forms multiple focal planes (the imaging parameters and read-out of which may or may not be independently controlled).
[00116] In many embodiments, a single sensor is utilized. A camera module in which lens barrels and a sensor are mounted to a carrier in accordance with an embodiment of the invention is illustrated in FIG. 15. The camera module 1500 includes four lens barrels 1502 and a single sensor 1504 that are attached to a carrier 1506, which is constructed from a transparent glass material. As can readily be appreciated, a camera module to which lens barrels and a single sensor are attached can utilize any of a variety of carrier materials as appropriate to the requirements of specific applications in accordance with embodiments of the invention.
[00117] Although the present invention has been described in certain specific aspects, many additional modifications and variations would be apparent to those skilled in the art. It is therefore to be understood that the present invention can be practiced otherwise than specifically described. Thus, embodiments of the present invention should be considered in all respects as illustrative and not restrictive.
Claims
1 . A method of assembling an array camera module, comprising:
forming at least one hole in at least one carrier;
mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor;
independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes; and
mounting a module cap over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.
2. The method of claim 1 , wherein forming at least one hole in at least one carrier comprises forming at least one hole in a single carrier.
3. The method of claim 2, wherein mounting the single carrier relative to at least one sensor comprises mounting the single carrier relative to a plurality of sensors.
4. The method of claim 3, wherein:
each of the plurality of sensors is mounted to a first side of the single carrier; each of the plurality of lens barrels is mounted to a second opposite side of the single carrier; and
the plurality of sensors comprises a separate sensor for each of the plurality of lens barrels.
5. The method of claim 4, wherein the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
6. The method of claim 3, wherein flip chip mounting is utilized to mount the
plurality of sensors to the single carrier.
7. The method of claim 3, wherein the plurality of sensors is mounted to a substrate and mounting the single carrier relative to the plurality of sensors comprises mounting the single carrier in a fixed location relative to the substrate.
8. The method of claim 7, wherein the plurality of sensors is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
9. The method of claim 8, wherein the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
10. The method of claim 2, wherein mounting the single carrier relative to at least one sensor comprises mounting the single carrier relative to a single sensor.
1 1 . The method of claim 10, wherein:
the single sensor is mounted to a first side of the single carrier; and
each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
12. The method of claim 1 1 , wherein the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
13. The method of claim 1 1 , wherein flip chip mounting is utilized to mount the single sensor to the single carrier.
14. The method of claim 10, wherein the single sensor is mounted to a substrate and mounting the single carrier relative to the single sensor comprises mounting the single carrier in a fixed location relative to the substrate.
15. The method of claim 14, wherein the single sensor is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
16. The method of claim 15, wherein the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
17. The method of claim 1 , wherein forming at least one hole in at least one carrier comprises forming a ledge in at least one hole in the at least one carrier and mounting at least one spectral filter on the ledge.
18. The method of claim 1 , further comprising mounting at least one spectral filter within at least one hole in the at least one carrier.
19. The method of claim 18, wherein the at least one spectral filter is selected from the group consisting of a color filter and an IR-cut filter.
20. The method of claim 1 , further comprising mounting an interface device relative to the at least one carrier.
21 . The method of claim 20, wherein the interface device is mounted to the carrier.
22. The method of claim 20, wherein the at least one sensor and the interface device are mounted to a substrate and mounting the at least one carrier relative to the at least one sensor comprises mounting the at least one carrier in a fixed location relative to the substrate.
23. The method of claim 1 , wherein independently mounting a plurality of lens barrels to the at least one carrier comprises using active alignment to separately mount each of the lens barrels to one of the at least one carrier.
24. The method of claim 23, wherein the at least one hole in the at least one carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.
25. The method of claim 1 , wherein the at least one opening in the module cap are dimensioned so that the module cap is not visible within the field of view of any of the lens stacks and so that light does not reflect from the module cap into the lens stacks.
26. The method of claim 1 , wherein the module cap is mounted to the at least one carrier so that a small air gap exists between the module cap and the top of the lens barrels and the method further comprises applying a small bead of adhesive to each of the lens barrels to seal the air gap between the module cap and the lens barrels.
27. The method of claim 1 , wherein the carrier is constructed from a material selected from the group consisting of ceramic and glass.
28. A method of assembling an array camera module, comprising:
forming a plurality of holes in carrier;
mounting the carrier relative to a plurality of sensors so that light passing through each of the plurality of holes in the carrier is incident on one of a plurality of focal planes formed by the plurality of sensors;
mounting at least one spectral filter within at least one of the plurality of holes in
the carrier;
independently mounting a plurality of lens barrels to the carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto a focal plane formed by a corresponding sensor in the plurality of sensors; and
mounting a module cap over the lens barrels so that the module cap is attached to the carrier and a small air gap exists between the module cap and the top of the lens barrels, where the module cap includes a plurality of openings that each admits light into one of the plurality lens stacks contained within the plurality of lens barrels; and applying a small bead of adhesive to each of the lens barrels to seal the air gap between the module cap and the lens barrels.
29. An array camera module, comprising:
at least one carrier in which at least one window is formed;
at least one sensor mounted relative to the at least one carrier so that light passing through the at least one window in the at least one carrier is incident on a plurality of focal planes formed by at least one array of pixels on the at least one sensor; a plurality of lens barrels mounted to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one window in the at least one carrier and focuses the light onto one of the plurality of focal planes; and
a module cap mounted over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.
30. The array camera module of claim 29, wherein the at least one carrier is a single carrier.
31 . The array camera module of claim 30, wherein:
each of the plurality of sensors is mounted to a first side of the single carrier; each of the plurality of lens barrels is mounted to a second opposite side of the single carrier; and
the plurality of sensors comprises a separate sensor for each of the plurality of
lens barrels.
32. The array camera module of claim 30, wherein:
the plurality of sensors is mounted to a substrate and the single carrier is mounted in a fixed location relative to the substrate; and
the plurality of sensors is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
33. The array camera module of claim 30, wherein the at least one sensor is a single sensor.
34. The array camera module of claim 33, wherein:
the single sensor is mounted to a first side of the single carrier; and
each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
35. The array camera module of claim 33, wherein:
the single sensor is mounted to a substrate and the single carrier is mounted in a fixed location relative to the substrate; and
the single sensor is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
36. The array camera module of claim 29, wherein:
the at least one sensor is mounted to a substrate and each of a plurality of carriers is mounted in a fixed location relative to the substrate; and
each of the plurality of lens barrels is mounted to a separate carrier.
37. The array camera module of claim 29, wherein each lens barrel forms a separate aperture.
38. The array camera module of claim 29, wherein:
each lens barrel and corresponding focal plane forms a camera;
different cameras within the array camera module image different parts of the electromagnetic spectrum; and
the lens stacks contained within the lens barrels differ depending upon the portion of the electromagnetic spectrum imaged by the camera to which the lens barrel belongs.
39. The array camera module of claim 38, wherein the lens stacks contained within the lens barrels differ with respect to at least one of: the materials used to construct the lens elements within the lens stacks; the shapes of at least one surface of corresponding lens elements in the lens stacks.
40. The array camera module of claim 29, wherein each lens stack in the lens barrels has a field of view that focuses light so that the plurality of arrays of pixels that form the focal planes sample the same object space within a scene.
41 . The array camera module of claim 40, wherein:
the pixel arrays of the focal planes define spatial resolutions for each pixel array; the lens stacks focus light onto the focal planes so that the plurality of arrays of pixels that form the focal planes sample the same object space within a scene with sub- pixel offsets that provide sampling diversity; and
the lens stacks have modulation transfer functions that enable contrast to be resolved at a spatial frequency corresponding to a higher resolution than the spatial resolutions of the pixel arrays.
42. The array camera module of claim 29, wherein at least one window in the at least one carrier includes a spectral filter.
43. The array camera module of claim 42, wherein at least one window in at least one carrier comprises a ledge on which the at least one spectral filter is mounted.
44. The array camera module of claim 42, wherein the at least one spectral filter is selected from the group consisting of a color filter and an IR-cut filter.
45. The array camera module of claim 29, wherein at least one spectral filter is applied to an array of pixels forming a focal plane on at least one of the sensors.
46. The array camera module of claim 29, wherein at least one lens stack includes at least one spectral filter.
47. The array camera module of claim 29, wherein the plurality of lens barrels and the plurality of focal planes form an M x N array of cameras.
48. The array camera module of claim 47, wherein the plurality of lens barrels and the plurality of focal planes form a 3 X 3 array of cameras.
49. The array camera module of claim 47, wherein the M x N array of cameras comprises a 3 x 3 group of cameras comprising:
a central reference camera;
four cameras that capture image data in a first color channel located in the four corners of the 3 x 3 group of cameras;
a pair of cameras that capture image data in a second color channel located on either side of the central reference camera; and
a pair of cameras that capture image data in a third color channel located on either side of the central reference camera.
50. The array camera module of claims 49, wherein the reference camera is selected from the group consisting of: a camera including a Bayer filter; and a camera that captures image data in the first color channel.
51 . The array camera module of claim 29, further comprising an interface device in communication with the at least one sensor, where the interface device multiplexes data received from the at least one sensor and provides an interface via
which multiplexed data is read and the imaging parameters of the focal planes formed by the at least one pixel array on the at least one sensor are controlled.
52. The array camera module of claim 51 , wherein:
the interface device is mounted to the carrier and the carrier includes circuit traces that carry signals between the interface device and the at least one sensor; and a common clock signal coordinates the capture of image data by the at least one sensor and readout of the image data from the at least one sensor via the interface device.
53. The array camera module of claim 51 , wherein:
the at least one sensor and the interface device are mounted to a substrate, which includes circuit traces that carry signals between the interface device and the at least one sensor;
the at least one carrier is mounted in a fixed location relative to the at least one sensor; and
a common clock signal coordinates the capture of image data by the at least one sensor and readout of the image data from the at least one sensor via the interface device.
54. The array camera module of claim 29, wherein the module cap is mounted to the at least one carrier so that a small air gap exists between the module cap and the top of the lens barrels and a small bead of adhesive seals the air gaps between the module cap and the lens barrels.
55. The array camera module of claim 29, wherein the carrier is constructed from a material selected from the group consisting of ceramic and glass.
56. A array camera module, comprising:
a carrier in which a plurality of windows are formed;
a plurality of sensors each including an array of pixels, where the plurality of sensors are mounted relative to the carrier so that light passing through the plurality of
windows is incident on a plurality of focal planes formed by the arrays of pixels;
a plurality of lens barrels mounted to the at least one carrier so that a lens stack in each lens barrel directs light through the at least one window in the at least one carrier and focuses the light onto one of the plurality of focal planes; and
a module cap mounted over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.
57. An array camera, comprising:
a processor;
memory containing an image capture application;
an array camera module, comprising:
at least one carrier in which at least one window is formed;
at least one sensor mounted relative to the at least one carrier so that light passing through the at least one window in the at least one carrier is incident on a plurality of focal planes formed by at least one array of pixels on the at least one sensor;
a plurality of lens barrels mounted to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one window in the at least one carrier and focuses the light onto one of the plurality of focal planes; and
a module cap mounted over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels;
wherein the image capture application directs the processor to:
trigger the capture of image data by the array camera module; obtain and store image data captured by the array camera module, where the image data forms a set of images captured from different viewpoints;
select a reference viewpoint relative to the viewpoints of the set of images captured from different viewpoints;
normalize the set of images to increase the similarity of corresponding pixels within the set of images;
determine depth estimates for pixel locations in an image from the reference viewpoint using at least a subset of the set of images, wherein generating a depth estimate for a given pixel location in the image from the reference viewpoint comprises:
identifying pixels in the at least a subset of the set of images that correspond to the given pixel location in the image from the reference viewpoint based upon expected disparity at a plurality of depths;
comparing the similarity of the corresponding pixels identified at each of the plurality of depths; and
selecting the depth from the plurality of depths at which the identified corresponding pixels have the highest degree of similarity as a depth estimate for the given pixel location in the image from the reference viewpoint.
58. The array camera of claim 57, wherein the at least one carrier is a single carrier.
59. The array camera of claim 58, wherein:
each of the plurality of sensors is mounted to a first side of the single carrier; each of the plurality of lens barrels is mounted to a second opposite side of the single carrier; and
the plurality of sensors comprises a separate sensor for each of the plurality of lens barrels.
60. The array camera of claim 58, wherein:
the plurality of sensors is mounted to a substrate and the single carrier is mounted in a fixed location relative to the substrate; and
the plurality of sensors is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
61 . The array camera of claim 58, wherein the at least one sensor is a single
sensor.
62. The array camera of claim 61 , wherein:
the single sensor is mounted to a first side of the single carrier; and
each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
63. The array camera of claim 61 , wherein:
the single sensor is mounted to a substrate and the single carrier is mounted in a fixed location relative to the substrate; and
the single sensor is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.
64. The array camera of claim 57, wherein:
the at least one sensor is mounted to a substrate and each of a plurality of carriers is mounted in a fixed location relative to the substrate; and
each of the plurality of lens barrels is mounted to a separate carrier.
65. The array camera of claim 57, wherein each lens barrel forms a separate aperture.
66. The array camera of claim 57, wherein:
each lens barrel and corresponding focal plane forms a camera;
different cameras within the array camera module image different parts of the electromagnetic spectrum; and
the lens stacks contained within the lens barrels differ depending upon the portion of the electromagnetic spectrum imaged by the camera to which the lens barrel belongs.
67. The array camera of claim 66, wherein the lens stacks contained within the lens barrels differ with respect to at least one of: the materials used to construct the lens elements within the lens stacks; the shapes of at least one surface of corresponding lens elements in the lens stacks.
68. The array camera of claim 57, wherein each lens stack in the lens barrels has a field of view that focuses light so that the plurality of arrays of pixels that form the focal planes sample the same object space within a scene.
69. The array camera of claim 68, wherein:
the pixel arrays of the focal planes define spatial resolutions for each pixel array; the lens stacks focus light onto the focal planes so that the plurality of arrays of pixels that form the focal planes sample the same object space within a scene with sub- pixel offsets that provide sampling diversity; and
the lens stacks have modulation transfer functions that enable contrast to be resolved at a spatial frequency corresponding to a higher resolution than the spatial resolutions of the pixel arrays.
70. The array camera of claim 69, wherein the image capture application further directs the processor to fuse pixels from the set of images using the depth estimates to create a fused image having a resolution that is greater than the
resolutions of the images in the set of images by:
determining the visibility of the pixels in the set of images from the reference viewpoint by:
identifying corresponding pixels in the set of images using the depth estimates; and
determining that a pixel in a given image is not visible in the reference viewpoint when the pixel fails a photometric similarity criterion determined based upon a comparison of corresponding pixels; and
applying scene dependent geometric shifts to the pixels from the set of images that are visible in an image from the reference viewpoint to shift the pixels into the reference viewpoint, where the scene dependent geometric shifts are determined using
the current depth estimates; and
fusing the shifted pixels from the set of images to create a fused image from the reference viewpoint having a resolution that is greater than the resolutions of the images in the set of images.
71 . The array camera of claim 70, wherein the image capture application further directs the processor to synthesize an image from the reference viewpoint by performing a super-resolution process based upon the fused image from the reference viewpoint, the set of images captured from different viewpoints, the current depth estimates, and visibility information.
72. The array camera of claim 57, wherein at least one spectral filter is mounted within at least one window in the at least one carrier.
73. The array camera of claim 72, wherein at least one window in at least one carrier comprises a ledge on which the at least one spectral filter is mounted.
74. The array camera of claim 72, wherein the at least one spectral filter is selected from the group consisting of a color filter and an IR-cut filter.
75. The array camera of claim 57, wherein at least one spectral filter is applied to an array of pixels forming a focal plane on at least one of the sensors.
76. The array camera of claim 57, wherein at least one lens stack includes at least one spectral filter.
77. The array camera of claim 57, wherein:
the plurality of images comprises image data in multiple color channels; and the image capture application directs the processor to compare the similarity of pixels that are identified as corresponding at each of the plurality of depths by comparing the similarity of the pixels that are identified as corresponding in each of a
plurality of color channels at each of the plurality of depths.
78. The array camera of claim 57, wherein the plurality of lens barrels and the plurality of focal planes form an M x N array of cameras.
79. The array camera of claim 78, wherein the plurality of lens barrels and the plurality of focal planes form a 3 X 3 array of cameras.
80. The array camera of claim 78, wherein the M x N array of cameras comprises a 3 x 3 group of cameras comprising:
a central reference camera;
four cameras that capture image data in a first color channel located in the four corners of the 3 x 3 group of cameras;
a pair of cameras that capture image data in a second color channel located on either side of the central reference camera; and
a pair of cameras that capture image data in a third color channel located on either side of the central reference camera.
81 . The array camera of claims 80, wherein the reference camera is selected from the group consisting of: a camera including a Bayer filter; and a camera that captures image data in the first color channel.
82. The array camera of claim 57, wherein the array camera module further comprises an interface device in communication with the at least one sensor, where the interface device multiplexes data received from the sensors and provides an interface via which the processor reads multiplexed data and via which the processor controls the imaging parameters of the focal planes formed by the plurality of pixel arrays.
83. The array camera of claim 82, wherein:
the interface device is mounted to the carrier and the carrier includes circuit traces that carry signals between the interface device and the at least one sensor; and a common clock signal coordinates the capture of image data by the at least one
sensor and readout of the image data from the at least one sensor via the interface device.
84. The array camera of claim 82, wherein:
the at least one sensor and the interface device are mounted to a substrate, which includes circuit traces that carry signals between the interface device and the at least one sensor;
the at least one carrier is mounted in a fixed location relative to the at least one sensor; and
a common clock signal coordinates the capture of image data by the at least one sensor and readout of the image data from the at least one sensor via the interface device.
85. The array camera of claim 57, wherein the module cap is mounted to the at least one carrier so that a small air gap exists between the module cap and the top of the lens barrels and a small bead of adhesive seals the air gaps between the module cap and the lens barrels.
86. The array camera of claim 57, wherein the carrier is constructed from a material selected from the group consisting of ceramic and glass.
87. A array camera, comprising:
a processor;
memory containing an image capture application;
an array camera module, comprising:
a carrier in which a plurality of windows are formed;
a plurality of sensors each including an array of pixels, where the plurality of sensors are mounted relative to the carrier so that light passing through the plurality of windows is incident on a plurality of focal planes formed by the arrays of pixels;
a plurality of lens barrels mounted to the at least one carrier so that a lens stack in each lens barrel directs light through the at least one window in the at
least one carrier and focuses the light onto one of the plurality of focal planes; and
a module cap mounted over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels;
wherein the image capture application directs the processor to:
trigger the capture of image data by the array camera module; obtain and store image data captured by the array camera module, where the image data forms a set of images captured from different viewpoints;
select a reference viewpoint relative to the viewpoints of the set of images captured from different viewpoints;
normalize the set of images to increase the similarity of corresponding pixels within the set of images;
determine depth estimates for pixel locations in an image from the reference viewpoint using at least a subset of the set of images, wherein generating a depth estimate for a given pixel location in the image from the reference viewpoint comprises:
identifying pixels in the at least a subset of the set of images that correspond to the given pixel location in the image from the reference viewpoint based upon expected disparity at a plurality of depths;
comparing the similarity of the corresponding pixels identified at each of the plurality of depths; and
selecting the depth from the plurality of depths at which the identified corresponding pixels have the highest degree of similarity as a depth estimate for the given pixel location in the image from the reference viewpoint.
88. The array camera of claim 87, wherein:
the pixel arrays of the focal planes define spatial resolutions for each pixel array; the lens stacks focus light onto the focal planes so that the plurality of arrays of pixels that form the focal planes sample the same object space within a scene with sub- pixel offsets that provide sampling diversity; and
the lens stacks have modulation transfer functions that enable contrast to be resolved at a spatial frequency corresponding to a higher resolution than the spatial resolutions of the pixel arrays; and
the image capture application further directs the processor to fuse pixels from the set of images using the depth estimates to create a fused image having a resolution that is greater than the resolutions of the images in the set of images by:
determining the visibility of the pixels in the set of images from the reference viewpoint by:
identifying corresponding pixels in the set of images using the depth estimates; and
determining that a pixel in a given image is not visible in the reference viewpoint when the pixel fails a photometric similarity criterion determined based upon a comparison of corresponding pixels; and applying scene dependent geometric shifts to the pixels from the set of images that are visible in an image from the reference viewpoint to shift the pixels into the reference viewpoint, where the scene dependent geometric shifts are determined using the current depth estimates; and
fusing the shifted pixels from the set of images to create a fused image from the reference viewpoint having a resolution that is greater than the resolutions of the images in the set of images.
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Cited By (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9374512B2 (en) | 2013-02-24 | 2016-06-21 | Pelican Imaging Corporation | Thin form factor computational array cameras and modular array cameras |
US9485496B2 (en) | 2008-05-20 | 2016-11-01 | Pelican Imaging Corporation | Systems and methods for measuring depth using images captured by a camera array including cameras surrounding a central camera |
US9497429B2 (en) | 2013-03-15 | 2016-11-15 | Pelican Imaging Corporation | Extended color processing on pelican array cameras |
US9536166B2 (en) | 2011-09-28 | 2017-01-03 | Kip Peli P1 Lp | Systems and methods for decoding image files containing depth maps stored as metadata |
US9638883B1 (en) | 2013-03-04 | 2017-05-02 | Fotonation Cayman Limited | Passive alignment of array camera modules constructed from lens stack arrays and sensors based upon alignment information obtained during manufacture of array camera modules using an active alignment process |
US9706132B2 (en) | 2012-05-01 | 2017-07-11 | Fotonation Cayman Limited | Camera modules patterned with pi filter groups |
US9733486B2 (en) | 2013-03-13 | 2017-08-15 | Fotonation Cayman Limited | Systems and methods for controlling aliasing in images captured by an array camera for use in super-resolution processing |
US9749547B2 (en) | 2008-05-20 | 2017-08-29 | Fotonation Cayman Limited | Capturing and processing of images using camera array incorperating Bayer cameras having different fields of view |
US9749568B2 (en) | 2012-11-13 | 2017-08-29 | Fotonation Cayman Limited | Systems and methods for array camera focal plane control |
US9754422B2 (en) | 2012-02-21 | 2017-09-05 | Fotonation Cayman Limited | Systems and method for performing depth based image editing |
US9766380B2 (en) | 2012-06-30 | 2017-09-19 | Fotonation Cayman Limited | Systems and methods for manufacturing camera modules using active alignment of lens stack arrays and sensors |
US9774789B2 (en) | 2013-03-08 | 2017-09-26 | Fotonation Cayman Limited | Systems and methods for high dynamic range imaging using array cameras |
US9794476B2 (en) | 2011-09-19 | 2017-10-17 | Fotonation Cayman Limited | Systems and methods for controlling aliasing in images captured by an array camera for use in super resolution processing using pixel apertures |
US9800856B2 (en) | 2013-03-13 | 2017-10-24 | Fotonation Cayman Limited | Systems and methods for synthesizing images from image data captured by an array camera using restricted depth of field depth maps in which depth estimation precision varies |
US9800859B2 (en) | 2013-03-15 | 2017-10-24 | Fotonation Cayman Limited | Systems and methods for estimating depth using stereo array cameras |
US9807382B2 (en) | 2012-06-28 | 2017-10-31 | Fotonation Cayman Limited | Systems and methods for detecting defective camera arrays and optic arrays |
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US9813617B2 (en) | 2013-11-26 | 2017-11-07 | Fotonation Cayman Limited | Array camera configurations incorporating constituent array cameras and constituent cameras |
US9858673B2 (en) | 2012-08-21 | 2018-01-02 | Fotonation Cayman Limited | Systems and methods for estimating depth and visibility from a reference viewpoint for pixels in a set of images captured from different viewpoints |
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US9898856B2 (en) | 2013-09-27 | 2018-02-20 | Fotonation Cayman Limited | Systems and methods for depth-assisted perspective distortion correction |
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US9986224B2 (en) | 2013-03-10 | 2018-05-29 | Fotonation Cayman Limited | System and methods for calibration of an array camera |
US10009538B2 (en) | 2013-02-21 | 2018-06-26 | Fotonation Cayman Limited | Systems and methods for generating compressed light field representation data using captured light fields, array geometry, and parallax information |
US10091405B2 (en) | 2013-03-14 | 2018-10-02 | Fotonation Cayman Limited | Systems and methods for reducing motion blur in images or video in ultra low light with array cameras |
US10089740B2 (en) | 2014-03-07 | 2018-10-02 | Fotonation Limited | System and methods for depth regularization and semiautomatic interactive matting using RGB-D images |
US10119808B2 (en) | 2013-11-18 | 2018-11-06 | Fotonation Limited | Systems and methods for estimating depth from projected texture using camera arrays |
US10122993B2 (en) | 2013-03-15 | 2018-11-06 | Fotonation Limited | Autofocus system for a conventional camera that uses depth information from an array camera |
US10127682B2 (en) | 2013-03-13 | 2018-11-13 | Fotonation Limited | System and methods for calibration of an array camera |
US10218889B2 (en) | 2011-05-11 | 2019-02-26 | Fotonation Limited | Systems and methods for transmitting and receiving array camera image data |
US10250871B2 (en) | 2014-09-29 | 2019-04-02 | Fotonation Limited | Systems and methods for dynamic calibration of array cameras |
US10306120B2 (en) | 2009-11-20 | 2019-05-28 | Fotonation Limited | Capturing and processing of images captured by camera arrays incorporating cameras with telephoto and conventional lenses to generate depth maps |
US10366472B2 (en) | 2010-12-14 | 2019-07-30 | Fotonation Limited | Systems and methods for synthesizing high resolution images using images captured by an array of independently controllable imagers |
US10390005B2 (en) | 2012-09-28 | 2019-08-20 | Fotonation Limited | Generating images from light fields utilizing virtual viewpoints |
US10412314B2 (en) | 2013-03-14 | 2019-09-10 | Fotonation Limited | Systems and methods for photometric normalization in array cameras |
US10455168B2 (en) | 2010-05-12 | 2019-10-22 | Fotonation Limited | Imager array interfaces |
US10482618B2 (en) | 2017-08-21 | 2019-11-19 | Fotonation Limited | Systems and methods for hybrid depth regularization |
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US11270110B2 (en) | 2019-09-17 | 2022-03-08 | Boston Polarimetrics, Inc. | Systems and methods for surface modeling using polarization cues |
US11290658B1 (en) | 2021-04-15 | 2022-03-29 | Boston Polarimetrics, Inc. | Systems and methods for camera exposure control |
US11302012B2 (en) | 2019-11-30 | 2022-04-12 | Boston Polarimetrics, Inc. | Systems and methods for transparent object segmentation using polarization cues |
US11525906B2 (en) | 2019-10-07 | 2022-12-13 | Intrinsic Innovation Llc | Systems and methods for augmentation of sensor systems and imaging systems with polarization |
US11580667B2 (en) | 2020-01-29 | 2023-02-14 | Intrinsic Innovation Llc | Systems and methods for characterizing object pose detection and measurement systems |
US11689813B2 (en) | 2021-07-01 | 2023-06-27 | Intrinsic Innovation Llc | Systems and methods for high dynamic range imaging using crossed polarizers |
US11792538B2 (en) | 2008-05-20 | 2023-10-17 | Adeia Imaging Llc | Capturing and processing of images including occlusions focused on an image sensor by a lens stack array |
US11797863B2 (en) | 2020-01-30 | 2023-10-24 | Intrinsic Innovation Llc | Systems and methods for synthesizing data for training statistical models on different imaging modalities including polarized images |
US11892356B2 (en) | 2019-08-30 | 2024-02-06 | Seek Thermal, Inc. | Design, test, and operation of a small thermal imaging core |
US11953700B2 (en) | 2020-05-27 | 2024-04-09 | Intrinsic Innovation Llc | Multi-aperture polarization optical systems using beam splitters |
US11954886B2 (en) | 2021-04-15 | 2024-04-09 | Intrinsic Innovation Llc | Systems and methods for six-degree of freedom pose estimation of deformable objects |
US12020455B2 (en) | 2021-03-10 | 2024-06-25 | Intrinsic Innovation Llc | Systems and methods for high dynamic range image reconstruction |
US12052409B2 (en) | 2023-06-22 | 2024-07-30 | Adela Imaging LLC | Systems and methods for encoding image files containing depth maps stored as metadata |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130265459A1 (en) | 2011-06-28 | 2013-10-10 | Pelican Imaging Corporation | Optical arrangements for use with an array camera |
US9214013B2 (en) | 2012-09-14 | 2015-12-15 | Pelican Imaging Corporation | Systems and methods for correcting user identified artifacts in light field images |
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US20150281601A1 (en) * | 2014-03-25 | 2015-10-01 | INVIS Technologies Corporation | Modular Packaging and Optical System for Multi-Aperture and Multi-Spectral Camera Core |
US9521319B2 (en) | 2014-06-18 | 2016-12-13 | Pelican Imaging Corporation | Array cameras and array camera modules including spectral filters disposed outside of a constituent image sensor |
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US10523854B2 (en) | 2015-06-25 | 2019-12-31 | Intel Corporation | Array imaging system having discrete camera modules and method for manufacturing the same |
JP6670565B2 (en) * | 2015-07-31 | 2020-03-25 | ソニーセミコンダクタソリューションズ株式会社 | Manufacturing method and mold for laminated lens structure |
CN105187697B (en) * | 2015-08-04 | 2019-12-31 | 宁波舜宇光电信息有限公司 | Multi-lens camera module conjoined bracket, multi-lens camera module and application thereof |
KR102446442B1 (en) | 2015-11-24 | 2022-09-23 | 삼성전자주식회사 | Digital photographing apparatus and the operating method for the same |
JP2017099616A (en) * | 2015-12-01 | 2017-06-08 | ソニー株式会社 | Surgical control device, surgical control method and program, and surgical system |
US10750071B2 (en) * | 2016-03-12 | 2020-08-18 | Ningbo Sunny Opotech Co., Ltd. | Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof |
WO2017177300A1 (en) | 2016-04-15 | 2017-10-19 | Teledyne Dalsa, Inc. | Alignment of multiple image dice in package |
US11102467B2 (en) | 2016-08-25 | 2021-08-24 | Facebook Technologies, Llc | Array detector for depth mapping |
US10462361B2 (en) * | 2017-09-26 | 2019-10-29 | Rosemount Aerospace Inc. | Seeker with dynamic resolution imaging |
KR20190072837A (en) * | 2017-12-18 | 2019-06-26 | 엘지전자 주식회사 | Camera Module and Mobile Terminal having it |
US10742904B2 (en) | 2018-05-25 | 2020-08-11 | Fotonation Limited | Multispectral image processing system for face detection |
CN109254379A (en) * | 2018-11-21 | 2019-01-22 | 中国科学院上海技术物理研究所 | A kind of poly-lens integrated package of cryogenic applications |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6172352B1 (en) * | 1998-03-20 | 2001-01-09 | Syscan, Inc. | Sensing module for accelerating signal readout from image sensors |
US6571466B1 (en) * | 2000-03-27 | 2003-06-03 | Amkor Technology, Inc. | Flip chip image sensor package fabrication method |
US20070296847A1 (en) * | 2006-06-21 | 2007-12-27 | Chao-Chi Chang | Method of making image capture unit |
US7639435B2 (en) * | 2007-04-04 | 2009-12-29 | Hon Hai Precision Industry Co., Ltd. | Optical module with adhesively mounted filter |
US20100166410A1 (en) * | 2008-12-27 | 2010-07-01 | Hon Hai Precision Industry Co., Ltd. | Camera module array for obtaining compound images |
US20100309292A1 (en) * | 2007-11-29 | 2010-12-09 | Gwangju Institute Of Science And Technology | Method and apparatus for generating multi-viewpoint depth map, method for generating disparity of multi-viewpoint image |
WO2012057619A1 (en) | 2010-10-24 | 2012-05-03 | Ziv Attar | System and method for imaging using multi aperture camera |
US20130088637A1 (en) * | 2011-10-11 | 2013-04-11 | Pelican Imaging Corporation | Lens Stack Arrays Including Adaptive Optical Elements |
US20130265459A1 (en) * | 2011-06-28 | 2013-10-10 | Pelican Imaging Corporation | Optical arrangements for use with an array camera |
US20130274923A1 (en) * | 2012-04-13 | 2013-10-17 | Automation Engineering, Inc. | Active Alignment Using Continuous Motion Sweeps and Temporal Interpolation |
Family Cites Families (731)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4124798A (en) | 1965-12-09 | 1978-11-07 | Thompson Kenneth B | Optical viewing apparatus |
US4198646A (en) | 1978-10-13 | 1980-04-15 | Hughes Aircraft Company | Monolithic imager for near-IR |
US4323925A (en) | 1980-07-07 | 1982-04-06 | Avco Everett Research Laboratory, Inc. | Method and apparatus for arraying image sensor modules |
JPS5769476A (en) | 1980-10-16 | 1982-04-28 | Fuji Xerox Co Ltd | Reader control system |
JPS5925483A (en) | 1982-08-04 | 1984-02-09 | Hitachi Denshi Ltd | Solid state image pickup device |
JPS5925483U (en) | 1982-08-09 | 1984-02-17 | 住友電気工業株式会社 | Defective insulator detection device |
US4652909A (en) | 1982-09-14 | 1987-03-24 | New York Institute Of Technology | Television camera and recording system for high definition television having imagers of different frame rate |
US4460449A (en) | 1983-01-03 | 1984-07-17 | Amerace Corporation | Apparatus for making a tool |
EP0289885A1 (en) | 1987-05-08 | 1988-11-09 | Siemens Aktiengesellschaft | Aperture system for production of several partical probes with changeable cross-section |
JPS6437177A (en) | 1987-08-03 | 1989-02-07 | Canon Kk | Image pickup device |
JPS6437177U (en) | 1987-08-31 | 1989-03-06 | ||
DE58902538D1 (en) | 1988-05-19 | 1992-12-03 | Siemens Ag | METHOD FOR OBSERVING A SCENE AND DEVICE FOR IMPLEMENTING THE METHOD. |
JPH02285772A (en) | 1989-04-26 | 1990-11-26 | Toshiba Corp | Picture reader |
US5070414A (en) | 1988-09-20 | 1991-12-03 | Kabushiki Kaisha Toshiba | Method and apparatus for reading image information formed on material |
US5157499A (en) | 1990-06-29 | 1992-10-20 | Kabushiki Kaisha N A C | High-speed video camera using solid-state image sensor |
US5144448A (en) | 1990-07-31 | 1992-09-01 | Vidar Systems Corporation | Scanning apparatus using multiple CCD arrays and related method |
US5325449A (en) | 1992-05-15 | 1994-06-28 | David Sarnoff Research Center, Inc. | Method for fusing images and apparatus therefor |
JP3032382B2 (en) | 1992-07-13 | 2000-04-17 | シャープ株式会社 | Digital signal sampling frequency converter |
US5659424A (en) | 1993-05-25 | 1997-08-19 | Hitachi, Ltd. | Projecting lens and image display device |
JPH0715457A (en) | 1993-06-18 | 1995-01-17 | Hitachi Ltd | Digital communication switchover system |
EP0677821A3 (en) | 1994-04-14 | 1996-03-06 | Hewlett Packard Co | Magnify a digital image using feedback. |
US20020195548A1 (en) | 2001-06-06 | 2002-12-26 | Dowski Edward Raymond | Wavefront coding interference contrast imaging systems |
US5629524A (en) | 1995-02-21 | 1997-05-13 | Advanced Scientific Concepts, Inc. | High speed crystallography detector |
EP0739039A3 (en) | 1995-04-18 | 1998-03-04 | Interuniversitair Micro-Elektronica Centrum Vzw | Pixel structure, image sensor using such pixel, structure and corresponding peripheric circuitry |
US6005607A (en) | 1995-06-29 | 1999-12-21 | Matsushita Electric Industrial Co., Ltd. | Stereoscopic computer graphics image generating apparatus and stereoscopic TV apparatus |
AU1074797A (en) | 1995-11-07 | 1997-06-05 | California Institute Of Technology | Capacitively coupled successive approximation ultra low power analog-to-digital converter |
JPH09181913A (en) | 1995-12-26 | 1997-07-11 | Olympus Optical Co Ltd | Camera system |
US6124974A (en) | 1996-01-26 | 2000-09-26 | Proxemics | Lenslet array systems and methods |
US5973844A (en) | 1996-01-26 | 1999-10-26 | Proxemics | Lenslet array systems and methods |
US6493465B2 (en) | 1996-02-21 | 2002-12-10 | Canon Kabushiki Kaisha | Matching point extracting method and apparatus therefor |
US5832312A (en) | 1996-02-22 | 1998-11-03 | Eastman Kodak Company | Watertight body for accommodating a photographic camera |
MY118360A (en) | 1996-04-30 | 2004-10-30 | Nippon Telegraph & Telephone | Scheme for detecting shot boundaries in compressed video data using inter-frame/inter field prediction coding and intra-frame/intra-field coding |
US6002743A (en) | 1996-07-17 | 1999-12-14 | Telymonde; Timothy D. | Method and apparatus for image acquisition from a plurality of cameras |
GB9616262D0 (en) | 1996-08-02 | 1996-09-11 | Philips Electronics Nv | Post-processing generation of focus/defocus effects for computer graphics images |
US6141048A (en) | 1996-08-19 | 2000-10-31 | Eastman Kodak Company | Compact image capture device |
US6137535A (en) | 1996-11-04 | 2000-10-24 | Eastman Kodak Company | Compact digital camera with segmented fields of view |
US5808350A (en) | 1997-01-03 | 1998-09-15 | Raytheon Company | Integrated IR, visible and NIR sensor and methods of fabricating same |
JPH10232626A (en) | 1997-02-20 | 1998-09-02 | Canon Inc | Stereoscopic image display device |
US5801919A (en) | 1997-04-04 | 1998-09-01 | Gateway 2000, Inc. | Adjustably mounted camera assembly for portable computers |
US6097394A (en) | 1997-04-28 | 2000-08-01 | Board Of Trustees, Leland Stanford, Jr. University | Method and system for light field rendering |
US6515701B2 (en) | 1997-07-24 | 2003-02-04 | Polaroid Corporation | Focal plane exposure control system for CMOS area image sensors |
US6563537B1 (en) | 1997-07-31 | 2003-05-13 | Fuji Photo Film Co., Ltd. | Image signal interpolation |
JP3430935B2 (en) | 1997-10-20 | 2003-07-28 | 富士ゼロックス株式会社 | Image reading device and lens |
NO305728B1 (en) * | 1997-11-14 | 1999-07-12 | Reidar E Tangen | Optoelectronic camera and method of image formatting in the same |
JP4243779B2 (en) | 1997-11-14 | 2009-03-25 | 株式会社ニコン | Diffusion plate manufacturing method, diffusion plate, microlens array manufacturing method, and microlens array |
US6069365A (en) | 1997-11-25 | 2000-05-30 | Alan Y. Chow | Optical processor based imaging system |
JPH11242189A (en) | 1997-12-25 | 1999-09-07 | Olympus Optical Co Ltd | Method and device for forming image |
US6721008B2 (en) | 1998-01-22 | 2004-04-13 | Eastman Kodak Company | Integrated CMOS active pixel digital camera |
JPH11223708A (en) | 1998-02-09 | 1999-08-17 | Nikon Corp | Indentator and production of micro-optical element array |
US6160909A (en) | 1998-04-01 | 2000-12-12 | Canon Kabushiki Kaisha | Depth control for stereoscopic images |
JP3931936B2 (en) | 1998-05-11 | 2007-06-20 | セイコーエプソン株式会社 | Microlens array substrate, method for manufacturing the same, and display device |
US6205241B1 (en) | 1998-06-01 | 2001-03-20 | Canon Kabushiki Kaisha | Compression of stereoscopic images |
US6137100A (en) | 1998-06-08 | 2000-10-24 | Photobit Corporation | CMOS image sensor with different pixel sizes for different colors |
US6069351A (en) | 1998-07-16 | 2000-05-30 | Intel Corporation | Focal plane processor for scaling information from image sensors |
US6903770B1 (en) | 1998-07-27 | 2005-06-07 | Sanyo Electric Co., Ltd. | Digital camera which produces a single image based on two exposures |
US6340994B1 (en) | 1998-08-12 | 2002-01-22 | Pixonics, Llc | System and method for using temporal gamma and reverse super-resolution to process images for use in digital display systems |
US6269175B1 (en) | 1998-08-28 | 2001-07-31 | Sarnoff Corporation | Method and apparatus for enhancing regions of aligned images using flow estimation |
US6879735B1 (en) | 1998-09-14 | 2005-04-12 | University Of Utah Reasearch Foundation | Method of digital image enhancement and sharpening |
US6310650B1 (en) | 1998-09-23 | 2001-10-30 | Honeywell International Inc. | Method and apparatus for calibrating a tiled display |
GB2343320B (en) | 1998-10-31 | 2003-03-26 | Ibm | Camera system for three dimentional images and video |
JP3596314B2 (en) | 1998-11-02 | 2004-12-02 | 日産自動車株式会社 | Object edge position measuring device and moving object traffic judging device |
US6611289B1 (en) | 1999-01-15 | 2003-08-26 | Yanbin Yu | Digital cameras using multiple sensors with multiple lenses |
JP3875423B2 (en) | 1999-01-19 | 2007-01-31 | 日本放送協会 | Solid-state imaging device and video signal output device therefor |
US6603513B1 (en) | 1999-02-16 | 2003-08-05 | Micron Technology, Inc. | Using a single control line to provide select and reset signals to image sensors in two rows of a digital imaging device |
US6563540B2 (en) | 1999-02-26 | 2003-05-13 | Intel Corporation | Light sensor with increased dynamic range |
US20020063807A1 (en) | 1999-04-19 | 2002-05-30 | Neal Margulis | Method for Performing Image Transforms in a Digital Display System |
US6819358B1 (en) | 1999-04-26 | 2004-11-16 | Microsoft Corporation | Error calibration for digital image sensors and apparatus using the same |
JP2001008235A (en) | 1999-06-25 | 2001-01-12 | Minolta Co Ltd | Image input method for reconfiguring three-dimensional data and multiple-lens data input device |
JP2001042042A (en) | 1999-07-27 | 2001-02-16 | Canon Inc | Image pickup device |
US7015954B1 (en) | 1999-08-09 | 2006-03-21 | Fuji Xerox Co., Ltd. | Automatic video system using multiple cameras |
US6647142B1 (en) | 1999-08-19 | 2003-11-11 | Mitsubishi Electric Research Laboratories, Inc. | Badge identification system |
US6771833B1 (en) | 1999-08-20 | 2004-08-03 | Eastman Kodak Company | Method and system for enhancing digital images |
US6628330B1 (en) | 1999-09-01 | 2003-09-30 | Neomagic Corp. | Color interpolator and horizontal/vertical edge enhancer using two line buffer and alternating even/odd filters for digital camera |
US6358862B1 (en) | 1999-09-02 | 2002-03-19 | Micron Technology, Inc | Passivation integrity improvements |
US6639596B1 (en) | 1999-09-20 | 2003-10-28 | Microsoft Corporation | Stereo reconstruction from multiperspective panoramas |
US6774941B1 (en) | 1999-10-26 | 2004-08-10 | National Semiconductor Corporation | CCD output processing stage that amplifies signals from colored pixels based on the conversion efficiency of the colored pixels |
US6671399B1 (en) | 1999-10-27 | 2003-12-30 | Canon Kabushiki Kaisha | Fast epipolar line adjustment of stereo pairs |
US6674892B1 (en) | 1999-11-01 | 2004-01-06 | Canon Kabushiki Kaisha | Correcting an epipolar axis for skew and offset |
JP2001195050A (en) | 1999-11-05 | 2001-07-19 | Mitsubishi Electric Corp | Graphic accelerator |
WO2001039512A1 (en) | 1999-11-26 | 2001-05-31 | Sanyo Electric Co., Ltd. | Device and method for converting two-dimensional video to three-dimensional video |
JP3950926B2 (en) | 1999-11-30 | 2007-08-01 | エーユー オプトロニクス コーポレイション | Image display method, host device, image display device, and display interface |
JP3728160B2 (en) | 1999-12-06 | 2005-12-21 | キヤノン株式会社 | Depth image measuring apparatus and method, and mixed reality presentation system |
US7068851B1 (en) | 1999-12-10 | 2006-06-27 | Ricoh Co., Ltd. | Multiscale sharpening and smoothing with wavelets |
FI107680B (en) | 1999-12-22 | 2001-09-14 | Nokia Oyj | Procedure for transmitting video images, data transmission systems, transmitting video terminal and receiving video terminal |
US6502097B1 (en) | 1999-12-23 | 2002-12-31 | Microsoft Corporation | Data structure for efficient access to variable-size data objects |
US6476805B1 (en) | 1999-12-23 | 2002-11-05 | Microsoft Corporation | Techniques for spatial displacement estimation and multi-resolution operations on light fields |
JP2001194114A (en) | 2000-01-14 | 2001-07-19 | Sony Corp | Image processing apparatus and method and program providing medium |
US6523046B2 (en) | 2000-02-25 | 2003-02-18 | Microsoft Corporation | Infrastructure and method for supporting generic multimedia metadata |
JP2001264033A (en) | 2000-03-17 | 2001-09-26 | Sony Corp | Three-dimensional shape-measuring apparatus and its method, three-dimensional modeling device and its method, and program providing medium |
JP2001277260A (en) | 2000-03-30 | 2001-10-09 | Seiko Epson Corp | Micro-lens array, its production method, and original board and display for producing it |
WO2001075949A1 (en) | 2000-04-04 | 2001-10-11 | Advantest Corporation | Multibeam exposure apparatus comprising multiaxis electron lens and method for manufacturing semiconductor device |
WO2001082593A1 (en) | 2000-04-24 | 2001-11-01 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Apparatus and method for color image fusion |
JP2001337263A (en) | 2000-05-25 | 2001-12-07 | Olympus Optical Co Ltd | Range-finding device |
AU2001277964A1 (en) | 2000-07-21 | 2002-02-05 | The Trustees Of Columbia University In The City Of New York | Method and apparatus for image mosaicing |
US7154546B1 (en) | 2000-08-07 | 2006-12-26 | Micron Technology, Inc. | Pixel optimization for color |
ATE313218T1 (en) | 2000-08-25 | 2005-12-15 | Fuji Photo Film Co Ltd | DEVICE FOR PARALLAX IMAGE RECORDING AND PARALLAX IMAGE PROCESSING |
US7085409B2 (en) | 2000-10-18 | 2006-08-01 | Sarnoff Corporation | Method and apparatus for synthesizing new video and/or still imagery from a collection of real video and/or still imagery |
US6734905B2 (en) | 2000-10-20 | 2004-05-11 | Micron Technology, Inc. | Dynamic range extension for CMOS image sensors |
US7262799B2 (en) | 2000-10-25 | 2007-08-28 | Canon Kabushiki Kaisha | Image sensing apparatus and its control method, control program, and storage medium |
US6476971B1 (en) | 2000-10-31 | 2002-11-05 | Eastman Kodak Company | Method of manufacturing a microlens array mold and a microlens array |
JP3918499B2 (en) | 2000-11-01 | 2007-05-23 | セイコーエプソン株式会社 | Gap measuring method, gap measuring device, shape measuring method, shape measuring device, and liquid crystal device manufacturing method |
US6788338B1 (en) | 2000-11-20 | 2004-09-07 | Petko Dimitrov Dinev | High resolution video camera apparatus having two image sensors and signal processing |
US7490774B2 (en) | 2003-11-13 | 2009-02-17 | Metrologic Instruments, Inc. | Hand-supportable imaging based bar code symbol reader employing automatic light exposure measurement and illumination control subsystem integrated therein |
JP2002171537A (en) | 2000-11-30 | 2002-06-14 | Canon Inc | Compound image pickup system, image pickup device and electronic device |
ATE552572T1 (en) | 2000-12-01 | 2012-04-15 | Imax Corp | METHOD AND DEVICE FOR GENERATING HIGH-RESOLUTION IMAGES |
CA2436607A1 (en) | 2000-12-05 | 2002-06-13 | Yeda Research And Development Co. Ltd. | Apparatus and method for alignment of spatial or temporal non-overlapping image sequences |
JP2002252338A (en) | 2000-12-18 | 2002-09-06 | Canon Inc | Imaging device and imaging system |
JP2002195910A (en) | 2000-12-26 | 2002-07-10 | Omron Corp | System for testing optical part |
JP2002209226A (en) | 2000-12-28 | 2002-07-26 | Canon Inc | Image pickup device |
US7805680B2 (en) | 2001-01-03 | 2010-09-28 | Nokia Corporation | Statistical metering and filtering of content via pixel-based metadata |
JP3957460B2 (en) | 2001-01-15 | 2007-08-15 | 沖電気工業株式会社 | Transmission header compression apparatus, moving picture encoding apparatus, and moving picture transmission system |
US6635941B2 (en) | 2001-03-21 | 2003-10-21 | Canon Kabushiki Kaisha | Structure of semiconductor device with improved reliability |
JP2002324743A (en) | 2001-04-24 | 2002-11-08 | Canon Inc | Exposing method and equipment thereof |
US6443579B1 (en) | 2001-05-02 | 2002-09-03 | Kenneth Myers | Field-of-view controlling arrangements |
US20020167537A1 (en) | 2001-05-11 | 2002-11-14 | Miroslav Trajkovic | Motion-based tracking with pan-tilt-zoom camera |
US7235785B2 (en) | 2001-05-11 | 2007-06-26 | Irvine Sensors Corp. | Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array |
WO2002098112A2 (en) | 2001-05-29 | 2002-12-05 | Transchip, Inc. | Patent application cmos imager for cellular applications and methods of using such |
US7738013B2 (en) | 2001-05-29 | 2010-06-15 | Samsung Electronics Co., Ltd. | Systems and methods for power conservation in a CMOS imager |
US6482669B1 (en) | 2001-05-30 | 2002-11-19 | Taiwan Semiconductor Manufacturing Company | Colors only process to reduce package yield loss |
US6525302B2 (en) | 2001-06-06 | 2003-02-25 | The Regents Of The University Of Colorado | Wavefront coding phase contrast imaging systems |
US20030025227A1 (en) | 2001-08-02 | 2003-02-06 | Zograph, Llc | Reproduction of relief patterns |
EP1289309B1 (en) | 2001-08-31 | 2010-04-21 | STMicroelectronics Srl | Noise filter for Bayer pattern image data |
JP3978706B2 (en) | 2001-09-20 | 2007-09-19 | セイコーエプソン株式会社 | Manufacturing method of fine structure |
JP2003139910A (en) | 2001-10-30 | 2003-05-14 | Sony Corp | Optical element, method and device for manufacturing the same, and liquid crystal display device and image projection type display device using the same |
DE10153237A1 (en) | 2001-10-31 | 2003-05-15 | Lfk Gmbh | Method and device for the automated determination of the modulation transfer function (MTF) of focal plane array (FPA) cameras |
JP3705766B2 (en) | 2001-11-28 | 2005-10-12 | 独立行政法人科学技術振興機構 | Image input device |
WO2003052465A2 (en) | 2001-12-18 | 2003-06-26 | University Of Rochester | Multifocal aspheric lens obtaining extended field depth |
US7302118B2 (en) | 2002-02-07 | 2007-11-27 | Microsoft Corporation | Transformation of images |
US20030179418A1 (en) | 2002-03-19 | 2003-09-25 | Eastman Kodak Company | Producing a defective pixel map from defective cluster pixels in an area array image sensor |
US8369607B2 (en) | 2002-03-27 | 2013-02-05 | Sanyo Electric Co., Ltd. | Method and apparatus for processing three-dimensional images |
JP2003298920A (en) | 2002-03-29 | 2003-10-17 | Fuji Photo Film Co Ltd | Digital camera |
US20030188659A1 (en) | 2002-04-05 | 2003-10-09 | Canadian Bank Note Company Limited | Method and apparatus for reproducing a color image based on monochrome images derived therefrom |
US6856314B2 (en) | 2002-04-18 | 2005-02-15 | Stmicroelectronics, Inc. | Method and system for 3D reconstruction of multiple views with altering search path and occlusion modeling |
JP3567327B2 (en) | 2002-05-08 | 2004-09-22 | 富士写真光機株式会社 | Imaging lens |
US6783900B2 (en) | 2002-05-13 | 2004-08-31 | Micron Technology, Inc. | Color filter imaging array and method of formation |
JP2004048644A (en) | 2002-05-21 | 2004-02-12 | Sony Corp | Information processor, information processing system and interlocutor display method |
JP2003347192A (en) | 2002-05-24 | 2003-12-05 | Toshiba Corp | Energy beam exposure method and exposure device |
JP2004088713A (en) | 2002-06-27 | 2004-03-18 | Olympus Corp | Image pickup lens unit and image pickup device |
US7129981B2 (en) | 2002-06-27 | 2006-10-31 | International Business Machines Corporation | Rendering system and method for images having differing foveal area and peripheral view area resolutions |
JP4147059B2 (en) | 2002-07-03 | 2008-09-10 | 株式会社トプコン | Calibration data measuring device, measuring method and measuring program, computer-readable recording medium, and image data processing device |
JP2004037924A (en) | 2002-07-04 | 2004-02-05 | Minolta Co Ltd | Imaging apparatus |
WO2004008403A2 (en) | 2002-07-15 | 2004-01-22 | Magna B.S.P. Ltd. | Method and apparatus for implementing multipurpose monitoring system |
US20040012689A1 (en) | 2002-07-16 | 2004-01-22 | Fairchild Imaging | Charge coupled devices in tiled arrays |
JP2004078296A (en) | 2002-08-09 | 2004-03-11 | Victor Co Of Japan Ltd | Picture generation device |
US7447380B2 (en) | 2002-09-12 | 2008-11-04 | Inoe Technologies, Llc | Efficient method for creating a viewpoint from plurality of images |
US20040050104A1 (en) | 2002-09-18 | 2004-03-18 | Eastman Kodak Company | Forming information transfer lens array |
US20040207836A1 (en) | 2002-09-27 | 2004-10-21 | Rajeshwar Chhibber | High dynamic range optical inspection system and method |
US7084904B2 (en) | 2002-09-30 | 2006-08-01 | Microsoft Corporation | Foveated wide-angle imaging system and method for capturing and viewing wide-angle images in real time |
US7477781B1 (en) | 2002-10-10 | 2009-01-13 | Dalsa Corporation | Method and apparatus for adaptive pixel correction of multi-color matrix |
JP4171786B2 (en) | 2002-10-25 | 2008-10-29 | コニカミノルタホールディングス株式会社 | Image input device |
US7742088B2 (en) | 2002-11-19 | 2010-06-22 | Fujifilm Corporation | Image sensor and digital camera |
CA2506608C (en) | 2002-11-21 | 2013-01-22 | Vision Iii Imaging, Inc. | Critical alignment of parallax images for autostereoscopic display |
US20040105021A1 (en) | 2002-12-02 | 2004-06-03 | Bolymedia Holdings Co., Ltd. | Color filter patterns for image sensors |
US20040114807A1 (en) | 2002-12-13 | 2004-06-17 | Dan Lelescu | Statistical representation and coding of light field data |
US6878918B2 (en) | 2003-01-09 | 2005-04-12 | Dialdg Semiconductor Gmbh | APS pixel with reset noise suppression and programmable binning capability |
US7340099B2 (en) | 2003-01-17 | 2008-03-04 | University Of New Brunswick | System and method for image fusion |
DE10301941B4 (en) | 2003-01-20 | 2005-11-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Camera and method for optical recording of a screen |
US7379592B2 (en) | 2003-01-21 | 2008-05-27 | United States Of America As Represented By The Secretary Of The Navy | System and method for significant dust detection and enhancement of dust images over land and ocean |
JP4214409B2 (en) | 2003-01-31 | 2009-01-28 | 国立大学法人東京工業大学 | High resolution color image generation method, high resolution color image generation apparatus, and high resolution color image generation program |
US7005637B2 (en) | 2003-01-31 | 2006-02-28 | Intevac, Inc. | Backside thinning of image array devices |
US7308157B2 (en) | 2003-02-03 | 2007-12-11 | Photon Dynamics, Inc. | Method and apparatus for optical inspection of a display |
US7595817B1 (en) | 2003-02-12 | 2009-09-29 | The Research Foundation Of State University Of New York | Linear system based, qualitative independent motion detection from compressed MPEG surveillance video |
US20040165090A1 (en) | 2003-02-13 | 2004-08-26 | Alex Ning | Auto-focus (AF) lens and process |
JP2004266369A (en) | 2003-02-21 | 2004-09-24 | Sony Corp | Solid-state image pickup unit and its driving method |
US7106914B2 (en) | 2003-02-27 | 2006-09-12 | Microsoft Corporation | Bayesian image super resolution |
US7148861B2 (en) | 2003-03-01 | 2006-12-12 | The Boeing Company | Systems and methods for providing enhanced vision imaging with decreased latency |
US8218052B2 (en) | 2003-03-07 | 2012-07-10 | Iconix Video, Inc. | High frame rate high definition imaging system and method |
US7218320B2 (en) | 2003-03-13 | 2007-05-15 | Sony Corporation | System and method for capturing facial and body motion |
US6801719B1 (en) | 2003-03-14 | 2004-10-05 | Eastman Kodak Company | Camera using beam splitter with micro-lens image amplification |
US7206449B2 (en) | 2003-03-19 | 2007-04-17 | Mitsubishi Electric Research Laboratories, Inc. | Detecting silhouette edges in images |
US7425984B2 (en) | 2003-04-04 | 2008-09-16 | Stmicroelectronics, Inc. | Compound camera and methods for implementing auto-focus, depth-of-field and high-resolution functions |
US7373005B2 (en) | 2003-04-10 | 2008-05-13 | Micron Technology, Inc. | Compression system for integrated sensor devices |
US7097311B2 (en) | 2003-04-19 | 2006-08-29 | University Of Kentucky Research Foundation | Super-resolution overlay in multi-projector displays |
US6958862B1 (en) | 2003-04-21 | 2005-10-25 | Foveon, Inc. | Use of a lenslet array with a vertically stacked pixel array |
US7428330B2 (en) | 2003-05-02 | 2008-09-23 | Microsoft Corporation | Cyclopean virtual imaging via generalized probabilistic smoothing |
SE525665C2 (en) | 2003-05-08 | 2005-03-29 | Forskarpatent I Syd Ab | Matrix of pixels and electronic imaging device comprising said matrix of pixels |
KR20060115961A (en) | 2003-05-13 | 2006-11-13 | 익시이드 이미징 리미티드 | Optical method and system for enhancing image resolution |
JP2004348674A (en) | 2003-05-26 | 2004-12-09 | Noritsu Koki Co Ltd | Region detection method and its device |
US20040240052A1 (en) | 2003-06-02 | 2004-12-02 | Pentax Corporation | Multiple-focal imaging device, and a mobile device having the multiple-focal-length imaging device |
JP2004363478A (en) | 2003-06-06 | 2004-12-24 | Sanyo Electric Co Ltd | Manufacturing method of semiconductor device |
KR100539234B1 (en) | 2003-06-11 | 2005-12-27 | 삼성전자주식회사 | A CMOS type image sensor module having transparent polymeric encapsulation material |
US7362918B2 (en) | 2003-06-24 | 2008-04-22 | Microsoft Corporation | System and method for de-noising multiple copies of a signal |
US6818934B1 (en) | 2003-06-24 | 2004-11-16 | Omnivision International Holding Ltd | Image sensor having micro-lens array separated with trench structures and method of making |
US7388609B2 (en) | 2003-07-07 | 2008-06-17 | Zoran Corporation | Dynamic identification and correction of defective pixels |
US7090135B2 (en) | 2003-07-07 | 2006-08-15 | Symbol Technologies, Inc. | Imaging arrangement and barcode imager for imaging an optical code or target at a plurality of focal planes |
US20050007461A1 (en) | 2003-07-11 | 2005-01-13 | Novatek Microelectronic Co. | Correction system and method of analog front end |
JP3731589B2 (en) | 2003-07-18 | 2006-01-05 | ソニー株式会社 | Imaging device and synchronization signal generator |
US7233737B2 (en) | 2003-08-12 | 2007-06-19 | Micron Technology, Inc. | Fixed-focus camera module and associated method of assembly |
US7643703B2 (en) | 2003-09-03 | 2010-01-05 | Battelle Energy Alliance, Llc | Image change detection systems, methods, and articles of manufacture |
US7161606B2 (en) | 2003-09-08 | 2007-01-09 | Honda Motor Co., Ltd. | Systems and methods for directly generating a view using a layered approach |
JP4020850B2 (en) | 2003-10-06 | 2007-12-12 | 株式会社東芝 | Magnetic recording medium manufacturing method, manufacturing apparatus, imprint stamper and manufacturing method thereof |
US7924327B2 (en) | 2003-10-22 | 2011-04-12 | Panasonic Corporation | Imaging apparatus and method for producing the same, portable equipment, and imaging sensor and method for producing the same |
US7840067B2 (en) | 2003-10-24 | 2010-11-23 | Arcsoft, Inc. | Color matching and color correction for images forming a panoramic image |
EP1686810A4 (en) | 2003-11-11 | 2009-06-03 | Olympus Corp | Multi-spectrum image pick up device |
JP4235539B2 (en) | 2003-12-01 | 2009-03-11 | 独立行政法人科学技術振興機構 | Image composition apparatus and image composition method |
US7328288B2 (en) | 2003-12-11 | 2008-02-05 | Canon Kabushiki Kaisha | Relay apparatus for relaying communication from CPU to peripheral device |
US20050128509A1 (en) | 2003-12-11 | 2005-06-16 | Timo Tokkonen | Image creating method and imaging device |
JP3859158B2 (en) | 2003-12-16 | 2006-12-20 | セイコーエプソン株式会社 | Microlens concave substrate, microlens substrate, transmissive screen, and rear projector |
US7123298B2 (en) | 2003-12-18 | 2006-10-17 | Avago Technologies Sensor Ip Pte. Ltd. | Color image sensor with imaging elements imaging on respective regions of sensor elements |
US7511749B2 (en) | 2003-12-18 | 2009-03-31 | Aptina Imaging Corporation | Color image sensor having imaging element array forming images on respective regions of sensor elements |
US7376250B2 (en) | 2004-01-05 | 2008-05-20 | Honda Motor Co., Ltd. | Apparatus, method and program for moving object detection |
US7496293B2 (en) | 2004-01-14 | 2009-02-24 | Elbit Systems Ltd. | Versatile camera for various visibility conditions |
US7773143B2 (en) | 2004-04-08 | 2010-08-10 | Tessera North America, Inc. | Thin color camera having sub-pixel resolution |
US8134637B2 (en) | 2004-01-28 | 2012-03-13 | Microsoft Corporation | Method and system to increase X-Y resolution in a depth (Z) camera using red, blue, green (RGB) sensing |
US7453688B2 (en) | 2004-01-29 | 2008-11-18 | Inventec Corporation | Multimedia device for portable computers |
US20050185711A1 (en) | 2004-02-20 | 2005-08-25 | Hanspeter Pfister | 3D television system and method |
SE527889C2 (en) | 2004-03-17 | 2006-07-04 | Thomas Jeff Adamo | Apparatus for imaging an object |
JP2006047944A (en) | 2004-03-24 | 2006-02-16 | Fuji Photo Film Co Ltd | Photographing lens |
WO2005096218A1 (en) | 2004-03-31 | 2005-10-13 | Canon Kabushiki Kaisha | Imaging system performance measurement |
US7633511B2 (en) | 2004-04-01 | 2009-12-15 | Microsoft Corporation | Pop-up light field |
JP4665422B2 (en) | 2004-04-02 | 2011-04-06 | ソニー株式会社 | Imaging device |
US8634014B2 (en) | 2004-04-05 | 2014-01-21 | Hewlett-Packard Development Company, L.P. | Imaging device analysis systems and imaging device analysis methods |
US7091531B2 (en) | 2004-04-07 | 2006-08-15 | Micron Technology, Inc. | High dynamic range pixel amplifier |
US8049806B2 (en) | 2004-09-27 | 2011-11-01 | Digitaloptics Corporation East | Thin camera and associated methods |
US7620265B1 (en) | 2004-04-12 | 2009-11-17 | Equinox Corporation | Color invariant image fusion of visible and thermal infrared video |
JP2005303694A (en) * | 2004-04-13 | 2005-10-27 | Konica Minolta Holdings Inc | Compound eye imaging device |
US7292735B2 (en) | 2004-04-16 | 2007-11-06 | Microsoft Corporation | Virtual image artifact detection |
US7773404B2 (en) | 2005-01-07 | 2010-08-10 | Invisage Technologies, Inc. | Quantum dot optical devices with enhanced gain and sensitivity and methods of making same |
US8218625B2 (en) | 2004-04-23 | 2012-07-10 | Dolby Laboratories Licensing Corporation | Encoding, decoding and representing high dynamic range images |
US20060034531A1 (en) | 2004-05-10 | 2006-02-16 | Seiko Epson Corporation | Block noise level evaluation method for compressed images and control method of imaging device utilizing the evaluation method |
CN1953708B (en) | 2004-05-14 | 2010-06-16 | 皇家飞利浦电子股份有限公司 | System and method for diagnosing breast cancer |
US7355793B2 (en) | 2004-05-19 | 2008-04-08 | The Regents Of The University Of California | Optical system applicable to improving the dynamic range of Shack-Hartmann sensors |
US20050265633A1 (en) | 2004-05-25 | 2005-12-01 | Sarnoff Corporation | Low latency pyramid processor for image processing systems |
JP2005354124A (en) | 2004-06-08 | 2005-12-22 | Seiko Epson Corp | Production of high pixel density image from a plurality of low pixel density images |
US7330593B2 (en) | 2004-06-25 | 2008-02-12 | Stmicroelectronics, Inc. | Segment based image matching method and system |
JP4479373B2 (en) | 2004-06-28 | 2010-06-09 | ソニー株式会社 | Image sensor |
JP4408755B2 (en) | 2004-06-28 | 2010-02-03 | Necエレクトロニクス株式会社 | Deinterleaving device, mobile communication terminal, and deinterleaving method |
US7447382B2 (en) | 2004-06-30 | 2008-11-04 | Intel Corporation | Computing a higher resolution image from multiple lower resolution images using model-based, robust Bayesian estimation |
JP2006033493A (en) | 2004-07-16 | 2006-02-02 | Matsushita Electric Ind Co Ltd | Imaging apparatus |
US7189954B2 (en) | 2004-07-19 | 2007-03-13 | Micron Technology, Inc. | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
JP2006033570A (en) | 2004-07-20 | 2006-02-02 | Olympus Corp | Image generating device |
US8027531B2 (en) | 2004-07-21 | 2011-09-27 | The Board Of Trustees Of The Leland Stanford Junior University | Apparatus and method for capturing a scene using staggered triggering of dense camera arrays |
GB0416496D0 (en) | 2004-07-23 | 2004-08-25 | Council Of The Central Lab Of | Imaging device |
US20060023197A1 (en) | 2004-07-27 | 2006-02-02 | Joel Andrew H | Method and system for automated production of autostereoscopic and animated prints and transparencies from digital and non-digital media |
US7068432B2 (en) | 2004-07-27 | 2006-06-27 | Micron Technology, Inc. | Controlling lens shape in a microlens array |
DE102004036469A1 (en) | 2004-07-28 | 2006-02-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Camera module, array based thereon and method for its production |
US20060028476A1 (en) | 2004-08-03 | 2006-02-09 | Irwin Sobel | Method and system for providing extensive coverage of an object using virtual cameras |
JP2006050263A (en) | 2004-08-04 | 2006-02-16 | Olympus Corp | Image generation method and device |
US7430339B2 (en) | 2004-08-09 | 2008-09-30 | Microsoft Corporation | Border matting by dynamic programming |
US7609302B2 (en) | 2004-08-11 | 2009-10-27 | Micron Technology, Inc. | Correction of non-uniform sensitivity in an image array |
US7645635B2 (en) | 2004-08-16 | 2010-01-12 | Micron Technology, Inc. | Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages |
US7061693B2 (en) | 2004-08-16 | 2006-06-13 | Xceed Imaging Ltd. | Optical method and system for extended depth of focus |
US20070247517A1 (en) | 2004-08-23 | 2007-10-25 | Sarnoff Corporation | Method and apparatus for producing a fused image |
US7564019B2 (en) | 2005-08-25 | 2009-07-21 | Richard Ian Olsen | Large dynamic range cameras |
US7795577B2 (en) | 2004-08-25 | 2010-09-14 | Richard Ian Olsen | Lens frame and optical focus assembly for imager module |
WO2006026354A2 (en) | 2004-08-25 | 2006-03-09 | Newport Imaging Corporation | Apparatus for multiple camera devices and method of operating same |
US8124929B2 (en) | 2004-08-25 | 2012-02-28 | Protarius Filo Ag, L.L.C. | Imager module optical focus and assembly method |
US7916180B2 (en) | 2004-08-25 | 2011-03-29 | Protarius Filo Ag, L.L.C. | Simultaneous multiple field of view digital cameras |
JP4057597B2 (en) | 2004-08-26 | 2008-03-05 | 独立行政法人科学技術振興機構 | Optical element |
CN100489599C (en) | 2004-08-26 | 2009-05-20 | 财团法人秋田企业活性化中心 | Liquid crystal lens |
US20060046204A1 (en) | 2004-08-31 | 2006-03-02 | Sharp Laboratories Of America, Inc. | Directly patternable microlens |
US20060055811A1 (en) | 2004-09-14 | 2006-03-16 | Frtiz Bernard S | Imaging system having modules with adaptive optical elements |
US7145124B2 (en) | 2004-09-15 | 2006-12-05 | Raytheon Company | Multispectral imaging chip using photonic crystals |
JP3977368B2 (en) | 2004-09-30 | 2007-09-19 | クラリオン株式会社 | Parking assistance system |
DE102004049676A1 (en) | 2004-10-12 | 2006-04-20 | Infineon Technologies Ag | Method for computer-aided motion estimation in a plurality of temporally successive digital images, arrangement for computer-aided motion estimation, computer program element and computer-readable storage medium |
JP2006119368A (en) | 2004-10-21 | 2006-05-11 | Konica Minolta Opto Inc | Wide-angle optical system, imaging lens device, monitor camera and digital equipment |
JP4534715B2 (en) | 2004-10-22 | 2010-09-01 | 株式会社ニコン | Imaging apparatus and image processing program |
DE102004052994C5 (en) | 2004-11-03 | 2010-08-26 | Vistec Electron Beam Gmbh | Multi-beam modulator for a particle beam and use of the multi-beam modulator for maskless substrate structuring |
US7598996B2 (en) | 2004-11-16 | 2009-10-06 | Aptina Imaging Corporation | System and method for focusing a digital camera |
US7538326B2 (en) | 2004-12-03 | 2009-05-26 | Fluke Corporation | Visible light and IR combined image camera with a laser pointer |
US7483065B2 (en) | 2004-12-15 | 2009-01-27 | Aptina Imaging Corporation | Multi-lens imaging systems and methods using optical filters having mosaic patterns |
US8854486B2 (en) | 2004-12-17 | 2014-10-07 | Mitsubishi Electric Research Laboratories, Inc. | Method and system for processing multiview videos for view synthesis using skip and direct modes |
EP1851527A2 (en) | 2005-01-07 | 2007-11-07 | GestureTek, Inc. | Creating 3d images of objects by illuminating with infrared patterns |
US7073908B1 (en) | 2005-01-11 | 2006-07-11 | Anthony Italo Provitola | Enhancement of depth perception |
US7671321B2 (en) | 2005-01-18 | 2010-03-02 | Rearden, Llc | Apparatus and method for capturing still images and video using coded lens imaging techniques |
US7767949B2 (en) | 2005-01-18 | 2010-08-03 | Rearden, Llc | Apparatus and method for capturing still images and video using coded aperture techniques |
US7602997B2 (en) | 2005-01-19 | 2009-10-13 | The United States Of America As Represented By The Secretary Of The Army | Method of super-resolving images |
US7408627B2 (en) | 2005-02-08 | 2008-08-05 | Canesta, Inc. | Methods and system to quantify depth data accuracy in three-dimensional sensors using single frame capture |
US7965314B1 (en) | 2005-02-09 | 2011-06-21 | Flir Systems, Inc. | Foveal camera systems and methods |
US7561191B2 (en) | 2005-02-18 | 2009-07-14 | Eastman Kodak Company | Camera phone using multiple lenses and image sensors to provide an extended zoom range |
CA2600926C (en) | 2005-03-11 | 2009-06-09 | Creaform Inc. | Auto-referenced system and apparatus for three-dimensional scanning |
JP2006258930A (en) | 2005-03-15 | 2006-09-28 | Nikon Corp | Method for manufacturing microlens and method for manufacturing die for microlens |
US7692147B2 (en) | 2005-03-21 | 2010-04-06 | Massachusetts Institute Of Technology | Real-time, continuous-wave terahertz imaging using a microbolometer focal-plane array |
JPWO2006100903A1 (en) | 2005-03-23 | 2008-08-28 | 松下電器産業株式会社 | In-vehicle imaging device |
JP4545190B2 (en) | 2005-03-24 | 2010-09-15 | パナソニック株式会社 | Imaging device |
US7297917B2 (en) | 2005-03-24 | 2007-11-20 | Micron Technology, Inc. | Readout technique for increasing or maintaining dynamic range in image sensors |
US7683950B2 (en) | 2005-04-26 | 2010-03-23 | Eastman Kodak Company | Method and apparatus for correcting a channel dependent color aberration in a digital image |
US7656428B2 (en) | 2005-05-05 | 2010-02-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Imaging device employing optical motion sensor as gyroscope |
US7876874B2 (en) | 2005-05-18 | 2011-01-25 | Hitachi Medical Corporation | Radiographing apparatus and image processing program |
US8411182B2 (en) | 2005-06-02 | 2013-04-02 | Xerox Corporation | System for controlling integration times of photosensors in an imaging device |
US7968888B2 (en) | 2005-06-08 | 2011-06-28 | Panasonic Corporation | Solid-state image sensor and manufacturing method thereof |
JP2006345233A (en) | 2005-06-09 | 2006-12-21 | Fujifilm Holdings Corp | Imaging device and digital camera |
KR100813961B1 (en) | 2005-06-14 | 2008-03-14 | 삼성전자주식회사 | Method and apparatus for transmitting and receiving of video, and transport stream structure thereof |
US7364306B2 (en) | 2005-06-20 | 2008-04-29 | Digital Display Innovations, Llc | Field sequential light source modulation for a digital display system |
JP4826152B2 (en) | 2005-06-23 | 2011-11-30 | 株式会社ニコン | Image composition method and imaging apparatus |
US20070102622A1 (en) | 2005-07-01 | 2007-05-10 | Olsen Richard I | Apparatus for multiple camera devices and method of operating same |
JP4577126B2 (en) | 2005-07-08 | 2010-11-10 | オムロン株式会社 | Projection pattern generation apparatus and generation method for stereo correspondence |
US20090268983A1 (en) | 2005-07-25 | 2009-10-29 | The Regents Of The University Of California | Digital imaging system and method using multiple digital image sensors to produce large high-resolution gapless mosaic images |
US8384763B2 (en) | 2005-07-26 | 2013-02-26 | Her Majesty the Queen in right of Canada as represented by the Minster of Industry, Through the Communications Research Centre Canada | Generating a depth map from a two-dimensional source image for stereoscopic and multiview imaging |
US7969488B2 (en) | 2005-08-03 | 2011-06-28 | Micron Technologies, Inc. | Correction of cluster defects in imagers |
US7929801B2 (en) | 2005-08-15 | 2011-04-19 | Sony Corporation | Depth information for auto focus using two pictures and two-dimensional Gaussian scale space theory |
US20070041391A1 (en) | 2005-08-18 | 2007-02-22 | Micron Technology, Inc. | Method and apparatus for controlling imager output data rate |
US20070040922A1 (en) | 2005-08-22 | 2007-02-22 | Micron Technology, Inc. | HDR/AB on multi-way shared pixels |
US20070258006A1 (en) | 2005-08-25 | 2007-11-08 | Olsen Richard I | Solid state camera optics frame and assembly |
US7964835B2 (en) | 2005-08-25 | 2011-06-21 | Protarius Filo Ag, L.L.C. | Digital cameras with direct luminance and chrominance detection |
US20070083114A1 (en) | 2005-08-26 | 2007-04-12 | The University Of Connecticut | Systems and methods for image resolution enhancement |
JP4804856B2 (en) | 2005-09-29 | 2011-11-02 | 富士フイルム株式会社 | Single focus lens |
WO2007036055A1 (en) | 2005-09-30 | 2007-04-05 | Simon Fraser University | Methods and apparatus for detecting defects in imaging arrays by image analysis |
WO2007044725A2 (en) | 2005-10-07 | 2007-04-19 | The Board Of Trustees Of The Leland Stanford Junior University | Microscopy arrangements and approaches |
JP4773179B2 (en) | 2005-10-14 | 2011-09-14 | 富士フイルム株式会社 | Imaging device |
US8300085B2 (en) | 2005-10-14 | 2012-10-30 | Microsoft Corporation | Occlusion handling in stereo imaging |
US7806604B2 (en) | 2005-10-20 | 2010-10-05 | Honeywell International Inc. | Face detection and tracking in a wide field of view |
KR100730406B1 (en) | 2005-11-16 | 2007-06-19 | 광운대학교 산학협력단 | Three-dimensional display apparatus using intermediate elemental images |
JP4389865B2 (en) | 2005-11-17 | 2009-12-24 | ソニー株式会社 | SIGNAL PROCESSING DEVICE FOR SOLID-STATE IMAGING ELEMENT, SIGNAL PROCESSING METHOD, AND IMAGING DEVICE |
EP1958458B1 (en) | 2005-11-30 | 2016-08-17 | Telecom Italia S.p.A. | Method for determining scattered disparity fields in stereo vision |
US7599547B2 (en) | 2005-11-30 | 2009-10-06 | Microsoft Corporation | Symmetric stereo model for handling occlusion |
JP4516516B2 (en) | 2005-12-07 | 2010-08-04 | 本田技研工業株式会社 | Person detection device, person detection method, and person detection program |
TWI296480B (en) | 2005-12-19 | 2008-05-01 | Quanta Comp Inc | Image camera of an electronic device |
JP4501855B2 (en) | 2005-12-22 | 2010-07-14 | ソニー株式会社 | Image signal processing apparatus, imaging apparatus, image signal processing method, and computer program |
JP2007180730A (en) | 2005-12-27 | 2007-07-12 | Eastman Kodak Co | Digital camera and data management method |
US7855786B2 (en) | 2006-01-09 | 2010-12-21 | Bae Systems Spectral Solutions Llc | Single camera multi-spectral imager |
US7675080B2 (en) | 2006-01-10 | 2010-03-09 | Aptina Imaging Corp. | Uniform color filter arrays in a moat |
JP4147273B2 (en) | 2006-01-20 | 2008-09-10 | 松下電器産業株式会社 | Compound eye camera module and manufacturing method thereof |
DE102006004802B4 (en) | 2006-01-23 | 2008-09-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Image acquisition system and method for producing at least one image capture system |
JP4834412B2 (en) | 2006-02-03 | 2011-12-14 | 富士フイルム株式会社 | Solid-state imaging device and electronic endoscope using the same |
US20070201859A1 (en) | 2006-02-24 | 2007-08-30 | Logitech Europe S.A. | Method and system for use of 3D sensors in an image capture device |
US7391572B2 (en) | 2006-03-01 | 2008-06-24 | International Business Machines Corporation | Hybrid optical/electronic structures fabricated by a common molding process |
US7924483B2 (en) | 2006-03-06 | 2011-04-12 | Smith Scott T | Fused multi-array color image sensor |
US7616254B2 (en) | 2006-03-16 | 2009-11-10 | Sony Corporation | Simple method for calculating camera defocus from an image scene |
US8360574B2 (en) | 2006-03-20 | 2013-01-29 | High Performance Optics, Inc. | High performance selective light wavelength filtering providing improved contrast sensitivity |
US7606484B1 (en) | 2006-03-23 | 2009-10-20 | Flir Systems, Inc. | Infrared and near-infrared camera hyperframing |
JP4615468B2 (en) | 2006-03-23 | 2011-01-19 | 富士フイルム株式会社 | Imaging device |
US7342212B2 (en) | 2006-03-31 | 2008-03-11 | Micron Technology, Inc. | Analog vertical sub-sampling in an active pixel sensor (APS) image sensor |
US7916934B2 (en) | 2006-04-04 | 2011-03-29 | Mitsubishi Electric Research Laboratories, Inc. | Method and system for acquiring, encoding, decoding and displaying 3D light fields |
US8044994B2 (en) | 2006-04-04 | 2011-10-25 | Mitsubishi Electric Research Laboratories, Inc. | Method and system for decoding and displaying 3D light fields |
CN101064780B (en) | 2006-04-30 | 2012-07-04 | 台湾新力国际股份有限公司 | Method and apparatus for improving image joint accuracy using lens distortion correction |
US20070263114A1 (en) | 2006-05-01 | 2007-11-15 | Microalign Technologies, Inc. | Ultra-thin digital imaging device of high resolution for mobile electronic devices and method of imaging |
US7580620B2 (en) | 2006-05-08 | 2009-08-25 | Mitsubishi Electric Research Laboratories, Inc. | Method for deblurring images using optimized temporal coding patterns |
US9736346B2 (en) | 2006-05-09 | 2017-08-15 | Stereo Display, Inc | Imaging system improving image resolution of the system with low resolution image sensor |
US7889264B2 (en) | 2006-05-12 | 2011-02-15 | Ricoh Co., Ltd. | End-to-end design of superresolution electro-optic imaging systems |
US7916362B2 (en) | 2006-05-22 | 2011-03-29 | Eastman Kodak Company | Image sensor with improved light sensitivity |
US8139142B2 (en) | 2006-06-01 | 2012-03-20 | Microsoft Corporation | Video manipulation of red, green, blue, distance (RGB-Z) data including segmentation, up-sampling, and background substitution techniques |
IES20070229A2 (en) | 2006-06-05 | 2007-10-03 | Fotonation Vision Ltd | Image acquisition method and apparatus |
US20070177004A1 (en) * | 2006-06-08 | 2007-08-02 | Timo Kolehmainen | Image creating method and imaging device |
JP4631811B2 (en) | 2006-06-12 | 2011-02-16 | 株式会社日立製作所 | Imaging device |
JP5106870B2 (en) | 2006-06-14 | 2012-12-26 | 株式会社東芝 | Solid-state image sensor |
FR2902530A1 (en) | 2006-06-19 | 2007-12-21 | St Microelectronics Rousset | Polymer lens fabricating method for e.g. complementary MOS imager, involves realizing opaque zones on convex lens by degrading molecular structure of polymer material, where zones form diaphragm and diffraction network that forms filter |
US7925117B2 (en) | 2006-06-27 | 2011-04-12 | Honeywell International Inc. | Fusion of sensor data and synthetic data to form an integrated image |
KR100793369B1 (en) | 2006-07-06 | 2008-01-11 | 삼성전자주식회사 | Image sensor for improving the resolution and method of sensing the image for improving it |
US20080024683A1 (en) | 2006-07-31 | 2008-01-31 | Niranjan Damera-Venkata | Overlapped multi-projector system with dithering |
US20080030592A1 (en) | 2006-08-01 | 2008-02-07 | Eastman Kodak Company | Producing digital image with different resolution portions |
JP2008039852A (en) | 2006-08-01 | 2008-02-21 | Agc Techno Glass Co Ltd | Glass optical element and its manufacturing method |
US8406562B2 (en) | 2006-08-11 | 2013-03-26 | Geo Semiconductor Inc. | System and method for automated calibration and correction of display geometry and color |
ATE479980T1 (en) | 2006-08-24 | 2010-09-15 | Valeo Vision | METHOD FOR DETERMINING THE PASSAGE OF A VEHICLE THROUGH A Narrow Passage |
US8306063B2 (en) | 2006-08-29 | 2012-11-06 | EXFO Services Assurance, Inc. | Real-time transport protocol stream detection system and method |
US8687087B2 (en) | 2006-08-29 | 2014-04-01 | Csr Technology Inc. | Digital camera with selectively increased dynamic range by control of parameters during image acquisition |
KR100746360B1 (en) | 2006-08-31 | 2007-08-06 | 삼성전기주식회사 | Manufacturing method of stamper |
NO326372B1 (en) | 2006-09-21 | 2008-11-17 | Polight As | Polymer Lens |
US7918555B2 (en) | 2006-09-25 | 2011-04-05 | Ophthonix, Inc. | Methods and lenses for correction of chromatic aberration |
JP4403162B2 (en) | 2006-09-29 | 2010-01-20 | 株式会社東芝 | Stereoscopic image display device and method for producing stereoscopic image |
US20080080028A1 (en) | 2006-10-02 | 2008-04-03 | Micron Technology, Inc. | Imaging method, apparatus and system having extended depth of field |
US8031258B2 (en) | 2006-10-04 | 2011-10-04 | Omnivision Technologies, Inc. | Providing multiple video signals from single sensor |
US8883019B2 (en) | 2006-10-11 | 2014-11-11 | Polight As | Method for manufacturing adjustable lens |
KR101360455B1 (en) | 2006-10-11 | 2014-02-07 | 포라이트 에이에스 | Design of compact adjustable lens |
US8073196B2 (en) | 2006-10-16 | 2011-12-06 | University Of Southern California | Detection and tracking of moving objects from a moving platform in presence of strong parallax |
US7702229B2 (en) | 2006-10-18 | 2010-04-20 | Eastman Kodak Company | Lens array assisted focus detection |
JP4349456B2 (en) | 2006-10-23 | 2009-10-21 | ソニー株式会社 | Solid-state image sensor |
US7888159B2 (en) | 2006-10-26 | 2011-02-15 | Omnivision Technologies, Inc. | Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating |
JP4452951B2 (en) | 2006-11-02 | 2010-04-21 | 富士フイルム株式会社 | Distance image generation method and apparatus |
KR20080043106A (en) | 2006-11-13 | 2008-05-16 | 삼성전자주식회사 | Optical lens and manufacturing method thereof |
US8059162B2 (en) | 2006-11-15 | 2011-11-15 | Sony Corporation | Imaging apparatus and method, and method for designing imaging apparatus |
US20080118241A1 (en) | 2006-11-16 | 2008-05-22 | Tekolste Robert | Control of stray light in camera systems employing an optics stack and associated methods |
WO2008062407A2 (en) | 2006-11-21 | 2008-05-29 | Mantisvision Ltd. | 3d geometric modeling and 3d video content creation |
KR20080047002A (en) | 2006-11-24 | 2008-05-28 | 엘지이노텍 주식회사 | Lens assembly and method manufacturing the same for camera module |
US20100265385A1 (en) | 2009-04-18 | 2010-10-21 | Knight Timothy J | Light Field Camera Image, File and Configuration Data, and Methods of Using, Storing and Communicating Same |
JP4406937B2 (en) | 2006-12-01 | 2010-02-03 | 富士フイルム株式会社 | Imaging device |
US8559705B2 (en) | 2006-12-01 | 2013-10-15 | Lytro, Inc. | Interactive refocusing of electronic images |
JP5040493B2 (en) | 2006-12-04 | 2012-10-03 | ソニー株式会社 | Imaging apparatus and imaging method |
US8242426B2 (en) | 2006-12-12 | 2012-08-14 | Dolby Laboratories Licensing Corporation | Electronic camera having multiple sensors for capturing high dynamic range images and related methods |
US7646549B2 (en) | 2006-12-18 | 2010-01-12 | Xceed Imaging Ltd | Imaging system and method for providing extended depth of focus, range extraction and super resolved imaging |
US8213500B2 (en) | 2006-12-21 | 2012-07-03 | Sharp Laboratories Of America, Inc. | Methods and systems for processing film grain noise |
TWI324015B (en) | 2006-12-22 | 2010-04-21 | Ind Tech Res Inst | Autofocus searching method |
US8103111B2 (en) | 2006-12-26 | 2012-01-24 | Olympus Imaging Corp. | Coding method, electronic camera, recording medium storing coded program, and decoding method |
US20080158259A1 (en) | 2006-12-28 | 2008-07-03 | Texas Instruments Incorporated | Image warping and lateral color correction |
US7973823B2 (en) | 2006-12-29 | 2011-07-05 | Nokia Corporation | Method and system for image pre-processing |
US20080158698A1 (en) * | 2006-12-29 | 2008-07-03 | Chao-Chi Chang | Lens barrel array and lens array and the method of making the same |
US20080165257A1 (en) | 2007-01-05 | 2008-07-10 | Micron Technology, Inc. | Configurable pixel array system and method |
US8655052B2 (en) | 2007-01-26 | 2014-02-18 | Intellectual Discovery Co., Ltd. | Methodology for 3D scene reconstruction from 2D image sequences |
JP5024992B2 (en) | 2007-02-02 | 2012-09-12 | 株式会社ジャパンディスプレイセントラル | Display device |
US7792423B2 (en) | 2007-02-06 | 2010-09-07 | Mitsubishi Electric Research Laboratories, Inc. | 4D light field cameras |
CN100585453C (en) | 2007-02-09 | 2010-01-27 | 奥林巴斯映像株式会社 | Decoding method and decoding apparatus |
JP4386083B2 (en) | 2007-02-27 | 2009-12-16 | トヨタ自動車株式会社 | Parking assistance device |
JP4153013B1 (en) | 2007-03-06 | 2008-09-17 | シャープ株式会社 | Imaging lens, imaging unit, and portable information terminal including the same |
US7755679B2 (en) | 2007-03-07 | 2010-07-13 | Altasens, Inc. | Apparatus and method for reducing edge effect in an image sensor |
US7676146B2 (en) | 2007-03-09 | 2010-03-09 | Eastman Kodak Company | Camera using multiple lenses and image sensors to provide improved focusing capability |
US7683962B2 (en) | 2007-03-09 | 2010-03-23 | Eastman Kodak Company | Camera using multiple lenses and image sensors in a rangefinder configuration to provide a range map |
JP4915859B2 (en) | 2007-03-26 | 2012-04-11 | 船井電機株式会社 | Object distance deriving device |
JP2008242658A (en) | 2007-03-26 | 2008-10-09 | Funai Electric Co Ltd | Three-dimensional object imaging apparatus |
US7738017B2 (en) | 2007-03-27 | 2010-06-15 | Aptina Imaging Corporation | Method and apparatus for automatic linear shift parallax correction for multi-array image systems |
US8165418B2 (en) | 2007-03-30 | 2012-04-24 | Brother Kogyo Kabushiki Kaisha | Image processor |
TWI433052B (en) | 2007-04-02 | 2014-04-01 | Primesense Ltd | Depth mapping using projected patterns |
US8213711B2 (en) | 2007-04-03 | 2012-07-03 | Her Majesty The Queen In Right Of Canada As Represented By The Minister Of Industry, Through The Communications Research Centre Canada | Method and graphical user interface for modifying depth maps |
US8098941B2 (en) | 2007-04-03 | 2012-01-17 | Aptina Imaging Corporation | Method and apparatus for parallelization of image compression encoders |
JP2008258885A (en) | 2007-04-04 | 2008-10-23 | Texas Instr Japan Ltd | Imaging apparatus and driving method of imaging apparatus |
EP2667412A1 (en) | 2007-04-18 | 2013-11-27 | Invisage Technologies, INC. | Materials, systems and methods for optoelectronic devices |
US8467628B2 (en) | 2007-04-24 | 2013-06-18 | 21 Ct, Inc. | Method and system for fast dense stereoscopic ranging |
KR100869219B1 (en) | 2007-05-03 | 2008-11-18 | 동부일렉트로닉스 주식회사 | Image Sensor and Method for Manufacturing thereof |
US8462220B2 (en) | 2007-05-09 | 2013-06-11 | Aptina Imaging Corporation | Method and apparatus for improving low-light performance for small pixel image sensors |
US7812869B2 (en) | 2007-05-11 | 2010-10-12 | Aptina Imaging Corporation | Configurable pixel array system and method |
JP4341695B2 (en) | 2007-05-17 | 2009-10-07 | ソニー株式会社 | Image input processing device, imaging signal processing circuit, and imaging signal noise reduction method |
JP4337911B2 (en) | 2007-05-24 | 2009-09-30 | ソニー株式会社 | Imaging device, imaging circuit, and imaging method |
US20080298674A1 (en) | 2007-05-29 | 2008-12-04 | Image Masters Inc. | Stereoscopic Panoramic imaging system |
WO2008150817A1 (en) | 2007-05-31 | 2008-12-11 | Artificial Muscle, Inc. | Optical systems employing compliant electroactive materials |
US8290358B1 (en) | 2007-06-25 | 2012-10-16 | Adobe Systems Incorporated | Methods and apparatus for light-field imaging |
WO2009001255A1 (en) | 2007-06-26 | 2008-12-31 | Koninklijke Philips Electronics N.V. | Method and system for encoding a 3d video signal, enclosed 3d video signal, method and system for decoder for a 3d video signal |
US8125619B2 (en) | 2007-07-25 | 2012-02-28 | Eminent Electronic Technology Corp. | Integrated ambient light sensor and distance sensor |
JP5006727B2 (en) | 2007-07-26 | 2012-08-22 | 株式会社リコー | Image processing apparatus and digital camera |
WO2009020977A1 (en) | 2007-08-06 | 2009-02-12 | Adobe Systems Incorporated | Method and apparatus for radiance capture by multiplexing in the frequency domain |
EP2034338A1 (en) | 2007-08-11 | 2009-03-11 | ETH Zurich | Liquid Lens System |
EP2026563A1 (en) | 2007-08-14 | 2009-02-18 | Deutsche Thomson OHG | System and method for detecting defective pixels |
US7782364B2 (en) | 2007-08-21 | 2010-08-24 | Aptina Imaging Corporation | Multi-array sensor with integrated sub-array for parallax detection and photometer functionality |
US7973834B2 (en) | 2007-09-24 | 2011-07-05 | Jianwen Yang | Electro-optical foveated imaging and tracking system |
US20090086074A1 (en) | 2007-09-27 | 2009-04-02 | Omnivision Technologies, Inc. | Dual mode camera solution apparatus, system, and method |
US7940311B2 (en) | 2007-10-03 | 2011-05-10 | Nokia Corporation | Multi-exposure pattern for enhancing dynamic range of images |
JP5172267B2 (en) | 2007-10-09 | 2013-03-27 | 富士フイルム株式会社 | Imaging device |
US8049289B2 (en) | 2007-10-11 | 2011-11-01 | Dongbu Hitek Co., Ltd. | Image sensor and method for manufacturing the same |
US7956924B2 (en) | 2007-10-18 | 2011-06-07 | Adobe Systems Incorporated | Fast computational camera based on two arrays of lenses |
US7920193B2 (en) | 2007-10-23 | 2011-04-05 | Aptina Imaging Corporation | Methods, systems and apparatuses using barrier self-calibration for high dynamic range imagers |
US7777804B2 (en) | 2007-10-26 | 2010-08-17 | Omnivision Technologies, Inc. | High dynamic range sensor with reduced line memory for color interpolation |
WO2009061814A2 (en) | 2007-11-05 | 2009-05-14 | University Of Florida Research Foundation, Inc. | Lossless data compression and real-time decompression |
US7852461B2 (en) | 2007-11-15 | 2010-12-14 | Microsoft International Holdings B.V. | Dual mode depth imaging |
US20090128644A1 (en) | 2007-11-15 | 2009-05-21 | Camp Jr William O | System and method for generating a photograph |
US8351685B2 (en) | 2007-11-16 | 2013-01-08 | Gwangju Institute Of Science And Technology | Device and method for estimating depth map, and method for generating intermediate image and method for encoding multi-view video using the same |
US8126279B2 (en) | 2007-11-19 | 2012-02-28 | The University Of Arizona | Lifting-based view compensated compression and remote visualization of volume rendered images |
JP5010445B2 (en) | 2007-11-29 | 2012-08-29 | パナソニック株式会社 | Manufacturing method of mold for microlens array |
US8384803B2 (en) | 2007-12-13 | 2013-02-26 | Keigo Iizuka | Camera system and method for amalgamating images to create an omni-focused image |
TWI353778B (en) | 2007-12-21 | 2011-12-01 | Ind Tech Res Inst | Moving object detection apparatus and method |
US20110031381A1 (en) | 2007-12-28 | 2011-02-10 | Hiok-Nam Tay | Light guide array for an image sensor |
TWI362628B (en) | 2007-12-28 | 2012-04-21 | Ind Tech Res Inst | Methof for producing an image with depth by using 2d image |
JP4413261B2 (en) | 2008-01-10 | 2010-02-10 | シャープ株式会社 | Imaging apparatus and optical axis control method |
JP5198295B2 (en) | 2008-01-15 | 2013-05-15 | 富士フイルム株式会社 | Image sensor position adjustment method, camera module manufacturing method and apparatus, and camera module |
US8189065B2 (en) | 2008-01-23 | 2012-05-29 | Adobe Systems Incorporated | Methods and apparatus for full-resolution light-field capture and rendering |
US7962033B2 (en) | 2008-01-23 | 2011-06-14 | Adobe Systems Incorporated | Methods and apparatus for full-resolution light-field capture and rendering |
JP4956452B2 (en) | 2008-01-25 | 2012-06-20 | 富士重工業株式会社 | Vehicle environment recognition device |
GB0802290D0 (en) | 2008-02-08 | 2008-03-12 | Univ Kent Canterbury | Camera adapter based optical imaging apparatus |
US8319301B2 (en) | 2008-02-11 | 2012-11-27 | Omnivision Technologies, Inc. | Self-aligned filter for an image sensor |
JP2009206922A (en) | 2008-02-28 | 2009-09-10 | Funai Electric Co Ltd | Compound-eye imaging apparatus |
CN101520532A (en) | 2008-02-29 | 2009-09-02 | 鸿富锦精密工业(深圳)有限公司 | Composite lens |
KR101607224B1 (en) | 2008-03-03 | 2016-03-29 | 아비길론 페이턴트 홀딩 2 코포레이션 | Dynamic object classification |
US20110018973A1 (en) | 2008-03-26 | 2011-01-27 | Konica Minolta Holdings, Inc. | Three-dimensional imaging device and method for calibrating three-dimensional imaging device |
US8497905B2 (en) | 2008-04-11 | 2013-07-30 | nearmap australia pty ltd. | Systems and methods of capturing large area images in detail including cascaded cameras and/or calibration features |
US8259208B2 (en) | 2008-04-15 | 2012-09-04 | Sony Corporation | Method and apparatus for performing touch-based adjustments within imaging devices |
US7843554B2 (en) | 2008-04-25 | 2010-11-30 | Rockwell Collins, Inc. | High dynamic range sensor system and method |
US8155456B2 (en) | 2008-04-29 | 2012-04-10 | Adobe Systems Incorporated | Method and apparatus for block-based compression of light-field images |
US8280194B2 (en) | 2008-04-29 | 2012-10-02 | Sony Corporation | Reduced hardware implementation for a two-picture depth map algorithm |
US8724921B2 (en) | 2008-05-05 | 2014-05-13 | Aptina Imaging Corporation | Method of capturing high dynamic range images with objects in the scene |
WO2009136989A1 (en) | 2008-05-09 | 2009-11-12 | Ecole Polytechnique Federale De Lausanne | Image sensor having nonlinear response |
US8208543B2 (en) | 2008-05-19 | 2012-06-26 | Microsoft Corporation | Quantization and differential coding of alpha image data |
KR101733443B1 (en) | 2008-05-20 | 2017-05-10 | 펠리칸 이매징 코포레이션 | Capturing and processing of images using monolithic camera array with heterogeneous imagers |
US8866920B2 (en) | 2008-05-20 | 2014-10-21 | Pelican Imaging Corporation | Capturing and processing of images using monolithic camera array with heterogeneous imagers |
US8125559B2 (en) | 2008-05-25 | 2012-02-28 | Avistar Communications Corporation | Image formation for large photosensor array surfaces |
US8131097B2 (en) | 2008-05-28 | 2012-03-06 | Aptina Imaging Corporation | Method and apparatus for extended depth-of-field image restoration |
US8244058B1 (en) | 2008-05-30 | 2012-08-14 | Adobe Systems Incorporated | Method and apparatus for managing artifacts in frequency domain processing of light-field images |
JP2009300268A (en) | 2008-06-13 | 2009-12-24 | Nippon Hoso Kyokai <Nhk> | Three-dimensional information detection device |
CN102016654A (en) | 2008-06-25 | 2011-04-13 | 柯尼卡美能达精密光学株式会社 | Imaging optical system, and imaging lens manufacturing method |
US7710667B2 (en) | 2008-06-25 | 2010-05-04 | Aptina Imaging Corp. | Imaging module with symmetrical lens system and method of manufacture |
KR101000531B1 (en) | 2008-06-26 | 2010-12-14 | 에스디씨마이크로 주식회사 | CCTV Management System Supporting Extended Data Transmission Coverage with Wireless LAN |
US7916396B2 (en) | 2008-06-27 | 2011-03-29 | Micron Technology, Inc. | Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same |
US8326069B2 (en) | 2008-06-30 | 2012-12-04 | Intel Corporation | Computing higher resolution images from multiple lower resolution images |
US7773317B2 (en) | 2008-07-01 | 2010-08-10 | Aptina Imaging Corp. | Lens system with symmetrical optics |
US7920339B2 (en) | 2008-07-02 | 2011-04-05 | Aptina Imaging Corporation | Method and apparatus providing singlet wafer lens system with field flattener |
US8456517B2 (en) | 2008-07-09 | 2013-06-04 | Primesense Ltd. | Integrated processor for 3D mapping |
KR101445185B1 (en) | 2008-07-10 | 2014-09-30 | 삼성전자주식회사 | Flexible Image Photographing Apparatus with a plurality of image forming units and Method for manufacturing the same |
CA2731680C (en) | 2008-08-06 | 2016-12-13 | Creaform Inc. | System for adaptive three-dimensional scanning of surface characteristics |
EP2329653B1 (en) | 2008-08-20 | 2014-10-29 | Thomson Licensing | Refined depth map |
CN101656259A (en) | 2008-08-20 | 2010-02-24 | 鸿富锦精密工业(深圳)有限公司 | Image sensor packaging structure, packaging method and camera module |
CN102138102A (en) | 2008-09-01 | 2011-07-27 | 兰斯维克托公司 | Wafer-level fabrication of liquid crystal optoelectronic devices |
JP5105482B2 (en) | 2008-09-01 | 2012-12-26 | 船井電機株式会社 | Optical condition design method and compound eye imaging apparatus |
US8098297B2 (en) | 2008-09-03 | 2012-01-17 | Sony Corporation | Pre- and post-shutter signal image capture and sort for digital camera |
KR20100028344A (en) | 2008-09-04 | 2010-03-12 | 삼성전자주식회사 | Method and apparatus for editing image of portable terminal |
JP5238429B2 (en) | 2008-09-25 | 2013-07-17 | 株式会社東芝 | Stereoscopic image capturing apparatus and stereoscopic image capturing system |
US8553093B2 (en) | 2008-09-30 | 2013-10-08 | Sony Corporation | Method and apparatus for super-resolution imaging using digital imaging devices |
US9064476B2 (en) | 2008-10-04 | 2015-06-23 | Microsoft Technology Licensing, Llc | Image super-resolution using gradient profile prior |
US8310525B2 (en) | 2008-10-07 | 2012-11-13 | Seiko Epson Corporation | One-touch projector alignment for 3D stereo display |
KR101498532B1 (en) | 2008-10-15 | 2015-03-04 | 스피넬라 아이피 홀딩스, 인코포레이티드 | Digital processing method and system for determination of optical flow |
JP2010096723A (en) | 2008-10-20 | 2010-04-30 | Funai Electric Co Ltd | Device for deriving distance of object |
US8436909B2 (en) | 2008-10-21 | 2013-05-07 | Stmicroelectronics S.R.L. | Compound camera sensor and related method of processing digital images |
WO2010050728A2 (en) | 2008-10-27 | 2010-05-06 | 엘지전자 주식회사 | Virtual view image synthesis method and apparatus |
US8063975B2 (en) | 2008-10-29 | 2011-11-22 | Jabil Circuit, Inc. | Positioning wafer lenses on electronic imagers |
KR101502597B1 (en) | 2008-11-13 | 2015-03-13 | 삼성전자주식회사 | Wide depth of field 3d display apparatus and method |
US8644547B2 (en) | 2008-11-14 | 2014-02-04 | The Scripps Research Institute | Image analysis platform for identifying artifacts in samples and laboratory consumables |
AU2008246243B2 (en) | 2008-11-19 | 2011-12-22 | Canon Kabushiki Kaisha | DVC as generic file format for plenoptic camera |
WO2010065344A1 (en) | 2008-11-25 | 2010-06-10 | Refocus Imaging, Inc. | System of and method for video refocusing |
US8289440B2 (en) | 2008-12-08 | 2012-10-16 | Lytro, Inc. | Light field data acquisition devices, and methods of using and manufacturing same |
US8013904B2 (en) | 2008-12-09 | 2011-09-06 | Seiko Epson Corporation | View projection matrix based high performance low latency display pipeline |
KR101200490B1 (en) | 2008-12-10 | 2012-11-12 | 한국전자통신연구원 | Apparatus and Method for Matching Image |
US8149323B2 (en) | 2008-12-18 | 2012-04-03 | Qualcomm Incorporated | System and method to autofocus assisted by autoexposure control |
JP4631966B2 (en) | 2008-12-22 | 2011-02-16 | ソニー株式会社 | Image processing apparatus, image processing method, and program |
US8405742B2 (en) | 2008-12-30 | 2013-03-26 | Massachusetts Institute Of Technology | Processing images having different focus |
WO2010081010A2 (en) | 2009-01-09 | 2010-07-15 | New York University | Methods, computer-accessible medium and systems for facilitating dark flash photography |
US20100177411A1 (en) | 2009-01-09 | 2010-07-15 | Shashikant Hegde | Wafer level lens replication on micro-electrical-mechanical systems |
US8315476B1 (en) | 2009-01-20 | 2012-11-20 | Adobe Systems Incorporated | Super-resolution with the focused plenoptic camera |
US8189089B1 (en) | 2009-01-20 | 2012-05-29 | Adobe Systems Incorporated | Methods and apparatus for reducing plenoptic camera artifacts |
US8300108B2 (en) | 2009-02-02 | 2012-10-30 | L-3 Communications Cincinnati Electronics Corporation | Multi-channel imaging devices comprising unit cells |
US20100194860A1 (en) | 2009-02-03 | 2010-08-05 | Bit Cauldron Corporation | Method of stereoscopic 3d image capture using a mobile device, cradle or dongle |
US8761491B2 (en) | 2009-02-06 | 2014-06-24 | Himax Technologies Limited | Stereo-matching processor using belief propagation |
US8290301B2 (en) | 2009-02-06 | 2012-10-16 | Raytheon Company | Optimized imaging system for collection of high resolution imagery |
KR101776955B1 (en) | 2009-02-10 | 2017-09-08 | 소니 주식회사 | Solid-state imaging device, method of manufacturing the same, and electronic apparatus |
WO2010095440A1 (en) | 2009-02-20 | 2010-08-26 | パナソニック株式会社 | Recording medium, reproduction device, and integrated circuit |
US8520970B2 (en) | 2010-04-23 | 2013-08-27 | Flir Systems Ab | Infrared resolution and contrast enhancement with fusion |
US8207759B2 (en) | 2009-03-12 | 2012-06-26 | Fairchild Semiconductor Corporation | MIPI analog switch for automatic selection of multiple inputs based on clock voltages |
WO2010108119A2 (en) | 2009-03-19 | 2010-09-23 | Flextronics Ap, Llc | Dual sensor camera |
US8106949B2 (en) | 2009-03-26 | 2012-01-31 | Seiko Epson Corporation | Small memory footprint light transport matrix capture |
US8450821B2 (en) | 2009-03-26 | 2013-05-28 | Micron Technology, Inc. | Method and apparatus providing combined spacer and optical lens element |
JP4529010B1 (en) | 2009-03-30 | 2010-08-25 | シャープ株式会社 | Imaging device |
JP5222205B2 (en) | 2009-04-03 | 2013-06-26 | Kddi株式会社 | Image processing apparatus, method, and program |
WO2010116366A1 (en) | 2009-04-07 | 2010-10-14 | Nextvision Stabilized Systems Ltd | Video motion compensation and stabilization gimbaled imaging system |
US20100259610A1 (en) | 2009-04-08 | 2010-10-14 | Celsia, Llc | Two-Dimensional Display Synced with Real World Object Movement |
US8294099B2 (en) | 2009-04-10 | 2012-10-23 | Bae Systems Information And Electronic Systems Integration Inc. | On-wafer butted microbolometer imaging array |
JP5463718B2 (en) | 2009-04-16 | 2014-04-09 | ソニー株式会社 | Imaging device |
US8717417B2 (en) | 2009-04-16 | 2014-05-06 | Primesense Ltd. | Three-dimensional mapping and imaging |
US20120249550A1 (en) | 2009-04-18 | 2012-10-04 | Lytro, Inc. | Selective Transmission of Image Data Based on Device Attributes |
US8908058B2 (en) | 2009-04-18 | 2014-12-09 | Lytro, Inc. | Storage and transmission of pictures including multiple frames |
EP2244484B1 (en) | 2009-04-22 | 2012-03-28 | Raytrix GmbH | Digital imaging method for synthesizing an image using data recorded with a plenoptic camera |
CN101527046B (en) | 2009-04-28 | 2012-09-05 | 青岛海信数字多媒体技术国家重点实验室有限公司 | Motion detection method, device and system |
US8271544B2 (en) | 2009-05-01 | 2012-09-18 | Creative Technology Ltd | Data file having more than one mode of operation |
DE102009003110A1 (en) | 2009-05-14 | 2010-11-18 | Robert Bosch Gmbh | Image processing method for determining depth information from at least two input images recorded by means of a stereo camera system |
US8203633B2 (en) | 2009-05-27 | 2012-06-19 | Omnivision Technologies, Inc. | Four-channel color filter array pattern |
KR20100130423A (en) | 2009-06-03 | 2010-12-13 | 삼성전자주식회사 | Wafer-level lens module and image module including the same |
US8766808B2 (en) | 2010-03-09 | 2014-07-01 | Flir Systems, Inc. | Imager with multiple sensor arrays |
CN101931742B (en) | 2009-06-18 | 2013-04-24 | 鸿富锦精密工业(深圳)有限公司 | Image sensing module and image capture module |
US20100321640A1 (en) | 2009-06-22 | 2010-12-23 | Industrial Technology Research Institute | Projection display chip |
JP5254893B2 (en) | 2009-06-26 | 2013-08-07 | キヤノン株式会社 | Image conversion method and apparatus, and pattern identification method and apparatus |
WO2011008443A2 (en) | 2009-06-29 | 2011-01-20 | Lensvector Inc. | Wafer level camera module with active optical element |
JP2011030184A (en) | 2009-07-01 | 2011-02-10 | Sony Corp | Image processing apparatus, and image processing method |
US8212197B2 (en) | 2009-07-02 | 2012-07-03 | Xerox Corporation | Image sensor with integration time compensation |
JP2011017764A (en) | 2009-07-07 | 2011-01-27 | Konica Minolta Opto Inc | Imaging lens, imaging apparatus and portable terminal |
US8345144B1 (en) | 2009-07-15 | 2013-01-01 | Adobe Systems Incorporated | Methods and apparatus for rich image capture with focused plenoptic cameras |
US20110019243A1 (en) | 2009-07-21 | 2011-01-27 | Constant Jr Henry J | Stereoscopic form reader |
CN101964866B (en) | 2009-07-24 | 2013-03-20 | 鸿富锦精密工业(深圳)有限公司 | Computation and image pickup type digital camera |
US20110025830A1 (en) | 2009-07-31 | 2011-02-03 | 3Dmedia Corporation | Methods, systems, and computer-readable storage media for generating stereoscopic content via depth map creation |
US8577183B2 (en) | 2009-08-05 | 2013-11-05 | Raytheon Company | Resolution on demand |
US8773652B2 (en) | 2009-08-11 | 2014-07-08 | Ether Precision, Inc. | Method and device for aligning a lens with an optical system |
JP2011044801A (en) | 2009-08-19 | 2011-03-03 | Toshiba Corp | Image processor |
US8154632B2 (en) | 2009-08-24 | 2012-04-10 | Lifesize Communications, Inc. | Detection of defective pixels in an image sensor |
KR101680300B1 (en) | 2009-08-31 | 2016-11-28 | 삼성전자주식회사 | Liquid lens and method for manufacturing the same |
US9274699B2 (en) | 2009-09-03 | 2016-03-01 | Obscura Digital | User interface for a large scale multi-user, multi-touch system |
US8411146B2 (en) | 2009-09-04 | 2013-04-02 | Lockheed Martin Corporation | Single camera color and infrared polarimetric imaging |
FR2950153B1 (en) | 2009-09-15 | 2011-12-23 | Commissariat Energie Atomique | OPTICAL DEVICE WITH DEFORMABLE MEMBRANE WITH PIEZOELECTRIC ACTUATION |
US20140076336A1 (en) | 2009-09-17 | 2014-03-20 | Ascentia Health, Inc. | Ear insert for relief of tmj discomfort and headaches |
WO2011039679A1 (en) | 2009-10-02 | 2011-04-07 | Koninklijke Philips Electronics N.V. | Selecting viewpoints for generating additional views in 3d video |
DE102009049387B4 (en) | 2009-10-14 | 2016-05-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Apparatus, image processing apparatus and method for optical imaging |
KR101807886B1 (en) | 2009-10-14 | 2017-12-11 | 돌비 인터네셔널 에이비 | Method and devices for depth map processing |
US8199165B2 (en) | 2009-10-14 | 2012-06-12 | Hewlett-Packard Development Company, L.P. | Methods and systems for object segmentation in digital images |
US8502909B2 (en) | 2009-10-19 | 2013-08-06 | Pixar | Super light-field lens |
US20110207074A1 (en) | 2009-10-26 | 2011-08-25 | Olaf Andrew Hall-Holt | Dental imaging system and method |
WO2011053711A1 (en) | 2009-10-30 | 2011-05-05 | Invisage Technologies, Inc. | Systems and methods for color binning |
WO2011055655A1 (en) | 2009-11-05 | 2011-05-12 | コニカミノルタオプト株式会社 | Image pickup device, optical unit, wafer lens laminated body, and method for manufacturing wafer lens laminated body |
WO2011058876A1 (en) | 2009-11-13 | 2011-05-19 | 富士フイルム株式会社 | Distance measuring device, distance measuring method, distance measuring program, distance measuring system, and image capturing device |
JP5399215B2 (en) | 2009-11-18 | 2014-01-29 | シャープ株式会社 | Multi-lens camera device and electronic information device |
US8514491B2 (en) | 2009-11-20 | 2013-08-20 | Pelican Imaging Corporation | Capturing and processing of images using monolithic camera array with heterogeneous imagers |
US8497934B2 (en) | 2009-11-25 | 2013-07-30 | Massachusetts Institute Of Technology | Actively addressable aperture light field camera |
KR101608970B1 (en) | 2009-11-27 | 2016-04-05 | 삼성전자주식회사 | Apparatus and method for processing image using light field data |
US8400555B1 (en) | 2009-12-01 | 2013-03-19 | Adobe Systems Incorporated | Focused plenoptic camera employing microlenses with different focal lengths |
US8730338B2 (en) | 2009-12-01 | 2014-05-20 | Nokia Corporation | Set of camera modules hinged on a body and functionally connected to a single actuator |
JP5446797B2 (en) | 2009-12-04 | 2014-03-19 | 株式会社リコー | Imaging device |
US8446492B2 (en) | 2009-12-10 | 2013-05-21 | Honda Motor Co., Ltd. | Image capturing device, method of searching for occlusion region, and program |
JP5387377B2 (en) | 2009-12-14 | 2014-01-15 | ソニー株式会社 | Image processing apparatus, image processing method, and program |
WO2011081646A1 (en) | 2009-12-15 | 2011-07-07 | Thomson Licensing | Stereo-image quality and disparity/depth indications |
US20110153248A1 (en) | 2009-12-23 | 2011-06-23 | Yeming Gu | Ophthalmic quality metric system |
EP2518995B1 (en) | 2009-12-24 | 2018-08-22 | Sharp Kabushiki Kaisha | Multocular image pickup apparatus and multocular image pickup method |
JP4983905B2 (en) | 2009-12-25 | 2012-07-25 | カシオ計算機株式会社 | Imaging apparatus, 3D modeling data generation method, and program |
KR101643607B1 (en) | 2009-12-30 | 2016-08-10 | 삼성전자주식회사 | Method and apparatus for generating of image data |
CN102117576A (en) | 2009-12-31 | 2011-07-06 | 鸿富锦精密工业(深圳)有限公司 | Digital photo frame |
CN102131044B (en) | 2010-01-20 | 2014-03-26 | 鸿富锦精密工业(深圳)有限公司 | Camera module |
WO2011097508A2 (en) | 2010-02-04 | 2011-08-11 | University Of Southern California | Combined spectral and polarimetry imaging and diagnostics |
US8593512B2 (en) | 2010-02-05 | 2013-11-26 | Creative Technology Ltd | Device and method for scanning an object on a working surface |
US8648918B2 (en) | 2010-02-18 | 2014-02-11 | Sony Corporation | Method and system for obtaining a point spread function using motion information |
JP5728673B2 (en) | 2010-02-19 | 2015-06-03 | デュアル・アパーチャー・インターナショナル・カンパニー・リミテッド | Multi-aperture image data processing |
KR20110097690A (en) | 2010-02-23 | 2011-08-31 | 삼성전자주식회사 | Method and apparatus for providing service of multiview still image, method and apparatus for receiving service of multiview still image |
KR101802238B1 (en) | 2010-02-23 | 2017-11-29 | 삼성전자주식회사 | Apparatus and method for generating a three-dimension image data in portable terminal |
EP2539759A1 (en) | 2010-02-28 | 2013-01-02 | Osterhout Group, Inc. | Local advertising content on an interactive head-mounted eyepiece |
US8817015B2 (en) | 2010-03-03 | 2014-08-26 | Adobe Systems Incorporated | Methods, apparatus, and computer-readable storage media for depth-based rendering of focused plenoptic camera data |
US20110222757A1 (en) | 2010-03-10 | 2011-09-15 | Gbo 3D Technology Pte. Ltd. | Systems and methods for 2D image and spatial data capture for 3D stereo imaging |
US20110221950A1 (en) | 2010-03-12 | 2011-09-15 | Doeke Jolt Oostra | Camera device, wafer scale package |
KR20130004505A (en) | 2010-03-17 | 2013-01-10 | 펠리칸 이매징 코포레이션 | Fabrication process for mastering imaging lens arrays |
US8890934B2 (en) | 2010-03-19 | 2014-11-18 | Panasonic Corporation | Stereoscopic image aligning apparatus, stereoscopic image aligning method, and program of the same |
WO2011116345A1 (en) | 2010-03-19 | 2011-09-22 | Invisage Technologies, Inc. | Dark current reduction in image sensors via dynamic electrical biasing |
WO2011114572A1 (en) | 2010-03-19 | 2011-09-22 | 富士フイルム株式会社 | Imaging device, method and program, and recording medium using same |
US8896668B2 (en) | 2010-04-05 | 2014-11-25 | Qualcomm Incorporated | Combining data from multiple image sensors |
US20110242342A1 (en) | 2010-04-05 | 2011-10-06 | Qualcomm Incorporated | Combining data from multiple image sensors |
US8600186B2 (en) | 2010-04-26 | 2013-12-03 | City University Of Hong Kong | Well focused catadioptric image acquisition |
US9053573B2 (en) | 2010-04-29 | 2015-06-09 | Personify, Inc. | Systems and methods for generating a virtual camera viewpoint for an image |
US20110267264A1 (en) | 2010-04-29 | 2011-11-03 | Mccarthy John | Display system with multiple optical sensors |
US20130250150A1 (en) | 2010-05-03 | 2013-09-26 | Michael R. Malone | Devices and methods for high-resolution image and video capture |
US9256974B1 (en) | 2010-05-04 | 2016-02-09 | Stephen P Hines | 3-D motion-parallax portable display software application |
US8885890B2 (en) | 2010-05-07 | 2014-11-11 | Microsoft Corporation | Depth map confidence filtering |
KR101756910B1 (en) | 2010-05-11 | 2017-07-26 | 삼성전자주식회사 | Apparatus and method for processing light field data using mask with attenuation pattern |
US20130147979A1 (en) | 2010-05-12 | 2013-06-13 | Pelican Imaging Corporation | Systems and methods for extending dynamic range of imager arrays by controlling pixel analog gain |
JP5545016B2 (en) | 2010-05-12 | 2014-07-09 | ソニー株式会社 | Imaging device |
CN103004180A (en) | 2010-05-12 | 2013-03-27 | 派力肯影像公司 | Architectures for imager arrays and array cameras |
WO2011142774A1 (en) | 2010-05-14 | 2011-11-17 | Omnivision Technologies, Inc. | Alternative color image array and associated methods |
US8576293B2 (en) | 2010-05-18 | 2013-11-05 | Aptina Imaging Corporation | Multi-channel imager |
US8602887B2 (en) | 2010-06-03 | 2013-12-10 | Microsoft Corporation | Synthesis of information from multiple audiovisual sources |
US20120062697A1 (en) | 2010-06-09 | 2012-03-15 | Chemimage Corporation | Hyperspectral imaging sensor for tracking moving targets |
US20110310980A1 (en) | 2010-06-22 | 2011-12-22 | Qualcomm Mems Technologies, Inc. | Apparatus and methods for processing frames of video data across a display interface using a block-based encoding scheme and a tag id |
KR20120000485A (en) | 2010-06-25 | 2012-01-02 | 삼성전자주식회사 | Apparatus and method for depth coding using prediction mode |
EP2403234A1 (en) | 2010-06-29 | 2012-01-04 | Koninklijke Philips Electronics N.V. | Method and system for constructing a compound image from data obtained by an array of image capturing devices |
CN101883291B (en) | 2010-06-29 | 2012-12-19 | 上海大学 | Method for drawing viewpoints by reinforcing interested region |
US8493432B2 (en) | 2010-06-29 | 2013-07-23 | Mitsubishi Electric Research Laboratories, Inc. | Digital refocusing for wide-angle images using axial-cone cameras |
GB2482022A (en) | 2010-07-16 | 2012-01-18 | St Microelectronics Res & Dev | Method for measuring resolution and aberration of lens and sensor |
US9406132B2 (en) | 2010-07-16 | 2016-08-02 | Qualcomm Incorporated | Vision-based quality metric for three dimensional video |
US8386964B2 (en) | 2010-07-21 | 2013-02-26 | Microsoft Corporation | Interactive image matting |
US20120019700A1 (en) | 2010-07-26 | 2012-01-26 | American Technologies Network Corporation | Optical system with automatic mixing of daylight and thermal vision digital video signals |
US20120026342A1 (en) | 2010-07-27 | 2012-02-02 | Xiaoguang Yu | Electronic system communicating with image sensor |
US20120026451A1 (en) | 2010-07-29 | 2012-02-02 | Lensvector Inc. | Tunable liquid crystal lens with single sided contacts |
CN102375199B (en) | 2010-08-11 | 2015-06-03 | 鸿富锦精密工业(深圳)有限公司 | Camera module |
US8428342B2 (en) | 2010-08-12 | 2013-04-23 | At&T Intellectual Property I, L.P. | Apparatus and method for providing three dimensional media content |
US8493482B2 (en) | 2010-08-18 | 2013-07-23 | Apple Inc. | Dual image sensor image processing system and method |
US8749694B2 (en) | 2010-08-27 | 2014-06-10 | Adobe Systems Incorporated | Methods and apparatus for rendering focused plenoptic camera data using super-resolved demosaicing |
US8724000B2 (en) | 2010-08-27 | 2014-05-13 | Adobe Systems Incorporated | Methods and apparatus for super-resolution in integral photography |
US8665341B2 (en) | 2010-08-27 | 2014-03-04 | Adobe Systems Incorporated | Methods and apparatus for rendering output images with simulated artistic effects from focused plenoptic camera data |
GB2483434A (en) | 2010-08-31 | 2012-03-14 | Sony Corp | Detecting stereoscopic disparity by comparison with subset of pixel change points |
US20120056982A1 (en) | 2010-09-08 | 2012-03-08 | Microsoft Corporation | Depth camera based on structured light and stereo vision |
US9013550B2 (en) | 2010-09-09 | 2015-04-21 | Qualcomm Incorporated | Online reference generation and tracking for multi-user augmented reality |
WO2012036902A1 (en) | 2010-09-14 | 2012-03-22 | Thomson Licensing | Compression methods and apparatus for occlusion data |
US9013634B2 (en) | 2010-09-14 | 2015-04-21 | Adobe Systems Incorporated | Methods and apparatus for video completion |
US8780251B2 (en) | 2010-09-20 | 2014-07-15 | Canon Kabushiki Kaisha | Image capture with focus adjustment |
WO2012039043A1 (en) | 2010-09-22 | 2012-03-29 | 富士通株式会社 | Stereo image generating unit, method of generating stereo image, and stereo image generating computer program |
US20120086803A1 (en) | 2010-10-11 | 2012-04-12 | Malzbender Thomas G | Method and system for distance estimation using projected symbol sequences |
US9876953B2 (en) | 2010-10-29 | 2018-01-23 | Ecole Polytechnique Federale De Lausanne (Epfl) | Omnidirectional sensor array system |
US9137503B2 (en) | 2010-11-03 | 2015-09-15 | Sony Corporation | Lens and color filter arrangement, super-resolution camera system and method |
US9065991B2 (en) | 2010-11-04 | 2015-06-23 | Lensvector Inc. | Methods of adjustment free manufacture of focus free camera modules |
US20120113232A1 (en) | 2010-11-10 | 2012-05-10 | Sony Pictures Technologies Inc. | Multiple camera system and method for selectable interaxial separation |
MY150361A (en) | 2010-12-03 | 2013-12-31 | Mimos Berhad | Method of image segmentation using intensity and depth information |
US20130258067A1 (en) | 2010-12-08 | 2013-10-03 | Thomson Licensing | System and method for trinocular depth acquisition with triangular sensor |
US8878950B2 (en) | 2010-12-14 | 2014-11-04 | Pelican Imaging Corporation | Systems and methods for synthesizing high resolution images using super-resolution processes |
JP5963422B2 (en) | 2010-12-17 | 2016-08-03 | キヤノン株式会社 | Imaging apparatus, display apparatus, computer program, and stereoscopic image display system |
US8682107B2 (en) | 2010-12-22 | 2014-03-25 | Electronics And Telecommunications Research Institute | Apparatus and method for creating 3D content for oriental painting |
US9177381B2 (en) | 2010-12-22 | 2015-11-03 | Nani Holdings IP, LLC | Depth estimate determination, systems and methods |
US8565709B2 (en) | 2010-12-30 | 2013-10-22 | Apple Inc. | Digital signal filter |
JP5699609B2 (en) | 2011-01-06 | 2015-04-15 | ソニー株式会社 | Image processing apparatus and image processing method |
EP2666048A4 (en) * | 2011-01-20 | 2014-06-04 | Fivefocal Llc | Passively athermalized infrared imaging system and methods of manufacturing same |
US8581995B2 (en) | 2011-01-25 | 2013-11-12 | Aptina Imaging Corporation | Method and apparatus for parallax correction in fused array imaging systems |
US8717467B2 (en) | 2011-01-25 | 2014-05-06 | Aptina Imaging Corporation | Imaging systems with array cameras for depth sensing |
US9235894B2 (en) | 2011-01-27 | 2016-01-12 | Metaio Gmbh | Method for determining correspondences between a first and a second image, and method for determining the pose of a camera |
US8717464B2 (en) | 2011-02-09 | 2014-05-06 | Blackberry Limited | Increased low light sensitivity for image sensors by combining quantum dot sensitivity to visible and infrared light |
US20120200726A1 (en) | 2011-02-09 | 2012-08-09 | Research In Motion Limited | Method of Controlling the Depth of Field for a Small Sensor Camera Using an Extension for EDOF |
US20140176592A1 (en) | 2011-02-15 | 2014-06-26 | Lytro, Inc. | Configuring two-dimensional image processing based on light-field parameters |
BR112012027306A2 (en) | 2011-02-28 | 2016-08-02 | Fujifilm Corp | color imaging device |
US8406548B2 (en) | 2011-02-28 | 2013-03-26 | Sony Corporation | Method and apparatus for performing a blur rendering process on an image |
US8537245B2 (en) | 2011-03-04 | 2013-09-17 | Hand Held Products, Inc. | Imaging and decoding device with quantum dot imager |
CA2769358C (en) | 2011-03-08 | 2016-06-07 | Research In Motion Limited | Quantum dot image sensor with dummy pixels used for intensity calculations |
US9565449B2 (en) | 2011-03-10 | 2017-02-07 | Qualcomm Incorporated | Coding multiview video plus depth content |
US20120249853A1 (en) | 2011-03-28 | 2012-10-04 | Marc Krolczyk | Digital camera for reviewing related images |
US8824821B2 (en) | 2011-03-28 | 2014-09-02 | Sony Corporation | Method and apparatus for performing user inspired visual effects rendering on an image |
US9030528B2 (en) | 2011-04-04 | 2015-05-12 | Apple Inc. | Multi-zone imaging sensor and lens array |
FR2974449A1 (en) | 2011-04-22 | 2012-10-26 | Commissariat Energie Atomique | IMAGEUR INTEGRATED CIRCUIT AND STEREOSCOPIC IMAGE CAPTURE DEVICE |
US20120274626A1 (en) | 2011-04-29 | 2012-11-01 | Himax Media Solutions, Inc. | Stereoscopic Image Generating Apparatus and Method |
KR101973822B1 (en) | 2011-05-11 | 2019-04-29 | 포토네이션 케이맨 리미티드 | Systems and methods for transmitting and receiving array camera image data |
US8843346B2 (en) | 2011-05-13 | 2014-09-23 | Amazon Technologies, Inc. | Using spatial information with device interaction |
US8629901B2 (en) | 2011-05-19 | 2014-01-14 | National Taiwan University | System and method of revising depth of a 3D image pair |
US20120293489A1 (en) | 2011-05-20 | 2012-11-22 | Himax Technologies Limited | Nonlinear depth remapping system and method thereof |
JP5797016B2 (en) | 2011-05-30 | 2015-10-21 | キヤノン株式会社 | Image processing apparatus, image processing method, and program |
JP2013005259A (en) | 2011-06-17 | 2013-01-07 | Sony Corp | Image processing apparatus, image processing method, and program |
WO2013003276A1 (en) | 2011-06-28 | 2013-01-03 | Pelican Imaging Corporation | Optical arrangements for use with an array camera |
US8773513B2 (en) | 2011-07-01 | 2014-07-08 | Seiko Epson Corporation | Context and epsilon stereo constrained correspondence matching |
US9300946B2 (en) | 2011-07-08 | 2016-03-29 | Personify, Inc. | System and method for generating a depth map and fusing images from a camera array |
JP5780865B2 (en) | 2011-07-14 | 2015-09-16 | キヤノン株式会社 | Image processing apparatus, imaging system, and image processing system |
US9363535B2 (en) | 2011-07-22 | 2016-06-07 | Qualcomm Incorporated | Coding motion depth maps with depth range variation |
US9264689B2 (en) | 2011-08-04 | 2016-02-16 | Semiconductor Components Industries, Llc | Systems and methods for color compensation in multi-view video |
US8432435B2 (en) | 2011-08-10 | 2013-04-30 | Seiko Epson Corporation | Ray image modeling for fast catadioptric light field rendering |
US8866951B2 (en) | 2011-08-24 | 2014-10-21 | Aptina Imaging Corporation | Super-resolution imaging systems |
US8704895B2 (en) | 2011-08-29 | 2014-04-22 | Qualcomm Incorporated | Fast calibration of displays using spectral-based colorimetrically calibrated multicolor camera |
US20130070060A1 (en) | 2011-09-19 | 2013-03-21 | Pelican Imaging Corporation | Systems and methods for determining depth from multiple views of a scene that include aliasing using hypothesized fusion |
US9100639B2 (en) | 2011-09-20 | 2015-08-04 | Panasonic Intellectual Property Management Co., Ltd. | Light field imaging device and image processing device |
CN103828361B (en) | 2011-09-21 | 2015-04-29 | 富士胶片株式会社 | Image processing device, method, stereoscopic image capture device, portable electronic apparatus, printer, and stereoscopic image player device |
JP6140709B2 (en) | 2011-09-28 | 2017-05-31 | ペリカン イメージング コーポレイション | System and method for encoding and decoding bright-field image files |
US8908083B2 (en) | 2011-09-28 | 2014-12-09 | Apple Inc. | Dynamic autofocus operations |
JP5831105B2 (en) | 2011-09-30 | 2015-12-09 | ソニー株式会社 | Imaging apparatus and imaging method |
EP2592823A3 (en) | 2011-10-12 | 2013-06-19 | Canon Kabushiki Kaisha | Image-capturing device |
US20130107061A1 (en) | 2011-10-31 | 2013-05-02 | Ankit Kumar | Multi-resolution ip camera |
US9692991B2 (en) | 2011-11-04 | 2017-06-27 | Qualcomm Incorporated | Multispectral imaging system |
JP5149435B1 (en) | 2011-11-04 | 2013-02-20 | 株式会社東芝 | Video processing apparatus and video processing method |
EP2590138B1 (en) | 2011-11-07 | 2019-09-11 | Flir Systems AB | Gas visualization arrangements, devices, and methods |
US20140313315A1 (en) | 2011-11-15 | 2014-10-23 | Technion Research & Development Foundation Limited | Method and system for transmitting light |
US20130121559A1 (en) | 2011-11-16 | 2013-05-16 | Sharp Laboratories Of America, Inc. | Mobile device with three dimensional augmented reality |
US9661310B2 (en) | 2011-11-28 | 2017-05-23 | ArcSoft Hanzhou Co., Ltd. | Image depth recovering method and stereo image fetching device thereof |
WO2013119706A1 (en) | 2012-02-06 | 2013-08-15 | Pelican Imaging Corporation | Systems and methods for extending dynamic range of imager arrays by controlling pixel analog gain |
US9172889B2 (en) | 2012-02-09 | 2015-10-27 | Semiconductor Components Industries, Llc | Imaging systems and methods for generating auto-exposed high-dynamic-range images |
US9412206B2 (en) | 2012-02-21 | 2016-08-09 | Pelican Imaging Corporation | Systems and methods for the manipulation of captured light field image data |
JP5860304B2 (en) | 2012-02-23 | 2016-02-16 | キヤノン株式会社 | Imaging apparatus, control method therefor, program, and storage medium |
JP6112824B2 (en) | 2012-02-28 | 2017-04-12 | キヤノン株式会社 | Image processing method and apparatus, and program. |
EP2637139A1 (en) | 2012-03-05 | 2013-09-11 | Thomson Licensing | Method and apparatus for bi-layer segmentation |
US9210392B2 (en) | 2012-05-01 | 2015-12-08 | Pelican Imaging Coporation | Camera modules patterned with pi filter groups |
EP2820838B1 (en) | 2012-05-09 | 2020-01-08 | Lytro, Inc. | Optimization of optical systems for improved light field capture and manipulation |
KR20150023907A (en) | 2012-06-28 | 2015-03-05 | 펠리칸 이매징 코포레이션 | Systems and methods for detecting defective camera arrays, optic arrays, and sensors |
US8896594B2 (en) | 2012-06-30 | 2014-11-25 | Microsoft Corporation | Depth sensing with depth-adaptive illumination |
US20140002674A1 (en) | 2012-06-30 | 2014-01-02 | Pelican Imaging Corporation | Systems and Methods for Manufacturing Camera Modules Using Active Alignment of Lens Stack Arrays and Sensors |
US9147251B2 (en) | 2012-08-03 | 2015-09-29 | Flyby Media, Inc. | Systems and methods for efficient 3D tracking of weakly textured planar surfaces for augmented reality applications |
US8988566B2 (en) | 2012-08-09 | 2015-03-24 | Omnivision Technologies, Inc. | Lens array for partitioned image sensor having color filters |
EP4296963A3 (en) | 2012-08-21 | 2024-03-27 | Adeia Imaging LLC | Method for depth detection in images captured using array cameras |
CN104685513B (en) | 2012-08-23 | 2018-04-27 | 派力肯影像公司 | According to the high-resolution estimation of the feature based of the low-resolution image caught using array source |
US9214013B2 (en) | 2012-09-14 | 2015-12-15 | Pelican Imaging Corporation | Systems and methods for correcting user identified artifacts in light field images |
US9143673B2 (en) | 2012-09-19 | 2015-09-22 | Google Inc. | Imaging device with a plurality of pixel arrays |
US20140092281A1 (en) | 2012-09-28 | 2014-04-03 | Pelican Imaging Corporation | Generating Images from Light Fields Utilizing Virtual Viewpoints |
TW201415879A (en) * | 2012-10-12 | 2014-04-16 | Wintek Corp | Image capture device |
US9609190B2 (en) | 2012-10-31 | 2017-03-28 | Invisage Technologies, Inc. | Devices, methods, and systems for expanded-field-of-view image and video capture |
US9143711B2 (en) | 2012-11-13 | 2015-09-22 | Pelican Imaging Corporation | Systems and methods for array camera focal plane control |
WO2014083489A1 (en) | 2012-11-28 | 2014-06-05 | Corephotonics Ltd. | High-resolution thin multi-aperture imaging systems |
US9001226B1 (en) | 2012-12-04 | 2015-04-07 | Lytro, Inc. | Capturing and relighting images using multiple devices |
US9088369B2 (en) | 2012-12-28 | 2015-07-21 | Synergy Microwave Corporation | Self injection locked phase locked looped optoelectronic oscillator |
US20140183334A1 (en) | 2013-01-03 | 2014-07-03 | Visera Technologies Company Limited | Image sensor for light field device and manufacturing method thereof |
WO2014107634A2 (en) | 2013-01-05 | 2014-07-10 | Tinz Optics, Inc. | Methods and apparatus relating to the use of multipe optical chains |
KR20140094395A (en) | 2013-01-22 | 2014-07-30 | 삼성전자주식회사 | photographing device for taking a picture by a plurality of microlenses and method thereof |
US9769365B1 (en) | 2013-02-15 | 2017-09-19 | Red.Com, Inc. | Dense field imaging |
US9462164B2 (en) | 2013-02-21 | 2016-10-04 | Pelican Imaging Corporation | Systems and methods for generating compressed light field representation data using captured light fields, array geometry, and parallax information |
US9253380B2 (en) | 2013-02-24 | 2016-02-02 | Pelican Imaging Corporation | Thin form factor computational array cameras and modular array cameras |
US20150002734A1 (en) | 2013-07-01 | 2015-01-01 | Motorola Mobility Llc | Electronic Device with Modulated Light Flash Operation for Rolling Shutter Image Sensor |
WO2014138697A1 (en) | 2013-03-08 | 2014-09-12 | Pelican Imaging Corporation | Systems and methods for high dynamic range imaging using array cameras |
US8866912B2 (en) | 2013-03-10 | 2014-10-21 | Pelican Imaging Corporation | System and methods for calibration of an array camera using a single captured image |
US9521416B1 (en) | 2013-03-11 | 2016-12-13 | Kip Peli P1 Lp | Systems and methods for image data compression |
WO2014160142A1 (en) | 2013-03-13 | 2014-10-02 | Pelican Imaging Corporation | Systems and methods for using alignment to increase sampling diversity of cameras in an array camera module |
US9519972B2 (en) | 2013-03-13 | 2016-12-13 | Kip Peli P1 Lp | Systems and methods for synthesizing images from image data captured by an array camera using restricted depth of field depth maps in which depth estimation precision varies |
US9106784B2 (en) | 2013-03-13 | 2015-08-11 | Pelican Imaging Corporation | Systems and methods for controlling aliasing in images captured by an array camera for use in super-resolution processing |
US9888194B2 (en) | 2013-03-13 | 2018-02-06 | Fotonation Cayman Limited | Array camera architecture implementing quantum film image sensors |
WO2014164550A2 (en) | 2013-03-13 | 2014-10-09 | Pelican Imaging Corporation | System and methods for calibration of an array camera |
US9578259B2 (en) | 2013-03-14 | 2017-02-21 | Fotonation Cayman Limited | Systems and methods for reducing motion blur in images or video in ultra low light with array cameras |
WO2014150856A1 (en) | 2013-03-15 | 2014-09-25 | Pelican Imaging Corporation | Array camera implementing quantum dot color filters |
EP2973476A4 (en) | 2013-03-15 | 2017-01-18 | Pelican Imaging Corporation | Systems and methods for stereo imaging with camera arrays |
US20140267286A1 (en) | 2013-03-15 | 2014-09-18 | Pelican Imaging Corporation | Systems and Methods for Providing an Array Projector |
WO2014144157A1 (en) | 2013-03-15 | 2014-09-18 | Pelican Imaging Corporation | Optical arrangements for use with an array camera |
US9445003B1 (en) | 2013-03-15 | 2016-09-13 | Pelican Imaging Corporation | Systems and methods for synthesizing high resolution images using image deconvolution based on motion and depth information |
US9497429B2 (en) | 2013-03-15 | 2016-11-15 | Pelican Imaging Corporation | Extended color processing on pelican array cameras |
US9898856B2 (en) | 2013-09-27 | 2018-02-20 | Fotonation Cayman Limited | Systems and methods for depth-assisted perspective distortion correction |
US20150098079A1 (en) | 2013-10-09 | 2015-04-09 | Hilti Aktiengesellschaft | System and method for camera based position and orientation measurement |
US20150104101A1 (en) | 2013-10-14 | 2015-04-16 | Apple Inc. | Method and ui for z depth image segmentation |
WO2015070105A1 (en) | 2013-11-07 | 2015-05-14 | Pelican Imaging Corporation | Methods of manufacturing array camera modules incorporating independently aligned lens stacks |
US9456134B2 (en) | 2013-11-26 | 2016-09-27 | Pelican Imaging Corporation | Array camera configurations incorporating constituent array cameras and constituent cameras |
JP6211435B2 (en) | 2014-02-26 | 2017-10-11 | 株式会社アドバンテスト | Manufacturing method of semiconductor device |
US9521319B2 (en) | 2014-06-18 | 2016-12-13 | Pelican Imaging Corporation | Array cameras and array camera modules including spectral filters disposed outside of a constituent image sensor |
-
2014
- 2014-11-07 WO PCT/US2014/064693 patent/WO2015070105A1/en active Application Filing
- 2014-11-07 US US14/536,554 patent/US9426343B2/en active Active
- 2014-11-07 EP EP14860103.2A patent/EP3066690A4/en not_active Ceased
- 2014-11-07 US US14/536,552 patent/US9264592B2/en active Active
- 2014-11-07 US US14/536,537 patent/US9185276B2/en active Active
-
2016
- 2016-08-19 US US15/242,405 patent/US9924092B2/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6172352B1 (en) * | 1998-03-20 | 2001-01-09 | Syscan, Inc. | Sensing module for accelerating signal readout from image sensors |
US6571466B1 (en) * | 2000-03-27 | 2003-06-03 | Amkor Technology, Inc. | Flip chip image sensor package fabrication method |
US20070296847A1 (en) * | 2006-06-21 | 2007-12-27 | Chao-Chi Chang | Method of making image capture unit |
US7639435B2 (en) * | 2007-04-04 | 2009-12-29 | Hon Hai Precision Industry Co., Ltd. | Optical module with adhesively mounted filter |
US20100309292A1 (en) * | 2007-11-29 | 2010-12-09 | Gwangju Institute Of Science And Technology | Method and apparatus for generating multi-viewpoint depth map, method for generating disparity of multi-viewpoint image |
US20100166410A1 (en) * | 2008-12-27 | 2010-07-01 | Hon Hai Precision Industry Co., Ltd. | Camera module array for obtaining compound images |
WO2012057619A1 (en) | 2010-10-24 | 2012-05-03 | Ziv Attar | System and method for imaging using multi aperture camera |
US20130265459A1 (en) * | 2011-06-28 | 2013-10-10 | Pelican Imaging Corporation | Optical arrangements for use with an array camera |
US20130088637A1 (en) * | 2011-10-11 | 2013-04-11 | Pelican Imaging Corporation | Lens Stack Arrays Including Adaptive Optical Elements |
US20130274923A1 (en) * | 2012-04-13 | 2013-10-17 | Automation Engineering, Inc. | Active Alignment Using Continuous Motion Sweeps and Temporal Interpolation |
Non-Patent Citations (1)
Title |
---|
See also references of EP3066690A4 |
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US11683594B2 (en) | 2021-04-15 | 2023-06-20 | Intrinsic Innovation Llc | Systems and methods for camera exposure control |
US11290658B1 (en) | 2021-04-15 | 2022-03-29 | Boston Polarimetrics, Inc. | Systems and methods for camera exposure control |
US11689813B2 (en) | 2021-07-01 | 2023-06-27 | Intrinsic Innovation Llc | Systems and methods for high dynamic range imaging using crossed polarizers |
US12052409B2 (en) | 2023-06-22 | 2024-07-30 | Adela Imaging LLC | Systems and methods for encoding image files containing depth maps stored as metadata |
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EP3066690A4 (en) | 2017-04-05 |
US9924092B2 (en) | 2018-03-20 |
US20150124151A1 (en) | 2015-05-07 |
US9264592B2 (en) | 2016-02-16 |
US20170070672A1 (en) | 2017-03-09 |
US20150124113A1 (en) | 2015-05-07 |
EP3066690A1 (en) | 2016-09-14 |
US9185276B2 (en) | 2015-11-10 |
US9426343B2 (en) | 2016-08-23 |
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