WO2015056825A1 - Method for manufacturing flexible printed circuit board through high-temperature heat treatment on heat-resistant substrate and flexible printed circuit board thereof - Google Patents

Method for manufacturing flexible printed circuit board through high-temperature heat treatment on heat-resistant substrate and flexible printed circuit board thereof Download PDF

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Publication number
WO2015056825A1
WO2015056825A1 PCT/KR2013/009321 KR2013009321W WO2015056825A1 WO 2015056825 A1 WO2015056825 A1 WO 2015056825A1 KR 2013009321 W KR2013009321 W KR 2013009321W WO 2015056825 A1 WO2015056825 A1 WO 2015056825A1
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WO
WIPO (PCT)
Prior art keywords
heat
circuit board
resistant substrate
conductive
printed circuit
Prior art date
Application number
PCT/KR2013/009321
Other languages
French (fr)
Korean (ko)
Inventor
박찬후
Original Assignee
박찬후
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Filing date
Publication date
Priority claimed from KR1020130122528A external-priority patent/KR101404681B1/en
Application filed by 박찬후 filed Critical 박찬후
Publication of WO2015056825A1 publication Critical patent/WO2015056825A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring

Definitions

  • the present invention relates to a method of manufacturing a flexible printed circuit board and a flexible printed circuit board. Specifically, after forming a printed circuit pattern with a conductive paste on a heat resistant substrate, a conductive electrode is formed through high temperature heat treatment, and the conductive electrode is applied to the flexible film. It transfers and manufactures a flexible printed circuit board.
  • printed circuit boards are divided into rigid circuit boards and flexible printed circuit boards. Recently, the use of flexible printed circuit boards that are light in weight and flexible in accordance with the miniaturization and light weight of electronic products has been increasing.
  • the conventional method of manufacturing a flexible printed circuit board is a conventional F-PCB method in which a PI (polyimide) film is attached to a thin copper foil, coated with a circuit pattern, and exposed by etching, removing portions except the circuit pattern, and forming a desired circuit pattern.
  • Conventional F-PCB manufacturing method is expensive because of complicated processing method, and various problems such as environmental pollution through plating are occurred.
  • One method of forming conductive material by printing conductive paste by silk screen etc. is a field of printed electronics. There is this.
  • a paste is prepared by adding an adhesive and a curing agent such as epoxy and acryl to a silver powder, and printing the desired circuit pattern on a film such as polyethylene terephthalate by using a screen or inkjet printer, and then using 200 degree centigrade.
  • an adhesive and a curing agent such as epoxy and acryl
  • a film such as polyethylene terephthalate
  • the flexible printed circuit board manufactured as described above is required to add epoxy, acrylic resin, and hardening agent that inhibit conductivity to adhere to the flexible film, and the conductive silver powder is less than 10 times the electrical conductivity of the bulk silver, so the copper foil is used. Compared to the flexible printed circuit board manufactured is limited in use.
  • the present invention provides a method for forming a flexible printed circuit board by forming a conductive electrode using a heat-resistant substrate at a high temperature of 600 degrees Celsius or more and transferring the conductive electrode to a film, and a flexible printed circuit board thereof.
  • the present invention enables the production of metal bulk from the metallic powder using the heat treatment at the firing temperature, and compared with the conventional copper foil etching method, the electrical conductivity is the same, the processing process is simple, and the manufacturing cost can be formed because the thin film can be formed. It is an object of the present invention to provide a method of manufacturing a flexible printed circuit board and a flexible printed circuit board, which are inexpensive and are advantageous in applications where thickness constraints such as mobile phones are difficult.
  • the present invention is a method of manufacturing a flexible printed circuit board that can be used in a wide range of applications without being limited in use because the electrical conductivity is remarkably superior to the conventional manufacturing method for forming a circuit by printing a conductive hardened silver electrode and its It is to provide a flexible printed circuit board.
  • the problem of the present invention is that a flexible film having a predetermined area and capable of bending, and an adhesive and a conductive paste applied to at least a portion of one surface of the flexible film are heat-treated to a firing temperature, and thus the flexible film is formed through the adhesive. It is achieved by a flexible circuit board having a conductive electrode formed by a high temperature heat treatment, characterized in that it comprises a conductive electrode attached to the top.
  • the upper surface of the conductive electrode may be further laminated with a combustion material produced by the combustion of the peeling resin in which the inorganic powder, carbon material or carbide is mixed with the resin.
  • the conductive electrode is formed by heat-treating the conductive paste laminated on a heat-resistant substrate with a peeling resin formed by mixing inorganic powder, carbon material or carbide with a resin to a firing temperature, and the heat-resistant substrate
  • the conductive electrode is transferred to the flexible film by contacting the conductive electrode formed by heat-treating the conductive paste laminated on the substrate to a firing temperature with the flexible film coated with the adhesive.
  • the object of the present invention is the step of forming a circuit pattern with a conductive paste on one surface of the heat-resistant substrate, heat-treating the heat-resistant substrate on which the circuit pattern is formed at a firing temperature to form a conductive electrode on the heat-resistant substrate and the heat treatment It is also achieved by a flexible printed circuit board manufacturing method comprising the step of transferring the conductive electrode to the flexible film by contacting the flexible film coated with an adhesive to the conductive electrode formed on one surface of the heat resistant substrate.
  • the step of forming the conductive electrode on the heat resistant substrate by heat-treating the heat resistant substrate on which the circuit pattern is formed at a firing temperature may include the conductive metal powder of the conductive paste constituting the circuit pattern.
  • the conductive electrode is formed by melting at this firing temperature and coalescing with each other to form an integral mass.
  • the step of forming a circuit pattern with a conductive paste on one surface of the heat resistant substrate may include applying a peeling resin to the heat resistant substrate and the peeling resin applied to the heat resistant substrate. Forming a circuit pattern on the upper portion of the conductive paste.
  • the peeling resin is formed by mixing an inorganic powder which does not burn at the firing temperature or a carbon material or carbide combusted at the firing temperature to form a combustion material in the resin.
  • the inorganic powder of the peeling resin includes paints, paints, inorganic oxides or minerals containing pigments that do not burn at the firing temperature.
  • the flexible printed circuit board manufacturing method and the flexible printed circuit board according to the present invention it is possible to manufacture a product having a thin film and excellent electrical conductivity, and the manufacturing method is easy because the manufacturing method is simple.
  • the flexible printed circuit board according to the present invention can heat-treat up to the firing temperature of the conductive metal, which is an electrode material, by using a high-temperature heat treatment method, so that the theoretical conductivity of each unique conductive metal can be realized.
  • the conductive metal which is an electrode material
  • the flexible printed circuit board according to the present invention has advantages in that all printing methods, such as screen printing, offset printing, gravure printing, and inkjet printing, can be applied to a method of printing a circuit pattern.
  • FIG. 1 is a schematic cross-sectional view showing a state in which a peeling resin and a conductive electrode material are applied to a heat resistant substrate in a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention.
  • FIG. 2 is a flowchart sequentially illustrating a process of a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention.
  • FIG. 3 is a process diagram schematically showing a process of a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view illustrating a cross section of a flexible printed circuit board manufactured by a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to the present invention.
  • FIG. 5 is a plan view illustrating an example of a circuit pattern of a conductive electrode that may be formed in a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an exemplary embodiment of the present invention.
  • FIG. 1 is a schematic cross-sectional view showing a state in which a peeling resin and a conductive paste are applied to a heat resistant substrate in a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention
  • FIG. 3 is a flowchart sequentially illustrating a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate
  • FIG. 3 is a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view illustrating a cross section of a flexible printed circuit board manufactured according to a method of manufacturing a flexible printed circuit board through a high temperature heat treatment of a heat resistant substrate according to the present invention, and FIG. Plane showing an example of a circuit pattern that can be formed in a flexible printed circuit board manufacturing method through a high temperature heat treatment of the heat-resistant substrate according to an embodiment of the invention A.
  • the heat resistant substrate 10 is prepared with a flat surface capable of withstanding high temperature heat treatment of 600 degrees Celsius or more and capable of printing a circuit pattern (S1).
  • the heat-resistant substrate 10 may be a ceramic substrate including alumina, a substrate made of a common ceramic material, a substrate made of heat-resistant tempered glass, a metal substrate that can withstand high temperature heat treatment temperatures, and a conductive material which will be described later.
  • Metals having a firing temperature higher than that of the conductive metal, which is the main component of the paste, may be used as the material of the metal substrate.
  • the metal substrate may be formed of non-ferrous metals including stainless as well as iron.
  • Peeling resin 20 is applied to the upper portion of the heat-resistant substrate 10 (S2).
  • the peeling resin 20 for example, an inorganic powder (including minerals, pigments, etc.), a carbonaceous material or a peeling material 21 such as carbide is used evenly mixed with a resin (natural resin or synthetic resin).
  • the peeling material 21 plays an important role in peeling the conductive electrode 31 from the heat resistant substrate 10 in the process of transferring the conductive electrode 31 to the flexible film 40 in the method of manufacturing the flexible printed circuit board according to the present invention. It refers to a substance that makes.
  • the resin used for the peeling resin 20 can be applied and can be used in any form that is decomposed by heat above a predetermined temperature.
  • thermally decomposable resins including a liquid epoxy resin can be used and applied. Possible thermally decomposable resins are well known and thus detailed descriptions thereof will be omitted.
  • the inorganic powder which may be used as the peeling material 21 included in the peeling resin 20 may be an oily, aqueous, enamel paint using a pigment as a colorant, or a paint in the form of a paste in which the pigment is uniformly mixed into a medium or the like. have.
  • the liquid or resin contained in the peeling resin 20 is blown away or burned in the process of heating to the firing temperature, and the inorganic powder remains between the conductive electrode 31 and the heat-resistant substrate 10 so that the conductive electrode 31 and By preventing adhesion between the heat resistant substrates 10, the conductive electrodes 31 may be separated from the heat resistant substrates 10 in the process of transferring the conductive electrodes 31 to the flexible film 40. Therefore, the inorganic powder may not be burned or lost at the firing temperature of the electrode material (conductive metal) forming the conductive electrode 31, including a wide range of inorganic materials, inorganic oxides, minerals, ceramic powders, and the like. May be included.
  • a carbon material or a carbide may be used in place of the inorganic powder.
  • the carbon material or carbide is burned by the high temperature in the heat treatment process to be described later, and then the combustion material generated is left between the electrode material and the heat-resistant substrate to space the gap between the electrode material and the heat-resistant substrate so that the conductive electrode 31 is heat-resistant. It is possible to separate from the substrate 10.
  • Such carbon materials include, for example, graphite (graphite), and carbides, for example, calcium carbide, and the like.
  • various carbon materials and carbides, which generate a combustion material and enable separation of the conductive electrode and the heat-resistant substrate may be used. have.
  • the method of applying the peeling resin 20 may be a method such as low viscosity spray method, brushing method, gravure printing, offset printing, inkjet printing, high viscosity silk screen, solid powder coating method, powder coating, laser printer or the like.
  • the printed circuit pattern 30 is formed using a conductive paste containing a conductive electrode material on the peeling resin 20 coated on the heat resistant substrate 10 (S3). Since the conductive paste is known to be formed in the form of a paste for printing a circuit pattern of the conductive metal powder, which is an electrode material having excellent electrical conductivity, a detailed description thereof will be omitted. As the electrode material used for the conductive paste, various metal materials including copper and nickel as well as precious metal materials including gold and silver can be used.
  • the printed circuit pattern 30 As a method of forming the printed circuit pattern 30 from the conductive paste, screen printing, offset printing, gravure printing, inkjet printing, or the like may be used.
  • the heat resistant substrate 10 having the printed circuit pattern 30 formed of the conductive paste is heat-treated to a firing temperature of the electrode material of the conductive paste (S4).
  • the electrode material of the conductive paste a variety of materials may be used as described above. Since the firing temperature is different for each electrode material, heat treatment is performed to the firing temperature of the used electrode material. The ambient atmosphere during the calcining heat treatment loses its function as a conductive conductor when the electrode material is oxidized. Therefore, the surrounding atmosphere during the calcining heat treatment is preferably performed in a vacuum or in an inert gas atmosphere to prevent oxidation of the electrode material.
  • the ambient atmosphere during plastic heat treatment is possible even in the air when the electrode material is a precious metal such as gold or silver, but when the electrode material is a non-ferrous metal such as copper or nickel, oxidation occurs at high temperature and thus loses its function as a conductive conductor.
  • the surrounding atmosphere during the calcining heat treatment must be performed under vacuum or in an inert gas atmosphere.
  • the electrode material in the form of powder contained in the conductive paste by the heat treatment process up to the above firing temperature is melted and coalesced with each other by high temperature to form agglomerates, and the moisture and resin contained in the conductive paste are heat treated at the firing temperature. In the process of evaporation or combustion is blown away. That is, the electrode material powder contained in the conductive paste is melted and coalesced with each other by the heat treatment process up to the firing temperature, thereby changing the structure of the electrode material mass.
  • the electrical conductivity of the conductive electrode 31 is remarkably improved since the powdered electrode materials contained in the conductive paste are changed into a bulk state through the heat treatment to the firing temperature in the powder state, which is separated from each other.
  • the liquid or resin contained in the exfoliation resin 20 in the heat treatment process is evaporated and blown away or burned in the heating process at the firing temperature, so that the conductive electrode 31 and the heat-resistant substrate 10 ), Only the peeling material 21 such as the inorganic powder contained in the peeling resin 20 or the combustion material of the carbon material or carbide remains.
  • the peeling material 21, such as the inorganic powder in the peeling resin 20 or the combustion material of carbon material or carbide is located between the conductive electrode 31 and the heat resistant substrate 10, the conductive electrode 31 and the heat resistant member Attachment of the substrates 10 to each other is prevented, and as a result, the conductive electrodes 31 can be separated from the heat-resistant substrate 10 during the transfer of the conductive electrodes. If the peeling resin 20 does not contain the inorganic powder or the peeling material 21 such as carbon material or carbide, the electrode material of the conductive paste is melted in the firing process of the heat resistant substrate 10 and the heat resistant substrate 10 is left as it is. Since it is difficult to separate the conductive electrode 31 from the heat-resistant substrate 10, the conductive electrode 31 cannot be transferred to the flexible film 40 afterwards.
  • the method of transferring the conductive electrode 31 on the upper portion of the heat-resistant substrate 10 by contacting the flexible film 40 coated with the adhesive may be performed by transferring the printed circuit pattern 30 with a simple contact.
  • Various methods can be used, such as a roller method or a compression press method.
  • the flexible film 40 is not limited to a specific material, as well as the PI film used in the current F-PCB, inexpensive PET film may be used, and in addition, all synthetic resin films such as PS resin for mobile phones may be used.
  • the flexible film 40 may be a paper material or may be any object.
  • the adhesive applied for the transfer to the flexible film 40 may be used for all applications including solvent-based adhesives and water-soluble adhesives, and adhesives for aqueous, solid paste and post-it may also be used.
  • a layer of an adhesive (not shown) is placed on the flexible film 40 and the printed circuit pattern 30 formed by the conductive paste is formed on the layer of the adhesive.
  • the conductive electrode 31 formed by heat treatment to a firing temperature is stacked, and the upper surface of the conductive electrode 31 is formed by burning inorganic powder or carbon material or carbide formed by the heat-removing resin 20 at a firing temperature.
  • a peeling material 21 like the raw material is formed.
  • the present invention heat-treats the metal powder contained in the conductive paste as a conductive electrode material at a firing temperature. Since the metal powder is melted to form a bulk, the present invention is not necessarily limited to a temperature of 600 degrees Celsius or more, and to perform heat treatment in a range of 600 degrees Celsius or less depending on the type of conductive electrode material. Of course it includes.
  • the metal melts at a temperature lower than the intrinsic melting point of the metal. That is, the actual melting point is lower than the melting point inherent to the metal. Therefore, using the nanonized particles as the metal of the conductive electrode material, it is possible to form the same bulk at a temperature lower than the intrinsic firing temperature, thereby making it possible to make an electrode having good electrical conductivity.
  • the particle size of the metal is preferably about 50 to 100 nanometers as the electrode material.
  • the silver powder forming the conductive silver electrode may be silver bulked at a low heat treatment temperature of 600 degrees Celsius or less when the silver nanopowder having a particle diameter of up to 100 nanometers is used.
  • non-ferrous metals such as copper may be oxidized when heat treated to a firing temperature
  • plastic heat treatment should be performed in a reducing atmosphere.
  • the present invention is used in the manufacture of flexible circuit boards.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The present invention relates to a method for manufacturing a flexible printed circuit board and a flexible printed circuit board thereof and, more particularly, to a method for manufacturing a printed circuit board by transferring, to a flexible film, a conductive electrode formed through high-temperature heat treatment on a heat-resistant substrate. The flexible printed circuit board manufactured according to the present invention has the advantages of having a uniform electrical conductivity when compared to conventional copper clad etching methods since an electrode material can be formed in a metal bulk form through heat treatment at a calcination temperature, having a simple processing process, and reducing manufacturing costs by allowing a thin film to be formed, and is capable of being applied even in the case where limited conditions for a thickness are difficult, such as a cellular phone.

Description

내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법 및 그 연성회로기판Method for manufacturing flexible printed circuit board through high temperature heat treatment of heat resistant board and its flexible printed circuit board
본 발명은 연성인쇄회로기판 제조방법 및 그 연성인쇄회로기판에 관한 것으로서 구체적으로는 내열기판에 도전성 페이스트로 인쇄회로패턴을 형성한 후 고온의 열처리를 통해 전도성 전극을 형성하고 전도성 전극을 연성필름에 전사하여 연성인쇄회로기판을 제조하는 것이다.The present invention relates to a method of manufacturing a flexible printed circuit board and a flexible printed circuit board. Specifically, after forming a printed circuit pattern with a conductive paste on a heat resistant substrate, a conductive electrode is formed through high temperature heat treatment, and the conductive electrode is applied to the flexible film. It transfers and manufactures a flexible printed circuit board.
일반적으로 인쇄회로기판은 경성회로기판과 연성인쇄회로기판으로 구분되며 근래에는 전자제품의 소형화, 경량화 추세에 따라 무게가 가볍고 구부러짐이 가능한 연성인쇄회로기판의 사용이 증대되고 있다.In general, printed circuit boards are divided into rigid circuit boards and flexible printed circuit boards. Recently, the use of flexible printed circuit boards that are light in weight and flexible in accordance with the miniaturization and light weight of electronic products has been increasing.
종래의 연성회로기판의 제조방법은 얇은 동박에 PI(폴리이미드)필름을 부착하여 회로패턴을 입혀 노광하고 회로패턴을 제외한 부분을 식각처리하여 제거하고 원하는 회로 패턴을 형성하는 전통적 F-PCB 방법이 있다. 전통적 F-PCB 제조 방법은 가공방법이 복잡하여 비용이 많이 들고 도금을 통한 환경오염 등 여러 문제점이 발생하여 인쇄전자의 한 분야로 도전성 페이스트를 실크 스크린 등의 방법으로 인쇄하여 도체를 형성하는 한 방법이 있다.The conventional method of manufacturing a flexible printed circuit board is a conventional F-PCB method in which a PI (polyimide) film is attached to a thin copper foil, coated with a circuit pattern, and exposed by etching, removing portions except the circuit pattern, and forming a desired circuit pattern. have. Conventional F-PCB manufacturing method is expensive because of complicated processing method, and various problems such as environmental pollution through plating are occurred. One method of forming conductive material by printing conductive paste by silk screen etc. is a field of printed electronics. There is this.
인쇄전자에 의한 제조방법은 은분말에 에폭시, 아크릴 등의 접착제와 경화제를 첨가하여 페이스트를 제조하고 이를 폴리에틸렌 테레프탈레이트 등의 필름에 직접 스크린 또는 잉크젯 프린터를 이용하여 원하는 회로패턴을 인쇄한 후 섭씨 200도 이하에서 열처리를 하여 경화건조하는 방법 등이 있다.In the manufacturing method by printed electronics, a paste is prepared by adding an adhesive and a curing agent such as epoxy and acryl to a silver powder, and printing the desired circuit pattern on a film such as polyethylene terephthalate by using a screen or inkjet printer, and then using 200 degree centigrade. The method of hardening and drying by heat processing below.
이렇게 제조된 연성인쇄회로기판은 연성필름에의 고착을 위해서 도전성을 저해하는 에폭시, 아크릴 수지 및 경화제의 첨가가 필수적이고 도전성 은분말도 벌크상태의 은보다는 10의 2승 이상 전기전도도가 떨어지므로 동박으로 제조된 연성인쇄회로기판에 비하여 용도가 제한적으로 사용될 수 밖에 없다.The flexible printed circuit board manufactured as described above is required to add epoxy, acrylic resin, and hardening agent that inhibit conductivity to adhere to the flexible film, and the conductive silver powder is less than 10 times the electrical conductivity of the bulk silver, so the copper foil is used. Compared to the flexible printed circuit board manufactured is limited in use.
연성인쇄회로기판 제조에 관한 종래기술은 한국공개특허 제2012-0010524호,명칭: 다층 연성회로기판의 제조방법이 있다.The prior art of manufacturing a flexible printed circuit board is disclosed in Korean Patent Laid-Open No. 2012-0010524, titled: Multi-layer Flexible Circuit Board.
본 발명은 섭씨 600도 이상의 고온에서 내열기판을 이용하여 전도성 전극을 형성하고 전도성 전극을 필름에 전사시켜 연성인쇄회로기판을 제조하는 방법 및 그 연성인쇄회로기판을 제공하는 것이다.The present invention provides a method for forming a flexible printed circuit board by forming a conductive electrode using a heat-resistant substrate at a high temperature of 600 degrees Celsius or more and transferring the conductive electrode to a film, and a flexible printed circuit board thereof.
또한 본 발명은 소성온도로의 열처리를 이용하여 금속성 분말로부터 금속벌크의 제조가 가능하여 종래의 동박에칭방법과 비교하여도 전기전도도가 동일하고 가공공정이 단순하며 박막을 형성할 수 있으므로 제조비용이 저렴하고 휴대폰 등과 같이 두께의 제한조건이 까다로운 경우에도 적용이 유리한 연성인쇄회로기판의 제조방법 및 그 연성인쇄회로기판을 제공하고자 하는 것이다.In addition, the present invention enables the production of metal bulk from the metallic powder using the heat treatment at the firing temperature, and compared with the conventional copper foil etching method, the electrical conductivity is the same, the processing process is simple, and the manufacturing cost can be formed because the thin film can be formed. It is an object of the present invention to provide a method of manufacturing a flexible printed circuit board and a flexible printed circuit board, which are inexpensive and are advantageous in applications where thickness constraints such as mobile phones are difficult.
또한 본 발명은 종래의 도전성 경화 은 전극을 인쇄하여 회로를 구성하는 제조방법에 비해서 전기전도도가 현저히 우수하기 때문에 용도에 제한을 받지 않고 폭넓은 분야에서 사용될 수 있는 연성인쇄회로기판의 제조방법 및 그 연성인쇄회로기판을 제공하고자 하는 것이다.In addition, the present invention is a method of manufacturing a flexible printed circuit board that can be used in a wide range of applications without being limited in use because the electrical conductivity is remarkably superior to the conventional manufacturing method for forming a circuit by printing a conductive hardened silver electrode and its It is to provide a flexible printed circuit board.
상기 본 발명의 과제는 소정의 면적을 가지며 굽힘이 가능한 연성필름과, 상기 연성필름의 일면의 적어도 일부에 도포된 접착제 및 도전성 페이스트가 소성온도까지 열처리되어 형성된 것으로서 상기 접착제를 매개로 상기 연성필름의 상부에 부착된 전도성 전극을 포함하는 것을 특징으로 하는 고온열처리에 의한 전도성전극이 형성된 연성회로기판에 의해 달성된다.The problem of the present invention is that a flexible film having a predetermined area and capable of bending, and an adhesive and a conductive paste applied to at least a portion of one surface of the flexible film are heat-treated to a firing temperature, and thus the flexible film is formed through the adhesive. It is achieved by a flexible circuit board having a conductive electrode formed by a high temperature heat treatment, characterized in that it comprises a conductive electrode attached to the top.
본 발명에서, 상기 전도성 전극의 상부면에는 무기질 분말, 탄소재료 또는 탄화물이 수지에 혼합된 박리용 수지가 연소되어 생성된 연소재가 더 적층될 수 있다.In the present invention, the upper surface of the conductive electrode may be further laminated with a combustion material produced by the combustion of the peeling resin in which the inorganic powder, carbon material or carbide is mixed with the resin.
본 발명에서, 상기 전도성 전극은 무기질 분말, 탄소재료 또는 탄화물이 수지에 혼합되어 형성된 박리용 수지를 사이에 두고 내열기판에 적층된 상기 도전성 페이스트를 소성온도까지 열처리하는 것에 의해 형성되며, 상기 내열기판의 위에 적층된 상기 도전성 페이스트를 소성온도까지 열처리하여 형성된 상기 전도성 전극을 상기 접착제가 도포된 상기 연성필름과 접촉시킴으로써 상기 연성필름에 상기 전도성 전극이 전사된다.In the present invention, the conductive electrode is formed by heat-treating the conductive paste laminated on a heat-resistant substrate with a peeling resin formed by mixing inorganic powder, carbon material or carbide with a resin to a firing temperature, and the heat-resistant substrate The conductive electrode is transferred to the flexible film by contacting the conductive electrode formed by heat-treating the conductive paste laminated on the substrate to a firing temperature with the flexible film coated with the adhesive.
상기 본 발명의 과제는 내열기판의 일면에 도전성 페이스트로 회로패턴을 형성하는 단계와, 상기 회로패턴이 형성된 상기 내열기판을 소성온도로 열처리하여 상기 내열기판에 전도성 전극을 형성하는 단계 및 상기 열처리에 의해 상기 내열기판의 일면에 형성된 상기 전도성 전극에 접착제가 도포된 연성필름을 접촉하여 상기 연성필름에 상기 전도성 전극을 전사시키는 단계를 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조방법에 의해서도 달성된다.The object of the present invention is the step of forming a circuit pattern with a conductive paste on one surface of the heat-resistant substrate, heat-treating the heat-resistant substrate on which the circuit pattern is formed at a firing temperature to form a conductive electrode on the heat-resistant substrate and the heat treatment It is also achieved by a flexible printed circuit board manufacturing method comprising the step of transferring the conductive electrode to the flexible film by contacting the flexible film coated with an adhesive to the conductive electrode formed on one surface of the heat resistant substrate.
본 발명에 따른 연성인쇄회로기판 제조방법에서, 상기 회로패턴이 형성된 상기 내열기판을 소성온도로 열처리하여 상기 내열기판에 전도성 전극을 형성하는 단계는 상기 회로패턴을 구성하는 상기 도전성 페이스트의 전도성 금속 분말이 소성온도에서 융해(melting)되어 서로 합체됨으로써 일체의 덩어리를 형성하는 것에 의해 상기 전도성 전극이 형성된다.In the method of manufacturing a flexible printed circuit board according to the present invention, the step of forming the conductive electrode on the heat resistant substrate by heat-treating the heat resistant substrate on which the circuit pattern is formed at a firing temperature may include the conductive metal powder of the conductive paste constituting the circuit pattern. The conductive electrode is formed by melting at this firing temperature and coalescing with each other to form an integral mass.
본 발명에 따른 연성인쇄회로기판 제조방법에서, 상기 내열기판의 일면에 도전성 페이스트로 회로패턴을 형성하는 단계는 상기 내열기판에 박리용 수지를 도포하는 단계 및 상기 내열기판에 도포된 상기 박리용 수지의 상부에 상기 도전성 페이스트로 회로패턴을 형성하는 단계를 포함한다.In the method of manufacturing a flexible printed circuit board according to the present invention, the step of forming a circuit pattern with a conductive paste on one surface of the heat resistant substrate may include applying a peeling resin to the heat resistant substrate and the peeling resin applied to the heat resistant substrate. Forming a circuit pattern on the upper portion of the conductive paste.
본 발명에 따른 연성인쇄회로기판 제조방법에서, 상기 박리용 수지는 상기 소성온도에서 타버리지 않는 무기질 분말 또는 상기 소성온도에서 연소되어 연소재를 형성하는 탄소재료 또는 탄화물이 수지에 혼합되어 형성된다.In the method of manufacturing a flexible printed circuit board according to the present invention, the peeling resin is formed by mixing an inorganic powder which does not burn at the firing temperature or a carbon material or carbide combusted at the firing temperature to form a combustion material in the resin.
본 발명에 따른 연성인쇄회로기판 제조방법에서, 상기 박리용 수지의 상기 무기질 분말은 상기 소성온도에서 타버리지 않는 안료가 포함된 물감, 페인트, 무기질 산화물 또는 광물을 포함한다.In the flexible printed circuit board manufacturing method according to the present invention, the inorganic powder of the peeling resin includes paints, paints, inorganic oxides or minerals containing pigments that do not burn at the firing temperature.
본 발명에 따른 연성인쇄회로기판 제조방법 및 그 연성인쇄회로기판에 의하면 박막이면서 전기전도성이 우수한 제품의 제조가 가능하며 제조방법이 간단하여 제품제조가 용이한 장점이 있다.According to the flexible printed circuit board manufacturing method and the flexible printed circuit board according to the present invention, it is possible to manufacture a product having a thin film and excellent electrical conductivity, and the manufacturing method is easy because the manufacturing method is simple.
또한 본 발명에 따른 연성인쇄회로기판은 경화 은 전극과는 달리 고온의 열처리 방법으로 전극재료인 전도성 금속의 소성온도까지 열처리를 할 수 있어서 고유한 각 전도성 금속의 이론 전도도까지 구현이 가능하며 열처리 조건에 따라 도전성 재료로 금, 은과 같은 귀금속 뿐만 아니라 비철금속인 구리, 니켈 등의 사용이 가능하다.In addition, unlike the cured silver electrode, the flexible printed circuit board according to the present invention can heat-treat up to the firing temperature of the conductive metal, which is an electrode material, by using a high-temperature heat treatment method, so that the theoretical conductivity of each unique conductive metal can be realized. As a conductive material, it is possible to use not only precious metals such as gold and silver, but also nonferrous metals such as copper and nickel.
또한 본 발명에 따른 연성인쇄회로기판은 회로패턴을 인쇄하는 방법에 있어서도 스크린인쇄, 옵셋인쇄, 그라비아 인쇄, 잉크젯 인쇄 등 모든 인쇄방법의 적용이 가능한 장점이 있다. In addition, the flexible printed circuit board according to the present invention has advantages in that all printing methods, such as screen printing, offset printing, gravure printing, and inkjet printing, can be applied to a method of printing a circuit pattern.
도 1은 본 발명의 실시예에 따른 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법에서 내열기판에 박리용 수지 및 전도성 전극재료가 도포된 상태를 도시한 개략적인 단면도이고,1 is a schematic cross-sectional view showing a state in which a peeling resin and a conductive electrode material are applied to a heat resistant substrate in a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention.
도 2는 본 발명의 실시예에 따른 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법의 공정을 순차적으로 나타낸 흐름도이고,2 is a flowchart sequentially illustrating a process of a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention.
도 3은 본 발명의 실시예에 따른 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법의 공정을 개략적으로 도시한 공정도이고,3 is a process diagram schematically showing a process of a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention.
도 4는 본 발명에 따른 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법에 의해 제조된 연성인쇄회로기판의 단면을 도시한 단면도이고,4 is a cross-sectional view illustrating a cross section of a flexible printed circuit board manufactured by a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to the present invention.
도 5는 본 발명의 실시예에 따른 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법에서 형성될 수 있는 전도성 전극의 회로패턴의 한 예를 도시한 평면도이다.5 is a plan view illustrating an example of a circuit pattern of a conductive electrode that may be formed in a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an exemplary embodiment of the present invention.
이하 첨부된 도면을 참조하여 본 발명의 바람직한 실시예에 따른 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법 및 그 연성인쇄회로기판의 구성에 대하여 상세히 설명한다.Hereinafter, a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate and a configuration of the flexible printed circuit board will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 실시예에 따른 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법에서 내열기판에 박리용 수지 및 도전성 페이스트가 도포된 상태를 도시한 개략적인 단면도이고, 도 2는 본 발명의 실시예에 따른 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법의 공정을 순차적으로 나타낸 흐름도이고, 도 3은 본 발명의 실시예에 따른 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법의 공정을 개략적으로 도시한 공정도이고, 도 4는 본 발명에 따른 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법에 따라 제조된 연성인쇄회로기판의 단면을 도시한 단면도이고, 도 5는 본 발명의 실시예에 따른 내열기판의 고온열처리를 통한 연성인쇄회로기판 제조방법에서 형성될 수 있는 회로패턴의 한 예를 도시한 평면도이다.1 is a schematic cross-sectional view showing a state in which a peeling resin and a conductive paste are applied to a heat resistant substrate in a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention, and FIG. 3 is a flowchart sequentially illustrating a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate, and FIG. 3 is a method of manufacturing a flexible printed circuit board through high temperature heat treatment of a heat resistant substrate according to an embodiment of the present invention. 4 is a cross-sectional view illustrating a cross section of a flexible printed circuit board manufactured according to a method of manufacturing a flexible printed circuit board through a high temperature heat treatment of a heat resistant substrate according to the present invention, and FIG. Plane showing an example of a circuit pattern that can be formed in a flexible printed circuit board manufacturing method through a high temperature heat treatment of the heat-resistant substrate according to an embodiment of the invention A.
도 1 내지 도 5에 도시된 바와 같이, 내열기판(10)으로써 섭씨 600도 이상의 고온의 열처리를 견딜 수 있고 회로패턴의 인쇄가 가능한 평평한 면을 구비한 것을 준비한다(S1). 내열기판(10)의 종류는 알루미나를 포함하는 세라믹기판, 통상의 세라믹재질의 기판, 내열강화유리재질의 기판, 고온의 열처리 온도를 견디는 금속기판이 사용될 수 있고 금속기판의 재질로는 후술할 도전성 페이스트의 주성분인 도전성 금속의 소성온도보다 높은 소성온도를 가지는 금속들이 금속기판의 재질로 사용될 수 있다. 금속기판은 철은 물론이고 스테인레스를 포함하는 비철금속들로 형성될 수 있다.1 to 5, the heat resistant substrate 10 is prepared with a flat surface capable of withstanding high temperature heat treatment of 600 degrees Celsius or more and capable of printing a circuit pattern (S1). The heat-resistant substrate 10 may be a ceramic substrate including alumina, a substrate made of a common ceramic material, a substrate made of heat-resistant tempered glass, a metal substrate that can withstand high temperature heat treatment temperatures, and a conductive material which will be described later. Metals having a firing temperature higher than that of the conductive metal, which is the main component of the paste, may be used as the material of the metal substrate. The metal substrate may be formed of non-ferrous metals including stainless as well as iron.
내열기판(10)의 상부에 박리용 수지(20)를 도포한다(S2). Peeling resin 20 is applied to the upper portion of the heat-resistant substrate 10 (S2).
박리용 수지(20)는 예를 들면 무기질 분말(광물, 안료 등 포함), 탄소재료 또는 탄화물과 같은 박리물질(21)을 수지(천연수지 또는 합성수지)에 골고루 혼합한 것을 사용한다. 박리물질(21)은 본 발명에 따른 연성인쇄회로기판의 제조방법에서 전도성 전극(31)을 연성필름(40)에 전사하는 과정에서 전도성 전극(31)이 내열기판(10)에서 박리되는데 중요한 역할을 하는 물질을 지칭한 것이다.As the peeling resin 20, for example, an inorganic powder (including minerals, pigments, etc.), a carbonaceous material or a peeling material 21 such as carbide is used evenly mixed with a resin (natural resin or synthetic resin). The peeling material 21 plays an important role in peeling the conductive electrode 31 from the heat resistant substrate 10 in the process of transferring the conductive electrode 31 to the flexible film 40 in the method of manufacturing the flexible printed circuit board according to the present invention. It refers to a substance that makes.
박리용 수지(20)에 사용되는 수지는 도포가 가능하고 일정 온도 이상의 열에 의해 분해되는 형태의 것은 어느 것이나 사용이 가능하며 예를 들면 액상의 에폭시 수지 등을 포함하는 열 분해성 수지들이 사용될 수 있고 도포가 가능한 열 분해성 수지들은 공지된 것이므로 구체적인 설명은 생략한다.The resin used for the peeling resin 20 can be applied and can be used in any form that is decomposed by heat above a predetermined temperature. For example, thermally decomposable resins including a liquid epoxy resin can be used and applied. Possible thermally decomposable resins are well known and thus detailed descriptions thereof will be omitted.
박리용 수지(20)에 포함되는 박리물질(21)로 사용될 수 있는 무기질 분말은 안료를 전색제로 사용하는 유성, 수성, 에나멜 페인트 또는 안료를 매제 등에 균일하게 혼합한 페이스트 상태의 물감 등이 사용될 수 있다. 박리용 수지(20)에 포함된 액체 또는 수지는 소성온도로 가열하는 과정에서 날아가 버리거나 연소되어 버리고 무기질 분말이 전도성 전극(31)과 내열기판(10)의 사이에 남게되어 전도성 전극(31)과 내열기판(10)의 사이의 부착을 방지함으로써 이후 연성필름(40)에 전도성 전극(31)을 전사하는 공정에서 전도성 전극(31)이 내열기판(10)으로부터 분리되는 것을 가능하게 한다. 따라서 무기질 분말은 넓은 범위의 무기재료, 무기질 산화물, 광물(mineral), 세라믹분말 등을 포함하여 전도성 전극(31)을 형성하는 전극재료(전도성 금속)의 소성온도에서 타버리거나 소실되지 않는 다양한 무기재료가 포함될 수 있다.The inorganic powder which may be used as the peeling material 21 included in the peeling resin 20 may be an oily, aqueous, enamel paint using a pigment as a colorant, or a paint in the form of a paste in which the pigment is uniformly mixed into a medium or the like. have. The liquid or resin contained in the peeling resin 20 is blown away or burned in the process of heating to the firing temperature, and the inorganic powder remains between the conductive electrode 31 and the heat-resistant substrate 10 so that the conductive electrode 31 and By preventing adhesion between the heat resistant substrates 10, the conductive electrodes 31 may be separated from the heat resistant substrates 10 in the process of transferring the conductive electrodes 31 to the flexible film 40. Therefore, the inorganic powder may not be burned or lost at the firing temperature of the electrode material (conductive metal) forming the conductive electrode 31, including a wide range of inorganic materials, inorganic oxides, minerals, ceramic powders, and the like. May be included.
또한 박리용 수지(20)에 포함되는 박리물질(21)로는 무기질 분말을 대신하여 탄소재료 또는 탄화물이 사용될 수 있다. 탄소재료 또는 탄화물은 후술할 열처리 과정에서 고온에 의해 연소된 후 연소되어 생성된 연소재가 전극재료와 내열기판의 사이에 남게되어 전극재료와 내열기판의 사이의 간격을 띄워서 전도성 전극(31)이 내열기판(10)에서 분리되는 것을 가능하게 한다. 이러한 탄소재료는 예를 들면 흑연(그라파이트) 등이 있으며 탄화물은 예를 들면 탄화칼슘 등이 있고, 이외에도 연소재를 생성하여 전도성 전극과 내열기판의 박리를 가능하게 하는 다양한 탄소재료, 탄화물이 사용될 수 있다. In addition, as the peeling material 21 included in the peeling resin 20, a carbon material or a carbide may be used in place of the inorganic powder. The carbon material or carbide is burned by the high temperature in the heat treatment process to be described later, and then the combustion material generated is left between the electrode material and the heat-resistant substrate to space the gap between the electrode material and the heat-resistant substrate so that the conductive electrode 31 is heat-resistant. It is possible to separate from the substrate 10. Such carbon materials include, for example, graphite (graphite), and carbides, for example, calcium carbide, and the like. In addition, various carbon materials and carbides, which generate a combustion material and enable separation of the conductive electrode and the heat-resistant substrate, may be used. have.
박리용 수지(20)를 도포하는 방법은 저점도 스프레이방법, 붓칠방법, 그라비아인쇄, 옵셋인쇄, 잉크젯인쇄, 고점도실크스크린, 고체파우더 도장방법 분체도장 및 레이저프린터 등의 방법을 사용할 수 있다.The method of applying the peeling resin 20 may be a method such as low viscosity spray method, brushing method, gravure printing, offset printing, inkjet printing, high viscosity silk screen, solid powder coating method, powder coating, laser printer or the like.
내열기판(10)에 도포된 박리용 수지(20)의 상부에 전도성 전극재료가 포함된 도전성 페이스트를 이용하여 인쇄회로패턴(30)을 형성한다(S3). 도전성 페이스트는 전기전도도가 우수한 전극재료인 전도성 금속의 분말을 회로패턴 인쇄를 하기 위해 페이스트(paste)형태로 형성한 것으로 공지된 것이므로 구체적인 설명은 생략한다. 도전성 페이스트에 사용되는 전극재료는 금, 은을 포함하는 귀금속재료는 물론이고 구리, 니켈을 포함하는 다양한 금속재료들이 사용될 수 있다.The printed circuit pattern 30 is formed using a conductive paste containing a conductive electrode material on the peeling resin 20 coated on the heat resistant substrate 10 (S3). Since the conductive paste is known to be formed in the form of a paste for printing a circuit pattern of the conductive metal powder, which is an electrode material having excellent electrical conductivity, a detailed description thereof will be omitted. As the electrode material used for the conductive paste, various metal materials including copper and nickel as well as precious metal materials including gold and silver can be used.
도전성 페이스트로 인쇄회로패턴(30)을 형성하는 방법은 스크린인쇄, 옵셋인쇄, 그라비아 인쇄, 잉크젯 인쇄 등이 사용될 수 있다. As a method of forming the printed circuit pattern 30 from the conductive paste, screen printing, offset printing, gravure printing, inkjet printing, or the like may be used.
도전성 페이스트로 인쇄회로패턴(30)이 형성된 내열기판(10)을 도전성 페이스트의 전극재료의 소성온도까지 열처리를 수행한다(S4). 도전성 페이스트의 전극재료는 앞서 설명한 바와 같이 다양한 재료가 사용될 수 있으며 전극재료마다 소성온도가 다르므로 사용된 전극재료의 소성온도까지 열처리를 수행한다. 소성 열처리시의 주변 분위기는 전극재료가 산화하면 전도성 도체로서의 기능을 상실하게 되므로 전극재료의 산화를 방지하기 위해 소성 열처리시의 주변 분위기를 진공으로 하거나 비활성가스 분위기에서 수행하는 것이 바람직하다. 소성 열처리시의 주변분위기는 전극재료가 금, 은 등과 같이 귀금속인 경우에서는 대기중에서도 가능하지만, 전극재료가 구리, 니켈 등과 같은 비철금속인 경우에는 고온에서 산화가 진행되어 전도성 도체로서의 기능을 상실하게 되므로 산화를 방지하기 위해 반드시 소성 열처리시의 주변 분위기를 진공으로 하거나 비활성가스 분위기에서 수행한다.The heat resistant substrate 10 having the printed circuit pattern 30 formed of the conductive paste is heat-treated to a firing temperature of the electrode material of the conductive paste (S4). As the electrode material of the conductive paste, a variety of materials may be used as described above. Since the firing temperature is different for each electrode material, heat treatment is performed to the firing temperature of the used electrode material. The ambient atmosphere during the calcining heat treatment loses its function as a conductive conductor when the electrode material is oxidized. Therefore, the surrounding atmosphere during the calcining heat treatment is preferably performed in a vacuum or in an inert gas atmosphere to prevent oxidation of the electrode material. The ambient atmosphere during plastic heat treatment is possible even in the air when the electrode material is a precious metal such as gold or silver, but when the electrode material is a non-ferrous metal such as copper or nickel, oxidation occurs at high temperature and thus loses its function as a conductive conductor. In order to prevent oxidation, the surrounding atmosphere during the calcining heat treatment must be performed under vacuum or in an inert gas atmosphere.
위 소성온도까지의 열처리 공정에 의해 전도성 페이스트에 포함된 분말형태의 전극재료는 고열에 의해 전극재료분말이 융해되어 상호간에 합체됨으로써 덩어리를 형성하고 전도성 페이스트에 포함된 수분과 수지는 소성온도로 열처리하는 과정에서 증발되거나 연소되어 날아가 버린다. 즉 소성온도까지의 열처리 공정에 의해 전도성 페이스트에 포함된 전극재료분말은 융해되어 상호간에 합체됨으로써 전극재료덩어리로 구조가 변화되는 것이다. 이렇게 전도성 페이스트에 포함된 분말상태의 전극재료가 서로 분리된 구조인 분말상태에서 소성온도까지의 열처리를 통해 덩어리(bulk)상태로 변화되기 때문에 전도성 전극(31)의 전기전도도가 현저히 향상되는 것이다.The electrode material in the form of powder contained in the conductive paste by the heat treatment process up to the above firing temperature is melted and coalesced with each other by high temperature to form agglomerates, and the moisture and resin contained in the conductive paste are heat treated at the firing temperature. In the process of evaporation or combustion is blown away. That is, the electrode material powder contained in the conductive paste is melted and coalesced with each other by the heat treatment process up to the firing temperature, thereby changing the structure of the electrode material mass. Thus, the electrical conductivity of the conductive electrode 31 is remarkably improved since the powdered electrode materials contained in the conductive paste are changed into a bulk state through the heat treatment to the firing temperature in the powder state, which is separated from each other.
또한 열처리의 과정(소성과정)에서 박리용 수지(20)에 포함되어 있던 액체 또는 수지는 소성온도로 가열하는 과정에서 증발되어 날아가 버리거나 연소되어 버리기 때문에 최후에는 전도성 전극(31)과 내열기판(10)의 사이에는 박리용 수지(20)에 포함된 무기질 분말 또는 탄소재료나 탄화물의 연소재와 같은 박리물질(21)만이 남게된다. 이렇게 박리용 수지(20)중의 무기질 분말 또는 탄소재료나 탄화물의 연소재와 같은 박리물질(21)이 전도성 전극(31)과 내열기판(10)의 사이에 위치하기 때문에 전도성 전극(31)과 내열기판(10)의 상호간의 부착이 방지되고 그 결과 전도성 전극의 전사과정에서 전도성 전극(31)이 내열기판(10)으로부터 분리되는 것을 가능하게 한다. 만약 박리용 수지(20)에 무기질 분말 또는 탄소재료나 탄화물과 같은 박리물질(21)이 포함되어 있지 않다면 내열기판(10)의 소성과정에서 도전성 페이스트의 전극재료가 용융되어 그대로 내열기판(10)에 부착되어 버리기 때문에 내열기판(10)으로부터 전도성 전극(31)을 분리하기가 어렵고 따라서 이후 전도성 전극(31)을 연성필름(40)으로 전사시킬 수 없게 된다.In addition, the liquid or resin contained in the exfoliation resin 20 in the heat treatment process (firing process) is evaporated and blown away or burned in the heating process at the firing temperature, so that the conductive electrode 31 and the heat-resistant substrate 10 ), Only the peeling material 21 such as the inorganic powder contained in the peeling resin 20 or the combustion material of the carbon material or carbide remains. Thus, since the peeling material 21, such as the inorganic powder in the peeling resin 20 or the combustion material of carbon material or carbide, is located between the conductive electrode 31 and the heat resistant substrate 10, the conductive electrode 31 and the heat resistant member Attachment of the substrates 10 to each other is prevented, and as a result, the conductive electrodes 31 can be separated from the heat-resistant substrate 10 during the transfer of the conductive electrodes. If the peeling resin 20 does not contain the inorganic powder or the peeling material 21 such as carbon material or carbide, the electrode material of the conductive paste is melted in the firing process of the heat resistant substrate 10 and the heat resistant substrate 10 is left as it is. Since it is difficult to separate the conductive electrode 31 from the heat-resistant substrate 10, the conductive electrode 31 cannot be transferred to the flexible film 40 afterwards.
열처리가 완료된 내열기판(10)의 상부의 전도성 전극(31)을 접착제가 도포된 연성필름(40)에 접촉시켰다가 내열기판(10)과 연성필름(40)을 분리시키면 내열기판(10)의 박리물질(21)의 위에 적층된 전도성 전극(31)이 내열기판(10)으로부터 분리되어 연성필름(40)으로 전사된다(S5). 이로써 연성필름(40)에 전도성 전극(31)이 전사되어 형성된 연성인쇄회로기판이 완성된다. When the conductive electrode 31 on the upper portion of the heat-resistant substrate 10 has been heat-treated, is brought into contact with the flexible film 40 coated with an adhesive, and the heat-resistant substrate 10 and the flexible film 40 are separated, the heat-resistant substrate 10 The conductive electrode 31 stacked on the peeling material 21 is separated from the heat resistant substrate 10 and transferred to the flexible film 40 (S5). As a result, the flexible printed circuit board formed by transferring the conductive electrode 31 to the flexible film 40 is completed.
내열기판(10)의 상부의 전도성 전극(31)을 접착제가 도포된 연성필름(40)에 접촉하여 전사시키는 방법은 간단한 접촉만으로도 인쇄회로패턴(30)의 전사가 가능하기 때문에 롤 사이를 통과하는 롤러방식 또는 압착 프레스에 의한 방식 등 다양한 방법이 사용될 수 있다.The method of transferring the conductive electrode 31 on the upper portion of the heat-resistant substrate 10 by contacting the flexible film 40 coated with the adhesive may be performed by transferring the printed circuit pattern 30 with a simple contact. Various methods can be used, such as a roller method or a compression press method.
연성필름(40)은 특정한 재질로 한정되지 않으며 현재의 F-PCB에 사용되는 PI필름은 물론 가격이 저렴한 PET 필름이 사용될 수 있으며 이외에도 핸드폰용 PS수지등 모든 합성수지 필름이 사용될 수 있다. 연성필름(40)은 종이재질도 가능하며 임의의 물체가 될 수도 있다. 연성필름(40)에 전사를 위해 도포되는 접착제는 용제계 접착제, 수용성 접착제를 포함하여 모든 용도의 접착제가 사용될 수 있으며 수성, 고체풀 및 포스트 잇용 접착제도 사용이 가능하다.The flexible film 40 is not limited to a specific material, as well as the PI film used in the current F-PCB, inexpensive PET film may be used, and in addition, all synthetic resin films such as PS resin for mobile phones may be used. The flexible film 40 may be a paper material or may be any object. The adhesive applied for the transfer to the flexible film 40 may be used for all applications including solvent-based adhesives and water-soluble adhesives, and adhesives for aqueous, solid paste and post-it may also be used.
위와 같은 본 발명에 따른 제조방법에 의해 제조된 연성인쇄회로기판은 연성필름(40)의 위에 접착제의 층(미도시)이 위치하고 접착제의 층의 위에 도전성 페이스트에 의해 형성된 인쇄회로패턴(30)이 소성온도까지 열처리되어 형성된 전도성 전극(31)이 적층되며, 전도성 전극(31)의 상부면에는 박리용 수지(20)가 소성온도로 열처리되어 형성된 무기질 분말 또는 탄소재료나 탄화물이 연소되어 생성된 연소재와 같은 박리물질(21)이 형성되어 있다.In the flexible printed circuit board manufactured by the manufacturing method according to the present invention as described above, a layer of an adhesive (not shown) is placed on the flexible film 40 and the printed circuit pattern 30 formed by the conductive paste is formed on the layer of the adhesive. The conductive electrode 31 formed by heat treatment to a firing temperature is stacked, and the upper surface of the conductive electrode 31 is formed by burning inorganic powder or carbon material or carbide formed by the heat-removing resin 20 at a firing temperature. A peeling material 21 like the raw material is formed.
상기한 본 발명의 바람직한 실시예에서 섭씨 600도 이상의 고온에서 내열기판을 연성회로 기판을 제조하는 방법을 예를 들었으나 본 발명은 전도성 전극재료인 도전성 페이스트에 포함된 금속분말들을 소성온도에서 열처리 하여 금속분말들이 융해된 후 벌크를 형성하도록 하는 것을 특징으로 하는 것이므로 반드시 섭씨 600도 이상의 온도로 본 발명이 제한되는 것은 아니며 전도성 전극재료의 종류에 따라 섭씨 600도 이하의 범위에서 열처리를 수행하도록 하는 것을 당연히 포함한다.In the above-described preferred embodiment of the present invention, a method of manufacturing a flexible circuit board using a heat-resistant substrate at a high temperature of 600 degrees Celsius or more has been exemplified. However, the present invention heat-treats the metal powder contained in the conductive paste as a conductive electrode material at a firing temperature. Since the metal powder is melted to form a bulk, the present invention is not necessarily limited to a temperature of 600 degrees Celsius or more, and to perform heat treatment in a range of 600 degrees Celsius or less depending on the type of conductive electrode material. Of course it includes.
전도성 전극재료로 사용되는 금속들의 입자가 나노 수준으로 작아지면 금속 고유의 녹는점보다 낮은 온도에서 금속이 녹는다. 즉 금속 고유의 녹는점보다 실제 녹는점이 낮아지는 효과를 가져온다. 따라서 전도성 전극재료의 금속으로서 나노화된 입자를 사용하면 고유 소성온도보다 낮은 온도에서도 동일한 벌크화를 형성하는 것이 가능하여 전기 전도도가 좋은 전극을 만들 수 있다.When the particles of metals used as conductive electrode materials are reduced to nanoscale, the metal melts at a temperature lower than the intrinsic melting point of the metal. That is, the actual melting point is lower than the melting point inherent to the metal. Therefore, using the nanonized particles as the metal of the conductive electrode material, it is possible to form the same bulk at a temperature lower than the intrinsic firing temperature, thereby making it possible to make an electrode having good electrical conductivity.
적절한 금속의 입경은 10나노미터 이하가 되면 페이스트화가 어렵고 또한 입자간 베리어효과 때문에 저항이 올라간다. 따라서 전극재료로서 금속의 입자크기는 50~100나노미터 정도가 적절하다. 예를 들면 전도성 은 전극을 형성하는 은 분말은 입경이 최대 100나노미터 이하의 입경을 갖는 은 나노 분말을 사용하면 은 나노 분말은 섭씨 600도 이하의 낮은 열처리 온도에서 은 벌크화가 가능하여 우수한 전기 전도도를 갖는다.When the suitable metal grain size is less than 10 nanometers, it becomes difficult to paste and the resistance increases due to the interparticle barrier effect. Therefore, the particle size of the metal is preferably about 50 to 100 nanometers as the electrode material. For example, the silver powder forming the conductive silver electrode may be silver bulked at a low heat treatment temperature of 600 degrees Celsius or less when the silver nanopowder having a particle diameter of up to 100 nanometers is used. Has
또한 구리 등과 같은 비철금속은 소성온도까지 열처리할 때에 산화가 일어날 수 있으므로 이를 방지하기 위해 환원분위기에서 소성 열처리를 수행해야 한다.In addition, since non-ferrous metals such as copper may be oxidized when heat treated to a firing temperature, plastic heat treatment should be performed in a reducing atmosphere.
상기한 본 발명의 바람직한 실시예는 예시의 목적을 위해 개시된 것이고, 본 발명에 대해 통상의 지식을 가진 당업자라면, 본 발명의 사상과 범위 안에서 다양한 수정, 변경 및 부가가 가능할 것이며, 이러한 수정, 변경 및 부가는 본 발명의 특허청구 범위에 속하는 것으로 보아야 할 것이다.Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and those skilled in the art will be able to make various modifications, changes and additions within the spirit and scope of the present invention. And additions should be considered to be within the scope of the claims of the present invention.
본 발명은 연성회로기판의 제조에 사용된다.The present invention is used in the manufacture of flexible circuit boards.

Claims (8)

  1. 소정의 면적을 가지며 굽힘이 가능한 연성필름;A flexible film having a predetermined area and capable of bending;
    상기 연성필름의 일면의 적어도 일부에 도포된 접착제; 및An adhesive applied to at least a portion of one surface of the flexible film; And
    도전성 페이스트가 소성온도까지 열처리되어 형성된 것으로서 상기 접착제를 매개로 상기 연성필름의 상부에 부착된 전도성 전극을 포함하는 것을 특징으로 하는 고온열처리에 의한 전도성전극이 형성된 연성회로기판.A conductive circuit board having a conductive electrode formed by high temperature heat treatment, wherein the conductive paste is formed by heat treatment to a firing temperature and includes a conductive electrode attached to an upper portion of the flexible film through the adhesive.
  2. 제1항에 있어서,The method of claim 1,
    상기 전도성 전극의 상부면에는 무기질 분말, 탄소재료 또는 탄화물이 수지에 혼합된 박리용 수지가 연소되어 생성된 연소재가 더 적층된 것을 특징으로 하는 고온열처리에 의한 전도성 전극이 형성된 연성회로기판.The conductive circuit board with a conductive electrode formed by high temperature heat treatment, characterized in that the upper surface of the conductive electrode is further laminated with a combustion material produced by burning the peeling resin mixed with the inorganic powder, carbon material or carbide to the resin.
  3. 제1항에 있어서,The method of claim 1,
    상기 전도성 전극은 무기질 분말, 탄소재료 또는 탄화물이 수지에 혼합되어 형성된 박리용 수지를 사이에 두고 내열기판에 적층된 상기 도전성 페이스트를 소성온도까지 열처리하는 것에 의해 형성되며,The conductive electrode is formed by heat-treating the conductive paste laminated on a heat-resistant substrate with a peeling resin formed by mixing inorganic powder, carbon material or carbide with resin to a firing temperature,
    상기 내열기판의 위에 적층된 상기 도전성 페이스트를 소성온도까지 열처리하여 형성된 상기 전도성 전극을 상기 접착제가 도포된 상기 연성필름과 접촉시킴으로써 상기 연성필름에 상기 전도성 전극이 전사되는 것을 특징으로 하는 고온열처리에 의한 전도성 전극이 형성된 연성회로기판.The conductive electrode formed by heat-treating the conductive paste laminated on the heat-resistant substrate to a firing temperature is brought into contact with the flexible film coated with the adhesive, thereby transferring the conductive electrode to the flexible film. Flexible circuit board with conductive electrodes formed.
  4. 내열기판의 일면에 도전성 페이스트로 회로패턴을 형성하는 단계;Forming a circuit pattern on one surface of the heat resistant substrate using a conductive paste;
    상기 회로패턴이 형성된 상기 내열기판을 소성온도까지 열처리하여 상기 내열기판에 전도성 전극을 형성하는 단계; 및Forming a conductive electrode on the heat resistant substrate by heat-treating the heat resistant substrate on which the circuit pattern is formed to a firing temperature; And
    상기 열처리에 의해 상기 내열기판의 일면에 형성된 상기 전도성 전극에 접착제가 도포된 연성필름을 접촉하여 상기 연성필름에 상기 전도성 전극을 전사시키는 단계를 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조방법.And transferring the conductive electrode to the flexible film by contacting the flexible film coated with an adhesive to the conductive electrode formed on one surface of the heat resistant substrate by the heat treatment.
  5. 제4항에 있어서,The method of claim 4, wherein
    상기 회로패턴이 형성된 상기 내열기판을 소성온도까지 열처리하여 상기 내열기판에 전도성 전극을 형성하는 단계는Heat-treating the heat resistant substrate on which the circuit pattern is formed to a firing temperature to form a conductive electrode on the heat resistant substrate;
    상기 회로패턴을 구성하는 상기 도전성 페이스트의 전도성 금속 분말이 소성온도에서 융해(melting)되어 서로 합체됨으로써 일체의 덩어리를 형성하는 것에 의해 상기 전도성 전극이 형성되는 것을 특징으로 하는 연성인쇄회로기판 제조방법.And the conductive electrode is formed by melting the conductive metal powder of the conductive paste constituting the circuit pattern at a firing temperature and coalescing with each other to form an integrated mass.
  6. 제4항에 있어서,The method of claim 4, wherein
    상기 내열기판의 일면에 도전성 페이스트로 회로패턴을 형성하는 단계는,Forming a circuit pattern with a conductive paste on one surface of the heat resistant substrate,
    상기 내열기판에 박리용 수지를 도포하는 단계; 및 Applying a peeling resin to the heat resistant substrate; And
    상기 내열기판에 도포된 상기 박리용 수지의 상부에 상기 도전성 페이스트로 회로패턴을 형성하는 단계를 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조방법.And forming a circuit pattern with the conductive paste on top of the peeling resin applied to the heat resistant substrate.
  7. 제6항에 있어서,The method of claim 6,
    상기 박리용 수지는 상기 소성온도에서 타버리지 않는 무기질 분말 또는 상기 소성온도에서 연소되어 재를 형성하는 탄소재료 또는 탄화물이 수지에 혼합되어 형성되는 것을 특징으로 하는 연성인쇄회로기판 제조방법.The peeling resin is a flexible printed circuit board manufacturing method, characterized in that the inorganic powder which does not burn at the firing temperature or carbon material or carbide which is burned at the firing temperature to form ashes are mixed with the resin.
  8. 제7항에 있어서,The method of claim 7, wherein
    상기 무기질 분말은 상기 소성온도에서 타버리지 않는 안료가 포함된 물감, 페인트, 무기질 산화물 또는 광물을 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조방법.The inorganic powder is a flexible printed circuit board manufacturing method comprising a paint, an inorganic oxide or a mineral containing a pigment that does not burn at the firing temperature.
PCT/KR2013/009321 2013-10-15 2013-10-18 Method for manufacturing flexible printed circuit board through high-temperature heat treatment on heat-resistant substrate and flexible printed circuit board thereof WO2015056825A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020130122528A KR101404681B1 (en) 2012-10-23 2013-10-15 Flexible PCB manufacturing method using high temperature heat treatment and the Flexible PCB thereof
KR1020130122584A KR101545607B1 (en) 2012-10-23 2013-10-15 Flexible PCB manufacturing method using heat treatment of silver nano powder and the Flexible PCB thereof
KR10-2013-0122584 2013-10-15
KR10-2013-0122528 2013-10-15

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001210933A (en) * 1999-11-18 2001-08-03 Japan Aviation Electronics Industry Ltd Method of forming conductor pattern, wiring member manufactured thereby, connector, flexible printed wiring board, and anisotropic conductive member
JP2004247572A (en) * 2003-02-14 2004-09-02 Harima Chem Inc Method for forming fine wiring pattern
JP2006100371A (en) * 2004-09-28 2006-04-13 Matsushita Electric Ind Co Ltd Wiring board, electric apparatus using the same and its manufacturing method
KR100918863B1 (en) * 2006-07-05 2009-09-28 가부시키가이샤 히타치세이사쿠쇼 Apparatus and method for forming conductive pattern on substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001210933A (en) * 1999-11-18 2001-08-03 Japan Aviation Electronics Industry Ltd Method of forming conductor pattern, wiring member manufactured thereby, connector, flexible printed wiring board, and anisotropic conductive member
JP2004247572A (en) * 2003-02-14 2004-09-02 Harima Chem Inc Method for forming fine wiring pattern
JP2006100371A (en) * 2004-09-28 2006-04-13 Matsushita Electric Ind Co Ltd Wiring board, electric apparatus using the same and its manufacturing method
KR100918863B1 (en) * 2006-07-05 2009-09-28 가부시키가이샤 히타치세이사쿠쇼 Apparatus and method for forming conductive pattern on substrate

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