WO2015056653A1 - ペリクル、ペリクル付フォトマスク及び半導体素子の製造方法 - Google Patents
ペリクル、ペリクル付フォトマスク及び半導体素子の製造方法 Download PDFInfo
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- WO2015056653A1 WO2015056653A1 PCT/JP2014/077251 JP2014077251W WO2015056653A1 WO 2015056653 A1 WO2015056653 A1 WO 2015056653A1 JP 2014077251 W JP2014077251 W JP 2014077251W WO 2015056653 A1 WO2015056653 A1 WO 2015056653A1
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- pellicle
- polymer
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- mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
Definitions
- the present invention relates to a pellicle for photolithography used for preventing foreign matter from adhering to a mask (photomask) when manufacturing a semiconductor device such as an LSI or VLSI semiconductor device or a liquid crystal display panel. .
- a semiconductor manufacturing apparatus such as a stepper (reduced projection exposure apparatus) is used to form a photoresist pattern corresponding to an integrated circuit on a wafer.
- the pellicle is formed by stretching a transparent thin film on one end surface of a pellicle frame having a frame shape, and prevents foreign matter from directly adhering to the mask and forming a circuit pattern defect. Specifically, even if foreign matter adheres to the pellicle in the photolithography process, the foreign matter does not form an image on the wafer coated with the photoresist. As a result, it is possible to prevent a short circuit and disconnection of the semiconductor integrated circuit due to a circuit pattern defect caused by an image of a foreign substance, and to improve the manufacturing yield of the photolithography process.
- the pressure-sensitive adhesive stably has an appropriate adhesive force, and when the pellicle is replaced, the pressure-sensitive adhesive aggregates and breaks when the pellicle is peeled off from the mask, and a part of the pressure-sensitive adhesive remains attached to the mask. It is desired to prevent this phenomenon (hereinafter, this phenomenon is referred to as adhesive residue).
- this phenomenon is referred to as adhesive residue.
- the adhesive described in Patent Document 1 becomes easier to bond to the mask due to decomposition of the adhesive due to leakage light, and when the pellicle is peeled from the mask. The adhesive residue on the mask surface is likely to occur.
- an object of the present invention is to provide a pellicle, a photomask with a pellicle, and a method for manufacturing a semiconductor element that can sufficiently prevent adhesive residue when the pellicle is peeled from the mask.
- the present invention provides the following (1) to (11).
- a pellicle frame A pellicle film stretched on one end surface of the pellicle frame; A non-crosslinked acrylic adhesive attached to the other end surface of the pellicle frame, A pellicle in which the content of a compound having a weight average molecular weight of 800 or less in the adhesive is 18% by mass or less.
- elastic modulus of the non-cross-linked acrylic adhesive 20 mN / mm 2 or more and 180mN / mm 2 or less, pellicle according to (1).
- the non-crosslinked acrylic pressure-sensitive adhesive contains an acrylic polymer (A) and an acrylic base polymer (B).
- the glass transition temperature of the acrylic polymer (A) is ⁇ 30 ° C. or lower
- the acrylic polymer (A) is a polymer or copolymer of an alkyl (meth) acrylate having an alkyl group having 1 to 14 carbon atoms, according to any one of (4) to (6) Pellicle.
- the block polymer has a structure represented by the following general formula (I) in the polymer main chain, In formula (I), (a1) and (a2) each represents a polymer having a glass transition temperature of 80 ° C. or higher, and (b) represents a polymer having a glass transition temperature of 30 ° C. or lower.
- (a1) and (a2) in the general formula (I) are each mainly composed of a methacrylic acid alkyl ester having 1 to 14 carbon atoms
- the weight average molecular weight of the acrylic polymer (A) is from 850 to 70000
- the pellicle according to any one of (4) to (10), wherein the acrylic base polymer (B) has a weight average molecular weight of 10,000 to 500,000.
- a photomask with a pellicle to which the pellicle according to any one of (1) to (11) is mounted.
- a method for manufacturing a semiconductor element comprising a step of exposing a substrate with the photomask with pellicle according to (12).
- adhesive residue when the pellicle is peeled from the mask can be sufficiently prevented.
- FIG. 1 is a perspective view showing a pellicle according to an embodiment of the present invention.
- FIG. 2 is a sectional view taken along line II-II in FIG. It is a figure which shows typically the process of exposing a board
- the present embodiment a mode for carrying out the present invention (hereinafter simply referred to as “the present embodiment”) will be described in detail.
- the following embodiments are examples for explaining the present invention, and are not intended to limit the present invention to the following contents.
- the present invention can be implemented with appropriate modifications within the scope of the gist thereof.
- FIG. 1 is a perspective view showing a pellicle according to this embodiment
- FIG. 2 is a cross-sectional view taken along line II-II in FIG.
- the pellicle 1 includes a pellicle frame 2, a pellicle film 3 stretched on one end surface 2e of the pellicle frame 2, and an adhesive 10 attached to the other end surface 2f of the pellicle frame 2.
- the protective film F is adhered to the adhesive 10 and protects the adhesive 10.
- FIG. 3 is a diagram schematically showing a step of exposing the substrate with the photomask with pellicle according to the present embodiment. As shown in FIG.
- the pellicle-equipped photomask 30 of this embodiment includes a pellicle 1 and a photomask 20.
- the other end surface 2f of the pellicle 1 is attached to the end surface 20f on the side where the pattern 20P of the photomask 20 is formed via the adhesive 10.
- the exposure light 40 is irradiated onto the photomask with pellicle 30 from above the photomask with pellicle 30.
- the exposure light 40 is collected by, for example, a light projecting optical system 50 and irradiated onto a substrate 60 on which a photoresist 62 is provided.
- the pattern 20P of the photomask 20 is transferred to the surface of the substrate 60 through predetermined processes such as a development process and an etching process.
- the substrate 60 is made of, for example, a semiconductor material.
- the process of transferring the pattern 20P of the photomask 20 onto the surface of the substrate 60 using the photomask 30 with pellicle as described above is, for example, a part of the manufacturing process of the semiconductor element.
- the pressure-sensitive adhesive (acrylic pressure-sensitive adhesive) used for the pellicle according to this embodiment is a non-crosslinked acrylic pressure-sensitive adhesive material, and the content ratio of the compound having a weight average molecular weight of 800 or less in the acrylic pressure-sensitive adhesive is 18% by mass or less. It is.
- non-crosslinked type as used herein includes a case where a reaction product with a curing material is included as long as the effect of the present invention is achieved.
- the glass transition temperature of the acrylic pressure-sensitive adhesive of this embodiment is preferably less than ⁇ 25 ° C., more preferably ⁇ 27 ° C. or less, and further preferably ⁇ 30 ° C. or less.
- the acrylic pressure-sensitive adhesive of the present embodiment has a plurality of glass transition temperatures, at least one of the plurality of glass transition temperatures may be in this range.
- the glass transition temperature is within the above-described range, the elastic modulus is low and the pressure-sensitive adhesive is used, so that the effect of reducing mask distortion described later can be more effectively exhibited.
- the lower limit of the glass transition temperature of the acrylic pressure-sensitive adhesive of this embodiment is not particularly limited, but is preferably ⁇ 90 ° C. or higher from the viewpoint of ease of handling and moldability of the mask pressure-sensitive adhesive.
- the elastic modulus of the acrylic pressure-sensitive adhesive of the present embodiment is preferably 20 mN / mm 2 or more 180mN / mm 2 or less. When the elastic modulus is within the above range, the pellicle can be prevented from shifting from the mask while maintaining softness, and the load applied to the mask can be reduced. Distortion can be reduced. Modulus of the acrylic pressure-sensitive adhesive of the present embodiment, further preferably 30 mN / mm 2 or more 160mN / mm 2 or less, and more preferably 40 mN / mm 2 or more 140mN / mm 2 or less.
- the elastic modulus of the pressure-sensitive adhesive can be adjusted in consideration of the elastic modulus of the raw material polymer used for the pressure-sensitive adhesive and the compatibility thereof when a plurality of raw material polymers are used.
- the acrylic pressure-sensitive adhesive used for the pellicle according to the present embodiment preferably contains an acrylic polymer (A) and an acrylic base polymer (B) from the viewpoint of giving good elastic adhesiveness.
- the weight average molecular weights of the above compounds and the like are values obtained by GPC (gel permeation chromatography) measurement.
- a compound having a weight average molecular weight of 800 or less is used as a tackifier for developing tackiness or improving tackiness / adhesion performance in a non-crosslinked acrylic tackiness agent.
- the tackifier not only has good compatibility with the base polymer of the pressure-sensitive adhesive (base polymer), but also gives the pressure-sensitive adhesive a good viscous flow characteristic, that is, a property of immediately bonding at the deformation or strain rate of the pressure-sensitive adhesive. It is important that the molecular weight be significantly lower than the base polymer. Therefore, a low molecular weight compound having a weight average molecular weight of 800 or less is usually used as a tackifier.
- the content ratio of the compound having a weight average molecular weight of 800 or less in the pressure-sensitive adhesive is 18% by mass or less.
- the content ratio of the compound having a weight average molecular weight of 800 or less is within the above range, the compound is appropriately prevented from exuding on the surface of the pressure-sensitive adhesive. Thereby, the cohesive failure of an adhesive can be suppressed and adhesive residue can be reduced.
- the content ratio of the compound is preferably as small as possible, and more preferably 15% by mass or less, 10% by mass or less, 7% by mass or less, or 3% by mass or less.
- the compound may not be contained in the pressure-sensitive adhesive, but the content ratio of the compound in the case where the compound is contained in the pressure-sensitive adhesive is 0.5% by mass or more, or 1% by mass or more. There may be.
- acrylic pressure-sensitive adhesives are largely divided into crosslinked and non-crosslinked pressure-sensitive adhesives.
- a base polymer and a tackifier are contained.
- the tackifier is an amorphous compound made of rosin resin, terpene resin, petroleum resin or the like and having a molecular weight of several hundred to several thousand.
- the most commonly applied tackifier for acrylic adhesives is rosin resins. Since the rosin-based resin has a three-dimensional and bulky cyclic structure, it has a low molecular weight and a narrow molecular weight distribution compared to other petroleum-based resins exhibiting the same softening point.
- rosin-based resins have polar groups such as ester bonds and are excellent in compatibility with the base polymer, and thus are most frequently used as tackifiers for acrylic pressure-sensitive adhesives.
- the rosin-based resin includes a structure having an unsaturated bond substituted for abithienic acid, it is easily oxidized and has poor light resistance and the like. Therefore, development of a resin obtained by esterifying a hydrogenated and polymerized modified rosin, and a rosin derivative excellent in optical use etc. have been developed by an ultra-lightening technique.
- the base polymer is blended with an amount of 20% by mass to 80% by mass of the tackifier in order to make the base polymer and the tackifier compatible with each other to express tackiness and rubber elasticity. is doing. This is because it is generally said that if the tackifier is less than 20% by mass, the tackiness is poor. However, if the tackifier has the above content ratio, separation or the like occurs between the tackifier and the base polymer. For this reason, the tackifier becomes blotted on the surface, and the tackifier moves to the mask side and remains on the mask side. This is considered to be one of the causes of adhesive residue when a conventional acrylic pressure-sensitive adhesive is used.
- the acrylic polymer (A) has a glass transition temperature of ⁇ 30 ° C. or lower, preferably ⁇ 33 ° C. or lower, more preferably ⁇ 35 ° C. or lower. By setting the glass transition temperature of the acrylic polymer (A) to ⁇ 30 ° C. or less, even when the environmental temperature is low, it has good elastic adhesiveness and good workability.
- the lower limit is not particularly limited, but the glass transition temperature is preferably ⁇ 90 ° C. or higher in view of ease of handling and availability.
- the acrylic polymer (A) has a plurality of glass transition temperatures
- at least one of the plurality of glass transition temperatures may be in the above range, and all of the plurality of glass transition temperatures are in the above range. It is preferable that it exists in.
- the glass transition temperature of the compound used in the present embodiment is a value obtained by DSC (differential scanning calorimetry).
- the acrylic polymer (A) is easy to handle because it becomes liquid at room temperature. Further, by using the acrylic polymer (A), even if a conventional tackifier such as a rosin resin is not blended with the acrylic adhesive, an adhesive force that can be used as a pellicle adhesive can be expressed. This is presumably because the use of the acrylic polymer (A) improves the compatibility with the monomer component having adhesiveness and flexibility contained in the acrylic base polymer (B). In addition, the acrylic polymer (A) has a good compatibility with the acrylic base polymer (B), so it is difficult to phase-separate and has good light resistance. The rate of coming in is reduced, and the adhesive residue of the adhesive is suppressed.
- a conventional tackifier such as a rosin resin
- Double patterning is known as a technique for miniaturization, and exposure is usually performed twice using two masks. For this reason, it is important to increase the positional accuracy between the two patterns to be formed. That is, if the positional accuracy between the pattern obtained by the first exposure and the pattern obtained by the second exposure is low, a desired pattern cannot be obtained. For this reason, since it is necessary to reduce the positional deviation between the two patterns to be formed, the flatness required for the mask is required. At this time, if a pellicle is attached to the mask, mask distortion may occur.
- the content of the acrylic polymer (A) is preferably 15 to 80% by mass with respect to the whole pressure-sensitive adhesive. It is more preferably 18 to 75% by mass, further preferably 20 to 70% by mass, particularly preferably 30 to 70% by mass, and particularly preferably 40 to 70% by mass. When the content is 15% by mass or more, an appropriate adhesive force can be obtained, and when the content is 80% by mass or less, the cohesive force can be within an appropriate range, and the holding force is improved. By setting the content of the acrylic polymer (A) in the above range, it is possible to prevent the pellicle from dropping from the mask after the pellicle is attached to the mask.
- the acrylic polymer (A) is preferably composed of a (meth) acrylic acid alkyl polymer or copolymer having an alkyl group having 1 to 14 carbon atoms from the viewpoint that it can also serve as a softener.
- These polymers or copolymers include diblocks, triblocks, and the like, and are used to polymerize one or more kinds of alkyl (meth) acrylate monomers, or one kind or two or more kinds. It can also be obtained by polymerizing a mixture of an alkyl (meth) acrylate monomer and another monomer other than the alkyl (meth) acrylate monomer.
- (meth) acrylic acid means “acrylic acid” and “methacrylic acid” corresponding thereto.
- alkyl (meth) acrylate monomers include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and hexyl (meth) acrylate.
- group monomer for example, acrylic acid, vinyl acetate, styrene etc. can be used.
- a polymer or copolymer formed of (meth) acrylic acid alkyl ester having an alkyl group having 1 to 8 carbon atoms such as methoxyethyl, isobutyl (meth) acrylate, etc. is bonded to acrylic base polymer (B). It is preferable because it is easily compatible with the monomer component capable of exhibiting properties.
- the above-mentioned polymer or copolymer can also serve as a softening agent.
- the molecular weight of the acrylic polymer (A) is preferably 850 or more and 70,000 or less, more preferably 900 or more and 68,000 or less in terms of weight average molecular weight. Sufficient adhesive strength can be obtained when the weight average molecular weight of the acrylic polymer (A) is 850 or more, and the viscosity can be controlled within an appropriate range when the weight average molecular weight is 70,000 or less. To preferred.
- the weight average molecular weight is 850 or more and 70,000 or less, it becomes easy to be compatible with the acrylic base polymer (B). For this reason, it becomes possible to improve the adhesiveness of an acrylic base polymer (B), and an acrylic polymer (A) can also function as a tackifier. Furthermore, even when the compound having a molecular weight of 800 or less is set to 18% by mass or less, the adhesive strength of the pressure-sensitive adhesive can be expressed well and the adhesive residue can be improved.
- the average molecular weight of the acrylic polymer (A) is preferably such that M W / M N is in the range of 1.0 to 2.0 from the viewpoint of preventing adhesive residue.
- a block polymer is preferable from the viewpoints that it is possible to apply the adhesive to the pellicle frame thickly and reduce mask distortion when the pellicle is attached to the mask.
- acrylic polymer (A) examples include a trade name “ARUFON (registered trademark)” series (manufactured by Toagosei Co., Ltd.), a trade name “clarity (registered trademark)” series (manufactured by Kuraray Co., Ltd.), and the like. Can do. Trade name “ARUFON (registered trademark)” series, polymerization initiator, chain transfer agent, fewer impurities because you do not want to use the solvent or the like, M W / M N of 1.0 to 2.0 and molecular weight distribution is narrow for glue It is particularly excellent in remaining prevention.
- the product name “Clarity (registered trademark)” series is a triblock copolymer having a hard segment and a soft segment, and can be applied thickly to a pellicle frame, and thus is particularly excellent in reducing mask distortion.
- the product name “Clarity (registered trademark)” series has excellent molecular weight distribution as M W / M N is 1.0 to 2.0, and is excellent in preventing adhesive residue.
- the acrylic base polymer (B) has a glass transition temperature of ⁇ 25 ° C. or higher and preferably 140 ° C. or lower. In particular, it is preferably ⁇ 25 ° C. or higher and 130 ° C. or lower, and more preferably ⁇ 25 ° C. or higher and 120 ° C. or lower.
- the acrylic base polymer (B) of the present embodiment has a plurality of glass transition temperatures, at least one of the plurality of glass transition temperatures may be in this range.
- the acrylic base polymer (B) is a block polymer from the viewpoint that it becomes possible to apply a thick adhesive to the pellicle frame and reduce mask distortion when the pellicle is attached to the mask. It is preferable that
- the glass transition temperature of the block polymer is preferably ⁇ 25 ° C. or higher, and preferably 140 ° C. or lower. In particular, it is preferably ⁇ 10 ° C. or higher and 130 ° C. or lower, and more preferably 0 ° C. or higher and 120 ° C. or lower.
- the block polymer consists of the general formula (I)-(a1)-(b)-(a2)-.
- the glass transition temperatures of (a1) and (a2) in formula (I) are preferably 80 ° C. or higher.
- the glass transition temperature of (b) in formula (I) is preferably 30 ° C. or lower.
- (b) in the formula (I) is preferably a block polymer having a polymer having a glass transition temperature of 30 ° C. or lower in the main chain.
- the monomer component constituting the polymer block represented by formulas (a1) and (a2) in formula (I) (hereinafter, these polymer blocks are referred to as “polymer block a”) mainly has 1 to 14 carbon atoms. It is preferable that the glass transition temperature of the polymer block a is 80 ° C. or higher.
- the alkyl methacrylate include methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, sec-butyl methacrylate, t-butyl methacrylate, methacrylic acid.
- amyl acid isoamyl methacrylate, n-hexyl methacrylate, 2-ethylhexyl methacrylate, pentadecyl methacrylate, cyclohexyl methacrylate, lauryl methacrylate, tridecyl methacrylate, 2-hexyldecyl methacrylate, etc.
- amyl acid isoamyl methacrylate
- n-hexyl methacrylate 2-ethylhexyl methacrylate
- pentadecyl methacrylate cyclohexyl methacrylate
- lauryl methacrylate tridecyl methacrylate
- 2-hexyldecyl methacrylate etc.
- the ester is the main component.
- “mainly” means that at least half of the entire polymer block “a”, preferably 80% or more, is occupied by an alkyl ester having 1 to 14 carbon atoms.
- at least one of the polymer blocks a may be made of a methacrylic acid alkyl ester having 1 to 14 carbon atoms.
- the polymer block a of the formula (I) has a small proportion (for example, less than half, preferably less than 20%), for example, trimethylsilyl methacrylate, trimethoxysilylpropyl methacrylate, glycidyl methacrylate, allyl methacrylate, etc.
- Monomers such as methacrylic acid esters other than alkyl esters of; acrylic acid alkyl esters such as methyl acrylate, n-butyl acrylate and t-butyl acrylate; olefins such as ethylene and propylene; lactones such as ⁇ -caprolactone and valerolactone
- the component derived from may be contained.
- the glass transition temperature of the polymer block a is 80 ° C. or higher, it is preferable because sufficient holding power and cohesive strength at high temperatures can be obtained.
- the monomer component constituting the polymer block represented by formula (I) (b) (hereinafter referred to as “polymer block b”) is mainly composed of an alkyl acrylate ester having 1 to 14 carbon atoms and / or methacrylic ester. It is preferable that it is acid alkylester from a viewpoint which makes the glass transition temperature of the polymer block b 30 degrees C or less.
- the alkyl acrylate that can constitute the polymer block b include, for example, methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, sec-butyl acrylate.
- methacrylic acid alkyl ester monomer that can constitute the polymer block b include, for example, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, methacrylic acid.
- the polymer block b is constituted using an alkyl methacrylate as the main monomer component, n-butyl methacrylate, isobutyl methacrylate, methacrylic acid are used in order to make the glass transition temperature 30 ° C. or less. Between methacrylic acid and 4 or more carbon atoms, such as amyl, isoamyl methacrylate, n-hexyl methacrylate, 2-ethylhexyl methacrylate, pentadecyl methacrylate, lauryl methacrylate, tridecyl methacrylate, 2-hexyldecyl methacrylate It is preferable to mainly use an ester.
- the polymer block b may contain other components as long as the adhesive residue on the mask and light resistance are not adversely affected.
- the glass transition temperature of the polymer block b is 30 ° C. or lower, since sufficient adhesive strength and holding power can be obtained.
- the block polymer has a structure in which one polymer block b is located between two polymer blocks a as in (a1) and (a2) of the formula (I).
- a block copolymer composed of four or more polymer blocks containing blocks may be included.
- the other polymer block described above may be the same type of polymer block as the polymer block a or b, or may be a different type of polymer block c.
- Examples of the polymer block c of another type include polymer blocks composed of olefins such as ethylene and propylene, and lactones such as ⁇ -caprolactone and valerolactone.
- Preferred block copolymers in the present embodiment include polymer block a-polymer block b-polymer block a, polymer block a-polymer block b-polymer block a-polymer block b, polymer block a-polymer block b-polymer block a-polymer block c and the like.
- the molecular weight of the block copolymer is preferably in the range of 10,000 to 500,000 in terms of weight average molecular weight, more preferably in the range of 30,000 to 450,000, especially 50,000 to 400,000. More preferred.
- the weight average molecular weight of the block copolymer is in the range of 10,000 to 500,000, a block copolymer that can be polymerized by a living polymerization method or the like and has a small molecular weight distribution and few impurities is obtained. Thereby, the adhesive residue of the pressure-sensitive adhesive is improved, and the pressure-sensitive adhesive can be applied thickly, which is preferable.
- M W / M N is preferably 1.0 to 2.0.
- the ratio (a / b) of the total mass of the polymer block a based on the total mass of the polymer block b contained in the molecule is 5/95 to 80/20. It is preferable. Further, a / b is more preferably 10/90 to 75/25. When a / b is 5/95 or more, the cohesive force of the pressure-sensitive adhesive is sufficiently obtained, and a high holding force tends to be obtained. Moreover, it becomes the tendency for adhesive force to be fully acquired because a / b is 80/20 or less.
- the block copolymer mentioned above If it is the block copolymer mentioned above, a side chain having a bulky branched structure can be formed in the polymer. For this reason, it becomes possible to apply a thick adhesive, and it is possible to reduce mask distortion when the pellicle is attached to the mask.
- the acrylic polymer (A) is particularly compatible with the polymer block b, it is possible to improve adhesion and flexibility, and more particularly to reduce mask distortion.
- the block copolymer has a hydroxyl group, a carboxyl group, or a hydroxyl group in the molecular side chain or at the molecular main chain end so as not to adversely affect the adhesive residue on the mask and the light resistance of the acrylic base polymer (B).
- You may have functional groups, such as an acid anhydride group and an amino group.
- block copolymers include a product name “Clarity (registered trademark)” series (manufactured by Kuraray Co., Ltd.) and a product name “Nanostrength” series (manufactured by Arkema Co., Ltd.).
- an inorganic substance may be added for the purpose of improving light resistance and improving adhesive residue.
- the pellicle of this embodiment can be suitably manufactured by the following method, for example.
- the above-mentioned acrylic polymer (A) and acrylic base polymer (B) are mixed to obtain an adhesive composition.
- the pressure-sensitive adhesive 10 in order to adhere (apply) the pressure-sensitive adhesive 10 as a mask pressure-sensitive adhesive layer having a predetermined thickness and width to the end surface of the pellicle frame 2, the pressure-sensitive adhesive composition is further diluted with a solvent, and the solution concentration (viscosity) is adjusted. adjust.
- the thickness of the mask adhesive layer is preferably from 0.25 mm to 3.0 mm.
- the thickness is preferably from 0.25 mm to 1.0 mm, and more preferably from 0.3 mm to 0.8 mm.
- the thickness is preferably 1.0 mm to 2.5 mm, and more preferably 1.2 mm to 2.0 mm.
- the width of the mask pressure-sensitive adhesive layer is preferably 30% or more and 90% or less, and more preferably 40% or more and 80% or less of the applied frame width.
- the frame width is generally 1.0 mm or more and 20 mm or less.
- the pressure-sensitive adhesive composition is applied to the other end surface 2f of the pellicle frame 2 having the pellicle film 3 stretched on the one end surface 2e.
- the application method is not particularly limited, but when the adhesive composition is diluted with a solvent, it is preferably applied using a dispenser or a syringe. Moreover, you may use the hot-melt method which heat-melts and apply
- the pressure-sensitive adhesive 10 molded by heating and drying the applied pressure-sensitive adhesive composition is brought into close contact with the other end surface 2f of the pellicle frame 2.
- the pressure-sensitive adhesive composition is applied by the hot melt method, the pressure-sensitive adhesive 10 that has been cooled after being molded is brought into close contact with the other end surface 2 f of the pellicle frame 2.
- the protective film F for example, a film made of polyester having a thickness of 30 to 200 ⁇ m is used.
- the pressure-sensitive adhesive surface may be molded substantially flatly by applying a load.
- the pressure-sensitive adhesive layer was pulled to an elongation of 20%. Separately, the cross-sectional area of the pressure-sensitive adhesive layer was measured, and the measurement result was divided by the cross-sectional area to obtain the stress value per unit area. Create a graph consisting of the elongation on the x-axis and the stress value per unit area on the y-axis, and the y-axis value at 100% elongation when a straight line is drawn at 0% elongation and 20% elongation. Elastic modulus was used.
- the i-BA / BA / AA / HEA composition was prepared by a known method. Specifically, ethyl acetate (30 parts by weight) is placed in a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, a dripping device, and a nitrogen introduction tube, and isobutyl acrylate / butyl acrylate / acrylic acid / 2-hydroxyethyl acrylate.
- ⁇ Example 1> (Production of pellicle) 70 parts by mass of “Clarity LA1114 (manufactured by Kuraray Co., Ltd.)” as the acrylic polymer (A), and 30 parts by mass of an acrylic block copolymer “Clarity LA2140e (manufactured by Kuraray Co., Ltd.)” as the base acrylic polymer (B) Were mixed to give a total of 48 g to obtain a raw material mixture. The obtained raw material mixture was put into a lab plast mill (manufactured by Toyo Seiki Seisakusho Co., Ltd., internal volume: 60 mL) and then sealed. It knead
- anodized aluminum alloy pellicle frame (outer diameter 113 mm ⁇ 149 mm, inner diameter 109 mm ⁇ 145 mm, height 2.9 mm) was prepared.
- a pin hole there are 4 jig holes each having a hole diameter of 1.6 mm ⁇ and a depth of 1.2 mm at a position of 1.7 mm from the film adhesive application end surface and at a position of 25 mm from the corner portion of the outer side surface of the pellicle frame.
- a mask adhesive layer in a molten state extruded from the needle tip communicating with the heating tank was applied onto one end surface of the pellicle frame to form a mask adhesive layer.
- the thickness of the formed mask pressure-sensitive adhesive layer was 0.6 mm. Thereafter, a 100 ⁇ m thick polyester protective film subjected to silicone release treatment was bonded to the surface of the mask pressure-sensitive adhesive layer. A pellicle film was attached to the other end surface of the pellicle frame via a film adhesive layer to produce a pellicle.
- the obtained pellicle was subjected to peelability evaluation and mask distortion evaluation. The results are shown in Table 1.
- the peelability was evaluated according to the following criteria by observing the surface of each adherend.
- the adhesive residue in this embodiment means that a part of the adhesive remains attached to the mask due to cohesive failure.
- the remaining adhesive area is 0% or more and 5% or less of the entire pasted area.
- the remaining adhesive area is more than 5% and 10% or less of the entire pasted area.
- the remaining adhesive area is more than 10% and 20% of the entire pasted area.
- the remaining adhesive area is more than 20% of the entire pasted area and 100% or less
- the pellicle was attached to quartz with a simple mounter (weight: 15 Kgf, 60 sec).
- ⁇ Deformation of mask due to pasting pellicle is 25 nm or less
- ⁇ Deformation of mask due to pasting pellicle is over 25 nm to 35 nm or less
- ⁇ Deformation of mask due to pasting pellicle is over 35 nm 60 nm or less
- x Deformation amount of the mask by attaching a pellicle exceeds 60 nm
- Examples 2 to 9 Comparative Examples 1 and 2> A pellicle was produced in the same manner as in Example 1 except that the components were mixed to obtain a mixture as shown in Table 1 to obtain a mixture. Evaluation similar to Example 1 was implemented with respect to the obtained pellicle. These results are also listed in Table 1.
- an anodized aluminum alloy pellicle frame (outer diameter 113 mm ⁇ 149 mm, inner diameter 109 mm ⁇ 145 mm, height 2.9 mm) was prepared.
- a mask adhesive layer in a molten state extruded from the needle tip communicating with the heating tank was applied onto one end surface of the pellicle frame to form a mask adhesive layer.
- the thickness of the formed mask pressure-sensitive adhesive layer was 0.6 mm.
- a 100 ⁇ m thick polyester protective film subjected to silicone release treatment was bonded to the surface of the mask pressure-sensitive adhesive layer.
- a pellicle film was attached to the other end surface of the pellicle frame via a film adhesive layer to produce a pellicle.
- toluene 38 parts by mass was added to the reaction solution to obtain an acrylic copolymer solution having a nonvolatile concentration of 32% by mass (weight average molecular weight 1.3 million).
- a polyfunctional epoxy compound a toluene solution of 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane, nonvolatile concentration 5% is added to 100 parts by mass of the obtained acrylic copolymer solution. Addition and stirring were mixed to obtain an adhesive precursor composition.
- an anodized aluminum alloy pellicle frame (outer diameter 113 mm ⁇ 149 mm, inner diameter 109 mm ⁇ 145 mm, height 3.2 mm) was prepared.
- a pin hole there are 4 jig holes each having a hole diameter of 1.6 mm ⁇ and a depth of 1.2 mm at a position of 1.7 mm from the film adhesive application end surface and at a position of 25 mm from the corner portion of the outer side surface of the pellicle frame.
- the prepared pressure-sensitive adhesive composition was applied on one end surface of the pellicle frame with a dispenser.
- the present invention can be suitably used in lithography processes such as IC (Integrated Circuit), LSI (Large Scale Integrated Circuit), LCD (Liquid Crystal Display) and the like, and excimer laser used particularly in exposure that requires high resolution. It can be suitably used in the lithography process used, preferably in the lithography process using ultraviolet light exposure of 200 nm or less.
- pellicle 1 ... pellicle, 2 ... pellicle frame, 2e, 2f ... end face of pellicle frame, 3 ... pellicle film, 10 ... adhesive, F ... protective film.
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Abstract
Description
(1)ペリクル枠と、
ペリクル枠の一端面に張設されたペリクル膜と、
ペリクル枠の他端面に付着した非架橋型のアクリル系粘着剤と、を備え、
粘着剤における重量平均分子量800以下の化合物の含有量が18質量%以下である、ペリクル。
(2)非架橋型のアクリル系粘着剤の弾性率は、20mN/mm2以上、180mN/mm2以下である、(1)に記載のペリクル。
(3)非架橋型のアクリル系粘着剤のガラス転移温度は-25℃未満である、(1)又は(2)に記載のペリクル。
(4)非架橋型のアクリル系粘着剤は、アクリル系ポリマー(A)と、アクリル系ベースポリマー(B)とを含有する、(1)~(3)のいずれかに記載のペリクル。
(5)アクリル系ポリマー(A)のガラス転移温度は-30℃以下であり、
アクリル系ベースポリマー(B)のガラス転移温度は-25℃以上である、(4)に記載のペリクル。
(6)非架橋型のアクリル系粘着剤におけるアクリル系ポリマー(A)の含有量が15~80質量%である、(4)又は(5)に記載のペリクル。
(7)アクリル系ポリマー(A)は、炭素数1~14のアルキル基を有する(メタ)アクリル酸アルキルの重合体又は共重合体である、(4)~(6)のいずれかに記載のペリクル。
(8)アクリル系ベースポリマー(B)は、ブロックポリマーである、(4)~(7)のいずれかに記載のペリクル。
(9)ブロックポリマーは、下記一般式(I)で示される構造を重合体主鎖中に有し、
式(I)中、(a1)及び(a2)は、それぞれガラス転移温度80℃以上のポリマーを示し、(b)はガラス転移温度30℃以下のポリマーを示す、(8)に記載のペリクル。
-(a1)-(b)-(a2)- (I)
(10)一般式(I)における(a1)及び(a2)は、それぞれ、主として炭素数1~14のメタクリル酸アルキルエステルからなり、
一般式(I)における(b)は、主として炭素数1~14の(メタ)アクリル酸アルキルエステルからなる、(9)に記載のペリクル。
(11)アクリル系ポリマー(A)の重量平均分子量が850以上70000以下であり、
アクリル系ベースポリマー(B)の重量平均分子量が10000以上500000以下である、(4)~(10)のいずれかに記載のペリクル。
(12)(1)~(11)のいずれかに記載のペリクルが装着されている、ペリクル付フォトマスク。
(13)(12)に記載のペリクル付フォトマスクによって基板を露光する工程を備える、半導体素子の製造方法。
本実施形態に係るペリクルに使用する粘着剤(アクリル系粘着剤)は、非架橋型のアクリル系粘着材であり、アクリル系粘着剤における重量平均分子量800以下の化合物の含有比率が18質量%以下である。ここで言う非架橋型とは、本発明の効果を奏する範囲で、硬化材との反応生成物を含む場合も含まれる。
重量平均分子量800以下の化合物は、非架橋型のアクリル系粘着剤において、粘着性を発現させる、又は粘着・接着性能を向上させるための粘着付与剤として用いられる。粘着付与剤は、粘着剤のベースとなるポリマー(ベースポリマー)との相溶性がよいだけでなく、優れた粘性流動特性すなわち粘着剤の変形又は歪み速度で直ちに結合する性質を粘着剤に付与することが求められ、ベースポリマーより大幅に低い分子量であることが重要になる。そのため、通常は、粘着付与剤として重量平均分子量800以下の低分子量化合物が用いられる。
アクリル系ポリマー(A)は、ガラス転移温度が-30℃以下であり、-33℃以下であることが好ましく、-35℃以下であることがより好ましい。アクリル系ポリマー(A)のガラス転移温度が-30℃以下とすることで、環境温度が低い場合でも良好な弾性接着性を有し、作業性も良好となる。下限は特に制限はないが、取り扱いの容易性、入手のし易さから、ガラス転移温度が-90℃以上であることが好ましい。また、アクリル系ポリマー(A)が複数のガラス転移温度を有する場合、当該複数のガラス転移温度のうちの少なくとも1つが上記範囲内にあればよく、当該複数のガラス転移温度の全てが上記範囲内にあることが好ましい。なお、本実施形態に用いられる化合物等のガラス転移温度は、DSC(示差走査熱量測定)にて得た値である。
本実施形態において、アクリル系ベースポリマー(B)は、ガラス転移温度が-25℃以上であり、140℃以下であることが好ましい。特に、-25℃以上130℃以下、更には、-25℃以上120℃以下が好ましい。本実施形態のアクリル系ベースポリマー(B)が複数のガラス転移温度を有する場合には、当該複数のガラス転移温度のうちの少なくとも1つがこの範囲に存在すればよい。また、アクリル系ベースポリマー(B)は、粘着剤をペリクル枠に厚く塗布することが可能になり、ペリクルをマスクに貼り付けた際のマスク歪を低減することが可能となる観点から、ブロックポリマーであることが好ましい。
・ARUFON(登録商標)UP1190(東亞合成株式会社製)(28.2%)
(ガラス転移温度:-50℃)
・ARUFON(登録商標)UP1080(東亞合成株式会社製)(5.9%)
(ガラス転移温度:-61℃)
・ARUFON(登録商標)UP1000(東亞合成株式会社製)(13.7%)
(ガラス転移温度:-77℃)
・クラリティ(登録商標)LA1114(株式会社クラレ製)(0.0%)
(ガラス転移温度:-40℃)
・i-BA/BA/AA/HEA(アクリル酸イソブチル/アクリル酸ブチル/アクリル酸/2-ヒドロキシエチルアクリレート)(2.4%)
(ガラス転移温度:-51℃)
(アクリル系ベースポリマー(B))
・クラリティ(登録商標)LA2140e(株式会社クラレ製)
(ガラス転移温度:-38℃、85℃)
・クラリティ(登録商標)LA2330(株式会社クラレ製)
(ガラス転移温度:-39℃、86℃)
・Nanostrength M-85(アルケマ株式会社製)
(ガラス転移温度:-54℃、100℃)
(分子量800以下の化合物)
・パインクリスタル(登録商標)KE-311(荒川化学工業株式会社製)
(1)GPC(ゲルパーミエーションクロマトグラフィー)による分子量測定
・装置:東ソー株式会社製ゲルパーミエーションクロマトグラフィー(HLC-8320)
・カラム:東ソー株式会社製「TSKgel SUPER HZ3000×2」および「HZ2000×2」を直列に連結
・溶離液:テトラヒドロフラン
・溶離液流量:0.6ml/分
・カラム温度:40℃
・検出器:示差屈折率(RI)計
・検量線:標準ポリスチレンを用いて作成
(2)DSC(示差走査熱量測定)によるガラス転移温度測定
・装置:TAインスツルメント社製 DSCQ2000
・密閉パン
・温度範囲:-80℃~160℃
・昇温速度:5℃/min
・試料重量:10mg
アクリル系ポリマー(A)・アクリル系ベースポリマー(B)を含む粘着剤のガラス転移温度が複数測定された場合は、最も低温側の温度をガラス転移温度Tgとして表1に記載した。
(3)プロトン核磁気共鳴(1H-NMR)分光法による、各共重合成分の含有量測定
・装置:日本電子株式会社製核磁気共鳴装置(JNM-LA400)
・溶媒:重クロロホルム
なお、1H-NMRスペクトルにおいて、3.6ppmおよび4.0ppm付近のシグナルは、それぞれ、メタクリル酸メチル単位のエステル基(-O-CH3)およびアクリル酸n-ブチル単位のエステル基-O-CH2-CH2-CH2-CH3)に帰属するため、これらのシグナルの積分値の比によって共重合成分の含有量を求めた。
(4)弾性率の測定
保護フィルム付ペリクルの1辺を切断し、その後、粘着剤層が変形しないようにゆっくりと保護フィルムを剥離し、その後、ペリクル枠からマスク粘着剤層をゆっくりと剥離した。その際、剥離し難いときは、シッカロールを手と粘着剤層に付着しながらゆっくりと剥離し、剥離した粘着剤層の伸び率が5%以下になるようにした。
剥離した粘着剤層を下記の装置を用い室温(25℃)にて測定した。
装置名:オートグラフ(SHIMAZU EZ-S 島津製作所製)
ロードセル: 1N (クリップ式チャック)
チャック間: 40mm
クロスヘッドスピード: 100mm/min.
上記装置にて、粘着剤層を伸度20%まで引張した。別途、粘着剤層の断面積を測定し、上記測定結果を断面積で割ることで、単位面積当たりの応力値を求めた。
x軸に伸度、y軸に単位面積当たりの応力値からなるグラフを作成し、伸度0%と伸度20%時で直線を引いた場合の伸度100%でのy軸の値を弾性率とした。
周知の方法によりi-BA/BA/AA/HEA組成物を調整した。具体的には、攪拌機、温度計、還流冷却器、滴下装置、窒素導入管を備えた反応容器に酢酸エチル(30重量部)を入れ、イソブチルアクリレート/ブチルアクリレート/アクリル酸/2-ヒドロキシエチルアクリレート/2、2’-アゾビスイソブチロニトリルの混合物(32重量部)を48/48/1.5/2.5/1.0の重量比で仕込み、窒素雰囲気下中、この反応溶液を60℃で8時間反応する。反応終了後、トルエン(38重量部)を添加して、不揮発分濃度32重量% のアクリル共重合体溶液を得た。
(ペリクルの作製)
アクリル系ポリマー(A)として「クラリティ LA1114(株式会社クラレ製)」70質量部と、ベース系アクリルポリマー(B)としてアクリル系ブロック共重合体「クラリティ LA2140e(株式会社クラレ製)」30質量部とを、全体で48gとなるように混合して原料混合物を得た。得られた原料混合物をラボプラストミル(株式会社東洋精機製作所製、内容量:60mL)に投入した後、密閉した。200℃、100rpmで20分間混練して、塊状のマスク粘着剤を得た。約10gのマスク粘着剤を加熱タンク(タンク内温度:200℃)に投入して溶融させた。
実施例1で得た粘着剤付ペリクルについて、保護フィルムを剥がして、6025クロム付きマスクブランクス基材に簡易型マウンターで加重(30Kgf、60sec)貼付を行い、ペリクルを貼り付けたマスク基材を得た。マスク基材を、室温(20±3℃)にて2時間放置後、マスク基材を水平に固定し、引張試験機により、ペリクルの各長辺に2個ずつあるピン穴、計4個を把持して各長辺を同時に、マスク面に対し垂直に5mm/minの速度で引き上げ、ペリクルの剥離を行った。剥離性は、各被着体表面の様子を観察し、以下の基準で評価した。本実施例での糊残りとは、凝集破壊により粘着剤の一部がマスクに付着したままの状態となることを言う。
◎:糊残り面積が貼付け面積全体の内0%以上5%以下
○:糊残り面積が貼付け面積全体の内5%超10%以下
△:糊残り面積が貼付け面積全体の内10%超20%以下
×:糊残り面積が貼付け面積全体の内20%超100%以下
マスクの歪み等による変形の評価は、Tropel社製のFlatMaster200を用いて測定した。まず、マスク(6025石英)について、ペリクルを貼りつける前の平坦度を測定した。その後に実施例1で得た粘着剤付ペリクルを当該マスクに貼り付け、ペリクル貼り付け後のマスクの平坦度を測定した(測定範囲:135mm×110mm)。貼り付け前後の平坦度の差し引きを行い、ペリクルを貼り付けたことでどれだけ6025石英が変形したかを算出した。
◎:ペリクルを貼り付けたことによるマスクの変形量が25nm以下
○:ペリクルを貼り付けたことによるマスクの変形量が25nm超35nm以下
△:ペリクルを貼り付けたことによるマスクの変形量が35nm超60nm以下
×:ペリクルを貼り付けたことによるマスクの変形量が60nm超
表1に記載した配合となるように各成分を混合して混合物を得たこと以外は、実施例1と同様にペリクルを作製した。得られたペリクルに対して実施例1と同様の評価を実施した。これらの結果も、表1に記載する。
スチレンエチレンブチレンスチレン共重合体100質量部、水添型テルペン樹脂80質量部、パラフィン系プロセスオイル40質量部及び酸化防止剤(BHT)2質量部を、ニーダーを用いて220℃で溶融混合することにより、塊状のマスク粘着剤を得た。約10gのマスク粘着剤を加熱タンク(タンク内温度:200℃)に投入して溶融させた。
攪拌機、温度計、還流冷却器、滴下装置、窒素導入管を備えた反応容器に酢酸エチル(30質量部)を投入した。イソブチルアクリレート/ブチルアクリレート/アクリル酸/2-ヒドロキシエチルアクリレート/2、2’-アゾビスイソブチロニトリルを30/66/1.5/2.5/1の質量比で混合した混合物(32質量部)を酢酸エチルに添加し、窒素雰囲気下、60℃で8時間反応させた。反応終了後、トルエン(38質量部)を反応溶液に添加して、不揮発分濃度32質量%のアクリル共重合体溶液を得た(重量平均分子量130万)。得られたアクリル共重合体溶液100質量部に多官能性エポキシ化合物(1,3-ビス(N,N-ジグリシジルアミノメチル)シクロヘキサンのトルエン溶液、不揮発分濃度5%)を0.3重量部添加・攪拌混合し、粘着剤前駆体組成物を得た。
Claims (13)
- ペリクル枠と、
前記ペリクル枠の一端面に張設されたペリクル膜と、
前記ペリクル枠の他端面に付着した非架橋型のアクリル系粘着剤と、
を備え、
前記非架橋型のアクリル系粘着剤における重量平均分子量800以下の化合物の含有量が18質量%以下である、ペリクル。 - 前記非架橋型のアクリル系粘着剤の弾性率は、20mN/mm2以上、180mN/mm2以下である、請求項1に記載のペリクル。
- 前記非架橋型のアクリル系粘着剤のガラス転移温度は-25℃未満である、請求項1又は2に記載のペリクル。
- 前記非架橋型のアクリル系粘着剤は、アクリル系ポリマー(A)と、アクリル系ベースポリマー(B)とを含有する、請求項1~3のいずれか一項に記載のペリクル。
- 前記アクリル系ポリマー(A)のガラス転移温度は-30℃以下であり、
前記アクリル系ベースポリマー(B)のガラス転移温度は-25℃以上である、請求項4に記載のペリクル。 - 前記非架橋型のアクリル系粘着剤における前記アクリル系ポリマー(A)の含有量が15~80質量%である、請求項4又は5に記載のペリクル。
- 前記アクリル系ポリマー(A)は、炭素数1~14のアルキル基を有する(メタ)アクリル酸アルキルの重合体又は共重合体である、請求項4~6のいずれか一項に記載のペリクル。
- 前記アクリル系ベースポリマー(B)は、ブロックポリマーである、請求項4~7のいずれか一項に記載のペリクル。
- 前記ブロックポリマーは、下記一般式(I)で示される構造を重合体主鎖中に有し、
式(I)中、(a1)及び(a2)は、それぞれガラス転移温度80℃以上のポリマーを示し、(b)はガラス転移温度30℃以下のポリマーを示す、請求項8に記載のペリクル。
-(a1)-(b)-(a2)- (I) - 前記一般式(I)における(a1)及び(a2)は、それぞれ、主として炭素数1~14のメタクリル酸アルキルエステルからなり、
前記一般式(I)における(b)は、主として炭素数1~14の(メタ)アクリル酸アルキルエステルからなる、請求項9に記載のペリクル。 - 前記アクリル系ポリマー(A)の重量平均分子量が850以上70000以下であり、
前記アクリル系ベースポリマー(B)の重量平均分子量が10000以上500000以下である、請求項4~10のいずれか一項に記載のペリクル。 - 請求項1~11のいずれか一項に記載のペリクルが装着されている、ペリクル付フォトマスク。
- 請求項12に記載のペリクル付フォトマスクによって基板を露光する工程を備える、半導体素子の製造方法。
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