WO2015049849A1 - Electronic circuit board and method of assembly for same - Google Patents

Electronic circuit board and method of assembly for same Download PDF

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Publication number
WO2015049849A1
WO2015049849A1 PCT/JP2014/004893 JP2014004893W WO2015049849A1 WO 2015049849 A1 WO2015049849 A1 WO 2015049849A1 JP 2014004893 W JP2014004893 W JP 2014004893W WO 2015049849 A1 WO2015049849 A1 WO 2015049849A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
electronic component
circuit board
connection body
electronic circuit
Prior art date
Application number
PCT/JP2014/004893
Other languages
French (fr)
Japanese (ja)
Inventor
昌広 山田
博 永井
Original Assignee
Ｎｅｃプラットフォームズ株式会社
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Filing date
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Application filed by Ｎｅｃプラットフォームズ株式会社 filed Critical Ｎｅｃプラットフォームズ株式会社
Publication of WO2015049849A1 publication Critical patent/WO2015049849A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an electronic circuit board provided with means for dissipating heat generated by an electronic component to the outside, and an assembling method thereof.
  • a heat sink formed of a material such as a metal having a larger heat capacity than an electronic component as a heating element is known.
  • the heat sink promotes heat dissipation of the electronic component by being in close contact with the outer surface of the electronic component via a heat transfer material such as thermal grease.
  • Patent Document 1 describes a heat sink mounting mechanism for fixing a heat sink to a substrate with a stepped screw via a coil spring.
  • Patent Document 2 describes a heat sink mounting structure for a semiconductor integrated circuit package.
  • a package side mounting hole is formed in a semiconductor integrated circuit package
  • a heat sink side mounting hole is formed in a heat sink
  • the heat sink and the semiconductor integrated circuit package are maintained in close contact with each other through the mounting hole. It is described to wear.
  • Patent Document 3 it is proposed to press and fix a printed circuit board to a heat sink with an elastic member made of a leaf spring.
  • Patent Document 4 relates to a magnetic tape head actuator assembly, in which a pair of upper leaf springs and a pair of lower leaf springs are configured as spring members integrated with a spring support so as to face each other from the spring support. It has been proposed to bend into a U-shape.
  • Patent Document 5 relates to a heat sink structure of an electronic package. In Patent Document 5, a compressive force is applied to a compressible heat conducting member on the lower surface of the heat sink by the holding spring of the base portion of the heat sink, the stud of the circuit board, and the fastener, and the electronic device of the circuit board is applied to the electronic device. It has been proposed to push the heat sink.
  • the allowable dimensional tolerance of the electronic component package is reduced, and it may be difficult to attach the heat sink depending on the production lot of the electronic component.
  • the heat sink cannot be brought into close contact with the electronic component, and the amount of heat of the electronic component that is a heating element may not be efficiently dissipated.
  • the present invention has been made in order to solve the above-described problems, and optimizes the pressing load of the heat sink against the electronic component and suppresses the horizontal displacement of the heat sink with respect to the electronic component, thereby realizing an excellent heat dissipation effect.
  • a circuit board and an assembly method thereof are provided.
  • An object of the present invention is to provide an electronic circuit board that solves the above problems.
  • the electronic circuit board according to the first aspect of the present invention is provided with a substrate body on which an electronic component is mounted on a surface, a heat transfer material applied to the electronic component, and an electronic component via the heat transfer material, A heat sink that dissipates heat radiated from the electronic component, a fixing member provided at a position spaced from the electronic component on the surface of the substrate body, a first end portion fixed to the heat sink, and a first end portion And at least two connecting members fixed to the substrate body via a fixing member, and the connecting members are leaf springs and press the heat sink against the electronic component.
  • the electronic circuit board assembly method includes a heat sink that mounts an electronic component on the surface of the substrate body, applies a heat transfer material to the electronic component, and dissipates heat radiated from the electronic component. Is provided on the electronic component via the heat transfer material, a fixing portion is provided on the surface of the substrate body at a position spaced from the electronic component, the first end is fixed to the heat sink, and the first end is The heat sink is pressed against the electronic component and mounted on the board body by a connection body composed of a leaf spring whose second end on the opposite side is fixed to the board body via a fixing part.
  • the adhesion of the heat sink to the heat transfer material applied to the electronic component can be improved.
  • the connection body is a leaf spring, even when external vibrations or impacts are applied, misalignment occurring in the heat sink is suppressed. Thereby, entrainment of bubbles in the heat transfer material can be suppressed, and high adhesion between the electronic component and the heat sink can be maintained. Further, the excess or deficiency of the adhesion between the heat sink and the electronic component is reduced, and as a result, the heat generated by the electronic component can be efficiently radiated.
  • FIG. 1 is an exploded perspective view of an electronic circuit board according to a first embodiment of the present invention.
  • FIG. 2 is a sectional view taken along line 2-2 of FIG. It is a disassembled perspective view which shows the modification of the electronic circuit board which concerns on 1st embodiment of this invention. It is a front view of the electronic circuit board which concerns on 2nd embodiment of this invention.
  • FIG. 1 is an exploded perspective view of an electronic circuit board 1 according to the present invention.
  • the electronic circuit board 1 is applied to a substrate body 10 having a printed wiring on its surface, an electronic component 20 mounted on the printed wiring of the substrate body 10 by soldering or the like, and an outer surface 21 of the electronic component 20. Heat transfer material 30. Further, the electronic circuit board 1 is provided on the outer surface 21 of the electronic component 20 via the heat transfer material 30 and dissipates heat generated by the electronic component 20, and a connection body 60 that connects the heat sink 40 and the substrate body 10. It is equipped with. Furthermore, the electronic circuit board 1 includes a fixing member 70 that fixes the connection body 60 to the board body 10 via the stud 50.
  • the substrate body 10 is a known electric wiring material formed of, for example, glass epoxy or alumina, and a desired printed wiring (not shown) is formed on the mounting surface 11 which is one surface thereof by etching. .
  • the substrate body 10 in the present embodiment is formed in a thin plate shape.
  • the board body 10 has a stud 50 and a board-side attachment hole 12 corresponding to a connection position of a connection body 60 described later.
  • the opening diameter of the board-side mounting hole 12 may be arbitrarily determined according to the shaft diameter of a screw that is a fixing member 70 described later.
  • the electronic component 20 is a component having an integrated circuit element inside and sealed with a resin material or a metal material, such as an LSI package.
  • the electronic component 20 in the present embodiment is formed to have a rectangular plate-like appearance when viewed from above, and a plurality of metal terminals (not shown) protrude from the surface facing the substrate body 10. Yes.
  • the electronic component 20 is soldered to the above-described printed wiring on the mounting surface 11 of the substrate body 10 through this terminal, and is electrically connected and physically fixed.
  • the heat sink 40 is a member formed in a rectangular parallelepiped shape as viewed from the outside. As shown in FIG. 1, the heat sink 40 includes a thin plate-like base 44 that has a rectangular shape when viewed from above, and a plurality of plates that protrude in a direction perpendicular to the extending plane of the base 44 on one surface of the base 44. And a heat sink 43 having a shape. The plurality of heat sinks 43 are provided in parallel with a certain gap between each other.
  • the surface on which the heat radiating plate 43 is provided forms a heat radiating surface 42, and the surface opposite to the heat radiating surface 42 is formed into a smooth flat surface to form the heat absorbing surface 41.
  • Flange 46 is formed at both ends of heat sink 40 in the longitudinal direction of base 44.
  • the flange 46 has a first mounting hole 45 that passes through the base 44 in a direction (thickness direction) perpendicular to the plane in which the base 44 extends.
  • Two first mounting holes 45 are provided in each flange 46. Note that the opening diameter of the first mounting hole 45 and the distance between the two first mounting holes 45 in the same flange 46 may be arbitrarily determined according to design requirements.
  • the heat sink 40 is integrally formed of a metal material having higher thermal conductivity than the resin material that forms the exterior package of the electronic component 20.
  • a metal material having good thermal conductivity for example, aluminum or copper is suitable.
  • the purpose of the thermal grease is to exclude air acting as a heat insulating material from between the heat sink 40 and the electronic component 20.
  • the main component of the thermal grease is silicon, which is formed into a paste by mixing fine powders such as silver, copper, and alumina in order to increase thermal conductivity.
  • connection body 60 is a flat plate spring having a rectangular shape in plan view.
  • the connection body 60 has four openings at each corner. Of the four openings, the two openings provided in the first end 47 on one long side of the connection body 60 are spaced apart from the two first mounting holes 45 provided in the flange 46 of the heat sink 40.
  • the second mounting hole 61 is formed with a separation distance equal to the distance.
  • the heat sink 40 and the first end 47 of the connection body 60 are fixed by a fixing member 80 such as a screw inserted into the second mounting hole 61 and the first mounting hole 45.
  • the two openings provided in the second end portion 48 on the other long side opposite to the long side provided with the second mounting hole 61 are connected to the stud 50 via a fixing member 70 such as a screw.
  • a third mounting hole 62 for fixing the connection body 60 (described later).
  • connection body 60 is formed of a metal plate material such as a spring steel material. As long as sufficient elasticity is obtained with respect to the bending stress in the thickness direction, the thickness dimension of the connection body 60 may be arbitrarily determined. Since the connection body 60 has elasticity in the thickness direction and at the same time has rigidity in the direction orthogonal to the thickness direction, the connection body 60 is not subjected to a load applied from the direction orthogonal to the thickness direction of the connection body 60. Less prone to deformation and curvature.
  • Stud 50 is a columnar member made of resin or the like.
  • the extension dimension of the stud 50 in the axial direction is determined as follows. That is, the dimension in the axial direction of the stud 50 is such that the mounting surface of the substrate body 10 is mounted from the heat radiation surface 42 of the base 44 of the heat sink 40 in the electronic circuit board 1 assembled by an assembly method described later (see FIG. 2). It is shorter than the dimension up to 11 by a predetermined dimension. Therefore, in the assembled electronic circuit board 1, the connection body 60 described above is maintained in an elastically deformed state and presses the heat sink 40 against the electronic component 20. More specifically, the connection body 60 is maintained in a state of being gently curved in a direction approaching the mounting surface 11 of the board body 10 from the end on the heat sink 40 side toward the end on the stud 50 side.
  • a heat transfer material 30 such as thermal grease is applied to the outer surface 21 of the electronic component 20 mounted on the mounting surface 11 of the substrate body 10.
  • the heat absorbing surface 41 of the heat sink 40 is brought into close contact with the applied heat transfer material 30 and the heat sink 40 is mounted on the outer surface 21 of the electronic component 20.
  • connection body 60 is arranged.
  • the second mounting hole 61 provided in the connection body 60 is made to correspond to the first mounting hole 45 provided in the flange 46 of the heat sink 40, and the third mounting hole 62 provided in the connection body 60 is preliminarily formed on the substrate. It corresponds to the position of the stud 50 arranged on the mounting surface 11 of the main body 10.
  • the fixing member 70 such as a screw inserted into the third mounting hole 62 is used to connect the second end 48 of the connection body 60 and the stud 50 and the screw inserted into the second mounting hole 61.
  • the first end portion 47 of the connection body 60 and the heat sink 40 are connected using a fixing member 80 such as the above.
  • the second end 48 of the connection body 60 and the stud 50 By connecting the second end 48 of the connection body 60 and the stud 50, the second end 48 of the connection body 60 and the substrate body 10 are connected via the stud 50.
  • the assembly of the electronic circuit board 1 is completed.
  • the heat sink 40 is fixed to the electronic component 20 via the connection body 60 and the stud 50.
  • the dimension of the stud 50 in the axial direction is shorter than the dimension from the heat radiation surface 42 of the base 44 of the heat sink 40 to the mounting surface 11 of the substrate body 10 by a predetermined dimension. Therefore, in the assembled state, the connection body 60 is fixed in a curved state with elastic deformation. That is, the connection body 60 generates a force that urges the heat sink 40 against the electronic component 20 by its own elastic force.
  • the heat sink 40 is fixed to the electronic component 20 while maintaining high adhesion. Therefore, even when the electronic component 20 generates heat during operation of the electronic circuit, the heat sink 40 exhibits high heat dissipation performance. Further, even when vibration or impact is applied to the electronic circuit board 1 from the outside, the connection body 60 has an elastic force so that the direction orthogonal to the mounting surface 11 of the board body 10 (vertical direction). The misalignment of the heat sink 40 can be absorbed.
  • connection body 60 since the connection body 60 has rigidity in the direction orthogonal to the thickness direction, the connection body 60 is deformed or curved with respect to the load applied from the direction orthogonal to the thickness direction of the connection body 60. Absent.
  • connection body 60 since the connection body 60 is firmly fixed by fixing members 70 and 80 such as screws, the connection body 60 resists impact force and vibration acting in a direction (horizontal direction) along the mounting surface 11 of the substrate body 10. be able to. Therefore, it is possible to prevent horizontal displacement from occurring in the heat sink 40. Thereby, since the entrainment of bubbles in the heat transfer material 30 can be suppressed, a good heat dissipation effect can be obtained by the heat sink 40.
  • connection body 60 is a leaf spring having elasticity, it is possible to absorb mounting errors of the electronic component 20 and dimensional tolerances during manufacturing. Therefore, even when there are variations in the soldering accuracy and the external dimensions of the electronic component 20, the heat sink 40 can be easily attached to the electronic component 20, and a high heat dissipation effect can be maintained.
  • connection body 60 is interposed between the connection body 60 and the board body 10. Accordingly, the amount of bending of the connection body 60 changes according to the difference between the axial dimension of the stud 50 and the dimension from the heat radiation surface 42 of the base 44 of the heat sink 40 to the mounting surface 11 of the substrate body 10. And the connection body 60 which acts as a leaf
  • the load (elastic force) applied to the electronic component 20 by the heat sink 40 can be adjusted by appropriately changing the size of the stud 50 interposed between the connection body 60 and the board body 10 according to the design. it can.
  • the heat sink 40 can be brought into close contact with the electronic component 20 with an appropriate load as necessary. In other words, damage to the electronic component 20 caused by applying an excessive load can be suppressed.
  • the electronic circuit board 1 according to the present embodiment can efficiently radiate the heat generated by the electronic component 20 to the outside via the heat sink 40.
  • a heat transfer material 30 such as thermal grease is interposed between the heat sink 40 and the electronic component 20. Therefore, the amount of heat generated by the electronic component 20 is more efficiently transmitted to the heat sink 40 and eventually radiated from the heat sink 43 of the heat sink 40 toward the outside.
  • the electronic circuit board 1 according to the present embodiment can efficiently dissipate the heat generated by the electronic component 20 and maintain the normal operation of the electronic circuit. Moreover, damage to the electronic component 20 due to heat is suppressed.
  • connection body 60 is formed of a metal plate formed in a rectangular shape.
  • shape and material of the connection body 60 are not limited as long as it has an appropriate elastic force.
  • a recess 63 may be formed in a part of the connection body 60.
  • the elastic force of the connecting body 60 as a leaf spring can be adjusted.
  • the electronic circuit board 1 that exhibits a high heat dissipation effect against the heat generated by the electronic component 20 can be obtained by the same operation as that of the above-described embodiment.
  • the fixing members 70 and 80 are not limited to screws, and any means may be used as long as the connection body 60 and the substrate body 10 (stud 50) or the connection body 60 and the heat sink 40 can be fixed to each other.
  • the rectangular parallelepiped heat sink 40 has been described as an example. However, as long as the product is designed for heat dissipation, the shape, material, and dimensions of the heat sink 40 are arbitrarily determined by design. May be.
  • the electronic circuit board 1 according to the second embodiment of the present invention is different from the first embodiment in the following points. That is, in the second embodiment, the end of the connection body 60 is directly fixed to the substrate body 10 without the stud 50 being interposed.
  • the load (elastic force) applied to the electronic component 20 by the heat sink 40 can be adjusted.
  • the heat sink 40 can be brought into close contact with the electronic component 20 with an appropriate load as necessary.
  • damage to the electronic component 20 caused by applying an excessive load can be suppressed.
  • the electronic circuit board 1 according to the present embodiment can efficiently radiate the heat generated by the electronic component 20 to the outside via the heat sink 40.
  • a stiffener may be disposed on the back surface of the substrate body 10, and the fixing member 70 may be fixed to the attachment hole of the stiffener via the stud 50 and the substrate body 10.
  • the board-side attachment hole 12 of the board body 10 may be a through hole, and the fixing member 70 may be fixed to the stiffener through the through hole of the board body 10.
  • a stiffener may be disposed on the back surface of the substrate body 10, and the fixing member 70 may be fixed to the stiffener attachment hole via the substrate body 10.
  • the board-side attachment hole 12 of the board body 10 may be a through hole, and the fixing member 70 may be fixed to the stiffener through the through hole of the board body 10.
  • the heat transfer material 30 has been described as being applied to the outer surface 21 of the electronic component 20, but is not limited thereto.
  • the heat transfer material 30 may be interposed between the outer surface 21 of the electronic component 20 and the heat sink 40 by inserting a solid heat transfer member between the electronic component 20 and the heat sink 40.
  • (Appendix 1) a substrate body on which electronic components are mounted on the surface; A heat transfer material applied to the electronic component; A heat sink provided in the electronic component via the heat transfer material to dissipate heat radiated from the electronic component; On the surface of the substrate body, a fixing member provided at a position separated from the electronic component; At least two or more connecting bodies having a first end fixed to the heat sink and a second end opposite to the first end fixed to the substrate body via the fixing member; With The connection body is a leaf spring, and the electronic circuit board presses the heat sink against the electronic component.
  • the said fixing member is an electronic circuit board of Additional remark 1 fixed to the said board
  • Appendix 3 Mounting electronic components on the surface of the board body, Applying a heat transfer material to the electronic component, A heat sink that dissipates heat radiated from the electronic component is provided in the electronic component via the heat transfer material, On the surface of the substrate body, a fixing portion is provided at a position separated from the electronic component, The first end portion is fixed to the heat sink, and the second end opposite to the first end portion is connected to the substrate body via the fixing portion.
  • Appendix 4 A board body on which electronic components are mounted on one main surface; A heat sink disposed on the electronic component via a predetermined heat transfer material; At least two connectors having a second end different from the first end and the first end, wherein the first end is fixed to the heat sink; and A fixing member for fixing the second end of the at least two connection bodies at a position spaced apart from a position where the electronic component is mounted on the one main surface of the substrate body,
  • the connection body is a leaf spring and presses the heat sink against the electronic component.
  • (Supplementary note 5) The electronic circuit board according to supplementary note 4, wherein the second end portion of the connection body is located on a side opposite to the first end portion of the connection body.
  • (Appendix 6) The electronic circuit board according to Appendix 4 or Appendix 5, wherein the connection body is rectangular.
  • (Supplementary note 7) The electronic circuit board according to supplementary note 4 or supplementary note 5, wherein the connection body has a rectangular shape and has a concave portion on one long side.
  • (Supplementary note 8) The electronic circuit board according to supplementary note 6 or supplementary note 7, wherein the first end portion and the second end portion of the connection body are located on a long side of the rectangle.
  • the fixing member is fixed to the substrate body through a columnar stud extending in a direction substantially orthogonal to the surface of the substrate body.
  • the electronic circuit board as described. (Appendix 10) Mounting electronic components on the surface of the board body, Placing a heat sink on the electronic component via a predetermined heat transfer material, A plate spring-like shape having a second end different from the first end and the first end, and fixing the first end of at least two connectors to the heat sink, The heat sink is attached to the electronic component by fixing the second end portions of the two connecting bodies to the substrate main body at a position spaced from the position where the electronic component is mounted on the surface of the substrate main body.
  • the assembly method of the electronic circuit board to be pressed is an assembly method of the electronic circuit board of Additional remark 10 located in the other side of the said 1st end part of the said connection body.
  • connection body assembly method After placing the heat sink on the electronic component, The first end portion of the connection body is fixed to the heat sink, and the second end portion of the connection body is fixed to the substrate body with a fixing member, whereby the heat sink is pressed against the electronic component.
  • the electronic circuit board assembly method according to appendix 11.
  • Additional remark 15 The assembly method of the electronic circuit board of Additional remark 13 or Additional remark 14 using the connection body which has comprised the rectangle as said connection body.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Provided is an electronic circuit board which optimizes pressing load of a heat sink for an electronic component, and suppresses misalignment in the horizontal direction of the heat sink with respect to the electronic component, achieving superior heat dissipation effect. An electronic circuit board according to the present invention is provided with: a board main body on which an electronic component is mounted on the surface thereof; thermally conductive material applied to the electronic component; a heat sink which is disposed across the thermally conductive material on the electronic component, and which dissipates heat radiated from the electronic component; securing members disposed at positions spaced apart from the electronic component upon the board main body; and at least two connections for which a first end portion is secured to the heat sink, and for which a second end portion at the opposite side of the first end portion is fixed to the board main body via a securing member. The connections are flat springs which press the heat sink onto the electronic component.

Description

電子回路基板およびその組立方法Electronic circuit board and its assembly method
　本発明は、電子部品の発熱を外部に放熱するための手段を備えた電子回路基板およびその組立方法に関する。 The present invention relates to an electronic circuit board provided with means for dissipating heat generated by an electronic component to the outside, and an assembling method thereof.
　近年、電子機器に使用されるＩＣ（Ｉｎｔｅｇｒａｔｅｄ　Ｃｉｒｃｕｉｔ）、ＬＳＩ（Ｌａｒｇｅ　Ｓｃａｌｅ　ＩＣ）等の半導体集積回路においては、より高密度な集積化が進められている。内部回路の高集積化に伴い、消費電力も従来に比して増大している。 In recent years, higher density integration has been promoted in semiconductor integrated circuits such as IC (Integrated Circuit) and LSI (Large Scale IC) used in electronic devices. Along with the high integration of internal circuits, the power consumption has also increased compared to the prior art.
　そして、消費電力の増大に比例して、半導体集積回路の内部抵抗等に起因する発熱量も増加している。 And in proportion to the increase in power consumption, the amount of heat generated due to the internal resistance of the semiconductor integrated circuit is also increasing.
　発熱が亢進すると回路動作の効率が低下するのみならず、電子回路の熱暴走や回路素子の損壊を誘発するため、熱源である集積回路の放熱手段を設けることは肝要である。このような放熱手段として、発熱体としての電子部品よりも大きな熱容量を有する金属等の素材で形成されたヒートシンクが知られている。ヒートシンクは、サーマルグリス等の伝熱材料を介して電子部品の外表面に密着させられることで、電子部品の放熱を促すものである。 When the heat generation increases, not only the efficiency of the circuit operation is lowered, but also the thermal runaway of the electronic circuit and the damage of the circuit element are induced. Therefore, it is important to provide the heat radiation means of the integrated circuit as the heat source. As such a heat radiating means, a heat sink formed of a material such as a metal having a larger heat capacity than an electronic component as a heating element is known. The heat sink promotes heat dissipation of the electronic component by being in close contact with the outer surface of the electronic component via a heat transfer material such as thermal grease.
　ヒートシンクによる良好な放熱効果を得るためには、ヒートシンクを電子部品の外表面に対して可能な限り密着させて配置する必要がある。 In order to obtain a good heat dissipation effect by the heat sink, it is necessary to arrange the heat sink as close as possible to the outer surface of the electronic component.
　このようなヒートシンクとしては、例えば以下の特許文献１、２に記載のものが知られている。特許文献１には、コイルバネを介して段付きねじによって基板にヒートシンクを固定するヒートシンクの取付け機構が記載されている。特許文献２には、半導体集積回路パッケージのためのヒートシンク取付構造が記載されている。特許文献２では、半導体集積回路パッケージにパッケージ側取付孔を形成し、ヒートシンクにヒートシンク側取付孔を形成し、これら取付孔を貫通してヒートシンクと半導体集積回路パッケージを密着させたまま維持する取付具を装着することが記載されている。特許文献３では、板ばねからなる弾性部材で、プリント基板をヒートシンクに押圧固定することが提案されている。特許文献４は磁気テープヘッドアクチュエータアセンブリに関するものであり、一対の上側板ばねと一対の下側板ばねとを、ばね支持体と一体化したばね部材として構成し、ばね支持体から互いに対向するようにコの字に曲げることが提案されている。特許文献５は、電子パッケージのヒートシンク構造に関するものである。特許文献５では、ヒートシンクのベース部の保持ばねと、回路化基板のスタッドと、留め具とでヒートシンク下面の圧縮可能な熱伝導部材へ圧縮力を加えると共に、回路化基板の電子デバイスに対してヒートシンクを押すことが提案されている。 As such heat sinks, for example, those described in Patent Documents 1 and 2 below are known. Patent Document 1 describes a heat sink mounting mechanism for fixing a heat sink to a substrate with a stepped screw via a coil spring. Patent Document 2 describes a heat sink mounting structure for a semiconductor integrated circuit package. In Patent Document 2, a package side mounting hole is formed in a semiconductor integrated circuit package, a heat sink side mounting hole is formed in a heat sink, and the heat sink and the semiconductor integrated circuit package are maintained in close contact with each other through the mounting hole. It is described to wear. In Patent Document 3, it is proposed to press and fix a printed circuit board to a heat sink with an elastic member made of a leaf spring. Patent Document 4 relates to a magnetic tape head actuator assembly, in which a pair of upper leaf springs and a pair of lower leaf springs are configured as spring members integrated with a spring support so as to face each other from the spring support. It has been proposed to bend into a U-shape. Patent Document 5 relates to a heat sink structure of an electronic package. In Patent Document 5, a compressive force is applied to a compressible heat conducting member on the lower surface of the heat sink by the holding spring of the base portion of the heat sink, the stud of the circuit board, and the fastener, and the electronic device of the circuit board is applied to the electronic device. It has been proposed to push the heat sink.
特開平５－２４３４３９号公報JP-A-5-243439 特開２００１－１６８２５１号公報JP 2001-168251 A 特開２０１０－８０５８７号公報JP 2010-80587 A 特開２００４－１９９７３１号公報JP 2004-199731 A 特開平１０－１８９８３９号公報Japanese Patent Laid-Open No. 10-189839
　しかしながら、上記特許文献１の装置では、段付きねじの軸部とヒートシンクに設けられた取付孔との間にすきまを設ける必要があるため、外部から衝撃や振動が付加された際に水平方向（基板表面と平行な方向）にヒートシンクがずれる可能性がある。一時的であれ、ヒートシンクにずれが生じると、伝熱材料であるサーマルグリスが気泡を巻き込み、熱伝導性が低下する可能性がある。また、上記特許文献２の装置では、電子部品の外表面に対するヒートシンクの押し付け荷重をコントロールすることが難しい。押し付け荷重が過大な場合は電子部品に悪影響を及ぼす場合がある。反対に、押し付け荷重が不十分な場合は所望の放熱効果を得られない場合がある。さらには、電子部品パッケージの許容寸法公差が小さくなり、電子部品の生産ロットによってはヒートシンクの取付けに困難が生じることもある。結果として、ヒートシンクを電子部品に対して密着させることができずに、発熱体である電子部品の熱量を効率的に放熱することができない可能性がある。 However, in the apparatus of Patent Document 1, since it is necessary to provide a gap between the shaft portion of the stepped screw and the mounting hole provided in the heat sink, when an impact or vibration is applied from the outside (horizontal direction ( There is a possibility that the heat sink shifts in a direction parallel to the substrate surface. Even if temporarily, if the heat sink is displaced, the thermal grease, which is a heat transfer material, entraps bubbles, which may lower the thermal conductivity. Moreover, in the apparatus of Patent Document 2, it is difficult to control the pressing load of the heat sink against the outer surface of the electronic component. If the pressing load is excessive, electronic components may be adversely affected. On the other hand, if the pressing load is insufficient, the desired heat dissipation effect may not be obtained. Furthermore, the allowable dimensional tolerance of the electronic component package is reduced, and it may be difficult to attach the heat sink depending on the production lot of the electronic component. As a result, the heat sink cannot be brought into close contact with the electronic component, and the amount of heat of the electronic component that is a heating element may not be efficiently dissipated.
　本発明は上記課題を解決するためになされたもので、電子部品に対するヒートシンクの押し付け荷重を適正化するとともに、電子部品に対するヒートシンクの水平方向の位置ずれを抑制し、良好な放熱効果を実現する電子回路基板およびその組立方法を提供する。 The present invention has been made in order to solve the above-described problems, and optimizes the pressing load of the heat sink against the electronic component and suppresses the horizontal displacement of the heat sink with respect to the electronic component, thereby realizing an excellent heat dissipation effect. A circuit board and an assembly method thereof are provided.
　本発明の目的は、上記課題を解決する電子回路基板を提供するものである。 An object of the present invention is to provide an electronic circuit board that solves the above problems.
　本発明の第一の態様に係る電子回路基板は、表面に電子部品が実装される基板本体と、電子部品に塗布される伝熱材料と、電子部品に伝熱材料を介して設けられて、電子部品から放射される熱を放熱するヒートシンクと、基板本体の表面上において、電子部品から離間した位置に設けられた固定部材と、第一端部がヒートシンクに固定されるとともに、第一端部とは反対側の第二端部が固定部材を介して基板本体に固定された、少なくとも２つ以上の接続体とを備え、接続体は板バネであって、ヒートシンクを電子部品に押し付けることを特徴とする。 The electronic circuit board according to the first aspect of the present invention is provided with a substrate body on which an electronic component is mounted on a surface, a heat transfer material applied to the electronic component, and an electronic component via the heat transfer material, A heat sink that dissipates heat radiated from the electronic component, a fixing member provided at a position spaced from the electronic component on the surface of the substrate body, a first end portion fixed to the heat sink, and a first end portion And at least two connecting members fixed to the substrate body via a fixing member, and the connecting members are leaf springs and press the heat sink against the electronic component. Features.
　また、本発明の第一態様に係る電子回路基板の組立方法は、基板本体の表面に電子部品を実装し、電子部品に伝熱材料を塗布し、電子部品から放射される熱を放熱するヒートシンクを伝熱材料を介して電子部品に設け、基板本体の表面上において、電子部品から離間した位置に固定部を設け、第一端部が前記ヒートシンクに固定されるとともに、第一端部とは反対側の第二端部が固定部を介して基板本体に固定された板バネからなる接続体によって、ヒートシンクを電子部品に押し付けて基板本体に搭載することを特徴とする。 The electronic circuit board assembly method according to the first aspect of the present invention includes a heat sink that mounts an electronic component on the surface of the substrate body, applies a heat transfer material to the electronic component, and dissipates heat radiated from the electronic component. Is provided on the electronic component via the heat transfer material, a fixing portion is provided on the surface of the substrate body at a position spaced from the electronic component, the first end is fixed to the heat sink, and the first end is The heat sink is pressed against the electronic component and mounted on the board body by a connection body composed of a leaf spring whose second end on the opposite side is fixed to the board body via a fixing part.
　本発明の電子回路基板およびその組立方法によれば、電子部品に塗布された伝熱材料に対するヒートシンクの密着性を高めることができる。加えて、接続体が板バネであるため、外部からの振動や衝撃が付加された場合であっても、ヒートシンクに生じる位置ずれが抑制される。これにより、伝熱材料への気泡の巻き込みを抑制でき、電子部品とヒートシンクとの間に高い密着性を維持することができる。また、ヒートシンクと電子部品との間における密着性の過不足が減少し、ひいては効率よく電子部品の発熱を放熱することができる。 According to the electronic circuit board and the assembling method of the present invention, the adhesion of the heat sink to the heat transfer material applied to the electronic component can be improved. In addition, since the connection body is a leaf spring, even when external vibrations or impacts are applied, misalignment occurring in the heat sink is suppressed. Thereby, entrainment of bubbles in the heat transfer material can be suppressed, and high adhesion between the electronic component and the heat sink can be maintained. Further, the excess or deficiency of the adhesion between the heat sink and the electronic component is reduced, and as a result, the heat generated by the electronic component can be efficiently radiated.
本発明の第一実施形態に係る電子回路基板の分解斜視図である。1 is an exploded perspective view of an electronic circuit board according to a first embodiment of the present invention. 図１の２－２断面図である。FIG. 2 is a sectional view taken along line 2-2 of FIG. 本発明の第一実施形態に係る電子回路基板の変形例を示す分解斜視図である。It is a disassembled perspective view which shows the modification of the electronic circuit board which concerns on 1st embodiment of this invention. 本発明の第二実施形態に係る電子回路基板の正面図である。It is a front view of the electronic circuit board which concerns on 2nd embodiment of this invention.
　（第一実施形態）
　以下、本発明に係る電子回路基板１の第一実施形態について、図１および図２を参照して説明する。 (First embodiment)
Hereinafter, a first embodiment of an electronic circuit board 1 according to the present invention will be described with reference to FIGS. 1 and 2.
　図１は、本発明に係る電子回路基板１の分解斜視図である。電子回路基板１は、表面にプリント配線が設けられた基板本体１０と、基板本体１０のプリント配線に対してはんだ付け等によって実装された電子部品２０と、電子部品２０の外表面２１に塗布される伝熱材料３０と、を備えている。さらに電子回路基板１は、伝熱材料３０を介して電子部品２０の外表面２１に設けられて電子部品２０の発熱を放熱するヒートシンク４０と、ヒートシンク４０と基板本体１０を接続する接続体６０と、を備えている。さらに電子回路基板１は、スタッド５０を介して接続体６０を基板本体１０に固定する固定部材７０を備えている。 FIG. 1 is an exploded perspective view of an electronic circuit board 1 according to the present invention. The electronic circuit board 1 is applied to a substrate body 10 having a printed wiring on its surface, an electronic component 20 mounted on the printed wiring of the substrate body 10 by soldering or the like, and an outer surface 21 of the electronic component 20. Heat transfer material 30. Further, the electronic circuit board 1 is provided on the outer surface 21 of the electronic component 20 via the heat transfer material 30 and dissipates heat generated by the electronic component 20, and a connection body 60 that connects the heat sink 40 and the substrate body 10. It is equipped with. Furthermore, the electronic circuit board 1 includes a fixing member 70 that fixes the connection body 60 to the board body 10 via the stud 50.
　（基板本体、電子部品）
　基板本体１０は、例えばガラスエポキシやアルミナ等で形成された公知の電気配線用材料であり、その一方の面である実装面１１にはエッチングによって所望のプリント配線（不図示）が形成されている。図１に示すように、本実施形態における基板本体１０は薄肉板状に形成されている。さらに、基板本体１０は後述する接続体６０の接続位置に対応してスタッド５０および基板側取付孔１２を有している。基板側取付孔１２の開孔径は、後述する固定部材７０であるねじの軸径に応じて任意に決定されてよい。 (Board body, electronic components)
The substrate body 10 is a known electric wiring material formed of, for example, glass epoxy or alumina, and a desired printed wiring (not shown) is formed on the mounting surface 11 which is one surface thereof by etching. . As shown in FIG. 1, the substrate body 10 in the present embodiment is formed in a thin plate shape. Furthermore, the board body 10 has a stud 50 and a board-side attachment hole 12 corresponding to a connection position of a connection body 60 described later. The opening diameter of the board-side mounting hole 12 may be arbitrarily determined according to the shaft diameter of a screw that is a fixing member 70 described later.
　電子部品２０は、例えばＬＳＩパッケージのように、内部に集積回路素子を備えるとともに外装が樹脂材料若しくは金属材料によって密封された部品である。本実施形態における電子部品２０は、上面視矩形の板状の外観を有して形成されており、基板本体１０と対向する側の表面には、複数の金属製端子（不図示）が突出している。電子部品２０は、この端子を介して上述の基板本体１０の実装面１１上におけるプリント配線にはんだ付けされて、電気的に接続されるとともに、物理的に固定される。 The electronic component 20 is a component having an integrated circuit element inside and sealed with a resin material or a metal material, such as an LSI package. The electronic component 20 in the present embodiment is formed to have a rectangular plate-like appearance when viewed from above, and a plurality of metal terminals (not shown) protrude from the surface facing the substrate body 10. Yes. The electronic component 20 is soldered to the above-described printed wiring on the mounting surface 11 of the substrate body 10 through this terminal, and is electrically connected and physically fixed.
　（ヒートシンク）
　ヒートシンク４０は外形視直方体状に形成された部材である。図１に示すように、ヒートシンク４０は上面視矩形を成す薄肉板状の基台４４と、基台４４の一方側の表面において基台４４の延在平面と直交する方向に突出する複数の板状の放熱板４３とを有する。複数の放熱板４３は、互いの間に一定の間隙を有して平行に設けられる。放熱板４３が設けられる側の面は放熱面４２を形成し、放熱面４２と反対側の面は平滑な平面状に形成されて、吸熱面４１を形成する。 (heatsink)
The heat sink 40 is a member formed in a rectangular parallelepiped shape as viewed from the outside. As shown in FIG. 1, the heat sink 40 includes a thin plate-like base 44 that has a rectangular shape when viewed from above, and a plurality of plates that protrude in a direction perpendicular to the extending plane of the base 44 on one surface of the base 44. And a heat sink 43 having a shape. The plurality of heat sinks 43 are provided in parallel with a certain gap between each other. The surface on which the heat radiating plate 43 is provided forms a heat radiating surface 42, and the surface opposite to the heat radiating surface 42 is formed into a smooth flat surface to form the heat absorbing surface 41.
　ヒートシンク４０の、基台４４の長手方向における両端部にはフランジ４６が形成されている。フランジ４６は、基台４４の延在する平面と直交する方向（厚さ方向）に基台４４を貫通する第一取付孔４５を有する。第一取付孔４５はそれぞれのフランジ４６に２つずつ設けられている。なお、第一取付孔４５の開口径や、同一のフランジ４６における２つの第一取付孔４５の離間距離は、設計上の必要に応じて任意に決定されてよい。 Flange 46 is formed at both ends of heat sink 40 in the longitudinal direction of base 44. The flange 46 has a first mounting hole 45 that passes through the base 44 in a direction (thickness direction) perpendicular to the plane in which the base 44 extends. Two first mounting holes 45 are provided in each flange 46. Note that the opening diameter of the first mounting hole 45 and the distance between the two first mounting holes 45 in the same flange 46 may be arbitrarily determined according to design requirements.
　ヒートシンク４０は、電子部品２０の外装パッケージを形成する樹脂材料と比較して高い熱伝導性を有する金属材料によって一体に形成される。このような良好な熱伝導性を有する金属材料として、例えばアルミニウムや銅が好適である。 The heat sink 40 is integrally formed of a metal material having higher thermal conductivity than the resin material that forms the exterior package of the electronic component 20. As such a metal material having good thermal conductivity, for example, aluminum or copper is suitable.
　本実施形態に係る電子回路基板１を組み上げた状態（図２参照）にあっては、ヒートシンク４０の吸熱面４１と電子部品２０の外表面２１との間に、５～１０Ｗ／ｍ・Ｋ程度の高い熱伝導率を有するサーマルグリスが伝熱材料３０として介在する。 In a state where the electronic circuit board 1 according to the present embodiment is assembled (see FIG. 2), between the heat absorbing surface 41 of the heat sink 40 and the outer surface 21 of the electronic component 20 is about 5 to 10 W / m · K. Thermal grease having a high thermal conductivity is interposed as the heat transfer material 30.
　サーマルグリスは、断熱材として作用する空気を、ヒートシンク４０と電子部品２０との間から排除することを目的とする。サーマルグリスの主成分はシリコンであり、熱伝導性を高めるために銀や銅、アルミナ等の微粉末が混合されて、ペースト状に形成されている。 The purpose of the thermal grease is to exclude air acting as a heat insulating material from between the heat sink 40 and the electronic component 20. The main component of the thermal grease is silicon, which is formed into a paste by mixing fine powders such as silver, copper, and alumina in order to increase thermal conductivity.
　（接続体、固定部材、スタッド）
　図１に示すように、接続体６０は平面視矩形の板バネである。接続体６０は、それぞれの角部に４つの開孔を有している。４つの開孔のうち、接続体６０の一方の長辺側の第一端部４７に設けられた２つの開孔は、ヒートシンク４０のフランジ４６に設けられた２つの第一取付孔４５の離間距離と同一の離間距離を持って設けられて、第二取付孔６１を形成する。第二取付孔６１と第一取付孔４５とに挿入されるねじ等の固定部材８０により、ヒートシンク４０と接続体６０の第一端部４７とが固定される。一方、第二取付孔６１が設けられた長辺とは反対側の他方の長辺側における第二端部４８に設けられた２つの開孔は、ねじ等の固定部材７０を介してスタッド５０（後述）と接続体６０を固定するための第三取付孔６２となっている。 (Connector, fixing member, stud)
As shown in FIG. 1, the connection body 60 is a flat plate spring having a rectangular shape in plan view. The connection body 60 has four openings at each corner. Of the four openings, the two openings provided in the first end 47 on one long side of the connection body 60 are spaced apart from the two first mounting holes 45 provided in the flange 46 of the heat sink 40. The second mounting hole 61 is formed with a separation distance equal to the distance. The heat sink 40 and the first end 47 of the connection body 60 are fixed by a fixing member 80 such as a screw inserted into the second mounting hole 61 and the first mounting hole 45. On the other hand, the two openings provided in the second end portion 48 on the other long side opposite to the long side provided with the second mounting hole 61 are connected to the stud 50 via a fixing member 70 such as a screw. A third mounting hole 62 for fixing the connection body 60 (described later).
　接続体６０は、例えばバネ鋼材等の金属製の板材によって形成される。厚さ方向における曲げ応力に対して十分な弾性が得られる限りにおいて、接続体６０の厚さ寸法は任意に決定されてよい。接続体６０は、厚さ方向に弾性力を有すると同時に、厚さ方向に直交する方向においては剛性を有するため、接続体６０の厚さ方向に直交する方向から付加される荷重に対しては変形や湾曲を生じにくい。 The connection body 60 is formed of a metal plate material such as a spring steel material. As long as sufficient elasticity is obtained with respect to the bending stress in the thickness direction, the thickness dimension of the connection body 60 may be arbitrarily determined. Since the connection body 60 has elasticity in the thickness direction and at the same time has rigidity in the direction orthogonal to the thickness direction, the connection body 60 is not subjected to a load applied from the direction orthogonal to the thickness direction of the connection body 60. Less prone to deformation and curvature.
　スタッド５０は、樹脂等で形成された柱状の部材である。なお、スタッド５０の軸線方向の延在寸法は以下のように決定される。すなわち、スタッド５０の軸線方向の寸法は、後述の組立方法によって組み上がった状態の電子回路基板１において（図２を参照）、ヒートシンク４０の基台４４の放熱面４２から基板本体１０の実装面１１までの寸法よりも、所定の寸法だけ短く形成される。したがって、組み上げた状態の電子回路基板１において上述の接続体６０は、弾性変形した状態で維持されて、ヒートシンク４０を電子部品２０に押し付ける。より具体的には、接続体６０はヒートシンク４０側の端部からスタッド５０側の端部に向かうに従って、基板本体１０の実装面１１に近づく方向に緩やかに湾曲した状態で維持される。 Stud 50 is a columnar member made of resin or the like. The extension dimension of the stud 50 in the axial direction is determined as follows. That is, the dimension in the axial direction of the stud 50 is such that the mounting surface of the substrate body 10 is mounted from the heat radiation surface 42 of the base 44 of the heat sink 40 in the electronic circuit board 1 assembled by an assembly method described later (see FIG. 2). It is shorter than the dimension up to 11 by a predetermined dimension. Therefore, in the assembled electronic circuit board 1, the connection body 60 described above is maintained in an elastically deformed state and presses the heat sink 40 against the electronic component 20. More specifically, the connection body 60 is maintained in a state of being gently curved in a direction approaching the mounting surface 11 of the board body 10 from the end on the heat sink 40 side toward the end on the stud 50 side.
　次に、本実施形態に係る電子回路基板１の組立方法の一例及び作用について説明する。 Next, an example and an operation of the assembly method of the electronic circuit board 1 according to the present embodiment will be described.
　まず、図１に示すように、基板本体１０の実装面１１に実装された電子部品２０の外表面２１に対して、サーマルグリス等の伝熱材料３０を塗布する。 First, as shown in FIG. 1, a heat transfer material 30 such as thermal grease is applied to the outer surface 21 of the electronic component 20 mounted on the mounting surface 11 of the substrate body 10.
　次に、塗布された伝熱材料３０にヒートシンク４０の吸熱面４１を密着させて電子部品２０の外表面２１にヒートシンク４０を搭載する。 Next, the heat absorbing surface 41 of the heat sink 40 is brought into close contact with the applied heat transfer material 30 and the heat sink 40 is mounted on the outer surface 21 of the electronic component 20.
　続いて、４つのスタッド５０を前述の基板側取付孔１２の上方に配置する。 Subsequently, four studs 50 are arranged above the board-side mounting hole 12 described above.
　さらに、接続体６０を配置する。このとき、接続体６０に設けられた第二取付孔６１を、ヒートシンク４０のフランジ４６に設けられた第一取付孔４５と対応させ、接続体６０に設けられた第三取付孔６２をあらかじめ基板本体１０の実装面１１上に配置したスタッド５０の位置に対応させる。 Furthermore, the connection body 60 is arranged. At this time, the second mounting hole 61 provided in the connection body 60 is made to correspond to the first mounting hole 45 provided in the flange 46 of the heat sink 40, and the third mounting hole 62 provided in the connection body 60 is preliminarily formed on the substrate. It corresponds to the position of the stud 50 arranged on the mounting surface 11 of the main body 10.
　最後に、第三取付孔６２に挿入されたねじ等の固定部材７０を用いて、接続体６０の第二端部４８とスタッド５０とを接続するとともに、第二取付孔６１に挿入されたねじ等の固定部材８０を用いて、接続体６０の第一端部４７とヒートシンク４０とを接続する。接続体６０の第二端部４８とスタッド５０との接続により、接続体６０の第二端部４８と基板本体１０とがスタッド５０を介して接続される。以上で、電子回路基板１の組立が完了する。 Finally, the fixing member 70 such as a screw inserted into the third mounting hole 62 is used to connect the second end 48 of the connection body 60 and the stud 50 and the screw inserted into the second mounting hole 61. The first end portion 47 of the connection body 60 and the heat sink 40 are connected using a fixing member 80 such as the above. By connecting the second end 48 of the connection body 60 and the stud 50, the second end 48 of the connection body 60 and the substrate body 10 are connected via the stud 50. Thus, the assembly of the electronic circuit board 1 is completed.
　上述したように、ヒートシンク４０は電子部品２０に対して接続体６０とスタッド５０を介して固定される。このとき、スタッド５０の軸線方向における寸法は、ヒートシンク４０の基台４４の放熱面４２から基板本体１０の実装面１１までの寸法よりも、所定の寸法だけ短く形成される。したがって、組み上げた状態において、接続体６０は弾性変形を伴って湾曲した状態で固定される。すなわち、接続体６０は自身の弾性力によって、ヒートシンク４０を電子部品２０に対して付勢する力を発する。 As described above, the heat sink 40 is fixed to the electronic component 20 via the connection body 60 and the stud 50. At this time, the dimension of the stud 50 in the axial direction is shorter than the dimension from the heat radiation surface 42 of the base 44 of the heat sink 40 to the mounting surface 11 of the substrate body 10 by a predetermined dimension. Therefore, in the assembled state, the connection body 60 is fixed in a curved state with elastic deformation. That is, the connection body 60 generates a force that urges the heat sink 40 against the electronic component 20 by its own elastic force.
　したがって、本実施形態に係る電子回路基板１においては、ヒートシンク４０が電子部品２０に対して高い密着性を維持して固定される。これにより、電子回路の動作時に電子部品２０が発熱した際にも、ヒートシンク４０は高い放熱性能を発揮する。また、電子回路基板１に対して外部から振動や衝撃が付加された場合であっても、接続体６０が弾性力を有することにより、基板本体１０の実装面１１に直交する方向（垂直方向）におけるヒートシンク４０の位置ずれを吸収することができる。 Therefore, in the electronic circuit board 1 according to this embodiment, the heat sink 40 is fixed to the electronic component 20 while maintaining high adhesion. Thereby, even when the electronic component 20 generates heat during operation of the electronic circuit, the heat sink 40 exhibits high heat dissipation performance. Further, even when vibration or impact is applied to the electronic circuit board 1 from the outside, the connection body 60 has an elastic force so that the direction orthogonal to the mounting surface 11 of the board body 10 (vertical direction). The misalignment of the heat sink 40 can be absorbed.
　また、上述したように、接続体６０は厚さ方向と直交する方向においては剛性を有するため、接続体６０の厚さ方向と直交する方向から付加される荷重に対しては変形や湾曲を生じない。加えて、接続体６０はねじ等の固定部材７０、８０によって強固に固定されているので、基板本体１０の実装面１１に沿う方向（水平方向）に作用する衝撃力や振動に対して抗することができる。したがって、ヒートシンク４０に水平方向の位置ずれが生じることを抑止することができる。これにより、伝熱材料３０への気泡の巻き込みを抑制できるため、ヒートシンク４０によって良好な放熱効果を得ることができる。 Further, as described above, since the connection body 60 has rigidity in the direction orthogonal to the thickness direction, the connection body 60 is deformed or curved with respect to the load applied from the direction orthogonal to the thickness direction of the connection body 60. Absent. In addition, since the connection body 60 is firmly fixed by fixing members 70 and 80 such as screws, the connection body 60 resists impact force and vibration acting in a direction (horizontal direction) along the mounting surface 11 of the substrate body 10. be able to. Therefore, it is possible to prevent horizontal displacement from occurring in the heat sink 40. Thereby, since the entrainment of bubbles in the heat transfer material 30 can be suppressed, a good heat dissipation effect can be obtained by the heat sink 40.
　さらに、接続体６０が弾性力を有する板バネであることから、電子部品２０の取付誤差や、製造時の寸法公差を吸収することができる。したがって、はんだ付けの精度や電子部品２０の外形寸法にばらつきがある場合であっても、ヒートシンク４０を電子部品２０に対して容易に取り付けることができるとともに、高い放熱効果を維持することができる。 Furthermore, since the connection body 60 is a leaf spring having elasticity, it is possible to absorb mounting errors of the electronic component 20 and dimensional tolerances during manufacturing. Therefore, even when there are variations in the soldering accuracy and the external dimensions of the electronic component 20, the heat sink 40 can be easily attached to the electronic component 20, and a high heat dissipation effect can be maintained.
　また、接続体６０と基板本体１０の間にはスタッド５０が介在している。これにより、スタッド５０の軸方向の寸法と、ヒートシンク４０の基台４４における放熱面４２から基板本体１０の実装面１１までの寸法との差に応じて、接続体６０の湾曲量は変わる。そして、板バネとして作用する接続体６０は、この湾曲量に応じた弾性力を発揮する。 Further, a stud 50 is interposed between the connection body 60 and the board body 10. Accordingly, the amount of bending of the connection body 60 changes according to the difference between the axial dimension of the stud 50 and the dimension from the heat radiation surface 42 of the base 44 of the heat sink 40 to the mounting surface 11 of the substrate body 10. And the connection body 60 which acts as a leaf | plate spring exhibits the elastic force according to this bending amount.
　したがって、接続体６０と基板本体１０の間に介在するスタッド５０の寸法を設計に応じて適宜変更することで、電子部品２０に対してヒートシンク４０が付加する荷重（弾性力）を調節することができる。これにより、必要に応じて適切な荷重でヒートシンク４０を電子部品２０に密接させることができる。言い換えると、過大な荷重が付加されることで生じる電子部品２０の損壊を抑止することできる。加えて、荷重が不十分な場合、密着性が不足することで生じる放熱不良を抑制することができる。これにより、本実施形態に係る電子回路基板１は、電子部品２０の発熱をヒートシンク４０を介して効率よく外部に放熱することができる。 Therefore, the load (elastic force) applied to the electronic component 20 by the heat sink 40 can be adjusted by appropriately changing the size of the stud 50 interposed between the connection body 60 and the board body 10 according to the design. it can. Thereby, the heat sink 40 can be brought into close contact with the electronic component 20 with an appropriate load as necessary. In other words, damage to the electronic component 20 caused by applying an excessive load can be suppressed. In addition, when the load is insufficient, it is possible to suppress heat radiation failure caused by insufficient adhesion. Thereby, the electronic circuit board 1 according to the present embodiment can efficiently radiate the heat generated by the electronic component 20 to the outside via the heat sink 40.
　また、ヒートシンク４０と電子部品２０の間にはサーマルグリス等の伝熱材料３０が介在している。したがって、電子部品２０の発熱量はより効率的にヒートシンク４０に伝搬され、やがてヒートシンク４０の放熱板４３から外部に向けて放射される。これにより、本実施形態に係る電子回路基板１は電子部品２０の発熱を効率よく放熱し、電子回路の正常動作を維持することができる。また、熱による電子部品２０の損壊が抑制される。 Further, a heat transfer material 30 such as thermal grease is interposed between the heat sink 40 and the electronic component 20. Therefore, the amount of heat generated by the electronic component 20 is more efficiently transmitted to the heat sink 40 and eventually radiated from the heat sink 43 of the heat sink 40 toward the outside. Thereby, the electronic circuit board 1 according to the present embodiment can efficiently dissipate the heat generated by the electronic component 20 and maintain the normal operation of the electronic circuit. Moreover, damage to the electronic component 20 due to heat is suppressed.
　以上、本発明の実施形態について図面を参照して詳述したが、具体的な構成はこの実施形態に限られるものではなく、本発明の要旨を逸脱しない範囲の設計変更等も含まれる。 The embodiment of the present invention has been described in detail above with reference to the drawings. However, the specific configuration is not limited to this embodiment, and design changes and the like within a scope not departing from the gist of the present invention are included.
　上述の実施形態においては、接続体６０は矩形に形成された金属製の板材によって形成されるとした。しかし、適切な弾性力を有する限りにおいて、接続体６０の形状や材質に制限はない。 In the above-described embodiment, the connection body 60 is formed of a metal plate formed in a rectangular shape. However, the shape and material of the connection body 60 are not limited as long as it has an appropriate elastic force.
　例えば、図３に示すように、接続体６０の一部に凹部６３が形成されていてもよい。凹部６３の寸法を適宜変更することにより、接続体６０の板バネとしての弾性力を調節することができる。加えて、上述の実施形態と同様の作用により、電子部品２０の発熱に対して高い放熱効果を奏する電子回路基板１を得ることができる。 For example, as shown in FIG. 3, a recess 63 may be formed in a part of the connection body 60. By appropriately changing the size of the recess 63, the elastic force of the connecting body 60 as a leaf spring can be adjusted. In addition, the electronic circuit board 1 that exhibits a high heat dissipation effect against the heat generated by the electronic component 20 can be obtained by the same operation as that of the above-described embodiment.
　また、上述の実施形態においては、固定部材７０、８０としてねじを用いた例を説明した。しかし、固定部材７０、８０はねじに限定されず、接続体６０と基板本体１０（スタッド５０）、又は接続体６０とヒートシンク４０をそれぞれ互いに固定できる限りにおいては、いかなる手段を用いても良い。 Further, in the above-described embodiment, an example in which screws are used as the fixing members 70 and 80 has been described. However, the fixing members 70 and 80 are not limited to screws, and any means may be used as long as the connection body 60 and the substrate body 10 (stud 50) or the connection body 60 and the heat sink 40 can be fixed to each other.
　さらに、上述の実施形態においては、一例として直方体状のヒートシンク４０について説明したが、放熱性を志向して設計された製品である限りにおいて、ヒートシンク４０の形状や材質、寸法は設計上任意に決定されてよい。 Furthermore, in the above-described embodiment, the rectangular parallelepiped heat sink 40 has been described as an example. However, as long as the product is designed for heat dissipation, the shape, material, and dimensions of the heat sink 40 are arbitrarily determined by design. May be.
　（第二実施形態）
　本発明に係る電子回路基板１の第二実施形態について図４を参照して説明する。また、以下の説明では、前述の第一実施形態と同様の部材については同じ符号を付し、詳細な説明を省略する。 (Second embodiment)
A second embodiment of the electronic circuit board 1 according to the present invention will be described with reference to FIG. Moreover, in the following description, the same code | symbol is attached | subjected about the member similar to above-mentioned 1st embodiment, and detailed description is abbreviate | omitted.
　本発明の第二実施形態に係る電子回路基板１は、以下の点で第一実施形態とは異なる。
すなわち、第二実施形態においては、また、接続体６０の端部はスタッド５０を介さず、基板本体１０に直接固定されている。 The electronic circuit board 1 according to the second embodiment of the present invention is different from the first embodiment in the following points.
That is, in the second embodiment, the end of the connection body 60 is directly fixed to the substrate body 10 without the stud 50 being interposed.
　第一実施形態と同様に、電子部品２０に対してヒートシンク４０が付加する荷重（弾性力）を調節することができる。これにより、必要に応じて適切な荷重でヒートシンク４０を電子部品２０に密接させることができる。言い換えると、過大な荷重が付加されることで生じる電子部品２０の損壊を抑止することできる。加えて、荷重が不十分な場合、密着性が不足することで生じる放熱不良を抑制することができる。これにより、本実施形態に係る電子回路基板１は、電子部品２０の発熱をヒートシンク４０を介して効率よく外部に放熱することができる。 As in the first embodiment, the load (elastic force) applied to the electronic component 20 by the heat sink 40 can be adjusted. Thereby, the heat sink 40 can be brought into close contact with the electronic component 20 with an appropriate load as necessary. In other words, damage to the electronic component 20 caused by applying an excessive load can be suppressed. In addition, when the load is insufficient, it is possible to suppress heat radiation failure caused by insufficient adhesion. Thereby, the electronic circuit board 1 according to the present embodiment can efficiently radiate the heat generated by the electronic component 20 to the outside via the heat sink 40.
　以上、本発明の好ましい実施形態を説明したが、本発明はこれに限定されるものではない。例えば、第一実施形態においては、基板本体１０の裏面にスチフナを配置し、スチフナの取付孔にスタッド５０及び基板本体１０を介して固定部材７０を固定してもよい。この場合、基板本体１０の基板側取付孔１２は貫通孔とし、基板本体１０の貫通孔を貫通させて固定部材７０をスチフナに固定してもよい。第二実施形態においては、基板本体１０の裏面にスチフナを配置し、スチフナの取付孔に基板本体１０を介して固定部材７０を固定してもよい。この場合、基板本体１０の基板側取付孔１２は貫通孔とし、基板本体１０の貫通孔を貫通させて固定部材７０をスチフナに固定してもよい。上述した実施形態では、伝熱材料３０は電子部品２０の外表面２１に塗布されるものであるとして説明したが、これに限られない。固形の伝熱部材を電子部品２０とヒートシンク４０との間に挿入することによって、電子部品２０の外表面２１とヒートシンク４０との間に伝熱材料３０を介在させてもよい。請求の範囲に記載した発明の範囲内で、種々の変形が可能であり、それらも本発明の範囲に含まれることはいうまでもない。 The preferred embodiment of the present invention has been described above, but the present invention is not limited to this. For example, in the first embodiment, a stiffener may be disposed on the back surface of the substrate body 10, and the fixing member 70 may be fixed to the attachment hole of the stiffener via the stud 50 and the substrate body 10. In this case, the board-side attachment hole 12 of the board body 10 may be a through hole, and the fixing member 70 may be fixed to the stiffener through the through hole of the board body 10. In the second embodiment, a stiffener may be disposed on the back surface of the substrate body 10, and the fixing member 70 may be fixed to the stiffener attachment hole via the substrate body 10. In this case, the board-side attachment hole 12 of the board body 10 may be a through hole, and the fixing member 70 may be fixed to the stiffener through the through hole of the board body 10. In the above-described embodiment, the heat transfer material 30 has been described as being applied to the outer surface 21 of the electronic component 20, but is not limited thereto. The heat transfer material 30 may be interposed between the outer surface 21 of the electronic component 20 and the heat sink 40 by inserting a solid heat transfer member between the electronic component 20 and the heat sink 40. It goes without saying that various modifications are possible within the scope of the invention described in the claims, and these are also included in the scope of the present invention.
　上記の実施形態の一部又は全部は、以下の付記のようにも記載されうるが、以下には限られない。
（付記１）表面に電子部品が実装される基板本体と、
前記電子部品に塗布される伝熱材料と、
前記電子部品に前記伝熱材料を介して設けられて、前記電子部品から放射される熱を放熱するヒートシンクと、
前記基板本体の表面上において、前記電子部品から離間した位置に設けられた固定部材と、
第一端部が前記ヒートシンクに固定されるとともに、前記第一端部とは反対側の第二端部が前記固定部材を介して前記基板本体に固定された、少なくとも２つ以上の接続体と、を備え、
前記接続体は板バネであって、前記ヒートシンクを前記電子部品に押し付ける電子回路基板。
（付記２）前記固定部材は、前記基板本体の表面と直交する方向に延在する柱状のスタッドを介して前記基板本体に固定される付記１に記載の電子回路基板。
（付記３）基板本体の表面に電子部品を実装し、
前記電子部品に伝熱材料を塗布し、
前記電子部品から放射される熱を放熱するヒートシンクを前記伝熱材料を介して前記電子部品に設け、
前記基板本体の表面上において、前記電子部品から離間した位置に固定部を設け、
第一端部が前記ヒートシンクに固定されるとともに、前記第一端部とは反対側の第二端部が前記固定部を介して前記基板本体に固定された板バネからなる接続体によって、前記ヒートシンクを前記電子部品に押し付けて前記基板本体に搭載する電子回路基板の組立方法。
（付記４）一主表面に電子部品が実装される基板本体と、
所定の伝熱材料を介して前記電子部品上に配置されるヒートシンクと、
第一端部及び前記第一端部とは異なる第二端部を有する、少なくとも２つの接続体であって、前記第一端部が前記ヒートシンクに固定される少なくとも２つの接続体と、
前記少なくとも２つの接続体の前記第二端部を、前記基板本体の前記一主表面上で前記電子部品が実装される位置から離間した位置に固定する固定部材と、を備え、
前記接続体は板バネであって前記ヒートシンクを前記電子部品に押し付ける、電子回路基板。
（付記５）前記接続体の前記第二端部は、前記接続体の前記第一端部の反対側に位置している、付記４に記載の電子回路基板。
（付記６）前記接続体は矩形をなしている、付記４又は付記５に記載の電子回路基板。
（付記７）前記接続体は矩形をなしており、一つの長辺側に凹部を有する、付記４又は付記５に記載の電子回路基板。
（付記８）前記接続体の前記第一端部及び前記第二端部は、前記矩形の長辺側に位置している、付記６又は付記７に記載の電子回路基板。
（付記９）前記固定部材は、前記基板本体の表面と実質的に直交する方向に延在する柱状のスタッドを介して前記基板本体に固定される、付記４乃至付記８のいずれか一つに記載の電子回路基板。
（付記１０）基板本体の表面に電子部品を実装し、
所定の伝熱材料を介して前記電子部品上にヒートシンクを配置し、
第一端部及び前記第一端部とは異なる第二端部を有する板バネ状の、少なくとも２つの接続体の前記第一端部をそれぞれ前記ヒートシンクに固定し、
前記２つの接続体の前記第二端部をそれぞれ、前記基板本体の表面上で前記電子部品が実装される位置から離間した位置で前記基板本体に固定することにより、前記ヒートシンクを前記電子部品に押し付ける、電子回路基板の組立方法。
（付記１１）前記接続体の前記第二端部は、前記接続体の前記第一端部の反対側に位置している、付記１０に記載の電子回路基板の組立方法。
（付記１２）前記接続体の前記第一端部が固定された前記ヒートシンクを前記電子部品上に配置した後で、
前記接続体の前記第二端部を固定部材で前記基板本体に固定することにより、前記ヒートシンクを前記電子部品に押し付ける、付記１０又は付記１１に記載の電子回路基板の組立方法。
（付記１３）前記ヒートシンクを前記電子部品上に配置した後で、
前記接続体の前記第一端部を前記ヒートシンクに固定すると共に、前記接続体の前記第二端部を固定部材で前記基板本体に固定することにより、前記ヒートシンクを前記電子部品に押し付ける、付記１０又は付記１１に記載の電子回路基板の組立方法。
（付記１４）前記接続体として、前記第二端部が前記第一端部の反対側に位置している接続体を用いる、付記１３に記載の電子回路基板の組立方法。
（付記１５）前記接続体として、矩形をなしている接続体を用いる、付記１３又は付記１４に記載の電子回路基板の組立方法。
（付記１６）前記接続体として、矩形をなしており、かつ一つの長辺側に凹部を有する接続体を用いる、付記１３又は付記１４に記載の電子回路基板の組立方法。
（付記１７）前記接続体として、前記第一端部及び前記第二端部が前記矩形の長辺側に位置している接続体を用いる、付記１５又は付記１６に記載の電子回路基板の組立方法。
（付記１８）前記基板本体の表面と実質的に直交する方向に延在する柱状のスタッドを介して、前記固定部材を前記基板本体に固定する、付記１３乃至付記１７のいずれか一つに記載の電子回路基板の組立方法。 A part or all of the above-described embodiment can be described as in the following supplementary notes, but is not limited thereto.
(Appendix 1) a substrate body on which electronic components are mounted on the surface;
A heat transfer material applied to the electronic component;
A heat sink provided in the electronic component via the heat transfer material to dissipate heat radiated from the electronic component;
On the surface of the substrate body, a fixing member provided at a position separated from the electronic component;
At least two or more connecting bodies having a first end fixed to the heat sink and a second end opposite to the first end fixed to the substrate body via the fixing member; With
The connection body is a leaf spring, and the electronic circuit board presses the heat sink against the electronic component.
(Additional remark 2) The said fixing member is an electronic circuit board of Additional remark 1 fixed to the said board | substrate body via the columnar stud extended in the direction orthogonal to the surface of the said board | substrate body.
(Appendix 3) Mounting electronic components on the surface of the board body,
Applying a heat transfer material to the electronic component,
A heat sink that dissipates heat radiated from the electronic component is provided in the electronic component via the heat transfer material,
On the surface of the substrate body, a fixing portion is provided at a position separated from the electronic component,
The first end portion is fixed to the heat sink, and the second end opposite to the first end portion is connected to the substrate body via the fixing portion. A method of assembling an electronic circuit board, wherein a heat sink is pressed against the electronic component and mounted on the board body.
(Appendix 4) A board body on which electronic components are mounted on one main surface;
A heat sink disposed on the electronic component via a predetermined heat transfer material;
At least two connectors having a second end different from the first end and the first end, wherein the first end is fixed to the heat sink; and
A fixing member for fixing the second end of the at least two connection bodies at a position spaced apart from a position where the electronic component is mounted on the one main surface of the substrate body,
The connection body is a leaf spring and presses the heat sink against the electronic component.
(Supplementary note 5) The electronic circuit board according to supplementary note 4, wherein the second end portion of the connection body is located on a side opposite to the first end portion of the connection body.
(Appendix 6) The electronic circuit board according to Appendix 4 or Appendix 5, wherein the connection body is rectangular.
(Supplementary note 7) The electronic circuit board according to supplementary note 4 or supplementary note 5, wherein the connection body has a rectangular shape and has a concave portion on one long side.
(Supplementary note 8) The electronic circuit board according to supplementary note 6 or supplementary note 7, wherein the first end portion and the second end portion of the connection body are located on a long side of the rectangle.
(Supplementary note 9) In any one of Supplementary notes 4 to 8, the fixing member is fixed to the substrate body through a columnar stud extending in a direction substantially orthogonal to the surface of the substrate body. The electronic circuit board as described.
(Appendix 10) Mounting electronic components on the surface of the board body,
Placing a heat sink on the electronic component via a predetermined heat transfer material,
A plate spring-like shape having a second end different from the first end and the first end, and fixing the first end of at least two connectors to the heat sink,
The heat sink is attached to the electronic component by fixing the second end portions of the two connecting bodies to the substrate main body at a position spaced from the position where the electronic component is mounted on the surface of the substrate main body. The assembly method of the electronic circuit board to be pressed.
(Additional remark 11) The said 2nd end part of the said connection body is an assembly method of the electronic circuit board of Additional remark 10 located in the other side of the said 1st end part of the said connection body.
(Additional remark 12) After arrange | positioning the said heat sink with which the said 1st end part of the said connection body was fixed on the said electronic component,
The electronic circuit board assembly method according to appendix 10 or appendix 11, wherein the heat sink is pressed against the electronic component by fixing the second end portion of the connection body to the substrate body with a fixing member.
(Supplementary note 13) After placing the heat sink on the electronic component,
The first end portion of the connection body is fixed to the heat sink, and the second end portion of the connection body is fixed to the substrate body with a fixing member, whereby the heat sink is pressed against the electronic component. Alternatively, the electronic circuit board assembly method according to appendix 11.
(Additional remark 14) The assembly method of the electronic circuit board of Additional remark 13 using the connection body in which said 2nd end part is located in the other side of said 1st end part as said connection body.
(Additional remark 15) The assembly method of the electronic circuit board of Additional remark 13 or Additional remark 14 using the connection body which has comprised the rectangle as said connection body.
(Additional remark 16) The assembly method of the electronic circuit board of Additional remark 13 or Additional remark 14 which uses the connection body which has made the rectangle and has a recessed part in one long side as said connection body.
(Supplementary Note 17) Assembling the electronic circuit board according to Supplementary Note 15 or 16, wherein the connection body uses a connection body in which the first end portion and the second end portion are positioned on the long side of the rectangle. Method.
(Supplementary note 18) The supplementary note 13 to the supplementary note 17, wherein the fixing member is fixed to the substrate body via a columnar stud extending in a direction substantially orthogonal to the surface of the substrate body. Assembly method for electronic circuit boards.
　この出願は、２０１３年１０月４日に出願された日本出願特願２０１３－２０８９１４号を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority based on Japanese Patent Application No. 2013-208914 filed on Oct. 4, 2013, the entire disclosure of which is incorporated herein.
　１　　電子回路基板
　１０　　基板本体
　１１　　実装面
　１２　　基板側取付孔
　２０　　電子部品
　２１　　外表面
　３０　　伝熱材料
　４０　　ヒートシンク
　４１　　吸熱面
　４２　　放熱面
　４３　　放熱板
　４４　　基台
　４５　　第一取付孔
　４６　　フランジ
　４７　　第一端部
　４８　　第二端部
　５０　　スタッド
　６０　　接続体
　６１　　第二取付孔
　６２　　第三取付孔
　６３　　凹部
　７０　　固定部材
　８０　　固定部材 DESCRIPTION OF SYMBOLS 1 Electronic circuit board 10 Board | substrate main body 11 Mounting surface 12 Board | substrate side attachment hole 20 Electronic component 21 Outer surface 30 Heat transfer material 40 Heat sink 41 Heat absorption surface 42 Heat radiation surface 43 Heat radiation plate 44 Base 45 First attachment hole 46 Flange 47 First end Portion 48 Second end 50 Stud 60 Connector 61 Second mounting hole 62 Third mounting hole 63 Recess 70 Fixing member 80 Fixing member

Claims (10)

  1. 　一主表面に電子部品が実装される基板本体と、
    　所定の伝熱材料を介して前記電子部品上に配置されるヒートシンクと、
    　第一端部及び前記第一端部とは異なる第二端部を有する、少なくとも２つの接続体であって、前記第一端部が前記ヒートシンクに固定される少なくとも２つの接続体と、
    　前記少なくとも２つの接続体の前記第二端部を、前記基板本体の前記一主表面上で前記電子部品が実装される位置から離間した位置に固定する固定部材と、を備え、
    　前記接続体は板バネであって前記ヒートシンクを前記電子部品に押し付ける、電子回路基板。     A substrate body on which electronic components are mounted on one main surface;
    A heat sink disposed on the electronic component via a predetermined heat transfer material;
    At least two connectors having a second end different from the first end and the first end, wherein the first end is fixed to the heat sink; and
    A fixing member for fixing the second end of the at least two connection bodies at a position spaced apart from a position where the electronic component is mounted on the one main surface of the substrate body,
    The connection body is a leaf spring and presses the heat sink against the electronic component.
  2. 　前記接続体の前記第二端部は、前記接続体の前記第一端部の反対側に位置している、請求項１に記載の電子回路基板。 The electronic circuit board according to claim 1, wherein the second end portion of the connection body is located on the opposite side of the first end portion of the connection body.
  3. 　前記接続体は矩形をなしている、請求項１又は請求項２に記載の電子回路基板。 3. The electronic circuit board according to claim 1, wherein the connection body has a rectangular shape.
  4. 　前記接続体は矩形をなしており、一つの長辺側に凹部を有する、請求項１又は請求項２に記載の電子回路基板。 The electronic circuit board according to claim 1 or 2, wherein the connection body has a rectangular shape and has a recess on one long side.
  5. 　前記接続体の前記第一端部及び前記第二端部は、前記矩形の長辺側に位置している、請求項３又は請求項４に記載の電子回路基板。 The electronic circuit board according to claim 3 or 4, wherein the first end and the second end of the connection body are located on a long side of the rectangle.
  6. 　前記固定部材は、前記基板本体の表面と実質的に直交する方向に延在する柱状のスタッドを介して前記基板本体に固定される、請求項１乃至請求項５のいずれか一項に記載の電子回路基板。 The said fixing member is fixed to the said board | substrate body via the columnar stud extended in the direction substantially orthogonal to the surface of the said board | substrate body, The Claim 1 thru | or 5 characterized by the above-mentioned. Electronic circuit board.
  7. 　基板本体の表面に電子部品を実装し、
    　所定の伝熱材料を介して前記電子部品上にヒートシンクを配置し、
    　第一端部及び前記第一端部とは異なる第二端部を有する板バネ状の、少なくとも２つの接続体の前記第一端部をそれぞれ前記ヒートシンクに固定し、
    　前記２つの接続体の前記第二端部をそれぞれ、前記基板本体の表面上で前記電子部品が実装される位置から離間した位置で前記基板本体に固定することにより、前記ヒートシンクを前記電子部品に押し付ける、電子回路基板の組立方法。     Mount electronic components on the surface of the board body,
    Placing a heat sink on the electronic component via a predetermined heat transfer material,
    A plate spring-like shape having a second end different from the first end and the first end, and fixing the first end of at least two connectors to the heat sink,
    The heat sink is attached to the electronic component by fixing the second end portions of the two connecting bodies to the substrate main body at a position spaced from the position where the electronic component is mounted on the surface of the substrate main body. The assembly method of the electronic circuit board to be pressed.
  8. 　前記接続体の前記第二端部は、前記接続体の前記第一端部の反対側に位置している、請求項７に記載の電子回路基板の組立方法。 The method for assembling an electronic circuit board according to claim 7, wherein the second end portion of the connection body is located on a side opposite to the first end portion of the connection body.
  9. 　前記接続体の前記第一端部が固定された前記ヒートシンクを前記電子部品上に配置した後で、
    　前記接続体の前記第二端部を固定部材で前記基板本体に固定することにより、前記ヒートシンクを前記電子部品に押し付ける、請求項７又は請求項８に記載の電子回路基板の組立方法。     After arranging the heat sink on which the first end portion of the connection body is fixed on the electronic component,
    The electronic circuit board assembly method according to claim 7 or 8, wherein the heat sink is pressed against the electronic component by fixing the second end portion of the connection body to the board body with a fixing member.
  10. 　前記ヒートシンクを前記電子部品上に配置した後で、
    　前記接続体の前記第一端部を前記ヒートシンクに固定すると共に、前記接続体の前記第二端部を固定部材で前記基板本体に固定することにより、前記ヒートシンクを前記電子部品に押し付ける、請求項７又は請求項８に記載の電子回路基板の組立方法。     After placing the heat sink on the electronic component,
    The first end portion of the connection body is fixed to the heat sink, and the second end portion of the connection body is fixed to the substrate body by a fixing member, thereby pressing the heat sink against the electronic component. 9. An electronic circuit board assembling method according to claim 7 or claim 8.
PCT/JP2014/004893 2013-10-04 2014-09-25 Electronic circuit board and method of assembly for same WO2015049849A1 (en)

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