WO2015039303A1

WO2015039303A1 - Method for packaging uncooled focal plane array and focal plane array apparatus

Info

Publication number: WO2015039303A1
Application number: PCT/CN2013/083769
Authority: WO
Inventors: 沈憧棐
Original assignee: 上海巨哥电子科技有限公司
Priority date: 2013-09-18
Filing date: 2013-09-18
Publication date: 2015-03-26
Also published as: CN105190264A

Abstract

A method for packaging an uncooled focal plane array (2) and a focal plane array apparatus. The focal plane array apparatus comprises a substrate (1), an uncooled focal plane array (2) attached to the substrate (1), a first connector (3) arranged along the outer periphery of the uncooled focal plane array (2) on the substrate (1), and a first lens unit (4) mounted above the first connector (3), wherein the first connector (3), the substrate (1) to which the uncooled focal plane array (2) is attached and the first lens unit (4) constitute a first closed area, and the first closed area formed by the first connector (3), the substrate (1) to which the uncooled focal plane array (2) is attached and the first lens unit (4) is formed by mounting the first lens unit (4) on the first connector (3) which is arranged on the outer periphery of the uncooled focal plane array (2). Using the first lens unit (4) to replace a sealing cover that forms a vacuum cavity in the prior art not only reduces production costs, but also enables a packaging assembly to have a small volume, thereby realizing a micro-infrared thermal imager.

Description

一种封装非制冷焦平面阵列的方法与焦平面阵列装置 Method for packaging uncooled focal plane array and focal plane array device

技术领域 Technical field

本发明涉及红外热像仪技术领域，尤其涉及一种封装非制冷焦平面阵列的方法与焦平面阵列装置的技术。背景技术 The present invention relates to the field of infrared camera technology, and more particularly to a method of packaging an uncooled focal plane array and a technique of a focal plane array device. Background technique

非制冷焦平面阵列（UFPA, Un-cooled Focal Plane Array )是红外热像仪的核心部件，其需要通过真空封装以有效使用，如采用低漏气率的金属管壳或陶瓷管壳以及封盖将整个非制冷焦平面阵列连同衬底封装在一个真空腔内，以降低器件的对热流损失、提高器件性能。但真空封装的封装成本较大，直接影响了红外热像仪的成本。为降低封装成本，现有技术还采用晶圆级封装，将衬底直接作为构成真空腔的一部分，在晶圆级进行封装后切割成单个器件（如图 1所示，非制冷焦平面阵列 2附着于衬底 1上，封装侧壁沿着非制冷焦平面阵列 2的外周设置，其中，封装侧壁、封盖、非制冷焦平面阵列 2所附着的衬底 1构成真空腔），但晶圆级封装仍需在非制冷焦平面阵列经 MEMS (微机电***， Micro-Electro-Mechanic System )工艺完成后采用额外的步骤和材料完成真空封装。为进一步降低封装成本，现有技术中有研究采用像素级封装，使用 MEMS加工工艺或半导体加工工艺对非制冷焦平面阵列的每个像素进行真空封装。但该方法由于像素级封装后，微小的封装结构脆弱且暴露在外，给非制冷焦平面阵列的使用、清洁等带来较大困难。发明内容 Uncooled Focal Plane Array (UFPA) is the core component of thermal imaging cameras. It needs to be vacuum-packed for efficient use, such as metal casing or ceramic casing with low air leak rate and cover. The entire uncooled focal plane array is packaged in a vacuum chamber along with the substrate to reduce heat flow losses and improve device performance. However, the packaging cost of the vacuum package is relatively large, which directly affects the cost of the infrared camera. In order to reduce the cost of packaging, the prior art also uses a wafer-level package, which directly forms a part of the vacuum cavity and is packaged into a single device after being packaged at the wafer level (as shown in Figure 1, the uncooled focal plane array 2 Attached to the substrate 1, the package sidewalls are disposed along the outer circumference of the uncooled focal plane array 2, wherein the package sidewalls, the cover, and the substrate 1 to which the uncooled focal plane array 2 is attached constitute a vacuum chamber), but the crystal The circular package still needs to be vacuum packaged with additional steps and materials after the CMOS (Micro-Electro-Mechanic System) process is completed. To further reduce packaging costs, prior art studies have employed vacuum packaging of each pixel of an uncooled focal plane array using a pixel scale package using a MEMS process or a semiconductor process. However, due to the fragile and exposed micro-package structure of the pixel-level package, the use of the uncooled focal plane array, cleaning, etc., poses great difficulties. Summary of the invention

本发明的目的是提供一种封装非制冷焦平面阵列的方法与焦平面阵列装置的方法与设备。 It is an object of the present invention to provide a method and apparatus for packaging an uncooled focal plane array and a focal plane array apparatus.

根据本发明的一个方面，提供了一种焦平面阵列装置，其中，该焦平面阵列装置包括衬底，附着于所述衬底的非制冷焦平面阵列，在所述衬底上沿着所述非制冷焦平面阵列的外周设置的第一连接件，以及安装于所述第一连接件上方的第一透镜单元，其中，所述第一连接件、所述非制冷焦平面阵列所附着的衬底及所述第一透镜单元构成第一封闭区域。 According to an aspect of the invention, a focal plane array device is provided, wherein the focal plane array device comprises a substrate, an uncooled focal plane array attached to the substrate, a first connecting member disposed along an outer circumference of the uncooled focal plane array on the substrate, and a first lens unit mounted above the first connecting member, wherein the first connecting member, the uncooled The substrate to which the focal plane array is attached and the first lens unit constitute a first enclosed region.

根据本发明的另一个方面，还提供了一种焦平面阵列装置，其中，该焦平面阵列装置包括衬底，附着于所述衬底的被像素级封装的非制冷焦平面阵列，第三连接件，以及所述第三连接件所连接的位于所述经像素级封装后的非制冷焦平面上方的封盖，其中，所述第三连接件、经像素级封装后的所述非制冷焦平面阵列所附着的衬底及所述封盖构成第一封闭区域。 According to another aspect of the present invention, there is also provided a focal plane array device, wherein the focal plane array device comprises a substrate, a pixel-level encapsulated uncooled focal plane array attached to the substrate, a third connection And a cover connected to the pixel-level packaged uncooled focal plane connected to the third connector, wherein the third connector, the pixel-packaged uncooled coke The substrate to which the planar array is attached and the cover constitute a first enclosed area.

根据本发明的再一个方面，还提供了一种焦平面阵列装置，其中，该焦平面阵列装置包括衬底、附着于所述衬底的非制冷焦平面阵列、在所述衬底上沿着所述非制冷焦平面阵列的外周设置的第一连接件、安装于所述第一连接件上方的封盖，以及在所述封盖、所述第一连接件或所述衬底上设置的第四连接件，其中，所述第四连接件使得安装于所述第四连接件上的第一透镜单元位于所述封盖相对于所述非制冷焦平面的另一侧，其中，所述第一连接件、所述非制冷焦平面阵列所附着的衬底及所述封盖构成真空区域。 According to still another aspect of the present invention, there is also provided a focal plane array device, wherein the focal plane array device comprises a substrate, an uncooled focal plane array attached to the substrate, along the substrate a first connecting member disposed on an outer circumference of the uncooled focal plane array, a cover mounted on the first connecting member, and a cover disposed on the cover, the first connecting member or the substrate a fourth connecting member, wherein the fourth connecting member is such that a first lens unit mounted on the fourth connecting member is located on the other side of the cover with respect to the uncooled focal plane, wherein A first connector, a substrate to which the uncooled focal plane array is attached, and the cover form a vacuum region.

根据本发明的又一个方面，还提供了一种带封装壳体的焦平面阵列装置，其中，所述带封装壳体的焦平面阵列装置包括衬底、附着于所述衬底的非制冷焦平面阵列，以及用于放置所述非制冷焦平面阵列所附着的衬底的封装壳体，其中，所述封装壳体为中空的、至少一端具有开口的壳体，所述非制冷焦平面阵列面向所述封装壳体的一个开口，该焦平面阵列装置还包括用于封闭所述封装壳体中所述非制冷焦平面阵列所面向的开口的第一透镜单元，以及用于封闭所述封装壳体的至多另一个开口的底盘。 According to still another aspect of the present invention, there is also provided a focal plane array device with a package housing, wherein the focal plane array device with a package housing comprises a substrate, an uncooled coke attached to the substrate a planar array, and a package housing for placing a substrate to which the uncooled focal plane array is attached, wherein the package housing is a hollow housing having an opening at least at one end, the uncooled focal plane array An opening facing the package housing, the focal plane array device further comprising a first lens unit for closing an opening of the package housing facing the uncooled focal plane array, and for enclosing the package At most another open chassis of the housing.

根据本发明的还一个方面，还提供了一种红外成像仪，其中，所述红外成像仪包括如前述根据本发明一个方面的焦平面阵列装置，或包括如前述根据本发明另一个方面的焦平面阵列装置，或包括如前述根据本发明再一个方面的焦平面阵列装置，或包括如前述才艮据本发明又一个方面的焦平面阵列装置。 According to still another aspect of the present invention, there is also provided an infrared imager, wherein the infrared imager comprises a focal plane array device according to one aspect of the present invention as described above, or comprises a focal point according to another aspect of the present invention as described above Planar array device, or as described above according to the present A focal plane array device according to still another aspect of the invention, or a focal plane array device according to still another aspect of the invention as described above.

根据本发明的另一方面，还提供了一种封装非制冷焦平面阵列的方法，其中，该方法包括： According to another aspect of the present invention, there is also provided a method of packaging an uncooled focal plane array, wherein the method comprises:

- 在多个所述非制冷焦平面阵列上沿着所述非制冷焦平面阵列的外周分别设置第一连接件； - providing a first connector along a periphery of the uncooled focal plane array on a plurality of said uncooled focal plane arrays;

- 在多个所述第一连接件上方分别安装第一透镜单元，以形成由每个非制冷焦平面阵列及其对应的第一连接件、第一透镜单元构成的第一去: f闭区域； - mounting a first lens unit above each of the plurality of first connectors to form a first de-f closed region consisting of each uncooled focal plane array and its corresponding first connector, first lens unit ;

其中，多个所述非制冷焦平面阵列，或多个所述第一连接件，或多个所述第一透镜单元，三者中至少一种位于同一基片上； Wherein, the plurality of the uncooled focal plane arrays, or the plurality of the first connecting members, or the plurality of the first lens units, at least one of the three are located on the same substrate;

其中，该方法还包括： The method further includes:

-按所述第一连接件对所述同一基片进行切割，以获得多个封装组件，其中，每一封装组件包括对应的非制冷焦平面阵列、第一连接件及第一透镜单元，其中，所述对应的非制冷焦平面阵列、第一连接件及透镜单元构成第一封闭区域。 Cutting the same substrate by the first connector to obtain a plurality of package components, wherein each package component comprises a corresponding uncooled focal plane array, a first connector and a first lens unit, wherein The corresponding uncooled focal plane array, the first connector, and the lens unit constitute a first enclosed area.

与现有技术相比，本发明通过将第一透镜单元安装于在非制冷焦平面阵列的外周设置的第一连接件上，以形成由所述第一连接件、所述非制冷焦平面阵列所附着的衬底及所述第一透镜单元构成的第一封闭区域，即采用第一透镜单元代替现有技术中（如图 1所示）形成真空腔的封盖，通过第一连接件的垂直厚度来控制第一透镜单元到非制冷焦平面阵列的距离以实现良好成像，不仅实现了降低生产成本，提高装配效率等有益效果，而且可实现非制冷焦平面阵列与第一透镜单元集成封装，使得封装后的非制冷焦平面阵列封装组件体积小，既易于安装，又可实现微型红外热像仪。而且，当非制冷焦平面阵列被像素级封装时，本发明还可采用第三连接件连接位于经像素级封装后的非制冷焦平面阵列上方的封盖，其中，所述第三连接件、经像素级封装后的所述非制冷焦平面阵列所附着的衬底及所述封盖构成第一封闭区域（或非封闭区域，优选封闭区域），即采用封盖来保护经像素级封装后的所述非制冷焦平面阵列，且该第一封闭区域可以为非真空区域，从而实现了封装过益效果。此外，当非制冷焦平面阵列被像素级封装时，所述第一连接件、所述第一透镜单元及经像素级封装后的所述非制冷焦平面阵列所附着的衬底构成第一封闭区域，即采用第一透镜单元作为封盖，同时起到了保护和成像的作用，且该第一封闭区域可以为非真空区域，封装简单。 Compared with the prior art, the present invention is formed by mounting a first lens unit on a first connecting member disposed on an outer circumference of an uncooled focal plane array to form the first connecting member, the uncooled focal plane array a first closed area formed by the attached substrate and the first lens unit, that is, a first lens unit is used instead of the cover of the prior art (as shown in FIG. 1) to form a vacuum chamber, through the first connecting member The vertical thickness controls the distance from the first lens unit to the uncooled focal plane array to achieve good imaging, which not only achieves the advantages of reduced production cost, improved assembly efficiency, but also realizes integration of the uncooled focal plane array and the first lens unit. The packaged uncooled focal plane array package assembly is small in size, easy to install, and can realize a miniature infrared camera. Moreover, when the uncooled focal plane array is packaged in a pixel level, the present invention may also use a third connector to connect the cap over the pixel-level encapsulated uncooled focal plane array, wherein the third connector, The substrate and the cover attached to the uncooled focal plane array after the pixel level packaging constitute a first closed area (or a non-closed area, preferably a closed area), that is, after the pixel level package is protected by a cover The uncooled The focal plane array, and the first enclosed area may be a non-vacuum area, thereby achieving a package benefit effect. In addition, when the uncooled focal plane array is packaged by the pixel level, the first connector, the first lens unit, and the substrate attached by the pixel-level encapsulated uncooled focal plane array constitute a first closed The area, that is, the first lens unit is used as the cover, and at the same time functions as protection and imaging, and the first closed area can be a non-vacuum area, and the package is simple.

此外，本发明中的第一透镜单元还包括微透镜阵列，当采用微透镜阵列作为所述第一透镜单元时，由于每个微透镜焦距较小，其可靠近或紧贴非制冷焦平面阵列，使得每个微透镜单独成像在非制冷焦平面阵列上对应的范围，而整个微透镜阵列的面积与非制冷焦平面阵列面积相当，使用的材料比传统红外镜头或镜头组少得多，进一步地实现了降低生产成本、降低封装后的非制冷焦平面阵列封装组件体积，相应地也降低红外热像仪的整机体积等有益效果，使得红外热像仪可应用于移动终端等领域。 Further, the first lens unit in the present invention further includes a microlens array, and when a microlens array is employed as the first lens unit, since each microlens has a small focal length, it can approach or closely follow an uncooled focal plane array. , so that each microlens is separately imaged on the corresponding range of the uncooled focal plane array, and the area of the entire microlens array is equivalent to the area of the uncooled focal plane array, using much less material than the conventional infrared lens or lens group, further The realization of reducing the production cost, reducing the volume of the packaged uncooled focal plane array package assembly, and correspondingly reducing the overall size of the infrared camera, and the like, so that the infrared camera can be applied to mobile terminals and the like.

此外，本发明中的第一透镜单元或第二透镜单元还包括菲涅尔透镜，更进一步地降低了红外热像仪的整机体积和生产成本。附图说明 Further, the first lens unit or the second lens unit in the present invention further includes a Fresnel lens, which further reduces the overall volume and production cost of the infrared camera. DRAWINGS

通过阅读参照以下附图所作的对非限制性实施例所作的详细描述，本发明的其它特征、目的和优点将会变得更明显： Other features, objects, and advantages of the present invention will become more apparent from the Detailed Description of Description

图 1示出现有技术中真空封装非制冷焦平面阵列的封装示意图；图 2 示出根据本发明一个实施例的焦平面阵列装置的结构示意图； 1 is a schematic view showing the packaging of a vacuum packaged uncooled focal plane array in the prior art; FIG. 2 is a schematic view showing the structure of a focal plane array device according to an embodiment of the present invention;

图 3示出安装于第一连接件上的微透镜阵列的立体示意图；图 4示出在第一连接件内壁上设置台阶以实现与衬底连接的结构示意图； 3 is a perspective view showing a microlens array mounted on a first connecting member; FIG. 4 is a schematic view showing a structure in which a step is provided on an inner wall of the first connecting member to realize connection with the substrate;

图 5示出另一个优选实施例的在第一连接件内壁上设置台阶以实现与衬底连接的结构示意图； Fig. 5 is a view showing the structure of another preferred embodiment in which a step is provided on the inner wall of the first connecting member to realize connection with the substrate;

图 6示出根据本发明另一个实施例的焦平面阵列装置的结构示意图； FIG. 6 is a block diagram showing the structure of a focal plane array device according to another embodiment of the present invention. Figure

图 7示出根据本发明再一个实施例的焦平面阵列装置的结构示意图； Figure 7 is a block diagram showing the structure of a focal plane array device according to still another embodiment of the present invention;

图 8 示出根据本发明另一个方面的焦平面阵列装置的结构示意图； Figure 8 is a block diagram showing the structure of a focal plane array device in accordance with another aspect of the present invention;

图 9 示出根据本发明再一个方面的焦平面阵列装置的结构示意图； Figure 9 is a block diagram showing the structure of a focal plane array device according to still another aspect of the present invention;

图 10示出根据本发明又一个方面的带封装壳体的焦平面阵列装置的结构示意图； Figure 10 is a block diagram showing the configuration of a focal plane array device with a package housing in accordance with still another aspect of the present invention;

图 11a 示出包含多个非制冷焦平面阵列的基片的示意图（俯视图）； Figure 11a shows a schematic view (top view) of a substrate comprising a plurality of uncooled focal plane arrays;

图 l ib示出形成多个第一连接件的基片的示意图（俯视图）；图 11c示出含有多个第一透镜单元的基片的示意图（俯视图）；图 12a示出封装后的非制冷焦平面阵列的电极暴露在外的封装示意图； Figure 1 ib shows a schematic view (top view) of a substrate forming a plurality of first connectors; Figure 11c shows a schematic view (top view) of a substrate containing a plurality of first lens units; Figure 12a shows uncooled after packaging A schematic view of the package in which the electrodes of the focal plane array are exposed;

图 12b示出通过封盖内嵌入（穿过）引线与非制冷焦平面阵列的电极形成接触的封装示意图； Figure 12b shows a package schematic showing the contact with the electrodes of the uncooled focal plane array by embedding (passing through) the leads within the cover;

图 13示出通过切割方法得到多个封装组件的切割示意图。 Figure 13 shows a schematic view of the cutting of a plurality of package components by a cutting method.

附图中相同或相似的附图标记代表相同或相似的部件。具体实施方式 The same or similar reference numerals in the drawings denote the same or similar components. detailed description

下面结合附图对本发明作进一步详细描述。 The invention is further described in detail below with reference to the accompanying drawings.

图 2 示出根据本发明一个实施例的焦平面阵列装置的结构示意图，其中，该焦平面阵列装置包括衬底 1 , 附着于所述衬底 1的非制冷焦平面阵列 2, 在所述衬底 1上沿着所述非制冷焦平面阵列 2的外周设置的第一连接件 3 , 以及安装于所述第一连接件 3上方的第一透镜单元 4, 其中，所述第一连接件 3、所述非制冷焦平面阵列 2所附着的衬底 1 及所述第一透镜单元 4构成第一封闭区域。敏电阻型非制冷焦平面阵列； 2 )热释电型非制冷焦平面阵列； 3 ) 热电堆型非制冷焦平面阵列； 4 )二极管型非制冷焦平面阵列； 5 )热-电容型非制冷焦平面阵列； 6 )应用光力学效应的非制冷焦平面阵列； 7 )基于法布里 -珀罗 FP ( FP, Fabry-Pero ) 敖腔阵列非制冷焦平面阵列。本领域技术人员应理解上述非制冷焦平面阵列仅为示例，其他现有的或今后可能出现的非制冷焦平面阵列如可适用于本发明，也应包含在本发明保护范围以内，并在此以引用方式包含于此。 2 shows a schematic structural view of a focal plane array device according to an embodiment of the present invention, wherein the focal plane array device includes a substrate 1 attached to an uncooled focal plane array 2 of the substrate 1 at the lining a first connecting member 3 disposed along an outer circumference of the uncooled focal plane array 2 on the bottom 1 and a first lens unit 4 mounted above the first connecting member 3, wherein the first connecting member 3 The substrate 1 to which the uncooled focal plane array 2 and the first lens unit 4 are attached constitute a first closed region. Sensitive resistance type uncooled focal plane array; 2) pyroelectric uncooled focal plane array; 3) thermopile type uncooled focal plane array; 4) diode type uncooled focal plane array; 5) thermo-capacitive uncooled Focal plane array; 6) Uncooled focal plane array using photodynamic effects; 7) Uncooled focal plane array based on Fabry-Perot FP (FP, Fabry-Pero) cavity array. Those skilled in the art should understand that the above uncooled focal plane array is only an example, and other existing or future uncooled focal plane arrays may be included in the scope of the present invention, and are also included in the scope of the present invention. It is included here by reference.

在此，所述第一透镜单元 4用于将景物发出的红外线聚焦到所述非制冷焦平面阵列 2上进行成像，其包括透镜组、菲涅尔透镜或微透镜阵列。其中，所述第一透镜单元可由包含硅 ( Si )或锗（Ge ) 的材料，或者由光学塑料如聚乙烯（PE )、高密度聚乙烯（HDPE )、聚苯乙烯（PS )、聚甲醛（POM )等，通过半导体加工工艺或模压等方法制成。其中，所述微透镜阵列（如图 3所示的安装于所述第一连接件 3上方的微透镜阵列）是指对应一个非制冷焦平面阵列的、由两个或两个以上透镜单元所构成的阵列，从而形成两个或两个以上的光路，分别对应于同一个非制冷焦平面阵列上的不同区域。 Here, the first lens unit 4 is configured to focus infrared rays emitted from a scene onto the uncooled focal plane array 2 for imaging, which includes a lens group, a Fresnel lens or a microlens array. Wherein, the first lens unit may be made of a material containing silicon (Si) or germanium (Ge), or an optical plastic such as polyethylene (PE), high density polyethylene (HDPE), polystyrene (PS), polyoxymethylene. (POM) or the like, which is produced by a semiconductor processing technique or molding. Wherein, the microlens array (the microlens array mounted on the first connecting member 3 as shown in FIG. 3) refers to two or more lens units corresponding to one uncooled focal plane array. The array is constructed such that two or more optical paths are formed, each corresponding to a different region on the same uncooled focal plane array.

本领域技术人员应理解上述第一透镜单元和光学塑料仅为示例，其他现有的或今后可能出现的第一透镜单元或光学塑料如可适用于本发明，也应包含在本发明保护范围以内，并在此以引用方式包含于此。 Those skilled in the art should understand that the above first lens unit and optical plastic are only examples, and other existing or future possible first lens units or optical plastics, as applicable to the present invention, should also be included in the scope of the present invention. And is hereby incorporated by reference.

在此，所述衬底 1 包括用于附着所述非制冷焦平面阵列 2的基底材料，其包括但不限于如硅（Si )、锗（Ge )、砷化镓（GaAs )、玻璃等。本领域技术人员应理解上述衬底 1 的材料仅为示例，其他现有的或今后可能出现的衬底 1的材料如可适用于本发明，也应包含在本发明保护范围以内，并在此以引用方式包含于此。 Here, the substrate 1 includes a base material for attaching the uncooled focal plane array 2, including but not limited to, for example, silicon (Si), germanium (Ge), gallium arsenide (GaAs), glass, or the like. Those skilled in the art should understand that the material of the above substrate 1 is only an example, and other materials of the substrate 1 that may be present or may appear in the future are applicable to the present invention, and should also be included in the scope of the present invention. It is included here by reference.

在此，第一连接件 3包括但不限于如以中空圆柱、中空圆台、中空长方体、中空正方体等各种形状制成的封装侧壁，其可通过粘接、在其内壁上设置台阶等方式实现与衬底 1的连接固定，在此，图 4和图 5分别给出两种具体设置台阶的方式，其中，在图 4中，第一连接件 3内壁上设置的台阶同时与衬底 1和第一透镜单元 4相连接，在图 5中，第一连接件 3内壁上设置的台阶与第一透镜单元 4相连接，第一连接件 3与衬底 1相连接。其中，所述粘接包括直接键合或通过共晶合金键合等方式实现。在此，所述第一连接件 3也可以和第一透镜单元 4在同一基材上加工而成，此时第一连接件 3和第一透镜单元 4为一个整体。本领域技术人员应理解上述第一连接件 3和第一连接件 3与衬底 1的连接方式仅为示例，其他现有的或今后可能出现的第一连接件或第一连接件与衬底的连接方式如可适用于本发明，也应包含在本发明保护范围以内，并在此以引用方式包含于此。 Here, the first connecting member 3 includes, but is not limited to, a package side wall made of various shapes such as a hollow cylinder, a hollow circular table, a hollow rectangular parallelepiped, a hollow rectangular parallelepiped, etc., which can be bonded, and a step is provided on the inner wall thereof. The connection with the substrate 1 is fixed. Here, FIG. 4 and FIG. 5 respectively show two ways of specifically setting the steps, wherein, in FIG. 4, the inner wall of the first connecting member 3 The step provided thereon is simultaneously connected to the substrate 1 and the first lens unit 4, and in FIG. 5, the step provided on the inner wall of the first connecting member 3 is connected to the first lens unit 4, the first connecting member 3 and the substrate 1 phase connection. Wherein, the bonding comprises direct bonding or bonding by eutectic alloy or the like. Here, the first connecting member 3 may also be processed on the same substrate as the first lens unit 4, in which case the first connecting member 3 and the first lens unit 4 are integrally formed. Those skilled in the art should understand that the connection manner of the first connecting member 3 and the first connecting member 3 to the substrate 1 is only an example, and other existing or first connecting members or first connecting members and substrates may appear in the future. The manner of attachment is as applicable to the present invention and is intended to be included within the scope of the present invention and is hereby incorporated by reference.

为便于说明，在此，在图 2、图 4、图 5以及如下图 6至图 10, 以及图 13中，仅以中空长方形状的第一连接件 3为例示出本发明的焦平面阵列装置的结构示意图。 For convenience of explanation, here, in FIG. 2, FIG. 4, FIG. 5, and FIGS. 6 to 10, and FIG. 13, the focal plane array device of the present invention is exemplified by the first connecting member 3 having a hollow rectangular shape. Schematic diagram of the structure.

优选地，所述第一封闭区域为真空区域。在此，实现所述第一封闭区域为真空区域的方式包括但不限于以下至少任一项： 1 )采用真空泵将所述第一封闭区域抽成真空后进行密封； 2 ) 在真空环境中实现所述第一封闭区域并进行密封。本领域技术人员应理解上述实现所述第一封闭区域为真空区域的方式仅为示例，其他现有的或今后可能出现的实现所述第一封闭区域为真空区域的方式如可适用于本发明，也应包含在本发明保护范围以内，并在此以引用方式包含于此。 Preferably, the first enclosed area is a vacuum area. Here, the manner of realizing the first closed region as a vacuum region includes, but is not limited to, at least one of the following: 1) vacuuming the first closed region with a vacuum pump for sealing; 2) implementing in a vacuum environment The first enclosed area is sealed. Those skilled in the art should understand that the manner of implementing the first closed region as a vacuum region is merely an example, and other existing or future possible ways to realize the first closed region as a vacuum region are applicable to the present invention. It is also intended to be included within the scope of the invention and is hereby incorporated by reference.

在一个优选实施例中，焦平面阵列装置还包括通过第二连接件（未示出）安装于所述第一透镜单元 4相对所述非制冷焦平面阵列 2另一侧的第二透镜单元（未示出）。所述第二透镜单元用于光场成像，其可以由透镜组构成，也可以是菲涅尔透镜。 In a preferred embodiment, the focal plane array device further includes a second lens unit mounted to the other side of the uncooled focal plane array 2 by the first lens unit 4 via a second connector (not shown) ( Not shown). The second lens unit is used for light field imaging, which may be composed of a lens group or a Fresnel lens.

在此，所述第二连接件包括但不限于如： 1 )以中空圆柱、中空圆台、中空长方体、中空正方体等各种形状制成的封装侧壁； 2 )连接机构，如由四根柱子组成的连接机构。其中，所述第二连接件其可设置于所述第一连接件 3上，或者，设置于所述衬底 1上，或者，设置于所述第一透镜单元 4所镶嵌的机械装置上，如镜框等。本领域技术人员应理解上述第二连接件仅为示例，其他现有的或今后可能出现的第二连接件如可适用于本发明，也应包含在本发明保护范围以内，并在此以引用方式包含于此。 Here, the second connecting member includes, but is not limited to, 1) a package side wall made of various shapes such as a hollow cylinder, a hollow circular table, a hollow rectangular parallelepiped, a hollow rectangular parallelepiped, etc.; 2) a connecting mechanism, such as four pillars The connection mechanism that makes up. The second connecting member may be disposed on the first connecting member 3, or disposed on the substrate 1, or disposed on a mechanical device in which the first lens unit 4 is mounted. Such as frames and so on. Those skilled in the art will appreciate that the second connector described above is merely an example, and other second connectors that may be present or may appear in the future, such as It is intended to be within the scope of the invention and is intended to be embraced herein.

优选地，当焦平面阵列装置中包括第二透镜单元时，该焦平面阵列装置中的第一透镜单元 4应采用微透镜阵列，第一透镜单元 4与第二透镜单元形成透镜组，以形成光场成像的光路。 Preferably, when the second lens unit is included in the focal plane array device, the first lens unit 4 in the focal plane array device should adopt a microlens array, and the first lens unit 4 and the second lens unit form a lens group to form The optical path of the light field imaging.

图 6示出根据本发明另一个实施例的焦平面阵列装置的结构示意图，其中，图 6所示的焦平面阵列装置基于如图 2所示的焦平面阵列装置。如图 6所示，其中，所述非制冷焦平面阵列 2被像素级封装，其中，所述第一连接件 3、所述第一透镜单元 4及经像素级封装后的所述非制冷焦平面阵列 2所附着的衬底 1构成第一封闭区域。如图 6所示，非制冷焦平面阵列 2具有被像素级封装后的封装层 5。所述第一封闭区域可以为非真空区域。 Fig. 6 is a view showing the configuration of a focal plane array device according to another embodiment of the present invention, wherein the focal plane array device shown in Fig. 6 is based on a focal plane array device as shown in Fig. 2. As shown in FIG. 6, the uncooled focal plane array 2 is encapsulated by a pixel level, wherein the first connecting member 3, the first lens unit 4, and the uncooled coke after being packaged by a pixel level The substrate 1 to which the planar array 2 is attached constitutes a first closed region. As shown in Fig. 6, the uncooled focal plane array 2 has an encapsulation layer 5 encapsulated in a pixel level. The first enclosed area may be a non-vacuum area.

在此，所述像素级封装是指通过诸如 MEMS (微机电***， Micro-Electro-Mechanic System ) 或半导体加工等工艺对所述非制冷焦平面阵列 2的每个像素或由多个像素组成的像素组进行真空封装。 Here, the pixel-level package refers to each pixel of the uncooled focal plane array 2 or composed of a plurality of pixels by a process such as MEMS (Micro-Electro-Mechanic System) or semiconductor processing. The pixel group is vacuum packaged.

优选地，在参考图 6描述的焦平面阵列装置中，由所述第一连接件 3、所述第一透镜单元 4及经像素级封装后的所述非制冷焦平面阵列 2所附着的衬底 1构成的第一封闭区域也可以是非封闭区域，在具体实施例中，优选封闭区域。 Preferably, in the focal plane array device described with reference to FIG. 6, the lining attached by the first connector 3, the first lens unit 4, and the pixel-level encapsulated uncooled focal plane array 2 The first enclosed area formed by the bottom 1 may also be a non-closed area, and in a particular embodiment, a closed area is preferred.

在此，本领域技术人员应能理解，当非制冷焦平面阵列 2事先被晶圆级封装或如图 6所示的被像素级封装等各种封装方式封装之后，仍可参照图 5所示的结构来进一步封装所述非制冷焦平面阵列，只需用晶圆级封装或适合本发明的其他封装方式代替图 6中所示的像素级封装，此时，由所述第一连接件 3、所述第一透镜单元 4及经像素级封装后的所述非制冷焦平面阵列 2所附着的衬底 1构成的第一封闭区域也可以是非封闭区域，在具体实施例中，优选封闭区域。 Here, those skilled in the art should understand that after the uncooled focal plane array 2 is previously packaged by the wafer level or by various packaging methods such as the pixel level package as shown in FIG. 6, still refer to FIG. Structure to further encapsulate the uncooled focal plane array, only need to replace the pixel level package shown in FIG. 6 with a wafer level package or other packaging suitable for the present invention, at this time, by the first connection member 3 The first closed area formed by the first lens unit 4 and the substrate 1 to which the uncooled focal plane array 2 is encapsulated by the pixel level may also be a non-closed area. In a specific embodiment, a closed area is preferred. .

图 7示出根据本发明再一个实施例的焦平面阵列装置的结构示意图，其中，图 7所示的焦平面阵列装置基于如图 2所示的焦平面阵列装置。如图 7所示，其中，该焦平面阵列装置还包括安装于所述第一连接件 3 围成的空腔内的封盖 6, 使得所述第一连接件 3、所述非制冷焦平面阵列 2所附着的衬底 1及所述第一透镜单元 4构成的第一封闭区域被所述封盖 6分隔为两个封闭区域，其中，所述封盖 6朝向所述焦平面阵列 2的封闭区域为第二封闭区域，所述封盖 6相对所述焦平面阵列 2 的另一侧的封闭区域为第三封闭区域，其中，所述第二封闭区域为真空区域。 Figure 7 is a block diagram showing the configuration of a focal plane array device according to still another embodiment of the present invention, wherein the focal plane array device shown in Figure 7 is based on a focal plane array device as shown in Figure 2. As shown in FIG. 7, wherein the focal plane array device further includes being installed in the first connection a cover 6 in the cavity enclosed by the connector 3, such that the first connector 3, the substrate 1 to which the uncooled focal plane array 2 is attached, and the first lens unit 4 are first closed The area is divided by the cover 6 into two closed areas, wherein the closed area of the cover 6 facing the focal plane array 2 is a second closed area, and the cover 6 is opposite to the focal plane array 2 The closed area on the other side is a third closed area, wherein the second closed area is a vacuum area.

在此，可通过在第一连接件 3的内壁上设置台阶（如图 7所示）来放置所述封盖 6的方法，实现将封盖 6安装于所述第一连接件 3围成的空腔内；或者，通过粘接方式，将封盖 6粘接于第一连接件 3的内壁上的台阶上，实现将封盖 6安装于所述第一连接件 3围成的空腔内。本领域技术人员应理解上述第一连接件 3与封盖 6的连接方式仅为示例，其他现有的或今后可能出现的第一连接件 3与封盖 6的连接方式如可适用于本发明，也应包含在本发明保护范围以内，并在此以引用方式包含于此。 Here, the method of placing the cover 6 by providing a step (as shown in FIG. 7) on the inner wall of the first connecting member 3 is achieved by mounting the cover 6 to the first connecting member 3. Or, the cover 6 is adhered to the step on the inner wall of the first connecting member 3 by bonding, so that the cover 6 is installed in the cavity surrounded by the first connecting member 3 . A person skilled in the art should understand that the connection manner of the first connecting member 3 and the cover 6 is only an example, and other existing or future possible connection manners of the first connecting member 3 and the cover 6 can be applied to the present invention. It is also intended to be included within the scope of the invention and is hereby incorporated by reference.

图 8 示出根据本发明另一个方面的焦平面阵列装置的结构示意图，其中，该焦平面阵列装置包括衬底 1 , 附着于所述衬底 1的被像素级封装的非制冷焦平面阵列 2, 第三连接件 7, 以及所述第三连接件 7 所连接的位于所述经像素级封装后的非制冷焦平面阵列 2上方的封盖 8, 其中，所述第三连接件 7、经像素级封装后的所述非制冷焦平面阵列 2 所附着的衬底 1及所述封盖 8构成第一封闭区域。如图 8所示，非制冷焦平面阵列 2具有被像素级封装后的封装层 5。所述第一封闭区域可以为非真空区域。 8 is a block diagram showing a configuration of a focal plane array device according to another aspect of the present invention, wherein the focal plane array device includes a substrate 1 and a pixel-level encapsulated uncooled focal plane array 2 attached to the substrate 1. a third connector 7 and a cover 8 connected to the pixel-level packaged uncooled focal plane array 2, wherein the third connector 7 The substrate 1 to which the uncooled focal plane array 2 is attached after the pixel level packaging and the cover 8 constitute a first closed region. As shown in Fig. 8, the uncooled focal plane array 2 has an encapsulation layer 5 encapsulated in a pixel level. The first enclosed area may be a non-vacuum area.

在此，所述第三连接件 7 包括但不限于如： 1 ) 以中空圆柱、中空圆台、中空长方体、中空正方体等各种形状制成的封装侧壁； 2 ) 连接机构，如由四根柱子组成的连接机构。本领域技术人员应理解上述第三连接件仅为示例，其他现有的或今后可能出现的第三连接件如可适用于本发明，也应包含在本发明保护范围以内，并在此以引用方式包含于此。 Here, the third connecting member 7 includes, but is not limited to, 1) a package side wall made of various shapes such as a hollow cylinder, a hollow circular table, a hollow rectangular parallelepiped, a hollow rectangular parallelepiped, etc.; 2) a connecting mechanism, such as four The connection mechanism composed of columns. It should be understood by those skilled in the art that the above-mentioned third connecting member is only an example, and other existing or future third connecting members may be included in the scope of the present invention, and are hereby incorporated by reference. The way is included here.

在此，所述第三连接件 7与衬底 1的连接方式与前述第一连接件 3 与衬底 1的连接方式相同或基本相同，为简明起见，故在此不再赘述，并以引用的方式包含于此。 Here, the connection manner of the third connecting member 7 and the substrate 1 is the same as or substantially the same as that of the first connecting member 3 and the substrate 1. For the sake of brevity, no further details are provided herein. It is hereby incorporated by reference.

在此，封盖 8与第三连接件 3的连接方式与图 6中所述第一连接件 3与封盖 6的连接方式相同或基本相同，为简明起见，故在此不再赘述，并以引用的方式包含于此。 Here, the connection manner of the cover 8 and the third connecting member 3 is the same as or substantially the same as that of the first connecting member 3 and the cover 6 in FIG. 6. For the sake of brevity, it will not be described again here, and It is included here by reference.

在此，本发明通过将经像素经封装后的非制冷焦平面阵列 2置于所述第一封闭区域中，封盖 8对经像素经封装后的非制冷焦平面阵列 2起到了保护作用，防止像素级封装时脆弱的微小封装结构暴露在外，解决了像素级封装的实用性问题。 Here, the present invention protects the pixel-encapsulated uncooled focal plane array 2 by placing the pixel-encapsulated uncooled focal plane array 2 in the first enclosed region. Prevents the fragile micro-package structure from being exposed when the pixel-level package is exposed, solving the practical problem of the pixel-level package.

优选地，在参考图 8描述的焦平面阵列装置中，当所述第三连接件 7为连接机构时，由所述第三连接件 7、经像素级封装后的所述非制冷焦平面阵列 2所附着的衬底 1及所述封盖 8构成的第一封闭区域可以是非封闭区域，在具体实施例中，优选封闭区域。 Preferably, in the focal plane array device described with reference to FIG. 8, when the third connecting member 7 is a connecting mechanism, the unconnected focal plane array after being encapsulated by the pixel level by the third connecting member 7 The first enclosed area formed by the attached substrate 1 and the cover 8 may be a non-closed area. In a specific embodiment, a closed area is preferred.

图 9 示出根据本发明再一个方面的焦平面阵列装置的结构示意图，其中，该焦平面阵列装置包括衬底 1、附着于所述衬底 1的非制冷焦平面阵列 2、在所述衬底 1上沿着所述非制冷焦平面阵列 2的外周设置的第一连接件 3、安装于所述第一连接件 3上方的封盖 9, 以及在所述封盖 9、所述第一连接件 3或所述衬底 1上设置的第四连接件 10, 其中，所述第四连接件 10使得安装于所述第四连接件 10上的第一透镜单元 4位于所述封盖 9相对于所述非制冷焦平面阵列 2的另一侧，其中，所述第一连接件 3、所述非制冷焦平面阵列 2所附着的衬底 1及所述封盖构 9成真空区域。优选地，所述第一透镜单元 4包括透镜组、菲涅尔透镜或微透镜阵列。 9 is a schematic structural view of a focal plane array device according to still another aspect of the present invention, wherein the focal plane array device includes a substrate 1, an uncooled focal plane array 2 attached to the substrate 1, and the lining a first connecting member 3 disposed along an outer circumference of the uncooled focal plane array 2 on the bottom 1 , a cover 9 mounted above the first connecting member 3 , and the cover 9 , the first a connector 3 or a fourth connector 10 disposed on the substrate 1, wherein the fourth connector 10 causes the first lens unit 4 mounted on the fourth connector 10 to be located on the cover 9 With respect to the other side of the uncooled focal plane array 2, the first connecting member 3, the substrate 1 to which the uncooled focal plane array 2 is attached, and the cover structure 9 are vacuum regions. Preferably, the first lens unit 4 comprises a lens group, a Fresnel lens or a microlens array.

在此，为便于说明，图 9中仅示例性地示出在所述封盖 9上设置所述第四连接件 10 的情形。对于已进行金属封装、陶瓷封装、晶圆级封装完成后的非制冷焦平面阵列，也可以将所述第一透镜单元 4通过所述第四连接件 10进行连接。 Here, for convenience of explanation, only the case where the fourth connecting member 10 is provided on the cover 9 is exemplarily shown in FIG. The first lens unit 4 may also be connected through the fourth connector 10 for an uncooled focal plane array after the metal package, the ceramic package, and the wafer level package have been completed.

在此，所述第一连接件 3与衬底 1的连接方式与图 2中所述第一连接件 3与衬底 1的连接方式相同或基本相同，为简明起见，故在此不再赘述，并以引用的方式包含于此。在此，所述第四连接件 10包括但不限于如： 1 ) 以中空圆柱、中空圆台、中空长方体、中空正方体等各种形状制成的封装侧壁； 2 ) 连接壳体，如由四根柱子组成的连接机构。本领域技术人员应理解上述第四连接件仅为示例，其他现有的或今后可能出现的第四连接件如可适用于本发明，也应包含在本发明保护范围以内，并在此以引用方式包含于此。 Here, the connection manner of the first connecting member 3 and the substrate 1 is the same as or substantially the same as that of the first connecting member 3 and the substrate 1 in FIG. 2, and is not described here for brevity. And is included here by reference. Here, the fourth connecting member 10 includes, but is not limited to, 1) a package side wall made of various shapes such as a hollow cylinder, a hollow circular table, a hollow rectangular parallelepiped, a hollow rectangular parallelepiped, etc.; 2) a connection housing, such as four The connection mechanism composed of the root pillars. It should be understood by those skilled in the art that the above fourth connecting member is merely an example, and other existing or future fourth connecting members may be included in the scope of the present invention, and are also referred to herein. The way is included here.

在此，所述第一连接件 1与所述封盖 9的连接方式与图 7中所述第一连接件 3与封盖 6的连接方式相同或基本相同，为简明起见，故在此不再赘述，并以引用的方式包含于此。 Here, the connection manner of the first connecting member 1 and the cover 9 is the same as or substantially the same as the manner in which the first connecting member 3 and the cover 6 are connected in FIG. 7. For the sake of brevity, it is not here. Further details are included herein by reference.

图 10示出根据本发明又一个方面的带封装壳体的焦平面阵列装置的结构示意图，其中，所述带封装壳体的焦平面阵列装置包括衬底 1、附着于所述衬底 1的非制冷焦平面阵列 2, 以及用于放置所述非制冷焦平面阵列 2所附着的衬底 1的封装壳体 11 , 其中，所述封装壳体 11为中空的、至少一端具有开口的壳体，所述非制冷焦平面阵列 2面向所述封装壳体 11的一个开口，该焦平面阵列装置还包括用于封闭所述封装壳体 11中所述非制冷焦平面阵列 2所面向的开口的第一透镜单元 4, 以及用于封闭所述封装壳体 11的至多另一个开口的底盘（未示出），例如，当所述封装壳体 11具有一端开口时，所述第一透镜单元 4封闭该开口；当所述封装壳体 11具有两端开口时，所述第一透镜单元 4封闭该封装壳体 11中所述非制冷焦平面阵列 2所面向的开口，所述底盘封闭该封装壳体 11的另一个开口。优选地，所述第一透镜单元 4包括菲涅尔透镜或微透镜阵列。 10 is a schematic structural view of a focal plane array device with a package housing including a substrate 1 attached to the substrate 1 according to still another aspect of the present invention. An uncooled focal plane array 2, and a package housing 11 for placing the substrate 1 to which the uncooled focal plane array 2 is attached, wherein the package housing 11 is a hollow housing having an opening at least at one end The uncooled focal plane array 2 faces an opening of the package housing 11 , the focal plane array device further comprising an opening for closing the opening of the uncooled focal plane array 2 in the package housing 11 a first lens unit 4, and a chassis (not shown) for closing at most another opening of the package housing 11, for example, when the package housing 11 has an opening at one end, the first lens unit 4 Closing the opening; when the package housing 11 has two ends open, the first lens unit 4 closes an opening of the package housing 11 facing the uncooled focal plane array 2, the chassis seal The other opening 11 of the housing package. Preferably, the first lens unit 4 comprises a Fresnel lens or a microlens array.

在此，为便于说明，图 10中仅示例性地示出所述封装壳体 11具有一端开口的情形。优选地，在具体实施例中，所述封装壳体 11也可以和第一透镜单元 4为一体，在所述底盘处开口。 Here, for convenience of explanation, only the case where the package casing 11 has one end opening is exemplarily shown in FIG. Preferably, in a specific embodiment, the package housing 11 may also be integral with the first lens unit 4 and open at the chassis.

本发明还包括封装非制冷焦平面阵列的方法流程，具体地，在多个所述非制冷焦平面阵列上沿着所述非制冷焦平面阵列的外周分别设置第一连接件；在多个所述第一连接件上方分别安装第一透镜单元，以形成由每个非制冷焦平面阵列及其对应的第一连接件、第一透镜单元构成的第一封闭区域；其中，多个所述非制冷焦平面阵列，或多个所述第一连接件，或多个所述第一透镜单元，三者中至少一种位于同一基片上；按所述第一连接件对所述同一基片进行切割，以获得多个封装组件，其中，每一封装组件包括对应的非制冷焦平面阵列、第一连接件及第一透镜单元，其中，所述对应的非制冷焦平面阵列、第一连接件及透镜单元构成第一封闭区域。 The present invention also includes a method flow for packaging an uncooled focal plane array, specifically, providing a first connector along a periphery of the uncooled focal plane array on a plurality of the uncooled focal plane arrays; a first lens unit is respectively disposed above the first connecting member to form a first closed region composed of each uncooled focal plane array and its corresponding first connecting member and first lens unit; wherein, the plurality of non- a cooled focal plane array, or a plurality of said first a connector, or a plurality of the first lens units, at least one of the three being on the same substrate; cutting the same substrate according to the first connector to obtain a plurality of package components, wherein each A package assembly includes a corresponding uncooled focal plane array, a first connector, and a first lens unit, wherein the corresponding uncooled focal plane array, the first connector, and the lens unit constitute a first enclosed region.

具体地，在多个所述非制冷焦平面阵列上沿着所述非制冷焦平面阵列的外周分别设置第一连接件。例如，如图 11a所示，基片 1上具有多个非制冷焦平面阵列，其中，每一小方块表示一个所述非制冷焦平面阵列，在另一基片如基片 2上去除类似如图 11a所示的非制冷焦平面阵列形状的材料，且每一去除处材料的面积大于或等于其所对应的基片 1上非制冷焦平面阵列的面积，留下的材料可形成第一连接件如封装侧壁，得到如图 l ib所示的形成封装侧壁的基片 2; 然后，将基片 2与基片 1 对准，通过粘接等方式将基片 2固定于基片 1上具有非制冷焦平面阵列的端面上，即在基片 1上的多个非制冷焦平面阵列上沿着所述非制冷焦平面阵列的外周分别设置第一连接件。 Specifically, a first connector is disposed on each of the plurality of uncooled focal plane arrays along an outer circumference of the uncooled focal plane array. For example, as shown in FIG. 11a, the substrate 1 has a plurality of uncooled focal plane arrays, wherein each small square represents one of the uncooled focal plane arrays, and the other substrate such as the substrate 2 is removed like The material of the uncooled focal plane array shape shown in Figure 11a, and the area of each removed material is greater than or equal to the area of the uncooled focal plane array on the corresponding substrate 1, and the remaining material can form a first connection. Such as the package sidewall, the substrate 2 forming the package sidewall is obtained as shown in FIG. 1 ib; then, the substrate 2 is aligned with the substrate 1 , and the substrate 2 is fixed to the substrate 1 by bonding or the like. A first connector is disposed on the end faces having the uncooled focal plane array, i.e., on the plurality of uncooled focal plane arrays on the substrate 1, along the outer circumference of the uncooled focal plane array.

本领域技术人员应理解上述在多个非制冷焦平面阵列上沿着所述非制冷焦平面阵列的外周分别设置第一连接件的方式仅为示例，其他现有的或今后可能出现的在多个非制冷焦平面阵列上沿着所述非制冷焦平面阵列的外周分别设置第一连接件的方式如可适用于本发明，也应包含在本发明保护范围以内，并在此以引用方式包含于此。 Those skilled in the art will appreciate that the manner in which the first connectors are respectively disposed along the outer circumference of the uncooled focal plane array on a plurality of uncooled focal plane arrays is merely an example, and other existing or future may occur. The manner in which the first connecting members are respectively disposed along the outer circumference of the uncooled focal plane array on the uncooled focal plane array is applicable to the present invention, and should also be included in the scope of the present invention, and is hereby incorporated by reference. herein.

接着，在多个所述第一连接件上方分别安装第一透镜单元，以形成由每个非制冷焦平面阵列及其对应的第一连接件、第一透镜单元构成的第一封闭区域；其中，多个所述非制冷焦平面阵列，或多个所述第一连接件，或多个所述第一透镜单元，三者中至少一种位于同一基片上。例如，接上例，在基片 2上对应去除材料的位置上方分别安装第一透镜单元，如将第一透镜单元分别安装于基片 2上对应去除材料的位置上方，或者，将上方第一透镜单元的机械装置如镜框分别固定于基片 2上对应去除材料的位置上方，以形成由每个非制冷焦平面阵列及其对应的第一连接件、第一透镜单元构成的第一封闭区域。再如，还接上例，在另一基片如基片 3上按如图 11a所示的非制冷焦平面阵列的排列去除相应材料，再将第一透镜单元分别安装于基片 3上对应去除材料的位置上方，得到如图 11c所示的含有多个第一透镜单元的基片 3; 接着，将基片 3 与基片 2对准，通过粘接等方式将基片 3固定于基片 2上，形成由每个非制冷焦平面阵列及其对应的第一连接件、第一透镜单元构成的第一封闭区域。在此，所述第一透镜单元还可由多个含有所述第一透镜单元的多个基片堆叠而成的透镜组。 Next, a first lens unit is respectively mounted over the plurality of the first connecting members to form a first closed region composed of each uncooled focal plane array and its corresponding first connecting member and first lens unit; And a plurality of the uncooled focal plane arrays, or a plurality of the first connectors, or a plurality of the first lens units, at least one of the three being on the same substrate. For example, in the above example, the first lens unit is respectively mounted on the substrate 2 above the position corresponding to the material removal, for example, the first lens unit is respectively mounted on the substrate 2 above the position corresponding to the material removed, or The mechanical means of the lens unit, such as the frame, are respectively fixed on the substrate 2 above the position corresponding to the material to be removed to form a first closed area composed of each uncooled focal plane array and its corresponding first connecting member and first lens unit. . Another example is the example, in another The substrate, such as the substrate 3, is removed from the corresponding material according to the arrangement of the uncooled focal plane array as shown in FIG. 11a, and the first lens unit is respectively mounted on the substrate 3 above the position corresponding to the material removed, as shown in FIG. 11c. The substrate 3 including a plurality of first lens units is shown; next, the substrate 3 is aligned with the substrate 2, and the substrate 3 is fixed to the substrate 2 by bonding or the like to form each uncooled coke. a first enclosed area of the planar array and its corresponding first connector, first lens unit. Here, the first lens unit may also be a lens group in which a plurality of substrates including the first lens unit are stacked.

举例来说，可采用硅晶片作为所述非制冷焦平面阵列所附着的衬底的材料，在另一硅晶片上、玻璃片上或其他材料制成的基片上通过掏空部分材料形成所述第一连接件，在硅材料、锗材料或其他可透射红外线的光学材料上通过半导体加工工艺或模压等方法加工形成所述第一透镜单元，其中，所述第一透镜单元还可以用若干加工后的基片叠加形成，以形成透镜组。 For example, a silicon wafer can be used as the material of the substrate to which the uncooled focal plane array is attached, and the first silicon wafer, the glass sheet or the substrate made of other materials can be formed by hollowing out a portion of the material. a connecting member formed on a silicon material, a germanium material or other infrared transmissive optical material by a semiconductor processing process or molding, etc., wherein the first lens unit can also be processed after several processes The substrates are superposed to form a lens group.

在此，本领域技术人员应能理解，在具体实施例中，构成所述第一封闭区域的方式还包括： 1 ) 首先将所述第一连接件和所述第一透镜单元进行粘接，然后再和所述衬底进行粘接，如通过直接键合或通过共晶合金键合等实现粘接，如先将图 11c所示的第一透镜单元粘接于图 l ib 所示的第一连接上，然后，再将粘接后的组件与图 11a所示的衬底粘接，以形成由每个非制冷焦平面阵列及其对应的第一连接件、第一透镜单元构成的第一封闭区域； 2 ) 首先将所述衬底、所述第一连接件、所述第一透镜单元按该顺序进行堆叠，然后，再进行粘接形成所述第一封闭区域，例如，先将如图 l ib所示的第一连接件放置于图 11a所示的衬底上，且第一连接件与所述衬底上的非制冷焦平面阵列对准，然后，将图 11c 所示的第一透镜单元放置于如图 l ib所示的第一连接件上，且第一透镜单元与所述第一连接件对准，以形成由每个非制冷焦平面阵列及其对应的第一连接件、第一透镜单元构成的区域，接着，再进行粘接，使该区域为封闭区域。 Herein, it should be understood by those skilled in the art that, in a specific embodiment, the manner of constituting the first closed area further includes: 1) first bonding the first connecting member and the first lens unit, Then bonding to the substrate, such as by direct bonding or by eutectic alloy bonding, etc., as shown by first bonding the first lens unit shown in FIG. 11c to FIG. a connection, and then bonding the bonded component to the substrate shown in FIG. 11a to form a first frame formed by each uncooled focal plane array and its corresponding first connector and first lens unit a closed area; 2) first stacking the substrate, the first connecting member, and the first lens unit in this order, and then bonding to form the first closed region, for example, first A first connector as shown in FIG. 1 ib is placed on the substrate shown in FIG. 11a, and the first connector is aligned with the uncooled focal plane array on the substrate, and then, as shown in FIG. 11c The first lens unit is placed as shown in FIG. a first connector, and the first lens unit is aligned with the first connector to form an area composed of each uncooled focal plane array and its corresponding first connector, first lens unit, and then Bonding is further performed to make the area a closed area.

优选地，所述第一连接件和所述第一透镜单元还可以为一体，如将所述第一透镜单元置于形成所述第一连接件的基片的去除材料位置上方。 Preferably, the first connecting member and the first lens unit may also be integrated, such as placing the first lens unit on a material removal position of a substrate forming the first connecting member. Party.

优选地，所述第一透镜单元包括透镜组、菲涅尔透镜或微透镜阵列。所述第一封闭区域为真空区域。 Preferably, the first lens unit comprises a lens group, a Fresnel lens or a microlens array. The first enclosed area is a vacuum area.

在此，在对非制冷焦平面阵列进行封装时，本发明直接采用第一透镜单元作为封盖，通过第一连接件的垂直厚度来控制第一透镜单元到非制冷焦平面的距离以控制成像效果，本发明中的封装工艺省略了现有技术中的封盖，且非制冷焦平面阵列与第一透镜单元集成封装，从而实现了降低生产成本，提高装配效率等有益效果。 Here, when encapsulating the uncooled focal plane array, the present invention directly uses the first lens unit as a cover, and controls the distance of the first lens unit to the uncooled focal plane by the vertical thickness of the first connecting member to control imaging. Effect, the packaging process in the present invention omits the cover in the prior art, and the uncooled focal plane array is integrated with the first lens unit, thereby achieving the beneficial effects of reducing production cost and improving assembly efficiency.

优选地，当作为封盖的第一透镜单元面积小于其对应的非制冷焦平面阵列的面积时，封装时可将从非制冷焦平面阵列引出的电极暴露在外，如图 12a所示；若当作为封盖的第一透镜单元面积与其对应的非制冷焦平面阵列的面积相等时，可从第一透镜单元所在基片内部嵌入或穿过金属引线，与非制冷焦平面阵列引出的电极形成接触，如图 12b所示。 Preferably, when the area of the first lens unit as the cover is smaller than the area of the corresponding uncooled focal plane array, the electrode drawn from the uncooled focal plane array may be exposed when packaged, as shown in FIG. 12a; When the area of the first lens unit as the cover is equal to the area of the corresponding uncooled focal plane array, the metal lead may be embedded or passed through the inside of the substrate where the first lens unit is located to form contact with the electrode drawn from the uncooled focal plane array. , as shown in Figure 12b.

本领域技术人员应理解上述在多个所述第一连接件上方分别安装第一透镜单元的方式仅为示例，其他现有的或今后可能出现的在多个所述第一连接件上方分别安装第一透镜单元的方式如可适用于本发明，也应包含在本发明保护范围以内，并在此以引用方式包含于此。 It should be understood by those skilled in the art that the manner in which the first lens unit is respectively mounted above the plurality of the first connecting members is only an example, and other existing or future possible installations are respectively installed above the plurality of the first connecting members. The manner in which the first lens unit is applicable to the present invention is also intended to be included within the scope of the present invention and is hereby incorporated by reference.

接着，按所述第一连接件对所述同一基片进行切割，以获得多个封装组件，其中，每一封装组件包括对应的非制冷焦平面阵列、第一连接件及第一透镜单元，其中，所述对应的非制冷焦平面阵列、第一连接件及透镜单元构成第一封闭区域。例如，接上例，通过依次将形成有所述第一连接件的基片 2置于包含多个所述非制冷焦平面阵列的基片 1上，将含有多个所述第一透镜单元的基片 3置于形成有所述第一连接件的基片 2上，可按所述第一连接件对所述同一基片进行切割，如图 13所示，以获得多个封装组件，其中，每一封装组件包括对应的非制冷焦平面阵列、第一连接件及第一透镜单元，其中，所述对应的非制冷焦平面阵列、第一连接件及透镜单元构成第一封闭区域。 Then, the same substrate is cut according to the first connecting member to obtain a plurality of package components, wherein each package component includes a corresponding uncooled focal plane array, a first connecting member and a first lens unit, The corresponding uncooled focal plane array, the first connecting member and the lens unit constitute a first closed region. For example, in the above example, by sequentially placing the substrate 2 on which the first connecting member is formed on the substrate 1 including a plurality of the uncooled focal plane arrays, a plurality of the first lens units are included. The substrate 3 is placed on the substrate 2 on which the first connecting member is formed, and the same substrate can be cut according to the first connecting member, as shown in FIG. 13, to obtain a plurality of package components, wherein Each package component includes a corresponding uncooled focal plane array, a first connector, and a first lens unit, wherein the corresponding uncooled focal plane array, the first connector, and the lens unit constitute a first enclosed region.

对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化涵括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。此外，显然"包括"一词不排除其他单元或步骤，单数不排除复数。装置权利要求中陈述的多个单元或装置也可以由一个单元或装置通过软件或者硬件来实现。第一，第二等词语用来表示名称，而并不表示任何特定的顺序。 It is apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, and other embodiments can be used without departing from the spirit or essential characteristics of the invention. The invention is embodied in a specific form. Therefore, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the invention is defined by the appended claims All changes in the meaning and scope of equivalent elements are included in the present invention. Any reference signs in the claims should not be construed as limiting the claim. In addition, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. A plurality of units or devices recited in the device claims may also be implemented by a unit or device by software or hardware. The first, second, etc. words are used to denote names, and do not denote any particular order.

Claims

权利要求书 Claim

1. 一种焦平面阵列装置，其中，该焦平面阵列装置包括衬底，附着于所述衬底的非制冷焦平面阵列，在所述衬底上沿着所述非制冷焦平面阵列的外周设置的第一连接件，以及安装于所述第一连接件上方的第一透镜单元，其中，所述第一连接件、所述非制冷焦平面阵列所附着的衬底及所述第一透镜单元构成第一封闭区域。 CLAIMS 1. A focal plane array device, wherein the focal plane array device comprises a substrate, an uncooled focal plane array attached to the substrate, along a periphery of the uncooled focal plane array on the substrate a first connecting member disposed, and a first lens unit mounted above the first connecting member, wherein the first connecting member, the substrate to which the uncooled focal plane array is attached, and the first lens The unit constitutes a first enclosed area.

2. 根据权利要求 1所述的焦平面阵列装置，其中，所述第一封闭区域为真空区域。 2. The focal plane array device according to claim 1, wherein the first enclosed region is a vacuum region.

3. 根据权利要求 1所述的焦平面阵列装置，其中，所述非制冷焦平面阵列被像素级封装，其中，所述第一连接件、所述第一透镜单元及经像素级封装后的所述非制冷焦平面阵列所附着的衬底构成第一封闭区域。 3. The focal plane array device according to claim 1, wherein the uncooled focal plane array is encapsulated by a pixel level, wherein the first connector, the first lens unit, and the pixel-level packaged The substrate to which the uncooled focal plane array is attached constitutes a first enclosed area.

4. 根据权利要求 1所述的焦平面阵列装置，其中，该焦平面阵列装置还包括安装于所述第一连接件围成的空腔内的封盖，使得所述第一连接件、所述非制冷焦平面阵列所附着的衬底及所述第一透镜单元构成的第一封闭区域被所述封盖分隔为两个封闭区域，其中，所述封盖朝向所述焦平面阵列的封闭区域为第二封闭区域，所述封盖相对所述焦平面阵列的另一侧的封闭区域为第三封闭区域，其中，所述第二封闭区域为真空区域。 4. The focal plane array device according to claim 1, wherein the focal plane array device further comprises a cover mounted in a cavity surrounded by the first connector, such that the first connector, the The substrate to which the uncooled focal plane array is attached and the first closed region formed by the first lens unit are separated into two closed regions by the cover, wherein the cover is closed toward the focal plane array The area is a second closed area, and the closed area of the cover opposite to the other side of the focal plane array is a third closed area, wherein the second closed area is a vacuum area.

5. 根据权利要求 1至 4中任一项所述的焦平面阵列装置，其中，该焦平面阵列装置还包括： The focal plane array device according to any one of claims 1 to 4, wherein the focal plane array device further comprises:

- 通过第二连接件安装于所述第一透镜单元相对所述非制冷焦平面阵列另一侧的第二透镜单元。 Mounting to the second lens unit of the first lens unit opposite the other side of the uncooled focal plane array by a second connector.

6. 根据权利要求 5所述的焦平面阵列装置，其中，所述第二透镜单元包括菲涅尔透镜。 6. The focal plane array device according to claim 5, wherein the second lens unit comprises a Fresnel lens.

7. 根据权利要求 1至 6中任一项所述的焦平面阵列装置，其中，所述第一透镜单元包括菲涅尔透镜或微透镜阵列。 The focal plane array device according to any one of claims 1 to 6, wherein the first lens unit comprises a Fresnel lens or a microlens array.

8. 一种焦平面阵列装置，其中，该焦平面阵列装置包括衬底，附着于所述衬底的被像素级封装的非制冷焦平面阵列，第三连接件，以及所述第三连接件所连接的位于所述经像素级封装后的非制冷焦平面阵列上方的封盖，其中，所述第三连接件、经像素级封装后的所述非制冷焦平面阵列所附着的衬底及所述封盖构成第一封闭区域。 8. A focal plane array device, wherein the focal plane array device comprises a substrate, attached a pixel-level encapsulated uncooled focal plane array of the substrate, a third connector, and a cap attached to the pixel-packaged uncooled focal plane array connected to the third connector The third connecting member, the substrate attached to the uncooled focal plane array after the pixel level packaging, and the cover constitute a first closed region.

9. 一种焦平面阵列装置，其中，该焦平面阵列装置包括衬底、附着于所述衬底的非制冷焦平面阵列、在所述衬底上沿着所述非制冷焦平面阵列的外周设置的第一连接件、安装于所述第一连接件上方的封盖，以及在所述封盖、所述第一连接件或所述衬底上设置的第四连接件，其中，所述第四连接件使得安装于所述第四连接件上的第一透镜单元位于所述封盖相对于所述非制冷焦平面阵列的另一侧，其中，所述第一连接件、所述非制冷焦平面阵列所附着的衬底及所述封盖构成真空区域。 9. A focal plane array device, wherein the focal plane array device comprises a substrate, an uncooled focal plane array attached to the substrate, and a periphery of the uncooled focal plane array on the substrate a first connector disposed, a cover mounted over the first connector, and a fourth connector disposed on the cover, the first connector or the substrate, wherein a fourth connector such that the first lens unit mounted on the fourth connector is located on the other side of the cover relative to the uncooled focal plane array, wherein the first connector, the non- The substrate to which the cooled focal plane array is attached and the cover form a vacuum region.

10. 根据权利要求 9所述的焦平面阵列装置，其中，所述第一透镜单元包括菲涅尔透镜或微透镜阵列。 10. The focal plane array device according to claim 9, wherein the first lens unit comprises a Fresnel lens or a microlens array.

11. 一种带封装壳体的焦平面阵列装置，其中，所述带封装壳体的焦平面阵列装置包括衬底、附着于所述衬底的非制冷焦平面阵列，以及用于放置所述非制冷焦平面阵列所附着的衬底的封装壳体，其中，所述封装壳体为中空的、至少一端具有开口的壳体，所述非制冷焦平面阵列面向所述封装壳体的一个开口，该焦平面阵列装置还包括用于封闭所述封装壳体中所述非制冷焦平面阵列所面向的开口的第一透镜单元，以及用于封闭所述封装壳体的至多另一个开口的底盘。 11. A focal plane array device with a package housing, wherein the focal plane array device with a package housing includes a substrate, an uncooled focal plane array attached to the substrate, and for placing the a package housing of a substrate to which an uncooled focal plane array is attached, wherein the package housing is a hollow housing having an opening at least at one end, and the uncooled focal plane array faces an opening of the package housing The focal plane array device further includes a first lens unit for closing an opening of the package housing facing the uncooled focal plane array, and a chassis for closing at most another opening of the package housing .

12. 根据权利要求 11所述的焦平面阵列装置，其中，所述第一透镜单元包括菲涅尔透镜或微透镜阵列。 The focal plane array device according to claim 11, wherein the first lens unit comprises a Fresnel lens or a microlens array.

13. 一种红外成像仪，其中，所述红外成像仪包括如权利要求 1至 12中任一项所述的焦平面阵列装置。 An infrared imager, wherein the infrared imager comprises the focal plane array device according to any one of claims 1 to 12.

14. 一种封装非制冷焦平面阵列的方法，其中，该方法包括： 14. A method of packaging an uncooled focal plane array, wherein the method comprises:

- 在多个所述第一连接件上方分别安装第一透镜单元，以形成由每个非制冷焦平面阵列及其对应的第一连接件、第一透镜单元构成的第一去: f闭区域； - mounting a first lens unit above each of the plurality of first connectors to form a first one of each uncooled focal plane array and its corresponding first connector, first lens unit Go to: f closed area;

其中，该方法还包括： The method further includes:

15. 根据权利要求 14所述的封装非制冷焦平面阵列的方法，其中，所述第一透镜单元包括菲涅尔透镜或微透镜阵列。 15. A method of packaging an uncooled focal plane array according to claim 14, wherein the first lens unit comprises a Fresnel lens or a microlens array.