WO2015037047A1 - 半導体装置、半導体モジュール - Google Patents
半導体装置、半導体モジュール Download PDFInfo
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- WO2015037047A1 WO2015037047A1 PCT/JP2013/074348 JP2013074348W WO2015037047A1 WO 2015037047 A1 WO2015037047 A1 WO 2015037047A1 JP 2013074348 W JP2013074348 W JP 2013074348W WO 2015037047 A1 WO2015037047 A1 WO 2015037047A1
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- cooling
- semiconductor module
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- cooling jacket
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/112—Mixed assemblies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to, for example, a semiconductor device used as a power control device, and a semiconductor module.
- Patent Document 1 discloses a semiconductor device in which a cooling jacket is fixed to a semiconductor module.
- the cooling jacket is fixed to the semiconductor module by inserting a screw through an opening formed in the cooling jacket and inserting the screw into a screw hole formed in the heat dissipation substrate of the semiconductor module.
- Patent Document 1 It is preferable to miniaturize the semiconductor device as much as possible.
- the semiconductor device disclosed in Patent Document 1 has a structure disadvantageous for miniaturization because it is necessary to secure a space for providing a screw hole in the heat dissipation substrate.
- the present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a semiconductor device and a semiconductor module which can be miniaturized.
- a semiconductor device includes: a semiconductor module having a plurality of cooling fins and a fixing cooling fin which is longer than the plurality of cooling fins and in which a screw hole is provided at a tip end portion; A cooling jacket having a coolant flow passage for containing the stationary cooling fin, and an opening formed to allow insertion of a screw into the screw hole; and the cooling jacket being inserted into the screw hole through the opening; And a screw fixed to the semiconductor module.
- Another semiconductor device includes a semiconductor module having a plurality of cooling fins, and a cooling jacket having a refrigerant flow path for accommodating the plurality of cooling fins, and the semiconductor module and the cooling jacket A snap fit mechanism is formed to fix the semiconductor module to the cooling jacket.
- a semiconductor module according to the invention of the present application is characterized by comprising a plurality of cooling fins and a fixing cooling fin which is longer than the plurality of cooling fins and in which a screw hole is provided at a tip end.
- Another semiconductor module according to the present invention is characterized by comprising a plurality of cooling fins and a hook extending in the same direction as the plurality of cooling fins.
- the semiconductor device and the semiconductor module can be miniaturized.
- FIG. 1 is an exploded view of a semiconductor device according to Embodiment 1 of the present invention. It is the perspective view which looked at the semiconductor module from the bottom side. It is a perspective view of a semiconductor device. It is sectional drawing of an opening and its periphery. It is sectional drawing of the opening after screwing and its periphery.
- FIG. 7 is a perspective view of a semiconductor device in accordance with a second embodiment of the present invention.
- FIG. 10 is a perspective view of a semiconductor device according to Embodiment 3 of the present invention.
- FIG. 10 is an exploded view of a semiconductor device according to Embodiment 4 of the present invention. It is a perspective view of a hook. It is a perspective view of the completed semiconductor device.
- FIG. 10 is a perspective view of a semiconductor device according to Embodiment 3 of the present invention. It is an exploded view of a semiconductor device according to Embodiment 4 of the present invention. It is a perspective view of a hook. It is
- FIG. 5 is a cross-sectional view of a portion including an O-ring of the semiconductor device. It is an exploded view of the semiconductor device concerning Embodiment 5 of the present invention. It is a perspective view of the completed semiconductor device. It is sectional drawing of the part containing the O ring of a semiconductor device. It is an exploded view of the semiconductor device concerning Embodiment 6 of this invention. It is a perspective view of the completed semiconductor device.
- a semiconductor device according to an embodiment of the present invention and a semiconductor module which is a part of the semiconductor device will be described with reference to the drawings.
- the same or corresponding components may be assigned the same reference numerals and repetition of the description may be omitted.
- FIG. 1 is an exploded view of a semiconductor device 10 according to a first embodiment of the present invention.
- the semiconductor device 10 includes a semiconductor module 12 and a cooling jacket 14 fixed to the semiconductor module 12. First, the semiconductor module 12 will be described.
- the semiconductor module 12 includes a mold resin 20 for sealing a semiconductor element such as, for example, an IGBT (Insulated Gate Bipolar Transistor).
- IGBT Insulated Gate Bipolar Transistor
- FIG. 2 is a perspective view of the semiconductor module 12 as viewed from the bottom side.
- a plurality of cooling fins 30 and a fixing cooling fin 32 are provided in contact with the base plate 24.
- the plurality of cooling fins 30 and the fixing cooling fins 32 are integrally formed with the base plate 24 using the same material as the base plate 24.
- the cooling fins 30 are formed, for example, of pin fins, but may be formed of other types of fins.
- the stationary cooling fins 32 are longer than the cooling fins 30. Therefore, the fixing cooling fins 32 project to the outside of the semiconductor module 12 more than the plurality of cooling fins 30.
- a screw hole is provided at the tip of the fixing cooling fin 32.
- Such a fixing cooling fin 32 is formed of, for example, a boss with a screw hole.
- the plurality of cooling fins 30 and the fixing cooling fins 32 are provided at the central portion of the base plate 24. Therefore, the plurality of cooling fins 30 and the fixing cooling fins 32 are not provided on the outer peripheral portion of the base plate 24.
- the stationary cooling fins 32 are provided substantially at the center of the base plate 24.
- An O-ring 40 and an O-ring 42 are provided between the semiconductor module 12 and the cooling jacket 14.
- the cooling jacket 14 will be described.
- a coolant channel 44 is formed in the cooling jacket 14.
- the flow direction of the refrigerant is indicated by an arrow.
- flow path openings 46, 48 are formed on the two opposite sides of the cooling jacket 14.
- An introduction opening 49 for introducing the plurality of cooling fins 30 and the fixing cooling fins 32 into the coolant channel 44 is formed on the upper surface side of the cooling jacket 14.
- the plurality of cooling fins 30 and the fixing cooling fins 32 are accommodated in the coolant channel 44 through the introduction openings 49.
- An annular groove 50 is formed on the surface (upper surface) of the cooling jacket 14 facing the semiconductor module 12.
- the grooves 50 surround the plurality of cooling fins 30 and the fixing cooling fins 32 when the semiconductor device 10 is completed.
- the O-ring 40 described above is accommodated in the groove 50.
- An opening 52 is formed in the cooling jacket 14 so that the screw 60 can be inserted into the screw hole of the fixing cooling fin 32 accommodated in the refrigerant flow path 44. Then, the cooling jacket 14 is fixed to the semiconductor module 12 by inserting the shaft of the screw 60 into the screw hole of the fixed cooling fin 32 through the opening 52 and screwing the head of the screw 60 to the outer wall of the cooling jacket 14. Ru.
- FIG. 3 is a perspective view of the semiconductor device 10. Only one half of the cooling jacket 14 is shown for convenience of explanation.
- the O-ring 42 is sandwiched between the cooling jacket 14 and the fixing cooling fins 32 to be elastically deformed. This will be described with reference to FIGS.
- FIG. 4 is a cross-sectional view of the opening 52 and the periphery thereof.
- the width (X2) on the inner wall 14a side is larger than the width (X1) on the outer wall 14b side.
- a counterbore 70 is formed on the inner wall of the cooling jacket 14. The width of the counterbore 70 matches the width of the stationary cooling fin 32.
- FIG. 5 is a cross-sectional view of the opening after screwing and the periphery thereof.
- the tip of the fixing cooling fin 32 is accommodated in the counterbore 70.
- the O-ring 42 is installed between the tip and the bottom surface of the counterbore 70.
- the screw 60 is inserted into the screw hole. Tightening the screw 60 can generate a force that presses the cooling jacket 14 against the semiconductor module 12.
- the O-ring 40 provided in the groove 50 is elastically deformed by this force to fill the gap between the cooling jacket 14 and the semiconductor module 12, and the O-ring 42 is elastically deformed to form the tip portion and the counterbore of the cooling fin 32 for fixation. Fill the gap between the bottom of 70. Therefore, the refrigerant flowing in the refrigerant flow path 44 can be sealed in the refrigerant flow path 44 by the O-rings 40 and 42.
- the outer diameter of the O-rings 40 and 42, the shape of the groove 50, the depth of the counterbore 70, and the cooling for fixing are set in order to make the amount of elastic deformation of the O-rings 40 and 42 optimal for refrigerant sealing.
- the length of the fins 32 is appropriately changed.
- the fixing cooling fins 32 used for fixing the semiconductor module 12 and the cooling jacket 14 are provided side by side with the plurality of cooling fins 30. That is, since the fixing cooling fins 32 are provided in the place where the cooling fins were provided conventionally, the semiconductor device can be prevented from increasing in size.
- the fixing cooling fins 32 contribute to the cooling of the semiconductor module 12 in the same manner as the plurality of cooling fins 30. Therefore, the semiconductor module 12 can be efficiently cooled, and furthermore, the semiconductor device 10 can be miniaturized.
- the O-ring 40 is provided in the groove 50 and the O-ring 42 is provided in the counterbore 70, the whole of the O-ring 40 does not touch the refrigerant or the whole of the O-ring 42 does not touch the refrigerant. . Therefore, the durability of the O-rings 40, 42 can be enhanced as compared with the case where the entire O-rings 40, 42 are in contact with the refrigerant. In particular, as can be seen from FIG. 5, the O-ring 42 provided in the counterbore 70 hardly contacts the refrigerant, and therefore the reliability of the semiconductor device 10 can be improved.
- the semiconductor device 10 and the semiconductor module 12 according to the first embodiment of the present invention can be variously modified.
- the mold resin 20 may be replaced by a case.
- the counterbore portion 70 may be omitted to simplify the configuration of the cooling jacket 14.
- FIG. 6 is a perspective view of the semiconductor device according to the second embodiment of the present invention. Only one half of the cooling jacket 80 is shown for convenience of explanation.
- the semiconductor module 90 includes an additional fixing cooling fin 92 having a screw hole at its tip.
- the additional fixing cooling fins 92 have the same shape as the fixing cooling fins 32 and are connected to the base plate 24.
- the additional fixing cooling fins 92 are accommodated in the refrigerant channel.
- the cooling jacket 80 is provided with an additional opening 82 so that a screw can be inserted into the screw hole of the additional fixing cooling fin 92.
- the additional opening 82 has the same shape as the opening 52 and forms a counterbore.
- the additional screw 94 is inserted into the screw hole of the additional fixing cooling fin 92 through the additional opening 82.
- An O-ring 96 is provided between the bottom surface of the counterbore and the tip of the additional fixing cooling fin 92.
- the cooling jacket 80 is inserted by inserting the screw 60 into the screw hole of the fixing cooling fin 32 and inserting the additional screw 94 into the screw hole of the additional fixing cooling fin 92. Is fixed to the semiconductor module 90.
- the bonding strength between the semiconductor module and the cooling jacket can be improved as compared with the semiconductor device of the first embodiment. it can.
- the number of fixing cooling fins is not limited to two, and may be three or more.
- FIG. 7 is a perspective view of the semiconductor device according to the third embodiment of the present invention.
- the plurality of cooling jackets 14 are connected to form a series of refrigerant flow paths.
- the cooling jackets 14 are fixed (connected) by a fitting structure capable of sealing the refrigerant.
- a plurality of semiconductor modules 12 constituting a three-phase inverter can be integrated in a small space.
- the number of connected semiconductor devices 10 is not particularly limited. Further, a plurality of semiconductor devices according to the second embodiment may be connected.
- FIG. 8 is an exploded view of a semiconductor device 100 according to the fourth embodiment of the present invention.
- a hook 104 is formed in the semiconductor module 102.
- the hooks 104 extend in the same direction as the plurality of cooling fins 30.
- the hooks 104 are formed of the same material as the mold resin 20 so as to be connected to the four corners of the mold resin 20.
- the hook 104 may be formed of the same material as the base plate so as to be connected to the base plate.
- FIG. 9 is a perspective view of the hook.
- the hooks 104 are tapered at the root portion 104a. Therefore, the hook 104 is thick at the root. It returns to the explanation of FIG.
- the cooling jacket 110 is formed with a hook groove 112 which is shaped so as to be snap fit with the hook 104 described above.
- the hook grooves 112 are formed at four corners of the cooling jacket 110.
- the hook groove 112 and the hook 104 described above form a snap fit mechanism.
- FIG. 10 is a perspective view of the completed semiconductor device 100.
- the cooling jacket 110 is fixed (snap-fit fixed) to the semiconductor module 102 by elastically deforming the hook 104 and fitting it into the hook groove 112.
- FIG. 11 is a cross-sectional view of a portion including the O-ring 40 of the semiconductor device 100. As shown in FIG. The snap fit fixing described above elastically deforms the O-ring 40 and fills the gap between the cooling jacket 110 and the semiconductor module 102. Thereby, the refrigerant can be sealed in the refrigerant channel.
- the hooks 104 formed in part of the semiconductor module 102 and the hook grooves 112 formed in part of the cooling jacket 110 do not increase the size of the semiconductor device 100. That is, there is no increase in size due to the provision of the hooks 104 and the hook grooves 112. Furthermore, since the cooling jacket 110 is fixed to the semiconductor module 102 by snap fitting, assembly is very easy. Further, the number of parts can be reduced as compared with the first embodiment. Furthermore, by making the root portion of the hook 104 tapered, the strength of the hook 104 can be increased.
- a snap fit mechanism may be formed on the semiconductor module and the cooling jacket to fix the semiconductor module to the cooling jacket. Therefore, for example, hook grooves may be formed in the semiconductor module and hooks may be formed in the cooling jacket.
- the position, size, shape, and number of hooks and hook grooves can be changed as appropriate. For example, when using a large semiconductor module, the number of hooks and hook grooves may be increased.
- FIG. 12 is an exploded view of a semiconductor device 120 according to the fifth embodiment of the present invention.
- the semiconductor device 120 includes a first semiconductor module 122 and a second semiconductor module 124 as semiconductor modules.
- the first semiconductor module 122 and the second semiconductor module 124 are the same as the semiconductor module 102 of the fourth embodiment.
- the cooling jacket 130 has an introduction opening 132 on the upper surface side and an introduction opening 134 on the lower surface side.
- the introduction opening 132 is formed to introduce the plurality of cooling fins 30 of the first semiconductor module 122 into the coolant channel 44.
- the introduction openings 134 are formed to introduce the plurality of cooling fins 30 of the second semiconductor module 124 into the coolant channel 44.
- Four hook grooves 140 that snap fit with the hooks 104 of the first semiconductor module 122 are formed on the side surface on the upper surface side of the cooling jacket 130.
- Four hook grooves 142 that snap fit with the hooks 104 of the second semiconductor module 124 are formed on the side surface on the lower surface side of the cooling jacket 130.
- FIG. 13 is a perspective view of the completed semiconductor device 120. As shown in FIG. The hooks 104 of the first semiconductor module 122 fit in the hook grooves 140, whereby the first semiconductor module 122 is fixed to the upper surface side of the cooling jacket 130. The hooks 104 of the second semiconductor module 124 fit in the hook grooves 142, whereby the second semiconductor module 124 is fixed to the lower surface side of the cooling jacket 130.
- FIG. 14 is a cross-sectional view of a portion including the O-ring 40 of the semiconductor device 120.
- the O-ring 40 on the upper surface side of the cooling jacket 130 is elastically deformed, and the gap between the cooling jacket 130 and the first semiconductor module 122 is filled. Further, the O-ring 40 on the lower surface side of the cooling jacket 130 is elastically deformed to fill the gap between the cooling jacket 130 and the second semiconductor module 124.
- the semiconductor modules can be fixed to both the upper surface and the lower surface of the cooling jacket 130. Therefore, two semiconductor modules (the first semiconductor module 122 and the second The semiconductor module 124) can be cooled.
- the distance between the plurality of cooling fins 30 of the first semiconductor module 122 and the plurality of cooling fins 30 of the second semiconductor module 124 is reduced, it is possible to suppress the variation of the flow velocity distribution in the refrigerant flow path and enhance the cooling efficiency.
- the plurality of cooling fins 30 of the first semiconductor module 122 and the plurality of cooling fins 30 of the second semiconductor module 124 are brought into contact with each other, variation in flow velocity distribution in the refrigerant flow path is suppressed. can do.
- FIG. 15 is an exploded view of a semiconductor device according to the sixth embodiment of the present invention.
- the plurality of cooling jackets 130 are connected to form a series of coolant channels.
- the cooling jackets 130 are fixed (connected) by a fitting structure capable of sealing the refrigerant.
- FIG. 16 is a perspective view of the completed semiconductor device 150.
- a plurality of semiconductor modules (three first semiconductor modules and three semiconductor modules) can be cooled by one cooling jacket 130. Thereby, for example, a plurality of semiconductor modules constituting a three-phase inverter can be integrated in a small space.
- the number of connected semiconductor devices 120 is not particularly limited. The effects of the present invention may be enhanced by appropriately combining the features of the semiconductor devices according to the above embodiments.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
図1は、本発明の実施の形態1に係る半導体装置10の分解図である。半導体装置10は、半導体モジュール12と、半導体モジュール12に固定された冷却ジャケット14とを備えている。まず半導体モジュール12について説明する。半導体モジュール12は、例えばIGBT(Insulated Gate Bipolar Transistor)などの半導体素子を封止するモールド樹脂20を備えている。
本発明の実施の形態2に係る半導体装置は、固定用冷却フィンを複数設けた点等において、実施の形態1に係る半導体装置と相違する。図6は、本発明の実施の形態2に係る半導体装置の斜視図である。説明の便宜上、冷却ジャケット80は半分だけ示す。
本発明の実施の形態3に係る半導体装置は、実施の形態1に係る半導体装置10を複数(3つ)連結させたものである。図7は、本発明の実施の形態3に係る半導体装置の斜視図である。複数の冷却ジャケット14は、一続きの冷媒流路を形成するように接続されている。冷却ジャケット14間は冷媒を封止できる嵌合構造で固定(連結)する。これにより、例えば3相インバータを構成する複数の半導体モジュール12を小さいスペースで集積することができる。
実施の形態4に係る半導体装置と半導体モジュールは実施の形態1との共通点が多いので、実施の形態1との相違点を中心に説明する。図8は、本発明の実施の形態4に係る半導体装置100の分解図である。半導体モジュール102にはフック104が形成されている。フック104は、複数の冷却フィン30と同じ方向に伸びている。フック104は、モールド樹脂20と同じ材料でモールド樹脂20の4つの角部につながるように形成されている。なお、フック104は、ベースプレートと同じ材料で、ベースプレートにつながるように形成してもよい。
実施の形態5に係る半導体装置については、実施の形態4の半導体装置100との相違点を中心に説明する。図12は、本発明の実施の形態5に係る半導体装置120の分解図である。半導体装置120は、半導体モジュールとして第1半導体モジュール122と第2半導体モジュール124を備えている。第1半導体モジュール122と第2半導体モジュール124は、実施の形態4の半導体モジュール102と同じものである。
本発明の実施の形態6に係る半導体装置は、実施の形態5に係る半導体装置120を複数(3つ)連結させたものである。図15は、本発明の実施の形態6に係る半導体装置の分解図である。複数の冷却ジャケット130は、一続きの冷媒流路を形成するように接続されている。冷却ジャケット130間は冷媒を封止できる嵌合構造で固定(連結)する。
Claims (13)
- 複数の冷却フィンと、前記複数の冷却フィンより長く、先端部にねじ穴が設けられた固定用冷却フィンと、を有する半導体モジュールと、
前記複数の冷却フィンと前記固定用冷却フィンとを収容する冷媒流路と、前記ねじ穴にねじを挿入できるように形成された開口と、を有する冷却ジャケットと、
前記開口を通じて前記ねじ穴に挿入され、前記冷却ジャケットを前記半導体モジュールに固定するねじと、を備えたことを特徴とする半導体装置。 - 前記複数の冷却フィンは複数のピンフィンで形成され、前記固定用冷却フィンはボスで形成されたことを特徴とする請求項1に記載の半導体装置。
- 前記先端部は前記冷却ジャケットの内壁に形成された座ぐり部に収容され、
前記先端部と前記座ぐり部の底面の間に設けられたOリングを備えたことを特徴とする請求項1又は2に記載の半導体装置。 - 前記冷却ジャケットの前記半導体モジュールに対向する面には、前記複数の冷却フィンと前記固定用冷却フィンを囲む環状の溝が形成され、
前記溝内に設けられ、前記冷却ジャケットと前記半導体モジュールの隙間を埋めるOリングを備えたことを特徴とする請求項1乃至3のいずれか1項に記載の半導体装置。 - 前記半導体モジュールは、前記複数の冷却フィンより長く、先端部にねじ穴が設けられた追加固定用冷却フィンを備え、
前記冷却ジャケットには、前記追加固定用冷却フィンのねじ穴にねじを挿入できるように追加開口が形成され、
前記冷媒流路には前記追加固定用冷却フィンが収容され、
前記追加開口を通じて前記追加固定用冷却フィンのねじ穴に挿入された追加ねじを備えたことを特徴とする請求項1乃至4のいずれか1項に記載の半導体装置。 - 前記半導体モジュールと前記冷却ジャケットを複数備え、
複数の前記冷却ジャケットは、一続きの冷媒流路を形成するように接続されたことを特徴とする請求項1乃至5のいずれか1項に記載の半導体装置。 - 複数の冷却フィンと、
前記複数の冷却フィンより長く、先端部にねじ穴が設けられた固定用冷却フィンと、を備えたことを特徴とする半導体モジュール。 - 複数の冷却フィンを有する半導体モジュールと、
前記複数の冷却フィンを収容する冷媒流路を有する冷却ジャケットと、を備え、
前記半導体モジュールと前記冷却ジャケットには、前記半導体モジュールを前記冷却ジャケットに固定するスナップフィット機構が形成されたことを特徴とする半導体装置。 - 前記スナップフィット機構は、
前記半導体モジュールに前記複数の冷却フィンと同じ方向に伸びるように形成されたフックと、
前記冷却ジャケットに前記フックとスナップフィット固定される形状で形成されたフック溝と、を備えたことを特徴とする請求項8に記載の半導体装置。 - 前記フックは付け根部分でテーパ形状に形成されたことを特徴とする請求項9に記載の半導体装置。
- 前記半導体モジュールは、
前記スナップフィット機構により前記冷却ジャケットの上面側に固定された第1半導体モジュールと、
前記スナップフィット機構により前記冷却ジャケットの下面側に固定された第2半導体モジュールと、を備えたことを特徴とする請求項8乃至10のいずれか1項に記載の半導体装置。 - 前記半導体モジュールと前記冷却ジャケットを複数備え、
複数の前記冷却ジャケットは、一続きの冷媒流路を形成するように接続されたことを特徴とする請求項8乃至11のいずれか1項に記載の半導体装置。 - 複数の冷却フィンと、
前記複数の冷却フィンと同じ方向に伸びるフックと、を備えたことを特徴とする半導体モジュール。
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