WO2015033775A1 - 面状発光ユニット - Google Patents
面状発光ユニット Download PDFInfo
- Publication number
- WO2015033775A1 WO2015033775A1 PCT/JP2014/071711 JP2014071711W WO2015033775A1 WO 2015033775 A1 WO2015033775 A1 WO 2015033775A1 JP 2014071711 W JP2014071711 W JP 2014071711W WO 2015033775 A1 WO2015033775 A1 WO 2015033775A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- planar light
- wiring
- emitting unit
- holding substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 238000007789 sealing Methods 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims description 12
- 239000012044 organic layer Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 12
- 239000010408 film Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/88—Terminals, e.g. bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/86—Series electrical configurations of multiple OLEDs
Definitions
- the present invention relates to a structure of a planar light emitting unit using a planar light emitting element.
- Patent Document 1 discloses an illuminating body that can be mounted on a curved surface portion and a manufacturing method thereof.
- the illuminating body disclosed in Patent Document 1 employs a structure in which the internal wiring of a textured EL (electroluminescent) element is drawn from the side surfaces of the insulating film and the insulating layer.
- planar light emitting unit such as an illuminating body is required to be used outdoors, and as a result, a more stable connection structure with external wiring is required.
- the present invention has been made in view of the above problems, and an object of the present invention is to provide a planar light emitting unit having a structure that can stabilize the connection with external wiring.
- the planar light emitting element and the planar light emitting element are held from the light emitting surface side of the planar light emitting element, and light emitted from the planar light emitting element is transmitted.
- a first sealing member for sealing the planar light emitting element and the wiring board On the holding substrate, on the holding substrate, on the same surface as the surface on which the planar light emitting element is held and electrically connected to the planar light emitting element, on the holding substrate, A first sealing member for sealing the planar light emitting element and the wiring board.
- the wiring board includes an external wiring connection portion on the holding substrate side, the opening is provided in the holding substrate, the wiring substrate covers the opening, and the external wiring connection portion passes through the opening.
- the surface of the substrate is sealed with the second sealing member.
- planar light emitting unit having a structure that can stabilize the connection with external wiring.
- FIG. 3 is a cross-sectional view taken along line II-II in FIG. It is a top view which shows schematic structure seen from the light emission surface side of the planar light emission unit in embodiment.
- FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. It is the figure seen from the arrow V direction in FIG. It is a block diagram at the time of mounting a drive control part in the planar light emission unit in embodiment. It is a block diagram at the time of mounting a rectifier circuit part in the planar light emission unit in embodiment.
- planar light-emitting element the planar light-emitting panel using this planar light-emitting element, and the planar light-emitting unit using this planar light-emitting panel in each embodiment based on the present invention
- the scope of the present invention is not necessarily limited to the number, amount, and the like unless otherwise specified.
- the same parts and corresponding parts are denoted by the same reference numerals, and redundant description may not be repeated. It is planned from the beginning to use a combination of the configurations in each embodiment as appropriate.
- FIG. 1 is a front view showing the planar light emitting panel 10 and shows a state when the planar light emitting panel 10 is viewed from the back surface 19 side of the planar light emitting panel 10.
- 2 is a cross-sectional view taken along line II-II in FIG.
- the planar light emitting panel 10 in the present embodiment is composed of an organic EL.
- the planar light emitting panel 10 may be configured as a planar light emitting panel from a plurality of light emitting diodes (LEDs) and a diffusion plate, or may be configured as a planar light emitting panel using a cold cathode tube or the like. .
- a planar light emitting panel 10 includes a holding substrate 11 (cover layer), an anode (anode) 14, an organic layer 15, a cathode (cathode) 16, a sealing member 17 and an insulating layer 18. Including.
- the planar light emitting device 1 is constituted by the anode 14, the organic layer 15, and the cathode 16.
- the holding substrate 11 forms the surface 12 (light emitting surface) of the planar light emitting panel 10, and the outer peripheral end surface of the holding substrate 11 forms the outer periphery 10E of the planar light emitting panel 10.
- the anode 14, the organic layer 15, and the cathode 16 are sequentially stacked on the back surface 13 of the holding substrate 11.
- the sealing member 17 forms the back surface 19 of the planar light emitting panel 10.
- the holding substrate 11 holds the planar light emitting element 1 from the light emitting surface side of the planar light emitting element 1 and transmits light emitted from the planar light emitting element 1. Further, a flexible material is used for the holding substrate 11 so that the planar light emitting unit described later can be bent.
- a light transmissive film member such as polyethylene terephthalate (PET), polycarbonate (PC), or polymethyl methacrylate (PMMA) is used as the flexible material.
- a thin glass substrate may be used for the holding substrate 11.
- polyimide polyethylene naphthalate (PEN), polystyrene (PS), polyethersulfone (PES), polypropylene (PP) and the like are used.
- PEN polyethylene naphthalate
- PS polystyrene
- PS polyethersulfone
- PP polypropylene
- the anode 14 is a conductive film having transparency.
- ITO Indium Tin Oxide
- PEDOT polyethylenedioxythiophene
- the organic layer 15 (light emitting unit) can generate light (visible light) when power is supplied.
- the organic layer 15 may be composed of a single light emitting layer, or may be composed of a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and the like that are sequentially laminated.
- the cathode 16 is, for example, aluminum (AL).
- the cathode 16 is formed so as to cover the organic layer 15 by a vacuum deposition method or the like. In order to pattern the cathode 16 into a predetermined shape, a mask may be used during vacuum deposition.
- Other materials for the cathode 16 include lithium fluoride (LiF), a stack of Al and Ca, a stack of Al and LiF, a stack of Al and Ba, and the like.
- An insulating layer 18 is provided between the cathode 16 and the anode 14 so that the cathode 16 and the anode 14 are not short-circuited.
- the insulating layer 18 is formed in a desired pattern so as to cover a portion that insulates the anode 14 and the cathode 16 from each other using a photolithography method or the like after, for example, a SiO 2 film is formed using a sputtering method. .
- the sealing member 17 is made of an insulating resin or a glass substrate.
- the sealing member 17 is formed to protect the organic layer 15 from moisture and the like.
- the sealing member 17 seals substantially the whole of the anode 14, the organic layer 15, and the cathode 16 (that is, a member provided inside the planar light emitting panel 10) on the holding substrate 11. A part of the anode 14 is exposed from the sealing member 17 for electrical connection (left side in FIG. 2).
- the sealing member 17 is formed by laminating a plurality of layers of an inorganic thin film such as SiO 2 , AL 2 O 3 , SiNx, and a flexible acrylic resin thin film on a film such as PET, PEN, PS, PES, and polyimide. Thus, those having gas barrier properties are used. Gold, silver, copper, or the like may be further laminated on the electrode portion 21 and the electrode portion 22.
- the portion exposed from the sealing member 17 of the anode 14 (on the left side in FIG. 2) constitutes an electrode portion 21 (for anode).
- the electrode portion 21 and the anode 14 are made of the same material.
- the electrode part 21 is located on the outer periphery of the planar light emitting panel 10.
- the portion of the cathode 16 exposed from the sealing member 17 (on the right side in FIG. 2) constitutes an electrode portion 22 (for the cathode).
- the electrode part 22 and the cathode 16 are made of the same material.
- the electrode part 22 is also located on the outer periphery of the planar light emitting panel 10.
- the electrode part 21 and the electrode part 22 are located on opposite sides of the organic layer 15.
- a divided region 20 (see FIG. 1) is formed between adjacent electrode portions 21 and electrode portions 22.
- a wiring pattern (not shown) is attached to the electrode portion 21 and the electrode portion 22 using soldering (silver paste) or the like.
- the wiring member 50 (see FIG. 4), the electrode portions 21 and 22, the anode 14 are supplied from an external wiring substrate 60 (see FIG. 4) described later. Power is supplied through the cathode 16. The light generated in the organic layer 15 is extracted from the surface 12 (light emitting surface) to the outside through the anode 14 and the holding substrate 11.
- a region corresponding to the organic layer 15 constitutes a light emitting region that emits light, and an outer region surrounding the light emitting region is a non-light emitting region.
- the holding substrate 11 has an outer size of 100 mm ⁇ 100 mm and a light emitting area of 90 mm ⁇ 90 mm. Therefore, the width of the non-light emitting region is 5 mm.
- FIGS. 3 is a plan view showing a schematic configuration viewed from the light emitting surface side of the planar light emitting unit 100
- FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3
- FIG. 5 is a direction of arrow V in FIG. It is the figure seen from.
- planar light emitting unit 100 in the present embodiment six planar light emitting panels 10 are formed on one elongated holding substrate 11.
- the respective planar light emitting panels 10 are connected in series in the present embodiment.
- the planar light emitting element 1 of the planar light emitting panel 10 is bonded and fixed using an optical adhesive member so that the light emitting surface faces the holding substrate 11 side.
- the number of the planar light emitting panels 10 provided is not limited and is appropriately changed according to the design specifications.
- the wiring substrate 60 is disposed on the main surface opposite to the light emitting side of the holding substrate 11 (the same side as the side where the planar light emitting element 1 is disposed). .
- the wiring member 50 is connected to each of the positive electrode and the negative electrode of each planar light emitting panel 10, and six planar light emitting panels 10 are connected in series. Both ends of the positive and negative electrodes connected in series are connected on the side opposite to the light emitting side of the wiring board 60.
- first sealing member 70 On the holding substrate 11, the planar light emitting panel 10, the wiring member 50, and the wiring substrate 60 are sealed with a first sealing member 70.
- first sealing member 70 a flexible resin film provided with a sealing region 70p around is used in order to improve outdoor dustproof and drip-proof performance.
- the width of the sealing region 70p is, for example, about 10 mm.
- the first sealing member 70 is preferably made of resin because it has flexibility and electrical insulation.
- Examples of the resin film material having flexibility include polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), polyimide, polyethylene naphthalate (PEN), polystyrene (PS), and polyethersulfone (PES). ), Polypropylene (PP) and the like.
- PET polyethylene terephthalate
- PC polycarbonate
- PMMA polymethyl methacrylate
- PEN polyethylene naphthalate
- PS polystyrene
- PES polyethersulfone
- PP Polypropylene
- the wiring board 60 is provided with positive and negative external wiring connecting portions 40 on the holding substrate 11 side.
- the holding substrate 11 is provided with an opening 11h.
- the wiring board 60 covers the opening 11h from the side opposite to the light emitting surface, and the external wiring connecting portion 40 is exposed to the light emitting surface through the opening 11h. It is arranged as follows. In plan view, the outer shape of the opening 11 h is smaller than the outer shape of the wiring board 60. Therefore, the opening 11 h is covered with the wiring substrate 60 without forming a gap with the holding substrate 11.
- the planar light emitting panel 10 is energized to emit light by supplying electric power to the positive and negative lands of the external wiring connecting portion 40 through the external wiring 90 (see FIG. 5).
- the external wiring connection portion 40 and the external wiring 90 are electrically connected by soldering or the like. As a result, the external wiring 90 is taken out to the light emitting surface side of the planar light emitting unit 100.
- the wiring located in the opening portion 11h is used to waterproof the package, the wiring pattern, and the wiring connecting portion on the wiring board 60 in a state where the external wiring 90 is connected to the external wiring connecting portion 40.
- the surface of the substrate 60 is filled and sealed with the second sealing member 80.
- a resin material for example, silicon resin potting material
- the second sealing member 80 is preferably made of a resin because it is easy to handle in manufacturing and has electrical insulation.
- a sealing region 70p is provided on the outer peripheral portion in order to obtain a dustproof and drip-proof performance that can withstand outdoor use. By satisfying with, it is possible to obtain a sufficient dustproof and splashproof performance.
- FIG. 6 is a block diagram when the drive control unit 200 is mounted on the planar light emitting unit 100
- FIG. 7 is a block diagram when the rectifier circuit unit 500 is mounted on the planar light emitting unit 100.
- planar light emitting unit 100 in order to drive the planar light emitting panel 10, it is preferable to perform constant current driving in order to reduce luminance unevenness due to individual differences of the planar light emitting panel 10.
- the planar light emitting panel 10 is driven by inputting a constant current generated by an external drive circuit unit (not shown) from the external wiring 90. is doing.
- a drive control unit 200 (driver IC) that generates a constant current is mounted on the wiring board 60.
- a direct current may be input.
- an external AC / DC power supply 300 is connected to the constant current circuit unit 210 of the drive control unit 200.
- a rectifier circuit unit (AC / DC conversion circuit) 500 is mounted on the wiring board 60, so that it is generally supplied as an external current. You may make it input alternating current directly.
- the rectifier circuit unit (AC / DC conversion circuit 500) includes a bridge circuit 510, a low-pass filter 520, and a limiting resistor 600.
- the external wiring 90 is taken out from the light emitting surface side of the planar light emitting unit 100 through the opening 11 h of the holding substrate 11, and the mounted object and wiring pattern on the wiring substrate 60.
- a configuration in which the surface of the wiring substrate 60 located in the opening portion 11h is sealed by the second sealing member 80 is employed. This makes it possible to stabilize the connection with the external wiring while ensuring the waterproof property even when used outdoors, despite the simple configuration. Further, the expansion of the non-light emitting area can be suppressed to the minimum, and the wiring work can be easily performed.
- the sealing region 70p of the first sealing member 70 is directly attached to the holding substrate over a certain width. It was. However, if the external wiring 90 is to be taken out to the side by sealing with this configuration, the external wiring 90 is sandwiched between the holding substrate 11 and the first sealing member 70 at the place where the external wiring 90 is taken out. Thus, it becomes difficult to obtain sufficient sealing performance at this extraction location.
- the non-light emitting portion of the joint becomes large, the luminance unevenness of the light emitting surface becomes large, and the uniformity of illumination is impaired. Furthermore, when tiling such a planar light emitting unit is installed on the wall surface, the wiring is drawn out from the side surface so that the side surface of the adjacent planar light emitting unit does not interfere with the external wiring. A defect that cannot be placed occurs. Furthermore, the wiring workability after installation of the surface light-emitting unit on the wall surface also has the problem that if external wiring is pulled out from the side, it is necessary to bend it further in the desired direction after being bent toward the light-emitting surface side. is there.
- the external wiring is not drawn out from the side surface of the planar light emitting unit 100, so it is necessary to provide a region for drawing the external wiring from the side surface in the peripheral portion of the holding substrate 11. There is no. Thereby, the width
- the ratio of the light emitting portions to the total tiling area is increased, and efficient arrangement is possible. Furthermore, since luminance unevenness caused by a luminance difference between the non-light emitting portion and the light emitting portion can be suppressed, high-quality illumination can be obtained.
- the planar light emitting unit 100 be installed on a curved surface such as a wall surface in a tunnel, but also illumination with excellent design utilizing the curved surface shape. It is possible to expand to.
- the external wiring 90 is connected from the light emitting surface side. Since it is taken out, the wiring work when attaching the planar light emitting unit 100 to the wall surface can be easily performed by simply bending the external wiring in a desired direction.
- planar light emitting unit according to the embodiment of the present invention has been described above, but the embodiment disclosed this time should be considered as illustrative in all points and not restrictive. Therefore, the scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
- SYMBOLS 1 planar light emitting element 10 planar light emitting panel, 10E outer periphery, 11 holding substrate, 11h opening part, 12 surface, 13 back surface, 14 anode, 15 organic layer, 16 cathode, 17 sealing member, 18 insulating layer, 19 back surface 40 external wiring connection part, 50 wiring member, 60 wiring board, 70 first sealing member, 70p sealing region, 80 second sealing member, 90 external wiring, 200 drive control part, 210 constant current circuit part, 500 Rectifier circuit (AC / DC conversion circuit), 510 bridge circuit, 520 low-pass filter, 600 limiting resistor.
- AC / DC conversion circuit Rectifier circuit
- 510 bridge circuit 520 low-pass filter
- 600 limiting resistor 600 limiting resistor.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
図1および図2を参照して、本実施の形態における面状発光パネル10の基本構成について説明する。図1は、面状発光パネル10を示す正面図であり、面状発光パネル10の背面19の側から面状発光パネル10を見たときの様子を示している。図2は、図1中II-II線矢視断面図である。
次に、図3から図5を参照して、上記構成を備える面状発光パネル10を用いた面状発光ユニット100の概略構成について説明する。図3は、面状発光ユニット100の発光面側から見た概略構成を示す平面図、図4は、図3中IV-IV線矢視断面図、図5は、図4中の矢印V方向から見た図である。
Claims (5)
- 面状発光素子と、
前記面状発光素子の発光面側から前記面状発光素子を保持し、前記面状発光素子から発光された光を透過する保持基板と、
前記保持基板上の、前記面状発光素子が保持される面と同一の面に保持され、前記面状発光素子に電気的に接続される配線基板と、
前記保持基板上において、前記面状発光素子および前記配線基板を封止する第1封止部材と、を備え、
前記配線基板は、前記保持基板側に外部配線接続部を含み、
前記保持基板には、開口部が設けられ、
前記配線基板は、前記開口部を覆い、前記外部配線接続部が前記開口部を通じて、前記保持基板の前記配線基板が保持される面とは反対側の面に露出するように配置され、
前記外部配線接続部に外部配線が接続された状態で、前記開口部内に位置する前記配線基板の表面が第2封止部材により封止されている、面状発光ユニット。 - 前記配線基板は、定電流を生成する駆動制御部を含む、請求項1に記載の面状発光ユニット。
- 前記配線基板は、整流回路部を含む、請求項1に記載の面状発光ユニット。
- 前記保持基板には、可撓性材料が用いられる、請求項1から3のいずれか1項に記載の面状発光ユニット。
- 前記面状発光素子は、有機EL素子を含む、請求項1から4のいずれか1項に記載の面状発光ユニット。
Priority Applications (2)
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JP2015530806A JP5811312B2 (ja) | 2013-09-04 | 2014-08-20 | 面状発光ユニット |
US14/916,926 US9853239B2 (en) | 2013-09-04 | 2014-08-20 | Surface light-emitting unit |
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JP2013182971 | 2013-09-04 | ||
JP2013-182971 | 2013-09-04 |
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WO2015033775A1 true WO2015033775A1 (ja) | 2015-03-12 |
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US (1) | US9853239B2 (ja) |
JP (1) | JP5811312B2 (ja) |
WO (1) | WO2015033775A1 (ja) |
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JP2007220569A (ja) * | 2006-02-20 | 2007-08-30 | Harison Toshiba Lighting Corp | 有機el発光装置 |
JP2011238908A (ja) * | 2010-04-16 | 2011-11-24 | Semiconductor Energy Lab Co Ltd | 発光装置、及び電子機器 |
JP2012133302A (ja) * | 2010-12-17 | 2012-07-12 | Samsung Mobile Display Co Ltd | 表示装置及び有機発光表示装置 |
JP2013102001A (ja) * | 2011-11-07 | 2013-05-23 | Panasonic Corp | 配線基板とそれを用いた有機デバイス |
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JP2000133438A (ja) | 1998-10-23 | 2000-05-12 | Matsushita Electric Ind Co Ltd | 照光体及びその製造方法 |
US6624570B1 (en) | 1999-09-29 | 2003-09-23 | Sanyo Electric Co., Ltd. | Electroluminescent display device and method for its fabrication |
TW558743B (en) * | 2001-08-22 | 2003-10-21 | Semiconductor Energy Lab | Peeling method and method of manufacturing semiconductor device |
JP5881926B2 (ja) | 2006-10-25 | 2016-03-09 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングOSRAM OLED GmbH | オプトエレクトロニクスデバイス及び該オプトエレクトロニクスデバイスを製造するための方法 |
US9055643B2 (en) * | 2013-03-13 | 2015-06-09 | Cree, Inc. | Solid state lighting apparatus and methods of forming |
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2014
- 2014-08-20 WO PCT/JP2014/071711 patent/WO2015033775A1/ja active Application Filing
- 2014-08-20 JP JP2015530806A patent/JP5811312B2/ja not_active Expired - Fee Related
- 2014-08-20 US US14/916,926 patent/US9853239B2/en active Active
Patent Citations (4)
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JP2007220569A (ja) * | 2006-02-20 | 2007-08-30 | Harison Toshiba Lighting Corp | 有機el発光装置 |
JP2011238908A (ja) * | 2010-04-16 | 2011-11-24 | Semiconductor Energy Lab Co Ltd | 発光装置、及び電子機器 |
JP2012133302A (ja) * | 2010-12-17 | 2012-07-12 | Samsung Mobile Display Co Ltd | 表示装置及び有機発光表示装置 |
JP2013102001A (ja) * | 2011-11-07 | 2013-05-23 | Panasonic Corp | 配線基板とそれを用いた有機デバイス |
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US20160197301A1 (en) | 2016-07-07 |
US9853239B2 (en) | 2017-12-26 |
JPWO2015033775A1 (ja) | 2017-03-02 |
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