WO2015029489A1 - Antenna device and method for manufacturing same - Google Patents

Antenna device and method for manufacturing same Download PDF

Info

Publication number
WO2015029489A1
WO2015029489A1 PCT/JP2014/060932 JP2014060932W WO2015029489A1 WO 2015029489 A1 WO2015029489 A1 WO 2015029489A1 JP 2014060932 W JP2014060932 W JP 2014060932W WO 2015029489 A1 WO2015029489 A1 WO 2015029489A1
Authority
WO
WIPO (PCT)
Prior art keywords
wireless
radiation electrode
sealing member
dipole antenna
antenna
Prior art date
Application number
PCT/JP2014/060932
Other languages
French (fr)
Japanese (ja)
Inventor
康晴 藤井
剛 向井
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2014541446A priority Critical patent/JP5652581B1/en
Publication of WO2015029489A1 publication Critical patent/WO2015029489A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Definitions

  • the present invention relates to an antenna device, and more particularly to an antenna device used in an RFID (Radio Frequency Identification) system and a manufacturing method thereof.
  • RFID Radio Frequency Identification
  • an article information management system As an article information management system, a reader / writer that generates an induced magnetic field and an RFID tag (also referred to as a wireless IC device) attached to the article are communicated in a non-contact manner using an electromagnetic field, and predetermined information is transmitted.
  • An RFID system for transmission has been put into practical use.
  • This RFID tag includes a wireless IC element that stores predetermined information and processes predetermined wireless signals, and an antenna device that transmits and receives high-frequency signals, and is attached to various articles to be managed (or packaging materials thereof). Used by sticking.
  • an HF band RFID system using a 13 MHz band and a UHF band RFID system using a 900 MHz band are generally used.
  • the UHF band RFID system is promising as an article management system because it has a relatively long communication distance and can read a plurality of tags at once.
  • Garment washing companies mainly provide laundry services to industries that require hygiene and environmental management, such as hotels, medical care, nursing care, and food.
  • this type of clothes washing company reads necessary information from an RFID tag attached to the clothes with a reader / writer, and collects, washes, and reduces the temperature. Management of bacteria treatment, delivery and disposal.
  • a clothes washing company covers the RFID tag including a wireless IC element and an antenna device with a cloth label, and attaches the cloth label to the clothes by thermocompression bonding or sewing.
  • thermocompression bonding or sewing there has been a problem that when the clothes are vigorously swollen in the washing process and the stress is repeatedly applied to the connection portion between the antenna device and the wireless IC element, the connection portion is easily damaged.
  • Patent Document 1 in the vicinity of the connection portion between the IC chip and the antenna portion provided on the substrate, there are at least two through-hole portions penetrating from the front surface to the back surface.
  • an IC chip including a connection portion is covered with a mold portion provided on the front and back surfaces of a substrate through a through hole portion.
  • An object of the present invention is to provide an antenna device that can effectively protect a wireless IC element attached to an antenna with a sealing member, and a manufacturing method thereof.
  • the antenna device is: A pair of radiation electrode portions having a predetermined width in a plan view; and a connection portion located at one end opposite to the pair of radiation electrode portions and recessed in both sides in a plan view.
  • a dipole antenna to which the elements are connected ;
  • a dipole antenna comprising a pair of radiation electrode portions having a predetermined width in a plan view, with one end of each of the pair of radiation electrode portions facing each other, and arranging a plurality of pairs in parallel; Forming a through-opening in a shape in which both sides are recessed in plan view at one end of each of the plurality of pairs of radiation electrode parts; Connecting a wireless IC element to one end of the pair of radiation electrode parts; Covering the wireless IC element with a sealing member including one end of the plurality of pairs of radiation electrode parts; Separating the dipole antenna including the sealing member for each pair of radiation electrode parts; With The sealing member is continuous with the front side and the back side of the dipole antenna through a recessed portion of one end of the pair of radiation electrode parts; It is characterized by.
  • the antenna device is integrated with a wireless IC element and attached to a clothing as an RFID tag (wireless IC device), for example, and used for process management such as washing and delivery by communicating with a reader / writer of the RFID system. Is done.
  • the wireless IC element is covered and protected by a sealing member, and the sealing member is continuous with the front side and the back side of the dipole antenna in a state where the both sides of the dipole antenna are recessed. Therefore, the required fixing strength can be maintained even if the IC tag is small. Therefore, there is no possibility that the connection portion between the wireless IC element and the dipole antenna will be damaged even if clothes are rubbed in the washing process or the like.
  • the wireless IC element attached to the antenna can be effectively protected by the sealing member.
  • the wireless IC device provided with the antenna apparatus which is one Example is shown, (A) is a top view, (B) is a front view.
  • 1A is a cross-sectional view taken along a line AA in FIG. 1A
  • FIG. 1B is a cross-sectional view taken along a line BB in FIG. 1A
  • D is a DD sectional view of FIG. 1 (A).
  • the wireless IC device shown in FIG. 1 in a state excluding the sealing resin is shown
  • (A) is a plan view
  • (B) is a front view.
  • FIG. 4 is an exploded perspective view showing the wireless IC device shown in FIG. 3. It is a top view which expands and shows the modification of a dent.
  • the wireless IC device is used for UHF band communication, and has a flexible base sheet 10 and a dipole antenna provided on the sheet 10. 20, the wireless IC element 30, and the sealing resin 40 that covers the wireless IC element 30 are configured as a so-called RFID tag.
  • the base sheet 10 preferably has, for example, heat resistance and chemical resistance, and a thermoplastic resin material such as polyimide, PET, or LCP can be suitably used.
  • the dipole antenna 20 is formed on the base material sheet 10 so as to have flexibility by a metal film mainly composed of silver, copper, aluminum, or the like provided on almost the entire surface of the sheet 10.
  • the sealing resin 40 is, for example, a silicone resin.
  • the dipole antenna 20 includes a pair of radiating electrode portions 20a having a predetermined width in a plan view, and a connecting portion 20b which is located at one end where the radiating electrode portions 20a face each other and both sides are recessed (dent 20c) in a plan view.
  • the wireless IC element 30 is connected and fixed to the connection portion 20b.
  • the base sheet 10 also has a recessed portion (recess 10a) having the same width as the connection portion 20b of the dipole antenna 20 in a plan view.
  • the wireless IC element 30 processes an RF signal, and is configured as a silicon semiconductor integrated circuit chip, for example, and includes a clock circuit, a logic circuit, a memory circuit, and the like, and necessary information is stored in the memory.
  • a wireless IC element 30 (IC chip) is provided with an input / output electrode and a mounting electrode on the back surface thereof, and the input / output electrode is connected to a connecting portion 20b of the dipole antenna 20 via a metal bump or the like.
  • Au, solder, etc. can be used as a material of a metal bump.
  • the wireless IC element 30 and the dipole antenna 20 may be electromagnetic coupling.
  • the sealing resin 40 entirely covers the wireless IC element 30 including the one end portion of the radiation electrode portion 20a of the dipole antenna 20 and the connection portion 20b, and further including the base sheet 10.
  • the sealing resin 40 is continuous to the front surface side and the back surface side of the antenna 20 and the sheet 10 through the recess 20 c of the dipole antenna 20 and the recess 10 a of the base sheet 10.
  • the sealing resin 40 protects the wireless IC element 30 from moisture and the surrounding environment, and the antenna 20 and the surface side of the sheet 10 in a state where the both sides of the dipole antenna 20 and the base sheet 10 are recessed are wrapped around. And the back surface side, the strength of fixing to the antenna 20 and the sheet 10 is high (hard to peel off). Therefore, even when the wireless IC device is downsized, the necessary fixing strength between the connection portion 20b of the dipole antenna 20 and the wireless IC element 30 can be maintained. As a result, there is no possibility that the connecting portion between the wireless IC element 30 and the dipole antenna 20 will be damaged even if the clothes are rubbed in the washing process.
  • the wireless IC element 30 is preferably disposed inside the region A (see FIG. 3A) where the recesses 10a and 20c are formed.
  • the sealing resin 40 can protect the wireless IC element 30 even in the short side direction.
  • the centers of the recesses 10 a and 20 c (region A) and the center of the wireless IC element 30 are overlapped, stress due to deformation of the resin 40 due to temperature and humidity is unlikely to act on the element 30.
  • both side portions of the sealing resin 40 have the same width as both side portions of the base sheet 10 in plan view. That is, in this wireless IC device, as shown in FIG. 1A, both side portions in the short side direction are straight and have no protruding portion, and there is no possibility of interference with other articles such as clothing.
  • the back surface side portion of the sealing resin 40 has an inclined surface 40 a that narrows away from the dipole antenna 20. By providing the inclined surface 40a, the corner of the back surface side portion of the sealing resin 40 becomes a protrusion and does not interfere with other articles.
  • the shape of the recesses 10a and 20c since the resin 40 can be filled in a small space due to the square shape, there is an advantage that the holding strength is sufficient and the reliability is high.
  • the shape of the recesses 10a and 20c is not limited to a quadrangular shape, and may be formed in a curved or polygonal shape such as an arc shape or an elliptical shape as shown in FIG. If the dents 10a and 20c have right-angled edges, impedance mismatch occurs and power loss is likely to occur. If the dents 10a and 20c are formed with curves or polygons with few edges, such power loss is unlikely to occur. On the other hand, the resin 40 can be held more firmly in a small space by using a rectangular shape.
  • the wireless IC device is attached to a large number of clothes by, for example, a clothes washing company and is used for managing clothes using an RFID system.
  • the communication operation of the wireless IC device will be schematically described.
  • the radiation electrode unit 20a receives a high frequency signal from the outside, power is supplied to the wireless IC element 30 through the connection unit 20b.
  • a predetermined high-frequency signal is transmitted from the wireless IC element 30 to the radiation electrode part 20a via the connection part 20b, it is emitted from the radiation electrode part 20a to the outside.
  • the wireless IC element 30 communicates with a reader / writer (not shown).
  • This manufacturing method is based on a so-called multi-chip method in which a plurality of wireless IC devices are manufactured as a collective substrate and then cut one unit at a time.
  • a plurality of pairs of radiation electrode portions 20a to be dipole antennas 20 are juxtaposed on a base material sheet 10 having a large area with their one end portions facing each other.
  • the radiation electrode portion 20a is formed as a metal film on almost the entire surface of the sheet 10, and is formed in a strip shape by a process such as etching.
  • step (2) an opening 11 penetrating the front and back surfaces of the sheet 10 is formed in one end portion of each pair of radiation electrode portions 20a so as to have both sides recessed in plan view.
  • step (3) the wireless IC element 30 is connected to the pair of connecting portions 20b facing each other by soldering or conductive paste.
  • the wireless IC element 30 is continuously covered with the sealing resin 40 including one end portions of the plurality of pairs of radiation electrode portions 20a.
  • a jig 50 having a recess 51 is disposed on the back surface side of the base sheet 10, and a resin liquid (for example, a silicone resin liquid) is applied from above the wireless IC element 30.
  • the applied resin liquid covers the wireless IC element 30 and wraps around the back side of the sheet 10 through the recesses 20c and 10a.
  • the dipole antenna 20 is cut at a position indicated by a one-dot chain line X including the sealing resin 40 for each pair of radiation electrode portions 20a.
  • a wireless IC device including one unit of antenna device is manufactured.
  • the jig 50 is made of a plate material such as stainless steel, and the jig 50 is removed in this cutting process.
  • the jig 50 shown in FIG. 8 can use the first example shown in FIG. 9, the second example shown in FIG. 10, and the third example shown in FIG.
  • the jig 50 according to the first example is one in which a recess 51 is formed at a location corresponding to each wireless IC element 30 on one jig plate 50 ⁇ / b> A.
  • the jig 50 according to the second example includes a plate 50 ⁇ / b> B formed with a recess 51 as a through-opening portion on the front and back surfaces at a position corresponding to each wireless IC element 30. It is a combination.
  • the recess 51 does not need to be formed corresponding to each wireless IC element 30. Even if the recess 51 is a continuous recess 51 as shown in FIG. Good.
  • the wireless IC element 30 may be a wireless IC chip that processes a high-frequency signal as described above, or includes a wireless IC chip 31 and a resonance circuit having a predetermined resonance frequency as shown in FIG.
  • the power supply circuit 32 may be configured as a module.
  • the power feeding circuit 32 supplies the high frequency signal received by the dipole antenna 20 to the wireless IC chip 31 and transmits a high frequency signal having a predetermined frequency transmitted from the wireless IC chip 31 to the dipole antenna 20. Since the power feeding circuit 32 has a predetermined resonance frequency, it is easy to match the impedance of the wireless IC chip 31 and the impedance of the dipole antenna 20.
  • the wireless IC element 30 When the wireless IC element 30 is configured by the wireless IC chip 31 and the power feeding circuit 32, as shown in FIGS. 13A, 13B, and 13C, various power feeding circuits 32 (resonance) are provided on the power feeding circuit board 35. Circuit / matching circuit). A pair of electrodes 36 a provided on the back surface of the power supply circuit board 35 is connected to the connection portion 20 b, and a pair of electrodes 36 b provided on the surface is connected to the input / output electrodes 32 a of the wireless IC chip 31.
  • the power supply circuit board 35 can be formed of a multilayer board such as a ceramic sheet, for example.
  • the feeder circuit board 35 can be thinned and the tolerance of characteristics can be reduced.
  • the power supply circuit board 35 may be configured by embedding a chip type inductance or capacitance in a resin multilayer board. In this case, since a large value of inductance or capacitance can be provided, matching can be easily achieved.
  • the wireless IC chip 31 and the power feeding circuit 32 may be electrically connected (DC connection), or may be coupled via an electromagnetic field (not shown).
  • the feed circuit 32 and the dipole antenna 20 may also be coupled via DC connection or an electromagnetic field.
  • the antenna device and the manufacturing method thereof according to the present invention are not limited to the above-described embodiments, and various modifications can be made within the scope of the gist.
  • the material, shape and size of the base sheet, dipole antenna, and sealing resin may be appropriately selected according to the application.
  • the shape of the dipole antenna is arbitrary, and may be a meander shape or curved.
  • the article to which the wireless IC device is attached is not necessarily limited to clothing, and may be various products such as surgical gauze.
  • the present invention is useful for an antenna device and a manufacturing method thereof, and is particularly excellent in that a wireless IC element attached to an antenna can be effectively protected with a sealing member.

Abstract

To effectively protect a wireless IC element by means of a sealing member, said wireless IC element being attached to an antenna. This antenna device is provided with: a dipole antenna (20), which has a pair of radiation electrode sections (20a) having a predetermined width in a planar view, and connecting sections (20b) positioned at radiation electrode section (20a) end portions facing each other, each of said connecting sections having recesses on both sides in a planar view, and which has a wireless IC element (30) connected to the connecting sections (20b); and a sealing member (40) for covering the wireless IC element (30). The sealing member (40) covers the wireless IC element (30), including the end portions of the radiation electrode sections (20a), and the connecting sections (20b), and is continuous to the front surface side and the rear surface side of the dipole antenna (20) via the recessed sections of each of the connecting sections (20b).

Description

アンテナ装置及びその製造方法Antenna device and manufacturing method thereof
　本発明は、アンテナ装置、特に、ＲＦＩＤ（Radio Frequency Identification）システムに用いられるアンテナ装置及びその製造方法に関する。 The present invention relates to an antenna device, and more particularly to an antenna device used in an RFID (Radio Frequency Identification) system and a manufacturing method thereof.
　近年、物品の情報管理システムとして、誘導磁界を発生するリーダライタと、物品に付されたＲＦＩＤタグ（無線ＩＣデバイスとも称する）とを電磁界を利用した非接触方式で通信し、所定の情報を伝達するＲＦＩＤシステムが実用化されている。このＲＦＩＤタグは、所定の情報を記憶し、所定の無線信号を処理する無線ＩＣ素子と、高周波信号の送受信を行うアンテナ装置とを備え、管理対象となる種々の物品（あるいはその包装材）に貼着して使用される。 In recent years, as an article information management system, a reader / writer that generates an induced magnetic field and an RFID tag (also referred to as a wireless IC device) attached to the article are communicated in a non-contact manner using an electromagnetic field, and predetermined information is transmitted. An RFID system for transmission has been put into practical use. This RFID tag includes a wireless IC element that stores predetermined information and processes predetermined wireless signals, and an antenna device that transmits and receives high-frequency signals, and is attached to various articles to be managed (or packaging materials thereof). Used by sticking.
　ＲＦＩＤシステムとしては、１３ＭＨｚ帯を利用したＨＦ帯ＲＦＩＤシステム、９００ＭＨｚ帯を利用したＵＨＦ帯ＲＦＩＤシステムが一般的である。特に、ＵＨＦ帯ＲＦＩＤシステムは、通信距離が比較的長く、複数のタグを一括して読取りが可能であることから、物品管理のシステムとして有望視されている。 As an RFID system, an HF band RFID system using a 13 MHz band and a UHF band RFID system using a 900 MHz band are generally used. In particular, the UHF band RFID system is promising as an article management system because it has a relatively long communication distance and can read a plurality of tags at once.
　近年、ＲＦＩＤシステムは、例えば、リネン業者と呼ばれる衣類洗濯業者にも適用が検討されている。衣類洗濯業者は、ホテル、医療、介護、食品などの衛生・環境管理が必要とされる業界に主に洗濯サービスを提供している。この種の衣類洗濯業者は、洗濯作業工程において、洗濯の対象となる多数の衣類を管理するために、衣類に取り付けたＲＦＩＤタグからリーダライタにて必要な情報を読み取り、回収、洗濯、高温減菌処理、納品、廃棄などの管理を行っている。 In recent years, application of the RFID system to a clothes washing company called a linen company has been studied. Garment washing companies mainly provide laundry services to industries that require hygiene and environmental management, such as hotels, medical care, nursing care, and food. In order to manage a large number of clothes to be washed in a washing process, this type of clothes washing company reads necessary information from an RFID tag attached to the clothes with a reader / writer, and collects, washes, and reduces the temperature. Management of bacteria treatment, delivery and disposal.
　衣類洗濯業者は、無線ＩＣ素子とアンテナ装置とを備えた前記ＲＦＩＤタグを布ラベルで覆い、該布ラベルを熱圧着又は縫製にて衣類に取り付けている。しかし、洗濯工程において衣類が激しく揉まれるのに伴って、アンテナ装置と無線ＩＣ素子との接続部に応力が繰り返して加わると、該接続部が破損しやすくなるといった問題点を有していた。 A clothes washing company covers the RFID tag including a wireless IC element and an antenna device with a cloth label, and attaches the cloth label to the clothes by thermocompression bonding or sewing. However, there has been a problem that when the clothes are vigorously swollen in the washing process and the stress is repeatedly applied to the connection portion between the antenna device and the wireless IC element, the connection portion is easily damaged.
　そこで、特許文献１に記載されているように、基板に設けたＩＣチップとアンテナ部との接続部の近傍に、表面から裏面まで貫通している少なくとも二つの貫通孔部を有し、これらの貫通孔部を介して基板の表裏面に設けたモールド部で接続部を含むＩＣチップを覆う構成が提案されている。しかしながら、この構成では、タグが小型化している現状において、基板に形成される貫通孔部を大きくすることが困難である。貫通孔部を細くするとモールドされる樹脂が貫通孔部に流入しにくくなり、ＩＣチップを十分に保護することができない。あるいは、貫通孔部が細いので、樹脂による十分な取付け強度が得られないという問題点を有している。 Therefore, as described in Patent Document 1, in the vicinity of the connection portion between the IC chip and the antenna portion provided on the substrate, there are at least two through-hole portions penetrating from the front surface to the back surface. There has been proposed a configuration in which an IC chip including a connection portion is covered with a mold portion provided on the front and back surfaces of a substrate through a through hole portion. However, with this configuration, it is difficult to increase the size of the through-hole portion formed in the substrate in the current situation where the tag is downsized. If the through-hole portion is narrowed, the resin to be molded becomes difficult to flow into the through-hole portion, and the IC chip cannot be sufficiently protected. Or since the through-hole part is thin, it has the problem that sufficient attachment strength by resin cannot be obtained.
特開２０１０－１７６４５１号公報JP 2010-176451 A
　本発明の目的は、アンテナに取り付けられた無線ＩＣ素子を封止部材にて効果的に保護できるアンテナ装置及びその製造方法を提供することにある。 An object of the present invention is to provide an antenna device that can effectively protect a wireless IC element attached to an antenna with a sealing member, and a manufacturing method thereof.
　本発明の第１の形態であるアンテナ装置は、
　平面視で所定の幅を有する一対の放射電極部と、前記一対の放射電極部の対向する一端部に位置して平面視で両側が凹んだ接続部とを有し、該接続部に無線ＩＣ素子が接続されたダイポールアンテナと、
　前記無線ＩＣ素子を被覆する封止部材と、
　を備え、
　前記封止部材は、前記放射電極部の一端部及び前記接続部を含めて前記無線ＩＣ素子を被覆しており、かつ、前記接続部の凹んだ部分を介して前記ダイポールアンテナの表面側と裏面側とに連続していること、
　を特徴とする。 The antenna device according to the first aspect of the present invention is:
A pair of radiation electrode portions having a predetermined width in a plan view; and a connection portion located at one end opposite to the pair of radiation electrode portions and recessed in both sides in a plan view. A dipole antenna to which the elements are connected;
A sealing member that covers the wireless IC element;
With
The sealing member covers the wireless IC element including the one end portion of the radiation electrode portion and the connection portion, and the front side and the back surface of the dipole antenna through the recessed portion of the connection portion. To be continuous with the side,
It is characterized by.
　本発明の第２の形態であるアンテナ装置の製造方法は、
　平面視で所定の幅を有する一対の放射電極部からなるダイポールアンテナを一対の放射電極部のそれぞれの一端部を対向させて複数対を並置する工程と、
　前記複数対の放射電極部のそれぞれの一端部に平面視で両側が凹む形状に貫通開口部を形成する工程と、
　前記一対の放射電極部の一端部に無線ＩＣ素子を接続する工程と、
　前記複数対の放射電極部の一端部を含めて前記無線ＩＣ素子を封止部材で被覆する工程と、
　前記ダイポールアンテナを一対の放射電極部ごとに前記封止部材を含めて切り分ける工程と、
　を備え、
　前記封止部材は前記一対の放射電極部の一端部の凹んだ部分を介して前記ダイポールアンテナの表面側と裏面側とに連続していること、
　を特徴とする。 The manufacturing method of the antenna device which is the 2nd form of the present invention,
A dipole antenna comprising a pair of radiation electrode portions having a predetermined width in a plan view, with one end of each of the pair of radiation electrode portions facing each other, and arranging a plurality of pairs in parallel;
Forming a through-opening in a shape in which both sides are recessed in plan view at one end of each of the plurality of pairs of radiation electrode parts;
Connecting a wireless IC element to one end of the pair of radiation electrode parts;
Covering the wireless IC element with a sealing member including one end of the plurality of pairs of radiation electrode parts;
Separating the dipole antenna including the sealing member for each pair of radiation electrode parts;
With
The sealing member is continuous with the front side and the back side of the dipole antenna through a recessed portion of one end of the pair of radiation electrode parts;
It is characterized by.
　前記アンテナ装置は、無線ＩＣ素子と一体化されてＲＦＩＤタグ（無線ＩＣデバイス）として、例えば、衣類などに取り付けられ、ＲＦＩＤシステムのリーダライタと交信することによって、洗濯や納品などの工程管理に利用される。前記アンテナ装置において、無線ＩＣ素子は封止部材によって覆われて保護されており、封止部材はダイポールアンテナの凹んだ両側部を回り込んだ状態でダイポールアンテナの表面側と裏面側とに連続しているため、ＩＣタグが小型であっても必要な固着強度を保持できる。従って、洗濯工程などで衣類が揉まれても無線ＩＣ素子とダイポールアンテナとの接続部が破損するおそれがない。 The antenna device is integrated with a wireless IC element and attached to a clothing as an RFID tag (wireless IC device), for example, and used for process management such as washing and delivery by communicating with a reader / writer of the RFID system. Is done. In the antenna device, the wireless IC element is covered and protected by a sealing member, and the sealing member is continuous with the front side and the back side of the dipole antenna in a state where the both sides of the dipole antenna are recessed. Therefore, the required fixing strength can be maintained even if the IC tag is small. Therefore, there is no possibility that the connection portion between the wireless IC element and the dipole antenna will be damaged even if clothes are rubbed in the washing process or the like.
　本発明によれば、アンテナに取り付けられた無線ＩＣ素子を封止部材にて効果的に保護できる。 According to the present invention, the wireless IC element attached to the antenna can be effectively protected by the sealing member.
一実施例であるアンテナ装置を備えた無線ＩＣデバイスを示し、（Ａ）は平面図、（Ｂ）は正面図である。The wireless IC device provided with the antenna apparatus which is one Example is shown, (A) is a top view, (B) is a front view. 前記無線ＩＣデバイスを示し、（Ａ）は図１（Ａ）のＡ－Ａ断面図、（Ｂ）は図１（Ａ）のＢ－Ｂ断面図、（Ｃ）は図１（Ａ）のＣ－Ｃ断面図、（Ｄ）は図１（Ａ）のＤ－Ｄ断面図である。1A is a cross-sectional view taken along a line AA in FIG. 1A, FIG. 1B is a cross-sectional view taken along a line BB in FIG. 1A, and FIG. -C sectional view, (D) is a DD sectional view of FIG. 1 (A). 封止樹脂を除いた状態の図１に記載の無線ＩＣデバイスを示し、（Ａ）は平面図、（Ｂ）は正面図である。The wireless IC device shown in FIG. 1 in a state excluding the sealing resin is shown, (A) is a plan view, and (B) is a front view. 図３に示した無線ＩＣデバイスを示す分解斜視図である。FIG. 4 is an exploded perspective view showing the wireless IC device shown in FIG. 3. 凹みの変形例を拡大して示す平面図である。It is a top view which expands and shows the modification of a dent. 前記無線ＩＣデバイスの製造工程を示す説明図である。It is explanatory drawing which shows the manufacturing process of the said wireless IC device. 前記無線ＩＣデバイスの製造工程（図６の続き）を示す説明図である。It is explanatory drawing which shows the manufacturing process (continuation of FIG. 6) of the said wireless IC device. 前記製造工程における封止部材の充填時を示す断面図である。It is sectional drawing which shows the time of filling of the sealing member in the said manufacturing process. 前記製造工程で使用される治具の第１例を示す斜視図である。It is a perspective view which shows the 1st example of the jig | tool used by the said manufacturing process. 前記製造工程で使用される治具の第２例を示す斜視図である。It is a perspective view which shows the 2nd example of the jig | tool used by the said manufacturing process. 前記製造工程で使用される治具の第３例を示す斜視図である。It is a perspective view which shows the 3rd example of the jig | tool used by the said manufacturing process. 無線ＩＣ素子をＩＣチップと給電回路基板とのモジュールとして構成した無線ＩＣデバイスの等価回路図。The equivalent circuit diagram of the radio | wireless IC device which comprised the radio | wireless IC element as a module of IC chip and electric power feeding circuit board. （Ａ），（Ｂ），（Ｃ）はそれぞれ前記給電回路を示す等価回路図である。(A), (B), (C) is an equivalent circuit diagram which shows the said electric power feeding circuit, respectively.
　以下、本発明に係るアンテナ装置及びその製造方法の実施例について添付図面を参照して説明する。なお、各図において、共通する部品、部分は同じ符号を付し、重複する説明は省略する。 Embodiments of an antenna device and a manufacturing method thereof according to the present invention will be described below with reference to the accompanying drawings. In each figure, common parts and portions are denoted by the same reference numerals, and redundant description is omitted.
　（アンテナ装置を備えた無線ＩＣデバイス、図１～図４参照）
　図１、図３及び図４に示すように、無線ＩＣデバイスは、ＵＨＦ帯の通信に用いられるものであり、可撓性を有する基材シート１０と、該シート１０上に設けられたダイポールアンテナ２０と、無線ＩＣ素子３０と、該無線ＩＣ素子３０を被覆する封止樹脂４０と、でいわゆるＲＦＩＤタグとして構成されている。 (Wireless IC device with antenna device, see FIGS. 1 to 4)
As shown in FIGS. 1, 3 and 4, the wireless IC device is used for UHF band communication, and has a flexible base sheet 10 and a dipole antenna provided on the sheet 10. 20, the wireless IC element 30, and the sealing resin 40 that covers the wireless IC element 30 are configured as a so-called RFID tag.
　基材シート１０は、例えば、耐熱性や耐薬品性を有することが好ましく、ポリイミドやＰＥＴ、ＬＣＰなどの熱可塑性樹脂材を好適に使用することができる。ダイポールアンテナ２０は、基材シート１０上に該シート１０のほぼ全面に設けられた銀、銅、アルミニウムなどを主成分とする金属膜によって可撓性を有するように形成されている。封止樹脂４０は、例えばシリコーン樹脂である。 The base sheet 10 preferably has, for example, heat resistance and chemical resistance, and a thermoplastic resin material such as polyimide, PET, or LCP can be suitably used. The dipole antenna 20 is formed on the base material sheet 10 so as to have flexibility by a metal film mainly composed of silver, copper, aluminum, or the like provided on almost the entire surface of the sheet 10. The sealing resin 40 is, for example, a silicone resin.
　ダイポールアンテナ２０は、平面視で所定の幅を有する一対の放射電極部２０ａと、該放射電極部２０ａが対向する一端部に位置して平面視で両側が凹んだ（凹み２０ｃ）接続部２０ｂとを有し、該接続部２０ｂに無線ＩＣ素子３０が接続固定されている。また、基材シート１０もダイポールアンテナ２０の接続部２０ｂと平面視で同じ幅の凹んだ部分（凹み１０ａ）を有している。 The dipole antenna 20 includes a pair of radiating electrode portions 20a having a predetermined width in a plan view, and a connecting portion 20b which is located at one end where the radiating electrode portions 20a face each other and both sides are recessed (dent 20c) in a plan view. The wireless IC element 30 is connected and fixed to the connection portion 20b. Further, the base sheet 10 also has a recessed portion (recess 10a) having the same width as the connection portion 20b of the dipole antenna 20 in a plan view.
　無線ＩＣ素子３０は、ＲＦ信号を処理するもので、例えば、シリコン半導体集積回路チップとして構成されており、クロック回路、ロジック回路、メモリ回路などを含み、必要な情報がメモリされている。このような無線ＩＣ素子３０（ＩＣチップ）は、その裏面に入出力用電極や実装用電極が設けられており、該入出力用電極は前記ダイポールアンテナ２０の接続部２０ｂに金属バンプなどを介して電気的に接続固定される。なお、金属バンプの材料としては、Ａｕ、はんだなどを用いることができる。また、無線ＩＣ素子３０とダイポールアンテナ２０とは電磁界結合であってもよい。 The wireless IC element 30 processes an RF signal, and is configured as a silicon semiconductor integrated circuit chip, for example, and includes a clock circuit, a logic circuit, a memory circuit, and the like, and necessary information is stored in the memory. Such a wireless IC element 30 (IC chip) is provided with an input / output electrode and a mounting electrode on the back surface thereof, and the input / output electrode is connected to a connecting portion 20b of the dipole antenna 20 via a metal bump or the like. Are electrically connected and fixed. In addition, Au, solder, etc. can be used as a material of a metal bump. The wireless IC element 30 and the dipole antenna 20 may be electromagnetic coupling.
　封止樹脂４０は、ダイポールアンテナ２０の放射電極部２０ａの一端部及び接続部２０ｂを含めて、さらに、基材シート１０をも含めて、無線ＩＣ素子３０を全体的に被覆している。この封止樹脂４０は、ダイポールアンテナ２０の凹み２０ｃ及び基材シート１０の凹み１０ａを介してアンテナ２０及びシート１０の表面側と裏面側とに連続している。 The sealing resin 40 entirely covers the wireless IC element 30 including the one end portion of the radiation electrode portion 20a of the dipole antenna 20 and the connection portion 20b, and further including the base sheet 10. The sealing resin 40 is continuous to the front surface side and the back surface side of the antenna 20 and the sheet 10 through the recess 20 c of the dipole antenna 20 and the recess 10 a of the base sheet 10.
　封止樹脂４０は、無線ＩＣ素子３０を水分や周囲の環境から保護するものであり、ダイポールアンテナ２０や基材シート１０の凹んだ両側部を回り込んだ状態でアンテナ２０及びシート１０の表面側と裏面側とに連続しているため、アンテナ２０やシート１０への固着強度が大きい（はがれにくい）。従って、無線ＩＣデバイスが小型化された場合であっても、ダイポールアンテナ２０の接続部２０ｂと無線ＩＣ素子３０との必要な固着強度を保持できる。その結果、洗濯工程などで衣類が揉まれても無線ＩＣ素子３０とダイポールアンテナ２０との接続部が破損するおそれはない。 The sealing resin 40 protects the wireless IC element 30 from moisture and the surrounding environment, and the antenna 20 and the surface side of the sheet 10 in a state where the both sides of the dipole antenna 20 and the base sheet 10 are recessed are wrapped around. And the back surface side, the strength of fixing to the antenna 20 and the sheet 10 is high (hard to peel off). Therefore, even when the wireless IC device is downsized, the necessary fixing strength between the connection portion 20b of the dipole antenna 20 and the wireless IC element 30 can be maintained. As a result, there is no possibility that the connecting portion between the wireless IC element 30 and the dipole antenna 20 will be damaged even if the clothes are rubbed in the washing process.
　無線ＩＣ素子３０は凹み１０ａ，２０ｃが形成されている領域Ａ（図３（Ａ）参照）の内側に配置することが好ましい。これにて、無線ＩＣ素子３０の短辺方向においても封止樹脂４０で保護することができる。特に、凹み１０ａ，２０ｃ（領域Ａ）の中心と無線ＩＣ素子３０の中心とが重なるように配置すると、温度や湿度に起因する樹脂４０の変形による応力が素子３０に作用し難くなる。 The wireless IC element 30 is preferably disposed inside the region A (see FIG. 3A) where the recesses 10a and 20c are formed. Thus, the sealing resin 40 can protect the wireless IC element 30 even in the short side direction. In particular, if the centers of the recesses 10 a and 20 c (region A) and the center of the wireless IC element 30 are overlapped, stress due to deformation of the resin 40 due to temperature and humidity is unlikely to act on the element 30.
　さらに、図２（Ｃ），（Ｄ）に基材シート１０の短辺方向の断面として示すように、封止樹脂４０は短辺方向の両側部分で大きく回り込んでいるため、この両側部分ではがれにくく、封止性が良好となる。また、封止樹脂４０の両側部分は平面視で基材シート１０の両側部分と同じ幅である。即ち、この無線ＩＣデバイスは、図１（Ａ）に示すように、短辺方向の両側部分は直線状であって出っ張り部がなく、衣類などの他の物品と干渉するおそれはない。さらに、封止樹脂４０の裏面側部分はダイポールアンテナ２０から離れる方向に狭まる傾斜面４０ａを有している。この傾斜面４０ａを設けることによって封止樹脂４０の裏面側部分の角が突起状となって他の物品と干渉することがなくなる。 Further, as shown in FIGS. 2 (C) and 2 (D) as a cross section in the short side direction of the base sheet 10, the sealing resin 40 wraps around greatly at both side parts in the short side direction. It is difficult to peel off and the sealing property is good. Further, both side portions of the sealing resin 40 have the same width as both side portions of the base sheet 10 in plan view. That is, in this wireless IC device, as shown in FIG. 1A, both side portions in the short side direction are straight and have no protruding portion, and there is no possibility of interference with other articles such as clothing. Further, the back surface side portion of the sealing resin 40 has an inclined surface 40 a that narrows away from the dipole antenna 20. By providing the inclined surface 40a, the corner of the back surface side portion of the sealing resin 40 becomes a protrusion and does not interfere with other articles.
　凹み１０ａ，２０ｃの形状に関しては、四角形状であることにより、少ないスペースに多くの樹脂４０を充填できるので、保持強度が充分で信頼性が高い利点を有している。但し、凹み１０ａ，２０ｃの形状は四角形状に限定するものではなく、図５に示すように、円弧形状や楕円形状などの曲線あるいは多角形状で形成されていてもよい。凹み１０ａ，２０ｃが直角のエッジを有すると、インピーダンスの不整合が生じて電力損失が起こりやすい。凹み１０ａ，２０ｃをエッジが少ない曲線や多角形で形成すると、このような電力損失が起こりにくい。一方、四角形状とすることで、小さいスペースでより強固に樹脂４０を保持できる。 With regard to the shape of the recesses 10a and 20c, since the resin 40 can be filled in a small space due to the square shape, there is an advantage that the holding strength is sufficient and the reliability is high. However, the shape of the recesses 10a and 20c is not limited to a quadrangular shape, and may be formed in a curved or polygonal shape such as an arc shape or an elliptical shape as shown in FIG. If the dents 10a and 20c have right-angled edges, impedance mismatch occurs and power loss is likely to occur. If the dents 10a and 20c are formed with curves or polygons with few edges, such power loss is unlikely to occur. On the other hand, the resin 40 can be held more firmly in a small space by using a rectangular shape.
　前記無線ＩＣデバイスは、例えば、衣類洗濯業者によって多数の衣類に取り付けられ、ＲＦＩＤシステムを利用した衣類の管理に使用される。無線ＩＣデバイスの通信作用について概略的に説明すると、放射電極部２０ａが外部からの高周波を受信すると、接続部２０ｂを介して無線ＩＣ素子３０に電力が供給される。一方、無線ＩＣ素子３０から所定の高周波信号が接続部２０ｂを介して放射電極部２０ａに伝達されると、放射電極部２０ａから外部に放射される。これにて、無線ＩＣ素子３０と図示しないリーダライタとが交信することになる。 The wireless IC device is attached to a large number of clothes by, for example, a clothes washing company and is used for managing clothes using an RFID system. The communication operation of the wireless IC device will be schematically described. When the radiation electrode unit 20a receives a high frequency signal from the outside, power is supplied to the wireless IC element 30 through the connection unit 20b. On the other hand, when a predetermined high-frequency signal is transmitted from the wireless IC element 30 to the radiation electrode part 20a via the connection part 20b, it is emitted from the radiation electrode part 20a to the outside. As a result, the wireless IC element 30 communicates with a reader / writer (not shown).
　（製造工程、図６～図８参照）
　次に、前記無線ＩＣデバイスの製造方法の一例について図６及び図７を参照して説明する。この製造方法は、複数の無線ＩＣデバイスを集合基板として作製した後、１単位ずつカットする、いわゆる多数個取りの手法によっている。 (Manufacturing process, see FIGS. 6 to 8)
Next, an example of a method for manufacturing the wireless IC device will be described with reference to FIGS. This manufacturing method is based on a so-called multi-chip method in which a plurality of wireless IC devices are manufactured as a collective substrate and then cut one unit at a time.
　まず、工程（１）として、広い面積の基材シート１０上にダイポールアンテナ２０となる複数対の放射電極部２０ａをそれぞれの一端部を対向させて並置する。放射電極部２０ａはシート１０上のほぼ全面に金属膜として形成されており、エッチングなどの処理で短冊状に形成される。 First, as a step (1), a plurality of pairs of radiation electrode portions 20a to be dipole antennas 20 are juxtaposed on a base material sheet 10 having a large area with their one end portions facing each other. The radiation electrode portion 20a is formed as a metal film on almost the entire surface of the sheet 10, and is formed in a strip shape by a process such as etching.
　次に、工程（２）として、一対ずつの放射電極部２０ａの一端部に平面視で両側が凹む形状にシート１０の表裏面に貫通する開口部１１を形成する。これにて、接続部２０ｂ、凹み２０ｃ，１０ａが形成されたことになる。次に、工程（３）として、対向する一対の接続部２０ｂ上に無線ＩＣ素子３０を、はんだ付けや導電性ペーストなどにより接続する。 Next, as step (2), an opening 11 penetrating the front and back surfaces of the sheet 10 is formed in one end portion of each pair of radiation electrode portions 20a so as to have both sides recessed in plan view. Thus, the connecting portion 20b and the recesses 20c and 10a are formed. Next, as a step (3), the wireless IC element 30 is connected to the pair of connecting portions 20b facing each other by soldering or conductive paste.
　次に、工程（４）として、複数対の放射電極部２０ａの一端部を含めて無線ＩＣ素子３０を封止樹脂４０で連続的に被覆する。この場合、図８に示すように、基材シート１０の裏面側に凹所５１を有する治具５０を配置し、無線ＩＣ素子３０の上方から樹脂液（例えばシリコーン樹脂液）を塗布する。塗布された樹脂液は、無線ＩＣ素子３０を覆うとともに、凹み２０ｃ，１０ａを介してシート１０の裏面側に回り込む。 Next, as a step (4), the wireless IC element 30 is continuously covered with the sealing resin 40 including one end portions of the plurality of pairs of radiation electrode portions 20a. In this case, as shown in FIG. 8, a jig 50 having a recess 51 is disposed on the back surface side of the base sheet 10, and a resin liquid (for example, a silicone resin liquid) is applied from above the wireless IC element 30. The applied resin liquid covers the wireless IC element 30 and wraps around the back side of the sheet 10 through the recesses 20c and 10a.
　次に、工程（５）として、ダイポールアンテナ２０を一対の放射電極部２０ａごとに封止樹脂４０を含めて一点鎖線Ｘで示す位置で切り分ける。これにて、１単位のアンテナ装置を含む無線ＩＣデバイスが製造される。なお、治具５０はステンレスなどの板材からなり、このカット工程において、治具５０は取り外されている。 Next, as a step (5), the dipole antenna 20 is cut at a position indicated by a one-dot chain line X including the sealing resin 40 for each pair of radiation electrode portions 20a. Thus, a wireless IC device including one unit of antenna device is manufactured. The jig 50 is made of a plate material such as stainless steel, and the jig 50 is removed in this cutting process.
　（製造用治具、図９～図１１参照）
　図８に示した治具５０は具体的には図９に示す第１例、図１０に示す第２例、図１１に示す第３例を用いることができる。第１例である治具５０は、図９に示すように、１枚の治具板５０Ａに各無線ＩＣ素子３０に対応した箇所に凹所５１を形成したものである。第２例である治具５０は、図１０に示すように、各無線ＩＣ素子３０に対応した箇所に凹所５１を表裏面への貫通開口部として形成した板５０Ｂをベース板５０Ｃ上に重ね合わせたものである。 (Manufacturing jig, see FIGS. 9 to 11)
Specifically, the jig 50 shown in FIG. 8 can use the first example shown in FIG. 9, the second example shown in FIG. 10, and the third example shown in FIG. As shown in FIG. 9, the jig 50 according to the first example is one in which a recess 51 is formed at a location corresponding to each wireless IC element 30 on one jig plate 50 </ b> A. As shown in FIG. 10, the jig 50 according to the second example includes a plate 50 </ b> B formed with a recess 51 as a through-opening portion on the front and back surfaces at a position corresponding to each wireless IC element 30. It is a combination.
　また、凹所５１は個々の無線ＩＣ素子３０に対応して形成される必要はなく、第３例である治具５０として図１１に示すように、連続した一つの凹所５１であってもよい。 Further, the recess 51 does not need to be formed corresponding to each wireless IC element 30. Even if the recess 51 is a continuous recess 51 as shown in FIG. Good.
　（無線ＩＣモジュール、図１２及び図１３参照）
　無線ＩＣ素子３０は、前述のように、高周波信号を処理する無線ＩＣチップであってもよく、あるいは、図１２に示すように、無線ＩＣチップ３１と所定の共振周波数を有する共振回路を含んだ給電回路３２とでモジュールとして構成されていてもよい。給電回路３２は、ダイポールアンテナ２０が受信した高周波信号を無線ＩＣチップ３１に供給し、かつ、無線ＩＣチップ３１から発信された所定の周波数を有する高周波信号をダイポールアンテナ２０に伝達する。給電回路３２が所定の共振周波数を有するので、無線ＩＣチップ３１のインピーダンスとダイポールアンテナ２０のインピーダンスとのマッチングが図りやすくなる。 (Wireless IC module, see FIGS. 12 and 13)
The wireless IC element 30 may be a wireless IC chip that processes a high-frequency signal as described above, or includes a wireless IC chip 31 and a resonance circuit having a predetermined resonance frequency as shown in FIG. The power supply circuit 32 may be configured as a module. The power feeding circuit 32 supplies the high frequency signal received by the dipole antenna 20 to the wireless IC chip 31 and transmits a high frequency signal having a predetermined frequency transmitted from the wireless IC chip 31 to the dipole antenna 20. Since the power feeding circuit 32 has a predetermined resonance frequency, it is easy to match the impedance of the wireless IC chip 31 and the impedance of the dipole antenna 20.
　無線ＩＣチップ３１と給電回路３２とで無線ＩＣ素子３０を構成する場合、図１３（Ａ），（Ｂ），（Ｃ）に示すように、給電回路基板３５には種々の給電回路３２（共振回路／整合回路を含む）を設けることができる。給電回路基板３５の裏面に設けた一対の電極３６ａが前記接続部２０ｂに接続され、表面に設けた一対の電極３６ｂが無線ＩＣチップ３１の入出力電極３２ａに接続される。給電回路基板３５は、例えば、セラミックシートなどの多層基板で形成することができる。インダクタンスやキャパシタンスをセラミックシート上に導電材をパターニングすることで内蔵すれば、給電回路基板３５が薄型化され、特性の公差を小さくすることができる。また、給電回路基板３５は樹脂製の多層基板にチップタイプのインダクタンスやキャパシタンスを埋め込んで構成してもよい。この場合は、大きな値のインダクタンスやキャパシタンスを設けることができるので整合が取りやすくなる。 When the wireless IC element 30 is configured by the wireless IC chip 31 and the power feeding circuit 32, as shown in FIGS. 13A, 13B, and 13C, various power feeding circuits 32 (resonance) are provided on the power feeding circuit board 35. Circuit / matching circuit). A pair of electrodes 36 a provided on the back surface of the power supply circuit board 35 is connected to the connection portion 20 b, and a pair of electrodes 36 b provided on the surface is connected to the input / output electrodes 32 a of the wireless IC chip 31. The power supply circuit board 35 can be formed of a multilayer board such as a ceramic sheet, for example. If the inductance and capacitance are built in by patterning a conductive material on the ceramic sheet, the feeder circuit board 35 can be thinned and the tolerance of characteristics can be reduced. The power supply circuit board 35 may be configured by embedding a chip type inductance or capacitance in a resin multilayer board. In this case, since a large value of inductance or capacitance can be provided, matching can be easily achieved.
　なお、無線ＩＣチップ３１と給電回路３２とは、電気的に接続（ＤＣ接続）されていてもよいし、図示しないが電磁界を介して結合されていてもよい。給電回路３２とダイポールアンテナ２０もＤＣ接続や電磁界を介しての結合であってもよい。 The wireless IC chip 31 and the power feeding circuit 32 may be electrically connected (DC connection), or may be coupled via an electromagnetic field (not shown). The feed circuit 32 and the dipole antenna 20 may also be coupled via DC connection or an electromagnetic field.
　（他の実施例）
　なお、本発明に係るアンテナ装置及びその製造方法は前記実施例に限定するものではなく、その要旨の範囲内で種々に変更することができる。 (Other examples)
The antenna device and the manufacturing method thereof according to the present invention are not limited to the above-described embodiments, and various modifications can be made within the scope of the gist.
　特に、基材シート、ダイポールアンテナ、封止樹脂の材質、形状やサイズは用途に応じて適宜選択すればよい。また、ダイポールアンテナの形状は任意であり、ミアンダ状であったり、湾曲していてもよい。さらに、無線ＩＣデバイスを取り付ける物品は、必ずしも衣類に限ることなく、例えば手術用ガーゼなどの様々な製品であってもよい。 In particular, the material, shape and size of the base sheet, dipole antenna, and sealing resin may be appropriately selected according to the application. The shape of the dipole antenna is arbitrary, and may be a meander shape or curved. Furthermore, the article to which the wireless IC device is attached is not necessarily limited to clothing, and may be various products such as surgical gauze.
　以上のように、本発明は、アンテナ装置やその製造方法に有用であり、特に、アンテナに取り付けられた無線ＩＣ素子を封止部材にて効果的に保護できる点で優れている。 As described above, the present invention is useful for an antenna device and a manufacturing method thereof, and is particularly excellent in that a wireless IC element attached to an antenna can be effectively protected with a sealing member.
　１０…基材シート
　１０ａ…凹み
　２０…ダイポールアンテナ
　２０ａ…放射電極部
　２０ｂ…接続部
　２０ｃ…凹み
　３０…無線ＩＣ素子
　３１…無線ＩＣチップ
　３２…給電回路
　３５…給電回路基板
　４０…封止樹脂 DESCRIPTION OF SYMBOLS 10 ... Base material sheet 10a ... Depression 20 ... Dipole antenna 20a ... Radiation electrode part 20b ... Connection part 20c ... Depression 30 ... Wireless IC element 31 ... Wireless IC chip 32 ... Feeding circuit 35 ... Feeding circuit board 40 ... Sealing resin

Claims (7)

  1. 　平面視で所定の幅を有する一対の放射電極部と、前記一対の放射電極部の対向する一端部に位置して平面視で両側が凹んだ接続部とを有し、該接続部に無線ＩＣ素子が接続されたダイポールアンテナと、
    　前記無線ＩＣ素子を被覆する封止部材と、
    　を備え、
    　前記封止部材は、前記放射電極部の一端部及び前記接続部を含めて前記無線ＩＣ素子を被覆しており、かつ、前記接続部の凹んだ部分を介して前記ダイポールアンテナの表面側と裏面側とに連続していること、
    　を特徴とするアンテナ装置。     A pair of radiation electrode portions having a predetermined width in a plan view; and a connection portion located at one end opposite to the pair of radiation electrode portions and recessed in both sides in a plan view. A dipole antenna to which the elements are connected;
    A sealing member that covers the wireless IC element;
    With
    The sealing member covers the wireless IC element including the one end portion of the radiation electrode portion and the connection portion, and the front side and the back surface of the dipole antenna through the recessed portion of the connection portion. To be continuous with the side,
    An antenna device characterized by the above.
  2. 　前記封止部材は樹脂材からなること、を特徴とする請求項１に記載のアンテナ装置。 The antenna device according to claim 1, wherein the sealing member is made of a resin material.
  3. 　前記ダイポールアンテナを保持する平面状の基材シートを備え、
    　前記基材シートは前記ダイポールアンテナの接続部と平面視でほぼ同じ幅の凹んだ部分有し、
    　前記封止部材は前記基材シートの凹んだ部分をも介して該基材シートの表面側と裏面側とに連続しており、
    　前記封止部材の平面視で両側部分は前記基材シートの両側部分と同じ幅であること、
    　を特徴とする請求項１又は請求項２に記載のアンテナ装置。     Comprising a planar substrate sheet for holding the dipole antenna;
    The base sheet has a recessed portion with substantially the same width in plan view as the connection portion of the dipole antenna,
    The sealing member is continuous to the front side and the back side of the base sheet through the recessed part of the base sheet,
    Both side portions in plan view of the sealing member have the same width as both side portions of the base sheet,
    The antenna device according to claim 1 or 2, wherein
  4. 　前記封止部材の前記ダイポールアンテナの裏面側部分は該ダイポールアンテナから離れる方向に狭まる傾斜面を有していること、を特徴とする請求項１ないし請求項３のいずれかに記載のアンテナ装置。 The antenna device according to any one of claims 1 to 3, wherein a back side portion of the dipole antenna of the sealing member has an inclined surface that narrows in a direction away from the dipole antenna.
  5. 　前記無線ＩＣ素子は所定の無線信号を処理する無線ＩＣチップであること、を特徴とする請求項１ないし請求項４のいずれかに記載のアンテナ装置。 The antenna device according to any one of claims 1 to 4, wherein the wireless IC element is a wireless IC chip that processes a predetermined wireless signal.
  6. 　前記無線ＩＣ素子は、所定の無線信号を処理する無線ＩＣチップと、所定の共振周波数を有する給電回路を含む給電回路基板とからなること、を特徴とする請求項１ないし請求項４のいずれかに記載のアンテナ装置。 5. The wireless IC device according to claim 1, wherein the wireless IC element includes a wireless IC chip that processes a predetermined wireless signal and a power supply circuit board including a power supply circuit having a predetermined resonance frequency. The antenna device according to 1.
  7. 　平面視で所定の幅を有する一対の放射電極部からなるダイポールアンテナを一対の放射電極部のそれぞれの一端部を対向させて複数対を並置する工程と、
    　前記複数対の放射電極部のそれぞれの一端部に平面視で両側が凹む形状に貫通開口部を形成する工程と、
    　前記一対の放射電極部の一端部に無線ＩＣ素子を接続する工程と、
    　前記複数対の放射電極部の一端部を含めて前記無線ＩＣ素子を封止部材で被覆する工程と、
    　前記ダイポールアンテナを一対の放射電極部ごとに前記封止部材を含めて切り分ける工程と、
    　を備え、
    　前記封止部材は前記一対の放射電極部の一端部の凹んだ部分を介して前記ダイポールアンテナの表面側と裏面側とに連続していること、
    　を特徴とするアンテナ装置の製造方法。     A dipole antenna comprising a pair of radiation electrode portions having a predetermined width in a plan view, with one end of each of the pair of radiation electrode portions facing each other, and arranging a plurality of pairs in parallel;
    Forming a through-opening in a shape in which both sides are recessed in plan view at one end of each of the plurality of pairs of radiation electrode parts;
    Connecting a wireless IC element to one end of the pair of radiation electrode parts;
    Covering the wireless IC element with a sealing member including one end of the plurality of pairs of radiation electrode parts;
    Separating the dipole antenna including the sealing member for each pair of radiation electrode parts;
    With
    The sealing member is continuous with the front side and the back side of the dipole antenna through a recessed portion of one end of the pair of radiation electrode parts;
    A manufacturing method of an antenna device characterized by the above.
PCT/JP2014/060932 2013-08-27 2014-04-17 Antenna device and method for manufacturing same WO2015029489A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014541446A JP5652581B1 (en) 2013-08-27 2014-04-17 Method for manufacturing antenna device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-175509 2013-08-27
JP2013175509 2013-08-27

Publications (1)

Publication Number Publication Date
WO2015029489A1 true WO2015029489A1 (en) 2015-03-05

Family

ID=52586072

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/060932 WO2015029489A1 (en) 2013-08-27 2014-04-17 Antenna device and method for manufacturing same

Country Status (1)

Country Link
WO (1) WO2015029489A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006309401A (en) * 2005-04-27 2006-11-09 Hitachi Chem Co Ltd Ic tag
WO2008044663A1 (en) * 2006-10-10 2008-04-17 Tatsuo Sasazaki Large-size inlet manufacturing method, inlet-equipped tape, its manufacturing method, and its manufacturing device
JP2009004494A (en) * 2007-06-20 2009-01-08 Sharp Corp Semiconductor device
JP2010015342A (en) * 2008-07-03 2010-01-21 Dainippon Printing Co Ltd Antenna sheet, inlet, and ic tag
EP2182576A1 (en) * 2008-10-30 2010-05-05 The Goodyear Tire & Rubber Company Tire and tag assembly
JP2010122764A (en) * 2008-11-17 2010-06-03 Fujitsu Ltd Rfid tag
JP2010176451A (en) * 2009-01-30 2010-08-12 Panasonic Corp Rfid tag
JP2012043283A (en) * 2010-08-20 2012-03-01 Toppan Forms Co Ltd Non-contact type data receiving/transmitting body

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006309401A (en) * 2005-04-27 2006-11-09 Hitachi Chem Co Ltd Ic tag
WO2008044663A1 (en) * 2006-10-10 2008-04-17 Tatsuo Sasazaki Large-size inlet manufacturing method, inlet-equipped tape, its manufacturing method, and its manufacturing device
JP2009004494A (en) * 2007-06-20 2009-01-08 Sharp Corp Semiconductor device
JP2010015342A (en) * 2008-07-03 2010-01-21 Dainippon Printing Co Ltd Antenna sheet, inlet, and ic tag
EP2182576A1 (en) * 2008-10-30 2010-05-05 The Goodyear Tire & Rubber Company Tire and tag assembly
JP2010122764A (en) * 2008-11-17 2010-06-03 Fujitsu Ltd Rfid tag
JP2010176451A (en) * 2009-01-30 2010-08-12 Panasonic Corp Rfid tag
JP2012043283A (en) * 2010-08-20 2012-03-01 Toppan Forms Co Ltd Non-contact type data receiving/transmitting body

Similar Documents

Publication Publication Date Title
US11003980B2 (en) Wireless communication device and article with the same attached thereto
US11087197B2 (en) Attention tag for retail article and retail article having same attached thereto
JP5024372B2 (en) Wireless IC device
JP5703977B2 (en) Metal articles with wireless communication devices
JP5521686B2 (en) Antenna apparatus and wireless communication device
EP3719707B1 (en) Wireless communication device and method for manufacturing same
WO2013047680A1 (en) Rfid tag
JP5170156B2 (en) Wireless IC device
JP2013258779A (en) Wireless communication device
US9378452B2 (en) Radio IC device
US8905296B2 (en) Wireless integrated circuit device and method of manufacturing the same
JP5299351B2 (en) Wireless IC device
JP5652581B1 (en) Method for manufacturing antenna device
JP5786618B2 (en) Wireless IC device and manufacturing method thereof
WO2015029489A1 (en) Antenna device and method for manufacturing same
JP4930236B2 (en) Wireless IC device
JP2015225579A (en) Radio ic device, manufacturing method of the same, and object with radio ic device
JP5896594B2 (en) Wireless IC device
US10528861B2 (en) Radio-frequency identification transponder for aggressive environments
JP6137347B2 (en) Wireless IC device and metal body with wireless IC device
JP6209981B2 (en) Wireless communication device and article provided with the wireless communication device
WO2023228941A1 (en) Electronic component module and wireless communication device comprising same
JP2012137894A (en) Radio ic device
KR101038498B1 (en) RFID tag and method for manufacturing the same
JP2007073015A (en) Non-contact ic tag inlet, non-contact ic tag, and antenna

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2014541446

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14839232

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14839232

Country of ref document: EP

Kind code of ref document: A1