WO2015003333A1 - Anti-stick processing method for mould and mould processed using same - Google Patents

Anti-stick processing method for mould and mould processed using same Download PDF

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Publication number
WO2015003333A1
WO2015003333A1 PCT/CN2013/079104 CN2013079104W WO2015003333A1 WO 2015003333 A1 WO2015003333 A1 WO 2015003333A1 CN 2013079104 W CN2013079104 W CN 2013079104W WO 2015003333 A1 WO2015003333 A1 WO 2015003333A1
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treatment method
mold according
mold
microstructure
binary alloy
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PCT/CN2013/079104
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French (fr)
Chinese (zh)
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苏友欣
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公凖精密工业股份有限公司
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Priority to PCT/CN2013/079104 priority Critical patent/WO2015003333A1/en
Publication of WO2015003333A1 publication Critical patent/WO2015003333A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B23K2103/26—Alloys of Nickel and Cobalt and Chromium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Definitions

  • the invention relates to a method for resisting adhesion of a mold and a mold treated by the method, in particular to a binary alloy coating film on which a chromium nitride is plated on a molding surface of the mold body, and forming an atomic level on the binary alloy coating film.
  • the microstructure method and mold prevent the product from sticking to the molding surface during demolding.
  • the mold will be coated with a release agent on the molding surface of the mold, so that after the product is molded in the mold, it is easier to demould and does not stick to the molding surface.
  • the anti-adhesive method of the above products requires repeated application of the release agent in each molding of the product, and the mold is required to be re-cleaned every certain working day, for example, 2 or 3 days, which inevitably adds a lot of man-hours. It affects the production efficiency, and sometimes the uneven coating of the release agent also affects the quality of the product, such as the deterioration of the surface gloss of the product, the yellowing of the product surface or the poor transmittance of the product.
  • Taiwan Patent No. I360470 Anti-sticking mold and its preparation method
  • an anti-adhesion film is disposed on an attachment surface of a mold body, that is, a chromium-nitrogen-carbon film is deposited.
  • the anti-adhesion film a v-cut type microstructure is processed on a processing surface of the anti-adhesion film by a processing method, and the processing method is micro-etching processing, electrochemical processing, laser processing or mechanical processing. Cutting processing. Thereby, an optical film corresponding to the v-cut microstructure can be formed.
  • the former case mainly uses the chromium-nitrogen-carbon film to achieve the anti-adhesion effect of the optical film not adhering to the adhesive surface, but the v-cut type microstructure still helps the optical film to resist the adhesion.
  • the actual water drop angle test showed that the water droplet angle between the optical film and the mold was about 90 to 100 degrees.
  • the present inventors have developed and designed the case in view of the above-mentioned mold anti-adhesive treatment method and the many defects and inconveniences caused by the unfinished design of the mold structure.
  • the object of the present invention is to provide a method for resisting adhesion of a mold and a mold treated by the method, which can improve the anti-sticking effect of the molding surface of the mold, and can prevent the molded product in the mold from being released from the molding surface.
  • Producing a sticky phenomenon can improve the surface gloss and light transmittance of the product, and solve the yellowing phenomenon of the product surface caused by the release agent.
  • the solution of the present invention is:
  • a method for resisting sticking of a mold, using a forming surface on a mold body comprising the following steps:
  • the material of the binary alloy coating is added with an atomic radius of 40 picometers or more to 180 picometers or less in the chromium nitride coating process.
  • Atomic-scale microstructure is induced on the binary alloy coating by laser processing.
  • the element is one of ruthenium, cobalt, copper, gallium, silicon, aluminum or carbon.
  • the amount of addition is between 15% and 55% by weight.
  • the amount of addition is between 5% and 35% by weight.
  • the wavelength ⁇ of the laser wave is used from 0.193 micrometer to 10.6 micrometer, and the pulse is from picosecond to femtosecond, and the period of the induced microstructure is between ⁇ /2n and 10 micrometers. Periodic columnar nanostructures.
  • n is a positive integer, and n is between 1 and 3.
  • the height of the above columnar nanostructures is between ⁇ /2n and 10 microns.
  • n is a positive integer, and n is between 1 and 3.
  • the wavelength ⁇ of the laser wave is used from 0.193 micrometer to 10.6 micrometer, and the pulse is from picosecond to femtosecond, and the period of the induced microstructure is between ⁇ /2n and 10 micrometers. Periodic columnar nanostructures.
  • n is a positive integer, and n is between 1 and 3.
  • the height of the above columnar nanostructures is between ⁇ /2n and 10 microns.
  • n is a positive integer, and n is between 1 and 3.
  • the wavelength ⁇ of the laser wave is used from 0.193 micrometer to 10.6 micrometer, and the pulse is from picosecond to femtosecond, and the period of the induced microstructure is between ⁇ /2n and 10 micrometers. Periodic columnar nanostructures.
  • n is a positive integer, and n is between 1 and 3.
  • the height of the above columnar nanostructures is between ⁇ /2n and 10 microns.
  • n is a positive integer, and n is between 1 and 3.
  • the wavelength ⁇ of the laser wave is used from 0.193 micrometer to 10.6 micrometer, and the pulse is from picosecond to femtosecond, and the period of the induced microstructure is between ⁇ /2n and 10 micrometers. Periodic columnar nanostructures.
  • n is a positive integer, and n is between 1 and 3.
  • the height of the above columnar nanostructures is between ⁇ /2n and 10 microns.
  • n is a positive integer, and n is between 1 and 3.
  • a wear layer is plated on the molding surface of the mold body, and the binary alloy plating film is plated on the wear layer.
  • the above wear layer is a hard chrome layer.
  • a mold processed by an anti-sticking treatment method for a mold characterized in that it comprises:
  • the mold body includes a molding surface, and the molding surface is coated with a binary alloy coating film, and the material of the binary alloy coating film adds an atomic radius of 40 ⁇ m or less to less than or equal to 40 ⁇ m in the chromium nitride coating process.
  • the effects of the present invention include:
  • the water droplet angle of the binary alloy coating film of the present invention can reach about 120 degrees or more, after the product is molded in the mold body, by the material of the binary alloy coating itself, and the atomic grade microstructure on the binary alloy coating film.
  • the mold using the coating of the present invention has an excellent anti-sticking effect.
  • the mold of the invention achieves the anti-sticking effect of the product by the anti-adhesive structure, can improve the surface gloss and light transmittance of the product without using a release agent, and solve the yellowing of the product surface caused by the release agent. phenomenon.
  • Figure 1 is a flow chart of a method of practicing the invention
  • FIG. 2 is a schematic structural view showing molding of the mold body of the present invention by different steps in the process of the present invention
  • Figure 3A is a micrograph of a conventionally formed fine smooth surface of a chromium nitride coating on a molding surface of the mold for use as an anti-adhesion effect;
  • 3B is a micrograph of the columnar nano microstructure of the present invention in the formation of a chromium nitride binary alloy coating film
  • 4A is a schematic view showing a water drop angle of a fine smooth surface of a conventional chromium nitride coating of about 91.65 degrees;
  • Fig. 4B is a schematic view showing a water drop angle of the chromium nitride binary alloy plating film of the present invention of about 129.15 degrees.
  • the method of the present invention includes the following steps:
  • a wear layer 2 is first plated on a molding surface 11 of the mold body 1.
  • the wear layer 2 is a hard chrome layer.
  • the wear-resistant layer 2 is further coated with a binary alloy plating film 3, and the material of the binary alloy coating film 3 is added with an atomic radius of 40 ⁇ m or more to 180 ⁇ m or less in the chromium nitride coating process.
  • the element for example, using ruthenium, cobalt, copper, gallium, silicon, aluminum, carbon, or the like, thereby changing the lattice structure of the chromium nitride so that after the subsequent atomic-scale periodic microstructure 31 is induced by laser processing,
  • the water drop angle can reach 120 degrees or more. Where the element is aluminum, the amount is between 15% and 55% by weight; when the element is carbon, the amount is between 5% and 35% by weight.
  • An atomic-scale periodic microstructure 31 is induced on the binary alloy plating film 3 by a laser processing method.
  • a laser having a lower energy than the energy gap energy of the chromium nitride binary alloy is used to generate a secondary resonance wave on the surface of the binary alloy coating 3, so that the surface of the material is generated to be much smaller than the incident laser wavelength.
  • the periodic microstructure using a laser wavelength ⁇ from 0.193 micron to 10.6 micron, pulse from picosecond picosecond to femtosecond femtosecond, the period d of the induced microstructure is between ⁇ /2n and 10 microns,
  • the period d of the pointed microstructure is the distance between two adjacent microstructures 31, and the microstructure 31 is a periodic columnar nanostructure, and the height of the columnar nanostructure is between ⁇ /2n and 10 microns. between.
  • the aforementioned n is a positive integer, and n is between 1 and 3.
  • the conventional anti-adhesive method forms a fine smooth surface of the chromium nitride coating on the molding surface by means of polishing, coating or diamond knife processing.
  • the binary alloy plating film 3 on the molding surface 11 of the mold body 1 is processed by femtosecond laser to form a periodic columnar nano microstructure, and the surface of the nano microstructure surface is in contact with the liquid material. Tension, achieving an anti-sticking effect.
  • the water droplet angle ⁇ of the fine smooth surface of the chromium nitride coating is about 91.65 degrees.
  • the water droplet angle ⁇ of the binary alloy plating film 3 of the present invention is about 129.15 degrees. Therefore, when the product is molded by using the mold of the present invention, when the product is molded in the mold body 1, the product is transparent.
  • the material of the binary alloy coating 3 itself and the atomic grade microstructure 31 on the binary alloy coating 3 make the product have extremely low adhesion to the binary alloy coating 3, and can have excellent Anti-stick effect.
  • the mold of the present invention does not require the use of a release agent, and the molded product can be easily released from the mold, so that the manufacturing cost can be reduced, and the surface gloss and light transmittance of the product can be improved, and the release agent can be solved.
  • the surface of the product is yellowed.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Disclosed is an anti-stick processing method for a mould and a mould processed using the method. The method comprises plating a binary alloy coating onto a moulding surface of a mould body, the materials of the binary alloy coating being chromium nitride with aluminium or carbon, then using a laser processing method to induce periodical microstructures at the atomic level on the binary alloy coating, so that, when the moulded product in the mould is demoulded, no sticking phenomenon occurs with the moulding surface, thereby improving the surface gloss and light transmittance of the product and solving the problem of the surface yellowing phenomenon caused by a releasing agent.

Description

模具的抗沾黏处理方法及以该方法处理的模具 Anti-sticking treatment method of mold and mold processed by the method 技术领域Technical field
本发明涉及一种模具的抗沾黏处理方法及以该方法处理的模具，尤其是指在模具本体的成型面镀上氮化铬的二元合金镀膜，并在二元合金镀膜上成型原子级微结构的方法及模具，避免产品在脱模时，与成型面会有沾黏的现象。 The invention relates to a method for resisting adhesion of a mold and a mold treated by the method, in particular to a binary alloy coating film on which a chromium nitride is plated on a molding surface of the mold body, and forming an atomic level on the binary alloy coating film. The microstructure method and mold prevent the product from sticking to the molding surface during demolding.
背景技术Background technique
一般模具在成型产品之前，会在模具的成型面上涂上离型剂，使得产品在模具内成型后，较容易脱模，不会与成型面有沾黏的现象。Generally, before the molding product, the mold will be coated with a release agent on the molding surface of the mold, so that after the product is molded in the mold, it is easier to demould and does not stick to the molding surface.
但是上述产品的防沾黏方法，在每一次成型产品时都需要重复涂上离型剂，且每隔特定工作天，例如2或3天都需要对模具进行再清理，无形中增加不少工时，影响生产效率，并且有时离型剂涂布不均匀也会影响产品质量，例如使产品表面光泽变差、产品表面黄化或产品透光率不佳等缺失。However, the anti-adhesive method of the above products requires repeated application of the release agent in each molding of the product, and the mold is required to be re-cleaned every certain working day, for example, 2 or 3 days, which inevitably adds a lot of man-hours. It affects the production efficiency, and sometimes the uneven coating of the release agent also affects the quality of the product, such as the deterioration of the surface gloss of the product, the yellowing of the product surface or the poor transmittance of the product.
再根据检索既有技术而言，有中国台湾专利第I360470号「抗沾黏模具及其制备方法」，于一模体的一附着面设置一抗沾黏膜，即沉积出铬-氮-碳薄膜作为该抗沾黏膜，再以一加工方式于该抗沾黏膜的一加工面进行加工形成一v-cut型态的微结构，加工方式为微影蚀刻加工、电化学加工、雷射加工或机械切削加工。借此可以成型对应v-cut微结构的光学膜片。According to the search for existing technologies, there is Taiwan Patent No. I360470 "Anti-sticking mold and its preparation method", and an anti-adhesion film is disposed on an attachment surface of a mold body, that is, a chromium-nitrogen-carbon film is deposited. As the anti-adhesion film, a v-cut type microstructure is processed on a processing surface of the anti-adhesion film by a processing method, and the processing method is micro-etching processing, electrochemical processing, laser processing or mechanical processing. Cutting processing. Thereby, an optical film corresponding to the v-cut microstructure can be formed.
前案主要是利用铬-氮-碳薄膜达成光学膜片不会沾黏在附着面的抗沾黏效果，惟v-cut型态的微结构仍然有帮助光学膜片抗沾黏的效果。将其实际进行水滴角测试发现，光学膜片与模具之间的水滴角约为90度至100度。The former case mainly uses the chromium-nitrogen-carbon film to achieve the anti-adhesion effect of the optical film not adhering to the adhesive surface, but the v-cut type microstructure still helps the optical film to resist the adhesion. The actual water drop angle test showed that the water droplet angle between the optical film and the mold was about 90 to 100 degrees.
有鉴于此，本发明人针对上述模具的抗沾黏处理方法及处理模具结构设计上未臻完善所导致的诸多缺失及不便，而深入构思，且积极研究改良试做而开发设计出本案。In view of this, the present inventors have developed and designed the case in view of the above-mentioned mold anti-adhesive treatment method and the many defects and inconveniences caused by the unfinished design of the mold structure.
发明内容Summary of the invention
本发明的目的在于提供一种模具的抗沾黏处理方法及以该方法处理的模具，提高模具成型面的抗沾黏效果，可使得模具内的成型产品在脱模时，不会与成型面产生沾黏的现象，可以提升产品的表面光泽、透光率，解决因为离型剂而造成的产品表面黄化现象。The object of the present invention is to provide a method for resisting adhesion of a mold and a mold treated by the method, which can improve the anti-sticking effect of the molding surface of the mold, and can prevent the molded product in the mold from being released from the molding surface. Producing a sticky phenomenon, can improve the surface gloss and light transmittance of the product, and solve the yellowing phenomenon of the product surface caused by the release agent.
为了达成上述目的，本发明的解决方案是：In order to achieve the above object, the solution of the present invention is:
一种模具的抗沾黏处理方法，使用在一模具本体上的一成型面，包括下列步骤：A method for resisting sticking of a mold, using a forming surface on a mold body, comprising the following steps:
A.在该模具本体的一成型面上镀上一层二元合金镀膜，该二元合金镀膜的材质在氮化铬镀膜制程中添加原子半径大于等于40皮米至小于等于180皮米的元素；A. Applying a binary alloy coating on a molding surface of the mold body, the material of the binary alloy coating is added with an atomic radius of 40 picometers or more to 180 picometers or less in the chromium nitride coating process. ;
B.利用雷射加工法在该二元合金镀膜上诱发原子等级的微结构。B. Atomic-scale microstructure is induced on the binary alloy coating by laser processing.
上述步骤A中，该元素为钪、钴、铜、镓、硅、铝或碳其中之一。In the above step A, the element is one of ruthenium, cobalt, copper, gallium, silicon, aluminum or carbon.
上述元素使用铝时，添加量为重量百分比介于15％至55％之间。When the above elements are used, the amount of addition is between 15% and 55% by weight.
上述元素使用碳时，添加量为重量百分比介于5％至35％之间。When the above elements are used, the amount of addition is between 5% and 35% by weight.
上述步骤B中，使用雷射波波长λ从0.193微米至10.6微米之间，脉冲从皮秒到飞秒之间，诱发微结构的周期介于λ/2n至10微米之间，前述微结构为周期性柱状奈米微结构。In the above step B, the wavelength λ of the laser wave is used from 0.193 micrometer to 10.6 micrometer, and the pulse is from picosecond to femtosecond, and the period of the induced microstructure is between λ/2n and 10 micrometers. Periodic columnar nanostructures.
上述n为正整数，且n介于1至3之间。The above n is a positive integer, and n is between 1 and 3.
上述柱状奈米微结构的高度介于λ/2n至10微米之间。The height of the above columnar nanostructures is between λ/2n and 10 microns.
上述n为正整数，且n介于1至3之间。The above n is a positive integer, and n is between 1 and 3.
上述步骤B中，使用雷射波波长λ从0.193微米至10.6微米之间，脉冲从皮秒到飞秒之间，诱发微结构的周期介于λ/2n至10微米之间，前述微结构为周期性柱状奈米微结构。In the above step B, the wavelength λ of the laser wave is used from 0.193 micrometer to 10.6 micrometer, and the pulse is from picosecond to femtosecond, and the period of the induced microstructure is between λ/2n and 10 micrometers. Periodic columnar nanostructures.
上述n为正整数，且n介于1至3之间。The above n is a positive integer, and n is between 1 and 3.
上述柱状奈米微结构的高度介于λ/2n至10微米之间。The height of the above columnar nanostructures is between λ/2n and 10 microns.
上述n为正整数，且n介于1至3之间。The above n is a positive integer, and n is between 1 and 3.
上述步骤B中，使用雷射波波长λ从0.193微米至10.6微米之间，脉冲从皮秒到飞秒之间，诱发微结构的周期介于λ/2n至10微米之间，前述微结构为周期性柱状奈米微结构。In the above step B, the wavelength λ of the laser wave is used from 0.193 micrometer to 10.6 micrometer, and the pulse is from picosecond to femtosecond, and the period of the induced microstructure is between λ/2n and 10 micrometers. Periodic columnar nanostructures.
上述n为正整数，且n介于1至3之间。The above n is a positive integer, and n is between 1 and 3.
上述柱状奈米微结构的高度介于λ/2n至10微米之间。The height of the above columnar nanostructures is between λ/2n and 10 microns.
上述n为正整数，且n介于1至3之间。The above n is a positive integer, and n is between 1 and 3.
上述步骤B中，使用雷射波波长λ从0.193微米至10.6微米之间，脉冲从皮秒到飞秒之间，诱发微结构的周期介于λ/2n至10微米之间，前述微结构为周期性柱状奈米微结构。In the above step B, the wavelength λ of the laser wave is used from 0.193 micrometer to 10.6 micrometer, and the pulse is from picosecond to femtosecond, and the period of the induced microstructure is between λ/2n and 10 micrometers. Periodic columnar nanostructures.
上述n为正整数，且n介于1至3之间。The above n is a positive integer, and n is between 1 and 3.
上述柱状奈米微结构的高度介于λ/2n至10微米之间。The height of the above columnar nanostructures is between λ/2n and 10 microns.
上述n为正整数，且n介于1至3之间。The above n is a positive integer, and n is between 1 and 3.
上述模具的抗沾黏处理方法，在执行步骤A之前，先在该模具本体的成型面镀上一层耐磨层，并将该二元合金镀膜镀在该耐磨层上。In the anti-adhesive treatment method of the above mold, before the step A is performed, a wear layer is plated on the molding surface of the mold body, and the binary alloy plating film is plated on the wear layer.
上述耐磨层为硬铬层。The above wear layer is a hard chrome layer.
一种模具的抗沾黏处理方法处理的模具，其特征在于，包括有：A mold processed by an anti-sticking treatment method for a mold, characterized in that it comprises:
一模具本体，该模具本体包括有一成型面，在该成型面上镀上一层二元合金镀膜，该二元合金镀膜的材质在氮化铬镀膜制程中添加原子半径大于等于40皮米至小于等于180皮米的元素，并在该二元合金镀膜上成型原子等级的微结构。a mold body, the mold body includes a molding surface, and the molding surface is coated with a binary alloy coating film, and the material of the binary alloy coating film adds an atomic radius of 40 μm or less to less than or equal to 40 μm in the chromium nitride coating process. An element equal to 180 picometers and an atomic grade microstructure formed on the binary alloy coating.
采用上述结构后，本发明的功效包括有：After adopting the above structure, the effects of the present invention include:
1.本发明二元合金镀膜的水滴角可达到约120度或以上，产品在模具本体内成型后，借由该二元合金镀膜本身材质，以及该二元合金镀膜上的原子等级的微结构，使得使用本发明镀膜的模具具有极佳的抗沾黏效果。1. The water droplet angle of the binary alloy coating film of the present invention can reach about 120 degrees or more, after the product is molded in the mold body, by the material of the binary alloy coating itself, and the atomic grade microstructure on the binary alloy coating film. The mold using the coating of the present invention has an excellent anti-sticking effect.
2.本发明的模具借由抗沾黏的构造达成产品抗沾黏的效果，不需使用离型剂，可以提升产品的表面光泽、透光率，解决因为离型剂造成的产品表面黄化现象。2. The mold of the invention achieves the anti-sticking effect of the product by the anti-adhesive structure, can improve the surface gloss and light transmittance of the product without using a release agent, and solve the yellowing of the product surface caused by the release agent. phenomenon.
3.不需使用离型剂，使得制造成本得以降低。3. No need to use a release agent, so that the manufacturing cost can be reduced.
附图说明DRAWINGS
图1是实施本发明方法的流程图；Figure 1 is a flow chart of a method of practicing the invention;
图2是本发明的模具本体利用本发明方法处理时，各不同步骤成型的构造示意图；2 is a schematic structural view showing molding of the mold body of the present invention by different steps in the process of the present invention;
图3A是传统采用在模具成型面形成氮化铬镀膜细致光滑表面用以作为抗沾黏作用的显微图；Figure 3A is a micrograph of a conventionally formed fine smooth surface of a chromium nitride coating on a molding surface of the mold for use as an anti-adhesion effect;
图3B是本发明在氮化铬二元合金镀膜形成周期柱状奈米微结构的显微图；3B is a micrograph of the columnar nano microstructure of the present invention in the formation of a chromium nitride binary alloy coating film;
图4A是传统氮化铬镀膜细致光滑表面的水滴角约为91.65度的示意图；4A is a schematic view showing a water drop angle of a fine smooth surface of a conventional chromium nitride coating of about 91.65 degrees;
图4B是本发明氮化铬二元合金镀膜的水滴角约为129.15度的示意图。Fig. 4B is a schematic view showing a water drop angle of the chromium nitride binary alloy plating film of the present invention of about 129.15 degrees.
主要组件符号说明Main component symbol description
1模具本体11成型面2耐磨层3二元合金镀膜1 mold body 11 molding surface 2 wear layer 3 binary alloy coating
31微结构θ水滴角d微结构的周期31 microstructure θ water drop angle d microstructure period
具体实施方式detailed description
首先请参阅图1及图2所示，本发明方法包括下列步骤：Referring first to Figures 1 and 2, the method of the present invention includes the following steps:
A1.先在一模具本体1的一成型面11镀上一层耐磨层2，本实施例中该耐磨层2为硬铬层。A1. A wear layer 2 is first plated on a molding surface 11 of the mold body 1. In the embodiment, the wear layer 2 is a hard chrome layer.
A.再于该耐磨层2上镀上一层二元合金镀膜3，该二元合金镀膜3的材质在氮化铬镀膜制程中添加原子半径大于等于40皮米至小于等于180皮米的元素，例如使用钪、钴、铜、镓、硅、铝、碳等，借此改变氮化铬的晶格结构，使得在后续以雷射加工法诱发原子等级的周期性微结构31之后，具有水滴角可达到120度或以上的效果。其中该元素使用铝时，添加量为重量百分比介于15％至55％之间；该元素使用碳时，添加量为重量百分比介于5％至35％之间。且若是添加铝在氮化铬溅镀制程中加入铝电极，若是添加碳在氮化铬溅镀制程中加入甲烷气体，并借由铝或碳的添加，使得原来氮化铬的体心立方晶格结构转变为较致密的二元合金面心立方晶格结构，从而可将该二元合金镀膜3的硬度从氮化铬镀膜约2000Hv提升至大于3000Hv，因而增加该二元合金镀膜3与前述耐磨层2的结合性及该模具本体1的寿命。A. The wear-resistant layer 2 is further coated with a binary alloy plating film 3, and the material of the binary alloy coating film 3 is added with an atomic radius of 40 μm or more to 180 μm or less in the chromium nitride coating process. The element, for example, using ruthenium, cobalt, copper, gallium, silicon, aluminum, carbon, or the like, thereby changing the lattice structure of the chromium nitride so that after the subsequent atomic-scale periodic microstructure 31 is induced by laser processing, The water drop angle can reach 120 degrees or more. Where the element is aluminum, the amount is between 15% and 55% by weight; when the element is carbon, the amount is between 5% and 35% by weight. And if aluminum is added to the chromium nitride sputtering process to add an aluminum electrode, if carbon is added to the chromium nitride sputtering process, methane gas is added, and by adding aluminum or carbon, the original chromium nitride body-centered cubic crystal The lattice structure is transformed into a dense binary alloy face-centered cubic lattice structure, so that the hardness of the binary alloy coating 3 can be increased from about 2000 Hv to more than 3000 Hv, thereby increasing the binary alloy coating 3 and the foregoing The bonding of the wear layer 2 and the life of the mold body 1.
B.利用雷射加工法在该二元合金镀膜3上诱发原子等级的周期性微结构31。其中雷射加工法操作时，利用能量小于前述氮化铬二元合金能隙能量的雷射，在该二元合金镀膜3表面产生二次谐振波，使材料表面上产生远小于入射雷射波长的周期性微结构，使用的雷射波波长λ从0.193微米至10.6微米之间，脉冲从皮秒picosecond到飞秒femtosecond间，诱发微结构的周期d介于λ/2n至10微米之间，而所指的微结构的周期d为两相邻微结构31的距离，前述微结构31为周期性柱状奈米微结构，且前述柱状奈米微结构的高度介于λ/2n至10微米之间。前述n为正整数，且n介于1至3之间。B. An atomic-scale periodic microstructure 31 is induced on the binary alloy plating film 3 by a laser processing method. In the laser processing method, a laser having a lower energy than the energy gap energy of the chromium nitride binary alloy is used to generate a secondary resonance wave on the surface of the binary alloy coating 3, so that the surface of the material is generated to be much smaller than the incident laser wavelength. The periodic microstructure, using a laser wavelength λ from 0.193 micron to 10.6 micron, pulse from picosecond picosecond to femtosecond femtosecond, the period d of the induced microstructure is between λ/2n and 10 microns, The period d of the pointed microstructure is the distance between two adjacent microstructures 31, and the microstructure 31 is a periodic columnar nanostructure, and the height of the columnar nanostructure is between λ/2n and 10 microns. between. The aforementioned n is a positive integer, and n is between 1 and 3.
参阅图3A，传统抗沾黏的作法在模具成型面利用抛光、镀膜或钻石刀加工方式形成氮化铬镀膜细致光滑表面。如图3B，本发明在该模具本体1的成型面11上的二元合金镀膜3经由飞秒雷射加工后形成周期柱状奈米微结构，借由奈米微结构表面与液态材料接触时的表面张力，达成抗沾黏效果。Referring to Fig. 3A, the conventional anti-adhesive method forms a fine smooth surface of the chromium nitride coating on the molding surface by means of polishing, coating or diamond knife processing. As shown in FIG. 3B, the binary alloy plating film 3 on the molding surface 11 of the mold body 1 is processed by femtosecond laser to form a periodic columnar nano microstructure, and the surface of the nano microstructure surface is in contact with the liquid material. Tension, achieving an anti-sticking effect.
请参阅图4A所示，氮化铬镀膜细致光滑表面的水滴角θ约为91.65度。再请参阅图4B所示，本发明在该二元合金镀膜3的水滴角θ约为129.15度，因此使用本发明的模具成型一产品时，当该产品在该模具本体1内成型时，透过该二元合金镀膜3本身材质，以及该二元合金镀膜3上的原子等级的微结构31，使得该产品与该二元合金镀膜3具有极低的沾黏力，而能够具有极佳的抗沾黏效果。Referring to FIG. 4A, the water droplet angle θ of the fine smooth surface of the chromium nitride coating is about 91.65 degrees. Referring to FIG. 4B, the water droplet angle θ of the binary alloy plating film 3 of the present invention is about 129.15 degrees. Therefore, when the product is molded by using the mold of the present invention, when the product is molded in the mold body 1, the product is transparent. The material of the binary alloy coating 3 itself and the atomic grade microstructure 31 on the binary alloy coating 3 make the product have extremely low adhesion to the binary alloy coating 3, and can have excellent Anti-stick effect.
由上所述，因此本发明的模具不需使用离型剂，也能使成型产品容易脱模，使得制造成本得以降低，并且可提升产品的表面光泽、透光率，解决因为离型剂造成的产品表面黄化现象。As described above, therefore, the mold of the present invention does not require the use of a release agent, and the molded product can be easily released from the mold, so that the manufacturing cost can be reduced, and the surface gloss and light transmittance of the product can be improved, and the release agent can be solved. The surface of the product is yellowed.
上述实施例和附图并非限定本发明的产品形态和式样，任何所属技术领域的普通技术人员对其所做的适当变化或修饰，皆应视为不脱离本发明的专利范畴。The above-mentioned embodiments and the accompanying drawings are not intended to limit the scope of the invention, and any suitable variations or modifications of the invention may be made without departing from the scope of the invention.

Claims (23)

1.一种模具的抗沾黏处理方法，使用在一模具本体上的一成型面，其特征在于，包括下列步骤：An anti-adhesive treatment method for a mold, using a molding surface on a mold body, comprising the steps of:
A.在该模具本体的一成型面上镀上一层二元合金镀膜，该二元合金镀膜的材质在氮化铬镀膜制程中添加原子半径大于等于40皮米至小于等于180皮米的元素；A. Applying a binary alloy coating on a molding surface of the mold body, the material of the binary alloy coating is added with an atomic radius of 40 picometers or more to 180 picometers or less in the chromium nitride coating process. ;
B.利用雷射加工法在该二元合金镀膜上诱发原子等级的微结构。B. Atomic-scale microstructure is induced on the binary alloy coating by laser processing.
2.如权利要求1所述的模具的抗沾黏处理方法，其特征在于：步骤A中，该元素为钪、钴、铜、镓、硅、铝或碳其中之一。The anti-adhesive treatment method for a mold according to claim 1, wherein in the step A, the element is one of bismuth, cobalt, copper, gallium, silicon, aluminum or carbon.
3.如权利要求2所述的模具的抗沾黏处理方法，其特征在于：该元素使用铝时，添加量为重量百分比介于15％至55％之间。3. The anti-sticking treatment method for a mold according to claim 2, wherein when the element is made of aluminum, the amount is added in an amount of between 15% and 55% by weight.
4.如权利要求2所述的模具的抗沾黏处理方法，其特征在于：该元素使用碳时，添加量为重量百分比介于5％至35％之间。The anti-adhesive treatment method for a mold according to claim 2, wherein when the element is made of carbon, the amount is added in an amount of between 5% and 35% by weight.
5.如权利要求1所述的模具的抗沾黏处理方法，其特征在于：步骤B中，使用雷射波波长λ从0.193微米至10.6微米之间，脉冲从皮秒到飞秒之间，诱发微结构的周期介于λ/2n至10微米之间，前述微结构为周期性柱状奈米微结构。The anti-adhesive treatment method for a mold according to claim 1, wherein in the step B, the wavelength λ of the laser wave is used from 0.193 μm to 10.6 μm, and the pulse is from picosecond to femtosecond. The period of the induced microstructure is between λ/2n and 10 microns, and the aforementioned microstructure is a periodic columnar nanostructure.
6.如权利要求5所述的模具的抗沾黏处理方法，其特征在于：前述n为正整数，且n介于1至3之间。The anti-sticking treatment method for a mold according to claim 5, wherein the n is a positive integer and n is between 1 and 3.
7.如权利要求5所述的模具的抗沾黏处理方法，其特征在于：前述柱状奈米微结构的高度介于λ/2n至10微米之间。The anti-adhesive treatment method for a mold according to claim 5, wherein the height of the columnar nanostructure is between λ/2n and 10 μm.
8.如权利要求7所述的模具的抗沾黏处理方法，其特征在于：前述n为正整数，且n介于1至3之间。The anti-sticking treatment method for a mold according to claim 7, wherein the n is a positive integer and n is between 1 and 3.
9.如权利要求2所述的模具的抗沾黏处理方法，其特征在于：步骤B中，使用雷射波波长λ从0.193微米至10.6微米之间，脉冲从皮秒到飞秒之间，诱发微结构的周期介于λ/2n至10微米之间，前述微结构为周期性柱状奈米微结构。The anti-adhesive treatment method for a mold according to claim 2, wherein in step B, the wavelength λ of the laser wave is used from 0.193 μm to 10.6 μm, and the pulse is from picosecond to femtosecond. The period of the induced microstructure is between λ/2n and 10 microns, and the aforementioned microstructure is a periodic columnar nanostructure.
10.如权利要求9所述的模具的抗沾黏处理方法，其特征在于：前述n为正整数，且n介于1至3之间。The anti-sticking treatment method for a mold according to claim 9, wherein the n is a positive integer and n is between 1 and 3.
11.如权利要求9所述的模具的抗沾黏处理方法，其特征在于：前述柱状奈米微结构的高度介于λ/2n至10微米之间。11. The method of claim 9, wherein the columnar nanostructure has a height between λ/2n and 10 microns.
12.如权利要求11所述的模具的抗沾黏处理方法，其特征在于：前述n为正整数，且n介于1至3之间。The anti-sticking treatment method for a mold according to claim 11, wherein the n is a positive integer and n is between 1 and 3.
13.如权利要求3所述的模具的抗沾黏处理方法，其特征在于：步骤B中，使用雷射波波长λ从0.193微米至10.6微米之间，脉冲从皮秒到飞秒之间，诱发微结构的周期介于λ/2n至10微米之间，前述微结构为周期性柱状奈米微结构。The anti-adhesive treatment method for a mold according to claim 3, wherein in step B, the wavelength λ of the laser wave is used from 0.193 μm to 10.6 μm, and the pulse is from picosecond to femtosecond. The period of the induced microstructure is between λ/2n and 10 microns, and the aforementioned microstructure is a periodic columnar nanostructure.
14.如权利要求13所述的模具的抗沾黏处理方法，其特征在于：前述n为正整数，且n介于1至3之间。The anti-sticking treatment method for a mold according to claim 13, wherein the n is a positive integer and n is between 1 and 3.
15.如权利要求13所述的模具的抗沾黏处理方法，其特征在于：前述柱状奈米微结构的高度介于λ/2n至10微米之间。The method of claim 13 , wherein the columnar nanostructure has a height between λ/2 n and 10 μm.
16.如权利要求15所述的模具的抗沾黏处理方法，其特征在于：前述n为正整数，且n介于1至3之间。16. The anti-sticking treatment method for a mold according to claim 15, wherein said n is a positive integer and n is between 1 and 3.
17.如权利要求4所述的模具的抗沾黏处理方法，其特征在于：步骤B中，使用雷射波波长λ从0.193微米至10.6微米之间，脉冲从皮秒到飞秒之间，诱发微结构的周期介于λ/2n至10微米之间，前述微结构为周期性柱状奈米微结构。The anti-adhesive treatment method for a mold according to claim 4, wherein in step B, the wavelength λ of the laser wave is used from 0.193 μm to 10.6 μm, and the pulse is from picosecond to femtosecond. The period of the induced microstructure is between λ/2n and 10 microns, and the aforementioned microstructure is a periodic columnar nanostructure.
18.如权利要求17所述的模具的抗沾黏处理方法，其特征在于：前述n为正整数，且n介于1至3之间。The anti-sticking treatment method for a mold according to claim 17, wherein said n is a positive integer and n is between 1 and 3.
19.如权利要求17所述的模具的抗沾黏处理方法，其特征在于：前述柱状奈米微结构的高度介于λ/2n至10微米之间。The anti-adhesive treatment method for a mold according to claim 17, wherein the height of the columnar nanostructure is between λ/2n and 10 μm.
20.如权利要求19所述的模具的抗沾黏处理方法，其特征在于：前述n为正整数，且n介于1至3之间。The anti-sticking treatment method for a mold according to claim 19, wherein the n is a positive integer and n is between 1 and 3.
21.如权利要求1所述的模具的抗沾黏处理方法，其特征在于：进一步在执行步骤A之前，先在该模具本体的成型面镀上一层耐磨层，并将该二元合金镀膜镀在该耐磨层上。The anti-adhesive treatment method for a mold according to claim 1, further comprising: applying a wear layer to the molding surface of the mold body and performing the binary alloy before performing step A; A coating is plated on the wear layer.
22.如权利要求21所述的模具的抗沾黏处理方法，其特征在于：该耐磨层为硬铬层。22. The anti-adhesion treatment method of a mold according to claim 21, wherein the wear layer is a hard chrome layer.
23.一种使用权利要求1所述的模具的抗沾黏处理方法处理的模具，其特征在于，包括有：23. A mold treated by the anti-sticking treatment method of the mold of claim 1, comprising:
一模具本体，该模具本体包括有一成型面，在该成型面上镀上一层二元合金镀膜，该二元合金镀膜的材质在氮化铬镀膜制程中添加原子半径大于等于40皮米至小于等于180皮米的元素，并在该二元合金镀膜上成型原子等级的微结构。a mold body, the mold body includes a molding surface, and the molding surface is coated with a binary alloy coating film, and the material of the binary alloy coating film adds an atomic radius of 40 μm or less to less than or equal to 40 μm in the chromium nitride coating process. An element equal to 180 picometers and an atomic grade microstructure formed on the binary alloy coating.
PCT/CN2013/079104 2013-07-10 2013-07-10 Anti-stick processing method for mould and mould processed using same WO2015003333A1 (en)

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