WO2014207894A1 - Inspection jig, and printed board inspection system employing the inspection jig - Google Patents

Inspection jig, and printed board inspection system employing the inspection jig Download PDF

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Publication number
WO2014207894A1
WO2014207894A1 PCT/JP2013/067819 JP2013067819W WO2014207894A1 WO 2014207894 A1 WO2014207894 A1 WO 2014207894A1 JP 2013067819 W JP2013067819 W JP 2013067819W WO 2014207894 A1 WO2014207894 A1 WO 2014207894A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
probe pin
inspection
plate
Prior art date
Application number
PCT/JP2013/067819
Other languages
French (fr)
Japanese (ja)
Inventor
英昭 山下
Original Assignee
株式会社メイコー
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Publication date
Application filed by 株式会社メイコー filed Critical 株式会社メイコー
Priority to PCT/JP2013/067819 priority Critical patent/WO2014207894A1/en
Publication of WO2014207894A1 publication Critical patent/WO2014207894A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards

Definitions

  • the present invention relates to an inspection jig, and more particularly to an inspection jig used for inspecting a printed circuit board, and to a printed circuit board inspection system using the inspection jig.
  • a printed circuit board to be inspected is fixed by an inspection jig, and various electrical inspections are performed by bringing an inspection probe pin into contact with a probe pin contact portion (inspection point) of a wiring pattern. Is called.
  • Such a printed circuit board inspection apparatus normally includes an alignment mechanism that corrects a positional deviation between the inspection point and the probe pin.
  • Such an alignment mechanism includes an optical camera for optically detecting alignment marks provided on a printed circuit board to obtain position data, and positions inspection points and probe pins based on the obtained data. Match.
  • a printed circuit board inspection apparatus provided with such an alignment mechanism for example, a printed circuit board inspection apparatus disclosed in Patent Document 1 is cited.
  • the above-mentioned printed circuit board inspection apparatus includes an alignment mechanism including precision equipment such as an optical camera, it cannot be placed in a thermostatic chamber that can create a high-temperature environment. Inspection of printed circuit boards is difficult.
  • the printed circuit board inspection apparatus usually, only a printed circuit board is accommodated in a high temperature constant temperature bath, and after the printed circuit board is heated to 80 ° C. to 120 ° C., the printed circuit board taken out from the constant temperature bath is used as an inspection jig of the printed circuit board inspection apparatus. A fixed electrical inspection is performed. In this case, the inspection jig is at room temperature, and the heated printed circuit board is cooled rapidly, so the resin contracts, the crack spreads back to the original state, and the wiring becomes conductive. Difficult to do.
  • the inspection jig is heated from the outside by an infrared lamp or the like, and the inspection jig is inspected in a state where residual heat is applied.
  • the heat conduction to the center of the inspection jig is insufficient, and the temperature distribution of the entire inspection jig is uneven. For this reason, it is impossible to perform an electrical inspection while keeping the temperature of the heated printed circuit board as a whole at a high temperature.
  • the present invention has been made based on the above-described circumstances, and the object of the present invention is to perform an electrical inspection while keeping the printed circuit board to be inspected at a desired temperature, and to achieve a desired temperature, for example, a high temperature.
  • An object of the present invention is to provide an inspection jig that can contribute to improving the detection rate of defects under a temperature environment, and to provide a printed circuit board inspection system using the inspection jig.
  • an inspection treatment included in a printed circuit board inspection apparatus that electrically inspects a printed circuit board having a first surface and a second surface opposite to the first surface.
  • a first holding assembly for supporting the first surface side of the printed circuit board; and a second holding assembly for supporting the second surface side of the printed circuit board, wherein the first holding assembly is provided on the printed circuit board.
  • a first probe pin holder that holds a number of first probe pins that are in contact with the wiring on the first surface, and a first temperature regulator that can adjust the temperature of the printed circuit board to a desired set temperature
  • the second holding assembly includes a second probe pin holder that holds a number of second probe pins that are in contact with the wiring on the second surface of the printed board, and the temperature of the printed board is the set temperature.
  • Inspecting jig characterized in that it includes a second temperature adjusting member which can be adjusted is provided.
  • the first probe pin holding body has a first base that holds the plurality of first probe pins in a state of protruding toward the first surface of the printed circuit board, and the first temperature
  • the adjusting body is disposed on the side of the first base where the first probe pin protrudes, and the adjustment body has a first probe pin escape hole that avoids the first probe pin at a position corresponding to the first probe pin.
  • a first plate made of a conductive material; and a heater integrally disposed on the first plate, wherein the second probe pin holding body attaches the second probe pins to the printed circuit board.
  • a second base that is held in a state of projecting toward the second surface, and the second temperature adjusting body is disposed on a side of the second base on which the second probe pin projects, Second Pro
  • the first holding assembly is disposed in a region of the first plate facing the printed circuit board, and a first pin insertion through which the first probe pin can be inserted at a position corresponding to the first probe pin.
  • a first protection plate made of an insulating material having a hole; and the second holding assembly is disposed in a region of the second plate facing the printed circuit board, and is connected to the second probe pin.
  • a second protective plate made of an insulating material having a second pin insertion hole through which the second probe pin can be inserted at a corresponding position, wherein the first plate and the second plate are made of aluminum. It is preferable to set it as the aspect which consists of.
  • the thermostat which keeps the printed circuit board which has the 1st surface and the 2nd surface on the opposite side to the said 1st surface at the desired setting temperature, and the said printed circuit board taken out from the said thermostat are conveyed.
  • a printed circuit board inspection apparatus that receives the printed circuit board conveyed by the transportation apparatus and electrically inspects the printed circuit board while maintaining the set temperature; Provides a printed circuit board inspection system including the inspection jig described above.
  • the inspection jig of the present invention includes a temperature adjusting body, it is possible to perform an electrical inspection while keeping a printed circuit board to be inspected at a desired set temperature, and to detect defects under an environment of a desired set temperature. This can contribute to improving the detection rate.
  • the printed circuit board inspection system of the present invention has the inspection jig as described above, only the printed circuit board can be maintained at a desired temperature, and the temperature of a precision instrument included in the printed circuit board inspection apparatus is low. Can be suppressed. For this reason, it is possible to easily detect defects in the printed circuit board under an environment of a desired temperature.
  • 1 is a schematic configuration diagram of a high temperature inspection system according to the present invention. It is the perspective view which decomposed
  • a high-temperature inspection system (printed circuit board inspection system) 6 including a printed circuit board inspection apparatus 4 including an inspection jig 2 according to the present invention will be described below with reference to the drawings.
  • the high temperature inspection system 6 includes a constant temperature bath 10 capable of heating a printed circuit board 8 to be inspected to a high temperature of 80 ° C. to 120 ° C., and a printed circuit board 8 heated in the constant temperature chamber 10. And a printed circuit board inspection apparatus 4 that receives the high-temperature printed circuit board 8 conveyed by the transportation apparatus 12 and performs an electrical inspection of the printed circuit board 8.
  • the temperature chamber 10 is not particularly limited, and for example, a hot air circulation type temperature chamber 10 is used.
  • reference numeral 14 indicates a hot air generator.
  • the transport device 12 is not particularly limited, and for example, a belt conveyor 16 having heat resistance can be used. Moreover, in order to suppress that the printed circuit board 8 raise
  • the printed circuit board inspection apparatus 4 receives inspection data from an inspection jig 2 that holds a printed circuit board 8 to be inspected, an alignment mechanism 22 that aligns the inspection jig 2, and an inspection probe pin attached to the inspection jig 2.
  • a defect detection device 24 for detecting defects on the printed circuit board is included.
  • the inspection jig 2 includes a first holding assembly 26 and a second holding assembly 28 that are arranged to face each other, and holds the printed circuit board 8 between the first holding assembly 26 and the second holding assembly 28.
  • the printed circuit board 8 has a first surface (lower side in FIG. 1) 30 and a second surface (upper side in FIG. 1) 32 opposite to the first surface 30.
  • a holding assembly positioned on the first surface 30 side of the first holding assembly 26 is referred to as a first holding assembly 26, and a holding assembly positioned on the second surface 32 side of the printed circuit board 8 is referred to as a second holding assembly 28. That is, the first holding assembly 26 supports the first surface 30 side of the printed circuit board 8, and the second holding assembly 28 supports the second surface 32 side of the printed circuit board 8.
  • the first holding assembly 26 includes a first probe pin holding body 36 that holds a number of first probe pins 34 as inspection probe pins, and a first probe of the first probe pin holding body 36.
  • a first heating unit (first temperature adjusting body) 38 located on the side where the pin 34 protrudes, and a first heating pin 38 located on the opposite side of the first probe pin holder 36 across the first heating unit 38.
  • the first protection plate 40 is provided, and the first probe pin holder 36, the first heating unit 38, and the first protection plate 40 are combined.
  • the first probe pin holder 36 includes a first base 42 made of a resin plate having both heat resistance and insulation, and a large number of first probe pins 34 attached to the first base 42.
  • the first probe pin 34 includes a cylindrical pin body, a lead wire 44 extending from the base end of the pin body, and a contact inserted into the pin body and partially protruding from the tip of the pin body. .
  • the contact is biased by a spring and can protrude and retract with respect to the pin body, and the tip of the contact directly contacts a probe pin contact portion on the wiring pattern 46 of the printed circuit board 8, that is, an inspection point. .
  • the first base 42 has a rectangular shape larger than the planar view shape of the printed circuit board 8 to be inspected.
  • the first surface 48 (surface opposite to the printed circuit board 8 in FIG. 2) and the first surface 48 Has a second surface 50 on the opposite side (surface on the printed circuit board 8 side in FIG. 2).
  • the first base 42 is provided with a large number of pin holding holes 52 penetrating from the first surface 48 to the second surface 50.
  • Each pin holding hole 52 is provided at a predetermined position corresponding to the inspection point of the wiring pattern 46 of the printed circuit board 8.
  • a first probe pin 34 with a lead wire 44 attached to the proximal end is inserted into each pin holding hole 52 from the first surface 48 side of the first base 42, and the distal end side of the first probe pin 34 is the first side.
  • the first base 42 is held so as to protrude from the second surface 50 by a predetermined length.
  • the lead wire 44 attached to the base end of the first probe pin 34 extends from the first surface 48 side of the first base 42 and is connected to the defect detection device 24 not shown in FIG. Thereby, the data detected by the first probe pin 34 is sent to the defect detection device 24.
  • a screw hole 41 is provided at a predetermined position on the second surface 50 of the first base 42. As is apparent from FIG. 2, one screw hole 41 is provided in the vicinity of the two left corners of the first base 42 in FIG. 2, and the rightmost in the row of the first probe pins 34 in FIG. A total of four screw holes 41 are provided, one on the extension line of the row located at a position sandwiching the row.
  • cylindrical spacers 43 are disposed on the screw holes 41, respectively.
  • the diameter of the central through hole of the spacer 43 is larger than the diameter of the screw hole 41 described above. For this reason, these spacers 43 do not fall into the screw holes 41 but are placed on the second surface 50 of the first base 42. At this time, the axis of the central through hole of the spacer 43 is in a state of being aligned with the axis of the screw hole 41.
  • the part shown with the referential mark 47 in FIG. 2 is the escape hole (guide pin escape hole 47) of the guide pin 58 mentioned later.
  • the first heating unit 38 includes a plate-like first heating plate 54, a belt-like heater 56 disposed on the first heating plate 54, and the first heating unit.
  • a guide pin 58 provided so as to protrude from the plate 54 is included.
  • the first heating plate 54 has a rectangular shape larger than the first probe pin holder 36 described above, and is a first surface on the first probe pin holder 36 side (opposite to the printed circuit board 8 in FIG. 2). Side surface) 60 and a second surface 62 opposite to the first surface 60 (surface on the printed circuit board 8 side in FIG. 2).
  • the thickness of the first heating plate 54 is slightly thinner than the height of the spacer 43 described above. In other words, the length along the axis of the central through hole of the spacer 43 is set to be longer than the thickness of the first heating plate 54. Preferably, the height of the spacer 43 is set to be 0.1 mm longer than the thickness of the first heating plate 54.
  • engagement protrusions 64 and 64 that partially protrude in the direction along the first surface 60 and the second surface 62 are formed at both ends in the longitudinal direction of the outer peripheral edge of the first heating plate 54. Is provided.
  • the engagement protrusion 64 is used when the first heating plate 54 including the guide pins 58 is fixed to the alignment holder 67 included in the alignment mechanism 22 of the printed circuit board inspection apparatus 4.
  • the engagement protrusion 64 is provided with a screw insertion hole 65, the plate fixing screw 71 is passed through the screw insertion hole 65, and the plate fixing screw 71 is inserted into the female screw hole 69 provided in the alignment holder 67.
  • the first heating plate 54 can be fixed to the alignment holder 67 by screwing.
  • a heat conductive material having little temperature distribution unevenness when heated and excellent in heat conductivity that is heated evenly is used as the first warming plate 54.
  • a heat conductive material include metals such as aluminum and copper, and ceramics such as aluminum nitride.
  • a plate material made of aluminum is used because of its high thermal conductivity and excellent workability.
  • the first heating plate 54 is a probe pin that avoids contact with the first probe pin 34 at a position corresponding to the multiple first probe pins 34 of the first probe pin holder 36.
  • An escape hole 66 is provided. Accordingly, when the first heating unit 38 and the first probe pin holder 36 are combined, the first probe pin 34 is inserted without contacting the inner wall of the probe pin escape hole 66.
  • Each first probe pin 34 is positioned with a margin at the approximate center of each probe pin escape hole 66.
  • the printed circuit board 8 On the second surface 62 of the first heating plate 54, guide pins 58 used for positioning the printed circuit board 8 are provided.
  • the guide pins 58 are on the second surface 62 of the first heating plate 54 at the four corners of a region where a large number of probe pin escape holes 66 are provided, on the opposite side to the first probe pin holder 36. That is, it protrudes toward the printed circuit board 8 side.
  • the printed circuit board 8 has a rectangular shape, and has, for example, positioning guide holes 68 capable of receiving the above-described guide pins 58 at predetermined positions at four corners thereof.
  • the printed circuit board 8 is integrated with the first heating plate 54 by setting the guide hole 68 and the guide pins 58 of the first heating plate 54 to engage with each other.
  • an area corresponding to the printed circuit board 8 is defined as a printed circuit board corresponding area 70.
  • the above-described guide pin 58 has a shape in which a tip portion thereof is processed into a tapered shape. Thereby, the guide hole 68 and the guide pin 58 are easily engaged.
  • the guide pin 58 is biased in a direction protruding from the second surface 62 of the first heating plate 54 by a spring (not shown), and can project and retract with respect to the second surface 62. That is, when the tip of the guide pin 58 is pushed toward the first heating plate 54 against the biasing force of the spring, the guide pin 58 is pushed into the first heating plate 54. The guide pin 58 that has been pushed in protrudes from the first surface 60 of the first heating plate 54 at the base end side. At this time, the base end portion of the guide pin 58 enters the guide pin escape hole 47 of the first base 42 described above.
  • the first heating plate 54 is provided with a spacer insertion hole 73 at a position corresponding to the screw hole 41 in which the spacer 43 is disposed on the second surface of the first base 42 described above.
  • the diameter of the spacer insertion hole 73 is set to a length that allows the spacer 43 to be inserted with a margin, and is preferably set to a value about 4 mm larger than the outer diameter of the spacer 43.
  • a belt-like heater 56 is disposed at a position surrounding the above-described printed board corresponding region 70.
  • a ribbon heater 56 made of nichrome wire protected by a glass fiber cloth is used.
  • the ribbon heater 56 is formed and fixed in a U shape so as to surround the printed board corresponding region 70 on the second surface 62 of the first heating plate 54.
  • a lead wire 72 extends from the end of the ribbon heater 56, and a connector 74 is attached to the tip of the lead wire 72.
  • the lead wire 72 is connected to a temperature control device (not shown) via a connector 74.
  • the first protective plate 40 is a rectangular plate made of a resin having heat resistance and insulating properties.
  • the first protection plate 40 is disposed so that the wiring of the printed circuit board 8 and the first heating plate 54 of the first heating unit 38 are not in contact with each other at an undesired position and cause an electrical short circuit. Is done.
  • the first protective plate 40 also has a function of preventing the first probe pin 34 from being bent.
  • the first protective plate 40 has a size that covers at least the printed circuit board corresponding area 70. However, it does not overlap with the ribbon heater 56 on the first heating plate 54. Moreover, it is preferable that the thickness of the 1st protection board 40 is the same as that of the ribbon heater 56, or a thing thicker than it. That is, the ribbon heater 56 is prevented from projecting in the thickness direction from the first protection plate 40. Further, the characteristics required for the first protective plate 40 include heat resistance, insulation and thermal conductivity. Since the first protection plate 40 is disposed in direct contact with the first heating plate 54 or provided with a slight clearance on the first heating plate, the influence of heat from the first heating plate is reduced. It must be heat resistant.
  • the first protective plate 40 As thin as possible. Accordingly, a ribbon heater 56 that is as thin as possible is employed.
  • the first protective plate 40 has a rectangular shape, and the first surface on the first heating plate 54 side (the surface opposite to the printed circuit board 8 in FIG. 2) 76 and This is a rectangular plate material having a second surface 78 on the printed circuit board 8 side (surface on the printed circuit board 8 side in FIG. 2) 78.
  • the first protective plate 40 is provided with a guide pin insertion hole 80 at a location corresponding to the guide pin 58 of the first heating plate 54.
  • the diameter of the guide pin insertion hole 80 is set to a length that allows the guide pin 58 to be inserted with a margin, and is preferably set to a value about 4 mm larger than the outermost diameter of the guide pin 58. .
  • the first protection plate 40 is provided with pin insertion holes 82 at locations corresponding to the probe pin escape holes 66 of the first heating plate 54, that is, locations corresponding to the first probe pins 34.
  • the first protective plate 40 is provided with screw insertion holes 75 at locations corresponding to the spacer insertion holes 73 of the first heating plate 54, that is, locations corresponding to the spacers 43 and the screw holes 41 of the first base 42. It has been.
  • the diameter of the screw insertion hole 75 is a length that allows the screw 45 to be inserted, and is set to a length that is smaller than the diameter of the central through hole of the spacer 43 described above.
  • the first probe pin holder 36, the first heating unit 38, and the first protection plate 40 described above are combined as follows, for example.
  • the first probe pin holder 36 and the first heating unit 38 include the second surface 50 of the first base 42 of the first probe pin holder 36 and the first heating plate 54 of the first heating unit 38.
  • the first surface 60 is opposed to the first surface 60.
  • spacers 43 are respectively arranged at positions corresponding to the respective screw holes 41 on the second surface 50 of the first base 42, and these spacers 43 are respectively located in the spacer insertion holes 73 of the first heating plate 54. Is inserted.
  • Each first probe pin 34 is inserted into a corresponding probe pin relief hole 66 in the first heating plate 54 and protrudes from the second surface 62 of the first heating plate 54 by a predetermined length.
  • the first protection plate 40 is disposed on the first heating unit 38. Specifically, the first protection plate 40 is disposed such that the first surface 76 faces the second surface 62 of the first heating plate 54. At this time, each first probe pin 34 protruding from each probe pin escape hole 66 of the first heating plate 54 is inserted into each corresponding pin insertion hole 82 in the first protection plate 40, and the contact portion is the first one. The first protection plate 40 protrudes from the second surface 78 by a predetermined length. Each guide pin 58 of the first heating plate 54 is inserted into a corresponding guide pin insertion hole 80 in the first protection plate 40 and protrudes from the second surface 78 of the first protection plate 40 by a predetermined length. .
  • each screw 45 is inserted into each screw insertion hole 75 of the first protective plate 40.
  • Each screw 45 is passed through the central through hole of each spacer 43 accommodated in the spacer insertion hole 73 of the first heating plate 54 and screwed into the corresponding screw hole 41 in the first base 42.
  • the height dimension of the spacer 43 is slightly longer than the thickness of the first heating plate 54, it is between the first base 42 and the first heating plate 54 and between the first protection plate 40 and the first heating plate 54. A slight gap is provided between the hot plate 54 and the hot plate 54.
  • the spacer insertion hole 73 is provided with a margin with respect to the spacer 43
  • the probe pin escape hole 66 is provided with a margin with respect to the first probe pin 34
  • the guide pin insertion hole 80 is The guide pin 58 is provided with a margin.
  • the first heating unit 38 is combined in a state of being sandwiched between the first probe pin holder 36 and the first protective plate 40 while being slightly movable in the plane direction.
  • a retention assembly 26 is obtained.
  • the first holding assembly 26 includes four spacers 43 in each of the four corners on the second surface 50 of the first base 42, and corresponding to the spacers 43, Although the four screw holes 41 of the first base 42, four spacer insertion holes 73 of the first heating plate 54, and four screws 45 are provided, the present invention is not limited to this mode. Arrangement positions can be arbitrarily set. Accordingly, the screw holes 41, the spacer insertion holes 73 of the first heating plate 54, and the screws 45 are also arranged so as to correspond to the spacers 43, respectively. In the first holding assembly 26, by installing the spacer 43, a space larger than the thickness of the first heating plate 54 is secured between the first base 42 and the protection plate 40, and the first heating plate 54 is X ⁇ .
  • the spacer 43 receives the load applied to the printed circuit board 8 through the protective plate 40 when the printed circuit board 8 is sandwiched between the first holding assembly 26 and the second holding assembly 28, the spacer 43 is balanced by an appropriate amount. It needs to be well placed. Therefore, when a high load is applied, the spacers 43 may be arranged at more locations, for example, at arbitrary positions of a dozen locations.
  • the second holding assembly 28 is constituted by almost the same parts as the parts constituting the first holding assembly 26.
  • the configuration of the second holding assembly 28 will be described below with reference to FIG.
  • the same referential mark is attached
  • the second holding assembly 28 includes a second probe pin holder 84 that holds a number of second probe pins 134 as inspection probe pins, and a second probe of the second probe pin holder 84.
  • a second heating unit (second temperature adjusting body) 86 positioned on the side where the pin protrudes, and a second heating unit 86 positioned on the opposite side of the second probe pin holding body 84 across the second heating unit 86.
  • a protective plate 87 is provided.
  • the second base 142 having the same shape as the first base 42 holds many second probe pins 134 having the same configuration as the first probe pin 34, and the spacer 43 is not disposed. Except for, the first probe pin holder 36 has the same structure.
  • Reference numeral 147 indicates a guide pin escape hole.
  • the guide pin clearance hole 147 in the second base 142 is a clearance hole that receives the tip of the guide pin 58. Specifically, since the tip of the guide pin 58 has a conical shape, when the printed board 8 is held between the first holding assembly 26 and the second holding assembly 28, the guide pin 58 extends from the guide hole 68 of the printed board 8. It slightly protrudes toward the second holding assembly 28 side. In this case, in order to avoid the tip of the guide pin 58 from hitting the second base 142, the second base 142 is provided with a guide pin escape hole 147 at a position corresponding to the guide pin 58.
  • the second heating unit 86 includes a second heating plate 88 and a ribbon heater 56 disposed on the second heating plate 88.
  • the second heating plate 88 does not include the guide pin 58 and the engagement protrusion 64, and includes a screw insertion hole 173 smaller than the spacer insertion hole 73 instead of the spacer insertion hole 73.
  • the first heating unit 38 is the same as the first heating unit 38 except that a guide pin escape hole 158 is provided at a corresponding position.
  • the screw insertion hole 173 is provided by making a hole having a diameter that allows the screw 45 to be inserted at a position corresponding to the screw hole 41 of the second probe pin holder 84.
  • the guide pin escape hole 158 communicates with the guide pin relief hole 147 of the second base 142 and allows the guide pin 58 to be inserted.
  • the second protective plate 87 has the same structure as the first protective plate 40 described above except that a guide pin escape hole 180 is provided instead of the guide pin insertion hole 80.
  • the guide pin relief hole 180 is a relief hole that receives the tip of the guide pin 58 and communicates with the guide pin relief hole 158 of the second heating plate 88.
  • the second probe pin holder 84, the second heating unit 86, and the second protection plate 87 are formed in the second holding assembly 28 by being combined in the same manner as in the case of the first holding assembly 26 described above.
  • the second probe pin holder 84 and the second heating unit 86 include the second surface 50 of the second base 142 of the second probe pin holder 84 and the second heating plate of the second heating unit 86.
  • the first surfaces 60 of the 88 are opposed to each other. Accordingly, each second probe pin 134 is inserted into each corresponding probe pin escape hole 66 in the second heating plate 88 and protrudes from the second surface 62 of the second heating plate 88 by a predetermined length. .
  • the second protection plate 87 is disposed on the second heating unit 86. Specifically, the second protective plate 87 is disposed such that the first surface 76 faces the second surface 62 of the second heating plate 88. At this time, each second probe pin 134 protruding from each probe pin escape hole 66 of the second heating plate 88 is inserted into the corresponding pin insertion hole 82 in the second protection plate 87, and the contact portion is the first. 2 A predetermined length protrudes from the second surface 78 of the protective plate 87.
  • each screw 45 is inserted into each screw insertion hole 75 of the second protective plate 87.
  • Each screw 45 is passed through the screw insertion hole 173 of the second heating plate 88 and screwed into the corresponding screw hole 41 in the second base 142.
  • the second probe pin holder 84, the second heating unit 86, and the second protection plate 87 are screwed to form the second holding assembly 28.
  • the second holding assembly 28 is different from the first holding assembly 26 in that the second heating plate 88, that is, the second heating unit 86 moves in the direction along the first surface 60 and the second surface 62. I can't.
  • the first holding assembly 26 and the second holding assembly 28 obtained as described above are attached to an alignment apparatus included in the alignment mechanism 22 of the printed circuit board inspection apparatus 4. The procedure for such mounting is shown below.
  • the first holding assembly 26 is mounted on a first alignment device as an alignment device for the first holding assembly.
  • the first surface 48 of the first base 42 is connected to a first fixed stage (not shown) of the first alignment apparatus via a number of columns (not shown).
  • a wiring space can be secured between the first base 42 and the first fixed stage.
  • the lead wire 44 extending from the first surface 48 of the first base 42 can be passed through the wiring space.
  • the first heating plate 54 is fixed to the alignment holder 67 extending from a predetermined position of the first alignment mechanism portion of the first alignment apparatus. Specifically, as shown in FIG. 2, the engagement protrusion 64 of the first heating plate 54 is placed on the alignment holder 67. Then, the plate fixing screw 71 is passed through the screw insertion hole 65 of the engagement protrusion 64, and the plate heating screw 71 is screwed into the female screw hole 69 of the alignment holder 67, whereby the first heating plate 54 is aligned with the alignment holder 67. Screwed on. Thereby, the 1st heating plate 54 becomes movable according to the motion of the alignment holder 67 driven by the 1st alignment mechanism part.
  • the second holding assembly 28 is attached to a second alignment device as an alignment device for the second holding assembly.
  • the first surface 48 of the second base 142 is connected to a movable stage (not shown) driven by the second alignment mechanism part of the second alignment device via a number of columns (not shown).
  • a wiring space can be secured between the second base 142 and the movable stage.
  • the lead wire 44 extending from the first surface 48 of the second base 142 can be passed through the wiring space.
  • the entire second holding assembly moves in accordance with the movement of the movable stage driven by the second alignment mechanism unit.
  • the alignment mechanism includes an optical camera that recognizes the position of the printed circuit board 8 and the positions of the first and second holding assemblies, and an inspection probe for the first and second holding assemblies from the information obtained by the optical camera.
  • a misalignment detection mechanism for detecting misalignment between the pin and the corresponding probe pin contact portion (inspection point) on the printed circuit board 8, and the first and second alignment devices are arranged based on the detection data of the misalignment detection mechanism. Drive to correct misalignment (both not shown).
  • the connector 74 of the ribbon heater 56 is connected to a temperature control device (not shown), and the lead wires 44 of the first and second probe pins are connected to the defect detection device 24, respectively.
  • a printed circuit board 8 to be inspected is prepared.
  • the prepared printed circuit board 8 is accommodated in the constant temperature bath 10.
  • the temperature in the thermostat 10 is set to 80 ° C. to 120 ° C., and this state is maintained for 5 minutes to 60 minutes.
  • the printed circuit board 8 is heated uniformly to a desired set temperature.
  • the printed circuit board 8 heated to a desired set temperature is transported toward the printed circuit board inspection device 4 by the transport device 12 and delivered to the inspection jig 2.
  • the inspection jig 2 is heated to the same desired set temperature as that of the printed circuit board 8 by energizing each ribbon heater 56 installed on the first heating plate 54 and the second heating plate 86.
  • the inspection jig 2 grips the printed circuit board 8 after the printed circuit board 8 is delivered. Specifically, the printed circuit board 8 is first placed on the first holding assembly 26. At this time, the guide pin 58 of the first holding assembly 26 is engaged with the guide hole 68 of the printed board 8, whereby the printed board 8 is fixed to the first heating plate 54 and integrated with the first heating plate 54. It becomes. For this reason, the position of the printed circuit board 8 can be adjusted by moving the first heating plate 54 by the first alignment mechanism. At this time, the position of the first holding assembly 26 and the position of the alignment mark provided at a predetermined position of the printed board 8 are read using an optical camera, and how much the first probe pin 34 and the printed board 8 are displaced. Is detected. Then, the first heating plate 54, that is, the printed circuit board 8 is moved by the amount of the shift, and the inspection point of the wiring pattern on the first surface 30 side of the printed circuit board 8 and the first probe pin 34 are aligned. .
  • the second holding assembly 28 is aligned. Specifically, the position of the alignment mark on the printed circuit board 8 and the position of the second holding assembly 28 are read by an optical camera, and how much the second holding assembly 28 and the printed circuit board 8 on the first holding assembly 26 are misaligned. To detect. Then, by moving the movable stage by the amount shifted, the entire second holding assembly 28 is moved, and the inspection point of the wiring pattern on the second surface 32 side of the printed circuit board and the second probe pin 134 are aligned. I do.
  • each first probe pin 34 on the first holding assembly 26 side comes into contact with a corresponding inspection point on the first surface 30 side of the printed circuit board 8
  • each second probe pin on the second holding assembly 28 side is Since it contacts with the corresponding inspection point on the second surface 32 side of the printed circuit board 8, various electrical inspections can be performed on the printed circuit board 8.
  • the contacts of the first and second probe pins slightly protrude from the pin insertion hole 82 of the first protection plate 40 and the pin insertion hole 82 of the second protection plate, respectively, and come into contact with the printed circuit board 8. Immerse it in each pin body. Thereby, each 1st and 2nd probe pin will be immersed in a pin insertion hole. However, since these contacts are urged by a spring, the contact state with the probe pin contact portion (inspection point) of the wiring pattern is maintained. As the contact is immersed, the first surface 30 of the printed circuit board 8 and the first protective plate 40 are in surface contact, and the second surface 32 of the printed circuit board 8 and the second protective plate are in surface contact.
  • the first and second heating plates included in the first and second holding assemblies are made of aluminum having excellent thermal conductivity. It can heat so that it may become uniform temperature as a whole, restraining. Since the heat of the heating plate is transmitted to the printed circuit board 8 in surface contact via the first protective plate and the second protective plate, the printed circuit board 8 can be evenly heated to a desired set temperature, and this state is maintained. be able to. Therefore, according to the present invention, the printed circuit board 8 can be maintained at a high temperature and the temperature of the printed circuit board 8 can be efficiently prevented from being lowered. Therefore, an electrical inspection can be easily performed in a high temperature state. be able to.
  • the printed circuit board inspection apparatus 4 since there is no need to put an optical camera or the like associated with the printed circuit board inspection apparatus 4 in the thermostat 10, the printed circuit board can be avoided while avoiding the problem of applying a heat load to precision equipment such as the optical camera. Electrical inspection at a high temperature of 8 can be performed.
  • FIG. 4 shows the inspection jig 102 of the second embodiment
  • FIG. 5 shows the second assembly 128 of the second embodiment.
  • the aspect of the first heating unit 138 of the first assembly 126 is different from the aspect of the first heating unit 38 in the first embodiment.
  • the aspect of the 2nd heating unit 186 is different from the aspect of the 2nd heating unit 86 in 1st Embodiment.
  • the ribbon heater 56 is formed in a U shape so as to avoid the first base 42 on the first surface 60 side of the first heating plate 54. Is arranged.
  • the ribbon is formed in a U shape so as to avoid the second base 142 on the first surface 60 side of the second heating plate 88.
  • a heater 56 is provided.
  • the ribbon heater 56 exists on the second surface 62 of the first heating plate 54 in the first heating unit 138 and the second surface 62 of the second heating plate 88 in the second heating unit 186.
  • the inspection jig 102 of the second embodiment is suitable for inspecting a thinner printed circuit board 8.
  • Example 1 The printed circuit board 8 was accommodated in the thermostat 10 set to 100 degreeC in the tank, and was hold
  • This inspection jig 2 is the inspection jig 2 according to the first embodiment of the present invention as shown in FIG. 2, and the first heating plate 54 and the second heating plate 88 are made of aluminum, A ribbon heater 56 is attached to each. The ribbon heater 56 was energized, and the temperature of the first heating plate 54 and the second heating plate 88 was set to 100 ° C. In this state, the continuity test of the wiring pattern of the printed circuit board 8 was performed. As a result of measuring the temperature of the printed circuit board 8 during the inspection, the temperature of the printed circuit board was 100 ° C.
  • the inspection jig 2 of the present embodiment can maintain a high temperature state such as 100 ° C. during the electrical inspection, it contributes to an improvement in the detection rate of defects in a high temperature environment.
  • Comparative Example 1 A continuity test of the printed circuit board 8 heated to 100 ° C. was performed in the same manner as in Example 1 except that a conventional inspection jig without a heating plate having a heater was used as the inspection jig. .
  • the temperature of the printed circuit board 8 was 40 ° C.
  • Comparative Example 1 Since the inspection jig of Comparative Example 1 is in a room temperature (about 25 ° C.) state, the printed board heated to 100 ° C. is deprived of heat by being set on the inspection jig, and the temperature decreases. Yes. That is, in the case of this comparative example 1, since the high temperature state cannot be maintained, the defect detection rate under a high temperature environment cannot be improved.
  • the inspection jig according to the present invention is not limited to the above-described embodiments and examples, and various modifications can be made.
  • the inspection jig provided with the heater was demonstrated, it is not limited to this aspect, For example, it is good also as an inspection jig provided with the cooling device containing a Peltier device etc. Thereby, the printed circuit board can be inspected at a low temperature.
  • the inspection jig provided with both a heater and a cooling device In this case, a heat cycle test that repeats heating and cooling can be performed on the printed circuit board.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

This inspection jig (2) is an inspection jig which is included in a printed board inspection apparatus (4) for carrying out electrical inspection of a printed board (8) having a first surface (30) and a second surface (32) on the opposite side from the first surface (30), and which is provided with a first retaining assembly (26) for supporting the first surface side of the printed board (8), and a second retaining assembly (28) for supporting the second surface side of the printed board (8). The first retaining assembly (26) includes a first probe pin retainer (36) for retaining a multitude of first probe pins (34), and a first heating plate (54) which can maintain the printed board (8) at a desired set temperature. The second retaining assembly (28) includes a second probe pin retainer (84) for retaining a multitude of second probe pins (34), and a second heating plate (86) which can maintain the printed board (8) at a desired set temperature.

Description

検査治具およびこの検査治具を用いたプリント基板検査システムInspection jig and printed circuit board inspection system using this inspection jig
　本発明は、検査治具に関し、詳しくは、プリント基板の検査に用いる検査治具に関し、また、この検査治具を用いたプリント基板検査システムに関する。 The present invention relates to an inspection jig, and more particularly to an inspection jig used for inspecting a printed circuit board, and to a printed circuit board inspection system using the inspection jig.
　プリント基板に設けられた配線パターンに対し、導通・短絡検査、抵抗値測定等の電気的な検査を行う場合、プリント基板検査装置を用いることが知られている。 It is known to use a printed circuit board inspection device when performing electrical inspection such as continuity / short circuit inspection and resistance value measurement on a wiring pattern provided on a printed circuit board.
　プリント基板検査装置においては、検査対象となるプリント基板が検査治具により固定され、検査用プローブピンを配線パターンのプローブピン当接箇所（検査点）に接触させることにより各種電気的な検査が行われる。このようなプリント基板検査装置は、通常、検査点とプローブピンとの位置ずれを補正するアライメント機構を備えている。このようなアライメント機構は、プリント基板上に設けられたアライメントマークを光学的に検出して位置データを得るための光学カメラを備えており、得られたデータを基に検査点とプローブピンとを位置合わせする。このようなアライメント機構を備えたプリント基板検査装置としては、例えば、特許文献１のプリント基板検査装置が挙げられる。 In a printed circuit board inspection apparatus, a printed circuit board to be inspected is fixed by an inspection jig, and various electrical inspections are performed by bringing an inspection probe pin into contact with a probe pin contact portion (inspection point) of a wiring pattern. Is called. Such a printed circuit board inspection apparatus normally includes an alignment mechanism that corrects a positional deviation between the inspection point and the probe pin. Such an alignment mechanism includes an optical camera for optically detecting alignment marks provided on a printed circuit board to obtain position data, and positions inspection points and probe pins based on the obtained data. Match. As a printed circuit board inspection apparatus provided with such an alignment mechanism, for example, a printed circuit board inspection apparatus disclosed in Patent Document 1 is cited.
実開平０１－１８０７８０号公報Japanese Utility Model Publication No. 01-180780
　ところで、近年、電子部品を実装したプリント基板が使用される環境はより過酷となっており、例えば、自動車に用いられる電子部品を実装したプリント基板は、８０～１２０℃といった高温環境下で使用されることがある。ここで、配線パターンにクラックが生じている場合、上記したような高温環境下においては、プリント基板の樹脂が膨張し、それにともない、配線パターンのクラックが拡がり、断線状態となることがある。このような高温環境下での不良を発見するためには、プリント基板を実際に高温環境下に置いて電気的な検査を行うことが望ましい。 By the way, in recent years, the environment in which a printed circuit board on which electronic components are mounted is used more severely. For example, a printed circuit board on which electronic components used in automobiles are used in a high temperature environment of 80 to 120 ° C. Sometimes. Here, when a crack is generated in the wiring pattern, the resin of the printed circuit board expands under the high temperature environment as described above, and accordingly, the crack of the wiring pattern spreads and may be disconnected. In order to find such a defect in a high temperature environment, it is desirable to perform an electrical inspection by actually placing the printed circuit board in a high temperature environment.
　しかしながら、上記したプリント基板検査装置は、光学カメラ等の精密機器を含むアライメント機構を備えているため高温環境をつくることができる恒温槽内に配置することはできず、高温状態の恒温槽内でのプリント基板の検査は困難である。 However, since the above-mentioned printed circuit board inspection apparatus includes an alignment mechanism including precision equipment such as an optical camera, it cannot be placed in a thermostatic chamber that can create a high-temperature environment. Inspection of printed circuit boards is difficult.
　このため、通常は、高温状態の恒温槽にプリント基板のみ収容し、プリント基板が８０℃～１２０℃に加熱された後、恒温槽から取り出されたプリント基板をプリント基板検査装置の検査治具に固定して電気的検査を行っている。この場合、検査治具は常温であり、加熱されたプリント基板は、急激に冷却されるため、樹脂が収縮し、上記したクラックの拡がりは元に戻り配線は導通状態となるので、不良を発見することが困難となる。 For this reason, usually, only a printed circuit board is accommodated in a high temperature constant temperature bath, and after the printed circuit board is heated to 80 ° C. to 120 ° C., the printed circuit board taken out from the constant temperature bath is used as an inspection jig of the printed circuit board inspection apparatus. A fixed electrical inspection is performed. In this case, the inspection jig is at room temperature, and the heated printed circuit board is cooled rapidly, so the resin contracts, the crack spreads back to the original state, and the wiring becomes conductive. Difficult to do.
　また、検査治具を外部から赤外線ランプ等により加熱し、検査治具に余熱を与えた状態で検査することも行われている。しかし、この場合、検査治具の中心部までの熱伝導が不十分であり、検査治具の全体の温度分布にむらが生じる。このため、加熱されたプリント基板の温度を全体的に高温に維持したままでの電気的検査を行うことはできない。 In addition, the inspection jig is heated from the outside by an infrared lamp or the like, and the inspection jig is inspected in a state where residual heat is applied. However, in this case, the heat conduction to the center of the inspection jig is insufficient, and the temperature distribution of the entire inspection jig is uneven. For this reason, it is impossible to perform an electrical inspection while keeping the temperature of the heated printed circuit board as a whole at a high temperature.
　本発明は、上記の事情に基づいてなされたものであり、その目的とするところは、検査対象のプリント基板を所望する温度に保持したまま電気的な検査が行え、所望する温度、例えば、高温度の環境下での不良の検出率を向上させることに貢献することができる検査治具を提供することにあり、また、この検査治具を用いたプリント基板検査システムを提供することにある。 The present invention has been made based on the above-described circumstances, and the object of the present invention is to perform an electrical inspection while keeping the printed circuit board to be inspected at a desired temperature, and to achieve a desired temperature, for example, a high temperature. An object of the present invention is to provide an inspection jig that can contribute to improving the detection rate of defects under a temperature environment, and to provide a printed circuit board inspection system using the inspection jig.
　上記目的を達成するために、本発明によれば、第１面及び前記第１面とは反対側の第２面を有するプリント基板の電気的な検査を行うプリント基板検査装置に含まれる検査治具において、前記プリント基板の第１面側を支える第１保持アセンブリと、前記プリント基板の第２面側を支える第２保持アセンブリとを備えており、前記第１保持アセンブリは、前記プリント基板の第１面の配線と当接される多数の第１プローブピンを保持する第１プローブピン保持体及び前記プリント基板の温度を所望する設定温度に調節することができる第１温度調節体を含み、前記第２保持アセンブリは、前記プリント基板の第２面の配線と当接される多数の第２プローブピンを保持する第２プローブピン保持体及び前記プリント基板の温度を前記設定温度に調節することができる第２温度調節体を含んでいることを特徴とする検査治具が提供される。 In order to achieve the above object, according to the present invention, an inspection treatment included in a printed circuit board inspection apparatus that electrically inspects a printed circuit board having a first surface and a second surface opposite to the first surface. A first holding assembly for supporting the first surface side of the printed circuit board; and a second holding assembly for supporting the second surface side of the printed circuit board, wherein the first holding assembly is provided on the printed circuit board. A first probe pin holder that holds a number of first probe pins that are in contact with the wiring on the first surface, and a first temperature regulator that can adjust the temperature of the printed circuit board to a desired set temperature; The second holding assembly includes a second probe pin holder that holds a number of second probe pins that are in contact with the wiring on the second surface of the printed board, and the temperature of the printed board is the set temperature. Inspecting jig, characterized in that it includes a second temperature adjusting member which can be adjusted is provided.
　ここで、前記第１プローブピン保持体は、前記多数の第１プローブピンを前記プリント基板の第１面に向かって突出させた状態で保持する第１ベースを有しており、前記第１温度調節体は、前記第１ベースの前記第１プローブピンが突出している側に配置され、前記第１プローブピンに対応する位置にて前記第１プローブピンを避ける第１プローブピン逃げ孔を有する熱伝導材料からなる第１プレートと、前記第１プレートに一体的に配設されたヒーターとを有しており、前記第２プローブピン保持体は、前記多数の第２プローブピンを前記プリント基板の第２面に向かって突出させた状態で保持する第２ベースを有しており、前記第２温度調節体は、前記第２ベースの前記第２プローブピンが突出している側に配置され、前記第２プローブピンに対応する位置にて前記第２プローブピンを避ける第２プローブピン逃げ孔を有する熱伝導材料からなる第２プレートと、前記第２プレートに一体的に配設されたヒーターとを有している態様とすることが好ましい。 Here, the first probe pin holding body has a first base that holds the plurality of first probe pins in a state of protruding toward the first surface of the printed circuit board, and the first temperature The adjusting body is disposed on the side of the first base where the first probe pin protrudes, and the adjustment body has a first probe pin escape hole that avoids the first probe pin at a position corresponding to the first probe pin. A first plate made of a conductive material; and a heater integrally disposed on the first plate, wherein the second probe pin holding body attaches the second probe pins to the printed circuit board. A second base that is held in a state of projecting toward the second surface, and the second temperature adjusting body is disposed on a side of the second base on which the second probe pin projects, Second Pro A second plate made of a heat conductive material having a second probe pin escape hole that avoids the second probe pin at a position corresponding to the pin; and a heater integrally disposed on the second plate. It is preferable to set it as the aspect which is.
　また、前記第１保持アセンブリは、前記第１プレートの前記プリント基板に相対する領域に配設され、前記第１プローブピンに対応する位置にて前記第１プローブピンを挿通可能な第１ピン挿通孔を有している絶縁材料からなる第１保護板を更に備えており、前記第２保持アセンブリは、前記第２プレートの前記プリント基板に相対する領域に配設され、前記第２プローブピンに対応する位置にて前記第２プローブピンを挿通可能な第２ピン挿通孔を有している絶縁材料からなる第２保護板を更に備えており、前記第１プレート及び前記第２プレートは、アルミニウムからなる態様とすることが好ましい。 Further, the first holding assembly is disposed in a region of the first plate facing the printed circuit board, and a first pin insertion through which the first probe pin can be inserted at a position corresponding to the first probe pin. A first protection plate made of an insulating material having a hole; and the second holding assembly is disposed in a region of the second plate facing the printed circuit board, and is connected to the second probe pin. And a second protective plate made of an insulating material having a second pin insertion hole through which the second probe pin can be inserted at a corresponding position, wherein the first plate and the second plate are made of aluminum. It is preferable to set it as the aspect which consists of.
　また、本発明では、第１面及び前記第１面とは反対側の第２面を有するプリント基板を所望する設定温度に保つ恒温槽と、前記恒温槽から取り出された前記プリント基板を搬送する搬送装置と、前記搬送装置により搬送されてきた前記プリント基板を受け取り、前記設定温度に保ったまま前記プリント基板の電気的な検査を行うプリント基板検査装置とを備えており、前記プリント基板検査装置は、上記した検査治具を有していることを特徴とするプリント基板検査システムが提供される。 Moreover, in this invention, the thermostat which keeps the printed circuit board which has the 1st surface and the 2nd surface on the opposite side to the said 1st surface at the desired setting temperature, and the said printed circuit board taken out from the said thermostat are conveyed. A printed circuit board inspection apparatus that receives the printed circuit board conveyed by the transportation apparatus and electrically inspects the printed circuit board while maintaining the set temperature; Provides a printed circuit board inspection system including the inspection jig described above.
　本発明の検査治具は、温度調節体を含むため、検査対象のプリント基板を所望の設定温度に保ったまま電気的な検査を行うことができ、所望の設定温度の環境下での不良の検出率を向上させることに貢献することができる。 Since the inspection jig of the present invention includes a temperature adjusting body, it is possible to perform an electrical inspection while keeping a printed circuit board to be inspected at a desired set temperature, and to detect defects under an environment of a desired set temperature. This can contribute to improving the detection rate.
　また、本発明のプリント基板検査システムは、上記したような検査治具を有しているので、プリント基板のみ所望温度に保持でき、プリント基板検査装置に含まれる精密機器等に対しては温度的な負荷を与えることを抑制することができる。このため、所望温度の環境下でのプリント基板の不良の検出を容易に行うことができる。 In addition, since the printed circuit board inspection system of the present invention has the inspection jig as described above, only the printed circuit board can be maintained at a desired temperature, and the temperature of a precision instrument included in the printed circuit board inspection apparatus is low. Can be suppressed. For this reason, it is possible to easily detect defects in the printed circuit board under an environment of a desired temperature.
本発明に係る高温検査システムの概略構成図である。1 is a schematic configuration diagram of a high temperature inspection system according to the present invention. 本発明の第１実施形態に係る検査治具の構成を一部を分解して示した斜視図である。It is the perspective view which decomposed | disassembled and showed the structure of the inspection jig which concerns on 1st Embodiment of this invention. 第１実施形態に係る第２保持アセンブリを分解して示した斜視図である。It is the perspective view which exploded and showed the 2nd holding assembly concerning a 1st embodiment. 本発明の第２実施形態に係る検査治具の構成を一部を分解して示した斜視図である。It is the perspective view which decomposed | disassembled and showed the structure of the inspection jig which concerns on 2nd Embodiment of this invention. 第２実施形態に係る第２保持アセンブリを分解して示した斜視図である。It is the perspective view which decomposed | disassembled and showed the 2nd holding | maintenance assembly which concerns on 2nd Embodiment.
（第１実施形態）
　本発明に係る検査治具２を含むプリント基板検査装置４を備えた高温検査システム（プリント基板検査システム）６について、図面を参照して以下に説明する。 (First embodiment)
A high-temperature inspection system (printed circuit board inspection system) 6 including a printed circuit board inspection apparatus 4 including an inspection jig 2 according to the present invention will be described below with reference to the drawings.
　高温検査システム６は、図１に示すように、検査対象のプリント基板８を８０℃～１２０℃といった高温に加熱することができる恒温槽１０と、この恒温槽１０にて加熱されたプリント基板８を搬送する搬送装置１２と、搬送装置１２により搬送されてきた高温状態のプリント基板８を受け取り、このプリント基板８の電気的な検査を行うプリント基板検査装置４とを備えている。 As shown in FIG. 1, the high temperature inspection system 6 includes a constant temperature bath 10 capable of heating a printed circuit board 8 to be inspected to a high temperature of 80 ° C. to 120 ° C., and a printed circuit board 8 heated in the constant temperature chamber 10. And a printed circuit board inspection apparatus 4 that receives the high-temperature printed circuit board 8 conveyed by the transportation apparatus 12 and performs an electrical inspection of the printed circuit board 8.
　恒温槽１０としては、特に限定されるものではなく、例えば、熱風循環型の恒温槽１０が用いられる。図１中、参照符号１４は、熱風発生装置を示している。 The temperature chamber 10 is not particularly limited, and for example, a hot air circulation type temperature chamber 10 is used. In FIG. 1, reference numeral 14 indicates a hot air generator.
　搬送装置１２としては、特に限定されるものではなく、例えば、耐熱性を備えたベルトコンベア１６等を用いることができる。また、プリント基板８が搬送中に温度低下を起こしてしまうことを抑制するため、搬送経路をフード１８で囲い、補助加熱装置２０を付加した構成とされている。 The transport device 12 is not particularly limited, and for example, a belt conveyor 16 having heat resistance can be used. Moreover, in order to suppress that the printed circuit board 8 raise | generates a temperature fall during conveyance, it is set as the structure which enclosed the conveyance path | route with the hood 18 and added the auxiliary heating apparatus 20. FIG.
　プリント基板検査装置４は、検査対象のプリント基板８を保持する検査治具２、検査治具２のアライメントを行うアライメント機構２２及び検査治具２に取り付けられた検査用プローブピンからの検査データを基にプリント基板の不良の検出を行う不良検出装置２４を含んでいる。 The printed circuit board inspection apparatus 4 receives inspection data from an inspection jig 2 that holds a printed circuit board 8 to be inspected, an alignment mechanism 22 that aligns the inspection jig 2, and an inspection probe pin attached to the inspection jig 2. A defect detection device 24 for detecting defects on the printed circuit board is included.
　検査治具２は、対向配置された第１保持アセンブリ２６及び第２保持アセンブリ２８からなり、これら第１保持アセンブリ２６及び第２保持アセンブリ２８の間にプリント基板８を挟んで保持する。ここで、プリント基板８は、第１面（図１中における下側）３０及びこの第１面３０とは反対側の第２面（図１中における上側）３２を有しており、プリント基板８の第１面３０側に位置する保持アセンブリを第１保持アセンブリ２６とし、プリント基板８の第２面３２側に位置する保持アセンブリを第２保持アセンブリ２８とする。つまり、第１保持アセンブリ２６はプリント基板８の第１面３０側を支え、第２保持アセンブリ２８はプリント基板８の第２面３２側を支える。 The inspection jig 2 includes a first holding assembly 26 and a second holding assembly 28 that are arranged to face each other, and holds the printed circuit board 8 between the first holding assembly 26 and the second holding assembly 28. Here, the printed circuit board 8 has a first surface (lower side in FIG. 1) 30 and a second surface (upper side in FIG. 1) 32 opposite to the first surface 30. A holding assembly positioned on the first surface 30 side of the first holding assembly 26 is referred to as a first holding assembly 26, and a holding assembly positioned on the second surface 32 side of the printed circuit board 8 is referred to as a second holding assembly 28. That is, the first holding assembly 26 supports the first surface 30 side of the printed circuit board 8, and the second holding assembly 28 supports the second surface 32 side of the printed circuit board 8.
　第１保持アセンブリ２６は、図２に示すように、検査用プローブピンとしての多数の第１プローブピン３４を保持する第１プローブピン保持体３６、この第１プローブピン保持体３６の第１プローブピン３４が突出している側に位置する第１加温ユニット（第１温度調節体）３８、及び、第１加温ユニット３８を挟んで第１プローブピン保持体３６とは反対側に位置する第１保護板４０を有しており、これら第１プローブピン保持体３６、第１加温ユニット３８及び第１保護板４０が組み合わされてなる。 As shown in FIG. 2, the first holding assembly 26 includes a first probe pin holding body 36 that holds a number of first probe pins 34 as inspection probe pins, and a first probe of the first probe pin holding body 36. A first heating unit (first temperature adjusting body) 38 located on the side where the pin 34 protrudes, and a first heating pin 38 located on the opposite side of the first probe pin holder 36 across the first heating unit 38. The first protection plate 40 is provided, and the first probe pin holder 36, the first heating unit 38, and the first protection plate 40 are combined.
　第１プローブピン保持体３６は、耐熱性及び絶縁性を併せ持つ樹脂製の板材からなる第１ベース４２と、この第１ベース４２に取り付けられた多数の第１プローブピン３４とを含む。 The first probe pin holder 36 includes a first base 42 made of a resin plate having both heat resistance and insulation, and a large number of first probe pins 34 attached to the first base 42.
　第１プローブピン３４は、筒状のピン本体と、このピン本体の基端から延びるリード線４４と、ピン本体に挿入され、ピン本体の先端から部分的に突出した接触子とを含んでいる。この接触子は、スプリングにより付勢されておりピン本体に対し突没自在であり、この接触子の先端が、プリント基板８の配線パターン４６におけるプローブピン当接箇所、すなわち検査点に直接接触する。 The first probe pin 34 includes a cylindrical pin body, a lead wire 44 extending from the base end of the pin body, and a contact inserted into the pin body and partially protruding from the tip of the pin body. . The contact is biased by a spring and can protrude and retract with respect to the pin body, and the tip of the contact directly contacts a probe pin contact portion on the wiring pattern 46 of the printed circuit board 8, that is, an inspection point. .
　第１ベース４２は、検査対象のプリント基板８の平面視形状よりも大きな矩形状をなし、第１面４８（図２中においてプリント基板８とは反対側の面）及びこの第１面４８とは反対側（図２中においてプリント基板８側の面）の第２面５０を有している。この第１ベース４２には、第１面４８から第２面５０にかけて貫通した多数のピン保持孔５２が設けられている。各ピン保持孔５２は、プリント基板８の配線パターン４６の検査点に対応した所定位置に設けられている。各ピン保持孔５２には、基端にリード線４４が取り付けられた第１プローブピン３４が、第１ベース４２の第１面４８側から挿通され、そして、第1プローブピン３４の先端側が第１ベース４２の第２面５０から所定長さだけ突出するように保持されている。一方、第１プローブピン３４の基端に取り付けられたリード線４４は、第１ベース４２の第１面４８側から延び、図２には示されていない不良検出装置２４に接続されている。これにより、第１プローブピン３４により検出したデータは不良検出装置２４へ送られる。 The first base 42 has a rectangular shape larger than the planar view shape of the printed circuit board 8 to be inspected. The first surface 48 (surface opposite to the printed circuit board 8 in FIG. 2) and the first surface 48 Has a second surface 50 on the opposite side (surface on the printed circuit board 8 side in FIG. 2). The first base 42 is provided with a large number of pin holding holes 52 penetrating from the first surface 48 to the second surface 50. Each pin holding hole 52 is provided at a predetermined position corresponding to the inspection point of the wiring pattern 46 of the printed circuit board 8. A first probe pin 34 with a lead wire 44 attached to the proximal end is inserted into each pin holding hole 52 from the first surface 48 side of the first base 42, and the distal end side of the first probe pin 34 is the first side. The first base 42 is held so as to protrude from the second surface 50 by a predetermined length. On the other hand, the lead wire 44 attached to the base end of the first probe pin 34 extends from the first surface 48 side of the first base 42 and is connected to the defect detection device 24 not shown in FIG. Thereby, the data detected by the first probe pin 34 is sent to the defect detection device 24.
　また、第１ベース４２の第２面５０上の所定位置には、ねじ穴４１が設けられている。このねじ穴４１は、図２から明らかなように、第１ベース４２の図２中における左側の２つの角部付近に１個ずつ、第１プローブピン３４の列のうち図２中において最も右側に位置する列の延長線上で且つこの列を挟む位置に１個ずつ、計４個のねじ穴４１が設けられている。 Further, a screw hole 41 is provided at a predetermined position on the second surface 50 of the first base 42. As is apparent from FIG. 2, one screw hole 41 is provided in the vicinity of the two left corners of the first base 42 in FIG. 2, and the rightmost in the row of the first probe pins 34 in FIG. A total of four screw holes 41 are provided, one on the extension line of the row located at a position sandwiching the row.
　更に、これらねじ穴４１上には、円筒状のスペーサ４３がそれぞれ配設されている。このスペーサ４３の中心貫通孔の直径は、上記したねじ穴４１の直径よりも大きい。このため、これらスペーサ４３は、ねじ穴４１内へ落ち込むことはなく、第１ベース４２の第２面５０上に立てられた状態で載置される。このとき、スペーサ４３の中心貫通孔の軸線はねじ穴４１の軸線と合致した状態とされる。
　なお、図２中参照符号４７で示す部分は、後述するガイドピン５８の逃げ孔（ガイドピン逃げ孔４７）である。 Further, cylindrical spacers 43 are disposed on the screw holes 41, respectively. The diameter of the central through hole of the spacer 43 is larger than the diameter of the screw hole 41 described above. For this reason, these spacers 43 do not fall into the screw holes 41 but are placed on the second surface 50 of the first base 42. At this time, the axis of the central through hole of the spacer 43 is in a state of being aligned with the axis of the screw hole 41.
In addition, the part shown with the referential mark 47 in FIG. 2 is the escape hole (guide pin escape hole 47) of the guide pin 58 mentioned later.
　第１加温ユニット３８は、図２から明らかなように、板状の第１加温プレート５４、この第１加温プレート５４上に配設された帯状のヒーター５６、及び、第１加温プレート５４から突出するように設けられたガイドピン５８を含んでいる。 As is apparent from FIG. 2, the first heating unit 38 includes a plate-like first heating plate 54, a belt-like heater 56 disposed on the first heating plate 54, and the first heating unit. A guide pin 58 provided so as to protrude from the plate 54 is included.
　第１加温プレート５４は、上記した第１プローブピン保持体３６よりも大きな矩形状をなしており、第１プローブピン保持体３６側の第１面（図２中においてプリント基板８とは反対側の面）６０及びこの第１面６０とは反対側の第２面６２（図２中においてプリント基板８側の面）を有している。また、この第１加温プレート５４の厚さは、上記したスペーサ４３の高さよりも僅かに薄い。換言すれば、スペーサ４３の中央貫通孔の軸線に沿った長さは、第１加温プレート５４の厚さよりも長く設定されている。好ましくは、スペーサ４３の高さは、第１加温プレート５４の厚さより０．１ｍｍ長く設定する。更に、第１加温プレート５４の外周縁のうち長手方向の両端縁には、上記した第１面６０及び第２面６２に沿った方向に部分的に突出した係合突出部６４，６４が設けられている。この係合突出部６４は、プリント基板検査装置４のアライメント機構２２に含まれるアライメントホルダ６７にガイドピン５８を含む第１加温プレート５４を固定する際に利用される。詳しくは、係合突出部６４にはねじ挿通孔６５が設けられており、このねじ挿通孔６５にプレート固定ねじ７１を通し、アライメントホルダ６７に設けられた雌ねじ孔６９にこのプレート固定ねじ７１を螺合することにより第１加温プレート５４をアライメントホルダ６７に固定することができる。 The first heating plate 54 has a rectangular shape larger than the first probe pin holder 36 described above, and is a first surface on the first probe pin holder 36 side (opposite to the printed circuit board 8 in FIG. 2). Side surface) 60 and a second surface 62 opposite to the first surface 60 (surface on the printed circuit board 8 side in FIG. 2). The thickness of the first heating plate 54 is slightly thinner than the height of the spacer 43 described above. In other words, the length along the axis of the central through hole of the spacer 43 is set to be longer than the thickness of the first heating plate 54. Preferably, the height of the spacer 43 is set to be 0.1 mm longer than the thickness of the first heating plate 54. Furthermore, engagement protrusions 64 and 64 that partially protrude in the direction along the first surface 60 and the second surface 62 are formed at both ends in the longitudinal direction of the outer peripheral edge of the first heating plate 54. Is provided. The engagement protrusion 64 is used when the first heating plate 54 including the guide pins 58 is fixed to the alignment holder 67 included in the alignment mechanism 22 of the printed circuit board inspection apparatus 4. Specifically, the engagement protrusion 64 is provided with a screw insertion hole 65, the plate fixing screw 71 is passed through the screw insertion hole 65, and the plate fixing screw 71 is inserted into the female screw hole 69 provided in the alignment holder 67. The first heating plate 54 can be fixed to the alignment holder 67 by screwing.
　この第１加温プレート５４としては、加熱された際に温度分布のむらが少なく、均等に加熱される熱伝導性に優れた熱伝導材料が用いられる。このような熱伝導材料としては、アルミニウムや銅といった金属、窒化アルミニウムといったセラミックスが挙げられる。本実施形態では、熱伝導率が高く、加工性にも優れることからアルミニウムからなる板材が用いられる。 As the first warming plate 54, a heat conductive material having little temperature distribution unevenness when heated and excellent in heat conductivity that is heated evenly is used. Examples of such a heat conductive material include metals such as aluminum and copper, and ceramics such as aluminum nitride. In this embodiment, a plate material made of aluminum is used because of its high thermal conductivity and excellent workability.
　この第１加温プレート５４は、図２から明らかなように、第１プローブピン保持体３６の多数の第１プローブピン３４に対応する箇所に、第１プローブピン３４との接触を避けるプローブピン逃げ孔６６が設けられている。これにより、第１加温ユニット３８と第１プローブピン保持体３６とが組み合わされる際、第１プローブピン３４がプローブピン逃げ孔６６の内壁に接触することなく挿通される。そして、各第１プローブピン３４は、各プローブピン逃げ孔６６のほぼ中心に余裕をもって位置付けられる。 As is apparent from FIG. 2, the first heating plate 54 is a probe pin that avoids contact with the first probe pin 34 at a position corresponding to the multiple first probe pins 34 of the first probe pin holder 36. An escape hole 66 is provided. Accordingly, when the first heating unit 38 and the first probe pin holder 36 are combined, the first probe pin 34 is inserted without contacting the inner wall of the probe pin escape hole 66. Each first probe pin 34 is positioned with a margin at the approximate center of each probe pin escape hole 66.
　第１加温プレート５４の第２面６２上には、プリント基板８の位置決めに用いられるガイドピン５８が設けられている。このガイドピン５８は、第１加温プレート５４の第２面６２上において、多数のプローブピン逃げ孔６６が設けられている領域の四隅にて、第１プローブピン保持体３６とは反対側、即ちプリント基板８側に向かって突出している。ここで、プリント基板８は、矩形状をなし、例えば、その四隅の部分の所定位置に上記したガイドピン５８を受け入れ可能な位置決め用のガイド孔６８を有している。このプリント基板８は、そのガイド孔６８と第１加温プレート５４のガイドピン５８とが係合するようにセットされることにより、第１加温プレート５４と一体化される。ここで、第１加温プレート５４の第２面６２上において、多数のプローブピン逃げ孔６６が設けられている領域及びこの領域の四隅に設けられたガイドピン５８が存在する領域を含む領域であって、プリント基板８と対応する領域をプリント基板対応領域７０と規定する。また、上記したガイドピン５８においては、その先端部がテーパー状に加工されている態様とすることが好ましい。これにより、ガイド孔６８とガイドピン５８とが係合しやすくなる。 On the second surface 62 of the first heating plate 54, guide pins 58 used for positioning the printed circuit board 8 are provided. The guide pins 58 are on the second surface 62 of the first heating plate 54 at the four corners of a region where a large number of probe pin escape holes 66 are provided, on the opposite side to the first probe pin holder 36. That is, it protrudes toward the printed circuit board 8 side. Here, the printed circuit board 8 has a rectangular shape, and has, for example, positioning guide holes 68 capable of receiving the above-described guide pins 58 at predetermined positions at four corners thereof. The printed circuit board 8 is integrated with the first heating plate 54 by setting the guide hole 68 and the guide pins 58 of the first heating plate 54 to engage with each other. Here, on the second surface 62 of the first heating plate 54, a region including a region where a large number of probe pin escape holes 66 are provided and a region where guide pins 58 provided at the four corners of this region are present. Therefore, an area corresponding to the printed circuit board 8 is defined as a printed circuit board corresponding area 70. Further, it is preferable that the above-described guide pin 58 has a shape in which a tip portion thereof is processed into a tapered shape. Thereby, the guide hole 68 and the guide pin 58 are easily engaged.
　また、このガイドピン５８は、図示しないスプリングにより第１加温プレート５４の第２面６２から突出する方向に付勢されており、この第２面６２に対して突没可能となっている。つまり、スプリングの付勢力に抗してガイドピン５８の先端が第１加温プレート５４側に押されると、ガイドピン５８は、第１加温プレート５４内へ押し込まれる。そして、押し込まれたガイドピン５８は、その基端側が第１加温プレート５４の第１面６０から突出する。このとき、このガイドピン５８の基端部は上記した第１ベース４２のガイドピン逃げ孔４７内に進入する。 Further, the guide pin 58 is biased in a direction protruding from the second surface 62 of the first heating plate 54 by a spring (not shown), and can project and retract with respect to the second surface 62. That is, when the tip of the guide pin 58 is pushed toward the first heating plate 54 against the biasing force of the spring, the guide pin 58 is pushed into the first heating plate 54. The guide pin 58 that has been pushed in protrudes from the first surface 60 of the first heating plate 54 at the base end side. At this time, the base end portion of the guide pin 58 enters the guide pin escape hole 47 of the first base 42 described above.
　また、第１加温プレート５４には、上記した第１ベース４２の第２面上にてスペーサ４３が配設されているねじ穴４１に対応する位置にスペーサ挿通孔７３が設けられている。このスペーサ挿通孔７３の直径は、スペーサ４３を余裕を持って挿通可能なだけの長さにされ、好ましくは、スペーサ４３の外径に対して４ｍｍ程度大きい値に設定される。 Further, the first heating plate 54 is provided with a spacer insertion hole 73 at a position corresponding to the screw hole 41 in which the spacer 43 is disposed on the second surface of the first base 42 described above. The diameter of the spacer insertion hole 73 is set to a length that allows the spacer 43 to be inserted with a margin, and is preferably set to a value about 4 mm larger than the outer diameter of the spacer 43.
　更に、第１加温プレート５４の第２面６２上においては、図２から明らかなように、上記したプリント基板対応領域７０を囲む位置に帯状のヒーター５６が配設されている。このヒーター５６としては、ガラス繊維製の布帛で保護されたニクロム線からなるリボンヒーター５６が用いられる。このリボンヒーター５６は、第１加温プレート５４の第２面６２上において、プリント基板対応領域７０を囲むようにＵ字状に形成され、固定されている。そして、リボンヒーター５６の端部からはリード線７２が延びており、このリード線７２の先端にはコネクタ７４が取り付けられている。このリード線７２は、コネクタ７４を介して温度制御装置（図示せず）と接続されている。 Furthermore, on the second surface 62 of the first heating plate 54, as is apparent from FIG. 2, a belt-like heater 56 is disposed at a position surrounding the above-described printed board corresponding region 70. As the heater 56, a ribbon heater 56 made of nichrome wire protected by a glass fiber cloth is used. The ribbon heater 56 is formed and fixed in a U shape so as to surround the printed board corresponding region 70 on the second surface 62 of the first heating plate 54. A lead wire 72 extends from the end of the ribbon heater 56, and a connector 74 is attached to the tip of the lead wire 72. The lead wire 72 is connected to a temperature control device (not shown) via a connector 74.
　次に、第１保護板４０は、耐熱性及び絶縁性を有する樹脂からなる矩形の板材である。この第１保護板４０は、プリント基板８の配線と第１加温ユニット３８の第１加温プレート５４とが不所望の位置で接触し電気的な短絡を起こさないようにするために配設される。また、第１保護板４０は第１プローブピン３４の曲がりを防ぐ役目も有している。 Next, the first protective plate 40 is a rectangular plate made of a resin having heat resistance and insulating properties. The first protection plate 40 is disposed so that the wiring of the printed circuit board 8 and the first heating plate 54 of the first heating unit 38 are not in contact with each other at an undesired position and cause an electrical short circuit. Is done. The first protective plate 40 also has a function of preventing the first probe pin 34 from being bent.
　この第１保護板４０は、少なくともプリント基板対応領域７０を覆う大きさを有している。但し、第１加温プレート５４上のリボンヒーター５６とはオーバーラップしない形状とされている。また、第１保護板４０の厚さは、リボンヒーター５６の厚さと同じかそれよりも厚いものを用いることが好ましい。つまり、リボンヒーター５６は第１保護板４０よりも厚さ方向に突出させないようにする。また、この第１保護板４０において要求される特性としては、耐熱性、絶縁性及び熱伝導性が挙げられる。第１保護板４０は、第１加温プレート５４と直接接触するか、または、第１加温プレート上に僅かなクリアランスを設けて配置されるため、第１加温プレートからの熱の影響を受けるので耐熱性を備えている必要がある。また、電気的な絶縁性を確保しつつ、第１加温プレート５４で発生した熱をプリント基板８に効率良く伝える必要があるため、絶縁性及び熱伝導性も必要となる。ここで、熱伝導性をより高めるために、第１保護板４０としては、なるべく薄いものを用いることが好ましい。これにともない、リボンヒーター５６もなるべく薄いものが採用される。 The first protective plate 40 has a size that covers at least the printed circuit board corresponding area 70. However, it does not overlap with the ribbon heater 56 on the first heating plate 54. Moreover, it is preferable that the thickness of the 1st protection board 40 is the same as that of the ribbon heater 56, or a thing thicker than it. That is, the ribbon heater 56 is prevented from projecting in the thickness direction from the first protection plate 40. Further, the characteristics required for the first protective plate 40 include heat resistance, insulation and thermal conductivity. Since the first protection plate 40 is disposed in direct contact with the first heating plate 54 or provided with a slight clearance on the first heating plate, the influence of heat from the first heating plate is reduced. It must be heat resistant. Moreover, since it is necessary to efficiently transfer the heat generated by the first heating plate 54 to the printed circuit board 8 while ensuring electrical insulation, insulation and thermal conductivity are also required. Here, in order to further increase the thermal conductivity, it is preferable to use the first protective plate 40 as thin as possible. Accordingly, a ribbon heater 56 that is as thin as possible is employed.
　第１保護板４０は、図２から明らかなように、矩形状をなしており、第１加温プレート５４側の第１面（図２中においてプリント基板８とは反対側の面）７６及びプリント基板８側の第２面（図２中においてプリント基板８側の面）７８を有する矩形状の板材である。この第１保護板４０には、第１加温プレート５４のガイドピン５８に対応する箇所にガイドピン挿通孔８０が設けられている。このガイドピン挿通孔８０の直径は、ガイドピン５８を余裕を持って挿通可能なだけの長さに設定され、好ましくは、ガイドピン５８の最外径に対して４ｍｍ程度大きい値に設定される。また、第１保護板４０には、第１加温プレート５４のプローブピン逃げ孔６６に対応する箇所、即ち、第１プローブピン３４に対応する箇所にピン挿通孔８２が設けられている。更に、第１保護板４０には、第１加温プレート５４のスペーサ挿通孔７３に対応する箇所、即ち、スペーサ４３及び第１ベース４２のねじ穴４１に対応する箇所にねじ挿通孔７５が設けられている。このねじ挿通孔７５の直径は、ねじ４５を挿通可能な長さであって、且つ、上記したスペーサ４３の中央貫通孔の直径よりも小さい長さに設定されている。 As is apparent from FIG. 2, the first protective plate 40 has a rectangular shape, and the first surface on the first heating plate 54 side (the surface opposite to the printed circuit board 8 in FIG. 2) 76 and This is a rectangular plate material having a second surface 78 on the printed circuit board 8 side (surface on the printed circuit board 8 side in FIG. 2) 78. The first protective plate 40 is provided with a guide pin insertion hole 80 at a location corresponding to the guide pin 58 of the first heating plate 54. The diameter of the guide pin insertion hole 80 is set to a length that allows the guide pin 58 to be inserted with a margin, and is preferably set to a value about 4 mm larger than the outermost diameter of the guide pin 58. . Further, the first protection plate 40 is provided with pin insertion holes 82 at locations corresponding to the probe pin escape holes 66 of the first heating plate 54, that is, locations corresponding to the first probe pins 34. Further, the first protective plate 40 is provided with screw insertion holes 75 at locations corresponding to the spacer insertion holes 73 of the first heating plate 54, that is, locations corresponding to the spacers 43 and the screw holes 41 of the first base 42. It has been. The diameter of the screw insertion hole 75 is a length that allows the screw 45 to be inserted, and is set to a length that is smaller than the diameter of the central through hole of the spacer 43 described above.
　以上説明した第１プローブピン保持体３６、第１加温ユニット３８及び第１保護板４０は、例えば、以下のようにして組み合わされる。 The first probe pin holder 36, the first heating unit 38, and the first protection plate 40 described above are combined as follows, for example.
　まず、第１プローブピン保持体３６及び第１加温ユニット３８が、第１プローブピン保持体３６の第１ベース４２の第２面５０と、第１加温ユニット３８の第１加温プレート５４の第１面６０とを突き合わせるようにして対向配置される。このとき、第１ベース４２の第２面５０上における各ねじ穴４１に対応する位置にスペーサ４３がそれぞれ配置され、そして、これらスペーサ４３は、それぞれ第１加温プレート５４のスペーサ挿通孔７３内に挿通される。また、各第１プローブピン３４は、第１加温プレート５４における対応する各プローブピン逃げ孔６６内にそれぞれ挿通され、第１加温プレート５４の第２面６２から所定長さ突出している。 First, the first probe pin holder 36 and the first heating unit 38 include the second surface 50 of the first base 42 of the first probe pin holder 36 and the first heating plate 54 of the first heating unit 38. The first surface 60 is opposed to the first surface 60. At this time, spacers 43 are respectively arranged at positions corresponding to the respective screw holes 41 on the second surface 50 of the first base 42, and these spacers 43 are respectively located in the spacer insertion holes 73 of the first heating plate 54. Is inserted. Each first probe pin 34 is inserted into a corresponding probe pin relief hole 66 in the first heating plate 54 and protrudes from the second surface 62 of the first heating plate 54 by a predetermined length.
　次いで、第１加温ユニット３８上に第１保護板４０が配置される。詳しくは、第１保護板４０は、その第１面７６が第１加温プレート５４の第２面６２と相対するように配置される。このとき、第１加温プレート５４の各プローブピン逃げ孔６６から突出している各第１プローブピン３４は、第１保護板４０における対応する各ピン挿通孔８２に挿通され、接触子部分が第１保護板４０の第２面７８から所定長さ突出している。また、第１加温プレート５４の各ガイドピン５８は、第１保護板４０における対応する各ガイドピン挿通孔８０に挿通され、第１保護板４０の第２面７８から所定長さ突出している。 Next, the first protection plate 40 is disposed on the first heating unit 38. Specifically, the first protection plate 40 is disposed such that the first surface 76 faces the second surface 62 of the first heating plate 54. At this time, each first probe pin 34 protruding from each probe pin escape hole 66 of the first heating plate 54 is inserted into each corresponding pin insertion hole 82 in the first protection plate 40, and the contact portion is the first one. The first protection plate 40 protrudes from the second surface 78 by a predetermined length. Each guide pin 58 of the first heating plate 54 is inserted into a corresponding guide pin insertion hole 80 in the first protection plate 40 and protrudes from the second surface 78 of the first protection plate 40 by a predetermined length. .
　この後、第１保護板４０の各ねじ挿通孔７５にねじ４５が挿通される。各ねじ４５は、第１加温プレート５４のスペーサ挿通孔７３内に収容された各スペーサ４３の中央貫通孔に通され、第１ベース４２における対応する各ねじ穴４１に螺合される。このとき、スペーサ４３の高さ寸法は、第１加温プレート５４の厚さよりも僅かに長いので、第１ベース４２と第１加温プレート５４との間及び第１保護板４０と第１加温プレート５４との間に僅かな隙間が設けられる。また、上記したように、スペーサ挿通孔７３はスペーサ４３に対し余裕をもって設けられており、プローブピン逃げ孔６６は第１プローブピン３４に対して余裕をもって設けられており、ガイドピン挿通孔８０はガイドピン５８に対して余裕をもって設けられている。このため、第１加温プレート５４、即ち、第１加温ユニット３８は、ある範囲内で第１面６０及び第２面６２に沿った方向への移動が可能である。 Thereafter, the screw 45 is inserted into each screw insertion hole 75 of the first protective plate 40. Each screw 45 is passed through the central through hole of each spacer 43 accommodated in the spacer insertion hole 73 of the first heating plate 54 and screwed into the corresponding screw hole 41 in the first base 42. At this time, since the height dimension of the spacer 43 is slightly longer than the thickness of the first heating plate 54, it is between the first base 42 and the first heating plate 54 and between the first protection plate 40 and the first heating plate 54. A slight gap is provided between the hot plate 54 and the hot plate 54. As described above, the spacer insertion hole 73 is provided with a margin with respect to the spacer 43, the probe pin escape hole 66 is provided with a margin with respect to the first probe pin 34, and the guide pin insertion hole 80 is The guide pin 58 is provided with a margin. For this reason, the 1st heating plate 54, ie, the 1st heating unit 38, can move to the direction along the 1st surface 60 and the 2nd surface 62 within a certain range.
　ここで、第１加温プレート５４の移動を可能にするために設けられた第１ベース４２と第１加温プレート５４との間及び第１保護板４０と第１加温プレート５４との間に設けられた隙間は、極めて小さいので、加熱された第１加温プレート５４の熱は第１保護板４０を介してプリント基板８に均等且つ充分に伝わる。 Here, between the 1st base 42 provided in order to enable movement of the 1st warming plate 54 and the 1st warming plate 54, and between the 1st protection board 40 and the 1st warming plate 54 Since the gap provided in is extremely small, the heat of the heated first heating plate 54 is evenly and sufficiently transmitted to the printed circuit board 8 through the first protective plate 40.
　このようにして、第１加温ユニット３８が平面方向に僅かに移動可能な状態で第１プローブピン保持体３６と第１保護板４０との間に挟まれた状態で組み合わされてなる第１保持アセンブリ２６が得られる。 In this way, the first heating unit 38 is combined in a state of being sandwiched between the first probe pin holder 36 and the first protective plate 40 while being slightly movable in the plane direction. A retention assembly 26 is obtained.
　なお、以上説明したように第１保持アセンブリ２６は、第１ベース４２の第２面５０上の四隅にスペーサ４３を各１個ずつ計４個備えており、これらスペーサ４３に対応して、第１ベース４２のねじ穴４１、第１加温プレート５４のスペーサ挿通孔７３及びねじ４５をそれぞれ４個ずつ備えているが、本発明はこの態様に限定されるものではなく、スペーサ４３の数及び配設位置は任意に設定することができ、それにともない、ねじ穴４１、第１加温プレート５４のスペーサ挿通孔７３及びねじ４５もそれぞれスペーサ４３に対応するように配設される。第１保持アセンブリ２６では、スペーサ４３の設置によって、第１ベース４２と保護板４０との間に第１加温プレート５４の板厚以上のスペースを確保し、第１加温プレート５４がＸ－Ｙ－θ方向に移動可能としている。また、プリント基板８を第１保持アセンブリ２６と第２保持アセンブリ２８とで挟む際にプリント基板８に掛かる荷重を保護板４０を介してスペーサ４３が受けるため、スペーサ４３は、相応の数量だけバランスよく配置される必要がある。よって、高い荷重が掛かる場合には、スペーサ４３は、より多くの箇所、例えば、１０数箇所の任意の位置にそれぞれ配置しても構わない。 As described above, the first holding assembly 26 includes four spacers 43 in each of the four corners on the second surface 50 of the first base 42, and corresponding to the spacers 43, Although the four screw holes 41 of the first base 42, four spacer insertion holes 73 of the first heating plate 54, and four screws 45 are provided, the present invention is not limited to this mode. Arrangement positions can be arbitrarily set. Accordingly, the screw holes 41, the spacer insertion holes 73 of the first heating plate 54, and the screws 45 are also arranged so as to correspond to the spacers 43, respectively. In the first holding assembly 26, by installing the spacer 43, a space larger than the thickness of the first heating plate 54 is secured between the first base 42 and the protection plate 40, and the first heating plate 54 is X−. It is possible to move in the Y-θ direction. Further, since the spacer 43 receives the load applied to the printed circuit board 8 through the protective plate 40 when the printed circuit board 8 is sandwiched between the first holding assembly 26 and the second holding assembly 28, the spacer 43 is balanced by an appropriate amount. It needs to be well placed. Therefore, when a high load is applied, the spacers 43 may be arranged at more locations, for example, at arbitrary positions of a dozen locations.
　一方、第２保持アセンブリ２８は、第１保持アセンブリ２６を構成するパーツとほぼ同じパーツにより構成されている。第２保持アセンブリ２８の構成については、図３を参照して以下に説明する。なお、第１保持アセンブリ２６に含まれる部位と同じ構造を有し、同じ機能を発揮する部位については、同じ参照符号を付して詳しい説明は省略する。 On the other hand, the second holding assembly 28 is constituted by almost the same parts as the parts constituting the first holding assembly 26. The configuration of the second holding assembly 28 will be described below with reference to FIG. In addition, about the site | part which has the same structure as the site | part contained in the 1st holding assembly 26, and exhibits the same function, the same referential mark is attached | subjected and detailed description is abbreviate | omitted.
　第２保持アセンブリ２８は、図３に示すように、検査用プローブピンとしての多数の第２プローブピン１３４を保持する第２プローブピン保持体８４、この第２プローブピン保持体８４の第２プローブピンが突出している側に位置する第２加温ユニット（第２温度調節体）８６、及び、第２加温ユニット８６を挟んで第２プローブピン保持体８４とは反対側に位置する第２保護板８７を有している。 As shown in FIG. 3, the second holding assembly 28 includes a second probe pin holder 84 that holds a number of second probe pins 134 as inspection probe pins, and a second probe of the second probe pin holder 84. A second heating unit (second temperature adjusting body) 86 positioned on the side where the pin protrudes, and a second heating unit 86 positioned on the opposite side of the second probe pin holding body 84 across the second heating unit 86. A protective plate 87 is provided.
　第２プローブピン保持体８４は、第１ベース４２と同じ形状の第２ベース１４２が第１プローブピン３４と同じ構成の第２プローブピン１３４を多数保持しており、スペーサ４３が配設されないことを除いて上記した第１プローブピン保持体３６と同じ構造をなしている。なお、参照符号１４７はガイドピン逃げ孔を示す。第２ベース１４２におけるガイドピン逃げ孔１４７は、ガイドピン５８の先端を受け入れる逃げ孔である。詳しくは、ガイドピン５８の先端は、円錐形状をなしているため、第１保持アセンブリ２６及び第２保持アセンブリ２８の間にプリント基板８を挟んで保持する際、プリント基板８のガイド孔６８から若干第２保持アセンブリ２８側に突出する。この場合、ガイドピン５８の先端が第２ベース１４２に突き当たることを避けるために、第２ベース１４２においては、ガイドピン５８に対応する位置にガイドピン逃げ孔１４７が設けられている。 In the second probe pin holder 84, the second base 142 having the same shape as the first base 42 holds many second probe pins 134 having the same configuration as the first probe pin 34, and the spacer 43 is not disposed. Except for, the first probe pin holder 36 has the same structure. Reference numeral 147 indicates a guide pin escape hole. The guide pin clearance hole 147 in the second base 142 is a clearance hole that receives the tip of the guide pin 58. Specifically, since the tip of the guide pin 58 has a conical shape, when the printed board 8 is held between the first holding assembly 26 and the second holding assembly 28, the guide pin 58 extends from the guide hole 68 of the printed board 8. It slightly protrudes toward the second holding assembly 28 side. In this case, in order to avoid the tip of the guide pin 58 from hitting the second base 142, the second base 142 is provided with a guide pin escape hole 147 at a position corresponding to the guide pin 58.
　第２加温ユニット８６は、第２加温プレート８８及びこの第２加温プレート８８に配設されたリボンヒーター５６を有している。 The second heating unit 86 includes a second heating plate 88 and a ribbon heater 56 disposed on the second heating plate 88.
　この第２加温プレート８８は、ガイドピン５８及び係合突出部６４を備えておらず、スペーサ挿通孔７３の代わりにスペーサ挿通孔７３よりも小さいねじ挿通孔１７３を備え、更にガイドピン５８に対応する位置にガイドピン逃げ孔１５８を備えていること以外は、上記した第１加温ユニット３８と同じである。 The second heating plate 88 does not include the guide pin 58 and the engagement protrusion 64, and includes a screw insertion hole 173 smaller than the spacer insertion hole 73 instead of the spacer insertion hole 73. The first heating unit 38 is the same as the first heating unit 38 except that a guide pin escape hole 158 is provided at a corresponding position.
　ねじ挿通孔１７３は、第２プローブピン保持体８４のねじ穴４１に対応する位置に、ねじ４５の挿通を許容する直径の孔をあけることにより設けられている。
　また、ガイドピン逃げ孔１５８は、第２ベース１４２のガイドピン逃げ孔１４７と連通しており、ガイドピン５８の挿通を許容する。 The screw insertion hole 173 is provided by making a hole having a diameter that allows the screw 45 to be inserted at a position corresponding to the screw hole 41 of the second probe pin holder 84.
The guide pin escape hole 158 communicates with the guide pin relief hole 147 of the second base 142 and allows the guide pin 58 to be inserted.
　第２保護板８７は、ガイドピン挿通孔８０の代わりにガイドピン逃げ孔１８０を備えていること以外は、上記した第１保護板４０と同じ構造をなしている。ここで、ガイドピン逃げ孔１８０は、ガイドピン５８の先端を受け入れる逃げ孔であり、第２加温プレート８８のガイドピン逃げ孔１５８と連通している。 The second protective plate 87 has the same structure as the first protective plate 40 described above except that a guide pin escape hole 180 is provided instead of the guide pin insertion hole 80. Here, the guide pin relief hole 180 is a relief hole that receives the tip of the guide pin 58 and communicates with the guide pin relief hole 158 of the second heating plate 88.
　これら第２プローブピン保持体８４、第２加温ユニット８６及び第２保護板８７は、上記した第１保持アセンブリ２６の場合と同様にして組み合わされることにより第２保持アセンブリ２８に形成される。詳しくは、第２プローブピン保持体８４及び第２加温ユニット８６が、第２プローブピン保持体８４の第２ベース１４２の第２面５０と、第２加温ユニット８６の第２加温プレート８８の第１面６０とを突き合わせるようにして対向配置される。これにより、各第２プローブピン１３４は、第２加温プレート８８における対応する各プローブピン逃げ孔６６内にそれぞれ挿通され、第２加温プレート８８の第２面６２から所定長さ突出している。 The second probe pin holder 84, the second heating unit 86, and the second protection plate 87 are formed in the second holding assembly 28 by being combined in the same manner as in the case of the first holding assembly 26 described above. Specifically, the second probe pin holder 84 and the second heating unit 86 include the second surface 50 of the second base 142 of the second probe pin holder 84 and the second heating plate of the second heating unit 86. The first surfaces 60 of the 88 are opposed to each other. Accordingly, each second probe pin 134 is inserted into each corresponding probe pin escape hole 66 in the second heating plate 88 and protrudes from the second surface 62 of the second heating plate 88 by a predetermined length. .
　次いで、第２加温ユニット８６上に第２保護板８７が配置される。詳しくは、第２保護板８７は、その第１面７６が第２加温プレート８８の第２面６２と相対するように配置される。このとき、第２加温プレート８８の各プローブピン逃げ孔６６から突出している各第２プローブピン１３４は、第２保護板８７における対応する各ピン挿通孔８２に挿通され、接触子部分が第２保護板８７の第２面７８から所定長さ突出している。 Next, the second protection plate 87 is disposed on the second heating unit 86. Specifically, the second protective plate 87 is disposed such that the first surface 76 faces the second surface 62 of the second heating plate 88. At this time, each second probe pin 134 protruding from each probe pin escape hole 66 of the second heating plate 88 is inserted into the corresponding pin insertion hole 82 in the second protection plate 87, and the contact portion is the first. 2 A predetermined length protrudes from the second surface 78 of the protective plate 87.
　この後、第２保護板８７の各ねじ挿通孔７５にねじ４５が挿通される。各ねじ４５は、第２加温プレート８８のねじ挿通孔１７３に通され、第２ベース１４２における対応する各ねじ穴４１に螺合される。これにより、第２プローブピン保持体８４、第２加温ユニット８６及び第２保護板８７は、ねじ止めされて第２保持アセンブリ２８に形成される。この第２保持アセンブリ２８は、第１保持アセンブリ２６とは異なり、第２加温プレート８８、即ち、第２加温ユニット８６は、第１面６０及び第２面６２に沿った方向への移動はできない。 Thereafter, the screw 45 is inserted into each screw insertion hole 75 of the second protective plate 87. Each screw 45 is passed through the screw insertion hole 173 of the second heating plate 88 and screwed into the corresponding screw hole 41 in the second base 142. As a result, the second probe pin holder 84, the second heating unit 86, and the second protection plate 87 are screwed to form the second holding assembly 28. The second holding assembly 28 is different from the first holding assembly 26 in that the second heating plate 88, that is, the second heating unit 86 moves in the direction along the first surface 60 and the second surface 62. I can't.
　以上のようにして得られた第１保持アセンブリ２６と第２保持アセンブリ２８とは、プリント基板検査装置４のアライメント機構２２に含まれるアライメント装置に装着される。かかる装着の手順を以下に示す。 The first holding assembly 26 and the second holding assembly 28 obtained as described above are attached to an alignment apparatus included in the alignment mechanism 22 of the printed circuit board inspection apparatus 4. The procedure for such mounting is shown below.
　まず、第１保持アセンブリ２６が第１保持アセンブリ用のアライメント装置としての第１アライメント装置に装着される。詳しくは、第１ベース４２の第１面４８が第１アライメント装置の第１固定ステージ（図示せず）に多数の支柱（図示せず）を介して接続される。ここで、これら支柱により、第１ベース４２と第１固定ステージとの間には配線スペースを確保することができる。この配線スペースには、第１ベース４２の第１面４８から延びるリード線４４を通すことができる。 First, the first holding assembly 26 is mounted on a first alignment device as an alignment device for the first holding assembly. Specifically, the first surface 48 of the first base 42 is connected to a first fixed stage (not shown) of the first alignment apparatus via a number of columns (not shown). Here, with these support columns, a wiring space can be secured between the first base 42 and the first fixed stage. The lead wire 44 extending from the first surface 48 of the first base 42 can be passed through the wiring space.
　更に、第１アライメント装置の第１アライメント機構部の所定位置より延びるアライメントホルダ６７に第１加温プレート５４を固定する。詳しくは、図２に示すように、第１加温プレート５４の係合突出部６４をアライメントホルダ６７に載置する。そして、係合突出部６４のねじ挿通孔６５にプレート固定ねじ７１を通し、このプレート固定ねじ７１をアライメントホルダ６７の雌ねじ孔６９に螺合することにより、第１加温プレート５４はアライメントホルダ６７にねじ止めされる。これにより、第１加温プレート５４は、第１アライメント機構部により駆動されるアライメントホルダ６７の動きに従って移動が可能となる。 Further, the first heating plate 54 is fixed to the alignment holder 67 extending from a predetermined position of the first alignment mechanism portion of the first alignment apparatus. Specifically, as shown in FIG. 2, the engagement protrusion 64 of the first heating plate 54 is placed on the alignment holder 67. Then, the plate fixing screw 71 is passed through the screw insertion hole 65 of the engagement protrusion 64, and the plate heating screw 71 is screwed into the female screw hole 69 of the alignment holder 67, whereby the first heating plate 54 is aligned with the alignment holder 67. Screwed on. Thereby, the 1st heating plate 54 becomes movable according to the motion of the alignment holder 67 driven by the 1st alignment mechanism part.
　一方、第２保持アセンブリ２８は、第２保持アセンブリ用のアライメント装置としての第２アライメント装置に装着される。詳しくは、第２ベース１４２の第１面４８が第２アライメント装置の第２アライメント機構部により駆動される可動ステージ（図示せず）に多数の支柱（図示せず）を介して接続される。ここで、これら支柱により、第２ベース１４２と可動ステージとの間には配線スペースを確保することができる。この配線スペースには、第２ベース１４２の第１面４８から延びるリード線４４を通すことができる。この第２保持アセンブリは、全体が、第２アライメント機構部により駆動される可動ステージの動きに従って移動する。 On the other hand, the second holding assembly 28 is attached to a second alignment device as an alignment device for the second holding assembly. Specifically, the first surface 48 of the second base 142 is connected to a movable stage (not shown) driven by the second alignment mechanism part of the second alignment device via a number of columns (not shown). Here, with these support columns, a wiring space can be secured between the second base 142 and the movable stage. The lead wire 44 extending from the first surface 48 of the second base 142 can be passed through the wiring space. The entire second holding assembly moves in accordance with the movement of the movable stage driven by the second alignment mechanism unit.
　以上のようにしてアライメント機構２２の所定位置にて対向配置された第１保持アセンブリ２６と第２保持アセンブリ２８とは、対をなして検査治具２を形成する。ここで、アライメント機構は、プリント基板８の位置と第１及び第２保持アセンブリの位置とを認識する光学カメラと、この光学カメラにより得られた情報から第１及び第２保持アセンブリの検査用プローブピンとプリント基板８における対応するプローブピン当接箇所（検査点）との位置ずれを検出する位置ずれ検出機構とを含み、この位置ずれ検出機構の検出データを基に第１及び第２アライメント装置を駆動して位置ずれを補正する（何れも図示せず）。 As described above, the first holding assembly 26 and the second holding assembly 28 that are arranged to face each other at a predetermined position of the alignment mechanism 22 form a pair to form the inspection jig 2. Here, the alignment mechanism includes an optical camera that recognizes the position of the printed circuit board 8 and the positions of the first and second holding assemblies, and an inspection probe for the first and second holding assemblies from the information obtained by the optical camera. And a misalignment detection mechanism for detecting misalignment between the pin and the corresponding probe pin contact portion (inspection point) on the printed circuit board 8, and the first and second alignment devices are arranged based on the detection data of the misalignment detection mechanism. Drive to correct misalignment (both not shown).
　なお、リボンヒーター５６のコネクタ７４は図示しない温度制御装置に接続され、第１及び第２プローブピンのリード線４４はそれぞれ不良検出装置２４に接続される。 The connector 74 of the ribbon heater 56 is connected to a temperature control device (not shown), and the lead wires 44 of the first and second probe pins are connected to the defect detection device 24, respectively.
　上記したような検査治具２を有するプリント基板検査装置４を備えた高温検査システム６を用いてプリント基板８の高温検査を行う手順を以下に説明する。 A procedure for performing a high temperature inspection of the printed circuit board 8 using the high temperature inspection system 6 including the printed circuit board inspection apparatus 4 having the inspection jig 2 as described above will be described below.
　まず、検査対象のプリント基板８を準備する。準備されたプリント基板８は、恒温槽１０内に収容される。このとき、恒温槽１０内の温度を８０℃～１２０℃に設定し、この状態で５分～６０分間保持する。これにより、プリント基板８を所望の設定温度に均等に加熱する。所望の設定温度に加熱されたプリント基板８は、搬送装置１２によりプリント基板検査装置４に向かって搬送され、検査治具２に受け渡される。このとき、検査治具２は、第１加温プレート５４及び第２加温プレート８６に設置された各リボンヒーター５６に通電することによりプリント基板８と同じ所望の設定温度に加熱されている。 First, a printed circuit board 8 to be inspected is prepared. The prepared printed circuit board 8 is accommodated in the constant temperature bath 10. At this time, the temperature in the thermostat 10 is set to 80 ° C. to 120 ° C., and this state is maintained for 5 minutes to 60 minutes. Thereby, the printed circuit board 8 is heated uniformly to a desired set temperature. The printed circuit board 8 heated to a desired set temperature is transported toward the printed circuit board inspection device 4 by the transport device 12 and delivered to the inspection jig 2. At this time, the inspection jig 2 is heated to the same desired set temperature as that of the printed circuit board 8 by energizing each ribbon heater 56 installed on the first heating plate 54 and the second heating plate 86.
　検査治具２は、プリント基板８を受け渡された後、かかるプリント基板８を把持する。詳しくは、プリント基板８は、まず、第１保持アセンブリ２６上に載置される。このとき、プリント基板８のガイド孔６８に、第１保持アセンブリ２６のガイドピン５８が係合されることにより、プリント基板８が第１加温プレート５４に固定され第１加温プレート５４と一体化される。このため、第１加温プレート５４を第１アライメント機構部により移動させることによりプリント基板８の位置の調節が行える。このとき、光学カメラを用い第１保持アセンブリ２６の位置と、プリント基板８の所定位置に設けられたアライメントマークの位置とを読み取り、第１プローブピン３４とプリント基板８とがどの程度ずれているかを検出する。そして、そのずれている分だけ第１加温プレート５４、即ち、プリント基板８を動かし、プリント基板８の第１面３０側の配線パターンの検査点と第１プローブピン３４との位置合わせを行う。 The inspection jig 2 grips the printed circuit board 8 after the printed circuit board 8 is delivered. Specifically, the printed circuit board 8 is first placed on the first holding assembly 26. At this time, the guide pin 58 of the first holding assembly 26 is engaged with the guide hole 68 of the printed board 8, whereby the printed board 8 is fixed to the first heating plate 54 and integrated with the first heating plate 54. It becomes. For this reason, the position of the printed circuit board 8 can be adjusted by moving the first heating plate 54 by the first alignment mechanism. At this time, the position of the first holding assembly 26 and the position of the alignment mark provided at a predetermined position of the printed board 8 are read using an optical camera, and how much the first probe pin 34 and the printed board 8 are displaced. Is detected. Then, the first heating plate 54, that is, the printed circuit board 8 is moved by the amount of the shift, and the inspection point of the wiring pattern on the first surface 30 side of the printed circuit board 8 and the first probe pin 34 are aligned. .
　その後、第２保持アセンブリ２８の位置合わせが行われる。詳しくは、プリント基板８のアライメントマークの位置と、第２保持アセンブリ２８の位置とを光学カメラで読み取り、第２保持アセンブリ２８と第１保持アセンブリ２６上のプリント基板８とがどの程度ずれているか検出する。そして、そのずれている分だけ可動ステージを移動させることにより、第２保持アセンブリ２８の全体を動かし、プリント基板の第２面３２側の配線パターンの検査点と第２プローブピン１３４との位置合わせを行う。 Thereafter, the second holding assembly 28 is aligned. Specifically, the position of the alignment mark on the printed circuit board 8 and the position of the second holding assembly 28 are read by an optical camera, and how much the second holding assembly 28 and the printed circuit board 8 on the first holding assembly 26 are misaligned. To detect. Then, by moving the movable stage by the amount shifted, the entire second holding assembly 28 is moved, and the inspection point of the wiring pattern on the second surface 32 side of the printed circuit board and the second probe pin 134 are aligned. I do.
　その後、第１保持アセンブリ２６と第２保持アセンブリ２８とは、互いに近付く方向に移動させられ、プリント基板８を第１保持アセンブリ２６と第２保持アセンブリ２８との間に挟んだ状態で保持する。これにより、第１保持アセンブリ２６側の各第１プローブピン３４は、プリント基板８の第１面３０側の対応する検査点と接触し、第２保持アセンブリ２８側の各第２プローブピンは、プリント基板８の第２面３２側の対応する検査点と接触するので、プリント基板８に対して各種電気的な検査を行うことができる。 Thereafter, the first holding assembly 26 and the second holding assembly 28 are moved toward each other, and hold the printed circuit board 8 in a state of being sandwiched between the first holding assembly 26 and the second holding assembly 28. Thus, each first probe pin 34 on the first holding assembly 26 side comes into contact with a corresponding inspection point on the first surface 30 side of the printed circuit board 8, and each second probe pin on the second holding assembly 28 side is Since it contacts with the corresponding inspection point on the second surface 32 side of the printed circuit board 8, various electrical inspections can be performed on the printed circuit board 8.
　ここで、各第１及び第２プローブピンの接触子は、第１保護板４０のピン挿通孔８２及び第２保護板のピン挿通孔８２からそれぞれ僅かに突出しており、プリント基板８と接触することによりそれぞれのピン本体内に没入する。これにより、各第１及び第２プローブピンは、ピン挿通孔内に没入することになる。但し、これら接触子は、スプリングにより付勢されているので、配線パターンのプローブピン当接箇所（検査点）との当接した状態は維持されている。そして、接触子が没入したことにともない、プリント基板８の第１面３０と第１保護板４０とが面接触し、プリント基板８の第２面３２と第２保護板とが面接触する。本実施形態の検査治具２では、第１及び第２保持アセンブリに含まれる第１及び第２加温プレートが、熱伝導性に優れるアルミニウムからなるので、これら加温プレートを温度むらの発生を抑えつつ全体的に均等な温度となるように加熱することができる。加温プレートの熱は、第１保護板及び第２保護板を介して面接触しているプリント基板８に伝わるため、プリント基板８を所望の設定温度に均等に加熱でき、この状態を維持することができる。よって、本発明によれば、プリント基板８を高温に維持することができ、効率良くプリント基板８の温度低下を防ぐことが可能となるので、高温状態のままでの電気的検査が容易に行うことができる。また、本発明によれば、プリント基板検査装置４に付随する光学カメラ等を恒温槽１０に入れる必要がないので、光学カメラ等の精密機器に熱による負荷を与える不具合を回避しつつ、プリント基板８の高温での電気的検査を行うことができる。 Here, the contacts of the first and second probe pins slightly protrude from the pin insertion hole 82 of the first protection plate 40 and the pin insertion hole 82 of the second protection plate, respectively, and come into contact with the printed circuit board 8. Immerse it in each pin body. Thereby, each 1st and 2nd probe pin will be immersed in a pin insertion hole. However, since these contacts are urged by a spring, the contact state with the probe pin contact portion (inspection point) of the wiring pattern is maintained. As the contact is immersed, the first surface 30 of the printed circuit board 8 and the first protective plate 40 are in surface contact, and the second surface 32 of the printed circuit board 8 and the second protective plate are in surface contact. In the inspection jig 2 according to the present embodiment, the first and second heating plates included in the first and second holding assemblies are made of aluminum having excellent thermal conductivity. It can heat so that it may become uniform temperature as a whole, restraining. Since the heat of the heating plate is transmitted to the printed circuit board 8 in surface contact via the first protective plate and the second protective plate, the printed circuit board 8 can be evenly heated to a desired set temperature, and this state is maintained. be able to. Therefore, according to the present invention, the printed circuit board 8 can be maintained at a high temperature and the temperature of the printed circuit board 8 can be efficiently prevented from being lowered. Therefore, an electrical inspection can be easily performed in a high temperature state. be able to. Further, according to the present invention, since there is no need to put an optical camera or the like associated with the printed circuit board inspection apparatus 4 in the thermostat 10, the printed circuit board can be avoided while avoiding the problem of applying a heat load to precision equipment such as the optical camera. Electrical inspection at a high temperature of 8 can be performed.
（第２実施形態）
　次に、第２実施形態に係る検査治具１０２を含むプリント基板検査装置４を備えた高温検査システム（プリント基板検査システム）６について説明する。なお、第２実施形態を説明するにあたり、既に説明した第１実施形態と同一の機能を発揮する部材および部位には同一の参照符号を付して、これらの説明は省略し、相違する点のみを説明する。 (Second Embodiment)
Next, a high temperature inspection system (printed circuit board inspection system) 6 including the printed circuit board inspection apparatus 4 including the inspection jig 102 according to the second embodiment will be described. In the description of the second embodiment, members and parts that exhibit the same functions as those of the first embodiment already described are denoted by the same reference numerals, description thereof is omitted, and only differences are described. Will be explained.
　図４は、第２実施形態の検査治具１０２を示し、図５は、第２実施形態の第２アセンブリ１２８を示す。 FIG. 4 shows the inspection jig 102 of the second embodiment, and FIG. 5 shows the second assembly 128 of the second embodiment.
　第２実施形態に係る検査治具１０２は、第１アセンブリ１２６の第１加温ユニット１３８の態様が第１実施形態における第１加温ユニット３８の態様と異なっているとともに、第２アセンブリ１２８の第２加温ユニット１８６の態様が第１実施形態における第２加温ユニット８６の態様と異なっている。詳しくは、第１加温ユニット１３８では、図４から明らかなように、第１加温プレート５４の第１面６０側にて、第１ベース４２を避けるようにしてＵ字状にリボンヒーター５６が配設されている。一方、第２加温ユニット１８６では、図４及び図５から明らかなように、第２加温プレート８８の第１面６０側にて、第２ベース１４２を避けるようにしてＵ字状にリボンヒーター５６が配設されている。 In the inspection jig 102 according to the second embodiment, the aspect of the first heating unit 138 of the first assembly 126 is different from the aspect of the first heating unit 38 in the first embodiment. The aspect of the 2nd heating unit 186 is different from the aspect of the 2nd heating unit 86 in 1st Embodiment. Specifically, in the first heating unit 138, as is apparent from FIG. 4, the ribbon heater 56 is formed in a U shape so as to avoid the first base 42 on the first surface 60 side of the first heating plate 54. Is arranged. On the other hand, in the second heating unit 186, as is apparent from FIGS. 4 and 5, the ribbon is formed in a U shape so as to avoid the second base 142 on the first surface 60 side of the second heating plate 88. A heater 56 is provided.
　この態様によれば、第１加温ユニット１３８における第１加温プレート５４の第２面６２及び第２加温ユニット１８６における第２加温プレート８８の第２面６２にリボンヒーター５６が存在していない、即ち、プリント基板８側の面にリボンヒーター５６が存在しないので、リボンヒーター５６の高さ（厚み）については大きな制限を設ける必要がなくなる。このため、第２実施形態の検査治具１０２は、より薄いプリント基板８の検査を行うのに好適である。 According to this aspect, the ribbon heater 56 exists on the second surface 62 of the first heating plate 54 in the first heating unit 138 and the second surface 62 of the second heating plate 88 in the second heating unit 186. In other words, since the ribbon heater 56 does not exist on the surface on the printed circuit board 8 side, there is no need to provide a great restriction on the height (thickness) of the ribbon heater 56. For this reason, the inspection jig 102 of the second embodiment is suitable for inspecting a thinner printed circuit board 8.
（実施例）
実施例１
　槽内温度が１００℃に設定された恒温槽１０内にプリント基板８を収容し、７分間保持した。７分間保持した後のプリント基板８の温度を測定したところ１００℃であった。その後、恒温槽１０から取り出されたプリント基板８は、搬送装置１２により搬送されプリント基板検査装置４の検査治具２にセットされた。この検査治具２は、図２に示したような上記した本発明の第１実施形態に係る検査治具２であり、第１加温プレート５４及び第２加温プレート８８がアルミニウムからなり、それぞれリボンヒーター５６が取り付けられている。そして、かかるリボンヒーター５６に通電し、第１加温プレート５４及び第２加温プレート８８の温度を１００℃とした。この状態でプリント基板８の配線パターンの導通検査を行った。この検査中のプリント基板８の温度を測定した結果、プリント基板の温度は１００℃であった。 (Example)
Example 1
The printed circuit board 8 was accommodated in the thermostat 10 set to 100 degreeC in the tank, and was hold | maintained for 7 minutes. It was 100 degreeC when the temperature of the printed circuit board 8 after hold | maintaining for 7 minutes was measured. Thereafter, the printed circuit board 8 taken out from the thermostatic chamber 10 was transported by the transport device 12 and set on the inspection jig 2 of the printed circuit board inspection device 4. This inspection jig 2 is the inspection jig 2 according to the first embodiment of the present invention as shown in FIG. 2, and the first heating plate 54 and the second heating plate 88 are made of aluminum, A ribbon heater 56 is attached to each. The ribbon heater 56 was energized, and the temperature of the first heating plate 54 and the second heating plate 88 was set to 100 ° C. In this state, the continuity test of the wiring pattern of the printed circuit board 8 was performed. As a result of measuring the temperature of the printed circuit board 8 during the inspection, the temperature of the printed circuit board was 100 ° C.
　このように、本実施例の検査治具２は、電気的な検査中に１００℃といった高温状態を維持できているので、高温環境下での不良の検出率の向上に寄与する。 Thus, since the inspection jig 2 of the present embodiment can maintain a high temperature state such as 100 ° C. during the electrical inspection, it contributes to an improvement in the detection rate of defects in a high temperature environment.
比較例１
　検査治具として、ヒーターを有する加温プレートを備えていない従来の検査治具を用いたことを除いては、実施例１と同様にして１００℃に加熱したプリント基板８の導通検査を行った。 Comparative Example 1
A continuity test of the printed circuit board 8 heated to 100 ° C. was performed in the same manner as in Example 1 except that a conventional inspection jig without a heating plate having a heater was used as the inspection jig. .
　このとき、検査中のプリント基板８の温度を測定した結果、プリント基板８の温度は４０℃であった。 At this time, as a result of measuring the temperature of the printed circuit board 8 under inspection, the temperature of the printed circuit board 8 was 40 ° C.
　この比較例１の検査治具は、室温（２５℃程度）状態であるので、１００℃に加熱されたプリント基板は、検査治具にセットされることにより熱が奪われ、温度が低下している。つまり、この比較例１の場合、高温状態を維持できていないので、高温環境下での不良の検出率を向上させることはできない。 Since the inspection jig of Comparative Example 1 is in a room temperature (about 25 ° C.) state, the printed board heated to 100 ° C. is deprived of heat by being set on the inspection jig, and the temperature decreases. Yes. That is, in the case of this comparative example 1, since the high temperature state cannot be maintained, the defect detection rate under a high temperature environment cannot be improved.
　なお、本発明に係る検査治具は、上記した実施形態及び実施例に限定されるものではなく、種々の変更が可能である。上記実施形態においては、ヒーターを備えた検査治具について説明したが、この態様に限定されるものではなく、例えば、ペルチェ素子等を含む冷却装置を備えた検査治具としてもよい。これにより、低温状態でのプリント基板の検査を行うことができる。また、ヒーター及び冷却装置の両方を備えた検査治具としても構わない。この場合、プリント基板に対して、加熱と冷却を繰り返すヒートサイクル試験も行える。 Note that the inspection jig according to the present invention is not limited to the above-described embodiments and examples, and various modifications can be made. In the said embodiment, although the inspection jig provided with the heater was demonstrated, it is not limited to this aspect, For example, it is good also as an inspection jig provided with the cooling device containing a Peltier device etc. Thereby, the printed circuit board can be inspected at a low temperature. Moreover, it does not matter as an inspection jig provided with both a heater and a cooling device. In this case, a heat cycle test that repeats heating and cooling can be performed on the printed circuit board.
２　　　　　　　検査治具
４　　　　　　　プリント基板検査装置
６　　　　　　　高温検査システム
８　　　　　　　プリント基板
１０　　　　　　恒温槽
１２　　　　　　搬送装置
２６　　　　　　第１保持アセンブリ
２８　　　　　　第２保持アセンブリ
３４　　　　　　第１プローブピン
３６　　　　　　第１プローブピン保持体
３８　　　　　　第１加温ユニット
４０　　　　　　第１保護板
５４　　　　　　第１加温プレート
５６　　　　　　ヒーター（リボンヒーター）
８４　　　　　　第２プローブピン保持体
８６　　　　　　第２加温ユニット
８８　　　　　　第２加温プレート 2 Inspection jig 4 Printed circuit board inspection device 6 High temperature inspection system 8 Printed circuit board 10 Constant temperature bath 12 Conveying device 26 First holding assembly 28 Second holding assembly 34 First probe pin 36 First probe pin holding body 38 First heating unit 40 First protective plate 54 First heating plate 56 Heater (ribbon heater)
84 Second probe pin holder 86 Second heating unit 88 Second heating plate

Claims (4)

  1. 　第１面及び前記第１面とは反対側の第２面を有するプリント基板の電気的な検査を行うプリント基板検査装置に含まれる検査治具において、
    　前記プリント基板の第１面側を支える第１保持アセンブリと、
    　前記プリント基板の第２面側を支える第２保持アセンブリとを備えており、
    　前記第１保持アセンブリは、前記プリント基板の第１面の配線と当接される多数の第１プローブピンを保持する第１プローブピン保持体及び前記プリント基板の温度を所望する設定温度に調節することができる第１温度調節体を含み、
    　前記第２保持アセンブリは、前記プリント基板の第２面の配線と当接される多数の第２プローブピンを保持する第２プローブピン保持体及び前記プリント基板の温度を前記設定温度に調節することができる第２温度調節体を含んでいる
    ことを特徴とする検査治具。     In an inspection jig included in a printed circuit board inspection apparatus that performs an electrical inspection of a printed circuit board having a first surface and a second surface opposite to the first surface,
    A first holding assembly for supporting the first surface side of the printed circuit board;
    A second holding assembly for supporting the second surface side of the printed circuit board,
    The first holding assembly adjusts the temperature of the first probe pin holder that holds a number of first probe pins that are in contact with the wiring on the first surface of the printed circuit board and the printed circuit board to a desired set temperature. A first temperature regulator capable of
    The second holding assembly adjusts the temperature of the printed circuit board to a second probe pin holder that holds a plurality of second probe pins that are in contact with the wiring on the second surface of the printed circuit board. An inspection jig comprising a second temperature control body capable of achieving the above.
  2. 　前記第１プローブピン保持体は、前記多数の第１プローブピンを前記プリント基板の第１面に向かって突出させた状態で保持する第１ベースを有しており、
    　前記第１温度調節体は、前記第１ベースの前記第１プローブピンが突出している側に配置され、前記第１プローブピンに対応する位置にて前記第１プローブピンを避ける第１プローブピン逃げ孔を有する熱伝導材料からなる第１プレートと、前記第１プレートに一体的に配設されたヒーターとを有しており、
    　前記第２プローブピン保持体は、前記多数の第２プローブピンを前記プリント基板の第２面に向かって突出させた状態で保持する第２ベースを有しており、
    　前記第２温度調節体は、前記第２ベースの前記第２プローブピンが突出している側に配置され、前記第２プローブピンに対応する位置にて前記第２プローブピンを避ける第２プローブピン逃げ孔を有する熱伝導材料からなる第２プレートと、前記第２プレートに一体的に配設されたヒーターとを有している
    ことを特徴とする請求項１に記載の検査治具。     The first probe pin holder includes a first base that holds the first probe pins in a state of projecting toward the first surface of the printed circuit board,
    The first temperature adjusting body is disposed on a side of the first base where the first probe pin protrudes, and escapes from the first probe pin to avoid the first probe pin at a position corresponding to the first probe pin. A first plate made of a heat conductive material having a hole, and a heater integrally disposed on the first plate;
    The second probe pin holder has a second base for holding the multiple second probe pins in a state of projecting toward the second surface of the printed circuit board,
    The second temperature adjusting body is disposed on a side of the second base where the second probe pin protrudes, and escapes from the second probe pin at a position corresponding to the second probe pin. The inspection jig according to claim 1, comprising: a second plate made of a heat conductive material having a hole; and a heater integrally disposed on the second plate.
  3. 　前記第１保持アセンブリは、
    　前記第１プレートの前記プリント基板に相対する領域に配設され、前記第１プローブピンに対応する位置にて前記第１プローブピンを挿通可能な第１ピン挿通孔を有している絶縁材料からなる第１保護板を更に備えており、
    　前記第２保持アセンブリは、
    　前記第２プレートの前記プリント基板に相対する領域に配設され、前記第２プローブピンに対応する位置にて前記第２プローブピンを挿通可能な第２ピン挿通孔を有している絶縁材料からなる第２保護板を更に備えており、
    　前記第１プレート及び前記第２プレートは、アルミニウムからなる
    ことを特徴とする請求項２に記載の検査治具。     The first holding assembly includes
    An insulating material disposed in a region of the first plate facing the printed circuit board and having a first pin insertion hole through which the first probe pin can be inserted at a position corresponding to the first probe pin. Further comprising a first protection plate,
    The second holding assembly includes
    An insulating material disposed in a region of the second plate facing the printed circuit board and having a second pin insertion hole through which the second probe pin can be inserted at a position corresponding to the second probe pin. Further comprising a second protective plate,
    The inspection jig according to claim 2, wherein the first plate and the second plate are made of aluminum.
  4. 　第１面及び前記第１面とは反対側の第２面を有するプリント基板を所望する設定温度に保つ恒温槽と、
    　前記恒温槽から取り出された前記プリント基板を搬送する搬送装置と、
    　前記搬送装置により搬送されてきた前記プリント基板を受け取り、前記設定温度に保ったまま前記プリント基板の電気的な検査を行うプリント基板検査装置とを備えており、
    　前記プリント基板検査装置は、請求項１～３の何れかに記載の検査治具を有している
    ことを特徴とするプリント基板検査システム。
          A constant temperature bath for maintaining a printed circuit board having a first surface and a second surface opposite to the first surface at a desired set temperature;
    A transport device for transporting the printed circuit board taken out of the thermostat;
    A printed circuit board inspection device that receives the printed circuit board that has been transported by the transport device and performs an electrical inspection of the printed circuit board while maintaining the set temperature;
    A printed circuit board inspection system comprising the inspection jig according to any one of claims 1 to 3.
PCT/JP2013/067819 2013-06-28 2013-06-28 Inspection jig, and printed board inspection system employing the inspection jig WO2014207894A1 (en)

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WO2017138380A1 (en) * 2016-02-12 2017-08-17 日本電産リード株式会社 Inspection jig, inspection jig set, and substrate inspection device
EP3783375A1 (en) * 2019-08-19 2021-02-24 Dyconex AG Hot e-test for non-equipped printed circuit boards
CN114167916A (en) * 2022-02-11 2022-03-11 为准（北京）电子科技有限公司 Circuit board temperature adjusting method and device, electronic equipment and storage medium

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JPH02242171A (en) * 1989-03-15 1990-09-26 Matsushita Electric Works Ltd Conduction tester for printed wiring board
JP2007064883A (en) * 2005-09-01 2007-03-15 Nippon Mektron Ltd Electrical conduction inspecting device and method of printed circuit board
JP2011174863A (en) * 2010-02-25 2011-09-08 Tatsumo Kk Method of inspecting printed circuit board used for electronic devices and inspection device used therefor

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JPH02242171A (en) * 1989-03-15 1990-09-26 Matsushita Electric Works Ltd Conduction tester for printed wiring board
JP2007064883A (en) * 2005-09-01 2007-03-15 Nippon Mektron Ltd Electrical conduction inspecting device and method of printed circuit board
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017138380A1 (en) * 2016-02-12 2017-08-17 日本電産リード株式会社 Inspection jig, inspection jig set, and substrate inspection device
TWI752928B (en) * 2016-02-12 2022-01-21 日商日本電產理德股份有限公司 Inspection jig, inspection jig set, and substrate inspecting apparatus
EP3783375A1 (en) * 2019-08-19 2021-02-24 Dyconex AG Hot e-test for non-equipped printed circuit boards
WO2021032396A1 (en) * 2019-08-19 2021-02-25 Dyconex Ag Hot e-test for unpopulated printed circuit boards
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