WO2014203875A1 - 熱伝導性シート及び熱伝導性シートの製造方法 - Google Patents
熱伝導性シート及び熱伝導性シートの製造方法 Download PDFInfo
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- WO2014203875A1 WO2014203875A1 PCT/JP2014/065977 JP2014065977W WO2014203875A1 WO 2014203875 A1 WO2014203875 A1 WO 2014203875A1 JP 2014065977 W JP2014065977 W JP 2014065977W WO 2014203875 A1 WO2014203875 A1 WO 2014203875A1
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- thermally conductive
- heat conductive
- conductive sheet
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- fiber
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0022—Combinations of extrusion moulding with other shaping operations combined with cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/06—Rod-shaped
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/12—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of short lengths, e.g. chopped filaments, staple fibres or bristles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/16—Fillers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
- B29K2995/0013—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/18—Heat-exchangers or parts thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat conductive sheet that promotes heat dissipation from a heat-generating electronic component and the like, and a method for manufacturing the heat conductive sheet.
- the semiconductor is attached to a heat sink such as a heat dissipating fan or a heat dissipating plate via a heat conductive sheet.
- a heat conductive sheet a sheet in which a filler such as an inorganic filler is dispersed and contained in silicone is widely used.
- the inorganic filler examples include alumina, aluminum nitride, and aluminum hydroxide.
- scale-like particles such as boron nitride and graphite, carbon fibers, and the like may be filled in the matrix. This is due to the anisotropy of the thermal conductivity of the scaly particles.
- carbon fiber has a thermal conductivity of about 600 to 1200 W / mK in the fiber direction.
- Boron nitride has a thermal conductivity of about 110 W / mK in the plane direction and about 2 W / mK in a direction perpendicular to the plane direction, and is known to have anisotropy. .
- Patent Document 1 describes a method of applying a heat conductive composition containing carbon fiber and orienting the carbon fiber by applying a magnetic field. However, since fluidity is required for the orientation of the carbon fibers, the method described in Patent Document 1 cannot increase the filling amount of the heat conductive filler.
- This invention is proposed in view of such a situation, and it aims at providing the manufacturing method of the heat conductive sheet with favorable heat conductivity of the thickness direction, and a heat conductive sheet.
- the present inventor has expressed the “L *” value in the L * a * b color system described in “JIS Z 8729” and “JIS Z 8730” when the surface of the heat conductive sheet is measured.
- the value of the brightness L * is within the predetermined range, it has been found that good thermal conductivity can be obtained, and the present invention has been completed.
- the thermally conductive sheet according to the present invention contains a curable resin composition, thermally conductive fibers, and thermally conductive particles, and the L * a * b color system on the surface of the thermally conductive sheet.
- the L * value at is 29 or more and 47 or less.
- the manufacturing method of the heat conductive sheet which concerns on this invention is the creation process which produces the heat conductive composition containing curable resin composition, a heat conductive fiber, and heat conductive particle,
- fever A molding step of extruding the conductive composition to obtain a columnar cured product, and cutting the columnar cured product into a predetermined thickness in a direction substantially perpendicular to the length direction of the column, and the surface L * a * b
- the L * value in the L * a * b color system of the surface of the heat conductive sheet containing the curable resin composition, the heat conductive fiber, and the heat conductive particles is 29.
- the thermal conductivity in the thickness direction of the thermal conductive sheet can be improved.
- FIG. 1 is a flowchart for explaining an example of a method for producing a thermally conductive sheet according to the present invention.
- FIG. 2 is an external view showing an example of an ultrasonic cutting machine used in a cutting step in the method for producing a thermally conductive sheet according to the present invention.
- FIG. 3 is an external view showing an example of a slicing apparatus.
- FIG. 4 is a flowchart for explaining an example of the arranging step in the method for producing another thermally conductive sheet according to the present invention.
- Drawing 5 is a mimetic diagram for explaining an example of a temporary forming process, an alignment process, and a main forming process in a manufacturing method of a heat conductive sheet concerning the present invention.
- FIG. 1 is a flowchart for explaining an example of a method for producing a thermally conductive sheet according to the present invention.
- FIG. 2 is an external view showing an example of an ultrasonic cutting machine used in a cutting step in the method for producing a thermally conductive
- FIG. 6 is a perspective view showing an example of a laminate obtained in the alignment step in the method for manufacturing a heat conductive sheet according to the present invention.
- FIG. 7A is a perspective view showing an example of the molded body that has not been pressed, and
- FIG. 7B is a perspective view showing an example of the molded body that has been pressed.
- Thermal conductive sheet> (Brightness L * in L * a * b color system]
- the color of an object generally consists of three elements: lightness (brightness), hue (hue), and saturation (brightness).
- a color system that expresses these numerically objectively is necessary.
- An example of such a color system is the L * a * b color system.
- the L * a * b color system can be easily measured by a measuring instrument such as a commercially available spectrophotometer.
- the L * a * b color system is a color system described in “JIS Z 8729” and “JIS Z 8730”, for example, and is shown by arranging each color in a spherical color space.
- lightness is indicated by a position in the vertical axis (z-axis) direction
- hue is indicated by a position in the outer peripheral direction
- saturation is indicated by a distance from the central axis.
- the position in the vertical axis (z-axis) direction indicating brightness is indicated by L *.
- the value of the lightness L * is a positive number. The smaller the number, the lower the lightness and the darker the tendency. Specifically, the value of L * varies from 0 corresponding to black to 100 corresponding to white.
- the positive direction of the x axis is the red direction
- the positive direction of the y axis is the yellow direction
- the negative direction of the x axis is the green direction
- y The negative direction of the axis is the blue direction.
- the position in the x-axis direction is represented by a * taking a value from ⁇ 60 to +60.
- the position in the y-axis direction is represented by b * taking values from ⁇ 60 to +60.
- a * and b * are positive and negative numbers representing chromaticity, and the closer to 0, the blacker the color becomes. Hue and saturation are represented by these a * and b * values.
- the lightness L * becomes whitish and the lightness L * becomes darker.
- the color becomes green when a * is less than ⁇ 1 and the color becomes red when a * is ⁇ 1 or more.
- the color becomes bluish, and when b * exceeds +1, the color becomes yellowish.
- the thermally conductive sheet according to the present embodiment contains a curable resin composition, thermally conductive fibers, and thermally conductive particles.
- the volume percentage of the thermally conductive fibers is increased, the surface brightness L * Tends to be small, and when the volume percentage of the thermally conductive particles is increased, the lightness L * tends to increase.
- the thermally conductive sheet according to the present embodiment contains a curable resin composition, thermally conductive fibers, and thermally conductive particles, and the L * a * b color of the surface of the thermally conductive sheet.
- the L * value in the system is 29 or more and 47 or less.
- mottled or streak lines may enter the surface of the heat conductive sheet. This is because, when extruding the heat conductive composition into the inside of the hollow mold, in the process in which the heat conductive compositions exiting through the slits are in close contact with each other inside the hollow mold, the surface has color shading. It was because it was made.
- the surface of the heat conductive sheet has a mottled pattern or a streak line, the carbon fibers are not oriented in a certain direction in the thickness direction, but are oriented randomly. However, the lightness L * is determined by the surface area of the carbon fiber, alumina, etc., regardless of the orientation direction of the carbon fiber. For this reason, when the surface of a heat conductive sheet has a mottled pattern or a streak line, the L * value per unit area of the surface of a heat conductive sheet should just be 29-47.
- the L * value of the surface of the heat conductive sheet can be adjusted by adjusting the mixing time.
- the mixing time is lengthened, the L * value tends to decrease, and when the mixing time is shortened, the L * value tends to increase.
- the mixing time is long, it is considered that the area of the carbon fiber on the surface of the heat conductive sheet increases, and the amount of white alumina and aluminum nitride exposed on the surface decreases. Further, when the surface of the sheet is glossy, the L * value tends to increase.
- the L * a * b color system is taken as an example, but the method of selecting the color system is not particularly limited, and a table that can be converted into the L * a * b color system. Any color system may be used. For example, an XYZ color system or an L * C * h color system may be used.
- the curable resin composition is not particularly limited, and can be appropriately selected depending on the performance required for the heat conductive sheet.
- a thermoplastic polymer or a thermosetting polymer can be used.
- thermoplastic polymer examples include thermoplastic resins, thermoplastic elastomers, and polymer alloys thereof.
- thermoplastic resin is not particularly limited and may be appropriately selected depending on the intended purpose.
- examples thereof include ethylene- ⁇ -olefin copolymers such as polyethylene, polypropylene and ethylene-propylene copolymers; polymethylpentene, polychlorinated Fluorine resins such as vinyl, polyvinylidene chloride, polyvinyl acetate, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polyacetal, polyvinylidene fluoride, polytetrafluoroethylene; polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polystyrene, Polyacrylonitrile, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer (ABS) resin, polyphenylene ether, modified polyphenylene ether, aliphatic polyamid , Aromatic polyamides, polyamideimide, poly
- thermoplastic elastomer examples include a styrene-based thermoplastic elastomer such as a styrene-butadiene copolymer or a hydrogenated polymer thereof, a styrene-isoprene block copolymer or a hydrogenated polymer thereof, an olefin-based thermoplastic elastomer, and a vinyl chloride-based thermoplastic.
- styrene-based thermoplastic elastomer such as a styrene-butadiene copolymer or a hydrogenated polymer thereof, a styrene-isoprene block copolymer or a hydrogenated polymer thereof, an olefin-based thermoplastic elastomer, and a vinyl chloride-based thermoplastic.
- elastomers polyester-based thermoplastic elastomers, polyurethane-based thermoplastic elastomers, and polyamide-based thermoplastic elastomers.
- thermosetting polymer examples include crosslinked rubber, epoxy resin, polyimide resin, bismaleimide resin, benzocyclobutene resin, phenol resin, unsaturated polyester, diallyl phthalate resin, silicone resin, polyurethane, polyimide silicone, thermosetting polyphenylene ether. And thermosetting modified polyphenylene ether. These may be used individually by 1 type and may use 2 or more types together.
- crosslinked rubber examples include natural rubber, butadiene rubber, isoprene rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, ethylene propylene rubber, chlorinated polyethylene, chlorosulfonated polyethylene, butyl rubber, halogenated butyl rubber, fluorine rubber, and urethane rubber.
- the curing method of the curable resin composition is not particularly limited and can be appropriately selected according to the performance required for the heat conductive sheet.
- the curing agent mixed type, the solvent volatilization type, the heat curing type, the heat A melt type, an ultraviolet curable type, or the like can be used.
- a hardener mixed type silicone resin from the viewpoints of excellent molding processability and weather resistance, as well as adhesion to electronic components and followability.
- the silicone resin is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include addition reaction type liquid silicone rubber and heat vulcanizable type millable type silicone rubber using peroxide for vulcanization. .
- an addition reaction type liquid silicone rubber is particularly preferable as a heat radiating member of an electronic device because adhesion between a heat generating surface of an electronic component and a heat sink surface is required.
- content of the curable resin composition in a heat conductive sheet is not specifically limited, For example, it can be 25 volume% or more and 45 volume% or less.
- Thermal conductive fiber for example, carbon fiber can be used.
- the carbon fiber for example, one synthesized by pitch system, PAN system, arc discharge method, laser evaporation method, CVD method (chemical vapor deposition method), CCVD method (catalyst chemical vapor deposition method) or the like is used. It can. Among these, pitch-based carbon fibers and carbon fibers obtained by graphitizing polybenzazole are particularly preferable from the viewpoint of heat conduction.
- Pitch-based carbon fibers are made from pitch as a main raw material and graphitized by heat treatment at a high temperature exceeding 2000 to 3000 ° C. or 3000 ° C. after each processing step such as melt spinning, infusibilization and carbonization.
- the raw material pitch is divided into an isotropic pitch that is optically disordered and does not exhibit deflection, and an anisotropic pitch (mesophase pitch) in which constituent molecules are arranged in a liquid crystal form and exhibit optical anisotropy.
- Carbon fibers manufactured from anisotropic pitch have better mechanical properties than carbon fibers manufactured from isotropic pitch, and electrical and thermal conductivity is increased. Therefore, it is preferable to use a mesophase pitch graphitized carbon fiber.
- Carbon fiber can be used by partially or entirely treating the carbon fiber as necessary.
- surface treatment include oxidation treatment, nitridation treatment, nitration, sulfonation, or adhesion or bonding of metals, metal compounds, organic compounds, etc. to the surface of functional groups or carbon fibers introduced to the surface by these treatments.
- the functional group include a hydroxyl group, a carboxyl group, a carbonyl group, a nitro group, and an amino group.
- the average fiber length of the heat conductive fibers is preferably 40 ⁇ m or more and 250 ⁇ m or less.
- the heat conductive fibers can be easily entangled with each other, and the heat conductivity in the thickness direction of the heat conductive sheet can be further improved.
- carbon fibers having different average fiber lengths may be mixed.
- the average fiber length of a heat conductive fiber can be measured with a particle size distribution meter, a microscope, a scanning electron microscope (SEM) etc., for example.
- the content of the heat conductive fiber in the heat conductive sheet is preferably 15% by volume or more and 35% by volume or less.
- the content of the heat conductive fiber is preferably 15% by volume or more and 35% by volume or less.
- the thermal resistance value can be more effectively lowered, so that the heat conductivity in the thickness direction of the heat conductive sheet can be improved.
- content of a heat conductive fiber shall be 35 volume% or less, when extruding a heat conductive composition with an extruder, it can prevent that extrusion becomes difficult, for example.
- the thermally conductive particles facilitate the alignment of the thermally conductive fibers in a predetermined direction due to the difference in flow rate from the thermally conductive fibers in the thermally conductive composition, that is, the thermally conductive fibers are heated along the extrusion direction. Used to facilitate the orientation of conductive fibers.
- the heat conductive particles are also used to maintain the shape of the heat conductive sheet.
- thermally conductive particles include: Alumina, aluminum nitride, aluminum hydroxide, silica, boron nitride, titania, glass, zinc oxide, silicon carbide, silicon (silicon), silicon oxide, aluminum oxide, metal particles, and the like can be used. These may be used individually by 1 type and may use 2 or more types together. Among these, it is preferable to use at least one of alumina, aluminum nitride, and aluminum hydroxide containing at least alumina.
- Aluminum nitride has nitrogen in its molecule, and this nitrogen inhibits the reaction of the curable resin composition and suppresses the increase in the viscosity of the thermally conductive composition. Therefore, by using aluminum nitride, it is possible to orient the heat conductive fibers more effectively along the thickness direction of the heat conductive sheet than when only alumina particles are used as the heat conductive particles. The heat conductivity in the thickness direction of the heat conductive sheet can be improved.
- the thermally conductive particles are surface-treated with, for example, a silane coupling agent.
- a silane coupling agent By surface-treating the heat conductive particles, the dispersibility can be improved and the flexibility of the heat conductive sheet can be improved. Moreover, the surface roughness obtained by slicing can be further reduced.
- the average particle diameter of the heat conductive particles is preferably 0.5 ⁇ m or more and 10 ⁇ m or less. If the average particle size is less than 0.5 ⁇ m, it may cause curing failure. If it exceeds 10 ⁇ m, the orientation of the carbon fibers may be hindered and the thermal conductivity of the cured product may be lowered.
- thermally conductive particles having different particle diameters it is possible to make it easier to orient the thermally conductive fibers along the thickness direction of the thermally conductive sheet.
- the thermal conductivity in the thickness direction of the conductive sheet can be made better.
- the large spherical particles are 3 ⁇ m or more and 10 ⁇ m or less, and the small spherical particles are 0.3 ⁇ m or more and 3 ⁇ m or less.
- the heat conductive fiber can be more easily oriented along the thickness direction of the heat conductive sheet, and the heat conductivity in the thickness direction of the heat conductive sheet can be improved.
- the average particle diameter of a heat conductive particle can be measured, for example with a particle size distribution meter and a scanning electron microscope (SEM).
- the content of the heat conductive particles in the heat conductive sheet is preferably 20% by volume or more and 60% by volume or less. Moreover, since the orientation of the heat conductive fiber is hardly disturbed by setting the content of the heat conductive particles to 20% by volume or more and 60% by volume or less, the heat conductivity in the thickness direction of the heat conductive sheet is better. Can be.
- the above-described thermally conductive composition further includes, for example, a solvent, a thixotropic agent, a dispersant, a curing agent, a curing accelerator, a retarder, a slightly tackifier, a plasticizer, a flame retardant, Other components such as an antioxidant, a stabilizer, and a colorant can be blended.
- the thickness of the heat conductive sheet is preferably 0.1 mm or more. If the thickness of the thermally conductive sheet is less than 0.1 mm, the shape may not be maintained during slicing depending on the hardness of the cured product. It is also possible to form an adhesive layer on the obtained sheet in the form of dots, lines, or the outer periphery.
- the manufacturing method of the heat conductive sheet which concerns on this Embodiment has heat conductive composition preparation process S1, shaping
- the heat conductive composition mentioned above is prepared by mixing curable resin composition, a heat conductive fiber, a heat conductive particle, etc. using a mixer etc.
- the blending amount in the heat conductive composition is preferably, for example, 15% to 35% by volume of the heat conductive fiber and 20% to 60% by volume of the heat conductive particles.
- the thermally conductive composition created in the thermally conductive composition creating step S1 is extruded into a mold using a pump, an extruder, etc., to obtain a columnar cured product.
- size, a material, etc. as a type
- size it can select suitably according to the magnitude
- the extruded product is made into a cured product by an appropriate curing reaction according to the resin used.
- the resin used There is no restriction
- a thermosetting resin such as a silicone resin
- Examples of the apparatus used for heating include a far-infrared furnace and a hot air furnace.
- the heating temperature is not particularly limited and may be appropriately selected depending on the purpose.
- the flexibility of the cured product preferably performed at 40 ° C. to 150 ° C. is not particularly limited, and may be appropriately selected according to the purpose. For example, it can be adjusted by the crosslinking density of silicone, the filling amount of the heat conductive filler, and the like.
- a columnar thermally conductive composition in which thermally conductive fibers are aligned in the columnar longitudinal direction L can be formed.
- heat conductive fibers, heat conductive particles, etc. are collected in the center direction of the heat conductive composition, and the density of the heat conductive fibers at the surface and the center. Will be in different states. That is, since the heat conductive fiber does not protrude on the surface of the heat conductive composition (molded body) that has passed through the extruder, the surface portion (heat) of the cured product obtained by curing the heat conductive composition (molded body).
- the outer peripheral portion of the conductive sheet has good fine tackiness and good adhesion to an adherend (semiconductor device or the like).
- adherend semiconductor device or the like.
- the surface that is in contact with the heat source or the heat radiating side has low adhesiveness because the thermally conductive fibers protrude.
- the above-mentioned slight tackiness means that the film has removability with little increase in adhesive strength due to aging and wet heat, and has such tackiness that the position does not easily shift when affixed to an adherend.
- the thermal conductive composition created in the thermal conductive composition creation step S1 is applied onto a polyester film coated with a release material, and a columnar thermal conduction as shown in FIG.
- the composition may be formed.
- the column-shaped cured product is cut into a predetermined thickness in a direction substantially perpendicular to the length direction of the column, and the L * value in the L * a * b color system of the surface is 29 or more and 47 or less.
- This is a process for obtaining a thermal conductive sheet.
- an ultrasonic cutting machine 3 is used to ultrasonically convert the columnar thermal conductive composition 2 in a direction V perpendicular to the longitudinal direction L of the columnar thermal conductive composition 2.
- the heat conductive sheet 1 can be formed in a state where the orientation of the heat conductive fibers is maintained. Therefore, the orientation of the heat conductive fiber is maintained in the thickness direction, and the heat conductive sheet 1 having good heat conduction characteristics can be obtained.
- the ultrasonic cutting machine 3 includes a work table 5 on which the columnar heat conductive composition 2 is placed, and a columnar heat conductive composition on the work table 5 while applying ultrasonic vibration. And an ultrasonic cutter 4 for slicing 2.
- the work table 5 is provided with a silicone rapper 7 on a metal moving table 6.
- the moving table 6 can be moved in a predetermined direction by the moving mechanism 8, and sequentially feeds the columnar heat conductive composition 2 to the lower part of the ultrasonic cutter 4.
- the silicone rubber 7 has a thickness sufficient to receive the cutting edge of the ultrasonic cutter 4.
- the ultrasonic cutter 4 has a knife 9 for slicing the columnar thermal conductive composition 2, an ultrasonic oscillation mechanism 10 for applying ultrasonic vibration to the knife 9, and an elevating mechanism 11 for raising and lowering the knife 9.
- the knife 9 has its cutting edge directed toward the work table 5 and is moved up and down by the elevating mechanism 11 to slice the columnar thermal conductive composition 2 placed on the work table 5.
- a single blade or a double blade capable of ultrasonic oscillation can be used. Since the thickness of the sliced sheet is inclined in the plane when the both blades are lowered perpendicular to the molded body, it is necessary to incline both blades so that the blade edges of both blades are perpendicular to the molded body. is there. The inclination is an angle that is half of the angle of the blade edges of both blades.
- the dimensions and material of the knife 9 are determined according to the size and composition of the columnar thermal conductive composition 2.
- the knife 9 is made of steel having a width of 40 mm, a thickness of 1.5 mm, and a cutting edge angle of 10 °. .
- the blade cuts perpendicularly to the cured product, it can be cut into a uniform thickness, and the surface roughness of the cut surface can be reduced.
- a thermal conductive sheet with low thermal resistance at the interface and high thermal conductivity in the thickness direction of the sheet can be produced.
- the surface roughness Ra can be measured, for example, with a laser microscope.
- the ultrasonic oscillation mechanism 10 applies ultrasonic vibration to the knife 9 in the slicing direction of the columnar thermal conductive composition 2, and the transmission frequency is in the range of 10 kHz to 100 kHz and the amplitude is in the range of 10 ⁇ m to 100 ⁇ m. It is preferable to adjust.
- the heat conductive sheet 1 sliced while applying ultrasonic vibration by the ultrasonic cutting machine 3 has a lower thermal resistance than the heat conductive sheet sliced without applying ultrasonic vibration. Since the ultrasonic cutting machine 3 imparts ultrasonic vibration in the slicing direction to the ultrasonic cutter 4, the thermal conductive fiber having low interface thermal resistance and oriented in the thickness direction of the thermal conductive sheet 1. This is because it is difficult to be laid down by the knife 9. On the other hand, in a thermally conductive sheet sliced without applying ultrasonic vibration, the orientation of the thermally conductive fibers is disturbed by the frictional resistance of the knife, and the exposure to the cut surface is reduced, which increases the thermal resistance. End up. Therefore, by using the ultrasonic cutting machine 3, the heat conductive sheet 1 having excellent heat conduction characteristics can be obtained.
- Thermally conductive fibers are oriented in the thickness direction of the thermally conductive sheet (vertical orientation) by cutting the molded body that has completed the curing reaction in this way in a direction perpendicular to the extrusion direction. A sheet can be obtained.
- the thickness of the heat conductive sheet is preferably 0.1 mm or more. If the thickness is less than 0.1 mm, the shape may not be maintained during slicing depending on the hardness of the cured product. Further, at the time of slicing, the molded body may be sliced while adjusting the temperature such as cooling or heating. Moreover, you may slice, cooling a blade.
- Temporal molding step S21 In temporary molding process S21, as shown to FIG. 5 (A), the heat conductive composition 12 created by heat conductive composition preparation process S1 is extruded with the extruder 13, and heat conductive fiber is followed along an extrusion direction.
- a long columnar temporary molded body 14 (hereinafter referred to as a temporary molded body 14) in which is oriented.
- the extruder 13 is formed in an elongated cylindrical shape, and the diameter W2 of the entrance portion 12B on the side from which the heat conductive composition 12 is discharged is the main body portion. It is preferable that the diameter is smaller than the inner diameter W1 of 12A. Further, in the extruder 13, the inner diameter W1 of the main body portion 12a is tapered from the predetermined position in the longitudinal direction toward the extrusion direction so that the diameter W2 of the entrance portion 12B is smaller than the inner diameter W1 of the main body portion 12A. The diameter may be reduced.
- the heat conductive fiber becomes easy to follow along the extrusion direction. Thereby, a heat conductive fiber can be more reliably orientated in the longitudinal direction of the temporary molding 14.
- the extruder 13 sets the diameter W2 of the inlet 12B to about 1.5 to 9.5 mm. It is preferable that In this case, when the diameter W2 of the opening 12B is set to 1.5 mm or more, it is possible to prevent the extrusion from becoming difficult when the heat conductive composition 12 is extruded by the extruder 13. Moreover, since the orientation of the thermally conductive fiber is less likely to be disturbed by setting the diameter W2 of the Sekiguchi 12B to 9.5 mm or less, the thermal conductivity in the thickness direction of the thermally conductive sheet 1 can be further improved. it can.
- the cross-sectional shape of the entrance 12B can be, for example, a circle, a triangle, a rectangle, or a square, but is preferably a rectangle or a square.
- the temporary molded body 14 has a prismatic shape. Therefore, in the alignment step S22, the plurality of temporary molded bodies 14 are aligned so as to be adjacent to the direction orthogonal to the longitudinal direction, and the aligned plurality of temporary molded bodies 14 are arranged in a direction substantially orthogonal to the alignment direction.
- the laminated body 14A hereinafter referred to as the laminated body 14A
- the preliminarily molded body 14 has heat conductive fibers oriented along the direction of extrusion by the extruder 13, and has an elongated columnar shape, for example, an elongated square columnar shape, an elongated triangular columnar shape, or an elongated columnar shape.
- the plurality of temporary molded bodies 14 formed in the temporary molding step S21 are adjacent to each other in the direction orthogonal to the longitudinal direction.
- the laminated body 14A is obtained.
- the temporary molded bodies 14 are aligned in a predetermined frame 15, and a laminated body 14A in which the temporary molded bodies 14 are arranged in a rectangular parallelepiped shape or a cubic shape is obtained.
- the frame 15 is used as a fixing means for fixing the laminated body 14A when the main molded body 16 is molded in the main molding step S23, and prevents the laminated body 14A from being greatly deformed.
- the frame 15 is made of, for example, metal.
- the laminated body 14A obtained in the alignment step S22 is cured, so that FIG. 5E, FIG. 7A, and FIG.
- the main molded body 16 in which the same material as the temporary molded body 14 constituting the laminated body 14A is integrated is molded.
- the method of curing the laminate 14A include a method of heating the laminate 14A with a heating device and a method of heating and pressurizing the laminate 14A with a heating and pressurizing device.
- an acrylic resin is used as the curable resin composition constituting the heat conductive composition 12, for example, the laminate 14A is cured at room temperature by including an isocyanate compound in the heat conductive composition 12. It is possible.
- a method of heating and pressurizing the laminate 14A with a heating and pressurizing device that is, when curing the laminate 14A, a plurality of temporary molded bodies 14 constituting the laminate 14A. It is preferable to press in a direction perpendicular to the longitudinal direction (vertical direction). By pressing the laminated body 14A in this way, air bubbles can be more reliably removed from the laminated body 14A, so that it is possible to obtain the molded body 16 with better flame retardancy in the main molding step S23. It becomes.
- a silicone resin composition containing thermally conductive fibers and thermally conductive particles was prepared, and in the L * a * b color system of the surface of the thermally conductive sheet obtained from the silicone resin composition.
- the L * value, the thermal conductivity in the thickness direction of the thermally conductive sheet, the defective rate of the thermally conductive sheet, and the appearance of the thermally conductive sheet were evaluated.
- the average fiber length of the thermally conductive fibers is a calculated value obtained by measuring each thermally conductive fiber with a microscope (manufactured by HiROX Co Ltd, KH7700), and is the average of the thermally conductive particles.
- the particle diameter is a value measured by a particle size distribution meter.
- the present invention is not limited to these examples.
- the thermal conductivity of the thermally conductive sheet was measured by applying a load of 1 kgf / cm 2 by a measuring method based on ASTM-D5470.
- Example 1 In Example 1, 40% by volume of alumina particles having an average particle diameter of 5 ⁇ m obtained by coupling treatment with a silane coupling agent as heat conductive particles to a two-component addition reaction type liquid silicone resin, and average fibers as heat conductive fibers A silicone resin composition was prepared by mixing 20% by volume of pitch-based carbon fiber having a length of 40 ⁇ m for 2 hours.
- the two-component addition-reaction type liquid silicone resin one containing organopolysiloxane as a main component was used, and 16.8% by volume of silicone A solution and 18.8% by volume of silicone B solution were mixed.
- the obtained silicone resin composition was extruded into a hollow square column mold (35 mm ⁇ 35 mm) to form a 35 mm ⁇ silicone molded body.
- the silicone molding was heated in an oven at 100 ° C. for 6 hours to obtain a cured silicone product.
- the silicone cured product was cut with an ultrasonic cutter so as to have a thickness of 2.0 mm to obtain a heat conductive sheet.
- the slice speed of the ultrasonic cutter was 50 mm per second.
- the ultrasonic vibration applied to the ultrasonic cutter had an oscillation frequency of 20.5 kHz and an amplitude of 60 ⁇ m.
- Table 1 shows the measurement and evaluation results of the thermal conductive sheet of Example 1.
- the lightness L * of the heat conductive sheet was 29.8, and the heat conductivity was 10.2 W / mK.
- the defect rate of the heat conductive sheet was less than 5%, and the appearance was good.
- Example 2 In Example 2, 37 parts by volume of alumina particles having an average particle diameter of 5 ⁇ m obtained by coupling treatment with a silane coupling agent as heat conductive particles to a two-component addition reaction type liquid silicone resin, and average fibers as heat conductive fibers A silicone resin composition was prepared by mixing 25 vol% of pitch-based carbon fibers having a length of 250 ⁇ m for 4 hours. Except this, it carried out similarly to Example 1, and obtained the heat conductive sheet.
- Table 1 shows the measurement and evaluation results of the thermally conductive sheet of Example 2.
- the lightness L * of the heat conductive sheet was 29.1, and the heat conductivity was 15.4 W / mK.
- the defect rate of the heat conductive sheet was less than 5%, and the appearance was good.
- Example 3 In Example 3, 19 parts by volume of alumina particles having an average particle size of 5 ⁇ m obtained by coupling a two-component addition reaction type liquid silicone resin with a silane coupling agent as heat conductive particles, and a coupling treatment with a silane coupling agent 24% by volume of aluminum nitride particles having an average particle diameter of 1 ⁇ m and 3% by volume of pitch-based carbon fibers having an average fiber length of 150 ⁇ m as heat conductive fibers were mixed for 4 hours to prepare a silicone resin composition. Except this, it carried out similarly to Example 1, and obtained the heat conductive sheet.
- Table 1 shows the measurement and evaluation results of the thermal conductive sheet of Example 3.
- the lightness L * of the heat conductive sheet was 37.5, and the heat conductivity was 23.2 W / mK. Moreover, the defect rate of the heat conductive sheet was less than 5%, and the appearance was good. *
- Example 4 the two-component addition reaction type liquid silicone resin was coupled with a silane coupling agent as a heat conductive particle and 18 volume% of alumina particles having an average particle diameter of 5 ⁇ m, and a coupling treatment with a silane coupling agent. 22 volume% of aluminum nitride particles having an average particle diameter of 1 ⁇ m and 32 volume% of pitch-based carbon fibers having an average fiber length of 100 ⁇ m as heat conductive fibers were mixed for 4 hours to prepare a silicone resin composition. Except this, it carried out similarly to Example 1, and obtained the heat conductive sheet.
- Table 1 shows the measurement and evaluation results of the thermally conductive sheet of Example 4.
- the lightness L * of the heat conductive sheet was 31.2, and the heat conductivity was 26.3 W / mK. Moreover, the defect rate of the heat conductive sheet was less than 5%, and the appearance was good.
- Example 5 25 parts by volume of alumina particles having an average particle diameter of 5 ⁇ m obtained by coupling a two-component addition reaction type liquid silicone resin with a silane coupling agent as heat conductive particles, a coupling treatment with a silane coupling agent 7 volume% of aluminum nitride particles having an average particle diameter of 1 ⁇ m and 34 volume% of pitch-based carbon fibers having an average fiber length of 150 ⁇ m as heat conductive fibers were mixed for 4 hours to prepare a silicone resin composition. Except this, it carried out similarly to Example 1, and obtained the heat conductive sheet.
- Table 1 shows the measurement and evaluation results of the thermally conductive sheet of Example 5.
- the lightness L * of the heat conductive sheet was 30.6, and the heat conductivity was 14.8 W / mK. Moreover, the defect rate of the heat conductive sheet was less than 5%, and the appearance was good.
- Example 6 a two-component addition reaction type liquid silicone resin was coupled with a silane coupling agent as a heat conductive particle, 6 volume% of alumina particles having an average particle diameter of 5 ⁇ m, and a coupling treatment with a silane coupling agent. 7 volume% of aluminum nitride particles having an average particle diameter of 1 ⁇ m and 34 volume% of pitch-based carbon fibers having an average fiber length of 150 ⁇ m as heat conductive fibers were mixed for 4 hours to prepare a silicone resin composition. Except this, it carried out similarly to Example 1, and obtained the heat conductive sheet.
- Table 1 shows the measurement and evaluation results of the heat conductive sheet of Example 6.
- the lightness L * of the heat conductive sheet was 45.3, and the heat conductivity was 17.2 W / mK.
- the defect rate of the heat conductive sheet was less than 5%, and the appearance was good.
- Example 7 In Example 7, a two-component addition-reaction liquid silicone resin was coupled with a silane coupling agent as a heat conductive particle and 30 volume percent of alumina particles having an average particle size of 5 ⁇ m, and a coupling treatment with a silane coupling agent. 3 volume% of aluminum hydroxide particles having an average particle diameter of 3 ⁇ m and 20 volume% of pitch-based carbon fibers having an average fiber length of 150 ⁇ m as heat conductive fibers were mixed for 4 hours to prepare a silicone resin composition. Except this, it carried out similarly to Example 1, and obtained the heat conductive sheet.
- Table 1 shows the measurement and evaluation results of the thermally conductive sheet of Example 7.
- the lightness L * of the heat conductive sheet was 34.3, and the heat conductivity was 11.2 W / mK.
- the defect rate of the heat conductive sheet was less than 5%, and the appearance was good.
- Comparative Example 1 a silicone resin composition was prepared by mixing 40% by volume of pitch-based carbon fiber having an average fiber length of 150 ⁇ m as a heat conductive fiber with a two-component addition reaction type liquid silicone resin for 4 hours. Except this, it was the same as Example 1.
- Table 1 shows the measurement and evaluation results of the heat conductive sheet of Comparative Example 1. Since the shape of the silicone cured product could not be maintained, the lightness L *, thermal conductivity, defect rate, and appearance of the thermally conductive sheet could not be evaluated.
- Comparative Example 2 50% by volume of alumina particles having an average particle diameter of 5 ⁇ m obtained by coupling a two-component addition reaction type liquid silicone resin with a silane coupling agent as heat conductive particles, and an average fiber as heat conductive fibers A silicone resin composition was prepared by mixing 10% by volume of pitch-based carbon fiber (trade name: Lahima, manufactured by Teijin Limited) having a length of 250 ⁇ m for 4 hours. Except this, it carried out similarly to Example 1, and obtained the heat conductive sheet.
- pitch-based carbon fiber trade name: Lahima, manufactured by Teijin Limited
- Table 1 shows the measurement and evaluation results of the heat conductive sheet of Comparative Example 7.
- the lightness L * of the heat conductive sheet was 47.3, and the heat conductivity was 6.5 W / mK.
- the defect rate of the heat conductive sheet was less than 5%, and the appearance was good.
- Reference Example 1 In Reference Example 1, 40% by volume of alumina particles having an average particle size of 5 ⁇ m obtained by coupling a two-component addition reaction type liquid silicone resin with a silane coupling agent as thermally conductive particles, and an average fiber as thermally conductive fibers A silicone resin composition was prepared by mixing 20% by volume of pitch-based carbon fibers having a length of 40 ⁇ m for 2 hours.
- silicone resin As the two-component addition reaction type liquid silicone resin, a mixture of 16.8% by volume of silicone A solution and 18.8% by volume of silicone B solution was used.
- the obtained silicone resin composition was applied to peeled PET with a bar coater to a thickness of 2 mm, cured at 100 ° C. for 6 hours, and then further applied with a bar coater to a thickness of 2 mm to form a 40 mm thick mold.
- a body was prepared, and a 40 mm ⁇ silicone molding was molded.
- the silicone molding was heated in an oven at 100 ° C. for 6 hours to obtain a cured silicone product.
- the silicone cured product was cut with an ultrasonic cutter so as to have a thickness of 2.0 mm to obtain a heat conductive sheet.
- the slice speed of the ultrasonic cutter was 50 mm per second.
- the ultrasonic vibration applied to the ultrasonic cutter had an oscillation frequency of 20.5 kHz and an amplitude of 60 ⁇ m.
- Table 1 shows the measurement and evaluation results of the thermal conductive sheet of Reference Example 1.
- the lightness L * of the heat conductive sheet was 29.4, and the heat conductivity was 8.6 W / mK. Moreover, the defect rate of the heat conductive sheet was 25%. When the thermal conductivity was measured, peeling occurred at the laminated interface, and the appearance was poor.
- Reference Example 2 In Reference Example 2, a two-component addition reaction type liquid silicone resin was coupled with a silane coupling agent as a heat conductive particle and 19 volume% of alumina particles having an average particle size of 5 ⁇ m, and a coupling treatment with a silane coupling agent. 24 volume% of aluminum nitride particles having an average particle diameter of 1 ⁇ m and 25 volume% of pitch-based carbon fibers having an average fiber length of 150 ⁇ m as heat conductive fibers were mixed for 4 hours to prepare a silicone resin composition. Except this, a heat conductive sheet was obtained in the same manner as in Reference Example 1.
- Table 1 shows the measurement and evaluation results of the thermal conductive sheet of Reference Example 2.
- the lightness L * of the heat conductive sheet was 27.9, and the heat conductivity was 18.7 W / mK. Moreover, the defect rate of the heat conductive sheet was 16%. When the thermal conductivity was measured, peeling occurred at the laminated interface, and the appearance was poor. *
- Reference Example 3 a two-component addition reaction type liquid silicone resin is coupled with a silane coupling agent and 18 volume% of alumina particles having an average particle diameter of 5 ⁇ m, which are coupled with a silane coupling agent as heat conductive particles. 22 volume% of aluminum nitride particles having an average particle diameter of 1 ⁇ m and 32 volume% of pitch-based carbon fibers having an average fiber length of 100 ⁇ m as heat conductive fibers were mixed for 4 hours to prepare a silicone resin composition. Except this, a heat conductive sheet was obtained in the same manner as in Reference Example 1.
- Table 1 shows the measurement and evaluation results of the heat conductive sheet of Reference Example 3.
- the lightness L * of the heat conductive sheet was 36.1, and the heat conductivity was 20.1 W / mK.
- the defective rate of the heat conductive sheet was 21%. When the thermal conductivity was measured, peeling occurred at the laminated interface, and the appearance was poor.
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Abstract
Description
1.熱伝導性シート
2.熱伝導性シートの製造方法
3.他の熱伝導性シートの製造方法
4.実施例
[L*a*b表色系における明度L*について]
物体の色は、一般に、明度(明るさ)、色相(色合い)及び彩度(鮮やかさ)の3つの要素からなる。これらを正確に測定し、表現するには、これらを客観的に数値化して表現する表色系が必要となる。このような表色系としては、例えば、L*a*b表色系が挙げられる。L*a*b表色系は、例えば、市販されている分光測色計などの測定器によって、容易に測定を行うことができる。
硬化性樹脂組成物は、特に限定されず、熱伝導性シートに要求される性能に応じて適宜選択することができ、例えば、熱可塑性ポリマー又は熱硬化性ポリマーを用いることができる。
熱伝導性繊維としては、例えば、炭素繊維を用いることができる。炭素繊維としては、例えばピッチ系、PAN系、アーク放電法、レーザー蒸発法、CVD法(化学気相成長法)、CCVD法(触媒化学気相成長法)等で合成されたものを用いることができる。これらの中でも、熱伝導の点からピッチ系炭素繊維やポリベンザゾールを黒鉛化した炭素繊維が特に好ましい。
熱伝導性粒子は、熱伝導性組成物における熱伝導性繊維との流速の違いにより、所定の方向に熱伝導性繊維を整列させやすくする、すなわち、熱伝導性繊維を押出方向に沿って熱伝導性繊維を配向させやすくするために用いられる。また、熱伝導性粒子は、熱伝導性シートの形状を維持させるためにも用いられる。
次に、前述した熱伝導性シートの製造方法について説明する。本実施の形態に係る熱伝導性シートの製造方法は、図1に示すように、熱伝導性組成物作成工程S1と、成型工程S2と、切断工程S3とを有する。
熱伝導性組成物作成工程S1において、硬化性樹脂組成物、熱伝導性繊維、熱伝導性粒子等を、ミキサー等を用いて混合することにより上述した熱伝導性組成物を調製する。熱伝導性組成物中の配合量は、例えば、熱伝導性繊維を15体積%以上35体積%以下とし、熱伝導性粒子を20体積%以上60体積%以下とすることが好ましい。
成型工程S2においては、熱伝導性組成物作成工程S1で作成した熱伝導性組成物をポンプ、押出機等を用いて、型内に押出成形し、柱状の硬化物を得る。型としては、形状、大きさ、材質などについては特に制限はなく、目的に応じて適宜選択することができ、形状としては、中空円柱状、中空角柱状などが挙げられる。大きさとしては、作製する熱伝導性シートの大きさに応じて適宜選定することができる。材質としては、例えばステンレスなどが挙げられる。
切断工程S3は、柱状の硬化物を、柱の長さ方向に対し略垂直方向に所定の厚みに切断し、表面のL*a*b表色系におけるL*値が、29以上47以下である熱伝導性シートを得る工程である。例えば、図2及び図3に示すように、超音波切断機3を用いて、柱状の熱伝導性組成物2の長手方向Lと直交する方向Vに柱状の熱伝導性組成物2を超音波カッター4でスライスすることにより、熱伝導性繊維の配向を保った状態で熱伝導性シート1を形成することができる。そのため、熱伝導性繊維の配向が厚み方向に維持され、熱伝導特性が良好な熱伝導性シート1を得ることができる。
熱伝導性シート1は、以下のような製造方法により作製してもよい。すなわち、図4に示すように、上述した熱伝導性シートの製造方法の成型工程S2において、仮成型工程S21と、整列工程S22と、本成型工程S23とを有してもよい。なお、以下の説明では、上述した熱伝導性組成物作成工程S1及び切断工程S3については、その詳細な説明を省略する。
仮成型工程S21では、図5(A)に示すように、熱伝導性組成物作成工程S1で作成した熱伝導性組成物12を押出機13で押出して、押出方向に沿って熱伝導性繊維が配向した細長柱状の仮成型体14(以下、仮成型体14と称する。)を成型する。
整列工程S22においては、例えば、図5(B)、図5(C)、図6に示すように、仮成型工程S21で成形した複数の仮成型体14を長手方向と直交する方向に隣接するように整列させ、積層体14Aを得る。例えば、整列工程S22においては、所定の枠15内に、仮成型体14を整列させ、直方体状や立方体状に仮成型体14を配設させた積層体14Aを得る。枠15は、本成型工程S23において本成型体16を成型する際に、積層体14Aを固定する固定手段として用いられ、積層体14Aが大きく変形してしまうことを防止する。枠15は、例えば金属で形成されている。
本成型工程S23においては、例えば、図5(D)に示すように、整列工程S22で得られた積層体14Aを硬化させることにより、図5(E)及び図7(A)、(B)に示すように、積層体14Aを構成する仮成型体14同土が一体化した本成型体16を成型する。積層体14Aを硬化させる方法としては、例えば、積層体14Aを加熱装置で加熱する方法や、積層体14Aを加熱加圧装置で加熱加圧する方法が挙げられる。また、熱伝導性組成物12を構成する硬化性樹脂組成物としてアクリル樹脂を用いたときには、例えば、イソシアネート化合物を熱伝導性組成物12中に含有させることにより、積層体14Aを常温で硬化させることが可能である。
<4.実施例>
分光光度計を用いて、熱伝導性シートの表面を測定した。「JIS Z 8729」及び「JIS Z 8730」に規定されているL*a*b表色系の色表示方法を用い、「L*」値で表される明度L*を測定した。
ASTM-D5470に準拠した測定方法により、1kgf/cm2の荷重をかけて熱伝導性シートの熱伝導率を測定した。
シリコーン硬化物から熱伝導性シートをスライスしたときに、熱伝導性シートの表面に気泡を巻き込んだものや、熱伝導性シートに貫通孔があったものを不良とし、その割合を算出した。なお、気泡の有無及び貫通孔の有無は、熱伝導性シートの表面を目視することによって判断した。
目視により熱伝導性シートを観察し、熱伝導性シートの剥離、熱伝導性シートの形状が維持できない等の不良が生じた場合を「不良」とし、それ以外を「良好」とした。
実施例1では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性粒子としてシランカップリング剤でカップリング処理した平均粒径5μmのアルミナ粒子40体積%、及び熱伝導性繊維として平均繊維長40μmのピッチ系炭素繊維20体積%を2時間混合し、シリコーン樹脂組成物を調製した。
実施例2では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性粒子としてシランカップリング剤でカップリング処理した平均粒径5μmのアルミナ粒子37体積%、及び熱伝導性繊維として平均繊維長250μmのピッチ系炭素繊維25体積%を4時間混合し、シリコーン樹脂組成物を調製した。これ以外は、実施例1と同様にして熱伝導性シートを得た。
実施例3では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性粒子としてシランカップリング剤でカップリング処理した平均粒径5μmのアルミナ粒子19体積%、シランカップリング剤でカップリング処理した平均粒径1μmの窒化アルミニウム粒子24体積%、及び熱伝導性繊維として平均繊維長150μmのピッチ系炭素繊維3体積%を4時間混合し、シリコーン樹脂組成物を調製した。これ以外は、実施例1と同様にして熱伝導性シートを得た。
実施例4では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性粒子としてシランカップリング剤でカップリング処理した平均粒径5μmのアルミナ粒子18体積%、シランカップリング剤でカップリング処理した平均粒径1μmの窒化アルミニウム粒子22体積%、及び熱伝導性繊維として平均繊維長100μmのピッチ系炭素繊維32体積%を4時間混合し、シリコーン樹脂組成物を調製した。これ以外は、実施例1と同様にして熱伝導性シートを得た。
実施例5では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性粒子としてシランカップリング剤でカップリング処理した平均粒径5μmのアルミナ粒子25体積%、シランカップリング剤でカップリング処理した平均粒径1μmの窒化アルミニウム粒子7体積%、及び熱伝導性繊維として平均繊維長150μmのピッチ系炭素繊維34体積%を4時間混合し、シリコーン樹脂組成物を調製した。これ以外は、実施例1と同様にして熱伝導性シートを得た。
実施例6では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性粒子としてシランカップリング剤でカップリング処理した平均粒径5μmのアルミナ粒子6体積%、シランカップリング剤でカップリング処理した平均粒径1μmの窒化アルミニウム粒子7体積%、及び熱伝導性繊維として平均繊維長150μmのピッチ系炭素繊維34体積%を4時間混合し、シリコーン樹脂組成物を調製した。これ以外は、実施例1と同様にして熱伝導性シートを得た。
実施例7では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性粒子としてシランカップリング剤でカップリング処理した平均粒径5μmのアルミナ粒子30体積%、シランカップリング剤でカップリング処理した平均粒径3μmの水酸化アルミニウム粒子3体積%、及び熱伝導性繊維として平均繊維長150μmのピッチ系炭素繊維20体積%を4時間混合し、シリコーン樹脂組成物を調製した。これ以外は、実施例1と同様にして熱伝導性シートを得た。
比較例1では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性繊維として平均繊維長150μmのピッチ系炭素繊維40体積%を4時間混合し、シリコーン樹脂組成物を調製した。これ以外は、実施例1と同様にした。
比較例2では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性粒子としてシランカップリング剤でカップリング処理した平均粒径5μmのアルミナ粒子50体積%、及び熱伝導性繊維として平均繊維長250μmのピッチ系炭素繊維(帝人株式会社製、商品名:ラヒーマ)10体積%を4時間混合し、シリコーン樹脂組成物を調製した。これ以外は、実施例1と同様にして熱伝導性シートを得た。
参考例1では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性粒子としてシランカップリング剤でカップリング処理した平均粒径5μmのアルミナ粒子40体積%、及び熱伝導性繊維として平均繊維長40μmのピッチ系炭素繊維20体積%を2時間混合し、シリコーン樹脂組成物を調製した。
参考例2では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性粒子としてシランカップリング剤でカップリング処理した平均粒径5μmのアルミナ粒子19体積%、シランカップリング剤でカップリング処理した平均粒径1μmの窒化アルミニウム粒子24体積%、及び熱伝導性繊維として平均繊維長150μmのピッチ系炭素繊維25体積%を4時間混合し、シリコーン樹脂組成物を調製した。これ以外は、参考例1と同様にして熱伝導性シートを得た。
参考例3では、2液性の付加反応型液状シリコーン樹脂に、熱伝導性粒子としてシランカップリング剤でカップリング処理した平均粒径5μmのアルミナ粒子18体積%、シランカップリング剤でカップリング処理した平均粒径1μmの窒化アルミニウム粒子22体積%、及び熱伝導性繊維として平均繊維長100μmのピッチ系炭素繊維32体積%を4時間混合し、シリコーン樹脂組成物を調製した。これ以外は、参考例1と同様にして熱伝導性シートを得た。
Claims (9)
- 硬化性樹脂組成物と、熱伝導性繊維と、熱伝導性粒子とを含有し、
当該熱伝導性シートの表面のL*a*b表色系におけるL*値が、29以上47以下である熱伝導性シート。 - 前記熱伝導性繊維が、炭素繊維であり、
前記熱伝導性粒子が、アルミナ、窒化アルミニウム、及び水酸化アルミニウムのうち、少なくともアルミナを含む1種以上である請求項1記載の熱伝導性シート。 - 前記熱伝導性繊維の平均繊維長が、40μm以上250μm以下であり、
前記熱伝導性粒子の平均粒子径が、0.5μm以上10μm以下である請求項2記載の熱伝導性シート。 - 前記熱伝導性粒子が、平均粒径が異なる2種以上を含む請求項3記載の熱伝導性シート。
- 前記熱伝導性繊維が、15体積%以上35体積%以下であり、
前記熱伝導性粒子が、20体積%以上60体積%以下である請求項1乃至4のいずれか1項に記載の熱伝導性シート。 - 前記硬化性樹脂組成物と、前記熱伝導性繊維と、前記熱伝導性粒子とを含有する熱伝導性組成物が押出成形された柱状の硬化物を、柱の長さ方向に対し略垂直方向に切断されてなる請求項1乃至4のいずれか1項に記載の熱伝導性シート。
- 前記硬化性樹脂組成物と、前記熱伝導性繊維と、前記熱伝導性粒子とを含有する熱伝導性組成物が押出成形された柱状の硬化物を、柱の長さ方向に対し略垂直方向に切断されてなる請求項5記載の熱伝導性シート。
- 硬化性樹脂組成物と、熱伝導性繊維と、熱伝導性粒子とを含有する熱伝導性組成物を作成する作成工程と、
前記熱伝導性組成物を押出成形し、柱状の硬化物を得る成型工程と、
前記柱状の硬化物を柱の長さ方向に対し略垂直方向に所定の厚みに切断し、表面のL*a*b表色系におけるL*値が、29以上47以下である熱伝導性シートを得る切断工程と
を有する熱伝導性シートの製造方法。 - 前記成型工程では、複数の柱状の仮成型体を長手方向と直交する方向に隣接するように整列させ、複数の仮成型体同士が一体化した本成型体を成型し、
前記切断工程では、前記本成型体の長手方向と略直交する方向に切断する請求項8記載の熱伝導性シートの製造方法。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016121341A (ja) * | 2014-12-25 | 2016-07-07 | デクセリアルズ株式会社 | 熱伝導シートの製造方法、熱伝導シート、及び半導体装置 |
WO2018037913A1 (ja) * | 2016-08-22 | 2018-03-01 | 富士フイルム株式会社 | 遮光性組成物、遮光膜、固体撮像素子、カラーフィルタ、及び、液晶表示装置 |
US10937714B2 (en) | 2015-11-26 | 2021-03-02 | Robert Bosch Gmbh | Electrical device having a covering material |
Families Citing this family (19)
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US10731067B2 (en) * | 2016-02-25 | 2020-08-04 | Zeon Corporation | Heat conductive sheet and method of producing same, and heat dissipation device |
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JP6960554B1 (ja) * | 2021-06-16 | 2021-11-05 | デクセリアルズ株式会社 | 熱伝導シート及び熱伝導シートの製造方法 |
KR102472849B1 (ko) * | 2022-03-15 | 2022-12-02 | 주식회사 이에스디웍 | 액상 원료 토출기를 이용하는 열전도성 시트의 제조 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000345040A (ja) * | 1999-06-02 | 2000-12-12 | Denki Kagaku Kogyo Kk | 熱伝導性シリコーン成形体の製造方法 |
JP2011249681A (ja) * | 2010-05-28 | 2011-12-08 | Sony Chemical & Information Device Corp | 熱伝導性シート及び半導体装置 |
JP2012023335A (ja) * | 2010-06-17 | 2012-02-02 | Sony Chemical & Information Device Corp | 熱伝導性シート及びその製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11302545A (ja) * | 1998-02-18 | 1999-11-02 | Nippon Mitsubishi Oil Corp | シリコーンゴム複合物 |
JP2002046137A (ja) * | 2000-08-04 | 2002-02-12 | Nippon Graphite Fiber Corp | 熱伝導性シートの製造方法 |
JP3838994B2 (ja) | 2003-06-04 | 2006-10-25 | 電気化学工業株式会社 | 放熱部材 |
JP5175022B2 (ja) | 2004-06-14 | 2013-04-03 | スリーエム イノベイティブ プロパティズ カンパニー | 多層熱伝導性シート |
JP4657816B2 (ja) | 2005-06-03 | 2011-03-23 | ポリマテック株式会社 | 熱伝導性成形体の製造方法及び熱伝導性成形体 |
JP4814550B2 (ja) * | 2005-06-03 | 2011-11-16 | ポリマテック株式会社 | 熱伝導性成形体の製造方法 |
JP5089908B2 (ja) | 2006-04-06 | 2012-12-05 | 株式会社マイクロン | 高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート用配合粒子、高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート、および、その製造方法 |
JP5085050B2 (ja) | 2006-04-06 | 2012-11-28 | 株式会社マイクロン | 高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート用配合粒子、高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート、および、その製造方法 |
JP4897360B2 (ja) | 2006-06-08 | 2012-03-14 | ポリマテック株式会社 | 熱伝導性成形体及びその製造方法 |
JP5608371B2 (ja) * | 2007-01-10 | 2014-10-15 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッド | 熱界面材料及びその製造方法 |
JP5217745B2 (ja) | 2007-08-01 | 2013-06-19 | 日立化成株式会社 | 熱伝導シート及びその製造方法 |
JP5185582B2 (ja) * | 2007-09-11 | 2013-04-17 | 日本バルカー工業株式会社 | 熱伝導性シート |
JP2010050240A (ja) | 2008-08-21 | 2010-03-04 | Toyota Industries Corp | 熱伝導性樹脂シートの製造方法及び製造装置 |
JP2010056299A (ja) | 2008-08-28 | 2010-03-11 | Teijin Ltd | 熱伝導ゴムシートの製造方法 |
JP5671266B2 (ja) * | 2010-06-17 | 2015-02-18 | デクセリアルズ株式会社 | 熱伝導性シート |
CN102971365B (zh) * | 2010-06-17 | 2015-07-01 | 迪睿合电子材料有限公司 | 导热性片和其制造方法 |
JP2013131562A (ja) | 2011-12-20 | 2013-07-04 | Dexerials Corp | 熱伝導性シートの製造方法 |
JP2013131564A (ja) | 2011-12-20 | 2013-07-04 | Dexerials Corp | 熱伝導性シート、この熱伝導性シートを用いた半導体装置及び半導体装置の製造方法 |
JP6034562B2 (ja) * | 2011-12-20 | 2016-11-30 | デクセリアルズ株式会社 | 熱伝導性シート及び熱伝導性シートの製造方法 |
-
2013
- 2013-06-19 JP JP2013128534A patent/JP6069112B2/ja active Active
-
2014
- 2014-06-17 WO PCT/JP2014/065977 patent/WO2014203875A1/ja active Application Filing
- 2014-06-17 KR KR1020187024943A patent/KR102049386B1/ko active IP Right Grant
- 2014-06-17 TW TW103120782A patent/TWI617449B/zh active
- 2014-06-17 CN CN201480034179.0A patent/CN105308740B/zh active Active
- 2014-06-17 KR KR1020167001028A patent/KR20160021830A/ko active Application Filing
-
2015
- 2015-12-08 US US14/962,788 patent/US10012453B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000345040A (ja) * | 1999-06-02 | 2000-12-12 | Denki Kagaku Kogyo Kk | 熱伝導性シリコーン成形体の製造方法 |
JP2011249681A (ja) * | 2010-05-28 | 2011-12-08 | Sony Chemical & Information Device Corp | 熱伝導性シート及び半導体装置 |
JP2012023335A (ja) * | 2010-06-17 | 2012-02-02 | Sony Chemical & Information Device Corp | 熱伝導性シート及びその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016121341A (ja) * | 2014-12-25 | 2016-07-07 | デクセリアルズ株式会社 | 熱伝導シートの製造方法、熱伝導シート、及び半導体装置 |
US10937714B2 (en) | 2015-11-26 | 2021-03-02 | Robert Bosch Gmbh | Electrical device having a covering material |
WO2018037913A1 (ja) * | 2016-08-22 | 2018-03-01 | 富士フイルム株式会社 | 遮光性組成物、遮光膜、固体撮像素子、カラーフィルタ、及び、液晶表示装置 |
JPWO2018037913A1 (ja) * | 2016-08-22 | 2019-06-20 | 富士フイルム株式会社 | 遮光性組成物、遮光膜、固体撮像素子、カラーフィルタ、及び、液晶表示装置 |
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