WO2014195368A1 - Composition pour formation d'un système en couches ou d'un système multicouche réactif et utilisation - Google Patents
Composition pour formation d'un système en couches ou d'un système multicouche réactif et utilisation Download PDFInfo
- Publication number
- WO2014195368A1 WO2014195368A1 PCT/EP2014/061612 EP2014061612W WO2014195368A1 WO 2014195368 A1 WO2014195368 A1 WO 2014195368A1 EP 2014061612 W EP2014061612 W EP 2014061612W WO 2014195368 A1 WO2014195368 A1 WO 2014195368A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- reactive
- layer system
- suspension
- metals
- composition according
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 20
- 239000000725 suspension Substances 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 150000002739 metals Chemical class 0.000 claims abstract description 26
- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- 239000011230 binding agent Substances 0.000 claims abstract description 10
- 239000002245 particle Substances 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000013528 metallic particle Substances 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 9
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 6
- 238000005304 joining Methods 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000003832 thermite Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/23—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces involving a self-propagating high-temperature synthesis or reaction sintering step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0006—Exothermic brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Definitions
- the invention relates to a compilation for the formation of a reactive layer system or multilayer system and their use.
- the composition is preferably formed with at least one suspension.
- reactive multi-layer systems are used for a locally targeted heating, as may be required, for example, in cohesive joining processes. These consist of alternately arranged layers which are formed from or with a different metal and with very small layer thicknesses. By an external energy input, if necessary, an exothermic reaction of the corresponding selected metals are triggered, resulting in a heating in or around the area of the reactive multilayer system, which can be used for example for soldering, welding or curing. So far, it has been customary to form such reactive multilayer systems by vacuum coating methods known per se. In order to increase flexibility in use, films are produced which can then be used on site for a joining process. This is for example in DE 10 2010 060
- Metal particles are applied, which is preferably done by spraying can.
- a binder for example, a suitable adhesive or gel can be used.
- One or more suspensions contain particles of two different metals in a liquid.
- the metallic particles should have a particle size of less than 5 ⁇ m, preferably less than 1 ⁇ m.
- a dispersing agent, a dispersing aid and / or a binder should be present in addition to the metallic particles and the liquid which preferably does not contain water or contains water , The absence of water has the advantage that oxidation of the metals can be avoided.
- a liquid for example
- Alcohols such as ethanol, methanol, isopropanol and the like. be used.
- Surfactants or other surface-active chemical compounds which avoid agglomeration of the metal particles and permit a homogeneous distribution of the metal particles with improved wetting behavior in the liquid can be used as the dispersing or dispersing aids.
- Long-chain polymers for example ethylcellulose, methylcellulose, nitrocellulose, rosin, polyacrylic acid and the like can be used as binders.
- the proportion and the selection should be such that a viscosity is achieved for the suspension at the respective temperature at which an application of the respective suspension takes place on a component or a component which ensures good processability.
- a suspension in which two suitable metals in particle form are contained in the liquid can be used.
- two suspensions A and B in order to form a reactive multilayer system in which layers in alternating arrangement are used one above the other with the two suspensions A and B, in each of which a different metal is contained.
- a liquid and / or a solder contained in a suspension can also be part of the composition. The lot can be on one
- Temperatures of up to 3000 ° C can be achieved with the reactive layer systems or the reactive multilayer systems.
- the advantage of the exploited effect for heating is also in the short time for the Heating and cooling and in addition the locally limited possible heating of one or more component (s), which can also be defined.
- different metal pairs can be used, the exothermic reaction can be exploited.
- group I-Ni / Ti Ti / Al, Y / Ag, Zr / Al, Y / Cu-group II-Ni / Al, Ni / Zr, Ru / Al, Pd / Sn, Pd / Zn, Co / Al, - Group III - Ti / Si, Zr / Si, Pt / Al and Ni / Si.
- the group I pairs are low-energy, achieving lower temperatures and lower temperatures.
- Group II concerns medium-energy and group III higher-energy pairings, which can reach temperatures above 450 ° C, which can be used, for example, in brazing. It is also possible to use Ti / CuO, Al / CuO, Al / Fe 2 O 3 , Al / FeO.
- a liquid and / or a suspension contained in a suspension may be part of the composition, the solder may be applied to a surface of a formed reactive layer system or multi-layer system and temporarily melted due to the exothermic reaction for formation of a cohesive solder joint become.
- the liquid solder for example, a eutectic tin alloy such as e.g. Sn63Pb37 known. But it can also be used a glass frit for a glass solder. The glass frit can be contained in a suspension and processed in this way.
- the energy input to initiate the exothermic reaction may be removed by irradiation, e.g. by laser beam, by electrical means, e.g. by spark rupture or also mechanically, e.g. be achieved by an applied force effect.
- a selected locally limited surface may be coated with a solder or suspension containing a solder.
- an application can also be effected by means of dispenser printing, inkjet printing or aerosoljet printing, which improves the flexibility in the geometric design of layers, even on contoured surfaces. In the simplest case, however, an order can also be made from a tube or a similar container.
- layer thicknesses in the range 20 nm to 3000 ⁇ should be kept. It can in one with a layer in the particles of two
- Metals are formed layer system formed this layer has a layer thickness in the range of 0.5 ⁇ to 3000 ⁇ . In the case of several layers of a reactive multilayer system, layer thicknesses less than 200 ⁇ m should be maintained.
- solder joints e.g. also welded joints are produced.
- This can also be achieved by dispensing with additional material by sufficiently heating the base material of parts to be joined and if necessary additionally exerting a compressive force in the joining region. It is also a cohesive connection of
- the suspension prepared is printed directly onto the components to be joined from brass with an aerosol printer from Optomec on a surface, on each of which a 10 ⁇ thick solder layer of AuSn is applied.
- the printing parameters are chosen so that the layer thickness after drying of the reactive suspension is about 10 ⁇ .
- the printed components are then heated at 150 ° C for 10 minutes to remove remaining solvent residues from the suspension.
- the components are placed against one another and pressed together with the surfaces on which the reactive layer system has been formed.
- the ignition of the reactive layer is brought about by applying an electrical voltage. By the thus initiated exothermic reaction, the solder is melted and made after solidification a cohesive solder joint.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
L'invention concerne une composition comportant au moins une suspension pour la formation d'un système en couches ou d'un système multicouche réactif et son utilisation. Des particules d'au moins deux métaux différents sont des constituants de la composition. Les métaux sont choisis de telle manière qu'en cas d'apport d'énergie, une réaction exothermique a lieu entre les métaux différents, les métaux étant contenus dans au moins une suspension ou pouvant être appliqués sur un liant qui peut être appliqué à la surface d'un composant, de telle manière qu'après la formation d'un système en couches réactif, les métaux sont disposés dans une couche ou de façon alternée dans les couches d'un système multicouche réactif.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE201310009835 DE102013009835A1 (de) | 2013-06-07 | 2013-06-07 | Zusammenstellung für die Ausbildung eines reaktiven Schichtsystems oder Multischichtsystems sowie deren Verwendung |
| DE102013009835.1 | 2013-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2014195368A1 true WO2014195368A1 (fr) | 2014-12-11 |
Family
ID=50976595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2014/061612 WO2014195368A1 (fr) | 2013-06-07 | 2014-06-04 | Composition pour formation d'un système en couches ou d'un système multicouche réactif et utilisation |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE102013009835A1 (fr) |
| WO (1) | WO2014195368A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015103494B4 (de) | 2015-03-10 | 2020-07-16 | Friedrich-Schiller-Universität Jena | Verfahren zur Herstellung eines Reflektorelements und Reflektorelement |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007020389A1 (de) * | 2007-04-30 | 2008-11-06 | Airbus Deutschland Gmbh | Fügeverfahren zum Fügen von Bauteilen |
| DE102009022584A1 (de) * | 2008-05-21 | 2009-11-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum stoffschlüssigen Verbinden von Teilen mit einem Klebstoff |
| WO2010107824A1 (fr) * | 2009-03-16 | 2010-09-23 | University Of Massachusetts | Procédés de fabrication d'éléments de chauffage utilisant des nanostructures |
| DE102011102555A1 (de) * | 2011-05-26 | 2012-11-29 | Forschungszentrum Jülich GmbH | Lotmaterial, Verwendung des Lotmaterials in einer Lotpaste sowie Verfahren zur Herstellung einer Lötverbindung mit Hilfe des Lotmaterials |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090186195A1 (en) * | 2006-09-08 | 2009-07-23 | Reactive Nanotechnologies, Inc. | Reactive Multilayer Joining With Improved Metallization Techniques |
| US9186755B2 (en) * | 2009-10-23 | 2015-11-17 | The Johns Hopkins University | Mechanical processing of reactive laminates |
| DE102010060937A1 (de) | 2010-12-01 | 2012-06-06 | Universität des Saarlandes | Reaktive metallische Multischichten und Verfahren zum Herstellen von reaktiven metallischen Multischichten |
-
2013
- 2013-06-07 DE DE201310009835 patent/DE102013009835A1/de not_active Ceased
-
2014
- 2014-06-04 WO PCT/EP2014/061612 patent/WO2014195368A1/fr active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007020389A1 (de) * | 2007-04-30 | 2008-11-06 | Airbus Deutschland Gmbh | Fügeverfahren zum Fügen von Bauteilen |
| DE102009022584A1 (de) * | 2008-05-21 | 2009-11-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum stoffschlüssigen Verbinden von Teilen mit einem Klebstoff |
| WO2010107824A1 (fr) * | 2009-03-16 | 2010-09-23 | University Of Massachusetts | Procédés de fabrication d'éléments de chauffage utilisant des nanostructures |
| DE102011102555A1 (de) * | 2011-05-26 | 2012-11-29 | Forschungszentrum Jülich GmbH | Lotmaterial, Verwendung des Lotmaterials in einer Lotpaste sowie Verfahren zur Herstellung einer Lötverbindung mit Hilfe des Lotmaterials |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102013009835A1 (de) | 2014-12-11 |
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