WO2014185092A1 - Bonded optical member manufacturing system, manufacturing method, and recording medium - Google Patents

Bonded optical member manufacturing system, manufacturing method, and recording medium Download PDF

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Publication number
WO2014185092A1
WO2014185092A1 PCT/JP2014/051757 JP2014051757W WO2014185092A1 WO 2014185092 A1 WO2014185092 A1 WO 2014185092A1 JP 2014051757 W JP2014051757 W JP 2014051757W WO 2014185092 A1 WO2014185092 A1 WO 2014185092A1
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WO
WIPO (PCT)
Prior art keywords
optical member
bonding
optical
member sheet
display component
Prior art date
Application number
PCT/JP2014/051757
Other languages
French (fr)
Japanese (ja)
Inventor
幹士 藤井
達也 土岡
Original Assignee
住友化学株式会社
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Application filed by 住友化学株式会社 filed Critical 住友化学株式会社
Publication of WO2014185092A1 publication Critical patent/WO2014185092A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing

Definitions

  • the present invention relates to a manufacturing system, a manufacturing method, and a recording medium for an optical member bonded body formed by bonding an optical member to an optical display component.
  • optical display devices such as liquid crystal displays
  • an optical member such as a polarizing plate to be bonded to a liquid crystal panel (optical display component) is cut out from a long film into a sheet piece having a size that matches the display area of the liquid crystal panel. Thereafter, the optical member is bonded to the liquid crystal panel (see, for example, Patent Document 1).
  • the manufacturing system of the optical member bonding body of 1 aspect which concerns on this invention bonds the 1st optical member sheet
  • a cutting device that separates the second region, which is a region, along the outer peripheral edge of the bonding surface between the optical display component and the first optical member sheet detected by the detection device. The first optical member sheet is cut.
  • the “bonding surface between the optical display component and the first optical member sheet” in the above configuration refers to a surface facing the first optical member sheet of the optical display component, and “the outer peripheral edge of the bonding surface”. Specifically, it refers to the outer peripheral edge of the substrate on the side where the first optical member sheet is bonded in the optical display component.
  • the “first region (region corresponding to the bonding surface)” of the first optical member sheet is equal to or larger than the size of the display region of the optical display component facing the first optical member sheet in the first optical member sheet. In addition, it refers to a region that is equal to or smaller than the size of the outer shape (contour shape in plan view) of the optical display component and that avoids functional parts such as electrical component mounting portions in the optical display component.
  • the cutting device may laser-cut the first optical member sheet.
  • the cutting device may laser-cut the first optical member sheet using a CO2 laser cutter.
  • the cutting device cuts out the first optical member sheet having a size corresponding to the bonding surface from the first optical member sheet, so that the optical display component and the You may cut out the optical member bonding body containing a 1st optical member sheet
  • the “size corresponding to the bonding surface” in the above configuration is a size not less than the size of the display area of the optical display component and not more than the size of the outer shape (contour shape in plan view) of the optical display component Point to.
  • the first bonding device has a region that is not less than the size of the display region and not more than the size of the outer shape of the optical display component as the first region. It may be used.
  • the first bonding apparatus may bond the lower surface of the first optical member sheet and the upper surface of the optical display component in contact with each other.
  • the optical display component may further include a first transport device that transports the first bonding device and the cutting device in this order.
  • a second transport device that transports the first optical member sheet to the first bonding device may be further provided.
  • the second transport device may include a recovery unit that recovers the second region of the first optical member sheet cut by the cutting device.
  • a second laminating device for laminating a second optical member sheet larger than the display area of the optical display component may be further provided on the other surface of the optical display component.
  • the cutting device is an area of the second optical member sheet bonded by the second bonding device, and includes the optical display component and the second optical member sheet. Separate the third region corresponding to the bonding surface and the fourth region, which is the region outside the third region of the second optical member sheet, at the same time as separating the first region and the second region. Also good.
  • the first optical member sheet larger than the display area of the optical display component is bonded to one surface of the optical display component;
  • the outer peripheral edge of the bonding surface between the optical display component and the first optical member sheet is detected; Separating a first region corresponding to the bonding surface between the optical display component and the first optical member sheet and a second region which is an outer region of the first region of the first optical member sheet;
  • front Cutting the first optical member sheet is
  • the first optical member sheet larger than the display area of the optical display component is bonded to one surface of the optical display component; the first optical member sheet is bonded In the optical display component, an outer peripheral edge of a bonding surface between the optical display component and the first optical member sheet is detected; a region of the bonded first optical member sheet, the optical display component and the first Separating a first region corresponding to the bonding surface with the optical member sheet and a second region which is an outer region of the first region of the first optical member sheet; the first region and the second region In the step of separating the first optical member sheet along the outer peripheral edge of the bonding surface of the optical display component and the first optical member sheet detected in the optical display component bonded with the first optical member sheet, Cutting an optical member sheet A computer-readable recording medium recording a program for executing the Rukoto.
  • a configuration in which the cutting device laser-cuts the optical member sheet is preferable.
  • mode which concerns on this invention WHEREIN WHEREIN: In the manufacturing method of the optical member bonding body formed by bonding an optical member to an optical display component, an optical member sheet larger than the display area of the said optical display component is provided in the said optical display component.
  • a step of bonding and forming a bonding sheet a step of detecting an outer peripheral edge of a bonding surface of the optical display component and the optical member sheet in the optical display component on which the optical member sheet is bonded, and the optical By cutting off the portion corresponding to the bonding surface with the optical display component of the member sheet and the excess portion outside thereof, and cutting out the optical member having a size corresponding to the bonding surface from the optical member sheet, A step of cutting out the optical member bonded body including the single optical display component and the optical member overlapping therewith from the bonding sheet.
  • seat after bonding the optical member sheet
  • the optical member can be provided with high accuracy up to the bonding surface, and the frame portion outside the display area can be narrowed to enlarge the display area and downsize the device.
  • the optical display component is adjusted according to the optical axis direction. Can be aligned and bonded. Thereby, the precision of the optical axis direction of the optical member with respect to the optical display component can be improved, and the color and contrast of the optical display device can be increased.
  • FIG. 7 is a cross-sectional view taken along the line AA in FIG. 6.
  • This embodiment demonstrates the film bonding system containing the manufacturing apparatus of an optical member bonding body.
  • FIG. 1 shows a schematic configuration of a film bonding system 1 of the present embodiment.
  • the film bonding system 1 bonds a film-shaped optical member such as a polarizing film, a retardation film, and a brightness enhancement film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.
  • a film bonding system manufactures the optical member bonding body containing the said optical display component and an optical member.
  • a liquid crystal panel P is used as the optical display component.
  • Each part of the film bonding system 1 is comprehensively controlled by a control device 20 as an electronic control device.
  • the film bonding system 1 sequentially performs a predetermined process on the liquid crystal panel P while transporting the liquid crystal panel P from the start position to the end position of the bonding process using, for example, a driving roller conveyor 5.
  • the liquid crystal panel P is conveyed on the roller conveyor 5 with its front and back surfaces being horizontal.
  • 1 shows the upstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport upstream side).
  • the right side of FIG. 1 shows the downstream side of the liquid crystal panel P in the transport direction (hereinafter referred to as the panel transport downstream side).
  • the upper side of the liquid crystal panel P on the paper surface indicates the display surface side
  • the lower surface of the paper surface indicates the backlight side.
  • the liquid crystal panel P has a rectangular shape in plan view (see FIG. 6).
  • a display region P4 having an outer shape along the outer peripheral edge is formed on the inner side of the outer peripheral edge of the liquid crystal panel P by a predetermined width (see FIG. 6).
  • the liquid crystal panel P is transported in a direction in which the short side of the display area P4 is substantially along the transport direction on the upstream side of the panel transport with respect to the second alignment device 14 described later.
  • the liquid crystal panel P is transported in a direction in which the long side of the display region P4 is generally along the transport direction on the downstream side of the panel transport from the second alignment device 14.
  • First, second, and third optical members F11, F12, and F13 cut out from the long, strip-like first, second, and third optical member sheets F1, F2, and F3 with respect to the front and back surfaces of the liquid crystal panel P are provided.
  • the liquid crystal panel P is appropriately bonded (see FIG. 8).
  • the 1st optical member F11 and the 3rd optical member F13 as a polarizing film are each bonded on both the backlight side and display surface side of liquid crystal panel P (refer FIG. 8).
  • a second optical member F12 as a brightness enhancement film is further bonded to the first optical member F11 (see FIG. 8).
  • the film bonding system 1 includes a first alignment device 11, a first bonding device 12, a first cutting device 13, and a second alignment device 14.
  • the first alignment device 11 conveys the liquid crystal panel P from the upstream process to the panel conveyance upstream side of the roller conveyor 5 and aligns the liquid crystal panel P.
  • the 1st bonding apparatus 12 is provided in a panel conveyance downstream rather than the 1st alignment apparatus 11.
  • FIG. The first cutting device 13 is provided in the vicinity of the first bonding device 12.
  • the 2nd alignment apparatus 14 is provided in a panel conveyance downstream rather than the 1st bonding apparatus 12 and the 1st cutting device 13.
  • the film bonding system 1 includes a second bonding device 15, a second cutting device 16, a third alignment device 17, a third bonding device 18, and a third cutting device 19.
  • the 2nd bonding apparatus 15 is provided in a panel conveyance downstream rather than the 2nd alignment apparatus 14.
  • FIG. The second cutting device 16 is provided in the vicinity of the second bonding device 15.
  • the 3rd alignment apparatus 17 is provided in a panel conveyance downstream rather than the 2nd bonding apparatus 15 and the 2nd cutting device 16.
  • the 3rd bonding apparatus 18 is provided in a panel conveyance downstream rather than the 3rd alignment apparatus 17.
  • the third cutting device 19 is provided close to the third bonding device 18.
  • the first alignment device 11 holds the liquid crystal panel P and freely conveys it in the vertical direction and the horizontal direction. Further, the first alignment device 11 has a pair of cameras C that image the upstream and downstream ends of the liquid crystal panel P (see FIG. 3). The imaging data of the camera C is sent to the control device 20. The control device 20 operates the first alignment device 11 based on the imaging data and inspection data stored in the optical axis direction, which will be described later. Note that second and third alignment devices 14 and 17 described later also have the camera C, and use image data of the camera C for alignment.
  • the first alignment device 11 is controlled by the control device 20 and performs alignment of the liquid crystal panel P with respect to the first bonding device 12.
  • the liquid crystal panel P is positioned in a horizontal direction (hereinafter referred to as a component width direction) orthogonal to the transport direction and in a rotation direction around the vertical axis (hereinafter simply referred to as a rotation direction).
  • a rotation direction a horizontal direction orthogonal to the transport direction and in a rotation direction around the vertical axis
  • the 1st bonding apparatus 12 bonds the lower surface (backlight side) of liquid crystal panel P conveyed above with respect to the upper surface of the elongate 1st optical member sheet
  • the 1st bonding apparatus 12 is provided with the conveying apparatus 12a and the pinching roll 12b.
  • the conveying apparatus 12a conveys the 1st optical member sheet
  • the pinching roll 12b bonds the lower surface of the liquid crystal panel P conveyed by the roller conveyor 5 to the upper surface of the first optical member sheet F1 conveyed by the conveying device 12a.
  • the transport device 12a includes a roll holding unit 12c and a pf collection unit 12d.
  • the roll holding unit 12c holds the first original roll R1 around which the first optical member sheet F1 is wound, and feeds the first optical member sheet F1 along the longitudinal direction thereof.
  • the pf collection unit 12d collects the protection film pf which is overlapped on the lower surface of the first optical member sheet F1 and is fed out together with the first optical member sheet F1, on the downstream side of the panel transfer of the first bonding apparatus 12.
  • the pinching roll 12b has a pair of laminating rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the inside of this gap is the bonding position of the first bonding apparatus 12.
  • the liquid crystal panel P and the first optical member sheet F1 are overlapped and introduced into the gap.
  • the liquid crystal panel P and the first optical member sheet F1 are sent out to the downstream side of the panel conveyance while being pressed between the bonding rollers. Thereby, the 1st bonding sheet
  • the upper side of the liquid crystal panel P on the paper surface indicates the backlight side
  • the lower surface of the paper surface indicates the display surface side.
  • the 1st cutting device 13 is located in the panel conveyance downstream rather than pf collection
  • the first cutting device 13 cuts a predetermined portion (between the liquid crystal panels P arranged in the transport direction) of the first optical member sheet F1 over the entire width in the component width direction. Thereby, the 1st cutting device 13 cut
  • the size of the surplus portion of the sheet piece F1S (the size of the portion that protrudes outside the liquid crystal panel P) is appropriately set according to the size of the liquid crystal panel P. For example, when the sheet piece F1S is applied to a medium-sized liquid crystal panel P of 5 to 10 inches, the distance between one side of the sheet piece F1S and one side of the liquid crystal panel P is 2 mm at each side of the sheet piece F1S. Set to a length in the range of ⁇ 5 mm.
  • the first cutting device 13 may use a cutting blade or a laser cutter. By the said cutting
  • the second alignment device 14 holds, for example, the first single-sided bonding panel P11 on the roller conveyor 5 and rotates it 90 ° around the vertical axis.
  • the first single-sided bonding panel P11 that has been transported substantially parallel to the short side of the display region P4 changes direction so as to be transported substantially parallel to the long side of the display region P4.
  • the rotation is performed when the optical axis direction of another optical member sheet bonded to the liquid crystal panel P is arranged at a right angle with respect to the optical axis direction of the first optical member sheet F1.
  • the second alignment device 14 performs the same alignment as the first alignment device 11. That is, the 2nd alignment apparatus 14 is based on the inspection data of the optical axis direction memorize
  • the 2nd bonding apparatus 15 is the lower surface (of liquid crystal panel P of the 1st single-sided bonding panel P11 conveyed above that with respect to the upper surface of the elongate 2nd optical member sheet
  • the 2nd bonding apparatus 15 is provided with the conveying apparatus 15a and the pinching roll 15b.
  • the conveying device 15a conveys the second optical member sheet F2 along the longitudinal direction while unwinding the second optical member sheet F2 from the second original roll R2 around which the second optical member sheet F2 is wound.
  • the pinching roll 15b bonds the lower surface of the 1st single-sided bonding panel P11 which the roller conveyor 5 conveys to the upper surface of the 2nd optical member sheet
  • the transport device 15a includes a roll holding unit 15c and a second recovery unit 15d.
  • the roll holding unit 15c holds the second original fabric roll R2 around which the second optical member sheet F2 is wound, and feeds the second optical member sheet F2 along its longitudinal direction.
  • the second collection unit 15d collects an excess portion of the second optical member sheet F2 that has passed through the second cutting device 16 that is located on the downstream side of the panel conveyance with respect to the pinching roll 15b.
  • the pinching roll 15b has a pair of laminating rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the inside of this gap is the bonding position of the second bonding apparatus 15.
  • the first single-sided bonding panel P11 and the second optical member sheet F2 are overlapped and introduced into the gap. These 1st single-sided bonding panels P11 and the 2nd optical member sheet
  • seat F2 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers. Thereby, the 2nd bonding sheet
  • the film bonding system 1 is provided with the 1st detection apparatus 41 (refer FIG. 14).
  • the 1st detection apparatus 41 is provided in a panel conveyance downstream rather than the 2nd bonding apparatus 15.
  • FIG. The 1st detection apparatus 41 detects the edge of the bonding surface (henceforth a 1st bonding surface) with liquid crystal panel P and the sheet piece F1S of the 1st optical member sheet
  • the first detection device 41 includes the edge ED (the outer peripheral edge of the bonding surface) of the first bonding surface SA1 in the four inspection areas CA installed on the conveyance path of the roller conveyor 5. ) Is detected.
  • region CA is arrange
  • the edge ED is detected for each liquid crystal panel P conveyed on the line.
  • the edge ED data detected by the first detection device 41 is stored in a storage unit (not shown).
  • region CA may be arrange
  • FIG. 14 is a schematic diagram of the first detection device 41.
  • the side of the first single-sided bonding panel P11 on which the sheet piece F1S is bonded is defined as the upper side, and the configuration of the first detection device 41 is shown upside down.
  • the first detection device 41 includes the illumination light source 44 that illuminates the edge ED and the first bonding surface SA1 rather than the edge ED with respect to the normal direction of the first bonding surface SA1.
  • An image pickup device 43 that is arranged in an inwardly inclined posture and picks up an image of the edge ED from the side on which the sheet piece F1S of the first single-sided bonding panel P11 is bonded.
  • the illumination light source 44 and the imaging device 43 are respectively arranged in the four inspection areas CA (positions corresponding to the four corners of the first bonding surface SA1) shown in FIG.
  • An angle ⁇ formed between the normal line of the first bonding surface SA1 and the normal line of the image pickup surface 43a of the image pickup device 43 (hereinafter referred to as an inclination angle ⁇ of the image pickup device 43) is divided into panels within the image pickup field of the image pickup device 43. It is preferable to set so that time lag, burrs and the like do not enter. For example, when the end surface of the second substrate P2 is shifted outward from the end surface of the first substrate P1, the inclination angle ⁇ of the imaging device 43 is set so that the edge of the second substrate P2 enters the imaging field of the imaging device 43. Set to not.
  • the inclination angle ⁇ of the imaging device 43 is set to match the distance H (hereinafter referred to as the height H of the imaging device 43) between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43. It is preferred that For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle ⁇ of the imaging device 43 is preferably set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 43 and the inclination angle ⁇ of the imaging device 43 can be obtained based on the deviation amount. In the present embodiment, the height H of the imaging device 43 is set to 78 mm, and the inclination angle ⁇ of the imaging device 43 is set to 10 °.
  • the illumination light source 44 and the imaging device 43 are fixedly arranged in each inspection area CA.
  • the illumination light source 44 and the imaging device 43 may be arrange
  • the illumination light source 44 and the imaging device 43 should each be provided one each. Thereby, the illumination light source 44 and the imaging device 43 can be moved to a position where the edge ED of the first bonding surface SA1 can be easily imaged.
  • the illumination light source 44 is arrange
  • the illumination light source 44 is arrange
  • the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 are parallel.
  • the illumination light source may be arrange
  • optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 may slightly cross each other.
  • each of the imaging device 43 and the illumination light source 44 may be arranged at a position overlapping the edge ED along the normal direction of the first bonding surface SA1.
  • a distance H1 between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43 detects the edge ED of the first bonding surface SA1. It is preferable to set the position at an easy position.
  • the height H1 of the imaging device 43 is preferably set in a range of 50 mm or more and 150 mm or less.
  • the cut position of the sheet piece F1S is adjusted based on the detection result of the edge ED of the first bonding surface SA1.
  • the control apparatus 20 acquires the data of the edge ED of 1st bonding surface SA1 memorize
  • the cut position of the sheet piece F1S is determined so that it does not protrude beyond the outer side.
  • the first cutting device 13 cuts the sheet piece F1S at the cutting position determined by the control device 20.
  • the 2nd cutting device 16 is located in the panel conveyance downstream rather than the 1st detection apparatus 41.
  • the second cutting device 16 is, for example, a CO 2 laser cutter.
  • the second cutting device 16 moves the second optical member sheet F2 and the sheet piece F1S of the first optical member sheet F1 along the edge ED of the first bonding surface SA1 (in this embodiment, the outer peripheral edge of the liquid crystal panel P). Along the edge).
  • the accuracy in the optical axis direction of the optical member sheets F1 and F2 is increased. Further, there is no deviation in the optical axis direction between the optical member sheets F1 and F2. Furthermore, the cutting with the first cutting device 13 is simplified.
  • the second cutting device 16 performs laser cutting along the edge ED, so that the sheet piece F1S (excess of the sheet piece F1S) protrudes from the first single-sided bonding panel P11 to the outside of the first bonding surface SA1. Part) is cut off, and optical members (first and second optical members F11 and F12) having a size corresponding to the first bonding surface SA1 are formed.
  • the 2nd cutting device 16 is corresponded to the cutting device as described in a claim.
  • the “size corresponding to the first bonding surface SA1” is not less than the size of the display area P4 of the liquid crystal panel P and not more than the size of the outer shape (contour shape in plan view) of the liquid crystal panel P.
  • disconnection of the 2nd cutting device 16 is formed (refer FIG. 7).
  • the part (each optical member F11, F12) corresponding to 2nd single-sided bonding panel P12 and 1st bonding surface SA1 is cut off, and the surplus part of each optical member sheet
  • a plurality of surplus portions of the second optical member sheet F2 are connected in a ladder shape. This surplus portion is wound around the second recovery portion 15d together with the surplus portion of the first optical member sheet F1.
  • the “part corresponding to the first bonding surface SA1” is an area that is not less than the size of the display area P4 and not more than the size of the outer shape of the liquid crystal panel P, and a functional part such as an electrical component mounting portion. Indicates an area that avoids.
  • the surplus portion in the three sides excluding the functional portion in the liquid crystal panel P having a rectangular shape in plan view, the surplus portion is laser-cut along the outer peripheral edge of the liquid crystal panel P, and in one side corresponding to the functional portion, the liquid crystal The surplus portion is laser-cut at a position that appropriately enters the display region P4 side from the outer peripheral edge of the panel P.
  • the third alignment device 17 inverts the second single-sided bonding panel P12 with the display surface side of the liquid crystal panel P as the upper surface so that the backlight side of the liquid crystal panel P is the upper surface.
  • the third alignment device 17 performs the same alignment as the first and second alignment devices 11 and 14. That is, the third alignment device 17 is based on the inspection data in the optical axis direction stored in the control device 20 and the imaging data of the camera C, and the component width direction of the second single-sided bonding panel P12 with respect to the third bonding device 18. And positioning in the rotational direction. In this state, the second single-sided bonding panel P ⁇ b> 12 is introduced into the bonding position of the third bonding device 18.
  • the 3rd bonding apparatus 18 is the lower surface (of liquid crystal panel P of 2nd single-sided bonding panel P12 conveyed above that with respect to the upper surface of the elongate 3rd optical member sheet
  • the 3rd bonding apparatus 18 is provided with the conveying apparatus 18a and the pinching roll 18b.
  • the conveying device 18a conveys the third optical member sheet F3 along the longitudinal direction while unwinding the third optical member sheet F3 from the third original roll R3 around which the third optical member sheet F3 is wound.
  • the pinching roll 18b bonds the lower surface of the second single-sided bonding panel P12 conveyed by the roller conveyor 5 to the upper surface of the third optical member sheet F3 conveyed by the conveying device 18a.
  • the transport device 18a includes a roll holding unit 18c and a third recovery unit 18d.
  • the roll holding portion 18c holds the third original fabric roll R3 around which the third optical member sheet F3 is wound, and feeds the third optical member sheet F3 along its longitudinal direction.
  • the third recovery unit 18d recovers the surplus portion of the third optical member sheet F3 that has passed through the third cutting device 19 located on the downstream side of the panel conveyance with respect to the pinching roll 18b.
  • the pinching roll 18b has a pair of laminating rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the third bonding device 18.
  • the second single-sided bonding panel P12 and the third optical member sheet F3 are overlapped and introduced.
  • seat F3 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers. Thereby, the 3rd bonding sheet
  • the film bonding system 1 is provided with the 2nd detection apparatus 42 (refer FIG. 14).
  • the 2nd detection apparatus 42 is provided in a panel conveyance downstream rather than the 3rd bonding apparatus 18.
  • FIG. The 2nd detection apparatus 42 detects the edge of the bonding surface (henceforth a 2nd bonding surface) of liquid crystal panel P and the 3rd optical member sheet
  • the edge data detected by the second detection device 42 is stored in a storage unit (not shown).
  • the cut position of the third optical member sheet F3 is adjusted based on the detection result of the edge of the second bonding surface.
  • the control apparatus 20 (refer FIG. 1) acquires the data of the edge of the 2nd bonding surface memorize
  • the cutting position of the third optical member sheet F3 is determined so as not to protrude.
  • the third cutting device 19 cuts the third optical member sheet F3 at the cutting position determined by the control device 20.
  • the third cutting device 19 is located on the downstream side of the panel conveyance with respect to the second detection device 42, and cuts the third optical member sheet F3.
  • the third cutting device 19 is a laser processing machine similar to the second cutting device 16, and the third optical member sheet F3 is disposed along the edge of the second bonding surface (for example, along the outer peripheral edge of the liquid crystal panel P). Cut endlessly.
  • the third cutting device 19 performs laser cutting along the edge of the second bonding surface, whereby the sheet piece (sheet piece) that protrudes from the second single-sided bonding panel P12 to the outside of the second bonding surface. ) And an optical member (third optical member F13) having a size corresponding to the second bonding surface is formed.
  • the “size corresponding to the second bonding surface” is not less than the size of the display region P4 of the liquid crystal panel P and not more than the size of the outer shape (contour shape in plan view) of the liquid crystal panel P. Point to.
  • the double-sided bonding panel P13 in which the third optical member F13 is bonded to the lower surface of the second single-sided bonding panel P12 is formed by cutting the third cutting device 19 (see FIG. 8). At this time, the double-sided bonding panel P13 and the part (third optical member F13) corresponding to the second bonding surface are cut off and the excess part of the third optical member sheet F3 remaining in a frame shape is separated.
  • seat F3 is continued in multiple numbers similarly to the excessive part of the 2nd optical member sheet
  • the “part corresponding to the second bonding surface” is a region that is not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and a functional part such as an electrical component mounting portion. Indicates the area that was avoided.
  • the surplus portions are laser-cut along the outer peripheral edge of the liquid crystal panel P on the four sides of the liquid crystal panel P having a rectangular shape in plan view. For example, when the portion corresponding to the second bonding surface is the bonding surface of the CF substrate, there is no portion corresponding to the functional portion, so that the four sides of the liquid crystal panel P are cut along the outer peripheral edge of the liquid crystal panel P. .
  • the double-sided bonding panel P13 is inspected for defects (bonding failure, etc.) through a defect inspection device (not shown), and then conveyed to the downstream process for other processing.
  • a long optical film (corresponding to each optical member sheet F1, F2, F3) is manufactured by uniaxially stretching a resin film dyed with a dichroic dye, and the direction of the optical axis of the optical film Generally coincides with the stretching direction of the resin film.
  • the optical axis of the optical film is not uniform throughout the optical film, but varies slightly in the width direction of the optical film.
  • An optical film as a polarizing film is dyed with, for example, iodine or a dichroic dye in order to block light other than light that vibrates in one direction.
  • a release film or a protective film may be further laminated on the optical film.
  • An inspection apparatus for inspecting the optical axis direction of an optical film includes a light source and an analyzer.
  • the light source is disposed on one side of the front and back of the optical film.
  • the analyzer is disposed on the other side of the optical film.
  • the analyzer receives the light irradiated from the light source and transmitted through the optical film, and detects the optical axis of the optical film by detecting the intensity of this light.
  • the analyzer can move, for example, in the width direction of the optical film, and can inspect the optical axis at an arbitrary position in the width direction of the optical film.
  • the inspection data indicating the optical axis direction of each of the optical member sheets F1, F2, and F3 obtained by the inspection apparatus is the longitudinal direction position and the width direction position of each optical member sheet F1, F2, and F3. It is associated and stored in the memory of the control device 20. After this inspection, the optical member sheets F1, F2, and F3 are wound up to form the original rolls R1, R2, and R3, respectively.
  • the optical member sheets F1, F2, and F3 are collectively referred to as the optical member sheet FX
  • the liquid crystal panel P that is bonded to the optical member sheets F1, F2, and F3, and the single-sided bonding panels P11 and P12 are collectively referred to as the optical display member PX. There are things to do.
  • the polarizer film constituting the optical member sheet FX is formed, for example, by uniaxially stretching a PVA film dyed with a dichroic dye.
  • the polarizer film has a difference in the optical axis direction between the inner side in the width direction and the outer side in the width direction of the optical member sheet FX due to uneven thickness of the PVA film when stretched, uneven coloring of the dichroic dye, and the like. Tend to occur.
  • the optical display component PX to be bonded to these is aligned. Then, the optical display component PX is bonded to the optical member sheet FX.
  • an optical axis having a maximum angle and a minimum optical axis with respect to a predetermined reference axis is found. . Then, with the axis that bisects the angle formed by each of these optical axes as an average optical axis of the part, the optical display component PX is aligned with reference to this axis.
  • the optical axis tolerance can be set to approximately 0 ° (allowable tolerance is ⁇ 0.25 °).
  • optical axis direction may be detected while the optical member sheet FX is unwound, and the optical display component PX may be aligned based on the detection data.
  • the various alignment methods described above are not limited to the case where the optical axis direction of the optical member sheet FX is 0 ° and 90 °, but can be applied to any angle.
  • FIG. 3 shows an example in which three optical display components PX are aligned and bonded to a relatively wide optical member sheet FX in the width direction.
  • the present invention is not limited to this, and two or less or four or more optical display components PX may be arranged and bonded in the width direction of the optical member sheet FX.
  • the liquid crystal panel P includes a first substrate P1, a second substrate P2, and a liquid crystal layer P3.
  • the first substrate P1 is a rectangular substrate made of, for example, a TFT substrate.
  • the second substrate P2 is a rectangular substrate disposed to face the first substrate P1.
  • the liquid crystal layer P3 is sealed between the first substrate P1 and the second substrate P2. For convenience of illustration, hatching of each layer in the cross-sectional view may be omitted.
  • the first substrate P1 has the three outer peripheral edges along the corresponding three sides of the second substrate P2, and the remaining one side of the outer peripheral edge protrudes outward from the corresponding one side of the second substrate P2.
  • the electrical component attachment part P5 which protrudes outside the 2nd board
  • the 2nd cutting device 16 is 1st along the outer periphery of the bonding surface (1st bonding surface SA1) of liquid crystal panel P which the 1st detection apparatus 41 detected, and the sheet piece F1S of the 1st optical member sheet
  • the cut end t may swell or wave due to thermal deformation. For this reason, when the optical member sheet FX after laser cutting is bonded to the optical display component PX, poor bonding such as air mixing and distortion is likely to occur in the optical member sheet FX.
  • the optical member sheet FX is laser-cut.
  • the cut end t of the optical member sheet FX is backed up on the glass surface of the liquid crystal panel P. Therefore, the cut end t of the optical member sheet FX is not swollen or undulated, and the bonding failure cannot occur because it is after bonding to the liquid crystal panel P.
  • the runout width (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting blade. Therefore, in the present embodiment, it is possible to reduce the width of the frame portion G as compared with the case where the optical member sheet FX is cut using a cutting blade. Further, the liquid crystal panel P can be reduced in size and / or the display area P4 can be increased in size. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.
  • the optical member sheet FX is cut into a sheet piece aligned with the display region P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and their relative bonding Position tolerances overlap. Therefore, it becomes difficult to narrow the width of the frame part G of the liquid crystal panel P. That is, it becomes difficult to enlarge the display area.
  • the sheet piece of the optical member sheet having a size that protrudes from the optical member sheet FX to the outside of the liquid crystal panel P, and pasting the cut sheet piece on the liquid crystal panel P the sheet piece is cut. Only line runout tolerances need to be considered. Therefore, the tolerance of the width of the frame part G can be reduced ( ⁇ 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).
  • the cutting force is not input to the liquid crystal panel P, and it becomes difficult for cracks and chips to occur at the edge of the substrate of the liquid crystal panel P, such as a heat cycle.
  • the durability against is improved.
  • the energy per unit length of laser irradiation is preferably determined in consideration of the thickness and configuration of the liquid crystal panel P and the optical member sheet FX.
  • the optical member sheet FX when the optical member sheet FX is cut with a laser, it is preferable to perform laser irradiation within an energy range of 0.01 to 0.11 (J / mm) per unit length. If the energy per unit length is too large in laser irradiation, the optical member sheet FX may be damaged when the optical member sheet FX is cut with a laser. However, it is possible to prevent the optical member sheet FX from being damaged by performing laser irradiation within an energy range of 0.01 to 0.11 (J / mm) per unit length.
  • the laser cut start point pt1 is set on the extension of one long side of the display region P4. Then, the cutting of the one long side is started from the starting point pt1.
  • the end point pt2 of the laser cut is set at a position where the laser goes around the display area P4 and reaches the extension of the short side on the start point side of the display area P4.
  • the start point pt1 and the end point pt2 are set so as to be able to withstand the tension when the optical member sheet FX is wound, leaving a predetermined connection allowance in the surplus portion of the optical member sheet FX.
  • the manufacturing system of the optical member bonding body in the above embodiment is the liquid crystal panel P in the manufacturing system of the second single-sided bonding panel P12 formed by bonding the optical members F11 and F12 to the liquid crystal panel P.
  • Bonding devices 12 and 15 first bonding device for bonding optical member sheets F1 and F2 (first optical member sheet) larger than the display area P4 of the liquid crystal panel P to one surface of (optical display component).
  • the first detection device 41 for detecting the outer peripheral edge of the bonding surface of the liquid crystal panel P on which the optical member sheets F1, F2 are bonded and the optical member sheets F1, F2, and the bonding device 12, 15 is a region of the optical member sheets F1 and F2 bonded, and a first region corresponding to the bonding surface of the liquid crystal panel P and the optical member sheets F1 and F2, and the optical member sheet F1
  • a cutting device 16 that separates the second region, which is an outer region of the first region, and the cutting device 16 includes the liquid crystal panel P detected by the first detection device 41 and the optical member sheet F1. , F2 are cut along the outer peripheral edge of the bonding surface with F2.
  • the manufacturing system of the optical member bonding body in the said embodiment WHEREIN In the manufacturing system of the double-sided bonding panel P13 formed by bonding the optical member F13 to the 2nd single-sided bonding panel P12, said 2nd single-sided bonding panel.
  • the bonding device 18 that is bonded to the optical member sheet F3 larger than the display area P4 of the liquid crystal panel P on the surface opposite to the optical members F11 and F12 of P12 to form the third bonding sheet F23;
  • the cutting device 19 may laser-cut the optical member sheets F1 and F2.
  • the cutting device 19 may laser-cut the first optical member sheet using a CO 2 laser cutter.
  • the cutting device 19 cuts the optical member sheets F1 and F2 having a size corresponding to the bonding surface from the optical member sheets F1 and F2, thereby the liquid crystal. You may cut out the 2nd bonding sheet
  • the said bonding apparatuses 12 and 15 are more than the magnitude
  • the said bonding apparatuses 12 and 15 may bond so that the lower surface of the said optical member sheet
  • the roller conveyor 5 (1st conveying apparatus) which conveys the said liquid crystal panel P in order of the said bonding apparatuses 12 and 15 and the said cutting device 19 as mentioned above.
  • the said conveying apparatus 12a is the 2nd collection
  • the bonding apparatus 18 which bonds the optical member sheet
  • the said cutting device 19 is the area
  • the third region corresponding to the mating surface and the fourth region that is the region outside the third region of the optical member sheet F3 may be separated simultaneously with the separation of the first region and the second region. .
  • the optical members F11, F12, and F13 can be accurately provided up to the display region P4, and the frame portion G outside the display region P4 can be narrowed to enlarge the display area and downsize the device. Moreover, it bonds on liquid crystal panel P to optical member sheet
  • the said cutting devices 16 and 19 laser-cut the said optical member sheet
  • the manufacturing method of the optical member bonding body in the said embodiment is optical member sheet
  • One optical member sheet) and the outer peripheral edge of the bonding surface of the liquid crystal panel P and the optical member sheets F1, F2 is detected in the liquid crystal panel P to which the optical member sheets F1, F2 are bonded, The first region corresponding to the bonding surface of the liquid crystal panel P and the optical member sheets F1 and F2 in the region of the bonded optical member sheets F1 and F2, and the optical member sheets F1 and F2.
  • the liquid crystal panel on which the optical member sheets F1 and F2 are bonded Along the outside edge of the lamination surface of the said liquid crystal panel P detected optical member sheet F1, F2 in, cutting the optical member sheet F1, F2.
  • the manufacturing method of the optical member bonding body in the said embodiment is a display area of said 2nd single-sided bonding panel P12 on the surface on the opposite side to said optical members F11 and F12 of said 2nd single-sided bonding panel P12.
  • the liquid crystal panel P and the third optical member in the liquid crystal panel P in which the third optical member sheet F3 is bonded, and the step of bonding to the optical member sheet F3 larger than P4 to form the third bonding sheet F23 The step of detecting the outer peripheral edge of the bonding surface with the sheet F3, the portion corresponding to the bonding surface with the liquid crystal panel P of the optical member sheet F3, and the excess portion outside thereof are separated, and the optical member sheet By cutting out the optical member F13 having a size corresponding to the bonding surface from F3, the single liquid crystal panel P and the optical member F13 overlapping therewith from the third bonding sheet F23. And a step of cutting the free said double-sided lamination panel P13.
  • FIG. 11 shows a modification of the film bonding system 1. This differs from the configuration of FIG. 1 in that a first bonding device 12 ′ replacing the first bonding device 12 and a first cutting device 13 ′ replacing the first cutting device 13 are provided.
  • the other components that are the same as those in the above embodiment are given the same reference numerals, and detailed description thereof is omitted.
  • 1st bonding apparatus 12 ' is equipped with the conveying apparatus 12a' replaced with the said conveying apparatus 12a.
  • the transport device 12a 'further includes a first recovery unit 12e in addition to the roll holding unit 12c and the pf recovery unit 12d, as compared with the transport device 12a.
  • recovery part 12e winds up the excess part of the 1st optical member sheet
  • 1st cutting device 13 ' is located in the panel conveyance downstream rather than the pf collection
  • the first cutting device 13 ' cuts the first optical member sheet F1 so as to cut out a sheet piece larger than the display area P4 from the first optical member sheet F1.
  • the first cutting device 13 ′ is a laser beam machine similar to the second and third cutting devices 16 and 19.
  • FIG. 12 shows another modification of the film bonding system 1. This differs from the configuration of FIG. 1 in that a third alignment device 17 ′ and a third bonding device 18 ′ are provided in place of the third alignment device 17 and the third bonding device 18.
  • the other components that are the same as those in the above embodiment are given the same reference numerals, and detailed description thereof is omitted.
  • the third alignment device 17 ′ has a panel front / back reversing function and has only the same alignment function as the first and second alignment devices 11 and 14. It has a simple configuration. That is, the third alignment device 17 ′ is a component of the second single-sided bonding panel P12 for the third bonding device 18 ′ based on the inspection data in the optical axis direction stored in the control device 20 and the imaging data of the camera C. Positioning is performed in the width direction and rotation direction. In this state, the second single-sided bonding panel P12 is introduced into the bonding position of the third bonding device 18 '.
  • 3rd bonding apparatus 18 ' is the 1st conveyed below the lower surface of the elongate 3rd optical member sheet
  • the upper surface (the display surface side of the liquid crystal panel P) of the two-sided bonding panel P12 is bonded.
  • 3rd bonding apparatus 18 ' has the structure which reversed the top and bottom of the said conveying apparatus 18a and the pinching roll 18b. Thereby, the bonding surface of the 3rd optical member sheet
  • this invention is not restricted to the said embodiment and modification,
  • seat suitably may be sufficient.
  • the structure in the said embodiment and modification is an example of this invention, A various change is possible in the range which does not deviate from the summary of the said invention.
  • the above-described control device 20 has a computer system inside.
  • the operation of each device described above is stored in a computer-readable recording medium in the form of a program, and the above processing is performed by the computer reading and executing this program.
  • the computer-readable recording medium means a magnetic disk, a magneto-optical disk, a CD-ROM, a DVD-ROM, a semiconductor memory, or the like.
  • the computer program may be distributed to the computer via a communication line, and the computer that has received the distribution may execute the program.
  • the program may be for realizing a part of the functions described above. Furthermore, what can implement
  • the outer periphery of the bonding surface is detected for every some liquid crystal panel P using a detection apparatus, and for each liquid crystal panel P based on the detected outer periphery.
  • the optical member having a desired size can be separated regardless of the individual differences in the sizes of the liquid crystal panel P and the optical member sheet. Therefore, the quality variation due to the individual differences in the sizes of the liquid crystal panel P and the optical member sheet is reduced.
  • the frame portion around the display area can be reduced to enlarge the display area and downsize the device.
  • the present invention can be applied to a manufacturing system, a manufacturing method, a recording medium, and the like of an optical member bonding body that can reduce the frame portion around the display area to increase the display area and downsize the device.

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Abstract

A bonded optical member manufacturing system comprising: a first bonding device for bonding a first optical member sheet, which is larger than a display region of an optical display component, to one surface of the optical display component; a detection device for detecting the outer peripheral edge of the bonding surface of the first optical member sheet and the optical display component to which the first optical member sheet has been bonded; and a cutting device for cutting apart a first region, which is a region of the first optical member sheet that has been bonded by the first bonding device, and corresponds to the bonding surface of the first optical member sheet and the optical display component, from a second region, which is a region of the first optical member sheet that is outside of the first region. The cutting device cuts the first optical member sheet along the outer peripheral edge, which has been detected by the detection device, of the bonding surface of the first optical member sheet and the optical display component.

Description

光学部材貼合体の製造システム、製造方法及び記録媒体Manufacturing system, manufacturing method and recording medium for optical member bonded body
　　本発明は、光学表示部品に光学部材を貼合してなる光学部材貼合体の製造システム、製造方法及び記録媒体に関する。
　本願は、２０１３年５月１６日に出願された日本国特願２０１３－１０４１４５号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to a manufacturing system, a manufacturing method, and a recording medium for an optical member bonded body formed by bonding an optical member to an optical display component.
This application claims priority based on Japanese Patent Application No. 2013-104145 for which it applied on May 16, 2013, and uses the content here.
　　従来、液晶ディスプレイ等の光学表示デバイスの生産システムが知られている。この生産システムでは、液晶パネル（光学表示部品）に貼合する偏光板等の光学部材は、長尺フィルムから液晶パネルの表示領域に合わせたサイズのシート片に切り出される。その後、光学部材は、液晶パネルに貼合される（例えば、特許文献１参照）。 Conventionally, production systems for optical display devices such as liquid crystal displays are known. In this production system, an optical member such as a polarizing plate to be bonded to a liquid crystal panel (optical display component) is cut out from a long film into a sheet piece having a size that matches the display area of the liquid crystal panel. Thereafter, the optical member is bonded to the liquid crystal panel (see, for example, Patent Document 1).
日本国特開２００３－２５５１３２号公報Japanese Unexamined Patent Publication No. 2003-255132
　　しかし、上記従来の構成では、液晶パネル及びシート片の各寸法バラツキ、並びに液晶パネルに対するシート片の貼合バラツキ（位置ズレ）を考慮して、表示領域よりも若干大きめのシート片を切り出している。そのため、表示領域の周辺部に余分な領域（額縁部）が形成され、機器の小型化が阻害されるという問題がある。 However, in the conventional configuration described above, a sheet piece slightly larger than the display area is cut out in consideration of variation in dimensions of the liquid crystal panel and the sheet piece, and bonding variation (positional deviation) of the sheet piece to the liquid crystal panel. . Therefore, there is a problem that an extra area (frame part) is formed around the display area, and downsizing of the device is hindered.
　　本発明に係る態様は、上記事情に鑑みてなされたもので、表示領域周辺の額縁部を縮小して表示エリアの拡大及び機器の小型化を図ることができる光学部材貼合体の製造システム、製造方法及び記録媒体を提供することを目的とする。 The aspect which concerns on this invention was made | formed in view of the said situation, the manufacturing system of the optical member bonding body which can aim at the enlargement of a display area, and size reduction of an apparatus by reducing the frame part around a display area, manufacture It is an object to provide a method and a recording medium.
（１）本発明に係る一態様の光学部材貼合体の製造システムは、光学表示部品の一方の面に、前記光学表示部品の表示領域よりも大きい第一光学部材シートを貼り合わせる第一貼合装置と；前記第一光学部材シートが貼合された前記光学表示部品と前記第一光学部材シートとの貼合面の外周縁を検出する検出装置と；前記第一貼合装置が貼合した前記第一光学部材シートの領域であって前記光学表示部品と前記第一光学部材シートとの前記貼合面に対応する第一領域と、前記第一光学部材シートの前記第一領域の外側の領域である第二領域とを切り離す切断装置と；を備え、前記切断装置は、前記検出装置が検出した前記光学表示部品と前記第一光学部材シートとの前記貼合面の外周縁に沿って、前記第一光学部材シートを切断する。
　　なお、上記構成中の「光学表示部品と第一光学部材シートとの貼合面」とは、光学表示部品の第一光学部材シートと対向する面を指し、「貼合面の外周縁」とは、具体的には、光学表示部品において第一光学部材シートが貼合された側の基板の外周縁を指す。
　また、第一光学部材シートの「第一領域（貼合面に対応する領域）」とは、第一光学部材シートにおいて、第一光学部材シートと対向する光学表示部品の表示領域の大きさ以上、光学表示部品の外形状（平面視における輪郭形状）の大きさ以下の領域であって、かつ光学表示部品における電気部品取付部等の機能部分を避けた領域を指す。 (1) The manufacturing system of the optical member bonding body of 1 aspect which concerns on this invention bonds the 1st optical member sheet | seat larger than the display area of the said optical display component to the one surface of an optical display component. An apparatus; a detection device for detecting an outer peripheral edge of a bonding surface of the optical display component on which the first optical member sheet is bonded and the first optical member sheet; and the first bonding apparatus bonded. A first region corresponding to the bonding surface of the optical display component and the first optical member sheet, and a region outside the first region of the first optical member sheet. A cutting device that separates the second region, which is a region, along the outer peripheral edge of the bonding surface between the optical display component and the first optical member sheet detected by the detection device. The first optical member sheet is cut.
The “bonding surface between the optical display component and the first optical member sheet” in the above configuration refers to a surface facing the first optical member sheet of the optical display component, and “the outer peripheral edge of the bonding surface”. Specifically, it refers to the outer peripheral edge of the substrate on the side where the first optical member sheet is bonded in the optical display component.
The “first region (region corresponding to the bonding surface)” of the first optical member sheet is equal to or larger than the size of the display region of the optical display component facing the first optical member sheet in the first optical member sheet. In addition, it refers to a region that is equal to or smaller than the size of the outer shape (contour shape in plan view) of the optical display component and that avoids functional parts such as electrical component mounting portions in the optical display component.
（２）上記（１）の態様において、前記切断装置は、前記第一光学部材シートをレーザーカットしても良い。 (2) In the above aspect (1), the cutting device may laser-cut the first optical member sheet.
（３）上記（２）の態様において、前記切断装置は、ＣＯ２レーザーカッターを用いて前記第一光学部材シートをレーザーカットしても良い。 (3) In the aspect of (2) above, the cutting device may laser-cut the first optical member sheet using a CO2 laser cutter.
（４）上記（１）の態様において、前記切断装置は、前記第一光学部材シートから前記貼合面に対応する大きさの前記第一光学部材シートを切り出すことで、前記光学表示部品及び前記第一光学部材シートを含む光学部材貼合体を切り出しても良い。
　なお、上記構成中の「貼合面に対応する大きさ」とは、光学表示部品の表示領域の大きさ以上、光学表示部品の外形状（平面視における輪郭形状）の大きさ以下の大きさを指す。 (4) In the aspect of (1), the cutting device cuts out the first optical member sheet having a size corresponding to the bonding surface from the first optical member sheet, so that the optical display component and the You may cut out the optical member bonding body containing a 1st optical member sheet | seat.
In addition, the “size corresponding to the bonding surface” in the above configuration is a size not less than the size of the display area of the optical display component and not more than the size of the outer shape (contour shape in plan view) of the optical display component Point to.
（５）上記（１）の態様において、前記第一貼合装置は、前記第一領域として、前記表示領域の大きさ以上であって、前記光学表示部品の外形状の大きさ以下の領域を用いても良い。 (5) In the aspect of the above (1), the first bonding device has a region that is not less than the size of the display region and not more than the size of the outer shape of the optical display component as the first region. It may be used.
（６）上記（１）の態様において、前記第一貼合装置は、前記第一光学部材シートの下面と、前記光学表示部品の上面とが接するように貼合しても良い。 (6) In the above aspect (1), the first bonding apparatus may bond the lower surface of the first optical member sheet and the upper surface of the optical display component in contact with each other.
（７）上記（１）の態様において、前記光学表示部品を、前記第一貼合装置、前記切断装置の順に搬送する第一搬送装置を更に備えても良い。 (7) In the above aspect (1), the optical display component may further include a first transport device that transports the first bonding device and the cutting device in this order.
（８）上記（１）の態様において、前記第一光学部材シートを、前記第一貼合装置に搬送する第二搬送装置を更に備えても良い。 (8) In the above aspect (1), a second transport device that transports the first optical member sheet to the first bonding device may be further provided.
（９）上記（８）の態様において、前記第二搬送装置は、前記切断装置で切り離した前記第一光学部材シートの前記第二領域を回収する回収部を備えても良い。 (9) In the aspect of (8), the second transport device may include a recovery unit that recovers the second region of the first optical member sheet cut by the cutting device.
（１０）上記（１）の態様において、光学表示部品の他方の面に、前記光学表示部品の表示領域よりも大きい第二光学部材シートを貼り合わせる第二貼合装置を更に備えても良い。 (10) In the aspect of the above (1), a second laminating device for laminating a second optical member sheet larger than the display area of the optical display component may be further provided on the other surface of the optical display component.
（１１）上記（１０）の態様において、前記切断装置は、前記第二貼合装置が貼合した前記第二光学部材シートの領域であって前記光学表示部品と前記第二光学部材シートとの貼合面に対応する第三領域と、前記第二光学部材シートの前記第三領域の外側の領域である第四領域とを、前記第一領域と前記第二領域とを切り離すと同時に切り離しても良い。 (11) In the aspect of the above (10), the cutting device is an area of the second optical member sheet bonded by the second bonding device, and includes the optical display component and the second optical member sheet. Separate the third region corresponding to the bonding surface and the fourth region, which is the region outside the third region of the second optical member sheet, at the same time as separating the first region and the second region. Also good.
（１２）本発明に係る一態様の光学部材貼合体の製造方法は、光学表示部品の一方の面に、前記光学表示部品の表示領域よりも大きい第一光学部材シートを貼り合わせ；前記第一光学部材シートが貼合された前記光学表示部品において前記光学表示部品と前記第一光学部材シートとの貼合面の外周縁を検出し；貼合した前記第一光学部材シートの領域であって前記光学表示部品と前記第一光学部材シートとの前記貼合面に対応する第一領域と、前記第一光学部材シートの前記第一領域の外側の領域である第二領域とを切り離し；前記第一領域と前記第二領域とを切り離すステップでは、前記第一光学部材シートが貼合された前記光学表示部品において検出した前記光学表示部品と前記第一光学部材シートとの前記貼合面の外周縁に沿って、前記第一光学部材シートを切断する。 (12) In the manufacturing method of the optical member bonded body according to one aspect of the present invention, the first optical member sheet larger than the display area of the optical display component is bonded to one surface of the optical display component; In the optical display component to which the optical member sheet is bonded, the outer peripheral edge of the bonding surface between the optical display component and the first optical member sheet is detected; Separating a first region corresponding to the bonding surface between the optical display component and the first optical member sheet and a second region which is an outer region of the first region of the first optical member sheet; In the step of separating the first region and the second region, the bonding surface of the optical display component and the first optical member sheet detected in the optical display component to which the first optical member sheet has been bonded. Along the outer periphery, front Cutting the first optical member sheet.
（１３）本発明に係る一態様は、光学表示部品の一方の面に、前記光学表示部品の表示領域よりも大きい第一光学部材シートを貼り合わせ；前記第一光学部材シートが貼合された前記光学表示部品において前記光学表示部品と前記第一光学部材シートとの貼合面の外周縁を検出し；貼合した前記第一光学部材シートの領域であって前記光学表示部品と前記第一光学部材シートとの前記貼合面に対応する第一領域と、前記第一光学部材シートの前記第一領域の外側の領域である第二領域とを切り離し；前記第一領域と前記第二領域とを切り離すステップでは、前記第一光学部材シートが貼合された前記光学表示部品において検出した前記光学表示部品と前記第一光学部材シートとの前記貼合面の外周縁に沿って、前記第一光学部材シートを切断することを実行するプログラムを記録したコンピュータ読み取り可能な記録媒体である。 (13) In one aspect of the present invention, the first optical member sheet larger than the display area of the optical display component is bonded to one surface of the optical display component; the first optical member sheet is bonded In the optical display component, an outer peripheral edge of a bonding surface between the optical display component and the first optical member sheet is detected; a region of the bonded first optical member sheet, the optical display component and the first Separating a first region corresponding to the bonding surface with the optical member sheet and a second region which is an outer region of the first region of the first optical member sheet; the first region and the second region In the step of separating the first optical member sheet along the outer peripheral edge of the bonding surface of the optical display component and the first optical member sheet detected in the optical display component bonded with the first optical member sheet, Cutting an optical member sheet A computer-readable recording medium recording a program for executing the Rukoto.
　　上記光学部材貼合体の製造装置では、前記切断装置が、前記光学部材シートをレーザーカットする構成が好ましい。 In the manufacturing apparatus for the optical member bonded body, a configuration in which the cutting device laser-cuts the optical member sheet is preferable.
　　また、本発明に係る一態様は、光学表示部品に光学部材を貼合してなる光学部材貼合体の製造方法において、前記光学表示部品に前記光学表示部品の表示領域よりも大きい光学部材シートを貼り合わせて貼合シートとする工程と、前記光学部材シートが貼合された前記光学表示部品において前記光学表示部品と前記光学部材シートとの貼合面の外周縁を検出する工程と、前記光学部材シートの前記光学表示部品との前記貼合面に対応する部分とその外側の余剰部分とを切り離し、前記光学部材シートから前記貼合面に対応する大きさの前記光学部材を切り出すことで、前記貼合シートから単一の前記光学表示部品及びこれに重なる前記光学部材を含む前記光学部材貼合体を切り出す工程とを含むことを特徴とする。 Moreover, the one aspect | mode which concerns on this invention WHEREIN: In the manufacturing method of the optical member bonding body formed by bonding an optical member to an optical display component, an optical member sheet larger than the display area of the said optical display component is provided in the said optical display component. A step of bonding and forming a bonding sheet, a step of detecting an outer peripheral edge of a bonding surface of the optical display component and the optical member sheet in the optical display component on which the optical member sheet is bonded, and the optical By cutting off the portion corresponding to the bonding surface with the optical display component of the member sheet and the excess portion outside thereof, and cutting out the optical member having a size corresponding to the bonding surface from the optical member sheet, A step of cutting out the optical member bonded body including the single optical display component and the optical member overlapping therewith from the bonding sheet.
　　本発明に係る態様によれば、表示領域よりも大きい光学部材シートを光学表示部品に貼合した後に、光学部材シートの余剰部分を切り離す。そのため、貼合面に対応する大きさの光学部材を光学表示部品の面上で形成することができる。これにより、光学部材を貼合面の際まで精度よく設けることができ、表示領域外側の額縁部を狭めて表示エリアの拡大及び機器の小型化を図ることができる。
　　また、表示領域よりも大きい光学部材シートに光学表示部品を貼合することで、光学部材シートの位置に応じてその光学軸方向が変化する場合でも、この光学軸方向に合わせて光学表示部品をアライメントして貼合することができる。これにより、光学表示部品に対する光学部材の光学軸方向の精度を向上させることができ、光学表示デバイスの精彩及びコントラストを高めることができる。 According to the aspect which concerns on this invention, after bonding the optical member sheet | seat larger than a display area to an optical display component, the excess part of an optical member sheet | seat is cut off. Therefore, an optical member having a size corresponding to the bonding surface can be formed on the surface of the optical display component. Thereby, the optical member can be provided with high accuracy up to the bonding surface, and the frame portion outside the display area can be narrowed to enlarge the display area and downsize the device.
Moreover, even when the optical axis direction changes according to the position of the optical member sheet by bonding the optical display component to the optical member sheet that is larger than the display area, the optical display component is adjusted according to the optical axis direction. Can be aligned and bonded. Thereby, the precision of the optical axis direction of the optical member with respect to the optical display component can be improved, and the color and contrast of the optical display device can be increased.
本発明の実施形態における光学表示デバイスのフィルム貼合システムの概略構成図である。It is a schematic block diagram of the film bonding system of the optical display device in embodiment of this invention. 上記フィルム貼合システムの第二貼合装置周辺の斜視図である。It is a perspective view of the 2nd bonding apparatus periphery of the said film bonding system. 上記フィルム貼合システムの光学部材シートの光学軸方向とこれに貼合する光学表示部品とを示す斜視図である。It is a perspective view which shows the optical axis direction of the optical member sheet | seat of the said film bonding system, and the optical display component bonded to this. 上記フィルム貼合システム中の第一貼合シートの断面図である。It is sectional drawing of the 1st bonding sheet | seat in the said film bonding system. 上記フィルム貼合システムの第二切断装置中の第二貼合シートの断面図である。It is sectional drawing of the 2nd bonding sheet | seat in the 2nd cutting device of the said film bonding system. 上記フィルム貼合システムの第三切断装置中の第三貼合シートの平面図である。It is a top view of the 3rd bonding sheet | seat in the 3rd cutting device of the said film bonding system. 図６のＡ－Ａ断面図である。FIG. 7 is a cross-sectional view taken along the line AA in FIG. 6. 上記フィルム貼合システムを経た両面貼合パネルの断面図である。It is sectional drawing of the double-sided bonding panel which passed through the said film bonding system. 液晶パネルに貼合した光学部材シートのレーザーによる切断端を示す断面図である。It is sectional drawing which shows the cutting end by the laser of the optical member sheet | seat bonded to the liquid crystal panel. 光学部材シート単体のレーザーによる切断端を示す断面図である。It is sectional drawing which shows the cutting end by the laser of a single optical member sheet | seat. 上記フィルム貼合システムの第一貼合装置周辺の変形例を示す概略構成図である。It is a schematic block diagram which shows the modification of the 1st bonding apparatus periphery of the said film bonding system. 上記フィルム貼合システムの第三貼合装置周辺の変形例を示す概略構成図である。It is a schematic block diagram which shows the modification of the 3rd bonding apparatus periphery of the said film bonding system. 貼合面の端縁の検出工程を示す平面図である。It is a top view which shows the detection process of the edge of a bonding surface. 検出装置の模式図である。It is a schematic diagram of a detection apparatus. 検出装置の変形例を示す模式図である。It is a schematic diagram which shows the modification of a detection apparatus.
　　　以下、本発明の実施形態について図面を参照して説明する。本実施形態では、光学部材貼合体の製造装置を含むフィルム貼合システムについて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. This embodiment demonstrates the film bonding system containing the manufacturing apparatus of an optical member bonding body.
　　　図１は、本実施形態のフィルム貼合システム１の概略構成を示す。フィルム貼合システム１は、例えば液晶パネルや有機ＥＬパネルといったパネル状の光学表示部品に、偏光フィルムや位相差フィルム、輝度上昇フィルムといったフィルム状の光学部材を貼合する。
　　フィルム貼合システムは、前記光学表示部品及び光学部材を含んだ光学部材貼合体を製造する。フィルム貼合システム１では、前記光学表示部品として液晶パネルＰを用いる。フィルム貼合システム１の各部は、電子制御装置としての制御装置２０により統括制御される。 FIG. 1 shows a schematic configuration of a film bonding system 1 of the present embodiment. The film bonding system 1 bonds a film-shaped optical member such as a polarizing film, a retardation film, and a brightness enhancement film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.
A film bonding system manufactures the optical member bonding body containing the said optical display component and an optical member. In the film bonding system 1, a liquid crystal panel P is used as the optical display component. Each part of the film bonding system 1 is comprehensively controlled by a control device 20 as an electronic control device.
　　　フィルム貼合システム１は、貼合工程の始発位置から終着位置まで、例えば駆動式のローラコンベヤ５を用いて液晶パネルＰを搬送しつつ、液晶パネルＰに順次所定の処理を施す。液晶パネルＰは、その表裏面を水平にした状態でローラコンベヤ５上を搬送される。
　　　尚、図１の紙面左側は液晶パネルＰの搬送方向上流側（以下、パネル搬送上流側という）を示す。図１の紙面右側は液晶パネルＰの搬送方向下流側（以下、パネル搬送下流側という）を示す。 The film bonding system 1 sequentially performs a predetermined process on the liquid crystal panel P while transporting the liquid crystal panel P from the start position to the end position of the bonding process using, for example, a driving roller conveyor 5. The liquid crystal panel P is conveyed on the roller conveyor 5 with its front and back surfaces being horizontal.
1 shows the upstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport upstream side). The right side of FIG. 1 shows the downstream side of the liquid crystal panel P in the transport direction (hereinafter referred to as the panel transport downstream side).
　　　図６～図８を併せて参照して説明する。尚、図７および図８において、液晶パネルＰの紙面上側は表示面側を示しており、紙面下側はバックライト側を示している。液晶パネルＰは平面視で長方形状である（図６参照）。液晶パネルＰの外周縁よりも所定幅だけ内側に、前記外周縁に沿う外形状を有する表示領域Ｐ４を形成する（図６参照）。液晶パネルＰは、後述する第二アライメント装置１４よりもパネル搬送上流側では、表示領域Ｐ４の短辺を概ね搬送方向に沿わせた向きで搬送される。液晶パネルＰは、前記第二アライメント装置１４よりもパネル搬送下流側では、表示領域Ｐ４の長辺を概ね搬送方向に沿わせた向きで搬送される。 This will be described with reference to FIGS. 6 to 8 together. 7 and 8, the upper side of the liquid crystal panel P on the paper surface indicates the display surface side, and the lower surface of the paper surface indicates the backlight side. The liquid crystal panel P has a rectangular shape in plan view (see FIG. 6). A display region P4 having an outer shape along the outer peripheral edge is formed on the inner side of the outer peripheral edge of the liquid crystal panel P by a predetermined width (see FIG. 6). The liquid crystal panel P is transported in a direction in which the short side of the display area P4 is substantially along the transport direction on the upstream side of the panel transport with respect to the second alignment device 14 described later. The liquid crystal panel P is transported in a direction in which the long side of the display region P4 is generally along the transport direction on the downstream side of the panel transport from the second alignment device 14.
　　　この液晶パネルＰの表裏面に対して、長尺帯状の第一、第二及び第三光学部材シートＦ１，Ｆ２，Ｆ３から切り出した第一、第二及び第三光学部材Ｆ１１，Ｆ１２，Ｆ１３が、液晶パネルＰに適宜貼合される（図８参照）。本実施形態において、液晶パネルＰのバックライト側及び表示面側の両面には、偏光フィルムとしての第一光学部材Ｆ１１及び第三光学部材Ｆ１３がそれぞれ貼合される（図８参照）。液晶パネルＰのバックライト側の面には、第一光学部材Ｆ１１に重ねて輝度向上フィルムとしての第二光学部材Ｆ１２がさらに貼合される（図８参照）。 First, second, and third optical members F11, F12, and F13 cut out from the long, strip-like first, second, and third optical member sheets F1, F2, and F3 with respect to the front and back surfaces of the liquid crystal panel P are provided. The liquid crystal panel P is appropriately bonded (see FIG. 8). In this embodiment, the 1st optical member F11 and the 3rd optical member F13 as a polarizing film are each bonded on both the backlight side and display surface side of liquid crystal panel P (refer FIG. 8). On the backlight side surface of the liquid crystal panel P, a second optical member F12 as a brightness enhancement film is further bonded to the first optical member F11 (see FIG. 8).
　　　図１に示すように、フィルム貼合システム１は、第一アライメント装置１１、第一貼合装置１２、第一切断装置１３、第二アライメント装置１４を備える。
　　　第一アライメント装置１１は、上流工程からローラコンベヤ５のパネル搬送上流側上に液晶パネルＰを搬送すると共に液晶パネルＰのアライメントを行う。第一貼合装置１２は、第一アライメント装置１１よりもパネル搬送下流側に設けられる。第一切断装置１３は、第一貼合装置１２に近接して設けられる。第二アライメント装置１４は、第一貼合装置１２及び第一切断装置１３よりもパネル搬送下流側に設けられる。 As shown in FIG. 1, the film bonding system 1 includes a first alignment device 11, a first bonding device 12, a first cutting device 13, and a second alignment device 14.
The first alignment device 11 conveys the liquid crystal panel P from the upstream process to the panel conveyance upstream side of the roller conveyor 5 and aligns the liquid crystal panel P. The 1st bonding apparatus 12 is provided in a panel conveyance downstream rather than the 1st alignment apparatus 11. FIG. The first cutting device 13 is provided in the vicinity of the first bonding device 12. The 2nd alignment apparatus 14 is provided in a panel conveyance downstream rather than the 1st bonding apparatus 12 and the 1st cutting device 13. FIG.
　　　また、フィルム貼合システム１は、第二貼合装置１５、第二切断装置１６、第三アライメント装置１７、第三貼合装置１８、第三切断装置１９を備える。
　　　第二貼合装置１５は、第二アライメント装置１４よりもパネル搬送下流側に設けられる。第二切断装置１６は、第二貼合装置１５に近接して設けられる。第三アライメント装置１７は、第二貼合装置１５及び第二切断装置１６よりもパネル搬送下流側に設けられる。
　　第三貼合装置１８は、第三アライメント装置１７よりもパネル搬送下流側に設けられる。
　　第三切断装置１９は、第三貼合装置１８に近接して設けられる。 The film bonding system 1 includes a second bonding device 15, a second cutting device 16, a third alignment device 17, a third bonding device 18, and a third cutting device 19.
The 2nd bonding apparatus 15 is provided in a panel conveyance downstream rather than the 2nd alignment apparatus 14. FIG. The second cutting device 16 is provided in the vicinity of the second bonding device 15. The 3rd alignment apparatus 17 is provided in a panel conveyance downstream rather than the 2nd bonding apparatus 15 and the 2nd cutting device 16. FIG.
The 3rd bonding apparatus 18 is provided in a panel conveyance downstream rather than the 3rd alignment apparatus 17. FIG.
The third cutting device 19 is provided close to the third bonding device 18.
　　　第一アライメント装置１１は、液晶パネルＰを保持して垂直方向及び水平方向で自在に搬送する。また、第一アライメント装置１１は、液晶パネルＰのパネル搬送上流側及び下流側の端部を撮像する一対のカメラＣを有する（図３参照）。カメラＣの撮像データは制御装置２０に送られる。
　　　制御装置２０は、前記撮像データと、予め記憶した後述の光学軸方向の検査データとに基づき、第一アライメント装置１１を作動させる。尚、後述する第二及び第三アライメント装置１４，１７も同様に前記カメラＣを有し、このカメラＣの撮像データをアライメントに用いる。 The first alignment device 11 holds the liquid crystal panel P and freely conveys it in the vertical direction and the horizontal direction. Further, the first alignment device 11 has a pair of cameras C that image the upstream and downstream ends of the liquid crystal panel P (see FIG. 3). The imaging data of the camera C is sent to the control device 20.
The control device 20 operates the first alignment device 11 based on the imaging data and inspection data stored in the optical axis direction, which will be described later. Note that second and third alignment devices 14 and 17 described later also have the camera C, and use image data of the camera C for alignment.
　　　第一アライメント装置１１は、制御装置２０に作動制御され、第一貼合装置１２に対する液晶パネルＰのアライメントを行う。このとき、液晶パネルＰは、搬送方向と直交する水平方向（以下、部品幅方向という）での位置決めと、垂直軸回りの回転方向（以下、単に回転方向という）での位置決めとがなされる。この状態で、液晶パネルＰが第一貼合装置１２の貼合位置に導入される。 The first alignment device 11 is controlled by the control device 20 and performs alignment of the liquid crystal panel P with respect to the first bonding device 12. At this time, the liquid crystal panel P is positioned in a horizontal direction (hereinafter referred to as a component width direction) orthogonal to the transport direction and in a rotation direction around the vertical axis (hereinafter simply referred to as a rotation direction). In this state, the liquid crystal panel P is introduced into the bonding position of the first bonding apparatus 12.
　　　第一貼合装置１２は、貼合位置に導入された長尺の第一光学部材シートＦ１の上面に対して、その上方を搬送される液晶パネルＰの下面（バックライト側）を貼合する。第一貼合装置１２は、搬送装置１２ａ、挟圧ロール１２ｂを備える。
　　　搬送装置１２ａは、第一光学部材シートＦ１を巻回した第一原反ロールＲ１から第一光学部材シートＦ１を巻き出しつつ、第一光学部材シートＦ１をその長手方向に沿って搬送する。挟圧ロール１２ｂは、搬送装置１２ａが搬送する第一光学部材シートＦ１の上面に、ローラコンベヤ５が搬送する液晶パネルＰの下面を貼合する。 The 1st bonding apparatus 12 bonds the lower surface (backlight side) of liquid crystal panel P conveyed above with respect to the upper surface of the elongate 1st optical member sheet | seat F1 introduce | transduced into the bonding position. . The 1st bonding apparatus 12 is provided with the conveying apparatus 12a and the pinching roll 12b.
The conveying apparatus 12a conveys the 1st optical member sheet | seat F1 along the longitudinal direction, unwinding the 1st optical member sheet | seat F1 from the 1st original fabric roll R1 which wound the 1st optical member sheet | seat F1. The pinching roll 12b bonds the lower surface of the liquid crystal panel P conveyed by the roller conveyor 5 to the upper surface of the first optical member sheet F1 conveyed by the conveying device 12a.
　　　搬送装置１２ａは、ロール保持部１２ｃ、ｐｆ回収部１２ｄを備える。ロール保持部１２ｃは、第一光学部材シートＦ１を巻回した第一原反ロールＲ１を保持すると共に、第一光学部材シートＦ１をその長手方向に沿って繰り出す。ｐｆ回収部１２ｄは、第一光学部材シートＦ１の下面に重なって第一光学部材シートＦ１と共に繰り出されたプロテクションフィルムｐｆを第一貼合装置１２のパネル搬送下流側で回収する。 The transport device 12a includes a roll holding unit 12c and a pf collection unit 12d. The roll holding unit 12c holds the first original roll R1 around which the first optical member sheet F1 is wound, and feeds the first optical member sheet F1 along the longitudinal direction thereof. The pf collection unit 12d collects the protection film pf which is overlapped on the lower surface of the first optical member sheet F1 and is fed out together with the first optical member sheet F1, on the downstream side of the panel transfer of the first bonding apparatus 12.
　　　挟圧ロール１２ｂは、互いに軸方向を平行にして配置された一対の貼合ローラを有する。一対の貼合ローラ間には所定の間隙が形成され、この間隙内が第一貼合装置１２の貼合位置となる。前記間隙内には、液晶パネルＰ及び第一光学部材シートＦ１が重なり合って導入される。これら液晶パネルＰ及び第一光学部材シートＦ１が、前記貼合ローラ間で挟圧されつつパネル搬送下流側に送り出される。これにより、複数の液晶パネルＰを所定の間隔を空けつつ長尺の第一光学部材シートＦ１の上面に連続的に貼合した第一貼合シートＦ２１が形成される。 The pinching roll 12b has a pair of laminating rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the inside of this gap is the bonding position of the first bonding apparatus 12. The liquid crystal panel P and the first optical member sheet F1 are overlapped and introduced into the gap. The liquid crystal panel P and the first optical member sheet F1 are sent out to the downstream side of the panel conveyance while being pressed between the bonding rollers. Thereby, the 1st bonding sheet | seat F21 which bonded together the several liquid crystal panel P continuously on the upper surface of the elongate 1st optical member sheet | seat F1 at predetermined intervals is formed.
　　　図４および図５を併せて参照して説明する。尚、図４および図５において、液晶パネルＰの紙面上側はバックライト側を示しており、紙面下側は表示面側を示している。第一切断装置１３はｐｆ回収部１２ｄよりもパネル搬送下流側に位置する。第一切断装置１３は、第一光学部材シートＦ１の所定箇所（搬送方向で並ぶ液晶パネルＰの間）を前記部品幅方向の全幅にわたって切断する。これにより、第一切断装置１３は、第一貼合シートＦ２１の第一光学部材シートＦ１を切断して表示領域Ｐ４よりも大きい（本実施形態では液晶パネルＰよりも大きい）シート片Ｆ１Ｓとする。
　尚、シート片Ｆ１Ｓの余剰部分の大きさ（液晶パネルＰの外側にはみ出る部分の大きさ）は、液晶パネルＰのサイズに応じて適宜設定される。例えば、シート片Ｆ１Ｓを５インチ～１０インチの中小型サイズの液晶パネルＰに適用する場合は、シート片Ｆ１Ｓの各辺においてシート片Ｆ１Ｓの一辺と液晶パネルＰの一辺との間の間隔を２ｍｍ～５ｍｍの範囲の長さに設定する。 This will be described with reference to FIGS. 4 and 5 together. 4 and 5, the upper side of the liquid crystal panel P on the paper surface indicates the backlight side, and the lower surface of the paper surface indicates the display surface side. The 1st cutting device 13 is located in the panel conveyance downstream rather than pf collection | recovery part 12d. The first cutting device 13 cuts a predetermined portion (between the liquid crystal panels P arranged in the transport direction) of the first optical member sheet F1 over the entire width in the component width direction. Thereby, the 1st cutting device 13 cut | disconnects the 1st optical member sheet | seat F1 of the 1st bonding sheet | seat F21, and is set to the sheet piece F1S larger than the display area P4 (it is larger than liquid crystal panel P in this embodiment). .
The size of the surplus portion of the sheet piece F1S (the size of the portion that protrudes outside the liquid crystal panel P) is appropriately set according to the size of the liquid crystal panel P. For example, when the sheet piece F1S is applied to a medium-sized liquid crystal panel P of 5 to 10 inches, the distance between one side of the sheet piece F1S and one side of the liquid crystal panel P is 2 mm at each side of the sheet piece F1S. Set to a length in the range of ~ 5 mm.
　尚、第一切断装置１３は、切断刃を用いても、レーザーカッターを用いても良い。前記切断により、液晶パネルＰの下面に表示領域Ｐ４よりも大きい前記シート片Ｆ１Ｓが貼合された第一片面貼合パネルＰ１１が形成される。 The first cutting device 13 may use a cutting blade or a laser cutter. By the said cutting | disconnection, the 1st single-sided bonding panel P11 by which the said sheet piece F1S larger than the display area P4 was bonded to the lower surface of liquid crystal panel P is formed.
　　図１を参照して説明する。第二アライメント装置１４は、例えばローラコンベヤ５上の第一片面貼合パネルＰ１１を保持して垂直軸回りに９０°回転させる。これにより、表示領域Ｐ４の短辺と略平行に搬送されていた第一片面貼合パネルＰ１１が、表示領域Ｐ４の長辺と略平行に搬送されるように方向転換する。尚、前記回転は、第一光学部材シートＦ１の光軸方向に対して、液晶パネルＰに貼合する他の光学部材シートの光学軸方向が直角に配置される場合になされる。 This will be described with reference to FIG. The second alignment device 14 holds, for example, the first single-sided bonding panel P11 on the roller conveyor 5 and rotates it 90 ° around the vertical axis. Thereby, the first single-sided bonding panel P11 that has been transported substantially parallel to the short side of the display region P4 changes direction so as to be transported substantially parallel to the long side of the display region P4. The rotation is performed when the optical axis direction of another optical member sheet bonded to the liquid crystal panel P is arranged at a right angle with respect to the optical axis direction of the first optical member sheet F1.
　　第二アライメント装置１４は、前記第一アライメント装置１１と同様のアライメントを行う。すなわち、第二アライメント装置１４は、制御装置２０に記憶された光学軸方向の検査データ及び前記カメラＣの撮像データに基づき、第二貼合装置１５に対する第一片面貼合パネルＰ１１の部品幅方向及び回転方向での位置決めを行う。この状態で、第一片面貼合パネルＰ１１が第二貼合装置１５の貼合位置に導入される。 The second alignment device 14 performs the same alignment as the first alignment device 11. That is, the 2nd alignment apparatus 14 is based on the inspection data of the optical axis direction memorize | stored in the control apparatus 20, and the imaging data of the said camera C, The component width direction of the 1st single-sided bonding panel P11 with respect to the 2nd bonding apparatus 15 And positioning in the rotational direction. In this state, the first single-sided bonding panel P <b> 11 is introduced into the bonding position of the second bonding device 15.
　　第二貼合装置１５は、貼合位置に導入された長尺の第二光学部材シートＦ２の上面に対して、その上方を搬送される第一片面貼合パネルＰ１１の下面（液晶パネルＰのバックライト側）を貼合する。第二貼合装置１５は、搬送装置１５ａ、挟圧ロール１５ｂを備える。
　　搬送装置１５ａは、第二光学部材シートＦ２を巻回した第二原反ロールＲ２から第二光学部材シートＦ２を巻き出しつつ第二光学部材シートＦ２をその長手方向に沿って搬送する。挟圧ロール１５ｂは、搬送装置１５ａが搬送する第二光学部材シートＦ２の上面にローラコンベヤ５が搬送する第一片面貼合パネルＰ１１の下面を貼合する。 The 2nd bonding apparatus 15 is the lower surface (of liquid crystal panel P of the 1st single-sided bonding panel P11 conveyed above that with respect to the upper surface of the elongate 2nd optical member sheet | seat F2 introduced into the bonding position. Paste the backlight side. The 2nd bonding apparatus 15 is provided with the conveying apparatus 15a and the pinching roll 15b.
The conveying device 15a conveys the second optical member sheet F2 along the longitudinal direction while unwinding the second optical member sheet F2 from the second original roll R2 around which the second optical member sheet F2 is wound. The pinching roll 15b bonds the lower surface of the 1st single-sided bonding panel P11 which the roller conveyor 5 conveys to the upper surface of the 2nd optical member sheet | seat F2 which the conveying apparatus 15a conveys.
　　搬送装置１５ａは、ロール保持部１５ｃ、第二回収部１５ｄを備える。
　　ロール保持部１５ｃは、第二光学部材シートＦ２を巻回した第二原反ロールＲ２を保持すると共に第二光学部材シートＦ２をその長手方向に沿って繰り出す。第二回収部１５ｄは、挟圧ロール１５ｂよりもパネル搬送下流側に位置する第二切断装置１６を経た第二光学部材シートＦ２の余剰部分を回収する。 The transport device 15a includes a roll holding unit 15c and a second recovery unit 15d.
The roll holding unit 15c holds the second original fabric roll R2 around which the second optical member sheet F2 is wound, and feeds the second optical member sheet F2 along its longitudinal direction. The second collection unit 15d collects an excess portion of the second optical member sheet F2 that has passed through the second cutting device 16 that is located on the downstream side of the panel conveyance with respect to the pinching roll 15b.
　　挟圧ロール１５ｂは、互いに軸方向を平行にして配置された一対の貼合ローラを有する。一対の貼合ローラ間には所定の間隙が形成され、この間隙内が第二貼合装置１５の貼合位置となる。前記間隙内には、第一片面貼合パネルＰ１１及び第二光学部材シートＦ２が重なり合って導入される。これら第一片面貼合パネルＰ１１及び第二光学部材シートＦ２が、前記貼合ローラ間で挟圧されつつパネル搬送下流側に送り出される。これにより、複数の第一片面貼合パネルＰ１１を所定の間隔を空けつつ長尺の第二光学部材シートＦ２の上面に連続的に貼合した第二貼合シートＦ２２が形成される。 The pinching roll 15b has a pair of laminating rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the inside of this gap is the bonding position of the second bonding apparatus 15. The first single-sided bonding panel P11 and the second optical member sheet F2 are overlapped and introduced into the gap. These 1st single-sided bonding panels P11 and the 2nd optical member sheet | seat F2 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers. Thereby, the 2nd bonding sheet | seat F22 which bonded together the several 1st single-sided bonding panel P11 continuously on the upper surface of the elongate 2nd optical member sheet | seat F2 is formed.
　また、フィルム貼合システム１は、第一検出装置４１（図１４参照）を備える。第一検出装置４１は、第二貼合装置１５よりもパネル搬送下流側に設けられる。第一検出装置４１は、液晶パネルＰと第一光学部材シートＦ１のシート片Ｆ１Ｓとの貼合面（以下、第一貼合面と称することがある。）の端縁を検出する。 Moreover, the film bonding system 1 is provided with the 1st detection apparatus 41 (refer FIG. 14). The 1st detection apparatus 41 is provided in a panel conveyance downstream rather than the 2nd bonding apparatus 15. FIG. The 1st detection apparatus 41 detects the edge of the bonding surface (henceforth a 1st bonding surface) with liquid crystal panel P and the sheet piece F1S of the 1st optical member sheet | seat F1.
　図１３、図１４および図１５を参照して説明する。尚、図１３、図１４および図１５においては、便宜上、第二光学部材シートＦ２の図示を省略する。
　第一検出装置４１は、例えば図１３に示すように、ローラコンベヤ５の搬送経路上に設置された４箇所の検査領域ＣＡにおいて第一貼合面ＳＡ１の端縁ＥＤ（貼合面の外周縁）を検出する。各検査領域ＣＡは、矩形形状を有する第一貼合面ＳＡ１の４つの角部に対応する位置に配置されている。端縁ＥＤは、ライン上を搬送される液晶パネルＰごとに検出される。第一検出装置４１によって検出された端縁ＥＤのデータは、図示しない記憶部に記憶される。 This will be described with reference to FIGS. 13, 14, and 15. In addition, in FIG. 13, FIG. 14, and FIG. 15, illustration of the 2nd optical member sheet | seat F2 is abbreviate | omitted for convenience.
For example, as illustrated in FIG. 13, the first detection device 41 includes the edge ED (the outer peripheral edge of the bonding surface) of the first bonding surface SA1 in the four inspection areas CA installed on the conveyance path of the roller conveyor 5. ) Is detected. Each inspection area | region CA is arrange | positioned in the position corresponding to four corner | angular parts of 1st bonding surface SA1 which has a rectangular shape. The edge ED is detected for each liquid crystal panel P conveyed on the line. The edge ED data detected by the first detection device 41 is stored in a storage unit (not shown).
　　尚、検査領域ＣＡの配置位置はこれに限らない。例えば、各検査領域ＣＡが、第一貼合面ＳＡ１の各辺の一部（例えば各辺の中央部）に対応する位置に配置されていてもよい。 Note that the arrangement position of the inspection area CA is not limited to this. For example, each inspection area | region CA may be arrange | positioned in the position corresponding to a part (for example, center part of each side) of each edge | side of 1st bonding surface SA1.
　　図１４は、第一検出装置４１の模式図である。
　　図１４においては、便宜上、第一片面貼合パネルＰ１１のシート片Ｆ１Ｓが貼合された側を上側とし、第一検出装置４１の構成を上下反転して示している。 FIG. 14 is a schematic diagram of the first detection device 41.
In FIG. 14, for convenience, the side of the first single-sided bonding panel P11 on which the sheet piece F1S is bonded is defined as the upper side, and the configuration of the first detection device 41 is shown upside down.
　　図１４に示すように、第一検出装置４１は、端縁ＥＤを照明する照明光源４４と、第一貼合面ＳＡ１の法線方向に対して端縁ＥＤよりも第一貼合面ＳＡ１の内側に傾斜した姿勢で配置され、第一片面貼合パネルＰ１１のシート片Ｆ１Ｓが貼合された側から端縁ＥＤの画像を撮像する撮像装置４３と、を備えている。 As illustrated in FIG. 14, the first detection device 41 includes the illumination light source 44 that illuminates the edge ED and the first bonding surface SA1 rather than the edge ED with respect to the normal direction of the first bonding surface SA1. An image pickup device 43 that is arranged in an inwardly inclined posture and picks up an image of the edge ED from the side on which the sheet piece F1S of the first single-sided bonding panel P11 is bonded.
　　照明光源４４と撮像装置４３とは、図１３で示した４箇所の検査領域ＣＡ（第一貼合面ＳＡ１の４つの角部に対応する位置）にそれぞれ配置されている。 The illumination light source 44 and the imaging device 43 are respectively arranged in the four inspection areas CA (positions corresponding to the four corners of the first bonding surface SA1) shown in FIG.
　　第一貼合面ＳＡ１の法線と撮像装置４３の撮像面４３ａの法線とのなす角度θ（以下、撮像装置４３の傾斜角度θと称する）は、撮像装置４３の撮像視野内にパネル分断時のずれやバリ等が入り込まないように設定することが好ましい。例えば、第二基板Ｐ２の端面が第一基板Ｐ１の端面よりも外側にずれている場合、撮像装置４３の傾斜角度θは、撮像装置４３の撮像視野内に第二基板Ｐ２の端縁が入り込まないように設定する。 An angle θ formed between the normal line of the first bonding surface SA1 and the normal line of the image pickup surface 43a of the image pickup device 43 (hereinafter referred to as an inclination angle θ of the image pickup device 43) is divided into panels within the image pickup field of the image pickup device 43. It is preferable to set so that time lag, burrs and the like do not enter. For example, when the end surface of the second substrate P2 is shifted outward from the end surface of the first substrate P1, the inclination angle θ of the imaging device 43 is set so that the edge of the second substrate P2 enters the imaging field of the imaging device 43. Set to not.
　　撮像装置４３の傾斜角度θは、第一貼合面ＳＡ１と撮像装置４３の撮像面４３ａの中心との間の距離Ｈ（以下、撮像装置４３の高さＨと称する）に適合するように設定されることが好ましい。例えば、撮像装置４３の高さＨが５０ｍｍ以上１００ｍｍ以下の場合、撮像装置４３の傾斜角度θは、５°以上２０°以下の範囲の角度に設定されることが好ましい。ただし、経験的にずれ量が分かっている場合には、そのずれ量に基づいて撮像装置４３の高さＨ及び撮像装置４３の傾斜角度θを求めることができる。本実施形態では、撮像装置４３の高さＨが７８ｍｍ、撮像装置４３の傾斜角度θが１０°に設定されている。 The inclination angle θ of the imaging device 43 is set to match the distance H (hereinafter referred to as the height H of the imaging device 43) between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43. It is preferred that For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 43 is preferably set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 43 and the inclination angle θ of the imaging device 43 can be obtained based on the deviation amount. In the present embodiment, the height H of the imaging device 43 is set to 78 mm, and the inclination angle θ of the imaging device 43 is set to 10 °.
　　照明光源４４と撮像装置４３とは、各検査領域ＣＡに固定して配置されている。
　　尚、照明光源４４と撮像装置４３とは、第一貼合面ＳＡ１の端縁ＥＤに沿って移動可能に配置されていてもよい。この場合、照明光源４４と撮像装置４３とがそれぞれ１つずつ設けられていればよい。また、これにより、照明光源４４と撮像装置４３とを、第一貼合面ＳＡ１の端縁ＥＤを撮像しやすい位置に移動させることができる。 The illumination light source 44 and the imaging device 43 are fixedly arranged in each inspection area CA.
In addition, the illumination light source 44 and the imaging device 43 may be arrange | positioned so that a movement is possible along the edge ED of 1st bonding surface SA1. In this case, the illumination light source 44 and the imaging device 43 should each be provided one each. Thereby, the illumination light source 44 and the imaging device 43 can be moved to a position where the edge ED of the first bonding surface SA1 can be easily imaged.
　　照明光源４４は、第一片面貼合パネルＰ１１のシート片Ｆ１Ｓが貼合された側とは反対側に配置されている。照明光源４４は、第一貼合面ＳＡ１の法線方向に対して端縁ＥＤよりも第一貼合面ＳＡ１の外側に傾斜した姿勢で配置されている。本実施形態では、照明光源４４の光軸と撮像装置４３の撮像面４３ａの法線とが平行になっている。 The illumination light source 44 is arrange | positioned on the opposite side to the side by which the sheet piece F1S of the 1st single-sided bonding panel P11 was bonded. The illumination light source 44 is arrange | positioned with the attitude | position which inclined outside the 1st bonding surface SA1 rather than the edge ED with respect to the normal line direction of 1st bonding surface SA1. In the present embodiment, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 are parallel.
　　尚、照明光源は、第一片面貼合パネルＰ１１のシート片Ｆ１Ｓが貼合された側に配置されていてもよい。 In addition, the illumination light source may be arrange | positioned at the side by which the sheet piece F1S of the 1st single-sided bonding panel P11 was bonded.
　　また、照明光源４４の光軸と撮像装置４３の撮像面４３ａの法線とが若干斜めに交差していてもよい。 In addition, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 may slightly cross each other.
　また、図１５に示すように、撮像装置４３及び照明光源４４の各々が、第一貼合面ＳＡ１の法線方向に沿って端縁ＥＤに重なる位置に配置されていてもよい。第一貼合面ＳＡ１と撮像装置４３の撮像面４３ａの中心との間の距離Ｈ１（以下、撮像装置４３の高さＨ１と称する）は、第一貼合面ＳＡ１の端縁ＥＤを検出しやすい位置に設定されることが好ましい。例えば、撮像装置４３の高さＨ１は、５０ｍｍ以上１５０ｍｍ以下の範囲に設定されることが好ましい。 Moreover, as shown in FIG. 15, each of the imaging device 43 and the illumination light source 44 may be arranged at a position overlapping the edge ED along the normal direction of the first bonding surface SA1. A distance H1 between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43 (hereinafter referred to as a height H1 of the imaging device 43) detects the edge ED of the first bonding surface SA1. It is preferable to set the position at an easy position. For example, the height H1 of the imaging device 43 is preferably set in a range of 50 mm or more and 150 mm or less.
　　シート片Ｆ１Ｓのカット位置は、第一貼合面ＳＡ１の端縁ＥＤの検出結果に基づいて調整される。制御装置２０（図１参照）は、記憶部に記憶された第一貼合面ＳＡ１の端縁ＥＤのデータを取得し、第一光学部材Ｆ１１が液晶パネルＰの外側（第一貼合面ＳＡ１の外側）にはみ出さない大きさとなるようにシート片Ｆ１Ｓのカット位置を決定する。第一切断装置１３は、制御装置２０によって決定されたカット位置においてシート片Ｆ１Ｓを切断する。 The cut position of the sheet piece F1S is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control apparatus 20 (refer FIG. 1) acquires the data of the edge ED of 1st bonding surface SA1 memorize | stored in the memory | storage part, and the 1st optical member F11 is the outer side (1st bonding surface SA1) of liquid crystal panel P. FIG. The cut position of the sheet piece F1S is determined so that it does not protrude beyond the outer side. The first cutting device 13 cuts the sheet piece F1S at the cutting position determined by the control device 20.
　　図２および図５を併せて参照して説明する。第二切断装置１６は第一検出装置４１よりもパネル搬送下流側に位置する。第二切断装置１６は、第二光学部材シートＦ２とその上面に貼合した第一片面貼合パネルＰ１１の第一光学部材シートＦ１のシート片Ｆ１Ｓとを同時に切断する。第二切断装置１６は例えばＣＯ２レーザーカッターである。第二切断装置１６は、第二光学部材シートＦ２と第一光学部材シートＦ１のシート片Ｆ１Ｓとを第一貼合面ＳＡ１の端縁ＥＤに沿って（本実施形態では液晶パネルＰの外周縁に沿って）無端状に切断する。各光学部材シートＦ１，Ｆ２を液晶パネルＰに貼合した後にまとめてカットすることで、各光学部材シートＦ１，Ｆ２の光学軸方向の精度が高まる。また、各光学部材シートＦ１，Ｆ２間の光学軸方向のズレが無くなる。更に、第一切断装置１３での切断が簡素化される。 This will be described with reference to FIGS. 2 and 5 together. The 2nd cutting device 16 is located in the panel conveyance downstream rather than the 1st detection apparatus 41. FIG. The 2nd cutting device 16 cut | disconnects simultaneously the 2nd optical member sheet | seat F2 and the sheet piece F1S of the 1st optical member sheet | seat F1 of the 1st single-sided bonding panel P11 bonded on the upper surface. The second cutting device 16 is, for example, a CO 2 laser cutter. The second cutting device 16 moves the second optical member sheet F2 and the sheet piece F1S of the first optical member sheet F1 along the edge ED of the first bonding surface SA1 (in this embodiment, the outer peripheral edge of the liquid crystal panel P). Along the edge). By bonding the optical member sheets F1 and F2 to the liquid crystal panel P and cutting them together, the accuracy in the optical axis direction of the optical member sheets F1 and F2 is increased. Further, there is no deviation in the optical axis direction between the optical member sheets F1 and F2. Furthermore, the cutting with the first cutting device 13 is simplified.
　第二切断装置１６は、端縁ＥＤに沿ってレーザーカットを行うことにより、第一片面貼合パネルＰ１１から第一貼合面ＳＡ１の外側にはみ出た部分のシート片Ｆ１Ｓ（シート片Ｆ１Ｓの余剰部分）を切り離し、第一貼合面ＳＡ１に対応する大きさの光学部材（第一及び第二光学部材Ｆ１１，Ｆ１２）を形成する。ここで、第二切断装置１６は、特許請求の範囲に記載の切断装置に相当する。 The second cutting device 16 performs laser cutting along the edge ED, so that the sheet piece F1S (excess of the sheet piece F1S) protrudes from the first single-sided bonding panel P11 to the outside of the first bonding surface SA1. Part) is cut off, and optical members (first and second optical members F11 and F12) having a size corresponding to the first bonding surface SA1 are formed. Here, the 2nd cutting device 16 is corresponded to the cutting device as described in a claim.
　　ここで、「第一貼合面ＳＡ１に対応する大きさ」とは、液晶パネルＰの表示領域Ｐ４の大きさ以上、液晶パネルＰの外形状（平面視における輪郭形状）の大きさ以下の大きさを指す。 Here, the “size corresponding to the first bonding surface SA1” is not less than the size of the display area P4 of the liquid crystal panel P and not more than the size of the outer shape (contour shape in plan view) of the liquid crystal panel P. Refers to
　　第二切断装置１６の切断により、液晶パネルＰの下面に第一及び第二光学部材Ｆ１１，Ｆ１２が重ねて貼合された第二片面貼合パネルＰ１２が形成される（図７参照）。このとき、第二片面貼合パネルＰ１２と、第一貼合面ＳＡ１に対応する部分（各光学部材Ｆ１１，Ｆ１２）が切り取られて、枠状に残る各光学部材シートＦ１，Ｆ２の余剰部分とが分離される。第二光学部材シートＦ２の余剰部分は複数連なって梯子状となる。この余剰部分が第一光学部材シートＦ１の余剰部分と共に第二回収部１５ｄに巻き取られる。 The 2nd single-sided bonding panel P12 by which the 1st and 2nd optical members F11 and F12 were accumulated and bonded by the lower surface of liquid crystal panel P by the cutting | disconnection of the 2nd cutting device 16 is formed (refer FIG. 7). At this time, the part (each optical member F11, F12) corresponding to 2nd single-sided bonding panel P12 and 1st bonding surface SA1 is cut off, and the surplus part of each optical member sheet | seat F1, F2 which remains in frame shape, Are separated. A plurality of surplus portions of the second optical member sheet F2 are connected in a ladder shape. This surplus portion is wound around the second recovery portion 15d together with the surplus portion of the first optical member sheet F1.
　　ここで、前記「第一貼合面ＳＡ１に対応する部分」とは、表示領域Ｐ４の大きさ以上、液晶パネルＰの外形状の大きさ以下の領域で、かつ電気部品取り付け部等の機能部分を避けた領域を示す。本実施形態では、平面視矩形状の液晶パネルＰにおける前記機能部分を除いた三辺では、液晶パネルＰの外周縁に沿って余剰部分をレーザーカットし、前記機能部分に相当する一辺では、液晶パネルＰの外周縁から表示領域Ｐ４側に適宜入り込んだ位置で余剰部分をレーザーカットしている。例えば、第一貼合面ＳＡ１に対応する部分がＴＦＴ基板の貼合面の場合、前記機能部分に相当する一辺では前記機能部分を除くよう液晶パネルＰの外周縁から表示領域Ｐ４側に所定量ずれた位置でカットされる。 Here, the “part corresponding to the first bonding surface SA1” is an area that is not less than the size of the display area P4 and not more than the size of the outer shape of the liquid crystal panel P, and a functional part such as an electrical component mounting portion. Indicates an area that avoids. In the present embodiment, in the three sides excluding the functional portion in the liquid crystal panel P having a rectangular shape in plan view, the surplus portion is laser-cut along the outer peripheral edge of the liquid crystal panel P, and in one side corresponding to the functional portion, the liquid crystal The surplus portion is laser-cut at a position that appropriately enters the display region P4 side from the outer peripheral edge of the panel P. For example, when the portion corresponding to the first bonding surface SA1 is the bonding surface of the TFT substrate, a predetermined amount from the outer peripheral edge of the liquid crystal panel P to the display region P4 side so as to exclude the functional portion on one side corresponding to the functional portion. Cut at the shifted position.
　　図１を参照して説明する。第三アライメント装置１７は、液晶パネルＰの表示面側を上面にした第二片面貼合パネルＰ１２を表裏反転させて液晶パネルＰのバックライト側を上面にする。第三アライメント装置１７は、前記第一及び第二アライメント装置１１，１４と同様のアライメントを行う。すなわち、第三アライメント装置１７は、制御装置２０に記憶された光学軸方向の検査データ及び前記カメラＣの撮像データに基づき、第三貼合装置１８に対する第二片面貼合パネルＰ１２の部品幅方向及び回転方向での位置決めを行う。この状態で、第二片面貼合パネルＰ１２が第三貼合装置１８の貼合位置に導入される。 This will be described with reference to FIG. The third alignment device 17 inverts the second single-sided bonding panel P12 with the display surface side of the liquid crystal panel P as the upper surface so that the backlight side of the liquid crystal panel P is the upper surface. The third alignment device 17 performs the same alignment as the first and second alignment devices 11 and 14. That is, the third alignment device 17 is based on the inspection data in the optical axis direction stored in the control device 20 and the imaging data of the camera C, and the component width direction of the second single-sided bonding panel P12 with respect to the third bonding device 18. And positioning in the rotational direction. In this state, the second single-sided bonding panel P <b> 12 is introduced into the bonding position of the third bonding device 18.
　　第三貼合装置１８は、貼合位置に導入された長尺の第三光学部材シートＦ３の上面に対して、その上方を搬送される第二片面貼合パネルＰ１２の下面（液晶パネルＰの表示面側）を貼合する。第三貼合装置１８は、搬送装置１８ａ、挟圧ロール１８ｂを備える。
　　搬送装置１８ａは、第三光学部材シートＦ３を巻回した第三原反ロールＲ３から第三光学部材シートＦ３を巻き出しつつ第三光学部材シートＦ３をその長手方向に沿って搬送する。挟圧ロール１８ｂは、搬送装置１８ａが搬送する第三光学部材シートＦ３の上面にローラコンベヤ５が搬送する第二片面貼合パネルＰ１２の下面を貼合する。 The 3rd bonding apparatus 18 is the lower surface (of liquid crystal panel P of 2nd single-sided bonding panel P12 conveyed above that with respect to the upper surface of the elongate 3rd optical member sheet | seat F3 introduced into the bonding position. Adhere the display surface side). The 3rd bonding apparatus 18 is provided with the conveying apparatus 18a and the pinching roll 18b.
The conveying device 18a conveys the third optical member sheet F3 along the longitudinal direction while unwinding the third optical member sheet F3 from the third original roll R3 around which the third optical member sheet F3 is wound. The pinching roll 18b bonds the lower surface of the second single-sided bonding panel P12 conveyed by the roller conveyor 5 to the upper surface of the third optical member sheet F3 conveyed by the conveying device 18a.
　　搬送装置１８ａは、ロール保持部１８ｃ、第三回収部１８ｄを備える。
　　ロール保持部１８ｃは、第三光学部材シートＦ３を巻回した第三原反ロールＲ３を保持すると共に第三光学部材シートＦ３をその長手方向に沿って繰り出す。第三回収部１８ｄは、挟圧ロール１８ｂよりもパネル搬送下流側に位置する第三切断装置１９を経た第三光学部材シートＦ３の余剰部分を回収する。 The transport device 18a includes a roll holding unit 18c and a third recovery unit 18d.
The roll holding portion 18c holds the third original fabric roll R3 around which the third optical member sheet F3 is wound, and feeds the third optical member sheet F3 along its longitudinal direction. The third recovery unit 18d recovers the surplus portion of the third optical member sheet F3 that has passed through the third cutting device 19 located on the downstream side of the panel conveyance with respect to the pinching roll 18b.
　　挟圧ロール１８ｂは、互いに軸方向を平行にして配置された一対の貼合ローラを有する。一対の貼合ローラ間には所定の間隙が形成され、この間隙内が第三貼合装置１８の貼合位置となる。前記間隙内には、第二片面貼合パネルＰ１２及び第三光学部材シートＦ３が重なり合って導入される。これら第二片面貼合パネルＰ１２及び第三光学部材シートＦ３が、前記貼合ローラ間で挟圧されつつパネル搬送下流側に送り出される。これにより、複数の第二片面貼合パネルＰ１２を所定の間隔を空けつつ長尺の第三光学部材シートＦ３の上面に連続的に貼合した第三貼合シートＦ２３が形成される。 The pinching roll 18b has a pair of laminating rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the third bonding device 18. In the gap, the second single-sided bonding panel P12 and the third optical member sheet F3 are overlapped and introduced. These 2nd single-sided bonding panels P12 and the 3rd optical member sheet | seat F3 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers. Thereby, the 3rd bonding sheet | seat F23 which bonded the several 2nd single-sided bonding panel P12 continuously on the upper surface of the elongate 3rd optical member sheet | seat F3 is formed.
　また、フィルム貼合システム１は、第二検出装置４２（図１４参照）を備える。第二検出装置４２は、第三貼合装置１８よりもパネル搬送下流側に設けられる。第二検出装置４２は、液晶パネルＰと第三光学部材シートＦ３との貼合面（以下、第二貼合面と称することがある。）の端縁を検出する。第二検出装置４２によって検出された端縁のデータは、図示しない記憶部に記憶される。 Moreover, the film bonding system 1 is provided with the 2nd detection apparatus 42 (refer FIG. 14). The 2nd detection apparatus 42 is provided in a panel conveyance downstream rather than the 3rd bonding apparatus 18. FIG. The 2nd detection apparatus 42 detects the edge of the bonding surface (henceforth a 2nd bonding surface) of liquid crystal panel P and the 3rd optical member sheet | seat F3. The edge data detected by the second detection device 42 is stored in a storage unit (not shown).
　第三光学部材シートＦ３のカット位置は、第二貼合面の端縁の検出結果に基づいて調整される。制御装置２０（図１参照）は、記憶部に記憶された第二貼合面の端縁のデータを取得し、第三光学部材Ｆ１３が液晶パネルＰの外側（第二貼合面の外側）にはみ出さない大きさとなるように第三光学部材シートＦ３のカット位置を決定する。第三切断装置１９は、制御装置２０によって決定されたカット位置において第三光学部材シートＦ３を切断する。 The cut position of the third optical member sheet F3 is adjusted based on the detection result of the edge of the second bonding surface. The control apparatus 20 (refer FIG. 1) acquires the data of the edge of the 2nd bonding surface memorize | stored in the memory | storage part, and the 3rd optical member F13 is the outer side of the liquid crystal panel P (outside of a 2nd bonding surface). The cutting position of the third optical member sheet F3 is determined so as not to protrude. The third cutting device 19 cuts the third optical member sheet F3 at the cutting position determined by the control device 20.
　　第三切断装置１９は第二検出装置４２よりもパネル搬送下流側に位置し、第三光学部材シートＦ３を切断する。第三切断装置１９は第二切断装置１６と同様のレーザー加工機であり、第三光学部材シートＦ３を第二貼合面の端縁に沿って（例えば液晶パネルＰの外周縁に沿って）無端状に切断する。 The third cutting device 19 is located on the downstream side of the panel conveyance with respect to the second detection device 42, and cuts the third optical member sheet F3. The third cutting device 19 is a laser processing machine similar to the second cutting device 16, and the third optical member sheet F3 is disposed along the edge of the second bonding surface (for example, along the outer peripheral edge of the liquid crystal panel P). Cut endlessly.
　第三切断装置１９は、第二貼合面の端縁に沿ってレーザーカットを行うことにより、第二片面貼合パネルＰ１２から第二貼合面の外側にはみ出た部分のシート片（シート片の余剰部分）を切り離し、第二貼合面に対応する大きさの光学部材（第三光学部材Ｆ１３）を形成する。 The third cutting device 19 performs laser cutting along the edge of the second bonding surface, whereby the sheet piece (sheet piece) that protrudes from the second single-sided bonding panel P12 to the outside of the second bonding surface. ) And an optical member (third optical member F13) having a size corresponding to the second bonding surface is formed.
　　ここで、「第二貼合面に対応する大きさ」とは、液晶パネルＰの表示領域Ｐ４の大きさ以上、液晶パネルＰの外形状（平面視における輪郭形状）の大きさ以下の大きさを指す。 Here, the “size corresponding to the second bonding surface” is not less than the size of the display region P4 of the liquid crystal panel P and not more than the size of the outer shape (contour shape in plan view) of the liquid crystal panel P. Point to.
　　第三切断装置１９の切断により、第二片面貼合パネルＰ１２の下面に第三光学部材Ｆ１３が貼合された両面貼合パネルＰ１３が形成される（図８参照）。このとき、両面貼合パネルＰ１３と、第二貼合面に対応する部分（第三光学部材Ｆ１３）が切り取られて枠状に残る第三光学部材シートＦ３の余剰部分とが分離される。第三光学部材シートＦ３の余剰部分は第二光学部材シートＦ２の余剰部分と同様に複数連なって梯子状をなす（図２参照）。この余剰部分が第三回収部１８ｄに巻き取られる。 The double-sided bonding panel P13 in which the third optical member F13 is bonded to the lower surface of the second single-sided bonding panel P12 is formed by cutting the third cutting device 19 (see FIG. 8). At this time, the double-sided bonding panel P13 and the part (third optical member F13) corresponding to the second bonding surface are cut off and the excess part of the third optical member sheet F3 remaining in a frame shape is separated. The excessive part of the 3rd optical member sheet | seat F3 is continued in multiple numbers similarly to the excessive part of the 2nd optical member sheet | seat F2, and makes a ladder shape (refer FIG. 2). This surplus portion is taken up by the third recovery portion 18d.
　　ここで、前記「第二貼合面に対応する部分」とは、表示領域Ｐ４の大きさ以上、液晶パネルＰの外形状の大きさ以下の領域で、かつ電気部品取り付け部等の機能部分を避けた領域を示す。本実施形態では、平面視矩形状の液晶パネルＰにおける四辺において、液晶パネルＰの外周縁に沿って余剰部分をレーザーカットしている。例えば、第二貼合面に対応する部分がＣＦ基板の貼合面の場合、前記機能部分に相当する部分がないため、液晶パネルＰの四辺において液晶パネルＰの外周縁に沿ってカットされる。 Here, the “part corresponding to the second bonding surface” is a region that is not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and a functional part such as an electrical component mounting portion. Indicates the area that was avoided. In the present embodiment, the surplus portions are laser-cut along the outer peripheral edge of the liquid crystal panel P on the four sides of the liquid crystal panel P having a rectangular shape in plan view. For example, when the portion corresponding to the second bonding surface is the bonding surface of the CF substrate, there is no portion corresponding to the functional portion, so that the four sides of the liquid crystal panel P are cut along the outer peripheral edge of the liquid crystal panel P. .
　　両面貼合パネルＰ１３は、不図示の欠陥検査装置を経て欠陥（貼合不良等）の有無が検査された後、下流工程に搬送されて他の処理がなされる。 The double-sided bonding panel P13 is inspected for defects (bonding failure, etc.) through a defect inspection device (not shown), and then conveyed to the downstream process for other processing.
　　ここで、一般に長尺の光学フィルム（各光学部材シートＦ１，Ｆ２，Ｆ３に相当）は、二色性色素で染色した樹脂フィルムを一軸延伸させて製造されており、光学フィルムの光学軸の方向は樹脂フィルムの延伸方向と概ね一致する。しかし、光学フィルムの光学軸は、光学フィルム全体で均一ではなく、光学フィルムの幅方向で若干ばらついている。 Here, in general, a long optical film (corresponding to each optical member sheet F1, F2, F3) is manufactured by uniaxially stretching a resin film dyed with a dichroic dye, and the direction of the optical axis of the optical film Generally coincides with the stretching direction of the resin film. However, the optical axis of the optical film is not uniform throughout the optical film, but varies slightly in the width direction of the optical film.
　　このため、光学フィルムにその幅方向で複数の光学表示部品を貼合するような場合、光学フィルムの光学軸方向に合わせて光学表示部品のアライメントを行うことが望ましい。
　　これは、光学表示デバイス単位の光学軸のバラツキを抑えて精彩やコントラストを高めるという点で有効である。 For this reason, when bonding a some optical display component to the optical film in the width direction, it is desirable to align an optical display component according to the optical axis direction of an optical film.
This is effective in that the variation in the optical axis of each optical display device is suppressed and the color and contrast are enhanced.
　　偏光フィルムとしての光学フィルムは、一方向に振動する光以外の光を遮断するために、例えばヨウ素や二色性染料等により染色されている。尚、光学フィルムに剥離フィルムや保護フィルムがさらに積層されてもよい。 An optical film as a polarizing film is dyed with, for example, iodine or a dichroic dye in order to block light other than light that vibrates in one direction. A release film or a protective film may be further laminated on the optical film.
　　光学フィルムの光学軸方向を検査する検査装置は、光源、検光子を備える。
　　光源は、光学フィルムの表裏一側方に配置される。検光子は、光学フィルムの表裏他側方に配置される。検光子は、光源から照射されて光学フィルムを透過した光を受光し、この光の強度を検出することで、光学フィルムの光学軸を検出する。検光子は、例えば光学フィルムの幅方向で移動可能であり、光学フィルムの幅方向の任意箇所で光学軸を検査可能である。 An inspection apparatus for inspecting the optical axis direction of an optical film includes a light source and an analyzer.
The light source is disposed on one side of the front and back of the optical film. The analyzer is disposed on the other side of the optical film. The analyzer receives the light irradiated from the light source and transmitted through the optical film, and detects the optical axis of the optical film by detecting the intensity of this light. The analyzer can move, for example, in the width direction of the optical film, and can inspect the optical axis at an arbitrary position in the width direction of the optical film.
　　本実施形態の場合、前記検査装置で得た各光学部材シートＦ１，Ｆ２，Ｆ３の光学軸方向を示す検査データは、各光学部材シートＦ１，Ｆ２，Ｆ３の長手方向位置と幅方向位置とに関連付けられて制御装置２０のメモリに記憶される。この検査後に各光学部材シートＦ１，Ｆ２，Ｆ３が巻き取られて各原反ロールＲ１，Ｒ２，Ｒ３をそれぞれ形成する。
　以下、各光学部材シートＦ１，Ｆ２，Ｆ３を光学部材シートＦＸ、各光学部材シートＦ１，Ｆ２，Ｆ３に貼合される液晶パネルＰ及び各片面貼合パネルＰ１１，Ｐ１２を光学表示部材ＰＸと総称することがある。 In the case of this embodiment, the inspection data indicating the optical axis direction of each of the optical member sheets F1, F2, and F3 obtained by the inspection apparatus is the longitudinal direction position and the width direction position of each optical member sheet F1, F2, and F3. It is associated and stored in the memory of the control device 20. After this inspection, the optical member sheets F1, F2, and F3 are wound up to form the original rolls R1, R2, and R3, respectively.
Hereinafter, the optical member sheets F1, F2, and F3 are collectively referred to as the optical member sheet FX, the liquid crystal panel P that is bonded to the optical member sheets F1, F2, and F3, and the single-sided bonding panels P11 and P12 are collectively referred to as the optical display member PX. There are things to do.
　　ここで、光学部材シートＦＸを構成する偏光子フィルムは、例えば二色性色素で染色したＰＶＡフィルムを一軸延伸して形成される。偏光子フィルムは、延伸する際のＰＶＡフィルムの厚さのムラや二色性色素の染色ムラ等に起因して、光学部材シートＦＸの幅方向内側と幅方向外側とで光学軸方向の相違が生じる傾向にある。 Here, the polarizer film constituting the optical member sheet FX is formed, for example, by uniaxially stretching a PVA film dyed with a dichroic dye. The polarizer film has a difference in the optical axis direction between the inner side in the width direction and the outer side in the width direction of the optical member sheet FX due to uneven thickness of the PVA film when stretched, uneven coloring of the dichroic dye, and the like. Tend to occur.
　　そこで、本実施形態では、制御装置２０に予め記憶した光学部材シートＦＸの各部における光学軸の面内分布の検査データに基づき、これらに貼合する光学表示部品ＰＸのアライメントを行う。そして、光学部材シートＦＸに光学表示部品ＰＸを貼合する。 Therefore, in this embodiment, based on the inspection data of the in-plane distribution of the optical axis in each part of the optical member sheet FX stored in advance in the control device 20, the optical display component PX to be bonded to these is aligned. Then, the optical display component PX is bonded to the optical member sheet FX.
　　具体的には、光学部材シートＦＸにおける光学表示部品ＰＸを貼合する部位の面内において、例えば所定の基準軸（長手方向軸等）に対する角度が最大の光学軸と最小の光学軸とを見出す。そして、これら各光学軸がなす角を二等分する軸を当該部位の平均的な光学軸として、この軸を基準に光学表示部品ＰＸのアライメントを行う。 Specifically, in the plane of the part where the optical display component PX is bonded in the optical member sheet FX, for example, an optical axis having a maximum angle and a minimum optical axis with respect to a predetermined reference axis (longitudinal axis or the like) is found. . Then, with the axis that bisects the angle formed by each of these optical axes as an average optical axis of the part, the optical display component PX is aligned with reference to this axis.
　　これにより、光学部材シートＦＸの幅方向で異なる位置に光学表示部品ＰＸを貼合する場合にも、光学表示部品ＰＸの基準位置に対する光学部材シートＦＸの光学軸方向のバラツキを抑制できる。また、光学軸公差をほぼ０°（許容公差は±０．２５°）にすることができる。 Thereby, even when the optical display component PX is bonded to a different position in the width direction of the optical member sheet FX, the variation in the optical axis direction of the optical member sheet FX with respect to the reference position of the optical display component PX can be suppressed. Further, the optical axis tolerance can be set to approximately 0 ° (allowable tolerance is ± 0.25 °).
　　尚、光学部材シートＦＸを巻き出しつつ光学軸方向を検出し、この検出データに基づき光学表示部品ＰＸのアライメントを行うようにしてもよい。また、前述した種々のアライメント手法は、光学部材シートＦＸの光学軸方向が０°及び９０°の場合に限らず、任意の角度の場合にも適用できる。 Note that the optical axis direction may be detected while the optical member sheet FX is unwound, and the optical display component PX may be aligned based on the detection data. The various alignment methods described above are not limited to the case where the optical axis direction of the optical member sheet FX is 0 ° and 90 °, but can be applied to any angle.
　　図３は比較的幅の広い光学部材シートＦＸにその幅方向で三つの光学表示部品ＰＸを並べて貼合する例を示す。しかし、これに限らず、二つ以下又は四つ以上の光学表示部品ＰＸを光学部材シートＦＸの幅方向で並べて貼合する構成としてもよい。また、比較的幅の狭い光学部材シートＦＸを幅方向に複数並べてこれらのそれぞれに光学表示部品ＰＸを貼合する構成としてもよい。 FIG. 3 shows an example in which three optical display components PX are aligned and bonded to a relatively wide optical member sheet FX in the width direction. However, the present invention is not limited to this, and two or less or four or more optical display components PX may be arranged and bonded in the width direction of the optical member sheet FX. Moreover, it is good also as a structure which arranges the optical display component PX on each of these by arranging two or more optical member sheet | seat FX with a comparatively narrow width in the width direction.
　　図４を参照して説明する。液晶パネルＰは、第一基板Ｐ１、第二基板Ｐ２、液晶層Ｐ３を備える。
　　第一基板Ｐ１は、例えばＴＦＴ基板からなる長方形状の基板である。第二基板Ｐ２は、第一基板Ｐ１に対向して配置される長方形状の基板である。液晶層Ｐ３は、第一基板Ｐ１と第二基板Ｐ２との間に封入される。尚、図示都合上、断面図の各層のハッチングを略すことがある。 This will be described with reference to FIG. The liquid crystal panel P includes a first substrate P1, a second substrate P2, and a liquid crystal layer P3.
The first substrate P1 is a rectangular substrate made of, for example, a TFT substrate. The second substrate P2 is a rectangular substrate disposed to face the first substrate P1. The liquid crystal layer P3 is sealed between the first substrate P1 and the second substrate P2. For convenience of illustration, hatching of each layer in the cross-sectional view may be omitted.
　　図６および図７を参照して説明する。第一基板Ｐ１は、その外周縁の三辺を第二基板Ｐ２の対応する三辺に沿わせると共に、外周縁の残りの一辺を第二基板Ｐ２の対応する一辺よりも外側に張り出させる。これにより、第一基板Ｐ１の前記一辺側に第二基板Ｐ２よりも外側に張り出す電気部品取り付け部Ｐ５が設けられる。 This will be described with reference to FIG. 6 and FIG. The first substrate P1 has the three outer peripheral edges along the corresponding three sides of the second substrate P2, and the remaining one side of the outer peripheral edge protrudes outward from the corresponding one side of the second substrate P2. Thereby, the electrical component attachment part P5 which protrudes outside the 2nd board | substrate P2 is provided in the said one side of the 1st board | substrate P1.
　　図５および図７を参照して説明する。第二切断装置１６は、第一検出装置４１が検出した液晶パネルＰと第一光学部材シートＦ１のシート片Ｆ１Ｓとの貼合面（第一貼合面ＳＡ１）の外周縁に沿って第一及び第二光学部材シートＦ１，Ｆ２を切断する。また、第三切断装置１９は、第二検出装置４２が検出した液晶パネルＰと第三光学部材シートＦ３との貼合面（第二貼合面）の外周縁に沿って第三光学部材シートＦ３を切断する。表示領域Ｐ４の外側には、第一及び第二基板Ｐ１，Ｐ２を接合するシール剤等を配置する所定幅の額縁部Ｇが設けられる。この額縁部Ｇの幅内で各切断装置１６，１９によるレーザーカットがなされる。 This will be described with reference to FIG. 5 and FIG. The 2nd cutting device 16 is 1st along the outer periphery of the bonding surface (1st bonding surface SA1) of liquid crystal panel P which the 1st detection apparatus 41 detected, and the sheet piece F1S of the 1st optical member sheet | seat F1. Then, the second optical member sheets F1, F2 are cut. Moreover, the 3rd cutting device 19 is a 3rd optical member sheet | seat along the outer periphery of the bonding surface (2nd bonding surface) of liquid crystal panel P and the 3rd optical member sheet | seat F3 which the 2nd detection apparatus 42 detected. Cut F3. Outside the display area P4, a frame portion G having a predetermined width for arranging a sealing agent or the like for joining the first and second substrates P1 and P2 is provided. Laser cutting is performed by the cutting devices 16 and 19 within the width of the frame portion G.
　　図１０に示すように、樹脂製の光学部材シートＦＸを単独でレーザーカットすると、その切断端ｔが熱変形により膨れたり波打ったりすることがある。このため、レーザーカット後の光学部材シートＦＸを光学表示部品ＰＸに貼合する場合には、光学部材シートＦＸにエア混入や歪み等の貼合不良が生じ易い。 As shown in FIG. 10, when the resin optical member sheet FX is laser-cut alone, the cut end t may swell or wave due to thermal deformation. For this reason, when the optical member sheet FX after laser cutting is bonded to the optical display component PX, poor bonding such as air mixing and distortion is likely to occur in the optical member sheet FX.
　　一方、本実施形態では、図９に示すように、光学部材シートＦＸを液晶パネルＰに貼合した後に光学部材シートＦＸをレーザーカットする。本実施形態では、光学部材シートＦＸの切断端ｔが液晶パネルＰのガラス面にバックアップされる。そのため、光学部材シートＦＸの切断端ｔの膨れや波打ち等が生じず、かつ液晶パネルＰへの貼合後であることから前記貼合不良も生じ得ない。 On the other hand, in this embodiment, as shown in FIG. 9, after the optical member sheet FX is bonded to the liquid crystal panel P, the optical member sheet FX is laser-cut. In the present embodiment, the cut end t of the optical member sheet FX is backed up on the glass surface of the liquid crystal panel P. Therefore, the cut end t of the optical member sheet FX is not swollen or undulated, and the bonding failure cannot occur because it is after bonding to the liquid crystal panel P.
　　レーザー加工機の切断線の振れ幅（公差）は切断刃のそれよりも小さい。したがって本実施形態では、切断刃を用いて光学部材シートＦＸを切断する場合と比べて、前記額縁部Ｇの幅を狭めることが可能である。また、液晶パネルＰの小型化及び（又は）表示領域Ｐ４の大型化が可能である。これは、近年のスマートフォンやタブレット端末のように、筐体のサイズが制限される中で表示画面の拡大が要求される高機能モバイルへの適用に有効である。 The runout width (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting blade. Therefore, in the present embodiment, it is possible to reduce the width of the frame portion G as compared with the case where the optical member sheet FX is cut using a cutting blade. Further, the liquid crystal panel P can be reduced in size and / or the display area P4 can be increased in size. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.
　　また、光学部材シートＦＸを液晶パネルＰの表示領域Ｐ４に整合するシート片にカットした後に液晶パネルＰに貼合する場合、前記シート片及び液晶パネルＰそれぞれの寸法公差、並びにこれらの相対貼合位置の寸法公差が重なる。そのため、液晶パネルＰの額縁部Ｇの幅を狭めることが困難になる。つまり、表示エリアの拡大が困難になる。 In addition, when the optical member sheet FX is cut into a sheet piece aligned with the display region P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and their relative bonding Position tolerances overlap. Therefore, it becomes difficult to narrow the width of the frame part G of the liquid crystal panel P. That is, it becomes difficult to enlarge the display area.
　　一方、光学部材シートＦＸから液晶パネルＰの外側にはみ出るサイズの光学部材シートのシート片を切り出し、この切り出したシート片を液晶パネルＰに貼合した後に貼合面に合わせてカットする場合、切断線の振れ公差のみを考慮すればよい。そのため、額縁部Ｇの幅の公差を小さくすることができる（±０．１ｍｍ以下）。この点においても、液晶パネルＰの額縁部Ｇの幅を狭めることができる（表示エリアの拡大が可能となる）。 On the other hand, when cutting out the sheet piece of the optical member sheet having a size that protrudes from the optical member sheet FX to the outside of the liquid crystal panel P, and pasting the cut sheet piece on the liquid crystal panel P, the sheet piece is cut. Only line runout tolerances need to be considered. Therefore, the tolerance of the width of the frame part G can be reduced (± 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).
　　さらに、光学部材シートＦＸを刃物ではなくレーザーでカットすることで、切断時の力が液晶パネルＰに入力されず、液晶パネルＰの基板の端縁にクラックや欠けが生じ難くなり、ヒートサイクル等に対する耐久性が向上する。同様に、液晶パネルＰに非接触であるため、電気部品取り付け部Ｐ５に対するダメージも少ない。
　　尚、光学部材シートＦＸをレーザーでカットする場合において、レーザー照射の単位長さ当たりのエネルギーは、液晶パネルＰや光学部材シートＦＸの厚みや構成を考慮して決定することが好ましい。
　　本実施形態では、光学部材シートＦＸをレーザーでカットする場合において、単位長さ当たりのエネルギーが、０．０１～０．１１（Ｊ／ｍｍ）の範囲内でレーザー照射を行うことが好ましい。レーザー照射において、単位長さ当たりのエネルギーが大きすぎると、光学部材シートＦＸをレーザーでカットする場合に、光学部材シートＦＸがダメージを受けるおそれがある。しかし、単位長さ当たりのエネルギーが、０．０１～０．１１（Ｊ／ｍｍ）の範囲内でレーザー照射を行うことにより、光学部材シートＦＸがダメージを受けることを防ぐことができる。 Further, by cutting the optical member sheet FX with a laser instead of a blade, the cutting force is not input to the liquid crystal panel P, and it becomes difficult for cracks and chips to occur at the edge of the substrate of the liquid crystal panel P, such as a heat cycle. The durability against is improved. Similarly, since there is no contact with the liquid crystal panel P, there is little damage to the electrical component mounting portion P5.
When the optical member sheet FX is cut with a laser, the energy per unit length of laser irradiation is preferably determined in consideration of the thickness and configuration of the liquid crystal panel P and the optical member sheet FX.
In the present embodiment, when the optical member sheet FX is cut with a laser, it is preferable to perform laser irradiation within an energy range of 0.01 to 0.11 (J / mm) per unit length. If the energy per unit length is too large in laser irradiation, the optical member sheet FX may be damaged when the optical member sheet FX is cut with a laser. However, it is possible to prevent the optical member sheet FX from being damaged by performing laser irradiation within an energy range of 0.01 to 0.11 (J / mm) per unit length.
　　図６に示すように、光学部材シートＦＸ（図６では第三光学部材シートＦ３）をレーザーカットする場合、例えば表示領域Ｐ４の一長辺の延長上にレーザーカットの始点ｐｔ１を設定する。そして、この始点ｐｔ１からまず前記一長辺の切断を開始する。レーザーカットの終点ｐｔ２は、レーザーが表示領域Ｐ４を一周して表示領域Ｐ４の始点側の短辺の延長上に至る位置に設定する。始点ｐｔ１及び終点ｐｔ２は、光学部材シートＦＸの余剰部分に所定の接続代を残し、光学部材シートＦＸを巻き取る際の張力に耐え得るように設定される。 As shown in FIG. 6, when the optical member sheet FX (third optical member sheet F3 in FIG. 6) is laser-cut, for example, the laser cut start point pt1 is set on the extension of one long side of the display region P4. Then, the cutting of the one long side is started from the starting point pt1. The end point pt2 of the laser cut is set at a position where the laser goes around the display area P4 and reaches the extension of the short side on the start point side of the display area P4. The start point pt1 and the end point pt2 are set so as to be able to withstand the tension when the optical member sheet FX is wound, leaving a predetermined connection allowance in the surplus portion of the optical member sheet FX.
　　以上説明したように、上記実施形態における光学部材貼合体の製造システムは、液晶パネルＰに光学部材Ｆ１１，Ｆ１２を貼合してなる第二片面貼合パネルＰ１２の製造システムにおいて、前記液晶パネルＰ（光学表示部品）の一方の面に、前記液晶パネルＰの表示領域Ｐ４よりも大きい光学部材シートＦ１，Ｆ２（第一光学部材シート）を貼り合わせる貼合装置１２，１５（第一貼合装置）と、前記光学部材シートＦ１，Ｆ２が貼合された液晶パネルＰと前記光学部材シートＦ１，Ｆ２との貼合面の外周縁を検出する第一検出装置４１と、前記貼合装置１２，１５が貼合した前記光学部材シートＦ１，Ｆ２の領域であって前記液晶パネルＰと前記光学部材シートＦ１，Ｆ２との貼合面に対応する第一領域と、前記光学部材シートＦ１，Ｆ２の前記第一領域の外側の領域である第二領域とを切り離す切断装置１６と、を備え、前記切断装置１６は、前記第一検出装置４１が検出した液晶パネルＰと前記光学部材シートＦ１，Ｆ２との貼合面の外周縁に沿って、前記光学部材シートＦ１，Ｆ２を切断する。 As explained above, the manufacturing system of the optical member bonding body in the above embodiment is the liquid crystal panel P in the manufacturing system of the second single-sided bonding panel P12 formed by bonding the optical members F11 and F12 to the liquid crystal panel P. Bonding devices 12 and 15 (first bonding device) for bonding optical member sheets F1 and F2 (first optical member sheet) larger than the display area P4 of the liquid crystal panel P to one surface of (optical display component). ), The first detection device 41 for detecting the outer peripheral edge of the bonding surface of the liquid crystal panel P on which the optical member sheets F1, F2 are bonded and the optical member sheets F1, F2, and the bonding device 12, 15 is a region of the optical member sheets F1 and F2 bonded, and a first region corresponding to the bonding surface of the liquid crystal panel P and the optical member sheets F1 and F2, and the optical member sheet F1 A cutting device 16 that separates the second region, which is an outer region of the first region, and the cutting device 16 includes the liquid crystal panel P detected by the first detection device 41 and the optical member sheet F1. , F2 are cut along the outer peripheral edge of the bonding surface with F2.
　　同様に、上記実施形態における光学部材貼合体の製造システムは、第二片面貼合パネルＰ１２に光学部材Ｆ１３を貼合してなる両面貼合パネルＰ１３の製造システムにおいて、前記第二片面貼合パネルＰ１２の前記光学部材Ｆ１１，Ｆ１２とは反対側の面に、前記液晶パネルＰの表示領域Ｐ４よりも大きい光学部材シートＦ３に貼り合わせて第三貼合シートＦ２３とする貼合装置１８と、前記光学部材シートＦ３が貼合された液晶パネルＰと前記光学部材シートＦ３との貼合面の外周縁を検出する第二検出装置４２と、前記光学部材シートＦ３の前記貼合面に対応する部分とその外側の余剰部分とを切り離し、前記光学部材シートＦ３から前記貼合面に対応する大きさの光学部材Ｆ１３を切り出すことで、前記第三貼合シートＦ２３から単一の前記液晶パネルＰ及びこれに重なる光学部材Ｆ１３を含む前記両面貼合パネルＰ１３を切り出す切断装置１９とを備える。 Similarly, the manufacturing system of the optical member bonding body in the said embodiment WHEREIN: In the manufacturing system of the double-sided bonding panel P13 formed by bonding the optical member F13 to the 2nd single-sided bonding panel P12, said 2nd single-sided bonding panel. The bonding device 18 that is bonded to the optical member sheet F3 larger than the display area P4 of the liquid crystal panel P on the surface opposite to the optical members F11 and F12 of P12 to form the third bonding sheet F23; A portion corresponding to the bonding surface of the optical member sheet F3 and the second detection device 42 that detects the outer peripheral edge of the bonding surface of the liquid crystal panel P bonded with the optical member sheet F3 and the optical member sheet F3. From the third bonding sheet F23, by cutting off the excess portion outside and the optical member F13 having a size corresponding to the bonding surface from the optical member sheet F3. And a cutting device 19 for cutting the double-sided lamination panel P13 containing one of the liquid crystal panel P and the optical member F13 overlapping thereto.
　　本実施形態では、上述したように、前記切断装置１９は、前記光学部材シートＦ１，Ｆ２をレーザーカットしても良い。
　　また、本実施形態では、上述したように、前記切断装置１９は、ＣＯ２レーザーカッターを用いて前記第一光学部材シートをレーザーカットしても良い。
　　また、本実施形態では、上述したように、前記切断装置１９は、前記光学部材シートＦ１，Ｆ２から前記貼合面に対応する大きさの前記光学部材シートＦ１，Ｆ２を切り出すことで、前記液晶パネルＰ及び前記光学部材シートＦ１，Ｆ２を含む第二貼合シートＦ２２（光学部材貼合体）を切り出しても良い。
　　また、本実施形態では、上述したように、前記貼合装置１２，１５は、前記第一領域として、前記表示領域の大きさ以上であって、前記液晶パネルＰの外形状の大きさ以下の領域を用いても良い。
　　また、本実施形態では、上述したように、前記貼合装置１２，１５は、前記光学部材シートＦ１，Ｆ２の下面と、前記液晶パネルＰの上面とが接するように貼合しても良い。 In the present embodiment, as described above, the cutting device 19 may laser-cut the optical member sheets F1 and F2.
In the present embodiment, as described above, the cutting device 19 may laser-cut the first optical member sheet using a CO 2 laser cutter.
Further, in the present embodiment, as described above, the cutting device 19 cuts the optical member sheets F1 and F2 having a size corresponding to the bonding surface from the optical member sheets F1 and F2, thereby the liquid crystal. You may cut out the 2nd bonding sheet | seat F22 (optical member bonding body) containing the panel P and the said optical member sheet | seat F1, F2.
Moreover, in this embodiment, as above-mentioned, the said bonding apparatuses 12 and 15 are more than the magnitude | size of the said display area as said 1st area | region, Comprising: Below the magnitude | size of the external shape of the said liquid crystal panel P A region may be used.
Moreover, in this embodiment, as above-mentioned, the said bonding apparatuses 12 and 15 may bond so that the lower surface of the said optical member sheet | seats F1 and F2 and the upper surface of the said liquid crystal panel P may contact | connect.
　また、本実施形態では、上述したように、前記液晶パネルＰを、前記貼合装置１２，１５、前記切断装置１９の順に搬送するローラコンベヤ５（第一搬送装置）を更に備えても良い。
　　また、本実施形態では、上述したように、前記光学部材シートＦ１，Ｆ２を、前記貼合装置１２，１５に搬送する搬送装置１２ａ（第二搬送装置）を更に備えても良い。
　　また、本実施形態では、上述したように、前記搬送装置１２ａは、前記切断装置１９で切り離した前記光学部材シートＦ１，Ｆ２の前記第二領域を回収する第二回収部１５ｄ（回収部）を備えても良い。 Moreover, in this embodiment, you may further provide the roller conveyor 5 (1st conveying apparatus) which conveys the said liquid crystal panel P in order of the said bonding apparatuses 12 and 15 and the said cutting device 19 as mentioned above.
Moreover, in this embodiment, as above-mentioned, you may further provide the conveying apparatus 12a (2nd conveying apparatus) which conveys the said optical member sheet | seat F1, F2 to the said bonding apparatuses 12 and 15. FIG.
Moreover, in this embodiment, as above-mentioned, the said conveying apparatus 12a is the 2nd collection | recovery part 15d (collection | recovery part) which collect | recovers said 2nd area | regions of the said optical member sheet | seat F1, F2 cut | disconnected with the said cutting device 19. You may prepare.
　　また、本実施形態では、上述したように、液晶パネルＰの他方の面に、前記液晶パネルＰの表示領域よりも大きい光学部材シートＦ３（第二光学部材シート）を貼り合わせる貼合装置１８（第二貼合装置）を更に備えても良い。
　　また、本実施形態では、上述したように、前記切断装置１９は、前記貼合装置１８が貼合した前記光学部材シートＦ３の領域であって前記液晶パネルＰと前記光学部材シートＦ３との貼合面に対応する第三領域と、前記光学部材シートＦ３の前記第三領域の外側の領域である第四領域とを、前記第一領域と前記第二領域とを切り離すと同時に切り離しても良い。 Moreover, in this embodiment, as above-mentioned, the bonding apparatus 18 which bonds the optical member sheet | seat F3 (2nd optical member sheet | seat) larger than the display area of the said liquid crystal panel P to the other surface of the liquid crystal panel P. You may further provide a 2nd bonding apparatus.
Moreover, in this embodiment, as mentioned above, the said cutting device 19 is the area | region of the said optical member sheet | seat F3 which the said bonding apparatus 18 bonded, Comprising: Pasting of the said liquid crystal panel P and the said optical member sheet | seat F3 The third region corresponding to the mating surface and the fourth region that is the region outside the third region of the optical member sheet F3 may be separated simultaneously with the separation of the first region and the second region. .
　　この構成では、表示領域Ｐ４よりも大きい光学部材シートＦ１，Ｆ２，Ｆ３を液晶パネルＰに貼合した後に、光学部材シートＦ１，Ｆ２，Ｆ３が貼合された液晶パネルＰと光学部材シートＦ１，Ｆ２，Ｆ３との貼合面との貼合面の外周縁を検出し、液晶パネルＰに貼合された光学部材シートＦ１，Ｆ２，Ｆ３から貼合面に対応する部分の外側に配置された余剰部分を切り離す。これにより、貼合面に対応する大きさの光学部品Ｆ１１，Ｆ１２，Ｆ１３を液晶パネルＰの面上で形成することができる。これにより、光学部材Ｆ１１，Ｆ１２，Ｆ１３を表示領域Ｐ４の際まで精度よく設けることができ、表示領域Ｐ４外側の額縁部Ｇを狭めて表示エリアの拡大及び機器の小型化を図ることができる。
　　また、表示領域Ｐ４よりも大きい光学部材シートＦ１，Ｆ２，Ｆ３に液晶パネルＰに貼合する。そのため、光学部材シートＦ１，Ｆ２，Ｆ３の位置に応じてその光学軸方向が変化する場合でも、この光学軸方向に合わせて液晶パネルＰをアライメントして貼合することができる。これにより、液晶パネルＰに対する光学部材Ｆ１１，Ｆ１２，Ｆ１３の光学軸方向の精度を向上させることができ、光学表示デバイスの精彩及びコントラストを高めることができる。 In this configuration, after the optical member sheets F1, F2, and F3 larger than the display area P4 are bonded to the liquid crystal panel P, the liquid crystal panel P and the optical member sheets F1 and F1 that are bonded to the optical member sheets F1, F2, and F3 are bonded. The outer peripheral edge of the bonding surface with the bonding surface with F2 and F3 was detected, and the optical member sheets F1, F2, and F3 bonded to the liquid crystal panel P were arranged outside the portion corresponding to the bonding surface. Cut off the excess part. Thereby, the optical components F11, F12, and F13 having a size corresponding to the bonding surface can be formed on the surface of the liquid crystal panel P. As a result, the optical members F11, F12, and F13 can be accurately provided up to the display region P4, and the frame portion G outside the display region P4 can be narrowed to enlarge the display area and downsize the device.
Moreover, it bonds on liquid crystal panel P to optical member sheet | seat F1, F2, F3 larger than the display area P4. Therefore, even when the optical axis direction changes according to the positions of the optical member sheets F1, F2, and F3, the liquid crystal panel P can be aligned and bonded in accordance with the optical axis direction. Thereby, the precision of the optical axis direction of the optical members F11, F12, and F13 with respect to the liquid crystal panel P can be improved, and the color and contrast of the optical display device can be increased.
　　また、上記光学部材貼合体の製造装置は、前記切断装置１６，１９が、前記光学部材シートＦ１，Ｆ２，Ｆ３をレーザーカットする。そのため、光学部材シートＦ１，Ｆ２，Ｆ３を刃物でカットする場合と比べて、液晶パネルＰに力が及ばず、クラックや欠けが生じ難くなり、液晶パネルＰの安定した耐久性を得ることができる。また、貼合前の光学部材シートＦ１，Ｆ２，Ｆ３を単独でレーザーカットする場合と比べて、貼合不具の発生を防止することができる。 Moreover, as for the manufacturing apparatus of the said optical member bonding body, the said cutting devices 16 and 19 laser-cut the said optical member sheet | seat F1, F2, F3. Therefore, compared with the case where the optical member sheets F1, F2, and F3 are cut with a blade, the liquid crystal panel P is not exerted, cracks and chips are less likely to occur, and stable durability of the liquid crystal panel P can be obtained. . Moreover, generation | occurrence | production of a bonding defect can be prevented compared with the case where the optical member sheet | seat F1, F2, F3 before bonding is laser-cut alone.
　　ここで、上記実施形態における光学部材貼合体の製造方法は、前記液晶パネルＰ（光学表示部品）の一方の面に、前記液晶パネルＰの表示領域Ｐ４よりも大きい光学部材シートＦ１，Ｆ２（第一光学部材シート）を貼り合わせ、前記光学部材シートＦ１，Ｆ２が貼合された前記液晶パネルＰにおいて前記液晶パネルＰと前記光学部材シートＦ１，Ｆ２との貼合面の外周縁を検出し、貼合した前記光学部材シートＦ１，Ｆ２の領域であって前記液晶パネルＰと前記光学部材シートＦ１，Ｆ２との前記貼合面に対応する第一領域と、前記光学部材シートＦ１，Ｆ２の前記第一領域の外側の領域である第二領域とを切り離し、前記第一領域と前記第二領域とを切り離すステップでは、前記光学部材シートＦ１，Ｆ２が貼合された前記液晶パネルＰにおいて検出した前記液晶パネルＰと前記光学部材シートＦ１，Ｆ２との前記貼合面の外周縁に沿って、前記光学部材シートＦ１，Ｆ２を切断する。 Here, the manufacturing method of the optical member bonding body in the said embodiment is optical member sheet | seat F1, F2 (1st) larger than the display area P4 of the said liquid crystal panel P on one surface of the said liquid crystal panel P (optical display component). One optical member sheet) and the outer peripheral edge of the bonding surface of the liquid crystal panel P and the optical member sheets F1, F2 is detected in the liquid crystal panel P to which the optical member sheets F1, F2 are bonded, The first region corresponding to the bonding surface of the liquid crystal panel P and the optical member sheets F1 and F2 in the region of the bonded optical member sheets F1 and F2, and the optical member sheets F1 and F2. In the step of separating the second region, which is the region outside the first region, and separating the first region and the second region, the liquid crystal panel on which the optical member sheets F1 and F2 are bonded Along the outside edge of the lamination surface of the said liquid crystal panel P detected optical member sheet F1, F2 in, cutting the optical member sheet F1, F2.
　　同様に、上記実施形態における光学部材貼合体の製造方法は、前記第二片面貼合パネルＰ１２の前記光学部材Ｆ１１，Ｆ１２とは反対側の面に、前記第二片面貼合パネルＰ１２の表示領域Ｐ４よりも大きい光学部材シートＦ３に貼り合わせて第三貼合シートＦ２３とする工程と、前記第三光学部材シートＦ３が貼合された前記液晶パネルＰにおいて前記液晶パネルＰと前記第三光学部材シートＦ３との貼合面の外周縁を検出する工程と、前記光学部材シートＦ３の前記液晶パネルＰとの前記貼合面に対応する部分とその外側の余剰部分とを切り離し、前記光学部材シートＦ３から前記貼合面に対応する大きさの光学部材Ｆ１３を切り出すことで、前記第三貼合シートＦ２３から単一の前記液晶パネルＰ及びこれに重なる光学部材Ｆ１３を含む前記両面貼合パネルＰ１３を切り出す工程とを含む。 Similarly, the manufacturing method of the optical member bonding body in the said embodiment is a display area of said 2nd single-sided bonding panel P12 on the surface on the opposite side to said optical members F11 and F12 of said 2nd single-sided bonding panel P12. The liquid crystal panel P and the third optical member in the liquid crystal panel P in which the third optical member sheet F3 is bonded, and the step of bonding to the optical member sheet F3 larger than P4 to form the third bonding sheet F23 The step of detecting the outer peripheral edge of the bonding surface with the sheet F3, the portion corresponding to the bonding surface with the liquid crystal panel P of the optical member sheet F3, and the excess portion outside thereof are separated, and the optical member sheet By cutting out the optical member F13 having a size corresponding to the bonding surface from F3, the single liquid crystal panel P and the optical member F13 overlapping therewith from the third bonding sheet F23. And a step of cutting the free said double-sided lamination panel P13.
　　尚、図１１はフィルム貼合システム１の変形例を示す。これは、図１の構成に対して、前記第一貼合装置１２に代わる第一貼合装置１２’と、前記第一切断装置１３に代わる第一切断装置１３’とを備える点で異なる。その他の、前記実施形態と同一構成には同一符号を付して詳細説明は省略する。 In addition, FIG. 11 shows a modification of the film bonding system 1. This differs from the configuration of FIG. 1 in that a first bonding device 12 ′ replacing the first bonding device 12 and a first cutting device 13 ′ replacing the first cutting device 13 are provided. The other components that are the same as those in the above embodiment are given the same reference numerals, and detailed description thereof is omitted.
　　第一貼合装置１２’は、前記搬送装置１２ａに代わる搬送装置１２ａ’を備える。搬送装置１２ａ’は、前記搬送装置１２ａに比して、ロール保持部１２ｃ及びｐｆ回収部１２ｄの他に、第一回収部１２ｅをさらに有する。第一回収部１２ｅは、第一切断装置１３’を経て梯子状に切り残された第一光学部材シートＦ１の余剰部分を巻き取る。 1st bonding apparatus 12 'is equipped with the conveying apparatus 12a' replaced with the said conveying apparatus 12a. The transport device 12a 'further includes a first recovery unit 12e in addition to the roll holding unit 12c and the pf recovery unit 12d, as compared with the transport device 12a. The 1st collection | recovery part 12e winds up the excess part of the 1st optical member sheet | seat F1 which remained uncut by the ladder shape through the 1st cutting device 13 '.
　　第一切断装置１３’は、ｐｆ回収部１２ｄよりもパネル搬送下流側で第一回収部１２ｅよりもパネル搬送上流側に位置する。第一切断装置１３’は、第一光学部材シートＦ１から表示領域Ｐ４よりも大きいシート片を切り抜くべく、第一光学部材シートＦ１を切断する。第一切断装置１３’は前記第二及び第三切断装置１６，１９と同様のレーザー加工機である。第一切断装置１３’は、第一光学部材シートＦ１を表示領域Ｐ４外側の所定ラインに沿って無端状に切断する。 1st cutting device 13 'is located in the panel conveyance downstream rather than the pf collection | recovery part 12d and the panel conveyance upstream rather than the 1st collection | recovery part 12e. The first cutting device 13 'cuts the first optical member sheet F1 so as to cut out a sheet piece larger than the display area P4 from the first optical member sheet F1. The first cutting device 13 ′ is a laser beam machine similar to the second and third cutting devices 16 and 19. The first cutting device 13 'cuts the first optical member sheet F1 endlessly along a predetermined line outside the display area P4.
　　第一切断装置１３’の切断により、液晶パネルＰの下面に表示領域Ｐ４よりも大きい第一光学部材シートＦ１のシート片が貼合された第一片面貼合パネルＰ１１’が形成される。このとき、第一片面貼合パネルＰ１１’と、梯子状に切り残された第一光学部材シートＦ１の余剰部分とが分離され、第一光学部材シートＦ１の余剰部分が第一回収部１２ｅに巻き取られる。 The 1st single-sided bonding panel P11 'by which the sheet piece of the 1st optical member sheet | seat F1 larger than the display area P4 was bonded to the lower surface of liquid crystal panel P by cutting | disconnection of 1st cutting device 13' is formed. At this time, 1st single-sided bonding panel P11 'and the surplus part of the 1st optical member sheet | seat F1 uncut and left in the ladder form are isolate | separated, and the surplus part of the 1st optical member sheet | seat F1 becomes the 1st collection | recovery part 12e. It is wound up.
　　図１２はフィルム貼合システム１の他の変形例を示す。これは、図１の構成に対して、前記第三アライメント装置１７及び第三貼合装置１８に代わる第三アライメント装置１７’及び第三貼合装置１８’を備える点で異なる。その他の、前記実施形態と同一構成には同一符号を付して詳細説明は省略する。 FIG. 12 shows another modification of the film bonding system 1. This differs from the configuration of FIG. 1 in that a third alignment device 17 ′ and a third bonding device 18 ′ are provided in place of the third alignment device 17 and the third bonding device 18. The other components that are the same as those in the above embodiment are given the same reference numerals, and detailed description thereof is omitted.
　　第三アライメント装置１７’は、前記第三アライメント装置１７に比して、パネル表裏反転機能を無くし、前記第一及び第二アライメント装置１１，１４と同様のアライメント機能のみを有することで、比較的簡単な構成とされる。すなわち、第三アライメント装置１７’は、制御装置２０に記憶された光学軸方向の検査データ及び前記カメラＣの撮像データに基づき、第三貼合装置１８’に対する第二片面貼合パネルＰ１２の部品幅方向及び回転方向での位置決めを行う。この状態で、第二片面貼合パネルＰ１２が第三貼合装置１８’の貼合位置に導入される。 Compared with the third alignment device 17, the third alignment device 17 ′ has a panel front / back reversing function and has only the same alignment function as the first and second alignment devices 11 and 14. It has a simple configuration. That is, the third alignment device 17 ′ is a component of the second single-sided bonding panel P12 for the third bonding device 18 ′ based on the inspection data in the optical axis direction stored in the control device 20 and the imaging data of the camera C. Positioning is performed in the width direction and rotation direction. In this state, the second single-sided bonding panel P12 is introduced into the bonding position of the third bonding device 18 '.
　　第三貼合装置１８’は、前記第三貼合装置１８に比して、貼合位置に導入された長尺の第三光学部材シートＦ３の下面に対して、その下方を搬送される第二片面貼合パネルＰ１２の上面（液晶パネルＰの表示面側）を貼合する。第三貼合装置１８’は、前記搬送装置１８ａ及び挟圧ロール１８ｂの天地を逆にした構成を有する。これにより、第三光学部材シートＦ３の貼合面が下向きになり、この貼合面に対する傷付きや塵埃等の異物の付着が抑制される。 Compared with the said 3rd bonding apparatus 18, 3rd bonding apparatus 18 'is the 1st conveyed below the lower surface of the elongate 3rd optical member sheet | seat F3 introduced into the bonding position. The upper surface (the display surface side of the liquid crystal panel P) of the two-sided bonding panel P12 is bonded. 3rd bonding apparatus 18 'has the structure which reversed the top and bottom of the said conveying apparatus 18a and the pinching roll 18b. Thereby, the bonding surface of the 3rd optical member sheet | seat F3 turns downward, and adhesion of foreign materials, such as a damage | wound and dust with respect to this bonding surface, is suppressed.
　　尚、本発明は上記実施形態及び変形例に限られるものではなく、例えば前記第三貼合装置１８’と同様、第一及び第二貼合装置１２，１５の天地を逆にすることも可能である。また、これら天地を逆にした各貼合装置と前記第一貼合装置１２’及び第一切断装置１３’とを適宜組み合わせることも可能である。
　　また、原反ロールから巻き出した光学部材シートに光学表示部品を貼合する構成ではなく、大判の光学部材シートに複数の光学表示部品を適宜貼合する構成であってもよい。
　　そして、上記実施形態及び変形例における構成は本発明の一例であり、当該発明の要旨を逸脱しない範囲で種々の変更が可能である。 In addition, this invention is not restricted to the said embodiment and modification, For example, it is also possible to reverse the top and bottom of the 1st and 2nd bonding apparatuses 12 and 15 similarly to said 3rd bonding apparatus 18 '. It is. Moreover, it is also possible to combine suitably each bonding apparatus which reversed these tops, said 1st bonding apparatus 12 ', and 1st cutting device 13'.
Moreover, it is not the structure which bonds an optical display component to the optical member sheet unwound from the original fabric roll, The structure which bonds a some optical display component to a large-sized optical member sheet | seat suitably may be sufficient.
And the structure in the said embodiment and modification is an example of this invention, A various change is possible in the range which does not deviate from the summary of the said invention.
　　上述の制御装置２０は内部に、コンピュータシステムを有している。そして、上述した各装置の動作は、プログラムの形式でコンピュータ読み取り可能な記録媒体に記憶されており、このプログラムをコンピュータが読み出して実行することによって、上記処理が行われる。ここでコンピュータ読み取り可能な記録媒体とは、磁気ディスク、光磁気ディスク、ＣＤ－ＲＯＭ、ＤＶＤ－ＲＯＭ、半導体メモリ等をいう。また、このコンピュータプログラムを通信回線によってコンピュータに配信し、この配信を受けたコンピュータが、そのプログラムを実行するようにしても良い。 The above-described control device 20 has a computer system inside. The operation of each device described above is stored in a computer-readable recording medium in the form of a program, and the above processing is performed by the computer reading and executing this program. Here, the computer-readable recording medium means a magnetic disk, a magneto-optical disk, a CD-ROM, a DVD-ROM, a semiconductor memory, or the like. Further, the computer program may be distributed to the computer via a communication line, and the computer that has received the distribution may execute the program.
　　また、上記プログラムは、前述した機能の一部を実現するためのものであっても良い。
　　さらに、前述した機能をコンピュータシステムにすでに記録されているプログラムとの組み合わせで実現できるもの、いわゆる差分ファイル（差分プログラム）であっても良い。 The program may be for realizing a part of the functions described above.
Furthermore, what can implement | achieve the function mentioned above in combination with the program already recorded on the computer system, and what is called a difference file (difference program) may be sufficient.
　尚、上記実施形態のフィルム貼合システム１では、検出装置を用いて複数の液晶パネルＰごとに貼合面の外周縁を検出し、検出した外周縁に基づいて、個々の液晶パネルＰごとに貼合した光学部材シートの切断位置を設定してもよい。これにより、液晶パネルＰや光学部材シートの大きさの個体差によらず所望の大きさの光学部材を切り離すことができるため、液晶パネルＰや光学部材シートの大きさの個体差による品質バラツキをなくし、表示領域周辺の額縁部を縮小して表示エリアの拡大及び機器の小型化を図ることができる。 In addition, in the film bonding system 1 of the said embodiment, the outer periphery of the bonding surface is detected for every some liquid crystal panel P using a detection apparatus, and for each liquid crystal panel P based on the detected outer periphery. You may set the cutting position of the bonded optical member sheet | seat. As a result, the optical member having a desired size can be separated regardless of the individual differences in the sizes of the liquid crystal panel P and the optical member sheet. Therefore, the quality variation due to the individual differences in the sizes of the liquid crystal panel P and the optical member sheet is reduced. In addition, the frame portion around the display area can be reduced to enlarge the display area and downsize the device.
　　本発明は、表示領域周辺の額縁部を縮小して表示エリアの拡大及び機器の小型化を図ることができる光学部材貼合体の製造システム、製造方法及び記録媒体などに適用することができる。 The present invention can be applied to a manufacturing system, a manufacturing method, a recording medium, and the like of an optical member bonding body that can reduce the frame portion around the display area to increase the display area and downsize the device.
　１２　第一貼合装置（貼合装置）　１５　第二貼合装置（貼合装置）　１８　第三貼合装置（貼合装置）　１６　第二切断装置（切断装置）　１９　第三切断装置（切断装置）　４１　第一検出装置（検出装置）　４２　第二検出装置（検出装置）　Ｐ　液晶パネル（光学表示部品）　Ｐ４　表示領域　Ｆ１　第一光学部材シート（光学部材シート）　Ｆ２　第二光学部材シート（光学部材シート）　Ｆ３　第三光学部材シート（光学部材シート）　Ｆ１１　第一光学部材（光学部材）　Ｆ１２　第二光学部材（光学部材）　Ｆ１３　第三光学部材（光学部材）　Ｆ２２　第二貼合シート（貼合シート）　Ｆ２３　第三貼合シート（貼合シート）　Ｐ１２　第二片面貼合パネル（光学部材貼合体）　Ｐ１３　両面貼合パネル（光学部材貼合体）　ＳＡ１　第一貼合面（貼合面）　ＥＤ　第一貼合面の端縁（貼合面の外周縁） 12 1st bonding apparatus (bonding apparatus) 15 2nd bonding apparatus (bonding apparatus) 18 3rd bonding apparatus (bonding apparatus) 16 2nd cutting apparatus (cutting apparatus) 19 3rd cutting apparatus (cutting apparatus) ) 41 First detection device (detection device) 42 Second detection device (detection device) P Liquid crystal panel (optical display component) P4 Display area F1 First optical member sheet (optical member sheet) F2 Second optical member sheet (optical member) Sheet) F3 Third optical member sheet (optical member sheet) F11 First optical member (optical member) F12 Second optical member (optical member) F13 Third optical member (optical member) F22 Second bonding sheet (bonding sheet) ) F23 3rd bonding sheet (bonding sheet) P12 2nd single-sided bonding panel (optical member bonding body) P13 Double-sided bonding panel (optical member bonding) ) SA1 first lamination surface (lamination surface) ED edge of the first lamination surface (the outer peripheral edge of the lamination surface)

Claims (13)

  1. 　光学表示部品の一方の面に、前記光学表示部品の表示領域よりも大きい第一光学部材シートを貼り合わせる第一貼合装置と；
    　前記第一光学部材シートが貼合された前記光学表示部品と前記第一光学部材シートとの貼合面の外周縁を検出する検出装置と；
    　　前記第一貼合装置が貼合した前記第一光学部材シートの領域であって前記光学表示部品と前記第一光学部材シートとの前記貼合面に対応する第一領域と、前記第一光学部材シートの前記第一領域の外側の領域である第二領域とを切り離す切断装置と；
    　　を備え、
    　前記切断装置は、前記検出装置が検出した前記光学表示部品と前記第一光学部材シートとの前記貼合面の外周縁に沿って、前記第一光学部材シートを切断する
    　光学部材貼合体の製造システム。     A first laminating device for laminating a first optical member sheet larger than the display area of the optical display component on one surface of the optical display component;
    A detection device for detecting an outer peripheral edge of a bonding surface between the optical display component on which the first optical member sheet is bonded and the first optical member sheet;
    The first region corresponding to the bonding surface of the optical display component and the first optical member sheet, the first optical member sheet bonded by the first bonding device, and the first optical A cutting device for separating the second region, which is an outer region of the first region of the member sheet;
    With
    The cutting device cuts the first optical member sheet along the outer peripheral edge of the bonding surface between the optical display component and the first optical member sheet detected by the detection device. system.
  2. 　　前記切断装置は、前記第一光学部材シートをレーザーカットする請求項１に記載の光学部材貼合体の製造システム。 The said cutting device is a manufacturing system of the optical member bonding body according to claim 1, wherein the first optical member sheet is laser-cut.
  3. 　　前記切断装置は、ＣＯ２レーザーカッターを用いて前記第一光学部材シートをレーザーカットする請求項２に記載の光学部材貼合体の製造システム。 The cutting device, an optical member bonded body producing system according to claim 2, laser cutting the first optical member sheet using a CO 2 laser cutter.
  4. 　　前記切断装置は、
    　　前記第一光学部材シートから前記貼合面に対応する大きさの前記第一光学部材シートを切り出すことで、前記光学表示部品及び前記第一光学部材シートを含む光学部材貼合体を切り出す請求項１に記載の光学部材貼合体の製造システム。     The cutting device is
    The optical member bonding body containing the optical display component and the first optical member sheet is cut out by cutting out the first optical member sheet having a size corresponding to the bonding surface from the first optical member sheet. The manufacturing system of the optical member bonding body of description.
  5. 　　前記第一貼合装置は、前記第一領域として、前記表示領域の大きさ以上であって、前記光学表示部品の外形状の大きさ以下の領域を用いる請求項１に記載の光学部材貼合体の製造システム。 2. The optical member bonding body according to claim 1, wherein the first bonding device uses, as the first area, an area that is not less than the size of the display area and not more than the size of the outer shape of the optical display component. Manufacturing system.
  6. 　　前記第一貼合装置は、
    　　前記第一光学部材シートの下面と、前記光学表示部品の上面とが接するように貼合する請求項１に記載の光学部材貼合体の製造システム。     Said 1st bonding apparatus is
    The manufacturing system of the optical member bonding body of Claim 1 bonded so that the lower surface of said 1st optical member sheet | seat and the upper surface of the said optical display component may contact | connect.
  7. 　前記光学表示部品を、前記第一貼合装置、前記切断装置の順に搬送する第一搬送装置を更に備える請求項１に記載の光学部材貼合体の製造システム。 The manufacturing system of the optical member bonding body of Claim 1 further equipped with the 1st conveying apparatus which conveys the said optical display component in order of said 1st bonding apparatus and the said cutting device.
  8. 　前記第一光学部材シートを、前記第一貼合装置に搬送する第二搬送装置を更に備える請求項１に記載の光学部材貼合体の製造システム。 The manufacturing system of the optical member bonding body of Claim 1 further equipped with the 2nd conveying apparatus which conveys said 1st optical member sheet | seat to said 1st bonding apparatus.
  9. 　前記第二搬送装置は、
    　前記切断装置で切り離した前記第一光学部材シートの前記第二領域を回収する回収部を備える請求項８に記載の光学部材貼合体の製造システム。     The second transport device is
    The manufacturing system of the optical member bonding body of Claim 8 provided with the collection | recovery part which collect | recovers said 2nd area | regions of said 1st optical member sheet cut | disconnected with the said cutting device.
  10. 　光学表示部品の他方の面に、前記光学表示部品の表示領域よりも大きい第二光学部材シートを貼り合わせる第二貼合装置を更に備える請求項１に記載の光学部材貼合体の製造システム。 The manufacturing system of the optical member bonding body of Claim 1 further equipped with the 2nd bonding apparatus which bonds the 2nd optical member sheet | seat larger than the display area of the said optical display component on the other surface of an optical display component.
  11. 　前記切断装置は、
    　前記第二貼合装置が貼合した前記第二光学部材シートの領域であって前記光学表示部品と前記第二光学部材シートとの貼合面に対応する第三領域と、前記第二光学部材シートの前記第三領域の外側の領域である第四領域とを、前記第一領域と前記第二領域とを切り離すと同時に切り離す請求項１０に記載の光学部材貼合体の製造システム。     The cutting device is
    A region of the second optical member sheet bonded by the second bonding device, a third region corresponding to the bonding surface of the optical display component and the second optical member sheet, and the second optical member The manufacturing system of the optical member bonding body according to claim 10, wherein the fourth region, which is a region outside the third region of the sheet, is separated simultaneously with the separation of the first region and the second region.
  12. 　光学表示部品の一方の面に、前記光学表示部品の表示領域よりも大きい第一光学部材シートを貼り合わせ；
    　前記第一光学部材シートが貼合された前記光学表示部品において前記光学表示部品と前記第一光学部材シートとの貼合面の外周縁を検出し；
    　　貼合した前記第一光学部材シートの領域であって前記光学表示部品と前記第一光学部材シートとの前記貼合面に対応する第一領域と、前記第一光学部材シートの前記第一領域の外側の領域である第二領域とを切り離し；
    　前記第一領域と前記第二領域とを切り離すステップでは、前記第一光学部材シートが貼合された前記光学表示部品において検出した前記光学表示部品と前記第一光学部材シートとの前記貼合面の外周縁に沿って、前記第一光学部材シートを切断する
    　　光学部材貼合体の製造方法。     Bonding a first optical member sheet larger than the display area of the optical display component to one surface of the optical display component;
    Detecting an outer peripheral edge of a bonding surface between the optical display component and the first optical member sheet in the optical display component on which the first optical member sheet is bonded;
    The first region of the first optical member sheet that is the region of the first optical member sheet that is bonded and that corresponds to the bonding surface of the optical display component and the first optical member sheet Separating from the second area, the area outside
    In the step of separating the first region and the second region, the bonding surface of the optical display component and the first optical member sheet detected in the optical display component on which the first optical member sheet is bonded. The manufacturing method of the optical member bonding body which cut | disconnects said 1st optical member sheet | seat along the outer periphery.
  13. 　　光学表示部品の一方の面に、前記光学表示部品の表示領域よりも大きい第一光学部材シートを貼り合わせ；
    　前記第一光学部材シートが貼合された前記光学表示部品において前記光学表示部品と前記第一光学部材シートとの貼合面の外周縁を検出し；
    　　貼合した前記第一光学部材シートの領域であって前記光学表示部品と前記第一光学部材シートとの前記貼合面に対応する第一領域と、前記第一光学部材シートの前記第一領域の外側の領域である第二領域とを切り離し；
    　前記第一領域と前記第二領域とを切り離すステップでは、前記第一光学部材シートが貼合された前記光学表示部品において検出した前記光学表示部品と前記第一光学部材シートとの前記貼合面の外周縁に沿って、前記第一光学部材シートを切断する
    　　ことを実行するプログラムを記録したコンピュータ読み取り可能な記録媒体。     Bonding a first optical member sheet larger than the display area of the optical display component to one surface of the optical display component;
    Detecting an outer peripheral edge of a bonding surface between the optical display component and the first optical member sheet in the optical display component on which the first optical member sheet is bonded;
    The first region of the first optical member sheet that is the region of the first optical member sheet that is bonded and that corresponds to the bonding surface of the optical display component and the first optical member sheet Separating from the second area, the area outside
    In the step of separating the first region and the second region, the bonding surface of the optical display component and the first optical member sheet detected in the optical display component on which the first optical member sheet is bonded. A computer-readable recording medium having recorded thereon a program for cutting the first optical member sheet along the outer peripheral edge thereof.
PCT/JP2014/051757 2013-05-16 2014-01-28 Bonded optical member manufacturing system, manufacturing method, and recording medium WO2014185092A1 (en)

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