WO2014174767A1 - Power conversion device - Google Patents

Power conversion device Download PDF

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Publication number
WO2014174767A1
WO2014174767A1 PCT/JP2014/001850 JP2014001850W WO2014174767A1 WO 2014174767 A1 WO2014174767 A1 WO 2014174767A1 JP 2014001850 W JP2014001850 W JP 2014001850W WO 2014174767 A1 WO2014174767 A1 WO 2014174767A1
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WO
WIPO (PCT)
Prior art keywords
bus bar
conversion device
substrate
power conversion
power module
Prior art date
Application number
PCT/JP2014/001850
Other languages
French (fr)
Japanese (ja)
Inventor
亮太 保坂
角谷　和重
田口　賢治
修央 山本
神谷　岳
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from JP2013091071A external-priority patent/JP2014217128A/en
Priority claimed from JP2013092186A external-priority patent/JP2014217152A/en
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Publication of WO2014174767A1 publication Critical patent/WO2014174767A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides

Definitions

  • the present invention relates to a power converter provided with a plurality of electronic circuit boards.
  • Vehicles such as plug-in HEVs (Hybrid Electric Vehicles) or EVs (Electric Vehicles) are equipped with a power conversion device that converts power to drive power for driving a motor.
  • the power converter include an inverter or a converter.
  • Such a power conversion device includes a high-voltage electronic circuit board that constitutes a drive circuit that switches and drives a plurality of semiconductor modules, and a low-voltage electronic circuit that constitutes a control circuit that controls the drive state based on vehicle information.
  • substrate is known (for example, refer patent document 1).
  • the power conversion apparatus of Patent Document 1 a space is provided between the two electronic circuit boards, and the two electronic circuit boards are stacked in the thickness direction of the board.
  • the two electronic circuit boards are fixed to a pair of stays arranged at their edges.
  • An object of the present invention is to provide a power conversion device capable of making the areas of two electronic circuit boards each have an arbitrary size without being affected by the area or fastening position of one electronic circuit board. Is to provide.
  • a power conversion device is a power conversion device in which a first substrate and a second substrate are stacked in the thickness direction of a substrate with a space interposed therebetween, and a table on which the second substrate is disposed
  • the substrate holding member is disposed such that the back surface of the surface on which the second substrate is disposed in the base portion is opposed to the first substrate with the space interposed therebetween. The structure is adopted.
  • the area of the two electronic circuit boards can be arbitrarily sized without the influence of the area of one electronic circuit board or the fastening position.
  • the disassembled perspective view which shows the structural example of the power converter device which concerns on Embodiment 1 of this invention.
  • the perspective view which shows an example of the smoothing capacitor which concerns on Embodiment 1 of this invention.
  • the top view which shows the structural example of the power converter device which concerns on Embodiment 1 of this invention.
  • the disassembled perspective view which shows the structural example of the power converter device which concerns on Embodiment 2 of this invention.
  • the top view which shows the structural example of the power converter device which concerns on Embodiment 2 of this invention.
  • FIG. 1 is an exploded perspective view showing a configuration of power converter 100 according to Embodiment 1 of the present invention.
  • power conversion device 100 is mounted on a vehicle, and an inverter device that converts electric power from a storage battery mounted on the vehicle into electric power for driving a motor is taken as an example. It is not limited to an inverter device.
  • the power conversion apparatus 100 includes a base member 1, a power module 2, a high-voltage board 3, a tower member 4, and a low-voltage board 5.
  • each dashed-dotted line has shown the fastening relationship of the boss
  • the base member 1 is a metal (for example, aluminum) plate-like member, and each device is disposed on one surface thereof.
  • the power module 2 is disposed in the central portion of the base member 1.
  • a plurality of screw holes 13 are provided at a position where the power module 2 is disposed. When the power module 2 is disposed on the base member 1, the screw hole 13 overlaps with the screw hole 21 provided in the power module 2, and a screw (not shown) is inserted and screwed.
  • the base member 1 is provided with a plurality of bosses around the position where the power module 2 is disposed. These bosses are used for fastening with the high-pressure substrate 3 or the tower member 4.
  • the boss 11 is fastened with a boss fastening portion 46 provided on the tower member 4.
  • the boss 12 is fastened to a boss fastening portion 31 provided on the high-voltage substrate 3.
  • the power module 2 is an IGBT (Insulated Gate Bipolar Transistor) module, for example, and is disposed on the base member 1.
  • the power module 2 includes a screw hole 21, a boss 22, an input side connection portion 23, and an output side connection portion 24.
  • a plurality of screw holes 21 are provided on the bottom surface of the power module 2. As described above, when the power module 2 is disposed on the base member 1, the screw hole 21 overlaps with the screw hole 13 provided in the base member 1, and a screw (not shown) is inserted and screwed.
  • a plurality of bosses 22 are provided on the upper surface of the power module 2.
  • the boss 22 is fastened with a boss fastening portion 32 provided on the high-voltage substrate 3.
  • the input side connection portion 23 is a portion connected to the smoothing capacitor 6 (see FIG. 2), and is provided at three locations on the upper surface of the power module 2.
  • FIG. 2 An external perspective view of the smoothing capacitor 6 is shown in FIG.
  • the smoothing capacitor 6 is disposed adjacent to the power module 2 in the base member 1 and fixed.
  • the three power module connection portions 61 provided on the side surface 60 of the smoothing capacitor 6 are connected in contact with the three input side connection portions 23, respectively.
  • the power module connecting portion 61 has a flat plate shape and is provided in the vertical direction of the side surface 60.
  • the side surface 60 is a surface facing the power module 2.
  • the output side connection portion 24 is a portion connected to a motor (not shown), and is provided on the upper surface of the power module 2 at three locations.
  • the power module 2 is fixed to the base member 1 and the high-voltage substrate 3 is fixed.
  • the power module 2 converts, for example, a direct current supplied from a bus bar (not shown) connected to the battery into three-phase alternating current power, and supplies the three-phase alternating current power to the motor via the output side connection unit 24.
  • the switching timing of the power module 2 is controlled by the high-voltage board 3.
  • the smoothing capacitor 6 smoothes the current.
  • the high-voltage board 3 is an electronic circuit board that controls the switching timing of the power module 2 based on a control signal from the low-voltage board 5.
  • the high-voltage substrate 3 has boss fastening portions 31 and 32 and cutout portions 33 and 34.
  • boss fastening portions 31 and 32 are provided. As described above, the boss fastening portion 31 is fastened with the boss 12 provided on the base member 1. Further, as described above, the boss fastening portion 32 is fastened with the boss 22 provided in the power module 2. With such a configuration, the high-voltage substrate 3 is disposed and fixed on the upper surface of the power module 2.
  • the notches 33 and 34 are provided at three locations along the long side of the high-voltage substrate 3, respectively.
  • the cutout portion 33 is provided corresponding to the position of the input side connection portion 23 of the power module 2. Further, the notch 34 is provided corresponding to the position of the output side connection 24 of the power module 2.
  • the tower member 4 is a member (an example of a substrate holding member) for stacking and arranging the low-pressure substrate 5 in the thickness direction while providing a space between the low-pressure substrate 5 and the high-pressure substrate 3.
  • the tower member 4 includes a base portion 40, a leg portion 41, a notch portion 42, an opening portion 43, a boss 44, a clamp portion 45, and a boss fastening portion 46.
  • the base 40 is a part on which the low-pressure substrate 5 is disposed, and is supported by the leg 41.
  • the back surface of the base portion 40 on which the low-voltage substrate 5 is disposed (hereinafter referred to as “substrate placement surface”) faces the high-voltage substrate 3 with a space in between.
  • This base part 40 is comprised with resin which can shield the radiation noise generated from the power module 2, for example. Thereby, the radiation noise generated from the power module 2 can be shielded, and the influence on the low-voltage substrate 5 can be prevented.
  • a plurality of leg portions 41 are provided along the long side of the base portion 40 and along the vertical direction of the back surface of the substrate arrangement surface.
  • One end of the leg portion 41 is connected to the base portion 40, and the other end is fastened to the base member 1.
  • the fastening of the leg part 41 and the base member 1 is implement
  • the notch 42 is provided at three locations along the long side of the base 40.
  • the cutout portion 42 is provided corresponding to the positions of the input side connection portion 23 of the power module 2 and the cutout portion 33 of the high voltage system substrate 3.
  • FIG. 3 is a top view of the tower member 4 when the low-pressure substrate 5 is not disposed.
  • the input side connection portion 23 is exposed from the notch portion 42. Therefore, the input side connection part 23 can be connected to the power module connection part 61 of the smoothing capacitor 6 described in FIG.
  • the opening 43 is provided at three locations along the vicinity of the long side of the base 40.
  • the opening 43 is provided corresponding to the position of the output side connection portion 24 of the power module 2 and the cutout portion 34 of the high voltage system substrate 3.
  • the output side connecting portion 24 is exposed to the outside. An example of this is shown in FIG. As shown in FIG. 3, the output side connection portion 24 is exposed from the opening 43. Therefore, the output side connecting portion 24 can be connected to a motor (not shown) by screw fastening or the like via, for example, a harness or a bus bar.
  • the opening 43 may be a notch.
  • a plurality of bosses 44 are provided near the center of the base 40.
  • the boss 44 is fastened with a boss fastening portion 51 provided on the low-pressure substrate 5.
  • the clamp part 45 holds a harness, for example. Thereby, since the harness is not bulky, the components can be laid out with a minimum distance, and the size of the power conversion device can be minimized. Further, if the clamp portion 45 is not provided, another resin component and a screw for fastening the same increase, and further, the cost increases because it is necessary to stand a boss on the base portion of the housing or to cut a tap. This can reduce the number of parts. Furthermore, if there is no clamp part 45, it is difficult to assemble because it is laid out at the minimum distance, but the assemblability can be improved by the clamp part 45. Note that the arrangement position and the number of arrangement of the clamp portions 45 are not limited to those shown in FIG.
  • a plurality of boss fastening portions 46 are provided on the leg portion 41. As described above, the boss fastening portion 46 is fastened with the boss 11 provided on the base member 1. With such a configuration, the tower member 4 is disposed and fixed to the base member 1. Note that the smoothing capacitor 6 is disposed on the portion of the leg portion 41 where the boss fastening portion 46 is provided.
  • the low-voltage board 5 is an electronic circuit board that controls the high-voltage board 3 based on vehicle information.
  • the low-pressure substrate 5 has a boss fastening part 51.
  • a plurality of boss fastening portions 51 are provided on the low-pressure substrate 5. As described above, the boss fastening portion 51 is fastened with the boss 44 provided on the base portion 40. With such a configuration, the low-pressure substrate 5 is disposed and fixed on the upper surface of the base portion 40 of the tower member 4.
  • the power conversion device 100 provides a space between the low-voltage substrate 5 and the high-voltage substrate 3 and stacks them in the thickness direction.
  • the tower member 4 provided with the mountable base 40 is used. That is, since the low-voltage substrate 5 is disposed on the base 40 and is laminated with a space of a predetermined distance between the low-voltage substrate 5 and the high-voltage substrate 3, there is no need to use a stay or the like. Further, since the boss 44 for fastening the low-pressure substrate 5 is provided on the base portion 40, it is not necessary to provide a hole for passing the boss in the high-pressure substrate 3. Therefore, in the power conversion device 100 of the present embodiment, one electronic circuit board is not affected by the area of the other electronic circuit board or the fastening position, and the areas of the two electronic circuit boards are set to arbitrary sizes, respectively. be able to.
  • the notch portions 33 and 42 are provided at positions corresponding to the input side connection portion 23 of the power module 2 in each of the high voltage system board 3 and the tower member 4. It is characterized by.
  • the smoothing capacitor 6 of the type provided with the protruding power module connection portion 61 on the side surface 60 the length of the power module connection portion 61 is shortened and the smoothing capacitor 6 is connected close to the power module 2. Can do. Therefore, the area of the power conversion device 100 (base member 1) can be reduced, and space saving can be realized.
  • the tower member 4 may be provided with a shield member (for example, an iron or aluminum plate) capable of shielding radiation noise generated from the power module 2 on the substrate arrangement surface or the back surface thereof.
  • a shield member for example, an iron or aluminum plate
  • the radiation noise generated from the power module 2 can be shielded, and the influence on the low-voltage substrate 5 can be prevented.
  • the low-voltage substrate 5 has an area smaller than that of the high-voltage substrate 3, but the area may be larger than that of the high-voltage substrate 3.
  • Embodiment 2 ⁇ Background and Problems According to Embodiment 2>
  • a power converter hereinafter referred to as a conventional power converter
  • a bus bar for supplying power to a power module is routed above a smoothing capacitor.
  • the power conversion device of the present embodiment it is possible to secure safety and improve earthquake resistance with respect to the routing of the bus bar for supplying power to the power module.
  • FIG. 4 is an exploded perspective view illustrating a configuration example of the power conversion apparatus 100 according to Embodiment 2 of the present invention from different angles.
  • FIG. 5 is a top view showing a configuration example of the power conversion apparatus 100 according to Embodiment 2 of the present invention. 4 and 5, the same reference numerals are given to the same parts as those described in FIGS. 1 to 3.
  • power conversion device 100 is mounted on a vehicle, and an inverter device that converts electric power from a battery mounted on the vehicle into electric power for driving a motor is taken as an example.
  • the power conversion device of the present invention is an inverter. It is not limited to a device.
  • the power conversion device 100 includes a base member 1, a power module 2, bus bars 7, 8, 50, 52, and a smoothing capacitor 6.
  • a base member 1 for controlling the power module 2
  • an electronic circuit board for controlling the high-voltage board 2
  • a base member A housing cover that collectively covers the entire device arranged in 1 is not shown.
  • the base member 1 is a metal (for example, aluminum) plate-like member, and each device is disposed on one surface thereof.
  • the power module 2 is fixedly disposed in the central portion of the base member 1.
  • the base member 1 is formed with a pedestal portion 9 adjacent to a portion where the power module 2 is disposed.
  • the pedestal portion 9 is a portion for arranging the smoothing capacitor 6 at a certain height from the base member 1. Therefore, when the smoothing capacitor 6 is disposed on the base portion 9, a space (hereinafter referred to as “capacitor lower space”) is formed between the base member 1 and the bottom surface of the smoothing capacitor 6. Bus bars 7 and 8 are arranged in this space.
  • the power module 2 is, for example, an IGBT (Insulated Gate Bipolar Transistor) module, and is fixedly disposed near the center of the base member 1.
  • the power module 2 has an input side connection part 23 and an output side connection part 24.
  • the input side connection portion 23 and the output side connection portion 24 are provided at three locations on the upper surface of the power module 2.
  • the input-side connection portion 23 is a portion that is electrically connected to the bus bars 7 and 8 and the smoothing capacitor 6 and is divided into a P-pole connection portion 14 and an N-pole connection portion 15.
  • the N pole connecting portion 15 is connected to the connecting portion 27 of the bus bar 8.
  • the P-pole connecting portion 14 is connected to the connecting portion 17 of the bus bar 7.
  • the P-pole connection part may be 22 and the N-pole connection part may be 21.
  • the output side connecting portion 24 is a portion that is electrically connected to a motor (not shown) that drives a vehicle wheel or the like.
  • Such a power module 2 converts the direct current supplied via the bus bars 50 and 52 and the bus bars 7 and 8 into three-phase alternating current power and supplies it to a motor or the like. At this time, the switching timing of the power module 2 is controlled by the high-voltage board.
  • the smoothing capacitor 6 smoothes the current.
  • the bus bar 7 is a metal (for example, copper) plate-like member for supplying the current from the bus bar 52 to the power module 2.
  • the bus bar 7 is fixedly disposed at the bottom in the space below the capacitor.
  • the bus bar 7 has connection portions 17 and 18 formed along the longitudinal direction thereof. In the example of FIG. 4, each of the connection portions 17 and 32 has a crank shape and is formed in three.
  • the connecting portion 17 is connected to the P-pole connecting portion 14 of the input side connecting portion 23 of the power module 2.
  • the connecting portion 18 is connected to the bus bar 52. It should be noted that at least one of the plurality of connecting portions 18 may be directly or indirectly connected to the bus bar 52. For example, as shown in FIG. 5, the middle connecting portion 18 is connected to the bus bar 52 via the bus bar 72.
  • the bus bar 8 is a metal (for example, copper) plate-like member for supplying current from the bus bar 50 to the power module 2.
  • the bus bar 8 is fixedly disposed on the upper side of the bus bar 7 in the space below the capacitor. At this time, the bus bar 8 is arranged with a predetermined insulation distance from the bus bar 7. This has an effect of removing common mode noise. Instead of the insulation distance, an insulator may be sandwiched between the bus bar 8 and the bus bar 7.
  • the bus bar 8 is formed with connecting portions 27 and 28 along the longitudinal direction thereof. In the example of FIG. 4, three connection portions 27 and 28 are formed. Moreover, in the example of FIG. 4, the connection part 27 is crank shape.
  • connection unit 28 is connected to the bus bar 50. It should be noted that at least one of the plurality of connection portions 28 may be directly or indirectly connected to the bus bar 50.
  • the end connection portion 28 is connected to the bus bar 50 via the bus bar 71.
  • the bus bar 7 and the bus bar 8 are configured to overlap in the vertical direction. That is, the bus bar 7 and the bus bar 8 are arranged in parallel, which is more effective for noise removal.
  • the bus bars 50 and 52 are metal (for example, copper) plate-like members that are electrically connected to, for example, a vehicle-mounted battery (not shown) and supply current from the battery to the bus bars 7 and 8. .
  • the bus bars 50 and 52 are fixedly provided in parallel and supported vertically (or horizontally) with respect to the device arrangement surface of the base member 1.
  • the bus bar 50 is for the N pole
  • the bus bar 52 is for the P pole. Therefore, the bus bar 8 connected to the bus bar 50 is for the N pole, and the bus bar 7 connected to the bus bar 52 is for the P pole.
  • the smoothing capacitor 6 is fixed to the pedestal portion 9 and arranged. That is, the smoothing capacitor 6 is fixedly disposed on the upper side of the bus bar 8 disposed in the capacitor lower space.
  • the smoothing capacitor 6 includes a power module connecting portion 61 on the side surface 60 facing the power module 2.
  • the power module connecting portion 61 is a portion connected to the input side connecting portion 23 (P pole connecting portion 14 and N pole connecting portion 15) of the power module 2 through the connecting portion 17 and the connecting portion 27, and is connected to the P pole. It is divided into the connection part for N and the connection part for N poles. In the example of FIG. 4, three power module connection portions 61 are formed.
  • the power module connecting portion 61 has a flat plate shape and is provided in the vertical direction of the side surface 60.
  • the order to overlap may be arbitrary orders.
  • the power conversion device 100 of the present embodiment is characterized in that the two bus bars 7 and 8 are routed between the smoothing capacitor 6 and the base member 1 and connected to the power module 2.
  • the smoothing capacitor 6 is on the bus bars 7 and 8, so that the user cannot touch the bus bars 7 and 8. Therefore, safety can be ensured.
  • the bus bars 7 and 8 are on the lower side of the smoothing capacitor 6, the center of gravity is lower than that on the upper side of the smoothing capacitor 6. Therefore, earthquake resistance can be improved. Therefore, the power conversion device 100 according to the present embodiment can ensure safety and improve the earthquake resistance with respect to the routing of the bus bar for supplying power to the power module.
  • Aspect 1 is a power conversion device in which a first substrate and a second substrate are stacked in the thickness direction of a substrate with a space interposed therebetween, and a substrate holding member provided with a base portion on which the second substrate is disposed And the substrate holding member is disposed such that a back surface of a surface of the base portion on which the second substrate is disposed is disposed so as to face the first substrate with the space interposed therebetween.
  • Aspect 2 is the power conversion device according to Aspect 1, wherein the base has a notch that exposes the capacitor connection to the outside at a position corresponding to the capacitor connection included in the power module.
  • Aspect 3 is the power conversion device according to Aspect 1, wherein the base is made of a resin capable of shielding radiation noise generated from the power module.
  • Aspect 4 is the power conversion device according to Aspect 1, wherein the base portion has a shield member capable of shielding radiation noise generated from the power module on the surface on which the second substrate is disposed or on the back surface thereof.
  • Aspect 5 is the power conversion device according to Aspect 1, wherein the substrate holding member has a clamp portion for holding a harness.
  • Aspect 6 includes a base member on which the power module is disposed, and a bus bar for supplying the power to the power module is disposed between the smoothing capacitor disposed adjacent to the power module and the base member.
  • Aspect 7 is the power conversion device according to aspect 6, wherein the bus bars are a P-pole bus bar and an N-pole bus bar, and the P-pole bus bar and the N-pole bus bar are arranged in parallel.
  • Aspect 8 is the power conversion device according to Aspect 7, wherein the P-pole bus bar and the N-pole bus bar are arranged with a predetermined insulation distance.
  • Aspect 9 is the power conversion device according to Aspect 6, wherein an insulator is disposed between the P-pole bus bar and the N-pole bus bar.
  • the base member includes a pedestal portion for arranging the smoothing capacitor at a predetermined height from the base member, adjacent to the power module, and the smoothing capacitor disposed on the pedestal portion is provided.
  • the present invention can be applied to, for example, a power conversion device including a plurality of electronic circuit boards.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)

Abstract

Provided is a power conversion device in which two electronic circuit boards can be set to have arbitrary area sizes while one of the two electronic circuit boards is not affected by the area or the fastening position of the other one of the two electronic circuit boards. The power conversion device (100) has a high-voltage power supply board (3) and a low-voltage power supply board (5). The high-voltage power supply board (3) and the low-voltage power supply board (5) are disposed stacked in the thickness direction of the board with a space in between. A tower member (4) is equipped with a mounting portion (40) on which the low-voltage power supply board (5) is placed, and the reverse side of the board placing surface of the mounting portion (40) is arranged so as to face the high-voltage power supply board (3) with a space in between.

Description

電力変換装置Power converter
　本発明は、複数の電子回路基板を備えた電力変換装置に関する。 The present invention relates to a power converter provided with a plurality of electronic circuit boards.
　プラグインＨＥＶ（Hybrid Electric Vehicle：ハイブリッド自動車）またはＥＶ（Electric Vehicle：電気自動車）などの車両は、電源電力を、モータを駆動するための駆動用電力に変換する電力変換装置を備えている。電力変換装置は、例えば、インバータまたはコンバータが挙げられる。 Vehicles such as plug-in HEVs (Hybrid Electric Vehicles) or EVs (Electric Vehicles) are equipped with a power conversion device that converts power to drive power for driving a motor. Examples of the power converter include an inverter or a converter.
　このような電力変換装置は、複数の半導体モジュールをスイッチング駆動させる駆動回路を構成する高圧系の電子回路基板と、車両の情報に基づいて駆動状態を制御する制御回路を構成する低圧系の電子回路基板と、を有するものが知られている（例えば、特許文献１参照）。 Such a power conversion device includes a high-voltage electronic circuit board that constitutes a drive circuit that switches and drives a plurality of semiconductor modules, and a low-voltage electronic circuit that constitutes a control circuit that controls the drive state based on vehicle information. What has a board | substrate is known (for example, refer patent document 1).
　特許文献１の電力変換装置において、２つの電子回路基板は、それらの間に空間が設けられ、かつ、基板の厚み方向に積層配置されている。そして、２つの電子回路基板は、それらの端縁に配置される一対のステーに固定されている。この構成により、特許文献１の電力変換装置は、車両の衝突等による外力が作用した場合でも、電子回路基板が変形することを抑制できる。 In the power conversion apparatus of Patent Document 1, a space is provided between the two electronic circuit boards, and the two electronic circuit boards are stacked in the thickness direction of the board. The two electronic circuit boards are fixed to a pair of stays arranged at their edges. With this configuration, the power conversion device of Patent Document 1 can suppress deformation of the electronic circuit board even when an external force due to a vehicle collision or the like is applied.
特開２００９－１５９７６７号公報JP 2009-159767 A
　しかしながら、特許文献１の電力変換装置は、一対のステーを各電子回路基板の端縁で固定するために、２つの電子回路基板の面積を同じにする必要がある。よって、一方の電子回路基板の面積は、他方の電子回路基板の面積によって制限されてしまう、という課題がある。 However, in the power conversion device of Patent Document 1, in order to fix the pair of stays at the edge of each electronic circuit board, the areas of the two electronic circuit boards need to be the same. Therefore, there is a problem that the area of one electronic circuit board is limited by the area of the other electronic circuit board.
　また、特許文献１の電力変換装置は、振動対策等として上の電子回路基板の中央付近を締結する場合、下の電子回路基板に穴を設け、その穴にボスを通して上の電子回路基板に締結することになる。すなわち、下の電子回路基板は、ボス用の穴が設けられることで、面積が小さくなる。よって、下の電子回路基板の面積は、上の電子回路基板の面積によって制限されてしまう、という課題がある。 In addition, in the power conversion device of Patent Document 1, when fastening the vicinity of the center of the upper electronic circuit board as a vibration countermeasure or the like, a hole is formed in the lower electronic circuit board, and the hole is fastened to the upper electronic circuit board through a boss. Will do. That is, the area of the lower electronic circuit board is reduced by providing a hole for the boss. Therefore, there is a problem that the area of the lower electronic circuit board is limited by the area of the upper electronic circuit board.
　本発明の目的は、一方の電子回路基板が他方の電子回路基板の面積または締結位置の影響を受けることなく、２つの電子回路基板の面積をそれぞれ任意の大きさとすることができる電力変換装置を提供することである。 SUMMARY OF THE INVENTION An object of the present invention is to provide a power conversion device capable of making the areas of two electronic circuit boards each have an arbitrary size without being affected by the area or fastening position of one electronic circuit board. Is to provide.
　本発明の一態様に係る電力変換装置は、第１基板と第２基板が空間を挟んで基板の厚み方向に積層して配置される電力変換装置であって、前記第２基板を配置する台部を備えた基板保持部材を有し、前記基板保持部材は、前記台部における前記第２基板が配置される面の裏面が、前記空間を挟んで前記第１基板と対向するように配置される構成を採る。 A power conversion device according to an aspect of the present invention is a power conversion device in which a first substrate and a second substrate are stacked in the thickness direction of a substrate with a space interposed therebetween, and a table on which the second substrate is disposed The substrate holding member is disposed such that the back surface of the surface on which the second substrate is disposed in the base portion is opposed to the first substrate with the space interposed therebetween. The structure is adopted.
　本発明は、一方の電子回路基板が他方の電子回路基板の面積または締結位置の影響を受けることなく、２つの電子回路基板の面積をそれぞれ任意の大きさとすることができる。 In the present invention, the area of the two electronic circuit boards can be arbitrarily sized without the influence of the area of one electronic circuit board or the fastening position.
本発明の実施の形態１に係る電力変換装置の構成例を示す分解斜視図The disassembled perspective view which shows the structural example of the power converter device which concerns on Embodiment 1 of this invention. 本発明の実施の形態１に係る平滑コンデンサの一例を示す斜視図The perspective view which shows an example of the smoothing capacitor which concerns on Embodiment 1 of this invention 本発明の実施の形態１に係る電力変換装置の構成例を示す上面図The top view which shows the structural example of the power converter device which concerns on Embodiment 1 of this invention. 本発明の実施の形態２に係る電力変換装置の構成例を示す分解斜視図The disassembled perspective view which shows the structural example of the power converter device which concerns on Embodiment 2 of this invention. 本発明の実施の形態２に係る電力変換装置の構成例を示す上面図The top view which shows the structural example of the power converter device which concerns on Embodiment 2 of this invention.
　以下、本発明の実施の形態について、図面を参照して説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
　（実施の形態１）
　図１は、本発明の実施の形態１に係る電力変換装置１００の構成を示す分解斜視図である。なお、本実施の形態では、電力変換装置１００は、車両に搭載され、車両搭載の蓄電池からの電力をモータ駆動用電力に変換するインバータ装置を例とするが、本発明の電力変換装置は、インバータ装置に限定されない。 (Embodiment 1)
FIG. 1 is an exploded perspective view showing a configuration of power converter 100 according to Embodiment 1 of the present invention. In the present embodiment, power conversion device 100 is mounted on a vehicle, and an inverter device that converts electric power from a storage battery mounted on the vehicle into electric power for driving a motor is taken as an example. It is not limited to an inverter device.
　図１において、電力変換装置１００は、ベース部材１、パワーモジュール２、高圧系基板３、やぐら部材４、および低圧系基板５を有する。図１において、各一点鎖線は、ボスとそれを受けるボス締結部との締結関係を示している。 1, the power conversion apparatus 100 includes a base member 1, a power module 2, a high-voltage board 3, a tower member 4, and a low-voltage board 5. In FIG. 1, each dashed-dotted line has shown the fastening relationship of the boss | hub and the boss | hub fastening part which receives it.
　ベース部材１は、金属製（例えばアルミ製）の板状部材であり、その一面に各デバイスが配置される。例えば、ベース部材１の中央部分には、パワーモジュール２が配置される。パワーモジュール２が配置される位置には、複数のネジ穴１３が設けられている。ネジ穴１３は、パワーモジュール２がベース部材１に配置された際に、パワーモジュール２に設けられたネジ穴２１と重なり、図示しないネジが挿入されてネジ止めされる。 The base member 1 is a metal (for example, aluminum) plate-like member, and each device is disposed on one surface thereof. For example, the power module 2 is disposed in the central portion of the base member 1. A plurality of screw holes 13 are provided at a position where the power module 2 is disposed. When the power module 2 is disposed on the base member 1, the screw hole 13 overlaps with the screw hole 21 provided in the power module 2, and a screw (not shown) is inserted and screwed.
　また、ベース部材１は、パワーモジュール２が配置される位置の周囲に、複数のボスが設けられている。これらのボスは、高圧系基板３またはやぐら部材４との締結に用いられる。例えば、ボス１１は、やぐら部材４に設けられたボス締結部４６と締結される。また、例えば、ボス１２は、高圧系基板３に設けられたボス締結部３１と締結される。 The base member 1 is provided with a plurality of bosses around the position where the power module 2 is disposed. These bosses are used for fastening with the high-pressure substrate 3 or the tower member 4. For example, the boss 11 is fastened with a boss fastening portion 46 provided on the tower member 4. Further, for example, the boss 12 is fastened to a boss fastening portion 31 provided on the high-voltage substrate 3.
　パワーモジュール２は、例えばＩＧＢＴ（Insulated Gate Bipolar Transistor）モジュールであり、ベース部材１に配置される。パワーモジュール２は、ネジ穴２１、ボス２２、入力側接続部２３、および出力側接続部２４を有する。 The power module 2 is an IGBT (Insulated Gate Bipolar Transistor) module, for example, and is disposed on the base member 1. The power module 2 includes a screw hole 21, a boss 22, an input side connection portion 23, and an output side connection portion 24.
　ネジ穴２１は、パワーモジュール２の底面に複数設けられている。ネジ穴２１は、上述したとおり、パワーモジュール２がベース部材１に配置された際に、ベース部材１に設けられたネジ穴１３と重なり、図示しないネジが挿入されてネジ止めされる。 A plurality of screw holes 21 are provided on the bottom surface of the power module 2. As described above, when the power module 2 is disposed on the base member 1, the screw hole 21 overlaps with the screw hole 13 provided in the base member 1, and a screw (not shown) is inserted and screwed.
　ボス２２は、パワーモジュール２の上面に複数設けられている。ボス２２は、高圧系基板３に設けられたボス締結部３２と締結される。 A plurality of bosses 22 are provided on the upper surface of the power module 2. The boss 22 is fastened with a boss fastening portion 32 provided on the high-voltage substrate 3.
　入力側接続部２３は、平滑コンデンサ６（図２参照）と接続する部分であり、パワーモジュール２の上面に３箇所設けられている。 The input side connection portion 23 is a portion connected to the smoothing capacitor 6 (see FIG. 2), and is provided at three locations on the upper surface of the power module 2.
　ここで、平滑コンデンサ６の外観斜視を図２に示す。平滑コンデンサ６は、ベース部材１において、パワーモジュール２に隣接して配置され、固定される。このとき、平滑コンデンサ６の側面６０に設けられた３つのパワーモジュール接続部６１は、それぞれ、３つの入力側接続部２３と接触して接続される。パワーモジュール接続部６１は、図２に示すように、平板状であり、かつ、側面６０の垂直方向に設けられている。側面６０は、パワーモジュール２と向かい合う面である。 Here, an external perspective view of the smoothing capacitor 6 is shown in FIG. The smoothing capacitor 6 is disposed adjacent to the power module 2 in the base member 1 and fixed. At this time, the three power module connection portions 61 provided on the side surface 60 of the smoothing capacitor 6 are connected in contact with the three input side connection portions 23, respectively. As shown in FIG. 2, the power module connecting portion 61 has a flat plate shape and is provided in the vertical direction of the side surface 60. The side surface 60 is a surface facing the power module 2.
　出力側接続部２４は、モータ（図示せず）と接続する部分であり、パワーモジュール２の上面に３箇所設けられている。 The output side connection portion 24 is a portion connected to a motor (not shown), and is provided on the upper surface of the power module 2 at three locations.
　このような構成により、パワーモジュール２は、ベース部材１に固定され、かつ、高圧系基板３が固定される。そして、パワーモジュール２は、例えば電池に接続されたバスバー（図示せず）から供給された直流電流を三相交流電力に変換し、出力側接続部２４を介してモータへ供給する。このとき、パワーモジュール２は、高圧系基板３によってスイッチングのタイミングを制御される。また、平滑コンデンサ６により、電流の平滑化が行われる。 With such a configuration, the power module 2 is fixed to the base member 1 and the high-voltage substrate 3 is fixed. The power module 2 converts, for example, a direct current supplied from a bus bar (not shown) connected to the battery into three-phase alternating current power, and supplies the three-phase alternating current power to the motor via the output side connection unit 24. At this time, the switching timing of the power module 2 is controlled by the high-voltage board 3. The smoothing capacitor 6 smoothes the current.
　高圧系基板３は、低圧系基板５からの制御信号に基づいて、パワーモジュール２のスイッチングのタイミングを制御する電子回路基板である。高圧系基板３は、ボス締結部３１、３２および切り欠き部３３、３４を有する。 The high-voltage board 3 is an electronic circuit board that controls the switching timing of the power module 2 based on a control signal from the low-voltage board 5. The high-voltage substrate 3 has boss fastening portions 31 and 32 and cutout portions 33 and 34.
　ボス締結部３１、３２は、それぞれ、複数設けられている。上述したとおり、ボス締結部３１は、ベース部材１に設けられたボス１２と締結される。また、上述したとおり、ボス締結部３２は、パワーモジュール２に設けられたボス２２と締結される。このような構成により、高圧系基板３は、パワーモジュール２の上面に配置され、固定される。 A plurality of boss fastening portions 31 and 32 are provided. As described above, the boss fastening portion 31 is fastened with the boss 12 provided on the base member 1. Further, as described above, the boss fastening portion 32 is fastened with the boss 22 provided in the power module 2. With such a configuration, the high-voltage substrate 3 is disposed and fixed on the upper surface of the power module 2.
　切り欠き部３３、３４は、それぞれ、高圧系基板３の長辺に沿って３箇所設けられている。切り欠き部３３は、パワーモジュール２の入力側接続部２３の位置に対応して設けられている。また、切り欠き部３４は、パワーモジュール２の出力側接続部２４の位置に対応して設けられている。 The notches 33 and 34 are provided at three locations along the long side of the high-voltage substrate 3, respectively. The cutout portion 33 is provided corresponding to the position of the input side connection portion 23 of the power module 2. Further, the notch 34 is provided corresponding to the position of the output side connection 24 of the power module 2.
　やぐら部材４は、低圧系基板５を、高圧系基板３との間に空間を設けつつ、厚み方向に積層配置するための部材（基板保持部材の一例）である。やぐら部材４は、台部４０、脚部４１、切り欠き部４２、開口部４３、ボス４４、クランプ部４５、およびボス締結部４６を有する。 The tower member 4 is a member (an example of a substrate holding member) for stacking and arranging the low-pressure substrate 5 in the thickness direction while providing a space between the low-pressure substrate 5 and the high-pressure substrate 3. The tower member 4 includes a base portion 40, a leg portion 41, a notch portion 42, an opening portion 43, a boss 44, a clamp portion 45, and a boss fastening portion 46.
　台部４０は、低圧系基板５が配置される部分であり、脚部４１によって支持される。台部４０において低圧系基板５が配置される面（以下、「基板配置面」という）の裏面は、空間を挟んで、高圧系基板３と対向する。この台部４０は、例えば、パワーモジュール２から発生する放射ノイズを遮蔽可能な樹脂で構成される。これにより、パワーモジュール２から発生する放射ノイズを遮蔽することができ、低圧系基板５への影響を防ぐことができる。 The base 40 is a part on which the low-pressure substrate 5 is disposed, and is supported by the leg 41. The back surface of the base portion 40 on which the low-voltage substrate 5 is disposed (hereinafter referred to as “substrate placement surface”) faces the high-voltage substrate 3 with a space in between. This base part 40 is comprised with resin which can shield the radiation noise generated from the power module 2, for example. Thereby, the radiation noise generated from the power module 2 can be shielded, and the influence on the low-voltage substrate 5 can be prevented.
　脚部４１は、台部４０の長辺に沿って、かつ、基板配置面の裏面の垂直方向に沿って複数設けられている。そして、脚部４１は、一端が台部４０と接続され、もう一端がベース部材１と締結される。なお、脚部４１とベース部材１との締結は、後述するボス締結部４６により実現する。 A plurality of leg portions 41 are provided along the long side of the base portion 40 and along the vertical direction of the back surface of the substrate arrangement surface. One end of the leg portion 41 is connected to the base portion 40, and the other end is fastened to the base member 1. In addition, the fastening of the leg part 41 and the base member 1 is implement | achieved by the boss | hub fastening part 46 mentioned later.
　切り欠き部４２は、台部４０の長辺に沿って３箇所設けられている。切り欠き部４２は、パワーモジュール２の入力側接続部２３および高圧系基板３の切り欠き部３３の位置に対応して設けられている。このような構成により、入力側接続部２３は、外部へ露出する。この例を図３に示す。図３は、低圧系基板５を配置していないときのやぐら部材４の上面図である。図３に示すように、切り欠き部４２から入力側接続部２３が露出している。よって、入力側接続部２３は、図２で説明した平滑コンデンサ６のパワーモジュール接続部６１と接続することができる。 The notch 42 is provided at three locations along the long side of the base 40. The cutout portion 42 is provided corresponding to the positions of the input side connection portion 23 of the power module 2 and the cutout portion 33 of the high voltage system substrate 3. With such a configuration, the input side connecting portion 23 is exposed to the outside. An example of this is shown in FIG. FIG. 3 is a top view of the tower member 4 when the low-pressure substrate 5 is not disposed. As shown in FIG. 3, the input side connection portion 23 is exposed from the notch portion 42. Therefore, the input side connection part 23 can be connected to the power module connection part 61 of the smoothing capacitor 6 described in FIG.
　開口部４３は、台部４０の長辺付近に沿って３箇所設けられている。開口部４３は、パワーモジュール２の出力側接続部２４および高圧系基板３の切り欠き部３４の位置に対応して設けられている。このような構成により、出力側接続部２４は、外部へ露出する。この例を図３に示す。図３に示すように、開口部４３から出力側接続部２４が露出している。よって、出力側接続部２４は、図示しないモータと、例えばハーネスまたはバスバー等を介してネジ締結等により接続することができる。なお、開口部４３は、切り欠き部であってもよい。 The opening 43 is provided at three locations along the vicinity of the long side of the base 40. The opening 43 is provided corresponding to the position of the output side connection portion 24 of the power module 2 and the cutout portion 34 of the high voltage system substrate 3. With such a configuration, the output side connecting portion 24 is exposed to the outside. An example of this is shown in FIG. As shown in FIG. 3, the output side connection portion 24 is exposed from the opening 43. Therefore, the output side connecting portion 24 can be connected to a motor (not shown) by screw fastening or the like via, for example, a harness or a bus bar. The opening 43 may be a notch.
　ボス４４は、台部４０の中央付近に複数設けられている。ボス４４は、低圧系基板５に設けられたボス締結部５１と締結される。 A plurality of bosses 44 are provided near the center of the base 40. The boss 44 is fastened with a boss fastening portion 51 provided on the low-pressure substrate 5.
　クランプ部４５は、例えば、ハーネスを保持する。これにより、ハーネスが嵩張らないので、各部品同士を最小の距離でレイアウトを可能にし、電力変換装置のサイズの最小化を実現できる。また、クランプ部４５がないと、別の樹脂部品やそれを締結するネジが増え、さらに筐体のベース部にボスを立てる、または、タップを切る必要があるなどコストも上がるが、クランプ部４５により部品の数を削減できる。さらに、クランプ部４５がないと、最小距離でレイアウトしているために組み立てし難いが、クランプ部４５により組み立て性を向上できる。なお、クランプ部４５の配置位置および配置数は、図１に示すものに限定されない。 The clamp part 45 holds a harness, for example. Thereby, since the harness is not bulky, the components can be laid out with a minimum distance, and the size of the power conversion device can be minimized. Further, if the clamp portion 45 is not provided, another resin component and a screw for fastening the same increase, and further, the cost increases because it is necessary to stand a boss on the base portion of the housing or to cut a tap. This can reduce the number of parts. Furthermore, if there is no clamp part 45, it is difficult to assemble because it is laid out at the minimum distance, but the assemblability can be improved by the clamp part 45. Note that the arrangement position and the number of arrangement of the clamp portions 45 are not limited to those shown in FIG.
　ボス締結部４６は、脚部４１に複数設けられている。上述したとおり、ボス締結部４６は、ベース部材１に設けられたボス１１と締結される。このような構成により、やぐら部材４は、ベース部材１に配置され、固定される。なお、脚部４１において、ボス締結部４６が設けられている部分の上には、平滑コンデンサ６が配置される。 A plurality of boss fastening portions 46 are provided on the leg portion 41. As described above, the boss fastening portion 46 is fastened with the boss 11 provided on the base member 1. With such a configuration, the tower member 4 is disposed and fixed to the base member 1. Note that the smoothing capacitor 6 is disposed on the portion of the leg portion 41 where the boss fastening portion 46 is provided.
　低圧系基板５は、車両の情報に基づいて高圧系基板３を制御する電子回路基板である。低圧系基板５は、ボス締結部５１を有する。 The low-voltage board 5 is an electronic circuit board that controls the high-voltage board 3 based on vehicle information. The low-pressure substrate 5 has a boss fastening part 51.
　ボス締結部５１は、低圧系基板５に複数設けられている。上述したとおり、ボス締結部５１は、台部４０に設けられたボス４４と締結される。このような構成により、低圧系基板５は、やぐら部材４の台部４０の上面に配置され、固定される。 A plurality of boss fastening portions 51 are provided on the low-pressure substrate 5. As described above, the boss fastening portion 51 is fastened with the boss 44 provided on the base portion 40. With such a configuration, the low-pressure substrate 5 is disposed and fixed on the upper surface of the base portion 40 of the tower member 4.
　以上説明したように、本実施の形態の電力変換装置１００は、低圧系基板５と高圧系基板３の間に空間を設け、かつ、それらを厚み方向に積層配置するにあたり、低圧系基板５を配置可能な台部４０を備えたやぐら部材４を用いることを特徴とする。すなわち、低圧系基板５は、台部４０に配置されることで、高圧系基板３との間に所定距離の空間を挟んで積層配置されるため、ステー等を用いる必要がない。また、低圧系基板５を締結するためのボス４４は、台部４０に設けられるため、ボスを通すための穴を高圧系基板３に設ける必要がない。したがって、本実施の形態の電力変換装置１００は、一方の電子回路基板が他方の電子回路基板の面積または締結位置の影響を受けることなく、２つの電子回路基板の面積をそれぞれ任意の大きさとすることができる。 As described above, the power conversion device 100 according to the present embodiment provides a space between the low-voltage substrate 5 and the high-voltage substrate 3 and stacks them in the thickness direction. The tower member 4 provided with the mountable base 40 is used. That is, since the low-voltage substrate 5 is disposed on the base 40 and is laminated with a space of a predetermined distance between the low-voltage substrate 5 and the high-voltage substrate 3, there is no need to use a stay or the like. Further, since the boss 44 for fastening the low-pressure substrate 5 is provided on the base portion 40, it is not necessary to provide a hole for passing the boss in the high-pressure substrate 3. Therefore, in the power conversion device 100 of the present embodiment, one electronic circuit board is not affected by the area of the other electronic circuit board or the fastening position, and the areas of the two electronic circuit boards are set to arbitrary sizes, respectively. be able to.
　また、本実施の形態の電力変換装置１００は、高圧系基板３およびやぐら部材４のそれぞれにおいて、パワーモジュール２の入力側接続部２３に対応する位置に、切り欠き部３３、４２を設けたことを特徴とする。これにより、側面６０に突起状のパワーモジュール接続部６１を備えるタイプの平滑コンデンサ６において、そのパワーモジュール接続部６１の長さを短くし、平滑コンデンサ６をパワーモジュール２に近接して接続することができる。したがって、電力変換装置１００（ベース部材１）の面積を小さくすることができ、省スペース化を実現できる。 Further, in the power conversion device 100 of the present embodiment, the notch portions 33 and 42 are provided at positions corresponding to the input side connection portion 23 of the power module 2 in each of the high voltage system board 3 and the tower member 4. It is characterized by. Thereby, in the smoothing capacitor 6 of the type provided with the protruding power module connection portion 61 on the side surface 60, the length of the power module connection portion 61 is shortened and the smoothing capacitor 6 is connected close to the power module 2. Can do. Therefore, the area of the power conversion device 100 (base member 1) can be reduced, and space saving can be realized.
　以上、本発明の実施の形態１について説明したが、上記説明は一例であり、種々の変形が可能である。 As mentioned above, although Embodiment 1 of this invention was demonstrated, the said description is an example and various deformation | transformation are possible.
　例えば、やぐら部材４において、基板配置面またはその裏面に、パワーモジュール２から発生する放射ノイズを遮蔽可能なシールド部材（例えば、鉄製またはアルミ製のプレート）を備えるようにしてもよい。これにより、パワーモジュール２から発生する放射ノイズを遮蔽することができ、低圧系基板５への影響を防ぐことができる。 For example, the tower member 4 may be provided with a shield member (for example, an iron or aluminum plate) capable of shielding radiation noise generated from the power module 2 on the substrate arrangement surface or the back surface thereof. Thereby, the radiation noise generated from the power module 2 can be shielded, and the influence on the low-voltage substrate 5 can be prevented.
　また、例えば、本実施の形態では、低圧系基板５は、高圧系基板３よりも面積が小さい例としたが、高圧系基板３よりも面積が大きくてもよい。 For example, in the present embodiment, the low-voltage substrate 5 has an area smaller than that of the high-voltage substrate 3, but the area may be larger than that of the high-voltage substrate 3.
　（実施の形態２）
　＜実施の形態２に係る背景および課題＞
　例えば特開２００４－２１５３４０号公報において、電源電力をパワーモジュールへ供給するためのバスバーを、平滑コンデンサの上側に引き回す構成の電力変換装置（以下、従来の電力変換装置という）が知られている。 (Embodiment 2)
<Background and Problems According to Embodiment 2>
For example, Japanese Patent Application Laid-Open No. 2004-215340 discloses a power converter (hereinafter referred to as a conventional power converter) having a configuration in which a bus bar for supplying power to a power module is routed above a smoothing capacitor.
　しかしながら、従来の電力変換装置では、平滑コンデンサの上側にバスバーを引き回すことで、ユーザが筐体のカバーを開けたときに、剥き出しになっているバスバーを直接触れることができてしまい、危険である、という課題がある。 However, in the conventional power conversion device, by pulling the bus bar above the smoothing capacitor, when the user opens the cover of the housing, the exposed bus bar can be directly touched, which is dangerous. There is a problem.
　また、従来の電力変換装置では、平滑コンデンサの上側にバスバーを引き回すことで、バスバーの重心が高くなり、耐震性が悪くなる、という課題がある。 Also, in the conventional power converter, there is a problem that the center of gravity of the bus bar is increased and the earthquake resistance is deteriorated by drawing the bus bar above the smoothing capacitor.
　そこで、本実施の形態の電力変換装置では、電源電力をパワーモジュールへ供給するためのバスバーの引き回しについて、安全性を確保でき、かつ、耐震性を向上できるようにする。 Therefore, in the power conversion device of the present embodiment, it is possible to secure safety and improve earthquake resistance with respect to the routing of the bus bar for supplying power to the power module.
　＜実施の形態２の説明＞
　図４は、本発明の実施の形態２に係る電力変換装置１００の構成例を、別角度からそれぞれ示す分解斜視図である。また、図５は、本発明の実施の形態２に係る電力変換装置１００の構成例を示す上面図である。図４、図５において、図１～図３で説明した構成要素と同一の部分には同一符号を付すものとする。なお、本実施の形態では、電力変換装置１００は、車両に搭載され、車両搭載の電池からの電力をモータ駆動用電力に変換するインバータ装置を例とするが、本発明の電力変換装置はインバータ装置に限定されない。 <Description of Embodiment 2>
FIG. 4 is an exploded perspective view illustrating a configuration example of the power conversion apparatus 100 according to Embodiment 2 of the present invention from different angles. FIG. 5 is a top view showing a configuration example of the power conversion apparatus 100 according to Embodiment 2 of the present invention. 4 and 5, the same reference numerals are given to the same parts as those described in FIGS. 1 to 3. In the present embodiment, power conversion device 100 is mounted on a vehicle, and an inverter device that converts electric power from a battery mounted on the vehicle into electric power for driving a motor is taken as an example. However, the power conversion device of the present invention is an inverter. It is not limited to a device.
　図４において、電力変換装置１００は、ベース部材１、パワーモジュール２、バスバー７、８、５０、５２、および平滑コンデンサ６を有する。なお、図４において、パワーモジュール２を制御する電子回路基板（以下、「高圧系基板」という）、高圧系基板を制御する電子回路基板（以下、「低圧系基板」という）、および、ベース部材１に配置されたデバイス全体をまとめて被覆する筐体カバーは、図示を省略している。 4, the power conversion device 100 includes a base member 1, a power module 2, bus bars 7, 8, 50, 52, and a smoothing capacitor 6. In FIG. 4, an electronic circuit board (hereinafter referred to as “high-voltage board”) for controlling the power module 2, an electronic circuit board (hereinafter referred to as “low-voltage board”) for controlling the high-voltage board, and a base member A housing cover that collectively covers the entire device arranged in 1 is not shown.
　ベース部材１は、金属製（例えばアルミ製）の板状部材であり、その一面に各デバイスが配置される。例えば、ベース部材１の中央部分には、パワーモジュール２が固定されて配置される。また、ベース部材１は、パワーモジュール２が配置される部分に隣接して、台座部９が形成されている。台座部９は、平滑コンデンサ６をベース部材１から一定の高さに配置するための部分である。よって、台座部９に平滑コンデンサ６が配置されると、ベース部材１と平滑コンデンサ６の底面との間に空間（以下、「コンデンサ下空間」という）が形成される。この空間にバスバー７、８が配置される。 The base member 1 is a metal (for example, aluminum) plate-like member, and each device is disposed on one surface thereof. For example, the power module 2 is fixedly disposed in the central portion of the base member 1. Further, the base member 1 is formed with a pedestal portion 9 adjacent to a portion where the power module 2 is disposed. The pedestal portion 9 is a portion for arranging the smoothing capacitor 6 at a certain height from the base member 1. Therefore, when the smoothing capacitor 6 is disposed on the base portion 9, a space (hereinafter referred to as “capacitor lower space”) is formed between the base member 1 and the bottom surface of the smoothing capacitor 6. Bus bars 7 and 8 are arranged in this space.
　パワーモジュール２は、例えばＩＧＢＴ（Insulated Gate Bipolar Transistor）モジュールであり、ベース部材１の中央付近に固定して配置される。パワーモジュール２は、入力側接続部２３および出力側接続部２４を有する。本実施の形態では、図４、図５に示すように、入力側接続部２３および出力側接続部２４は、それぞれ、パワーモジュール２の上面に３箇所ずつ設けられている。 The power module 2 is, for example, an IGBT (Insulated Gate Bipolar Transistor) module, and is fixedly disposed near the center of the base member 1. The power module 2 has an input side connection part 23 and an output side connection part 24. In the present embodiment, as shown in FIGS. 4 and 5, the input side connection portion 23 and the output side connection portion 24 are provided at three locations on the upper surface of the power module 2.
　入力側接続部２３は、バスバー７、８および平滑コンデンサ６と電気的に接続する部分であり、Ｐ極用接続部１４とＮ極用接続部１５に分かれている。Ｎ極用接続部１５は、バスバー８の接続部２７と接続される。一方、Ｐ極用接続部１４は、バスバー７の接続部１７と接続される。なお、Ｐ極用接続部が２２、Ｎ極用接続部が２１であってもよい。 The input-side connection portion 23 is a portion that is electrically connected to the bus bars 7 and 8 and the smoothing capacitor 6 and is divided into a P-pole connection portion 14 and an N-pole connection portion 15. The N pole connecting portion 15 is connected to the connecting portion 27 of the bus bar 8. On the other hand, the P-pole connecting portion 14 is connected to the connecting portion 17 of the bus bar 7. The P-pole connection part may be 22 and the N-pole connection part may be 21.
　出力側接続部２４は、車両のホイール等を駆動させるモータ（図示せず）と電気的に接続する部分である。 The output side connecting portion 24 is a portion that is electrically connected to a motor (not shown) that drives a vehicle wheel or the like.
　このようなパワーモジュール２は、バスバー５０、５２およびバスバー７、８を介して供給された直流電流を三相交流電力に変換し、モータ等へ供給する。このとき、パワーモジュール２は、高圧系基板によってスイッチングのタイミングを制御される。また、平滑コンデンサ６により、電流の平滑化が行われる。 Such a power module 2 converts the direct current supplied via the bus bars 50 and 52 and the bus bars 7 and 8 into three-phase alternating current power and supplies it to a motor or the like. At this time, the switching timing of the power module 2 is controlled by the high-voltage board. The smoothing capacitor 6 smoothes the current.
　バスバー７は、バスバー５２からの電流をパワーモジュール２へ供給するための金属製（例えば銅製）の板状部材である。バスバー７は、コンデンサ下空間において、最も下に固定して配置される。また、バスバー７は、その長手方向に沿って、接続部１７、１８がそれぞれ形成されている。図４の例では、接続部１７および３２は、それぞれ、クランク形状をしており、３つずつ形成されている。接続部１７は、パワーモジュール２の入力側接続部２３のＰ極用接続部１４と接続される。一方、接続部１８は、バスバー５２と接続される。なお、接続部１８は、複数有るうちの少なくとも１つが、バスバー５２と直接または間接的に接続されればよい。例えば、図５に示すように、真ん中の接続部１８が、バスバー７２を介してバスバー５２と接続される。 The bus bar 7 is a metal (for example, copper) plate-like member for supplying the current from the bus bar 52 to the power module 2. The bus bar 7 is fixedly disposed at the bottom in the space below the capacitor. The bus bar 7 has connection portions 17 and 18 formed along the longitudinal direction thereof. In the example of FIG. 4, each of the connection portions 17 and 32 has a crank shape and is formed in three. The connecting portion 17 is connected to the P-pole connecting portion 14 of the input side connecting portion 23 of the power module 2. On the other hand, the connecting portion 18 is connected to the bus bar 52. It should be noted that at least one of the plurality of connecting portions 18 may be directly or indirectly connected to the bus bar 52. For example, as shown in FIG. 5, the middle connecting portion 18 is connected to the bus bar 52 via the bus bar 72.
　バスバー８は、バスバー５０からの電流をパワーモジュール２へ供給するための金属製（例えば銅製）の板状部材である。バスバー８は、コンデンサ下空間において、バスバー７の上側に固定して配置される。このときバスバー８は、バスバー７から所定の絶縁距離を保って配置される。これにより、コモンモードノイズを除去できる効果がある。なお、絶縁距離の代わりに、バスバー８とバスバー７との間に絶縁物を挟む構成としてもよい。また、バスバー８は、その長手方向に沿って、接続部２７、２８がそれぞれ形成されている。図４の例では、接続部２７および２８は、それぞれ、３つずつ形成されている。また、図４の例では、接続部２７は、クランク形状である。接続部２７は、パワーモジュール２の入力側接続部２３のＮ極用接続部１５と接続される。一方、接続部２８は、バスバー５０と接続される。なお、接続部２８は、複数有るうちの少なくとも１つが、バスバー５０と直接または間接的に接続されればよい。例えば、図５に示すように、端の接続部２８が、バスバー７１を介してバスバー５０と接続される。なお、図４に示すように、バスバー７とバスバー８は、上下方向に重ねて構成される。すなわち、バスバー７とバスバー８は、平行に配置されており、これにより、ノイズの除去に対して、より効果的である。 The bus bar 8 is a metal (for example, copper) plate-like member for supplying current from the bus bar 50 to the power module 2. The bus bar 8 is fixedly disposed on the upper side of the bus bar 7 in the space below the capacitor. At this time, the bus bar 8 is arranged with a predetermined insulation distance from the bus bar 7. This has an effect of removing common mode noise. Instead of the insulation distance, an insulator may be sandwiched between the bus bar 8 and the bus bar 7. Further, the bus bar 8 is formed with connecting portions 27 and 28 along the longitudinal direction thereof. In the example of FIG. 4, three connection portions 27 and 28 are formed. Moreover, in the example of FIG. 4, the connection part 27 is crank shape. The connecting portion 27 is connected to the N pole connecting portion 15 of the input side connecting portion 23 of the power module 2. On the other hand, the connection unit 28 is connected to the bus bar 50. It should be noted that at least one of the plurality of connection portions 28 may be directly or indirectly connected to the bus bar 50. For example, as shown in FIG. 5, the end connection portion 28 is connected to the bus bar 50 via the bus bar 71. In addition, as shown in FIG. 4, the bus bar 7 and the bus bar 8 are configured to overlap in the vertical direction. That is, the bus bar 7 and the bus bar 8 are arranged in parallel, which is more effective for noise removal.
　バスバー５０、５２は、例えば車両搭載の電池（図示せず）と電気的に接続され、その電池からの電流をバスバー７、８へ供給するための金属製（例えば銅製）の板状部材である。図４に示すように、バスバー５０、５２は、並列に、かつ、ベース部材１のデバイス配置面に対して垂直（水平などでもよい）に支持されて、固定して設けられている。バスバー５０はＮ極用であり、バスバー５２はＰ極用である。よって、バスバー５０と接続されるバスバー８はＮ極用であり、バスバー５２と接続されるバスバー７はＰ極用である。 The bus bars 50 and 52 are metal (for example, copper) plate-like members that are electrically connected to, for example, a vehicle-mounted battery (not shown) and supply current from the battery to the bus bars 7 and 8. . As shown in FIG. 4, the bus bars 50 and 52 are fixedly provided in parallel and supported vertically (or horizontally) with respect to the device arrangement surface of the base member 1. The bus bar 50 is for the N pole, and the bus bar 52 is for the P pole. Therefore, the bus bar 8 connected to the bus bar 50 is for the N pole, and the bus bar 7 connected to the bus bar 52 is for the P pole.
　平滑コンデンサ６は、台座部９に固定して配置される。すなわち、平滑コンデンサ６は、コンデンサ下空間に配置されたバスバー８の上側に固定して配置される。平滑コンデンサ６は、パワーモジュール２と向き合う側面６０に、パワーモジュール接続部６１を備える。パワーモジュール接続部６１は、接続部１７および接続部２７を介してパワーモジュール２の入力側接続部２３（Ｐ極用接続部１４およびＮ極用接続部１５）と接続する部分であり、Ｐ極用の接続部分とＮ極用の接続部分に分かれている。図４の例では、パワーモジュール接続部６１は、３つ形成されている。パワーモジュール接続部６１は、図４に示すように、平板状であり、かつ、側面６０の垂直方向に設けられている。なお、パワーモジュール接続部６１と、接続部１７および接続部２７と、入力側接続部２３とが、接触していればよいため、重ねる順番は任意の順番でよい。 The smoothing capacitor 6 is fixed to the pedestal portion 9 and arranged. That is, the smoothing capacitor 6 is fixedly disposed on the upper side of the bus bar 8 disposed in the capacitor lower space. The smoothing capacitor 6 includes a power module connecting portion 61 on the side surface 60 facing the power module 2. The power module connecting portion 61 is a portion connected to the input side connecting portion 23 (P pole connecting portion 14 and N pole connecting portion 15) of the power module 2 through the connecting portion 17 and the connecting portion 27, and is connected to the P pole. It is divided into the connection part for N and the connection part for N poles. In the example of FIG. 4, three power module connection portions 61 are formed. As shown in FIG. 4, the power module connecting portion 61 has a flat plate shape and is provided in the vertical direction of the side surface 60. In addition, since the power module connection part 61, the connection part 17, the connection part 27, and the input side connection part 23 should just be in contact, the order to overlap may be arbitrary orders.
　以上説明したように、本実施の形態の電力変換装置１００は、平滑コンデンサ６とベース部材１との間に２つのバスバー７、８を引き回して、パワーモジュール２に接続することを特徴とする。これにより、ユーザが筐体カバーを開けたとき、バスバー７、８の上には平滑コンデンサ６があるため、ユーザがバスバー７、８に触れることはできない。よって、安全性を確保できる。また、バスバー７、８は、平滑コンデンサ６の下側にあるため、平滑コンデンサ６の上側にある場合に比べ、重心が低くなる。よって、耐震性を向上できる。したがって、本実施の形態の電力変換装置１００は、電源電力をパワーモジュールへ供給するためのバスバーの引き回しについて、安全性を確保でき、かつ、耐震性を向上できる。 As described above, the power conversion device 100 of the present embodiment is characterized in that the two bus bars 7 and 8 are routed between the smoothing capacitor 6 and the base member 1 and connected to the power module 2. Thereby, when the user opens the housing cover, the smoothing capacitor 6 is on the bus bars 7 and 8, so that the user cannot touch the bus bars 7 and 8. Therefore, safety can be ensured. Further, since the bus bars 7 and 8 are on the lower side of the smoothing capacitor 6, the center of gravity is lower than that on the upper side of the smoothing capacitor 6. Therefore, earthquake resistance can be improved. Therefore, the power conversion device 100 according to the present embodiment can ensure safety and improve the earthquake resistance with respect to the routing of the bus bar for supplying power to the power module.
　以上、本発明の実施の形態２について説明したが、上記説明は一例であり、種々の変形が可能である。 The second embodiment of the present invention has been described above, but the above description is an example, and various modifications are possible.
　＜発明の一態様の概要＞
　続いて、本発明に係る一態様の概要を記載する。 <Outline of One Embodiment of Invention>
Then, the outline | summary of the one aspect | mode which concerns on this invention is described.
　態様１は、第１基板と第２基板が空間を挟んで基板の厚み方向に積層して配置される電力変換装置であって、前記第２基板を配置する台部を備えた基板保持部材を有し、前記基板保持部材は、前記台部における前記第２基板が配置される面の裏面が、前記空間を挟んで前記第１基板と対向するように配置される、電力変換装置。 Aspect 1 is a power conversion device in which a first substrate and a second substrate are stacked in the thickness direction of a substrate with a space interposed therebetween, and a substrate holding member provided with a base portion on which the second substrate is disposed And the substrate holding member is disposed such that a back surface of a surface of the base portion on which the second substrate is disposed is disposed so as to face the first substrate with the space interposed therebetween.
　態様２は、前記台部は、パワーモジュールが備えるコンデンサ接続部に対応する位置に、前記コンデンサ接続部を外部へ露出させる切り欠き部を有する、態様１記載の電力変換装置。 Aspect 2 is the power conversion device according to Aspect 1, wherein the base has a notch that exposes the capacitor connection to the outside at a position corresponding to the capacitor connection included in the power module.
　態様３は、前記台部は、パワーモジュールから発生する放射ノイズを遮蔽可能な樹脂で構成される、態様１記載の電力変換装置。 Aspect 3 is the power conversion device according to Aspect 1, wherein the base is made of a resin capable of shielding radiation noise generated from the power module.
　態様４は、前記台部は、前記第２基板が配置される面またはその裏面に、パワーモジュールから発生する放射ノイズを遮蔽可能なシールド部材を有する、態様１記載の電力変換装置。 Aspect 4 is the power conversion device according to Aspect 1, wherein the base portion has a shield member capable of shielding radiation noise generated from the power module on the surface on which the second substrate is disposed or on the back surface thereof.
　態様５は、前記基板保持部材は、ハーネスを保持するクランプ部を有する、態様１記載の電力変換装置。 Aspect 5 is the power conversion device according to Aspect 1, wherein the substrate holding member has a clamp portion for holding a harness.
　態様６は、パワーモジュールが配置されるベース部材を有し、前記パワーモジュールに隣接して配置される平滑コンデンサと前記ベース部材との間に、前記電源電力を前記パワーモジュールへ供給するバスバーを配置した、態様１記載の電力変換装置。 Aspect 6 includes a base member on which the power module is disposed, and a bus bar for supplying the power to the power module is disposed between the smoothing capacitor disposed adjacent to the power module and the base member. The power conversion device according to aspect 1.
　態様７は、前記バスバーは、Ｐ極用バスバーとＮ極用バスバーであり、前記Ｐ極用バスバーと前記Ｎ極用バスバーとは、平行に配置されている、態様６記載の電力変換装置。 Aspect 7 is the power conversion device according to aspect 6, wherein the bus bars are a P-pole bus bar and an N-pole bus bar, and the P-pole bus bar and the N-pole bus bar are arranged in parallel.
　態様８は、前記Ｐ極用バスバーと前記Ｎ極用バスバーは、所定の絶縁距離を保って配置される、態様７記載の電力変換装置。 Aspect 8 is the power conversion device according to Aspect 7, wherein the P-pole bus bar and the N-pole bus bar are arranged with a predetermined insulation distance.
　態様９は、前記Ｐ極用バスバーと前記Ｎ極用バスバーとの間に絶縁物が配置される、態様６記載の電力変換装置。 Aspect 9 is the power conversion device according to Aspect 6, wherein an insulator is disposed between the P-pole bus bar and the N-pole bus bar.
　態様１０は、前記ベース部材は、前記平滑コンデンサを前記ベース部材から所定の高さで配置するための台座部を、前記パワーモジュールに隣接して備え、前記台座部に配置された前記平滑コンデンサの底面と前記ベース部材との間の空間に、前記Ｐ極用バスバーおよび前記Ｎ極用バスバーが配置される、態様７記載の電力変換装置。 In the aspect 10, the base member includes a pedestal portion for arranging the smoothing capacitor at a predetermined height from the base member, adjacent to the power module, and the smoothing capacitor disposed on the pedestal portion is provided. The power conversion device according to aspect 7, wherein the P-pole bus bar and the N-pole bus bar are arranged in a space between a bottom surface and the base member.
　２０１３年４月２４日出願の特願２０１３－０９１０７１および２０１３年４月２５日出願の特願２０１３－０９２１８６の日本出願に含まれる明細書、図面および要約書の開示内容は、すべて本願に援用される。 The disclosures of the specification, drawings and abstract contained in Japanese Patent Application No. 2013-0091071 filed on Apr. 24, 2013 and Japanese Patent Application No. 2013-092186 filed on Apr. 25, 2013 are all incorporated herein by reference. The
　本発明は、例えば、複数の電子回路基板を備えた電力変換装置に適用することができる。 The present invention can be applied to, for example, a power conversion device including a plurality of electronic circuit boards.
　１　ベース部材
　２　パワーモジュール
　３　高圧系基板
　４　やぐら部材
　５　低圧系基板
　６　平滑コンデンサ
　７、８、５０、５２、７１、７２　バスバー
　９　台座部
　１１、１２、２２、４４　ボス
　１３、２１　ネジ穴
　１４　Ｐ極用接続部
　１５　Ｎ極用接続部
　１７、１８、２７、２８　接続部
　２３　入力側接続部
　２４　出力側接続部
　３１、３２、４６、５１　ボス締結部
　３３、３４、４２　切り欠き部
　４０　台部
　４１　脚部
　４３　開口部
　４５　クランプ部
　６０　側面
　６１　パワーモジュール接続部
　１００　電力変換装置 DESCRIPTION OF SYMBOLS 1 Base member 2 Power module 3 High voltage system board 4 Toggle member 5 Low voltage system board 6 Smoothing capacitor 7, 8, 50, 52, 71, 72 Bus bar 9 Base part 11, 12, 22, 44 Boss 13, 21 Screw hole 14P Pole connection part 15 N pole connection part 17, 18, 27, 28 connection part 23 Input side connection part 24 Output side connection part 31, 32, 46, 51 Boss fastening part 33, 34, 42 Notch part 40 Base part 41 Leg part 43 Opening part 45 Clamp part 60 Side 61 Power module connection part 100 Power converter

Claims (10)

  1. 　第１基板と第２基板が空間を挟んで基板の厚み方向に積層して配置される電力変換装置であって、
    　前記第２基板を配置する台部を備えた基板保持部材を有し、
    　前記基板保持部材は、
    　前記台部における前記第２基板が配置される面の裏面が、前記空間を挟んで前記第１基板と対向するように配置される、
    　電力変換装置。     A power conversion device in which a first substrate and a second substrate are stacked in the thickness direction of a substrate across a space,
    A substrate holding member having a base portion on which the second substrate is disposed;
    The substrate holding member is
    The back surface of the surface on which the second substrate is disposed in the pedestal is disposed so as to face the first substrate across the space.
    Power conversion device.
  2. 　前記台部は、
    　パワーモジュールが備えるコンデンサ接続部に対応する位置に、前記コンデンサ接続部を外部へ露出させる切り欠き部を有する、
    　請求項１記載の電力変換装置。     The platform is
    In a position corresponding to the capacitor connecting portion provided in the power module, it has a notch for exposing the capacitor connecting portion to the outside.
    The power conversion device according to claim 1.
  3. 　前記台部は、
    　パワーモジュールから発生する放射ノイズを遮蔽可能な樹脂で構成される、
    　請求項１記載の電力変換装置。     The platform is
    Consists of resin capable of shielding radiation noise generated from power modules,
    The power conversion device according to claim 1.
  4. 　前記台部は、
    　前記第２基板が配置される面またはその裏面に、パワーモジュールから発生する放射ノイズを遮蔽可能なシールド部材を有する、
    　請求項１記載の電力変換装置。     The platform is
    A shield member capable of shielding radiation noise generated from the power module on the surface on which the second substrate is disposed or on the back surface thereof;
    The power conversion device according to claim 1.
  5. 　前記基板保持部材は、
    　ハーネスを保持するクランプ部を有する、
    　請求項１記載の電力変換装置。     The substrate holding member is
    Having a clamp to hold the harness,
    The power conversion device according to claim 1.
  6. 　パワーモジュールが配置されるベース部材を有し、
    　前記パワーモジュールに隣接して配置される平滑コンデンサと前記ベース部材との間に、前記電源電力を前記パワーモジュールへ供給するバスバーを配置した、
    　請求項１記載の電力変換装置。     A base member on which the power module is disposed;
    Between the smoothing capacitor disposed adjacent to the power module and the base member, a bus bar for supplying the power to the power module is disposed.
    The power conversion device according to claim 1.
  7. 　前記バスバーは、Ｐ極用バスバーとＮ極用バスバーであり、
    　前記Ｐ極用バスバーと前記Ｎ極用バスバーとは、平行に配置されている、
    　請求項６記載の電力変換装置。     The bus bars are a P pole bus bar and an N pole bus bar,
    The P pole bus bar and the N pole bus bar are arranged in parallel.
    The power conversion device according to claim 6.
  8. 　前記Ｐ極用バスバーと前記Ｎ極用バスバーは、所定の絶縁距離を保って配置される、
    　請求項６記載の電力変換装置。     The P-pole bus bar and the N-pole bus bar are arranged with a predetermined insulation distance.
    The power conversion device according to claim 6.
  9. 　前記Ｐ極用バスバーと前記Ｎ極用バスバーとの間に絶縁物が配置される、
    　請求項６記載の電力変換装置。     An insulator is disposed between the P pole bus bar and the N pole bus bar.
    The power conversion device according to claim 6.
  10. 　前記ベース部材は、前記平滑コンデンサを前記ベース部材から所定の高さで配置するための台座部を、前記パワーモジュールに隣接して備え、
    　前記台座部に配置された前記平滑コンデンサの底面と前記ベース部材との間の空間に、前記Ｐ極用バスバーおよび前記Ｎ極用バスバーが配置される、
    　請求項７記載の電力変換装置。     The base member includes a pedestal for placing the smoothing capacitor at a predetermined height from the base member, adjacent to the power module,
    The P-pole bus bar and the N-pole bus bar are arranged in a space between the bottom surface of the smoothing capacitor arranged on the pedestal portion and the base member.
    The power conversion device according to claim 7.
PCT/JP2014/001850 2013-04-24 2014-03-28 Power conversion device WO2014174767A1 (en)

Applications Claiming Priority (4)

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JP2013091071A JP2014217128A (en) 2013-04-24 2013-04-24 Power converter
JP2013-091071 2013-04-24
JP2013092186A JP2014217152A (en) 2013-04-25 2013-04-25 Power converter
JP2013-092186 2013-04-25

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