WO2014171564A1 - Film layer component element and method for manufacturing same - Google Patents

Film layer component element and method for manufacturing same Download PDF

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Publication number
WO2014171564A1
WO2014171564A1 PCT/KR2013/003173 KR2013003173W WO2014171564A1 WO 2014171564 A1 WO2014171564 A1 WO 2014171564A1 KR 2013003173 W KR2013003173 W KR 2013003173W WO 2014171564 A1 WO2014171564 A1 WO 2014171564A1
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WO
WIPO (PCT)
Prior art keywords
microchip
mold
film
depression
fpcb
Prior art date
Application number
PCT/KR2013/003173
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French (fr)
Korean (ko)
Inventor
이성
Original Assignee
Lee Sung
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Publication date
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Publication of WO2014171564A1 publication Critical patent/WO2014171564A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/053—Tails
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component

Definitions

  • the present invention relates to a film layer component device having a significantly low defect rate by attaching a film part to a mold part in which a microchip is embedded, and a method of manufacturing the same.
  • the center portion of the mold portion made of synthetic resin material is recessed to a predetermined depth downward, and an opening is formed to cut a predetermined width of the bottom surface of the recessed portion, and a film in the form of a thin film is formed on the lower surface of the mold portion corresponding to the opening portion.
  • the microchip is embedded in the recessed portion and the film interfaced with the microchip.
  • micro component devices such as sensors are mounted to provide a security function to a portable information communication device or an entrance gate.
  • the conventional micro component device has a large number of components, and when stacked for manufacturing, its thickness is so thick that it is not suitable for portable or miniaturization.
  • Fingerprint recognition sensor module using multi-layer electrode and its manufacturing method Korean Patent Application No. 10-2002-0049134
  • An object of the present invention is to integrally bond the film portion to the lower surface of the mold portion in which the microchip is embedded to allow the film portion to interface with the outside and the microchip, and a film that can significantly lower the defect rate in the process of bonding the mold portion and the film portion by hot pressing.
  • the present invention provides a layer component device and a method of manufacturing the same.
  • the film layer component device includes a microchip; FPCB formed in a sticker form of a thin film, one side is attached to the side of the microchip, the other side is extended from the microchip to transmit and receive signals between the outside and the microchip; A recessed portion bent downward in the center portion, an opening having a size corresponding to the width of the microchip is formed on the bottom surface of the recess, and a mold portion for holding the microchip in the opening; A block cap closing the depression from above in a state of being in close contact with the upper surface of the microchip; And a film portion laminated on the lower surface of the mold portion in a thin film form to block the opening from the outside and interface the microchip with the outside of the opening.
  • the other side of the FPCB connected to one side of the microchip is bent upwards and then horizontally bent again to be connected to the outside, so that the first guide grooves are cut in the vertical direction so that the FPCB is inserted therein.
  • the upper surface of the mold portion extending from the first guide groove it is preferable that the second guide groove which is cut in the front-rear direction to fit the FPCB is formed.
  • a third guide groove may be formed on an outer wall of the block cap facing the first guide groove so that the FPCB, which is cut in the vertical direction and fitted into the first guide groove, is inserted at the same time.
  • the thin film may further include a magnetic tape of a thin film stacked on a lower surface of the FPCB to interface the lower surface of the film unit with the microchip.
  • Method for producing a film layer component device comprises the steps of: (a) forming a depression bent downward in the center of the mold portion made of a synthetic resin material in the form of a plate; (b) forming an opening penetrating vertically on the bottom surface of the depression; (c) forming a block cam that closes the depressions by fitting the depressions from above; (d) laminating a film part in the form of a thin film on a lower surface of the mold part corresponding to the opening; (e) mounting the film part on a fixing mold supported on the ground in a state in which the lower surface of the mold part is in close contact with the upper part of the film part; (f) pressing the mold die and the film portion integrally by pressing the bottom surface of the depression while the pressing mold die moves downward while the film portion and the mold portion are seated on the stationary mold die; (g) mounting a microchip and an FPCB extending from the microchip in a state of being attached to the microchip and transmitting and receiving a signal between the
  • the attachment of the mold part and the film part is preferably made of hot pressing by the fixed mold and the pressing mold.
  • the microchip may support the recessed portion and accurately perform the interface with the outside due to the thin film portion of the film portion.
  • FIG. 1 is an exploded perspective view showing a film layer component device according to the present invention.
  • FIG. 3 is an exploded perspective view illustrating a film layer component device according to the present invention.
  • Figure 4 is a perspective perspective view showing a film layer component device according to the present invention 1.
  • FIG. 6 is a perspective view showing a combination of the film layer component device according to the present invention 3.
  • FIG. 7 is a perspective perspective view showing a film layer component device according to the present invention 4.
  • FIG. 8 is an exemplary view illustrating a process of attaching a mold unit and a film unit according to the present invention.
  • FIG. 9 is an exemplary view illustrating a process of laminating a microchip and a block cap in a mold part according to the present invention.
  • Figure 10 is a side cross-sectional view of the combined state of each component of the film layer component device according to the present invention.
  • FIG. 11 is a flow chart showing a manufacturing process of the film layer component device according to the present invention.
  • FIG. 1 is an exploded perspective view 1 showing a film layer component device according to the present invention
  • FIG. 2 is an exploded perspective view 2 showing a film layer component device according to the present invention
  • FIG. 3 is a film layer component device according to the present invention.
  • Figure 3 is an exploded perspective view 3
  • Figure 4 is a combined perspective view 1 showing a film layer component device according to the present invention
  • Figure 5 is a combined perspective view 2 showing a film layer component device according to the invention
  • Figure 6 3 is a perspective view showing a combined film layer component device according to the present invention
  • FIG. 7 is a combined perspective view 4 showing a film layer component device according to the present invention.
  • the film layer component device may include a microchip 10, an FPCB 20, a mold part 30, a block cap 40, a film part 50, and a magnetic plate ( 60).
  • the microchip 10 is responsible for information processing as a processor. Specifically, the magnetic tape 60 laminated on the lower surface of the FPCB 20 grasps the information interfaced with the outside with the film portion 50 as a boundary.
  • FPCB 20 is made of a thin film sticker, one side is attached to the side of the microchip 10, the other side is extended from the microchip 10 to transmit and receive signals between the outside and the microchip 10.
  • the FPCB 20 is connected to an external device and the microchip 10 to transmit information processed by the microchip 10 to an external device.
  • the FPCB 20 is formed in a flexible form, the FPCB 20 is firstly bent in a state in which it is connected to one side of the microchip 10 and the block cap (the first guide groove 31a of the mold part 30). It fits between the 3rd guide grooves 41 of 40, it is bent again, it fits in the 2nd guide groove 31b of the mold part 30, and is fixed. In addition, it is extended to the front of the mold portion 30 in a state of being fitted in the second guide groove 31b, the extended one end may be connected to the external device.
  • the mold part 30 is preferably made of a synthetic resin material, and may be molded by extrusion molding or injection molding using a mold.
  • the mold part 30 has a recessed portion 31 bent downward in the center portion, and an opening 32 having a size corresponding to the width of the microchip 10 is formed on the bottom surface of the recessed portion 31.
  • the microchip 10 is held by inserting the microchip 10 in the opening 32, and the microchip 10 may sense information from the outside through the opened portion.
  • a multi-stepped step may be formed on the inner wall of the recess 31 downwardly inwardly, and an outer wall of the block cap 40 may have a multi-stepped step corresponding to the stepped portion of the depression 31.
  • the block cap 40 and the mold part 30 may be integrally coupled to each other in a state where the stepped portion of the recess 31 and the stepped portion of the block cap 40 are in close contact with each other. For this reason, the microchip 10 built in the mold part 30 can be firmly fixed.
  • the other side of the FPCB 20 having one side connected to the microchip 10 is bent upward on the inner wall of the recess 31, and then horizontally bent and cut in the vertical direction so as to be connected to the outside.
  • a first guide groove 31a into which the 20 is fitted is formed, and a second guide through which the FPCB 20 is inserted into the upper surface of the mold portion 30 extending from the first guide groove 31a is inserted in the front-rear direction.
  • the groove 31b is formed.
  • the block cap 40 closes the depression 31 from above in a state of being in close contact with the upper surface of the microchip 10.
  • the FPCB 20 is configured to hold the FPCB 20 in a state where the first guide groove 31a of the depression 31 and the third guide groove 41 of the block cap 40 face each other.
  • the FPCB 20 is configured to hold the FPCB 20 in a state where the first guide groove 31a of the depression 31 and the third guide groove 41 of the block cap 40 face each other.
  • the film part 50 is stacked in the form of a thin film on the lower surface of the mold part 30 to block the opening 32 from the outside, and to interface the outside of the opening 32 and the microchip 10.
  • the film unit 50 may adopt various thicknesses depending on the type of the product on which the film layer component device is mounted.
  • the magnetic tape 60 is formed in a thin film form and is stacked on the lower surface of the FPCB 20 to interface the outside and the microchip 10 with the film portion 50 as a boundary.
  • FIG. 8 is an exemplary view illustrating a process of attaching a mold unit and a film unit according to the present invention.
  • the film part 50 is laminated on the lower surface of the mold part 30 having the depression 31 and the opening 32 formed therein, the film part 50 and the mold part 30 are disposed. It laminates on the upper surface of the stationary die M1. At this time, the microchip 10 and the block cap 40 are not embedded inside the mold part 30.
  • the crimping mold mold M2 moves from the upper side to the downward direction, and adheres to the fixed mold mold M1, and the mold The part 30 and the film part 50 are joined together integrally.
  • the hot pressing is applied to the mold part 30 and the film part 50 by applying heat of a predetermined temperature from the fixing mold M1 or the pressing mold M2.
  • FIG. 9 is an exemplary view illustrating a process of laminating a microchip and a block cap in a mold unit according to the present invention
  • FIG. 10 is a side cross-sectional view of the components of the film layer component device according to the present invention in a combined state.
  • the mold part 30 and the film part 50 are integrally bonded to each other by a hot pressing method through the fixing mold M1 and the pressing mold M2.
  • the microchip 10 connected to the FPCB 20 from the upward direction is seated, and then, as shown in FIG. 10, the block cap 40 is inserted into the recess 31 from the upper side of the microchip 10 to form a film layer component. Complete the device.
  • the microchip 10 connected to the FPCB 20 is embedded in the recessed part 31, whereby the film layer component device as before.
  • the upper surface of the fixing mold (M1) is formed in the form recessed downward corresponding to the shape of the lower surface of the mold portion 30 so as to be in close contact with the lower surface of the mold portion 30,
  • the lower surface corresponds to the shape of the mold portion 30 and the depression 31 to form a central portion protruding downward to enable effective hot pressing.
  • FIG. 11 is a flowchart illustrating a manufacturing process of a film layer component device according to the present invention.
  • the manufacturing process of the film layer component device according to the present invention will be described in detail with reference to FIG. 11.
  • the process of forming the depression it is possible to simultaneously form the multi-stepped step inwardly downward on the inner wall of the depression, and in the process of forming the block cap, the multi-stage on the outer wall of the block cap corresponding to the step of the depression.
  • the stepped portion can be formed simultaneously.
  • the multi-stepped portions formed on the sidewalls of the recessed portion and the block cap form a structure in which the recessed portions are engaged with each other, whereby the microchip embedded in the recessed portion can be firmly fixed.
  • the pressing mold holding the predetermined high temperature state moves downward from the upper part of the mold to closely contact the upper surface of the fixing mold by hot pressing.
  • the lower surface of the mold portion and the upper surface of the film portion are firmly bonded.
  • the lower surface of the pressing die mold is preferably provided with a width standard that can be fitted into the depression.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention relates to a film layer component element capable of remarkably lowering a defect rate of a product by attaching a film which enables the outside of a mold portion and a micro-chip to be interfaced, with respect the micro-chip embedded in the mold portion. Particularly, the present invention enables: the central part of the mold portion made from a synthetic resin material to be downwardly dented in a predetermined depth; an opening portion for cutting the bottom surface of the dented part by a predetermined width to be formed; a thin film to be attached, through hot pressing, to the lower side of the mold portion of a part corresponding to the opening portion; and the micro-chip to be embedded in the dented part, and the film to be interfaced the outside with the micro-chip. The present invention remarkably lowers a defect rate of a product after manufacture by firstly bonding the mold portion and the film through hot pressing at a distance from the micro-chip, with respect to the mold portion having the micro-chip embedded therein.

Description

필름 레이어 부품소자 및 그 제조방법Film layer component device and manufacturing method
본 발명은 마이크로 칩이 내장된 몰드부에 필름부를 부착시켜 불량률이 현저히 낮은 필름 레이어 부품소자 및 그 제조방법에 관한 기술이다.The present invention relates to a film layer component device having a significantly low defect rate by attaching a film part to a mold part in which a microchip is embedded, and a method of manufacturing the same.
더욱 상세하게는, 합성수지재로 이루어진 몰드부의 중앙부를 하방으로 소정 깊이 함몰시키고 함몰된 부분의 바닥면을 소정 너비 절개하는 개구부를 형성하며, 개구부에 대응하는 부분의 몰드부 하면에 박막 형태의 필름을 핫 프레싱으로 부착한 후, 그 함몰된 부분에 마이크로 칩을 내장하고 필름이 외부와 마이크로 칩을 인터페이스하도록 하는 기술이다.More specifically, the center portion of the mold portion made of synthetic resin material is recessed to a predetermined depth downward, and an opening is formed to cut a predetermined width of the bottom surface of the recessed portion, and a film in the form of a thin film is formed on the lower surface of the mold portion corresponding to the opening portion. After attaching by hot pressing, the microchip is embedded in the recessed portion and the film interfaced with the microchip.
일반적으로 휴대용 정보통신기기나 출입 게이트에 보안기능을 부여하기 위하여 센서 등 다양한 마이크로 부품소자가 탑재된다.In general, various micro component devices such as sensors are mounted to provide a security function to a portable information communication device or an entrance gate.
그러나, 종래의 마이크로 부품소자는 그 구성부품이 많기 때문에 제조를 위해 적층하는 경우 그 두께가 두꺼워서 휴대용이나 소형화를 위해서 적합하지 않은 문제점이 있다.However, the conventional micro component device has a large number of components, and when stacked for manufacturing, its thickness is so thick that it is not suitable for portable or miniaturization.
또한, 종래의 마이크로 부품소자는 구성부품을 적층한 후에 금형틀을 이용한 가압을 통해 하나의 모듈을 제조하는 과정에서 불량률이 매우 높게 발생하는 문제점이 있다.In addition, the conventional micro-component device has a problem that the defective rate is very high in the process of manufacturing one module by pressing using a mold after laminating the component parts.
[관련기술문헌][Related Technical Documents]
1. 다층전극을 이용한 지문인식 센서모듈 및 그 제조방법(대한민국 특허출원 10-2002-0049134호)1. Fingerprint recognition sensor module using multi-layer electrode and its manufacturing method (Korean Patent Application No. 10-2002-0049134)
2. 가압 지문인식소자(대한민국 특허출원 10-2001-0003345호)2. Pressurized fingerprint recognition device (Korean Patent Application No. 10-2001-0003345)
본 발명의 목적은 마이크로 칩을 내장하는 몰드부의 하면에 필름부를 일체로 접합하여 필름부가 외부와 마이크로 칩을 인터페이스 하도록 하고 몰드부와 필름부를 핫 프레싱 방식으로 접합하는 과정에서 불량률을 현저히 낮출 수 있는 필름 레이어 부품소자 및 그 제조방법을 제공함에 있다.An object of the present invention is to integrally bond the film portion to the lower surface of the mold portion in which the microchip is embedded to allow the film portion to interface with the outside and the microchip, and a film that can significantly lower the defect rate in the process of bonding the mold portion and the film portion by hot pressing. The present invention provides a layer component device and a method of manufacturing the same.
상기의 목적을 달성하기 위하여 본 발명에 따른 필름 레이어 부품소자는, 마이크로 칩; 박막의 스티커 형태로 이루어지며, 일측부가 마이크로 칩의 측면에 부착되고, 타측부는 마이크로 칩으로부터 확장되어 외부와 마이크로 칩 간의 신호를 송수신하는 FPCB; 중앙부에 하방으로 절곡된 함몰부가 형성되고, 함몰부의 바닥면에 마이크로 칩의 너비에 대응하는 크기의 개구부가 형성되며, 개구부에 마이크로 칩을 끼워 홀딩하는 몰드부; 마이크로 칩의 상면에 밀착된 상태로 상방으로부터 함몰부를 마감하는 블록 캡; 몰드부의 하면에 박막 형태로 적층되어 개구부를 외부와 차단하고, 개구부의 외부와 마이크로 칩을 인터페이스하는 필름부;를 포함하여 구성된다.In order to achieve the above object, the film layer component device according to the present invention includes a microchip; FPCB formed in a sticker form of a thin film, one side is attached to the side of the microchip, the other side is extended from the microchip to transmit and receive signals between the outside and the microchip; A recessed portion bent downward in the center portion, an opening having a size corresponding to the width of the microchip is formed on the bottom surface of the recess, and a mold portion for holding the microchip in the opening; A block cap closing the depression from above in a state of being in close contact with the upper surface of the microchip; And a film portion laminated on the lower surface of the mold portion in a thin film form to block the opening from the outside and interface the microchip with the outside of the opening.
이때, 마이크로 칩에 일측부가 연결되는 FPCB의 타측부가 상방으로 절곡된 후 다시 수평으로 절곡되어 외부와 연결될 수 있도록 함몰부의 내측벽에는 상하방향으로 절개되어 FPCB가 끼워지는 제 1 가이드홈이 형성되고, 제 1 가이드 홈으로부터 연장되는 몰드부의 상면에는 전후방향으로 절개되어 FPCB가 끼워지는 제 2 가이드홈이 형성됨이 바람직하다. 그리고, 제 1 가이드홈과 마주하는 블록 캡의 외측벽에는 상하방향으로 절개되어 제 1 가이드홈에 끼워지는 FPCB가 동시에 끼워지는 제 3 가이드홈이 형성될 수 있다.At this time, the other side of the FPCB connected to one side of the microchip is bent upwards and then horizontally bent again to be connected to the outside, so that the first guide grooves are cut in the vertical direction so that the FPCB is inserted therein. The upper surface of the mold portion extending from the first guide groove, it is preferable that the second guide groove which is cut in the front-rear direction to fit the FPCB is formed. In addition, a third guide groove may be formed on an outer wall of the block cap facing the first guide groove so that the FPCB, which is cut in the vertical direction and fitted into the first guide groove, is inserted at the same time.
한편, FPCB의 하면에 적층되어 상기 필름부의 하면과 상기 마이크로 칩을 인터페이스하는 박막의 자성체 테이프를 더 포함하여 구성될 수 있다.The thin film may further include a magnetic tape of a thin film stacked on a lower surface of the FPCB to interface the lower surface of the film unit with the microchip.
본 발명에 따른 필름 레이어 부품소자의 제조방법은 (a) 플레이트 형태의 합성수지재로 이루어진 몰드부의 중앙부에 하방으로 절곡되는 함몰부를 형성하는 단계; (b) 함몰부의 바닥면에 상하방향으로 관통하는 개구부를 형성하는 단계; (c) 상방으로부터 함몰부에 끼움으로써 함몰부를 마감하는 블록 캠을 형성하는 단계; (d) 개구부에 대응하는 몰드부의 하면에 박막 형태의 필름부를 적층하는 단계; (e) 필름부의 상면에 몰드부의 하면이 밀착된 상태로 지면에 지지되는 고정 금형틀에 필름부를 안착시키는 단계; (f) 고정 금형틀에 필름부와 몰드부가 안착된 상태에서 압착 금형틀이 하방으로 움직이면서 함몰부의 바닥면을 압착하여 몰드부와 필름부를 일체로 부착시키는 단계; (g) 마이크로 칩과, 마이크로 칩에 부착된 상태로 마이크로 칩으로부터 확장되어 외부와 마이크로 칩 간의 신호를 송수신하는 FPCB를 함몰부의 바닥면에 안착시키는 단계; (h) 블록 캡을 상기 마이크로 칩의 상면에 밀착되도록 상방으로부터 함몰부에 끼워 함몰부를 마감하는 단계;를 포함하여 구성된다.Method for producing a film layer component device according to the present invention comprises the steps of: (a) forming a depression bent downward in the center of the mold portion made of a synthetic resin material in the form of a plate; (b) forming an opening penetrating vertically on the bottom surface of the depression; (c) forming a block cam that closes the depressions by fitting the depressions from above; (d) laminating a film part in the form of a thin film on a lower surface of the mold part corresponding to the opening; (e) mounting the film part on a fixing mold supported on the ground in a state in which the lower surface of the mold part is in close contact with the upper part of the film part; (f) pressing the mold die and the film portion integrally by pressing the bottom surface of the depression while the pressing mold die moves downward while the film portion and the mold portion are seated on the stationary mold die; (g) mounting a microchip and an FPCB extending from the microchip in a state of being attached to the microchip and transmitting and receiving a signal between the outside and the microchip on the bottom surface of the depression; (h) closing the recessed part by inserting the block cap into the recessed portion from above so as to be in close contact with the upper surface of the microchip.
이때, 단계 (e)에서는 몰드부와 필름부의 부착은 고정 금형틀과 압착 금형틀에 의한 핫 프레싱으로 이루어짐이 바람직하다.At this time, in the step (e), the attachment of the mold part and the film part is preferably made of hot pressing by the fixed mold and the pressing mold.
본 발명에 따른 필름 레이어 부품소자 및 그 제조방법은,Film layer component device and a method of manufacturing the same according to the present invention,
(1) 마이크로 칩을 내장하는 몰드부를 마이크로 칩과 별도로 먼저 몰드부와 필름부를 핫 프레싱에 의해 접합시킴으로써, 제조 후 제품의 불량률을 현저히 낮추었다.(1) By separately pressing the mold part and the film part by hot pressing separately from the microchip, the mold part incorporating the microchip, the defective rate of the product after manufacture was remarkably lowered.
(2) 몰드부의 하면에 접합되는 필름부를 다양한 패턴의 두께를 갖는 것으로 채택할 수 있으므로 본 발명의 모듈이 부착되는 제품에 따라 호환성이 좋은 장점이 있다.(2) Since the film portion bonded to the lower surface of the mold portion can be adopted to have a thickness of various patterns, there is an advantage of good compatibility according to the product to which the module of the present invention is attached.
(3) 마이크로 칩이 내장되는 몰드부에는 마이크로 칩을 홀딩하는 함몰부를 형성하고, 함몰부의 바닥면에 개구부를 형성한 후 이 개구부를 밀폐하는 박막의 필름부를 몰드부의 하면에 접합함으로써, 마이크로 칩의 무게로 필름부가 찢어지지 않도록 마이크로 칩을 함몰부가 지탱할 수 있고 필름부의 박막으로 인한 외부와의 인터페이스를 정확히 수행할 수 있는 장점이 있다.(3) In the mold portion in which the microchip is embedded, a recess for holding the microchip is formed, an opening is formed in the bottom surface of the recess, and then a film portion of the thin film that seals the opening is joined to the lower surface of the mold portion. In order to avoid tearing the film portion by weight, the microchip may support the recessed portion and accurately perform the interface with the outside due to the thin film portion of the film portion.
(4) 구성 부품을 단순화하여 제조단가를 현저히 낮추었다.(4) The manufacturing cost was significantly reduced by simplifying the components.
도 1은 본 발명에 따른 필름 레이어 부품소자를 도시한 분리사시도 1.1 is an exploded perspective view showing a film layer component device according to the present invention.
도 2는 본 발명에 따른 필름 레이어 부품소자를 도시한 분리사시도 2.Figure 2 is an exploded perspective view showing a film layer component device according to the present invention 2.
도 3은 본 발명에 따른 필름 레이어 부품소자를 도시한 분리사시도 3.3 is an exploded perspective view illustrating a film layer component device according to the present invention.
도 4는 본 발명에 따른 필름 레이어 부품소자를 도시한 결합사시도 1.Figure 4 is a perspective perspective view showing a film layer component device according to the present invention 1.
도 5는 본 발명에 따른 필름 레이어 부품소자를 도시한 결합사시도 2.5 is a perspective perspective view showing a film layer component device according to the present invention 2.
도 6은 본 발명에 따른 필름 레이어 부품소자를 도시한 결합사시도 3.6 is a perspective view showing a combination of the film layer component device according to the present invention 3.
도 7은 본 발명에 따른 필름 레이어 부품소자를 도시한 결합사시도 4.7 is a perspective perspective view showing a film layer component device according to the present invention 4.
도 8은 본 발명에 따른 몰드부와 필름부를 부착하는 과정을 도시한 예시도.8 is an exemplary view illustrating a process of attaching a mold unit and a film unit according to the present invention.
도 9는 본 발명에 따른 몰드부에 마이크로 칩과 블록 캡을 적층하는 과정을 도시한 예시도.9 is an exemplary view illustrating a process of laminating a microchip and a block cap in a mold part according to the present invention.
도 10은 본 발명에 따른 필름 레이어 부품소자의 각 구성이 결합된 상태의 측단면도.Figure 10 is a side cross-sectional view of the combined state of each component of the film layer component device according to the present invention.
도 11은 본 발명에 따른 필름 레이어 부품소자의 제조과정을 나타낸 순서도.11 is a flow chart showing a manufacturing process of the film layer component device according to the present invention.
이하, 도면을 참조하여 본 발명은 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the drawings.
도 1은 본 발명에 따른 필름 레이어 부품소자를 도시한 분리사시도 1이고, 도 2는 본 발명에 따른 필름 레이어 부품소자를 도시한 분리사시도 2이고, 도 3은 본 발명에 따른 필름 레이어 부품소자를 도시한 분리사시도 3이고, 도 4는 본 발명에 따른 필름 레이어 부품소자를 도시한 결합사시도 1이고, 도 5는 본 발명에 따른 필름 레이어 부품소자를 도시한 결합사시도 2이고, 도 6은 본 발명에 따른 필름 레이어 부품소자를 도시한 결합사시도 3이고, 도 7은 본 발명에 따른 필름 레이어 부품소자를 도시한 결합사시도 4를 나타낸다.1 is an exploded perspective view 1 showing a film layer component device according to the present invention, FIG. 2 is an exploded perspective view 2 showing a film layer component device according to the present invention, and FIG. 3 is a film layer component device according to the present invention. Figure 3 is an exploded perspective view 3, Figure 4 is a combined perspective view 1 showing a film layer component device according to the present invention, Figure 5 is a combined perspective view 2 showing a film layer component device according to the invention, Figure 6 3 is a perspective view showing a combined film layer component device according to the present invention, and FIG. 7 is a combined perspective view 4 showing a film layer component device according to the present invention.
도 1 내지 도 7을 참조하면, 본 발명에 따른 필름 레이어 부품소자는 마이크로 칩(10), FPCB(20), 몰드부(30), 블록 캡(40), 필름부(50), 자성체 플레이트(60)를 포함하여 구성된다.1 to 7, the film layer component device according to the present invention may include a microchip 10, an FPCB 20, a mold part 30, a block cap 40, a film part 50, and a magnetic plate ( 60).
마이크로 칩(10)은 프로세서로서 정보 처리를 담당한다. 구체적으로 FPCB(20)의 하면에 적층된 자성체 테이프(60)가 필름부(50)를 경계로 외부와 인터페이스한 정보를 파악한다.The microchip 10 is responsible for information processing as a processor. Specifically, the magnetic tape 60 laminated on the lower surface of the FPCB 20 grasps the information interfaced with the outside with the film portion 50 as a boundary.
FPCB(20)는 박막의 스티커 형태로 이루어지며, 일측부가 마이크로 칩(10)의 측면에 부착되고, 타측부는 마이크로 칩(10)으로부터 확장되어 외부와 마이크로 칩(10) 간의 신호를 송수신한다. FPCB(20)는 외부의 장치와 마이크로 칩(10)에 연결되어 마이크로 칩(10)이 처리한 정보를 외부의 장치에 전송한다.FPCB 20 is made of a thin film sticker, one side is attached to the side of the microchip 10, the other side is extended from the microchip 10 to transmit and receive signals between the outside and the microchip 10. The FPCB 20 is connected to an external device and the microchip 10 to transmit information processed by the microchip 10 to an external device.
한편, 본 발명에서 FPCB(20)는 플렉시블한 형태로 이루어지기 때문에 마이크로 칩(10)의 일측부에 연결된 상태에서 1차적으로 꺽여 몰드부(30)의 제 1 가이드홈(31a)과 블록 캡(40)의 제 3 가이드홈(41) 사이에 끼워지고, 다시 꺽여 몰드부(30)의 제 2 가이드홈(31b)에 끼워져 고정된다. 또한, 제 2 가이드홈(31b)에 끼워진 상태로 몰드부(30)의 전방으로 확장되며, 확장된 일단부가 외부의 장치에 접속될 수 있다.Meanwhile, in the present invention, since the FPCB 20 is formed in a flexible form, the FPCB 20 is firstly bent in a state in which it is connected to one side of the microchip 10 and the block cap (the first guide groove 31a of the mold part 30). It fits between the 3rd guide grooves 41 of 40, it is bent again, it fits in the 2nd guide groove 31b of the mold part 30, and is fixed. In addition, it is extended to the front of the mold portion 30 in a state of being fitted in the second guide groove 31b, the extended one end may be connected to the external device.
몰드부(30)는 바람직하게 합성수지재로 이루어지며, 금형틀에 의한 압출 성형 또는 사출 성형으로 몰딩이 가능하다. 몰드부(30)는 중앙부에 하방으로 절곡된 함몰부(31)가 형성되고, 함몰부(31)의 바닥면에 마이크로 칩(10)의 너비에 대응하는 크기의 개구부(32)가 형성된다. 이때, 개구부(32)에 마이크로 칩(10)을 끼워 홀딩하는데, 개구된 부분을 통해 외부로부터의 정보를 마이크로 칩(10)이 감지할 수 있다.The mold part 30 is preferably made of a synthetic resin material, and may be molded by extrusion molding or injection molding using a mold. The mold part 30 has a recessed portion 31 bent downward in the center portion, and an opening 32 having a size corresponding to the width of the microchip 10 is formed on the bottom surface of the recessed portion 31. At this time, the microchip 10 is held by inserting the microchip 10 in the opening 32, and the microchip 10 may sense information from the outside through the opened portion.
또한, 함몰부(31)의 내측벽에는 하방으로 비스듬히 내향하는 다단의 단차부를 형성할 수 있고, 함몰부(31)의 단차부에 대응하여 블록 캡(40)의 외측벽이 다단으로 단차부를 형성하여 함몰부(31)의 단차부와 블록 캡(40)의 단차부가 상호 밀착된 상태로 블록 캡(40)과 몰드부(30)를 일체로 결합시킬 수 있다. 이로 인해, 몰드부(30)의 내측에 내장된 마이크로 칩(10)이 견고하게 고정된 상태를 유지할 수 있다.In addition, a multi-stepped step may be formed on the inner wall of the recess 31 downwardly inwardly, and an outer wall of the block cap 40 may have a multi-stepped step corresponding to the stepped portion of the depression 31. The block cap 40 and the mold part 30 may be integrally coupled to each other in a state where the stepped portion of the recess 31 and the stepped portion of the block cap 40 are in close contact with each other. For this reason, the microchip 10 built in the mold part 30 can be firmly fixed.
그리고, 함몰부(31)의 내측벽에는 마이크로 칩(10)에 일측부가 연결되는 FPCB(20)의 타측부가 상방으로 절곡된 후 다시 수평으로 절곡되어 외부와 연결될 수 있도록 상하방향으로 절개되어 FPCB(20)가 끼워지는 제 1 가이드홈(31a)이 형성되고, 제 1 가이드 홈(31a)으로부터 연장되는 몰드부(30)의 상면에는 전후방향으로 절개되어 FPCB(20)가 끼워지는 제 2 가이드홈(31b)이 형성된다.In addition, the other side of the FPCB 20 having one side connected to the microchip 10 is bent upward on the inner wall of the recess 31, and then horizontally bent and cut in the vertical direction so as to be connected to the outside. A first guide groove 31a into which the 20 is fitted is formed, and a second guide through which the FPCB 20 is inserted into the upper surface of the mold portion 30 extending from the first guide groove 31a is inserted in the front-rear direction. The groove 31b is formed.
블록 캡(40)은 마이크로 칩(10)의 상면에 밀착된 상태로 상방으로부터 함몰부(31)를 마감한다. 그리고, 블록 캡(40)의 외측벽에는 제 1 가이드홈(31a)과 마주하는 상하방향으로 절개되어 제 1 가이드홈(31a)에 끼워지는 FPCB(20)가 동시에 끼워지는 제 3 가이드홈(41)이 형성된다.The block cap 40 closes the depression 31 from above in a state of being in close contact with the upper surface of the microchip 10. In addition, a third guide groove 41 into which the FPCB 20 inserted into the first guide groove 31a is simultaneously cut in an up and down direction facing the first guide groove 31a on the outer wall of the block cap 40. Is formed.
이처럼, 함몰부(31)의 제 1 가이드홈(31a)과 블록 캡(40)의 제 3 가이드홈(41)이 마주한 상태로 FPCB(20)를 홀딩하는 구조로 구성됨으로써 본 발명에 따르면 FPCB(20)의 일측부와 연결되는 마이크로 칩(10)을 보다 견고하게 고정할 수 있는 장점도 있다.As such, according to the present invention, the FPCB 20 is configured to hold the FPCB 20 in a state where the first guide groove 31a of the depression 31 and the third guide groove 41 of the block cap 40 face each other. There is also an advantage that can more firmly fix the microchip 10 is connected to one side of 20).
필름부(50)는 몰드부(30)의 하면에 박막 형태로 적층되어 개구부(32)를 외부와 차단하고, 개구부(32) 하방의 외부와 마이크로 칩(10)을 상호 인터페이스 한다. 필름부(50)는 필름 레이어 부품소자가 탑재되는 제품의 종류에 따라 다양한 두께의 것을 채택할 수 있다. 그리고, 자성체 테이프(60)는 박막 형태로 이루어지고, FPCB(20)의 하면에 적층되어 필름부(50)를 경계로 외부와 마이크로 칩(10)을 상호 인터페이스 한다.The film part 50 is stacked in the form of a thin film on the lower surface of the mold part 30 to block the opening 32 from the outside, and to interface the outside of the opening 32 and the microchip 10. The film unit 50 may adopt various thicknesses depending on the type of the product on which the film layer component device is mounted. In addition, the magnetic tape 60 is formed in a thin film form and is stacked on the lower surface of the FPCB 20 to interface the outside and the microchip 10 with the film portion 50 as a boundary.
도 8은 본 발명에 따른 몰드부와 필름부를 부착하는 과정을 도시한 예시도이다. 도 8을 참조하면, 함몰부(31)와 개구부(32)가 형성된 상태의 몰드부(30)의 하면에 필름부(50)를 적층한 후, 필름부(50)와 몰드부(30)를 고정 금형틀(M1)의 상면에 적층한다. 이때, 몰드부(30)의 내측에는 마이크로 칩(10)과 블록 캡(40)이 내장되지 않은 상태이다.8 is an exemplary view illustrating a process of attaching a mold unit and a film unit according to the present invention. Referring to FIG. 8, after the film part 50 is laminated on the lower surface of the mold part 30 having the depression 31 and the opening 32 formed therein, the film part 50 and the mold part 30 are disposed. It laminates on the upper surface of the stationary die M1. At this time, the microchip 10 and the block cap 40 are not embedded inside the mold part 30.
이렇게 고정 금형틀(M1)에 순차적으로 필름부(50)와 몰드부(30)를 적층한 상태에서 압착 금형틀(M2)이 상방으로부터 하방으로 이동하여 고정 금형틀(M1)에 밀착됨으로써, 몰드부(30)와 필름부(50)를 일체로 접합한다. 이때, 고정 금형틀(M1) 또는 압착 금형틀(M2)로부터 소정 온도의 열을 몰드부(30)와 필름부(50)에 가하는 핫 프레싱 방식으로 이루어짐이 바람직하다.Thus, in the state in which the film part 50 and the mold part 30 were laminated | stacked on the fixed mold mold M1 sequentially, the crimping mold mold M2 moves from the upper side to the downward direction, and adheres to the fixed mold mold M1, and the mold The part 30 and the film part 50 are joined together integrally. At this time, it is preferable that the hot pressing is applied to the mold part 30 and the film part 50 by applying heat of a predetermined temperature from the fixing mold M1 or the pressing mold M2.
도 9는 본 발명에 따른 몰드부에 마이크로 칩과 블록 캡을 적층하는 과정을 도시한 예시도이고, 도 10은 본 발명에 따른 필름 레이어 부품소자의 각 구성이 결합된 상태의 측단면도이다.9 is an exemplary view illustrating a process of laminating a microchip and a block cap in a mold unit according to the present invention, and FIG. 10 is a side cross-sectional view of the components of the film layer component device according to the present invention in a combined state.
도 9에서 보는 바와 같이, 고정 금형틀(M1)과 압착 금형틀(M2)을 통한 핫 프레싱 방식으로 몰드부(30)와 필름부(50)를 일체로 접합한 상태에서 몰드부(30)의 상방향으로부터 FPCB(20)와 연결된 마이크로 칩(10)을 안착시키고, 이어서 도 10에서 보는 바와 같이, 마이크로 칩(10)의 상방으로부터 블록 캡(40)을 함몰부(31)에 끼워서 필름 레이어 부품소자를 완성한다.As shown in FIG. 9, the mold part 30 and the film part 50 are integrally bonded to each other by a hot pressing method through the fixing mold M1 and the pressing mold M2. The microchip 10 connected to the FPCB 20 from the upward direction is seated, and then, as shown in FIG. 10, the block cap 40 is inserted into the recess 31 from the upper side of the microchip 10 to form a film layer component. Complete the device.
이처럼, 몰드부(30)와 필름부(50)를 먼저 핫 프레싱으로 접합한 후, 함몰부(31)에 FPCB(20)와 연결된 마이크로 칩(10)을 내장시킴으로써, 기존과 같이 필름 레이어 부품소자를 제조하는 가압 과정에서 제품의 불량률이 발생하는 빈도를 현저히 낮출 수 있는 장점이 있다.As such, after the mold part 30 and the film part 50 are first bonded by hot pressing, the microchip 10 connected to the FPCB 20 is embedded in the recessed part 31, whereby the film layer component device as before. There is an advantage that can significantly lower the frequency of occurrence of the defective rate of the product during the pressing process to manufacture.
한편, 고정 금형틀(M1)의 상면은 몰드부(30)의 하면에 밀착될 수 있도록 몰드부(30)의 하면 형상에 대응하여 하방으로 움푹 패인 형태로 이루어지고, 압착 금형틀(M2)의 하면은 몰드부(30)와 함몰부(31)의 형상에 대응하여 중앙부가 하방으로 돌출된 형태를 이루어 효과적인 핫 프레싱이 가능하도록 한다.On the other hand, the upper surface of the fixing mold (M1) is formed in the form recessed downward corresponding to the shape of the lower surface of the mold portion 30 so as to be in close contact with the lower surface of the mold portion 30, The lower surface corresponds to the shape of the mold portion 30 and the depression 31 to form a central portion protruding downward to enable effective hot pressing.
도 11은 본 발명에 따른 필름 레이어 부품소자의 제조과정을 나타낸 순서도이다. 도 11을 참조하여 본 발명에 본 발명에 따른 필름 레이어 부품소자의 제조과정을 구체적으로 설명하면 다음과 같다.11 is a flowchart illustrating a manufacturing process of a film layer component device according to the present invention. Hereinafter, the manufacturing process of the film layer component device according to the present invention will be described in detail with reference to FIG. 11.
S100, S110, S120 : 먼저, 합성수지재의 플레이트 형태로 이루어진 몰드부에 대해 중앙부를 하방으로 절곡시켜 마이크로 칩이 내장된 함몰부를 형성한다. 이어서, 함몰부의 바닥면에 소정 너비를 절개하여 개구부를 형성한다. 이 개구부에 마이크로 칩이 끼워져 홀딩된다. 그리고, 마이크로 칩이 내장된 상태의 함몰부를 마감하는 블록 캡을 미리 마련해 놓는다.S100, S110, S120: First, the center portion is bent downward with respect to the mold portion formed of a plate of synthetic resin material to form a recess in which the microchip is embedded. Subsequently, an opening is formed by cutting a predetermined width into the bottom surface of the depression. The microchip is inserted into and held in this opening. And the block cap which finishes the recessed part in which the microchip is built-in is prepared previously.
한편, 함몰부를 형성하는 과정 중에서 당해 함몰부의 내측벽에 하방을 향해 내향하는 다단의 단차부를 동시에 형성할 수 있고, 블록 캡을 형성하는 과정 중에서 함몰부의 단차부에 대응하여 블록 캡의 외측벽에 다단으로 단차부를 동시에 형성할 수 있다.On the other hand, in the process of forming the depression, it is possible to simultaneously form the multi-stepped step inwardly downward on the inner wall of the depression, and in the process of forming the block cap, the multi-stage on the outer wall of the block cap corresponding to the step of the depression. The stepped portion can be formed simultaneously.
이처럼, 함몰부와 블록 캡의 측벽에 형성되는 다단의 단차부가 상호 맞물리는 구조를 이룸으로써, 함몰부에 내장되는 마이크로 칩을 보다 견고하게 고정할 수 있다.As described above, the multi-stepped portions formed on the sidewalls of the recessed portion and the block cap form a structure in which the recessed portions are engaged with each other, whereby the microchip embedded in the recessed portion can be firmly fixed.
S130, S140 : 블록 캡과 몰드부를 미리 성형하여 마련한 후, 지면에 위치하는 고정 금형틀의 상면에 박막의 필름부를 안착시킨다. 이어서 필름부의 상면에 개구부가 밀착되도록 몰드부를 적층시킨다. 여기서, 몰드부의 하면에 필름부를 먼저 적층한 상태로 몰드부와 필름부를 고정 금형틀에 안착시킬 수도 있다.S130, S140: After forming the block cap and the mold portion in advance, the film portion of the thin film is seated on the upper surface of the fixed mold frame located on the ground. Subsequently, a mold part is laminated so that the opening part is in close contact with the upper surface of the film part. Here, the mold part and the film part may be seated on the fixed mold frame in a state where the film parts are first stacked on the lower surface of the mold part.
S150 : 고정 금형틀에 필름부와 몰드부가 순차적으로 적층된 상태에서 소정의 고온 상태를 유지하는 압착 금형틀이 몰드부의 상방으로부터 하방으로 이동하여 고정 금형틀의 상면을 핫 프레싱 방식으로 밀착한다. 이 과정에서 몰드부의 하면과 필름부의 상면이 견고하게 접합된다. 여기서, 압착 금형틀의 하면은 함몰부의 내측으로 끼워질 수 있는 너비의 규격으로 구비됨이 바람직하다.S150: In the state in which the film part and the mold part are sequentially stacked on the fixing mold, the pressing mold holding the predetermined high temperature state moves downward from the upper part of the mold to closely contact the upper surface of the fixing mold by hot pressing. In this process, the lower surface of the mold portion and the upper surface of the film portion are firmly bonded. Here, the lower surface of the pressing die mold is preferably provided with a width standard that can be fitted into the depression.
S160, S170 : 몰드부와 필름부가 일체로 접합된 상태에서 몰드부의 상방으로부터 함몰부의 내측에 FPCB와 연결된 마이크로 칩을 안착시킨 후, 마이크로 칩의 상방으로부터 블록 캡을 함몰부에 끼워 본 발명의 필름 레이어 부품소자를 완성한다.S160, S170: After the microchip connected with the FPCB is seated from the upper side of the mold portion to the inside of the recessed portion in a state where the mold portion and the film portion are integrally bonded, the film layer of the present invention is inserted into the recessed portion from the top of the microchip. Complete the component elements.

Claims (6)

  1. 마이크로 칩(10);Microchip 10;
    박막의 스티커 형태로 이루어지며, 일측부가 상기 마이크로 칩의 측면에 부착되고, 타측부는 상기 마이크로 칩으로부터 확장되어 외부와 상기 마이크로 칩 간의 신호를 송수신하는 FPCB(20);A FPCB (20) formed in a sticker form of a thin film, one side of which is attached to a side of the microchip, and the other side of which extends from the microchip to transmit and receive a signal between the outside and the microchip;
    중앙부에 하방으로 절곡된 함몰부(31)가 형성되고, 상기 함몰부의 바닥면에 상기 마이크로 칩의 너비에 대응하는 크기의 개구부(32)가 형성되며, 상기 개구부에 상기 마이크로 칩을 끼워 홀딩하는 몰드부(30);A depression 31 bent downward is formed in the center portion, and an opening 32 having a size corresponding to the width of the microchip is formed on the bottom surface of the depression, and a mold for holding the microchip in the opening is formed. Part 30;
    상기 마이크로 칩의 상면에 밀착된 상태로 상방으로부터 상기 함몰부를 마감하는 블록 캡(40);A block cap 40 closing the recessed portion from above in a state of being in close contact with the upper surface of the microchip;
    상기 몰드부의 하면에 박막 형태로 적층되어 상기 개구부를 외부와 차단하고, 상기 개구부의 외부와 상기 마이크로 칩을 인터페이스하는 필름부(50);A film part 50 stacked on a lower surface of the mold part to block the opening from the outside and to interface the outside of the opening with the microchip;
    를 포함하여 구성되는 필름 레이어 부품소자.Film layer component device comprising a.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 마이크로 칩에 일측부가 연결되는 상기 FPCB의 타측부가 상방으로 절곡된 후 다시 수평으로 절곡되어 외부와 연결될 수 있도록 상기 함몰부의 내측벽에는 상하방향으로 절개되어 상기 FPCB가 끼워지는 제 1 가이드홈(31a)이 형성되고, 상기 제 1 가이드 홈으로부터 연장되는 상기 몰드부의 상면에는 전후방향으로 절개되어 상기 FPCB가 끼워지는 제 2 가이드홈(31b)이 형성된 것을 특징으로 하는 필름 레이어 부품소자.A first guide groove into which the FPCB is inserted into the inner wall of the depression so that the other side of the FPCB, which is connected to the microchip, is bent upward and then be horizontally bent again to be connected to the outside; And a second guide groove (31b) cut in the front-rear direction to fit the FPCB on the upper surface of the mold portion extending from the first guide groove.
  3. 청구항 2에 있어서,The method according to claim 2,
    상기 제 1 가이드홈과 마주하는 상기 블록 캡의 외측벽에는 상하방향으로 절개되어 상기 제 1 가이드홈에 끼워지는 상기 FPCB가 동시에 끼워지는 제 3 가이드홈(41)이 형성된 것을 특징으로 하는 필름 레이어 부품소자.A film layer component device, characterized in that a third guide groove 41 is formed on an outer wall of the block cap facing the first guide groove so as to be cut in the vertical direction to simultaneously fit the FPCB fitted to the first guide groove. .
  4. 청구항 3에 있어서,The method according to claim 3,
    상기 FPCB의 하면에 적층되어 상기 필름부의 하면과 상기 마이크로 칩을 인터페이스하는 박막의 자성체 테이프(60)를 더 포함하여 구성되는 것을 특징으로 하는 필름 레이어 부품소자.And a thin film magnetic tape (60) laminated on the lower surface of the FPCB to interface the lower surface of the film portion with the microchip.
  5. (a) 플레이트 형태의 합성수지재로 이루어진 몰드부의 중앙부에 하방으로 절곡되는 함몰부를 형성하는 단계;(A) forming a depression that is bent downward in the center of the mold portion made of a synthetic resin material in the form of a plate;
    (b) 상기 함몰부의 바닥면에 상하방향으로 관통하는 개구부를 형성하는 단계;(b) forming an opening penetrating vertically on the bottom surface of the depression;
    (c) 상방으로부터 상기 함몰부에 끼움으로써 상기 함몰부를 마감하는 블록 캠을 형성하는 단계;(c) forming a block cam that closes the depression by fitting the depression from above;
    (d) 상기 개구부에 대응하는 상기 몰드부의 하면에 박막 형태의 필름부를 적층하는 단계;(d) stacking a film part in a thin film form on a lower surface of the mold part corresponding to the opening;
    (e) 상기 필름부의 상면에 상기 몰드부의 하면이 밀착된 상태로 지면에 지지되는 고정 금형틀에 상기 필름부를 안착시키는 단계;(e) seating the film part on a fixed mold frame supported on the ground in a state in which the bottom surface of the mold part is in close contact with the top surface of the film part;
    (f) 상기 고정 금형틀에 상기 필름부와 상기 몰드부가 안착된 상태에서 압착 금형틀이 하방으로 움직이면서 상기 함몰부의 바닥면을 압착하여 상기 몰드부와 상기 필름부를 일체로 부착시키는 단계;(f) pressing the mold surface and the film part integrally by compressing a bottom surface of the recessed part while the pressing mold die moves downward while the film part and the mold part are seated on the fixing mold;
    (g) 마이크로 칩과, 상기 마이크로 칩에 부착된 상태로 상기 마이크로 칩으로부터 확장되어 외부와 상기 마이크로 칩 간의 신호를 송수신하는 FPCB를 상기 함몰부의 바닥면에 안착시키는 단계;(g) mounting a microchip and an FPCB extending from the microchip in a state of being attached to the microchip and transmitting and receiving signals between the microchip and the outside to the bottom surface of the depression;
    (h) 상기 블록 캡을 상기 마이크로 칩의 상면에 밀착되도록 상방으로부터 상기 함몰부에 끼워 상기 함몰부를 마감하는 단계;(h) closing the recessed part by inserting the block cap into the recessed part from above to be in close contact with the upper surface of the microchip;
    를 포함하여 구성되는 필름 레이어 부품소자의 제조방법.Method of manufacturing a film layer component device comprising a.
  6. 청구항 5에 있어서,The method according to claim 5,
    상기 단계 (e)에서,In step (e) above,
    상기 몰드부와 상기 필름부의 부착은 상기 고정 금형틀과 상기 압착 금형틀에 의한 핫 프레싱으로 이루어지는 것을 특징으로 하는 필름 레이어 부품소자의 제조방법.Attaching the mold portion and the film portion is a method of manufacturing a film layer component element, characterized in that the hot pressing by the fixed mold and the pressing die.
PCT/KR2013/003173 2013-04-15 2013-04-16 Film layer component element and method for manufacturing same WO2014171564A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6404052B1 (en) * 1999-07-12 2002-06-11 Sony Chemicals Corp. Multi-layer flexible printed wiring board
KR100565462B1 (en) * 2003-12-03 2006-03-29 주식회사 비에스이 Holder Kit for directional condenser microphone
KR100931017B1 (en) * 2007-12-05 2009-12-10 티.비텔레콤(주) Chip molding method and chip package parts manufactured by it
KR100931295B1 (en) * 2008-01-24 2009-12-11 세크론 주식회사 Electronic component molding device and electronic component molding method
US20120037939A1 (en) * 2009-04-13 2012-02-16 Youji Urano Light emitting diode

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6404052B1 (en) * 1999-07-12 2002-06-11 Sony Chemicals Corp. Multi-layer flexible printed wiring board
KR100565462B1 (en) * 2003-12-03 2006-03-29 주식회사 비에스이 Holder Kit for directional condenser microphone
KR100931017B1 (en) * 2007-12-05 2009-12-10 티.비텔레콤(주) Chip molding method and chip package parts manufactured by it
KR100931295B1 (en) * 2008-01-24 2009-12-11 세크론 주식회사 Electronic component molding device and electronic component molding method
US20120037939A1 (en) * 2009-04-13 2012-02-16 Youji Urano Light emitting diode

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