WO2014141451A1 - Optical connector apparatus, optical cable apparatus, and optical interconnect apparatus - Google Patents

Optical connector apparatus, optical cable apparatus, and optical interconnect apparatus Download PDF

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Publication number
WO2014141451A1
WO2014141451A1 PCT/JP2013/057289 JP2013057289W WO2014141451A1 WO 2014141451 A1 WO2014141451 A1 WO 2014141451A1 JP 2013057289 W JP2013057289 W JP 2013057289W WO 2014141451 A1 WO2014141451 A1 WO 2014141451A1
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WO
WIPO (PCT)
Prior art keywords
optical
lens structure
connector device
optical connector
optical element
Prior art date
Application number
PCT/JP2013/057289
Other languages
French (fr)
Japanese (ja)
Inventor
俊明 高井
中條　徳男
松嶋　直樹
Original Assignee
株式会社日立製作所
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Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to PCT/JP2013/057289 priority Critical patent/WO2014141451A1/en
Publication of WO2014141451A1 publication Critical patent/WO2014141451A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Definitions

  • the present invention relates to technologies such as optical transmission, optical interconnect, and optical connector device.
  • the transmission speed of various IT devices such as servers, routers, and storage is improving year by year. In the future, for example, 25 gigabits per second is required for the transmission rate. In that case, electrical transmission becomes difficult due to wiring loss, crosstalk, and the like.
  • Responding to difficulties in electrical transmission is divided into board transmission, metal cable transmission, and optical transmission using an optical interconnect, depending on the wiring density, cost, and the like.
  • an optical transmission system such as a packet optical transport system (POTS)
  • POTS packet optical transport system
  • Optical transmission has characteristics such as high speed and low power compared to metal cable transmission and the like.
  • optical interconnect device is mounted on a device to be transmitted and received by optical transmission.
  • the optical interconnect device includes an optical element having a photoelectric conversion function, an optical element driving IC, and an optical connector device connected to an optical waveguide such as an optical fiber, which are mounted on a substrate.
  • the optical connector device includes a lens structure. In the optical interconnect device on the transmission side and the reception side, the optical connector devices are connected by an optical waveguide such as an optical fiber.
  • optical element of the optical interconnect device and the optical waveguide such as an optical fiber are connected by an optical path by the optical connector device.
  • optical alignment relating to the optical path in other words, alignment of the optical axis is performed.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2009-169116
  • Patent Document 2 Japanese Unexamined Patent Application Publication No. 2008-40318
  • Patent Document 3 Japanese Unexamined Patent Application Publication No. 2003-391958
  • Patent Document 1 describes a method based on image recognition regarding an alignment process and alignment means.
  • a lens and an alignment mark or an optical element are image-recognized and aligned by a camera.
  • Patent Document 2 describes a method using a fitting pin with respect to an alignment process and alignment means. In this technique, parts are aligned by inserting a fitting pin into a guide hole.
  • Patent Document 3 describes a method using a silicon optical bench (SiOB) for the alignment process and alignment means.
  • SiOB silicon optical bench
  • the accuracy of the V-groove in SiOB is used to perform high-precision alignment of optical components.
  • an optical element driving IC which is an electrical component or an electronic component
  • an optical element which is an optical component
  • an optical element which is an optical component
  • the optical element driving IC and the substrate on which the optical element is mounted has a configuration in which electrical components and optical components are mixed.
  • the optical element and the optical connector device are basically separated as separate optical components.
  • the optical element on the substrate and the lens structure constituting the optical connector device are connected including optical alignment.
  • the connection step including alignment is a step in which the optical axis of the optical path of the lens structure on the optical connector device side is aligned and connected to the optical axis such as the emission point of the optical element on the substrate.
  • connection process including alignment between the optical element and the optical connector device requires optically high-precision alignment. The reason is to ensure the characteristics of the optical interconnect device including the transmission speed of optical transmission.
  • the alignment accuracy requires, for example, an accuracy that suppresses the deviation of the optical axis to 10 ⁇ m or less.
  • the above connection process has a problem of high cost because it requires optically highly accurate alignment.
  • Optical transmission using an optical interconnect is required to be realized at a cost equivalent to or close to that of electric transmission from the viewpoint of replacement from electric transmission to optical transmission.
  • the process of connecting the optical element and the optical connector device particularly the optically accurate alignment process, occupies a large cost.
  • the optical interconnect device is considered to be applied to various objects, for example, between IT devices, between boards, and between IC chips.
  • the viewpoint of maintenance and exchangeability of devices and parts such as optical connector devices is also important.
  • an optical element that is an optical component mounted on a substrate of an optical interconnect device fails or when the optical element is inspected, it is desirable that maintenance and replacement work be easy and low cost.
  • the configuration of the optical interconnect device described above is a configuration in which electrical components and optical components are mixed, and the optical element and the optical connector device are separate optical components. There is.
  • Representative embodiments of the present invention are an optical connector device, an optical cable device, and an optical interconnect device, and have the following configuration.
  • the optical connector device of the present embodiment constitutes an optical path between an optical element and an optical waveguide, and has an optical waveguide connection portion to which an end portion of the optical waveguide is connected, and a concave structure, Mounted in the concave portion of the lens structure, the wiring portion formed on the lens structure, and electrically connected to the optical element and an external substrate wiring portion. And the optical element aligned with the optical axis.
  • the concave portion of the lens structure is provided on a first surface which is a surface mounted on an external substrate in the lens structure, and the optical element is a surface-emitting type.
  • the light emitting element has a first surface including an emission point of surface light emission disposed on a bottom surface of the concave portion of the lens structure, and the lens structure changes the direction of the emitted light in the optical path from the first direction to the second direction.
  • a light bending portion to be bent, and an optical path in the lens structure is between a first point of the concave portion corresponding to an emission point of surface light emission of the optical element and a second point which is a bending point of the light bending portion.
  • An optical connector device comprising: a first optical path portion in the first direction; and a second optical path portion in the second direction between the second point and a third point of the optical waveguide connection portion.
  • the lens structure is disposed between the concave portion and the optical waveguide connection portion, and enters the light emitted from the optical element to the end of the optical waveguide.
  • a first lens that increases the amount of incident light is included.
  • the concave portion of the lens structure is provided on a second surface that is upright with respect to a first surface that is a surface mounted on an external substrate in the lens structure
  • the optical element is a surface-emitting light-emitting element
  • a first surface including an emission point of surface emission is disposed on the bottom surface of the concave portion of the lens structure
  • the optical path in the lens structure is An optical connector device including an optical path portion between a first point of the concave portion corresponding to an emission point of surface light emission of the optical element and a second point of the optical waveguide connection portion.
  • the concave portion of the lens structure is provided on the second surface opposite to the first surface that is the surface mounted on the external substrate in the lens structure.
  • the optical element is an edge-emitting type light-emitting element, a first surface including an emission point of end-surface light emission is disposed toward a side surface of the concave portion of the lens structure, and the wiring portion is the lens structure.
  • the optical path in the lens structure is connected to the first point of the recess corresponding to the emission point of the end surface light emission of the optical element and the optical waveguide connection.
  • the optical connector apparatus containing the optical path part between the 2nd points of a part.
  • the optical element is a light emitting element that converts an electrical signal input through the wiring portion into an optical signal and emits the optical signal to the optical path of the lens structure.
  • the optical element is a light receiving element that converts an optical signal incident from an optical path of the lens structure into an electrical signal and outputs the electrical signal through the wiring portion.
  • the optical cable device includes the first optical connector device and the second optical connector device according to any one of the optical connector devices described above, and the optical waveguide connection portion of the lens structure of the first optical connector device. A first end portion connected to the optical waveguide connecting portion of the lens structure of the second optical connector device; and a second end portion connected to the optical waveguide connecting portion.
  • An optical interconnect device includes any one of the optical connector devices described above, a circuit unit for driving an optical element of the optical connector device, and a substrate on which the circuit unit and the optical connector device are mounted. And a board wiring portion that is formed on the substrate and electrically connects the circuit portion and the wiring portion connected to the optical element of the optical connector device.
  • an optical interconnect device for an optical interconnect device, an optical connector device, and the like, a connection process including alignment between an optical element and an optical connector device, and a manufacturing process including the process are realized at low cost.
  • an optical interconnect device and an optical connector device can be realized at low cost.
  • FIG. 3 is a diagram illustrating a configuration of an XZ section after connection of a transmission-side optical interconnect device according to the first embodiment.
  • FIG. 3 is a diagram illustrating a configuration of an XZ section after connection of the optical interconnect device on the reception side according to the first embodiment.
  • FIG. 5 is a diagram illustrating a flow example of a method for manufacturing the optical interconnect device according to the first embodiment. It is a figure which shows the structure of the XZ cross section of the optical connector apparatus of Embodiment 1.
  • FIG. It is a figure which shows the structure of the XZ cross section of the state before the connection of the components at the time of manufacture of the optical connector apparatus of Embodiment 1.
  • FIG. (A) And (b) is a figure which shows the structural example of the surface emitting optical element in the optical connector apparatus of Embodiment 1.
  • FIG. 3 is a diagram illustrating a configuration example relating to mechanical connection of the optical connector device of the optical interconnect device according to the first embodiment. It is a figure which shows the 2nd structural example of the optical interconnect system to which the optical interconnect apparatus of Embodiment 1 is applied.
  • FIG. 3 is a diagram illustrating a first configuration example in the XY plane of the optical connector device according to the first embodiment. It is a figure which shows the 2nd structural example in XY plane of the optical connector apparatus of Embodiment 1.
  • FIG. It is a figure which shows the structure of the XZ cross section of the optical connector apparatus of the optical interconnect apparatus of Embodiment 2 of this invention.
  • FIG. 4 shows the structure of the XZ cross section of the optical interconnect apparatus of Embodiment 4 of this invention. It is a figure which shows the structure of the XZ cross section of the optical connector apparatus of Embodiment 4.
  • FIG. It is a figure which shows the structure of the XZ cross section of the state before the connection of the optical connector apparatus of Embodiment 4.
  • FIG. It is a figure which shows the structure of the XZ cross section of the optical interconnect apparatus of Embodiment 5 of this invention. It is a figure which shows the structure of the XZ cross section of the optical connector apparatus of Embodiment 5.
  • FIG. It is a figure which shows the structure of the XZ cross section of the state before the connection of the optical connector apparatus of Embodiment 5.
  • FIG. It is a figure which shows the structure of the XZ cross section of the optical connector apparatus of the optical interconnect apparatus of Embodiment 6 of this invention. It is a figure which shows the structure of the XZ cross section before the connection of the optical interconnect apparatus of a comparative example. It is a figure which shows the structure of the XZ cross section after the connection of the optical interconnect apparatus of a comparative example.
  • FIG. 29 shows a state before connection between the optical element 925 and the optical connector device 920 as a configuration of the XZ cross section of the optical interconnect device of the comparative example. Specifically, the alignment between the optical axis of the optical element 925 mounted on the package substrate 911 in the electronic circuit board 910 and the optical axis of the optical path of the lens structure 921 which is a main body constituting the optical connector device 920 is adjusted. The state corresponding to the process of connection C0 including is shown.
  • the optical interconnect device of the comparative example has a configuration in which an electronic circuit board 910 including an optical element 925 and an optical connector device 920 are connected.
  • the optical connector device 920 is mainly configured by a lens structure 921, and an end of an optical fiber portion 933 serving as an optical waveguide is connected to a part of the lens structure 921. In the optical interconnect device on the transmission side and the reception side, the optical connector device 920 is connected by an optical fiber portion 933.
  • the electronic circuit board 910 has a configuration in which electrical components and optical components are mixed.
  • an optical element driving IC 915, an optical element 925, and the like are mounted on the package substrate 911 via electrical wiring 912.
  • the optical element 925 is an optical element having a photoelectric conversion function, for example, a light emitting element corresponding to a transmission function.
  • a point p0 of the optical element 925 indicates a light emission point.
  • the optical element driving IC 915 is a driving IC that is an integrated circuit unit that drives the optical element 925.
  • the wiring 912 includes a wiring that electrically connects the optical element driving IC 915 and the optical element 925.
  • the optical element 925 of the optical interconnect device and the optical waveguide formed by the optical fiber portion 933 are connected by an optical path configured in the lens structure 921 of the optical connector device 920.
  • the optical path of the lens structure 921 is that the optical path portion in the Z direction from the point p1 to the point p2 on the optical axis in the Z direction perpendicular to the substrate surface indicated by the line AA and the substrate surface indicated by the line BB.
  • the lens structure 921 has a point p1 to which the point p0 on the upper surface of the optical element 925 is connected on the bottom surface f1 that is a flat XY plane on the side mounted on the package substrate 911.
  • the point p1 of the lens structure 921 corresponds to the position of the point p0 of the optical element 925 at the time of connection C0 on the optical axis of the line AA.
  • the point p1 is an incident point from the optical element 925.
  • the point p2 of the lens structure 921 indicates a bending point at which 90-degree total reflection of light is performed at a 45-degree inclined surface between the X direction and the Z direction shown in the drawing.
  • the 45-degree inclined surface portion of the lens structure 921 is configured by a mirror or the like having a characteristic of performing 90-degree total reflection of light.
  • the point p3 of the lens structure 921 indicates a point corresponding to the optical axis of the core of the optical fiber indicated by the BB line on the surface of the YZ plane to which the end of the optical fiber portion 933 is connected. In other words, the point p3 is an incident point to the optical fiber portion 933.
  • connection C0 including alignment between the optical element 925 on the package substrate 911 and the lens structure 921 of the optical connector device 920.
  • connection C0 including this alignment optical alignment related to the optical path, in other words, alignment of the optical axis is performed. That is, the point p0 of the optical element 925 and the point p1 of the lens structure 921 are connected on the optical axis of the line AA.
  • the alignment accuracy is required to be high, for example, to suppress the deviation between the points p0 and p1 on the optical axis of the AA line to 10 ⁇ m or less.
  • FIG. 30 shows a state after the connection C0 between the optical element 925 on the electronic circuit board 910 side and the lens structure 921 on the optical connector device 920 side in the optical interconnect device of the comparative example of FIG.
  • a heat sink 917 is mounted on the optical element driving IC 915.
  • the optical connector device 920 is mounted on the optical element 925 on the package substrate 911.
  • FIG. 30 only the state where the upper surface of the optical element 925 and the bottom surface f1 of the lens structure 921 are in contact with each other is shown as a state of connection of the optical connector device 920 to the electronic circuit board 910.
  • This form of connection actually has not only the location of the optical element 925 but also a site that is mechanically connected and held on the package substrate 911 at another site of the optical connector device 920, such as a peripheral edge. It is good also as a form.
  • light emitted in the Z direction from the emission point p0 of the optical element 925 that is a light emitting element is an optical path portion from the point p1 to the point p2 of the lens structure 921. Is totally reflected 90 degrees on the surface in the vicinity of the point p2, and changes to emitted light in the X direction. The emitted light enters the core at the end of the optical fiber portion 933 via the optical path portion from the point p2 to the point p3.
  • the outline of the optical transmission operation of data from the first optical interconnect device on the transmission side to the second optical interconnect device on the reception side in the optical interconnect system using the optical interconnect device of the comparative example is as follows.
  • the first optical interconnect device on the transmission side converts an electrical signal of transmission data into an optical signal by the optical element 925 based on control by the optical element driving IC 915.
  • the transmission-side optical interconnect device emits the optical signal from the optical element 925 to the optical waveguide formed by the optical fiber unit 933 through the optical path formed by the optical connector device 920.
  • the optical waveguide formed by the optical fiber unit 933 transmits an optical signal.
  • the optical interconnect device on the receiving side enters the optical signal from the optical waveguide by the optical fiber portion 933 into the optical element 925 through the optical path by the optical connector device 920.
  • the optical interconnect device on the receiving side converts the optical signal into an electrical signal by the optical element 920 based on the control of the optical element driving IC 915.
  • the optical element driving IC 915 of the optical interconnect device on the receiving side acquires an electrical signal from the optical element 925 as reception data.
  • the optical element driving IC 915 that is an electrical component and the optical element 925 that is an optical component are mixed. Further, the optical element 925 and the optical connector device 920 are basically separated as separate optical components. The process of connection C0 including the alignment of the optical element 925 and the optical connector device 920 is expensive because it requires optically highly accurate alignment.
  • the configuration is a mixture of electrical components and optical components or separation of optical components, for example, when an optical element 925 that is an optical component on the package substrate 911 fails, or when the optical element 925 is inspected, Its maintainability is not so good. That is, since the process of connection C0 including alignment is required again in the optical element 925 and the optical connector device 920, the cost is high.
  • FIG. 1 shows an XZ cross-sectional configuration of the state before the electronic circuit board 10 and the optical connector device 20 are connected as an outline of the optical interconnect device 1 and the optical connector device 20 of the first embodiment.
  • the optical interconnect device 1 according to the first embodiment includes an electronic circuit board 10 on which an optical element driving IC 15 is mounted via a wiring 12 on a package substrate 11, and an optical connector apparatus in which an optical element 25 is built in a lens structure 21. 20.
  • it has a configuration in which the optical element 25 is mounted in the concave portion 26 of the lens structure 21 constituting the optical connector device 20.
  • the optical element 25 is mounted in the concave portion 26 of the lens structure 21 via the wiring 22. At the time of mounting, alignment between the optical element 25 and the optical path of the lens structure 21 on the optical axis indicated by the line AA is completed.
  • the optical connector device 20 is mainly composed of a lens structure 21, and an end portion of an optical fiber portion 33 serving as an optical waveguide is connected to an optical fiber connection portion 23 that is a part of the lens structure 21.
  • the optical connector devices 20 are connected by an optical fiber portion 33.
  • a portion including the optical connector device 20 and the optical waveguide such as the optical fiber portion 33 is referred to as an optical cable device 30 described later.
  • the optical interconnect device 1 includes an optical element 925, which is another optical component in the optical interconnect device of the comparative example of FIG. 29, and the lens structure 921 of the optical connector device 920, as one integrated optical component.
  • the optical connector device 20 is an integrated configuration. In other words, the optical connector device 20 can be handled as a single integrated optical component that is optically coupled to the optical element 25 and ensures alignment accuracy.
  • the optical interconnect device 1 of the first embodiment has a configuration in which the optical connector device 20 that is an optical component and the electronic circuit board 10 that is an electrical component are clearly separated. This simplifies the connection process including alignment in the comparative example, and reduces the connection process including alignment that occupies a large cost in the manufacturing process. By reducing the cost of the connection process including alignment, the optical interconnect device 1 can be configured at a low cost, and the optical interconnect device 1 having excellent maintenance and replaceability can be provided.
  • connection C2 between the electronic circuit board 10 and the optical connector device 20 the wiring 12 of the optical connector device 20 in which the optical element 25 is incorporated is electrically connected to the wiring 12 at a predetermined position on the package substrate 11.
  • the optical element driving IC 15 and the optical element 25 are electrically connected through the wiring 22 and the wiring 12.
  • the optical interconnect device 1 on which the optical connector device 20 is mounted is configured. Since the electrical component and the optical component are clearly separated as described above, the connection C2 of the optical connector device 20 on the package substrate 11 is not optically high precision as in the comparative example, The connection accuracy can be achieved.
  • various known techniques can be applied, and it is easy and low-cost.
  • FIG. 2 shows an example of a system and apparatus to which the optical interconnect device 1 according to the first embodiment is applied.
  • FIG. 2A shows an IT system 300 that is an application target system.
  • the IT system 300 has a configuration in which a plurality of IT devices 301 are connected via a network such as a LAN.
  • the IT device 301 is a server rack, for example.
  • the IT device 301 includes one or more board modules 302.
  • FIG. 2B shows a configuration example of the board module 302 of the IT equipment 301 in FIG.
  • a plurality of substrates 303 such as blade substrates are connected to each other via a backplane substrate 304.
  • Each substrate 303 mounts a plurality of chips 305 and the like, and the plurality of chips 305 are connected to each other by a bus or the like.
  • the chip 305 is an IC chip that includes a processor, a memory, and the like.
  • the first chip 305 of the first substrate 303 and the second chip 305 of the second substrate 303 are connected via the backplane substrate 304, and communication including transmission a and reception b of electrical signals is performed. An example is shown.
  • the optical interconnect there are the IT devices 301 in FIG. 2A, the substrate modules 302, the substrates 303 in FIG. 2B, or the chips 305.
  • the optical interconnect device 1 of the first embodiment or the like is mounted on each target substrate 303.
  • the optical interconnect devices 1 on the board 303 are connected by an optical cable device 30 having both ends of the optical connector device 20.
  • FIG. 3 shows a configuration example of functional blocks of an optical interconnect system including the optical interconnect device 1.
  • the optical interconnect system of FIG. 3 shows a configuration example in which two optical interconnect devices 1 having a configuration capable of transmitting and receiving light in one direction are connected by an optical cable device 30.
  • the first optical interconnect device 1A on the left side has only the transmission function 2A
  • the second optical interconnect device 1B on the right side has only the reception function 2B.
  • the optical interconnect device 1A can transmit light in one direction from the optical interconnect device 1B.
  • An example of the physical configuration of the transmission-side optical interconnect device 1A is shown in FIG.
  • a physical configuration example of the optical interconnect device 1B on the receiving side is shown in FIG.
  • the optical interconnect device 1A on the transmission side and the optical interconnect device 1B on the reception side have an optical element driving IC 15 and an optical connector device 20, respectively.
  • the optical cable device 30 includes an optical connector device 20 at one end that is a transmission side, an optical connector device 20 at the other end that is a reception side, and an optical fiber portion 33 that connects both ends, particularly one optical fiber. And a fiber portion 33A.
  • the transmission-side optical interconnect device 1A includes a transmission-side optical element driving IC 15A and a transmission-side optical connector device 20A connected thereto as the transmission function 2A.
  • the transmission-side optical connector device 20A includes a VCSEL, which is a vertical-resonance surface-emitting optical element shown in FIG. 10 described later, as a light-emitting element that is the transmission-side optical element 25A.
  • the transmission-side optical element driving IC 15A is a VCSEL driver that drives a VCSEL that is the optical element 25A of the transmission-side optical connector device 20A.
  • the receiving-side optical interconnect device 1B includes a receiving-side optical element driving IC 15B and a receiving-side optical connector device 20B as the receiving function 2B.
  • the reception-side optical connector device 20B includes a photodiode (abbreviated as PD) as a light-receiving element that is the reception-side optical element 25B.
  • the receiving side optical element driving IC 15B is a trans-impedance amplifier (TIA) that drives the PD that is the optical element 25B of the receiving side optical connector apparatus 20B.
  • TIA trans-impedance amplifier
  • the transmission side optical element driving IC 15A transmits the electrical signal of the transmission data through the wiring 12 and the wiring 22 as in the case of transmission a1.
  • the VCSEL which is the optical element 25A of the transmission side optical connector device 25A is driven.
  • the optical element 25A converts an electrical signal into an optical signal and emits it.
  • the optical signal is incident on the end portion of the optical fiber portion 33A through the optical path of the transmission side optical connector device 20A.
  • the optical fiber unit 33 of the optical cable device 30 transmits an optical signal.
  • the optical interconnect device 1B on the reception side enters the optical signal from the optical fiber portion 33A into the optical connector device 25B on the reception side.
  • the optical signal enters the optical element 25B through the optical path of the receiving side optical connector device 25B.
  • the PD which is the optical element 25B of the receiving side optical connector device 25B is driven.
  • the PD which is the optical element 25B, converts an optical signal into an electrical signal and receives it.
  • An electrical signal from the PD, which is the optical element 25B is transmitted to the reception-side optical element driving IC 15B through the wiring 22 and the wiring 12.
  • the reception-side optical element driving IC 15B acquires an electrical signal from the optical element 25B as reception data.
  • FIG. 4 shows a configuration example of the optical cable device 30 according to the first embodiment.
  • the optical cable device 30 is a cable with an optical connector.
  • FIG. 4A shows an optical cable device 30 corresponding to a configuration capable of optical transmission in one direction in FIG.
  • the optical cable device 30 has two optical connector devices 20 as both ends and an optical fiber portion 33 that connects them.
  • the optical connector device 20 at one end is a transmission side optical connector device 20A corresponding to the transmission function 2A
  • the optical connector device 20 at the other end is a reception side optical connector device 20B corresponding to the reception function 2B.
  • the optical fiber portion 33 is configured by an optical fiber and a protective coating 34 on the outside thereof as a cross-sectional structure.
  • the optical fiber of the optical fiber portion 33 has an outer cladding 31 and an inner core 32.
  • FIG. 5 shows a configuration of an XZ cross section before connection of the transmission-side optical interconnect device 1A of the first embodiment.
  • the optical interconnect device 1A has a VCSEL driver as the transmission side optical element driving IC 15A
  • the transmission side optical connector device 20A has a VCSEL as a light emitting element as the transmission side optical element 25A.
  • a shows the emitted light from the optical element 25 ⁇ / b> A to the optical fiber portion 33.
  • the package substrate 11 of the electronic circuit substrate 10 is mounted on the target substrate 50 via, for example, solder balls 51.
  • the electronic circuit board 10 is mainly mounted on the package board 11, the wiring 12 formed on the package board 11, the transmission side optical element driving IC 15A connected via the wiring 12, and the transmission side optical element driving IC 15A. And a heat sink 17.
  • the transmission side optical element driving IC 15 ⁇ / b> A is mounted on the wiring 12 of the package substrate 11 via, for example, solder balls 13.
  • the electronic circuit board 10 shows a portion excluding the optical connector device 20 that is an optical component, and is configured as an electrical component.
  • the transmission side optical connector device 20A has the same configuration as that of FIG.
  • the transmission-side optical connector device 20A includes a lens structure 21 as a main body, a transmission-side optical element 25A mounted in a recess of the lens structure 21, and a metal formed in the lens structure 21 and connected to the optical element 25A. And an end portion of the optical fiber portion 33 is connected.
  • the package substrate 11 is an organic substrate, and an electrical wiring 12 made of metal is formed on the main surface.
  • the wiring 12 on the package substrate 11 includes a wiring formed to extend from a wiring connected to the transmission-side optical element driving IC 15A to a predetermined position on the right side in the X direction.
  • the wiring 22 made of metal formed on the optical connector device 20 side is electrically connected in the Z direction to the wiring 12 at the predetermined position, that is, the connection position of the optical connector device 20.
  • Receiveiver side optical interconnect device 6 shows an XZ cross-sectional configuration of the receiving-side optical interconnect device 1B of the first embodiment.
  • the reception-side optical interconnect device 1B has a TIA as the reception-side optical element driving IC 15B, and has a PD that is a light-receiving element as the reception-side optical element 25B of the reception-side optical connector device 20B.
  • b shows the incident light from the optical fiber part 33 to the optical element 25B.
  • the optical signal incident on the point p3 of the lens structure 21 from the end of the optical fiber portion 33 travels along the optical path portion to the left in the X direction from the point p3, and is 90 degrees around the point p2 of the 45 degree mirror 24. Reflected and changed to light in the Z direction. Then, the incident light travels along the optical path portion downward from the point p2 in the Z direction, and is incident on the optical element 25B via the point p1 of the recess.
  • the optical element 25B which is a PD, converts an optical signal into an electrical signal and outputs it.
  • the optical element driving IC 15B which is a TIA, impedance-converts and amplifies the current signal received from the optical element 25B through the wiring 22 and the wiring 12, and acquires it as a voltage signal.
  • FIG. 7 shows an example of a manufacturing flow of the optical interconnect device 1 of the first embodiment.
  • S1 etc. show a process.
  • the lens structure 21 is manufactured or prepared.
  • the optical element 25 is manufactured or prepared.
  • the optical fiber portion 33 is manufactured or prepared.
  • step S4 the lens structure 21 in step S1 and the optical element 25 in step S2 are connected while optically aligned.
  • Step S4 corresponds to connection C1 including alignment shown in FIG. 9 described later.
  • the wiring 22 is formed over the concave portion 26 of the bottom surface f1 of the lens structure 21 and a part of the bottom surface f1.
  • step S4 for example, using a manufacturing apparatus such as a chip mounter, the electrode structure on the upper surface of the optical element 25 is connected to the concave portion 26 of the lens structure 21 via the wiring 22.
  • step S4 When mounting, alignment is performed so that the point p0 of the optical element 25, the point p1 of the concave portion 26 of the lens structure 21, and the point p2 of the 45-degree mirror 24 are aligned on the optical axis of the AA line. Is done. Thereby, the optical element 25 and the lens structure 21 are optically coupled.
  • the connection C2 including alignment in step S4 is realized with the mounting accuracy of a manufacturing apparatus such as a chip mounter to be used. As the required alignment accuracy, for example, a high accuracy for keeping the deviation in the optical axis to 10 ⁇ m or less is ensured.
  • step S4 the optical connector device 20 including the optical element 25 is obtained.
  • the alignment in step S4 is a method different from the conventional passive alignment.
  • step S5 the optical fiber connection portion 23 in the optical connector device 20 incorporating the optical element 25 obtained in step S4 and the end of the optical fiber portion 33 in step S3 are connected while optically aligned. To do.
  • the optical fiber core 32 at the end of the optical fiber portion 33 is It is connected while optically aligning. Connection including alignment in the optical fiber connection portion 23 is possible by various known techniques.
  • step S6 the electronic circuit board 10 is manufactured or prepared.
  • the wiring 12 is formed on the package substrate 11, and the optical element driving IC 15 and the like are mounted via the wiring 12, whereby the electronic circuit substrate 10 is obtained.
  • step S7 the optical connector device 20 in which the optical element 25 obtained in step S5 is mounted and the optical fiber portion 33 is connected is mounted on the package substrate 11 of the electronic circuit board 10 obtained in step S6.
  • Step S7 corresponds to connection C2 in FIG.
  • the manufacturing apparatus is used to electrically connect the wiring 22 on the bottom surface f ⁇ b> 1 side of the lens structure 21 to the wiring 12 at a predetermined position on the package substrate 11.
  • the optical element 25 and the optical element driving IC 15 are electrically connected through the wiring 12 and the wiring 22.
  • step S7 mechanical connection of the optical connector device 20 onto the package substrate 11 may be performed separately from the electrical connection, as in the example shown in FIG.
  • step S7 the optical interconnect device 1 to which the optical connector device 20 is connected is obtained. Note that step S7 may be performed at the time of setup or maintenance replacement, not at the time of manufacture, depending on the application target.
  • step S7 and connection C2 Various known techniques can be applied to the means for electrically connecting the wiring 22 on the optical connector device 20 side to the wiring 12 on the package substrate 11 in step S7 and connection C2.
  • solder connection, connection through a layer of silver paste or the like, or connection using an anisotropic conductive film (ACF) can be applied.
  • connection by a spring connector or the like can be applied as in the fourth embodiment described later.
  • step S7 and connection C2 when an ACF is used, the ACF is connected between the wiring 12 on the package substrate 11 side and the wiring 22 on the bottom surface f1 on the optical connector device 20 side.
  • the optical connector device 20 incorporating the optical element 25 has been aligned with high accuracy in step S4, so that it is handled as an optical component that ensures optical coupling and predetermined optical accuracy. Can do. Therefore, the mounting of the optical connector device 20 on the package substrate 11 in the step S7 can be performed easily and at low cost not with optical accuracy but with electrical accuracy.
  • the connection including optical alignment in step S4 is easier and less expensive than the connection C0 including alignment in FIG. 29 of the comparative example. That is, the optical interconnect device 1 can be provided at a low cost.
  • the optical connector device 20 including the optical element 25 can be replaced. At the time of the replacement, it is only necessary to remove the optical connector device 20 from the package substrate 11 and attach a new optical connector device 20 by electrical connection C2. That is, the optical interconnect device 1 according to the first embodiment has high maintenance and exchangeability.
  • FIG. 8 shows a state after the optical element 25 is built in as an XZ cross-sectional configuration of the optical connector device 20 of the first embodiment.
  • the configuration of the optical path and the like will be described in detail with reference to FIG.
  • FIG. 8 shows a case where a VCSEL which is the optical element 25A on the transmission side is used as the optical element 25.
  • the upper surface on the upper side in the Z direction is a light emitting surface, and a point p0 on the upper surface indicates an emission point. Details of the VCSEL which is the optical element 25 are shown in FIG.
  • the lens structure 21 is made of a material such as glass or plastic.
  • the optical fiber connection portion 23 which is a part of the lens structure 21 has a shape for connecting the end portion of the optical fiber portion 33.
  • the optical fiber connection portion 23 is provided as a region corresponding to the shape of the optical fiber portion 33 at the right side in the X direction and the upper side in the Z direction of the lens structure 21 and includes the YZ including the point p3. Includes a plane.
  • the surface of the end portion of the optical fiber portion 33 is connected to the surface including the point p3 of the optical fiber connection portion 23 including optical alignment on the optical axis of the BB line.
  • the point p3 of the optical fiber connection portion 23 of the lens structure 21 is a point aligned with the optical axis of the core 32 at the end of the optical fiber portion 33, and is an exit point from the lens structure 21 to the optical fiber portion 33.
  • a concave portion 26 is provided on a bottom surface f1 which is an XY plane on the lens structure 21 on the side mounted on the package substrate 11.
  • the concave portion 26 is an optical element built-in portion, and is a concave region having a depth in the Z direction upward on the bottom surface f1 of the flat XY plane of the lens structure 21.
  • the recess 26 is an optical element built-in portion.
  • the shape of the recess 26 is designed in accordance with the shape of the optical element 25. For example, when the optical element 25 has a cylindrical shape as shown in FIG. 10 described later, the concave portion 26 also has a cylindrical shape.
  • the depth of the recess in the Z direction of the recess 26 is larger than the height of the optical element 25 in the Z direction.
  • a point p ⁇ b> 1 of the recess 26 is a center point for mounting the optical element 25.
  • the optical element 25 is mounted in the concave portion 26 on the bottom surface f1 of the lens structure 21 via the wiring 12.
  • the bottom surface of the concave portion 26 in the Z direction is an XY plane parallel to the bottom surface f1 of the lens structure 21.
  • the optical element 25 is mounted such that the top surface including the surface emission point p ⁇ b> 0 is parallel to the XY plane that is the bottom surface of the recess 26.
  • the X direction and the Y direction are directions parallel to the substrate surface such as the package substrate 11 and the bottom surface f1 of the lens structure 21.
  • the optical element 25 mounted in the concave portion 26 is accommodated in the region of the concave portion 26 and does not protrude outward from the bottom surface f1 of the lens structure 21 in the Z direction.
  • the wiring 22 formed on the optical connector device 20 side is formed over the bottom and side surfaces of the concave portion 26 of the lens structure 21 and a partial region of the bottom surface f1 of the lens structure 21.
  • an electrode terminal at the peripheral edge of the upper surface of the optical element 25 is electrically connected to one end portion of the wiring 22 formed on the bottom surface of the recess 26.
  • the other end of the wiring 22 is formed to extend to a predetermined position on the bottom surface f ⁇ b> 1 around the concave portion 26 of the lens structure 21 via the side surface of the concave portion 26. 1, the exposed wiring 22 around the recess 26 in the bottom surface f1 of the lens structure 21 and the wiring 12 on the package substrate 11 corresponding to the position of the wiring 22 in the X direction and the Y direction. Are electrically connected.
  • the lens structure 21 has a 45-degree mirror 24 that is a light bending means at a 45-degree inclined surface between the X direction and the Z direction shown in the figure as one of the elements constituting the optical path.
  • the lens structure 21 forms an optical path that bends 90 degrees in the Z direction and the X direction.
  • the lens structure 21 has a 45-degree mirror 24 as a light bending means.
  • the 45 degree mirror 24 has a characteristic of totally reflecting light at 90 degrees inside the lens structure 21.
  • the 45 degree mirror 24 reflects light from the Z direction in the X direction in the vicinity of the point p2.
  • Point p2 is a perpendicular intersection of the optical axis in the Z direction of the AA line and the optical axis in the X direction of the BB line, and is a bending point of the optical path, and is a reflection point of the 45 ° mirror 24. It is.
  • Examples of the form of the 45-degree mirror 24 of the lens structure 21 include a form in which a metal film, a dielectric multilayer film, or the like is formed at the 45-degree slope portion of the lens structure 21.
  • the 45-degree mirror 24 of the lens structure 21 is shaped like a right-angle prism, that is, a triangular prism having a 45-degree right-angled isosceles triangle in the region including the 45-degree slope of the lens structure 21.
  • a prism or the like is provided.
  • the lens structure 21 constitutes an optical path connecting the optical element 15 and the end of the optical fiber portion 33.
  • the optical path formed in the lens structure 21 is a 45-degree mirror from the point p1 of the concave portion 26 corresponding to the point p0 on the upper surface of the optical element 25 on the optical axis of the AA line, upward in the Z direction perpendicular to the substrate surface.
  • a straight optical path portion from the point p2 of the 45-degree mirror 24 to the point p3 of the optical fiber connection portion 23 to the right in the X direction parallel to the substrate surface.
  • the light emitted in the Z direction from the point p 0 on the upper surface of the optical element 25 enters the lens structure 21 from the position of the point p 1 of the recess 26.
  • the light from the point p1 is reflected near the point p2 of the 45 degree mirror 24 and becomes light in the X direction.
  • Light from the point p ⁇ b> 2 enters the core 32 at the end of the optical fiber portion 33 from the point p ⁇ b> 3 of the optical fiber connection portion 23. Thereafter, the emitted light is optically transmitted through the optical fiber unit 33 and is incident on the optical connector device 20 of the optical interconnect device 1 on the receiving side.
  • the optical connector device 20 in the optical interconnect device 1 of the first embodiment is mounted so that the optical element 25 is built in the concave portion 26 of the bottom surface f1 of the lens structure 21.
  • the optical element 925 protrudes in the Z direction with respect to the flat bottom surface f1 of the lens structure 921. Therefore, in the optical interconnect device 1 of the first embodiment, the overall shape of the optical connector device 20 on which the optical element 25 is mounted is compact, and the process of mounting the optical connector device 20 on the package substrate 11 is facilitated.
  • the overall shape of the optical interconnect device 1 on which the optical connector device 20 is mounted particularly the height in the Z direction, can be made compact.
  • FIG. 9 is an XZ cross-sectional view of the optical connector device 20 of the optical interconnect device 1 according to the first embodiment, corresponding to step S4 of FIGS. 8 and 7, in a state before the connection between the lens structure 21 and the optical element 25.
  • the configuration is shown.
  • the connection C1 including alignment indicates a state in which the optical element 25 is mounted via the wiring 22 with respect to the concave portion 26 of the lens structure 21 on the optical axis of the AA line in the Z direction.
  • the concave portion 26 is located on the upper side with the lens structure 21 facing downward in the Z direction, contrary to the state shown in FIG.
  • the optical element 25 is mounted in the recess 26 from the upper side in the Z direction.
  • the wiring 22 is formed in the area
  • FIG. 10 shows a configuration of a VCSEL which is a vertical resonance surface emitting optical element used as the optical element 25 of the optical connector device 20 according to the first embodiment, particularly as the transmitting optical device 25A in the transmitting optical connector device 20A.
  • a VCSEL Very Cavity Surface Emitting Laser
  • the optical element 25A in FIG. 10 shows a case of a cylindrical shape and a case where there is one emission region including the emission point p0.
  • FIG. 10A shows an outline of an XZ section of a VCSEL which is the optical element 25A on the transmission side.
  • s1 indicates a light emitting surface which is the upper surface of the optical element 25A.
  • the surface-emitting optical element 25A emits light a in the Z direction from the emission point p0 by resonating in the Z direction perpendicular to the substrate surface on the light emitting surface s1 in the XY direction parallel to the substrate surface. Is emitted.
  • An emission region including the emission point p0 is provided at the center position in the X direction of the light emitting surface s1.
  • s2 represents an active layer or emission part inside the optical element 25A.
  • s3 indicates the electrode terminal of the optical element 25 or its position.
  • the aforementioned wiring 22 is connected to the electrode terminal s3.
  • FIG. 10B shows an outline on the XY plane on the upper surface of the optical element 25A in FIG.
  • An emission region including one emission point p0 is provided at the circular center of the light emitting surface s1.
  • an electrode terminal s3 is provided on the outer periphery of the circular upper surface of the optical element 25.
  • FIG. 11 shows a configuration of an optical element 25Ab that is a modification of the VCSEL that is the optical element 25A on the transmission side.
  • the optical element 25Ab in FIG. 11 is a rectangular parallelepiped shape, and shows a case where the emission point p0 has a plurality of emission regions in an array.
  • FIG. 11A shows an outline of the XZ section of the optical element 25Ab.
  • the light emitting surface s1 on the upper surface of the optical element 25A has an emission region including a plurality of emission points p0.
  • FIG. 11B shows an outline of the XY plane of the upper surface of the optical element 25Ab. In the rectangle of the light emitting surface s1, a plurality of emission regions s4 including the emission point p0 are arranged in a two-dimensional array.
  • FIG. 12 shows an outline of an XZ cross section of an example of the configuration of mechanical connection between the optical connector device 20 and the package substrate 11 in step S7 and connection C2, as a modification of the optical interconnect device 1 of the first embodiment.
  • FIG. 12 shows a state in which the lens structure 21 is detachably mechanically connected to the package substrate 11 separately from the electrical connection shown in FIG.
  • maintenance part 121 which is a means to hold is shown.
  • the holding unit 121 is provided at a predetermined position on the package substrate 11 so as to correspond to a predetermined portion of the lens structure 21, for example, the position of the outer peripheral portion such as the four corners, on the XY plane. At the time of the above-described connection C2, predetermined locations such as the four corners of the lens structure 21 of the optical connector device 20 are mounted and held on the holding portion 121 on the package substrate 11 in the Z direction.
  • the holding part 121 can be a structure made of, for example, a resin material. Further, the holding unit 12 is not limited to the configuration of FIG. 12, and various means such as screwing can be applied.
  • FIG. 13 shows a configuration example of functional blocks of an optical interconnect system including the optical interconnect device 1.
  • FIG. 13 shows a configuration example in which two optical interconnect devices 1C having a configuration capable of bidirectional transmission and reception are connected by an optical cable device 30 as a second configuration example of the optical interconnect system.
  • the two optical interconnect devices 1C each have both the transmission function 2A and the reception function 2B.
  • the elements constituting the transmission function 2A and the reception function 2B are the same as the elements in FIG.
  • the first optical interconnect device 1 ⁇ / b> C on the left side includes a transmission-side optical element drive IC 15 ⁇ / b> A and a reception-side optical element drive IC 15 ⁇ / b> B as the optical element drive IC 15, and the transmission-side optical connector device 20 ⁇ / b> A and the reception-side light as the optical connector device 15.
  • a connector device 20B is provided.
  • the transmitting side optical element driving IC 15A and the receiving side optical element driving IC 15B are connected by a wiring 12 so as to be communicable.
  • Examples of the mounting form of the optical interconnect device 1C include a form in which the components of the transmission function 2A and the components of the reception function 2B are mounted in parallel in the Y direction on the XY plane of the package substrate 11 described above. .
  • the transmission side optical connector device 20 ⁇ / b> A and the reception side optical connector device 20 ⁇ / b> B may be configured to be mounted in common on one lens structure 21 as in the example of FIG. 14 described later. .
  • the transmission side optical connector device 20A of the first optical interconnect device 1C on the left side is connected to the reception side optical connector device 20B of the second optical interconnect device 1C on the right side by an optical fiber portion 33A.
  • the transmission side optical connector device 20A of the second optical interconnect device 1C on the right side is connected to the reception side optical connector device 20B of the first optical interconnect device 1C on the left side by an optical fiber portion 33B.
  • the optical fiber portion 33A and the optical fiber portion 33B in the optical cable device 30 may be composed of two separate optical fibers as in the example of FIG. 14 described later, or one common optical fiber. It may be constituted by.
  • FIG. 4B shows the optical cable device 30 corresponding to the configuration capable of bidirectional optical transmission in FIG.
  • the optical cable device 30 has two optical connector devices 20 having both the transmission function 2A and the reception function 2B as both ends, and an optical fiber portion 33 that connects them.
  • the optical fiber section 33 in FIG. 4B has a configuration in which the transmission-side optical fiber section 33A and the reception-side optical fiber section 33B are shared as one optical fiber section 33.
  • FIG. 14 shows an outline of the configuration of the XY plane as a mounting configuration example of the optical connector device 20 and the like of the optical interconnect device 1C of FIG.
  • the configuration of the XY plane in FIG. 14 roughly corresponds to the configuration of the XZ cross section in FIG.
  • the shapes of the optical element 25A, the optical element 25B, and the recess in the XY plane are shown by rectangles corresponding to FIG. 11 in FIG. 14, but as described above, the circular shape of FIG. Various shapes are possible.
  • FIG. 14 shows an optical connector device 20Ca that is a first configuration example of the XY plane of the optical connector device 20.
  • the optical connector device 20Ca integrates the above-described transmission-side optical connector device 20A and the reception-side optical connector device 20B in one lens structure 21, and is provided as a transmission-side optical connector portion 20a and a reception-side optical connector portion 20b.
  • the transmitting optical element 25A and the receiving optical element 25B are arranged in parallel in the Y direction.
  • the transmitting optical element 25A is mounted in the concave portion of the transmitting-side optical connector portion 20a in the lens structure 21, and the receiving optical element 25B is mounted in the concave portion of the receiving-side optical connector portion 20b.
  • the optical element driving IC 15A and the optical element 25A are connected by the wiring 12 in the X direction.
  • the optical element 25A and the transmission optical fiber portion 33A are linearly arranged and connected in the X direction.
  • a shows the emitted light from the optical element 25A.
  • the optical element driving IC 15B and the optical element 25B are connected by the wiring 12 in the X direction.
  • the optical element 25B and the receiving optical fiber portion 33B are linearly arranged and connected in the X direction.
  • b shows the incident light to the optical element 25B.
  • FIG. 15 shows an optical connector device 20Cb which is a second configuration example of the XY plane of the optical connector device 20, which is different from FIG.
  • the optical connector device 20 ⁇ / b> Cb further has a configuration in which the transmission optical fiber portion 33 ⁇ / b> A and the reception optical fiber portion 33 ⁇ / b> B are shared as one optical fiber portion 33.
  • the optical connector device 20Cb corresponds to the common configuration of the optical fiber portion 33, and in the lens structure 21, a common optical unit that shares a part of the optical path on the transmission side and a part of the optical path on the reception side. It has a system part 151.
  • the common optical system 151 includes, for example, an end portion of the optical fiber portion 33 in which the optical path in the X direction of the optical axis of the BB line in the outgoing light a from the optical element 25A on the transmission side is different in the Y direction. Is bent from the optical axis in the X direction toward the Y direction in the direction of minus 45 degrees. Then, the common optical system unit 151 bends the light by plus 45 degrees so that the optical path in the minus 45 degree direction returns to the optical axis in the X direction again at the position of the end of the optical fiber part 33. . Regarding the incident light b to the optical element 25B on the receiving side, the direction of the optical path is changed by the common optical system 151 as described above.
  • the optical connector device 20 may have a configuration in which a plurality of optical elements 25 are arranged in parallel in the Y direction or the like in a single lens structure 21 and are built in the same manner as described above.
  • the configuration of the optical element 25, the wiring 22, and the concave portion 26 of the lens structure 21 in Embodiment 1 is not limited to the configuration described above, and various modifications as described below are possible.
  • the shapes of the concave portions 26 and the wirings 22 of the lens structure 21 are designed according to the shape of the components of the optical element 25 used for mounting.
  • FIG. 16 shows a first modification related to mounting of the optical element 25 in the recess 26 of the lens structure 21.
  • the optical element 25 in FIG. 16 has a shape of a two-stage cylinder in the Z direction, not a simple cylinder shape with a fixed radius. That is, the optical element 25 of FIG. 16 has two types of widths a1 and a2 as widths on the XY plane. The width a1 in the XY direction on the upper surface side having the light emitting surface s1 is smaller than the width a2 on the lower surface side.
  • the concave portion 26 of the lens structure 21 has a shape having a width of two steps corresponding to the shape of the optical element 25.
  • FIG. 16 shows a case where the electrode terminal s3 of the optical element 25 is provided, for example, on the outer peripheral portion of the upper surface of the lower cylindrical portion.
  • the wiring 22 is formed in the first-stage recess in the recess 26, and the wiring 22 is connected to the electrode terminal s3.
  • FIG. 16 shows a case where the lower surface of the optical element 25 and the bottom surface f1 of the lens structure 21 are substantially at the same height in the Z direction.
  • FIG. 17 shows a second modification regarding the mounting of the optical element 25 in the concave portion 26 of the lens structure 21.
  • the optical element 25 in FIG. 17 has an electrode terminal s3 on the side surface.
  • the wiring 22 is formed over the side surface of the concave portion 26 of the lens structure 21 and a part of the bottom surface f1 of the lens structure 21.
  • the optical element 25 is mounted on the bottom surface of the recess 26, and the wiring 22 formed on the side surface of the recess 26 is connected to the electrode terminal s3 on the side surface of the optical element 25.
  • FIG. 17 shows a case where the lower surface of the optical element 25 and the bottom surface f1 of the lens structure 21 are substantially at the same height in the Z direction.
  • FIG. 18 shows a third modification regarding the mounting of the optical element 25 in the recess 26 of the lens structure 21.
  • the optical element 25 in FIG. 18 has an electrode terminal s3 on the outer peripheral portion on the lower side opposite to the upper surface having the light emitting surface s1.
  • the wiring 22 is first formed over a part of the side surface of the concave portion 26 of the lens structure 21 and a part of the bottom surface f1 of the lens structure 21.
  • the optical element 25 is mounted on the bottom surface of the concave portion 26, and the portion extending in the Z direction of the electrode terminal s 3 on the lower surface side of the optical element 25 is connected to the wiring 22 on the side surface of the concave portion 26 of the lens structure 21. Is done.
  • the depth of the recess 26 in the Z direction is larger than the height of the optical element 25 in the Z direction.
  • the optical interconnect device 1 and the optical connector device 20 As described above, according to the optical interconnect device 1 and the optical connector device 20 according to the first embodiment, the electronic circuit board 10 that is an electrical component and the optical connector device 20 that is an optical component are clearly separated. Therefore, the cost of the connection process including alignment between the optical element 915 of the comparative example and the lens structure 921 of the optical connector device 920 and the manufacturing process including the process can be reduced. Thereby, the optical interconnect device 1 and the optical connector device 20 can be provided at low cost.
  • the optical connector device 20 as an integrated optical component incorporating the optical element 25 and the connection C2 between the electronic circuit board 10 and the optical connector device 20 are electrical connections and easy. Therefore, it is easy to replace the optical element 25, and the maintenance and replaceability of the optical interconnect device 1 and the optical connector device 20 is excellent.
  • the optical interconnect device 1 according to the second embodiment will be described with reference to FIG.
  • the second embodiment is based on the configuration of the optical interconnect device 1 of the first embodiment.
  • the lens structure 21 of the optical connector device 20D has a plano-convex lens 27.
  • the second embodiment will be described in the case of the optical interconnect device 1A on the transmission side.
  • FIG. 19 shows an XZ cross-sectional configuration of the optical connector device 20D in the optical interconnect device 1 of the second embodiment.
  • the lens structure 21 has a plano-convex lens 27 at the position of the point p1 of the recess 26 corresponding to the emission point p0 of the optical element 25 on the optical axis of the AA line.
  • the plano-convex lens 27 is a condenser lens.
  • the plane side of the plano-convex lens 27 is disposed on the bottom surface of the recess 26, and the center point of the plane coincides with the point p 1 of the recess 26.
  • the convex surface side of the plano-convex lens 27 is disposed on the inner side of the lens structure 21 and in the upward direction in the Z direction.
  • the focal point of the plano-convex lens 27 exists on the optical axis of the AA line.
  • the outgoing light from the point p0 of the optical element 25 is incident from the point p1 on the plane side of the plano-convex lens 27 on the optical axis of the line AA. Emits from the convex side. Light emitted from the plano-convex lens 27 in the Z direction is totally reflected by 90 degrees near the point p2 of the 45 degree mirror 24, and becomes light in the X direction. On the optical axis of the BB line, light in the X direction from the point p2 enters the core at the end of the optical fiber portion 33 from the point p3 of the optical fiber connection portion 23.
  • the outgoing light a in the optical path of the lens structure 21 of the second embodiment has a light width and an area that are reduced by the action of the plano-convex lens 27 as a condenser lens.
  • the width h1 in the X direction of the optical path portion in the Z direction and the width h2 in the Y direction of the optical path portion in the X direction in the optical path of the lens structure 21 in the second embodiment are the same in the optical path of the lens structure 21 in the first embodiment. It becomes narrower than the width of the part.
  • the plano-convex lens 27 is provided in the middle of the optical path portion in the Z direction from the point p1 to the point p2.
  • a plano-convex lens 27 may be provided in the middle of the optical path portion in the X direction to the point p3.
  • the direction of the light is reversed as in the case of the incident light b in FIG. 6 described above, and accordingly, the direction of the plano-convex lens 27 is reversed to the lens structure 21 accordingly. It is sufficient to adopt the form provided as above.
  • the optical interconnect device 1 according to the third embodiment will be described with reference to FIG.
  • the third embodiment is based on the configuration of the optical interconnect device 1 of the first embodiment.
  • an optical element is provided in the concave portion 26 of the lens structure 21 of the optical connector device 20E.
  • 26 has a lid portion 28 on the lower side in the Z direction.
  • FIG. 20 shows a configuration of an XZ cross section of the optical connector device 20E in the optical interconnect device 1 of the third embodiment.
  • the optical element 25 is mounted in the concave portion 26 of the lens structure 21 via the wiring 22.
  • the lid portion 28 is further mounted close to the lower side of the concave portion 26 in the Z direction of the optical element 25.
  • the height of the lid portion 28 is designed according to the depth of the concave portion 26 and the height of the optical element 25 in the Z direction so that the bottom surface f1 of the lens structure 21 is flat except for the wiring 22.
  • the lid portion 28 in the lens structure 21 may be fixed to the optical element 25 or may be fixed to the side surface of the lens structure 21 or the like.
  • the optical element 25 has no portion exposed to the outside at the bottom surface f ⁇ b> 1 of the lens structure 21.
  • the bottom surface f ⁇ b> 1 of the lens structure 21 is a substantially flat XY plane including the lid portion 301 except for the portion of the wiring 22 connected to the wiring 12 on the package substrate 11 side. Only a part of the wiring 22 is exposed to the outside on the flat bottom surface f1 of the lens structure 21.
  • the lid portion 28 may be made of the same material as the lens structure 21 or may be made of another material. That is, the lid 28 may be included as a part of the lens structure 21, or the lid 28 may be provided as a separate component from the lens structure 21.
  • the lid 28 may have a structure that can be attached to and detached from the lens structure 21. Further, the lid portion 28 may be configured to be fixed in contact with the optical element 25 in the concave portion 26. In this case, the position of the optical element 25 in the recess 26 and the optical axis retainability are enhanced.
  • the optical interconnect device 1 according to the fourth embodiment will be described with reference to FIGS.
  • a concave portion 26 is provided on the side surface of the lens structure 21, and a surface emitting optical element 25 is mounted on the concave portion 26 on the side surface. Constitutes a linear optical path in the X direction.
  • the fourth embodiment uses a press-fit spring connector as means for electrical and mechanical connection between the optical connector device 20 and the package substrate 11.
  • the optical interconnect device 1F according to the fourth embodiment will be described in the case of the optical interconnect device 1A on the transmission side.
  • FIG. 21 shows an XZ cross-sectional configuration of the optical interconnect device 1F of the fourth embodiment.
  • the optical interconnect device 1F mounts a transmission side optical element drive IC 15A and an optical connector device 20F, which is the transmission side optical connector device 20B, on the package substrate 11 via the wiring 12.
  • the optical connector device 20F is electrically and mechanically connected to the package substrate 11 using a press-fit spring connector.
  • the wire 22 on the optical connector device 20F side is connected to a pin 41 of a spring connector as a connection portion.
  • the wiring 12 on the package substrate 11 side is formed with a spring connector socket 42 as a connecting portion.
  • the pins 41 on the optical connector device 20F side are inserted into the sockets 42 on the package substrate 11 side in the Z direction, which is the direction perpendicular to the substrate surface. Then, the wiring 12 and the wiring 22 are electrically connected and fixed.
  • the pin 41 is press-fitted into the socket 42, the elastic portion of the pin 41 is deformed and contacts the inner surface of the socket 42. Thereby, the optical element driving IC 15 and the optical element 25 are electrically connected through the wiring 12 and the wiring 22. Further, when the optical connector device 20 ⁇ / b> F is removed from the package substrate 11, the pins 41 are removed from the socket 42.
  • FIG. 22 shows an XZ cross-sectional configuration of the optical connector device 20F of the fourth embodiment.
  • the lens structure 21 of the optical connector device 20F according to the fourth embodiment has an optical fiber connection portion 23 on one side surface which is a YZ plane on the right side in the X direction, and the end of the optical fiber portion 33 is connected to the optical fiber connection portion 23. Parts are connected.
  • the point p2 of the lens structure 21 corresponds to the point where the core at the end of the optical fiber portion 33 is connected on the optical axis of the BB line.
  • the lens structure 21 of the optical connector device 20F has a recess 26 on the other side surface f2 which is the YZ plane on the left side in the X direction.
  • the side surface f2 is a surface that stands upright with respect to the bottom surface f1.
  • a surface-emitting optical element 25, particularly a transmitting-side optical element 25 ⁇ / b> A is mounted in the concave portion 26 on the side surface f ⁇ b> 2 of the lens structure 21 via the wiring 22.
  • the upper surface which is the light emitting surface including the point p0 of the optical element 25, is mounted in an arrangement facing the X direction with respect to the bottom surface, which is the YZ plane of the recess 26.
  • the optical path constituted by the lens structure 21 extends from the point p1 on the side surface of the concave portion 26 of the lens structure 21 corresponding to the point p0 on the light emitting surface of the optical element 25 to the point p2 on the optical fiber connection portion 23. It includes a straight optical path in the X direction. That is, the optical path of the lens structure 21 is a linear optical path in the X direction.
  • the outgoing light a in the X direction from the point p0 of the optical element 25A on the transmission side is incident on the core of the optical fiber portion 33 via the points p1 and p2 of the lens structure 21.
  • the wiring 22 is formed to extend from the bottom surface and side surface of the recess 26 to the bottom surface f1 of the lens structure 21 via the side surface f2 of the lens structure 21.
  • the electrode terminals on the outer periphery of the upper surface of the optical element 25 are connected to the wiring 22 on the bottom surface of the recess 26.
  • a pin 41 of a spring connector is connected to the end of the wiring 22 on the bottom surface f1 side.
  • Reference numeral 43 denotes a housing portion for the pin 41 of the spring connector.
  • FIG. 23 shows a configuration of an XZ cross section in a state before connection of the optical connector device 20F of the fourth embodiment, corresponding to FIG.
  • the wiring 22 is formed from the bottom surface of the concave portion 26 of the lens structure 21 to the side surface f2 of the lens structure 21.
  • the optical element 25 is positioned at the point p0 of the optical element 25 and the bottom surface of the concave portion 26 of the lens structure 21 with respect to the lens structure 21 on the optical axis of the BB line in the X direction.
  • the point p1 and the point p2 of the optical fiber connecting portion 33 are connected while being aligned.
  • the optical interconnect device 1F of the fourth embodiment as in the first embodiment and the like, it is possible to reduce the cost of the connection process including alignment, thereby reducing the cost and maintaining and exchanging the optical interconnect device 1F. Etc. can be provided.
  • the connection method between the electronic circuit board 10 and the optical connector device 20 in the fourth embodiment the wiring 12 and the wiring 22 can be connected without soldering.
  • the connection method of the fourth embodiment for example, when replacing the optical connector device 20 due to a failure of the optical element 25, the replacement work can be performed simply by inserting and removing the pin 41 and the socket 42.
  • a condensing unit such as a plano-convex lens is provided between the optical element 25 of the concave portion 26 and the end of the optical fiber portion 33.
  • the amount of light incident on the core may be adjusted.
  • not only the connection method by the spring connector but also the wiring 22 formed to extend to a part of the bottom surface f1 of the lens structure 21 is provided as in the first embodiment, for example.
  • the wiring 22 on the bottom surface f1 may be connected to the wiring 12 on the package substrate 11 side.
  • the optical interconnect device 1D according to the fifth embodiment will be described with reference to FIGS.
  • an optical element of an edge-emitting type different from the above-described surface-emitting type is used as the optical element 25, and a concave portion 26 is provided on the upper surface f3 of the lens structure 21.
  • the optical element 25 is mounted in the concave portion 26 of the upper surface f3, whereby the lens structure 21 forms a linear optical path in the X direction.
  • the optical interconnect device 1G according to the fifth embodiment will be described in the case of the optical interconnect device 1A on the transmission side.
  • FIG. 24 shows an XZ cross-sectional configuration of the optical interconnect device 1G of the fifth embodiment.
  • the optical interconnect device 1G mounts a transmission side optical element driving IC 15A and an optical connector device 20G as the transmission side optical connector device 20B on the package substrate 11 via the wiring 12.
  • the lens structure 21 of the optical connector device 20G is provided with a recess 26 on an upper surface f3 that is an XY plane on the upper side in the Z direction on the side opposite to the bottom surface f1.
  • An edge-emitting optical element 25G is mounted in the recess 26 on the upper surface f3.
  • FIG. 27 described later shows the edge-emitting optical element 25G.
  • the wiring 22 connected to the optical element 25G is formed from the bottom surface of the recess 26 to the bottom surface f1 of the lens structure 21 through the through-hole 63 provided in the lens structure 21.
  • the wiring 22 on the bottom surface f1 of the lens structure 21 is connected to the wiring 12 on the package substrate 11 side.
  • FIG. 25 shows a configuration of an XZ section of the optical connector device 20G of the fifth embodiment.
  • the lens structure 21 of the optical connector device 20G according to the fifth embodiment has the optical fiber connection portion 23 in the region on the right side in the X direction and the upper side in the Z direction, and the end portion of the optical fiber portion 33 is connected to the optical fiber connection portion 23. Is done.
  • the point p2 of the optical fiber connection portion 23 of the lens structure 21 corresponds to the point where the core at the end of the optical fiber portion 33 is connected on the optical axis of the BB line.
  • the lens structure 21 of the optical connector device 20G is provided with a recess 26 on the upper surface f3 that is the XY plane above the Z direction.
  • An edge-emitting optical element 25G in particular, a transmitting-side optical element 25A is mounted on the concave portion 26 of the upper surface f3 of the lens structure 21 via the wiring 22.
  • An end face which is a light emitting surface including the point p0 of the optical element 25G faces the right side in the X direction with respect to the bottom surface which is the XY plane of the recess 26 on the central axis of the mounting in the Z direction indicated by the line AA.
  • the lower surface of 25G is mounted.
  • the wiring 22 is formed to extend from the bottom surface of the recess 26 to a part of the bottom surface f1 of the lens structure 21 through a through hole 63 extending in the Z direction.
  • an electrode terminal on the outer peripheral portion of the lower surface of the optical element 25G is connected to one end portion of the wiring 22 formed through the through hole 63 provided in the bottom surface of the recess 26.
  • the optical path constituted by the lens structure 21 is X from the point p1 on the side surface of the concave portion 26 of the lens structure 21 corresponding to the point p0 on the end face of the optical element 25 to the point p2 on the optical fiber connection portion 23.
  • the optical path of the lens structure 21 is a linear optical path in the X direction.
  • the outgoing light a in the X direction from the point p0 of the optical element 25A on the transmission side is incident on the core of the optical fiber portion 33 via the points p1 and p2 of the lens structure 21.
  • FIG. 26 shows an XZ cross-sectional configuration before connection of the optical connector device 20G of the fifth embodiment, corresponding to FIG.
  • the wiring 22 is formed through the through hole 63 from the bottom surface of the concave portion 26 of the lens structure 21 to the bottom surface f1 of the lens structure 21.
  • the optical element 25G has a central structure on the upper and lower surfaces of the optical element 25G on the central axis of the mounting in the Z direction indicated by the line AA with respect to the lens structure 21, and the lens structure. 21 are connected while being aligned so that the center points of the bottom surfaces of the recesses 26 are aligned.
  • the optical element 25G When mounted, the optical element 25G has a point p0 on the end face of the optical element 25G, a point p1 on the side surface of the concave portion 26 of the lens structure 21, and an optical fiber connection portion on the optical axis in the X direction of the BB line.
  • the connections are made while aligning so that 33 points p2 are aligned.
  • the optical connector device 20G condenses light on the optical axis of the BB line between the concave portion 26 and the optical fiber connecting portion 23 in the lens structure 21.
  • a plano-convex lens 27 serving as a lens may be provided. On the plane side of the plano-convex lens 27, the center point thereof is arranged corresponding to the point 1 of the recess 26. The convex surface side of the plano-convex lens 27 is arranged in the right direction in the X direction.
  • the plano-convex lens 27 receives light emitted from the point p0 of the optical element 25G from the plane side and exits from the convex surface side, and the width h3 or the width of light in the YZ direction in the optical path portion in the X direction on the optical axis of the BB line. Narrow the area. As a result, the amount of light incident on the core at the end of the optical fiber portion 33 is increased.
  • FIG. 27 shows a configuration example of an edge-emitting optical element 25G used as the transmitting-side optical element 25A in the optical connector device 20G of the fifth embodiment.
  • the optical element 25G in FIG. 27 shows a case of a rectangular parallelepiped shape and a case where there is one emission region including the emission point p0.
  • FIG. 27A schematically shows an XZ section of the edge-emitting optical element 25G.
  • s1 indicates an end surface serving as a light emitting surface including the emission point p0, and is a YZ plane perpendicular to the substrate surface on the right side in the X direction.
  • s2 represents an active layer or emission part inside the optical element 25G.
  • FIG. 27B is a perspective view showing the state of the end face s1 of the optical element 25G in FIG.
  • the optical element 25G has an emission region including the emission point p0 at the center position in the Y direction and Z direction of the light emitting surface s1.
  • the optical element 25G emits light a from the emission point p0 in the X direction by resonating in the X direction, which is a direction parallel to the substrate surface, from the emission region on the end surface s1.
  • the cost of the connection process including alignment can be reduced, thereby reducing the cost and maintaining and exchanging the optical interconnect device 1G. Etc. can be provided.
  • the through hole 63 provided in the lens structure 21 is not limited to the Z direction, and may be provided as a through hole extending from the side surface of the recess 26 to the side surface f2 of the lens structure 21 in the X direction.
  • the lens structure 21 may be provided with the wiring 22 routed to the bottom surface f1 via the top surface f3 and the side surface f2 without providing the through hole 63 in the lens structure 21. .
  • the optical interconnect device 1H according to the sixth embodiment will be described with reference to FIG.
  • the sixth embodiment uses an edge-emitting optical element 25G as the optical element 25 in the same manner as in the fifth embodiment, and a concave portion on the bottom surface f1 of the lens structure 21 as in the first embodiment. 26, and the optical element 25G is mounted in the concave portion 26 of the bottom f1, whereby the lens structure 21 forms a linear optical path in the X direction.
  • the optical interconnect device 1H of the sixth embodiment will be described in the case of the optical interconnect device 1A on the transmission side.
  • FIG. 28 shows a configuration of an XZ section of the optical connector device 20H provided in the optical interconnect device 1H of the sixth embodiment.
  • the lens structure 21 of the optical connector device 20H according to the sixth embodiment has the optical fiber connection portion 23 in the X direction right side and Z direction lower side regions, and the end portion of the optical fiber portion 33 is connected to the optical fiber connection portion 23. Connected.
  • the point p2 of the optical fiber connection portion 23 of the lens structure 21 corresponds to the point where the core at the end of the optical fiber portion 33 is connected on the optical axis of the BB line.
  • the lens structure 21 of the optical connector device 20H has a recess 26 on the bottom surface f1.
  • An end surface light emitting type optical element 25G, particularly a transmitting side optical element 25A is mounted in the concave portion 26 of the bottom surface f1 of the lens structure 21 via the wiring 22.
  • the wiring 22 connected to the optical element 25G is formed from the bottom surface of the recess 26 to a predetermined position on the bottom surface f1 of the lens structure 21 via the side surface.
  • an electrode terminal on the outer peripheral portion of the lower surface of the optical element 25G is connected to one end portion of the wiring 22 formed on the bottom surface of the recess 26.
  • the wiring 22 on the bottom surface f1 of the lens structure 21 is connected to the wiring 12 on the package substrate 11 as in the first embodiment.
  • the optical element 25G is placed on the center axis of the mounting in the Z direction indicated by line AA with respect to the bottom surface of the recess 26.
  • the upper surface or the lower surface of the optical element 25G is mounted such that the end surface, which is the light emitting surface including the point p0, faces right in the X direction.
  • the optical element 25G is located at the center point of the upper and lower surfaces of the optical element 25G and the bottom surface of the concave portion 26 of the lens structure 21 with respect to the lens structure 21 in the Z-axis mounting center axis indicated by the line AA.
  • the optical element 25G When mounted, the optical element 25G has a point p0 on the end face of the optical element 25G, a point p1 on the side surface of the concave portion 26 of the lens structure 21, and an optical fiber connection portion on the optical axis in the X direction of the BB line. The connections are made while aligning so that 33 points p2 are aligned.
  • the optical path constituted by the lens structure 21 is X from the point p1 on the side surface of the concave portion 26 of the lens structure 21 corresponding to the point p0 on the end face of the optical element 25G to the point p2 on the optical fiber connection portion 23.
  • the optical path of the lens structure 21 is a linear optical path in the X direction.
  • the outgoing light a in the X direction from the point p0 of the optical element 25A on the transmission side is incident on the core of the optical fiber portion 33 via the points p1 and p2 of the lens structure 21.
  • the cost of the connection process including alignment can be reduced, thereby reducing the cost and maintaining and exchanging the optical interconnect device 1H. Etc. can be provided.
  • a condensing lens is provided between the optical element 25 and the optical fiber connecting portion 23 in the lens structure 21 and on the optical axis of the BB line. It is good also as a form which provided the plano-convex lens which works as.
  • Optical fiber connection part 24 ... 45 degree mirror, 25, 25A, 25B ...
  • Optical element, 26 ... Recessed part, 27 ... Plano-convex lens, 28 ... Lid, 30 ...
  • Optical cable device 31 ... Cladding, 32 ... Core, 33 ...
  • Optical fiber part 41 ... Pin, 42 ... Socket, 50 Board, 51 ... solder balls.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

Provided is a technology of achieving an optical interconnect apparatus and an optical connector apparatus, which have low cost and excellent maintainability and replaceability. An optical connector apparatus (20) provided in an optical interconnect apparatus (1) has: a lens structural body (21), which constitutes an optical path between an optical element (25) and an optical fiber section (33), and which has a recessed section (26), and an optical fiber connecting section (23) to which an end portion of the optical fiber section (33) is connected; wiring (22), which is formed on the lens structural body (21), and which is electrically connected to the optical element (25) and to wiring (12) of an external package board (11); and the optical element (25), which is mounted in the recessed section (26) of the lens structural body (21), and which has the center thereof aligned with an optical axis of the optical path of the lens structural body (21) when being mounted.

Description

光コネクタ装置、光ケーブル装置、及び光インターコネクト装置Optical connector device, optical cable device, and optical interconnect device
　本発明は、光伝送、光インターコネクト、及び光コネクタ装置などの技術に関する。 The present invention relates to technologies such as optical transmission, optical interconnect, and optical connector device.
　サーバ、ルータ、及びストレージ等の各種のＩＴ機器は、伝送速度が年々向上している。伝送速度は将来的には例えば２５ギガビット毎秒が要求される。その場合、電気伝送は、配線損失やクロストーク等によって困難になる。電気伝送の困難への対応は、配線密度やコスト等の観点により、基板伝送、メタルケーブル伝送、及び光インターコネクトによる光伝送などに分かれる。例えばパケット・オプティカル・トランスポート・システム（ＰＯＴＳ）などの光伝送システムでは、構造上の制約や配線数の多さから、電気伝送では損失低減が困難である。そのため、光インターコネクトの適用が必須になると考えられる。光伝送は、メタルケーブル伝送などに比べて、高速及び低電力などの特性を有する。 The transmission speed of various IT devices such as servers, routers, and storage is improving year by year. In the future, for example, 25 gigabits per second is required for the transmission rate. In that case, electrical transmission becomes difficult due to wiring loss, crosstalk, and the like. Responding to difficulties in electrical transmission is divided into board transmission, metal cable transmission, and optical transmission using an optical interconnect, depending on the wiring density, cost, and the like. For example, in an optical transmission system such as a packet optical transport system (POTS), it is difficult to reduce loss in electrical transmission due to structural limitations and the number of wires. Therefore, application of optical interconnects is considered essential. Optical transmission has characteristics such as high speed and low power compared to metal cable transmission and the like.
　光インターコネクトによる光伝送の適用対象となる部位ないし距離としては、例えば、ＩＴ機器間、基板間、及びＩＣチップ間が挙げられる。光インターコネクトのシステムは、光伝送による送信及び受信の対象となる装置に、光インターコネクト装置が搭載される。 Examples of parts or distances to which optical transmission by the optical interconnect is applied include, for example, between IT devices, between boards, and between IC chips. In an optical interconnect system, an optical interconnect device is mounted on a device to be transmitted and received by optical transmission.
　光インターコネクト装置は、基板上に搭載される、光電変換機能を持つ光素子、光素子駆動ＩＣ、及び光ファイバ等の光導波路に接続される光コネクタ装置などを有する。光コネクタ装置は、レンズ構造体などで構成される。送信側及び受信側の光インターコネクト装置は、光コネクタ装置間が光ファイバ等の光導波路で接続される。 The optical interconnect device includes an optical element having a photoelectric conversion function, an optical element driving IC, and an optical connector device connected to an optical waveguide such as an optical fiber, which are mounted on a substrate. The optical connector device includes a lens structure. In the optical interconnect device on the transmission side and the reception side, the optical connector devices are connected by an optical waveguide such as an optical fiber.
　光インターコネクト装置の光素子と、光ファイバ等の光導波路との間は、光コネクタ装置による光路によって接続される。光インターコネクト装置の製造時、光素子と光コネクタ装置との接続の工程においては、上記光路に関する光学的な調芯、言い換えると光軸の位置合わせ、が行われる。 The optical element of the optical interconnect device and the optical waveguide such as an optical fiber are connected by an optical path by the optical connector device. At the time of manufacturing the optical interconnect device, in the process of connecting the optical element and the optical connector device, optical alignment relating to the optical path, in other words, alignment of the optical axis is performed.
　上記光インターコネクト装置、光コネクタ装置、及び光学的な調芯などに関する先行技術例として、特開２００９－１６９１１６号公報（特許文献１）、特開２００８－４０３１８号公報（特許文献２）、及び特開２００３－３９１９５８号公報（特許文献３）が挙げられる。 As prior art examples relating to the above optical interconnect device, optical connector device, optical alignment, and the like, Japanese Unexamined Patent Application Publication No. 2009-169116 (Patent Document 1), Japanese Unexamined Patent Application Publication No. 2008-40318 (Patent Document 2), and No. 2003-391958 (Patent Document 3).
　特許文献１では、調芯工程及び調芯手段に関して、画像認識による方式について記載されている。この技術では、カメラにより、レンズとアライメントマークまたは光素子とを画像認識して位置合わせを行う。 Patent Document 1 describes a method based on image recognition regarding an alignment process and alignment means. In this technique, a lens and an alignment mark or an optical element are image-recognized and aligned by a camera.
　特許文献２では、調芯工程及び調芯手段に関して、嵌合ピンによる方式について記載されている。この技術では、ガイド孔に嵌合ピンを挿入することにより、部品同士の位置合わせを行う。 Patent Document 2 describes a method using a fitting pin with respect to an alignment process and alignment means. In this technique, parts are aligned by inserting a fitting pin into a guide hole.
　特許文献３では、調芯工程及び調芯手段に関して、シリコン・オプティカル・ベンチ（ＳｉＯＢ）による方式について記載されている。この技術では、ＳｉＯＢにおけるＶ溝の精度を用いて、光部品の高精度な位置合わせを行う。 Patent Document 3 describes a method using a silicon optical bench (SiOB) for the alignment process and alignment means. In this technique, the accuracy of the V-groove in SiOB is used to perform high-precision alignment of optical components.
特開２００９－１６９１１６号公報JP 2009-169116 A 特開２００８－４０３１８号公報JP 2008-40318 A 特開２００３－３９１９５８号公報JP 2003-391958 A
　前述の光インターコネクト装置は、基板上に、電気部品ないし電子部品である光素子駆動ＩＣと、光部品である光素子とが搭載され、光素子駆動ＩＣと光素子とを電気的に接続する配線などが形成されている。上記光素子駆動ＩＣ及び光素子を搭載した基板は、電気部品と光部品とが混在した構成である。また前述の光インターコネクト装置は、光素子と光コネクタ装置とが別の光部品として基本的に分離されている。光インターコネクト装置の製造時またはセットアップ時、基板上の光素子と、光コネクタ装置を構成するレンズ構造体とは、光学的な調芯を含む接続がされる。この調芯を含む接続の工程は、基板上の光素子の出射点などの光軸に対して、光コネクタ装置側のレンズ構造体の光路の光軸を位置合わせして接続する工程である。 In the optical interconnect device described above, an optical element driving IC, which is an electrical component or an electronic component, and an optical element, which is an optical component, are mounted on a substrate and electrically connect the optical element driving IC and the optical element. Etc. are formed. The optical element driving IC and the substrate on which the optical element is mounted has a configuration in which electrical components and optical components are mixed. In the above optical interconnect device, the optical element and the optical connector device are basically separated as separate optical components. At the time of manufacturing or setting up the optical interconnect device, the optical element on the substrate and the lens structure constituting the optical connector device are connected including optical alignment. The connection step including alignment is a step in which the optical axis of the optical path of the lens structure on the optical connector device side is aligned and connected to the optical axis such as the emission point of the optical element on the substrate.
　上記光素子と光コネクタ装置との調芯を含む接続の工程は、光学的に高精度な調芯を必要とする。理由は、光伝送の伝送速度を含む光インターコネクト装置の特性を確保するためである。この調芯の精度は、例えば光軸のズレを１０μｍ以下に抑える精度が必要である。しかしながら、上記接続の工程は、光学的に高精度な調芯が必要であるため、高コストであるという課題がある。 The connection process including alignment between the optical element and the optical connector device requires optically high-precision alignment. The reason is to ensure the characteristics of the optical interconnect device including the transmission speed of optical transmission. The alignment accuracy requires, for example, an accuracy that suppresses the deviation of the optical axis to 10 μm or less. However, the above connection process has a problem of high cost because it requires optically highly accurate alignment.
　光インターコネクトによる光伝送は、電気伝送から光伝送への置き換え等の観点から、電気伝送と同等の又は近いコストで実現することが求められる。従来の光インターコネクト装置の製造プロセスでは、上記光素子と光コネクタ装置との接続の工程、特に光学的に高精度な調芯の工程が、大きなコストを占める。光インターコネクト装置などを低コストで実現するためには、上記調芯を含む接続の工程を低コスト化することが必要である。 Optical transmission using an optical interconnect is required to be realized at a cost equivalent to or close to that of electric transmission from the viewpoint of replacement from electric transmission to optical transmission. In the manufacturing process of the conventional optical interconnect device, the process of connecting the optical element and the optical connector device, particularly the optically accurate alignment process, occupies a large cost. In order to realize an optical interconnect device or the like at a low cost, it is necessary to reduce the cost of the connection process including the alignment.
　また上記調芯を含む接続の工程の低コスト化だけでなく、光インターコネクト装置を各種対象、例えばＩＴ機器間、基板間、及びＩＣチップ間などへ適用することを考慮した場合、光インターコネクト装置及び光コネクタ装置などの装置や部品の保守交換性の観点も重要である。例えば光インターコネクト装置の基板上に搭載される光部品である光素子が故障した際や、光素子を点検する際などに、その保守交換の作業が容易で低コストであることが望ましい。しかしながら、前述の光インターコネクト装置の構成は、電気部品と光部品とが混在した構成であり、光素子と光コネクタ装置とが別の光部品であること等から、保守交換性の観点では改善余地がある。 In addition to the cost reduction of the connection process including the alignment, the optical interconnect device is considered to be applied to various objects, for example, between IT devices, between boards, and between IC chips. The viewpoint of maintenance and exchangeability of devices and parts such as optical connector devices is also important. For example, when an optical element that is an optical component mounted on a substrate of an optical interconnect device fails or when the optical element is inspected, it is desirable that maintenance and replacement work be easy and low cost. However, the configuration of the optical interconnect device described above is a configuration in which electrical components and optical components are mixed, and the optical element and the optical connector device are separate optical components. There is.
　なお前述の光インターコネクト装置などに関する先行技術例は、調芯工程及び調芯手段として、アクティブ調芯あるいはパッシブ調芯が可能となるように、画像認識、嵌合ピン、あるいはＳｉＯＢ等が用いられている。しかしながら、上記調芯工程及び調芯手段は、アクティブ調芯とパッシブ調芯のいずれにしても、設備や使用部品が高コストである課題や、製造プロセスの手間が大きく高コストである課題がある。特許文献１の技術では、画像認識のための設備投資が必要である。特許文献２の技術では、ガイド孔の位置やサイズに関して高精度が必要であり部品コストが高い。特許文献３の技術では、ＳｉＯＢ自体のコストが高い。 In the prior art examples relating to the optical interconnect device described above, image recognition, fitting pins, or SiOB are used as the alignment process and alignment means so that active alignment or passive alignment is possible. Yes. However, the alignment process and the alignment means have a problem that the cost of equipment and parts used is high, and a problem that the manufacturing process is large and expensive, regardless of whether it is active alignment or passive alignment. . The technique of Patent Document 1 requires capital investment for image recognition. In the technique of Patent Document 2, high accuracy is required with respect to the position and size of the guide hole, and the component cost is high. In the technique of Patent Document 3, the cost of SiOB itself is high.
　本発明の目的は、上記光インターコネクト装置及び光コネクタ装置などに関して、光素子と光コネクタ装置との調芯を含む接続の工程、及び当該工程を含む製造プロセスを低コストで実現でき、光インターコネクト装置及び光コネクタ装置などを低コストで実現できる技術を提供することである。本発明の他の目的は、光インターコネクト装置及び光コネクタ装置などに関する保守交換性を高くすることができる技術を提供することである。 An object of the present invention is to provide an optical interconnect device, an optical connector device, and the like that can realize a connection process including alignment between an optical element and an optical connector device and a manufacturing process including the step at low cost. And a technology capable of realizing an optical connector device and the like at a low cost. Another object of the present invention is to provide a technique capable of improving maintenance and exchangeability related to an optical interconnect device and an optical connector device.
　本発明のうち代表的な形態は、光コネクタ装置、光ケーブル装置、及び光インターコネクト装置であって、以下に示す構成を有することを特徴とする。 Representative embodiments of the present invention are an optical connector device, an optical cable device, and an optical interconnect device, and have the following configuration.
　（１）本形態の光コネクタ装置は、光素子と光導波路との間の光路を構成し、前記光導波路の端部が接続される光導波路接続部、及び凹部を有する、レンズ構造体と、前記レンズ構造体に形成され、前記光素子、及び外部の基板配線部に対して電気的に接続される、配線部と、前記レンズ構造体の凹部に搭載され、当該搭載の際に前記光路の光軸に調芯されている、前記光素子と、を有する。 (1) The optical connector device of the present embodiment constitutes an optical path between an optical element and an optical waveguide, and has an optical waveguide connection portion to which an end portion of the optical waveguide is connected, and a concave structure, Mounted in the concave portion of the lens structure, the wiring portion formed on the lens structure, and electrically connected to the optical element and an external substrate wiring portion. And the optical element aligned with the optical axis.
　（２）本形態の光コネクタ装置において、前記レンズ構造体の凹部は、前記レンズ構造体における外部の基板に搭載される面である第１面に設けられ、前記光素子は、面発光型の発光素子であり、面発光の出射点を含む第１面が前記レンズ構造体の凹部の底面に配置され、前記レンズ構造体は、前記光路における出射光の方向を第１方向から第２方向へ屈曲させる光屈曲部を含み、前記レンズ構造体における光路は、前記光素子の面発光の出射点に対応した前記凹部の第１点と前記光屈曲部の屈曲点である第２点との間の前記第１方向への第１光路部と、前記第２点と前記光導波路接続部の第３点との間の前記第２方向への第２光路部と、を含む、光コネクタ装置。 (2) In the optical connector device of the present embodiment, the concave portion of the lens structure is provided on a first surface which is a surface mounted on an external substrate in the lens structure, and the optical element is a surface-emitting type. The light emitting element has a first surface including an emission point of surface light emission disposed on a bottom surface of the concave portion of the lens structure, and the lens structure changes the direction of the emitted light in the optical path from the first direction to the second direction. A light bending portion to be bent, and an optical path in the lens structure is between a first point of the concave portion corresponding to an emission point of surface light emission of the optical element and a second point which is a bending point of the light bending portion. An optical connector device comprising: a first optical path portion in the first direction; and a second optical path portion in the second direction between the second point and a third point of the optical waveguide connection portion.
　（３）本形態の光コネクタ装置において、前記レンズ構造体は、前記凹部と前記光導波路接続部との間に配置され、前記光素子からの出射光を入射して前記光導波路の端部へ入射される光量を大きくする、第１レンズを含む。 (3) In the optical connector device according to the present embodiment, the lens structure is disposed between the concave portion and the optical waveguide connection portion, and enters the light emitted from the optical element to the end of the optical waveguide. A first lens that increases the amount of incident light is included.
　（４）本形態の光コネクタ装置において、前記レンズ構造体の凹部は、前記レンズ構造体における外部の基板に搭載される面である第１面に対して直立する第２面に設けられ、前記光素子は、面発光型の発光素子であり、面発光の出射点を含む第１面が前記レンズ構造体の凹部の底面に配置され、前記レンズ構造体は、前記レンズ構造体における光路は、前記光素子の面発光の出射点に対応した前記凹部の第１点と前記光導波路接続部の第２点との間の光路部を含む、光コネクタ装置。 (4) In the optical connector device of the present embodiment, the concave portion of the lens structure is provided on a second surface that is upright with respect to a first surface that is a surface mounted on an external substrate in the lens structure, The optical element is a surface-emitting light-emitting element, and a first surface including an emission point of surface emission is disposed on the bottom surface of the concave portion of the lens structure, and the optical path in the lens structure is An optical connector device including an optical path portion between a first point of the concave portion corresponding to an emission point of surface light emission of the optical element and a second point of the optical waveguide connection portion.
　（５）本形態の光コネクタ装置において、前記レンズ構造体の凹部は、前記レンズ構造体における前記外部の基板に搭載される面である第１面に対して反対側である第２面に設けられ、前記光素子は、端面発光型の発光素子であり、端面発光の出射点を含む第１面が前記レンズ構造体の凹部の側面に向いて配置され、前記配線部は、前記レンズ構造体の凹部から前記レンズ構造体の第１面までの貫通孔を通じて設けられ、前記レンズ構造体における光路は、前記光素子の端面発光の出射点に対応した前記凹部の第１点と前記光導波路接続部の第２点との間の光路部を含む、光コネクタ装置。 (5) In the optical connector device of the present embodiment, the concave portion of the lens structure is provided on the second surface opposite to the first surface that is the surface mounted on the external substrate in the lens structure. The optical element is an edge-emitting type light-emitting element, a first surface including an emission point of end-surface light emission is disposed toward a side surface of the concave portion of the lens structure, and the wiring portion is the lens structure. The optical path in the lens structure is connected to the first point of the recess corresponding to the emission point of the end surface light emission of the optical element and the optical waveguide connection. The optical connector apparatus containing the optical path part between the 2nd points of a part.
　（６）本形態の光コネクタ装置において、前記光素子は、前記配線部を通じて入力される電気信号を光信号に変換して前記レンズ構造体の光路へ出射する発光素子である。 (6) In the optical connector device of the present embodiment, the optical element is a light emitting element that converts an electrical signal input through the wiring portion into an optical signal and emits the optical signal to the optical path of the lens structure.
　（７）本形態の光コネクタ装置において、前記光素子は、前記レンズ構造体の光路から入射される光信号を電気信号に変換して前記配線部を通じて出力する受光素子である。 (7) In the optical connector device of the present embodiment, the optical element is a light receiving element that converts an optical signal incident from an optical path of the lens structure into an electrical signal and outputs the electrical signal through the wiring portion.
　（８）本形態の光ケーブル装置は、上記のいずれかの光コネクタ装置による第１光コネクタ装置及び第２光コネクタ装置と、前記第１光コネクタ装置の前記レンズ構造体の前記光導波路接続部に第１端部が接続され、前記第２光コネクタ装置の前記レンズ構造体の前記光導波路接続部に第２端部が接続される、前記光導波路と、を有する。 (8) The optical cable device according to the present embodiment includes the first optical connector device and the second optical connector device according to any one of the optical connector devices described above, and the optical waveguide connection portion of the lens structure of the first optical connector device. A first end portion connected to the optical waveguide connecting portion of the lens structure of the second optical connector device; and a second end portion connected to the optical waveguide connecting portion.
　（９）本形態の光インターコネクト装置は、上記のいずれかの光コネクタ装置と、前記光コネクタ装置の光素子を駆動するための回路部と、前記回路部と前記光コネクタ装置とを搭載する基板と、前記基板に形成され前記回路部と前記光コネクタ装置の前記光素子に接続される前記配線部とを電気的に接続する基板配線部と、を有する。 (9) An optical interconnect device according to the present embodiment includes any one of the optical connector devices described above, a circuit unit for driving an optical element of the optical connector device, and a substrate on which the circuit unit and the optical connector device are mounted. And a board wiring portion that is formed on the substrate and electrically connects the circuit portion and the wiring portion connected to the optical element of the optical connector device.
　本発明のうち代表的な形態によれば、光インターコネクト装置及び光コネクタ装置などに関して、光素子と光コネクタ装置との調芯を含む接続の工程、及び当該工程を含む製造プロセスを低コストで実現でき、光インターコネクト装置及び光コネクタ装置などを低コストで実現できる。また本発明のうち代表的な形態によれば、光インターコネクト装置及び光コネクタ装置などに関する保守交換性を高くすることができる。 According to typical embodiments of the present invention, for an optical interconnect device, an optical connector device, and the like, a connection process including alignment between an optical element and an optical connector device, and a manufacturing process including the process are realized at low cost. In addition, an optical interconnect device and an optical connector device can be realized at low cost. In addition, according to the representative embodiment of the present invention, it is possible to improve maintenance and exchangeability regarding the optical interconnect device and the optical connector device.
本発明の実施の形態１の光インターコネクト装置の概要として、接続前のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section before a connection as an outline | summary of the optical interconnect apparatus of Embodiment 1 of this invention. （ａ）及び（ｂ）は、実施の形態１等の光インターコネクト装置を適用する対象となるシステムの構成例を示す図である。(A) And (b) is a figure which shows the structural example of the system used as the object to which the optical interconnect apparatus of Embodiment 1 etc. is applied. 実施の形態１の光インターコネクト装置を適用した光インターコネクトシステムの第１の構成例を示す図である。It is a figure which shows the 1st structural example of the optical interconnect system to which the optical interconnect apparatus of Embodiment 1 is applied. （ａ）及び（ｂ）は、実施の形態１の光ケーブル装置の構成例を示す図である。(A) And (b) is a figure which shows the structural example of the optical cable apparatus of Embodiment 1. FIG. 実施の形態１の送信側の光インターコネクト装置の接続後のＸＺ断面の構成を示す図である。FIG. 3 is a diagram illustrating a configuration of an XZ section after connection of a transmission-side optical interconnect device according to the first embodiment. 実施の形態１の受信側の光インターコネクト装置の接続後のＸＺ断面の構成を示す図である。FIG. 3 is a diagram illustrating a configuration of an XZ section after connection of the optical interconnect device on the reception side according to the first embodiment. 実施の形態１の光インターコネクト装置の製造方法のフロー例を示す図である。FIG. 5 is a diagram illustrating a flow example of a method for manufacturing the optical interconnect device according to the first embodiment. 実施の形態１の光コネクタ装置のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section of the optical connector apparatus of Embodiment 1. FIG. 実施の形態１の光コネクタ装置の製造時における部品の接続前の状態のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section of the state before the connection of the components at the time of manufacture of the optical connector apparatus of Embodiment 1. FIG. （ａ）及び（ｂ）は、実施の形態１の光コネクタ装置における面発光型光素子の構成例を示す図である。(A) And (b) is a figure which shows the structural example of the surface emitting optical element in the optical connector apparatus of Embodiment 1. FIG. （ａ）及び（ｂ）は、実施の形態１の光コネクタ装置における面発光型光素子の変形例を示す図である。(A) And (b) is a figure which shows the modification of the surface emitting type optical element in the optical connector apparatus of Embodiment 1. FIG. 実施の形態１の光インターコネクト装置の光コネクタ装置の機械的な接続に関する構成例を示す図である。FIG. 3 is a diagram illustrating a configuration example relating to mechanical connection of the optical connector device of the optical interconnect device according to the first embodiment. 実施の形態１の光インターコネクト装置を適用した光インターコネクトシステムの第２の構成例を示す図である。It is a figure which shows the 2nd structural example of the optical interconnect system to which the optical interconnect apparatus of Embodiment 1 is applied. 実施の形態１の光コネクタ装置のＸＹ平面における第１の構成例を示す図である。FIG. 3 is a diagram illustrating a first configuration example in the XY plane of the optical connector device according to the first embodiment. 実施の形態１の光コネクタ装置のＸＹ平面における第２の構成例を示す図である。It is a figure which shows the 2nd structural example in XY plane of the optical connector apparatus of Embodiment 1. FIG. 実施の形態１の光コネクタ装置の光素子の搭載に関する第１の変形例を示す図である。It is a figure which shows the 1st modification regarding mounting of the optical element of the optical connector apparatus of Embodiment 1. FIG. 実施の形態１の光コネクタ装置の光素子の搭載に関する第２の変形例を示す図である。It is a figure which shows the 2nd modification regarding mounting of the optical element of the optical connector apparatus of Embodiment 1. FIG. 実施の形態１の光コネクタ装置の光素子の搭載に関する第３の変形例を示す図である。It is a figure which shows the 3rd modification regarding mounting of the optical element of the optical connector apparatus of Embodiment 1. FIG. 本発明の実施の形態２の光インターコネクト装置の光コネクタ装置のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section of the optical connector apparatus of the optical interconnect apparatus of Embodiment 2 of this invention. 本発明の実施の形態３の光インターコネクト装置の光コネクタ装置のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section of the optical connector apparatus of the optical interconnect apparatus of Embodiment 3 of this invention. 本発明の実施の形態４の光インターコネクト装置のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section of the optical interconnect apparatus of Embodiment 4 of this invention. 実施の形態４の光コネクタ装置のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section of the optical connector apparatus of Embodiment 4. FIG. 実施の形態４の光コネクタ装置の接続前の状態のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section of the state before the connection of the optical connector apparatus of Embodiment 4. FIG. 本発明の実施の形態５の光インターコネクト装置のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section of the optical interconnect apparatus of Embodiment 5 of this invention. 実施の形態５の光コネクタ装置のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section of the optical connector apparatus of Embodiment 5. FIG. 実施の形態５の光コネクタ装置の接続前の状態のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section of the state before the connection of the optical connector apparatus of Embodiment 5. FIG. （ａ）及び（ｂ）は、実施の形態５の光コネクタ装置における端面発光型光素子の概要を示す図である。(A) And (b) is a figure which shows the outline | summary of the end surface light emission type | mold optical element in the optical connector apparatus of Embodiment 5. FIG. 本発明の実施の形態６の光インターコネクト装置の光コネクタ装置のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section of the optical connector apparatus of the optical interconnect apparatus of Embodiment 6 of this invention. 比較例の光インターコネクト装置の接続前のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section before the connection of the optical interconnect apparatus of a comparative example. 比較例の光インターコネクト装置の接続後のＸＺ断面の構成を示す図である。It is a figure which shows the structure of the XZ cross section after the connection of the optical interconnect apparatus of a comparative example.
　以下、本発明の実施の形態を図面に基づいて詳細に説明する。なお、実施の形態を説明するための全図において、同一部には原則として同一符号を付し、その繰り返しの説明は省略する。なお説明上、基板面などを構成する方向をＸ方向及びＹ方向とし、その垂直方向をＺ方向とする。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted. For the sake of explanation, the directions constituting the substrate surface and the like are defined as the X direction and the Y direction, and the vertical direction thereof is defined as the Z direction.
　＜比較例＞
　図２９及び図３０を用いて、本実施の形態に対する比較例の光インターコネクト装置の構成について説明する。なお本比較例では、送信機能を有する光インターコネクト装置の例で説明する。 <Comparative example>
A configuration of an optical interconnect device of a comparative example with respect to the present embodiment will be described with reference to FIGS. In this comparative example, an example of an optical interconnect device having a transmission function will be described.
　図２９は、比較例の光インターコネクト装置のＸＺ断面の構成として、光素子９２５と光コネクタ装置９２０との接続前の状態を示す。詳しくは、電子回路基板９１０におけるパッケージ基板９１１上に搭載されている光素子９２５の光軸と、光コネクタ装置９２０を構成する本体であるレンズ構造体９２１の光路の光軸とにおける、調芯を含む接続Ｃ０の工程に対応した状態を示す。 FIG. 29 shows a state before connection between the optical element 925 and the optical connector device 920 as a configuration of the XZ cross section of the optical interconnect device of the comparative example. Specifically, the alignment between the optical axis of the optical element 925 mounted on the package substrate 911 in the electronic circuit board 910 and the optical axis of the optical path of the lens structure 921 which is a main body constituting the optical connector device 920 is adjusted. The state corresponding to the process of connection C0 including is shown.
　光インターコネクトの適用対象装置の基板９５０上に、比較例の光インターコネクト装置を構成する電子回路基板９１０における特にパッケージ基板９１１が搭載される。比較例の光インターコネクト装置は、光素子９２５を含む電子回路基板９１０と、光コネクタ装置９２０とが接続される構成を有する。光コネクタ装置９２０は、主にレンズ構造体９２１で構成され、レンズ構造体９２１の一部に対して光導波路となる光ファイバ部９３３の端部が接続される。送信側及び受信側の光インターコネクト装置は、光コネクタ装置９２０間が光ファイバ部９３３で接続される。 On the substrate 950 of the optical interconnect application target device, in particular, the package substrate 911 in the electronic circuit substrate 910 constituting the optical interconnect device of the comparative example is mounted. The optical interconnect device of the comparative example has a configuration in which an electronic circuit board 910 including an optical element 925 and an optical connector device 920 are connected. The optical connector device 920 is mainly configured by a lens structure 921, and an end of an optical fiber portion 933 serving as an optical waveguide is connected to a part of the lens structure 921. In the optical interconnect device on the transmission side and the reception side, the optical connector device 920 is connected by an optical fiber portion 933.
　電子回路基板９１０は、電気部品と光部品が混在した構成である。電子回路基板９１０は、パッケージ基板９１１上に、電気的な配線９１２を介して、光素子駆動ＩＣ９１５、光素子９２５などが搭載される。光素子９２５は、光電変換機能を持つ光素子であり、例えば送信機能に対応した発光素子である。光素子９２５の点ｐ０は光の出射点を示す。光素子駆動ＩＣ９１５は、光素子９２５を駆動する集積回路部である駆動ＩＣである。配線９１２は、光素子駆動ＩＣ９１５と光素子９２５とを電気的に接続する配線を含む。 The electronic circuit board 910 has a configuration in which electrical components and optical components are mixed. On the electronic circuit board 910, an optical element driving IC 915, an optical element 925, and the like are mounted on the package substrate 911 via electrical wiring 912. The optical element 925 is an optical element having a photoelectric conversion function, for example, a light emitting element corresponding to a transmission function. A point p0 of the optical element 925 indicates a light emission point. The optical element driving IC 915 is a driving IC that is an integrated circuit unit that drives the optical element 925. The wiring 912 includes a wiring that electrically connects the optical element driving IC 915 and the optical element 925.
　光インターコネクト装置の光素子９２５と、光ファイバ部９３３による光導波路との間は、光コネクタ装置９２０のレンズ構造体９２１に構成される光路によって接続される。このレンズ構造体９２１の光路は、Ａ－Ａ線で示す基板面垂直なＺ方向の光軸における、点ｐ１から点ｐ２までのＺ方向の直線の光路部と、Ｂ－Ｂ線で示す基板面平行なＸ方向の光軸における、点ｐ２から点ｐ３までのＸ方向の直線の光路部とを有する。 The optical element 925 of the optical interconnect device and the optical waveguide formed by the optical fiber portion 933 are connected by an optical path configured in the lens structure 921 of the optical connector device 920. The optical path of the lens structure 921 is that the optical path portion in the Z direction from the point p1 to the point p2 on the optical axis in the Z direction perpendicular to the substrate surface indicated by the line AA and the substrate surface indicated by the line BB. And a straight optical path portion in the X direction from the point p2 to the point p3 on the parallel optical axis in the X direction.
　レンズ構造体９２１は、パッケージ基板９１１上に搭載される側の平坦なＸＹ平面である底面ｆ１において、光素子９２５の上面の点ｐ０が接続される点ｐ１を有する。レンズ構造体９２１の点ｐ１は、Ａ－Ａ線の光軸における、接続Ｃ０の際の光素子９２５の点ｐ０の位置と対応している。言い換えると点ｐ１は光素子９２５からの入射点である。 The lens structure 921 has a point p1 to which the point p0 on the upper surface of the optical element 925 is connected on the bottom surface f1 that is a flat XY plane on the side mounted on the package substrate 911. The point p1 of the lens structure 921 corresponds to the position of the point p0 of the optical element 925 at the time of connection C0 on the optical axis of the line AA. In other words, the point p1 is an incident point from the optical element 925.
　レンズ構造体９２１の点ｐ２は、図示するＸ方向とＺ方向との間の４５度の斜面の箇所における光の９０度の全反射が行われる屈曲点を示す。レンズ構造体９２１の当該４５度の斜面の箇所は、光の９０度の全反射が行われる特性を持つミラー等で構成される。 The point p2 of the lens structure 921 indicates a bending point at which 90-degree total reflection of light is performed at a 45-degree inclined surface between the X direction and the Z direction shown in the drawing. The 45-degree inclined surface portion of the lens structure 921 is configured by a mirror or the like having a characteristic of performing 90-degree total reflection of light.
　レンズ構造体９２１の点ｐ３は、光ファイバ部９３３の端部が接続されるＹＺ平面の面における、Ｂ－Ｂ線で示す光ファイバのコアの光軸に対応した点を示す。言い換えると点ｐ３は光ファイバ部９３３への入射点である。 The point p3 of the lens structure 921 indicates a point corresponding to the optical axis of the core of the optical fiber indicated by the BB line on the surface of the YZ plane to which the end of the optical fiber portion 933 is connected. In other words, the point p3 is an incident point to the optical fiber portion 933.
　比較例の光インターコネクト装置の製造時またはセットアップ時、パッケージ基板９１１上の光素子９２５と光コネクタ装置９２０のレンズ構造体９２１との調芯を含む接続Ｃ０の工程を有する。この調芯を含む接続Ｃ０の工程において、上記光路に関する光学的な調芯、言い換えると光軸の位置合わせ、が行われる。即ちＡ－Ａ線の光軸上に、光素子９２５の点ｐ０とレンズ構造体９２１の点ｐ１とが殆ど一致するように接続される。この接続Ｃ０の際、調芯の精度は、例えばＡ－Ａ線の光軸における点ｐ０と点ｐ１とのズレを１０μｍ以下に抑える高精度が必要とされる。 At the time of manufacturing or setting up the optical interconnect device of the comparative example, there is a process of connection C0 including alignment between the optical element 925 on the package substrate 911 and the lens structure 921 of the optical connector device 920. In the process of connection C0 including this alignment, optical alignment related to the optical path, in other words, alignment of the optical axis is performed. That is, the point p0 of the optical element 925 and the point p1 of the lens structure 921 are connected on the optical axis of the line AA. For this connection C0, the alignment accuracy is required to be high, for example, to suppress the deviation between the points p0 and p1 on the optical axis of the AA line to 10 μm or less.
　図３０は、図２９の比較例の光インターコネクト装置における電子回路基板９１０側の光素子９２５と光コネクタ装置９２０側のレンズ構造体９２１との接続Ｃ０の後の状態を示す。電子回路基板９１０は、例えば光素子駆動ＩＣ９１５上にヒートシンク９１７が搭載される。比較例の光インターコネクト装置は、パッケージ基板９１１上の光素子９２５上に光コネクタ装置９２０が搭載される。なお図３０では、電子回路基板９１０に対する光コネクタ装置９２０の接続の状態として、光素子９２５の上面とレンズ構造体９２１の底面ｆ１とが接触する状態のみを図示している。この接続の形態は、実際には、当該光素子９２５の箇所だけではなく、光コネクタ装置９２０の他の部位、例えば周縁部などでパッケージ基板９１１上に機械的に接続及び保持される部位を有する形態としてもよい。 FIG. 30 shows a state after the connection C0 between the optical element 925 on the electronic circuit board 910 side and the lens structure 921 on the optical connector device 920 side in the optical interconnect device of the comparative example of FIG. In the electronic circuit board 910, for example, a heat sink 917 is mounted on the optical element driving IC 915. In the optical interconnect device of the comparative example, the optical connector device 920 is mounted on the optical element 925 on the package substrate 911. In FIG. 30, only the state where the upper surface of the optical element 925 and the bottom surface f1 of the lens structure 921 are in contact with each other is shown as a state of connection of the optical connector device 920 to the electronic circuit board 910. This form of connection actually has not only the location of the optical element 925 but also a site that is mechanically connected and held on the package substrate 911 at another site of the optical connector device 920, such as a peripheral edge. It is good also as a form.
　上記接続後の状態におけるレンズ構造体９２１の光路により、例えば発光素子である光素子９２５の出射点ｐ０からのＺ方向への出射光は、レンズ構造体９２１の点ｐ１から点ｐ２への光路部を経由して点ｐ２付近の面で９０度全反射され、Ｘ方向への出射光に変化する。そして当該出射光は、点ｐ２から点ｐ３への光路部を経由して、光ファイバ部９３３の端部のコアに入射される。 Due to the optical path of the lens structure 921 in the state after the connection, for example, light emitted in the Z direction from the emission point p0 of the optical element 925 that is a light emitting element is an optical path portion from the point p1 to the point p2 of the lens structure 921. Is totally reflected 90 degrees on the surface in the vicinity of the point p2, and changes to emitted light in the X direction. The emitted light enters the core at the end of the optical fiber portion 933 via the optical path portion from the point p2 to the point p3.
　比較例の光インターコネクト装置を用いた光インターコネクトのシステムにおける、送信側の第１の光インターコネクト装置から受信側の第２の光インターコネクト装置へのデータの光伝送の動作の概要は以下である。送信側の第１の光インターコネクト装置は、光素子駆動ＩＣ９１５による制御に基づいて、送信データの電気信号を光素子９２５により光信号へ変換する。送信側の光インターコネクト装置は、当該光素子９２５からの光信号を光コネクタ装置９２０による光路を通じて光ファイバ部９３３による光導波路へ出射する。光ファイバ部９３３による光導波路は、光信号を伝送する。受信側の光インターコネクト装置は、光ファイバ部９３３による光導波路からの光信号を、光コネクタ装置９２０による光路を通じて光素子９２５へ入射する。受信側の光インターコネクト装置は、光素子駆動ＩＣ９１５の制御に基づいて、当該光信号を光素子９２０により電気信号へ変換する。そして受信側の光インターコネクト装置の光素子駆動ＩＣ９１５は、光素子９２５からの電気信号を受信データとして取得する。 The outline of the optical transmission operation of data from the first optical interconnect device on the transmission side to the second optical interconnect device on the reception side in the optical interconnect system using the optical interconnect device of the comparative example is as follows. The first optical interconnect device on the transmission side converts an electrical signal of transmission data into an optical signal by the optical element 925 based on control by the optical element driving IC 915. The transmission-side optical interconnect device emits the optical signal from the optical element 925 to the optical waveguide formed by the optical fiber unit 933 through the optical path formed by the optical connector device 920. The optical waveguide formed by the optical fiber unit 933 transmits an optical signal. The optical interconnect device on the receiving side enters the optical signal from the optical waveguide by the optical fiber portion 933 into the optical element 925 through the optical path by the optical connector device 920. The optical interconnect device on the receiving side converts the optical signal into an electrical signal by the optical element 920 based on the control of the optical element driving IC 915. Then, the optical element driving IC 915 of the optical interconnect device on the receiving side acquires an electrical signal from the optical element 925 as reception data.
　上記比較例の光インターコネクト装置は、電子回路基板９１０において、電気部品である光素子駆動ＩＣ９１５等と、光部品である光素子９２５とが混在している。また、光素子９２５と光コネクタ装置９２０とが別の光部品として基本的に分離されている。上記光素子９２５と光コネクタ装置９２０との調芯を含む接続Ｃ０の工程は、光学的に高精度な調芯が必要であるため、高コストである。 In the optical interconnect device of the above comparative example, in the electronic circuit board 910, the optical element driving IC 915 that is an electrical component and the optical element 925 that is an optical component are mixed. Further, the optical element 925 and the optical connector device 920 are basically separated as separate optical components. The process of connection C0 including the alignment of the optical element 925 and the optical connector device 920 is expensive because it requires optically highly accurate alignment.
　また、電気部品と光部品の混在や、光部品の分離の構成であるため、例えばパッケージ基板９１１上の光部品である光素子９２５が故障した際や、光素子９２５を点検する際などに、その保守交換性があまり良くない。即ち、光素子９２５と光コネクタ装置９２０とにおいて調芯を含む接続Ｃ０の工程を再度必要とするので、高コストである。 In addition, since the configuration is a mixture of electrical components and optical components or separation of optical components, for example, when an optical element 925 that is an optical component on the package substrate 911 fails, or when the optical element 925 is inspected, Its maintainability is not so good. That is, since the process of connection C0 including alignment is required again in the optical element 925 and the optical connector device 920, the cost is high.
　＜実施の形態１＞
　図１～図１８を用いて、本発明の実施の形態１の光インターコネクト装置、光コネクタ装置、及び光ケーブル装置などについて説明する。 <Embodiment 1>
The optical interconnect device, optical connector device, optical cable device, and the like according to the first embodiment of the present invention will be described with reference to FIGS.
　［光インターコネクト装置］
　図１は、実施の形態１の光インターコネクト装置１、及び光コネクタ装置２０の概要として、電子回路基板１０と光コネクタ装置２０との接続前の状態のＸＺ断面の構成を示す。実施の形態１の光インターコネクト装置１は、パッケージ基板１１上に配線１２を介して光素子駆動ＩＣ１５が搭載される電子回路基板１０と、レンズ構造体２１に光素子２５が内蔵された光コネクタ装置２０とを有する。特に、光コネクタ装置２０を構成するレンズ構造体２１の凹部２６に光素子２５を内蔵するように搭載する構成を有する。光コネクタ装置２０を含む光インターコネクト装置１の製造時、レンズ構造体２１の凹部２６に対して、配線２２を介して光素子２５が内蔵されるように搭載される。その搭載の際、Ａ－Ａ線に示す光軸における光素子２５とレンズ構造体２１の光路との調芯が済んでいる。 [Optical interconnect equipment]
FIG. 1 shows an XZ cross-sectional configuration of the state before the electronic circuit board 10 and the optical connector device 20 are connected as an outline of the optical interconnect device 1 and the optical connector device 20 of the first embodiment. The optical interconnect device 1 according to the first embodiment includes an electronic circuit board 10 on which an optical element driving IC 15 is mounted via a wiring 12 on a package substrate 11, and an optical connector apparatus in which an optical element 25 is built in a lens structure 21. 20. In particular, it has a configuration in which the optical element 25 is mounted in the concave portion 26 of the lens structure 21 constituting the optical connector device 20. When the optical interconnect device 1 including the optical connector device 20 is manufactured, the optical element 25 is mounted in the concave portion 26 of the lens structure 21 via the wiring 22. At the time of mounting, alignment between the optical element 25 and the optical path of the lens structure 21 on the optical axis indicated by the line AA is completed.
　光コネクタ装置２０は、主にレンズ構造体２１で構成され、レンズ構造体２１の一部である光ファイバ接続部２３に対して光導波路となる光ファイバ部３３の端部が接続される。送信側及び受信側の光インターコネクト装置１は、光コネクタ装置２０間が光ファイバ部３３で接続される。なお本明細書では、光コネクタ装置２０と光ファイバ部３３等の光導波路とを含めた部分を、後述の光ケーブル装置３０と称する。 The optical connector device 20 is mainly composed of a lens structure 21, and an end portion of an optical fiber portion 33 serving as an optical waveguide is connected to an optical fiber connection portion 23 that is a part of the lens structure 21. In the optical interconnect device 1 on the transmission side and the reception side, the optical connector devices 20 are connected by an optical fiber portion 33. In this specification, a portion including the optical connector device 20 and the optical waveguide such as the optical fiber portion 33 is referred to as an optical cable device 30 described later.
　実施の形態１の光インターコネクト装置１は、図２９の比較例の光インターコネクト装置では別の光部品である光素子９２５と光コネクタ装置９２０のレンズ構造体９２１とを、一体的な１つの光部品である光コネクタ装置２０として統合した構成を有する。即ち、光コネクタ装置２０は、光素子２５との光結合がされ、調芯の精度が確保された、一体的な１つの光部品として取り扱うことができる。 The optical interconnect device 1 according to the first embodiment includes an optical element 925, which is another optical component in the optical interconnect device of the comparative example of FIG. 29, and the lens structure 921 of the optical connector device 920, as one integrated optical component. The optical connector device 20 is an integrated configuration. In other words, the optical connector device 20 can be handled as a single integrated optical component that is optically coupled to the optical element 25 and ensures alignment accuracy.
　また図２９の比較例の光インターコネクト装置の電子回路基板９１０は、光部品と電気部品とが混在した構成であるため、光学的な調芯を含む接続Ｃ０が高コストである。それに対し、実施の形態１の光インターコネクト装置１は、光部品である光コネクタ装置２０と、電気部品である電子回路基板１０とが明確に分離された構成を有する。これにより、比較例における調芯を含む接続の工程を簡便化し、製造プロセスで大きなコストを占める調芯を含む接続の工程を低コスト化する。調芯を含む接続の工程の低コスト化により、光インターコネクト装置１を低コストで構成でき、かつ、保守交換性にも優れた光インターコネクト装置１を提供できる。 In addition, since the electronic circuit board 910 of the optical interconnect device of the comparative example of FIG. 29 has a configuration in which optical components and electrical components are mixed, the connection C0 including optical alignment is expensive. In contrast, the optical interconnect device 1 of the first embodiment has a configuration in which the optical connector device 20 that is an optical component and the electronic circuit board 10 that is an electrical component are clearly separated. This simplifies the connection process including alignment in the comparative example, and reduces the connection process including alignment that occupies a large cost in the manufacturing process. By reducing the cost of the connection process including alignment, the optical interconnect device 1 can be configured at a low cost, and the optical interconnect device 1 having excellent maintenance and replaceability can be provided.
　電子回路基板１０と光コネクタ装置２０との接続Ｃ２の際、パッケージ基板１１上の所定の位置の配線１２に対し、光素子２５が内蔵された光コネクタ装置２０の配線１２が電気的に接続される。これにより、光素子駆動ＩＣ１５と光素子２５とは、配線２２及び配線１２を通じて電気的に接続される。これにより、光コネクタ装置２０が搭載された光インターコネクト装置１が構成される。上記のように電気部品と光部品とが明確に分離された構成を有するので、パッケージ基板１１上への光コネクタ装置２０の接続Ｃ２は、比較例のような光学的な高精度ではなく、電気的な接続の精度で行えばよい。この電気的な接続の手段は、各種の公知技術が適用可能であり、容易かつ低コストである。 At the time of connection C2 between the electronic circuit board 10 and the optical connector device 20, the wiring 12 of the optical connector device 20 in which the optical element 25 is incorporated is electrically connected to the wiring 12 at a predetermined position on the package substrate 11. The Thereby, the optical element driving IC 15 and the optical element 25 are electrically connected through the wiring 22 and the wiring 12. Thereby, the optical interconnect device 1 on which the optical connector device 20 is mounted is configured. Since the electrical component and the optical component are clearly separated as described above, the connection C2 of the optical connector device 20 on the package substrate 11 is not optically high precision as in the comparative example, The connection accuracy can be achieved. As this means for electrical connection, various known techniques can be applied, and it is easy and low-cost.
　［適用対象システム］
　図２は、実施の形態１等の光インターコネクト装置１を適用する対象となるシステム及び装置の例を示す。図２（ａ）は、適用対象システムであるＩＴシステム３００を示す。ＩＴシステム３００は、複数のＩＴ機器３０１がＬＡＮ等のネットワークで接続された構成である。ＩＴ機器３０１は、例えばサーバラックである。ＩＴ機器３０１は、１つ以上の基板モジュール３０２を備える。 [Applicable systems]
FIG. 2 shows an example of a system and apparatus to which the optical interconnect device 1 according to the first embodiment is applied. FIG. 2A shows an IT system 300 that is an application target system. The IT system 300 has a configuration in which a plurality of IT devices 301 are connected via a network such as a LAN. The IT device 301 is a server rack, for example. The IT device 301 includes one or more board modules 302.
　図２（ｂ）は、図２（ａ）のＩＴ機器３０１の基板モジュール３０２の構成例を示す。基板モジュール３０２は、ブレード基板などの複数の基板３０３が、バックプレーン基板３０４を介して相互に接続される。各基板３０３は、複数のチップ３０５などを搭載し、複数のチップ３０５がバス等で相互に接続される。チップ３０５は、プロセッサやメモリ等を備えるＩＣチップである。例えば第１の基板３０３の第１のチップ３０５と、第２の基板３０３の第２のチップ３０５とが、バックプレーン基板３０４を介して接続され、電気信号の送信ａ及び受信ｂを含む通信を行う例を示している。 FIG. 2B shows a configuration example of the board module 302 of the IT equipment 301 in FIG. In the substrate module 302, a plurality of substrates 303 such as blade substrates are connected to each other via a backplane substrate 304. Each substrate 303 mounts a plurality of chips 305 and the like, and the plurality of chips 305 are connected to each other by a bus or the like. The chip 305 is an IC chip that includes a processor, a memory, and the like. For example, the first chip 305 of the first substrate 303 and the second chip 305 of the second substrate 303 are connected via the backplane substrate 304, and communication including transmission a and reception b of electrical signals is performed. An example is shown.
　光インターコネクトの適用例として、図２（ａ）のＩＴ装置３０１間、基板モジュール３０２間、図２（ｂ）の基板３０３間、あるいはチップ３０５間が挙げられる。例えば基板３０３間を光インターコネクトで接続する場合、対象の各基板３０３に、実施の形態１等の光インターコネクト装置１を搭載する。当該基板３０３の光インターコネクト装置１間は、光コネクタ装置２０を両端とする光ケーブル装置３０で接続される。 As an application example of the optical interconnect, there are the IT devices 301 in FIG. 2A, the substrate modules 302, the substrates 303 in FIG. 2B, or the chips 305. For example, when the substrates 303 are connected by an optical interconnect, the optical interconnect device 1 of the first embodiment or the like is mounted on each target substrate 303. The optical interconnect devices 1 on the board 303 are connected by an optical cable device 30 having both ends of the optical connector device 20.
　［光インターコネクトシステム（１）］
　図３は、光インターコネクト装置１を含む光インターコネクトシステムの機能ブロックの構成例を示す。特に図３の光インターコネクトシステムは、送信及び受信の一方向の光伝送が可能な構成を有する２つの光インターコネクト装置１を光ケーブル装置３０で接続した構成例を示す。左側の第１の光インターコネクト装置１Ａは、送信機能２Ａのみを有し、右側の第２の光インターコネクト装置１Ｂは、受信機能２Ｂのみを有する。光インターコネクト装置１Ａから光インターコネクト装置１Ｂへの一方向の光伝送が可能な構成を有する。送信側の光インターコネクト装置１Ａの物理的な構成例を後述の図５で示す。受信側の光インターコネクト装置１Ｂの物理的な構成例を後述の図６で示す。 [Optical interconnect system (1)]
FIG. 3 shows a configuration example of functional blocks of an optical interconnect system including the optical interconnect device 1. In particular, the optical interconnect system of FIG. 3 shows a configuration example in which two optical interconnect devices 1 having a configuration capable of transmitting and receiving light in one direction are connected by an optical cable device 30. The first optical interconnect device 1A on the left side has only the transmission function 2A, and the second optical interconnect device 1B on the right side has only the reception function 2B. The optical interconnect device 1A can transmit light in one direction from the optical interconnect device 1B. An example of the physical configuration of the transmission-side optical interconnect device 1A is shown in FIG. A physical configuration example of the optical interconnect device 1B on the receiving side is shown in FIG.
　送信側の光インターコネクト装置１Ａ及び受信側の光インターコネクト装置１Ｂは、それぞれ光素子駆動ＩＣ１５及び光コネクタ装置２０を有する。光ケーブル装置３０は、送信側である一方の端部の光コネクタ装置２０と、受信側である他方の端部の光コネクタ装置２０と、それら両端を接続する光ファイバ部３３、特に１本の光ファイバ部３３Ａとを有する。 The optical interconnect device 1A on the transmission side and the optical interconnect device 1B on the reception side have an optical element driving IC 15 and an optical connector device 20, respectively. The optical cable device 30 includes an optical connector device 20 at one end that is a transmission side, an optical connector device 20 at the other end that is a reception side, and an optical fiber portion 33 that connects both ends, particularly one optical fiber. And a fiber portion 33A.
　送信側の光インターコネクト装置１Ａは、送信機能２Ａとして、送信側光素子駆動ＩＣ１５Ａと、それに接続される送信側光コネクタ装置２０Ａとを有する。送信側光コネクタ装置２０Ａは、送信側の光素子２５Ａである発光素子として、後述の図１０で示す、垂直共振型の面発光型の光素子であるＶＣＳＥＬを有する。送信側光素子駆動ＩＣ１５Ａは、送信側光コネクタ装置２０Ａの光素子２５ＡであるＶＣＳＥＬを駆動するＶＣＳＥＬドライバである。 The transmission-side optical interconnect device 1A includes a transmission-side optical element driving IC 15A and a transmission-side optical connector device 20A connected thereto as the transmission function 2A. The transmission-side optical connector device 20A includes a VCSEL, which is a vertical-resonance surface-emitting optical element shown in FIG. 10 described later, as a light-emitting element that is the transmission-side optical element 25A. The transmission-side optical element driving IC 15A is a VCSEL driver that drives a VCSEL that is the optical element 25A of the transmission-side optical connector device 20A.
　受信側の光インターコネクト装置１Ｂは、受信機能２Ｂとして、受信側光素子駆動ＩＣ１５Ｂと、受信側光コネクタ装置２０Ｂとを有する。受信側光コネクタ装置２０Ｂは、受信側の光素子２５Ｂである受光素子として、フォトダイオード（ＰＤと略す）を含む。受信側光素子駆動ＩＣ１５Ｂは、受信側光コネクタ装置２０Ｂの光素子２５ＢであるＰＤを駆動するトランス・インピーダンス・アンプ（ＴＩＡ）である。 The receiving-side optical interconnect device 1B includes a receiving-side optical element driving IC 15B and a receiving-side optical connector device 20B as the receiving function 2B. The reception-side optical connector device 20B includes a photodiode (abbreviated as PD) as a light-receiving element that is the reception-side optical element 25B. The receiving side optical element driving IC 15B is a trans-impedance amplifier (TIA) that drives the PD that is the optical element 25B of the receiving side optical connector apparatus 20B.
　光インターコネクト装置１Ａから光インターコネクト装置１Ｂへデータを光伝送する場合、送信ａ１のように、送信側光素子駆動ＩＣ１５Ａは、送信データの電気信号を、配線１２及び配線２２を通じて送信側光コネクタ装置２０Ａの光素子２５Ａへ送信する。送信側光素子駆動ＩＣ１５Ａによる制御に基づき、送信側光コネクタ装置２５Ａの光素子２５ＡであるＶＣＳＥＬを駆動する。光素子２５Ａは、電気信号を光信号に変換して出射する。当該光信号は、送信側光コネクタ装置２０Ａの光路を通じて、光ファイバ部３３Ａの端部へ入射される。光ケーブル装置３０の光ファイバ部３３は、光信号を伝送する。そして、受信側の光インターコネクト装置１Ｂは、光ファイバ部３３Ａからの光信号を受信側光コネクタ装置２５Ｂに入射する。当該光信号は、受信側光コネクタ装置２５Ｂの光路を通じて、光素子２５Ｂに入射される。受信側光素子駆動ＩＣ１５Ｂによる制御に基づき、受信側光コネクタ装置２５Ｂの光素子２５ＢであるＰＤを駆動する。光素子２５ＢであるＰＤは、光信号を電気信号に変換して受信する。光素子２５ＢであるＰＤからの電気信号は、配線２２及び配線１２を通じて受信側光素子駆動ＩＣ１５Ｂへ送信される。受信側光素子駆動ＩＣ１５Ｂは、当該光素子２５Ｂからの電気信号を受信データとして取得する。 When optically transmitting data from the optical interconnect device 1A to the optical interconnect device 1B, the transmission side optical element driving IC 15A transmits the electrical signal of the transmission data through the wiring 12 and the wiring 22 as in the case of transmission a1. To the optical element 25A. Based on the control by the transmission side optical element driving IC 15A, the VCSEL which is the optical element 25A of the transmission side optical connector device 25A is driven. The optical element 25A converts an electrical signal into an optical signal and emits it. The optical signal is incident on the end portion of the optical fiber portion 33A through the optical path of the transmission side optical connector device 20A. The optical fiber unit 33 of the optical cable device 30 transmits an optical signal. Then, the optical interconnect device 1B on the reception side enters the optical signal from the optical fiber portion 33A into the optical connector device 25B on the reception side. The optical signal enters the optical element 25B through the optical path of the receiving side optical connector device 25B. Based on the control by the receiving side optical element driving IC 15B, the PD which is the optical element 25B of the receiving side optical connector device 25B is driven. The PD, which is the optical element 25B, converts an optical signal into an electrical signal and receives it. An electrical signal from the PD, which is the optical element 25B, is transmitted to the reception-side optical element driving IC 15B through the wiring 22 and the wiring 12. The reception-side optical element driving IC 15B acquires an electrical signal from the optical element 25B as reception data.
　［光ケーブル装置］
　図４は、実施の形態１の光ケーブル装置３０の構成例を示す。光ケーブル装置３０は、言い換えると、光コネクタ付きケーブルである。図４（ａ）は、図３の一方向の光伝送が可能な構成に対応した光ケーブル装置３０を示す。光ケーブル装置３０は、２つの光コネクタ装置２０を両端として、それらを接続する光ファイバ部３３を有する。一方の端部の光コネクタ装置２０は、送信機能２Ａに対応した送信側光コネクタ装置２０Ａであり、他方の端部の光コネクタ装置２０は、受信機能２Ｂに対応した受信側光コネクタ装置２０Ｂである。光ファイバ部３３は、断面構造として、光ファイバ、及びその外側の保護被膜３４などで構成される。光ファイバ部３３の光ファイバは、外側のクラッド３１と、内側のコア３２とを有する。 [Optical cable device]
FIG. 4 shows a configuration example of the optical cable device 30 according to the first embodiment. In other words, the optical cable device 30 is a cable with an optical connector. FIG. 4A shows an optical cable device 30 corresponding to a configuration capable of optical transmission in one direction in FIG. The optical cable device 30 has two optical connector devices 20 as both ends and an optical fiber portion 33 that connects them. The optical connector device 20 at one end is a transmission side optical connector device 20A corresponding to the transmission function 2A, and the optical connector device 20 at the other end is a reception side optical connector device 20B corresponding to the reception function 2B. is there. The optical fiber portion 33 is configured by an optical fiber and a protective coating 34 on the outside thereof as a cross-sectional structure. The optical fiber of the optical fiber portion 33 has an outer cladding 31 and an inner core 32.
　［送信側の光インターコネクト装置］
　図５は、実施の形態１の送信側の光インターコネクト装置１Ａの接続前のＸＺ断面の構成を示す。光インターコネクト装置１Ａは、送信側光素子駆動ＩＣ１５ＡとしてＶＣＳＥＬドライバを有し、送信側光コネクタ装置２０Ａは、送信側の光素子２５Ａとして、発光素子であるＶＣＳＥＬを有する。ａは光素子２５Ａから光ファイバ部３３への出射光を示す。 [Transmitter optical interconnect device]
FIG. 5 shows a configuration of an XZ cross section before connection of the transmission-side optical interconnect device 1A of the first embodiment. The optical interconnect device 1A has a VCSEL driver as the transmission side optical element driving IC 15A, and the transmission side optical connector device 20A has a VCSEL as a light emitting element as the transmission side optical element 25A. a shows the emitted light from the optical element 25 </ b> A to the optical fiber portion 33.
　光インターコネクト装置１Ａは、適用対象の基板５０上に、例えばはんだボール５１を介して、電子回路基板１０のパッケージ基板１１が搭載される。電子回路基板１０は、主に、パッケージ基板１１と、パッケージ基板１１上に形成される配線１２と、配線１２を介して接続される送信側光素子駆動ＩＣ１５Ａと、送信側光素子駆動ＩＣ１５Ａに搭載されるヒートシンク１７とを有する。送信側光素子駆動ＩＣ１５Ａは、パッケージ基板１１の配線１２上に例えばはんだボール１３を介して搭載される。なお電子回路基板１０は、光部品である光コネクタ装置２０を除く部分を示し、電気部品として構成されている。 In the optical interconnect device 1 </ b> A, the package substrate 11 of the electronic circuit substrate 10 is mounted on the target substrate 50 via, for example, solder balls 51. The electronic circuit board 10 is mainly mounted on the package board 11, the wiring 12 formed on the package board 11, the transmission side optical element driving IC 15A connected via the wiring 12, and the transmission side optical element driving IC 15A. And a heat sink 17. The transmission side optical element driving IC 15 </ b> A is mounted on the wiring 12 of the package substrate 11 via, for example, solder balls 13. The electronic circuit board 10 shows a portion excluding the optical connector device 20 that is an optical component, and is configured as an electrical component.
　送信側光コネクタ装置２０Ａは、図１の構成と同様である。送信側光コネクタ装置２０Ａは、本体であるレンズ構造体２１と、レンズ構造体２１の凹部に搭載される送信側の光素子２５Ａと、レンズ構造体２１に形成され光素子２５Ａと接続される金属による電気的な配線２２とを有し、光ファイバ部３３の端部が接続される。 The transmission side optical connector device 20A has the same configuration as that of FIG. The transmission-side optical connector device 20A includes a lens structure 21 as a main body, a transmission-side optical element 25A mounted in a recess of the lens structure 21, and a metal formed in the lens structure 21 and connected to the optical element 25A. And an end portion of the optical fiber portion 33 is connected.
　パッケージ基板１１は、有機基板であり、主面に金属による電気的な配線１２が形成されている。パッケージ基板１１上の配線１２は、送信側光素子駆動ＩＣ１５Ａに接続される配線から、Ｘ方向右方の所定の位置まで延在して形成される配線を含む。当該所定の位置、即ち光コネクタ装置２０の接続位置の配線１２に対して、Ｚ方向で、光コネクタ装置２０側に形成された金属による配線２２が電気的に接続される。 The package substrate 11 is an organic substrate, and an electrical wiring 12 made of metal is formed on the main surface. The wiring 12 on the package substrate 11 includes a wiring formed to extend from a wiring connected to the transmission-side optical element driving IC 15A to a predetermined position on the right side in the X direction. The wiring 22 made of metal formed on the optical connector device 20 side is electrically connected in the Z direction to the wiring 12 at the predetermined position, that is, the connection position of the optical connector device 20.
　［受信側の光インターコネクト装置］
　図６は、実施の形態１の受信側の光インターコネクト装置１ＢのＸＺ断面の構成を示す。受信側の光インターコネクト装置１Ｂは、受信側光素子駆動ＩＣ１５ＢとしてＴＩＡを有し、受信側光コネクタ装置２０Ｂの受信側の光素子２５Ｂとして、受光素子であるＰＤを有する。ｂは光ファイバ部３３から光素子２５Ｂへの入射光を示す。 [Receiver side optical interconnect device]
6 shows an XZ cross-sectional configuration of the receiving-side optical interconnect device 1B of the first embodiment. The reception-side optical interconnect device 1B has a TIA as the reception-side optical element driving IC 15B, and has a PD that is a light-receiving element as the reception-side optical element 25B of the reception-side optical connector device 20B. b shows the incident light from the optical fiber part 33 to the optical element 25B.
　光ファイバ部３３の端部からレンズ構造体２１の点ｐ３に入射された光信号は、点ｐ３からＸ方向左方への光路部を進み、４５度ミラー２４の点ｐ２の付近で９０度全反射され、Ｚ方向への光に変化する。そして当該入射光は、点ｐ２からＺ方向下方への光路部を進み、凹部の点ｐ１を経由して、光素子２５Ｂに入射される。ＰＤである光素子２５Ｂは、光信号を電気信号に変換して出力する。ＴＩＡである光素子駆動ＩＣ１５Ｂは、光素子２５Ｂから配線２２及び配線１２を通じて受信した電流信号を、インピーダンス変換して増幅し、電圧信号として取得する。 The optical signal incident on the point p3 of the lens structure 21 from the end of the optical fiber portion 33 travels along the optical path portion to the left in the X direction from the point p3, and is 90 degrees around the point p2 of the 45 degree mirror 24. Reflected and changed to light in the Z direction. Then, the incident light travels along the optical path portion downward from the point p2 in the Z direction, and is incident on the optical element 25B via the point p1 of the recess. The optical element 25B, which is a PD, converts an optical signal into an electrical signal and outputs it. The optical element driving IC 15B, which is a TIA, impedance-converts and amplifies the current signal received from the optical element 25B through the wiring 22 and the wiring 12, and acquires it as a voltage signal.
　［製造フロー］
　図７は、実施の形態１の光インターコネクト装置１の製造フロー例を示す。Ｓ１等は工程を示す。工程Ｓ１では、レンズ構造体２１を製造または準備する。工程Ｓ２では、光素子２５を製造または準備する。工程Ｓ３では、光ファイバ部３３を製造または準備する。 [Production flow]
FIG. 7 shows an example of a manufacturing flow of the optical interconnect device 1 of the first embodiment. S1 etc. show a process. In step S1, the lens structure 21 is manufactured or prepared. In step S2, the optical element 25 is manufactured or prepared. In step S3, the optical fiber portion 33 is manufactured or prepared.
　工程Ｓ４では、工程Ｓ１のレンズ構造体２１と、工程Ｓ２の光素子２５とを、光学的に調芯しながら接続する。工程Ｓ４は、後述の図９に示す調芯を含む接続Ｃ１に対応する。工程Ｓ４において、まずレンズ構造体２１の底面ｆ１の凹部２６及び底面ｆ１の一部にわたって配線２２が形成される。そして工程Ｓ４では、例えばチップマウンタ等の製造装置を用いて、レンズ構造体２１の凹部２６に、配線２２を介して、光素子２５の上面の電極端子が接続されるように搭載する。この搭載の際、調芯として、Ａ－Ａ線の光軸において、光素子２５の点ｐ０、レンズ構造体２１の凹部２６の点ｐ１、及び４５度ミラー２４の点ｐ２が揃うように位置合わせがされる。これにより光素子２５とレンズ構造体２１とが光結合される。工程Ｓ４における調芯を含む接続Ｃ２は、使用するチップマウンタ等の製造装置が持つ搭載の精度で実現される。必要な調芯の精度として例えば光軸におけるズレを１０μｍ以下に抑える高精度が確保される。工程Ｓ４により、光素子２５を内蔵した光コネクタ装置２０を得る。工程Ｓ４の調芯は、従来のパッシブ調芯とは異なる方式である。 In step S4, the lens structure 21 in step S1 and the optical element 25 in step S2 are connected while optically aligned. Step S4 corresponds to connection C1 including alignment shown in FIG. 9 described later. In step S4, first, the wiring 22 is formed over the concave portion 26 of the bottom surface f1 of the lens structure 21 and a part of the bottom surface f1. In step S4, for example, using a manufacturing apparatus such as a chip mounter, the electrode structure on the upper surface of the optical element 25 is connected to the concave portion 26 of the lens structure 21 via the wiring 22. When mounting, alignment is performed so that the point p0 of the optical element 25, the point p1 of the concave portion 26 of the lens structure 21, and the point p2 of the 45-degree mirror 24 are aligned on the optical axis of the AA line. Is done. Thereby, the optical element 25 and the lens structure 21 are optically coupled. The connection C2 including alignment in step S4 is realized with the mounting accuracy of a manufacturing apparatus such as a chip mounter to be used. As the required alignment accuracy, for example, a high accuracy for keeping the deviation in the optical axis to 10 μm or less is ensured. In step S4, the optical connector device 20 including the optical element 25 is obtained. The alignment in step S4 is a method different from the conventional passive alignment.
　工程Ｓ５では、工程Ｓ４により得られた、光素子２５を内蔵した光コネクタ装置２０における光ファイバ接続部２３と、工程Ｓ３の光ファイバ部３３の端部とを、光学的に調芯しながら接続する。この接続の際、Ｂ－Ｂ線の光軸において、レンズ構造体２１の光ファイバ接続部２３のＹＺ平面の点ｐ３の位置に対し、光ファイバ部３３の端部の光ファイバのコア３２が、光学的に調芯しながら接続される。この光ファイバ接続部２３における調芯を含む接続は、各種の公知技術により可能である。 In step S5, the optical fiber connection portion 23 in the optical connector device 20 incorporating the optical element 25 obtained in step S4 and the end of the optical fiber portion 33 in step S3 are connected while optically aligned. To do. At the time of this connection, with respect to the position of the point p3 on the YZ plane of the optical fiber connection portion 23 of the lens structure 21 on the optical axis of the BB line, the optical fiber core 32 at the end of the optical fiber portion 33 is It is connected while optically aligning. Connection including alignment in the optical fiber connection portion 23 is possible by various known techniques.
　工程Ｓ６では、電子回路基板１０を製造または準備する。パッケージ基板１１上に配線１２が形成され、配線１２を介して光素子駆動ＩＣ１５等が搭載されることにより、電子回路基板１０を得る。 In step S6, the electronic circuit board 10 is manufactured or prepared. The wiring 12 is formed on the package substrate 11, and the optical element driving IC 15 and the like are mounted via the wiring 12, whereby the electronic circuit substrate 10 is obtained.
　工程Ｓ７では、工程Ｓ６で得られた電子回路基板１０のパッケージ基板１１上に、工程Ｓ５で得られた光素子２５が搭載済みかつ光ファイバ部３３が接続済みの光コネクタ装置２０を搭載する。工程Ｓ７は、図１の接続Ｃ２に対応する。工程Ｓ７では、製造装置を用いて、パッケージ基板１１上の所定の位置の配線１２に対して、レンズ構造体２１の底面ｆ１側の配線２２を位置合わせしながら、電気的に接続する。これにより光素子２５と光素子駆動ＩＣ１５とが配線１２及び配線２２を通じて電気的に接続される。また工程Ｓ７は、後述の図１２で示す例のように、電気的な接続とは別に、パッケージ基板１１上への光コネクタ装置２０の機械的な接続が行われてもよい。工程Ｓ７により、光コネクタ装置２０が接続された光インターコネクト装置１が得られる。なお工程Ｓ７は、適用対象に応じて、製造時ではなく、セットアップ時や保守交換時に行われてもよい。 In step S7, the optical connector device 20 in which the optical element 25 obtained in step S5 is mounted and the optical fiber portion 33 is connected is mounted on the package substrate 11 of the electronic circuit board 10 obtained in step S6. Step S7 corresponds to connection C2 in FIG. In step S <b> 7, the manufacturing apparatus is used to electrically connect the wiring 22 on the bottom surface f <b> 1 side of the lens structure 21 to the wiring 12 at a predetermined position on the package substrate 11. As a result, the optical element 25 and the optical element driving IC 15 are electrically connected through the wiring 12 and the wiring 22. In step S7, mechanical connection of the optical connector device 20 onto the package substrate 11 may be performed separately from the electrical connection, as in the example shown in FIG. By step S7, the optical interconnect device 1 to which the optical connector device 20 is connected is obtained. Note that step S7 may be performed at the time of setup or maintenance replacement, not at the time of manufacture, depending on the application target.
　工程Ｓ７及び接続Ｃ２における、パッケージ基板１１上の配線１２に対する光コネクタ装置２０側の配線２２を電気的に接続する手段については、各種の公知技術を適用可能である。例えば、はんだ接続、銀ペースト等の層を介した接続、あるいは異方性導電フィルム（ＡＣＦ：Anisotropic Conductive Film）による接続などが適用可能である。また後述の実施の形態４のように、スプリングコネクタ等による接続も適用可能である。工程Ｓ７及び接続Ｃ２の構成一例として、ＡＣＦを用いる場合、パッケージ基板１１側の配線１２と、光コネクタ装置２０側の底面ｆ１の配線２２との間に、ＡＣＦを挟んで接続する。 Various known techniques can be applied to the means for electrically connecting the wiring 22 on the optical connector device 20 side to the wiring 12 on the package substrate 11 in step S7 and connection C2. For example, solder connection, connection through a layer of silver paste or the like, or connection using an anisotropic conductive film (ACF) can be applied. Further, connection by a spring connector or the like can be applied as in the fourth embodiment described later. As an example of the configuration of step S7 and connection C2, when an ACF is used, the ACF is connected between the wiring 12 on the package substrate 11 side and the wiring 22 on the bottom surface f1 on the optical connector device 20 side.
　上記製造フローのように、光素子２５を内蔵した光コネクタ装置２０は、工程Ｓ４で高精度に調芯済みであるため、光結合及び所定の光学的な精度が保障された光部品として取り扱うことができる。そのため、工程Ｓ７におけるパッケージ基板１１への光コネクタ装置２０の搭載は、光学的な精度ではなく電気的な精度で容易かつ低コストで可能となる。工程Ｓ４の光学的な調芯を含む接続は、比較例の図２９の調芯を含む接続Ｃ０よりも、容易で低コストである。即ち、光インターコネクト装置１を低コストで提供できる。また例えば光素子２５の故障や点検の際には、光素子２５を内蔵した光コネクタ装置２０ごと交換することができる。当該交換時には、パッケージ基板１１から光コネクタ装置２０を取り外し、新たな光コネクタ装置２０を電気的な接続Ｃ２によって取り付ける作業だけで済む。即ち、実施の形態１の光インターコネクト装置１は保守交換性が高い。 As in the above manufacturing flow, the optical connector device 20 incorporating the optical element 25 has been aligned with high accuracy in step S4, so that it is handled as an optical component that ensures optical coupling and predetermined optical accuracy. Can do. Therefore, the mounting of the optical connector device 20 on the package substrate 11 in the step S7 can be performed easily and at low cost not with optical accuracy but with electrical accuracy. The connection including optical alignment in step S4 is easier and less expensive than the connection C0 including alignment in FIG. 29 of the comparative example. That is, the optical interconnect device 1 can be provided at a low cost. Further, for example, when the optical element 25 is broken or inspected, the optical connector device 20 including the optical element 25 can be replaced. At the time of the replacement, it is only necessary to remove the optical connector device 20 from the package substrate 11 and attach a new optical connector device 20 by electrical connection C2. That is, the optical interconnect device 1 according to the first embodiment has high maintenance and exchangeability.
　［光コネクタ装置］
　図８は、実施の形態１の光コネクタ装置２０のＸＺ断面の構成として、光素子２５を内蔵した後の状態を示す。図８を用いて光コネクタ装置２０の詳細として光路などの構成について説明する。なお図８は光素子２５として特に送信側の光素子２５ＡであるＶＣＳＥＬを用いた場合を示す。 [Optical connector device]
FIG. 8 shows a state after the optical element 25 is built in as an XZ cross-sectional configuration of the optical connector device 20 of the first embodiment. The configuration of the optical path and the like will be described in detail with reference to FIG. FIG. 8 shows a case where a VCSEL which is the optical element 25A on the transmission side is used as the optical element 25.
　光素子２５は、Ｚ方向上側である上面が発光面となっており、その上面の点ｐ０は出射点を示す。光素子２５であるＶＣＳＥＬの詳細については後述の図１０で示す。 In the optical element 25, the upper surface on the upper side in the Z direction is a light emitting surface, and a point p0 on the upper surface indicates an emission point. Details of the VCSEL which is the optical element 25 are shown in FIG.
　レンズ構造体２１は、例えばガラスやプラスチック等の材料で構成される。 The lens structure 21 is made of a material such as glass or plastic.
　レンズ構造体２１の一部である光ファイバ接続部２３は、光ファイバ部３３の端部を接続するための形状を有する。実施の形態１では、光ファイバ接続部２３は、レンズ構造体２１のＸ方向右側及びＺ方向上側の箇所において、光ファイバ部３３の形状に対応した領域として設けられており、点ｐ３を含むＹＺ平面を含む。光ファイバ接続部２３の点ｐ３を含む面に対して、光ファイバ部３３の端部の面が、Ｂ－Ｂ線の光軸における光学的な調芯を含めて接続される。レンズ構造体２１の光ファイバ接続部２３の点ｐ３は、光ファイバ部３３の端部のコア３２の光軸に位置合わせされた点であり、レンズ構造体２１から光ファイバ部３３への出射点に対応する。 The optical fiber connection portion 23 which is a part of the lens structure 21 has a shape for connecting the end portion of the optical fiber portion 33. In the first embodiment, the optical fiber connection portion 23 is provided as a region corresponding to the shape of the optical fiber portion 33 at the right side in the X direction and the upper side in the Z direction of the lens structure 21 and includes the YZ including the point p3. Includes a plane. The surface of the end portion of the optical fiber portion 33 is connected to the surface including the point p3 of the optical fiber connection portion 23 including optical alignment on the optical axis of the BB line. The point p3 of the optical fiber connection portion 23 of the lens structure 21 is a point aligned with the optical axis of the core 32 at the end of the optical fiber portion 33, and is an exit point from the lens structure 21 to the optical fiber portion 33. Corresponding to
　実施の形態１の光コネクタ装置２０は、レンズ構造体２１におけるパッケージ基板１１に搭載される側のＸＹ平面である底面ｆ１において凹部２６が設けられている。凹部２６は、言い換えると光素子内蔵部であり、レンズ構造体２１の平坦なＸＹ平面の底面ｆ１においてＺ方向上方に深さを持つへこみ領域である。凹部２６は言い換えると光素子内蔵部である。凹部２６の形状は、光素子２５の形状に合わせて設計されている。光素子２５が例えば後述の図１０のような円柱形状である場合、それに対応して凹部２６も円柱形状である。凹部２６のＺ方向のへこみの深さは、光素子２５のＺ方向の高さよりも大きい。凹部２６の点ｐ１は、光素子２５の搭載の中心点である。 In the optical connector device 20 of the first embodiment, a concave portion 26 is provided on a bottom surface f1 which is an XY plane on the lens structure 21 on the side mounted on the package substrate 11. In other words, the concave portion 26 is an optical element built-in portion, and is a concave region having a depth in the Z direction upward on the bottom surface f1 of the flat XY plane of the lens structure 21. In other words, the recess 26 is an optical element built-in portion. The shape of the recess 26 is designed in accordance with the shape of the optical element 25. For example, when the optical element 25 has a cylindrical shape as shown in FIG. 10 described later, the concave portion 26 also has a cylindrical shape. The depth of the recess in the Z direction of the recess 26 is larger than the height of the optical element 25 in the Z direction. A point p <b> 1 of the recess 26 is a center point for mounting the optical element 25.
　レンズ構造体２１の底面ｆ１の凹部２６に、配線１２を介して、光素子２５が内蔵されるように搭載される。凹部２６のＺ方向上方の底面は、レンズ構造体２１の底面ｆ１と平行なＸＹ平面である。凹部２６の底面に対して、光素子２５は、面発光の出射点ｐ０を含む上面が、凹部２６の底面であるＸＹ平面に平行な配置で搭載される。なおＸ方向及びＹ方向は、パッケージ基板１１等の基板面及びレンズ構造体２１の底面ｆ１などに平行な方向である。凹部２６に搭載された光素子２５は、凹部２６の領域内に収まり、レンズ構造体２１の底面ｆ１からＺ方向外側へは出ない。 The optical element 25 is mounted in the concave portion 26 on the bottom surface f1 of the lens structure 21 via the wiring 12. The bottom surface of the concave portion 26 in the Z direction is an XY plane parallel to the bottom surface f1 of the lens structure 21. With respect to the bottom surface of the recess 26, the optical element 25 is mounted such that the top surface including the surface emission point p <b> 0 is parallel to the XY plane that is the bottom surface of the recess 26. The X direction and the Y direction are directions parallel to the substrate surface such as the package substrate 11 and the bottom surface f1 of the lens structure 21. The optical element 25 mounted in the concave portion 26 is accommodated in the region of the concave portion 26 and does not protrude outward from the bottom surface f1 of the lens structure 21 in the Z direction.
　光コネクタ装置２０側に形成される配線２２は、レンズ構造体２１の凹部２６の底面や側面、及びレンズ構造体２１の底面ｆ１の一部の領域にわたって形成される。例えば、凹部２６の底面に形成された配線２２の一方端の部分に対して、光素子２５の上面の周縁部にある電極端子が電気的に接続される。配線２２の他方端は、凹部２６の側面を経由してレンズ構造体２１の凹部２６の周りの底面ｆ１の所定の位置まで延在して形成される。図１の接続Ｃ２の際、レンズ構造体２１の底面ｆ１の凹部２６の周りの露出した配線２２と、当該配線２２のＸ方向及びＹ方向の位置で対応した、パッケージ基板１１上の配線１２とが、電気的に接続される。 The wiring 22 formed on the optical connector device 20 side is formed over the bottom and side surfaces of the concave portion 26 of the lens structure 21 and a partial region of the bottom surface f1 of the lens structure 21. For example, an electrode terminal at the peripheral edge of the upper surface of the optical element 25 is electrically connected to one end portion of the wiring 22 formed on the bottom surface of the recess 26. The other end of the wiring 22 is formed to extend to a predetermined position on the bottom surface f <b> 1 around the concave portion 26 of the lens structure 21 via the side surface of the concave portion 26. 1, the exposed wiring 22 around the recess 26 in the bottom surface f1 of the lens structure 21 and the wiring 12 on the package substrate 11 corresponding to the position of the wiring 22 in the X direction and the Y direction. Are electrically connected.
　レンズ構造体２１は、光路を構成する要素の１つとして、図示するＸ方向とＺ方向との間の４５度の斜面の箇所に、光屈曲手段である４５度ミラー２４を有する。実施の形態１では、レンズ構造体２１は、Ｚ方向とＸ方向とで９０度屈曲する光路を構成する。そのための光屈曲手段としてレンズ構造体２１は４５度ミラー２４を有する。４５度ミラー２４は、レンズ構造体２１の内部において光を９０度で全反射させる特性を有する。４５度ミラー２４は、点ｐ２の付近で、Ｚ方向からの光をＸ方向へと反射させる。点ｐ２は、Ａ－Ａ線のＺ方向の光軸とＢ－Ｂ線のＸ方向の光軸との直角の交点であって、また光路の屈曲点であって、４５度ミラー２４の反射点である。 The lens structure 21 has a 45-degree mirror 24 that is a light bending means at a 45-degree inclined surface between the X direction and the Z direction shown in the figure as one of the elements constituting the optical path. In the first embodiment, the lens structure 21 forms an optical path that bends 90 degrees in the Z direction and the X direction. For this purpose, the lens structure 21 has a 45-degree mirror 24 as a light bending means. The 45 degree mirror 24 has a characteristic of totally reflecting light at 90 degrees inside the lens structure 21. The 45 degree mirror 24 reflects light from the Z direction in the X direction in the vicinity of the point p2. Point p2 is a perpendicular intersection of the optical axis in the Z direction of the AA line and the optical axis in the X direction of the BB line, and is a bending point of the optical path, and is a reflection point of the 45 ° mirror 24. It is.
　レンズ構造体２１の４５度ミラー２４の形態は、例えば、レンズ構造体２１の当該４５度の斜面の箇所において金属膜や誘電体多層膜などを形成する形態が挙げられる。あるいは、レンズ構造体２１の４５度ミラー２４の形態は、レンズ構造体２１の当該４５度の斜面を含む領域において、直角プリズム、即ち４５度の直角二等辺三角形の面を持つ三角柱などの形状を持つプリズムなどを設ける形態が挙げられる。 Examples of the form of the 45-degree mirror 24 of the lens structure 21 include a form in which a metal film, a dielectric multilayer film, or the like is formed at the 45-degree slope portion of the lens structure 21. Alternatively, the 45-degree mirror 24 of the lens structure 21 is shaped like a right-angle prism, that is, a triangular prism having a 45-degree right-angled isosceles triangle in the region including the 45-degree slope of the lens structure 21. There is a form in which a prism or the like is provided.
　レンズ構造体２１は、光素子１５と光ファイバ部３３の端部との間を結ぶ光路を構成する。レンズ構造体２１に構成される光路は、Ａ－Ａ線の光軸における、光素子２５の上面の点ｐ０に対応した凹部２６の点ｐ１から、基板面垂直なＺ方向上方への４５度ミラー２４の点ｐ２までの直線の光路部と、４５度ミラー２４の点ｐ２から基板面平行なＸ方向右方への光ファイバ接続部２３の点ｐ３までの直線の光路部とを含む。 The lens structure 21 constitutes an optical path connecting the optical element 15 and the end of the optical fiber portion 33. The optical path formed in the lens structure 21 is a 45-degree mirror from the point p1 of the concave portion 26 corresponding to the point p0 on the upper surface of the optical element 25 on the optical axis of the AA line, upward in the Z direction perpendicular to the substrate surface. And a straight optical path portion from the point p2 of the 45-degree mirror 24 to the point p3 of the optical fiber connection portion 23 to the right in the X direction parallel to the substrate surface.
　光素子２５の上面の点ｐ０からＺ方向に出射された光は、凹部２６の点ｐ１の位置からレンズ構造体２１に入射される。点ｐ１からの光は、４５度ミラー２４の点ｐ２の付近で反射されてＸ方向への光になる。点ｐ２からの光は、光ファイバ接続部２３の点ｐ３から光ファイバ部３３の端部のコア３２に入射される。その後、当該出射光は、光ファイバ部３３を光伝送されて、受信側の光インターコネクト装置１の光コネクタ装置２０へ入射される。なおＡ－Ａ線の光軸及びＢ－Ｂ線の光軸において、光素子２５からの出射光の広がりのイメージを破線で図示しているが、出射光の指向性が高い光素子２５を用いることにより、光ファイバ部３３の端部のコア３２に入射される出射光の広がりの幅は狭くなる。 The light emitted in the Z direction from the point p 0 on the upper surface of the optical element 25 enters the lens structure 21 from the position of the point p 1 of the recess 26. The light from the point p1 is reflected near the point p2 of the 45 degree mirror 24 and becomes light in the X direction. Light from the point p <b> 2 enters the core 32 at the end of the optical fiber portion 33 from the point p <b> 3 of the optical fiber connection portion 23. Thereafter, the emitted light is optically transmitted through the optical fiber unit 33 and is incident on the optical connector device 20 of the optical interconnect device 1 on the receiving side. Note that the image of the spread of the outgoing light from the optical element 25 on the optical axis of the AA line and the optical axis of the BB line is shown by broken lines, but the optical element 25 having high directivity of the outgoing light is used. As a result, the width of the spread of the outgoing light incident on the core 32 at the end of the optical fiber portion 33 is narrowed.
　実施の形態１の光インターコネクト装置１における光コネクタ装置２０は、レンズ構造体２１の底面ｆ１の凹部２６に光素子２５が内蔵されるように搭載されている。前述の比較例では、図３０のように、接続後、レンズ構造体９２１の平坦な底面ｆ１に対してＺ方向で光素子９２５が出る形状となる。従って、実施の形態１の光インターコネクト装置１は、光素子２５を搭載した光コネクタ装置２０の全体の形状がコンパクトであり、光コネクタ装置２０をパッケージ基板１１上に搭載する工程についても容易化される。またそれに併せて、光コネクタ装置２０を搭載する光インターコネクト装置１の全体の形状、特にＺ方向の高さを、コンパクトにできる。 The optical connector device 20 in the optical interconnect device 1 of the first embodiment is mounted so that the optical element 25 is built in the concave portion 26 of the bottom surface f1 of the lens structure 21. In the above-described comparative example, as shown in FIG. 30, after the connection, the optical element 925 protrudes in the Z direction with respect to the flat bottom surface f1 of the lens structure 921. Therefore, in the optical interconnect device 1 of the first embodiment, the overall shape of the optical connector device 20 on which the optical element 25 is mounted is compact, and the process of mounting the optical connector device 20 on the package substrate 11 is facilitated. The At the same time, the overall shape of the optical interconnect device 1 on which the optical connector device 20 is mounted, particularly the height in the Z direction, can be made compact.
　図９は、図８及び図７の工程Ｓ４に対応した、実施の形態１の光インターコネクト装置１の光コネクタ装置２０におけるレンズ構造体２１と光素子２５との接続の前の状態のＸＺ断面の構成を示す。調芯を含む接続Ｃ１は、Ｚ方向のＡ－Ａ線の光軸において、レンズ構成体２１の凹部２６に対し、配線２２を介して、光素子２５が搭載される状態を示す。なお工程Ｓ４における、チップマウンタ等の製造装置を用いた、調芯を含む接続Ｃ１の際には、図９の状態とは逆に、レンズ構造体２１をＺ方向下側にして凹部２６が上側に来るように配置し、Ｚ方向上側から光素子２５を凹部２６へ搭載する。 FIG. 9 is an XZ cross-sectional view of the optical connector device 20 of the optical interconnect device 1 according to the first embodiment, corresponding to step S4 of FIGS. 8 and 7, in a state before the connection between the lens structure 21 and the optical element 25. The configuration is shown. The connection C1 including alignment indicates a state in which the optical element 25 is mounted via the wiring 22 with respect to the concave portion 26 of the lens structure 21 on the optical axis of the AA line in the Z direction. In the connection S1 including alignment using a manufacturing apparatus such as a chip mounter in step S4, the concave portion 26 is located on the upper side with the lens structure 21 facing downward in the Z direction, contrary to the state shown in FIG. The optical element 25 is mounted in the recess 26 from the upper side in the Z direction.
　まずｃ１に示すように、製造装置を用いて、レンズ構造体２１の凹部２６の底面及び側面、並びにレンズ構造体２１の底面ｆ１の凹部２６の周りの領域に、配線２２が形成される。そして、チップマウンタ等の製造装置を用いて、レンズ構造体２１の凹部２６及び配線２２に対し、光素子２５が、調芯を含めて接続Ｃ１がされる。その調芯の際、Ａ－Ａ線の光軸において、光素子２５の点ｐ０、レンズ構造体２１の凹部２６の点ｐ１、及び４５度ミラー２４の点ｐ２が揃うように位置合わせがされる。 First, as shown by c1, the wiring 22 is formed in the area | region around the recessed part 26 of the bottom face f1 of the lens structure 21, and the bottom face and side surface of the recessed part 26 of the lens structure 21 using a manufacturing apparatus. Then, using a manufacturing apparatus such as a chip mounter, the optical element 25 is connected to the concave portion 26 and the wiring 22 of the lens structure 21 with the connection C1 including alignment. During the alignment, alignment is performed so that the point p0 of the optical element 25, the point p1 of the recess 26 of the lens structure 21, and the point p2 of the 45 degree mirror 24 are aligned on the optical axis of the AA line. .
　［面発光型光素子］
　図１０は、実施の形態１の光コネクタ装置２０の光素子２５、特に送信側光コネクタ装置２０Ａにおける送信側の光素子２５Ａとして用いる、垂直共振型の面発光型の光素子であるＶＣＳＥＬの構成例を示す。ＶＣＳＥＬ（Vertical Cavity Surface Emitting Laser：垂直共振面発光レーザ）は、半導体レーザの一種である。図１０の光素子２５Ａは、円柱形状の場合、及び出射点ｐ０を含む出射領域が１つの場合を示す。 [Surface emitting optical element]
FIG. 10 shows a configuration of a VCSEL which is a vertical resonance surface emitting optical element used as the optical element 25 of the optical connector device 20 according to the first embodiment, particularly as the transmitting optical device 25A in the transmitting optical connector device 20A. An example is shown. A VCSEL (Vertical Cavity Surface Emitting Laser) is a kind of semiconductor laser. The optical element 25A in FIG. 10 shows a case of a cylindrical shape and a case where there is one emission region including the emission point p0.
　図１０（ａ）は、送信側の光素子２５ＡであるＶＣＳＥＬのＸＺ断面の概要を示す。ｓ１は、光素子２５Ａの上面である発光面を示す。面発光型である光素子２５Ａは、基板面に平行なＸＹ方向の発光面ｓ１において、基板面に垂直なＺ方向に共振して面発光することにより、出射点ｐ０からＺ方向への光ａを出射する。発光面ｓ１のＸ方向中心位置に、出射点ｐ０を含む出射領域を有する。ｓ２は、光素子２５Ａの内部の活性層ないし出射部を示す。ｓ３は、光素子２５の電極端子ないしその位置を示す。電極端子ｓ３に対して前述の配線２２が接続される。 FIG. 10A shows an outline of an XZ section of a VCSEL which is the optical element 25A on the transmission side. s1 indicates a light emitting surface which is the upper surface of the optical element 25A. The surface-emitting optical element 25A emits light a in the Z direction from the emission point p0 by resonating in the Z direction perpendicular to the substrate surface on the light emitting surface s1 in the XY direction parallel to the substrate surface. Is emitted. An emission region including the emission point p0 is provided at the center position in the X direction of the light emitting surface s1. s2 represents an active layer or emission part inside the optical element 25A. s3 indicates the electrode terminal of the optical element 25 or its position. The aforementioned wiring 22 is connected to the electrode terminal s3.
　図１０（ｂ）は、図１０（ａ）の光素子２５Ａの上面におけるＸＹ平面での概要を示す。発光面ｓ１の円形の中心に、１つの出射点ｐ０を含む出射領域を有する。また、光素子２５の円形の上面における外周部に電極端子ｓ３を有する。 FIG. 10B shows an outline on the XY plane on the upper surface of the optical element 25A in FIG. An emission region including one emission point p0 is provided at the circular center of the light emitting surface s1. In addition, an electrode terminal s3 is provided on the outer periphery of the circular upper surface of the optical element 25.
　図１１は、上記送信側の光素子２５ＡであるＶＣＳＥＬの変形例である光素子２５Ａｂの構成を示す。図１１の光素子２５Ａｂは、直方体形状の場合であり、出射点ｐ０を出射領域が複数、アレイ状に存在する場合を示す。図１１（ａ）は、光素子２５ＡｂのＸＺ断面の概要を示す。光素子２５Ａの上面の発光面ｓ１において複数の出射点ｐ０を含む出射領域を有する。図１１（ｂ）は、光素子２５Ａｂの上面のＸＹ平面の概要を示す。発光面ｓ１の矩形において、出射点ｐ０を含む出射領域ｓ４が複数、２次元アレイ状に配置されている。 FIG. 11 shows a configuration of an optical element 25Ab that is a modification of the VCSEL that is the optical element 25A on the transmission side. The optical element 25Ab in FIG. 11 is a rectangular parallelepiped shape, and shows a case where the emission point p0 has a plurality of emission regions in an array. FIG. 11A shows an outline of the XZ section of the optical element 25Ab. The light emitting surface s1 on the upper surface of the optical element 25A has an emission region including a plurality of emission points p0. FIG. 11B shows an outline of the XY plane of the upper surface of the optical element 25Ab. In the rectangle of the light emitting surface s1, a plurality of emission regions s4 including the emission point p0 are arranged in a two-dimensional array.
　［機械的接続例］
　図１２は、実施の形態１の光インターコネクト装置１の変形例として、工程Ｓ７及び接続Ｃ２における、光コネクタ装置２０とパッケージ基板１１との機械的接続の構成一例のＸＺ断面の概要を示す。図１２は、パッケージ基板１１上に光コネクタ装置２０を接続した状態において、前述の図１の電気的な接続とは別に、パッケージ基板１１に対しレンズ構造体２１を着脱可能に機械的に接続して保持する手段である保持部１２１を設けた構成を示す。 [Mechanical connection example]
FIG. 12 shows an outline of an XZ cross section of an example of the configuration of mechanical connection between the optical connector device 20 and the package substrate 11 in step S7 and connection C2, as a modification of the optical interconnect device 1 of the first embodiment. FIG. 12 shows a state in which the lens structure 21 is detachably mechanically connected to the package substrate 11 separately from the electrical connection shown in FIG. The structure which provided the holding | maintenance part 121 which is a means to hold is shown.
　保持部１２１は、例えば、ＸＹ平面において、レンズ構造体２１の所定の箇所、例えば四隅などの外周部の位置に対応させて、パッケージ基板１１上の所定の位置に設けられる。前述の接続Ｃ２の際、Ｚ方向において、パッケージ基板１１上の保持部１２１に対し、光コネクタ装置２０のレンズ構造体２１の四隅などの所定の箇所が装着され、保持される。保持部１２１は、例えば樹脂材料などによる構造物が可能である。また、保持部１２は、図１２の構成に限らず、例えばネジ止めなど、各種の手段を適用可能である。 The holding unit 121 is provided at a predetermined position on the package substrate 11 so as to correspond to a predetermined portion of the lens structure 21, for example, the position of the outer peripheral portion such as the four corners, on the XY plane. At the time of the above-described connection C2, predetermined locations such as the four corners of the lens structure 21 of the optical connector device 20 are mounted and held on the holding portion 121 on the package substrate 11 in the Z direction. The holding part 121 can be a structure made of, for example, a resin material. Further, the holding unit 12 is not limited to the configuration of FIG. 12, and various means such as screwing can be applied.
　［光インターコネクトシステム（２）］
　図１３は、光インターコネクト装置１を含む光インターコネクトシステムの機能ブロックの構成例を示す。図１３は、特に光インターコネクトシステムの第２の構成例として、送信及び受信の双方向の光伝送が可能な構成を有する２つの光インターコネクト装置１Ｃを光ケーブル装置３０で接続した構成例を示す。 [Optical interconnect system (2)]
FIG. 13 shows a configuration example of functional blocks of an optical interconnect system including the optical interconnect device 1. FIG. 13 shows a configuration example in which two optical interconnect devices 1C having a configuration capable of bidirectional transmission and reception are connected by an optical cable device 30 as a second configuration example of the optical interconnect system.
　２つの光インターコネクト装置１Ｃは、いずれも、送信機能２Ａと受信機能２Ｂとの両方を備える。送信機能２Ａ及び受信機能２Ｂを構成する要素については、図３の要素と同様である。例えば左側の第１の光インターコネクト装置１Ｃは、光素子駆動ＩＣ１５として、送信側光素子駆動ＩＣ１５Ａ及び受信側光素子駆動ＩＣ１５Ｂを備え、光コネクタ装置１５として、送信側光コネクタ装置２０Ａ及び受信側光コネクタ装置２０Ｂを備える。送信側光素子駆動ＩＣ１５Ａと受信側光素子駆動ＩＣ１５Ｂとは、通信可能に配線１２で接続されている。 The two optical interconnect devices 1C each have both the transmission function 2A and the reception function 2B. The elements constituting the transmission function 2A and the reception function 2B are the same as the elements in FIG. For example, the first optical interconnect device 1 </ b> C on the left side includes a transmission-side optical element drive IC 15 </ b> A and a reception-side optical element drive IC 15 </ b> B as the optical element drive IC 15, and the transmission-side optical connector device 20 </ b> A and the reception-side light as the optical connector device 15. A connector device 20B is provided. The transmitting side optical element driving IC 15A and the receiving side optical element driving IC 15B are connected by a wiring 12 so as to be communicable.
　光インターコネクト装置１Ｃの実装の形態は、例えば前述のパッケージ基板１１のＸＹ平面において、Ｙ方向に、上記送信機能２Ａの部品と、受信機能２Ｂの部品とを並列させる配置で搭載する形態が挙げられる。 Examples of the mounting form of the optical interconnect device 1C include a form in which the components of the transmission function 2A and the components of the reception function 2B are mounted in parallel in the Y direction on the XY plane of the package substrate 11 described above. .
　なお光コネクタ装置２０において、送信側光コネクタ装置２０Ａと受信側光コネクタ装置２０Ｂとは、後述の図１４の例のように、１つのレンズ構造体２１に共通化して実装された形態としてもよい。 In the optical connector device 20, the transmission side optical connector device 20 </ b> A and the reception side optical connector device 20 </ b> B may be configured to be mounted in common on one lens structure 21 as in the example of FIG. 14 described later. .
　左側の第１の光インターコネクト装置１Ｃの送信側光コネクタ装置２０Ａは、右側の第２の光インターコネクト装置１Ｃの受信側光コネクタ装置２０Ｂと、光ファイバ部３３Ａで接続されている。同様に、右側の第２の光インターコネクト装置１Ｃの送信側光コネクタ装置２０Ａは、左側の第１の光インターコネクト装置１Ｃの受信側光コネクタ装置２０Ｂと、光ファイバ部３３Ｂで接続されている。なお光ケーブル装置３０における光ファイバ部３３Ａと光ファイバ部３３Ｂは、後述の図１４の例のように、２本の別の光ファイバで構成されてもよいし、１本の共通化された光ファイバで構成されてもよい。 The transmission side optical connector device 20A of the first optical interconnect device 1C on the left side is connected to the reception side optical connector device 20B of the second optical interconnect device 1C on the right side by an optical fiber portion 33A. Similarly, the transmission side optical connector device 20A of the second optical interconnect device 1C on the right side is connected to the reception side optical connector device 20B of the first optical interconnect device 1C on the left side by an optical fiber portion 33B. Note that the optical fiber portion 33A and the optical fiber portion 33B in the optical cable device 30 may be composed of two separate optical fibers as in the example of FIG. 14 described later, or one common optical fiber. It may be constituted by.
　図４（ｂ）は、図１３の双方向の光伝送が可能な構成に対応した光ケーブル装置３０を示す。光ケーブル装置３０は、送信機能２Ａ及び受信機能２Ｂの両方を備える２つの光コネクタ装置２０を両端として、それらを接続する光ファイバ部３３を有する。図４（ｂ）の光ファイバ部３３は、特に送信側の光ファイバ部３３Ａと受信側の光ファイバ部３３Ｂとを１本の光ファイバ部３３として共通化した構成を有する。 FIG. 4B shows the optical cable device 30 corresponding to the configuration capable of bidirectional optical transmission in FIG. The optical cable device 30 has two optical connector devices 20 having both the transmission function 2A and the reception function 2B as both ends, and an optical fiber portion 33 that connects them. The optical fiber section 33 in FIG. 4B has a configuration in which the transmission-side optical fiber section 33A and the reception-side optical fiber section 33B are shared as one optical fiber section 33.
　［光コネクタ装置の平面構成例］
　図１４は、図１３の光インターコネクト装置１Ｃの光コネクタ装置２０等の実装構成例として、ＸＹ平面の構成の概要を示す。なお図１４のＸＹ平面の構成は、前述の図１等のＸＺ断面の構成と概略対応している。なおＸＹ平面における光素子２５Ａ、光素子２５Ｂ、及び凹部の形状を図１４では図１１に対応した矩形で示しているが、前述のように光素子２５の実装の詳細に応じて図１０の円形などの各種の形状が可能である。 [Example of planar configuration of optical connector device]
FIG. 14 shows an outline of the configuration of the XY plane as a mounting configuration example of the optical connector device 20 and the like of the optical interconnect device 1C of FIG. The configuration of the XY plane in FIG. 14 roughly corresponds to the configuration of the XZ cross section in FIG. Note that the shapes of the optical element 25A, the optical element 25B, and the recess in the XY plane are shown by rectangles corresponding to FIG. 11 in FIG. 14, but as described above, the circular shape of FIG. Various shapes are possible.
　図１４は、光コネクタ装置２０のＸＹ平面の第１の構成例である光コネクタ装置２０Ｃａを示す。光コネクタ装置２０Ｃａは、１つのレンズ構造体２１において、前述の送信側光コネクタ装置２０Ａと受信側光コネクタ装置２０Ｂとを統合し、送信側光コネクタ部２０ａ及び受信側光コネクタ部２０ｂとして備える。光コネクタ装置２０Ｃａは、レンズ構造体２１において、Ｙ方向で、送信用の光素子２５Ａと受信用の光素子２５Ｂとが並列で配置される。光コネクタ装置２０Ｃａは、レンズ構造体２１における送信側光コネクタ部２０ａの凹部に送信用の光素子２５Ａが搭載され、受信側光コネクタ部２０ｂの凹部に受信用の光素子２５Ｂが搭載される。 FIG. 14 shows an optical connector device 20Ca that is a first configuration example of the XY plane of the optical connector device 20. The optical connector device 20Ca integrates the above-described transmission-side optical connector device 20A and the reception-side optical connector device 20B in one lens structure 21, and is provided as a transmission-side optical connector portion 20a and a reception-side optical connector portion 20b. In the optical connector device 20Ca, in the lens structure 21, the transmitting optical element 25A and the receiving optical element 25B are arranged in parallel in the Y direction. In the optical connector device 20Ca, the transmitting optical element 25A is mounted in the concave portion of the transmitting-side optical connector portion 20a in the lens structure 21, and the receiving optical element 25B is mounted in the concave portion of the receiving-side optical connector portion 20b.
　送信側光コネクタ部２０ａは、Ｘ方向において、前述の光素子駆動ＩＣ１５Ａと、光素子２５Ａとが配線１２で接続される。また送信側光コネクタ部２０ａは、Ｘ方向において、光素子２５Ａと送信用の光ファイバ部３３Ａとが直線的に配置され接続されている。ａは光素子２５Ａからの出射光を示す。受信側光コネクタ部２０ｂは、Ｘ方向において、前述の光素子駆動ＩＣ１５Ｂと、光素子２５Ｂとが配線１２で接続される。また受信側光コネクタ部２０ｂは、Ｘ方向において、光素子２５Ｂと受信用の光ファイバ部３３Ｂとが直線的に配置され接続されている。ｂは光素子２５Ｂへの入射光を示す。 In the transmission side optical connector portion 20a, the optical element driving IC 15A and the optical element 25A are connected by the wiring 12 in the X direction. In the transmission side optical connector portion 20a, the optical element 25A and the transmission optical fiber portion 33A are linearly arranged and connected in the X direction. a shows the emitted light from the optical element 25A. In the receiving side optical connector portion 20b, the optical element driving IC 15B and the optical element 25B are connected by the wiring 12 in the X direction. In the receiving side optical connector portion 20b, the optical element 25B and the receiving optical fiber portion 33B are linearly arranged and connected in the X direction. b shows the incident light to the optical element 25B.
　図１５は、図１４とは別の、光コネクタ装置２０のＸＹ平面の第２の構成例である光コネクタ装置２０Ｃｂを示す。光コネクタ装置２０Ｃｂは、更に、送信用の光ファイバ部３３Ａと受信用の光ファイバ部３３Ｂとを１本の光ファイバ部３３として共通化した構成を有する。また光コネクタ装置２０Ｃｂは、共通化された光ファイバ部３３の構成に対応して、レンズ構造体２１において、送信側の光路の一部と受信側の光路の一部とを共通化する共通光学系部１５１を有する。共通光学系部１５１は、例えば、送信側の光素子２５Ａからの出射光ａにおける前述のＢ－Ｂ線の光軸のＸ方向の光路を、Ｙ方向の位置が異なる光ファイバ部３３の端部へと導くために、当該Ｘ方向の光軸からＹ方向へマイナス４５度の方向へ光を曲げる。そして、共通光学系部１５１は、当該マイナス４５度の方向の光路から、光ファイバ部３３の端部の位置で、再度Ｘ方向の光軸へと戻すように、プラス４５度分、光を曲げる。受信側の光素子２５Ｂへの入射光ｂに関しても上記と同様に共通光学系部１５１で光路の方向が変化される。 FIG. 15 shows an optical connector device 20Cb which is a second configuration example of the XY plane of the optical connector device 20, which is different from FIG. The optical connector device 20 </ b> Cb further has a configuration in which the transmission optical fiber portion 33 </ b> A and the reception optical fiber portion 33 </ b> B are shared as one optical fiber portion 33. Further, the optical connector device 20Cb corresponds to the common configuration of the optical fiber portion 33, and in the lens structure 21, a common optical unit that shares a part of the optical path on the transmission side and a part of the optical path on the reception side. It has a system part 151. The common optical system 151 includes, for example, an end portion of the optical fiber portion 33 in which the optical path in the X direction of the optical axis of the BB line in the outgoing light a from the optical element 25A on the transmission side is different in the Y direction. Is bent from the optical axis in the X direction toward the Y direction in the direction of minus 45 degrees. Then, the common optical system unit 151 bends the light by plus 45 degrees so that the optical path in the minus 45 degree direction returns to the optical axis in the X direction again at the position of the end of the optical fiber part 33. . Regarding the incident light b to the optical element 25B on the receiving side, the direction of the optical path is changed by the common optical system 151 as described above.
　他の実施の形態として、光コネクタ装置２０は、１つのレンズ構造体２１において、Ｙ方向などで複数の光素子２５を並列で配置して上記と同様に内蔵させた形態が可能である。 As another embodiment, the optical connector device 20 may have a configuration in which a plurality of optical elements 25 are arranged in parallel in the Y direction or the like in a single lens structure 21 and are built in the same manner as described above.
　［変形例］
　実施の形態１における光素子２５、配線２２、及びレンズ構造体２１の凹部２６などの構成については、上述した構成に限らず、以下に示すような各種の変形例が可能である。実装上用いる光素子２５の部品の形状などに合わせて、レンズ構造体２１の凹部２６及び配線２２の形状などが設計される。 [Modification]
The configuration of the optical element 25, the wiring 22, and the concave portion 26 of the lens structure 21 in Embodiment 1 is not limited to the configuration described above, and various modifications as described below are possible. The shapes of the concave portions 26 and the wirings 22 of the lens structure 21 are designed according to the shape of the components of the optical element 25 used for mounting.
　［光素子の搭載の変形例（１）］
　図１６は、レンズ構造体２１の凹部２６への光素子２５の搭載に関する第１の変形例を示す。図１６の光素子２５は、一定半径の単純な円柱の形状ではなく、Ｚ方向において２段の円柱の形状である。即ち、図１６の光素子２５は、ＸＹ平面での幅として、２種類の幅であるａ１とａ２を有する。発光面ｓ１を持つ上面側のＸＹ方向の幅ａ１が、下面側の幅ａ２よりも小さい。レンズ構造体２１の凹部２６は、この光素子２５の形状に対応して、２段の幅を持つ形状を有する。また図１６は、光素子２５の電極端子ｓ３が例えば下側の円柱部の上面の外周部に設けられている場合を示す。これに対応して、工程Ｓ４及び接続Ｃ１の際、凹部２６における１段目の凹部に配線２２が形成され、当該配線２２が電極端子ｓ３と接続される。また図１６は、光素子２５の下面と、レンズ構造体２１の底面ｆ１とが、Ｚ方向で概略同じ高さに揃っている場合を示す。 [Variation of mounting optical element (1)]
FIG. 16 shows a first modification related to mounting of the optical element 25 in the recess 26 of the lens structure 21. The optical element 25 in FIG. 16 has a shape of a two-stage cylinder in the Z direction, not a simple cylinder shape with a fixed radius. That is, the optical element 25 of FIG. 16 has two types of widths a1 and a2 as widths on the XY plane. The width a1 in the XY direction on the upper surface side having the light emitting surface s1 is smaller than the width a2 on the lower surface side. The concave portion 26 of the lens structure 21 has a shape having a width of two steps corresponding to the shape of the optical element 25. FIG. 16 shows a case where the electrode terminal s3 of the optical element 25 is provided, for example, on the outer peripheral portion of the upper surface of the lower cylindrical portion. Correspondingly, in the process S4 and the connection C1, the wiring 22 is formed in the first-stage recess in the recess 26, and the wiring 22 is connected to the electrode terminal s3. FIG. 16 shows a case where the lower surface of the optical element 25 and the bottom surface f1 of the lens structure 21 are substantially at the same height in the Z direction.
　［光素子の搭載の変形例（２）］
　図１７は、レンズ構造体２１の凹部２６への光素子２５の搭載に関する第２の変形例を示す。図１７の光素子２５は、側面に電極端子ｓ３を有する。工程Ｓ４及び接続Ｃ１の際、まずレンズ構造体２１の凹部２６の側面及びレンズ構造体２１の底面ｆ１の一部にわたって配線２２が形成される。そして、凹部２６の底面に対して光素子２５が搭載され、凹部２６の側面に形成された配線２２と、光素子２５の側面の電極端子ｓ３とが接続される。また図１７は、光素子２５の下面と、レンズ構造体２１の底面ｆ１とが、Ｚ方向で概略同じ高さに揃っている場合を示す。 [Variation of mounting optical element (2)]
FIG. 17 shows a second modification regarding the mounting of the optical element 25 in the concave portion 26 of the lens structure 21. The optical element 25 in FIG. 17 has an electrode terminal s3 on the side surface. In the process S4 and the connection C1, first, the wiring 22 is formed over the side surface of the concave portion 26 of the lens structure 21 and a part of the bottom surface f1 of the lens structure 21. Then, the optical element 25 is mounted on the bottom surface of the recess 26, and the wiring 22 formed on the side surface of the recess 26 is connected to the electrode terminal s3 on the side surface of the optical element 25. FIG. 17 shows a case where the lower surface of the optical element 25 and the bottom surface f1 of the lens structure 21 are substantially at the same height in the Z direction.
　［光素子の搭載の変形例（３）］
　図１８は、レンズ構造体２１の凹部２６への光素子２５の搭載に関する第３の変形例を示す。図１８の光素子２５は、発光面ｓ１を有する上面とは反対側の下側における外周部に電極端子ｓ３を有する。工程Ｓ４及び接続Ｃ１の際、まずレンズ構造体２１の凹部２６の側面の一部及びレンズ構造体２１の底面ｆ１の一部にわたって配線２２が形成される。そして、凹部２６の底面に対して光素子２５が搭載され、光素子２５の下面側の電極端子ｓ３のＺ方向に伸びた部分と、レンズ構造体２１の凹部２６の側面の配線２２とが接続される。凹部２６のＺ方向の深さは、光素子２５のＺ方向の高さよりも大きい。 [Variation of mounting optical element (3)]
FIG. 18 shows a third modification regarding the mounting of the optical element 25 in the recess 26 of the lens structure 21. The optical element 25 in FIG. 18 has an electrode terminal s3 on the outer peripheral portion on the lower side opposite to the upper surface having the light emitting surface s1. In the process S4 and the connection C1, the wiring 22 is first formed over a part of the side surface of the concave portion 26 of the lens structure 21 and a part of the bottom surface f1 of the lens structure 21. The optical element 25 is mounted on the bottom surface of the concave portion 26, and the portion extending in the Z direction of the electrode terminal s 3 on the lower surface side of the optical element 25 is connected to the wiring 22 on the side surface of the concave portion 26 of the lens structure 21. Is done. The depth of the recess 26 in the Z direction is larger than the height of the optical element 25 in the Z direction.
　［効果等］
　以上のように、実施の形態１の光インターコネクト装置１及び光コネクタ装置２０等によれば、電気部品である電子回路基板１０と光部品である光コネクタ装置２０とで明確に分離された構成を有するので、比較例の光素子９１５と光コネクタ装置９２０のレンズ構造体９２１との調芯を含む接続の工程、及び当該工程を含む製造プロセスを低コスト化できる。これにより光インターコネクト装置１及び光コネクタ装置２０等を低コストで提供できる。また実施の形態１によれば、光素子２５が内蔵された一体的な光部品としての光コネクタ装置２０、及び電子回路基板１０と光コネクタ装置２０との接続Ｃ２が電気的な接続であり容易である構成などを有するので、光素子２５の交換が容易である等、光インターコネクト装置１及び光コネクタ装置２０等に関する保守交換性に優れる。 [Effects]
As described above, according to the optical interconnect device 1 and the optical connector device 20 according to the first embodiment, the electronic circuit board 10 that is an electrical component and the optical connector device 20 that is an optical component are clearly separated. Therefore, the cost of the connection process including alignment between the optical element 915 of the comparative example and the lens structure 921 of the optical connector device 920 and the manufacturing process including the process can be reduced. Thereby, the optical interconnect device 1 and the optical connector device 20 can be provided at low cost. In addition, according to the first embodiment, the optical connector device 20 as an integrated optical component incorporating the optical element 25 and the connection C2 between the electronic circuit board 10 and the optical connector device 20 are electrical connections and easy. Therefore, it is easy to replace the optical element 25, and the maintenance and replaceability of the optical interconnect device 1 and the optical connector device 20 is excellent.
　＜実施の形態２＞
　図１９を用いて、実施の形態２の光インターコネクト装置１について説明する。実施の形態２は、実施の形態１の光インターコネクト装置１の構成を前提とし、追加される要素として、図１９に示すように、光コネクタ装置２０Ｄのレンズ構造体２１に、平凸レンズ２７を有する。なお実施の形態２は、送信側の光インターコネクト装置１Ａの場合で説明する。 <Embodiment 2>
The optical interconnect device 1 according to the second embodiment will be described with reference to FIG. The second embodiment is based on the configuration of the optical interconnect device 1 of the first embodiment. As an added element, as shown in FIG. 19, the lens structure 21 of the optical connector device 20D has a plano-convex lens 27. . The second embodiment will be described in the case of the optical interconnect device 1A on the transmission side.
　図１９は、実施の形態２の光インターコネクト装置１における光コネクタ装置２０ＤのＸＺ断面の構成を示す。レンズ構造体２１は、Ａ－Ａ線の光軸における光素子２５の出射点ｐ０に対応した凹部２６の点ｐ１の位置に、平凸レンズ２７を有する。平凸レンズ２７は、集光レンズである。平凸レンズ２７の平面側は、凹部２６の底面に配置され、当該平面の中心点が凹部２６の点ｐ１に一致する。平凸レンズ２７の凸面側は、レンズ構造体２１の内側、Ｚ方向上方の向きで配置される。平凸レンズ２７の焦点は、Ａ－Ａ線の光軸上に存在する。 FIG. 19 shows an XZ cross-sectional configuration of the optical connector device 20D in the optical interconnect device 1 of the second embodiment. The lens structure 21 has a plano-convex lens 27 at the position of the point p1 of the recess 26 corresponding to the emission point p0 of the optical element 25 on the optical axis of the AA line. The plano-convex lens 27 is a condenser lens. The plane side of the plano-convex lens 27 is disposed on the bottom surface of the recess 26, and the center point of the plane coincides with the point p 1 of the recess 26. The convex surface side of the plano-convex lens 27 is disposed on the inner side of the lens structure 21 and in the upward direction in the Z direction. The focal point of the plano-convex lens 27 exists on the optical axis of the AA line.
　平凸レンズ２７を含むレンズ構造体２１により構成される光路は、Ａ－Ａ線の光軸において、光素子２５の点ｐ０からの出射光が、平凸レンズ２７の平面側の点ｐ１から入射され、凸面側から出射する。平凸レンズ２７からのＺ方向への出射光が、４５度ミラー２４の点ｐ２の付近で９０度全反射され、Ｘ方向への光となる。Ｂ－Ｂ線の光軸において、点ｐ２からのＸ方向への光は、光ファイバ接続部２３の点ｐ３から、光ファイバ部３３の端部のコアに入射される。 In the optical path constituted by the lens structure 21 including the plano-convex lens 27, the outgoing light from the point p0 of the optical element 25 is incident from the point p1 on the plane side of the plano-convex lens 27 on the optical axis of the line AA. Emits from the convex side. Light emitted from the plano-convex lens 27 in the Z direction is totally reflected by 90 degrees near the point p2 of the 45 degree mirror 24, and becomes light in the X direction. On the optical axis of the BB line, light in the X direction from the point p2 enters the core at the end of the optical fiber portion 33 from the point p3 of the optical fiber connection portion 23.
　実施の形態２のレンズ構造体２１の光路における出射光ａは、平凸レンズ２７の集光レンズとしての働きにより、光の幅及び面積が小さくなる。実施の形態２のレンズ構造体２１の光路におけるＺ方向の光路部のＸ方向の幅ｈ１及びＸ方向の光路部のＹ方向の幅ｈ２は、実施の形態１のレンズ構造体２１の光路における同じ箇所の幅に比べて狭くなる。これにより、実施の形態２の光コネクタ装置２０Ｄは、点ｐ３から光ファイバ部３３の端部のコア３２へ入射される光の光量が、実施の形態１よりも増える。即ち、実施の形態２は、光伝送の効率を向上することができる。 The outgoing light a in the optical path of the lens structure 21 of the second embodiment has a light width and an area that are reduced by the action of the plano-convex lens 27 as a condenser lens. The width h1 in the X direction of the optical path portion in the Z direction and the width h2 in the Y direction of the optical path portion in the X direction in the optical path of the lens structure 21 in the second embodiment are the same in the optical path of the lens structure 21 in the first embodiment. It becomes narrower than the width of the part. Thereby, in the optical connector device 20D according to the second embodiment, the amount of light incident on the core 32 at the end of the optical fiber portion 33 from the point p3 is larger than that in the first embodiment. That is, Embodiment 2 can improve the efficiency of optical transmission.
　上記実施の形態２は、点ｐ１から点ｐ２へのＺ方向の光路部の途中に平凸レンズ２７を設けた形態であるが、これに限らず、実施の形態２の変形例として、点ｐ２から点ｐ３へのＸ方向の光路部の途中に平凸レンズ２７を設けた形態としてもよい。また受信側の光インターコネクト装置１Ｂに適用する場合、前述の図６の入射光ｂのように、光の方向が逆になるので、それに合わせて、レンズ構造体２１に平凸レンズ２７の向きを逆にして設けた形態とすればよい。 In the second embodiment, the plano-convex lens 27 is provided in the middle of the optical path portion in the Z direction from the point p1 to the point p2. However, the present invention is not limited to this. A plano-convex lens 27 may be provided in the middle of the optical path portion in the X direction to the point p3. Further, when applied to the optical interconnect device 1B on the reception side, the direction of the light is reversed as in the case of the incident light b in FIG. 6 described above, and accordingly, the direction of the plano-convex lens 27 is reversed to the lens structure 21 accordingly. It is sufficient to adopt the form provided as above.
　＜実施の形態３＞
　図２０を用いて、実施の形態３の光インターコネクト装置１について説明する。実施の形態３は、実施の形態１の光インターコネクト装置１の構成を前提とし、追加される要素として、図２０に示すように、光コネクタ装置２０Ｅのレンズ構造体２１の凹部２６において、光素子２６のＺ方向下側に蓋部２８を有する。 <Embodiment 3>
The optical interconnect device 1 according to the third embodiment will be described with reference to FIG. The third embodiment is based on the configuration of the optical interconnect device 1 of the first embodiment. As an added element, as shown in FIG. 20, in the concave portion 26 of the lens structure 21 of the optical connector device 20E, an optical element is provided. 26 has a lid portion 28 on the lower side in the Z direction.
　図２０は、実施の形態３の光インターコネクト装置１における光コネクタ装置２０ＥのＸＺ断面の構成を示す。前述の製造時の工程Ｓ４及び接続Ｃ１の際、レンズ構造体２１の凹部２６に、配線２２を介して、光素子２５が搭載される。そして実施の形態３では、更に、凹部２６の光素子２５のＺ方向下側に近接して、蓋部２８が搭載される。例えば、レンズ構造体２１の底面ｆ１が配線２２を除いて平坦になるように、Ｚ方向における凹部２６の深さと光素子２５の高さとに合わせて、蓋部２８の高さが設計される。またレンズ構造体２１における蓋部２８は、光素子２５に対して固定されてもよいし、レンズ構造体２１の側面などに対して固定されてもよい。 FIG. 20 shows a configuration of an XZ cross section of the optical connector device 20E in the optical interconnect device 1 of the third embodiment. In the above-described manufacturing step S4 and connection C1, the optical element 25 is mounted in the concave portion 26 of the lens structure 21 via the wiring 22. In the third embodiment, the lid portion 28 is further mounted close to the lower side of the concave portion 26 in the Z direction of the optical element 25. For example, the height of the lid portion 28 is designed according to the depth of the concave portion 26 and the height of the optical element 25 in the Z direction so that the bottom surface f1 of the lens structure 21 is flat except for the wiring 22. The lid portion 28 in the lens structure 21 may be fixed to the optical element 25 or may be fixed to the side surface of the lens structure 21 or the like.
　凹部２６が蓋部２８が搭載されることにより、光素子２５は、レンズ構造体２１の底面ｆ１で外側に露出する部分が無くなる。レンズ構造体２１の底面ｆ１は、パッケージ基板１１側の配線１２と接続される部分の配線２２を除き、蓋部３０１を含めて、概略的に平坦なＸＹ平面になる。レンズ構造体２１の平坦な底面ｆ１において配線２２の一部のみが外部に露出した状態となる。 By mounting the lid portion 28 on the concave portion 26, the optical element 25 has no portion exposed to the outside at the bottom surface f <b> 1 of the lens structure 21. The bottom surface f <b> 1 of the lens structure 21 is a substantially flat XY plane including the lid portion 301 except for the portion of the wiring 22 connected to the wiring 12 on the package substrate 11 side. Only a part of the wiring 22 is exposed to the outside on the flat bottom surface f1 of the lens structure 21.
　蓋部２８は、レンズ構造体２１と同じ材料で構成されてもよいし、別の材料で構成されてもよい。即ち、レンズ構造体２１の一部として蓋部２８を含む構成としてもよいし、レンズ構造体２１とは別の部品として蓋部２８を設ける構成としてもよい。また蓋部２８は、レンズ構造体２１に対して取り付け及び取り外しが可能な構造としてもよい。また蓋部２８は、更に、凹部２６において光素子２５に接触して固定する構造としてもよい。その場合、凹部２６内における光素子２５の位置及び光軸の保持性が高まる。 The lid portion 28 may be made of the same material as the lens structure 21 or may be made of another material. That is, the lid 28 may be included as a part of the lens structure 21, or the lid 28 may be provided as a separate component from the lens structure 21. The lid 28 may have a structure that can be attached to and detached from the lens structure 21. Further, the lid portion 28 may be configured to be fixed in contact with the optical element 25 in the concave portion 26. In this case, the position of the optical element 25 in the recess 26 and the optical axis retainability are enhanced.
　＜実施の形態４＞
　図２１～図２３を用いて、実施の形態４の光インターコネクト装置１について説明する。実施の形態４は、図２１等に示すように、レンズ構造体２１の側面に凹部２６が設けられ、当該側面の凹部２６に面発光型の光素子２５が搭載され、これによりレンズ構造体２１はＸ方向の直線的な光路を構成する。また実施の形態４は、光コネクタ装置２０とパッケージ基板１１との電気的及び機械的な接続の手段として、プレスフィット方式のスプリングコネクタを用いる。なお実施の形態４の光インターコネクト装置１Ｆは、送信側の光インターコネクト装置１Ａの場合で説明する。 <Embodiment 4>
The optical interconnect device 1 according to the fourth embodiment will be described with reference to FIGS. In the fourth embodiment, as shown in FIG. 21 and the like, a concave portion 26 is provided on the side surface of the lens structure 21, and a surface emitting optical element 25 is mounted on the concave portion 26 on the side surface. Constitutes a linear optical path in the X direction. The fourth embodiment uses a press-fit spring connector as means for electrical and mechanical connection between the optical connector device 20 and the package substrate 11. The optical interconnect device 1F according to the fourth embodiment will be described in the case of the optical interconnect device 1A on the transmission side.
　図２１は、実施の形態４の光インターコネクト装置１ＦのＸＺ断面の構成を示す。光インターコネクト装置１Ｆは、パッケージ基板１１上に、配線１２を介して、送信側光素子駆動ＩＣ１５Ａ、及び送信側光コネクタ装置２０Ｂである光コネクタ装置２０Ｆ等を搭載する。光コネクタ装置２０Ｆは、パッケージ基板１１に対して、プレスフィット方式のスプリングコネクタを用いて電気的及び機械的に接続される。光コネクタ装置２０Ｆ側の配線２２は、接続部として、スプリングコネクタのピン４１が接続されている。パッケージ基板１１側の配線１２は、接続部として、スプリングコネクタのソケット４２が形成されている。 FIG. 21 shows an XZ cross-sectional configuration of the optical interconnect device 1F of the fourth embodiment. The optical interconnect device 1F mounts a transmission side optical element drive IC 15A and an optical connector device 20F, which is the transmission side optical connector device 20B, on the package substrate 11 via the wiring 12. The optical connector device 20F is electrically and mechanically connected to the package substrate 11 using a press-fit spring connector. The wire 22 on the optical connector device 20F side is connected to a pin 41 of a spring connector as a connection portion. The wiring 12 on the package substrate 11 side is formed with a spring connector socket 42 as a connecting portion.
　光コネクタ装置２０Ｆは、前述の工程Ｓ７でパッケージ基板１１に搭載される際は、基板面垂直方向であるＺ方向において、光コネクタ装置２０Ｆ側のピン４１が、パッケージ基板１１側のソケット４２に挿入され、配線１２と配線２２が電気的に接続されると共に固定される。ソケット４２へのピン４１の圧入によりピン４１の弾性部が変形してソケット４２の内面に接触する。これにより、光素子駆動ＩＣ１５と光素子２５とが配線１２及び配線２２を通じて電気的に接続される。また光コネクタ装置２０Ｆは、パッケージ基板１１から取り外される際は、ピン４１がソケット４２から抜かれる。 When the optical connector device 20F is mounted on the package substrate 11 in the above-described step S7, the pins 41 on the optical connector device 20F side are inserted into the sockets 42 on the package substrate 11 side in the Z direction, which is the direction perpendicular to the substrate surface. Then, the wiring 12 and the wiring 22 are electrically connected and fixed. When the pin 41 is press-fitted into the socket 42, the elastic portion of the pin 41 is deformed and contacts the inner surface of the socket 42. Thereby, the optical element driving IC 15 and the optical element 25 are electrically connected through the wiring 12 and the wiring 22. Further, when the optical connector device 20 </ b> F is removed from the package substrate 11, the pins 41 are removed from the socket 42.
　図２２は、実施の形態４の光コネクタ装置２０ＦのＸＺ断面の構成を示す。実施の形態４の光コネクタ装置２０Ｆのレンズ構造体２１は、Ｘ方向右側のＹＺ平面である一方側の側面に光ファイバ接続部２３を有し、光ファイバ接続部２３に光ファイバ部３３の端部が接続される。レンズ構造体２１の点ｐ２は、Ｂ－Ｂ線の光軸における、光ファイバ部３３の端部のコアが接続される点に対応する。 FIG. 22 shows an XZ cross-sectional configuration of the optical connector device 20F of the fourth embodiment. The lens structure 21 of the optical connector device 20F according to the fourth embodiment has an optical fiber connection portion 23 on one side surface which is a YZ plane on the right side in the X direction, and the end of the optical fiber portion 33 is connected to the optical fiber connection portion 23. Parts are connected. The point p2 of the lens structure 21 corresponds to the point where the core at the end of the optical fiber portion 33 is connected on the optical axis of the BB line.
　光コネクタ装置２０Ｆのレンズ構造体２１は、Ｘ方向左側のＹＺ平面である他方側の側面ｆ２に凹部２６が設けられている。側面ｆ２は、底面ｆ１に対して直立する面である。レンズ構造体２１の側面ｆ２の凹部２６に、配線２２を介して、面発光型の光素子２５、特に送信側の光素子２５Ａが搭載される。Ｂ－Ｂ線の光軸において、凹部２６のＹＺ平面である底面に対し、光素子２５の点ｐ０を含む発光面である上面が、Ｘ方向を向く配置で搭載される。 The lens structure 21 of the optical connector device 20F has a recess 26 on the other side surface f2 which is the YZ plane on the left side in the X direction. The side surface f2 is a surface that stands upright with respect to the bottom surface f1. A surface-emitting optical element 25, particularly a transmitting-side optical element 25 </ b> A is mounted in the concave portion 26 on the side surface f <b> 2 of the lens structure 21 via the wiring 22. On the optical axis of the BB line, the upper surface, which is the light emitting surface including the point p0 of the optical element 25, is mounted in an arrangement facing the X direction with respect to the bottom surface, which is the YZ plane of the recess 26.
　これにより、レンズ構造体２１により構成される光路は、光素子２５の発光面の点ｐ０に対応したレンズ構造体２１の凹部２６の側面の点ｐ１から、光ファイバ接続部２３の点ｐ２までのＸ方向への直線の光路部を含む。即ちレンズ構造体２１の光路は、Ｘ方向の直線的な光路となる。送信側の光素子２５Ａの点ｐ０からのＸ方向への出射光ａは、レンズ構造体２１の点ｐ１、点ｐ２を経由して、光ファイバ部３３のコアへ入射される。実施の形態４は、レンズ構造体２１において前述の４５度ミラー２４を設ける必要は無い。 Thereby, the optical path constituted by the lens structure 21 extends from the point p1 on the side surface of the concave portion 26 of the lens structure 21 corresponding to the point p0 on the light emitting surface of the optical element 25 to the point p2 on the optical fiber connection portion 23. It includes a straight optical path in the X direction. That is, the optical path of the lens structure 21 is a linear optical path in the X direction. The outgoing light a in the X direction from the point p0 of the optical element 25A on the transmission side is incident on the core of the optical fiber portion 33 via the points p1 and p2 of the lens structure 21. In the fourth embodiment, it is not necessary to provide the aforementioned 45-degree mirror 24 in the lens structure 21.
　配線２２は、凹部２６の底面及び側面からレンズ構造体２１の側面ｆ２を経由して、レンズ構造体２１の底面ｆ１まで延在して形成される。例えば実施の形態１と同様に、光素子２５の上面の外周部の電極端子が凹部２６の底面の配線２２に接続される。配線２２の底面ｆ１側の端部は、スプリングコネクタのピン４１が接続される。４３はスプリングコネクタのピン４１の収容部を示す。 The wiring 22 is formed to extend from the bottom surface and side surface of the recess 26 to the bottom surface f1 of the lens structure 21 via the side surface f2 of the lens structure 21. For example, as in the first embodiment, the electrode terminals on the outer periphery of the upper surface of the optical element 25 are connected to the wiring 22 on the bottom surface of the recess 26. A pin 41 of a spring connector is connected to the end of the wiring 22 on the bottom surface f1 side. Reference numeral 43 denotes a housing portion for the pin 41 of the spring connector.
　図２３は、図２２に対応した、実施の形態４の光コネクタ装置２０Ｆの接続前の状態のＸＺ断面の構成を示す。前述の工程Ｓ４及び接続Ｃ１の際、レンズ構造体２１の凹部２６の底面からレンズ構造体２１の側面ｆ２にわたって配線２２が形成される。チップマウンタ等の製造装置を用いて、光素子２５は、レンズ構造体２１に対し、Ｘ方向のＢ－Ｂ線の光軸において、光素子２５の点ｐ０、レンズ構造体２１の凹部２６の底面の点ｐ１、及び光ファイバ接続部３３の点ｐ２が揃うように調芯しながら接続される。 FIG. 23 shows a configuration of an XZ cross section in a state before connection of the optical connector device 20F of the fourth embodiment, corresponding to FIG. In the above-described step S4 and connection C1, the wiring 22 is formed from the bottom surface of the concave portion 26 of the lens structure 21 to the side surface f2 of the lens structure 21. Using a manufacturing apparatus such as a chip mounter, the optical element 25 is positioned at the point p0 of the optical element 25 and the bottom surface of the concave portion 26 of the lens structure 21 with respect to the lens structure 21 on the optical axis of the BB line in the X direction. The point p1 and the point p2 of the optical fiber connecting portion 33 are connected while being aligned.
　実施の形態４の光インターコネクト装置１Ｆによれば、実施の形態１等と同様に、調芯を含む接続の工程を低コスト化でき、これにより低コストで保守交換性に優れた光インターコネクト装置１Ｆ等を提供できる。実施の形態４における電子回路基板１０と光コネクタ装置２０との接続の方式によれば、配線１２と配線２２との無はんだ接続が可能である。実施の形態４の接続の方式によれば、例えば光素子２５が故障して光コネクタ装置２０ごと交換する際、交換の作業はピン４１とソケット４２との抜き差しだけで済み、容易である。 According to the optical interconnect device 1F of the fourth embodiment, as in the first embodiment and the like, it is possible to reduce the cost of the connection process including alignment, thereby reducing the cost and maintaining and exchanging the optical interconnect device 1F. Etc. can be provided. According to the connection method between the electronic circuit board 10 and the optical connector device 20 in the fourth embodiment, the wiring 12 and the wiring 22 can be connected without soldering. According to the connection method of the fourth embodiment, for example, when replacing the optical connector device 20 due to a failure of the optical element 25, the replacement work can be performed simply by inserting and removing the pin 41 and the socket 42.
　実施の形態４の変形例として、レンズ構造体２１において凹部２６の光素子２５と光ファイバ部３３の端部との間に平凸レンズ等の集光手段が設けられることで、光ファイバ部３３のコアに入射される光量を調整する形態としてもよい。また実施の形態４の変形例として、スプリングコネクタによる接続の方式に限らず、例えば実施の形態１と同様にレンズ構造体２１の底面ｆ１の一部まで延在して形成される配線２２を設け、当該底面ｆ１の配線２２がパッケージ基板１１側の配線１２に接続される形態としてもよい。 As a modification of the fourth embodiment, in the lens structure 21, a condensing unit such as a plano-convex lens is provided between the optical element 25 of the concave portion 26 and the end of the optical fiber portion 33. The amount of light incident on the core may be adjusted. Further, as a modification of the fourth embodiment, not only the connection method by the spring connector but also the wiring 22 formed to extend to a part of the bottom surface f1 of the lens structure 21 is provided as in the first embodiment, for example. The wiring 22 on the bottom surface f1 may be connected to the wiring 12 on the package substrate 11 side.
　＜実施の形態５＞
　図２４～図２７を用いて、実施の形態５の光インターコネクト装置１Ｄについて説明する。実施の形態５は、図２４等に示すように、光素子２５として前述の面発光型とは異なる端面発光型の光素子を用い、レンズ構造体２１の上面ｆ３に凹部２６が設けられ、当該上面ｆ３の凹部２６に光素子２５が搭載され、これによりレンズ構造体２１はＸ方向の直線的な光路を構成する。なお実施の形態５の光インターコネクト装置１Ｇは、送信側の光インターコネクト装置１Ａの場合で説明する。 <Embodiment 5>
The optical interconnect device 1D according to the fifth embodiment will be described with reference to FIGS. In the fifth embodiment, as shown in FIG. 24 and the like, an optical element of an edge-emitting type different from the above-described surface-emitting type is used as the optical element 25, and a concave portion 26 is provided on the upper surface f3 of the lens structure 21. The optical element 25 is mounted in the concave portion 26 of the upper surface f3, whereby the lens structure 21 forms a linear optical path in the X direction. The optical interconnect device 1G according to the fifth embodiment will be described in the case of the optical interconnect device 1A on the transmission side.
　図２４は、実施の形態５の光インターコネクト装置１ＧのＸＺ断面の構成を示す。光インターコネクト装置１Ｇは、パッケージ基板１１上に、配線１２を介して、送信側光素子駆動ＩＣ１５Ａ、及び送信側光コネクタ装置２０Ｂである光コネクタ装置２０Ｇ等を搭載する。光コネクタ装置２０Ｇのレンズ構造体２１は、底面ｆ１とは反対側の、Ｚ方向上方のＸＹ平面である上面ｆ３に凹部２６が設けられている。上面ｆ３の凹部２６に端面発光型の光素子２５Ｇが搭載される。後述の図２７は、端面発光型の光素子２５Ｇについて示す。実施の形態５では、光素子２５Ｇに接続される配線２２は、レンズ構造体２１に設けられた貫通孔６３を通じて、凹部２６の底面からレンズ構造体２１の底面ｆ１までにわたって形成される。そしてレンズ構造体２１の底面ｆ１の配線２２がパッケージ基板１１側の配線１２に対して接続される。 FIG. 24 shows an XZ cross-sectional configuration of the optical interconnect device 1G of the fifth embodiment. The optical interconnect device 1G mounts a transmission side optical element driving IC 15A and an optical connector device 20G as the transmission side optical connector device 20B on the package substrate 11 via the wiring 12. The lens structure 21 of the optical connector device 20G is provided with a recess 26 on an upper surface f3 that is an XY plane on the upper side in the Z direction on the side opposite to the bottom surface f1. An edge-emitting optical element 25G is mounted in the recess 26 on the upper surface f3. FIG. 27 described later shows the edge-emitting optical element 25G. In the fifth embodiment, the wiring 22 connected to the optical element 25G is formed from the bottom surface of the recess 26 to the bottom surface f1 of the lens structure 21 through the through-hole 63 provided in the lens structure 21. The wiring 22 on the bottom surface f1 of the lens structure 21 is connected to the wiring 12 on the package substrate 11 side.
　図２５は、実施の形態５の光コネクタ装置２０ＧのＸＺ断面の構成を示す。実施の形態５の光コネクタ装置２０Ｇのレンズ構造体２１は、Ｘ方向右側及びＺ方向上側の領域に光ファイバ接続部２３を有し、光ファイバ接続部２３に光ファイバ部３３の端部が接続される。レンズ構造体２１の光ファイバ接続部２３の点ｐ２は、Ｂ－Ｂ線の光軸における、光ファイバ部３３の端部のコアが接続される点に対応する。 FIG. 25 shows a configuration of an XZ section of the optical connector device 20G of the fifth embodiment. The lens structure 21 of the optical connector device 20G according to the fifth embodiment has the optical fiber connection portion 23 in the region on the right side in the X direction and the upper side in the Z direction, and the end portion of the optical fiber portion 33 is connected to the optical fiber connection portion 23. Is done. The point p2 of the optical fiber connection portion 23 of the lens structure 21 corresponds to the point where the core at the end of the optical fiber portion 33 is connected on the optical axis of the BB line.
　光コネクタ装置２０Ｇのレンズ構造体２１は、Ｚ方向上方のＸＹ平面である上面ｆ３に凹部２６が設けられている。レンズ構造体２１の上面ｆ３の凹部２６に、配線２２を介して、端面発光型の光素子２５Ｇ、特に送信側の光素子２５Ａが搭載される。Ａ－Ａ線で示すＺ方向の搭載の中心軸において、凹部２６のＸＹ平面である底面に対し、光素子２５Ｇの点ｐ０を含む発光面である端面がＸ方向右側を向く配置で、光素子２５Ｇの下面が搭載される。 The lens structure 21 of the optical connector device 20G is provided with a recess 26 on the upper surface f3 that is the XY plane above the Z direction. An edge-emitting optical element 25G, in particular, a transmitting-side optical element 25A is mounted on the concave portion 26 of the upper surface f3 of the lens structure 21 via the wiring 22. An end face which is a light emitting surface including the point p0 of the optical element 25G faces the right side in the X direction with respect to the bottom surface which is the XY plane of the recess 26 on the central axis of the mounting in the Z direction indicated by the line AA. The lower surface of 25G is mounted.
　配線２２は、凹部２６の底面からＺ方向に延在する貫通孔６３を経由してレンズ構造体２１の底面ｆ１の一部まで延在して形成される。例えば光素子２５Ｇの下面の外周部にある電極端子が、凹部２６の底面に設けられた貫通孔６３を通じて形成される配線２２の一方端部と接続される。 The wiring 22 is formed to extend from the bottom surface of the recess 26 to a part of the bottom surface f1 of the lens structure 21 through a through hole 63 extending in the Z direction. For example, an electrode terminal on the outer peripheral portion of the lower surface of the optical element 25G is connected to one end portion of the wiring 22 formed through the through hole 63 provided in the bottom surface of the recess 26.
　これにより、レンズ構造体２１により構成される光路は、光素子２５の端面の点ｐ０に対応したレンズ構造体２１の凹部２６の側面の点ｐ１から、光ファイバ接続部２３の点ｐ２までのＸ方向への直線の光路部を含む。即ちレンズ構造体２１の光路は、Ｘ方向の直線的な光路となる。送信側の光素子２５Ａの点ｐ０からのＸ方向への出射光ａは、レンズ構造体２１の点ｐ１、点ｐ２を経由して、光ファイバ部３３のコアへ入射される。実施の形態５は、レンズ構造体２１において前述の４５度ミラー２４を設ける必要は無い。 Thereby, the optical path constituted by the lens structure 21 is X from the point p1 on the side surface of the concave portion 26 of the lens structure 21 corresponding to the point p0 on the end face of the optical element 25 to the point p2 on the optical fiber connection portion 23. Includes a straight optical path to the direction. That is, the optical path of the lens structure 21 is a linear optical path in the X direction. The outgoing light a in the X direction from the point p0 of the optical element 25A on the transmission side is incident on the core of the optical fiber portion 33 via the points p1 and p2 of the lens structure 21. In the fifth embodiment, it is not necessary to provide the aforementioned 45-degree mirror 24 in the lens structure 21.
　図２６は、図２５に対応した、実施の形態５の光コネクタ装置２０Ｇの接続前の状態のＸＺ断面の構成を示す。前述の工程Ｓ４及び接続Ｃ１の際、レンズ構造体２１の凹部２６の底面からレンズ構造体２１の底面ｆ１への貫通孔６３を通じて配線２２が形成される。チップマウンタ等の製造装置を用いて、光素子２５Ｇは、レンズ構造体２１に対し、Ａ－Ａ線で示すＺ方向の搭載の中心軸において、光素子２５Ｇの上下面の中心点、レンズ構造体２１の凹部２６の底面の中心点が揃うように、調芯しながら接続される。またその搭載の際、光素子２５Ｇは、Ｂ－Ｂ線のＸ方向の光軸において、光素子２５Ｇの端面の点ｐ０、レンズ構造体２１の凹部２６の側面の点ｐ１、及び光ファイバ接続部３３の点ｐ２が揃うように、調芯しながら接続される。 FIG. 26 shows an XZ cross-sectional configuration before connection of the optical connector device 20G of the fifth embodiment, corresponding to FIG. In the above-described step S4 and connection C1, the wiring 22 is formed through the through hole 63 from the bottom surface of the concave portion 26 of the lens structure 21 to the bottom surface f1 of the lens structure 21. Using a manufacturing apparatus such as a chip mounter, the optical element 25G has a central structure on the upper and lower surfaces of the optical element 25G on the central axis of the mounting in the Z direction indicated by the line AA with respect to the lens structure 21, and the lens structure. 21 are connected while being aligned so that the center points of the bottom surfaces of the recesses 26 are aligned. When mounted, the optical element 25G has a point p0 on the end face of the optical element 25G, a point p1 on the side surface of the concave portion 26 of the lens structure 21, and an optical fiber connection portion on the optical axis in the X direction of the BB line. The connections are made while aligning so that 33 points p2 are aligned.
　更に、図２５に示すように、実施の形態５の光コネクタ装置２０Ｇは、レンズ構造体２１において、凹部２６と光ファイバ接続部２３との間、Ｂ－Ｂ線の光軸上に、集光レンズとして働く平凸レンズ２７を設けた形態としてもよい。平凸レンズ２７の平面側は、その中心点が凹部２６の点１に対応して配置される。平凸レンズ２７の凸面側は、Ｘ方向右側の向きで配置される。平凸レンズ２７は、光素子２５Ｇの点ｐ０からの出射光を平面側から入射して凸面側から出射し、Ｂ－Ｂ線の光軸におけるＸ方向の光路部におけるＹＺ方向の光の幅ｈ３ないし面積を狭める。これにより光ファイバ部３３の端部のコアに入射される光量を増やす。 Further, as shown in FIG. 25, the optical connector device 20G according to the fifth embodiment condenses light on the optical axis of the BB line between the concave portion 26 and the optical fiber connecting portion 23 in the lens structure 21. A plano-convex lens 27 serving as a lens may be provided. On the plane side of the plano-convex lens 27, the center point thereof is arranged corresponding to the point 1 of the recess 26. The convex surface side of the plano-convex lens 27 is arranged in the right direction in the X direction. The plano-convex lens 27 receives light emitted from the point p0 of the optical element 25G from the plane side and exits from the convex surface side, and the width h3 or the width of light in the YZ direction in the optical path portion in the X direction on the optical axis of the BB line. Narrow the area. As a result, the amount of light incident on the core at the end of the optical fiber portion 33 is increased.
　［端面発光型光素子］
　図２７は、実施の形態５の光コネクタ装置２０Ｇにおいて送信側の光素子２５Ａとして用いる、端面発光型の光素子２５Ｇの構成例を示す。図２７の光素子２５Ｇは、直方体形状の場合、及び出射点ｐ０を含む出射領域が１つの場合を示す。図２７（ａ）は、端面発光型の光素子２５ＧのＸＺ断面の概略を示す。ｓ１は、出射点ｐ０を含む発光面となる端面を示し、Ｘ方向右側の基板面垂直なＹＺ平面である。ｓ２は、光素子２５Ｇの内部の活性層ないし出射部を示す。ｓ３は、光素子２５Ｇの電極端子ないしその位置の例として下面の外周部にある場合を示す。図２７（ｂ）は、図２７（ａ）の光素子２５Ｇの端面ｓ１の様子を斜視図で示す。光素子２５Ｇは、発光面ｓ１のＹ方向及びＺ方向の中心位置に、出射点ｐ０を含む出射領域を有する。光素子２５Ｇは、端面ｓ１における出射領域から、基板面に平行な方向であるＸ方向へ共振させて発光することにより、出射点ｐ０からＸ方向への光ａを出射する。 [Edge-emitting optical device]
FIG. 27 shows a configuration example of an edge-emitting optical element 25G used as the transmitting-side optical element 25A in the optical connector device 20G of the fifth embodiment. The optical element 25G in FIG. 27 shows a case of a rectangular parallelepiped shape and a case where there is one emission region including the emission point p0. FIG. 27A schematically shows an XZ section of the edge-emitting optical element 25G. s1 indicates an end surface serving as a light emitting surface including the emission point p0, and is a YZ plane perpendicular to the substrate surface on the right side in the X direction. s2 represents an active layer or emission part inside the optical element 25G. s3 shows the case where it exists in the outer peripheral part of a lower surface as an example of the electrode terminal of the optical element 25G, or its position. FIG. 27B is a perspective view showing the state of the end face s1 of the optical element 25G in FIG. The optical element 25G has an emission region including the emission point p0 at the center position in the Y direction and Z direction of the light emitting surface s1. The optical element 25G emits light a from the emission point p0 in the X direction by resonating in the X direction, which is a direction parallel to the substrate surface, from the emission region on the end surface s1.
　実施の形態５の光インターコネクト装置１Ｇによれば、実施の形態１等と同様に、調芯を含む接続の工程を低コスト化でき、これにより低コストで保守交換性に優れた光インターコネクト装置１Ｇ等を提供できる。 According to the optical interconnect device 1G of the fifth embodiment, as in the first embodiment and the like, the cost of the connection process including alignment can be reduced, thereby reducing the cost and maintaining and exchanging the optical interconnect device 1G. Etc. can be provided.
　実施の形態５の変形例として、レンズ構造体２１に設ける貫通孔６３は、Ｚ方向に限らず、凹部２６の側面からＸ方向へレンズ構造体２１の側面ｆ２へ抜ける貫通孔として設けてもよい。また実施の形態５の変形例として、レンズ構造体２１に貫通孔６３を設けずに、レンズ構造体２１の上面ｆ３や側面ｆ２を経由して底面ｆ１まで配線２２を引き回して設ける形態としてもよい。 As a modification of the fifth embodiment, the through hole 63 provided in the lens structure 21 is not limited to the Z direction, and may be provided as a through hole extending from the side surface of the recess 26 to the side surface f2 of the lens structure 21 in the X direction. . As a modification of the fifth embodiment, the lens structure 21 may be provided with the wiring 22 routed to the bottom surface f1 via the top surface f3 and the side surface f2 without providing the through hole 63 in the lens structure 21. .
　＜実施の形態６＞
　図２８を用いて、実施の形態６の光インターコネクト装置１Ｈについて説明する。実施の形態６は、図２６に示すように、光素子２５として実施の形態５と同様に端面発光型の光素子２５Ｇを用い、実施の形態１と同様にレンズ構造体２１の底面ｆ１に凹部２６が設けられ、当該底ｆ１の凹部２６に光素子２５Ｇが搭載され、これによりレンズ構造体２１はＸ方向の直線的な光路を構成する。なお実施の形態６の光インターコネクト装置１Ｈは、送信側の光インターコネクト装置１Ａの場合で説明する。 <Embodiment 6>
The optical interconnect device 1H according to the sixth embodiment will be described with reference to FIG. As shown in FIG. 26, the sixth embodiment uses an edge-emitting optical element 25G as the optical element 25 in the same manner as in the fifth embodiment, and a concave portion on the bottom surface f1 of the lens structure 21 as in the first embodiment. 26, and the optical element 25G is mounted in the concave portion 26 of the bottom f1, whereby the lens structure 21 forms a linear optical path in the X direction. The optical interconnect device 1H of the sixth embodiment will be described in the case of the optical interconnect device 1A on the transmission side.
　図２８は、実施の形態６の光インターコネクト装置１Ｈに備える光コネクタ装置２０ＨのＸＺ断面の構成を示す。実施の形態６の光コネクタ装置２０Ｈのレンズ構造体２１は、Ｘ方向右側及びＺ方向下側の領域に光ファイバ接続部２３を有し、光ファイバ接続部２３に光ファイバ部３３の端部が接続される。レンズ構造体２１の光ファイバ接続部２３の点ｐ２は、Ｂ－Ｂ線の光軸における、光ファイバ部３３の端部のコアが接続される点に対応する。 FIG. 28 shows a configuration of an XZ section of the optical connector device 20H provided in the optical interconnect device 1H of the sixth embodiment. The lens structure 21 of the optical connector device 20H according to the sixth embodiment has the optical fiber connection portion 23 in the X direction right side and Z direction lower side regions, and the end portion of the optical fiber portion 33 is connected to the optical fiber connection portion 23. Connected. The point p2 of the optical fiber connection portion 23 of the lens structure 21 corresponds to the point where the core at the end of the optical fiber portion 33 is connected on the optical axis of the BB line.
　実施の形態６の光コネクタ装置２０Ｈのレンズ構造体２１は、底面ｆ１に凹部２６が設けられている。レンズ構造体２１の底面ｆ１の凹部２６に、配線２２を介して、端面発光型の光素子２５Ｇ、特に送信側の光素子２５Ａが搭載される。光素子２５Ｇに接続される配線２２は、凹部２６の底面から側面を経由してレンズ構造体２１の底面ｆ１の所定の位置までにわたって形成される。例えば光素子２５Ｇの下面の外周部にある電極端子が、凹部２６の底面に形成された配線２２の一方端部と接続される。光コネクタ装置２０Ｈは、実施の形態１と同様に、レンズ構造体２１の底面ｆ１の配線２２が、パッケージ基板１１の配線１２に対して接続される。 The lens structure 21 of the optical connector device 20H according to the sixth embodiment has a recess 26 on the bottom surface f1. An end surface light emitting type optical element 25G, particularly a transmitting side optical element 25A is mounted in the concave portion 26 of the bottom surface f1 of the lens structure 21 via the wiring 22. The wiring 22 connected to the optical element 25G is formed from the bottom surface of the recess 26 to a predetermined position on the bottom surface f1 of the lens structure 21 via the side surface. For example, an electrode terminal on the outer peripheral portion of the lower surface of the optical element 25G is connected to one end portion of the wiring 22 formed on the bottom surface of the recess 26. In the optical connector device 20H, the wiring 22 on the bottom surface f1 of the lens structure 21 is connected to the wiring 12 on the package substrate 11 as in the first embodiment.
　前述の工程Ｓ４及び接続Ｃ１の際、チップマウンタ等の製造装置を用いて、光素子２５Ｇは、Ａ－Ａ線で示すＺ方向の搭載の中心軸において、凹部２６の底面に対し、光素子２５Ｇの点ｐ０を含む発光面である端面がＸ方向右側を向く配置で、光素子２５Ｇの上面または下面が搭載される。搭載の際、光素子２５Ｇは、レンズ構造体２１に対し、Ａ－Ａ線で示すＺ方向の搭載の中心軸において、光素子２５Ｇの上下面の中心点、レンズ構造体２１の凹部２６の底面の中心点が揃うように、調芯しながら接続される。またその搭載の際、光素子２５Ｇは、Ｂ－Ｂ線のＸ方向の光軸において、光素子２５Ｇの端面の点ｐ０、レンズ構造体２１の凹部２６の側面の点ｐ１、及び光ファイバ接続部３３の点ｐ２が揃うように、調芯しながら接続される。 At the time of the above-described step S4 and connection C1, using a manufacturing apparatus such as a chip mounter, the optical element 25G is placed on the center axis of the mounting in the Z direction indicated by line AA with respect to the bottom surface of the recess 26. The upper surface or the lower surface of the optical element 25G is mounted such that the end surface, which is the light emitting surface including the point p0, faces right in the X direction. At the time of mounting, the optical element 25G is located at the center point of the upper and lower surfaces of the optical element 25G and the bottom surface of the concave portion 26 of the lens structure 21 with respect to the lens structure 21 in the Z-axis mounting center axis indicated by the line AA. They are connected while aligning so that their center points are aligned. When mounted, the optical element 25G has a point p0 on the end face of the optical element 25G, a point p1 on the side surface of the concave portion 26 of the lens structure 21, and an optical fiber connection portion on the optical axis in the X direction of the BB line. The connections are made while aligning so that 33 points p2 are aligned.
　これにより、レンズ構造体２１により構成される光路は、光素子２５Ｇの端面の点ｐ０に対応したレンズ構造体２１の凹部２６の側面の点ｐ１から、光ファイバ接続部２３の点ｐ２までのＸ方向への直線の光路部を含む。即ちレンズ構造体２１の光路は、Ｘ方向の直線的な光路となる。送信側の光素子２５Ａの点ｐ０からのＸ方向への出射光ａは、レンズ構造体２１の点ｐ１、点ｐ２を経由して、光ファイバ部３３のコアへ入射される。実施の形態６は、レンズ構造体２１において前述の４５度ミラー２４を設ける必要は無い。 Thereby, the optical path constituted by the lens structure 21 is X from the point p1 on the side surface of the concave portion 26 of the lens structure 21 corresponding to the point p0 on the end face of the optical element 25G to the point p2 on the optical fiber connection portion 23. Includes a straight optical path to the direction. That is, the optical path of the lens structure 21 is a linear optical path in the X direction. The outgoing light a in the X direction from the point p0 of the optical element 25A on the transmission side is incident on the core of the optical fiber portion 33 via the points p1 and p2 of the lens structure 21. In the sixth embodiment, it is not necessary to provide the aforementioned 45-degree mirror 24 in the lens structure 21.
　実施の形態６の光インターコネクト装置１Ｈによれば、実施の形態１等と同様に、調芯を含む接続の工程を低コスト化でき、これにより低コストで保守交換性に優れた光インターコネクト装置１Ｈ等を提供できる。 According to the optical interconnect device 1H of the sixth embodiment, similarly to the first embodiment, the cost of the connection process including alignment can be reduced, thereby reducing the cost and maintaining and exchanging the optical interconnect device 1H. Etc. can be provided.
　実施の形態６の変形例として、前述の実施の形態５と同様に、レンズ構造体２１において光素子２５と光ファイバ接続部２３との間、Ｂ－Ｂ線の光軸上に、集光レンズとして働く平凸レンズを設けた形態としてもよい。 As a modified example of the sixth embodiment, similar to the fifth embodiment described above, a condensing lens is provided between the optical element 25 and the optical fiber connecting portion 23 in the lens structure 21 and on the optical axis of the BB line. It is good also as a form which provided the plano-convex lens which works as.
　以上、本発明者によってなされた発明を実施の形態に基づき具体的に説明したが、本発明は前記実施の形態に限定されるものではなく、その要旨を逸脱しない範囲で種々変更可能であることは言うまでもない。 As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.
　１，１Ａ，１Ｂ，１Ｃ…光インターコネクト装置、２Ａ…送信機能、２Ｂ…受信機能、１０…電子回路基板、１１…パッケージ基板、１２…配線、１３…はんだボール、１５…光素子駆動ＩＣ、１５Ａ…送信側光素子駆動ＩＣ、１５Ｂ…受信側光素子駆動ＩＣ、１７…ヒートシンク、２０，２０Ｃａ，２０Ｃｂ，…光コネクタ装置、２０Ａ…送信側光コネクタ装置、２０Ｂ…受信側光コネクタ装置、２０ａ…送信側光コネクタ部、２０ｂ…受信側光コネクタ部、２１…レンズ構造体、２２…配線、２３…光ファイバ接続部、２４…４５度ミラー、２５，２５Ａ，２５Ｂ…光素子、２６…凹部、２７…平凸レンズ、２８…蓋部、３０…光ケーブル装置、３１…クラッド、３２…コア、３３…光ファイバ部、４１…ピン、４２…ソケット、５０…基板、５１…はんだボール。 DESCRIPTION OF SYMBOLS 1,1A, 1B, 1C ... Optical interconnect device, 2A ... Transmission function, 2B ... Reception function, 10 ... Electronic circuit board, 11 ... Package board, 12 ... Wiring, 13 ... Solder ball, 15 ... Optical element drive IC, 15A Transmission side optical element drive IC, 15B ... Reception side optical element drive IC, 17 ... Heat sink, 20, 20Ca, 20Cb, ... Optical connector device, 20A ... Transmission side optical connector device, 20B ... Reception side optical connector device, 20a ... Transmission side optical connector part, 20b ... Reception side optical connector part, 21 ... Lens structure, 22 ... Wiring, 23 ... Optical fiber connection part, 24 ... 45 degree mirror, 25, 25A, 25B ... Optical element, 26 ... Recessed part, 27 ... Plano-convex lens, 28 ... Lid, 30 ... Optical cable device, 31 ... Cladding, 32 ... Core, 33 ... Optical fiber part, 41 ... Pin, 42 ... Socket, 50 Board, 51 ... solder balls.

Claims (20)

  1. 　光素子と光導波路との間の光路を構成し、前記光導波路の端部が接続される光導波路接続部、及び凹部を有する、レンズ構造体と、
    　前記レンズ構造体に形成され、前記光素子、及び外部の基板配線部に対して電気的に接続される、配線部と、
    　前記レンズ構造体の凹部に搭載され、当該搭載の際に前記光路の光軸に調芯されている、前記光素子と、を有する、光コネクタ装置。     An optical path between the optical element and the optical waveguide, an optical waveguide connecting portion to which an end of the optical waveguide is connected, and a concave structure;
    A wiring portion formed in the lens structure and electrically connected to the optical element and an external substrate wiring portion;
    An optical connector device comprising: the optical element that is mounted in the concave portion of the lens structure and is aligned with the optical axis of the optical path at the time of mounting.
  2. 　請求項１記載の光コネクタ装置において、
    　前記レンズ構造体の凹部は、前記レンズ構造体における外部の基板に搭載される面である第１面に設けられ、
    　前記光素子は、面発光型の発光素子であり、面発光の出射点を含む第１面が前記レンズ構造体の凹部の底面に配置され、
    　前記レンズ構造体は、前記光路における出射光の方向を第１方向から第２方向へ屈曲させる光屈曲部を含み、
    　前記レンズ構造体における光路は、前記光素子の面発光の出射点に対応した前記凹部の第１点と前記光屈曲部の屈曲点である第２点との間の前記第１方向への第１光路部と、前記第２点と前記光導波路接続部の第３点との間の前記第２方向への第２光路部と、を含む、光コネクタ装置。     The optical connector device according to claim 1,
    The concave portion of the lens structure is provided on a first surface which is a surface mounted on an external substrate in the lens structure,
    The optical element is a surface-emitting type light-emitting element, and a first surface including an emission point of surface emission is disposed on the bottom surface of the concave portion of the lens structure,
    The lens structure includes a light bending portion that bends the direction of outgoing light in the optical path from a first direction to a second direction;
    The optical path in the lens structure has a first direction in the first direction between a first point of the concave portion corresponding to an emission point of surface light emission of the optical element and a second point that is a bending point of the light bending portion. An optical connector device comprising: an optical path portion; and a second optical path portion in the second direction between the second point and a third point of the optical waveguide connection portion.
  3. 　請求項１記載の光コネクタ装置において、
    　前記レンズ構造体は、前記凹部と前記光導波路接続部との間に配置され、前記光素子からの出射光を入射して前記光導波路の端部へ入射される光量を大きくする、第１レンズを含む、光コネクタ装置。     The optical connector device according to claim 1,
    The lens structure is disposed between the concave portion and the optical waveguide connecting portion, and is configured to increase a light amount incident on an end portion of the optical waveguide by entering light emitted from the optical element. An optical connector device.
  4. 　請求項１記載の光コネクタ装置において、
    　前記レンズ構造体の凹部において前記光素子の外側に配置される蓋部を有する、光コネクタ装置。     The optical connector device according to claim 1,
    An optical connector device having a lid portion disposed outside the optical element in the concave portion of the lens structure.
  5. 　請求項１記載の光コネクタ装置において、
    　前記レンズ構造体の凹部は、前記レンズ構造体における外部の基板に搭載される面である第１面に対して直立する第２面に設けられ、
    　前記光素子は、面発光型の発光素子であり、面発光の出射点を含む第１面が前記レンズ構造体の凹部の底面に配置され、
    　前記レンズ構造体における光路は、前記光素子の面発光の出射点に対応した前記凹部の第１点と前記光導波路接続部の第２点との間の光路部を含む、光コネクタ装置。     The optical connector device according to claim 1,
    The concave portion of the lens structure is provided on a second surface that stands upright with respect to the first surface that is a surface mounted on an external substrate in the lens structure,
    The optical element is a surface-emitting type light-emitting element, and a first surface including an emission point of surface emission is disposed on the bottom surface of the concave portion of the lens structure,
    The optical connector device in which the optical path in the lens structure includes an optical path portion between a first point of the concave portion and a second point of the optical waveguide connecting portion corresponding to a surface emission emission point of the optical element.
  6. 　請求項１記載の光コネクタ装置において、
    　前記レンズ構造体の凹部は、前記レンズ構造体における前記外部の基板に搭載される面である第１面に対して反対側である第２面に設けられ、
    　前記光素子は、端面発光型の発光素子であり、端面発光の出射点を含む第１面が前記レンズ構造体の凹部の側面に向いて配置され、
    　前記配線部は、前記レンズ構造体の凹部から前記レンズ構造体の第１面までの貫通孔を通じて設けられ、
    　前記レンズ構造体における光路は、前記光素子の端面発光の出射点に対応した前記凹部の第１点と前記光導波路接続部の第２点との間の光路部を含む、光コネクタ装置。     The optical connector device according to claim 1,
    The concave portion of the lens structure is provided on a second surface opposite to the first surface which is a surface mounted on the external substrate in the lens structure,
    The optical element is an edge-emitting type light-emitting element, and a first surface including an emission point of edge emission is disposed toward a side surface of the concave portion of the lens structure,
    The wiring portion is provided through a through hole from the concave portion of the lens structure to the first surface of the lens structure,
    The optical path in the said lens structure is an optical connector apparatus containing the optical path part between the 1st point of the said recessed part corresponding to the emission point of the end surface light emission of the said optical element, and the 2nd point of the said optical waveguide connection part.
  7. 　請求項１記載の光コネクタ装置において、
    　前記レンズ構造体の凹部は、前記レンズ構造体における前記外部の基板に搭載される面である第１面に設けられ、
    　前記光素子は、端面発光型の発光素子であり、端面発光の出射点を含む第１面が前記レンズ構造体の凹部の側面に向いて配置され、
    　前記レンズ構造体における光路は、前記光素子の端面発光の出射点に対応した前記凹部の第１点と前記光導波路接続部の第２点との間の光路部を含む、光コネクタ装置。     The optical connector device according to claim 1,
    The concave portion of the lens structure is provided on a first surface which is a surface mounted on the external substrate in the lens structure,
    The optical element is an edge-emitting type light-emitting element, and a first surface including an emission point of edge emission is disposed toward a side surface of the concave portion of the lens structure,
    The optical path in the said lens structure is an optical connector apparatus containing the optical path part between the 1st point of the said recessed part corresponding to the emission point of the end surface light emission of the said optical element, and the 2nd point of the said optical waveguide connection part.
  8. 　請求項１記載の光コネクタ装置において、
    　前記光素子は、前記配線部を通じて入力される電気信号を光信号に変換して前記レンズ構造体の光路へ出射する発光素子である、光コネクタ装置。     The optical connector device according to claim 1,
    The optical connector device, wherein the optical element is a light emitting element that converts an electrical signal input through the wiring portion into an optical signal and emits the optical signal to the optical path of the lens structure.
  9. 　請求項１記載の光コネクタ装置において、
    　前記光素子は、前記光導波路を通じて前記レンズ構造体の光路から入射される光信号を電気信号に変換して前記配線部を通じて出力する受光素子である、光コネクタ装置。     The optical connector device according to claim 1,
    The optical connector device, wherein the optical element is a light receiving element that converts an optical signal incident from an optical path of the lens structure through the optical waveguide into an electrical signal and outputs the electrical signal through the wiring unit.
  10. 　請求項１記載の光コネクタ装置において、
    　前記配線部は、
    　前記レンズ構造体の凹部の底面または側面に形成される第１配線部と、
    　前記レンズ構造体の凹部以外の表面部に形成され、前記外部の基板配線部に対して電気的に接続される、第２配線部と、を含む、光コネクタ装置。     The optical connector device according to claim 1,
    The wiring part is
    A first wiring portion formed on the bottom surface or side surface of the concave portion of the lens structure;
    An optical connector device comprising: a second wiring portion formed on a surface portion other than the concave portion of the lens structure and electrically connected to the external substrate wiring portion.
  11. 　請求項１記載の光コネクタ装置において、
    　前記レンズ構造体は、前記光路における光の方向を第１方向と第２方向との間で屈曲する光屈曲部を含み、
    　前記光屈曲部は、光を反射させるミラーまたはプリズムを含む、光コネクタ装置。     The optical connector device according to claim 1,
    The lens structure includes a light bending portion that bends the direction of light in the optical path between a first direction and a second direction,
    The said optical bending part is an optical connector apparatus containing the mirror or prism which reflects light.
  12. 　請求項１記載の光コネクタ装置において、
    　前記配線部に接続されるピンを有し、
    　前記ピンは、前記外部の基板の基板配線部に設けられるソケットに対して電気的及び機械的に接続される、光コネクタ装置。     The optical connector device according to claim 1,
    Having a pin connected to the wiring portion;
    The optical connector device, wherein the pin is electrically and mechanically connected to a socket provided in a board wiring portion of the external board.
  13. 　請求項１記載の光コネクタ装置による第１光コネクタ装置及び第２光コネクタ装置と、
    　前記第１光コネクタ装置の前記レンズ構造体の前記光導波路接続部に第１端部が接続され、前記第２光コネクタ装置の前記レンズ構造体の前記光導波路接続部に第２端部が接続される、前記光導波路と、を有する、光ケーブル装置。     A first optical connector device and a second optical connector device by the optical connector device according to claim 1;
    A first end is connected to the optical waveguide connecting portion of the lens structure of the first optical connector device, and a second end is connected to the optical waveguide connecting portion of the lens structure of the second optical connector device. An optical cable device comprising: the optical waveguide.
  14. 　請求項１３記載の光ケーブル装置において、
    　前記第１光コネクタ装置は、前記光素子として、発光素子を有し、
    　前記第２光コネクタ装置は、前記光素子として、受光素子を有し、
    　前記第１光コネクタ装置から第２光コネクタ装置への一方向の光伝送機能を持つ、光ケーブル装置。     The optical cable device according to claim 13.
    The first optical connector device has a light emitting element as the optical element,
    The second optical connector device has a light receiving element as the optical element,
    An optical cable device having a one-way optical transmission function from the first optical connector device to the second optical connector device.
  15. 　請求項１３記載の光ケーブル装置において、
    　前記第１光コネクタ装置及び第２光コネクタ装置は、前記光素子として、発光素子及び受光素子を有し、
    　前記第１光コネクタ装置から第２光コネクタ装置への方向及び前記第２光コネクタ装置から第１光コネクタ装置への方向による双方向の光伝送機能を持つ、光ケーブル装置。     The optical cable device according to claim 13.
    The first optical connector device and the second optical connector device have a light emitting element and a light receiving element as the optical element,
    An optical cable device having a bidirectional optical transmission function according to a direction from the first optical connector device to the second optical connector device and a direction from the second optical connector device to the first optical connector device.
  16. 　請求項１３記載の光ケーブル装置において、
    　前記光導波路は、光ファイバを含んで構成される、光ケーブル装置。     The optical cable device according to claim 13.
    The optical waveguide device includes the optical waveguide including an optical fiber.
  17. 　請求項１～７のいずれかに記載の光コネクタ装置と、
    　前記光コネクタ装置の光素子を駆動するための回路部と、
    　前記回路部と前記光コネクタ装置とを搭載する基板と、
    　前記基板に形成され前記回路部と前記光コネクタ装置の光素子に接続される前記配線部とを電気的に接続する基板配線部と、を有する、光インターコネクト装置。     An optical connector device according to any one of claims 1 to 7,
    A circuit unit for driving the optical element of the optical connector device;
    A substrate on which the circuit unit and the optical connector device are mounted;
    An optical interconnect device comprising: a substrate wiring portion that electrically connects the circuit portion formed on the substrate and the wiring portion connected to the optical element of the optical connector device.
  18. 　請求項１７記載の光インターコネクト装置において、
    　前記光コネクタ装置の光素子は、前記回路部から前記基板配線部及び前記配線部を通じて入力される電気信号を光信号に変換して前記レンズ構造体の光路へ出射する発光素子を有し、
    　前記回路部は、光インターコネクトの送信の際に前記光素子への電気信号を制御する、送信用駆動部を有する、光インターコネクト装置。     The optical interconnect device according to claim 17, wherein
    The optical element of the optical connector device includes a light emitting element that converts an electrical signal input from the circuit unit through the substrate wiring unit and the wiring unit into an optical signal and emits the optical signal to the optical path of the lens structure,
    The optical interconnect device, wherein the circuit unit includes a transmission drive unit that controls an electrical signal to the optical element during transmission of the optical interconnect.
  19. 　請求項１７記載の光インターコネクト装置において、
    　前記光コネクタ装置の光素子は、前記光導波路の端部から前記レンズ構造体の光路を通じて入射される光信号を電気信号に変信して前記配線部及び前記基板配線部を通じて前記回路部へ出力する受光素子を有し、
    　前記回路部は、光インターコネクトの受信の際に前記光素子からの電気信号を制御する、受信用駆動部を有する、光インターコネクト装置。     The optical interconnect device according to claim 17, wherein
    The optical element of the optical connector device converts an optical signal incident from the end of the optical waveguide through the optical path of the lens structure into an electrical signal and outputs the electrical signal to the circuit unit through the wiring unit and the substrate wiring unit. A light receiving element
    The optical interconnect device, wherein the circuit unit includes a reception drive unit that controls an electrical signal from the optical element when receiving the optical interconnect.
  20. 　請求項１７記載の光インターコネクト装置において、
    　前記光コネクタ装置は、前記回路部から前記基板配線部及び前記配線部を通じて入力される電気信号を光信号に変換して前記レンズ構造体の光路へ出射する発光素子と、前記光導波路の端部から前記レンズ構造体の光路を通じて入射される光信号を電気信号に変信して前記配線部及び前記基板配線部を通じて前記回路部へ出力する受光素子と、を有し、
    　前記回路部は、光インターコネクトの送信の際に前記光素子への電気信号を制御する、送信用駆動部と、光インターコネクトの受信の際に前記光素子からの電気信号を制御する、受信用駆動部と、を有する、光インターコネクト装置。     The optical interconnect device according to claim 17, wherein
    The optical connector device includes: a light emitting element that converts an electric signal input from the circuit unit through the substrate wiring unit and the wiring unit into an optical signal and emits the optical signal to an optical path of the lens structure; and an end of the optical waveguide A light receiving element that converts an optical signal incident through the optical path of the lens structure into an electrical signal and outputs the electrical signal to the circuit unit through the wiring unit and the substrate wiring unit,
    The circuit unit controls an electrical signal to the optical element during transmission of the optical interconnect, and a driving unit for transmission and a reception drive that controls an electrical signal from the optical element during reception of the optical interconnect. And an optical interconnect device.
PCT/JP2013/057289 2013-03-14 2013-03-14 Optical connector apparatus, optical cable apparatus, and optical interconnect apparatus WO2014141451A1 (en)

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