WO2014138840A1 - Electroplating assembly and related components - Google Patents

Electroplating assembly and related components Download PDF

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Publication number
WO2014138840A1
WO2014138840A1 PCT/CA2013/050198 CA2013050198W WO2014138840A1 WO 2014138840 A1 WO2014138840 A1 WO 2014138840A1 CA 2013050198 W CA2013050198 W CA 2013050198W WO 2014138840 A1 WO2014138840 A1 WO 2014138840A1
Authority
WO
WIPO (PCT)
Prior art keywords
rod
electroplating
rack
pieces
receiving terminal
Prior art date
Application number
PCT/CA2013/050198
Other languages
French (fr)
Inventor
Bradley Wright
Rudy KOEHLER
Original Assignee
Bradley Wright
Koehler Rudy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bradley Wright, Koehler Rudy filed Critical Bradley Wright
Priority to PCT/CA2013/050198 priority Critical patent/WO2014138840A1/en
Priority to MX2015012753A priority patent/MX2015012753A/en
Priority to US14/775,845 priority patent/US20160024682A1/en
Priority to CA2906214A priority patent/CA2906214A1/en
Publication of WO2014138840A1 publication Critical patent/WO2014138840A1/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005Contacting devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • C25D17/08Supporting racks, i.e. not for suspending

Definitions

  • the invention relates to the field of electroplating, and more particularly to electroplating components configured for mounting on racks.
  • Electroplating is well established process that uses electrical current to reduce cations of a desired material from a solution and coat a conductive object with a thin layer of the material, typically such as a metal. Electroplating is primarily used in practice for depositing a layer of material to bestow a desired property (for example, abrasion and wear resistance, corrosion protection, lubricity, aesthetic qualities, etc.) to a surface that otherwise lacks that property.
  • a desired property for example, abrasion and wear resistance, corrosion protection, lubricity, aesthetic qualities, etc.
  • the process used in electroplating is called electro deposition.
  • the part to be plated is typically but not always made the cathode (negative electrode) of the circuit.
  • the anode is made of the actual metal to be plated on the (cathode) part. Both components are immersed in a solution called an electrolyte containing one or more dissolved metal salts as well as other ions that facilitate the deposition process.
  • a power supply provides current to the anode-electrolyte-cathode circuit.
  • metal atoms that comprise it are oxidized allowing them to dissolve in the electrolyte solution. This is just one type of electroplating.
  • electroplating examples include an inert anode (like platinum) and dissolved metal salt in the electrolyte.
  • an inert anode like platinum
  • dissolved metal salt in the electrolyte.
  • Plastic parts may be plated with many finishes such as nickel, chrome, copper or a plethora of other metal.
  • the raw plastic part is typically attached to a metal/conducting rack that is successively immersed into various tanks. In some of these tanks, the racks are supplied with electric current.
  • the rack with the plastic parts on it may be immersed, for example, into an acid bath that chemically etches and cleans the surface of the part.
  • the parts on the rack undergo various etching/cleaning stages.
  • the next step involves a deposition process/routine of copper metal. That step makes the plastic part nearly but not completely conducting. To make the parts conducting, in preparation for the elecrodeposition process an additional step is usually required. That step is known in the art as a copper strike.
  • the rack clips are in electrical connection with the part surfaces, the part is electrically conductive and the rack can go into the electrodeposition tanks and receive the final metallic coating or coatings of typically but not exclusively, nickel, chrome or other metals.
  • Prior art electroplating systems generally include a large number of clips for a given rack relative to the number of pieces which are being electroplated while being carried on a given rack. Often, this results in low throughput, and increased man-hours required in preparing - that is loading - the rack for the electroplating process, and subsequent unloading. In addition, rack throughput and control of current to different parts of the rack is problematic, often resulting in less than optimal coating of pieces that have not been fully electroplated.
  • an electroplating assembly having a pieces assembly and individual pieces which substantially reduce the number of clips for a given rack relative to the number of pieces which are electroplated while being carried on a given rack. This is accomplished by concatenating pieces such that current flows between adjacent pieces arranged on the rack in a novel way.
  • an electroplating system including an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack.
  • the pieces assembly includes an electrically conductive elongate rod having a central axis and at least one receiving terminal. The elongate rod is connected to the rack connecting member at first and second ends thereof.
  • the pieces assembly also including a plurality of pieces, each piece having a final-shape portion and a means for attaching connected to the final-shape portion, with the means for attaching is sized and otherwise dimensioned to be fixedly received in the at least one receiving terminal.
  • the at least one receiving terminal comprises a recess depressed from an outer surface of the elongate rod.
  • each piece further includes a joining portion connecting the final-shape portion and the means for attaching; the final-shape portion adapted to be disconnected from the joining portion following an electroplating process.
  • the means for attaching comprises a tubular portion adapted to slidingly engage the outer surface of the rod, at least one projecting clip attached to the tubular portion, and an engaging element at an end of the at least one projecting clip.
  • the engaging element is sized and otherwise dimensioned to be friction fit into the at least one receiving terminal.
  • the at least one projecting clip is tapered towards a central axis of the tubular portion.
  • the at least one projecting clip is spring loaded with a bias towards the central axis.
  • the at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of the rod, and the at least one projecting clip comprises two projecting clips.
  • the recess comprises a generally rectangular slot.
  • a rod for use in an electroplating system in which a plurality of pieces to be electroplated are mounted on the rod; the rod including an electrically conductive elongate portion having a central axis and at least one receiving terminal for receiving at least one of the plurality of pieces and means for connecting first and second ends of the rod to an electroplating rack.
  • the at least one receiving terminal comprises a recess depressed from an outer surface of the elongate rod.
  • the at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of the rod.
  • the recess comprises a generally rectangular slot.
  • a method for electroplating including providing an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack; mounting a plurality of pieces on an electrically conductive elongate rod; the elongate rod having a central axis and at least one receiving terminal; the plurality of pieces having a final-shape portion and a means for attaching connected to the final- shape portion; wherein the means for attaching is sized and otherwise dimensioned to be fixedly received in the at least one receiving terminal; attaching the rod with the mounted plurality of pieces onto the electroplating rack; and, carrying out an electroplating reaction.
  • the rack, pieces assembly, rod and pieces are as herein described.
  • Figure 1 is a perspective view of an electroplating rack on which embodiments of the invention may be mounted.
  • Figure 2 is a perspective view of a pieces assembly according to one embodiment of the invention. In Figure 2, pieces are removed for ease of illustration and understanding.
  • Figure 3 is a top view of the assembly of Figure 2.
  • Figure 4 is an exploded view of one piece mounted on a rod according to the invention.
  • Figure 5 is a detail view of a receiving terminal on the rod and connecting means on the plastic piece of the embodiment of Figure 2.
  • Figure 6 is a perspective view of an end portion of the rod with a piece mounted in the receiving terminal.
  • electroplating system 250 includes a rigid electroplating rack frame 2B formed of electrically conductive members which are in electrical contact with one another for removably mounting thereon the assemblies 6B of preferably identical molded plastic pieces 5B (shown in more detail in Figure 2).
  • the present invention is directed primarily at novel assemblies 6B of molded plastic pieces 5B that may be adapted for use on various electroplating rack frames, including the example rack frame 2B. It will be appreciated that other rack frames are applicable and the invention may be used with same. These include present prior art rack frames, and racks frames that may later be developed.
  • the means for connecting 35 includes a sleeve that is press-fit into a receiving portion on the rack, or alternatively, is held by clips (not shown) of the rack shown in Figure 1.
  • the means for connecting 35 includes a sleeve that is press-fit into a receiving portion on the rack, or alternatively, is held by clips (not shown) of the rack shown in Figure 1.
  • an end cap 40 may be provided to prevent an adjacent piece 5N from becoming dislodged prematurely from the rod 10.
  • the end cap 40 may also provide a degree of safety, by reducing the sharpness of the end of the rod 10, and also provides a surface area on which the rod 10 can be handled.
  • plastic pieces 5B may be arranged to fit outwardly from the rack frame 2B.
  • a rack 2B is shown in Figure 1, and has a top and bottom and, front and back and defining therebetween an axial direction, and left and right sides and defining therebetween a longitudinal direction.
  • the rack is electrically conductive and includes attachment means for mounting the rod.
  • the rack illustrated is exemplary only, and as will be appreciated by one skilled in the art, any electrically conductive rack suitable for electroplating may be used.
  • FIGS 2 and 3 show a representative assembly 6B according to one embodiment of the invention.
  • the assembly 6B is characterized generally by a current transmitting rod 10 that is attachable and detachable from the rack of Figure 1.
  • the current transmitting rod 10 preferably includes a central axis 15 along which current is transmitted to a plurality of piece receiving terminals 20.
  • the piece receiving terminals 20 are sized and otherwise dimensioned to receive a respective piece 5A thereon.
  • Piece 5A has a corresponding means for attaching 30 to the terminals 20.
  • each of the receiving terminals 20 will have an associated piece 5N, but for ease of understanding and illustration, pieces are only illustrated on some of the terminals 20 of the skewer 10.
  • each piece 5B is provided in a manner that permits each piece to be independently attached to the rod 10 along the central axis thereof.
  • Each of the pieces 5B are preferably molded plastic pieces-and are identical to each other such that large volumes of pieces may be electroplated at a time. This arrangement provides significant advantages over the prior art, where typically electroplating only occurs between a single piece and the rack itself.
  • each plastic piece 5 A preferably includes a joining portion 45 and a final- shape portion 50, where the joining portion 45 permits attachment with the rod 10, and the final- shape portion represents the desired end-use piece that is to be electroplated. These elements are typically formed from a molded plastic, and are of a material capable of being electroplated.
  • both the joining portion 45 and the final-shape portion 50 will be electroplated, but the final-shape portion 50 is detached from the joining portion 45 prior to use. This detachment may occur, for example, by providing a break point between the joining portion 45 and the final-shape portion 50, such that detachment can occur manually. The joining portion 45 is then discarded, or recycled.
  • FIGS. 4, 5 and 6, there are shown detail views of a single piece 5A, and a respective receiving terminal 20 for receiving the piece 5A.
  • a terminal 20 proximate the end of the rod 10 is shown, however, the illustrations are applicable to any particular terminal 20 on the rod 10.
  • Piece 5B may have various sections which project outwardly relative to one another but are not described in detail here.
  • the final-shape portion 50 forms a final shape part that may take on any appearance or configuration, and is not limited to the embodiments herein illustrated.
  • Joining portion 45 preferably includes an elongate member 60 leading to the means for attaching 30, which provides an interface between the piece being electroplated, and the terminal 20 of the rod 10.
  • the terminal 20 preferably includes a generally rectangular shaped, or other non-circular shaped, recess or cavity 65 depressed from an outer surface 70 of the rod 10. Shown more clearly in Figure 6, recess 65 may be a slot formed on an outer surface of the rod 70, defined by an inner surface 75 including a flat, or generally flat, bottom that is sized and otherwise dimensioned to receive a engaging element 80 of the means for receiving 30 of the piece 5 A. Details of the piece 5A are provided below.
  • the recess 65 further includes sidewalls 85 onto which the means for receiving 30 is clipped.
  • the recess 65 is sized and otherwise dimensioned to engage the means for receiving 30 of the piece 5 A in a friction-fit arrangement, such that the piece 5 A is unable to move, either in translation or in rotation, when engaged in the recess 65.
  • Pieces 5 A are joined to the rod 10 by an interference fit connection or a snap fit connection, along the central axis 15 of the rod 10.
  • the final shape portion 50 is the portion of the piece 5A that is intended to be used as an end-product.
  • final shape portion 50 is attached to a joining portion 45, by break portion 90. Break portion 90 defines the point at which the final shape portion 50 is separated from the joining portion 45.
  • the final shape portion 50 may be any shape being electroplated, and only a representative version is depicted here.
  • the joining portion 45 is shown elongated, and disproportionately larger than the final shape portion 50, for ease of illustration.
  • the size of the joining portion 45 may be adjusted to optimize the process should be and/or minimize byproduct. Focusing now on the means for attaching 30, which is connected to the joining portion 45, a generally tubular portion having an inner diameter 100 within a predetermined tolerance larger than the outer diameter of the rod 10, such that the inner diameter 100 of the tubular portion slidingly engages the outer surface 105 of the rod 10. Projecting from the tubular portion 95, in a direction parallel with the central axis 15 of the rod 10, are a pair of projecting clips 110 that have disposed at ends thereof, engaging elements 80 extending into the terminals 65 of the rod 10.
  • Engaging elements 80 extend perpendicular to the central axis 15 from the projecting clips and are arranged such that the distance between the engaging elements 80a and 80b is less than the outer diameter of the rod 10.
  • the projecting clips 110 are provided with sufficient flexibility to permit the projecting clips 10, and the engaging elements 80a and 80b, to be displaced by flexing, relative to the tubular portion 95, such that the tubular portion 95 can slide over the outer surface 105 of the rod 10.
  • inner walls 115 of the projecting clips 110 may be tapered to provide spring action in the flexing of the projecting clips 110, with a bias towards engagement of the engaging elements 80 with the terminals 20.
  • Various modifications to the interaction between the rod 10 and the means for attaching 30 are contemplated.
  • a plurality of rods 10 are each donned with a plurality of pieces 5N before mounting on an electroplating rack. Any means for mounting on the rack may be used, provided that current is able to flow from the rack to the rods 10.
  • the pieces In fixedly mounting the plurality of pieces 5N onto each rod 10, the pieces may be slid from an end of the rod until engagement of the engaging elements 80 with the terminals 65 (as shown in Figure 4, for example).
  • Tooling may be developed to mount a number of pieces 5N onto the rod 10 simultaneously. After the electroplating process has been complete, the pieces 5N can either be individually removed, or the final shape portion can be detached from the joining portion, and the removal of any waste material still attached to the rod performed separately. It is also feasible that tooling be used to remove multiple pieces simultaneously.
  • the removable rod 10 allows for pieces to be mounted on the rod at a location distal from the electroplating facility.
  • mounting on the rod facilitates shipping and transport of the pieces as well.
  • the pieces may be mounted onto the rod, packaged and shipped to an electroplating facility.
  • the electroplating process can be completed, and the rod with pieces intact can be shipped to another facility for further processing, where the final shape portion can be removed, and processed further as needed.
  • This arrangement is not possible in the majority of prior art systems where pieces have to be removed from the electroplating rack individually.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

An electroplating system including an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack; the pieces assembly having an electrically conductive elongate rod having a central axis and at least one receiving terminal; the elongate rod connected to the rack connecting member at first and second ends thereof and a plurality of pieces, each piece having a final-shape portion and a means for attaching connected to the final-shape portion. The means for attaching is sized and otherwise dimensioned to be fixedly received in the at least one receiving terminal.

Description

ELECTROPLATING ASSEMBLY AND RELATED COMPONENTS
FIELD OF THE INVENTION
[0001] The invention relates to the field of electroplating, and more particularly to electroplating components configured for mounting on racks.
BACKGROUND OF THE INVENTION
[0002] Electroplating is well established process that uses electrical current to reduce cations of a desired material from a solution and coat a conductive object with a thin layer of the material, typically such as a metal. Electroplating is primarily used in practice for depositing a layer of material to bestow a desired property (for example, abrasion and wear resistance, corrosion protection, lubricity, aesthetic qualities, etc.) to a surface that otherwise lacks that property.
[0003] The process used in electroplating is called electro deposition. The part to be plated is typically but not always made the cathode (negative electrode) of the circuit. In one typical but not exclusive technique, the anode is made of the actual metal to be plated on the (cathode) part. Both components are immersed in a solution called an electrolyte containing one or more dissolved metal salts as well as other ions that facilitate the deposition process. A power supply provides current to the anode-electrolyte-cathode circuit. At the anode, metal atoms that comprise it are oxidized allowing them to dissolve in the electrolyte solution. This is just one type of electroplating. Other electroplating examples include an inert anode (like platinum) and dissolved metal salt in the electrolyte. [0004] At the electrolyte-cathode interface, the dissolved metal ions in the electrolyte solution are reduced, such that they "plate out" onto the cathode. Thus under these conditions the rate at which the anode is dissolved into the solution is equal to the rate at which the cathode is plated, by the current flowing through the circuit. In this manner, the ions in the electrolyte bath are continuously replenished by the anode.
[0005] Plastic parts may be plated with many finishes such as nickel, chrome, copper or a plethora of other metal. The raw plastic part is typically attached to a metal/conducting rack that is successively immersed into various tanks. In some of these tanks, the racks are supplied with electric current. The rack with the plastic parts on it may be immersed, for example, into an acid bath that chemically etches and cleans the surface of the part. By way of summary, the parts on the rack undergo various etching/cleaning stages. The next step involves a deposition process/routine of copper metal. That step makes the plastic part nearly but not completely conducting. To make the parts conducting, in preparation for the elecrodeposition process an additional step is usually required. That step is known in the art as a copper strike. In addition once the rack clips are in electrical connection with the part surfaces, the part is electrically conductive and the rack can go into the electrodeposition tanks and receive the final metallic coating or coatings of typically but not exclusively, nickel, chrome or other metals.
[0006] Prior art electroplating systems generally include a large number of clips for a given rack relative to the number of pieces which are being electroplated while being carried on a given rack. Often, this results in low throughput, and increased man-hours required in preparing - that is loading - the rack for the electroplating process, and subsequent unloading. In addition, rack throughput and control of current to different parts of the rack is problematic, often resulting in less than optimal coating of pieces that have not been fully electroplated.
[0007] One solution to these prior art problem has been disclosed in applicant's PCT International Application No. PCT/CA2012/050657 filed September 20, 2012. In this application, an electroplating assembly is disclosed having a pieces assembly and individual pieces which substantially reduce the number of clips for a given rack relative to the number of pieces which are electroplated while being carried on a given rack. This is accomplished by concatenating pieces such that current flows between adjacent pieces arranged on the rack in a novel way.
[0008] However, there is still room for improvement on these prior art methods. For example, when concatenating parts as described above, restrictions on particular part geometries that may be used have been observed.
[0009] Accordingly, there is a need in the art for an improved electroplating assembly. SUMMARY OF THE INVENTION
[0010] According to one embodiment of the invention, there is provided an electroplating system including an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack. The pieces assembly includes an electrically conductive elongate rod having a central axis and at least one receiving terminal. The elongate rod is connected to the rack connecting member at first and second ends thereof. The pieces assembly also including a plurality of pieces, each piece having a final-shape portion and a means for attaching connected to the final-shape portion, with the means for attaching is sized and otherwise dimensioned to be fixedly received in the at least one receiving terminal.
[0011] According to one aspect of this embodiment, the at least one receiving terminal comprises a recess depressed from an outer surface of the elongate rod.
[0012] According to another aspect of this embodiment, each piece further includes a joining portion connecting the final-shape portion and the means for attaching; the final-shape portion adapted to be disconnected from the joining portion following an electroplating process.
[0013] According to another aspect of this embodiment, the means for attaching comprises a tubular portion adapted to slidingly engage the outer surface of the rod, at least one projecting clip attached to the tubular portion, and an engaging element at an end of the at least one projecting clip.
[0014] According to another aspect of this embodiment, the engaging element is sized and otherwise dimensioned to be friction fit into the at least one receiving terminal.
[0015] According to another aspect of this embodiment, the at least one projecting clip is tapered towards a central axis of the tubular portion.
[0016] According to another aspect of this embodiment, the at least one projecting clip is spring loaded with a bias towards the central axis. [0017] According to another aspect of this embodiment, the at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of the rod, and the at least one projecting clip comprises two projecting clips.
[0018] According to another aspect of this embodiment, the recess comprises a generally rectangular slot.
[0019] According to a second embodiment of the invention, there is provided a rod for use in an electroplating system in which a plurality of pieces to be electroplated are mounted on the rod; the rod including an electrically conductive elongate portion having a central axis and at least one receiving terminal for receiving at least one of the plurality of pieces and means for connecting first and second ends of the rod to an electroplating rack.
[0020] According to one aspect of the second embodiment, the at least one receiving terminal comprises a recess depressed from an outer surface of the elongate rod.
[0021] According to another aspect of the second embodiment, the at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of the rod.
[0022] According to another aspect of the second embodiment the recess comprises a generally rectangular slot.
[0023] According to a third embodiment of the invention, there is provided a method for electroplating including providing an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack; mounting a plurality of pieces on an electrically conductive elongate rod; the elongate rod having a central axis and at least one receiving terminal; the plurality of pieces having a final-shape portion and a means for attaching connected to the final- shape portion; wherein the means for attaching is sized and otherwise dimensioned to be fixedly received in the at least one receiving terminal; attaching the rod with the mounted plurality of pieces onto the electroplating rack; and, carrying out an electroplating reaction.
[0024] According to various aspects of the third embodiment, the rack, pieces assembly, rod and pieces are as herein described.
[0025] Accordingly, it is an object of the invention to mitigate one or more of the deficiencies of the prior art as herein identified.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] The novel features which are characteristic of the present invention, as to its structure, organization, use and method of operation, together with further objectives and advantages thereof, will be better understood from the following drawings in which a presently preferred embodiment of the invention will now be illustrated by way of example. It is expressly understood, however, that the drawings are for the purpose of illustration and description only, and are not intended as a definition of the limits of the invention. In the accompanying drawings:
[0027] Figure 1 is a perspective view of an electroplating rack on which embodiments of the invention may be mounted. [0028] Figure 2 is a perspective view of a pieces assembly according to one embodiment of the invention. In Figure 2, pieces are removed for ease of illustration and understanding.
[0029] Figure 3 is a top view of the assembly of Figure 2.
[0030] Figure 4 is an exploded view of one piece mounted on a rod according to the invention.
[0031] Figure 5 is a detail view of a receiving terminal on the rod and connecting means on the plastic piece of the embodiment of Figure 2.
[0032] Figure 6 is a perspective view of an end portion of the rod with a piece mounted in the receiving terminal.
DETAILED DESCRIPTION
[0033] Referring now to Figure 1, there is shown one embodiment of the invention, in which electroplating system 250 includes a rigid electroplating rack frame 2B formed of electrically conductive members which are in electrical contact with one another for removably mounting thereon the assemblies 6B of preferably identical molded plastic pieces 5B (shown in more detail in Figure 2). The present invention is directed primarily at novel assemblies 6B of molded plastic pieces 5B that may be adapted for use on various electroplating rack frames, including the example rack frame 2B. It will be appreciated that other rack frames are applicable and the invention may be used with same. These include present prior art rack frames, and racks frames that may later be developed. [0034] Referring to Figure 2, at a first end 12 of the rod 10, there is provided a means for connecting 35 to the rack 6B. In the illustrated example, the means for connecting 35 includes a sleeve that is press-fit into a receiving portion on the rack, or alternatively, is held by clips (not shown) of the rack shown in Figure 1. Various other ways of connecting the rod 10 to the rack such that current flows from the rack to the rod 10 are contemplated. At a distal end 14 of the rod 10, an end cap 40 may be provided to prevent an adjacent piece 5N from becoming dislodged prematurely from the rod 10. The end cap 40 may also provide a degree of safety, by reducing the sharpness of the end of the rod 10, and also provides a surface area on which the rod 10 can be handled.
[0035] By virtue of being attachable to the rod 10, and the rod 10 being attached to the electroplating rack, plastic pieces 5B may be arranged to fit outwardly from the rack frame 2B. One example of a rack 2B is shown in Figure 1, and has a top and bottom and, front and back and defining therebetween an axial direction, and left and right sides and defining therebetween a longitudinal direction. The rack is electrically conductive and includes attachment means for mounting the rod. The rack illustrated is exemplary only, and as will be appreciated by one skilled in the art, any electrically conductive rack suitable for electroplating may be used.
[0036] Figures 2 and 3 show a representative assembly 6B according to one embodiment of the invention. The assembly 6B is characterized generally by a current transmitting rod 10 that is attachable and detachable from the rack of Figure 1. As previously discussed, the means or method used to attach the rod to the rack does not form part of this invention, and therefore, any particular means or method of attachment may be used. The current transmitting rod 10 preferably includes a central axis 15 along which current is transmitted to a plurality of piece receiving terminals 20. The piece receiving terminals 20 are sized and otherwise dimensioned to receive a respective piece 5A thereon. Piece 5A has a corresponding means for attaching 30 to the terminals 20. When the means for attaching 30 is engaged with the terminal 20, the piece 5A is fixed with respect to the rod 10, and spaced along the central axis 15 from an adjacent piece 5B. Accordingly, current is able to flow along the rod 10 to piece 5A, but does not flow from piece 5A to piece 5B. This arrangement maintains consistent and nearly predictable current flow to the end of each rod. By comparison, traditional prior art systems relied on the rack to transmit current to each piece 5B, resulting in mutually inconsistent electroplating amongst pieces on the rack, or an overuse of electroplating chemicals or current to ensure full electroplating at all points of contact between pieces and the rack. The rod 10 of the present invention thus reduces the number of points of contact required between pieces being electroplated and the rack itself. In practice, each of the receiving terminals 20 will have an associated piece 5N, but for ease of understanding and illustration, pieces are only illustrated on some of the terminals 20 of the skewer 10.
[0037] The pieces 5B according to the invention are provided in a manner that permits each piece to be independently attached to the rod 10 along the central axis thereof. Each of the pieces 5B are preferably molded plastic pieces-and are identical to each other such that large volumes of pieces may be electroplated at a time. This arrangement provides significant advantages over the prior art, where typically electroplating only occurs between a single piece and the rack itself. [0038] Generally, each plastic piece 5 A preferably includes a joining portion 45 and a final- shape portion 50, where the joining portion 45 permits attachment with the rod 10, and the final- shape portion represents the desired end-use piece that is to be electroplated. These elements are typically formed from a molded plastic, and are of a material capable of being electroplated. In practice, both the joining portion 45 and the final-shape portion 50 will be electroplated, but the final-shape portion 50 is detached from the joining portion 45 prior to use. This detachment may occur, for example, by providing a break point between the joining portion 45 and the final-shape portion 50, such that detachment can occur manually. The joining portion 45 is then discarded, or recycled.
[0039] Referring now to Figures 4, 5 and 6, there are shown detail views of a single piece 5A, and a respective receiving terminal 20 for receiving the piece 5A. For convenience, a terminal 20 proximate the end of the rod 10 is shown, however, the illustrations are applicable to any particular terminal 20 on the rod 10. Piece 5B may have various sections which project outwardly relative to one another but are not described in detail here. The final-shape portion 50 forms a final shape part that may take on any appearance or configuration, and is not limited to the embodiments herein illustrated.
[0040] Joining portion 45 preferably includes an elongate member 60 leading to the means for attaching 30, which provides an interface between the piece being electroplated, and the terminal 20 of the rod 10. [0041] The terminal 20 preferably includes a generally rectangular shaped, or other non-circular shaped, recess or cavity 65 depressed from an outer surface 70 of the rod 10. Shown more clearly in Figure 6, recess 65 may be a slot formed on an outer surface of the rod 70, defined by an inner surface 75 including a flat, or generally flat, bottom that is sized and otherwise dimensioned to receive a engaging element 80 of the means for receiving 30 of the piece 5 A. Details of the piece 5A are provided below. The recess 65 further includes sidewalls 85 onto which the means for receiving 30 is clipped. Generally, the recess 65 is sized and otherwise dimensioned to engage the means for receiving 30 of the piece 5 A in a friction-fit arrangement, such that the piece 5 A is unable to move, either in translation or in rotation, when engaged in the recess 65.
[0042] Pieces 5 A are joined to the rod 10 by an interference fit connection or a snap fit connection, along the central axis 15 of the rod 10. The final shape portion 50 is the portion of the piece 5A that is intended to be used as an end-product. As shown in Figure 4, final shape portion 50 is attached to a joining portion 45, by break portion 90. Break portion 90 defines the point at which the final shape portion 50 is separated from the joining portion 45. It will be understood by one skilled in the art that the final shape portion 50 may be any shape being electroplated, and only a representative version is depicted here. In addition, the joining portion 45 is shown elongated, and disproportionately larger than the final shape portion 50, for ease of illustration. In practice, the size of the joining portion 45 may be adjusted to optimize the process should be and/or minimize byproduct. Focusing now on the means for attaching 30, which is connected to the joining portion 45, a generally tubular portion having an inner diameter 100 within a predetermined tolerance larger than the outer diameter of the rod 10, such that the inner diameter 100 of the tubular portion slidingly engages the outer surface 105 of the rod 10. Projecting from the tubular portion 95, in a direction parallel with the central axis 15 of the rod 10, are a pair of projecting clips 110 that have disposed at ends thereof, engaging elements 80 extending into the terminals 65 of the rod 10. Engaging elements 80 extend perpendicular to the central axis 15 from the projecting clips and are arranged such that the distance between the engaging elements 80a and 80b is less than the outer diameter of the rod 10. In this regard, the projecting clips 110 are provided with sufficient flexibility to permit the projecting clips 10, and the engaging elements 80a and 80b, to be displaced by flexing, relative to the tubular portion 95, such that the tubular portion 95 can slide over the outer surface 105 of the rod 10. In addition, it should be possible to remove the engaging elements 80a and 80b from being depressed into the terminals 20 without excessive force. Optionally, inner walls 115 of the projecting clips 110 may be tapered to provide spring action in the flexing of the projecting clips 110, with a bias towards engagement of the engaging elements 80 with the terminals 20. Various modifications to the interaction between the rod 10 and the means for attaching 30 are contemplated.
[0043] In use, a plurality of rods 10 are each donned with a plurality of pieces 5N before mounting on an electroplating rack. Any means for mounting on the rack may be used, provided that current is able to flow from the rack to the rods 10. In fixedly mounting the plurality of pieces 5N onto each rod 10, the pieces may be slid from an end of the rod until engagement of the engaging elements 80 with the terminals 65 (as shown in Figure 4, for example). Tooling may be developed to mount a number of pieces 5N onto the rod 10 simultaneously. After the electroplating process has been complete, the pieces 5N can either be individually removed, or the final shape portion can be detached from the joining portion, and the removal of any waste material still attached to the rod performed separately. It is also feasible that tooling be used to remove multiple pieces simultaneously.
[0044] Various advantages of the invention as herein described will be evident to those skilled in the art. For example, the volume of pieces that may be simultaneously electroplated on a rack of a given footprint is dramatically increased over prior art systems. Furthermore, the removable rod 10 allows for pieces to be mounted on the rod at a location distal from the electroplating facility. In this regard, mounting on the rod facilitates shipping and transport of the pieces as well. For example, at an injection molding facility, the pieces may be mounted onto the rod, packaged and shipped to an electroplating facility. Here, the electroplating process can be completed, and the rod with pieces intact can be shipped to another facility for further processing, where the final shape portion can be removed, and processed further as needed. This arrangement is not possible in the majority of prior art systems where pieces have to be removed from the electroplating rack individually.
[0045] Moreover, the description and illustration of the invention is an example and the invention is not limited to the exact details shown or described.
[0046] Variations and adaptations to the methods herein described are contemplated by the invention and accordingly, the above-described embodiments are intended to be examples of the present invention and alterations and modifications may be effected thereto, by those of skill in the art, without departing from the scope of the invention that is defined solely by the claims appended hereto.

Claims

CLAIMS:
1. An electroplating system comprising:
an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to said rack; said pieces assembly comprising
an electrically conductive elongate rod having a central axis and at least one receiving terminal; said elongate rod connected to said rack connecting member at first and second ends thereof;
a plurality of pieces, each piece having a final-shape portion and a means for attaching connected to said final-shape portion;
wherein said means for attaching is sized and otherwise dimensioned to be fixedly received in said at least one receiving terminal.
2. An electroplating system according to claim 1, wherein said at least one receiving terminal comprises a recess depressed from an outer surface of said elongate rod.
3. An electroplating system according to 1, wherein each piece further includes a joining portion connecting said final-shape portion and said means for attaching; said final-shape portion adapted to be disconnected from said joining portion following an electroplating process.
4. An electroplating system according to claim 2, wherein said means for attaching comprises a tubular portion adapted to slidingly engage said outer surface of said rod, at least one projecting clip attached to said tubular portion, and an engaging element at an end of said at least one projecting clip.
5. An electroplating system according to claim 4, wherein said engaging element is sized and otherwise dimensioned to be friction fit into said at least one receiving terminal.
6. An electroplating system according to claim 4, wherein said at least one projecting clip is tapered towards a central axis of said tubular portion.
7. An electroplating system according to claim 6, wherein said at least one projecting clip is spring loaded with a bias towards said central axis.
8. An electroplating system according to claim 4, wherein said at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of said rod, and said at least one projecting clip comprises two projecting clips.
9. An electroplating system according to claim 2, wherein said recess comprises a generally rectangular slot.
10. A rod for use in an electroplating system in which a plurality of pieces to be electroplated are mounted on the rod; the rod comprising
an electrically conductive elongate portion having a central axis and at least one receiving terminal for receiving at least one of the plurality of pieces; and,
means for connecting first and second ends of the rod to an electroplating rack.
11. A rod according to claim 10, wherein said at least one receiving terminal comprises a recess depressed from an outer surface of said elongate rod.
12. A rod according to claim 10, wherein said at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of the rod.
13. An rod according to claim 11, wherein said recess comprises a generally rectangular slot.
14. A method for electroplating comprising:
providing an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to said rack;
mounting a plurality of pieces on an electrically conductive elongate rod; said elongate rod having a central axis and at least one receiving terminal; said plurality of pieces having a final-shape portion and a means for attaching connected to said final-shape portion; wherein said means for attaching is sized and otherwise dimensioned to be fixedly received in said at least one receiving terminal; attaching said rod with said mounted plurality of pieces onto said electroplating rack; and,
carrying out an electroplating reaction.
15. A method according to claim 14, wherein said at least one receiving terminal comprises a recess depressed from an outer surface of said elongate rod.
16. A method according to claim 14, wherein each piece further includes a joining portion connecting said final-shape portion and said means for attaching; said final-shape portion adapted to be disconnected from said joining portion following an electroplating process.
17. A method according to claim 15, wherein said means for attaching comprises a tubular portion adapted to slidingly engage said outer surface of said rod, at least one projecting clip attached to said tubular portion, and an engaging element at an end of said at least one projecting clip.
18. A method according to claim 17, wherein said engaging element is sized and otherwise dimensioned to be friction fit into said at least one receiving terminal.
19. A method according to claim 17, wherein said at least one projecting clip is tapered towards a central axis of said tubular portion.
20. A method according to claim 19, wherein said at least one projecting clip is spring loaded with a bias towards said central axis.
21. A method according to claim 17, wherein said at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of said rod, and said at least one projecting clip comprises two projecting clips.
22. A method according to claim 15, wherein said recess comprises a generally rectangular slot.
PCT/CA2013/050198 2011-09-22 2013-03-14 Electroplating assembly and related components WO2014138840A1 (en)

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PCT/CA2013/050198 WO2014138840A1 (en) 2013-03-14 2013-03-14 Electroplating assembly and related components
MX2015012753A MX2015012753A (en) 2013-03-14 2013-03-14 Electroplating assembly and related components.
US14/775,845 US20160024682A1 (en) 2011-09-22 2013-03-14 Electroplating Assembly And Related Components
CA2906214A CA2906214A1 (en) 2013-03-14 2013-03-14 Electroplating assembly and related components

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN105112987A (en) * 2015-09-28 2015-12-02 无锡市星亿涂装环保设备有限公司 Electroplating conductive stick swinging and water-pouring device

Citations (4)

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US3056739A (en) * 1959-11-13 1962-10-02 Machlett Lab Inc Electroplating rack
CA1215939A (en) * 1983-05-24 1986-12-30 Horst Mallok Plating rack
EP1600529A2 (en) * 2004-05-26 2005-11-30 Komag, Inc. Method and apparatus for applying a voltage to one or more substrates during plating
CA2631055A1 (en) * 2007-05-11 2008-11-11 Lacks Enterprises, Inc. Method and apparatus for racking articles for surface treatment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056739A (en) * 1959-11-13 1962-10-02 Machlett Lab Inc Electroplating rack
CA1215939A (en) * 1983-05-24 1986-12-30 Horst Mallok Plating rack
EP1600529A2 (en) * 2004-05-26 2005-11-30 Komag, Inc. Method and apparatus for applying a voltage to one or more substrates during plating
CA2631055A1 (en) * 2007-05-11 2008-11-11 Lacks Enterprises, Inc. Method and apparatus for racking articles for surface treatment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105112987A (en) * 2015-09-28 2015-12-02 无锡市星亿涂装环保设备有限公司 Electroplating conductive stick swinging and water-pouring device
CN105112987B (en) * 2015-09-28 2018-06-26 无锡星亿智能环保装备股份有限公司 A kind of plating flies a bar swing pouring device

Also Published As

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CA2906214A1 (en) 2014-09-18
MX2015012753A (en) 2016-06-10

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