WO2014111010A1 - Hole sealing method for conductive through-hole and hole-sealed product - Google Patents

Hole sealing method for conductive through-hole and hole-sealed product Download PDF

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Publication number
WO2014111010A1
WO2014111010A1 PCT/CN2014/070621 CN2014070621W WO2014111010A1 WO 2014111010 A1 WO2014111010 A1 WO 2014111010A1 CN 2014070621 W CN2014070621 W CN 2014070621W WO 2014111010 A1 WO2014111010 A1 WO 2014111010A1
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WO
WIPO (PCT)
Prior art keywords
conductive
hole
sealing
micropores
housing
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Application number
PCT/CN2014/070621
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French (fr)
Chinese (zh)
Inventor
范建
赵泽炎
苏默克
Original Assignee
贝尔罗斯(广州)电子部件有限公司
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Publication of WO2014111010A1 publication Critical patent/WO2014111010A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Definitions

  • the invention relates to a sealing method for a conductive through hole and a sealing product. Background technique
  • Embodiments of the present invention provide a method for sealing a conductive via and a sealed product.
  • a method for sealing a conductive through hole includes: forming a blind hole penetrating through an inner surface of the casing; forming a micro hole penetrating through an outer surface of the casing and communicating with the blind hole; The blind hole and the inner wall of the micro hole are plated with a conductive film to form a conductive via; and the conductive via is sealed.
  • a sealed product includes: a housing, a blind hole penetrating through an inner surface of the housing; and a micro hole penetrating through an outer surface of the housing and communicating with the blind hole;
  • the blind hole and the inner wall of the micro hole are provided with a conductive film to constitute a conductive via, and the conductive via is sealed.
  • Embodiment 1 The technical content and detailed description of the embodiments of the present invention will be described below with reference to the accompanying drawings.
  • the method for preparing the conductive via hole generally includes the following steps: First, a mold or a numerical control machine (CNC, Computer numerical control) is used to pass the ⁇ L; secondly, a conductive film is formed on the inner wall of the overnight ⁇ L, which is formed at the force port, to form Conductive via hole; Finally, sealing is performed using glue in the formed conductive via hole to complete the processing of the conductive via hole.
  • CNC Computer numerical control
  • the diameter of the conductive via hole which can be obtained can be at least 0.35 mm.
  • a method for sealing a conductive via hole includes the following steps:
  • Step 10 Form a blind hole through the inner surface of the housing.
  • a blind hole 21 penetrating the inner surface of the casing 10 is machined using a mold or a CNC.
  • the opening diameter D1 of the blind hole 21 should be greater than 0.5 mm, so as to facilitate the entry of the dispensing head into the blind hole 21 during subsequent sealing; in addition, considering the ease of processing and cost, etc., the maximum processing time
  • the diameter is generally less than 5 mm, and the preferred values may be: lmm, 1.2 mm, and the like.
  • the minimum diameter D2 of the blind hole 21 which can be machined by the mold or the CNC method is 0.35 mm
  • the bottom diameter D2 of the blind hole 21 is larger than 0.35 mm, so that the blind hole is processed and continues in the blind hole 21 The bottom of the micromachined hole 22.
  • the cross-sectional shape of the blind hole may be a circular shape, or a continuously gradual elliptical shape, or the like, and may also be an irregular cross-sectional shape, and is not limited thereto.
  • Step 11 forming micropores that penetrate the outer surface of the housing and communicate with the blind holes.
  • micropores 22 penetrating the outer surface of the casing 10 and communicating with the blind holes 21 are processed by laser direct structuring (LDS).
  • LDS laser direct structuring
  • the diameter D3 of the micropores 22 may be 0.02-0.3 mm, preferably 0.1-0.15 mm, and when the diameter D3 of the micropores 22 is within the preferred numerical range, the conductive film can be conveniently plated later, and the sealing film can be sealed. A good appearance effect is obtained after the subsequent painting; more preferably 0.14 mm or 0.15 mm, which is industrially easier to implement. If the diameter D3 of the micropores 22 is less than 0.02 mm, it is disadvantageous for the subsequent plating of the conductive film, so that the conductive film layer is not easily plated completely, causing a disconnection defect. If the diameter D3 of the micropores 22 is larger than 0.3 mm, it is easy to see a bright spot at this position after subsequent sealing and painting, resulting in appearance defects.
  • the axial height H of the micropores 22 may be 0.05-0.3 mm, preferably 0.1-0.15 mm, and when the axial height H is within the preferred numerical range, the blind holes 21 are made simple and convenient, and a good appearance can be ensured. The effect; more preferably 0.1 mm or 0.11 mm, is industrially easier to implement. If the axial height H of the micropores 22 (i.e., the thickness of the casing 10 under the bottom of the blind holes 21) is larger than 0.3 mm, the surface of the casing 10 is arched when the micropores 22 are processed, and a snare drum is formed after painting. , causing appearance defects. If the axial height H of the micropores 22 is less than 0.05 mm, the bottom of the blind holes 21 is too thin, making the fabrication of the blind holes 21 difficult or impossible.
  • Step 12 plating a conductive film on the inner wall of the blind hole and the micro hole to form a conductive via.
  • a conductive film (not shown) is electrolessly plated on the inner walls of the blind holes 21 and the micro holes 22, and the blind holes 21 and the micro holes 22 plated with the conductive film constitute the conductive vias 20.
  • the conductive film may have a thickness of 5-15 um, preferably 9 ⁇ m, ⁇ , or the like.
  • the thickness is too thin, the electrical conductivity of the conductive film layer is poor; and the thickness is too thick, which not only causes an increase in the plating cost, but also affects the aesthetics of the product after painting.
  • the conductive film may be a metal film such as copper and nickel, copper and silver, or copper and gold. It is not limited to this, and it can also be other materials that are electrically conductive and resistant to corrosion.
  • Step 13 sealing the conductive via hole.
  • the adhesive tape 30 is attached to one end of the micro hole 22 of the conductive through hole 20; the glue 40 is injected at one end of the blind hole 21 of the conductive through hole 20; after the glue 40 is cured, the adhesive is removed. Tape 30.
  • the glue 40 may be an ultraviolet UV glue, an epoxy resin AB glue or a conductive paste, and is not limited thereto, and any glue capable of adhering to the outer surface of the plated conductive film may be used.
  • the form of the glue 40 (solid or liquid) and the shape are arbitrary, and the size thereof should be smaller than the volume of the blind hole 21.
  • the tape 30 can be other members, enabling the sealing of the micropores 22 to prevent the glue 40 from flowing out, and can be easily removed.
  • an embodiment of the present invention further provides a sealed product, the sealed product including a casing, a blind hole penetrating through an inner surface of the casing, and an outer surface penetrating the casing and a blind hole communicating with the micro hole; the blind hole and the inner wall of the micro hole are provided with a conductive film to form a conductive through hole, and the conductive through hole is sealed.
  • the connection and combination of the conductive vias and other components/parts/circuits on the housing are well known and understood by those skilled in the art and will not be described herein.
  • the sealed product may be a mobile phone, that is, a conductive through hole is formed on the casing of the mobile phone. It is also possible to form a conductive via or the like on the radio, that is, on the casing of the radio.
  • the method for sealing a conductive through hole and the sealing product of the embodiment of the invention have a good waterproof and moisture proof sealing function, and further, since the diameter of the micro hole is only 0.02-0.3 mm, it is not visible after painting. Traces to the contour of the hole ensure the uniformity of the product housing and improve the aesthetic appearance of the product housing.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

A hole sealing method for a conductive through-hole and a hole-sealed product. The hole sealing method comprises: forming a blind hole (21) penetrating the inner surface of a housing (10); forming a micropore (22) penetrating the outer surface of the housing (10) and communicating with the blind hole (21); plating conductive films on the inner walls of the blind hole (21) and the micropore (22) to constitute a conductive through-hole (20); and performing hole sealing on the conductive through-hole (20). The hole-sealed product includes a housing (10), a blind hole (21) penetrating the inner surface of the housing, and a micropore (22) penetrating the outer surface of the housing (10) and communicating with the blind hole (21), wherein the inner walls of the blind hole (21) and the micropore (22) are provided with the conductive films to thus constitute a conductive through-hole (20), and the conductive through-hole (20) is sealed. This not only has sealing functions of water-proofing and damp-proofing, but also can ensure the aesthetic effect of a painted product housing.

Description

导电通孔的封孔方法及封孔产品 技术领域  Sealing method of conductive through hole and sealing product technical field
本发明涉及一种导电通孔的封孔方法及一种封孔产品。 背景技术  The invention relates to a sealing method for a conductive through hole and a sealing product. Background technique
目前， 包含有无线电路的产品如手机等通常都设置有导电通孔， 通过 该导电通孔将产品的壳体外表面上的电路与壳体内表面上的电路进行电连 接。 对于导电通孔的尺寸， 通常是以小孔径为佳。 一旦导电通孔的孔径较 大， 封孔用的胶水在固化后表面会缩水， 进行喷漆后能看到孔的轮廓痕迹， 从而影响了产品壳体的美观效果。 发明内容  Currently, products including wireless circuits, such as mobile phones, are generally provided with conductive vias through which electrical circuits on the outer surface of the product housing are electrically connected to circuitry on the inner surface of the housing. For the size of the conductive via, it is usually a small aperture. Once the diameter of the conductive through hole is large, the surface of the sealing hole will shrink when it is cured, and the outline of the hole can be seen after painting, thereby affecting the aesthetic effect of the product casing. Summary of the invention
本发明实施例提供了一种导电通孔的封孔方法及一种封孔产品。  Embodiments of the present invention provide a method for sealing a conductive via and a sealed product.
本发明实施例的一种导电通孔的封孔方法， 包括： 形成贯通壳体的内 表面的盲孔； 形成贯通所述壳体的外表面并与所述盲孔连通的微孔； 在所 述盲孔和所述微孔的内壁制镀导电膜， 构成导电通孔； 对所述导电通孔进 行封孔。  A method for sealing a conductive through hole according to an embodiment of the present invention includes: forming a blind hole penetrating through an inner surface of the casing; forming a micro hole penetrating through an outer surface of the casing and communicating with the blind hole; The blind hole and the inner wall of the micro hole are plated with a conductive film to form a conductive via; and the conductive via is sealed.
本发明实施例的一种封孔产品， 包括： 壳体、 贯通所述壳体的内表面 的盲孔、 以及贯通所述壳体的外表面并与所述盲孔连通的微孔； 所述盲孔 和所述微孔的内壁设置有导电膜进而构成导电通孔， 所述导电通孔被封孔。 附图说明 图 2至图 7为本发明实施例的导电通孔的封孔方法的加工过程的示意 图。 A sealed product according to an embodiment of the present invention includes: a housing, a blind hole penetrating through an inner surface of the housing; and a micro hole penetrating through an outer surface of the housing and communicating with the blind hole; The blind hole and the inner wall of the micro hole are provided with a conductive film to constitute a conductive via, and the conductive via is sealed. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 to FIG. 7 are schematic diagrams showing a processing procedure of a method for sealing a conductive via according to an embodiment of the present invention; Figure.
附图标记说明：  Description of the reference signs:
10壳体 20通孔  10 housing 20 through holes
21盲孔 22 孔  21 blind holes 22 holes
30胶带 40胶水  30 tape 40 glue
D1-D3直径 H高度 具体实施方式  D1-D3 diameter H height
有关本发明实施例的技术内容及详细说明， 现结合附图说明如下。 实施例一  The technical content and detailed description of the embodiments of the present invention will be described below with reference to the accompanying drawings. Embodiment 1
制备导电通孔的方法通常包括以下步驟： 首先， 采用模具或者数控机 ( CNC, Computer numerical control )力口工通孑 L; 其次， 在力口工出的通孑 L 内壁镀有导电膜， 形成导电通孔； 最后， 在形成的导电通孔内使用胶水进 行封孔， 完成对该导电通孔的处理。  The method for preparing the conductive via hole generally includes the following steps: First, a mold or a numerical control machine (CNC, Computer numerical control) is used to pass the 孑L; secondly, a conductive film is formed on the inner wall of the overnight 工L, which is formed at the force port, to form Conductive via hole; Finally, sealing is performed using glue in the formed conductive via hole to complete the processing of the conductive via hole.
采用上述制备方法， 可以获得的导电通孔的孔径最小可为 0.35mm。 实施例二  With the above preparation method, the diameter of the conductive via hole which can be obtained can be at least 0.35 mm. Embodiment 2
如图 1 所示， 本发明实施例的一种导电通孔的封孔方法， 包括以下步 驟：  As shown in FIG. 1, a method for sealing a conductive via hole according to an embodiment of the present invention includes the following steps:
步驟 10: 形成贯通壳体的内表面的盲孔。  Step 10: Form a blind hole through the inner surface of the housing.
具体地， 如图 2所示， 使用模具或者 CNC加工出贯通壳体 10的内表 面的盲孔 21。  Specifically, as shown in Fig. 2, a blind hole 21 penetrating the inner surface of the casing 10 is machined using a mold or a CNC.
其中， 盲孔 21的开口直径 D1应大于 0.5mm, 以利于在后续封孔时点 胶头能够进入该盲孔 21 ; 此外， 考虑到加工的难易程度及成本等因素， 实 际加工时的最大直径一般小于 5mm, 优选值可为： lmm、 1.2mm等。 目前 模具或者 CNC方法可加工出的盲孔 21的底部直径 D2最小值为 0.35mm, 盲孔 21的底部直径 D2大于 0.35mm, 以便于盲孔的加工并继续在盲孔 21 的底部加工微孔 22。 此外， 盲孔的横截面形状可以为圆形， 或者连续渐变 的椭圆形等等， 还可以为不规则的截面形状， 并不以此为限。 Wherein, the opening diameter D1 of the blind hole 21 should be greater than 0.5 mm, so as to facilitate the entry of the dispensing head into the blind hole 21 during subsequent sealing; in addition, considering the ease of processing and cost, etc., the maximum processing time The diameter is generally less than 5 mm, and the preferred values may be: lmm, 1.2 mm, and the like. At present, the minimum diameter D2 of the blind hole 21 which can be machined by the mold or the CNC method is 0.35 mm, and the bottom diameter D2 of the blind hole 21 is larger than 0.35 mm, so that the blind hole is processed and continues in the blind hole 21 The bottom of the micromachined hole 22. In addition, the cross-sectional shape of the blind hole may be a circular shape, or a continuously gradual elliptical shape, or the like, and may also be an irregular cross-sectional shape, and is not limited thereto.
步驟 11 : 形成贯通所述壳体的外表面并与所述盲孔连通的微孔。  Step 11: forming micropores that penetrate the outer surface of the housing and communicate with the blind holes.
具体地，如图 3所示，采用激光直接成型（ LDS , Laser Direct Structuring ) 技术加工出贯通壳体 10的外表面并与盲孔 21连通的微孔 22。  Specifically, as shown in Fig. 3, micropores 22 penetrating the outer surface of the casing 10 and communicating with the blind holes 21 are processed by laser direct structuring (LDS).
其中， 微孔 22的直径 D3可以为 0.02-0.3mm, 优选为 0.1-0.15mm, 微 孔 22的直径 D3在该优选数值范围内时， 可方便后续制镀导电膜， 并可在 封孔及后续喷漆后获得好的外观效果； 更优选为 0.14mm或 0.15mm时， 在 工业上更易于实施。如果微孔 22的直径 D3小于 0.02mm, 不利于后续制镀 导电膜， 使得导电膜层不易被镀制完全， 造成断路缺陷。 如果微孔 22的直 径 D3大于 0.3mm, 后续封孔及喷漆后， 容易在该位置处看到一个亮点， 造 成外观缺陷。  Wherein, the diameter D3 of the micropores 22 may be 0.02-0.3 mm, preferably 0.1-0.15 mm, and when the diameter D3 of the micropores 22 is within the preferred numerical range, the conductive film can be conveniently plated later, and the sealing film can be sealed. A good appearance effect is obtained after the subsequent painting; more preferably 0.14 mm or 0.15 mm, which is industrially easier to implement. If the diameter D3 of the micropores 22 is less than 0.02 mm, it is disadvantageous for the subsequent plating of the conductive film, so that the conductive film layer is not easily plated completely, causing a disconnection defect. If the diameter D3 of the micropores 22 is larger than 0.3 mm, it is easy to see a bright spot at this position after subsequent sealing and painting, resulting in appearance defects.
此外， 微孔 22的轴向高度 H可以为 0.05-0.3mm, 优选为 0.1-0.15mm, 轴向高度 H在该优选数值范围内时， 制作盲孔 21简易方便， 并可保证获得 好的外观效果； 更优选为 0.1mm或 0.11mm时， 在工业上更易于实施。 如 果微孔 22的轴向高度 H(即盲孔 21的底部下的壳体 10的厚度）大于 0.3mm, 在加工微孔 22时会使壳体 10的表面拱起， 喷漆后会形成小鼓包， 造成外 观缺陷。 如果微孔 22的轴向高度 H小于 0.05mm, 盲孔 21的底部太薄， 使 得盲孔 21的制作较为困难， 甚至无法完成。  In addition, the axial height H of the micropores 22 may be 0.05-0.3 mm, preferably 0.1-0.15 mm, and when the axial height H is within the preferred numerical range, the blind holes 21 are made simple and convenient, and a good appearance can be ensured. The effect; more preferably 0.1 mm or 0.11 mm, is industrially easier to implement. If the axial height H of the micropores 22 (i.e., the thickness of the casing 10 under the bottom of the blind holes 21) is larger than 0.3 mm, the surface of the casing 10 is arched when the micropores 22 are processed, and a snare drum is formed after painting. , causing appearance defects. If the axial height H of the micropores 22 is less than 0.05 mm, the bottom of the blind holes 21 is too thin, making the fabrication of the blind holes 21 difficult or impossible.
步驟 12: 在所述盲孔和所述微孔的内壁制镀导电膜， 构成导电通孔。 具体地， 在盲孔 21和微孔 22的内壁化学镀导电膜（图中未示出）， 镀 有所述导电膜的盲孔 21和微孔 22构成了导电通孔 20。  Step 12: plating a conductive film on the inner wall of the blind hole and the micro hole to form a conductive via. Specifically, a conductive film (not shown) is electrolessly plated on the inner walls of the blind holes 21 and the micro holes 22, and the blind holes 21 and the micro holes 22 plated with the conductive film constitute the conductive vias 20.
其中， 所述导电膜厚度可以为 5-15um, 优选可为： 9 μ ιη、 ΙΟ μ ιη等。 厚度太薄， 导电膜层的电性能差； 而厚度太厚， 不仅导致电镀成本增加， 还会影响产品喷漆后的美观度。 此外， 所述导电膜可以为金属薄膜， 如铜和镍， 铜和银， 或铜和金。 并不以此为限， 也可以为导电性良好且耐腐蚀的其它材料。 The conductive film may have a thickness of 5-15 um, preferably 9 μm, ΙΟμιη, or the like. The thickness is too thin, the electrical conductivity of the conductive film layer is poor; and the thickness is too thick, which not only causes an increase in the plating cost, but also affects the aesthetics of the product after painting. Further, the conductive film may be a metal film such as copper and nickel, copper and silver, or copper and gold. It is not limited to this, and it can also be other materials that are electrically conductive and resistant to corrosion.
步驟 13: 对所述导电通孔进行封孔。  Step 13: sealing the conductive via hole.
具体地， 如图 4至图 7所示， 在导电通孔 20的微孔 22的一端粘贴胶 带 30; 在导电通孔 20的盲孔 21的一端注射胶水 40; 待胶水 40固化后， 移除胶带 30。  Specifically, as shown in FIG. 4 to FIG. 7 , the adhesive tape 30 is attached to one end of the micro hole 22 of the conductive through hole 20; the glue 40 is injected at one end of the blind hole 21 of the conductive through hole 20; after the glue 40 is cured, the adhesive is removed. Tape 30.
其中， 胶水 40可以为紫外线 UV胶、 环氧树脂 AB胶或导电胶， 并不 以此为限， 任何能够与镀有的所述导电膜的外表面具有粘结性的胶水均可。 另外， 胶水 40 的形态 （固态或液态）及形状任意， 其大小应小于盲孔 21 的容积。  The glue 40 may be an ultraviolet UV glue, an epoxy resin AB glue or a conductive paste, and is not limited thereto, and any glue capable of adhering to the outer surface of the plated conductive film may be used. In addition, the form of the glue 40 (solid or liquid) and the shape are arbitrary, and the size thereof should be smaller than the volume of the blind hole 21.
此外， 胶带 30还可以为其它构件， 能够实现封堵微孔 22防止胶水 40 流出， 并且可以方便地移除即可。  In addition, the tape 30 can be other members, enabling the sealing of the micropores 22 to prevent the glue 40 from flowing out, and can be easily removed.
进一步地， 本发明实施例还提供了一种封孔产品， 所述封孔产品包括 壳体、 贯通所述壳体的内表面的盲孔、 以及贯通所述壳体的外表面并与所 述盲孔连通的微孔； 所述盲孔和所述微孔的内壁设置有导电膜进而构成导 电通孔， 所述导电通孔被封孔。 所述导电通孔与壳体上的其它部件 /零件 / 电路的连接及组合关系容易被本领域技术人员熟知及掌握， 在此不再赘述。  Further, an embodiment of the present invention further provides a sealed product, the sealed product including a casing, a blind hole penetrating through an inner surface of the casing, and an outer surface penetrating the casing and a blind hole communicating with the micro hole; the blind hole and the inner wall of the micro hole are provided with a conductive film to form a conductive through hole, and the conductive through hole is sealed. The connection and combination of the conductive vias and other components/parts/circuits on the housing are well known and understood by those skilled in the art and will not be described herein.
其中， 封孔产品可以为手机， 即在手机的壳体上形成导电通孔。 还可 以为收音机， 即在收音机的壳体上形成导电通孔等等。  The sealed product may be a mobile phone, that is, a conductive through hole is formed on the casing of the mobile phone. It is also possible to form a conductive via or the like on the radio, that is, on the casing of the radio.
本发明实施例的一种导电通孔的封孔方法以及一种封孔产品， 具备良 好的防水防潮的密封功能， 此外， 由于微孔的直径仅仅可为 0.02-0.3mm, 在喷漆后看不到孔的轮廓痕迹， 保证了产品壳体的均一性， 提高了产品壳 体的美观效果。  The method for sealing a conductive through hole and the sealing product of the embodiment of the invention have a good waterproof and moisture proof sealing function, and further, since the diameter of the micro hole is only 0.02-0.3 mm, it is not visible after painting. Traces to the contour of the hole ensure the uniformity of the product housing and improve the aesthetic appearance of the product housing.
以上所述， 仅为本发明的较佳实施例而已， 并非用于限定本发明的保 护范围。  The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention.

Claims

权利要求书 claims
1、 一种导电通孔的封孔方法， 其特征在于， 包括： 1. A method for sealing conductive via holes, which is characterized by including:
形成贯通壳体的内表面的盲孔； forming a blind hole penetrating the inner surface of the housing;
形成贯通所述壳体的外表面并与所述盲孔连通的微孔； Form micropores that penetrate the outer surface of the housing and communicate with the blind holes;
在所述盲孔和所述微孔的内壁制镀导电膜， 构成导电通孔； Conductive films are plated on the inner walls of the blind holes and micropores to form conductive through holes;
对所述导电通孔进行封孔。 The conductive via holes are sealed.
2、 如权利要求 1所述的导电通孔的封孔方法， 其中， 所述形成贯通壳 体的内表面的盲孔， 包括： 2. The method for sealing conductive via holes as claimed in claim 1, wherein the formation of the blind hole penetrating the inner surface of the housing includes:
使用模具或者数控机床加工出贯通所述壳体的内表面的所述盲孔。 A mold or CNC machine tool is used to process the blind hole penetrating the inner surface of the housing.
3、 如权利要求 1所述的导电通孔的封孔方法， 其中， 所述形成贯通所 述壳体的外表面并与所述盲孔连通的微孔， 包括： 3. The method for sealing conductive via holes according to claim 1, wherein forming micropores penetrating the outer surface of the housing and communicating with the blind holes includes:
采用激光直接成型技术加工出贯通所述壳体的外表面并与所述盲孔连 通的所述微孔。 Laser direct forming technology is used to process the microholes that penetrate the outer surface of the housing and communicate with the blind holes.
4、 如权利要求 1至 3中任一项所述的导电通孔的封孔方法， 其中， 所 述在所述盲孔和所述微孔的内壁制镀导电膜， 包括： 4. The method for sealing conductive via holes according to any one of claims 1 to 3, wherein said plating a conductive film on the inner walls of the blind holes and the micropores includes:
在所述盲孔和所述微孔的内壁化学镀所述导电膜。 The conductive film is electrolessly plated on the inner walls of the blind holes and micropores.
5、 如权利要求 4所述的导电通孔的封孔方法， 其中， 所述导电膜是由 铜和镍， 铜和银， 或铜和金制成的。 5. The method for sealing conductive via holes according to claim 4, wherein the conductive film is made of copper and nickel, copper and silver, or copper and gold.
6、 如权利要求 1至 3中任一项所述的导电通孔的封孔方法， 其中， 所 述对所述导电通孔进行封孔， 包括： 6. The method for sealing conductive via holes according to any one of claims 1 to 3, wherein the sealing of the conductive via holes includes:
在所述导电通孔的所述微孔的一端粘贴胶带； Paste tape on one end of the microhole of the conductive via;
在所述导电通孔的所述盲孔的一端注射胶水； Inject glue into one end of the blind hole of the conductive through hole;
待所述胶水固化后， 移除所述胶带。 After the glue has cured, remove the tape.
7、 如权利要求 6所述的导电通孔的封孔方法， 其中， 所述胶水为紫外 线胶、 环氧树脂胶或导电胶。 7. The method for sealing conductive via holes according to claim 6, wherein the glue is ultraviolet glue, epoxy resin glue or conductive glue.
8、 一种封孔产品， 其特征在于， 包括壳体、 贯通所述壳体的内表面的 盲孔、 以及贯通所述壳体的外表面并与所述盲孔连通的微孔； 所述盲孔和 所述微孔的内壁设置有导电膜进而构成导电通孔， 所述导电通孔被封孔。 8. A sealing product, characterized in that it includes a housing, a blind hole penetrating the inner surface of the housing, and micropores penetrating the outer surface of the housing and communicating with the blind hole; A conductive film is provided on the inner wall of the blind hole and the micropore to form a conductive through hole, and the conductive through hole is sealed.
9、 如权利要求 8所述的封孔产品， 其中， 所述导电通孔的盲孔的开口 直径大于 0.5mm, 所述盲孔的底部直径大于 0.35mm。 9. The sealing product according to claim 8, wherein the opening diameter of the blind hole of the conductive through hole is greater than 0.5mm, and the bottom diameter of the blind hole is greater than 0.35mm.
10、 如权利要求 8或 9所述的封孔产品， 其中， 所述导电通孔的微孔 的直径为 0.02-0.3mm。 10. The sealing product according to claim 8 or 9, wherein the diameter of the micropores of the conductive through holes is 0.02-0.3mm.
11、 如权利要求 8或 9所述的封孔产品， 其中， 所述导电通孔的微孔 的直径为 0.1-0.15mm。 11. The sealing product according to claim 8 or 9, wherein the diameter of the micropores of the conductive through holes is 0.1-0.15 mm.
12、 如权利要求 8或 9所述的封孔产品， 其中， 所述导电通孔的微孔 的直径为 0.14mm或 0.15mm。 12. The sealing product according to claim 8 or 9, wherein the diameter of the micropores of the conductive through holes is 0.14mm or 0.15mm.
13、 如权利要求 8或 9所述的封孔产品， 其中， 所述微孔的轴向高度 为 0.05-0.3mm。 13. The sealing product according to claim 8 or 9, wherein the axial height of the micropores is 0.05-0.3mm.
14、 如权利要求 8或 9所述的封孔产品， 其中， 所述微孔的轴向高度 为 0.1-0.15mm。 14. The sealing product according to claim 8 or 9, wherein the axial height of the micropores is 0.1-0.15mm.
15、 如权利要求 8或 9所述的封孔产品， 其中， 所述微孔的轴向高度 为 0.1mm或 0.11mm。 15. The sealing product according to claim 8 or 9, wherein the axial height of the micropores is 0.1mm or 0.11mm.
PCT/CN2014/070621 2013-01-15 2014-01-14 Hole sealing method for conductive through-hole and hole-sealed product WO2014111010A1 (en)

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CN107889389B (en) * 2017-10-31 2019-10-25 Oppo广东移动通信有限公司 A kind of processing method of shell, shell and mobile terminal
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