WO2014095023A1 - Led chips on devices and the methods of manufacturing them - Google Patents

Led chips on devices and the methods of manufacturing them Download PDF

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Publication number
WO2014095023A1
WO2014095023A1 PCT/EP2013/003789 EP2013003789W WO2014095023A1 WO 2014095023 A1 WO2014095023 A1 WO 2014095023A1 EP 2013003789 W EP2013003789 W EP 2013003789W WO 2014095023 A1 WO2014095023 A1 WO 2014095023A1
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WO
WIPO (PCT)
Prior art keywords
led
illumination device
carrier material
chip
light
Prior art date
Application number
PCT/EP2013/003789
Other languages
French (fr)
Inventor
Daniel Muessli
Original Assignee
Daniel Muessli
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daniel Muessli filed Critical Daniel Muessli
Publication of WO2014095023A1 publication Critical patent/WO2014095023A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Definitions

  • the present invention relates generally to LED lighting.
  • the present invention relates to LED lighting devices or lamps which are applicable to, for example, substituting conventional lighting devices such as incandescent light bulbs or fluorescent light tubes.
  • LEDs Light Emitting Diodes
  • LEDs have a wide range of applications nowadays, for example, indoor or outdoor lighting, backlighting for displays and other sorts of illumination.
  • LEDs provide a more energy-efficient solution and offer a longer lifetime than conventional lighting, as well as less solid waste is generated when lamps need to be replaced less frequently.
  • LED lamps have been welcomed by consumers and had a huge market worldwide. Every business or household desires to cut their electricity bill by converting to LED lighting. The greater the demand becomes, the higher expectation the consumers will have and LED lighting devices with higher and higher efficiency or performance have always been anticipated, for example, with higher power factor, or with longer lifetime, or with more uniform light distribution, or with less materials or cost to build. Summary of the invention:
  • the present invention provides new lighting solutions with LEDs as an alternative to conventional LED lighting devices.
  • the invention shows an illumination device where the LED chip' s are direct mounted on a transparent or translucent material where the thermal conductivity is lower than 5 watts per meter-Kelvin such as the very low- cost material glass (silica (Si02) ) .
  • the thermal management can maintain the junction temperature of the LED chip in an acceptable temperature range, if the carrier material (device) surface ratio to the LED chip surface ratio is greater than 8:1 and the average thermal density on the top surface of the carrier material (device) is below 0.5 W per 100mm2.
  • the power of the chip must be greater than 50mW/mm2.
  • CRI Color rendering Index
  • the present solution in this invention has the advantage to get an efficiency improvement of 40 - 70% and dramatically lowers the cost, compared to most of today's exist LED light Bulb in the market.
  • the follow description shows the illumination units which comprises the device, which is also the carrier for the attached LED chip.
  • a light convert media can partly or complete comprises the LED chip on device unit. Also the device can be coated before the LED chip is attached to the device.
  • One aspect of the present invention is to provide an LED lighting device without metallic parts or extrusions for heat dissipation.
  • the resulting LED lighting devices will be less bulky and have a lower manufacturing cost.
  • the less metallic materials such as copper or aluminum are needed for manufacturing the LED lighting devices, the more the commodity or metal reserve on earth can be conserved.
  • the LED lighting devices are used as light bulbs.
  • the present invention provides LED lighting devices designed for retrofit replacement of conventional light bulbs so that those LED lighting devices can be fitted into sockets such as B15, B22, E14 , E27 or E40.
  • the LED light bulbs provided by the present invention may have cap bases of various sizes, for example, B15, B22, E14, E27 or E40.
  • the terms "LED lighting devices” and “light bulbs” and “lamps” are used interchangeably hereinafter, and they all refer to the solutions provided by the present invention unless otherwise specified, such as, being described as conventional .
  • Other aspects of the present invention are also disclosed as illustrated by the following embodiments. DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Figure 1 shows a schematic illustration of the chip on device LED unit.
  • a LED chip 3 is attached to the carrier, called in this invention device 1 where the top light extraction on the chip 3 is parallel to the device 1 top surface.
  • the material of device 1 is a transparent or translucent media with low watts per meter- Kelvin, between 0.5 to 5 W/m » K.
  • the electrical power from the chip to the connection Pad 9 and 10 on the top of the device 1 is connected with two bond wire 7.
  • the unit (device 1 with chip 3) is covert on the top surface of the device 1 and chip 3 with a light converting media 6. 19 show one of the four sides of the device 1.
  • the material of device 1 is preferred made of silica (Si02) or quartz or a silica or quartz compound such porcelain or glass - ceramic and can be transparent, opaque or translucent such as milk glass. Furthermore the device 1 can be partly or fully surface coated with a light convert media before the chip 3 is attached, that means also that under the chip surface of the device 1 can be coated with an light converting media. After the chip 3 is attached to the device 1, the device 1 including the LED chip 3 can be over coated again. Furthermore the backside 13 on the device 1 can also have attached LED chips with the electrical connection trough bond-wire and be covered with a lighting converting area similar as the top surface of the device 1.
  • FIG. 1 shows the schematically perspective illustration of the LED chip 3 on the device 1 unit.
  • the top surface 18 of the device 1 is preferred high glossy such as the surface of a typical glass substrate. The reflection on the top glossy surface 18 will improve the light emission efficiency of the LED chip 3 on device 1 for the light extraction of the side light emitting surfaces 52.
  • an inner surface zone 16 is hotter than the (outer) other cooler- zone 17, depending on the thermo insulation capability of the thermal conductive device 1.
  • This important circumstance helps to keep the device 1 with an over coated light- converting- media cooler at the cooler- zone 17, compared to a usual high- thermal- conductivity LED- chip carrier material where the thermal conductivity of today's solution of >10W/m « K.
  • the top surface temperature is higher, on the light- converting- media surface in average, compare to the present solution of the low- thermal - conductivity device 1 material.
  • a cooler light- converting- media with phosphor for instant will help to improve the light- converting- media efficiency.
  • the light rays between the inner surface of the translucent or transparent devicel bounce on all side such back- surface 13 and side-surface 19 and back to the top surfacel7 of the device 1.
  • the back surface 13 as well the side surface 19 can be covered with a mirror reflective material 14 to back bounce the light rays to the top surface to improve the light intensity on the top light emitting of the light converting material.
  • the device 1 can be also equipped with multiple arrangement of LED chip 3 and the logical electrical connection in between.
  • the kind of the electrical connection of the LED chip 3 is known for an expert in this field.
  • the LED chip 3 can be in the flip chip technology, where the connecting surface of the LED chip is face to the device 1 side.
  • the Technology is known for an expert, how to mount and contact the LEDs chips in the flip chip technology a different to the bond wire technology will not affect the main topic of this invention.
  • Figure 3 show schematically the thermal and light radiation round the device 1.
  • 15 show the back illumination of the device 1.
  • 22 symbolizes the light ray bouncing inside the device 1.
  • 5 show the light- converting- media 5 which overcoats the device 1 and the LED chip 3.
  • 20 show the light-emitting area of the relatively cooler temperature on top-surface zone over the device 1.
  • 21 show the light-emitting area of the relatively hotter temperature zone of the device 1.
  • the light-emitting area on zone 20 extracts from the light converting material 5, which can be a yellow with red blended phosphor, relatively a warmer spectrum light emission compared to the hotter temperature zone 21.
  • the efficiency of the LED chip 3 which is typically in the blue spectrum and with material Indium gallium nitride (InGaN) has a relatively low light depreciation at high temperature.
  • the light- converting- media 5 which is typically phosphor where the light depreciation at high temperature over 80 deg C is at least more than 7%. which explained the said advantage of the low thermal conductivity material of the device 1. According to the law of the temperature distribution gives a hotter zone 17 around the LED Chip 3 a relatively cooler zone 16 outside around the hot zone 17.
  • Figure 5 shows the perspective view of the single led device similar to Figure 4 where the SMD connector clip 11 and 12 is added in the sketch.
  • Figure 6 shows the single SMD device, according to Figure 4 and 5, where on the top of the LED unit an lighting Converting media 5 such phosphors is over covered.
  • Figure 7 shows the single SMD device according to Figure 4, where the lighting Converting media 5 over cover the whole embodiment shows in Figure 4.
  • Figure 8 shows a LED unit where multiple LED ' s are mounted on an LED chip mounting substrates 23 where the material is transparent or translucent.
  • Underlay of the bottom on the mounting substrates 23 can be a reflector tape 24 connected.
  • the light rays coming from LED chip 3 and passes the transparent or translucent material of the LED chip mounting substrate 23 will back bounce from the reflective mounting tape 24 to the top direction surface of the LED chip mounting substrate 23, where the LED chip's 3 are mounted.
  • any other reflective material can be underlay under the transparent or translucent LED chip mounting substrates 23 to back bounce the light rays emitting from LED chip 3.
  • Figure 9 shows multiple LED unit ' s according to Figure 8 , and they are mounted additional to a carrier 26.
  • the electrical connector terminals 9 and 10 bridge the LED chip's 3 with the bond wire's 8.
  • Figure 10 shows multiple LED units, described under Figure 8 and connected as said in Figure 9. Such an LED array can be preferred used in ceiling panels or inside of T8 tubes.
  • Figure 11 shows a flat panel with multiple LED's array 4 they are connected with a bond wire array 8 and LED chip array's 4 are connected on a device 1.
  • Figure 12 shows a flat panel unit shows in Figure 11.
  • the top surface is covered or over coated with a light- converting- media 5 such phosphor compound.
  • On the backside of the device 1 can be a back light converting media 55.
  • the back light converting media 55 can have a different color then the light converting media on the front.
  • the light- converting- media 5 on the front can emit a light color of 2700 Kelvin
  • the back light- converting- media 55 on the back can emit a light color of 4000 Kelvin to attract different ambient in illuminations .
  • Figure 13 shows a pendant lamp design, where the device 1, which is also the LED array 4 mounting platform, together with the cover platte (plate) 30 is the main part of the design.
  • the lighting converting media 5 is in between the Device 1 where the LED array 4 is fixed and the cover platte (plate) on the front.
  • Figure 14 shows the finish design of the exploded pendant lamp design shows in Figure 13
  • Figure 15 shows a formed device 2 which is at the same time the main design form giving part on the lamp design.
  • the function of the device 1 described also in Figure 1, 2, 3, and 4 has the same function as the said device 2 in this Figure 15.
  • the LED chip 3 is attached to the device 1.
  • 7 shows the connection wire to the connection pat (pad) 9 and 10 where the connection is also connected with the wire 28 and 58.
  • Figure 16 shows the ball pendant lamp design of Figure 15 with a lighting converting media 5 on the front.
  • the opposite part, means uncovered surface of the device 1 can be covered with a lighting converting media 5 which emits a different light color.
  • Figure 17 shows, how the device 1 can be used in an ordinary LED bulb.
  • the multiple LED chip's 4 are direct attached to the translucent or transparent device 1 which is preferred the said low conductive material silica.
  • a lighting converting media 5 is over coating the device 1 and LED chip array 4.
  • the through bond wire 1 s connected electrical terminal 9 and 10 with LED chip array 5 is further connected over the connection wire 36 and 37 to a LED driver 38 which is build in the bulb housing 33.
  • the . electrical connection 39 and 40 of the connection base 34 is further connected with the LED driver 38. It is known for a technical person in this lighting field how a LED driver is connected from a connector bulb base 34 to the multiple LED chip array 4.
  • the backside of the device 13 can be coated with a light converting media such phosphor to enhance the lighting quality which is coming from the emitting of the light converting media 5 and the LED chip array 4.
  • a light converting media such phosphor to enhance the lighting quality which is coming from the emitting of the light converting media 5 and the LED chip array 4.
  • Figure 19 shows the explosion drawing of a design with three chip- on- device- LED- units 45, the detailed description of a chip on device LED unit is in Figure 1, 2, 3, 11 and 12.
  • a transparent or translucent chip- on- device- LED- unit- cover 42 is direct attached to the chip- on- device- LED- units 45 which can be glued with silicon to avoid refraction, to air between the chip- on- device- LED- units 45 and an protection cover such as the cover 35 shown in Figure 17.
  • a direct attached cover to protect the chip- on- device- LED- units 45 avoids air refraction and will improve the light efficiency.
  • 43 shows the top surface of the chip- on- device- LED- unit- cover 42 of the chip- on- device- LED- units 45 where the light emission can exits.
  • a housing part 44 is preferred made with translucent or transparent material to improve the light efficiency of the whole bulb shown in Figure 20 number 48.
  • 34 is the connection base which can be connected with a build in driver inside the bulb housing and again connected as explained in Figure 17.
  • Figure 20 shows the assembled design 48 shown in the explosion Figure 19.
  • this assembled design is shown how the chip- on- device- LED- units 45 together with the housing part 44 can build a complete and very efficient LED- light bulb.
  • the chip- on- device- LED- units 45 without an air refraction between LED Chip's which outer surface on the top of the chip- on- device- LED- units 45 covers more than 20% of an outer surface of the design called also light bulb in this description is part of the Invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention provides new lighting solutions with LEDs as an alternative to conventional LED lighting devices. The invention shows an illumination device where the LED chip' s are direct mounted on a transparent or translucent material where the thermal conductivity is lower than (5) watts per meter-Kelvin such as the very low-cost material glass (silica (Si02) ).

Description

LED CHIPS ON DEVICES AND THE METHODS OF MANUFACTURING THEM
Field of the invention:
The present invention relates generally to LED lighting. In particular, the present invention relates to LED lighting devices or lamps which are applicable to, for example, substituting conventional lighting devices such as incandescent light bulbs or fluorescent light tubes.
Background: LEDs (Light Emitting Diodes) have a wide range of applications nowadays, for example, indoor or outdoor lighting, backlighting for displays and other sorts of illumination. For a sustainable development, LEDs provide a more energy-efficient solution and offer a longer lifetime than conventional lighting, as well as less solid waste is generated when lamps need to be replaced less frequently.
Therefore, LED lamps have been welcomed by consumers and had a huge market worldwide. Every business or household desires to cut their electricity bill by converting to LED lighting. The greater the demand becomes, the higher expectation the consumers will have and LED lighting devices with higher and higher efficiency or performance have always been anticipated, for example, with higher power factor, or with longer lifetime, or with more uniform light distribution, or with less materials or cost to build. Summary of the invention:
The present invention provides new lighting solutions with LEDs as an alternative to conventional LED lighting devices. The invention shows an illumination device where the LED chip' s are direct mounted on a transparent or translucent material where the thermal conductivity is lower than 5 watts per meter-Kelvin such as the very low- cost material glass (silica (Si02) ) .
The thermal management can maintain the junction temperature of the LED chip in an acceptable temperature range, if the carrier material (device) surface ratio to the LED chip surface ratio is greater than 8:1 and the average thermal density on the top surface of the carrier material (device) is below 0.5 W per 100mm2. To get under this arrangement an illumination device to replace the traditional light sources such incandescent bulb, halogen bulb and low and high pressure bulbs the power of the chip must be greater than 50mW/mm2.
For Example: 140 pieces LED chip's, each 40 mW and with a size of 18"x23" each, mounted on a translucent silica ceramic composition or porcelain device of 60x60 mm with a thermal conductivity between 1-2 watts per meter-Kelvin (W/m»K) giving a light output, by a CRI (Color rendering Index) of 80 and color temperature of 4000k, between 840 and 896 lm which is an efficacy of 150-160 lm/Watt.
The present solution in this invention has the advantage to get an efficiency improvement of 40 - 70% and dramatically lowers the cost, compared to most of today's exist LED light Bulb in the market. The follow description shows the illumination units which comprises the device, which is also the carrier for the attached LED chip. A light convert media can partly or complete comprises the LED chip on device unit. Also the device can be coated before the LED chip is attached to the device.
One aspect of the present invention is to provide an LED lighting device without metallic parts or extrusions for heat dissipation. The resulting LED lighting devices will be less bulky and have a lower manufacturing cost. The less metallic materials such as copper or aluminum are needed for manufacturing the LED lighting devices, the more the commodity or metal reserve on earth can be conserved. In one example for possible applications of the present invention, the LED lighting devices are used as light bulbs. In order to be compatible with existing fixtures, the present invention provides LED lighting devices designed for retrofit replacement of conventional light bulbs so that those LED lighting devices can be fitted into sockets such as B15, B22, E14 , E27 or E40. Therefore, the LED light bulbs provided by the present invention may have cap bases of various sizes, for example, B15, B22, E14, E27 or E40. The terms "LED lighting devices" and "light bulbs" and "lamps" are used interchangeably hereinafter, and they all refer to the solutions provided by the present invention unless otherwise specified, such as, being described as conventional . Other aspects of the present invention are also disclosed as illustrated by the following embodiments. DESCRIPTION OF THE PREFERRED EMBODIMENTS
Figure 1 shows a schematic illustration of the chip on device LED unit. As shown in FIG. 1, a LED chip 3 is attached to the carrier, called in this invention device 1 where the top light extraction on the chip 3 is parallel to the device 1 top surface. The material of device 1 is a transparent or translucent media with low watts per meter- Kelvin, between 0.5 to 5 W/m»K. The electrical power from the chip to the connection Pad 9 and 10 on the top of the device 1 is connected with two bond wire 7. The unit (device 1 with chip 3) is covert on the top surface of the device 1 and chip 3 with a light converting media 6. 19 show one of the four sides of the device 1. The material of device 1 is preferred made of silica (Si02) or quartz or a silica or quartz compound such porcelain or glass - ceramic and can be transparent, opaque or translucent such as milk glass. Furthermore the device 1 can be partly or fully surface coated with a light convert media before the chip 3 is attached, that means also that under the chip surface of the device 1 can be coated with an light converting media. After the chip 3 is attached to the device 1, the device 1 including the LED chip 3 can be over coated again. Furthermore the backside 13 on the device 1 can also have attached LED chips with the electrical connection trough bond-wire and be covered with a lighting converting area similar as the top surface of the device 1. To protect the front surface of the light- converting- media 5, a Chip-on-Device-LED-Unite-Cover 42 to protect them and can be added and preferred glued with silicone. A further advantage of the present solution of the Chip-on-Device-LED Unit is, that they can be function and a design part of any light- device housing- construction. Figure 2 shows the schematically perspective illustration of the LED chip 3 on the device 1 unit. The top surface 18 of the device 1 is preferred high glossy such as the surface of a typical glass substrate. The reflection on the top glossy surface 18 will improve the light emission efficiency of the LED chip 3 on device 1 for the light extraction of the side light emitting surfaces 52. Because the low thermal conductivity of 0.5-5 W/m»K an inner surface zone 16 is hotter than the (outer) other cooler- zone 17, depending on the thermo insulation capability of the thermal conductive device 1. This important circumstance helps to keep the device 1 with an over coated light- converting- media cooler at the cooler- zone 17, compared to a usual high- thermal- conductivity LED- chip carrier material where the thermal conductivity of today's solution of >10W/m«K. Because the high thermal- conductivity of today's solution for the chip mounting platform device 1, the top surface temperature is higher, on the light- converting- media surface in average, compare to the present solution of the low- thermal - conductivity device 1 material. A cooler light- converting- media with phosphor for instant, will help to improve the light- converting- media efficiency. The light rays between the inner surface of the translucent or transparent devicel bounce on all side such back- surface 13 and side-surface 19 and back to the top surfacel7 of the device 1. The back surface 13 as well the side surface 19 can be covered with a mirror reflective material 14 to back bounce the light rays to the top surface to improve the light intensity on the top light emitting of the light converting material. The device 1 can be also equipped with multiple arrangement of LED chip 3 and the logical electrical connection in between. The kind of the electrical connection of the LED chip 3 is known for an expert in this field. Furthermore the LED chip 3 can be in the flip chip technology, where the connecting surface of the LED chip is face to the device 1 side. The Technology is known for an expert, how to mount and contact the LEDs chips in the flip chip technology a different to the bond wire technology will not affect the main topic of this invention.
Figure 3 show schematically the thermal and light radiation round the device 1. 15 show the back illumination of the device 1. 22 symbolizes the light ray bouncing inside the device 1. 5 show the light- converting- media 5 which overcoats the device 1 and the LED chip 3. 20 show the light-emitting area of the relatively cooler temperature on top-surface zone over the device 1. 21 show the light-emitting area of the relatively hotter temperature zone of the device 1. The light-emitting area on zone 20 extracts from the light converting material 5, which can be a yellow with red blended phosphor, relatively a warmer spectrum light emission compared to the hotter temperature zone 21. It is known that the efficiency of the LED chip 3 which is typically in the blue spectrum and with material Indium gallium nitride (InGaN) has a relatively low light depreciation at high temperature. Opposite, the light- converting- media 5 which is typically phosphor where the light depreciation at high temperature over 80 deg C is at least more than 7%. which explained the said advantage of the low thermal conductivity material of the device 1. According to the law of the temperature distribution gives a hotter zone 17 around the LED Chip 3 a relatively cooler zone 16 outside around the hot zone 17. The advantage of a cooler light- converting- media 5 which can be phosphor, will have an higher efficiency because the low thermal conductive material such glass (silica) compare to a high device 1 material such aluminum or alumina with an thermal conductive > then 10 W /mK. The transparency and or translucency of the material of device 1 help to travel the light rays from the light-emitting side 52 of the LED chip (3 Fig2) to the side-surface (19Fig2) as well to the back-surface (13 Fig2) . The back surface can be covered with a converting material phosphor. Figure 4 shows a single LED device where the LED chip 3 is mounted direct to the device 1. The bond wire 7 connects the LED chip 3 to the connection pad 9 and 10.
Figure 5 shows the perspective view of the single led device similar to Figure 4 where the SMD connector clip 11 and 12 is added in the sketch.
Figure 6 shows the single SMD device, according to Figure 4 and 5, where on the top of the LED unit an lighting Converting media 5 such phosphors is over covered.
Figure 7 shows the single SMD device according to Figure 4, where the lighting Converting media 5 over cover the whole embodiment shows in Figure 4.
Figure 8 shows a LED unit where multiple LED ' s are mounted on an LED chip mounting substrates 23 where the material is transparent or translucent. Underlay of the bottom on the mounting substrates 23 can be a reflector tape 24 connected. The light rays coming from LED chip 3 and passes the transparent or translucent material of the LED chip mounting substrate 23 will back bounce from the reflective mounting tape 24 to the top direction surface of the LED chip mounting substrate 23, where the LED chip's 3 are mounted. Instead of the Reflective mounting tape any other reflective material can be underlay under the transparent or translucent LED chip mounting substrates 23 to back bounce the light rays emitting from LED chip 3.
Figure 9 shows multiple LED unit ' s according to Figure 8 , and they are mounted additional to a carrier 26. The electrical connector terminals 9 and 10 bridge the LED chip's 3 with the bond wire's 8.
Figure 10 shows multiple LED units, described under Figure 8 and connected as said in Figure 9. Such an LED array can be preferred used in ceiling panels or inside of T8 tubes.
Figure 11 shows a flat panel with multiple LED's array 4 they are connected with a bond wire array 8 and LED chip array's 4 are connected on a device 1.
Figure 12 shows a flat panel unit shows in Figure 11. The top surface is covered or over coated with a light- converting- media 5 such phosphor compound. On the backside of the device 1 can be a back light converting media 55. The back light converting media 55 can have a different color then the light converting media on the front. For instant the light- converting- media 5 on the front can emit a light color of 2700 Kelvin, and the back light- converting- media 55 on the back can emit a light color of 4000 Kelvin to attract different ambient in illuminations . Figure 13 shows a pendant lamp design, where the device 1, which is also the LED array 4 mounting platform, together with the cover platte (plate) 30 is the main part of the design. The lighting converting media 5 is in between the Device 1 where the LED array 4 is fixed and the cover platte (plate) on the front.
Figure 14 shows the finish design of the exploded pendant lamp design shows in Figure 13
Figure 15 shows a formed device 2 which is at the same time the main design form giving part on the lamp design. The function of the device 1 described also in Figure 1, 2, 3, and 4 has the same function as the said device 2 in this Figure 15. The LED chip 3 is attached to the device 1. 7 shows the connection wire to the connection pat (pad) 9 and 10 where the connection is also connected with the wire 28 and 58. Figure 16 shows the ball pendant lamp design of Figure 15 with a lighting converting media 5 on the front. The opposite part, means uncovered surface of the device 1 can be covered with a lighting converting media 5 which emits a different light color.
Figure 17 shows, how the device 1 can be used in an ordinary LED bulb. The multiple LED chip's 4 are direct attached to the translucent or transparent device 1 which is preferred the said low conductive material silica. A lighting converting media 5 is over coating the device 1 and LED chip array 4. The through bond wire 1 s connected electrical terminal 9 and 10 with LED chip array 5 is further connected over the connection wire 36 and 37 to a LED driver 38 which is build in the bulb housing 33. The. electrical connection 39 and 40 of the connection base 34 is further connected with the LED driver 38. It is known for a technical person in this lighting field how a LED driver is connected from a connector bulb base 34 to the multiple LED chip array 4. The backside of the device 13 can be coated with a light converting media such phosphor to enhance the lighting quality which is coming from the emitting of the light converting media 5 and the LED chip array 4. Because the light spectrum from the LED array 4 which is direct mounted to the device 1 emits typically blue light and the light converting media 5 emits yellow light. That cause that the light spectrum which is emitting to the back surface 13 of the translucent or transparent device 1 is cooler, means has more light in the blue spectrum than the light which is emitting to the front side, coming from the light converting media 5 and them LED chip array 4 together, because the light emission of the LED chip side emitting surface 52 mention and shown in Figure 3 is less over covered on the surface of the backside-of-device 13 then on the front of the device 1. This circumstance can make it essential to overcoat the back surface 13 with a light converting media such phosphor. It is known for an expert how to composite phosphor to influence the light color temperature. The advantage of a double side over coated device 1 with different phosphor composition on each side is a uniform color temperature around the LED unite embodiment, which an expert in the LED phosphor field easy can adjust. 35 shows a transparent or translucent cover to protect the chip on device LED unit . Figure 18 shows the assembled design 41 shown in the explosion Figure 17.
Figure 19 shows the explosion drawing of a design with three chip- on- device- LED- units 45, the detailed description of a chip on device LED unit is in Figure 1, 2, 3, 11 and 12. A transparent or translucent chip- on- device- LED- unit- cover 42 is direct attached to the chip- on- device- LED- units 45 which can be glued with silicon to avoid refraction, to air between the chip- on- device- LED- units 45 and an protection cover such as the cover 35 shown in Figure 17. A direct attached cover to protect the chip- on- device- LED- units 45 avoids air refraction and will improve the light efficiency. 43 shows the top surface of the chip- on- device- LED- unit- cover 42 of the chip- on- device- LED- units 45 where the light emission can exits. Because the light emission of the chip- on- device- LED- units 45 can be on both side, a housing part 44 is preferred made with translucent or transparent material to improve the light efficiency of the whole bulb shown in Figure 20 number 48. 34 is the connection base which can be connected with a build in driver inside the bulb housing and again connected as explained in Figure 17.
Figure 20 shows the assembled design 48 shown in the explosion Figure 19. In this assembled design is shown how the chip- on- device- LED- units 45 together with the housing part 44 can build a complete and very efficient LED- light bulb. The chip- on- device- LED- units 45 without an air refraction between LED Chip's which outer surface on the top of the chip- on- device- LED- units 45 covers more than 20% of an outer surface of the design called also light bulb in this description is part of the Invention.

Claims

Claims
Illumination device comprising a number of LED chips (3) which are direct mounted on a transparent or translucent carrier material (1) , whereby the thermal conductivity of the carrier material (1) is lower than 5 W/m*K.
Illumination device according to claim 1, characterized in that the thermal conductivity of the carrier material (1) is between 0.5 to 5 W/m*K.
Illumination device according to claim 1 or 2, characterized in that the transparent or translucent carrier material (1) is a very low-cost material made of glass, preferably silica glass (Si02) .
Illumination device according to claim 1 or 2, characterized in that in case the carrier material (1) is translucent a silica ceramic composition or a porcelain device can be used with a thermal conductivity between 1 to 2 W/m*K.
Illumination device according to any of the preceding claims 1 to 4 , characterized in that for thermal management the ratio between the carrier material surface and the LED chip (3) surface is greater than 8:1.
Illumination device according to any of the preceding claims 1 to 5, characterized in that for thermal management an average thermal density on the top surface (18) of the carrier material is below 0.5 W/100mm2. Illumination device according to any of the preceding claims 1 to 6, characterized in that the power of the LED chip (3) is greater than 50mW/mm2.
Illumination device according to any of the preceding claims 1 to 7 , characterized in that a LED lighting device is provided without metallic parts or extrusions for heat dissipation.
Illumination device according to any of the preceding claims 1 to 8 , characterized in that an electrical connection between the chip (3) and connection pads (9, 10) on the top surface (18) of the carrier material (1) is made by bond wire technology or a connecting surface of the LED chip (3) is faced to the carrier material (1) side to mount and contact the LED Chip (3) in flip chip technology.
Illumination device according to any of the preceding claims 1 to 9, characterized in that an inner surface zone (16) is hotter than an outer cooler zone (17) depending on the thermo insulation capability of the thermal conductive carrier material (1) .
Illumination device according to any of the preceding claims 1 to 10, characterized in that a LED-chip-on- device-unit is partly or fully surface coated with a light convert media (5) , preferably phosphor.
Illumination device according to claim 11, characterized in that the carrier material (1) is coated with the light convert media (5) before the LED chip (3) is attached to the carrier material (1) and then the carrier material (1) including the LED chip (3) is over coated. Illumination device according to claim 11 or 12, characterized in that a LED chip-on-device-led-unit- cover (42) protects the front surface of the light convert media (5) .
Illumination device according to any of the preceding claims 1 to 13, characterized in that on a backside (13) of the carrier material (1) is attached a number of LED chips (3) .
Illumination device according to any of the preceding claims 1 to 14, characterized in that a back surface (13) as well as side surfaces (19) of the device (1) is covered with a mirror reflective material (14) .
PCT/EP2013/003789 2012-12-17 2013-12-16 Led chips on devices and the methods of manufacturing them WO2014095023A1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012053134A1 (en) * 2010-10-22 2012-04-26 パナソニック株式会社 Mounting board, light emitting device and lamp

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012053134A1 (en) * 2010-10-22 2012-04-26 パナソニック株式会社 Mounting board, light emitting device and lamp

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