WO2014089789A1 - Touch screen and manufacturing method thereof - Google Patents

Touch screen and manufacturing method thereof Download PDF

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Publication number
WO2014089789A1
WO2014089789A1 PCT/CN2012/086472 CN2012086472W WO2014089789A1 WO 2014089789 A1 WO2014089789 A1 WO 2014089789A1 CN 2012086472 W CN2012086472 W CN 2012086472W WO 2014089789 A1 WO2014089789 A1 WO 2014089789A1
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WO
WIPO (PCT)
Prior art keywords
buffer layer
substrate
mask layer
layer
touch screen
Prior art date
Application number
PCT/CN2012/086472
Other languages
French (fr)
Chinese (zh)
Inventor
兪正光
禹庆槿
蔡文勇
Original Assignee
富元精密镀膜股份有限公司
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Application filed by 富元精密镀膜股份有限公司 filed Critical 富元精密镀膜股份有限公司
Priority to PCT/CN2012/086472 priority Critical patent/WO2014089789A1/en
Publication of WO2014089789A1 publication Critical patent/WO2014089789A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Definitions

  • the present invention relates to a touch screen and a method of fabricating the same, and more particularly to a touch screen capable of passing a ball dropping test and a method of manufacturing the same.
  • touch screens are also developing toward light, thin or flexible features.
  • the touch screen itself must be tested for various mechanical properties, such as ball drop test, hardness test, temperature test, hot and cold cycle test, humidity test, and high temperature or low temperature storage test.
  • the falling ball test of the touch screen is to drop the steel ball from the standard height from the stationary state to the center of the touch screen to verify the impact resistance of the touch surface of the touch screen. For example, taking a 130-gram steel ball from a height of 50 cm, for example, since the steel ball hits the touch screen for a very short time, and the contact area of the steel ball and the touch screen is very small, the ball drop test The middle touch screen will be greatly impacted.
  • the metal layer is first sputtered on the transparent substrate, and then a plurality of sensing electrodes or conductive lines are formed by etching or the like.
  • the target material is ion bombarded by high pressure, and the target atoms are emitted into the substrate in the form of gas. This technique of emitting target atoms to the substrate tends to produce minute nicks on the surface of the substrate, which results in the substrate failing to withstand the impact of the steel balls in subsequent ball drop tests.
  • the technical problem to be solved by the present invention is to provide a touch screen and a manufacturing method thereof by making up for the deficiencies of the above prior art.
  • a method of manufacturing a touch screen comprising:
  • the buffer layer covers a portion of the mask layer to form an exposed area of the mask layer, and the step of forming a plurality of sensing components in the buffer layer further includes forming a plurality of peripheral lines In the exposed area of the mask layer.
  • the buffer layer completely covers the mask layer, and the forming a plurality of sensing components is The step of stamping the layer further includes forming a plurality of peripheral lines in the buffer layer.
  • the buffer layer is formed on the substrate and optionally at least a portion of the mask layer by a lithography process, a spray coating process, or an evaporation process.
  • the buffer layer is made of transparent acryl, transparent polyimide, silicon oxide or nitride.
  • a method of manufacturing a touch screen comprising:
  • a plurality of sensing components are formed in the buffer layer and the mask layer.
  • the step of forming the plurality of sensing components in the buffer layer and the mask layer further comprises forming a plurality of peripheral lines on the mask layer.
  • the buffer layer is further formed on the substrate by a lithography process, a spray method or an evaporation process.
  • the buffer layer is made of transparent acryl, transparent polyimide, silicon oxide or nitride.
  • a touch screen comprising:
  • a substrate having an opposite first surface and a second surface, the first surface being a touch surface; a mask layer disposed on a surrounding area of the second surface;
  • the buffer layer disposed between the plurality of sensing components and the second surface of the substrate; wherein the buffer layer covers the substrate or selectively covers the mask layer At least part.
  • the buffer layer covers a portion of the mask layer to form an exposed area of the mask layer, and the plurality of sensing components further includes a plurality of peripheral lines disposed in the exposed area.
  • the buffer layer completely covers the mask layer, and the plurality of sensing components further comprise a plurality of peripheral lines formed on the buffer layer.
  • the buffer layer is disposed between the mask layer and the substrate, and the plurality of sensing components further includes a plurality of peripheral lines formed on the mask layer.
  • the buffer layer is made of transparent acryl, transparent polyimide, silicon oxide or nitride.
  • the beneficial effects of the present invention compared with the prior art are: in the manufacturing process, the touch screen is covered with a buffer layer or selectively covered on a part of the mask layer, and then sputtered for other purposes.
  • the layered structure of the sensing component is formed on the buffer layer to prevent the substrate from being damaged during the sputtering process.
  • FIG. 1 to 10 are manufacturing flowcharts of a first embodiment of a touch screen of the present invention
  • Figure 11 is a schematic view of a first embodiment of the touch screen of the present invention
  • Figure 12 is a cross-sectional view showing a second embodiment of the touch screen of the present invention.
  • Figure 13 is a cross-sectional view showing a third embodiment of the touch panel of the present invention.
  • FIG. 1 to FIG. 10 are a manufacturing flowchart of a first embodiment of a touch screen of the present invention along a section line FF′ of FIG. 11
  • FIG. 11 is a first embodiment of the present invention.
  • Schematic of the touch screen As shown in Fig. 1, first, a substrate 10 is required.
  • the substrate 10 has opposing first and second surfaces 12 and 14, and the first surface 12 of the substrate 10 serves as a touch surface of the touch screen.
  • the substrate 10 is preferably a transparent insulating plate, and the material may be glass, polycarbonate, PC, polythylene terephthalate (PET), polymethylmethacrylate (PMMA), cycloolefin. Cyclic Olefin Copolymer (C0C) or Polyether Sulfone (PES), etc., but the invention is not limited thereto.
  • a mask layer 20 is formed on the second surface 14 of the substrate 10 in the peripheral region of the substrate 10.
  • the mask layer 20 may be a black matrix pattern of a metallic chromium (Cr), a chromium oxide plating layer or a resin type black coating layer having a light blocking effect.
  • the buffer layer 30 is covered on the second surface 14 of the substrate 10.
  • the buffer layer 30 covers a portion of the mask layer 20, thereby being in the mask layer.
  • the surface of 20 forms the exposed area 22, but is not limited thereto.
  • the buffer layer 30 may completely cover the mask layer 20 without a corresponding exposed area.
  • the material of the buffer layer 30 may include transparent acrylic, transparent polyimide, silicon oxide or nitride, etc., and the buffer layer 30 is formed on the substrate by a lithography process, a spray process or an evaporation process.
  • the second surface 14 of the 10 is formed on the partial mask layer 20, but is not limited thereto. In other embodiments of the invention, the buffer layer 20 may completely cover the mask layer 20 and the second surface 14 of the substrate 10.
  • the buffer layer 30 of the present embodiment is formed on the second surface 14 of the substrate 10 in a relatively gentle manner, such as a spraying method or an evaporation method, etc., instead of being formed by sputtering. Two surfaces 14. Therefore, the buffer layer 30 is formed without causing physical damage to the second surface 14 of the substrate 10, and at the same time protecting the substrate 10 from physical damage during subsequent sputtering of other metal layers.
  • the touch screen of the present embodiment can be passed through a mechanical test such as a ball drop test.
  • the sidewall 21 of the mask layer 20 and the substrate 10 are in a right angle state, if the sensing component is directly sputtered on the substrate 10, the sidewall 21 of the mask layer 20 and the liner are caused. Sputtering of the joints of the bottom 10 is uneven, resulting in a shadow effect. Therefore, by covering the buffer layer 30 at the same time on the second table of the substrate 10 The surface 14 and the portion of the mask layer 20 can effectively eliminate the shadow effect on the touch screen caused by uneven sputtering during the formation of the sensing component.
  • a plurality of sensing components are initially formed on the buffer layer 30, and the plurality of sensing components are first formed by sputtering to form a metal layer in the buffer.
  • the first metal layer 40 is first sputtered on the buffer layer 30.
  • the buffer layer 30 and the mask layer 20 have formed a relatively flat surface, so the first metal layer 40 can be sputtered on the buffer layer 30 more evenly.
  • the material of the first metal layer 40 may be, but not limited to, a composite material such as silver, chromium, aluminum, molybdenum or molybdenum/aluminum/molybdenum laminate.
  • the first metal layer 40 is etched to form a plurality of first metal bridge structures 41.
  • the first metal bridge structures 41 are electrically connected to the sensing pads in the same direction.
  • a transparent insulating layer 50 is formed to cover each of the first metal bridge structures 41, and only the opposite ends of each of the first metal bridge structures 41 are exposed.
  • the transparent insulating layer 50 can be a photosensitive transparent insulating layer such as, but not limited to, ink or a high transmittance polyester material formed by exposure and development.
  • a second metal layer 60 is formed on the buffer layer 30, the mask layer 20, the first metal bridge structure 41, and the transparent insulating layer 50.
  • the second metal layer 60 may be a transparent photosensitive material such as indium tin oxide (ITO), indium zinc oxide (yttrium), antimony tin oxide (yttrium), aluminum zinc oxide (yttrium) or an organic transparent conductive material.
  • the second metal layer 60 is etched to form a plurality of first sensing pads 61, a plurality of second sensing pads 62, and a plurality of second metal bridge structures 63.
  • the first metal bridge structure 41 connects the first sensing pads 61 in the first direction
  • the second metal bridge structure 63 connects the second sensing pads 62 in the second direction
  • the first direction is not equal to The second direction.
  • forming a plurality of first sensing pads 61, a plurality of second sensing pads 62, and a plurality of second metal bridge structures 63 can be completed by the same yellow light process.
  • a plurality of peripheral lines 70 are formed to electrically connect the first sensing pad 61 and the second sensing pad 62, and the first sensing pad 61 and the first The signals from the two sensing pads 62 are transmitted to an external processing module (not shown) to calculate the sensing position or sensing area.
  • peripheral line 70 of the present embodiment is substantially connected to the exposed region 22 of the mask layer 20, and therefore has preferable connectivity, but is not limited thereto. In other embodiments of the invention, the perimeter line 70 may be formed substantially on the buffer layer 30.
  • the protective layer 80 is formed to cover the first sensing pad 61, the second sensing pad 62, the first metal bridge structure 41, the second metal bridge structure 63, and the peripheral line 70.
  • the sensing components are protected from scratches and damage.
  • the transparent protective layer 80 is an insulating material.
  • FIG. 12 is a cross-sectional view of a second embodiment of the touch screen of the present invention.
  • the first The touch screen of the second embodiment is most different from the first embodiment in that the buffer layer 30 of the touch screen of the second embodiment completely covers the second surface 14 of the substrate 10 and the mask layer 20.
  • the present embodiment can simplify the process of forming the buffer layer 30 with respect to the first embodiment.
  • FIG. 13 is a cross-sectional view of a third embodiment of the touch screen of the present invention.
  • the touch screen of the third embodiment is most different from the second embodiment in that the buffer layer 30 of the third embodiment completely covers the second surface 14 of the substrate 10 and is interposed between the second surface 14. And between the mask layers 20.
  • the present embodiment can simplify the process of forming the buffer layer 30 as compared with the first embodiment, and since the peripheral line 70 is directly connected to the mask layer 20, the present embodiment is relative to the periphery of the second embodiment. Line 70 has a preferred connectivity.
  • the buffer layers of the first embodiment, the second embodiment and the third embodiment described above are all formed on the second surface of the substrate, and thus can be formed during the subsequent sputtering process of forming the sensing component. , protect the substrate from damage caused by the sputtering process.
  • the substrate In the subsequent ball drop test, the substrate can be subjected to at least an impact force such as a 130 gram steel ball falling from a height of 50 cm.
  • the weight and height of the steel ball in the ball drop test are merely examples, and the present invention is not limited thereto.
  • the touch panel of the present invention is formed between the sensing component and the substrate by the buffer layer, the substrate can be protected from damage during the sputtering process, so that the impact resistance of the substrate can be improved.
  • the buffer layer and the mask layer can be flattened together, which can effectively reduce the shadow defects generated by the touch screen in the future.

Abstract

A touch screen and a manufacturing method thereof. The touch screen comprises a substrate (10), a mask layer (20), multiple sensing components (61, 62, 41, 63, 70) and a buffer layer (30). In a manufacturing process of the touch screen, first cover the substrate (10) or a part of the mask layer (20) selectively with the buffer layer (30), and sputter another layered structure used for forming the sensing components on the buffer layer (30), so that the substrate (10) will not be damaged in a sputtering procedure.

Description

触控屏及其制造方法 技术领域  Touch screen and manufacturing method thereof
本发明是有关于一种触控屏及其制造方法， 特别是关于一种能通过落球测试 (ball dropping test)的触控屏及其制造方法。  The present invention relates to a touch screen and a method of fabricating the same, and more particularly to a touch screen capable of passing a ball dropping test and a method of manufacturing the same.
背景技术 Background technique
随着科技发达， 触控屏也朝着轻、 薄或可挠性等特色发展。 然而， 除了达到上述 外形上的特色外， 触控屏本身仍须兼顾各种机械性能的测试， 如落球测试、 硬度测试、 温度测试、 冷热循环测试、 湿度测试以及高温或低温的储存测试等。  With the development of technology, touch screens are also developing toward light, thin or flexible features. However, in addition to the above-mentioned features, the touch screen itself must be tested for various mechanical properties, such as ball drop test, hardness test, temperature test, hot and cold cycle test, humidity test, and high temperature or low temperature storage test. .
其中， 触控屏的落球测试是将钢球从规范的高度由静止的状态下向触控屏中心落 下， 以检验触控屏的触控面的耐撞击力。 举例而言， 以 130公克的钢球从 50公分的高 度落下为例， 由于钢球在撞击触控屏的时间非常短暂， 且钢球与触控屏接触点的面积 非常小， 所以在落球测试中触控屏将受到很大的冲击力道。  Wherein, the falling ball test of the touch screen is to drop the steel ball from the standard height from the stationary state to the center of the touch screen to verify the impact resistance of the touch surface of the touch screen. For example, taking a 130-gram steel ball from a height of 50 cm, for example, since the steel ball hits the touch screen for a very short time, and the contact area of the steel ball and the touch screen is very small, the ball drop test The middle touch screen will be greatly impacted.
而目前在触控屏的制造过程中， 是先溅镀金属层在透明衬底上， 再通过蚀刻等方 法形成多个传感电极或传导线路等。 其中在溅镀的过程中， 是透过高压对靶材料进行 离子轰击 (ion bombardment),使靶原子以气体形式向衬底发射出来。此种将靶原子向衬 底发射的技术容易对衬底表面产生微小的刻痕， 而导致后续的落球测试中衬底无法承 受钢球的撞击力道。  At present, in the manufacturing process of the touch panel, the metal layer is first sputtered on the transparent substrate, and then a plurality of sensing electrodes or conductive lines are formed by etching or the like. In the process of sputtering, the target material is ion bombarded by high pressure, and the target atoms are emitted into the substrate in the form of gas. This technique of emitting target atoms to the substrate tends to produce minute nicks on the surface of the substrate, which results in the substrate failing to withstand the impact of the steel balls in subsequent ball drop tests.
发明内容 Summary of the invention
本发明所要解决的技术问题是： 弥补上述现有技术的不足， 提供一种触控屏及其 制造方法。  The technical problem to be solved by the present invention is to provide a touch screen and a manufacturing method thereof by making up for the deficiencies of the above prior art.
本发明的技术问题通过以下的技术方案予以解决：  The technical problem of the present invention is solved by the following technical solutions:
一种触控屏的制造方法， 包含：  A method of manufacturing a touch screen, comprising:
提供一衬底；  Providing a substrate;
形成一掩膜层在所述衬底的周围表面；  Forming a mask layer on a peripheral surface of the substrate;
覆盖一缓冲层在所述衬底以及选择性地在所述掩膜层的至少一部分； 以及 形成多个传感组件在所述缓冲层。  Covering a buffer layer on the substrate and optionally at least a portion of the mask layer; and forming a plurality of sensing components in the buffer layer.
优选地， 所述缓冲层是覆盖部分所述掩膜层， 以形成所述掩膜层的曝露区域， 而 所述形成多个传感组件在所述缓冲层的步骤还包含形成多个周边线路在所述掩膜层的 所述曝露区域。  Preferably, the buffer layer covers a portion of the mask layer to form an exposed area of the mask layer, and the step of forming a plurality of sensing components in the buffer layer further includes forming a plurality of peripheral lines In the exposed area of the mask layer.
优选地， 所述缓冲层是完全覆盖所述掩膜层， 而所述形成多个传感组件在所述缓 冲层的步骤还包含形成多个周边线路在所述缓冲层。 Preferably, the buffer layer completely covers the mask layer, and the forming a plurality of sensing components is The step of stamping the layer further includes forming a plurality of peripheral lines in the buffer layer.
优选地， 还包含利用微影工艺、 喷涂法或蒸镀工艺将所述缓冲层形成在所述衬底 以及选择性地在所述掩膜层的至少一部分。  Preferably, the buffer layer is formed on the substrate and optionally at least a portion of the mask layer by a lithography process, a spray coating process, or an evaporation process.
优选地， 其中所述缓冲层是以透明压克力、 透明聚酰亚胺、 硅氧化物或氮化物制 成。  Preferably, wherein the buffer layer is made of transparent acryl, transparent polyimide, silicon oxide or nitride.
一种触控屏的制造方法， 包含：  A method of manufacturing a touch screen, comprising:
提供一衬底；  Providing a substrate;
覆盖一缓冲层在所述衬底；  Covering a buffer layer on the substrate;
形成一掩膜层在所述缓冲层相对所述衬底的周围表面的位置； 以及  Forming a mask layer at a position of the buffer layer relative to a peripheral surface of the substrate;
形成多个传感组件在所述缓冲层与所述掩膜层。  A plurality of sensing components are formed in the buffer layer and the mask layer.
优选地， 所述形成多个传感组件在所述缓冲层与所述掩膜层的步骤还包含形成多 个周边线路在所述掩膜层上。  Preferably, the step of forming the plurality of sensing components in the buffer layer and the mask layer further comprises forming a plurality of peripheral lines on the mask layer.
优选地， 还包含利用微影工艺、 喷涂法或蒸镀工艺将所述缓冲层形成在所述衬底。 优选地， 所述缓冲层是以透明压克力、 透明聚酰亚胺、 硅氧化物或氮化物制成。 一种触控屏， 包含：  Preferably, the buffer layer is further formed on the substrate by a lithography process, a spray method or an evaporation process. Preferably, the buffer layer is made of transparent acryl, transparent polyimide, silicon oxide or nitride. A touch screen comprising:
一衬底， 具有相对的一第一表面以及一第二表面， 所述第一表面是作为一触控面; 一掩膜层， 设置在所述第二表面的周围区域；  a substrate having an opposite first surface and a second surface, the first surface being a touch surface; a mask layer disposed on a surrounding area of the second surface;
多个传感组件， 设置在所述衬底的所述第二表面； 以及  a plurality of sensing components disposed on the second surface of the substrate;
一缓冲层， 设置在所述多个传感组件以及所述衬底的所述第二表面之间； 其中， 所述缓冲层是覆盖所述衬底或选择性地覆盖所述掩膜层的至少一部分。 优选地， 所述缓冲层覆盖部分所述掩膜层， 以形成所述掩膜层的曝露区域， 并且 所述多个传感组件还包含多个周边线路设置在所述曝露区域。  a buffer layer disposed between the plurality of sensing components and the second surface of the substrate; wherein the buffer layer covers the substrate or selectively covers the mask layer At least part. Preferably, the buffer layer covers a portion of the mask layer to form an exposed area of the mask layer, and the plurality of sensing components further includes a plurality of peripheral lines disposed in the exposed area.
优选地， 所述缓冲层完全覆盖所述掩膜层， 并且所述多个传感组件还包含多个周 边线路形成在所述缓冲层。  Preferably, the buffer layer completely covers the mask layer, and the plurality of sensing components further comprise a plurality of peripheral lines formed on the buffer layer.
优选地， 所述缓冲层设置在所述掩膜层以及所述衬底之间， 且所述多个传感组件 还包含多个周边线路形成在所述掩膜层。  Preferably, the buffer layer is disposed between the mask layer and the substrate, and the plurality of sensing components further includes a plurality of peripheral lines formed on the mask layer.
优选地， 所述缓冲层是以透明压克力、 透明聚酰亚胺、 硅氧化物或氮化物制成。 本发明与现有技术对比的有益效果是： 本发明的触控屏在制造的过程中， 是先将 缓冲层覆盖在衬底或选择性地覆盖在部分掩膜层上， 再溅镀其它用以形成传感组件的 层状结构在缓冲层上， 以免衬底在溅镀程序时受到损害。  Preferably, the buffer layer is made of transparent acryl, transparent polyimide, silicon oxide or nitride. The beneficial effects of the present invention compared with the prior art are: in the manufacturing process, the touch screen is covered with a buffer layer or selectively covered on a part of the mask layer, and then sputtered for other purposes. The layered structure of the sensing component is formed on the buffer layer to prevent the substrate from being damaged during the sputtering process.
附图说明 DRAWINGS
图 1至图 10是本发明的触控屏的第一实施例的制造流程图； 图 11是本发明的触控屏的第一实施例的示意图； 1 to 10 are manufacturing flowcharts of a first embodiment of a touch screen of the present invention; Figure 11 is a schematic view of a first embodiment of the touch screen of the present invention;
图 12是本发明的触控屏的第二实施例的剖面示意图；  Figure 12 is a cross-sectional view showing a second embodiment of the touch screen of the present invention;
图 13是本发明的触控屏的第三实施例的剖面示意图。  Figure 13 is a cross-sectional view showing a third embodiment of the touch panel of the present invention.
具体实施方式 detailed description
以下将参照相关附图式， 说明依本发明的触控屏及其制造方法的实施例， 为使便 于理解， 下述实施例中的相同组件是以相同的符号标示来说明。  Embodiments of the touch panel and the method of manufacturing the same according to the present invention will be described below with reference to the accompanying drawings. For the sake of understanding, the same components in the following embodiments are denoted by the same reference numerals.
请参照图 1至图 11， 其中图 1至图 10为本发明的触控屏的第一实施例沿着图 11 的剖面线 F-F' 的制造流程图， 图 11为本发明的第一实施例的触控屏的示意图。 如图 1所示， 首先， 需提供一衬底 10。 衬底 10具有相对的第一表面 12以及第二表面 14， 衬底 10的第一表面 12可作为触控屏的触控面。其中，衬底 10较佳为一透明绝缘板材， 材料可以是玻璃、 聚碳酸酯 (Polycarbonate, PC)、 聚酯 (Polythylene terephthalate, PET)、 聚甲基丙烯酸甲酯 (Polymethylmethacrylate, PMMA)、 环烯烃共聚合物 (Cyclic Olefin Copolymer, C0C)或聚醚砜 (Polyether Sulfone, PES)等， 但本发明不限于此。  Referring to FIG. 1 to FIG. 11 , FIG. 1 to FIG. 10 are a manufacturing flowchart of a first embodiment of a touch screen of the present invention along a section line FF′ of FIG. 11 , and FIG. 11 is a first embodiment of the present invention. Schematic of the touch screen. As shown in Fig. 1, first, a substrate 10 is required. The substrate 10 has opposing first and second surfaces 12 and 14, and the first surface 12 of the substrate 10 serves as a touch surface of the touch screen. The substrate 10 is preferably a transparent insulating plate, and the material may be glass, polycarbonate, PC, polythylene terephthalate (PET), polymethylmethacrylate (PMMA), cycloolefin. Cyclic Olefin Copolymer (C0C) or Polyether Sulfone (PES), etc., but the invention is not limited thereto.
接着请参照图 2， 如图 2所示， 在衬底 10的周围区域形成掩膜层 20在衬底 10的 第二表面 14上。掩膜层 20可为具有遮光效果的金属铬 (Cr)、铬氧化物镀层或树脂型黑 色涂布层的黑色矩阵图形。  Referring next to Fig. 2, as shown in Fig. 2, a mask layer 20 is formed on the second surface 14 of the substrate 10 in the peripheral region of the substrate 10. The mask layer 20 may be a black matrix pattern of a metallic chromium (Cr), a chromium oxide plating layer or a resin type black coating layer having a light blocking effect.
接着请参照图 3， 如图 3所示， 覆盖缓冲层 30在衬底 10的第二表面 14上， 并且 在本实施例中， 缓冲层 30覆盖部分掩膜层 20， 藉此在掩膜层 20的表面形成曝露区域 22， 但不以此为限。 在本发明的其它实施例中， 缓冲层 30可完全覆盖掩膜层 20， 而不 具有对应的曝露区域。  Referring to FIG. 3, as shown in FIG. 3, the buffer layer 30 is covered on the second surface 14 of the substrate 10. In the present embodiment, the buffer layer 30 covers a portion of the mask layer 20, thereby being in the mask layer. The surface of 20 forms the exposed area 22, but is not limited thereto. In other embodiments of the invention, the buffer layer 30 may completely cover the mask layer 20 without a corresponding exposed area.
缓冲层 30的材料可包含透明压克力、 透明聚酰亚胺、 硅氧化物或氮化物等， 并以 微影工艺、 喷涂法 (spray process)或蒸镀工艺将缓冲层 30形成在衬底 10的第二表面 14 上以及形成在部分掩膜层 20上， 但不以此为限。在本发明的其它实施例中， 缓冲层 20 可完全覆盖掩膜层 20以及衬底 10的第二表面 14。  The material of the buffer layer 30 may include transparent acrylic, transparent polyimide, silicon oxide or nitride, etc., and the buffer layer 30 is formed on the substrate by a lithography process, a spray process or an evaporation process. The second surface 14 of the 10 is formed on the partial mask layer 20, but is not limited thereto. In other embodiments of the invention, the buffer layer 20 may completely cover the mask layer 20 and the second surface 14 of the substrate 10.
值得一提的是， 本实施例的缓冲层 30是以较温和的方法形成在衬底 10的第二表 面 14上， 如喷涂法或蒸镀法等， 而不是以溅镀的方法形成在第二表面 14。 因此， 缓冲 层 30形成的过程中并不会对衬底 10的第二表面 14造成刻痕等物理上的损害， 并同时 保护衬底 10避免在后续溅镀其它金属层时产生物理上的损害， 以维持衬底 10的物理 强度， 使得本实施例的触控屏得以通过诸如落球测试等机械性的检验。  It is worth mentioning that the buffer layer 30 of the present embodiment is formed on the second surface 14 of the substrate 10 in a relatively gentle manner, such as a spraying method or an evaporation method, etc., instead of being formed by sputtering. Two surfaces 14. Therefore, the buffer layer 30 is formed without causing physical damage to the second surface 14 of the substrate 10, and at the same time protecting the substrate 10 from physical damage during subsequent sputtering of other metal layers. In order to maintain the physical strength of the substrate 10, the touch screen of the present embodiment can be passed through a mechanical test such as a ball drop test.
除此之外， 因为掩膜层 20的侧壁 21与衬底 10之间是呈现直角的状态， 若传感组 件直接溅镀在衬底 10上将造成掩膜层 20的侧壁 21与衬底 10的连结处溅镀不平均， 而导致阴影效应 (shadow effect)。 因此， 通过将缓冲层 30同时覆盖在衬底 10的第二表 面 14以及部分掩膜层 20上， 可有效消除触控屏上因为传感组件形成的过程中溅镀不 平均而导致的阴影效应。 In addition, since the sidewall 21 of the mask layer 20 and the substrate 10 are in a right angle state, if the sensing component is directly sputtered on the substrate 10, the sidewall 21 of the mask layer 20 and the liner are caused. Sputtering of the joints of the bottom 10 is uneven, resulting in a shadow effect. Therefore, by covering the buffer layer 30 at the same time on the second table of the substrate 10 The surface 14 and the portion of the mask layer 20 can effectively eliminate the shadow effect on the touch screen caused by uneven sputtering during the formation of the sensing component.
详细的说， 请参照图 4至图 10， 在覆盖缓冲层 30后， 开始形成多个传感组件在缓 冲层 30上， 而多个传感组件是先以溅镀的方式形成金属层在缓冲层 30上。 如图 4所 示， 是先溅镀第一金属层 40在缓冲层 30上。 此时， 缓冲层 30与掩膜层 20已形成较 平坦化的表面， 所以第一金属层 40可较平均的溅镀在缓冲层 30上。 其中， 第一金属 层 40的材料可以但不限于银、 铬、 铝、 钼或钼 /铝 /钼迭层等复合材料。  In detail, referring to FIG. 4 to FIG. 10, after covering the buffer layer 30, a plurality of sensing components are initially formed on the buffer layer 30, and the plurality of sensing components are first formed by sputtering to form a metal layer in the buffer. On layer 30. As shown in Fig. 4, the first metal layer 40 is first sputtered on the buffer layer 30. At this time, the buffer layer 30 and the mask layer 20 have formed a relatively flat surface, so the first metal layer 40 can be sputtered on the buffer layer 30 more evenly. The material of the first metal layer 40 may be, but not limited to, a composite material such as silver, chromium, aluminum, molybdenum or molybdenum/aluminum/molybdenum laminate.
接着， 请一并参照图 5以及图 11。如图所示， 蚀刻第一金属层 40以形成多个第一 金属桥接结构 41， 第一金属桥接结构 41是用以电性连接同一方向上的传感垫。  Next, please refer to Figure 5 and Figure 11 together. As shown, the first metal layer 40 is etched to form a plurality of first metal bridge structures 41. The first metal bridge structures 41 are electrically connected to the sensing pads in the same direction.
接着， 请一并参照图 6以及图 11， 如图所示， 形成透明绝缘层 50分别覆盖各个第 一金属桥接结构 41， 并只显露出每一个第一金属桥接结构 41的相对两端。在一实施例 中， 透明绝缘层 50可为一感光透明绝缘层， 例如但不限于油墨或是高透光率的聚酯材 料经曝光显影后形成。  Next, referring to FIG. 6 and FIG. 11, together, as shown, a transparent insulating layer 50 is formed to cover each of the first metal bridge structures 41, and only the opposite ends of each of the first metal bridge structures 41 are exposed. In one embodiment, the transparent insulating layer 50 can be a photosensitive transparent insulating layer such as, but not limited to, ink or a high transmittance polyester material formed by exposure and development.
接着请一并参照图 7以及图 11， 如图所示， 形成第二金属层 60在缓冲层 30、 掩 膜层 20、第一金属桥接结构 41以及透明绝缘层 50上。第二金属层 60可为透明感光材 料， 如氧化铟锡 (ITO)、 氧化铟锌 (ΙΖΟ)、 氧化锡锑 (ΑΤΟ)、 氧化铝锌 (ΑΖΟ)或有机透明 导电材料。  Next, referring to FIG. 7 and FIG. 11, as shown, a second metal layer 60 is formed on the buffer layer 30, the mask layer 20, the first metal bridge structure 41, and the transparent insulating layer 50. The second metal layer 60 may be a transparent photosensitive material such as indium tin oxide (ITO), indium zinc oxide (yttrium), antimony tin oxide (yttrium), aluminum zinc oxide (yttrium) or an organic transparent conductive material.
接着请一并参照图 8以及图 11， 如图所示， 蚀刻第二金属层 60以形成多个第一传 感垫 61、 多个第二传感垫 62以及多个第二金属桥接结构 63。 其中， 第一金属桥接结 构 41是连接各第一传感垫 61在第一方向上， 第二金属桥接结构 63是连接各第二传感 垫 62在第二方向上， 并且第一方向不等于第二方向。 其中， 形成多个第一传感垫 61、 多个第二传感垫 62以及多个第二金属桥接结构 63可由同一道黄光工艺所完成。  Referring to FIG. 8 and FIG. 11 together, as shown, the second metal layer 60 is etched to form a plurality of first sensing pads 61, a plurality of second sensing pads 62, and a plurality of second metal bridge structures 63. . The first metal bridge structure 41 connects the first sensing pads 61 in the first direction, and the second metal bridge structure 63 connects the second sensing pads 62 in the second direction, and the first direction is not equal to The second direction. Wherein, forming a plurality of first sensing pads 61, a plurality of second sensing pads 62, and a plurality of second metal bridge structures 63 can be completed by the same yellow light process.
接着请一并参照图 9以及图 11， 如图所示， 形成多个周边线路 70以电性连接第一 传感垫 61以及第二传感垫 62，并将第一传感垫 61以及第二传感垫 62的讯号传输至外 部的处理模组 (未图示)以计算传感位置或传感区域。  Referring to FIG. 9 and FIG. 11 together, as shown in the figure, a plurality of peripheral lines 70 are formed to electrically connect the first sensing pad 61 and the second sensing pad 62, and the first sensing pad 61 and the first The signals from the two sensing pads 62 are transmitted to an external processing module (not shown) to calculate the sensing position or sensing area.
值得一提的是， 本实施例的周边线路 70是实质上连接在掩膜层 20的曝光区域 22 上， 因此具有优选的连结性， 但并不限于此。 在本发明的其它实施例中， 周边线路 70 可实质上形成在缓冲层 30上。  It is to be noted that the peripheral line 70 of the present embodiment is substantially connected to the exposed region 22 of the mask layer 20, and therefore has preferable connectivity, but is not limited thereto. In other embodiments of the invention, the perimeter line 70 may be formed substantially on the buffer layer 30.
接着请参照图 10， 如图所示， 形成保护层 80覆盖在第一传感垫 61、 第二传感垫 62、 第一金属桥接结构 41、 第二金属桥接结构 63以及周边线路 70等传感组件上， 以 保护这些传感组件免于刮伤损毁。 其中， 透明保护层 80为绝缘物质。  Referring to FIG. 10, as shown, the protective layer 80 is formed to cover the first sensing pad 61, the second sensing pad 62, the first metal bridge structure 41, the second metal bridge structure 63, and the peripheral line 70. The sensing components are protected from scratches and damage. The transparent protective layer 80 is an insulating material.
接着请参照图 12， 为本发明的触控屏的第二实施例的剖面示意图。 如图所示， 第 二实施例的触控屏与第一实施例最大的不同在于， 第二实施例的触控屏的缓冲层 30是 完全覆盖衬底 10的第二表面 14以及掩膜层 20。 如此一来， 因为本实施例的缓冲层 30 不需要额外曝露掩膜层 20， 所以本实施例相对在第一实施例是可简化形成缓冲层 30 的过程。 Next, please refer to FIG. 12, which is a cross-sectional view of a second embodiment of the touch screen of the present invention. As shown, the first The touch screen of the second embodiment is most different from the first embodiment in that the buffer layer 30 of the touch screen of the second embodiment completely covers the second surface 14 of the substrate 10 and the mask layer 20. As a result, since the buffer layer 30 of the present embodiment does not require additional exposure of the mask layer 20, the present embodiment can simplify the process of forming the buffer layer 30 with respect to the first embodiment.
接着请参照图 13， 为本发明的触控屏的第三实施例的剖面示意图。 如图所示， 第 三实施例的触控屏与第二实施例最大的不同在于， 第三实施例的缓冲层 30是完全覆盖 衬底 10的第二表面 14， 并介于第二表面 14以及掩膜层 20之间。如此一来， 本实施例 相对在第一实施例而言同样可简化形成缓冲层 30的过程， 并且因为周边线路 70与掩 膜层 20直接连接， 因此本实施例相对于第二实施例的周边线路 70而言具有优选的连 结性。  Please refer to FIG. 13, which is a cross-sectional view of a third embodiment of the touch screen of the present invention. As shown, the touch screen of the third embodiment is most different from the second embodiment in that the buffer layer 30 of the third embodiment completely covers the second surface 14 of the substrate 10 and is interposed between the second surface 14. And between the mask layers 20. As such, the present embodiment can simplify the process of forming the buffer layer 30 as compared with the first embodiment, and since the peripheral line 70 is directly connected to the mask layer 20, the present embodiment is relative to the periphery of the second embodiment. Line 70 has a preferred connectivity.
在此要说明的是， 上述的第一实施例、 第二实施例以及第三实施例的缓冲层皆形 成在衬底的第二表面上， 因此可在后续形成传感组件的溅镀过程中， 保护衬底不受溅 镀程序的损害。 使得衬底在后续的落球测试中， 可至少承受如 130公克的钢球从 50cm 高的高度落下的冲击力。 其中， 落球测试中钢球的重量以及高度只是举例， 本发明并 不限于此。  It is to be noted that the buffer layers of the first embodiment, the second embodiment and the third embodiment described above are all formed on the second surface of the substrate, and thus can be formed during the subsequent sputtering process of forming the sensing component. , protect the substrate from damage caused by the sputtering process. In the subsequent ball drop test, the substrate can be subjected to at least an impact force such as a 130 gram steel ball falling from a height of 50 cm. Here, the weight and height of the steel ball in the ball drop test are merely examples, and the present invention is not limited thereto.
综上所述， 本发明的触控屏由于缓冲层形成在传感组件以及衬底之间， 因此可保 护衬底避免在溅镀工艺中受到损害， 所以可以提高衬底的耐撞击力。 同时， 缓冲层以 及掩膜层之间又可平坦化的设置， 可有效降低日后触控屏产生的阴影缺陷。  In summary, since the touch panel of the present invention is formed between the sensing component and the substrate by the buffer layer, the substrate can be protected from damage during the sputtering process, so that the impact resistance of the substrate can be improved. At the same time, the buffer layer and the mask layer can be flattened together, which can effectively reduce the shadow defects generated by the touch screen in the future.
以上所述仅为举例性， 而非为限制性者。 任何未脱离本发明的精神与范畴， 而对 其进行的等效修改或变更， 均应包含在所附的权利要求书中。  The foregoing is illustrative only and not limiting. Equivalent modifications or variations of the present invention are intended to be included within the scope of the appended claims.

Claims

权 利 要 求 书 claims
1、 一种触控屏的制造方法， 其特征在于， 包含： 1. A method of manufacturing a touch screen, characterized by comprising:
提供一衬底； provide a substrate;
形成一掩膜层在所述衬底的周围表面； forming a mask layer on a peripheral surface of the substrate;
覆盖一缓冲层在所述衬底以及选择性地在所述掩膜层的至少一部分； 以及 形成多个传感组件在所述缓冲层。 Covering a buffer layer on the substrate and selectively on at least a portion of the mask layer; and forming a plurality of sensing components on the buffer layer.
2、 如权利要求 1所述的制造方法， 其特征在于， 所述缓冲层是覆盖部分所述掩膜 层， 以形成所述掩膜层的曝露区域， 而所述形成多个传感组件在所述缓冲层的步骤还 包含形成多个周边线路在所述掩膜层的所述曝露区域。 2. The manufacturing method of claim 1, wherein the buffer layer covers part of the mask layer to form an exposed area of the mask layer, and the plurality of sensing components are formed in The step of forming the buffer layer further includes forming a plurality of peripheral circuits in the exposed area of the mask layer.
3、 如权利要求 1所述的制造方法， 其特征在于， 所述缓冲层是完全覆盖所述掩膜 层， 而所述形成多个传感组件在所述缓冲层的步骤还包含形成多个周边线路在所述缓 冲层。 3. The manufacturing method of claim 1, wherein the buffer layer completely covers the mask layer, and the step of forming a plurality of sensing components on the buffer layer further includes forming a plurality of Peripheral lines are in the buffer layer.
4、 如权利要求 1所述的制造方法， 其特征在于， 还包含利用微影工艺、 喷涂法或 蒸镀工艺将所述缓冲层形成在所述衬底以及选择性地在所述掩膜层的至少一部分。 4. The manufacturing method according to claim 1, further comprising using a photolithography process, a spraying process or an evaporation process to form the buffer layer on the substrate and selectively on the mask layer. at least part of.
5、如权利要求 1所述的制造方法，其特征在于，其中所述缓冲层是以透明压克力、 透明聚酰亚胺、 硅氧化物或氮化物制成。 5. The manufacturing method of claim 1, wherein the buffer layer is made of transparent acrylic, transparent polyimide, silicon oxide or nitride.
6、 一种触控屏的制造方法， 其特征在于， 包含： 6. A method of manufacturing a touch screen, characterized in that it includes:
提供一衬底； provide a substrate;
覆盖一缓冲层在所述衬底； Covering the substrate with a buffer layer;
形成一掩膜层在所述缓冲层相对所述衬底的周围表面的位置； 以及 forming a mask layer on the buffer layer relative to the surrounding surface of the substrate; and
形成多个传感组件在所述缓冲层与所述掩膜层。 A plurality of sensing components are formed on the buffer layer and the mask layer.
7、 如权利要求 6所述的制造方法， 其特征在于， 所述形成多个传感组件在所述缓 冲层与所述掩膜层的步骤还包含形成多个周边线路在所述掩膜层上。 7. The manufacturing method of claim 6, wherein the step of forming a plurality of sensing components on the buffer layer and the mask layer further includes forming a plurality of peripheral circuits on the mask layer. superior.
8、 如权利要求 6所述的制造方法， 其特征在于， 还包含利用微影工艺、 喷涂法或 蒸镀工艺将所述缓冲层形成在所述衬底。 8. The manufacturing method according to claim 6, further comprising forming the buffer layer on the substrate using a photolithography process, a spraying process or an evaporation process.
9、 如权利要求 6所述的制造方法， 其特征在于， 所述缓冲层是以透明压克力、 透 明聚酰亚胺、 硅氧化物或氮化物制成。 9. The manufacturing method of claim 6, wherein the buffer layer is made of transparent acrylic, transparent polyimide, silicon oxide or nitride.
10、 一种触控屏， 其特征在于， 它包含： 10. A touch screen, characterized in that it contains:
一衬底， 具有相对的一第一表面以及一第二表面， 所述第一表面是作为一触控面; 一掩膜层， 设置在所述第二表面的周围区域； A substrate having an opposite first surface and a second surface, the first surface being used as a touch surface; a mask layer disposed in the surrounding area of the second surface;
多个传感组件， 设置在所述衬底的所述第二表面； 以及 a plurality of sensing components disposed on the second surface of the substrate; and
一缓冲层， 设置在所述多个传感组件以及所述衬底的所述第二表面之间； 其中， 所述缓冲层是覆盖所述衬底或选择性地覆盖所述掩膜层的至少一部分。 A buffer layer disposed between the plurality of sensing components and the second surface of the substrate; wherein the buffer layer covers the substrate or selectively covers the mask layer At least part of it.
11、如权利要求 10所述的触控屏，其特征在于，所述缓冲层覆盖部分所述掩膜层， 以形成所述掩膜层的曝露区域， 并且所述多个传感组件还包含多个周边线路设置在所 述曝露区域。 11. The touch screen of claim 10, wherein the buffer layer covers part of the mask layer to form an exposed area of the mask layer, and the plurality of sensing components further comprise A plurality of peripheral circuits are provided in the exposed area.
12、如权利要求 10所述的触控屏，其特征在于，所述缓冲层完全覆盖所述掩膜层， 并且所述多个传感组件还包含多个周边线路形成在所述缓冲层。 12. The touch screen of claim 10, wherein the buffer layer completely covers the mask layer, and the plurality of sensing components further include a plurality of peripheral circuits formed on the buffer layer.
13、 如权利要求 10所述的触控屏， 其特征在于， 所述缓冲层设置在所述掩膜层以 及所述衬底之间， 且所述多个传感组件还包含多个周边线路形成在所述掩膜层。 13. The touch screen of claim 10, wherein the buffer layer is provided between the mask layer and the substrate, and the plurality of sensing components further include a plurality of peripheral circuits. formed on the mask layer.
14、 如权利要求 10所述的触控屏， 其特征在于， 所述缓冲层是以透明压克力、 透 明聚酰亚胺、 硅氧化物或氮化物制成。 14. The touch screen of claim 10, wherein the buffer layer is made of transparent acrylic, transparent polyimide, silicon oxide or nitride.
PCT/CN2012/086472 2012-12-12 2012-12-12 Touch screen and manufacturing method thereof WO2014089789A1 (en)

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US20080165139A1 (en) * 2007-01-05 2008-07-10 Apple Inc. Touch screen stack-up processing
CN102629175A (en) * 2012-03-27 2012-08-08 福建连城天域高科技有限公司 Method for producing projected type capacitive touch screen
CN102693056A (en) * 2012-05-25 2012-09-26 芜湖长信科技股份有限公司 Capacitive touch screen and process for manufacturing same
CN102799296A (en) * 2011-05-26 2012-11-28 胜华科技股份有限公司 Touch sensing device and manufacture method thereof
CN102799327A (en) * 2012-03-28 2012-11-28 友达光电股份有限公司 Touch panel and manufacturing method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080165139A1 (en) * 2007-01-05 2008-07-10 Apple Inc. Touch screen stack-up processing
CN102799296A (en) * 2011-05-26 2012-11-28 胜华科技股份有限公司 Touch sensing device and manufacture method thereof
CN102629175A (en) * 2012-03-27 2012-08-08 福建连城天域高科技有限公司 Method for producing projected type capacitive touch screen
CN102799327A (en) * 2012-03-28 2012-11-28 友达光电股份有限公司 Touch panel and manufacturing method thereof
CN102693056A (en) * 2012-05-25 2012-09-26 芜湖长信科技股份有限公司 Capacitive touch screen and process for manufacturing same

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