WO2014088044A1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- WO2014088044A1 WO2014088044A1 PCT/JP2013/082635 JP2013082635W WO2014088044A1 WO 2014088044 A1 WO2014088044 A1 WO 2014088044A1 JP 2013082635 W JP2013082635 W JP 2013082635W WO 2014088044 A1 WO2014088044 A1 WO 2014088044A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- base plate
- plate
- heat pipe
- heat receiving
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract 3
- 238000005452 bending Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 abstract description 13
- 230000005855 radiation Effects 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat sink including a heat pipe disposed on a base plate.
- a heat sink provided with a radiation fin is known (see, for example, Patent Document 1).
- a base plate in contact with the heat pipe is made of a material having excellent thermal conductivity (for example, copper or copper alloy). Etc.).
- the base plate is entirely made of copper or a copper alloy, there is a problem that the amount of copper used increases and the weight and manufacturing cost increase.
- the heat pipe is sandwiched between the base plate and the heat radiation fins, so it is desirable to suppress the load applied to the heat pipe.
- the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a heat sink that suppresses a load applied to a heat pipe and improves heat transfer efficiency from a heating element to a radiation fin.
- the present invention includes a base plate having a heat receiving portion to which a heating element is thermally connected, a heat pipe that is partly in contact with the heat receiving portion and disposed on the base plate, A heat dissipating fin disposed on the base plate and the heat pipe, the base plate is formed of a metal plate, and has an opening at a portion corresponding to the heat receiving portion, and the opening includes the
- the heat receiving plate formed of a metal plate having a higher thermal conductivity than the base plate is disposed so that one surface of the heat receiving plate and the surface of the base plate on which the heat pipe is installed are substantially the same surface. It is characterized by.
- the base plate is formed by bending a metal plate, and includes a groove portion in which the heat pipe is disposed, and placement portions on which the heat radiation fins are placed on both sides of the groove portion. While providing the said opening part, you may form the surface of the said groove part, and the back surface of the said mounting part in the same height position.
- the heat receiving plate may be fixed to the back surface of the mounting portion.
- the heat dissipating fins may include a plurality of fin plates provided in parallel, and the fin plates may be arranged in the extending direction of the heat pipe.
- the heat dissipating fin may include a plurality of housing grooves for housing the heat pipes on a surface facing the base plate, and a leg portion contacting the surface of the base plate may be provided between the housing grooves.
- the base plate is formed of a metal plate, and has an opening at a portion corresponding to the heat receiving portion, and the heat receiving portion formed of a metal plate having higher thermal conductivity than the base plate in the opening. Since the plate is provided, the heat from the heating element can be efficiently transmitted to the heat radiating fin through the heat receiving plate and the heat pipe. Furthermore, since the heat receiving plate is disposed on the same surface (substantially flush) with the surface of the base plate where the heat pipe is installed, the step on the base plate is prevented, and the radiating fins are connected to the base plate and the heat pipe. Even in the case of overlapping, it is possible to prevent an excessive load from being applied to the heat pipe.
- FIG. 1 is an exploded perspective view of the heat sink 10 according to the first embodiment
- FIG. 2 is an external perspective view of the heat sink 10.
- the heat sink 10 is used, for example, in an electronic device such as a personal computer, and is thermally connected to a semiconductor element (heating element) 11 such as a CPU mounted on a circuit board (not shown) to cool the semiconductor element 11. Is what you do.
- the heat sink 10 includes a flat base plate 21, and a plurality of (three in this embodiment) heat pipes 22 are arranged side by side on the base plate 21.
- a plurality of (two in the present embodiment) radiation fins 23 are arranged side by side on the heat pipe 22. That is, in this configuration, the heat pipe 22 is sandwiched and held between the base plate 21 and the radiation fins 23 as shown in FIG.
- the base plate 21 is formed by bending a metal plate such as aluminum by press molding. As shown in FIG. 1, the base plate 21 includes a wide groove portion 31 extending in the longitudinal direction (Y direction in the drawing) at the approximate center in the short direction (X direction in the drawing), and the groove portions on both sides of the groove portion 31. And a pair of bank portions (mounting portions) 32 formed higher than 31. The bank portions 32 are formed at substantially the same height, and the edge portions 33 of the bank portions 32 are bent downward.
- the heat pipe 22 is disposed in the groove portion 31, and the radiation fins 23 are placed on the bank portion 32.
- Each bank portion 32 is formed with two hole portions 34 (four in total). These holes 34 are holes through which fixing screws for fixing the heat sink 10 to the circuit board pass.
- the groove part 31 is provided in the approximate center of the width direction in the base board 21, it is not restricted to this, You may provide in any position of the said width direction.
- This type of base plate can be formed by, for example, die casting, extrusion, or cutting, in addition to bending and forming a metal plate.
- die casting and extrusion molding there is a situation in which a mold cost for molding occurs and it is not suitable for small-scale production.
- processing costs and material costs increase.
- the die-cast product is generally inferior in thermal conductivity to the metal plate, if the other conditions are the same, a difference in the cooling performance of the heat sink occurs due to the difference in the thermal conductivity of the base plate.
- the base plate 21 is formed by bending a metal plate by press molding.
- the thermal conductivity of the base plate 21 itself can be increased and the manufacturing cost can be reduced as compared with the above-described one. Furthermore, since the groove part 31 and the edge part 33 bent by the base plate 21 exhibit the function as the reinforcing rib, the weight and thickness can be reduced while ensuring the rigidity of the base plate 21.
- the base plate 21 includes an opening 35 at a substantially center in the longitudinal direction of the groove 31 (a position corresponding to a heat receiving portion thermally connected to the semiconductor element 11).
- a heat receiving plate 36 made of a metal (for example, copper) having a higher thermal conductivity than the plate 21 is disposed.
- the above-described semiconductor element 11 is connected to the back surface (lower surface in the drawing) 36A of the heat receiving plate 36, and is fixed to the front surface (upper surface in the drawing) 36B with a part of the heat pipe 22 in contact therewith. In this configuration, heat generated from the semiconductor element 11 is transmitted to the heat pipe 22 through the heat receiving plate 36.
- the heat receiving plate 36 is made of a metal having a higher thermal conductivity than the base plate 21, the heat of the semiconductor element 11 can be quickly transmitted to the heat radiating fins 23 through the heat receiving plate 36 and the heat pipe 22.
- the cooling performance of the heat sink 10 can be enhanced.
- weight reduction and reduction of a material and manufacturing cost can be achieved.
- the heat pipe 22 is a member for diffusing the heat received by the heat receiving plate 36 to the heat radiating fins 23.
- the heat pipe 22 is formed by, for example, sealing a working fluid such as water in a reduced pressure inside a sealed container made of a metal having excellent thermal conductivity such as copper or an alloy made of the above metal. Yes.
- the container is formed flat in order to suppress the height (thickness) and secure a large contact area with the base plate 21 and the radiation fins 23.
- the heat pipe 22 is fixed to the groove portion 31 and the heat receiving plate 36 of the base plate 21 by soldering, brazing, or the like.
- the heat radiating fins 23 release heat transferred through the heat pipe 22 into the air.
- the heat radiating fins 23 are formed to be approximately half the length of the heat pipe 22 and are arranged side by side in the extending direction of the heat pipe 22. ing.
- the heat radiating fins 23 are formed in a region including directly above the heat receiving plate 36, and exist over a wide area in a region on the base plate 21.
- the number of the heat dissipating fins 23 can be changed according to the length of the heat pipe 22 and can be a single heat dissipating fin.
- Each radiating fin 23 includes a plurality of fin plates 43 formed in a substantially U-shaped cross-section by bending an upper edge 41 and a lower edge 42 of a metal plate 40 such as aluminum, for example, substantially in parallel. These fin plates 43 are arranged side by side in the extending direction of the heat pipe 22, and the fin plates 43 are fixed integrally by soldering, for example. Air can flow through a gap between adjacent fin plates 43. For this reason, in the radiation fin 23, the heat transmitted to the heat pipe 22 can be diffused throughout the radiation fin 23, and this heat can be dissipated by exchanging heat with the air flowing through the gaps between the fin plates 43 described above. .
- the heat radiating fin 23 includes a housing groove 24 for housing the heat pipe 22 on a lower surface (opposing surface) 23 ⁇ / b> A facing the base plate 21 and the heat pipe 22.
- the housing groove 24 is formed in accordance with the outer shape of the heat pipe 22 to improve the heat transfer area between the heat pipe 22 and the heat radiating fins 23.
- leg portions 25 are provided between the respective housing grooves 24, and these leg portions 25 are formed on the surface of the groove portion 31 of the base plate 21 (when the radiating fins 23 are placed on the bank portion 32 of the base plate 21 ( The surface on which the heat pipe 22 is installed) abuts on 31A.
- the heat sink 10 is integrally configured by fixing the radiating fins 23 to the base plate 21 and the heat pipes 22 by soldering or the like. Further, the radiating fin 23 is provided with a notch 26 at a location corresponding to the hole 34 provided in the base plate 21.
- the base plate 21 is formed by bending a metal plate in order to increase the thermal conductivity of the base plate 21 with an inexpensive configuration, and at the heat receiving portion thermally connected to the semiconductor element 11.
- An opening 35 is provided at a corresponding location, and a heat receiving plate 36 made of a metal having a higher thermal conductivity than the base plate 21 is disposed in the opening 35.
- the heat sink 10 is configured such that the heat radiating fins 23 are placed on the base plate 21 so that the heat pipe 22 is sandwiched between the base plate 21 and the heat radiating fins 23. It is desirable to suppress the load.
- the heat receiving plate 36 has a surface (upper surface; upper surface in the drawing) 36B of the heat receiving plate 36 that is not stepped from the surface 31A of the groove portion 31 (upper surface in the drawing) 31A of the base plate 21 or
- the steps are arranged in such a manner that there are very few steps, that is, the surface 36B of the heat receiving plate 36 and the surface 31A of the groove 31 of the base plate 21 are substantially the same surface (substantially flush).
- the base plate 21 is formed by bending a metal plate so that the front surface 31A of the groove portion 31 and the back surface (lower surface in the drawing) 32A of the bank portion 32 are at the same height position.
- the heat receiving plate 36 is formed to be larger than the width of the groove portion 31 and is fixed to the back surface 32A of the bank portion 32 by soldering or the like. According to this, as shown in FIG. 4, the heat receiving plate 36 is attached to the opening 35 from the back surface 32A side of the bank portion 32 and fixed to the back surface 32A.
- the heat receiving plate 36 can be disposed in the opening 35 of the base plate 21 with the surface 31A of the groove portion 31 being substantially the same surface (substantially flush). For this reason, a step between the heat receiving plate 36 and the base plate 21 can be prevented, and even when the radiating fins 23 are arranged on the base plate 21 and the heat pipe 22, an excessive load is applied to the heat pipe 22. This can be prevented.
- FIG. 5 is a plan view of the base plate 21 before press molding.
- the metal plate is punched into the outer shape shown in FIG. 5, and the opening 35 and the hole 34 are formed at predetermined positions.
- the punched metal plate is bent into a desired shape by press molding. Specifically, the line 50 along the inner side of the predetermined distance from the edge of the metal plate and the line 51 along the inner edge 35A of the opening 35 are folded and the line along the inner side of the predetermined distance from the line 51.
- the base plate 21 is formed by valley-folding 52.
- recesses 35B extending outward from the edge 35A are formed at the four corners of the edge 35A of the opening 35.
- the base plate 21 having the heat receiving portion to which the semiconductor element 11 is thermally connected, the heat pipe 22 partially disposed in contact with the heat receiving portion, and the base
- the base plate 21 is formed of a metal plate and has an opening 35 in a portion corresponding to the heat receiving portion.
- the opening 35 includes a heat radiating fin 23 disposed on the plate 21 and the heat pipe 22. Since the heat receiving plate 36 made of a metal plate having a higher thermal conductivity than the base plate 21 is provided, the heat from the semiconductor element 11 is efficiently transferred to the radiating fins 23 through the heat receiving plate 36 and the heat pipe 22. be able to.
- the heat receiving plate 36 is disposed on a surface (substantially flush) with the surface 31A on which the heat pipe 22 of the base plate 21 is installed, the step on the base plate 21 is prevented, and the radiating fins 23 are installed. Even in the case where the heat pipe 22 is placed over the base plate 21 and the heat pipe 22, it is possible to prevent an excessive load from being applied to the heat pipe 22.
- the base plate 21 is formed by bending a metal plate, and the groove portion 31 in which the heat pipe 22 is disposed, and the bank portion 32 in which the radiation fins 23 are placed on both sides of the groove portion 31.
- the opening portion 35 is provided in the groove portion 31 and the front surface 31A of the groove portion 31 and the back surface 32A of the bank portion 32 are formed at the same height position, so that the heat receiving plate 36 is formed from the back surface 32A side of the bank portion 32.
- the heat receiving plate 36 is arranged so that the surface 36B of the heat receiving plate 36 and the surface 31A of the groove portion 31 are substantially the same surface (substantially flush) by a simple operation such as applying to the opening 35 and fixing to the back surface 32A. Can be disposed in the opening 35 of the base plate 21.
- the fixing structure can be simplified and the appearance of the heat sink 10 is improved because the fixing portion is not exposed on the surface. be able to.
- the radiating fins 23 include a plurality of fin plates 43 provided in parallel, and these fin plates 43 are arranged along the extending direction of the heat pipe 22, so that the heat pipes The transmitted heat can be diffused to each fin plate 43 via 22, and the heat can be dissipated by exchanging heat with the air flowing through the gaps between the fin plates 43.
- the radiating fin 23 includes the plurality of housing grooves 24 for housing the heat pipes 22 on the lower surface 23 ⁇ / b> A facing the base plate 21, and the groove portions of the base plate 21 between these housing grooves 24. Since the leg portion 25 that abuts on the surface 31A of the base plate 31 is provided, the leg portion 25 abuts on the surface 31A of the groove portion 31 of the base plate 21 when the radiating fin 23 is placed on the bank portion 32 of the base plate 21. Through the legs 25, heat conduction can be performed directly from the base plate 21 to the heat radiation fins 23. Furthermore, the load applied to the heat pipe 22 can be reduced by supporting the load of the radiating fin 23 with the leg portion 25.
- the heat sink 100 of the second embodiment is different from that of the first embodiment in the shape of the base plate. For this reason, in this 2nd Embodiment, only the point from which a structure differs is demonstrated, the same code
- FIG. 6 is a side view of the heat sink 100 according to the second embodiment
- FIG. 7 is a side sectional view of the heat sink 100.
- the base plate 121 of the present embodiment is formed of a metal plate that is not subjected to bending processing.
- the heat receiving plate 36 is formed in substantially the same size as the opening 135 provided in the base plate 121, and the surface 36B of the heat receiving plate 36 and the surface (upper surface in the drawing) 121A of the base plate 121 The heat receiving plate 36 is fixed to the opening 135 so that they are substantially the same surface (substantially flush).
- a base plate 121 is arranged on the surface 121A side of the base plate 121 (surface on which the heat pipe 22 is installed), and the base plate 121 is in contact with the surface 36B of the heat receiving plate 36 against the base plate.
- the base plate 121 and the heat receiving plate 36 are fixed by soldering or the like from the back surface 121B side.
- a technique is required for fixing the heat receiving plate 36 as compared with the first embodiment described above, but the surface 36B of the heat receiving plate 36 and the surface 121A of the base plate 121 are simply arranged on substantially the same surface (substantially surface). 1)
- the heat sink 100 can be made thinner as much as the thickness of the base plate 121 can be suppressed.
- this invention is not limited to the said embodiment, It can change in the range which does not deviate from the summary.
- the three heat pipes 22 are arranged on the base plates 21 and 121 in the above embodiment, the number of the heat pipes 22 may be changed as appropriate.
- the heat pipe 22 has a flat shape, it may be a round shape.
- the openings 35 and 135 are provided at substantially the center of the base plates 21 and 131.
- the present invention is not limited to this, and the openings 35 and 135 are changed according to the position of the semiconductor element 11 disposed on the circuit board. May be.
- the semiconductor element 11 arranged on the circuit board is a heating element.
- the present invention is not limited to this.
- Heat sink 11 Semiconductor element (heating element) 21, 121 Base plate 22 Heat pipe 23 Radiation fin 23A Lower surface (opposing surface) 24 receiving groove 25 leg 31 groove 31A, 121A surface (surface on which heat pipe is arranged) 32 Bank portion 32A Back surface 35, 135 Opening portion 36 Heat receiving plate 36B Front surface 43 Fin plate
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- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
一方、ヒートシンクは小型化の要望が強く、ベース板に放熱フィンを重ねて配置する場合、ヒートパイプはベース板と放熱フィンとで挟まれるため、ヒートパイプにかかる荷重を抑えることが望ましい。 In this type of heat sink, in order to efficiently transfer heat from the heating element to the heat radiating fins through the heat pipe, a base plate in contact with the heat pipe is made of a material having excellent thermal conductivity (for example, copper or copper alloy). Etc.). However, if the base plate is entirely made of copper or a copper alloy, there is a problem that the amount of copper used increases and the weight and manufacturing cost increase.
On the other hand, there is a strong demand for miniaturization of the heat sink, and when the heat radiation fins are placed on the base plate, the heat pipe is sandwiched between the base plate and the heat radiation fins, so it is desirable to suppress the load applied to the heat pipe.
上記目的を達成するために、本発明は、発熱体が熱的に接続される受熱部を有するベース板と、前記受熱部と一部が接触して前記ベース板に配置されるヒートパイプと、前記ベース板及び前記ヒートパイプに重ねて配置される放熱フィンとを備え、前記ベース板は、金属板で形成され、前記受熱部に相当する部位に開口部を有し、前記開口部に、前記ベース板よりも熱伝導度の高い金属板で形成された受熱板を、該受熱板の一面と前記ベース板の前記ヒートパイプが設置される面とが略同一の面となるように配置したことを特徴とする。 This specification includes all the contents of Japanese Patent Application / Japanese Patent Application No. 2012-267171 filed on Dec. 6, 2012.
In order to achieve the above object, the present invention includes a base plate having a heat receiving portion to which a heating element is thermally connected, a heat pipe that is partly in contact with the heat receiving portion and disposed on the base plate, A heat dissipating fin disposed on the base plate and the heat pipe, the base plate is formed of a metal plate, and has an opening at a portion corresponding to the heat receiving portion, and the opening includes the The heat receiving plate formed of a metal plate having a higher thermal conductivity than the base plate is disposed so that one surface of the heat receiving plate and the surface of the base plate on which the heat pipe is installed are substantially the same surface. It is characterized by.
また、前記放熱フィンは、前記ベース板との対向面に前記ヒートパイプを収容する複数の収容溝を備え、これら収容溝の間に前記ベース板の表面に当接する脚部を設けても良い。 The heat dissipating fins may include a plurality of fin plates provided in parallel, and the fin plates may be arranged in the extending direction of the heat pipe.
The heat dissipating fin may include a plurality of housing grooves for housing the heat pipes on a surface facing the base plate, and a leg portion contacting the surface of the base plate may be provided between the housing grooves.
[第1実施形態]
図1は、第1実施形態にかかるヒートシンク10の分解斜視図であり、図2は、ヒートシンク10の外観斜視図である。
ヒートシンク10は、例えば、パーソナルコンピュータ等の電子機器に用いられ、不図示の回路基板に搭載されるCPU等の半導体素子(発熱体)11と熱的に接続されて、当該半導体素子11の冷却を行うものである。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[First Embodiment]
FIG. 1 is an exploded perspective view of the
The
また、各土手部32には、それぞれ2か所(合計4か所)の孔部34が形成されている。これら孔部34は、ヒートシンク10を回路基板に固定する固定用ねじが貫通するための孔である。
なお、溝部31は、ベース板21における幅方向の略中央に設けているが、これに限るものではなく、当該幅方向のいずれの位置に設けても良い。 The
Each
In addition, although the
これに対して、本構成では、ベース板21は、プレス成形により金属板を折り曲げて形成されている。この構成では、上記したものに比べて、ベース板21自体の熱伝導度を高めることができるとともに、製造コストを抑えることができる。さらに、ベース板21で折り曲げ加工した溝部31や縁部33が補強リブとしての機能を発揮するため、ベース板21の剛性を確保しつつ軽量化、薄型化を実現できる。 This type of base plate can be formed by, for example, die casting, extrusion, or cutting, in addition to bending and forming a metal plate. However, in die casting and extrusion molding, there is a situation in which a mold cost for molding occurs and it is not suitable for small-scale production. Moreover, even in the case of cutting, there arises a problem that processing costs and material costs increase. Furthermore, since the die-cast product is generally inferior in thermal conductivity to the metal plate, if the other conditions are the same, a difference in the cooling performance of the heat sink occurs due to the difference in the thermal conductivity of the base plate.
On the other hand, in this configuration, the
この構成では、半導体素子11から発せられた熱は、受熱板36を通じて、ヒートパイプ22に伝達される。この受熱板36は、ベース板21よりも熱伝導度の高い金属で形成されるため、半導体素子11の熱を受熱板36及びヒートパイプ22を通じて、速やかに放熱フィン23に伝達することができ、ヒートシンク10の冷却性能を高めることができる。また、ベース板21全体を銅で形成するものに比べて、軽量化及び材料、製造コストの低減化を図ることができる。 In this configuration, the
In this configuration, heat generated from the
各放熱フィン23は、例えばアルミニウム等の金属板40の上縁41及び下縁42をそれぞれ略平行に折り曲げて、断面略コ字状に形成された複数のフィン板43を備える。
これらフィン板43は、ヒートパイプ22の延出方向に並べて配置され、各フィン板43は、例えば、半田付けによって一体に固定されている。隣接するフィン板43間の隙間を通じて空気が流通可能となっている。このため、放熱フィン23では、ヒートパイプ22に伝達された熱を放熱フィン23全体に拡散させることができ、この熱を上記したフィン板43間の隙間を流れる空気と熱交換することで放熱できる。 The heat radiating fins 23 release heat transferred through the
Each radiating
These
また、各収容溝24間にはそれぞれ脚部25が設けられ、これら脚部25は、放熱フィン23をベース板21の土手部32に載せた際に、このベース板21の溝部31の表面(ヒートパイプ22が設置される面)31Aに当接する。これにより、脚部25を通じて、ベース板21から放熱フィン23へ、直接、熱伝導を可能とするとともに、放熱フィン23の荷重を脚部25で支え、ヒートパイプ22へかかる荷重を低減している。
本実施形態では、放熱フィン23は、ベース板21及び各ヒートパイプ22とそれぞれ半田付け等で固定されることにより、ヒートシンク10は一体に構成される。また、放熱フィン23には、ベース板21に設けられた孔部34に対応する箇所に切欠26が設けられている。 The
Further,
In the present embodiment, the
また、ヒートシンク10は、ベース板21に放熱フィン23を重ねて配置する構成とすることにより、ヒートパイプ22はベース板21と放熱フィン23とで挟まれるため、ヒートパイプ22にかかる放熱フィン23の荷重を抑えることが望ましい。
このため、本構成では、受熱板36は、この受熱板36の表面(図中上面;一の面)36Bがベース板21の溝部31の表面(図中上面)31Aと、段差がないか或いは段差のごく僅かな状態、すなわち受熱板36の表面36Bとベース板21の溝部31の表面31Aとが略同一の面(略面一)となるように配置されている。 By the way, in the
The
For this reason, in this configuration, the
これによれば、図4に示すように、受熱板36を土手部32の裏面32A側から開口部35に当てがい、この裏面32Aに固定するといった簡単な作業で、受熱板36の表面36Bと溝部31の表面31Aとを略同一の面(略面一)に、当該受熱板36をベース板21の開口部35に配置できる。このため、受熱板36とベース板21との段差を防止することができ、放熱フィン23をベース板21及びヒートパイプ22に重ねて配置する場合であっても、ヒートパイプ22に過剰な荷重がかかることを防止できる。 Specifically, as shown in FIG. 3, the
According to this, as shown in FIG. 4, the
図5は、ベース板21のプレス成形前の平面図である。
まず、金属板を、図5に示す外形に打ち抜くとともに、所定の位置に開口部35及び孔部34を形成する。
続いて、打ち抜いた金属板をプレス成形によって、所望の形状に折り曲げ加工する。具体的には、金属板の縁から所定距離内側に沿ったライン50、及び、開口部35の縁部35Aに沿ったライン51を山折りするとともに、このライン51から所定距離内側に沿ったライン52を谷折りすることにより、ベース板21が成形される。
この場合、開口部35の縁部35Aの4隅には、この縁部35Aから外側に延びる凹部35Bが形成される。これにより、上記したライン51で折り曲げる際に、開口部35の4隅近傍での膨らみを防止でき、開口部35の縁部35Aに沿って正確に折り曲げることができる。 Next, a method for forming the
FIG. 5 is a plan view of the
First, the metal plate is punched into the outer shape shown in FIG. 5, and the
Subsequently, the punched metal plate is bent into a desired shape by press molding. Specifically, the
In this case, recesses 35B extending outward from the
次に、ヒートシンクの別の実施形態について説明する。この第2実施形態のヒートシンク100は、上記した第1実施形態のものとベース板の形状が異なる。このため、この第2実施形態では、構成の異なる点のみを説明し、同一の構成については同一の符号を付して説明を省略する。 [Second Embodiment]
Next, another embodiment of the heat sink will be described. The
本実施形態のベース板121は、折り曲げ加工を施していない金属板により形成される。この実施形態では、受熱板36は、ベース板121に設けられた開口部135と略同一の大きさに形成され、この受熱板36の表面36Bとベース板121の表面(図中上面)121Aとが略同一の面(略面一)となるように、当該受熱板36は開口部135に固定されている。
具体的には、ベース板121の表面(ヒートパイプ22が設置される面)121A側に当て板を配置し、この当て板に受熱板36の表面36Bを当接させた状態で、ベース板121の裏面121B側からベース板121と受熱板36とを半田付け等で固定する。この構成では、上記した第1実施形態のものよりも、受熱板36の固定に技術を要するが、簡単に受熱板36の表面36Bとベース板121の表面121Aとを略同一の面(略面一)にできる。
本実施形態によれば、ベース板121の厚みを抑えることができる分、ヒートシンク100の薄型化を図ることができる。 FIG. 6 is a side view of the
The
Specifically, a
According to the present embodiment, the
例えば、上記実施形態では、ベース板21、121上に3本のヒートパイプ22を配置する構成としたが、ヒートパイプ22の本数は適宜変更しても良い。さらに、ヒートパイプ22は、扁平形状としたが丸型としても良いことは勿論である。
また、上記した実施形態では、開口部35、135は、ベース板21、131の略中央に設けているが、これに限らず、回路基板に配置される半導体素子11の位置に応じて変更しても良い。また、上記した実施形態では、回路基板に配置される半導体素子11を発熱体とする構成としたが、これに限るものではないことは勿論である。 As mentioned above, although this invention was concretely demonstrated based on embodiment, this invention is not limited to the said embodiment, It can change in the range which does not deviate from the summary.
For example, although the three
In the above-described embodiment, the
11 半導体素子(発熱体)
21、121 ベース板
22 ヒートパイプ
23 放熱フィン
23A 下面(対向面)
24 収容溝
25 脚部
31 溝部
31A、121A 表面(ヒートパイプが配置される面)
32 土手部
32A 裏面
35、135 開口部
36 受熱板
36B 表面
43 フィン板 10, 100
21, 121
24 receiving
32
Claims (5)
- 発熱体が熱的に接続される受熱部を有するベース板と、前記受熱部と一部が接触して前記ベース板に配置されるヒートパイプと、前記ベース板及び前記ヒートパイプに重ねて配置される放熱フィンとを備え、
前記ベース板は、金属板で形成され、前記受熱部に相当する部位に開口部を有し、
前記開口部に、前記ベース板よりも熱伝導度の高い金属板で形成された受熱板を、該受熱板の一面と前記ベース板の前記ヒートパイプが設置される面とが略同一の面となるように配置したことを特徴とするヒートシンク。 A base plate having a heat receiving portion to which a heating element is thermally connected, a heat pipe that is partly in contact with the heat receiving portion and disposed on the base plate, and is disposed on the base plate and the heat pipe. With heat dissipation fins,
The base plate is formed of a metal plate, and has an opening at a portion corresponding to the heat receiving portion,
A heat receiving plate formed of a metal plate having higher thermal conductivity than the base plate in the opening, and one surface of the heat receiving plate is substantially the same as a surface on which the heat pipe is installed. A heat sink characterized by being arranged as follows. - 前記ベース板は、金属板を折り曲げて形成され、前記ヒートパイプが配置される溝部と、この溝部の両側に前記放熱フィンが載置される載置部とを備え、前記溝部に前記開口部を設けると共に、当該溝部の表面と前記載置部の裏面とを同一の高さ位置に形成したことを特徴とする請求項1に記載のヒートシンク。 The base plate is formed by bending a metal plate, and includes a groove portion in which the heat pipe is disposed, and a placement portion on which the radiating fin is placed on both sides of the groove portion, and the opening portion is formed in the groove portion. The heat sink according to claim 1, wherein the heat sink is formed at the same height position as the front surface of the groove and the back surface of the mounting portion.
- 前記受熱板は、前記載置部の裏面に固定されることを特徴とする請求項2に記載のヒートシンク。 The heat sink according to claim 2, wherein the heat receiving plate is fixed to a back surface of the mounting portion.
- 前記放熱フィンは、並列に設けられた複数のフィン板を備え、これらフィン板は、前記ヒートパイプの延出方向に沿って配置されることを特徴とする請求項1乃至3のいずれかに記載のヒートシンク。 The said heat radiating fin is provided with the several fin board provided in parallel, These fin boards are arrange | positioned along the extending direction of the said heat pipe. Heat sink.
- 前記放熱フィンは、前記ベース板との対向面に前記ヒートパイプを収容する複数の収容溝を備え、これら収容溝の間に前記ベース板の表面に当接する脚部を設けたことを特徴とする請求項1乃至4のいずれかに記載のヒートシンク。 The heat radiating fin includes a plurality of housing grooves for housing the heat pipe on a surface facing the base plate, and a leg portion that contacts the surface of the base plate is provided between the housing grooves. The heat sink according to claim 1.
Priority Applications (3)
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CN201390000739.1U CN204596782U (en) | 2012-12-06 | 2013-12-04 | Radiator |
US14/423,002 US20150219400A1 (en) | 2012-12-06 | 2013-12-04 | Heat sink |
JP2014517299A JP5579349B1 (en) | 2012-12-06 | 2013-12-04 | heatsink |
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JP2012267171 | 2012-12-06 | ||
JP2012-267171 | 2012-12-06 |
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Family
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PCT/JP2013/082635 WO2014088044A1 (en) | 2012-12-06 | 2013-12-04 | Heat sink |
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US (1) | US20150219400A1 (en) |
JP (1) | JP5579349B1 (en) |
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Also Published As
Publication number | Publication date |
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JP5579349B1 (en) | 2014-08-27 |
US20150219400A1 (en) | 2015-08-06 |
CN204596782U (en) | 2015-08-26 |
JPWO2014088044A1 (en) | 2017-01-05 |
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