WO2014053462A1 - Electrical insulator comprising an organofluorine compound and method for producing it - Google Patents
Electrical insulator comprising an organofluorine compound and method for producing it Download PDFInfo
- Publication number
- WO2014053462A1 WO2014053462A1 PCT/EP2013/070401 EP2013070401W WO2014053462A1 WO 2014053462 A1 WO2014053462 A1 WO 2014053462A1 EP 2013070401 W EP2013070401 W EP 2013070401W WO 2014053462 A1 WO2014053462 A1 WO 2014053462A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- insulator
- electrical
- insulating
- electrical insulator
- preferably less
- Prior art date
Links
- 239000000615 nonconductor Substances 0.000 title claims abstract description 94
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title description 10
- 239000012212 insulator Substances 0.000 claims abstract description 48
- 239000011343 solid material Substances 0.000 claims abstract description 22
- 238000010792 warming Methods 0.000 claims abstract description 12
- 239000007787 solid Substances 0.000 claims abstract description 11
- IYRWEQXVUNLMAY-UHFFFAOYSA-N fluoroketone group Chemical group FC(=O)F IYRWEQXVUNLMAY-UHFFFAOYSA-N 0.000 claims description 48
- 239000007789 gas Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 40
- 125000004432 carbon atom Chemical group C* 0.000 claims description 29
- 238000012545 processing Methods 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 15
- 238000005266 casting Methods 0.000 claims description 13
- 238000001746 injection moulding Methods 0.000 claims description 13
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 12
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 9
- 229920001774 Perfluoroether Polymers 0.000 claims description 8
- 239000001569 carbon dioxide Substances 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 230000000087 stabilizing effect Effects 0.000 claims description 4
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052756 noble gas Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000011417 postcuring Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 239000004005 microsphere Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229920001470 polyketone Polymers 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 description 36
- 125000000217 alkyl group Chemical group 0.000 description 14
- 238000009835 boiling Methods 0.000 description 11
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- GCDWNCOAODIANN-UHFFFAOYSA-N 1,1,1,2,2-pentafluoro-2-methoxyethane Chemical group COC(F)(F)C(F)(F)F GCDWNCOAODIANN-UHFFFAOYSA-N 0.000 description 7
- 125000001153 fluoro group Chemical group F* 0.000 description 7
- MWVZDOGOCGRMOE-UHFFFAOYSA-N 1,1,1-trifluoro-2-(trifluoromethoxy)ethane Chemical compound FC(F)(F)COC(F)(F)F MWVZDOGOCGRMOE-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 231100000252 nontoxic Toxicity 0.000 description 6
- 230000003000 nontoxic effect Effects 0.000 description 6
- 229920006395 saturated elastomer Polymers 0.000 description 6
- ABQIAHFCJGVSDJ-UHFFFAOYSA-N 1,1,1,3,4,4,4-heptafluoro-3-(trifluoromethyl)butan-2-one Chemical group FC(F)(F)C(=O)C(F)(C(F)(F)F)C(F)(F)F ABQIAHFCJGVSDJ-UHFFFAOYSA-N 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 239000004848 polyfunctional curative Substances 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 150000002170 ethers Chemical class 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 125000001033 ether group Chemical group 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- DMUPYMORYHFFCT-UHFFFAOYSA-N 1,2,3,3,3-pentafluoroprop-1-ene Chemical compound FC=C(F)C(F)(F)F DMUPYMORYHFFCT-UHFFFAOYSA-N 0.000 description 2
- LOUICXNAWQPGSU-UHFFFAOYSA-N 2,2,3,3-tetrafluorooxirane Chemical compound FC1(F)OC1(F)F LOUICXNAWQPGSU-UHFFFAOYSA-N 0.000 description 2
- FXRLMCRCYDHQFW-UHFFFAOYSA-N 2,3,3,3-tetrafluoropropene Chemical compound FC(=C)C(F)(F)F FXRLMCRCYDHQFW-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 235000019000 fluorine Nutrition 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- VBZWSGALLODQNC-UHFFFAOYSA-N hexafluoroacetone Chemical compound FC(F)(F)C(=O)C(F)(F)F VBZWSGALLODQNC-UHFFFAOYSA-N 0.000 description 2
- 231100000053 low toxicity Toxicity 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 238000005204 segregation Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- DMUPYMORYHFFCT-OWOJBTEDSA-N (e)-1,2,3,3,3-pentafluoroprop-1-ene Chemical compound F\C=C(\F)C(F)(F)F DMUPYMORYHFFCT-OWOJBTEDSA-N 0.000 description 1
- ZUAQTIHDWIHCSV-OWOJBTEDSA-N (e)-1,2,3,3-tetrafluoroprop-1-ene Chemical compound F\C=C(\F)C(F)F ZUAQTIHDWIHCSV-OWOJBTEDSA-N 0.000 description 1
- CDOOAUSHHFGWSA-OWOJBTEDSA-N (e)-1,3,3,3-tetrafluoroprop-1-ene Chemical compound F\C=C\C(F)(F)F CDOOAUSHHFGWSA-OWOJBTEDSA-N 0.000 description 1
- CDOOAUSHHFGWSA-UPHRSURJSA-N (z)-1,3,3,3-tetrafluoroprop-1-ene Chemical compound F\C=C/C(F)(F)F CDOOAUSHHFGWSA-UPHRSURJSA-N 0.000 description 1
- GWFGVRFAJMXXBL-UHFFFAOYSA-N 1,1,1,3,3,4,4,5,5,5-decafluoropentan-2-one Chemical compound FC(F)(F)C(=O)C(F)(F)C(F)(F)C(F)(F)F GWFGVRFAJMXXBL-UHFFFAOYSA-N 0.000 description 1
- QXKKNVWUTKFIPI-UHFFFAOYSA-N 1,1,1,3,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)pentan-2-one Chemical compound FC(F)(F)C(=O)C(F)(F)C(F)(C(F)(F)F)C(F)(F)F QXKKNVWUTKFIPI-UHFFFAOYSA-N 0.000 description 1
- ZNPTZZRIBUAVRB-UHFFFAOYSA-N 1,1,1-trifluorohexan-3-one Chemical compound CCCC(=O)CC(F)(F)F ZNPTZZRIBUAVRB-UHFFFAOYSA-N 0.000 description 1
- YBTCBNQUROAZJL-UHFFFAOYSA-N 1,1,1-trifluoropentan-3-one Chemical compound CCC(=O)CC(F)(F)F YBTCBNQUROAZJL-UHFFFAOYSA-N 0.000 description 1
- NDMMKOCNFSTXRU-UHFFFAOYSA-N 1,1,2,3,3-pentafluoroprop-1-ene Chemical compound FC(F)C(F)=C(F)F NDMMKOCNFSTXRU-UHFFFAOYSA-N 0.000 description 1
- PGJHURKAWUJHLJ-UHFFFAOYSA-N 1,1,2,3-tetrafluoroprop-1-ene Chemical compound FCC(F)=C(F)F PGJHURKAWUJHLJ-UHFFFAOYSA-N 0.000 description 1
- QAERDLQYXMEHEB-UHFFFAOYSA-N 1,1,3,3,3-pentafluoroprop-1-ene Chemical compound FC(F)=CC(F)(F)F QAERDLQYXMEHEB-UHFFFAOYSA-N 0.000 description 1
- BNYODXFAOQCIIO-UHFFFAOYSA-N 1,1,3,3-tetrafluoroprop-1-ene Chemical compound FC(F)C=C(F)F BNYODXFAOQCIIO-UHFFFAOYSA-N 0.000 description 1
- ZUAQTIHDWIHCSV-UHFFFAOYSA-N 1,2,3,3-tetrafluoroprop-1-ene Chemical compound FC=C(F)C(F)F ZUAQTIHDWIHCSV-UHFFFAOYSA-N 0.000 description 1
- CDOOAUSHHFGWSA-UHFFFAOYSA-N 1,3,3,3-tetrafluoropropene Chemical compound FC=CC(F)(F)F CDOOAUSHHFGWSA-UHFFFAOYSA-N 0.000 description 1
- YUMDTEARLZOACP-UHFFFAOYSA-N 2,2,3,3,4,4,5,5,6,6-decafluorocyclohexan-1-one Chemical compound FC1(F)C(=O)C(F)(F)C(F)(F)C(F)(F)C1(F)F YUMDTEARLZOACP-UHFFFAOYSA-N 0.000 description 1
- LKEYHSAKBVEOJQ-UHFFFAOYSA-N 6,6,6-trifluorohexan-3-one Chemical compound CCC(=O)CCC(F)(F)F LKEYHSAKBVEOJQ-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 206010007269 Carcinogenicity Diseases 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229920000784 Nomex Polymers 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 231100000260 carcinogenicity Toxicity 0.000 description 1
- 230000007670 carcinogenicity Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000001684 chronic effect Effects 0.000 description 1
- 231100000762 chronic effect Toxicity 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 231100000636 lethal dose Toxicity 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000007886 mutagenicity Effects 0.000 description 1
- 231100000299 mutagenicity Toxicity 0.000 description 1
- 239000004763 nomex Substances 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- RMLFHPWPTXWZNJ-UHFFFAOYSA-N novec 1230 Chemical compound FC(F)(F)C(F)(F)C(=O)C(F)(C(F)(F)F)C(F)(F)F RMLFHPWPTXWZNJ-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- UJMWVICAENGCRF-UHFFFAOYSA-N oxygen difluoride Chemical class FOF UJMWVICAENGCRF-UHFFFAOYSA-N 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000001850 reproductive effect Effects 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 230000002110 toxicologic effect Effects 0.000 description 1
- 231100000027 toxicology Toxicity 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 238000004046 wet winding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/421—Polyesters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/56—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
- H01B7/2813—Protection against damage caused by electrical, chemical or water tree deterioration
Definitions
- the present invention relates to an electrical insulator as well as to a method for preparing, the electrical insulator according to the preamble of the independent claims 1 and 21.
- the present invention further relates to an apparatus for the generation, the distribution and/or the usage of electrical energy, said apparatus comprising the electrical insulator, and to the use of the electrical insulator as a high-voltage insulator as well as to the use in an insulating spacer, a post type spacer, a partition insulator or base insulator, a support insulator, a suspended insulator, a bushing, a high voltage insulator, a medium voltage insulator, a low voltage insulator, a cast insulating cylinder, an insulating envelope, an insulating rod, an insulating shaft, an insulating joint, an insulating terminal, a cable insulation, and/or an insulating coating. Still further, the present invention relates to the use of an organofluorine compound as a cover gas in the processing of
- Electrical insulators are well known in the art. They are used in electrical equipment to support and separate electrical conductors without allowing current flow through the insulator itself. In particular when used for high-voltage applications, the electrical insulator can be subject to partial discharge phenomena. Partial discharge is a localised dielectric breakdown of a small portion of the electrical insulation system under high voltage stress.
- partial discharge In a solid electrical insulator, partial discharge often starts within voids or cracks formed within the body of the insulator. Because the dielectric constant of the gas contained in the void is normally considerably less than that of the surrounding solid material, the electric field in the void is significantly higher than in the solid material. If the voltage stress across the void is increased above the corona inception voltage of the gas contained therein, partial discharge will then occur. In commercial production, the casting process is made in atmospheric air and voids are filled with air, which leads to poorer dielectric strength compared to the dielectric strength of the surrounding solid insulating material.
- Protracted partial discharge can erode solid insulation and eventually lead to breakdown of the insulation. In order to prevent this, attempts to eliminate the formation of voids within the insulating material and, thus, to suppress initiation of partial discharge have been made.
- insulating materials based on epoxy resin for example, a so-called "vacuum casting” has been proposed with the aim of eliminating voids or ⁇ any other defects in them.
- a corresponding method is e.g. referred to on the website http : //www . toshiba .co.jp/sis/en/tands/insulator/index . htm .
- the object of the present invention is to provide an electrical insulator which is easy to manufacture and which at the same time shows a very low tendency for partial discharge.
- the present invention relates to an electrical insulator for an electrical apparatus, such as a transformer or switchgear, said insulator comprising a body containing an electrical insulating, solid material and non-solid inclusions dispersed within the body.
- the electrical insulator of the present invention is characterized in that at least a portion of the inclusions comprise at least one organo ' fluorine compound having a lower Global Warming Potential than SF 6 .
- the body of the electrical insulator comprises a plurality of gaseous and/or liquid inclusions.
- Each inclusion defines a separate inclusion space, i.e. a cavity or void, surrounded by the electrical insulating, solid material.
- the inclusions can be formed of a gas or liquid or both; accordingly, the inclusion spaces can independently from each other contain a gas, a liquid or both.
- the present invention allows for providing a very high dielectric strength within the inclusion space. Compared to conventional electrical insulators comprising air inclusions, the tendency of the electrical insulator for partial discharge is thus significantly reduced. Ultimately, this results in a much safer operation of the electrical apparatus compared with an apparatus provided with a conventional insulator comprising air inclusions.
- the approach of the present invention is thus completely different to the one proposed by the state of the art mentioned above which teaches voids to be eliminated. Rather, the present invention allows these voids to be present, but renders them less harmful by "filling" them with an organofluorine compound having a high dielectric strength.
- the inclusions have a dielectric strength higher than that of air, and/or the organofluorine compound has a dielectric strength higher than that of air.
- the inclusions comprise at least one component selected from the group consisting of: air, air component, carbon dioxide (CO 2 ) , oxygen (0 2 ) , nitrogen (N 2 ) , noble gas, nitric oxide, nitrogen dioxide, and mixtures thereof.
- the organofluorine compound has a lower Global Warming Potential (GWP) than S 6 .
- GWP Global Warming Potential
- the inclusions in the electrical insulator have a global warming potential GWP pver 100 years of less than 22'800, preferably less than 15*000, more preferably less than 10*000, even more preferably less than 5'000, even more preferably less than 3*000, even more preferably less than 2 ⁇ 00.
- the GWP is a relative measure of how much heat a greenhouse gas traps in the atmosphere. It compares the amount of heat trapped by a certain mass of the gas in question to the amount of heat trapped by a similar mass of carbon dioxide. A GWP is calculated over a specific time interval, commonly 20, 100 or 500 years. It is expressed as a factor of carbon dioxide (C0 2 ), whose GWP is standardized to 1. Further, the organofluorine compound used according to the present invention is generally non-toxic or has a very low toxicity level, as discussed below.
- the electrical insulator of the present invention and, more particularly, the method for producing it has no substantial impact on the environment. There is, thus, no need for intricate safety measures that would be required, when SF 6 is employed.
- the organofluorine compound has a global warming potential GWP over 100 years of ' less than 1000, preferably less than 700, more preferably less than 300, further more preferably less than 100, further more preferably less than 50, further more preferably less than 20, most preferred less than 10.
- the organofluorine compound according to the present invention generally has an Ozone Depletion Potential (ODP) of 0.
- ODP Ozone Depletion Potential
- the term "inclusion” is to be interpreted broadly and encompasses any non-solid material surrounded by the electrical insulating, solid material.
- the terms “inclusion space” is to be interpreted broadly and encompasses any separate space formed within the electrical insulating, solid material or at the interface or boundary between two different materials. In particular, it encompasses a void, which in the following is also referred to as bubble. More particularly, the term “inclusion space” encompasses bubbles which are spontaneously formed within a prepolymeric or a polymeric mass during its processing as well as bubbles of a foamed material. More particularly, the term encompasses bubbles in the submillimeter scale, i.e. having an average diameter of less than 1 millimeter, and more particularly bubbles in the microscopic scale, i.e. bubbles which are smaller than those that can easily be seen by the naked eye and which require a lens or microscope to see them clearly.
- inclusion space or “inclusion” or “bubble” also encompasses the interior of hollow bodies, e.g. microspheres, used for reducing the density of the electrical insulating solid material and in particular of a polymeric material of the electrical insulating solid material.
- an inclusion can contain both gaseous and/or liquid components and in particular can be a two-phase system
- the inclusions of the present invention generally or in embodiments are gas inclusions, meaning that every component of the inclusions is in gaseous form at operational conditions of the electrical apparatus.
- the inclusions, and in particular the gas inclusions can independently from each other comprise one single component or a mixture of components; accordingly, the inclusion spaces can independently from each other contain one single component or a mixture of components.
- the inclusions can comprise air and/or at least one air component, in particular selected from the group consisting of carbon dioxide (CO 2 ) , oxygen (0 2 ) and nitrogen (N 2 ), and/or a noble gas, and/or nitric oxide, and/or nitrogen dioxide.
- the inclusions comprising the at least one organofluorine compound further comprise O 2 , since this allows the formation of harmful decomposition products to be efficiently avoided.
- the inclusions of the electrical insulator according to the present invention generally are gas inclusions. It is thus particularly preferred that the at least one organofluorine compound is in the gaseous state at operational conditions of the electrical apparatus. Specifically, the at least one organofluorine compound can be in the gaseous state over the whole temperature range to which the electrical insulator is typically exposed; it, thus, has a boiling point higher than the lowest temperature of exposure. More preferably, every component of the inclusions is in the gaseous state at operational conditions of the electrical apparatus.
- the insulator Since there is no phase transition of the organofluorine compound occurring, and in particular no vaporisation, the insulator is not subject to any stress that might occur when there is a significant pressure increase in the inclusion spaces and that can ultimately lead to the formation of cracks.
- the organofluorine compound being in the gaseous state at operational conditions of the electrical apparatus further contributes to the high stability and breakdown resistance of the insulator.
- the present invention encompasses both embodiments, in which at least a portion of the inclusions, more particularly the gas inclusions, comprise further components apart from the organofluorine compound, as well as embodiments in which at least a portion of the inclusions, more particularly the gas inclusions, essentially consists of the organofluorine compound.
- Embodiments of the method relate to performing the processing in the presence of a cover gas comprising the at least one organofluorine compound.
- the processing of the prepolymeric or polymeric mass comprises the method elements of: (i) forming voids, which comprise the organofluorine compound, in the prepolymeric or polymeric mass, and (ii) stabilizing the voids such that an amount of the organofluorine compound is comprised in the voids and forms inclusions of the electrical insulator.
- the electrical insulating, solid material is a polymeric material.
- the polymeric material is selected from the group of silicones, acrylic resins, polystyrenes, polyurethanes , polyimides, polyamides, polyesters, polyolefins, polyethers, polyketones, polysulfones and epoxy polymers, as well as mixtures thereof.
- Particularly preferred are silicones, acrylic resins, polystyrenes, polyurethanes, polyesters and/or epoxy polymers. Since these materials can be prone to oxidative degradation when air inclusions are contained, the presence of an organofluorine compound having a low oxidation potential is of particular interest in these embodiments.
- this spontaneous bubble formation allows preparing the electrical insulator in a very straightforward manner by simply performing the processing in the presence of the organofluorine compound, thereby "filling" the bubbles with the organofluorine compound.
- At least some of the inclusions each define a separate bubble, the size of which being in the submillimeter scale, more particularly in the microscopic scale.
- said bubble has an average diameter in the range from 10 ⁇ (micrometer) to 500 ⁇ , preferably from 50 ⁇ to 300 ym, more preferably from 100 ]i to 200 ⁇ .
- bubbles having a larger diameter, in particular of up to 2 mm, can also be present.
- the body of the electrical insulator has a density higher than 120 kg/m 3 , preferably higher than 150 kg/m 3 , more preferably higher than 170 kg/m 3 , and most preferably higher than 220 kg/m 3 .
- the density is thus higher than e.g. the one of an insulating foam to be used in a cable, particularly of the low loss foam disclosed in US 2004/0220287.
- the at least one organofluorine compound is selected from the group consisting of fluoroethers , in particular hydrofluoromonoethers , fluoroketones and fluoroolefins, in particular hydrofluoro- olefins, and mixtures thereof.
- fluoroethers in particular hydrofluoromonoethers , fluoroketones and fluoroolefins, in particular hydrofluoro- olefins, and mixtures thereof.
- the invention encompasses both embodiments in which the organofluorine compound comprises either one of a fluoroether, in particular a hydrofluoromonoether, a fluoroketone and a fluoroolefin , in particular a hydrofluoroolefin, as well as embodiments in which the organofluorine compound comprises a mixture of at least two of these compounds.
- fluoroether as used in the context of the present invention encompasses both perfluoroethers, i.e. fully fluorinated ethers, and hydrofluoroethers , i.e. ethers that are only partially fluorinated.
- the term further encompasses saturated compounds as well as unsaturated compounds, i.e. compounds including double and/or triple bonds.
- the at least partially fluorinated alkyl chains attached to the oxygen atom of the fluoroether can be linear or branched.
- fluoroethers encompasses both non-cyclic and cyclic ethers.
- the two alkyl chains attached to the oxygen atom can optionally form a ring.
- the term encompasses fluorooxiranes .
- the organofluorine compound according to the present invention is a perfluorooxirane or a hydrofluorooxirane, more specifically a perfluorooxirane or hydrofluorooxirane comprising from three to fifteen carbon atoms.
- At least a portion of the inclusions comprises a hydrofluoromonoether containing at least three carbon atoms.
- hydrofluoro- monoethers are chemically and thermally stable to temperatures above 140°C. They are further non-toxic or have a low toxicity level. In addition, they are non-corrosive and non-explosive.
- hydrofluoromonoether refers to a compound having one and only one ether group, said ether group linking two alkyl groups, which can be, independently from each other, linear or branched, and which can optionally form a ring.
- the compound is thus in clear contrast to the compounds disclosed in, e.g., US-B-7128133, relating to the use of compounds containing two ether groups, i.e. hydrofluoro- diethers, in heat-transfer fluids.
- hydrofluoromonoether as used herein is further to be understood such that the monoether is partially hydrogenated and partially fluorinated. It is further to be understood such that it may comprise a mixture of differently structured hydrofluoromonoethers .
- the term "structurally different” shall broadly encompass any difference in sum formula or structural formula of the hydrofluoromonoether .
- hydrofluoromonoethers containing at least three carbon atoms have been found to have a relatively high dielectric strength.
- the ratio of the dielectric strength of the hydrofluoromonoethers according to the present invention to the dielectric strength of SF 6 is greater than about 0.4.
- the GWP of the hydrofluoromonoethers is low.
- the GWP is less than l'OOO over 100 years, more specifically less than 700 over 100 years.
- hydrofluoromonoethers mentioned have a relatively low atmospheric lifetime and in addition are devoid of halogen atoms that' play a role in the ozone destruction catalytic cycle, namely CI, Br or I. Their ODP is zero, which is very favourable from an environmental perspective.
- hydrofluoromonoether containing at least three carbon atoms and thus having a relatively high boiling point of more than -20°C is based on the finding that a higher boiling point of the hydrofluoromonoether generally goes along with a higher dielectric strength.
- the hydrofluoromonoether contains exactly three or four or five or six carbon atoms, in particular exactly three or four carbon atoms, most . preferably exactly three carbon atoms. More particularly, the hydrofluoromonoether is thus at least one compound selected from the group consisting of the compounds defined by the following structural formulae in which a part of the hydrogen atoms is substituted by a fluorine atom:
- the ratio of the number of fluorine atoms to the number of carbon atoms can range from 1.5:1 to 2:1.
- Such compounds generally have a GWP of less than l'OOO over 100 years, and are thus very environment-friendly.
- the hydrofluoro- monoether can have a GWP of less than 700 over 100 years.
- At least a portion of the inclusions comprises a hydrofluoromonoether having the general structure (O)
- exactly one of c and f in the general structure (0) is 0.
- the corresponding grouping of fluorines on one side of the ether linkage, with the other side remaining unsubstituted, is called "segregation". Segregation has been found to reduce the boiling point compared to unsegregated compounds of the same chain length. This feature is thus of particular interest, because compounds with longer chain lengths allowing for higher dielectric strength can be used without risk of liquefaction under operational conditions.
- the hydrofluoromonoether is selected from the group consisting of pentafluoro-ethyl-methyl ether (CH 3 -0- CF 2 CF 3 ) and 2 , 2 , 2-trifluoroethyl-trifluoromethyl ether
- Pentafluoro-ethyl-methyl ether has a boiling point of +5.25°C and a GWP of 697 over 100 years, the F-rate being 0.625; while 2 , 2 , 2-trifluoroethyl-trifluoromethyl ether has a boiling point of +11°C and a GWP of 487 over 100 years, the F-rate being 0.75. They both have an ODP of 0 and are thus environmentally fully acceptable.
- pentafluoro-ethyl-methyl ether has been found to be thermally stable at a temperature of 175°C for 30 days and therefore to be fully suitable for the operational conditions given in an electrical insulator. Since thermal stability studies of hydrofluoromonoethers of higher molecular weight have shown that the stability of ethers containing fully hydrogenated methyl or ethyl groups have a lower thermal stability compared to those having partially hydrogenated groups, it can be assumed that the thermal stability of 2,2,2- trifluoroethyl-trifluoromethyl ether is even higher.
- hydrofluoromonoethers and in particular pentafluoro-ethyl-methyl ether as well as 2 , 2 , 2-trifluoroethyl- trifluoromethyl ether, have a lethal concentration LC 50 of higher than 10' 000 ppm, rendering them suitable also from a toxicological point of view.
- hydrofluoromonoethers have a higher dielectric strength than air.
- pentafluoro-ethyl-methyl ether has a dielectric strength about 2.4 times higher than air at 1 bar.
- hydrofluoromonoethers particularly pentafluoro-ethyl-methyl ether and 2 , 2 , 2-trifluoroethyl-trifluoromethyl ether, respectively, are normally in the gaseous state at operational conditions.
- inclusions inside which every component is in the gaseous state at operational conditions of the electrical apparatus can be achieved, which is preferred, as mentioned.
- At least a portion of the inclusions comprises a fluoroketone containing from four to twelve carbon atoms.
- fluoroketone as used in this application shall be interpreted broadly and shall encompass both perfluoroketones and hydrofluoroketones , and shall further encompass both saturated compounds and unsaturated compounds, i.e. compounds including double and/or triple bonds.
- the at least partially fluorinated alkyl chain of the fluoroketones can be linear or branched.
- the fluoroketone is a perfluoroketone .
- the fluoroketone has a branched alkyl chain, in particular an at least partially fluorinated alkyl chain.
- the fluoroketone is a fully saturated compound.
- the fluoroketone is at least one compound selected from the group consisting of the compounds defined by the following structural formulae in which at least one hydrogen atom is substituted with a fluorine atom:
- Fluoroketones containing five or more carbon atoms are further advantageous, because they are generally non-toxic with outstanding margins for human safety. This is in contrast to fluoroketones having less than four carbon atoms, such as hexafluoroacetone (or hexafluoropropanone) , which are toxic and very reactive.
- fluoroketones containing exactly five carbon atoms herein briefly named fluoroketones a)
- fluoroketones containing exactly six carbon atoms are thermally stable up to 500 °C.
- the fluoroketones in particular fluoroketones a) , having a branched alkyl chain are advantageous, because their boiling points are lower than the boiling points of the corresponding compounds (i.e. compounds with same molecular formula) having a straight alkyl chain.
- the fluoroketone a) is a perfluoroketone , in particular has the molecular formula C5F10O, i.e. is fully saturated without double or triple bonds.
- the fluoroketone a) may more preferably be selected from the group consisting of 1, 1, 1, 3, 4, 4, -heptafluoro-3- (trifluoromethyl ) butan-2-one (also named decafluoro-2-methylbutan-3-one ) , 1,1,1,3,3,4,4,5,5, 5-decafluoropentan-2-one ,
- C5-ketone 1,1,1,3,4,4, 4-heptafluoro-3- (trifluoromethyl) butan-2-one, here briefly called "C5-ketone", with molecular formula CF 3 C (0) CF (C ' F 3 ) 2 or C 5 F 10 O, has been found to be particularly preferred for high and medium voltage insulation applications, because it has the advantages of high dielectric insulation performance, in particular in mixtures w ' ith a dielectric carrier gas, has very low GWP and has a low boiling point. It has an ODP of 0 and is practically non-toxic.
- a fluoroketone containing exactly five carbon atoms as described above and here briefly called fluoroketone a
- fluoroketone c a fluoroketone containing exactly six carbon atoms or exactly seven carbon atoms
- an insulation medium can be achieved having more than one fluoroketone, each contributing by itself to the dielectric strength of the inclusion.
- the further fluoroketone c) is at least one compound selected from the group consisting of the compounds defined by the following structural formulae in which at least one hydrogen atom is substituted with a fluorine atom:
- any fluoroketone having exactly 6 carbon atoms in which the at least partially fluorinated alkyl chain of the fluoroketone forms a ring, which is substituted by one or more alkyl groups (Ilh); and/or is at least one compound selected from the group consisting of the compounds defined by the following structural formulae in which at least one hydrogen atom is substituted with a fluorine atom:
- the present invention encompasses, in particular, each combination of any of the compounds according to structural formulae la to Id with any of the compounds according to structural formulae Ila to Ilg and/or Ilia to Illn.
- the present invention encompasses each compound or each combination of compounds selected from the group consisting of the compounds according to structural formulae (la) to (Ii), (Ila) to (Ilh) , (Ilia) to (IIIo), and mixtures thereof.
- fluoroketone c) a fluoroketone containing exactly six carbon atoms (falling under the designation “fluoroketone c) " mentioned above) may be preferred; such a fluoroketone is non-toxic, with outstanding margins for human safety.
- fluoroketone c) alike fluoroketon a) , is a perfluoroketone, and/or has a branched alkyl chain, in particular an at least partially fluorinated alkyl chain, and/or the fluoroketone c) contains fully saturated compounds.
- the fluoroketone c) has the molecular formula C 6 Fi 2 0, i.e. is fully saturated without double or triple bonds. More preferably, the fluoroketone c) can be selected from the group consisting of 1 , 1 , 1 , 2 , 4 , , 5 , 5 , 5-nonafluoro-2-
- the organofluorine compound can also be a fluoroolefin, in particular a hydrofluoroolefin . More particularly, the fluoroolefin or hydrofluorolefin, respectively, contains exactly three carbon atoms.
- the hydrofluoroolefin is thus selected from the group consisting of: 1, 1, 1, 2-tetrafluoropropene (HFO-1234yf ) , 1,2,3,3- tetrafluoro-2-propene (HFO-1234yc) , 1, 1, 3, 3-tetrafluoro-2- propene (HFO-1234zc) , 1, 1, 1, 1, 3-tetrafluoro-2-propene (HFO- 1234ze), 1, 1, 2, 3-tetrafluoro-2-propene (HFO-1234ye) , 1,1,1,2,3- pentafluoropropene (HFO-1225ye) , 1 , 1 , 2 , 3 , 3-pentafluoropropene (HFO-1225yc) , 1 , 1 , 1 , 3 , 3-pentafluoropropene (HFO-1225zc) ,
- the present invention further relates to a method for preparing an electrical insulator in particular as described above, said method comprising the step of processing a prepolymeric or polymeric mass before its solidification to the electrical insulating, solid material, whereby the processing is performed in the presence of at least one organofluorine compound having a lower Global Warming Potential (GWP) than SF 6 .
- GWP Global Warming Potential
- processing a prepolymeric or polymeric mass before its solidification is to be understood broadly and, in particular, shall encompass the processing of a thermosetting prepolymeric mass, more particularly the curing of a reaction resin to the polymeric material, as well as the processing of a thermoplastic polymeric material in melted form.
- the term "performed in the presence of at least one organofluorine compound” is also to be understood broadly and in particular encompasses embodiments in which the at least one organoflourine compound is only temporarily present during the processing of the prepolymeric or polymeric mass, and, thus, not necessarily during the entire processing.
- the method of the present invention includes the step of processing the prepolymeric or polymeric mass in the presence of a cover gas comprising or at least essentially consisting of the at least one organofluorine compound.
- prepolymeric mass thereby includes both a mass comprising the precursor resin without further components as well as the reaction resin comprising the precursor resin and further components, particularly a hardener.
- cover gas as used in the context of the present invention shall be interpreted broadly as a gas which is in contact with the mass during its processing and which at least partially shields the mass from coming into contact with other gases .
- the partial pressure of the cover gas is typically chosen as high as possible in order to achieve a particularly high resistance of the electrical insulator to dielectric breakdown.
- the processing of the mass comprises casting it into a desired shape, preferably by injection molding.
- Casting of a thermosetting prepolymeric mass by injection molding generally includes the steps or method elements of:
- step a) can, for example, include, apart from the precursor resin, a hardener, a flexibilizer., an accelerator, a filler and/or a dye.
- Step a) can, for example, include separate pre-drying of at least the precursor resin and the hardener in a vacuum pre-mixer.
- the casting of the prepolymeric mass by injection molding comprises the method elements of: (i) forming voids, which comprise the organofluorine compound, in the prepolymeric mass during any of the steps d) to f) , and (ii) stabilizing the voids during Curing (possibly including post- curing) , in particular during the Curing in step f), such that an amount of the organofluorine compound is comprised in the voids and forms inclusions of the electrical insulator.
- a filler is included, it is also preferably pre-dried before being introduced.
- Any filler known to the skilled person as suitable for the respective purpose can be used.
- the filler is selected from the group consisting of metal oxides, Si0 2 , ⁇ 1 2 0 3 or ATH (Aluminum Trihydroxide) , carbonates, mica, talc, clays, glass fibers, and mixtures thereof.
- the precursor resin is an epoxy resin.
- the cavity of the mold can comprise at least one component, more particularly an electrical component, to be integrally casted.
- Preheating of the mold - optionally comprising the (electrical) component - according to step b) can, for example, be carried out at a temperature ranging from about 60°C to about 110°C.
- the process can further comprise the optional step of at least partially evacuating the cavity of the mold.
- Evacuation can, for example, be performed down to a pressure of less than about 30 mbar, preferably in the range of about 0.1 mbar to about 3 mbar.
- the method can further comprise the optional step of post-curing the polymeric material, for example at a temperature selected in a range from 120 °C to 160 °C and in particular at a temperature of about 140°C.
- the method of the present invention can also encompass automatic pressure gelation processes.
- the method of the present invention can also encompass embodiments, in which a strand or foil with the prepolymeric or polymeric mass applied thereon is wound.
- the concept of the present invention is particularly useful for these embodiments, since these embodiments are particularly prone to the formation of voids, especially at the interface between two radial layers and/or between alternating material components.
- the present invention relates to a method in which a foil conductor with the prepolmyeric or polymeric mass applied thereon is wound in a radial direction, one on top of the other, to result in a disc winding in which a layer of insulating material is disposed between each layer or turn of the conductor.
- the insulating material may be comprised of a polyimide film, such as is sold under the trademark Nomex®; a polyamide film, such as is sold under the trademark Kapton®; or a polyester film, such as is sold under the trademark Mylar®.
- the organofluorine compound used for the method of the present invention can correspond to the ones mentioned above for the electrical insulator.
- the present invention further relates - according to a further aspect - to the use of the electrical insulator in a high-voltage or medium-voltage electrical apparatus, as thereby the advantages of the present invention are of particular relevance . More particularly, the present invention relates to the use of the electrical insulator in an insulating spacer, a post type spacer, a cast insulating cylinder, in particular an insulating cylinder for a condenser, an insulating envelope, a partition insulator or base insulator, an insulating rod, an insulating shaft e.g.
- GIS gas-insulated switchgear
- a bushing for movement transmission in a gas-insulated switchgear (GIS) , a bushing, an insulating joint, an insulating terminal, a cable insulation, and/or an insulating coating, in particular an insulating coating of an inner conductor.
- GIS gas-insulated switchgear
- further fields of applications of the electrical insulator according to the present invention include its use in a voltage transformer, a current transformer, a cable distribution head and a ground electrode, for example.
- the present invention thus also relates to an electrical insulator as described above, said insulator forming or being part of: an insulating spacer, a post type spacer, a partition insulator or base insulator, a support insulator, a suspended insulator, a bushing, a high voltage insulator, a medium voltage insulator, a low voltage insulator, a cast insulating cylinder, an insulating envelope, an insulating rod, an insulating shaft, an insulating joint, an insulating terminal, a cable insulation, and/or an insulating coating.
- the present invention also relates to an apparatus for the generation, the distribution and/or the usage of electrical energy, said apparatus comprising an electrical insulator as described herein.
- the apparatus is part of or is a: high voltage apparatus, medium voltage apparatus, low voltage apparatus, direct-current apparatus, switchgear, air-insulated switchgear, part or component of air ⁇ insulated switchgear, gas-insulated metal-encapsulated switchgear (GIS) , part or component of gas- insulated metal-encapsulated switchgear, air-insulated transmission line, gas-insulated transmission line (GIL) , bus bar, bushing, air-insulated insulator, gas-insulated metal- encapsulated insulator, cable, gas-insulated cable, cable joint, current transformer, voltage transformer, sensors, surge arrester, capacitor, inductance, resistor, current limiter, high voltage switch, earthing switch, disconnector, load-break switch, circuit breaker, gas circuit breaker, vacuum circuit breaker, generator circuit breaker, medium Voltage switch, ring main unit, recloser, sectionalizer, low voltage switch, transformer, distribution transformer, power transformer, tap changer, transformer bushing, electrical rotating machine, generator, motor, drive, semiconducting device, power
- the present invention further relates to the use of an organofluorine compound as a cover gas in the processing of .
- a prepolymeric or polymeric mass in particular for providing an electrical insulating, solid material for an electrical insulator, as mentioned herein.
- Fig. 1 shows purely schematically a cross-sectional view of an electrical insulator according to the present invention arranged between two electrodes;
- Fig. 2 shows the layout of a facility for producing an electrical insulator according to the present invention by injection molding
- FIG. 3 shows purely schematically a cross-sectional view of a mold to be used for the production of an electrical insulator according to the present invention by injection molding, together with an electrical component to be integrally cast;
- Fig. 4 shows purely schematically an electrical insulator according to the present invention obtainable by an injection molding process using the mold according to Fig. 3;
- Fig. 5a shows a photograph of an electrical insulator for insulating the space between two electrodes
- Fig. 5b shows a drawing of the electrical insulator of the photograph according to Fig. 5a.
- Fig. 6 shows an X-ray photograph of another electrical insulator produced according to the present invention.
- the electrical insulator 2 shown in Fig. 1 is sandwiched between two electrodes 10a, 10b and comprises a body 4 containing an electrical insulating, solid material 6 and non- solid inclusions 8 dispersed within the body 4.
- the inclusion 8 defines an inclusion space 9 and comprises inside at least one organofluorine compound having a lower Global Warming Potential than SF 6 .
- the inclusions in the electrical insulator ⁇ have a Global Warming Potential (GWP over 100 years) of less than 22 ' 800, preferably less than 15 '000, more preferably less than 10 '000, even more preferably less than 5 '000, even more preferably less than 3' 000, even more preferably less than 2' 000, even more preferably less than l'OOO, even more preferably less than 700, even more preferably less than 300, even more preferably less than 100, even more preferably less than 50, even more preferably less than 20, most preferred less than 10.
- GWP over 100 years of less than 22 ' 800, preferably less than 15 '000, more preferably less than 10 '000, even more preferably less than 5 '000, even more preferably less than 3' 000, even more preferably less than 2' 000, even more preferably less than l'OOO, even more preferably less than 700, even more preferably less than 300, even more preferably less than 100, even more preferably less than 50, even more preferably less
- the electrical insulator 2 can e.g. be prepared by injection molding, a layout of a corresponding facility being shown in Fig. 2.
- the facility in Fig. 2 includes a mold 12 comprising two mold parts 14a, 14b each being connected to a platen 16a, 16b and moveable with respect to each other. In the clamped position shown in Fig. 2, the mold parts 14a, 14b define a mold cavity 18.
- the prepolymeric or polymeric mass 20 to be molded is stored in a pressure vessel 22, the wall 24 of which being provided with a fitting 26 to be connected to a gas inlet pipe (not shown) for charging a cover gas comprising an organofluorine compound and thereby pressurizing the interior 28 of the pressure vessel 22.
- the mass 20 Upon pressurization, the mass 20 is pumped through an ascending pipe 30 into a pressure pipe 32 which opens out into the interior 36 of a barrel 34.
- Said barrel 34 comprises a nozzle 38 which is connectable to the mold 12 and through which the mass 20 can be forced by means of a piston 40 via an injection channel 41 into the mold cavity 18.
- the mold cavity 18 is charged with a cover gas comprising an organofluorine compound.
- the mold 12 comprises a ventilation channel 42 which is connected to a respective gas inlet pipe (not shown) . Both the gas inlet pipe connected to the fitting 26 of the pressure vessel 22 as well as the gas inlet pipe connected to the ventilation channel 42 of the mold 12 are fed by a pressure tank (not shown) filled with the cover gas comprising the organofluorine compound.
- the mold 12 can further be conntected to an evacuation pump for evacuating the mold cavity 18 prior to the charging with the cover gas (not shown) .
- Fig. 3 relates to the integral casting of an electrical component 44 and specifically shows a mold 12' comprising two mold parts 14a', 14b' ⁇ defining a mold cavity 18' having a circular cross-section with the electrical component 44 being arranged in the centre of the mold cavity 18' .
- the mold 12' further comprises an injection channel 41' opening into the mold cavity 18' and a ventilation channel 42' .
- the ventilation channel 42' is connected to a gas inlet pipe 46 which itself is fed with cover gas comprising an organofluorine compound (as disclosed herein) from a cover-gas-containing tank 48 by means of a pump 50.
- the electrical insulator 2' obtainable by an injection molding process using the mold 12' shown in Fig. 3 is given in Fig. 4.
- the injection molding process voids or bubbles are formed spontaneously within the prepolymeric mass resulting in the inclusions 8' present within the body 4' of the electrical insulator 2' .
- the cover gas used for the processing comprises an organofluorine compound
- the inclusions 8' comprises the organofluorine compound.
- the disclosed electrical insulator and its corresponding method for preparing or producing the electrical insulator encompass any production method or production device in which the cover gas containing an organofluorine compound is present and can be incorporated into the thus prepared insulator.
- any preparing method which includes casting, wet winding, UV-cured casting, injection molding, or extrusion, e.g. of thermoplasts , or similar processes.
- the vacuum oven was evacuated, then the connection with the first autoclave was opened letting the gas flow into the oven and equilibrate, such that a final pressure of 1 bar was achieved.
- connection with the second autoclave was opened and the prepolymeric mass was transferred into the mold until the casting was completed.
- the oven temperature was then set to 100 °C and, after 30 minutes, the temperature was raised to 130°C in order to cure the mass. After 6 hours of curing, a cured body for use in an electrical insulator 2 was obtained.
- the body 4 of the thus produced electrical insulator 2 contains inclusions 8 dispersed within the body 4, said ' inclusions 8 comprising 1,1,1,3,4,4, -heptafluoro-3- (trifluoromcthyl) butan- 2-one and N2.
- Such a body 4 formed according to the process of the present invention is shown in the above-mentioned figures 5a, 5b and 6.
- Fig. 5a relates to a photograph of the electrical insulator 2 for insulating the space between two rods or rod-like electrodes 10a, 10b, wherein said insulator 2 is prepared according to the above-disclosed execution example.
- Fig. 5b relates to a corresponding schematic drawing of the electrical insulator 2 shown by the photograph of Fig. 5a.
- Fig. 6 relates to an X-ray photograph of another electrical insulator 2 according to the present invention which is also based on cast epoxy polymer, and in particular which is also produced according to the production method disclosed herein.
- the body of the electrical insulator 2 contains the electrical insulating, solid material 6, in the specific case an epoxy polymer, and non-solid inclusions 8 dispersed within the body 4, in the specific case inclusions containing the cover gas mixture of 1,1,1,3,4,4, 4-heptafluoro-3- (trifluoromethyl ) butan-2-one (C5- fluoroketone ) and nitrogen gas N 2 .
- inclusions 8 are likewise shown in Fig. 6. Particularly, five inclusions 8 are shown and have diameters between 0.5 mm and 1.2 mm. Again, the inclusions 8 were formed under application of the cover gas mixture of 1,1,1,3,4,4,4- heptafluoro-3- ( trifluoromethyl ) butan-2-one (C5-fluoroketone) and nitrogen gas 3 ⁇ 4 and likewise contain such a gas mixture.
- the electrical insulator 2, 2' Compared to conventional electrical insulators comprising air inclusions, the electrical insulator 2, 2' according to the present disclosure show a reduced or strongly reduced tendency for partial discharge, which ultimately results in a very safe operation of any electrical apparatus comprising such an electric insulator 2, 2' .
- the invention is not limited to the shown execution examples or embodiments.
- the processing conditions such as the type of organofluorine compound, the type of polymeric casting material, the pressure- of the cover gas to be applied over the mold, etc. can largely vary from the conditions mentioned in the execution examples.
- Such exemplary processing conditions are given solely for the purpose to allow easy reworking of exemplary embodiments of the invention.
- the scope of the appended claims is meant to be broad and to cover all variants and embodiments as claimed and as disclosed herein.
- prepolymeric or polymeric mass to be molded pressure vessel
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Insulating Materials (AREA)
Abstract
The present invention relates to an electrical insulator (2, 2') for an electrical apparatus, said insulator (2, 2') comprising a body (4, 4') containing an electrical insulating solid material (6) and non-solid inclusions (8) dispersed within the body (4, 4'). According to the invention, at least a portion of the inclusions (8) comprise at least one organofluorine compound having a lower Global Warming Potential than SF6.
Description
ELECTRICAL INSULATOR COMPRISING AN ORGANOFLUORINE COMPOUND AND
METHOD FOR PRODUCING IT
The present invention relates to an electrical insulator as well as to a method for preparing, the electrical insulator according to the preamble of the independent claims 1 and 21. The present invention further relates to an apparatus for the generation, the distribution and/or the usage of electrical energy, said apparatus comprising the electrical insulator, and to the use of the electrical insulator as a high-voltage insulator as well as to the use in an insulating spacer, a post type spacer, a partition insulator or base insulator, a support insulator, a suspended insulator, a bushing, a high voltage insulator, a medium voltage insulator, a low voltage insulator, a cast insulating cylinder, an insulating envelope, an insulating rod, an insulating shaft, an insulating joint, an insulating terminal, a cable insulation, and/or an insulating coating. Still further, the present invention relates to the use of an organofluorine compound as a cover gas in the processing of a prepolymeric or polymeric mass, in particular for providing an electrical insulating, solid material for an electrical insulator.
Electrical insulators are well known in the art. They are used in electrical equipment to support and separate electrical conductors without allowing current flow through the insulator itself. In particular when used for high-voltage applications, the electrical insulator can be subject to partial discharge phenomena. Partial discharge is a localised dielectric breakdown of a small portion of the electrical insulation system under high voltage stress.
In a solid electrical insulator, partial discharge often starts within voids or cracks formed within the body of the insulator. Because the dielectric constant of the gas contained in the
void is normally considerably less than that of the surrounding solid material, the electric field in the void is significantly higher than in the solid material. If the voltage stress across the void is increased above the corona inception voltage of the gas contained therein, partial discharge will then occur. In commercial production, the casting process is made in atmospheric air and voids are filled with air, which leads to poorer dielectric strength compared to the dielectric strength of the surrounding solid insulating material.
Protracted partial discharge can erode solid insulation and eventually lead to breakdown of the insulation. In order to prevent this, attempts to eliminate the formation of voids within the insulating material and, thus, to suppress initiation of partial discharge have been made.
With regard to insulating materials based on epoxy resin, for example, a so-called "vacuum casting" has been proposed with the aim of eliminating voids or■ any other defects in them. A corresponding method is e.g. referred to on the website http : //www . toshiba .co.jp/sis/en/tands/insulator/index . htm .
Methods for eliminating voids in a polymeric material such as an epoxy resin are, however, relatively complex and require sophisticated facilities. This is particularly the case for a large scale production, since thereby relatively large reactor spaces need to be evacuated.
In consideration of this drawback, the object of the present invention is to provide an electrical insulator which is easy to manufacture and which at the same time shows a very low tendency for partial discharge.
The object of the present invention is solved by the subject matter of the independent claims. Preferred embodiments are defined in the dependent claims.
Specifically, the present invention relates to an electrical insulator for an electrical apparatus, such as a transformer or switchgear, said insulator comprising a body containing an electrical insulating, solid material and non-solid inclusions dispersed within the body. The electrical insulator of the present invention is characterized in that at least a portion of the inclusions comprise at least one organo'fluorine compound having a lower Global Warming Potential than SF6.
Thus, the body of the electrical insulator comprises a plurality of gaseous and/or liquid inclusions. Each inclusion defines a separate inclusion space, i.e. a cavity or void, surrounded by the electrical insulating, solid material. As mentioned, the inclusions can be formed of a gas or liquid or both; accordingly, the inclusion spaces can independently from each other contain a gas, a liquid or both.
Due to at least a portion of the inclusions containing an organofluorine compound, the present invention allows for providing a very high dielectric strength within the inclusion space. Compared to conventional electrical insulators comprising air inclusions, the tendency of the electrical insulator for partial discharge is thus significantly reduced. Ultimately, this results in a much safer operation of the electrical apparatus compared with an apparatus provided with a conventional insulator comprising air inclusions.
The approach of the present invention is thus completely different to the one proposed by the state of the art mentioned above which teaches voids to be eliminated. Rather, the present invention allows these voids to be present, but renders them less harmful by "filling" them with an organofluorine compound having a high dielectric strength. In embodiments, the inclusions have a dielectric strength higher than that of air, and/or the organofluorine compound has a dielectric strength higher than that of air.
In embodiments, the inclusions comprise at least one component selected from the group consisting of: air, air component, carbon dioxide (CO2) , oxygen (02) , nitrogen (N2) , noble gas, nitric oxide, nitrogen dioxide, and mixtures thereof.
According to the present invention, the organofluorine compound has a lower Global Warming Potential (GWP) than S 6. In embodiments, the inclusions in the electrical insulator have a global warming potential GWP pver 100 years of less than 22'800, preferably less than 15*000, more preferably less than 10*000, even more preferably less than 5'000, even more preferably less than 3*000, even more preferably less than 2Ό00.
The GWP is a relative measure of how much heat a greenhouse gas traps in the atmosphere. It compares the amount of heat trapped by a certain mass of the gas in question to the amount of heat trapped by a similar mass of carbon dioxide. A GWP is calculated over a specific time interval, commonly 20, 100 or 500 years. It is expressed as a factor of carbon dioxide (C02), whose GWP is standardized to 1. Further, the organofluorine compound used according to the present invention is generally non-toxic or has a very low toxicity level, as discussed below.
Given the fact that the organofluorine compound has a GWP lower than SF6, the electrical insulator of the present invention and, more particularly, the method for producing it has no substantial impact on the environment. There is, thus, no need for intricate safety measures that would be required, when SF6 is employed.
In a specific embodiment of the present invention, the organofluorine compound has a global warming potential GWP over 100 years of' less than 1000, preferably less than 700, more preferably less than 300, further more preferably less than 100, further more preferably less than 50, further more preferably less than 20, most preferred less than 10.
Regarding the environmental aspect, the organofluorine compound according to the present invention generally has an Ozone Depletion Potential (ODP) of 0.
In the context of the present invention, the term "inclusion" is to be interpreted broadly and encompasses any non-solid material surrounded by the electrical insulating, solid material. Likewise, the terms "inclusion space" is to be interpreted broadly and encompasses any separate space formed within the electrical insulating, solid material or at the interface or boundary between two different materials. In particular, it encompasses a void, which in the following is also referred to as bubble. More particularly, the term "inclusion space" encompasses bubbles which are spontaneously formed within a prepolymeric or a polymeric mass during its processing as well as bubbles of a foamed material. More particularly, the term encompasses bubbles in the submillimeter scale, i.e. having an average diameter of less than 1 millimeter, and more particularly bubbles in the microscopic scale, i.e. bubbles which are smaller than those that can easily be seen by the naked eye and which require a lens or microscope to see them clearly.
Specifically, the term "inclusion space" or "inclusion" or "bubble" also encompasses the interior of hollow bodies, e.g. microspheres, used for reducing the density of the electrical insulating solid material and in particular of a polymeric material of the electrical insulating solid material.
Although an inclusion can contain both gaseous and/or liquid components and in particular can be a two-phase system, the inclusions of the present invention generally or in embodiments are gas inclusions, meaning that every component of the inclusions is in gaseous form at operational conditions of the electrical apparatus.
Furthermore, the inclusions, and in particular the gas inclusions, can independently from each other comprise one single component or a mixture of components; accordingly, the inclusion spaces can independently from each other contain one single component or a mixture of components.
In particular, the inclusions can comprise air and/or at least one air component, in particular selected from the group consisting of carbon dioxide (CO2) , oxygen (02) and nitrogen (N2), and/or a noble gas, and/or nitric oxide, and/or nitrogen dioxide. According to a particularly preferred embodiment, the inclusions comprising the at least one organofluorine compound further comprise O2, since this allows the formation of harmful decomposition products to be efficiently avoided.
As mentioned, the inclusions of the electrical insulator according to the present invention generally are gas inclusions. It is thus particularly preferred that the at least one organofluorine compound is in the gaseous state at operational conditions of the electrical apparatus. Specifically, the at least one organofluorine compound can be in the gaseous state over the whole temperature range to which the electrical insulator is typically exposed; it, thus, has a boiling point higher than the lowest temperature of exposure. More preferably, every component of the inclusions is in the gaseous state at operational conditions of the electrical apparatus. Since there is no phase transition of the organofluorine compound occurring, and in particular no vaporisation, the insulator is not subject to any stress that might occur when there is a significant pressure increase in the inclusion spaces and that can ultimately lead to the formation of cracks. Thus, the organofluorine compound being in the gaseous state at operational conditions of the electrical apparatus further contributes to the high stability and breakdown resistance of the insulator.
As mentioned herein, the present invention encompasses both embodiments, in which at least a portion of the inclusions, more particularly the gas inclusions, comprise further components apart from the organofluorine compound, as well as embodiments in which at least a portion of the inclusions, more particularly the gas inclusions, essentially consists of the organofluorine compound.
Embodiments of the method relate to performing the processing in the presence of a cover gas comprising the at least one organofluorine compound.
In embodiments, the processing of the prepolymeric or polymeric mass comprises the method elements of: (i) forming voids, which comprise the organofluorine compound, in the prepolymeric or polymeric mass, and (ii) stabilizing the voids such that an amount of the organofluorine compound is comprised in the voids and forms inclusions of the electrical insulator.
In general, the electrical insulating, solid material is a polymeric material. According to a more particular embodiment, the polymeric material is selected from the group of silicones, acrylic resins, polystyrenes, polyurethanes , polyimides, polyamides, polyesters, polyolefins, polyethers, polyketones, polysulfones and epoxy polymers, as well as mixtures thereof. Particularly preferred are silicones, acrylic resins, polystyrenes, polyurethanes, polyesters and/or epoxy polymers. Since these materials can be prone to oxidative degradation when air inclusions are contained, the presence of an organofluorine compound having a low oxidation potential is of particular interest in these embodiments.
As mentioned, the processing of a polymeric or prepolymeric material typically goes along with the formation of bubbles. As will be pointed out in the context of the method, this spontaneous bubble formation allows preparing the electrical insulator in a very straightforward manner by simply performing
the processing in the presence of the organofluorine compound, thereby "filling" the bubbles with the organofluorine compound.
Thus, in specific embodiments of the present invention, at least some of the inclusions each define a separate bubble, the size of which being in the submillimeter scale, more particularly in the microscopic scale. For example, said bubble has an average diameter in the range from 10 μπι (micrometer) to 500 μιη, preferably from 50 μιτι to 300 ym, more preferably from 100 ]i to 200 μπι. Of course, bubbles having a larger diameter, in particular of up to 2 mm, can also be present.
According to an embodiment, the body of the electrical insulator has a density higher than 120 kg/m3, preferably higher than 150 kg/m3, more preferably higher than 170 kg/m3, and most preferably higher than 220 kg/m3. According to this embodiment, the density is thus higher than e.g. the one of an insulating foam to be used in a cable, particularly of the low loss foam disclosed in US 2004/0220287.
According to a further embodiment, the at least one organofluorine compound is selected from the group consisting of fluoroethers , in particular hydrofluoromonoethers , fluoroketones and fluoroolefins, in particular hydrofluoro- olefins, and mixtures thereof. These classes of compounds have been found to have very high insulation capabilities, in particular a high dielectric strength (or breakdown field strength) , and at the same time a low G P.
The invention encompasses both embodiments in which the organofluorine compound comprises either one of a fluoroether, in particular a hydrofluoromonoether, a fluoroketone and a fluoroolefin , in particular a hydrofluoroolefin, as well as embodiments in which the organofluorine compound comprises a mixture of at least two of these compounds.
The term "fluoroether" as used in the context of the present invention encompasses both perfluoroethers, i.e. fully fluorinated ethers, and hydrofluoroethers , i.e. ethers that are only partially fluorinated. The term further encompasses saturated compounds as well as unsaturated compounds, i.e. compounds including double and/or triple bonds. The at least partially fluorinated alkyl chains attached to the oxygen atom of the fluoroether can be linear or branched.
The term "fluoroethers" encompasses both non-cyclic and cyclic ethers. Thus, the two alkyl chains attached to the oxygen atom can optionally form a ring. In particular, the term encompasses fluorooxiranes . In a specific embodiment, the organofluorine compound according to the present invention is a perfluorooxirane or a hydrofluorooxirane, more specifically a perfluorooxirane or hydrofluorooxirane comprising from three to fifteen carbon atoms.
According to a particularly preferred embodiment, at least a portion of the inclusions comprises a hydrofluoromonoether containing at least three carbon atoms.
Apart from their high dielectric strength, these hydrofluoro- monoethers are chemically and thermally stable to temperatures above 140°C. They are further non-toxic or have a low toxicity level. In addition, they are non-corrosive and non-explosive.
The term "hydrofluoromonoether" as used herein refers to a compound having one and only one ether group, said ether group linking two alkyl groups, which can be, independently from each other, linear or branched, and which can optionally form a ring. The compound is thus in clear contrast to the compounds disclosed in, e.g., US-B-7128133, relating to the use of compounds containing two ether groups, i.e. hydrofluoro- diethers, in heat-transfer fluids.
The term "hydrofluoromonoether" as used herein is further to be understood such that the monoether is partially hydrogenated and partially fluorinated. It is further to be understood such that it may comprise a mixture of differently structured hydrofluoromonoethers . The term "structurally different" shall broadly encompass any difference in sum formula or structural formula of the hydrofluoromonoether .
As mentioned above, hydrofluoromonoethers containing at least three carbon atoms have been found to have a relatively high dielectric strength. Specifically, the ratio of the dielectric strength of the hydrofluoromonoethers according to the present invention to the dielectric strength of SF6 is greater than about 0.4.
As also mentioned, the GWP of the hydrofluoromonoethers is low. Preferably, the GWP is less than l'OOO over 100 years, more specifically less than 700 over 100 years.
The hydrofluoromonoethers mentioned have a relatively low atmospheric lifetime and in addition are devoid of halogen atoms that' play a role in the ozone destruction catalytic cycle, namely CI, Br or I. Their ODP is zero, which is very favourable from an environmental perspective.
The preference for a hydrofluoromonoether containing at least three carbon atoms and thus having a relatively high boiling point of more than -20°C is based on the finding that a higher boiling point of the hydrofluoromonoether generally goes along with a higher dielectric strength.
According to a particular embodiment, the hydrofluoromonoether contains exactly three or four or five or six carbon atoms, in particular exactly three or four carbon atoms, most . preferably exactly three carbon atoms.
More particularly, the hydrofluoromonoether is thus at least one compound selected from the group consisting of the compounds defined by the following structural formulae in which a part of the hydrogen atoms is substituted by a fluorine atom:
I0f ) ,
(Og) ,
By using a hyd.rofluoromonoether containing three or four carbon atoms, no liquefaction occurs under typical operational conditions. Thus, inclusions in which every component is in the gaseous state at operational conditions of the electrical apparatus can be achieved, which is advantageous, as mentioned above .
Considering flammability of the compounds, there are further embodiments in which the ratio of the number of fluorine atoms to the total number of fluorine and hydrogen atoms, here briefly called "F-rate", of the hydrofluoromonoether is at least 5:8. It has been found that compounds falling within this definition are generally non-flammable and thus result in an insulation medium complying with highest safety requirements'. Thus, safety requirements of the electrical insulator and the method of its production can readily be fulfilled by using a corresponding hydrofluoromonoether .
According to other embodiments, the ratio of the number of fluorine atoms to the number of carbon atoms, here briefly called "F/C-ratio", can range from 1.5:1 to 2:1. Such compounds generally have a GWP of less than l'OOO over 100 years, and are thus very environment-friendly. In particualr, the hydrofluoro- monoether can have a GWP of less than 700 over 100 years.
According to other embodiments of the present invention, at least a portion of the inclusions comprises a hydrofluoromonoether having the general structure (O)
CaHbFc-0-CdHeFf (0) wherein a and d independently are an integer from 1 to 3 with a + d = 3 or 4 or 5 or 6, in particular 3 or 4, b and c independently are an integer from 0 to 11, in particular 0 to 7, with b + c = 2a + 1, and e and f independently are an integer from 0 to 11, in particular 0 to 7, with e + f = 2d + 1, with further at least one of b and e being 1 or greater and at least one of c and f being 1 or greater.
It is thereby a further embodiment that in the general structure or formula (0) of the hydrofluoromonoether : a is 1, b and c independently are an integer ranging from 0 to 3 with b + c = 3, d = 2, e and f independently are an integer
ranging from 0 to 5 with e + f = 5, with further at least one of b and e being 1 or greater and at least one of c and f being 1 or greater.
According to a further embodiment, exactly one of c and f in the general structure (0) is 0. The corresponding grouping of fluorines on one side of the ether linkage, with the other side remaining unsubstituted, is called "segregation". Segregation has been found to reduce the boiling point compared to unsegregated compounds of the same chain length. This feature is thus of particular interest, because compounds with longer chain lengths allowing for higher dielectric strength can be used without risk of liquefaction under operational conditions.
In embodiments, the hydrofluoromonoether is selected from the group consisting of pentafluoro-ethyl-methyl ether (CH3-0- CF2CF3) and 2 , 2 , 2-trifluoroethyl-trifluoromethyl ether
(CF3-O-CH2CF3) .
Pentafluoro-ethyl-methyl ether has a boiling point of +5.25°C and a GWP of 697 over 100 years, the F-rate being 0.625; while 2 , 2 , 2-trifluoroethyl-trifluoromethyl ether has a boiling point of +11°C and a GWP of 487 over 100 years, the F-rate being 0.75. They both have an ODP of 0 and are thus environmentally fully acceptable.
In addition, pentafluoro-ethyl-methyl ether has been found to be thermally stable at a temperature of 175°C for 30 days and therefore to be fully suitable for the operational conditions given in an electrical insulator. Since thermal stability studies of hydrofluoromonoethers of higher molecular weight have shown that the stability of ethers containing fully hydrogenated methyl or ethyl groups have a lower thermal stability compared to those having partially hydrogenated groups, it can be assumed that the thermal stability of 2,2,2- trifluoroethyl-trifluoromethyl ether is even higher.
Hydrofluoromonoethers in general, and pentafluoro-ethyl-methyl ether as well as 2 , 2 , 2-trifluoroethyl-trifluoromethyl ether in particular, display a low risk for human toxicity. This can be concluded from the available results of mammalian HFC (hydrofluorocarbon) tests. Also, information available on commercial hydrofluoromonoethers gives no evidence of carcinogenicity, mutagenicity, reproductive/developmental effect and other chronic effects of the compounds of the present application. Based on the data available for commercial hydrofluoro ethers of higher molecular weight, it can be concluded that the hydrofluoromonoethers, and in particular pentafluoro-ethyl-methyl ether as well as 2 , 2 , 2-trifluoroethyl- trifluoromethyl ether, have a lethal concentration LC 50 of higher than 10' 000 ppm, rendering them suitable also from a toxicological point of view.
The mentioned hydrofluoromonoethers have a higher dielectric strength than air. In particular, pentafluoro-ethyl-methyl ether has a dielectric strength about 2.4 times higher than air at 1 bar.
Given its boiling point, which is preferably below 55 °C, more preferably below 40°C, in particular below 30°C, the mentioned hydrofluoromonoethers , particularly pentafluoro-ethyl-methyl ether and 2 , 2 , 2-trifluoroethyl-trifluoromethyl ether, respectively, are normally in the gaseous state at operational conditions. Thus, inclusions inside which every component is in the gaseous state at operational conditions of the electrical apparatus can be achieved, which is preferred, as mentioned.
Alternatively or additionally to the hydrofluoromonoethers mentioned herein, at least a portion of the inclusions comprises a fluoroketone containing from four to twelve carbon atoms.
The term "fluoroketone" as used in this application shall be interpreted broadly and shall encompass both perfluoroketones and hydrofluoroketones , and shall further encompass both
saturated compounds and unsaturated compounds, i.e. compounds including double and/or triple bonds. The at least partially fluorinated alkyl chain of the fluoroketones can be linear or branched. In exemplary embodiments, the fluoroketone is a perfluoroketone . In further exemplary embodiment, the fluoroketone has a branched alkyl chain, in particular an at least partially fluorinated alkyl chain. In still further exemplary embodiments, the fluoroketone is a fully saturated compound.
Compared to fluoroketones having a greater chain length with more than six carbon atoms, fluoroketones containing five or six carbon atoms have the advantage of a relatively low boiling point. Thus, problems which might go along with liquefaction can be avoided even when the electrical apparatus is used at low temperatures. According to a preferred embodiment, the fluoroketone is at least one compound selected from the group consisting of the compounds defined by the following structural formulae in which at least one hydrogen atom is substituted with a fluorine atom:
Fluoroketones containing five or more carbon atoms are further advantageous, because they are generally non-toxic with outstanding margins for human safety. This is in contrast to fluoroketones having less than four carbon atoms, such as hexafluoroacetone (or hexafluoropropanone) , which are toxic and very reactive. In particular, fluoroketones containing exactly
five carbon atoms, herein briefly named fluoroketones a) , and fluoroketones containing exactly six carbon atoms are thermally stable up to 500 °C.
In embodiments of this invention, the fluoroketones , in particular fluoroketones a) , having a branched alkyl chain are advantageous, because their boiling points are lower than the boiling points of the corresponding compounds (i.e. compounds with same molecular formula) having a straight alkyl chain.
According to embodiments, the fluoroketone a) is a perfluoroketone , in particular has the molecular formula C5F10O, i.e. is fully saturated without double or triple bonds. The fluoroketone a) may more preferably be selected from the group consisting of 1, 1, 1, 3, 4, 4, -heptafluoro-3- (trifluoromethyl ) butan-2-one (also named decafluoro-2-methylbutan-3-one ) , 1,1,1,3,3,4,4,5,5, 5-decafluoropentan-2-one ,
1,1,1,2,2,.4,4,5,5, 5-decafluoropentan-3-one and octafluorocylcopentanone; and most preferably is 1,1,1,3,4,4,4- heptafluoro-3- (trifluoromethyl) butan-2-one .
1 , 1, 1 , 3, 4 , 4 , -heptafluoro-3- (trifluoromethyl ) butan-2-one can be represented by the following structural formula (I):
1,1,1,3,4,4, 4-heptafluoro-3- (trifluoromethyl) butan-2-one, here briefly called "C5-ketone", with molecular formula CF3C (0) CF (C'F3) 2 or C5F10O, has been found to be particularly preferred for high and medium voltage insulation applications, because it has the advantages of high dielectric insulation performance, in particular in mixtures w'ith a dielectric
carrier gas, has very low GWP and has a low boiling point. It has an ODP of 0 and is practically non-toxic.
According to embodiments, even higher insulation capabilities can be achieved by combining the mixture of different fluoroketone components. In embodiments, a fluoroketone containing exactly five carbon atoms, as described above and here briefly called fluoroketone a) , and a fluoroketone containing exactly six carbon atoms or exactly seven carbon atoms, here briefly named fluoroketone c) , can favourably be part of the dielectric insulation at the same time.
Thus, an insulation medium can be achieved having more than one fluoroketone, each contributing by itself to the dielectric strength of the inclusion.
In embodiments, the further fluoroketone c) is at least one compound selected from the group consisting of the compounds defined by the following structural formulae in which at least one hydrogen atom is substituted with a fluorine atom:
dig) ; as well as any fluoroketone having exactly 6 carbon atoms, in which the at least partially fluorinated alkyl chain of the fluoroketone forms a ring, which is substituted by one or more alkyl groups (Ilh); and/or is at least one compound selected from the group consisting of the compounds defined by the following structural formulae in which at least one hydrogen atom is substituted with a fluorine atom:
( Illm) , and
(Illn), in particular dodecafluoro- cycloheptanone, as well as any fluoroketone having exactly 7 carbon atoms, in which the at least partially fluorinated alkyl chain of the fluoroketone forms a ring, which is substituted by one or more alkyl groups (IIIo) .
The present invention encompasses, in particular, each combination of any of the compounds according to structural formulae la to Id with any of the compounds according to structural formulae Ila to Ilg and/or Ilia to Illn. As well, the present invention encompasses each compound or each combination of compounds selected from the group consisting of the compounds according to structural formulae (la) to (Ii), (Ila) to (Ilh) , (Ilia) to (IIIo), and mixtures thereof.
Depending on the specific application of the electrical insulator of the present invention, a fluoroketone containing exactly six carbon atoms (falling under the designation "fluoroketone c) " mentioned above) may be preferred; such a fluoroketone is non-toxic, with outstanding margins for human safety. In embodiments, fluoroketone c) , alike fluoroketon a) , is a perfluoroketone, and/or has a branched alkyl chain, in particular an at least partially fluorinated alkyl chain, and/or the fluoroketone c) contains fully saturated compounds. In particular, the fluoroketone c) has the molecular formula C6Fi20, i.e. is fully saturated without double or triple bonds. More preferably, the fluoroketone c) can be selected from the group consisting of 1 , 1 , 1 , 2 , 4 , , 5 , 5 , 5-nonafluoro-2-
(trifluoromethyl) pentan-3-one (also named dodecafluoro-2- methylpentan-3-one) , 1,1,1,3,3,4,5,5, 5-nonafluoro-4- (trifluoromethyl ) pentan-2-one (also named dodecafluoro-4- methylpentan-2-one) , 1,1,1,3,4,4,5,5, 5-nonafluoro-3-
( trifluoromethyl ) pentan-2-one (also named dodecafluoro-3- methylpentan-2-one) , 1, 1, 1,4,4, 4-hexafluoro-3, 3-bis-
(trifluoromethyl) butan-2-one (also named dodecafluoro-3 , 3- (dimethyl) butan-2-one) , dodecafluorohexan-2-one, dodecafluorohexan-3-one and decafluorocyclohexanone,. and particularly is the mentioned 1, 1, 1, 2, , 4, 5, 5, 5-nonafluoro-2- (trifluoromethyl) pentan-3-one .
1,1,1,2,4,4,5,5, 5-Nonafluoro-2- ( trifluoromethyl ) pentan-3-one (also named dodecafluoro-2~methylpentan-3-one) can be represented by the following■ structural formula (II):
1,1,1,2,4,4,5,5, 5-Nonafluoro-4- (trifluoromethyl) pentan-3-one (here briefly called "C6-ketone", with molecular formula C2F5C (0) CF (CF3) 2, has been found to be particularly preferred for high voltage insulation applications because of its high insulating properties and its extremely low GWP. Specifically, its pressure-reduced breakdown field strength Ecr is around 240 kV/cm/bar which is much higher than the one of air having a relatively weaker dielectric strength (Ecr = 25 kV/cm/bar) . It has an ozone depletion- potential of 0 and is non-toxic (LC50 of about 100r000 ppm) . Thus, the environmental impact is very low, and at the same time outstanding margins for human safety are achieved .
As mentioned above, the organofluorine compound can also be a fluoroolefin, in particular a hydrofluoroolefin . More particularly, the fluoroolefin or hydrofluorolefin, respectively, contains exactly three carbon atoms.
According to a particularly preferred embodiment, the hydrofluoroolefin is thus selected from the group consisting of: 1, 1, 1, 2-tetrafluoropropene (HFO-1234yf ) , 1,2,3,3- tetrafluoro-2-propene (HFO-1234yc) , 1, 1, 3, 3-tetrafluoro-2- propene (HFO-1234zc) , 1, 1, 1, 3-tetrafluoro-2-propene (HFO- 1234ze), 1, 1, 2, 3-tetrafluoro-2-propene (HFO-1234ye) , 1,1,1,2,3- pentafluoropropene (HFO-1225ye) , 1 , 1 , 2 , 3 , 3-pentafluoropropene (HFO-1225yc) , 1 , 1 , 1 , 3 , 3-pentafluoropropene (HFO-1225zc) ,
(Z) 1, 1, 1, 3-tetrafluoropropene (HFO-1234 zeZ ) , (Z)l,l,2,3-
tetrafluoro-2-propene ( HFO-1234yeZ ) , (E) 1,1, 1,3- tetrafluoropropene (HFO-1234zeE) , (E) 1 , 1 , 2 , 3-tetrafluoro-2- propene (HFO-1234yeE) , ( Z ) 1 , 1 , 1 , 2 , 3-pentafluoropropene (HFO- 1225yeZ), (E ) 1 , 1 , 1 , 2 , 3-pentafluoropropene (HFO-1225yeE) and combinations thereof.
According to a further aspect, the present invention further relates to a method for preparing an electrical insulator in particular as described above, said method comprising the step of processing a prepolymeric or polymeric mass before its solidification to the electrical insulating, solid material, whereby the processing is performed in the presence of at least one organofluorine compound having a lower Global Warming Potential (GWP) than SF6.
The term "processing a prepolymeric or polymeric mass before its solidification" is to be understood broadly and, in particular, shall encompass the processing of a thermosetting prepolymeric mass, more particularly the curing of a reaction resin to the polymeric material, as well as the processing of a thermoplastic polymeric material in melted form. The term "performed in the presence of at least one organofluorine compound" is also to be understood broadly and in particular encompasses embodiments in which the at least one organoflourine compound is only temporarily present during the processing of the prepolymeric or polymeric mass, and, thus, not necessarily during the entire processing.
Specifically, the method of the present invention includes the step of processing the prepolymeric or polymeric mass in the presence of a cover gas comprising or at least essentially consisting of the at least one organofluorine compound.
The term "prepolymeric mass" thereby includes both a mass comprising the precursor resin without further components as well as the reaction resin comprising the precursor resin and further components, particularly a hardener.
The term "cover gas" as used in the context of the present invention shall be interpreted broadly as a gas which is in contact with the mass during its processing and which at least partially shields the mass from coming into contact with other gases .
In order to achieve an optimum insulating performance, the partial pressure of the cover gas is typically chosen as high as possible in order to achieve a particularly high resistance of the electrical insulator to dielectric breakdown. Typically, the processing of the mass comprises casting it into a desired shape, preferably by injection molding.
Casting of a thermosetting prepolymeric mass by injection molding according to the present invention generally includes the steps or method elements of:
a) Separately providing the components of the prepolymeric mass ,
b) Preheating a mold,
c) Charging the mold with a cover gas containing the at least one organofluorine compound,
d) Preparing the prepolymeric mass, i.e. the reaction resin, by mixing its components,
e) Injecting the prepolymeric mass into the mold while simultaneously at least partially removing the cover gas, and
f) Curing the prepolymeric mass with the hardener to the solid, electrical insulating polymeric material.
The components of step a) can, for example, include, apart from the precursor resin, a hardener, a flexibilizer., an accelerator, a filler and/or a dye. Step a) can, for example, include separate pre-drying of at least the precursor resin and the hardener in a vacuum pre-mixer.
In embodiments, the casting of the prepolymeric mass by injection molding comprises the method elements of: (i) forming voids, which comprise the organofluorine compound, in the prepolymeric mass during any of the steps d) to f) , and (ii) stabilizing the voids during Curing (possibly including post- curing) , in particular during the Curing in step f), such that an amount of the organofluorine compound is comprised in the voids and forms inclusions of the electrical insulator.
If a filler is included, it is also preferably pre-dried before being introduced. Any filler known to the skilled person as suitable for the respective purpose can be used. Particularly, the filler is selected from the group consisting of metal oxides, Si02, Α1203 or ATH (Aluminum Trihydroxide) , carbonates, mica, talc, clays, glass fibers, and mixtures thereof.
According to a specific embodiment, the precursor resin is an epoxy resin.
Optionally, the cavity of the mold can comprise at least one component, more particularly an electrical component, to be integrally casted. Preheating of the mold - optionally comprising the (electrical) component - according to step b) can, for example, be carried out at a temperature ranging from about 60°C to about 110°C.
After step b) and prior to step c) , the process can further comprise the optional step of at least partially evacuating the cavity of the mold. Evacuation can, for example, be performed down to a pressure of less than about 30 mbar, preferably in the range of about 0.1 mbar to about 3 mbar.
After step f) , the method can further comprise the optional step of post-curing the polymeric material, for example at a temperature selected in a range from 120 °C to 160 °C and in particular at a temperature of about 140°C.
In particular, the method of the present invention can also encompass automatic pressure gelation processes.
The method of the present invention can also encompass embodiments, in which a strand or foil with the prepolymeric or polymeric mass applied thereon is wound. The concept of the present invention is particularly useful for these embodiments, since these embodiments are particularly prone to the formation of voids, especially at the interface between two radial layers and/or between alternating material components.
For example, the present invention relates to a method in which a foil conductor with the prepolmyeric or polymeric mass applied thereon is wound in a radial direction, one on top of the other, to result in a disc winding in which a layer of insulating material is disposed between each layer or turn of the conductor. In this particular embodiment, the insulating material may be comprised of a polyimide film, such as is sold under the trademark Nomex®; a polyamide film, such as is sold under the trademark Kapton®; or a polyester film, such as is sold under the trademark Mylar®.
The organofluorine compound used for the method of the present invention can correspond to the ones mentioned above for the electrical insulator.
Since according to this method the bubbles that are typically formed during processing of the prepolymeric or polymeric mass comprise the organofluorine compound, an electrical insulator as described above with the above described features and advantages is thereby formed in a very straightforward manner.
Since electrical insulators used in medium and high voltage applications are particularly prone to partial discharge phenomena, the present invention further relates - according to a further aspect - to the use of the electrical insulator in a high-voltage or medium-voltage electrical apparatus, as thereby the advantages of the present invention are of particular relevance .
More particularly, the present invention relates to the use of the electrical insulator in an insulating spacer, a post type spacer, a cast insulating cylinder, in particular an insulating cylinder for a condenser, an insulating envelope, a partition insulator or base insulator, an insulating rod, an insulating shaft e.g. for movement transmission in a gas-insulated switchgear (GIS) , a bushing, an insulating joint, an insulating terminal, a cable insulation, and/or an insulating coating, in particular an insulating coating of an inner conductor. Apart from a GIS, further fields of applications of the electrical insulator according to the present invention include its use in a voltage transformer, a current transformer, a cable distribution head and a ground electrode, for example.
In analogy, the present invention thus also relates to an electrical insulator as described above, said insulator forming or being part of: an insulating spacer, a post type spacer, a partition insulator or base insulator, a support insulator, a suspended insulator, a bushing, a high voltage insulator, a medium voltage insulator, a low voltage insulator, a cast insulating cylinder, an insulating envelope, an insulating rod, an insulating shaft, an insulating joint, an insulating terminal, a cable insulation, and/or an insulating coating.
According to a further aspect, the present invention also relates to an apparatus for the generation, the distribution and/or the usage of electrical energy, said apparatus comprising an electrical insulator as described herein.
In embodiments, the apparatus is part of or is a: high voltage apparatus, medium voltage apparatus, low voltage apparatus, direct-current apparatus, switchgear, air-insulated switchgear, part or component of air^insulated switchgear, gas-insulated metal-encapsulated switchgear (GIS) , part or component of gas- insulated metal-encapsulated switchgear, air-insulated transmission line, gas-insulated transmission line (GIL) , bus
bar, bushing, air-insulated insulator, gas-insulated metal- encapsulated insulator, cable, gas-insulated cable, cable joint, current transformer, voltage transformer, sensors, surge arrester, capacitor, inductance, resistor, current limiter, high voltage switch, earthing switch, disconnector, load-break switch, circuit breaker, gas circuit breaker, vacuum circuit breaker, generator circuit breaker, medium Voltage switch, ring main unit, recloser, sectionalizer, low voltage switch, transformer, distribution transformer, power transformer, tap changer, transformer bushing, electrical rotating machine, generator, motor, drive, semiconducting device, power semiconductor device, power converter, computing machine; and components and/or combinations of such devices.
According to a still further aspect, the present invention further relates to the use of an organofluorine compound as a cover gas in the processing of . a prepolymeric or polymeric mass, in particular for providing an electrical insulating, solid material for an electrical insulator, as mentioned herein.
The present invention is further illustrated by way of the following figures, of which
Fig. 1 shows purely schematically a cross-sectional view of an electrical insulator according to the present invention arranged between two electrodes;
Fig. 2 shows the layout of a facility for producing an electrical insulator according to the present invention by injection molding;
Fig. 3 shows purely schematically a cross-sectional view of a mold to be used for the production of an electrical insulator according to the present invention by injection molding, together with an electrical component to be integrally cast;
Fig. 4 shows purely schematically an electrical insulator according to the present invention obtainable by an injection molding process using the mold according to Fig. 3;
Fig. 5a shows a photograph of an electrical insulator for insulating the space between two electrodes;
Fig. 5b shows a drawing of the electrical insulator of the photograph according to Fig. 5a; and
Fig. 6 shows an X-ray photograph of another electrical insulator produced according to the present invention.
The electrical insulator 2 shown in Fig. 1 is sandwiched between two electrodes 10a, 10b and comprises a body 4 containing an electrical insulating, solid material 6 and non- solid inclusions 8 dispersed within the body 4. In Fig. 1, only one of these inclusions 8 is shown for reasons of illustration. The inclusion 8 defines an inclusion space 9 and comprises inside at least one organofluorine compound having a lower Global Warming Potential than SF6. In embodiments, the inclusions in the electrical insulator · have a Global Warming Potential (GWP over 100 years) of less than 22 ' 800, preferably less than 15 '000, more preferably less than 10 '000, even more preferably less than 5 '000, even more preferably less than 3' 000, even more preferably less than 2' 000, even more preferably less than l'OOO, even more preferably less than 700, even more preferably less than 300, even more preferably less than 100, even more preferably less than 50, even more preferably less than 20, most preferred less than 10.
Due to the presence of the organofluorine compound, a very high dielectric strength within the inclusion space 9 is achieved; the tendency of the electrical insulator 2 for partial discharge is thus significantly reduced.
The electrical insulator 2 can e.g. be prepared by injection molding, a layout of a corresponding facility being shown in Fig. 2. The facility in Fig. 2 includes a mold 12 comprising two mold parts 14a, 14b each being connected to a platen 16a, 16b and moveable with respect to each other. In the clamped position shown in Fig. 2, the mold parts 14a, 14b define a mold cavity 18.
The prepolymeric or polymeric mass 20 to be molded is stored in a pressure vessel 22, the wall 24 of which being provided with a fitting 26 to be connected to a gas inlet pipe (not shown) for charging a cover gas comprising an organofluorine compound and thereby pressurizing the interior 28 of the pressure vessel 22.
Upon pressurization, the mass 20 is pumped through an ascending pipe 30 into a pressure pipe 32 which opens out into the interior 36 of a barrel 34. Said barrel 34 comprises a nozzle 38 which is connectable to the mold 12 and through which the mass 20 can be forced by means of a piston 40 via an injection channel 41 into the mold cavity 18.
Like the pressure vessel 22, the mold cavity 18 is charged with a cover gas comprising an organofluorine compound. To this end, the mold 12 comprises a ventilation channel 42 which is connected to a respective gas inlet pipe (not shown) . Both the gas inlet pipe connected to the fitting 26 of the pressure vessel 22 as well as the gas inlet pipe connected to the ventilation channel 42 of the mold 12 are fed by a pressure tank (not shown) filled with the cover gas comprising the organofluorine compound.
The mold 12 can further be conntected to an evacuation pump for evacuating the mold cavity 18 prior to the charging with the cover gas (not shown) .
Fig. 3 relates to the integral casting of an electrical component 44 and specifically shows a mold 12' comprising two mold parts 14a', 14b' ■ defining a mold cavity 18' having a circular cross-section with the electrical component 44 being arranged in the centre of the mold cavity 18' . The mold 12' further comprises an injection channel 41' opening into the mold cavity 18' and a ventilation channel 42' . The ventilation channel 42' is connected to a gas inlet pipe 46 which itself is fed with cover gas comprising an organofluorine compound (as disclosed herein) from a cover-gas-containing tank 48 by means of a pump 50.
The electrical insulator 2' obtainable by an injection molding process using the mold 12' shown in Fig. 3 is given in Fig. 4. In the injection molding process, voids or bubbles are formed spontaneously within the prepolymeric mass resulting in the inclusions 8' present within the body 4' of the electrical insulator 2' . As the cover gas used for the processing comprises an organofluorine compound, also the inclusions 8' comprises the organofluorine compound. Thus, the tendency of the electrical insulator 2' for partial discharge is significantly reduced which results in a much safer operation of the electrical apparatus in which the electrical insulator 2' is used.
Throughout this application, terms like "preferable", "preferred", "advantageous", "favourable" and the like shall designate embodiments or exemplary features only, that are thus disclosed to be optional only.
The disclosed electrical insulator and its corresponding method for preparing or producing the electrical insulator encompass any production method or production device in which the cover gas containing an organofluorine compound is present and can be incorporated into the thus prepared insulator. For example, it encompasses any preparing method which includes casting, wet
winding, UV-cured casting, injection molding, or extrusion, e.g. of thermoplasts , or similar processes.
EXAMPLES
In order to proof the concept of the invention, two autoclaves were provided, which were connected to a vacuum oven (Heraeus Vacutherm, Type VT6130 M) preheated at 80 °C and comprising a mold 12.
Into a first autoclave, "C5-ketone" 1 , 1 , 1 , 3 , 4 , 4 , 4-heptafluoro- 3- (trifluoromethyl ) butan-2-one was filled up to 800 mbar and then topped with N2 up to a total pressure of 3 bar. The gas mixture was mixed with a mechanical propeller arranged in the autoclave .
In the second autoclave, a prepolymeric mass containing a 100:80 mixture of bisphenol A diglycidyl ether (Araldit® CY225 from Huntsman) and a hardener (Aradur® HY 225 from Huntsman) was provided.
The vacuum oven was evacuated, then the connection with the first autoclave was opened letting the gas flow into the oven and equilibrate, such that a final pressure of 1 bar was achieved.
Thereupon, the connection with the second autoclave was opened and the prepolymeric mass was transferred into the mold until the casting was completed.
The oven temperature was then set to 100 °C and, after 30 minutes, the temperature was raised to 130°C in order to cure the mass. After 6 hours of curing, a cured body for use in an electrical insulator 2 was obtained.
The body 4 of the thus produced electrical insulator 2 contains inclusions 8 dispersed within the body 4, said' inclusions 8
comprising 1,1,1,3,4,4, -heptafluoro-3- (trifluoromcthyl) butan- 2-one and N2.
Such a body 4 formed according to the process of the present invention is shown in the above-mentioned figures 5a, 5b and 6.
Fig. 5a relates to a photograph of the electrical insulator 2 for insulating the space between two rods or rod-like electrodes 10a, 10b, wherein said insulator 2 is prepared according to the above-disclosed execution example.
Fig. 5b relates to a corresponding schematic drawing of the electrical insulator 2 shown by the photograph of Fig. 5a.
Fig. 6 relates to an X-ray photograph of another electrical insulator 2 according to the present invention which is also based on cast epoxy polymer, and in particular which is also produced according to the production method disclosed herein.
As is clearly visible in Fig. 5a and 5b, the body of the electrical insulator 2 contains the electrical insulating, solid material 6, in the specific case an epoxy polymer, and non-solid inclusions 8 dispersed within the body 4, in the specific case inclusions containing the cover gas mixture of 1,1,1,3,4,4, 4-heptafluoro-3- (trifluoromethyl ) butan-2-one (C5- fluoroketone ) and nitrogen gas N2.
Such inclusions 8 are likewise shown in Fig. 6. Particularly, five inclusions 8 are shown and have diameters between 0.5 mm and 1.2 mm. Again, the inclusions 8 were formed under application of the cover gas mixture of 1,1,1,3,4,4,4- heptafluoro-3- ( trifluoromethyl ) butan-2-one (C5-fluoroketone) and nitrogen gas ¾ and likewise contain such a gas mixture.
Compared to conventional electrical insulators comprising air inclusions, the electrical insulator 2, 2' according to the present disclosure show a reduced or strongly reduced tendency for partial discharge, which ultimately results in a very safe
operation of any electrical apparatus comprising such an electric insulator 2, 2' .
Throughout this application, it is made clear that the invention is not limited to the shown execution examples or embodiments. In particular, the processing conditions, such as the type of organofluorine compound, the type of polymeric casting material, the pressure- of the cover gas to be applied over the mold, etc. can largely vary from the conditions mentioned in the execution examples. Such exemplary processing conditions are given solely for the purpose to allow easy reworking of exemplary embodiments of the invention. The scope of the appended claims is meant to be broad and to cover all variants and embodiments as claimed and as disclosed herein.
List of reference numerals , 2' electrical insulator
, 4' body of the electrical insulator
electrical insulating, solid material, 8' non-solid inclusion
inclusion space
0a, 10b electrodes
, 12' mold
a, 14b, 14a' , 14b' mold parts
a, 16b platen
, 18' mold cavity
prepolymeric or polymeric mass to be molded pressure vessel
wall of the pressure vessel
fitting
interior of the pressure vessel ascending pipe
pressure pipe
barrel
interior of the barrel
nozzle
piston
, 41' injection channel
, 42' ventilation channel
electrical component
gas inlet pipe
cover-gas-containing tank
pump
Claims
Electrical insulator (2, 2') for an electrical apparatus, said insulator (2, 2' ) comprising a body (4, 4') containing an electrical insulating, solid material (6) and non-solid inclusions (8) dispersed within the body (4, 4') , characterized in that at least a portion of the inclusions (8) comprise at least one organofluorine compound having a lower Global Warming Potential than SFS.
Electrical insulator (2, 2 ' ) according to claim 1, characterized in that the at least one organofluorine compound is selected from the group consisting of: fluoroethers, in particular hydrofluoromonoethers, fluoroketones and fluoroolefins , in particular hydrofluoroolefins .
Electrical . insulator (2, 2') according to any of the preceding claims, characterized in that at least a portion of the inclusions (8) comprises a hydrofluoromonoether containing at least three carbon atoms.
Electrical insulator (2, 2') according to any of the preceding claims, characterized in that at least a portion of the inclusions (8) comprises a fluoroketone containing from four to twelve carbon atoms.
Electrical insulator (2, 2') according to claim 4, characterized in that the fluoroketone contains exactly five or exactly six carbon atoms.
Electrical insulator (2, 2 ' ) according to any of the preceding claims, characterized in that the at least one organofluorine compound is in the gaseous state at operational conditions of the electrical apparatus.
Electrical insulator (2, 2') according to any of the preceding claims, characterized in that every component of the inclusions (8) is in the gaseous state at operational conditions of the electrical apparatus.
Electrical insulator (2, 2') according to any of the preceding claims, characterized in that the electrical insulating, solid material (6) is a polymeric material.
Electrical insulator (2, 2') according to claim 8, characterized in that the polymeric material is selected from the group consisting of: silicones, acrylic resins, polystyrenes, polyurethanes , polyimides, polyamides, polyesters, polyolefins, polyethers, polyketones, polysulfones and epoxy polymers, as well as mixtures thereof; and 1Π Darticular is selected from the group consisting of: silicones, acrylic resins, polystyrenes, polyurethanes, polyesters and epoxy polymers, as well as mixtures thereof.
Electrical insulator (2, 2' ) according to any of the preceding claims, characterized in that at least some of the inclusions (8) each define a separate bubble (8), the size of which being in the submillimeter scale, specifically in the microscopic scale.
Electrical insulator (2, 2') according to claim 10, characterized in that the bubble (8) has an average diameter in the range from 10 pm to 500 μηι, preferably from 50 pm to 300 pm, more preferably from 100 pm to 200 pm.
Electrical insulator (2, 2') according to any of the preceding claims, characterized in that at least some of the inclusions (8) are formed in the interior of hollow bodies, in particular in the interior of hollow microspheres, that are present in the electrical insulating solid material (6) .
Electrical insulator (2, 2 ' ) according to any of the preceding claims, characterized in that the body (4, 4') has a density higher than 120 kg/m3, preferably higher than 150 kg/m3, more preferably higher than 170 kg/m3, and most preferably higher than 220 kg/m3.
Electrical insulator (2, 2') according to any of . the preceding claims, characterized in that the body (4, 4') comprises a filler, in particular a filler selected from the group consisting of: metal oxides, Si02, A1203, carbonates, mica, talc, clays, glass fibers, and mixtures thereof .
Electrical insulator (2, 2' ) according to any of the preceding claims, said insulator (2, 2') forming or being part of a: insulating spacer, post type spacer, partition insulator or base insulator, support insulator, suspended insulator, bushing, high voltage insulator, medium voltage insulator, low voltage insulator, cast insulating cylinder, insulating envelope, insulating rod, insulating shaft, insulating joint, insulating terminal, cable insulation, and/or insulating coating.
Electrical insulator (2, 2') according to any of the preceding claims, characterized in that the inclusions (8) in the electrical insulator (2, 2') have a Global Warming Potential of less than 22 '800, preferably less than 15 '000, more preferably less than 10 '000, even more preferably less than 5 '000, even more preferably less than 3 '000, even more preferably less than 2 '000, even more preferably less than I'OOO, even more preferably less than 700, even more preferably less than 300, even more preferably less than 100, even more preferably less than 50, even more preferably less than 20, most preferred less than 10.
Electrical insulator (2, 2') according to any of the preceding claims, characterized in that the inclusions (8) have a dielectric strength higher than that of air; and/or that the organofluorine compound has a dielectric strength higher than that of air.
Electrical insulator (2, 2') according to any of the preceding claims, characterized in that the inclusions (8) comprise at least one component selected from the group consisting of: air, air component, carbon dioxide (C02), oxygen (02) , nitrogen (N2) , noble gas, nitric oxide, nitrogen dioxide, and mixtures thereof.
Apparatus for the generation, the distribution and/or the usage of electrical energy, said apparatus comprising an electrical insulator (2, 2' ) according to any of the claims 1 to 18.
Apparatus according to claim■ 19, said apparatus being a part of or being a: high voltage apparatus, medium voltage apparatus, low voltage apparatus, direct-current apparatus, switchgear, air-insulated switchgear, part or component of air-insulated switchgear, gas-insulated metal-encapsulated switchgear (GIS) , part or component of gas-insulated metal- encapsulated switchgear, air-insulated transmission line, gas-insulated transmission line (GIL) , bus bar, bushing, air-insulated insulator, gas-insulated metal-encapsulated insulator, cable, gas-insulated cable, cable joint, current transformer, voltage transformer, sensors, surge arrester, capacitor, inductance, resistor, current limiter, high voltage switch, earthing switch, disconnector, load-break switch, circuit breaker, gas circuit breaker, vacuum circuit breaker, generator circuit breaker, medium voltage switch, ring main unit, recloser, sectionalizer, low voltage switch, transformer, distribution transformer, power transformer, tap changer, transformer bushing,
electrical rotating machine, generator, motor, drive, semiconducting device, power semiconductor device, power converter, computing machine; and components and/or combinations of such devices.
Method for preparing an electrical insulator (2, 2'), in particular for preparing an electrical insulator (2, 2') according to any of claims 1 to 18, said method comprising the step of processing a prepolymeric or polymeric mass (20) before its solidification to an electrical insulating solid material (6), characterized in that the processing is performed in the presence of at least one organofluorine compound having a lower Global Warming Potential than SFe.
Method according to claim 21, characterized in that the processing is performed in the presence of a cover gas comprising the at least one organofluorine compound.
Method according to any of the claims 21 to 22, characterized in that the processing of the prepolymeric or polymeric mass (20) comprises casting it into a desired shape, preferably by injection molding.
Method according to claim 23, characterized in that casting of the prepolymeric mass (20) by injection molding comprises the steps of:
a) Separately providing the components of the prepolymeric mass ,
b) Preheating a mold (12, 12'),
c) Charging the mold (12, 12') with a cover gas containing the at least one organofluorine compound,
d) Preparing the prepolymeric mass (20) by mixing its components ,
e) Injecting the prepolymeric mass (20) into the mold (12, 12') while simultaneously at least partially removing the cover gas, and
f) Curing the prepolymeric mass (20) to produce the solid electrical insulating polymeric material (6).
25. Method according to any of the claims 21 to 24, characterized in that the processing of the prepolymeric or polymeric mass (20) comprises the method elements of: •(i) forming voids (8), which comprise the organofluorine compound, in the prepolymeric or polymeric mass (20), and (ii) stabilizing the voids (8) such that an amount of the organofluorine compound is comprised in the voids (8) and forms inclusions (8) of the electrical insulator (2, 2' ) .
26. Method according to claim 24, characterized in that the casting of the prepolymeric mass (20) by injection molding comprises the method elements of: (i) forming voids (8), which comprise the organofluorine compound, in the prepolymeric mass (20) during any of the steps d) to f ) , and (ii) stabilizing the voids (8) during Curing, in particular the Curing in step f) , such that an amount of the organofluorine compound is comprised in the voids and forms inclusions (8) of the electrical insulator (2, 2') .
27. Method according to any of the claims 21 to 26, characterized in that the at least one organofluorine compound is selected from the group consisting of: fluoroethers , in particular hydrofluoromonoethers , fluoroketones, and fluoroolefins , in particular hydrofluoroolefins , and mixtures thereof.
28. Method according to any of the claims 21 to 27, characterized in that the at least one organofluorine compound is a hydrofluoromonoether containing at least three carbon atoms.
29. Method according to any of claims 21 to 28, characterized in that the at least one organofluorine compound is a fluoroketone containing from four to twelve carbon atoms.
Method according to claim 29, characterized in that the fluoroketone contains exactly five or exactly six carbon atoms .
Method according to claim 24 and any of the claims 21-23, 25-30, characterized by a step of evacuating the mold (12, 12') being executed after step b) and prior to step c) , in particular evacuating down to a pressure of less than 30 mbar or down to a pressure range of 0.1 mbar to 3 mbar.
Method according to claim 24 and any of the claims 21-23, 25-30, characterized by a step of post-curing the poylmeric material, in particular at a temperature selected in a range from 120°C to 160°C, being executed after step f) .
Method according to any of the claims 21 to 32, characterized in that the inclusions (8) in the electrical insulator (2, 2' ) have a Global Warming Potential of less than 22' 800, preferably less than 15' 000, more preferably less than 10 '000, even more preferably less than 5' 000, even more preferably less than 3 '000, even more preferably less than 2' 000, even more preferably less than l'OOO, even more preferably less than 700, even more preferably less than 300, even more preferably less than 100, even more preferably less than 50, even more preferably less than 20, most preferred less than 10.
Use of the electrical insulator (2, 2') according to any of the claims 1 to 18 in a high-voltage or medium-voltage electrical apparatus.
Use, in particular according to claim 34, of the electrical insulator (2, 2') according to any of the claims 1 to 18 in an insulating spacer, a post type spacer, . a partition insulator or base insulator, a support insulator, a suspended insulator, a bushing, a high voltage insulator, a medium voltage insulator, a cast insulating cylinder, an insulating envelope, an insulating rod, an insulating
shaft, an insulating joint, an insulating terminal, a cable insulation, and/or an insulating coating.
Use of an organofluorine compound as a cover gas in the processing of a prepolymeric or polymeric mass (20) , in particular for providing an electrical insulating solid material (6) for an electrical insulator (2, 2') and more particularly for an electrical insulator (2, 2') according to any of the claims 1 to 18.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201380051505.4A CN104685576B (en) | 2012-10-01 | 2013-10-01 | Electrical insulator and its manufacture method comprising organofluorine compound |
EP13770912.7A EP2904616A1 (en) | 2012-10-01 | 2013-10-01 | Electrical insulator comprising an organofluorine compound and method for producing it |
US14/676,267 US20150206621A1 (en) | 2012-10-01 | 2015-04-01 | Electrical Insulator Comprising An Organofluorine Compound And Method For Producing It |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP2012069381 | 2012-10-01 | ||
EPPCT/EP2012/069381 | 2012-10-01 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2010/069381 Continuation WO2011070154A1 (en) | 2009-12-11 | 2010-12-10 | A waterjet assembly comprising a structural waterjet nozzle |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/676,267 Continuation US20150206621A1 (en) | 2012-10-01 | 2015-04-01 | Electrical Insulator Comprising An Organofluorine Compound And Method For Producing It |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014053462A1 true WO2014053462A1 (en) | 2014-04-10 |
Family
ID=47046572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2013/070401 WO2014053462A1 (en) | 2012-10-01 | 2013-10-01 | Electrical insulator comprising an organofluorine compound and method for producing it |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN104685576B (en) |
WO (1) | WO2014053462A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016091274A1 (en) * | 2014-12-12 | 2016-06-16 | Abb Technology Ag | Apparatus for the generation, distribution and/or usage of electrical energy and component for such an apparatus |
DE102018207587A1 (en) * | 2018-05-16 | 2019-11-21 | Robert Bosch Gmbh | Busbar and electrical device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5176000A (en) * | 1974-12-25 | 1976-06-30 | Matsushita Electric Ind Co Ltd | DENKIZE TSUENTAI |
US4173690A (en) * | 1977-12-02 | 1979-11-06 | Gould Inc. | Method of producing electrical insulation foam |
US20040220287A1 (en) | 2003-04-24 | 2004-11-04 | Champagne Michel F. | Low loss foam composition and cable having low loss foam layer |
US7128133B2 (en) | 2003-12-16 | 2006-10-31 | 3M Innovative Properties Company | Hydrofluoroether as a heat-transfer fluid |
WO2010142346A1 (en) * | 2009-06-12 | 2010-12-16 | Abb Technology Ag | Dielectric insulation medium |
WO2012080269A1 (en) * | 2010-12-16 | 2012-06-21 | Abb Technology Ag | Dielectric insulation medium |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002081570A1 (en) * | 2001-04-05 | 2002-10-17 | Sumitomo Chemical Company, Limited | Thermoplastic elastomer composition and molded object thereof |
CN101694791B (en) * | 2003-04-24 | 2012-12-05 | 加拿大国家研究委员会 | Low-loss cable and preparation method thereof |
JP5590569B2 (en) * | 2008-07-16 | 2014-09-17 | ハネウェル・インターナショナル・インコーポレーテッド | HFC-245fa and HFO-1234ze mixed isomers as blowing agents, aerosols and solvents |
CN102573818B (en) * | 2009-09-25 | 2016-08-03 | 阿科玛股份有限公司 | There is the biodegradable foam of the dimensional stability of improvement |
-
2013
- 2013-10-01 CN CN201380051505.4A patent/CN104685576B/en not_active Expired - Fee Related
- 2013-10-01 WO PCT/EP2013/070401 patent/WO2014053462A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5176000A (en) * | 1974-12-25 | 1976-06-30 | Matsushita Electric Ind Co Ltd | DENKIZE TSUENTAI |
US4173690A (en) * | 1977-12-02 | 1979-11-06 | Gould Inc. | Method of producing electrical insulation foam |
US20040220287A1 (en) | 2003-04-24 | 2004-11-04 | Champagne Michel F. | Low loss foam composition and cable having low loss foam layer |
US7128133B2 (en) | 2003-12-16 | 2006-10-31 | 3M Innovative Properties Company | Hydrofluoroether as a heat-transfer fluid |
WO2010142346A1 (en) * | 2009-06-12 | 2010-12-16 | Abb Technology Ag | Dielectric insulation medium |
WO2012080269A1 (en) * | 2010-12-16 | 2012-06-21 | Abb Technology Ag | Dielectric insulation medium |
Non-Patent Citations (1)
Title |
---|
DATABASE WPI Week 197633, Derwent World Patents Index; AN 1976-62475X, XP002718651 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016091274A1 (en) * | 2014-12-12 | 2016-06-16 | Abb Technology Ag | Apparatus for the generation, distribution and/or usage of electrical energy and component for such an apparatus |
US10818407B2 (en) | 2014-12-12 | 2020-10-27 | Abb Schweiz Ag | Apparatus for the generation, distribution and/or usage of electrical energy and component for such an apparatus |
DE102018207587A1 (en) * | 2018-05-16 | 2019-11-21 | Robert Bosch Gmbh | Busbar and electrical device |
Also Published As
Publication number | Publication date |
---|---|
CN104685576A (en) | 2015-06-03 |
CN104685576B (en) | 2017-08-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2652751B1 (en) | Dielectric insulation medium | |
US20150206621A1 (en) | Electrical Insulator Comprising An Organofluorine Compound And Method For Producing It | |
JP6625053B2 (en) | Water and contaminant sorbents for CO2 insulated electrical equipment for producing, transmitting, distributing and / or using electrical energy | |
EP3230987B1 (en) | Apparatus for the generation, distribution and/or usage of electrical energy and component for such an apparatus | |
US10256008B2 (en) | Electrical apparatus for the generation, transmission, distribution and/or usage of electrical energy and method for recovering a substance from an insulation medium of such an apparatus | |
KR102639421B1 (en) | Perfluorinated 1-alkoxypropenes in dielectric fluids and electrical devices | |
JP5940180B2 (en) | Insulation material molded body for arc extinguishing, gas circuit breaker using the same | |
EP2936504B1 (en) | A method for dielectrically insulating active electric parts | |
DE202014003243U1 (en) | Device for the generation, distribution and / or use of electrical energy or a component of such a connection | |
CN101632137B (en) | Insulator material and method for manufacturing thereof | |
WO2014053462A1 (en) | Electrical insulator comprising an organofluorine compound and method for producing it | |
US11450448B2 (en) | Use of a linear octafluorobutene as a dielectric compound in an environmentally safe dielectric-insulation or arc-extinction fluid | |
DE2241036A1 (en) | CLOSED-CELL RIGID FOAM AND ITS USE IN ELECTRICAL EQUIPMENT AND EQUIPMENT | |
CN114072881B (en) | Dielectric insulating or extinguishing fluid | |
WO2013064410A1 (en) | A method for dielectrically insulating active electric parts | |
WO2016146197A1 (en) | Dielectric insulation or arc-extinction fluid | |
US3108153A (en) | High voltage electrical insulation including gassing inhibitor | |
CN212411704U (en) | Electrical insulation and power system assembly including the same | |
JP2010220300A (en) | Molding insulator for electrical insulation | |
WO2022054154A1 (en) | Gas-insulated device | |
Jin et al. | Design and Fabrication of A 72 kV Bushing for the TESLA Breaker |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13770912 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2013770912 Country of ref document: EP |