WO2014041659A1 - Method for manufacturing embedded component substrate - Google Patents

Method for manufacturing embedded component substrate Download PDF

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Publication number
WO2014041659A1
WO2014041659A1 PCT/JP2012/073471 JP2012073471W WO2014041659A1 WO 2014041659 A1 WO2014041659 A1 WO 2014041659A1 JP 2012073471 W JP2012073471 W JP 2012073471W WO 2014041659 A1 WO2014041659 A1 WO 2014041659A1
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WIPO (PCT)
Prior art keywords
support
component
support plate
metal film
manufacturing
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PCT/JP2012/073471
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French (fr)
Japanese (ja)
Inventor
浩 島田
峰進 樋口
光昭 戸田
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株式会社メイコー
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Priority to PCT/JP2012/073471 priority Critical patent/WO2014041659A1/en
Publication of WO2014041659A1 publication Critical patent/WO2014041659A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Definitions

  • the present invention relates to a method for manufacturing a component-embedded substrate.
  • a component-embedded substrate there are various methods for manufacturing a component-embedded substrate (see, for example, Patent Document 1).
  • an adhesive layer is formed on a copper foil by a dispenser or a printing method, a component to be incorporated is mounted thereon, the adhesive layer is cured, and the component is fixed.
  • an insulating layer such as a prepreg is formed, and the component is embedded in the insulating material by a lamination press.
  • vias that reach the component terminals from the outside are formed by laser processing.
  • the via is plated to form a conductive via so as to be electrically connected to the terminal.
  • the present invention has been made in consideration of the above-described prior art, and an object of the present invention is to provide a method for manufacturing a component-embedded substrate that can accommodate a large number of substrates in a press and can increase production efficiency.
  • a method for manufacturing a component-embedded substrate wherein a stacked body is formed by stacking a plurality of the intermediate bodies and stacking the support body on the uppermost side, and pressurizing from above and below the stacked body.
  • the entire surface of the support plate is covered with the metal film.
  • blast polishing using alumina # 1000 to # 1500 or glass beads # 200 to # 400 in advance on the contact surface of the support plate with the metal film, or approximately # 320 Apply scrubbing.
  • another electrical or electronic component is mounted on the other surface of the support.
  • the support plate used in the above-described method for manufacturing a component-embedded substrate has a surface roughness Ra of 0.15 ⁇ m to 0.60 ⁇ m and a colorimeter L value of 65 to 75 including the side surfaces.
  • a support plate is also provided.
  • the support in which the metal film is adhered to at least both surfaces of the support plate is formed in the support formation process.
  • a stacked body in which a plurality of intermediate bodies using the support are stacked and the support is stacked on the uppermost side is formed, and pressure is applied from above and below the stacked body.
  • an intermediate plate and a backing plate are not required at the time of the lamination press, and the lamination height per product can be reduced. Therefore, a large number of substrates can be accommodated in the press machine, and production efficiency can be improved.
  • the support plate since the entire surface of the support plate is covered with the metal film in the support formation process, the support plate is covered not only with the upper and lower surfaces, but also with all the side surfaces covered with the metal film, and is entirely wrapped. Thereby, it can prevent that a metal film peels from the peripheral side of a support plate.
  • the number of support plates can be halved when manufacturing a double-sided component-embedded substrate. That is, it is possible to provide a substrate mounting surface for two substrates by using both surfaces of a single support.
  • a support forming step is performed.
  • the support plate 11 is plated, and the entire surface of the support plate 11 including the side surfaces of the support plate 11 is covered with the metal film 12.
  • the metal film 12 is specifically a copper foil.
  • the support plate 11 has a degree of rigidity required for process conditions.
  • the support plate 11 is formed of a rigid SUS (stainless steel) plate or aluminum plate as a support device.
  • the metal film 12 Since the metal film 12 will be used as a conductor pattern of the substrate in the future, it should be formed only on both surfaces except at least the side surface of the support plate 11. That is, only the upper metal foil 8 that is in close contact with one surface of the support plate 11 and the lower metal foil 9 that is in close contact with the other surface may be used. However, since the metal film 12 is easily peeled from the peripheral side of the support plate 11 in a state where the metal film 12 is attached only to both surfaces, it is preferable to cover the side surfaces. When the side surface of the support plate 11 is covered in this manner, due to the difference in thermal expansion coefficient between the support plate 11 and the metal film 12, stress is exerted on the contact surface between the two in the manufacturing process at 100 ° C. to 270 ° C.
  • the surface roughness of the support plate 11 is preferably Ra 0.15 ⁇ m to 0.60 ⁇ m, and the color difference meter L value is preferably 65 to 75.
  • an electrical or electronic component 3 is mounted on one surface of the support 5 (specifically, the surface of the upper metal foil 8). More specifically, an adhesive layer (not shown) made of an insulating material adhesive is first formed on the upper metal foil 8. This adhesive layer is applied to the upper metal foil 8 by using, for example, a dispenser or printing. Then, the component 3 is mounted on the adhesive layer. The mounted component 3 includes an active component and a passive component. Then, the insulator 4 made of an insulating material such as a thermosetting resin (prepreg) is further mounted on one surface of the support 5 (the surface of the upper metal foil 8).
  • preg thermosetting resin
  • a through hole 14 is previously formed in the insulator 4 by a laser or the like, and this through hole 14 is provided in a region where the component 3 to be mounted on the upper metal foil 8 is mounted. Therefore, when the insulator 4 is mounted on the upper metal foil 8, the component 3 is inserted into the through hole 14. Thereby, the intermediate body 10 in which the component 3 and the insulator 4 are mounted on the support body 5 is formed.
  • the laminated body 15 is formed, and this is accommodated in a press machine (not shown) and pressurized from above and below.
  • the stacked body 15 is formed by stacking a plurality of intermediate bodies 10 and further stacking the support body 5 on the uppermost side.
  • the press machine has a plurality of stages of storage spaces, and each stage is provided with a carrier plate 16.
  • a cushion paper 17 is placed on the carrier plate 16, and a backing plate 18 is placed thereon.
  • the backing plate 18 is an approximately 1 mm resin plate with copper foil pasted on both sides, but the copper foil is not essential.
  • the stacked body 15 is placed on the backing plate 18. In this way, the stacked body 15 is accommodated in each stage of the press.
  • the laminated body 15 is pressed while being heated under vacuum from above and below.
  • the insulator 4 flows into the through hole 15 to become the insulating layer 2, and the component 3 is embedded in the insulating layer 2.
  • the support plate 11 is removed and a normal substrate manufacturing process is performed.
  • the lower metal foil 9 is disposed on the upper side and the upper metal foil 8 is disposed on the lower side per substrate (state of FIG. 5).
  • a hole reaching the component 3 is made using a laser or the like to form a via (not shown).
  • a desmear process is performed to remove the resin remaining during the via formation.
  • the component-embedded substrate 1 obtained through such a process includes an insulating layer 2, a component 3, and a conductor pattern 6, as shown in FIG. As shown in FIG. 4, when two stacked bodies 10 are stacked to form the stacked body 15, two substrates 1 are obtained.
  • another electrical or electronic component 13 may be mounted on the other surface of the support 5.
  • substrate can be manufactured.
  • the number of support plates 11 used for stacking can be halved. That is, it is possible to provide a substrate mounting surface for two substrates by using both surfaces of a single support 5. Moreover, the manufacturing cost of the support body 5 can be significantly reduced.
  • FIG. 8 a conventional laminated body 7 is shown in FIG. 8 for comparison.
  • the metal film 12 is formed only on one surface of the support plate 11, it is necessary to separately provide the metal film 19 on the surface opposite to the metal film 12 with the insulating layer 2 interposed therebetween. And in order to press this, the intermediate board 20 was required on this metal film 19.
  • FIG. On top of that, a unit to be another product of the substrate 1 is stacked thereon via a backing plate 18. That is, in order to obtain two substrates as described above, when accommodated in a conventional press, the carrier plate 16, the cushion paper 17, the backing plate 18, the support plate 11, the metal film 12, the insulating layer 2 from below.
  • the metal film 19, the intermediate plate 20, the backing plate 18, the support plate 11, the metal film 12, the insulating layer 2, the metal film 19, and the support plate 11 are required.
  • a backing plate (thickness: 1.0 mm) and an intermediate plate (thickness: 1.0 mm) are unnecessary. For this reason, it is possible to further stack the intermediates accordingly, and it is possible to increase the number of substrates that can be accommodated in the press and increase the production efficiency.
  • SYMBOLS 1 Component built-in board 2 Insulating layer 3 Electrical or electronic component 4 Insulator 5 Support body 6 Conductive pattern 7 Conventional laminated body 8 Upper metal foil 9 Lower metal foil 10 Intermediate body 11 Support plate 12 Metal film 13 Electricity or Electronic component 14 Through-hole 15 Laminate 16 Carrier plate 17 Cushion paper 18 Pad plate 19 Metal film 20 Intermediate plate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

This method for manufacturing an embedded component substrate is equipped with: a support body formation step, wherein a support body (5) is formed by adhering a metal film (12) on at least both surfaces of a support plate (11); a mounting step, wherein an intermediate body (10) is formed by mounting, on at least one of the surfaces of the support body (5), electric or electronic components (3) and insulating bodies (4); and a lamination step, wherein the insulating bodies (4) are pressed, thereby forming an insulation layer and embedding the components (3) within the insulation layer. In the lamination step a laminated body (15) is formed by stacking multiple intermediate bodies (10), with a support body (5) at the top of the stack, and applying pressure from above and below the laminated body (15).

Description

部品内蔵基板の製造方法Manufacturing method of component-embedded substrate
　本発明は、部品内蔵基板の製造方法に関する。 The present invention relates to a method for manufacturing a component-embedded substrate.
　部品内蔵基板の製造方法としては、種々の方法がある（例えば特許文献１参照）。この方法は、銅箔上へディスペンサー又は印刷工法により接着層を形成し、その上に内蔵すべき部品を搭載し、接着層を硬化して部品を固定するものである。そして、プリプレグ等の絶縁層を形成し、積層プレスにより、部品を絶縁材内に埋め込む。そして、外側から部品の端子に到達するようなビアをレーザ加工により形成する。そして、このビアにめっき加工を施して導通ビアとし、端子との電気的接続を図っている。 There are various methods for manufacturing a component-embedded substrate (see, for example, Patent Document 1). In this method, an adhesive layer is formed on a copper foil by a dispenser or a printing method, a component to be incorporated is mounted thereon, the adhesive layer is cured, and the component is fixed. Then, an insulating layer such as a prepreg is formed, and the component is embedded in the insulating material by a lamination press. Then, vias that reach the component terminals from the outside are formed by laser processing. Then, the via is plated to form a conductive via so as to be electrically connected to the terminal.
　しかしながら、上記積層プレスをする際、プレス機の高さ方向の幅は決まっているため、収容できる高さには限りがある。このため、１製品あたりに使用する部材数を少なくして、プレス機に多数の製品を収容することで、製造効率の向上が求められている。部品内蔵基板を製造する場合、片面に銅箔が貼られた片面銅箔付き支持板が用いられている。この場合に、１製品あたり中間板と当て板がプレスに際して必要になる。上述した中間板と当て板が不要となれば、プレス機に収容できる基板の数が向上するため好ましい。 However, when performing the above laminating press, the width in the height direction of the press machine is fixed, so the height that can be accommodated is limited. For this reason, improvement of manufacturing efficiency is calculated | required by reducing the number of members used per product and accommodating many products in a press. When manufacturing a component built-in substrate, a support plate with a single-sided copper foil in which a copper foil is pasted on one side is used. In this case, an intermediate plate and a backing plate are required for one product. If the intermediate plate and the contact plate described above are unnecessary, it is preferable because the number of substrates that can be accommodated in the press machine is improved.
特開２０１０－２７９１７号公報JP 2010-27917 A
　本発明は、上記従来技術を考慮したものであり、プレス機に多数の基板を収容することができ、生産効率を高めることができる部品内蔵基板の製造方法を提供することを目的とする。 The present invention has been made in consideration of the above-described prior art, and an object of the present invention is to provide a method for manufacturing a component-embedded substrate that can accommodate a large number of substrates in a press and can increase production efficiency.
　前記目的を達成するため、本発明では、支持板の少なくとも両面に金属膜を密着させて支持体を形成する支持体形成工程と、前記支持体の少なくとも一方の面に電気又は電子的な部品及び絶縁体を搭載して中間体を形成する搭載工程と、前記絶縁体を加圧して絶縁層を形成し、該絶縁層内に前記部品を埋設する積層工程とを備え、前記積層工程にて、前記中間体を複数重ねて且つ最も上側に前記支持体を重ねた被積層体を形成し、該被積層体の上下側から加圧することを特徴とする部品内蔵基板の製造方法を提供する。 In order to achieve the above object, in the present invention, a support forming step of forming a support by bringing a metal film into close contact with at least both surfaces of the support plate, an electrical or electronic component on at least one surface of the support, and A mounting step of mounting an insulator to form an intermediate; and a stacking step of pressurizing the insulator to form an insulating layer and embedding the component in the insulating layer. Provided is a method for manufacturing a component-embedded substrate, wherein a stacked body is formed by stacking a plurality of the intermediate bodies and stacking the support body on the uppermost side, and pressurizing from above and below the stacked body.
　好ましくは、前記支持体形成工程にて、前記支持板の表面を全て前記金属膜にて覆う。 Preferably, in the support body forming step, the entire surface of the support plate is covered with the metal film.
　好ましくは、前記支持体形成工程にて、前記支持板に対して前記金属膜との密着面に予めアルミナ＃１０００～＃１５００又はガラスビーズ＃２００～＃４００を用いたブラスト研磨、若しくは略＃３２０のスクラブ研磨を施す。 Preferably, in the support formation step, blast polishing using alumina # 1000 to # 1500 or glass beads # 200 to # 400 in advance on the contact surface of the support plate with the metal film, or approximately # 320 Apply scrubbing.
　好ましくは、前記搭載工程にて、前記支持体の他方の面に他の電気又は電子的な部品を搭載する。 Preferably, in the mounting step, another electrical or electronic component is mounted on the other surface of the support.
　また、本発明では、上記部品内蔵基板の製造方法に用いる支持板であって、側面を含む表面全体の表面粗さがＲａ０．１５μｍ～０．６０μｍ、且つ色差計Ｌ値は６５～７５である支持板も提供する。 In the present invention, the support plate used in the above-described method for manufacturing a component-embedded substrate has a surface roughness Ra of 0.15 μm to 0.60 μm and a colorimeter L value of 65 to 75 including the side surfaces. A support plate is also provided.
　本発明によれば、支持体形成工程にて支持板の少なくとも両面に金属膜が密着された支持体を形成する。そして積層工程にて、この支持体を用いた中間体を複数重ね、且つ最も上側に支持体を重ねた被積層体を形成し、被積層体の上下側から加圧する。このため、片面のみに金属膜が密着された支持体を用いることに比べ、積層プレスの際に中間板や当て板が不要となり、１製品あたりの積層高さを減少させることができる。したがって、プレス機に多数の基板を収容することができ、生産効率を高めることができる。 According to the present invention, the support in which the metal film is adhered to at least both surfaces of the support plate is formed in the support formation process. In the stacking step, a stacked body in which a plurality of intermediate bodies using the support are stacked and the support is stacked on the uppermost side is formed, and pressure is applied from above and below the stacked body. For this reason, compared with using the support body in which the metal film is adhered to only one side, an intermediate plate and a backing plate are not required at the time of the lamination press, and the lamination height per product can be reduced. Therefore, a large number of substrates can be accommodated in the press machine, and production efficiency can be improved.
　また、支持体形成工程にて、支持板の表面を全て金属膜にて覆うため、支持板は上下両面のみならず、側面も全て金属膜で覆われ、全体的に包まれることになる。これにより、金属膜が支持板の周縁側から剥がれていくことを防止できる。 In addition, since the entire surface of the support plate is covered with the metal film in the support formation process, the support plate is covered not only with the upper and lower surfaces, but also with all the side surfaces covered with the metal film, and is entirely wrapped. Thereby, it can prevent that a metal film peels from the peripheral side of a support plate.
　また、搭載工程にて、支持板の他方の面に他の電気又は電子的な部品を搭載することにより、両面部品内蔵基板を製造する場合に支持板の枚数を半分にすることができる。すなわち、一枚の支持体の両面を利用して２個の基板に対する基板実装面を提供することができる。 Also, by mounting other electrical or electronic components on the other surface of the support plate in the mounting process, the number of support plates can be halved when manufacturing a double-sided component-embedded substrate. That is, it is possible to provide a substrate mounting surface for two substrates by using both surfaces of a single support.
本発明に係る部品内蔵基板の製造方法を順番に説明するための概略図である。It is the schematic for demonstrating in order the manufacturing method of the component built-in board which concerns on this invention. 本発明に係る部品内蔵基板の製造方法を順番に説明するための概略図である。It is the schematic for demonstrating in order the manufacturing method of the component built-in board which concerns on this invention. 本発明に係る部品内蔵基板の製造方法を順番に説明するための概略図である。It is the schematic for demonstrating in order the manufacturing method of the component built-in board which concerns on this invention. 本発明に係る部品内蔵基板の製造方法を順番に説明するための概略図である。It is the schematic for demonstrating in order the manufacturing method of the component built-in board which concerns on this invention. 本発明に係る部品内蔵基板の製造方法を順番に説明するための概略図である。It is the schematic for demonstrating in order the manufacturing method of the component built-in board which concerns on this invention. 本発明に係る部品内蔵基板の製造方法を順番に説明するための概略図である。It is the schematic for demonstrating in order the manufacturing method of the component built-in board which concerns on this invention. 被積層体の別の例を示す概略図である。It is the schematic which shows another example of a laminated body. 従来の被積層体の概略図である。It is the schematic of the conventional laminated body.
　本発明に係る部品内蔵基板の製造方法は、まず、支持体形成工程を行う。この工程は、図１に示すように、支持板１１にめっき処理を施し、支持板１１の側面を含む支持板１１の表面を全て金属膜１２で覆う。これにより、支持体５が形成される。めっき処理は電気銅めっき処理で行われるので、金属膜１２は具体的には銅箔である。なお、支持板１１は、プロセス条件にて必要とされる程度の剛性を有する。支持板１１は、支持機材として剛性のあるＳＵＳ（ステンレス）板又はアルミ板等で形成されている。 In the method for manufacturing a component-embedded substrate according to the present invention, first, a support forming step is performed. In this step, as shown in FIG. 1, the support plate 11 is plated, and the entire surface of the support plate 11 including the side surfaces of the support plate 11 is covered with the metal film 12. Thereby, the support body 5 is formed. Since the plating process is performed by an electrolytic copper plating process, the metal film 12 is specifically a copper foil. The support plate 11 has a degree of rigidity required for process conditions. The support plate 11 is formed of a rigid SUS (stainless steel) plate or aluminum plate as a support device.
　金属膜１２は、将来的に基板の導体パターンとして用いられるものであるから、少なくとも支持板１１の側面を除く両面のみに形成されていればよい。すなわち、支持板１１の一方の面に密着する上側金属箔８、及び他方の面に密着する下側金属箔９のみでもよい。しかしながら、両面のみに金属膜１２が貼り付けられた状態では、支持板１１の周縁側から金属膜１２が剥がれやすいため、側面まで覆うことが好ましい。このように支持板１１の側面まで覆うと、支持板１１と金属膜１２との熱膨張率の差異により、接着剤の硬化に伴う１００℃～２７０℃の製造プロセスで両者の密着面に応力が集中し、この発散によってやはり剥離が問題となる。この場合、支持板１１と金属膜１２との密着面にアルミナ＃１０００～＃１５００、ガラスビーズ＃２００～＃４００を用いたブラスト研磨、あるいは＃３２０程度のスクラブ研磨を施すことで金属膜１２の剥離を防止することができる。したがって、熱膨張率の違いによる剥離と支持板１１の端からの剥離の両方に対応することができる。この場合の支持板１１の表面粗さはＲａ０．１５μｍ～０．６０μｍ、色差計Ｌ値は６５～７５が好ましい。 Since the metal film 12 will be used as a conductor pattern of the substrate in the future, it should be formed only on both surfaces except at least the side surface of the support plate 11. That is, only the upper metal foil 8 that is in close contact with one surface of the support plate 11 and the lower metal foil 9 that is in close contact with the other surface may be used. However, since the metal film 12 is easily peeled from the peripheral side of the support plate 11 in a state where the metal film 12 is attached only to both surfaces, it is preferable to cover the side surfaces. When the side surface of the support plate 11 is covered in this manner, due to the difference in thermal expansion coefficient between the support plate 11 and the metal film 12, stress is exerted on the contact surface between the two in the manufacturing process at 100 ° C. to 270 ° C. accompanying the curing of the adhesive. Concentration, and this divergence still causes separation. In this case, blast polishing using alumina # 1000 to # 1500 and glass beads # 200 to # 400, or scrub polishing of about # 320 is performed on the adhesion surface between the support plate 11 and the metal film 12 to form the metal film 12. Peeling can be prevented. Therefore, it is possible to cope with both peeling due to the difference in thermal expansion coefficient and peeling from the end of the support plate 11. In this case, the surface roughness of the support plate 11 is preferably Ra 0.15 μm to 0.60 μm, and the color difference meter L value is preferably 65 to 75.
　次に、搭載工程を行う。この工程は、図２に示すように、支持体５の一方の面（具体的には上側金属箔８の表面）に電気又は電子的な部品３を搭載する。より詳しくは、まず上側金属箔８上に絶縁材料の接着剤からなる接着層（不図示）を形成する。この接着層は上側金属箔８に例えばディスペンサーや印刷等を用いて塗布される。そして、この接着層上に部品３が搭載される。搭載される部品３には能動部品や受動部品も含まれる。そして、熱硬化性樹脂（プリプレグ）等の絶縁材料からなる絶縁体４をさらに支持体５の一方の面（上側金属箔８の表面）に搭載する。絶縁体４には予めレーザ等により貫通孔１４が形成されていて、この貫通孔１４は上側金属箔８に搭載されるべき部品３が搭載される領域に設けられている。したがって、絶縁体４を上側金属箔８に搭載すると、部品３は貫通孔１４内に挿通される。これにより、支持体５上に部品３と絶縁体４とが搭載された中間体１０が形成される。 Next, the mounting process is performed. In this step, as shown in FIG. 2, an electrical or electronic component 3 is mounted on one surface of the support 5 (specifically, the surface of the upper metal foil 8). More specifically, an adhesive layer (not shown) made of an insulating material adhesive is first formed on the upper metal foil 8. This adhesive layer is applied to the upper metal foil 8 by using, for example, a dispenser or printing. Then, the component 3 is mounted on the adhesive layer. The mounted component 3 includes an active component and a passive component. Then, the insulator 4 made of an insulating material such as a thermosetting resin (prepreg) is further mounted on one surface of the support 5 (the surface of the upper metal foil 8). A through hole 14 is previously formed in the insulator 4 by a laser or the like, and this through hole 14 is provided in a region where the component 3 to be mounted on the upper metal foil 8 is mounted. Therefore, when the insulator 4 is mounted on the upper metal foil 8, the component 3 is inserted into the through hole 14. Thereby, the intermediate body 10 in which the component 3 and the insulator 4 are mounted on the support body 5 is formed.
　次に、積層工程を行う。この工程は、図３に示すように、被積層体１５を形成し、これをプレス機（不図示）に収容して上下方向から加圧するものである。被積層体１５は、中間体１０が複数重ねられ、さらに最も上側に支持体５が重ねられて形成されている。図３の例では、中間体１０が２個重ねられ、その上に支持体５が重ねられている。プレス機には複数段の収容スペースがあり、各段にはそれぞれキャリアプレート１６が備わっている。このキャリアプレート１６の上にクッション紙１７が載せられ、さらにその上に当て板１８が載せられる。当て板１８は、両面に銅箔が貼られた略１ｍｍの樹脂板であるが、銅箔は必須ではない。そしてこの当て板１８の上に被積層体１５が載せられる。被積層体１５はこのようにしてプレス機の各段に収容される。 Next, a lamination process is performed. In this process, as shown in FIG. 3, the laminated body 15 is formed, and this is accommodated in a press machine (not shown) and pressurized from above and below. The stacked body 15 is formed by stacking a plurality of intermediate bodies 10 and further stacking the support body 5 on the uppermost side. In the example of FIG. 3, two intermediate bodies 10 are stacked, and the support body 5 is stacked thereon. The press machine has a plurality of stages of storage spaces, and each stage is provided with a carrier plate 16. A cushion paper 17 is placed on the carrier plate 16, and a backing plate 18 is placed thereon. The backing plate 18 is an approximately 1 mm resin plate with copper foil pasted on both sides, but the copper foil is not essential. Then, the stacked body 15 is placed on the backing plate 18. In this way, the stacked body 15 is accommodated in each stage of the press.
　そして、上下方向から被積層体１５は真空下で加熱しながらプレスされる。これにより、図４に示すように、絶縁体４が貫通孔１５内に流れ込んで絶縁層２となり、部品３はこの絶縁層２内に埋設される。この後、支持板１１が除去されて通常の基板製造プロセスが行われる。支持板１１が除去されることにより、基板１枚あたり上側に下側金属箔９が、下側に上側金属箔８が配されることになる（図５の状態）。そして、レーザ等を用いて部品３まで到達する孔あけを行い、ビア（不図示）を形成する。ビア形成後、デスミア処理が施され、ビア形成の際に残留している樹脂が除去される。そして、ビア内にめっき処理が施され、導通ビア（不図示）が形成される。この後、エッチング等を用いて絶縁層２の両面に導体パターン６を形成する。このような工程を経て得られた部品内蔵基板１は、図６に示すように、絶縁層２と部品３と、導体パターン６とを備えている。図４のように中間体１０を２個重ねて被積層体１５を形成すると、基板１が２枚得られる。 Then, the laminated body 15 is pressed while being heated under vacuum from above and below. As a result, as shown in FIG. 4, the insulator 4 flows into the through hole 15 to become the insulating layer 2, and the component 3 is embedded in the insulating layer 2. Thereafter, the support plate 11 is removed and a normal substrate manufacturing process is performed. By removing the support plate 11, the lower metal foil 9 is disposed on the upper side and the upper metal foil 8 is disposed on the lower side per substrate (state of FIG. 5). Then, a hole reaching the component 3 is made using a laser or the like to form a via (not shown). After the via is formed, a desmear process is performed to remove the resin remaining during the via formation. Then, plating is performed in the via to form a conductive via (not shown). Thereafter, the conductor pattern 6 is formed on both surfaces of the insulating layer 2 by etching or the like. The component-embedded substrate 1 obtained through such a process includes an insulating layer 2, a component 3, and a conductor pattern 6, as shown in FIG. As shown in FIG. 4, when two stacked bodies 10 are stacked to form the stacked body 15, two substrates 1 are obtained.
　なお、上述した搭載工程にて、支持体５の他方の面に他の電気又は電子的な部品１３を搭載してもよい。これにより、基板として製造した際に両面部品内蔵基板を製造することができる。このとき、積層に用いる支持板１１の枚数を半分にすることができる。すなわち、一枚の支持体５の両面を利用して２個の基板に対する基板実装面を提供することができる。また、大幅な支持体５の製造コストを削減できる。 In the mounting process described above, another electrical or electronic component 13 may be mounted on the other surface of the support 5. Thereby, when manufacturing as a board | substrate, a double-sided component built-in board | substrate can be manufactured. At this time, the number of support plates 11 used for stacking can be halved. That is, it is possible to provide a substrate mounting surface for two substrates by using both surfaces of a single support 5. Moreover, the manufacturing cost of the support body 5 can be significantly reduced.
　ここで、比較のために従来の被積層体７を図８に示す。従来は、支持板１１の片面にのみ金属膜１２が形成されていたので、絶縁層２を介したこの金属膜１２と反対側の面には、別に金属膜１９を設ける必要があった。そしてこれをプレスするために、この金属膜１９の上には中間板２０が必要であった。そして、その上には当て板１８を介してその上に別の基板１製品となるべきユニットが重ねられていた。すなわち、上述したように基板２枚を得るためには、従来プレス機に収容する際には、下からキャリアプレート１６、クッション紙１７、当て板１８、支持板１１、金属膜１２、絶縁層２、金属膜１９、中間板２０、当て板１８、支持板１１、金属膜１２、絶縁層２、金属膜１９、支持板１１が必要となる。 Here, a conventional laminated body 7 is shown in FIG. 8 for comparison. Conventionally, since the metal film 12 is formed only on one surface of the support plate 11, it is necessary to separately provide the metal film 19 on the surface opposite to the metal film 12 with the insulating layer 2 interposed therebetween. And in order to press this, the intermediate board 20 was required on this metal film 19. FIG. On top of that, a unit to be another product of the substrate 1 is stacked thereon via a backing plate 18. That is, in order to obtain two substrates as described above, when accommodated in a conventional press, the carrier plate 16, the cushion paper 17, the backing plate 18, the support plate 11, the metal film 12, the insulating layer 2 from below. The metal film 19, the intermediate plate 20, the backing plate 18, the support plate 11, the metal film 12, the insulating layer 2, the metal film 19, and the support plate 11 are required.
　本発明では、従来必要となっているもののうち、当て板（厚さ１．０ｍｍ）、中間板（厚さ１．０ｍｍ）が不要となっている。このため、その分さらに中間体を重ねることが可能となり、プレス機に収容できる基板枚数を増加させて製造効率を高めることができる。 In the present invention, among those conventionally required, a backing plate (thickness: 1.0 mm) and an intermediate plate (thickness: 1.0 mm) are unnecessary. For this reason, it is possible to further stack the intermediates accordingly, and it is possible to increase the number of substrates that can be accommodated in the press and increase the production efficiency.
１　部品内蔵基板
２　絶縁層
３　電気又は電子的な部品
４　絶縁体
５　支持体
６　導体パターン
７　従来の被積層体
８　上側金属箔
９　下側金属箔
１０　中間体
１１　支持板
１２　金属膜
１３　電気又は電子的な部品
１４　貫通孔
１５　被積層体
１６　キャリアプレート
１７　クッション紙
１８　当て板
１９　金属膜
２０　中間板 DESCRIPTION OF SYMBOLS 1 Component built-in board 2 Insulating layer 3 Electrical or electronic component 4 Insulator 5 Support body 6 Conductive pattern 7 Conventional laminated body 8 Upper metal foil 9 Lower metal foil 10 Intermediate body 11 Support plate 12 Metal film 13 Electricity or Electronic component 14 Through-hole 15 Laminate 16 Carrier plate 17 Cushion paper 18 Pad plate 19 Metal film 20 Intermediate plate

Claims (5)

  1. 　支持板の少なくとも両面に金属膜を密着させて支持体を形成する支持体形成工程と、
    　前記支持体の少なくとも一方の面に電気又は電子的な部品及び絶縁体を搭載して中間体を形成する搭載工程と、
    　前記絶縁体を加圧して絶縁層を形成し、該絶縁層内に前記部品を埋設する積層工程と
    を備え、
    　前記積層工程にて、前記中間体を複数重ねて且つ最も上側に前記支持体を重ねた被積層体を形成し、該被積層体の上下側から加圧することを特徴とする部品内蔵基板の製造方法。     A support forming step of forming a support by closely attaching a metal film to at least both surfaces of the support plate; and
    A mounting step of mounting an electrical or electronic component and an insulator on at least one surface of the support to form an intermediate; and
    A layering step of pressurizing the insulator to form an insulating layer, and embedding the component in the insulating layer;
    In the laminating step, a laminated body in which a plurality of the intermediate bodies are stacked and the support body is stacked on the uppermost side is formed, and pressure is applied from above and below the laminated body. Method.
  2. 　前記支持体形成工程にて、前記支持板の表面を全て前記金属膜にて覆うことを特徴とする請求項１に記載の部品内蔵基板の製造方法。 The method for manufacturing a component-embedded board according to claim 1, wherein in the supporting body forming step, the entire surface of the supporting plate is covered with the metal film.
  3. 　前記支持体形成工程にて、前記支持板に対して前記金属膜との密着面に予めアルミナ＃１０００～＃１５００又はガラスビーズ＃２００～＃４００を用いたブラスト研磨、若しくは略＃３２０のスクラブ研磨を施すことを特徴とする請求項２に記載の部品内蔵基板の製造方法。 In the support forming step, blast polishing using alumina # 1000 to # 1500 or glass beads # 200 to # 400 in advance on the contact surface of the support plate with the metal film, or scrub polishing of approximately # 320 The method for manufacturing a component built-in substrate according to claim 2, wherein:
  4. 　前記搭載工程にて、前記支持体の他方の面に他の電気又は電子的な部品を搭載することを特徴とする請求項２に記載の部品内蔵基板の製造方法。 3. The method of manufacturing a component-embedded board according to claim 2, wherein in the mounting step, another electrical or electronic component is mounted on the other surface of the support.
  5. 　前記支持板は、側面を含む表面全体の表面粗さがＲａ０．１５μｍ～０．６０μｍ、且つ色差計Ｌ値は６５～７５であることを特徴とする請求項３に記載の部品内蔵基板の製造方法に用いる支持板。 The component-embedded substrate according to claim 3, wherein the support plate has a surface roughness Ra of 0.15 μm to 0.60 μm including a side surface and a color difference meter L value of 65 to 75. Support plate used in the method.
PCT/JP2012/073471 2012-09-13 2012-09-13 Method for manufacturing embedded component substrate WO2014041659A1 (en)

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