WO2014015618A1 - 触控面板及其制造方法、触控设备 - Google Patents

触控面板及其制造方法、触控设备 Download PDF

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Publication number
WO2014015618A1
WO2014015618A1 PCT/CN2012/086315 CN2012086315W WO2014015618A1 WO 2014015618 A1 WO2014015618 A1 WO 2014015618A1 CN 2012086315 W CN2012086315 W CN 2012086315W WO 2014015618 A1 WO2014015618 A1 WO 2014015618A1
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WO
WIPO (PCT)
Prior art keywords
layer
conductive layer
conductive
pattern
touch panel
Prior art date
Application number
PCT/CN2012/086315
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English (en)
French (fr)
Inventor
任涛
Original Assignee
北京京东方光电科技有限公司
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Publication of WO2014015618A1 publication Critical patent/WO2014015618A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

Definitions

  • Touch panel manufacturing method thereof, and touch device
  • Embodiments of the present invention relate to a touch panel, a method of fabricating the same, and a touch device. Background technique
  • Touch Sensors are important devices in touch screens for sensing touch points.
  • touch sensors mainly include a resistive touch sensor and a capacitive touch sensor.
  • the resistive touch sensor mainly realizes the sensing of the touch point by providing two layers of non-contact ITO (Indium-Tin-Oxide) conductive film in the touch area of the display screen;
  • ITO Indium-Tin-Oxide
  • the main disadvantages of the sensor are: The upper and lower ITO conductive films are prone to contact failure, which makes the resistive touch response insensitive, and the resolution of handwriting or pen writing is low.
  • the capacitive touch mode has high sensitivity and can be directly manipulated by fingers, which is convenient to use;
  • the capacitive touch sensor mainly uses a densely arranged array structure, when the user touches the finger In the array structure, by detecting a high-speed current or voltage scanning signal transmitted by means of a finger, the touched touch position is calculated and analyzed to realize the positioning of the touch point.
  • the conventional touch panel is generally fabricated by a capacitive touch sensor, and includes a pixel structure formed on the substrate and a flexible printed circuit (FPC) lead pad (Pad) structure connected to the pixel structure.
  • the pixel structure includes a first ITO layer 100, a second ITO layer for receiving and transmitting external touch signals, and an insulating layer between the first ITO layer 100 and the second ITO layer (not shown) And a passivation layer (not shown) on the second ITO layer.
  • the second ITO layer includes a horizontal ITO layer 120B and a vertical ITO layer 120A, and the horizontal ITO layer 120B and the vertical ITO layer 120A are insulated from each other by an insulating layer; the first ITO layer 100 passes through two through holes on the insulating layer in the horizontal direction. 110 is in contact with the horizontal ITO layer 120B on both sides, and the first ITO layer 100 is insulated from the vertical ITO layer 120A by an insulating layer.
  • the pixel structures 10 in the touch panel are distributed in an array.
  • the horizontal ITO layers of all pixel structures in the same row are turned on, and the vertical ITO layers of all pixel structures in the same column are turned on.
  • the FPC Pad structures 11 in the touch panel are distributed at the edges of the array of pixel structures, and the horizontal ITO layers of all the pixel structures 10 of each row in the array of pixel structures 10 are connected to a different FPC Pad structure 11.
  • the vertical ITO layers of all of the pixel structures 10 of each column are connected to a different FPC Pad structure 11.
  • the existing touch panel has a good surface visual effect, but the production cost is high, which reduces the market competitiveness of the product.
  • the embodiment of the invention provides a touch panel, a manufacturing method thereof and a touch device, which are used to solve the problem of high manufacturing cost of the conventional touch panel.
  • An embodiment of the present invention provides a touch panel including a pixel structure and a driving circuit connected to the pixel structure, the pixel structure including: a first conductive layer on the substrate, located in the first conductive layer An insulating layer on the second conductive layer on the insulating layer and a passivation layer on the second conductive layer; wherein a pattern of via holes on the insulating layer and the first conductive layer The patterns are the same, and both ends of the first conductive layer are electrically connected to the two horizontal conductive portions of the second conductive layer through the via holes, and the first conductive layer passes through the insulating layer and the The vertical conductive portion of the second conductive layer is insulated; and/or the pattern of the hollow region on the passivation layer is the same as the pattern of the metal layer in the drive circuit.
  • the substrate is glass, plastic, flexible circuit board or insulating film.
  • the material of the first conductive layer is ITO (Indium-Tin-Oxide) or IZO (Indium Zinc Oxide); for the touch panel, for example, the material of the second conductive layer is ITO or IZO.
  • the materials of the first conductive layer and the second conductive layer are
  • the material of the insulating layer is silicon nitride or silicon oxide.
  • the material of the passivation layer is silicon nitride or silicon oxide.
  • Another embodiment of the present invention provides a touch device including any of the above touch panels.
  • a further embodiment of the present invention provides a method of manufacturing the touch panel described above, including: forming a metal layer in a region where a driving circuit on a substrate is located by a first mask process; and performing a second mask process, Forming a first conductive layer, an insulating layer, a second conductive layer, and a passivation layer in a region where the pixel structure on the substrate on which the metal layer is formed; wherein, the insulating layer and the first conductive layer Manufactured by the same mask, and the pattern of the first conductive layer is the same as the pattern of the via of the insulating layer; and/or, the passivation layer and the metal layer are the same mask
  • the pattern of the hollow regions on the passivation layer is the same as the pattern of the metal layer in the driving circuit.
  • FIG. 1 is a schematic top plan view of a pixel structure of a touch panel in the background art
  • FIG. 2 is a schematic top plan view of a touch panel in the background art
  • FIG. 3 is a longitudinal cross-sectional view showing a pixel structure of a touch panel of the present invention.
  • FIG. 4 is a schematic plan view showing a pixel structure of a touch panel of the present invention. detailed description
  • Connected” or “connected” and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
  • “Upper”, “Bottom”, “Left”, “Right”, etc. are only used to indicate the relative positional relationship. When the absolute position of the object to be described is changed, the relative positional relationship may also change accordingly.
  • the pattern of the first conductive layer in the touch panel of the embodiment of the present invention is the same as the pattern of the via holes on the insulating layer; and/or the pattern of the cutout region on the passivation layer is the same as the pattern of the metal layer in the driving circuit. Not only the performance of the traditional touch panel, but also the production cost.
  • the touch panel of the embodiment of the present invention includes a plurality of pixel structures and a driving circuit connected to the pixel structure, each pixel structure includes: a first conductive layer on the substrate; an insulating layer on the first conductive layer; and an insulating layer a second conductive layer; and a passivation layer on the second conductive layer.
  • the substrate of the embodiment of the invention may be glass, plastic, flexible circuit board or insulating film.
  • the second conductive layer functions to receive an external touch signal
  • the second conductive layer includes a vertical conductive portion as a longitudinal signal conducting line and is respectively located on both sides of the vertical conductive portion and insulated from the vertical conductive portion.
  • the horizontal conductive portion of the second conductive layer is insulated from the vertical conductive portion, and the horizontally adjacent two horizontal conductive portions are bridged by the first conductive layer to achieve electrical connection.
  • the pattern of the via holes on the insulating layer is the same as the pattern of the first conductive layer, and the two are spaced apart by a certain distance in the spatial position; in the actual structure, the two ends of the via of the insulating layer and the first There are overlapping regions at both ends of the conductive layer, in which the horizontal conductive portion of the second conductive layer is in direct contact with the first conductive layer to achieve electrical connection of the two horizontal conductive portions; and other non-overlapping The region between the first conductive layer and the second conductive layer is isolated (ie, insulated) by an insulating layer.
  • the material of the first conductive layer may be an oxide such as ITO or IZO; and the material of the second conductive layer may be an oxide conductive material such as ITO or IZO. It should be noted that the material of the second conductive layer may be the same as or different from the material of the first conductive layer.
  • the first conductive layer and the second conductive layer are both made of ITO material.
  • the insulating material may be silicon nitride or silicon oxide.
  • the passivation layer is used to protect the substrate, the first conductive layer, the second conductive layer, and the insulating layer from the external environment; in addition, the passivation layer can also make the second conductive layer and the outside Insulation to avoid interference; the passivation layer is made of an insulating material, specifically silicon nitride or silicon oxide.
  • the vertical conductive portions of the second conductive layer of each pixel structure are connected to the metal layers in a different FPC Pad structure; the two horizontal conductive portions of the second conductive layer of each pixel structure One of them is connected to a metal layer in a different FPC Pad structure; therefore, the number of FPC Pad structures in the touch panel is at least twice the number of pixel structures.
  • the touch panel of the embodiment of the invention includes the following three different structures.
  • the first structure the pattern of the first conductive layer is the same as the pattern of the via holes of the insulating layer, and the patterns of the passivation layer and the second conductive layer are the same as those of the passivation layer and the second conductive layer in the conventional touch panel. .
  • the third structure the pattern of the first conductive layer is the same as the pattern of the via of the insulating layer, and the pattern of the hollow area on the passivation layer is the same as the pattern of the metal layer in the driving circuit, and the pattern and the tradition of the second conductive layer
  • the pattern of the second conductive layer in the touch panel is the same.
  • the pattern of the first conductive layer is the same as the pattern of the via holes of the insulating layer, that is, the portion of the insulating layer that is etched away during the fabrication process of the insulating layer (ie, the hollow portion corresponding to the via hole in the insulating layer)
  • the pattern is the same as the pattern of the first conductive layer, such that the two ends of the first conductive layer are electrically connected to the two horizontal conductive portions of the second conductive layer respectively through the via holes of the insulating layer, and the first conductive layer passes through the insulating layer and
  • the vertical conductive portion of the second conductive layer is insulated.
  • the pattern of the hollow region on the passivation layer is the same as the pattern of the metal layer in the driving circuit, that is, the pattern of the portion of the passivation layer that is etched away and the pattern of the metal layer during the fabrication of the passivation layer.
  • the portion of the passivation layer that is etched away corresponds to the position of the metal layer.
  • FIG. 3 is a schematic top view of a pixel structure
  • FIG. 4 is an AA of the pixel structure shown in FIG. 3. Schematic diagram of the cross-sectional structure of the direction.
  • each pixel structure of the touch panel of the embodiment of the present invention includes: a first conductive layer 20 on the substrate 10, an insulating layer 30 on the first conductive layer 20, and a first layer on the insulating layer 30. Two conductive layers.
  • the second conductive layer includes a vertical conductive portion 40A and horizontal conductive portions 40B and 40C respectively located on both sides of the vertical conductive portion 40A and insulated from the vertical conductive portion 40A, that is, two horizontal conductive portions 40B and 40C of the second conductive layer And between any two portions of the vertical conductive portion 40A are insulated; and the passivation layer 50 on the second conductive layer; the pattern of the first conductive layer 20 is the same as the pattern of the via holes of the insulating layer 30, and is blunt The pattern of the hollowed out area on the layer 50 is the same as the pattern of the metal layer in the driving circuit;
  • the pattern of the first conductive layer 20 in the embodiment of the present invention is the same as the pattern of the via holes of the insulating layer 30, and the first conductive layer 20 is formed in the insulating layer.
  • Both ends 20B and 20C of the first conductive layer 20 are connected to the two horizontal conductive portions 40B and 40C of the second conductive layer through the both ends 30B and 30C of the via of the insulating layer 30, respectively, so that the two horizontal conductive portions 40B and 40C Signals can be transmitted between the first conductive layer 20 therebetween.
  • the first conductive layer 20 and the vertical conductive portion 40A are insulated from each other by the insulating layer 30, that is, the first conductive
  • the horizontal portion 20A of the layer 20 is spaced apart from the horizontal portion 30A of the via of the insulating layer 30 by a set distance to ensure that the horizontal portion 20A of the first conductive layer 20 does not overlap with the horizontal portion 30A of the via of the insulating layer 30.
  • the first conductive layer 20 is insulated from the vertical conductive portion 40A.
  • the pattern of the hollow region on the passivation layer 50 is the same as the pattern of the metal layer in the driving circuit, that is, the pattern of the portion of the passivation layer that is etched away and the metal layer during the fabrication process of the passivation layer.
  • the patterns are the same, and the etched portion of the passivation layer corresponds to the position of the metal layer; except for the bond pad region in the passivation layer 50, other regions are covered by the passivation layer to ensure that except for the bond pad region
  • the other regions have no external leakage conductive layer (first conductive layer and second conductive layer) and a metal layer.
  • the FPC Pad structure of the driving circuit of the touch panel of the embodiment of the present invention can be the same as the FPC Pad structure of the conventional touch panel, and the FPC Pad structure will not be described here.
  • the vertical conductive portions of the second conductive layer of each pixel structure are connected to the metal layers in a different FPC Pad structure; the two horizontal conductive portions of the second conductive layer of each pixel structure One of them is connected to a different metal layer; therefore, in the touch panel
  • the number of FPC Pad structures is at least twice the number of pixel structures.
  • a method for manufacturing a touch panel of the first embodiment of the present invention includes the following steps.
  • Step 501 forming a metal layer in a region where the driving circuit on the substrate is located by a mask process.
  • a metal thin film is deposited on the substrate, and a positive photoresist is coated on the metal thin film, and the first photoresist mask is used for exposure, development, etching, and stripping of the positive photoresist to form The pattern of the metal layer.
  • the metal layer may be made of a single layer of metal (such as molybdenum, aluminum, tungsten, titanium, copper, etc.), or a single layer of alloy material (such as alloys of molybdenum and aluminum), or may be made of molybdenum or aluminum.
  • a multilayer combination of metals such as tungsten, titanium, and copper.
  • Step 502 Form a first conductive layer in a region where the pixel structure on the substrate on which the metal layer is formed by a mask process.
  • a conductive film is deposited on the substrate on which the metal layer is formed, and a positive photoresist is coated on the conductive film, and the second mask is used for exposure, development, etching, and stripping of the positive light.
  • the glue is engraved to form a pattern of the first conductive layer.
  • Step 503 forming an insulating layer on the substrate on which the first conductive layer is formed by a mask process, wherein the insulating layer is formed with via holes; the pattern of the via holes of the insulating layer is the same as the pattern of the first conductive layer, the insulating The layer and the first conductive layer are fabricated through the same mask.
  • the material of the insulating layer may be an insulating material such as silicon nitride or silicon oxide.
  • the first conductive layer and the insulating layer are both formed by the second mask.
  • the pattern of the first conductive layer is formed by the positive photoresist, and the insulation is formed by the negative photoresist.
  • the pattern of the layer therefore, the pattern of the first conductive layer is the same as the pattern of the via of the insulating layer, that is, the pattern of the portion that is etched away during the process of forming the insulating layer (ie, the hollow portion corresponding to the via hole in the insulating layer) The same pattern as the first conductive layer.
  • the mask is translated upward or downward by a certain distance, so that both ends of the first conductive layer can be hollowed out through the insulating layer.
  • a portion is connected to the two horizontal conductive portions of the second conductive layer, and the first conductive layer is insulated from the vertical portion of the second conductive layer by the insulating layer.
  • Step 504 forming a second conductive layer on the substrate on which the insulating layer is formed by a mask process
  • a conductive film is deposited on a substrate on which an insulating layer is formed, and a positive photoresist is coated on the conductive film, and the third mask is used for exposure, development, etching, and stripping of the positive light.
  • the glue is engraved to form a pattern of the second conductive layer.
  • the material of the second conductive layer may be a transparent conductive material such as an oxide conductive material such as ITO or IZO.
  • the material of the second conductive layer may be the same as or different from the material of the first conductive layer.
  • the first conductive layer and the second conductive layer are both made of ITO material.
  • Step 505 forming a passivation layer on the substrate on which the second conductive layer is formed by a mask process to protect all structures on the substrate;
  • the material of the passivation layer is made of an insulating material, specifically silicon nitride or silicon oxide. It should be noted that the material of the passivation layer may be the same as or different from the material of the insulating layer; preferably, the passivation layer and the insulating layer are made of the same material.
  • a second method for manufacturing a touch panel according to an embodiment of the present invention includes the following steps.
  • Step 601 Form a metal layer in a region where the driving circuit on the substrate is located by a mask process.
  • a metal thin film is deposited on the substrate, and a positive photoresist is coated on the metal thin film, and the first photoresist mask is used for exposure, development, etching, and stripping of the positive photoresist to form The pattern of the metal layer.
  • Step 602 Form a first conductive layer in a region where the pixel structure on the substrate on which the metal layer is formed by a mask process.
  • the material of the first conductive layer is made of a transparent conductive material, and may be an oxide conductive material such as ITO or IZO.
  • Step 603 forming an insulating layer on the substrate on which the first conductive layer is formed by a mask process.
  • the material of the insulating layer is made of an insulating material and may be silicon nitride or silicon oxide.
  • Step 604 forming a second conductive layer on the substrate on which the insulating layer is formed by a mask process.
  • a conductive film is deposited on the substrate on which the insulating layer is formed, and a positive photoresist is coated on the conductive film, and the fourth mask is used for exposure, development, etching, and stripping of the positive light.
  • the glue is engraved to form a pattern of the second conductive layer.
  • the material of the second conductive layer is made of a transparent conductive material, which may be oxidized by ITO or IZO. Things.
  • the material of the second conductive layer may be the same as or different from the material of the first conductive layer.
  • the first conductive layer and the second conductive layer are both made of ITO material.
  • Step 605 forming a passivation layer on the substrate on which the second conductive layer is formed by a mask process to protect all structures on the substrate, wherein the passivation layer and the metal layer are the same mask
  • the board is formed, and the pattern of the hollow area on the passivation layer is the same as the pattern of the metal layer in the driving circuit.
  • a thin film of insulating material is deposited on the substrate on which the second conductive layer is formed, and a negative photoresist is coated on the insulating material film, and the first mask is used for exposure, development, etching, and The negative photoresist is stripped to form a pattern of the passivation layer; since a negative photoresist is used in the process of forming the passivation layer, the pattern of the cutout region on the passivation layer is the same as the pattern of the metal layer.
  • the material of the passivation layer is made of an insulating material, which may be silicon nitride or silicon oxide. It should be noted that the material of the passivation layer may be the same as or different from the material of the insulating layer; preferably, the passivation layer Use the same material as the insulation layer.
  • the conventional touch panel uses 5 mask processes during the fabrication process and requires the use of 5 masks.
  • the manufacturing process of the second touch panel of the embodiment of the present invention since the pattern of the hollow region on the insulating layer is the same as the pattern of the metal layer, the insulating layer and the metal layer can be fabricated by using the same mask, that is, only Using 4 masks, 5 masks are needed compared to the traditional touch panel manufacturing process, reducing the number of masks. Due to the high cost of the mask, the number of masks is reduced. , can reduce the manufacturing cost of the touch panel.
  • a method for manufacturing a touch panel of the first embodiment of the present invention includes the following steps.
  • Step 701 Form a metal layer in a region where the driving circuit on the substrate is located by a mask process.
  • a metal thin film is deposited on the substrate, and a positive photoresist is coated on the metal thin film, and the first photoresist mask is used for exposure, development, etching, and stripping of the positive photoresist to form a pattern of metal layers;
  • the metal layer may be made of a single layer of metal (such as molybdenum, aluminum, tungsten, titanium, copper, etc.), or a single layer of alloy material (such as an alloy of molybdenum and aluminum), or molybdenum, A multilayer combination of metals such as aluminum, tungsten, titanium, and copper.
  • metal such as molybdenum, aluminum, tungsten, titanium, copper, etc.
  • alloy material such as an alloy of molybdenum and aluminum
  • molybdenum A multilayer combination of metals such as aluminum, tungsten, titanium, and copper.
  • Step 702 A pixel structure on a substrate on which a metal layer is formed by a mask process A first conductive layer is formed in the region.
  • a conductive film is deposited on the substrate on which the metal layer is formed, and a positive photoresist is coated on the conductive film, and the second mask is used for exposure, development, etching, and stripping of the positive light.
  • the glue is engraved to form a pattern of the first conductive layer.
  • the material of the first conductive layer is made of a transparent conductive material, and specifically may be an oxide such as ITO or IZO.
  • Step 703 forming an insulating layer on the substrate on which the first conductive layer is formed by a mask process, wherein the insulating layer and the first conductive layer are formed by the same mask, and the pattern of the via of the insulating layer is The patterns of the first conductive layer are the same.
  • a thin film of insulating material is deposited on the substrate on which the first conductive layer is formed, and a negative photoresist is coated on the insulating material film, and the second mask is used for exposure, development, etching, and The negative photoresist is stripped to form a pattern of the insulating layer.
  • the material of the insulating layer is made of an insulating material and may be silicon nitride or silicon oxide.
  • the first conductive layer and the insulating layer are both formed by the second mask.
  • the pattern of the first conductive layer is formed by the positive photoresist, and the insulation is formed by the negative photoresist.
  • the pattern of the layer therefore, the pattern of the first conductive layer is the same as the pattern of the via of the insulating layer, that is, the pattern of the portion that is etched away during the process of forming the insulating layer (ie, the hollow portion in the insulating layer) and the first conductive
  • the layers have the same graphics.
  • the mask is translated upward or downward by a certain distance so that both ends of the first conductive layer can pass through the insulating layer.
  • the hole is connected to the two horizontal conductive portions of the second conductive layer, and the first conductive layer is insulated from the vertical portion of the second conductive layer by the insulating layer.
  • Step 704 forming a second conductive layer on the substrate on which the insulating layer is formed by a mask process.
  • the material of the second conductive layer is made of a transparent conductive material, specifically an oxide such as ITO or IZO.
  • the material of the second conductive layer may be the same as the material of the first conductive layer, or may be different, preferably, The first conductive layer and the second conductive layer are both made of IT0 material.
  • a thin film of insulating material is deposited on the substrate on which the second conductive layer is formed, and a negative photoresist is coated on the insulating material film, and the first mask is used for exposure, development, etching, and The negative photoresist is stripped to form a pattern of the passivation layer.
  • the material of the passivation layer is made of an insulating material, which may be silicon nitride or silicon oxide. It should be noted that the material of the passivation layer may be the same as or different from the material of the insulating layer; preferably, the passivation layer Use the same material as the insulation layer.
  • the conventional touch panel uses 5 mask processes during the fabrication process and requires the use of 5 masks.
  • the third touch panel manufacturing process of the embodiment of the present invention since the pattern of the via holes of the first conductive layer and the insulating layer is the same, and the hollow area on the passivation layer is the same as the pattern of the metal layer in the driving circuit, A conductive layer and an insulating layer can be fabricated using the same mask.
  • the passivation layer and the metal layer can be fabricated using the same mask. Therefore, only three masks can be used, because the cost of the mask is high. In the embodiment of the present invention, the manufacturing cost of the touch panel can be reduced by reducing the number of masks.
  • the touch panel of the embodiment of the invention may be an Add-On touch panel (external touch panel), an On-Cell touch panel (external touch panel) or an In-Cell type touch panel ( In-line touch panel) and so on.
  • the touch device provided by the embodiment of the present invention may include the touch panel described in any of the above embodiments.
  • the two horizontal conductive portions of the second conductive layer in the touch panel of the embodiment of the present invention are electrically connected through the first conductive layer, that is, the first conductive layer is connected to the two horizontal conductive portions of the second conductive layer by a bridge. Therefore, the touch panel of the embodiment of the present invention has a better surface visual effect performance of the conventional touch panel; the pattern of the first conductive layer of the touch panel is the same as the pattern of the via of the insulating layer; and/or The pattern of the hollow region on the passivation layer is the same as the pattern of the metal layer in the driving circuit of the touch panel, so that the number of the mask is reduced during the manufacturing process of the touch panel, thereby reducing the manufacturing cost. Thereby improving the market competitiveness of the product.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
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Abstract

本发明实施例提供了一种触控面板及其制造方法、触控设备。该触控面板包括像素结构及与所述像素结构连接的驱动电路部分，该像素结构包括：位于基板上的第一导电层，位于第一导电层上的绝缘层，位于绝缘层上的第二导电层及位于第二导电层上的钝化层；其中，绝缘层上的过孔的图形与第一导电层的图形相同，而且第一导电层的两端通过该过孔分别与第二导电层的两个水平导电部分电性连接，第一导电层通过绝缘层与第二导电层的垂直导电部分绝缘；和/或，钝化层上的镂空区域的图形与驱动电路的金属层的图形相同。

Description

触控面板及其制造方法、 触控设备 技术领域
本发明的实施例涉及一种触控面板及其制造方法、 及触控设备。 背景技术
触摸屏由于具有节省空间、 良好的人机交互性等优点， 广泛应用于各种 电子设备中， 如手机、 平板电脑、 MP3/MP4/MP5、 PDA ( Personal Digital Assistant, 个人数字助理） 、 家用电器等。
触控传感器（Touch Sensor )是触摸屏中重要的器件， 用于实现对触控 点的感测。 目前常用的触控传感器主要包括电阻式触控传感器和电容式触控 传感器。 电阻式触控传感器主要是通过在显示屏的触控区域设置上下两层不 接触的 ITO ( Indium-Tin-Oxide , 氧化铟锡）导电薄膜， 以实现对触控点的感 测； 电阻式触控传感器的缺点主要是： 上下两层 ITO导电薄膜容易出现接触 故障， 进而使得电阻式触控的反应不灵敏， 对手写或笔写的解析度较低。
相对于电阻式触控模式， 电容式触控模式具有较高的灵敏度， 并可以直 接利用手指操控， 使用方便； 电容式触控传感器主要釆用密集排布的阵列结 构， 当使用者的手指触及阵列结构时， 利用检测借助于手指传导的高速电流 或电压扫描信号， 进而计算并分析出受触控的触控位置， 实现对触摸点的定 位。
现有触控面板一般釆用电容式触控传感器制作， 包括形成于基板上的像 素结构及与该像素结构连接的挠性印刷电路（ Flexible Printed Circuit, FPC ) 引线区域（Pad )结构。 如图 1所示， 该像素结构包括第一 ITO层 100、 用于 接收及传递外界触摸信号的第二 ITO层、 位于第一 ITO层 100与第二 ITO 层之间的绝缘层（图中未示）、以及位于第二 ITO层上的钝化层（图中未示）。 第二 ITO层包括水平 ITO层 120B和垂直 ITO层 120A, 水平 ITO层 120B 和垂直 ITO层 120A之间通过绝缘层相互绝缘； 第一 ITO层 100在水平方向 上通过绝缘层上的两个通孔 110与两侧的水平 ITO层 120B相接触，第一 ITO 层 100通过绝缘层与垂直 ITO层 120A相互绝缘。 如图 2所示，触控面板中的像素结构 10呈阵列分布。 同一行所有像素结 构的水平 ITO层导通， 同一列所有像素结构的垂直 ITO层导通。触控面板中 的 FPC Pad结构 11分布于像素结构组成的阵列的边缘， 像素结构 10组成的 阵列中每一行所有像素结构 10的水平 ITO层连接一个不同的 FPC Pad结构 11。每一列所有像素结构 10的垂直 ITO层连接一个不同的 FPC Pad结构 11。
现有的触控面板具有较好的表面视觉效果， 但由于制作成本高， 降低了 产品的市场竟争力。 发明内容
本发明实施例提供了一种触控面板及其制造方法、 触控设备， 用于解决 传统的触控面板制造成本高的问题。
本发明的一个实施例提供了一种触控面板， 包括像素结构及与所述像素 结构连接的驱动电路， 所述像素结构包括： 位于基板上的第一导电层， 位于 所述第一导电层上的绝缘层， 位于所述绝缘层上的第二导电层及位于所述第 二导电层上的钝化层； 其中， 所述绝缘层上的过孔的图形与所述第一导电层 的图形相同， 而且所述第一导电层的两端通过所述过孔分别与所述第二导电 层的两个水平导电部分电性连接， 所述第一导电层通过所述绝缘层与所述第 二导电层的垂直导电部分绝缘； 和 /或， 所述钝化层上的镂空区域的图形与所 述驱动电路中的金属层的图形相同。
对于该触控面板， 例如， 所述钝化层上的镂空区域的位置与所述金属层 的位置对应。
对于该触控面板， 例如， 所述基板为玻璃、 塑料、 柔性电路板或绝缘薄 膜。
对于该触控面板， 例如， 所述第一导电层的材料为 ITO ( Indium-Tin-Oxide, 氧化铟锡）或 IZO ( Indium Zinc Oxide, 铟辞氧化物）； 对于该触控面板， 例如， 所述第二导电层的材料为 ITO或 IZO。
对于该触控面板， 例如， 所述第一导电层与所述第二导电层的材料为
ITO。
对于该触控面板， 例如， 所述绝缘层的材料为氮化硅或氧化硅。
对于该触控面板， 例如， 所述钝化层的材料为氮化硅或氧化硅。 本发明的另一个实施例提供了一种触控设备，包括上述的任一触控面板。 本发明的再一个实施例提供了一种制造上述的触控面板的方法， 包括： 通过第一掩膜工艺， 在基板上的驱动电路所在的区域内形成金属层； 通过第 二掩膜工艺， 依次在形成了所述金属层的基板上的像素结构所在的区域内形 成第一导电层、 绝缘层、 第二导电层及钝化层； 其中， 所述绝缘层与所述第 一导电层釆用同一个掩膜板制作， 且所述第一导电层的图形与所述绝缘层的 过孔的图形相同； 和 /或， 所述钝化层与所述金属层釆用同一个掩膜板制作， 且所述钝化层上的镂空区域的图形与所述驱动电路中的金属层的图形相同。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1为背景技术中触控面板的像素结构的俯视结构示意图；
图 2为背景技术中触控面板的俯视结构示意图；
图 3为本发明触控面板的像素结构的纵截面示意图；
图 4为本发明触控面板的像素结构的平面结构示意图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
除非另作定义， 此处使用的技术术语或者科学术语应当为本发明所属领 域内具有一般技能的人士所理解的通常意义。 本发明专利申请说明书以及权 利要求书中使用的 "第一" 、 "第二" 以及类似的词语并不表示任何顺序、 数量或者重要性，而只是用来区分不同的组成部分。同样， "一个 "或者 "一" 等类似词语也不表示数量限制， 而是表示存在至少一个。 "包括" 或者 "包 含" 等类似的词语意指出现在 "包括" 或者 "包含" 前面的元件或者物件涵 盖出现在 "包括" 或者 "包含" 后面列举的元件或者物件及其等同， 并不排 除其他元件或者物件。 "连接" 或者 "相连" 等类似的词语并非限定于物理 的或者机械的连接， 而是可以包括电性的连接， 不管是直接的还是间接的。 "上" 、 "下" 、 "左" 、 "右" 等仅用于表示相对位置关系， 当被描述对 象的绝对位置改变后， 则该相对位置关系也可能相应地改变。
本发明的实施例触控面板中的第一导电层的图形与绝缘层上的过孔的图 形相同； 和 /或钝化层上的镂空区域的图形与驱动电路中的金属层的图形相 同， 不仅具有传统触控面板的性能， 还降低了制作成本。
下面结合说明书附图对本发明的实施例作进一步详细描述。
本发明实施例触控面板， 包括多个像素结构及与像素结构连接的驱动电 路，每个像素结构包括： 位于基板上的第一导电层； 位于第一导电层上的绝 缘层； 位于绝缘层上的第二导电层； 及位于第二导电层上的钝化层。
绝缘层上的过孔的图形与所述第一导电层的图形相同， 而且第一导电层 的两端通过该过孔分别与所述第二导电层的两个水平导电部分电性连接， 第 一导电层通过绝缘层与第二导电层的垂直导电部分绝缘； 和 /或， 钝化层上的 镂空区域的图形与驱动电路中的金属层的图形相同， 其中， 驱动电路包括多 个与像素结构连接的挠性印刷电路 FPC Pad结构。
本发明实施例基板可以为玻璃、 塑料、 柔性电路板或绝缘薄膜。
本发明实施例第二导电层的作用是接收外界触摸信号， 该第二导电层包 括作为纵向信号传导线的垂直导电部分及分别位于该垂直导电部分两侧且与 该垂直导电部分相互绝缘的且作为横向信号传导线的水平导电部分； 第二导 电层的水平导电部分与垂直导电部分之间保持绝缘， 横向相邻的两个水平导 电部分通过第一导电层进行搭桥以实现电连接。
例如， 本实施例中绝缘层上的过孔的图形与第一导电层的图形相同， 且 二者在空间位置上相距一定距离； 在实际结构中， 绝缘层的过孔的两端和第 一导电层的两端存在交叠区域， 在该交叠区域内第二导电层的水平导电部分 与第一导电层直接接触， 以实现两个水平导电部分的电性连接； 而在其他非 交叠区域， 第一导电层和第二导电层之间通过绝缘层进行隔离 （即绝缘） 。
本发明实施例第一导电层的材料可以是 ITO或 IZO等氧化物； 第二导电层的材料可以是 ITO或 IZO等氧化物导电材料。 需要说明的是， 第二导电层的材料可以与第一导电层的材料相同， 也可 以不同； 优选的， 第一导电层与第二导电层均釆用 ITO材料。
本发明实施例绝缘层釆用绝缘性材料， 可以是氮化硅或氧化硅。
本发明实施例钝化层用于保护基板、第一导电层、第二导电层及绝缘层， 使其免受外界环境的侵蝕等作用； 另外， 钝化层还可以使第二导电层与外界 绝缘， 以免产生干扰； 钝化层釆用绝缘性材料， 具体可以是氮化硅或氧化硅。
本发明实施例触控面板中每个像素结构的第二导电层的垂直导电部分均 与一个不同的 FPC Pad结构中的金属层连接； 每个像素结构的第二导电层的 两个水平导电部分中的一个均与一个不同的 FPC Pad结构中的金属层连接； 因此， 触控面板中 FPC Pad结构的数量至少是像素结构数量的两倍。
本发明实施例触控面板包括可以以下三种不同的结构。
第一种结构： 第一导电层的图形与绝缘层的过孔的图形相同， 且钝化层 及第二导电层的图形均与传统触控面板中钝化层及第二导电层的图形相同。
第二种结构： 钝化层上的镂空区域的图形与驱动电路中的金属层的图形 相同， 且第一导电层、 第二导电层及绝缘层的图形均与传统触控面板中第一 导电层、 第二导电层及绝缘层的图形相同。
第三种结构： 第一导电层的图形与绝缘层的过孔的图形相同， 且钝化层 上的镂空区域的图形与驱动电路中的金属层的图形相同， 第二导电层的图形 与传统触控面板中第二导电层的图形相同。
本发明实施例第一导电层的图形与绝缘层的过孔的图形相同， 即在绝缘 层的制作过程中， 绝缘层中被刻蚀掉的部分（即绝缘层中过孔对应的镂空部 分） 的图形与第一导电层的图形相同， 使得第一导电层的两端通过绝缘层的 过孔分别与第二导电层的两个水平导电部分电性连接， 且第一导电层通过绝 缘层与第二导电层的垂直导电部分绝缘。
本发明实施例钝化层上的镂空区域的图形与驱动电路中金属层的图形相 同， 即在钝化层的制作过程中， 钝化层中被刻蚀掉的部分的图形与金属层的 图形相同， 且钝化层中被刻蚀掉的部分与金属层的位置对应。
下面以第三种结构为例， 结合图 3和图 4对本发明实施例触控面板的每 个像素结构进行详细说明， 其他两种结构与此类似， 此处不再赘述。
图 3为像素结构的俯视结构示意图， 图 4为图 3所示的像素结构的 A-A 方向的截面结构示意图。
如图 4所示， 本发明实施例触控面板的每个像素结构包括： 位于基板 10 上的第一导电层 20;位于第一导电层 20上的绝缘层 30;位于绝缘层 30上的 第二导电层。第二导电层包括垂直导电部分 40A及分别位于该垂直导电部分 40A两侧且与该垂直导电部分 40A相互绝缘的水平导电部分 40B和 40C,即 第二导电层的两个水平导电部分 40B和 40C及垂直导电部分 40A中任意两 个部分之间都是绝缘的； 及位于第二导电层上的钝化层 50; 第一导电层 20 的图形与绝缘层 30的过孔的图形相同， 且钝化层 50上镂空区域的图形与驱 动电路中的金属层的图形相同；
如图 3所示， 本发明实施例第一导电层 20的图形与绝缘层 30的过孔的 图形相同，第一导电层 20形成于绝缘层中。第一导电层 20的两端 20B和 20C 分别通过绝缘层 30的过孔的两端 30B和 30C与第二导电层的两个水平导电 部分 40B和 40C连接， 使两个水平导电部分 40B和 40C之间能够通过该第 一导电层 20传输信号。
为了保证第二导电层的水平导电部分 40B、 40C与垂直导电部分 40A之 间是绝缘的， 优选的， 第一导电层 20与垂直导电部分 40A之间通过绝缘层 30相互绝缘，即第一导电层 20的水平部分 20A与绝缘层 30的过孔的水平部 分 30A之间相距设定距离， 以保证第一导电层 20的水平部分 20A与绝缘层 30的过孔的水平部分 30A之间不重叠， 从而使第一导电层 20与垂直导电部 分 40A之间绝缘。
本发明实施例钝化层 50 上镂空区域的图形与驱动电路中的金属层的图 形相同， 即在钝化层的制作过程中， 钝化层中被刻蚀掉的部分的图形与金属 层的图形相同， 且钝化层中被刻蚀掉的部分与金属层的位置对应； 钝化层 50 中除了结合垫区域之外， 其它区域均被钝化层覆盖， 以保证除结合垫区域外 的其他区域无外漏导电层（第一导电层及第二导电层）和金属层。 由于本发 明实施例触控面板的驱动电路的 FPC Pad结构可以与传统触控面板的 FPC Pad结构相同， 此处不再对 FPC Pad结构进行说明。
本发明实施例触控面板中每个像素结构的第二导电层的垂直导电部分均 与一个不同的 FPC Pad结构中的金属层连接； 每个像素结构的第二导电层的 两个水平导电部分中的一个均与一个不同的金属层连接； 因此， 触控面板中 FPC Pad结构的数量至少是像素结构数量的两倍。
下面以上述三种触控面板的结构为例， 对本发明实施例触控面板的制造 方法进行详细说明。
本发明实施例第一种触控面板的制造方法包括以下步骤。
步骤 501、 通过一次掩膜工艺， 在基板上的驱动电路所在的区域内形成 金属层。
例如，在基板上沉积一层金属薄膜，并在该金属薄膜上涂覆正性光刻胶， 釆用第一掩膜板进行曝光、 显影、 刻蚀及剥离该正性光刻胶， 以形成金属层 的图形。
该金属层可以釆用单层金属 （如钼、 铝、 钨、 钛、 铜等）材料， 也可以 釆用单层合金材料（如钼和铝的合金等） ， 还可以釆用钼、 铝、 钨、 钛、 铜 等金属的多层组合。
步骤 502、 通过一次掩膜工艺， 在形成了金属层的基板上的像素结构所 在的区域内形成第一导电层。
例如， 在形成了金属层的基板上沉积一层导电薄膜， 并在该导电薄膜上 涂覆正性光刻胶， 釆用第二掩膜板进行曝光、 显影、 刻蚀及剥离该正性光刻 胶， 以形成第一导电层的图形。
例如， 该第一导电层的材料釆用透明导电材料， 可以是氧化铟锡 ( Indium-Tin-Oxide, ITO )或铟辞氧化物（ Indium Zinc Oxide , IZO )等氧化 物。
步骤 503、 通过一次掩膜工艺， 在形成了第一导电层的基板上形成绝缘 层，该绝缘层上形成有过孔； 绝缘层的过孔的图形与第一导电层的图形相同， 该绝缘层与第一导电层通过同一个掩膜板制作。
例如， 在形成了第一导电层的基板上沉积一层绝缘材料薄膜， 并在该绝 缘材料薄膜上涂覆负性光刻胶， 仍釆用第二掩膜板进行曝光、 显影、 刻蚀及 剥离该负性光刻胶， 以形成绝缘层的图形； 绝缘层上的过孔的图形与第一导 电层的图形相同， 且二者在空间位置上相距设定距离； 在实际结构中， 绝缘 层的过孔的两端和第一导电层的两端存在交叠区域， 以便于后续在该交叠区 域内第二导电层的水平导电部分与第一导电层直接接触而实现电性连接。
绝缘层的材料可以釆用绝缘性材料， 例如可以是氮化硅或氧化硅。 需要说明的是， 第一导电层与绝缘层都是通过第二掩膜板形成的， 在形 成过程中， 通过正性光刻胶形成第一导电层的图形， 通过负性光刻胶形成绝 缘层的图形， 因此， 第一导电层的图形与绝缘层的过孔的图形相同， 即在形 成绝缘层的过程中被刻蚀掉的部分（即绝缘层中过孔对应的镂空部分） 的图 形与第一导电层的图形相同。
在绝缘层的形成过程中， 在负性光刻胶上放置第二掩膜板时， 将掩膜板 向上或向下平移一定距离， 以使第一导电层的两端能够通过绝缘层中镂空部 分与第二导电层的两个水平导电部分连接， 且第一导电层通过该绝缘层与第 二导电层的垂直部分绝缘。
步骤 504、 通过一次掩膜工艺， 在形成了绝缘层的基板上形成第二导电 层；
例如， 在形成了绝缘层的基板上沉积一层导电薄膜， 并在该导电薄膜上 涂覆正性光刻胶， 釆用第三掩膜板进行曝光、 显影、 刻蚀及剥离该正性光刻 胶， 以形成第二导电层的图形。
例如，第二导电层的材料可以釆用透明导电材料，例如可以是 ITO或 IZO 等氧化物导电材料。
第二导电层的材料可以与第一导电层的材料相同，也可以不同，优选的， 第一导电层与第二导电层均釆用 ITO材料。
步骤 505、 通过一次掩膜工艺， 在形成了第二导电层的基板上形成钝化 层， 以起到保护基板上所有结构的作用；
例如， 在形成了第二导电层的基板上沉积一层绝缘材料薄膜， 并在该绝 缘材料薄膜上涂覆正性光刻胶， 釆用第四掩膜板进行曝光、 显影、 刻蚀及剥 离该正性光刻胶， 以形成钝化层的图形。
例如， 钝化层的材料釆用绝缘性材料， 具体可以是氮化硅或氧化硅。 需要说明的是， 钝化层的材料可以与绝缘层的材料相同， 也可以不同； 优选的， 钝化层与绝缘层釆用相同的材料。
传统触控面板在制作过程中釆用 5 次掩膜工艺且需要使用 5 张掩膜板 ( mask plate )形成。与此相对，本发明实施例第一种触控面板在制作过程中， 由于第一导电层与绝缘层的过孔的图形相同， 使得第一导电层与绝缘层可以 使用同一张掩膜板制作， 即只需要使用 4张掩膜板， 因此相比于传统触控面 板制作过程中需要使用 5张掩膜板， 减少了掩膜板的个数， 由于掩膜板的成 本高， 通过减少掩膜板的个数， 能够降低触控面板的制造成本。
本发明实施例第二种触控面板的制造方法包括以下步骤。
步骤 601、 通过一次掩膜工艺， 在基板上的驱动电路所在的区域内形成 金属层。
例如，在基板上沉积一层金属薄膜，并在该金属薄膜上涂覆正性光刻胶， 釆用第一掩膜板进行曝光、 显影、 刻蚀及剥离该正性光刻胶， 以形成金属层 的图形。
例如， 该金属层可以釆用单层金属 （如钼、 铝、 钨、 钛、 铜等）材料， 也可以釆用单层合金材料（如钼和铝的合金等） ， 还可以釆用钼、 铝、 钨、 钛、 铜等金属的多层组合。
步骤 602、 通过一次掩膜工艺， 在形成了金属层的基板上的像素结构所 在的区域内形成第一导电层。
例如， 在形成了金属层的基板上沉积一层导电薄膜， 并在该导电薄膜上 涂覆正性光刻胶， 釆用第二掩膜板进行曝光、 显影、 刻蚀及剥离该正性光刻 胶， 以形成第一导电层的图形。
例如， 该第一导电层的材料釆用透明导电材料， 可以是 ITO或 IZO等氧 化物导电材料。
步骤 603、 通过一次掩膜工艺， 在形成了第一导电层的基板上形成绝缘 层。
例如， 在形成了第一导电层的基板上沉积一层绝缘材料薄膜， 并在该绝 缘材料薄膜上涂覆正性光刻胶， 釆用第三掩膜板进行曝光、 显影、 刻蚀及剥 离该正性光刻胶， 以形成绝缘层的图形。
例如， 绝缘层的材料釆用绝缘性材料， 可以是氮化硅或氧化硅。
步骤 604、 通过一次掩膜工艺， 在形成了绝缘层的基板上形成第二导电 层。
例如， 在形成了绝缘层的基板上沉积一层导电薄膜， 并在该导电薄膜上 涂覆正性光刻胶， 釆用第四掩膜板进行曝光、 显影、 刻蚀及剥离该正性光刻 胶， 以形成第二导电层的图形。
例如， 第二导电层的材料釆用透明导电材料， 可以是 ITO或 IZO等氧化 物。
第二导电层的材料可以与第一导电层的材料相同，也可以不同，优选的， 第一导电层与第二导电层均釆用 ITO材料。
步骤 605、 通过一次掩膜工艺， 在形成了第二导电层的基板上形成钝化 层， 以起到保护基板上所有结构的作用， 其中， 该钝化层与金属层釆用同一 个掩膜板制作， 且钝化层上的镂空区域的图形与驱动电路中的金属层的图形 相同。
例如， 在形成了第二导电层的基板上沉积一层绝缘材料薄膜， 并在该绝 缘材料薄膜上涂覆负性光刻胶， 仍釆用第一掩膜板进行曝光、 显影、 刻蚀及 剥离该负性光刻胶， 以形成钝化层的图形； 由于在形成钝化层的过程中使用 负性光刻胶， 因此， 钝化层上的镂空区域的图形与金属层的图形相同。
例如， 钝化层的材料釆用绝缘性材料， 可以是氮化硅或氧化硅； 需要说明的是， 钝化层的材料可以与绝缘层的材料相同， 也可以不同； 优选的， 钝化层与绝缘层釆用相同的材料。
传统触控面板在制作过程中釆用 5次掩膜工艺且需要使用 5张掩膜板形 成。 本发明实施例的第二种触控面板在制作过程中， 由于绝缘层上的镂空区 域的图形与金属层的图形相同， 使得绝缘层与金属层可以使用同一张掩膜板 制作， 即只需要使用 4张掩膜板， 相比于传统触控面板制作过程中需要使用 5 张掩膜板， 减少了掩膜板的个数， 由于掩膜板的成本高， 通过减少掩膜板 的个数， 能够降低触控面板的制造成本。
本发明实施例第一种触控面板的制造方法包括以下步骤。
步骤 701、 通过一次掩膜工艺， 在基板上的驱动电路所在的区域内形成 金属层。
例如，在基板上沉积一层金属薄膜，并在该金属薄膜上涂覆正性光刻胶， 釆用第一掩膜板进行曝光、 显影、 刻蚀及剥离该正性光刻胶， 以形成金属层 的图形；
例如， 该金属层可以釆用单层金属 （如钼、 铝、 钨、 钛、 铜等）材料， 也可以釆用单层合金材料（如钼和铝的合金等） ， 还可以釆用钼、 铝、 钨、 钛、 铜等金属的多层组合。
步骤 702、 通过一次掩膜工艺， 在形成了金属层的基板上的像素结构所 在的区域内形成第一导电层。
例如， 在形成了金属层的基板上沉积一层导电薄膜， 并在该导电薄膜上 涂覆正性光刻胶， 釆用第二掩膜板进行曝光、 显影、 刻蚀及剥离该正性光刻 胶， 以形成第一导电层的图形。
例如， 该第一导电层的材料釆用透明导电材料， 具体可以是 ITO或 IZO 等氧化物。
步骤 703、 通过一次掩膜工艺， 在形成了第一导电层的基板上形成绝缘 层， 其中， 该绝缘层与第一导电层通过同一个掩膜板制作， 且绝缘层的过孔 的图形与第一导电层的图形相同。
例如， 在形成了第一导电层的基板上沉积一层绝缘材料薄膜， 并在该绝 缘材料薄膜上涂覆负性光刻胶， 仍釆用第二掩膜板进行曝光、 显影、 刻蚀及 剥离该负性光刻胶， 以形成绝缘层的图形。
例如， 绝缘层的材料釆用绝缘性材料， 可以是氮化硅或氧化硅。
需要说明的是， 第一导电层与绝缘层都是通过第二掩膜板形成的， 在形 成过程中， 通过正性光刻胶形成第一导电层的图形， 通过负性光刻胶形成绝 缘层的图形， 因此， 第一导电层的图形与绝缘层的过孔的图形相同， 即在形 成绝缘层的过程中被刻蚀掉的部分（即绝缘层中镂空部分） 的图形与第一导 电层的图形相同。
在绝缘层的形成过程中， 在负性光刻胶上放置第二掩膜板时， 将掩膜板 向上或向下平移一定距离， 以使第一导电层的两端能够通过绝缘层的过孔与 第二导电层的两个水平导电部分连接， 且第一导电层通过该绝缘层与第二导 电层的垂直部分绝缘。
步骤 704、 通过一次掩膜工艺， 在形成了绝缘层的基板上形成第二导电 层。
例如， 在形成了绝缘层的基板上沉积一层导电薄膜， 并在该导电薄膜上 涂覆正性光刻胶， 釆用第三掩膜板进行曝光、 显影、 刻蚀及剥离该正性光刻 胶， 以形成第二导电层的图形；
例如， 第二导电层的材料釆用透明导电材料， 具体可以是 ITO或 IZO等 氧化物。
第二导电层的材料可以与第一导电层的材料相同，也可以不同，优选的， 第一导电层与第二导电层均釆用 IT0材料。
步骤 705、 通过一次掩膜工艺， 在形成了第二导电层的基板上形成钝化 层， 以起到保护基板上所有结构的作用， 其中， 该钝化层与金属层使用同一 个掩膜板制作， 且钝化层上的镂空区域的图形与金属层的图形相同。
例如， 在形成了第二导电层的基板上沉积一层绝缘材料薄膜， 并在该绝 缘材料薄膜上涂覆负性光刻胶， 仍釆用第一掩膜板进行曝光、 显影、 刻蚀及 剥离该负性光刻胶， 以形成钝化层的图形。
例如， 钝化层的材料釆用绝缘性材料， 可以是氮化硅或氧化硅； 需要说明的是， 钝化层的材料可以与绝缘层的材料相同， 也可以不同； 优选的， 钝化层与绝缘层釆用相同的材料。
传统触控面板在制作过程中釆用 5次掩膜工艺且需要使用 5张掩膜板形 成。 本发明实施例第三种触控面板制作过程中， 由于第一导电层与绝缘层的 过孔的图形相同，且钝化层上的镂空区域与驱动电路中的金属层的图形相同， 使得第一导电层与绝缘层可以使用同一张掩膜板制作， 钝化层与金属层可以 使用同一张掩膜板制作， 因此， 只需使用 3张掩膜板即可， 由于掩膜板的成 本高，本发明实施例通过减少掩膜板的个数， 能够降低触控面板的制造成本。
本发明实施例触控面板（Touch Panel )可以是 Add-On触控面板（外挂 式触控面板） 、 On-Cell触控面板（外嵌式触控面板）或 In-Cell型触控面板 (内嵌式触控面板）等。
本发明实施例提供的触控设备， 可以包括上述任一实施例中所描述的触 控面板。
由于本发明实施例触控面板中第二导电层的两个水平导电部分通过第一 导电层电性连接， 即第一导电层釆用搭桥方式与第二导电层的两个水平导电 部分连接， 因此， 本发明实施例触控面板具有传统触控面板较好的表面视觉 效果性能； 由于本发明实施例触控面板的第一导电层的图形与绝缘层的过孔 的图形相同；和 /或钝化层上的镂空区域的图形与该触控面板的驱动电路中的 金属层的图形相同， 使得在该触控面板的制作过程中减少了掩膜板的数量， 因此， 降低了制作成本， 从而提高了产品的市场竟争力。
以上所述仅是本发明的示范性实施方式， 而非用于限制本发明的保护范 围， 本发明的保护范围由所附的权利要求确定。

Claims

权利要求书
1、 一种触控面板， 包括像素结构及与所述像素结构连接的驱动电路， 其 中， 所述像素结构包括：
位于基板上的第一导电层， 位于所述第一导电层上的绝缘层， 位于所述 绝缘层上的第二导电层及位于所述第二导电层上的钝化层；
其中， 所述绝缘层上的过孔的图形与所述第一导电层的图形相同， 而且 所述第一导电层的两端通过所述过孔分别与所述第二导电层的两个水平导电 部分电性连接， 所述第一导电层通过所述绝缘层与所述第二导电层的垂直导 电部分绝缘； 和 /或
所述钝化层上的镂空区域的图形与所述驱动电路中的金属层的图形相 同。
2、如权利要求 1所述的触控面板， 其中， 所述钝化层上的镂空区域的位 置与所述金属层的位置对应。
3、 如权利要求 1或 2所述的触控面板， 其中， 所述基板为玻璃、 塑料、 柔性电路板或绝缘薄膜。
4、 如权利要求 1-3任一所述的触控面板， 其中， 所述第一导电层的材料 为氧化铟锡 ITO或铟辞氧化物 IZO;
所述第二导电层的材料为 ITO或 IZO。
5、 如权利要求 1-4任一所述的触控面板， 其中， 所述第一导电层与所述 第二导电层的材料为 ITO。
6、 如权利要求 1-5任一所述的触控面板， 其中， 所述绝缘层的材料为氮 化硅或氧化硅。
7、 如权利要求 1-6任一所述的触控面板， 其中， 所述钝化层的材料为氮 化硅或氧化硅。
8、 一种触控设备， 包括如权利要求 1至 7中任一项所述的触控面板。
9、 一种制造权利要求 1所述的触控面板的方法， 包括：
通过第一掩膜工艺， 在基板上的驱动电路所在的区域内形成金属层； 通过第二掩膜工艺， 依次在形成了所述金属层的基板上的像素结构所在 的区域内形成第一导电层、 绝缘层、 第二导电层及钝化层； 其中， 所述绝缘层与所述第一导电层釆用同一个掩膜板制作， 且所述第 一导电层的图形与所述绝缘层的过孔的图形相同； 和 /或
所述钝化层与所述金属层釆用同一个掩膜板制作， 且所述钝化层上的镂 空区域的图形与所述驱动电路中的金属层的图形相同。
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