WO2014006956A1 - Film-like resin laminating device - Google Patents

Film-like resin laminating device Download PDF

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Publication number
WO2014006956A1
WO2014006956A1 PCT/JP2013/061766 JP2013061766W WO2014006956A1 WO 2014006956 A1 WO2014006956 A1 WO 2014006956A1 JP 2013061766 W JP2013061766 W JP 2013061766W WO 2014006956 A1 WO2014006956 A1 WO 2014006956A1
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WO
WIPO (PCT)
Prior art keywords
film
resin
semiconductor wafer
thin semiconductor
temporary
Prior art date
Application number
PCT/JP2013/061766
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French (fr)
Japanese (ja)
Inventor
岩田　和敏
善明 本間
定智 西村
Original Assignee
ニチゴー・モートン株式会社
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Filing date
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Publication of WO2014006956A1 publication Critical patent/WO2014006956A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers

Definitions

  • the present invention relates to a film-like resin laminating apparatus for efficiently laminating a film-like resin such as an insulating adhesive film on an electrode forming surface of a thin semiconductor wafer while securely protecting the thin semiconductor wafer with a dicing frame. is there.
  • Integrated circuits that are primarily mounted on a substrate by wire bonding or flip chip bonding are very vulnerable to external forces and stresses, and often break easily with little force. Also weak against temperature.
  • a resin is poured between a substrate and a chip.
  • NCF Non Conductive Film
  • the film-like resin is laminated on the electrode forming surface of the semiconductor wafer without any gap, and this film-like resin is used for bonding.
  • the electrodes of the semiconductor wafer and the circuit of the substrate are connected.
  • the adhesion surface of a film-form resin is piled up on the electrode formation surface of a semiconductor wafer, and a laminating roll is carried out on it from the semiconductor wafer. It moves along an electrode formation surface and performs pressure contact. Thereby, film-like resin can be laminated
  • the semiconductor wafer itself is favorably thin with a thickness of 50 ⁇ m or less.
  • Such a thin semiconductor wafer is easy to break as it is, so that it can be detachably fixed on a dicing tape and surrounded by an annular dicing frame made of metal, and handled with the dicing frame.
  • the thickness of the dicing frame is larger than the thickness of the semiconductor wafer.
  • the laminate roll hits the upper edge of the dicing frame and cannot be lowered to the position of the semiconductor wafer. Therefore, in a state surrounded by the dicing frame, there is a problem that the press contact with the laminate roll cannot be performed.
  • the present invention has been made in view of such circumstances.
  • a thin semiconductor wafer is reliably protected by a dicing frame, and a film-like resin such as an insulating adhesive film is formed on the electrode forming surface of the thin semiconductor wafer. It is an object of the present invention to provide a film-like resin laminating apparatus that can be laminated without any problems.
  • the present invention provides a film-like resin placed on a thin semiconductor wafer that is detachably fixed on a dicing tape and surrounded by an annular dicing frame, and is pressed from above and below.
  • a film-like resin laminating apparatus for laminating by tightening wherein a temporary laminate unit in which a film-like resin is placed on the thin semiconductor wafer to form a temporary laminate, and the obtained temporary laminate is taken from above and below.
  • a transporting means comprising a pair of upper and lower transport films on which the stacking unit picks up and transports the temporary stack.
  • the film-like resin laminated device and a clamping means below provided in the conveyance path way by the conveying means (A) and its gist.
  • Clamping means set so as to press the temporary laminate conveyed by the conveyance film from above and below to form a laminate by inflating the flexible sheet toward the elastic sheet.
  • the “thin semiconductor wafer” means a wafer having a thickness of 50 ⁇ m or less, and means a wafer having a thickness smaller than that of a general semiconductor wafer (having a thickness of about 0.8 mm).
  • the “substantially the same contour shape” is sufficient if both contours are substantially the same shape, and the contour shape of the film-like resin is a thin semiconductor wafer in consideration of the thermal deformation, dimensional error, etc. of the resin. It is meant to include those that are slightly larger than the outline shape.
  • the film-like resin laminating apparatus of the present invention a film-like resin having substantially the same contour shape as this thin semiconductor wafer is formed on a thin semiconductor wafer fixed removably on a dicing tape and surrounded by an annular dicing frame. Therefore, the film-like resin can be laminated on the thin semiconductor wafer while reliably protecting the thin semiconductor wafer. That is, the film-like resin laminating apparatus of the present invention comprises a temporary lamination unit in which a film-like resin is placed on the thin semiconductor wafer to form a temporary laminate, and the obtained temporary laminate is pressed from above and below.
  • stacking unit has a conveyance means which consists of a pair of upper and lower conveyance films which picks up and conveys the said temporary laminated body, lamination
  • the stacked unit has the pressing means (A) in the middle of the transfer path of the transfer means, there is an extreme difference in height between the thin semiconductor wafer and the dicing frame surrounding the periphery.
  • the flexible sheet can follow along the extreme unevenness formed by the thin semiconductor wafer and the dicing frame, and the both can be reliably pressed. Therefore, a film-like resin can be efficiently and reliably laminated on a thin semiconductor wafer surrounded by a dicing frame, which could not be laminated by pressure contact with a conventional laminate roll.
  • the molding means is configured to mold the film-shaped resin with the adhesive surface of the film-shaped resin facing upward, and the placing means is the molded film-shaped resin. Is turned 180 ° and placed on the thin wafer with the adhesive surface of the film-like resin facing downward. Then, by handling the outside of the portion that is in contact with the thin wafer on the adhesive surface of the film-like resin, it can be laminated on the electrode forming surface of the thin semiconductor wafer while keeping the adhesive surface of the portion in contact with the thin wafer clean. it can.
  • the forming means of the temporary lamination unit includes a base plate on which the film-like resin is placed, and a lift plate having a blade shape that moves up and down toward the base plate and punches out the film-like resin when lowered.
  • the stamping means is set so that the film-like resin placed on the base plate is punched into substantially the same shape as the thin semiconductor wafer by descending the film-like resin, the film-like resin is efficiently formed into substantially the same contour shape as the thin semiconductor wafer.
  • the stamping means includes a film-like resin supply means that feeds a long film-shaped resin, the adhesive surface of which is protected by a release sheet, by a predetermined length onto the base plate; Between the peeling means for peeling from the resin and the film-like resin supplied on the base plate and the base plate, a long shape that hits the blade shape and protects the blade edge when the film-like resin is punched sequentially.
  • Back sheet supply means for supplying the back sheet, and the film resin is substantially the same as the thin semiconductor wafer in a state where the adhesive surface of the film resin from which the release sheet is peeled is overlapped with the back sheet. When punching into a contour shape, the back sheet is moved by a predetermined length each time the film-like resin is punched.
  • FIG. 1 It is a block diagram which shows one Embodiment of the film-form resin lamination apparatus of this invention.
  • (A) to (c) are all explanatory views showing the state of the thin semiconductor wafer and the film-like resin in the film-like resin laminating apparatus, and (d) to (e) are all the results obtained by the film-like resin laminating apparatus.
  • It is explanatory drawing which shows the procedure which connects the obtained laminated body to a circuit board. It is explanatory drawing which shows typically the lamination process in the said film-form resin lamination apparatus.
  • FIG. 1 shows an embodiment of a film-like resin laminating apparatus of the present invention.
  • the film-like resin laminating apparatus is composed of a temporary laminating unit 1 and a laminating unit 2, and is directed from upstream to downstream in the flow direction of thin semiconductor wafer 5 (see the white arrow in FIG. 1). They are arranged in this order.
  • a thin semiconductor wafer 5 to be stacked according to the present invention is detachably fixed on a dicing tape 11 and surrounded by an annular dicing frame 10.
  • reference numeral 5 a denotes an electrode protruding from the circuit surface of the thin semiconductor wafer 5.
  • the electrode 5a is not shown in the drawings other than FIGS. 2 (a) to 2 (e).
  • the dicing frame 10 is, for example, a metal or resin annular body having a thickness of about 1.0 to 1.5 mm.
  • the dicing tape 11 is, for example, a resin sheet having a thickness of about 0.08 mm, and one surface has adhesiveness to fix the thin semiconductor wafer 5.
  • FIG. 4 which is a plan view of the temporary lamination unit 1, a stamping means 6 for punching and molding a film-like resin 4 supplied in a long shape into substantially the same contour shape as a thin semiconductor wafer 5, and punching Reversing means 14 (see FIG. 7) for adsorbing the end portion of the formed film-like resin 4 from the surface side and reversing it 180 ° so that the adhesive surface faces downward, and the film-like resin 4 with the adhesive surface facing downward Is mounted on a thin semiconductor wafer 5 protected by a dicing frame 10 or the like, and has a mounting means 8 (see FIG. 7) as a temporary laminate 7.
  • the stamping means 6 includes a base plate 25 on which the long film-like resin 4 is placed, and a blade mold 20 that moves up and down toward the base plate 25 and punches the film-like resin 4 when lowered.
  • a lifting plate 24 provided with a film-like resin supply means 16 for feeding out a long film-like resin 4 whose adhesive surface is protected by a release sheet 9 by a predetermined length and supplying it on a base plate 25, and the release sheet 9
  • the film-like resin 4 is sequentially punched between the peeling means 17 that peels the film-like resin 4 from the front side of the base plate 25 and the film-like resin 4 and the base plate 25 supplied onto the base plate 25.
  • Back sheet supply means for supplying a long back sheet 18 that contacts the blade mold 20 and protects the cutting edge And a 9. Then, when the film-like resin 4 from which the peeling sheet 9 has been peeled off by the peeling means 17 is lowered toward the base plate 25 with the surface opposite to the adhesive surface being overlapped on the back sheet 18.
  • the blade tip of the blade mold 20 provided for this is set so as to penetrate the film-like resin 4 and reach the back sheet 18 (see FIG. 6). Thereby, the film-like resin 4 can be punched into substantially the same outline shape as the thin semiconductor wafer 5 while protecting the blade mold 20.
  • the back sheet 18 is fed a predetermined length after the punching is finished so that the cut formed by the blade mold 20 does not affect the next punching, so that it is prepared for the next punching. It has become.
  • the elevating means 26 for elevating and lowering the elevating plate 24 is, for example, a hydraulic cylinder.
  • the elevating plate 24 can be moved up and down with respect to the base plate 25 by changing the pressure of the hydraulic cylinder.
  • the film-like resin supply means 16 grips the unwinding roll 21 around which the film-like resin 4 whose adhesive surface is protected by the release sheet 9 is wound, and the end of the film-like resin 4 and holds only a predetermined length.
  • a drawing part (not shown) for drawing out, and whenever the film-like resin 4 having a predetermined shape is punched out, the drawing-out part draws out the film-like resin 4 and supplies a new part onto the base plate 25. It has become.
  • the peeling means 17 includes a guide plate 22 for peeling the release sheet 9 from the film-like resin 4 and drawing it in a different direction, and a take-up roll 23 for winding the release sheet 9 drawn in the different direction. It is configured.
  • the backsheet supply means 19 passes the backsheet 18 unwound from the unwinding roll 27 provided below the base plate 25 between the upper surface of the base plate 25 and the film-like resin 4, Like the unwinding roll 27, the sheet is wound up by a winding roll 28 provided below the base plate 25, and the back sheet 18 that hits the blade mold 20 and protects the blade edge is punched out of the film-like resin 4. Each time, a new sheet portion can be supplied onto the base plate 25.
  • a back sheet 18 for example, Lumirror made by Toray Industries, Inc. is preferably used.
  • the placing means 8 places the punched film-like resin 4 on the thin semiconductor wafer 5 surrounded by a dicing frame with the adhesive surface facing downward.
  • the temporary laminated body 7 can be obtained by this operation.
  • the suction head 60 of the handler 30 sucks the end of the punched film-like resin 4 (in this example, the range from the end to 5 mm inside).
  • the rail part 32 is slid in a state.
  • the film-like resin 4 adsorbed by the adsorption head 60 is positioned on the reversing table 31, the adsorption is released, and the film-like resin 4 is placed on the reversing table 31 with the adhesive surface facing upward. Place.
  • the reversing table 31 reverses (rotates) 180 degrees around the rotation portion 31a with the film-shaped resin 4 adsorbed from the back surface (opposite surface of the adhesive surface) as the center of rotation.
  • the adhesive surface is stacked on the thin semiconductor wafer 5 that has been separately conveyed by the conveyor 56 to form a temporary laminate 7.
  • the mechanism for transferring the film-like resin 4 onto the reversing table 31 and the mechanism for reversing the reversing table 31 can be appropriately selected in consideration of the horizontal and vertical spaces.
  • the laminated unit 2 is a unit that presses the obtained temporary laminated body 7 to form the laminated body 33, and a pair of upper and lower transport films that take up and convey the temporary laminated body 7. 34 and 35, and a pressure clamping means 36 provided in the middle of the conveyance path.
  • the transport means sandwiches and transports the temporary laminate 7 between a pair of upper and lower transport films 34 and 35, and the upper transport film 34 is interposed between the unwinding roll 37 and the winding roll 38.
  • the transport film 34 is transported without slack.
  • the lower conveyance film 35 is stretched between the unwinding roll 39 and the take-up roll 40, and the unwinding roll 39 and the take-up roll 40 move in synchronization, whereby the conveying film 35 is moved. It is designed to be transported without slack.
  • Examples of such a transport film include a polyethylene terephthalate (PET) film.
  • reference numeral 53 denotes a cooling fan that cools the formed stacked body 33.
  • the pressing means 36 is provided in the middle of the conveying path of the conveying means, and the temporary laminated body 7 conveyed by the conveying means is pressed in the vertical direction by heating and pressing in a vacuum state, so that the laminated body 33 is pressed. It is what. As shown in FIG. 1, the pressing means 36 is installed on a plurality of columns 42 (only two are shown in FIG. 1) erected on the bed frame 41, and on the upper ends of these columns 42. In addition, a plurality of horizontal plates 43 (only one is shown in FIG. 1), an upper plate 44 fixed to each horizontal plate 43 by fixing means (not shown) such as bolts and nuts, and the vertical movement A possible lower plate 45 is provided.
  • the lower plate 45 moves up and down as the cylinder rod extends and contracts by the operation of the air cylinder 46.
  • a pair of upper and lower pressing means 49 is constituted by the pair of plates 44 and 45, a flexible sheet 47 described later, an elastic sheet 48, a pressure adjusting means, and the like.
  • a plurality of upper openings 54 are opened in portions corresponding to the gaps 50, and pressure adjustment is performed.
  • the gap 50 into a vacuum state from the means (not shown) through the upper openings 54, or introducing air or compressed air into the gap 50, the flexible sheet 47 becomes like a balloon.
  • the swelled and temporary laminate 7 is structured to be pressed between the flexible sheet 47 and the elastic sheet 48.
  • the flexible sheet 47 and the elastic sheet 48 those made of heat-resistant Viton rubber or silicon rubber are preferably used.
  • the flexible sheet 47 is arrange
  • the outer peripheral part is being fixed airtightly by the pressing metal fitting (not shown).
  • a gap 50 is formed between the upper plate 44 and the flexible sheet 47 in the inner part of the presser fitting.
  • An elastic sheet 48 is placed on the upper surface of the lower plate 45 at a portion corresponding to the gap 50.
  • Such upper and lower plates 44 and 45 contain heating means (not shown) such as a rubber heater or a sheath heater.
  • a plurality of lower openings 55 are opened on the upper surface of the lower plate 45, and the upper and lower plates 44, 45 are hermetically sealed to form a vacuum chamber.
  • the air in the space 51 formed between the flexible sheet 47 and the lower plate 45 can be evacuated.
  • 52 is a seal member fixed to the upper surface of the outer peripheral portion of the lower plate 45, and acts to enhance the airtightness of the space 51 in the vacuum state.
  • This lamination process is schematically shown in FIG. That is, first, a thin semiconductor wafer 5 is detachably fixed on a dicing tape 11 and a periphery thereof is surrounded by an annular dicing frame 10 (see FIG. 2A). And the thin semiconductor wafer 5 protected by the said dicing frame 10 grade
  • a long film-like resin 4 having an adhesive surface protected by a release sheet 9 is prepared and used as the unwinding roll 21 of the stamping means 6. set. Further, the back sheet 18 is routed between the unwinding roll 27 and the winding roll 28 via the base plate 25. Then, the release sheet 9 is peeled off from the film-like resin 4 and taken up by the take-up roll 23 via the guide plate 22, and the release sheet 9 is peeled off, and the adhesive film is exposed. It is mounted on the back sheet 18 with the adhesive surface facing up. Note that one end of the film-like resin 4 is gripped by a drawer portion (not shown) and is tensioned so that there is no slack.
  • the elevating plate 24 to which the blade mold 20 having substantially the same contour shape as that of the thin semiconductor wafer 5 is lowered until the blade edge of the blade mold 20 reaches the back sheet 18.
  • the film-like resin 4 is punched into the shape of the blade mold 20, and the punched portion becomes the film-like resin 4 having substantially the same contour shape as that of the thin semiconductor wafer 5.
  • Unnecessary film-like resin 4 other than the punched portion is cut at a length corresponding to one pitch at the same time as punching, and is sequentially stacked and accommodated in a dust box 57.
  • the molded film-like resin 4 has a ring-shaped portion extending from the entire circumference of the end portion to the inner 5 mm so as to reduce contact as much as possible because the adhesive surface faces upward and the adhesive surface is exposed.
  • the suction head 60 of the handler 30 sucks from above and lifts it up to a predetermined position. That is, as shown in FIG. 7, the root portion 61 that holds the suction head 60 slides downward on the protrusion 62 a provided on the side surface of the slide guide 62, so that the suction head 60 is moved to the film-like resin 4. To adsorb the film-like resin 4.
  • the base portion 61 is returned to the original position by sliding the protrusion 62a upward, and in this state, the slide guide 62 of the handler 30 slides on the rail portion 32, and the film-like resin 4 is reversed.
  • the handler 30 is moved until it is positioned on the table 31.
  • the root portion 61 slides down the ridge 62a, places the film-like resin 4 adsorbed by the adsorption head 60 at a predetermined position of the reversing table 31, and releases the adsorption.
  • the handler 30 returns to a predetermined position after placing the film-like resin 4 on the reversing table 31.
  • the reversing table 31 adsorbs the opposite surface of the adhesive surface of the film-like resin 4 placed above, and in this state, the reversing table is 180 with the rotating portion 31a as the rotation center.
  • the film-like resin 4 is positioned and placed on the thin semiconductor wafer 5 (protected by the dicing frame 10 or the like) that is reversed (rotated) and conveyed by the conveying conveyor 56, and the reversing table 31 is sucked. Is released.
  • the temporary laminated body 7 (FIG. 2 (FIG. 2 (A))) is mounted on the thin semiconductor wafer 5 fixed on the dicing tape 11 and surrounded by the dicing frame 10. b) can be obtained.
  • the obtained temporary laminate 7 is handed over from the conveyor 56 to a conveying means composed of a pair of upper and lower conveying films 34, 35, and conveyed while being sandwiched between the conveying films 34, 35 (FIG. 1). reference).
  • the temporary laminate 7 is pressed in the following manner in the pressing means 36 provided in the middle of the conveying path of the conveying means.
  • the temporary laminate 7 conveyed by the upper and lower conveying films 34 and 35 is positioned at a predetermined position (clamping position) in a closed space formed in a shape surrounding the passing surface of the conveying films 34 and 35.
  • the air cylinder 46 is actuated to raise the lower plate 45, and the lower surface of the presser fitting 58 of the upper plate 44 and the upper surface of the lower plate 45 are brought into close contact with each other to seal the upper and lower plates 44, 45 together.
  • the gap 50 and the space 51 are put under reduced pressure. Specifically, the gap 50 is decompressed via the upper opening 54 by the pressure adjusting means, and the space 51 is decompressed via the lower opening 55 by the decompressing means.
  • the pressure in the space 51 is preferably set to a vacuum state of 200 Pa or less within 20 seconds, and particularly preferably set to a vacuum state of 100 Pa or less in 2 to 8 seconds.
  • the space 50 may be decompressed to 200 Pa or less after the gap 50 has been decompressed to 200 Pa or less in advance and the temporary laminate 7 is carried in to form a vacuum chamber.
  • the temperature of the flexible sheet 47 and the elastic sheet 48 is preferably 40 to 185 ° C., more preferably 70 to 185 ° C.
  • the temperature is adjusted by a sheath heater or the like built in the upper and lower plates 44 and 45.
  • the flexible sheet 47 is expanded downward to form the thin semiconductor wafer 5 of the temporary laminate 7 and the film-shaped resin 4 having a predetermined shape.
  • Laminate slap down process is performed. Specifically, the adjustment of the pressure difference may be performed by returning the pressure of the gap 50 to the normal force while the space 51 is decompressed, and the flexible sheet 47 expands toward the space 51 due to the pressure difference.
  • the temporary laminate 7 is pressed from above and pressed between the elastic sheet 48 and formed into a laminate 33 (see FIG. 2C).
  • the flexible sheet 47 has high followability, and even if there is a height difference between the upper edge of the dicing frame 10 and the upper surface of the thin semiconductor wafer 5, there is no gap between them. Therefore, uniform and sufficient pressure can be applied to the entire surface of the thin semiconductor wafer 5.
  • a laminate pressure increasing process for increasing the pressure in the gap 50 is performed.
  • compressed air is introduced into the gap 50 to increase the pressure in the gap 50 and the flexible sheet 47 is further inflated, and the laminate 33 is further strongly clamped. That is, the thin semiconductor wafer 5 and the film-shaped resin 4 having a predetermined shape are brought into close contact by the laminate slap down process, and the adhesiveness between the thin semiconductor wafer 5 and the film-like resin 4 is further ensured by the laminating pressure increasing process.
  • the upper opening 54 and the lower opening 55 release the vacuum state of the space 51 and the pressurized state of the gap 50 to return to normal pressure, and move the lower plate 45 downward.
  • the sealing engagement between the upper and lower plates 44 and 45 is released.
  • the obtained laminated body 33 is conveyed in the state pinched by the up-and-down conveyance films 34 and 35, and then is taken out via a conveyance conveyor (not shown).
  • the obtained laminate 33 is, for example, diced to a predetermined size (see FIG. 2D), removed from the dicing tape 11, and then used for the circuit board 59 separately prepared using the film-like resin 4. Connected and used (see FIG. 2E).
  • an unnecessary portion of the film-like resin 4 other than the portion punched into a predetermined shape is cut to a predetermined length and sequentially stored in the dust box 57. You may make it wind up with a winding roll. However, if cutting is performed at a predetermined length as described above, it is not necessary to secure a space for installing a separate take-up roll or the like, and the apparatus can be further downsized.
  • the film-like resin laminating apparatus of the present invention can efficiently and reliably laminate a film-like resin such as an insulating adhesive film on a thin semiconductor wafer.

Abstract

The objective of the present invention is to provide a laminating device with which an adhesive film can be efficiently and reliably laminated while ensuring the protection of a thin semiconductor wafer. This film-like resin laminating device, which laminates a film-like resin (4) onto a thin semiconductor wafer (5) surrounded by a dicing frame (10), is equipped with a preliminary lamination unit (1), which places a film-like resin (4) on the thin semiconductor wafer (5), thereby forming a preliminary laminated body (7), and a lamination unit (2), which presses the resulting preliminary laminated body (7), thereby forming a laminated body (33). The preliminary lamination unit (1) has a formation means, which forms the film-like resin (4) in a shape approximately identical to the outline shape of the thin semiconductor wafer (5), and a placement means, which places the formed film-like resin (4) on the thin semiconductor wafer (5), thereby forming the preliminary laminated body (7). The lamination unit (2) has a transport means comprising a pair of transport films, that is, an upper transport film (34) and a lower transport film (35), which take up and transport the preliminary laminated body (7), and a prescribed pressing means (36), which is provided midway along the transport path of this transport means.

Description

フィルム状樹脂積層装置Film-like resin laminating equipment
　本発明は、薄型の半導体ウエハをダイシングフレームで確実に保護しつつ、効率よく、薄型の半導体ウエハの電極形成面に絶縁性接着フィルム等のフィルム状樹脂を積層するフィルム状樹脂積層装置に関するものである。 The present invention relates to a film-like resin laminating apparatus for efficiently laminating a film-like resin such as an insulating adhesive film on an electrode forming surface of a thin semiconductor wafer while securely protecting the thin semiconductor wafer with a dicing frame. is there.
　ワイヤーボンディングやフリップチップボンディング等で基板へ一次実装された集積回路（チップ）は、外力・応力に対して非常に脆弱であり、少々の力で容易に破断してしまうケースが多く、また、湿度や温度に対しても弱い。こういった問題の解決策として、基板とチップの間に樹脂を流し込むアンダフィリングを行うのが一般的であるが、樹脂の充填に時間が掛かったり、残渣除去が必要になる等の問題が生じることが判明した。したがって、これらの問題を解決する為、予めウエハチップに接続・絶縁機能を持ったＮＣＦ（Ｎｏｎ　Ｃｏｎｄｕｃｔｉｖｅ　Ｆｉｌｍ）フィルム等のフィルム状樹脂を貼り付ける工法が提案されている。 Integrated circuits (chips) that are primarily mounted on a substrate by wire bonding or flip chip bonding are very vulnerable to external forces and stresses, and often break easily with little force. Also weak against temperature. As a solution to these problems, it is common to perform underfilling in which a resin is poured between a substrate and a chip. However, it takes time to fill the resin, and it is necessary to remove residues. It has been found. Therefore, in order to solve these problems, a method of attaching a film-like resin such as an NCF (Non Conductive Film) film having a connection / insulation function to the wafer chip in advance has been proposed.
　上記フィルム状樹脂を用いて基板の回路と半導体ウエハの電極とを接続するには、まず、半導体ウエハの電極形成面に上記フィルム状樹脂を隙間なく積層し、このフィルム状樹脂を接着に用いることにより、上記半導体ウエハの電極と基板の回路との接続を行う。そして、上記フィルム状樹脂を半導体ウエハの電極形成面の凹凸に隙間なく積層するには、半導体ウエハの電極形成面に、フィルム状樹脂の接着面を重ね合わせ、その上からラミネートロールを半導体ウエハの電極形成面に沿って移動させ圧接を行う。これにより、フィルム状樹脂を半導体ウエハの凹凸に隙間なく積層することができる。 In order to connect the circuit of the substrate and the electrode of the semiconductor wafer using the film-like resin, first, the film-like resin is laminated on the electrode forming surface of the semiconductor wafer without any gap, and this film-like resin is used for bonding. Thus, the electrodes of the semiconductor wafer and the circuit of the substrate are connected. And in order to laminate | stack the said film-form resin on the unevenness | corrugation of the electrode formation surface of a semiconductor wafer without a clearance gap, the adhesion surface of a film-form resin is piled up on the electrode formation surface of a semiconductor wafer, and a laminating roll is carried out on it from the semiconductor wafer. It moves along an electrode formation surface and performs pressure contact. Thereby, film-like resin can be laminated | stacked on the unevenness | corrugation of a semiconductor wafer without gap.
　一方で、半導体装置の小型化に伴って、半導体ウエハ自体もその厚みが５０μｍ以下という薄型が好まれるようになっている。このような薄型の半導体ウエハは、そのままでは割れ易いため、ダイシングテープ上に着脱自在に固定しその周囲を金属からなる環状のダイシングフレームで囲った状態にして、このダイシングフレームごと取り扱うことにより、その保護を図っている。しかしながら、このようにダイシングフレームで保護された薄型の半導体ウエハに、先に述べたラミネートロールによる積層方法により接着フィルムを積層しようとすると、ダイシングフレームの厚みの方が半導体ウエハの厚みより大きいため、ラミネートロールがダイシングフレームの上縁に当たり、半導体ウエハの位置まで下降させることができない。よって、ダイシングフレームに囲われた状態では、ラミネートロールによる圧接を行うことができないという問題が生じている。 On the other hand, with the miniaturization of semiconductor devices, the semiconductor wafer itself is favorably thin with a thickness of 50 μm or less. Such a thin semiconductor wafer is easy to break as it is, so that it can be detachably fixed on a dicing tape and surrounded by an annular dicing frame made of metal, and handled with the dicing frame. We are trying to protect it. However, when the adhesive film is laminated on the thin semiconductor wafer protected by the dicing frame as described above by the laminating method using the laminating roll, the thickness of the dicing frame is larger than the thickness of the semiconductor wafer. The laminate roll hits the upper edge of the dicing frame and cannot be lowered to the position of the semiconductor wafer. Therefore, in a state surrounded by the dicing frame, there is a problem that the press contact with the laminate roll cannot be performed.
　そこで、ダイシングフレームで半導体ウエハが保護されている場合、ダイシングテープの裏面側から半導体ウエハを上方へ押し上げる上昇手段を設け、半導体ウエハの電極形成面の高さとダイシングフレームの上縁の高さを等しくした上で、ラミネートロールによる圧接を行う方法が提案されている（特許文献１参照）。これによれば、ダイシングフレームによって半導体ウエハが囲まれている場合であっても、フィルム状樹脂を半導体ウエハに隙間なく積層することが可能であるとされる。 Therefore, when the semiconductor wafer is protected by the dicing frame, a raising means for pushing the semiconductor wafer upward from the back side of the dicing tape is provided, and the height of the electrode forming surface of the semiconductor wafer is equal to the height of the upper edge of the dicing frame. In addition, a method of performing pressure contact with a laminate roll has been proposed (see Patent Document 1). According to this, even when the semiconductor wafer is surrounded by the dicing frame, the film-like resin can be laminated on the semiconductor wafer without any gap.
特開２００９－１４７０８７号公報JP 2009-147087 A
　しかしながら、特許文献１の方法では、ダイシングテープの裏面に設けられた上昇手段によりダイシングテープが伸張するため、これに固定されている半導体ウエハが、伸張するダイシングテープに引っ張られて破損するおそれがある。半導体ウエハが薄型であれば、なおさらである。このため、薄型の半導体ウエハの保護を確実に行いながら、フィルム状樹脂を半導体ウエハの電極形成面に隙間なく積層することのできる積層装置の開発が強く望まれている。 However, in the method of Patent Document 1, since the dicing tape is stretched by the raising means provided on the back surface of the dicing tape, the semiconductor wafer fixed to the dicing tape may be pulled and damaged by the stretching dicing tape. . This is especially true if the semiconductor wafer is thin. Therefore, there is a strong demand for development of a laminating apparatus capable of laminating a film-like resin on the electrode forming surface of the semiconductor wafer without any gap while reliably protecting the thin semiconductor wafer.
　本発明は、このような事情に鑑みなされたもので、薄型の半導体ウエハをダイシングフレームで確実に保護し、しかも、薄型の半導体ウエハの電極形成面に絶縁性接着フィルム等のフィルム状樹脂を隙間なく積層することのできるフィルム状樹脂積層装置の提供をその目的とする。 The present invention has been made in view of such circumstances. A thin semiconductor wafer is reliably protected by a dicing frame, and a film-like resin such as an insulating adhesive film is formed on the electrode forming surface of the thin semiconductor wafer. It is an object of the present invention to provide a film-like resin laminating apparatus that can be laminated without any problems.
　上記の目的を達成するため、本発明は、ダイシングテープ上に着脱自在に固定されその周囲を環状のダイシングフレームで囲われた薄型半導体ウエハの上にフィルム状樹脂を載置して上下方向から圧締することにより積層するフィルム状樹脂積層装置であって、上記薄型半導体ウエハの上にフィルム状樹脂を載置し仮積層体とする仮積層ユニットと、上記得られた仮積層体を上下方向から圧締し積層体に形成する積層ユニットとを備え、上記仮積層ユニットが、フィルム状樹脂を薄型半導体ウエハと略同じ輪郭形状に成形する成形手段と、成形されたフィルム状樹脂を薄型半導体ウエハの上に載置し仮積層体とする載置手段とを有しており、上記積層ユニットが、上記仮積層体を引き取って搬送する上下一対の搬送フィルムからなる搬送手段と、この搬送手段による搬送路途中に設けられる下記の圧締手段（Ａ）とを有しているフィルム状樹脂積層装置をその要旨とする。
（Ａ）上記搬送フィルムの通過面を囲うよう形成された閉鎖空間と、その内側に、上記搬送フィルムを間に挟んで対峙する上下一対のプレートと、これら両プレートの少なくとも一方を他方に対し進退させるための昇降手段と、上記上側のプレートと搬送フィルムとの間を仕切る可撓性シートと、上記下側のプレートの上面に固定される弾性シートと、上側のプレートと可撓性シートの間に形成される空隙部と可撓性シートと弾性シートとの間に形成される空間部の圧力を調整する圧力調整手段とを有し、上記空隙部の圧力を上記空間部の圧力より大きくし、上記可撓性シートを弾性シート側に膨らませることにより、上記搬送フィルムで搬送される仮積層体を上下方向から圧締し積層体に形成するよう設定された圧締手段。 In order to achieve the above object, the present invention provides a film-like resin placed on a thin semiconductor wafer that is detachably fixed on a dicing tape and surrounded by an annular dicing frame, and is pressed from above and below. A film-like resin laminating apparatus for laminating by tightening, wherein a temporary laminate unit in which a film-like resin is placed on the thin semiconductor wafer to form a temporary laminate, and the obtained temporary laminate is taken from above and below. A laminate unit that forms a pressed laminate, wherein the temporary laminate unit forms a film-like resin into substantially the same contour shape as that of the thin semiconductor wafer, and the formed film-like resin of the thin semiconductor wafer. A transporting means comprising a pair of upper and lower transport films on which the stacking unit picks up and transports the temporary stack. , The film-like resin laminated device and a clamping means below provided in the conveyance path way by the conveying means (A) and its gist.
(A) a closed space formed so as to enclose the passage surface of the transport film, a pair of upper and lower plates facing each other with the transport film interposed therebetween, and at least one of these plates is advanced and retracted with respect to the other Lifting and lowering means, a flexible sheet for partitioning the upper plate and the transport film, an elastic sheet fixed to the upper surface of the lower plate, and between the upper plate and the flexible sheet Pressure adjusting means for adjusting the pressure of the space formed between the gap formed in the flexible sheet and the elastic sheet, and the pressure of the space is made larger than the pressure of the space. Clamping means set so as to press the temporary laminate conveyed by the conveyance film from above and below to form a laminate by inflating the flexible sheet toward the elastic sheet.
　なお、本発明において、「薄型の半導体ウエハ」とは、その厚みが５０μｍ以下であるものをいい、一般的な半導体ウエハ（厚み０．８ｍｍ程度）より厚みが薄いものを意味する。 In the present invention, the “thin semiconductor wafer” means a wafer having a thickness of 50 μm or less, and means a wafer having a thickness smaller than that of a general semiconductor wafer (having a thickness of about 0.8 mm).
　また、本発明において、「略同じ輪郭形状」とは、両者の輪郭が概ね同じ形状であればよく、樹脂の熱変形，寸法誤差等を考慮し、フィルム状樹脂の輪郭形状が、薄型半導体ウエハの輪郭形状よりやや大きくなっているものを含むことを意味する。 Further, in the present invention, the “substantially the same contour shape” is sufficient if both contours are substantially the same shape, and the contour shape of the film-like resin is a thin semiconductor wafer in consideration of the thermal deformation, dimensional error, etc. of the resin. It is meant to include those that are slightly larger than the outline shape.
　本発明のフィルム状樹脂積層装置によると、ダイシングテープ上に着脱自在に固定されその周囲を環状のダイシングフレームで囲われた薄型半導体ウエハの上にこの薄型半導体ウエハと略同じ輪郭形状のフィルム状樹脂を積層するため、薄型半導体ウエハを確実に保護しながら、その上にフィルム状樹脂を積層することができる。すなわち、本発明のフィルム状樹脂積層装置は、上記薄型半導体ウエハの上にフィルム状樹脂を載置し仮積層体とする仮積層ユニットと、上記得られた仮積層体を上下方向から圧締し積層体に形成する積層ユニットとを備えており、上記仮積層ユニットが、フィルム状樹脂を薄型半導体ウエハと略同じ輪郭形状に成形する成形手段と、成形されたフィルム状樹脂を薄型半導体ウエハの上に載置し仮積層体とする載置手段とを有している。したがって、上記成形手段により薄型半導体ウエハ上に載置されるフィルム状樹脂が、薄型半導体ウエハと略同じ輪郭形状をしており、後の工程である圧締によってその他の部位にはみ出すことがなく、殊更ダイシングフレームを汚すことがない。また、上記積層ユニットが、上記仮積層体を引き取って搬送する上下一対の搬送フィルムからなる搬送手段を有しているため、薄型半導体ウエハとフィルム状樹脂との積層を連続的に行うことができ、効率がよい。しかも、上記積層ユニットが、上記搬送手段の搬送路途中に上記の圧締手段（Ａ）を有しているため、薄型半導体ウエハとその周囲を取り囲むダイシングフレームとの間に極端な高低差があっても、可撓性シートが薄型半導体ウエハとダイシングフレームとで形成される極端な凹凸に沿って追従することができ、両者の圧締を確実に行うことができる。したがって、従来ラミネートロールによる圧接による積層ができなかった、ダイシングフレームで囲われた状態の薄型半導体ウエハに、フィルム状樹脂を効率よく、確実に積層することができる。 According to the film-like resin laminating apparatus of the present invention, a film-like resin having substantially the same contour shape as this thin semiconductor wafer is formed on a thin semiconductor wafer fixed removably on a dicing tape and surrounded by an annular dicing frame. Therefore, the film-like resin can be laminated on the thin semiconductor wafer while reliably protecting the thin semiconductor wafer. That is, the film-like resin laminating apparatus of the present invention comprises a temporary lamination unit in which a film-like resin is placed on the thin semiconductor wafer to form a temporary laminate, and the obtained temporary laminate is pressed from above and below. A laminate unit formed on the laminate, wherein the temporary laminate unit forms a film-like resin into a shape substantially the same as that of the thin semiconductor wafer, and the molded film-like resin is formed on the thin semiconductor wafer. And a placing means that is placed as a temporary laminate. Therefore, the film-like resin placed on the thin semiconductor wafer by the molding means has substantially the same contour shape as the thin semiconductor wafer, and does not protrude to other parts by the subsequent pressing. In particular, the dicing frame is not soiled. Moreover, since the said lamination | stacking unit has a conveyance means which consists of a pair of upper and lower conveyance films which picks up and conveys the said temporary laminated body, lamination | stacking with a thin semiconductor wafer and film-like resin can be performed continuously. Efficient. In addition, since the stacked unit has the pressing means (A) in the middle of the transfer path of the transfer means, there is an extreme difference in height between the thin semiconductor wafer and the dicing frame surrounding the periphery. However, the flexible sheet can follow along the extreme unevenness formed by the thin semiconductor wafer and the dicing frame, and the both can be reliably pressed. Therefore, a film-like resin can be efficiently and reliably laminated on a thin semiconductor wafer surrounded by a dicing frame, which could not be laminated by pressure contact with a conventional laminate roll.
　そして、仮積層ユニットにおいて、上記成形手段が、フィルム状樹脂の接着面を上に向けた状態でフィルム状樹脂の成形を行うようになっており、上記載置手段が、成形されたフィルム状樹脂を１８０°反転させフィルム状樹脂の接着面を下に向けた状態で、上記薄型ウエハ上に載置するようになっている。そして、フィルム状樹脂の接着面において、薄型ウエハと接する予定部分の外側をハンドリングすることで、薄型ウエハと接する部分の接着面を清浄に保ったまま薄型半導体ウエハの電極形成面に積層することができる。 In the temporary lamination unit, the molding means is configured to mold the film-shaped resin with the adhesive surface of the film-shaped resin facing upward, and the placing means is the molded film-shaped resin. Is turned 180 ° and placed on the thin wafer with the adhesive surface of the film-like resin facing downward. Then, by handling the outside of the portion that is in contact with the thin wafer on the adhesive surface of the film-like resin, it can be laminated on the electrode forming surface of the thin semiconductor wafer while keeping the adhesive surface of the portion in contact with the thin wafer clean. it can.
　また、仮積層ユニットの成形手段が、フィルム状樹脂を載置するベースプレートと、このベースプレートに向かって昇降し、下降時にフィルム状樹脂を打ち抜く刃型を備えた昇降プレートとを有し、上記昇降プレートの下降により上記ベースプレート上に載置されたフィルム状樹脂を薄型半導体ウエハと略同じ形状に打ち抜くよう設定されたスタンピング手段であると、フィルム状樹脂を効率よく薄型半導体ウエハと略同じ輪郭形状に成形できるとともに、その切断面に余計な凹凸が形成されずに済むため好適である。 Further, the forming means of the temporary lamination unit includes a base plate on which the film-like resin is placed, and a lift plate having a blade shape that moves up and down toward the base plate and punches out the film-like resin when lowered. When the stamping means is set so that the film-like resin placed on the base plate is punched into substantially the same shape as the thin semiconductor wafer by descending the film-like resin, the film-like resin is efficiently formed into substantially the same contour shape as the thin semiconductor wafer. In addition, it is preferable because unnecessary unevenness is not formed on the cut surface.
　さらに、スタンピング手段が、接着面が剥離シートで保護された長尺状のフィルム状樹脂を所定長ずつ繰り出してベースプレート上に供給するフィルム状樹脂供給手段と、上記剥離シートをベースプレート手前側においてフィルム状樹脂から剥離する剥離手段と、上記ベースプレート上に供給されたフィルム状樹脂とベースプレートとの間に、順次、上記フィルム状樹脂の打ち抜きの際に刃型の当たりとなって刃先を保護する長尺状のバックシートを供給するバックシート供給手段とを有し、上記剥離シートが剥離されたフィルム状樹脂の接着面と反対面を上記バックシートに重ねた状態でフィルム状樹脂を薄型半導体ウエハと略同じ輪郭形状に打ち抜くようになっていると、フィルム状樹脂の打ち抜きの度にバックシートを所定長ずつ移動させることにより、刃先が当たって切れ込みが入った個所をずらし、常に新しいバックシートの上でフィルム状樹脂を打ち抜くことができる。したがって、バックシートに形成された切り込みが次回打ち抜き時に影響することがないため、より精緻な状態での打ち抜きが可能となり、所望どおりのサイズのフィルム状樹脂を得ることができる。 Further, the stamping means includes a film-like resin supply means that feeds a long film-shaped resin, the adhesive surface of which is protected by a release sheet, by a predetermined length onto the base plate; Between the peeling means for peeling from the resin and the film-like resin supplied on the base plate and the base plate, a long shape that hits the blade shape and protects the blade edge when the film-like resin is punched sequentially. Back sheet supply means for supplying the back sheet, and the film resin is substantially the same as the thin semiconductor wafer in a state where the adhesive surface of the film resin from which the release sheet is peeled is overlapped with the back sheet. When punching into a contour shape, the back sheet is moved by a predetermined length each time the film-like resin is punched. By, shifting the location where cutting edge containing the notch hit, can be punched a film-like resin always on new back sheet. Accordingly, since the cut formed in the back sheet does not affect the next punching, it is possible to punch in a more precise state, and a film-like resin having a desired size can be obtained.
本発明のフィルム状樹脂積層装置の一実施の形態を示す構成図である。It is a block diagram which shows one Embodiment of the film-form resin lamination apparatus of this invention. （ａ）～（ｃ）は、いずれも上記フィルム状樹脂積層装置における薄型半導体ウエハとフィルム状樹脂の状態を示す説明図、（ｄ）～（ｅ）は、いずれも上記フィルム状樹脂積層装置によって得られた積層体を回路基板に接続する手順を示す説明図である。(A) to (c) are all explanatory views showing the state of the thin semiconductor wafer and the film-like resin in the film-like resin laminating apparatus, and (d) to (e) are all the results obtained by the film-like resin laminating apparatus. It is explanatory drawing which shows the procedure which connects the obtained laminated body to a circuit board. 上記フィルム状樹脂積層装置における積層工程を模式的に示す説明図である。It is explanatory drawing which shows typically the lamination process in the said film-form resin lamination apparatus. 上記フィルム状樹脂積層装置における仮積層ユニットを示す平面図である。It is a top view which shows the temporary lamination | stacking unit in the said film-form resin lamination apparatus. 上記仮積層ユニットにおけるスタンピング手段を示す構成図である。It is a block diagram which shows the stamping means in the said temporary lamination | stacking unit. 上記スタンピング手段におけるスタンピング時の刃型とフィルム状樹脂とバックシートとの関係を示す状態説明図である。It is a state explanatory drawing which shows the relationship between the blade type at the time of stamping in the said stamping means, film-form resin, and a back sheet | seat. 上記仮積層ユニットにおける載置手段を模式的に示す説明図である。It is explanatory drawing which shows typically the mounting means in the said temporary lamination | stacking unit. 上記フィルム状樹脂積層装置における圧締手段の圧締状態を示す説明図である。It is explanatory drawing which shows the pressing state of the pressing means in the said film-form resin lamination apparatus.
　つぎに、本発明を実施するための形態について説明する。 Next, a mode for carrying out the present invention will be described.
　図１は、本発明のフィルム状樹脂積層装置の一実施の形態を示したものである。この実施の形態では、上記フィルム状樹脂積層装置は、仮積層ユニット１と積層ユニット２とで構成されており、薄型半導体ウエハ５の流れ方向（図１の白矢印参照）の上流から下流に向かってこの順で配設されている。 FIG. 1 shows an embodiment of a film-like resin laminating apparatus of the present invention. In this embodiment, the film-like resin laminating apparatus is composed of a temporary laminating unit 1 and a laminating unit 2, and is directed from upstream to downstream in the flow direction of thin semiconductor wafer 5 (see the white arrow in FIG. 1). They are arranged in this order.
　本発明の積層対象となる薄型半導体ウエハ５は、図２（ａ）に示すように、ダイシングテープ１１上に着脱自在に固定されその周囲を環状のダイシングフレーム１０で囲われているものである。図において、５ａは、薄型半導体ウエハ５の回路面から突出する電極である。なお、この電極５ａは、図２（ａ）～（ｅ）以外の図においては記載を略している。 As shown in FIG. 2A, a thin semiconductor wafer 5 to be stacked according to the present invention is detachably fixed on a dicing tape 11 and surrounded by an annular dicing frame 10. In the figure, reference numeral 5 a denotes an electrode protruding from the circuit surface of the thin semiconductor wafer 5. The electrode 5a is not shown in the drawings other than FIGS. 2 (a) to 2 (e).
　上記ダイシングフレーム１０は、例えば、厚み１．０～１．５ｍｍ程度の金属または樹脂製の環状体である。また、上記ダイシングテープ１１は、例えば、厚み０．０８ｍｍ程度の樹脂製のシート状であり、一方の面が薄型半導体ウエハ５を固定するため粘着性を有している。 The dicing frame 10 is, for example, a metal or resin annular body having a thickness of about 1.0 to 1.5 mm. The dicing tape 11 is, for example, a resin sheet having a thickness of about 0.08 mm, and one surface has adhesiveness to fix the thin semiconductor wafer 5.
　上記仮積層ユニット１は、その平面図である図４に示すように、長尺状で供給されるフィルム状樹脂４を薄型半導体ウエハ５と略同じ輪郭形状に打ち抜き成形するスタンピング手段６と、打ち抜き成形されたフィルム状樹脂４の端部を表面側から吸着し１８０°反転させ、接着面を下に向ける反転手段１４(図７参照）と、接着面を下に向けた状態のフィルム状樹脂４をダイシングフレーム１０等で保護された薄型半導体ウエハ５の上に載置し、仮積層体７とする載置手段８(図７参照）とを有している。 As shown in FIG. 4 which is a plan view of the temporary lamination unit 1, a stamping means 6 for punching and molding a film-like resin 4 supplied in a long shape into substantially the same contour shape as a thin semiconductor wafer 5, and punching Reversing means 14 (see FIG. 7) for adsorbing the end portion of the formed film-like resin 4 from the surface side and reversing it 180 ° so that the adhesive surface faces downward, and the film-like resin 4 with the adhesive surface facing downward Is mounted on a thin semiconductor wafer 5 protected by a dicing frame 10 or the like, and has a mounting means 8 (see FIG. 7) as a temporary laminate 7.
　上記スタンピング手段６は、図５に示すように、長尺状のフィルム状樹脂４を載置するベースプレート２５と、このベースプレート２５に向かって昇降し、下降時に上記フィルム状樹脂４を打ち抜く刃型２０を備えた昇降プレート２４と、接着面が剥離シート９で保護された長尺状のフィルム状樹脂４を所定長ずつ繰り出してベースプレート２５上に供給するフィルム状樹脂供給手段１６と、上記剥離シート９をベースプレート２５の手前側においてフィルム状樹脂４から剥離する剥離手段１７と、上記ベースプレート２５上に供給されたフィルム状樹脂４とベースプレート２５との間に、順次、上記フィルム状樹脂４の打ち抜きの際に刃型２０の当たりとなって刃先を保護する長尺状のバックシート１８を供給するバックシート供給手段１９とを有している。そして、上記剥離手段１７により剥離シート９が剥離されたフィルム状樹脂４を、その接着面と反対面を上記バックシート１８に重ねた状態で、上記昇降プレート２４をベースプレート２５に向かって下降させると、これに備えられた刃型２０の刃先が上記フィルム状樹脂４を貫通しバックシート１８に到達するように設定されている(図６参照）。これにより、刃型２０の保護を図りながら、フィルム状樹脂４を薄型半導体ウエハ５と略同じ輪郭形状に打ち抜くことができる。上記バックシート１８は、上記刃型２０によって形成された切り込みが、次回の打ち抜き時に影響することがないように、上記打ち抜きが終わった後、所定長さが送り出され、つぎの打ち抜きに備えるようになっている。 As shown in FIG. 5, the stamping means 6 includes a base plate 25 on which the long film-like resin 4 is placed, and a blade mold 20 that moves up and down toward the base plate 25 and punches the film-like resin 4 when lowered. A lifting plate 24 provided with a film-like resin supply means 16 for feeding out a long film-like resin 4 whose adhesive surface is protected by a release sheet 9 by a predetermined length and supplying it on a base plate 25, and the release sheet 9 When the film-like resin 4 is sequentially punched between the peeling means 17 that peels the film-like resin 4 from the front side of the base plate 25 and the film-like resin 4 and the base plate 25 supplied onto the base plate 25. Back sheet supply means for supplying a long back sheet 18 that contacts the blade mold 20 and protects the cutting edge And a 9. Then, when the film-like resin 4 from which the peeling sheet 9 has been peeled off by the peeling means 17 is lowered toward the base plate 25 with the surface opposite to the adhesive surface being overlapped on the back sheet 18. The blade tip of the blade mold 20 provided for this is set so as to penetrate the film-like resin 4 and reach the back sheet 18 (see FIG. 6). Thereby, the film-like resin 4 can be punched into substantially the same outline shape as the thin semiconductor wafer 5 while protecting the blade mold 20. The back sheet 18 is fed a predetermined length after the punching is finished so that the cut formed by the blade mold 20 does not affect the next punching, so that it is prepared for the next punching. It has become.
　なお、上記昇降プレート２４を昇降させる昇降手段２６は、例えば、油圧シリンダ等であり、この油圧シリンダの圧力を変動させることにより、昇降プレート２４をベースプレート２５に対し進退可能に昇降させることができる。 The elevating means 26 for elevating and lowering the elevating plate 24 is, for example, a hydraulic cylinder. The elevating plate 24 can be moved up and down with respect to the base plate 25 by changing the pressure of the hydraulic cylinder.
　また、上記フィルム状樹脂供給手段１６は、剥離シート９により接着面を保護されたフィルム状樹脂４が巻き回された巻き出しロール２１と、フィルム状樹脂４の端部を把持し所定長さだけ引き出す引き出し部（図示せず）とを有しており、所定形状のフィルム状樹脂４を打ち抜くごとに、上記引き出し部がフィルム状樹脂４を引き出して、新しい部分をベースプレート２５上に供給するようになっている。 The film-like resin supply means 16 grips the unwinding roll 21 around which the film-like resin 4 whose adhesive surface is protected by the release sheet 9 is wound, and the end of the film-like resin 4 and holds only a predetermined length. A drawing part (not shown) for drawing out, and whenever the film-like resin 4 having a predetermined shape is punched out, the drawing-out part draws out the film-like resin 4 and supplies a new part onto the base plate 25. It has become.
　さらに、上記剥離手段１７は、剥離シート９をフィルム状樹脂４から剥がして、異なる方向に引き出すためのガイド板２２と、上記異なる方向に引き出された剥離シート９を巻き取る巻き取りロール２３とで構成されている。 Further, the peeling means 17 includes a guide plate 22 for peeling the release sheet 9 from the film-like resin 4 and drawing it in a different direction, and a take-up roll 23 for winding the release sheet 9 drawn in the different direction. It is configured.
　そして、上記バックシート供給手段１９は、上記ベースプレート２５の下方に備えられた巻き出しロール２７から巻き出されたバックシート１８を、ベースプレート２５上面と、フィルム状樹脂４との間を経由させて、上記巻き出しロール２７と同じくベースプレート２５の下方に備えられた巻き取りロール２８で巻き取るもので、上記刃型２０の当たりとなってその刃先を保護するバックシート１８を、フィルム状樹脂４の打ち抜きの度に新しいシート部分をベースプレート２５上に供給できるようになっている。このようなバックシート１８としては、例えば、東レ社製、ルミラーが好適に使用される。 The backsheet supply means 19 passes the backsheet 18 unwound from the unwinding roll 27 provided below the base plate 25 between the upper surface of the base plate 25 and the film-like resin 4, Like the unwinding roll 27, the sheet is wound up by a winding roll 28 provided below the base plate 25, and the back sheet 18 that hits the blade mold 20 and protects the blade edge is punched out of the film-like resin 4. Each time, a new sheet portion can be supplied onto the base plate 25. As such a back sheet 18, for example, Lumirror made by Toray Industries, Inc. is preferably used.
　また、上記載置手段８は、上記打ち抜かされたフィルム状樹脂４を、接着面を下に向けた状態で、ダイシングフレームで周囲を囲われた薄型半導体ウエハ５の上に位置合わせをしながら載置する動作を行うものであり、この動作により、仮積層体７が得られるようになっている。 The placing means 8 places the punched film-like resin 4 on the thin semiconductor wafer 5 surrounded by a dicing frame with the adhesive surface facing downward. The temporary laminated body 7 can be obtained by this operation.
　すなわち、図４および図７に示すように、まず、ハンドラー３０の吸着ヘッド６０は上記打ち抜かれたフィルム状樹脂４の端部（この例では、端から５ｍｍ内側までの範囲）を吸着し、その状態でレール部３２を摺動する。そして、上記吸着ヘッド６０が吸着したフィルム状樹脂４を反転テーブル３１の上で位置決めしながらその吸着を解除し、上記フィルム状樹脂４を反転テーブル３１の上に接着面が上を向いた状態で載置する。ついで、上記反転テーブル３１は、上記フィルム状樹脂４を裏面（接着面の反対面）側から吸着した状態で、回動部３１ａを回転中心に１８０°反転（回転）し、フィルム状樹脂４の接着面を、別途搬送コンベア５６で搬送されてきた薄型半導体ウエハ５上に重ねて、仮積層体７とするものである。 That is, as shown in FIGS. 4 and 7, first, the suction head 60 of the handler 30 sucks the end of the punched film-like resin 4 (in this example, the range from the end to 5 mm inside). The rail part 32 is slid in a state. Then, while the film-like resin 4 adsorbed by the adsorption head 60 is positioned on the reversing table 31, the adsorption is released, and the film-like resin 4 is placed on the reversing table 31 with the adhesive surface facing upward. Place. Next, the reversing table 31 reverses (rotates) 180 degrees around the rotation portion 31a with the film-shaped resin 4 adsorbed from the back surface (opposite surface of the adhesive surface) as the center of rotation. The adhesive surface is stacked on the thin semiconductor wafer 5 that has been separately conveyed by the conveyor 56 to form a temporary laminate 7.
　なお、上記フィルム状樹脂４を反転テーブル３１上に移載する機構、および反転テーブル３１を反転させる機構等は、水平方向、上下方向のスペースを考慮して適宜の機構を選択することができる。 It should be noted that the mechanism for transferring the film-like resin 4 onto the reversing table 31 and the mechanism for reversing the reversing table 31 can be appropriately selected in consideration of the horizontal and vertical spaces.
　つぎに、上記積層ユニット２（図１参照）は、上記得られた仮積層体７を圧締し積層体３３に形成するものであり、仮積層体７を引き取って搬送する上下一対の搬送フィルム３４，３５からなる搬送手段と、この搬送路途中に設けられる圧締手段３６とを有している。 Next, the laminated unit 2 (see FIG. 1) is a unit that presses the obtained temporary laminated body 7 to form the laminated body 33, and a pair of upper and lower transport films that take up and convey the temporary laminated body 7. 34 and 35, and a pressure clamping means 36 provided in the middle of the conveyance path.
　上記搬送手段は、上下一対の搬送フィルム３４，３５の間に仮積層体７を狭持して搬送するものであり、上側の搬送フィルム３４が巻き出ロール３７と巻き取りロール３８との間に掛け渡され、巻き出しロール３７と巻き取りロール３８とが同調して可動することにより、搬送フィルム３４がたるみなく搬送されるようになっている。同様に、下側の搬送フィルム３５が巻き出しロール３９と巻き取りロール４０との間に掛け渡され、巻き出しロール３９と巻き取りロール４０とが同調して可動することにより、搬送フィルム３５がたるみなく搬送されるようになっている。このような搬送フィルムとしては、例えば、ポリエチレンテレフタレート（ＰＥＴ）フィルムがあげられ、具体的には、東レ社製の「ルミラー」やユニチカ社製の「ＥＭＢＬＥＴ　ＰＴＨシリーズ」や、ダイヤフォイル社製の「マットフィルムシリーズ」等が使用される。なお、図１において、５３は冷却ファンであり、形成された積層体３３を冷却している。 The transport means sandwiches and transports the temporary laminate 7 between a pair of upper and lower transport films 34 and 35, and the upper transport film 34 is interposed between the unwinding roll 37 and the winding roll 38. When the take-up roll 37 and the take-up roll 38 are moved in synchronism with each other, the transport film 34 is transported without slack. Similarly, the lower conveyance film 35 is stretched between the unwinding roll 39 and the take-up roll 40, and the unwinding roll 39 and the take-up roll 40 move in synchronization, whereby the conveying film 35 is moved. It is designed to be transported without slack. Examples of such a transport film include a polyethylene terephthalate (PET) film. Specifically, “Lumirror” manufactured by Toray Industries, “EMBLET PTH series” manufactured by Unitika, and “ "Matte film series" or the like is used. In FIG. 1, reference numeral 53 denotes a cooling fan that cools the formed stacked body 33.
　また、上記圧締手段３６は、上記搬送手段の搬送路途中に設けられ、搬送手段によって搬送される仮積層体７を真空状態で加熱加圧することにより上下方向から圧締して、積層体３３とするものである。この圧締手段３６は、図１に示すように、ベットフレーム４１に立設された複数本（図１では２本しか図示せず）の支柱４２と、これら各支柱４２の上端部に架設された複数本（図１では１本しか図示せず）の横板４３と、これら各横板４３にボルト，ナット等の固定手段（図示せず）で固定された上部プレート４４と、上下に進退可能な下部プレート４５等を備えている。この下部プレート４５は、エアシリンダ４６の作動によりシリンダロッドの伸張および収縮に伴って、上下に移動するようになっている。そして、上記一対のプレート４４，４５、後述する可撓性シート４７、弾性シート４８、圧力調整手段等で上下一対のプレス手段４９が構成されている。 The pressing means 36 is provided in the middle of the conveying path of the conveying means, and the temporary laminated body 7 conveyed by the conveying means is pressed in the vertical direction by heating and pressing in a vacuum state, so that the laminated body 33 is pressed. It is what. As shown in FIG. 1, the pressing means 36 is installed on a plurality of columns 42 (only two are shown in FIG. 1) erected on the bed frame 41, and on the upper ends of these columns 42. In addition, a plurality of horizontal plates 43 (only one is shown in FIG. 1), an upper plate 44 fixed to each horizontal plate 43 by fixing means (not shown) such as bolts and nuts, and the vertical movement A possible lower plate 45 is provided. The lower plate 45 moves up and down as the cylinder rod extends and contracts by the operation of the air cylinder 46. A pair of upper and lower pressing means 49 is constituted by the pair of plates 44 and 45, a flexible sheet 47 described later, an elastic sheet 48, a pressure adjusting means, and the like.
　上記上部プレート４４の下面には、図８に示すように、空隙部５０に対応する部分に複数個（図８では２個しか図示せず）の上側開口部５４が開口しており、圧力調整手段（図示せず）から上記各上側開口部５４を介して空隙部５０を真空状態にしたり、大気や圧縮空気を空隙部５０内に導入することにより、可撓性シート４７が風船のように膨らみ、仮積層体７が、上記可撓性シート４７と弾性シート４８との間で圧締される構造となっている。このような可撓性シート４７、弾性シート４８としては、その材質が耐熱性のバイトンゴムやシリコンゴムであるものが好適に使用される。とりわけ、ポリエステル，ポリアミド等の化学繊維やガラス繊維を布状に織ったものからなる繊維層（図示せず）を有するものであると、この繊維層により可撓性シート４７，弾性シート４８の耐久性を向上させることができるため、好ましい。 On the lower surface of the upper plate 44, as shown in FIG. 8, a plurality of upper openings 54 (only two are shown in FIG. 8) are opened in portions corresponding to the gaps 50, and pressure adjustment is performed. By making the gap 50 into a vacuum state from the means (not shown) through the upper openings 54, or introducing air or compressed air into the gap 50, the flexible sheet 47 becomes like a balloon. The swelled and temporary laminate 7 is structured to be pressed between the flexible sheet 47 and the elastic sheet 48. As the flexible sheet 47 and the elastic sheet 48, those made of heat-resistant Viton rubber or silicon rubber are preferably used. In particular, when a fiber layer (not shown) made of a fabric woven from a chemical fiber such as polyester or polyamide or a glass fiber is used, durability of the flexible sheet 47 and the elastic sheet 48 is achieved by the fiber layer. It is preferable because the property can be improved.
　そして、上記上部プレート４４には、その下面に可撓性シート４７が配設されており、その外周部が押さえ金具（図示せず）により気密状に固定されている。この押さえ金具の内側部分には、上部プレート４４と可撓性シート４７との間に空隙部５０が形成されている。上記下部プレート４５には、その上面の、上記空隙部５０に対応する部分に弾性シート４８が載置されている。このような上下両プレート４４，４５には、ラバーヒーターやシース状ヒーター等の加熱手段（図示せず）が内蔵されている。 And the flexible sheet 47 is arrange | positioned by the lower surface at the said upper plate 44, The outer peripheral part is being fixed airtightly by the pressing metal fitting (not shown). A gap 50 is formed between the upper plate 44 and the flexible sheet 47 in the inner part of the presser fitting. An elastic sheet 48 is placed on the upper surface of the lower plate 45 at a portion corresponding to the gap 50. Such upper and lower plates 44 and 45 contain heating means (not shown) such as a rubber heater or a sheath heater.
　また、上記下部プレート４５の上面には、複数個（図８では２個しか図示せず）の下側開口部５５が開口しており、上下両プレート４４，４５を密封契合して真空チャンバーを形成したときに、可撓性シート４７と下部プレート４５の間に形成される空間部５１の空気を真空状態にすることができるようになっている。図において、５２は下部プレート４５の外周部上面に固定されたシール部材であり、上記真空状態の際に空間部５１の気密性を高める作用をしている。 Further, a plurality of lower openings 55 (only two are shown in FIG. 8) are opened on the upper surface of the lower plate 45, and the upper and lower plates 44, 45 are hermetically sealed to form a vacuum chamber. When formed, the air in the space 51 formed between the flexible sheet 47 and the lower plate 45 can be evacuated. In the figure, 52 is a seal member fixed to the upper surface of the outer peripheral portion of the lower plate 45, and acts to enhance the airtightness of the space 51 in the vacuum state.
　このような仮積層ユニット１と積層ユニット２とを備えた本発明のフィルム状樹脂積層装置を用いて、ダイシングフレーム１０で周囲を囲われた薄型半導体ウエハ５にフィルム状樹脂４を積層する工程を以下に説明する。この積層工程を図３に模式的に示す。すなわち、まず、薄型半導体ウエハ５をダイシングテープ１１の上に着脱自在に固定し、その周囲を環状のダイシングフレーム１０で囲ったものを準備する（図２（ａ）参照）。そして、搬送コンベア５６によって、上記ダイシングフレーム１０等で保護された薄型半導体ウエハ５を順次、仮積層ユニット１に搬送する（図１参照）。 A step of laminating the film-like resin 4 on the thin semiconductor wafer 5 surrounded by the dicing frame 10 using the film-like resin laminating apparatus of the present invention including the temporary lamination unit 1 and the lamination unit 2 as described above. This will be described below. This lamination process is schematically shown in FIG. That is, first, a thin semiconductor wafer 5 is detachably fixed on a dicing tape 11 and a periphery thereof is surrounded by an annular dicing frame 10 (see FIG. 2A). And the thin semiconductor wafer 5 protected by the said dicing frame 10 grade | etc., Is sequentially conveyed by the conveyance conveyor 56 to the temporary lamination | stacking unit 1 (refer FIG. 1).
　一方、仮積層ユニット１のスタンピング手段６（図５参照）においては、接着面が剥離シート９によって保護された長尺状のフィルム状樹脂４を用意し、上記スタンピング手段６の巻き出しロール２１としてセットする。また、バックシート１８をベースプレート２５の上を経由させて、巻き出しロール２７と巻き取りロール２８との間に掛け渡す。そして、上記剥離シート９をフィルム状樹脂４から剥がし、ガイド板２２を経由させて巻き取りロール２３で巻き取るとともに、剥離シート９が剥がされ、接着面が剥き出しになったフィルム状樹脂４を上記バックシート１８の上に接着面を上にした状態で載置する。なお、上記フィルム状樹脂４の片端は、引き出し部（図示せず）によって把持され、たるみがないように張力が掛けられている。 On the other hand, in the stamping means 6 (see FIG. 5) of the temporary lamination unit 1, a long film-like resin 4 having an adhesive surface protected by a release sheet 9 is prepared and used as the unwinding roll 21 of the stamping means 6. set. Further, the back sheet 18 is routed between the unwinding roll 27 and the winding roll 28 via the base plate 25. Then, the release sheet 9 is peeled off from the film-like resin 4 and taken up by the take-up roll 23 via the guide plate 22, and the release sheet 9 is peeled off, and the adhesive film is exposed. It is mounted on the back sheet 18 with the adhesive surface facing up. Note that one end of the film-like resin 4 is gripped by a drawer portion (not shown) and is tensioned so that there is no slack.
　そして、薄型半導体ウエハ５と略同じ輪郭形状の刃型２０を取り付けた昇降プレート２４を、上記刃型２０の刃先がバックシート１８に到達するまで下降させる。これにより、フィルム状樹脂４が上記刃型２０の形状に打ち抜かれ、打ち抜かれた部分が、薄型半導体ウエハ５と略同じ輪郭形状を有するフィルム状樹脂４となる。打ち抜かれた部分以外の不要フィルム状樹脂４は、打ち抜きと同時に１ピッチ分の長さで切断され、ダストボックス５７に順次重ねて収容される。 Then, the elevating plate 24 to which the blade mold 20 having substantially the same contour shape as that of the thin semiconductor wafer 5 is lowered until the blade edge of the blade mold 20 reaches the back sheet 18. Thereby, the film-like resin 4 is punched into the shape of the blade mold 20, and the punched portion becomes the film-like resin 4 having substantially the same contour shape as that of the thin semiconductor wafer 5. Unnecessary film-like resin 4 other than the punched portion is cut at a length corresponding to one pitch at the same time as punching, and is sequentially stacked and accommodated in a dust box 57.
　上記成形されたフィルム状樹脂４は、接着面が上を向き、しかもその接着面が剥き出しになっているため、できるだけ接触を少なくするように、端部全周からその内側５ｍｍまでのリング状部分を、上記ハンドラー３０の吸着ヘッド６０が上方から吸着し、所定位置まで持ち上げる。すなわち、図７に示すように、吸着ヘッド６０を保持する根元部６１が、スライドガイド６２の側面に設けられた突条６２ａを下方に摺動することにより、吸着ヘッド６０を上記フィルム状樹脂４に当接させ、フィルム状樹脂４を吸着する。ついで、上記根元部６１を、突条６２ａを上方に摺動させて元の位置に戻し、その状態で、ハンドラー３０のスライドガイド６２がレール部３２を摺動し、上記フィルム状樹脂４が反転テーブル３１上に位置するまでハンドラー３０を移動させる。そして、上記根元部６１が、突条６２ａを下方に摺動し、吸着ヘッド６０に吸着されているフィルム状樹脂４を反転テーブル３１の所定位置に載置し、吸着を解除する。ハンドラー３０は、フィルム状樹脂４を反転テーブル３１に載置後、所定位置に戻る。 The molded film-like resin 4 has a ring-shaped portion extending from the entire circumference of the end portion to the inner 5 mm so as to reduce contact as much as possible because the adhesive surface faces upward and the adhesive surface is exposed. The suction head 60 of the handler 30 sucks from above and lifts it up to a predetermined position. That is, as shown in FIG. 7, the root portion 61 that holds the suction head 60 slides downward on the protrusion 62 a provided on the side surface of the slide guide 62, so that the suction head 60 is moved to the film-like resin 4. To adsorb the film-like resin 4. Next, the base portion 61 is returned to the original position by sliding the protrusion 62a upward, and in this state, the slide guide 62 of the handler 30 slides on the rail portion 32, and the film-like resin 4 is reversed. The handler 30 is moved until it is positioned on the table 31. Then, the root portion 61 slides down the ridge 62a, places the film-like resin 4 adsorbed by the adsorption head 60 at a predetermined position of the reversing table 31, and releases the adsorption. The handler 30 returns to a predetermined position after placing the film-like resin 4 on the reversing table 31.
　つぎに、上記反転テーブル３１は、上記載置されたフィルム状樹脂４の接着面の反対面を吸着するようになっており、その状態で、回動部３１ａを回動中心として反転テーブルが１８０°反転（回転）し、前記搬送コンベア５６で搬送される薄型半導体ウエハ５（ダイシングフレーム１０等で保護されている）上にフィルム状樹脂４を位置決めして載置し、上記反転テーブル３１の吸着を解除する。このようにして、ダイシングテープ１１上に固定され、ダイシングフレーム１０でその周囲を囲われた薄型半導体ウエハ５上に、所定形状のフィルム状樹脂４が載置された仮積層体７（図２（ｂ）参照）を得ることができる。 Next, the reversing table 31 adsorbs the opposite surface of the adhesive surface of the film-like resin 4 placed above, and in this state, the reversing table is 180 with the rotating portion 31a as the rotation center. The film-like resin 4 is positioned and placed on the thin semiconductor wafer 5 (protected by the dicing frame 10 or the like) that is reversed (rotated) and conveyed by the conveying conveyor 56, and the reversing table 31 is sucked. Is released. In this way, the temporary laminated body 7 (FIG. 2 (FIG. 2 (A))) is mounted on the thin semiconductor wafer 5 fixed on the dicing tape 11 and surrounded by the dicing frame 10. b) can be obtained.
　上記得られた仮積層体７は、搬送コンベア５６から上下一対の搬送フィルム３４，３５からなる搬送手段に引き渡され、上記両搬送フィルム３４，３５に狭持された状態で搬送される（図１参照）。 The obtained temporary laminate 7 is handed over from the conveyor 56 to a conveying means composed of a pair of upper and lower conveying films 34, 35, and conveyed while being sandwiched between the conveying films 34, 35 (FIG. 1). reference).
　そして、上記仮積層体７は、上記搬送手段の搬送路途中に設けられる上記圧締手段３６において、つぎのように圧締が行われる。まず、上下搬送フィルム３４，３５で搬送される仮積層体７を、上記搬送フィルム３４，３５の通過面を囲う形状に形成された閉鎖空間内の所定位置（圧締位置）に位置決めする。ついで、エアシリンダ４６を作動し、下部プレート４５を上昇させ、上部プレート４４の押さえ金具５８の下面と下部プレート４５の上面とを密着させて上下両プレート４４，４５を密封契合する。 Then, the temporary laminate 7 is pressed in the following manner in the pressing means 36 provided in the middle of the conveying path of the conveying means. First, the temporary laminate 7 conveyed by the upper and lower conveying films 34 and 35 is positioned at a predetermined position (clamping position) in a closed space formed in a shape surrounding the passing surface of the conveying films 34 and 35. Next, the air cylinder 46 is actuated to raise the lower plate 45, and the lower surface of the presser fitting 58 of the upper plate 44 and the upper surface of the lower plate 45 are brought into close contact with each other to seal the upper and lower plates 44, 45 together.
　この密封契合ののち、空隙部５０および空間部５１を減圧状態にする。具体的には、圧力調整手段により上側開口部５４を介して空隙部５０を減圧し、減圧手段により下側開口部５５を介して空間部５１を減圧する。上記空間部５１の圧力は２０秒以内に２００Ｐａ以下の真空状態にすることが好ましく、特には２～８秒間で１００Ｐａ以下の真空状態にすることが好ましい。なお、予め空隙部５０を２００Ｐａ以下の真空状態に減圧しておいて仮積層体７を搬入して真空チャンバーを形成してから空間部５１を２００Ｐａ以下の真空状態に減圧してもよい。また、真空引きする際には、可撓性シート４７および弾性シート４８の温度を４０～１８５℃にすることが好ましく、より好ましくは７０～１８５℃である。このような温度コントロールの方法としては、例えば、上下両プレート４４，４５に内蔵されるシース状ヒーター等で調整される。 After this sealing engagement, the gap 50 and the space 51 are put under reduced pressure. Specifically, the gap 50 is decompressed via the upper opening 54 by the pressure adjusting means, and the space 51 is decompressed via the lower opening 55 by the decompressing means. The pressure in the space 51 is preferably set to a vacuum state of 200 Pa or less within 20 seconds, and particularly preferably set to a vacuum state of 100 Pa or less in 2 to 8 seconds. Alternatively, the space 50 may be decompressed to 200 Pa or less after the gap 50 has been decompressed to 200 Pa or less in advance and the temporary laminate 7 is carried in to form a vacuum chamber. When evacuating, the temperature of the flexible sheet 47 and the elastic sheet 48 is preferably 40 to 185 ° C., more preferably 70 to 185 ° C. As such a temperature control method, for example, the temperature is adjusted by a sheath heater or the like built in the upper and lower plates 44 and 45.
　つぎに、図８に示すように、空隙部５０と空間部５１との圧力差により、可撓性シート４７を下方に膨らませて仮積層体７の薄型半導体ウエハ５と所定形状のフィルム状樹脂４とを貼り合せるラミネートスラップダウン工程を行う。上記圧力差の調整は、具体的には、空間部５１を減圧したまま空隙部５０の圧力を常力に戻せばよく、その圧力差により、上記可撓性シート４７が空間部５１側に膨らみ、上記仮積層体７を上から押え付けて、弾性シート４８との間で圧締し、積層体３３（図２（ｃ）参照）に形成する。このとき、上記可撓性シート４７は、高い追従性を有しており、ダイシングフレーム１０の上縁と薄型半導体ウエハ５の上面とに高低差があっても、いずれに対しても隙間なく密着するため、薄型半導体ウエハ５の全面に対し均一かつ充分な押圧をすることができる。 Next, as shown in FIG. 8, due to the pressure difference between the gap 50 and the space 51, the flexible sheet 47 is expanded downward to form the thin semiconductor wafer 5 of the temporary laminate 7 and the film-shaped resin 4 having a predetermined shape. Laminate slap down process is performed. Specifically, the adjustment of the pressure difference may be performed by returning the pressure of the gap 50 to the normal force while the space 51 is decompressed, and the flexible sheet 47 expands toward the space 51 due to the pressure difference. The temporary laminate 7 is pressed from above and pressed between the elastic sheet 48 and formed into a laminate 33 (see FIG. 2C). At this time, the flexible sheet 47 has high followability, and even if there is a height difference between the upper edge of the dicing frame 10 and the upper surface of the thin semiconductor wafer 5, there is no gap between them. Therefore, uniform and sufficient pressure can be applied to the entire surface of the thin semiconductor wafer 5.
　引き続いて、空隙部５０の圧力を高めるラミネート増圧工程を行う。この工程では、空隙部５０に圧縮空気を導入して空隙部５０内の圧力を高めて可撓性シート４７をさらに強く膨らませ、上記積層体３３をさらに強く圧締する。すなわち、上記ラミネートスラップダウン工程により、薄型半導体ウエハ５と所定形状のフィルム状樹脂４とを密着させ、ラミネート増圧工程により薄型半導体ウエハ５とフィルム状樹脂４との密着性をより確実にする。 Subsequently, a laminate pressure increasing process for increasing the pressure in the gap 50 is performed. In this step, compressed air is introduced into the gap 50 to increase the pressure in the gap 50 and the flexible sheet 47 is further inflated, and the laminate 33 is further strongly clamped. That is, the thin semiconductor wafer 5 and the film-shaped resin 4 having a predetermined shape are brought into close contact by the laminate slap down process, and the adhesiveness between the thin semiconductor wafer 5 and the film-like resin 4 is further ensured by the laminating pressure increasing process.
　ラミネート増圧工程が終了した後に、上側開口部５４および下側開口部５５により空間部５１の真空状態と空隙部５０の加圧状態を開放して常圧に戻し、下部プレート４５を下方に移動させ、上下両プレート４４，４５の密封契合を解除する。そして、上記得られた積層体３３は、上下搬送フィルム３４，３５に狭持された状態で搬送され、ついで、搬送コンベア（図示せず）を経由して取り出される。 After the lamination pressure increasing process is finished, the upper opening 54 and the lower opening 55 release the vacuum state of the space 51 and the pressurized state of the gap 50 to return to normal pressure, and move the lower plate 45 downward. The sealing engagement between the upper and lower plates 44 and 45 is released. And the obtained laminated body 33 is conveyed in the state pinched by the up-and-down conveyance films 34 and 35, and then is taken out via a conveyance conveyor (not shown).
　上記得られた積層体３３は、例えば、所定のサイズにダイシングされ（図２（ｄ）参照）、ダイシングテープ１１から取り外された後、別途用意した回路基板５９に、フィルム状樹脂４を利用して接続され用いられる（図２（ｅ）参照）。 The obtained laminate 33 is, for example, diced to a predetermined size (see FIG. 2D), removed from the dicing tape 11, and then used for the circuit board 59 separately prepared using the film-like resin 4. Connected and used (see FIG. 2E).
　なお、上記スタンピング手段６において、所定形状に打ち抜かれた部分以外の不要な部分のフィルム状樹脂４を、所定長さで切断し、ダストボックス５７に順次収容するようにしているが、切断せずに巻き取りロールで巻き取るようにしてもよい。しかし、上記のように所定長さで切断するようにすると、別途巻き取りロール等を設置するスペースを確保する必要がなくなり、さらに装置の小型化を図ることができる。 In the stamping means 6, an unnecessary portion of the film-like resin 4 other than the portion punched into a predetermined shape is cut to a predetermined length and sequentially stored in the dust box 57. You may make it wind up with a winding roll. However, if cutting is performed at a predetermined length as described above, it is not necessary to secure a space for installing a separate take-up roll or the like, and the apparatus can be further downsized.
　上記実施の形態においては、本発明における具体的な形態について示したが、上記実施の形態は単なる例示に過ぎず、限定的に解釈されるものではない。当業者に明らかな様々な変形は、本発明の範囲内であることが企図されている。 In the above embodiment, specific forms in the present invention have been described. However, the above embodiment is merely an example and should not be interpreted in a limited manner. Various modifications apparent to those skilled in the art are contemplated to be within the scope of this invention.
　本発明のフィルム状樹脂積層装置は、薄型の半導体ウエハに絶縁性接着フィルム等のフィルム状樹脂を効率よく確実に積層することができる。 The film-like resin laminating apparatus of the present invention can efficiently and reliably laminate a film-like resin such as an insulating adhesive film on a thin semiconductor wafer.
１　　仮積層ユニット
２　　積層ユニット
４　　フィルム状樹脂
５　　薄型半導体ウエハ
７　　仮積層体
１０　ダイシングフレーム
３３　積層体
３４　上側の搬送フィルム
３５　下側の搬送フィルム
３６　圧締手段 DESCRIPTION OF SYMBOLS 1 Temporary laminated unit 2 Laminated unit 4 Film-like resin 5 Thin semiconductor wafer 7 Temporary laminated body 10 Dicing frame 33 Laminated body 34 Upper conveyance film 35 Lower conveyance film 36 Clamping means

Claims (4)

  1. 　ダイシングテープ上に着脱自在に固定されその周囲を環状のダイシングフレームで囲われた薄型半導体ウエハの上にフィルム状樹脂を載置して上下方向から圧締することにより積層するフィルム状樹脂積層装置であって、上記薄型半導体ウエハの上にフィルム状樹脂を載置し仮積層体とする仮積層ユニットと、上記得られた仮積層体を上下方向から圧締し積層体に形成する積層ユニットとを備え、上記仮積層ユニットが、フィルム状樹脂を薄型半導体ウエハと略同じ輪郭形状に成形する成形手段と、成形されたフィルム状樹脂を薄型半導体ウエハの上に載置し仮積層体とする載置手段とを有しており、上記積層ユニットが、上記仮積層体を引き取って搬送する上下一対の搬送フィルムからなる搬送手段と、この搬送手段による搬送路途中に設けられる下記の圧締手段（Ａ）とを有していることを特徴とするフィルム状樹脂積層装置。
    （Ａ）上記搬送フィルムの通過面を囲うよう形成された閉鎖空間と、その内側に、上記搬送フィルムを間に挟んで対峙する上下一対のプレートと、これら両プレートの少なくとも一方を他方に対し進退させるための昇降手段と、上記上側のプレートと搬送フィルムとの間を仕切る可撓性シートと、上記下側のプレートの上面に固定される弾性シートと、上側のプレートと可撓性シートの間に形成される空隙部と可撓性シートと弾性シートとの間に形成される空間部の圧力を調整する圧力調整手段とを有し、上記空隙部の圧力を上記空間部の圧力より大きくし、上記可撓性シートを弾性シート側に膨らませることにより、上記搬送フィルムで搬送される仮積層体を上下方向から圧締し積層体に形成するよう設定された圧締手段。     A film-like resin laminating device that lays on a thin semiconductor wafer that is detachably fixed on a dicing tape and is surrounded by an annular dicing frame and laminated by pressing from above and below. A temporary lamination unit that places a film-like resin on the thin semiconductor wafer to form a temporary laminate, and a laminate unit that presses the obtained temporary laminate from above and below to form the laminate. The temporary lamination unit includes a molding unit that molds the film-like resin into substantially the same contour shape as the thin semiconductor wafer, and a placement that places the molded film resin on the thin semiconductor wafer to form a temporary laminate. And the stacking unit is provided in the middle of a transport path by the transport means and a pair of transport films for picking up and transporting the temporary laminate. It and a following clamping means (A) a film-like resin laminated device according to claim to be.
    (A) a closed space formed so as to enclose the passage surface of the transport film, a pair of upper and lower plates facing each other with the transport film interposed therebetween, and at least one of these plates is advanced and retracted with respect to the other Lifting and lowering means, a flexible sheet for partitioning the upper plate and the transport film, an elastic sheet fixed to the upper surface of the lower plate, and between the upper plate and the flexible sheet Pressure adjusting means for adjusting the pressure of the space formed between the gap formed in the flexible sheet and the elastic sheet, and the pressure of the space is made larger than the pressure of the space. Clamping means set so as to press the temporary laminate conveyed by the conveyance film from above and below to form a laminate by inflating the flexible sheet toward the elastic sheet.
  2. 　上記仮積層ユニットにおいて、上記成形手段が、フィルム状樹脂の接着面を上に向けた状態でフィルム状樹脂の成形を行うようになっており、上記載置手段が、成形されたフィルム状樹脂を１８０°反転させフィルム状樹脂の接着面を下に向けた状態で、上記薄型ウエハ上に載置するようになっていることを特徴とする請求項１記載のフィルム状樹脂積層装置。 In the temporary stacking unit, the molding means is configured to mold the film-shaped resin with the adhesive surface of the film-shaped resin facing upward, and the placing means includes the molded film-shaped resin. 2. The film-shaped resin laminating apparatus according to claim 1, wherein the film-shaped resin laminating apparatus is placed on the thin wafer with the adhesive surface of the film-shaped resin facing downward by turning 180 °.
  3. 　上記仮積層ユニットの成形手段が、フィルム状樹脂を載置するベースプレートと、このベースプレートに向かって昇降し、下降時にフィルム状樹脂を打ち抜く刃型を備えた昇降プレートとを有し、上記昇降プレートの下降により上記ベースプレート上に載置されたフィルム状樹脂を薄型半導体ウエハと略同じ形状に打ち抜くよう設定されたスタンピング手段であることを特徴とする請求項１または２記載のフィルム状樹脂積層装置。 The forming means of the temporary lamination unit includes a base plate on which the film-like resin is placed, and a lifting plate having a blade shape that moves up and down toward the base plate and punches out the film-like resin when lowered. 3. The film-like resin laminating apparatus according to claim 1, wherein the film-like resin laminating apparatus is a stamping means set so as to punch out the film-like resin placed on the base plate into substantially the same shape as that of the thin semiconductor wafer.
  4. 　上記スタンピング手段が、接着面が剥離シートで保護された長尺状のフィルム状樹脂を所定長ずつ繰り出してベースプレート上に供給するフィルム状樹脂供給手段と、上記剥離シートをベースプレート手前側においてフィルム状樹脂から剥離する剥離手段と、上記ベースプレート上に供給されたフィルム状樹脂とベースプレートとの間に、順次、上記フィルム状樹脂の打ち抜きの際に刃型の当たりとなって刃先を保護する長尺状のバックシートを供給するバックシート供給手段とを有し、上記剥離シートが剥離されたフィルム状樹脂の接着面と反対面を上記バックシートに重ねた状態でフィルム状樹脂を薄型半導体ウエハと略同じ輪郭形状に打ち抜くようになっていることを特徴とする請求項３記載のフィルム状樹脂積層装置。 The stamping means includes a film-like resin supply means that feeds a long film-shaped resin, the adhesive surface of which is protected by a release sheet, to the base plate by a predetermined length, and the release sheet is disposed on the front side of the base plate. The stripping means for peeling from the base plate and the film-like resin supplied on the base plate and the base plate in order, hitting the blade mold when the film-like resin is punched in order, and protecting the cutting edge Back sheet supply means for supplying a back sheet, and the film resin is substantially the same as a thin semiconductor wafer in a state where the adhesive surface of the film resin from which the release sheet has been peeled is overlapped on the back sheet 4. The film-like resin laminating apparatus according to claim 3, wherein the apparatus is punched into a shape.
PCT/JP2013/061766 2012-07-06 2013-04-22 Film-like resin laminating device WO2014006956A1 (en)

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JP5995325B2 (en) * 2012-08-24 2016-09-21 株式会社名機製作所 Lamination method and lamination system
JP6236561B1 (en) * 2017-04-27 2017-11-22 信越エンジニアリング株式会社 Work bonding apparatus and work bonding method
JP6165372B1 (en) * 2017-01-10 2017-07-19 信越エンジニアリング株式会社 Work conveying apparatus and work conveying method

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CN111180367A (en) * 2015-10-02 2020-05-19 Ap***股份有限公司 Bonding system using vacuum lamination
CN111180367B (en) * 2015-10-02 2023-08-15 Ap***股份有限公司 Bonding system using vacuum lamination

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