WO2013189082A1 - Sawing wire with bare steel surface and method to make the same - Google Patents
Sawing wire with bare steel surface and method to make the same Download PDFInfo
- Publication number
- WO2013189082A1 WO2013189082A1 PCT/CN2012/077385 CN2012077385W WO2013189082A1 WO 2013189082 A1 WO2013189082 A1 WO 2013189082A1 CN 2012077385 W CN2012077385 W CN 2012077385W WO 2013189082 A1 WO2013189082 A1 WO 2013189082A1
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- WIPO (PCT)
- Prior art keywords
- wire
- sawing wire
- sawing
- bare steel
- present
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
Definitions
- This invention relates to a steel wire for use in a wire saw to cut semiconductor ingots into wafers, and in particular to a sawing wire with bare steel surface. This invention also provides the method to manufacture a sawing wire with bare steel surface.
- Semiconductor wafers are generally prepared from a single crystal ingot, such as a silicon ingot, that is cylindrical in shape.
- the ingot is sliced in a direction normal to its longitudinal axis to produce as many as several hundred thin, disk-shaped wafers.
- the slicing operation may be accomplished by means of a wire saw, wherein the ingot is contacted with a reciprocating wire while liquid slurry containing abrasive grains is supplied to a contact area between the ingot and the wire.
- liquid slurry containing abrasive grains is supplied to a contact area between the ingot and the wire.
- silicon crystal is removed and the ingot is gradually sliced.
- the wire saw provides a gentle mechanical method for slicing which makes it ideal for cutting silicon crystal, which is brittle and could be damaged by other types of saws.
- the sawing wire is generally plated with copper or copper alloy.
- the reason for plating a sawing wire with copper or copper alloy is to impart a corrosion preventive effect and to impart a lubricating effect during a drawing process in which a starting wire passes through several dies having different sizes of holes so as to be drawn in several steps.
- a starting wire without copper or copper alloy plating is drawn, not only does the drawing speed significantly decrease due to poor lubrication between the wire and the die, but also there are formed many scratches on the wire surface, which impair quality characteristics that a sawing wire is required to have, for example tensile strength.
- this lubricating effect is particularly important.
- Prior art US5927131 provides a sawing wire without copper or copper alloy plating, wherein the copper or copper alloy plating is removed by physical polishing and/or chemical polishing after the finish drawing stage.
- Prior art KR20010002690A provides a sawing wire without copper or copper plating, wherein the copper or copper alloy plating is dissolved into a chemical solution. Both prior art documents have the drawback that copper or copper alloy is firstly plated on the starting wire as a lubricant for followed wire drawing process, and secondly removed either physically or chemically from the surface of the sawing wire.
- a sawing wire with bare steel surface wherein lubricant is present on the surface in an amount corresponding to between 5 to 50 mg/m of carbon, and preferably between 15 and 50 mg/m of carbon.
- a sawing wire with bare steel surface wherein phosphorus is present on the surface in an amount corresponding to between 2 to 30 mg/m , and preferably between 5 to 15 mg/m 2 .
- a sawing wire with bare steel surface wherein boron is present on the surface in an amount corresponding to between 2 to 30 mg/m 2 , and preferably between 5 to 15 mg/m 2.
- phosphorous and boron are the elements that are used to make the silicon n-type (phosphorus) or p-type (boron), it is important to the invention that their remnants on the wire are controlled as this could lead to contamination of the wafers.
- a sawing wire with bare steel surface wherein grooves are present on the surface with depth between 0.5 ⁇ to ⁇ on the cross-sectional view, and preferably between ⁇ ⁇ and 5 ⁇ .
- a method of manufacturing a sawing wire with bare steel surface comprises the steps of:
- the lubrication enhancing substance is Phosphate, or Borax or Borax and Phosphate salt.
- Figure 1 is a process diagram showing a method of manufacturing a sawing wire with bare steel surface according to present invention.
- Figure 2 is a schematic illustration showing a magnified cross- sectional view of a sawing wire with bare steel surface according to present invention.
- Figure 1 is a process diagram showing a method of manufacturing a sawing wire with bare steel surface according to present invention.
- the starting wire 10 goes through steps, patenting, lubrication enhancement, and drawing, to a final sawing wire 20.
- Patenting is a thermal treatment applied to rods and wires.
- the object of patenting is to obtain a structure which combines high tensile strength with high ductility so that the wire is able to withstand heavy drafting, i.e. reduction in diameter by drawing, to produce the desired finished sizes with a combination of high tensile strength and good toughness.
- Conventionally patenting treatment comprises heating the starting wire until above the austenitizing temperature and followed by cooling the starting wire down to between 500C and 680C thereby allowing transformation from austenite to pearlite.
- US3458365 provides a patenting treatment for rods and wire, while UK1011972 provides another patenting treatment.
- Lubrication enhancement is a surface treatment on the starting wire 10 to provide the wire with a coating which can enhance the lubrication on the starting wire 10 to go through the drawing thereafter.
- Phosphate coating is a good lubrication enhancement, in which phosphate coating binds a subsequently applied lubricant so firmly that it virtually will not be removed by the next drawing operation, because the combination of the phosphate coating and the lubricant permits a repeated strong cold working, without a new intermediate treatment with lubricant.
- EP403241A and EP414301A provide solutions and process to form phosphate coating.
- Borax is another lubrication enhancement.
- GB9788124A and US5614261A provide method to apply Borax on the steel wire as lubrication enhancement before drawing. Besides, Borax can be applied after the phosphate coating to neutralize the phosphate coating because the borax solution is alkaline and the solution for phosphate coating is acidic.
- Drawing is a mechanical deformation in that a starting wire 10 passes through a series of dies having decreasing size of holes so as to be drawn in several steps.
- drawing processes dry drawing and wet drawing, depending on whether the drawing process is conducted in a coolant (wet drawing) or not (dry drawing).
- US3961511A discloses a dry drawing process wherein a lubricating or drawing mixture made up of three essential ingredients, namely soap powder, powdered fire clay, and powdered graphite, is used.
- US5189897A discloses a wet wire drawing process and apparatus to produce high tensile strength steel wire.
- the finished sawing wire with bare steel surface has residual of lubricant, phosphorus, and boron on the surface.
- the residual of lubricant can be tested on a surface carbon analyser STROHLEIN C-MAT 5500 machine.
- the sample of sawing wire is weighed in tarred sample boat.
- the sample boat is heated in a quartz combustion tube, under an O 2 purge.
- Organic material on the sample surface is vaporized or decomposed into CO or C0 2 .
- the evolved gas is lead through a catalyst where a full conversion of organics and CO into CO 2 takes place. After being lead through a moisture trap, the gas flows through a selective infra-red detector and the amount of C0 2 is quantified.
- the amount of carbon in the gas flow and thus on the samples surface is calculated.
- the residual of phosphate and boron can be tested by means of an Inductively Coupled Plasma spectrophotometer.
- the test method comprises: cut a sample of G gram of a finished sawing wire and merge the sample into M ml of 0.01 mol/L HC1 for 15 seconds with shake, transfer the solution into a test tube and mount the tube on ICP test machine, set the detection wavelength of phosphate at 214.914nm and set the detection wavelength of boron at 249.772nm, read P the concentration of phosphate in the solution in mg/1 and B the concentration of boron in the solution in mg/1.
- the amount of residual phosphate on the surface in mg/m can be calculated according to following formula, P x M x (D x 1.963) / (G x 3.0645), in which P is the concentration of phosphate test on ICP in mg/1, M the volume of O.Olmol/L HC1 used in ml, D the diameter of the sawing wire in mm and G the amount of sample in gram.
- the amount of residual boron on the surface in mg/m can be calculated according to following formula, B x M x (D x 1.963) / (G x 3.0645), in which B is the concentration of boron test on ICP in mg/1, M the volume of 0.01 mol/L HC1 used in ml, D the diameter of the sawing wire in mm and G the amount of sample in gram.
- a starting wire 10 with 1.05 mm diameter firstly goes through the patenting process, secondly the lubrication enhancement with borax, and finally the dry drawing process to a final sawing wire 20 with 0.175 mm diameter.
- a starting wire 10 with 1.05 mm diameter firstly goes through the patent process, secondly the lubrication enhancement with phosphate coating and borax, and finally the wet drawing process in oil, to a final sawing wire 20 with 0.12 mm diameter.
- the second embodiment is better than the first one, on the productivity (high drawing speed), draw-ability (small diameter with less fracture), and durability (little wear on drawing dies and long life), because of the improved lubrication and cooling of the drawing of process.
- Figure 2 schematically illustrates a magnified cross-sectional view of a sawing wire with bare steel surface according to present invention, wherein the depth of the scratch is defined as the radial distance from the lowest point of the scratch to the smallest imaginary circle covering the cross-sectional view of the wire.
- the scratches on the surface may decrease the sawing wire tensile strength as a surface defect, on the other hand can pick more slurry to improve the cutting process.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metal Extraction Processes (AREA)
- Lubricants (AREA)
Abstract
A sawing wire (20) has a bare steel surface wherein lubricant is present on the surface. And a method to manufacture said sawing wire (20) comprises the steps of, patenting a starting steel wire (10), applying lubrication enhancement substances on the surface of the starting steel wire (10), and drawing the starting steel wire (10) through a plurality of drawing dies to a finish diameter. The bare steel surface of the sawing wire does not have copper or copper alloy coatings to contaminate the wafers, and scratches on the surface of the sawing wire can pick more slurry to improve the cutting process.
Description
Sawing wire with bare steel surface
and method to make the same
Technical Field
[0001] This invention relates to a steel wire for use in a wire saw to cut semiconductor ingots into wafers, and in particular to a sawing wire with bare steel surface. This invention also provides the method to manufacture a sawing wire with bare steel surface.
Background Art
[0002] Semiconductor wafers are generally prepared from a single crystal ingot, such as a silicon ingot, that is cylindrical in shape. The ingot is sliced in a direction normal to its longitudinal axis to produce as many as several hundred thin, disk-shaped wafers. The slicing operation may be accomplished by means of a wire saw, wherein the ingot is contacted with a reciprocating wire while liquid slurry containing abrasive grains is supplied to a contact area between the ingot and the wire. As the abrasive particles in the slurry are rubbed by the wire against the ingot, silicon crystal is removed and the ingot is gradually sliced. The wire saw provides a gentle mechanical method for slicing which makes it ideal for cutting silicon crystal, which is brittle and could be damaged by other types of saws.
[0003] Conventionally, the sawing wire is generally plated with copper or copper alloy. The reason for plating a sawing wire with copper or copper alloy is to impart a corrosion preventive effect and to impart a lubricating effect during a drawing process in which a starting wire passes through several dies having different sizes of holes so as to be drawn in several steps. When a starting wire without copper or copper alloy plating is drawn, not only does the drawing speed significantly decrease due to poor lubrication between the wire and the die, but also there are formed many scratches on the wire surface,
which impair quality characteristics that a sawing wire is required to have, for example tensile strength. Thus, this lubricating effect is particularly important.
[0004] However, when a sawing wire with copper or copper alloy plating is used to slice a semiconductor ingot, not only does the copper or copper alloy plating exfoliates from the wire surface during slicing and accumulates in the collected abrasive slurry, but also copper or other metallic impurities contained in copper or copper alloy plating directly contact the sliced surface of the semiconductor ingot, resulting in contaminated product wafers. Copper has a greater coefficient of diffusion within silicon than does iron, which is the material used for the sawing wire. Therefore, when semiconductor silicon is contaminated with copper, copper is highly likely to diffuse from the sliced surface into the bulk of a silicon wafer due to the heat generated by slicing fiction between a sawing wire and a silicon ingot. Thus, product wafers are difficult to be decontaminated by merely cleaning the surface thereof.
[0005]Prior art US5927131 provides a sawing wire without copper or copper alloy plating, wherein the copper or copper alloy plating is removed by physical polishing and/or chemical polishing after the finish drawing stage. Prior art KR20010002690A provides a sawing wire without copper or copper plating, wherein the copper or copper alloy plating is dissolved into a chemical solution. Both prior art documents have the drawback that copper or copper alloy is firstly plated on the starting wire as a lubricant for followed wire drawing process, and secondly removed either physically or chemically from the surface of the sawing wire.
Disclosure of Invention
[0006] It is the objective of present invention to provide a sawing wire with bare steel surface. It is also the objective of present invention to provide the method to manufacture a sawing wire with bare steel surface.
[0007]According to present invention, a sawing wire with bare steel
surface wherein lubricant is present on the surface in an amount corresponding to between 5 to 50 mg/m of carbon, and preferably between 15 and 50 mg/m of carbon.
[0008]According to present invention, a sawing wire with bare steel surface wherein phosphorus is present on the surface in an amount corresponding to between 2 to 30 mg/m , and preferably between 5 to 15 mg/m2.
[0009] According to present invention, a sawing wire with bare steel surface wherein boron is present on the surface in an amount corresponding to between 2 to 30 mg/m 2 , and preferably between 5 to 15 mg/m 2.
[0010] As phosphorous and boron are the elements that are used to make the silicon n-type (phosphorus) or p-type (boron), it is important to the invention that their remnants on the wire are controlled as this could lead to contamination of the wafers.
[0011] According to present invention, a sawing wire with bare steel surface wherein grooves are present on the surface with depth between 0.5 μηι to ΙΟμηι on the cross-sectional view, and preferably between Ι μηι and 5μηι.
[0012] According to the present invention, a method of manufacturing a sawing wire with bare steel surface, comprises the steps of:
a. patenting the starting steel wire;
b. applying a lubrication enhancing substance on the surface of the starting steel wire; and
c. drawing the starting steel wire through a plurality of drawing dies to a final diameter.
Preferably the lubrication enhancing substance is Phosphate, or Borax or Borax and Phosphate salt.
Brief Description of Figures in the Drawings
[0013]Figure 1 is a process diagram showing a method of manufacturing
a sawing wire with bare steel surface according to present invention.
[0014]Figure 2 is a schematic illustration showing a magnified cross- sectional view of a sawing wire with bare steel surface according to present invention.
Mode(s) for Carrying Out the Invention
[0015] Preferred embodiments of the present invention will be described herein below with reference to the accompanying drawings.
[0016] Figure 1 is a process diagram showing a method of manufacturing a sawing wire with bare steel surface according to present invention. The starting wire 10 goes through steps, patenting, lubrication enhancement, and drawing, to a final sawing wire 20.
[0017] Patenting is a thermal treatment applied to rods and wires. The object of patenting is to obtain a structure which combines high tensile strength with high ductility so that the wire is able to withstand heavy drafting, i.e. reduction in diameter by drawing, to produce the desired finished sizes with a combination of high tensile strength and good toughness. Conventionally patenting treatment comprises heating the starting wire until above the austenitizing temperature and followed by cooling the starting wire down to between 500C and 680C thereby allowing transformation from austenite to pearlite. US3458365 provides a patenting treatment for rods and wire, while UK1011972 provides another patenting treatment.
[0018] Lubrication enhancement is a surface treatment on the starting wire 10 to provide the wire with a coating which can enhance the lubrication on the starting wire 10 to go through the drawing thereafter. Phosphate coating is a good lubrication enhancement, in which phosphate coating binds a subsequently applied lubricant so firmly that it virtually will not be removed by the next drawing operation, because the combination of the phosphate coating and the lubricant permits a repeated strong cold working, without a
new intermediate treatment with lubricant. EP403241A and EP414301A provide solutions and process to form phosphate coating. Borax is another lubrication enhancement. GB9788124A and US5614261A provide method to apply Borax on the steel wire as lubrication enhancement before drawing. Besides, Borax can be applied after the phosphate coating to neutralize the phosphate coating because the borax solution is alkaline and the solution for phosphate coating is acidic.
[0019] Drawing is a mechanical deformation in that a starting wire 10 passes through a series of dies having decreasing size of holes so as to be drawn in several steps. There are types of drawing processes, dry drawing and wet drawing, depending on whether the drawing process is conducted in a coolant (wet drawing) or not (dry drawing). US3961511A discloses a dry drawing process wherein a lubricating or drawing mixture made up of three essential ingredients, namely soap powder, powdered fire clay, and powdered graphite, is used. US5189897A discloses a wet wire drawing process and apparatus to produce high tensile strength steel wire.
[0020] Going through the above manufacturing step, the finished sawing wire with bare steel surface has residual of lubricant, phosphorus, and boron on the surface.
[0021] The residual of lubricant can be tested on a surface carbon analyser STROHLEIN C-MAT 5500 machine. The sample of sawing wire is weighed in tarred sample boat. The sample boat is heated in a quartz combustion tube, under an O2 purge. Organic material on the sample surface is vaporized or decomposed into CO or C02. The evolved gas is lead through a catalyst where a full conversion of organics and CO into CO2 takes place. After being lead through a moisture trap, the gas flows through a selective infra-red detector and the amount of C02 is quantified. By means of an experimentally determined calibration factor, the amount of carbon in the gas flow and thus on the samples surface is calculated.
[0022] The residual of phosphate and boron can be tested by means of an Inductively Coupled Plasma spectrophotometer. The test method comprises: cut a sample of G gram of a finished sawing wire and merge the sample into M ml of 0.01 mol/L HC1 for 15 seconds with shake, transfer the solution into a test tube and mount the tube on ICP test machine, set the detection wavelength of phosphate at 214.914nm and set the detection wavelength of boron at 249.772nm, read P the concentration of phosphate in the solution in mg/1 and B the concentration of boron in the solution in mg/1. The amount of residual phosphate on the surface in mg/m can be calculated according to following formula, P x M x (D x 1.963) / (G x 3.0645), in which P is the concentration of phosphate test on ICP in mg/1, M the volume of O.Olmol/L HC1 used in ml, D the diameter of the sawing wire in mm and G the amount of sample in gram. The amount of residual boron on the surface in mg/m can be calculated according to following formula, B x M x (D x 1.963) / (G x 3.0645), in which B is the concentration of boron test on ICP in mg/1, M the volume of 0.01 mol/L HC1 used in ml, D the diameter of the sawing wire in mm and G the amount of sample in gram.
[0023] In a first embodiment of present invention, a starting wire 10 with 1.05 mm diameter firstly goes through the patenting process, secondly the lubrication enhancement with borax, and finally the dry drawing process to a final sawing wire 20 with 0.175 mm diameter. In a second embodiment, a starting wire 10 with 1.05 mm diameter firstly goes through the patent process, secondly the lubrication enhancement with phosphate coating and borax, and finally the wet drawing process in oil, to a final sawing wire 20 with 0.12 mm diameter. Comparatively the second embodiment is better than the first one, on the productivity (high drawing speed), draw-ability (small diameter with less fracture), and durability (little wear on drawing dies and long life), because of the improved lubrication and cooling of the drawing of process.
[0024] Even when the wire goes through the enhanced lubrication
process, there are scratches on the surface of the sawing wire because of the attrition between the wire and the drawing dies. Figure 2 schematically illustrates a magnified cross-sectional view of a sawing wire with bare steel surface according to present invention, wherein the depth of the scratch is defined as the radial distance from the lowest point of the scratch to the smallest imaginary circle covering the cross-sectional view of the wire. The scratches on the surface, on one hand may decrease the sawing wire tensile strength as a surface defect, on the other hand can pick more slurry to improve the cutting process.
Claims
1. A sawing wire having a bare steel surface wherein lubricant is present on the surface in an amount corresponding to between 5 to 50 mg/m of carbon.
2. A sawing wire having a bare steel surface as claimed in claim 1, wherein lubricant is present on the surface in an amount corresponding to between 15 to 50 mg/m of carbon.
3. A sawing wire having a bare steel surface as claimed in claim 1, wherein phosphorus is present on the surface in an amount corresponding to between 2 and 30 mg/m .
4. A sawing wire having a bare steel surface as claimed in claim 3, wherein phosphorus is present on the surface in an amount corresponding to between 5 and 15 mg/m .
5. A sawing wire having a bare steel surface as claimed in claim 1, wherein boron is present on the surface in an amount corresponding to between 2 to 30 mg/m .
6. A sawing wire having a bare steel surface as claimed in claim 5, wherein boron is present on the surface in an amount corresponding to between 5 to 15 mg/m .
7. A sawing wire having a bare steel surface as claimed in claim 1, wherein scratches are present on the surface with depth between 0.5 μηι to ΙΟμηι on the cross-sectional view.
8. A sawing wire having a bare steel surface as claimed in claim 7, wherein scratches are present on the surface with depth between Ιμπι to 5μηι on the cross-sectional view.
9. A method of manufacturing a sawing wire having a bare steel surface, comprising the steps of
patenting the starting steel wire;
applying a lubrication enhancement substance on the surface of the starting steel wire;
drawing the starting steel wire through a plurality of drawing dies to a finish final diameter;
10. A method of manufacturing a steel wire having a bare steel surface according to claim 9, wherein said lubrication enhancement substance is Borax.
11. A method of manufacturing a steel wire having a bare steel surface according to claim 9, wherein lubrication enhancement substance is Borax and Phosphate salt.
12. A method of manufacturing a steel wire having a bare steel surface according to claim 9, wherein lubrication enhancement substance is phosphate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2012/077385 WO2013189082A1 (en) | 2012-06-21 | 2012-06-21 | Sawing wire with bare steel surface and method to make the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2012/077385 WO2013189082A1 (en) | 2012-06-21 | 2012-06-21 | Sawing wire with bare steel surface and method to make the same |
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| Publication Number | Publication Date |
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| WO2013189082A1 true WO2013189082A1 (en) | 2013-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/CN2012/077385 WO2013189082A1 (en) | 2012-06-21 | 2012-06-21 | Sawing wire with bare steel surface and method to make the same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6063076B1 (en) * | 2016-03-02 | 2017-01-18 | ジャパンファインスチール株式会社 | Resin bond saw wire and manufacturing method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614261A (en) * | 1992-06-05 | 1997-03-25 | Wirelube Research Company | Predrawing treatment system |
| US5927131A (en) * | 1996-03-26 | 1999-07-27 | Shin-Etsu Handotai Co., Ltd. | Method of manufacturing wire for use in a wire saw and wire for use in a wire saw |
| CN1143903C (en) * | 2001-09-10 | 2004-03-31 | 株式会社神户制钢所 | High-strength steel wire with anti-strain-ageing-brittle and anti-longitudinal-crack and manufacture method thereof |
| CN101875059A (en) * | 2010-05-20 | 2010-11-03 | 宝钢集团上海二钢有限公司 | Method for manufacturing 1,860MPa ultrahigh strength hotly-galvanized steel wire with diameter of 5.0 millimeters |
| CN101965413A (en) * | 2008-03-04 | 2011-02-02 | 贝卡尔特股份有限公司 | The preparation method of cold drawing Mild Steel Wire and described steel wire |
| CN102413983A (en) * | 2009-04-29 | 2012-04-11 | 贝卡尔特公司 | A sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder |
| CN102421538A (en) * | 2009-05-14 | 2012-04-18 | 贝卡尔特公司 | Martensitic wire with thin polymer coating |
-
2012
- 2012-06-21 WO PCT/CN2012/077385 patent/WO2013189082A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614261A (en) * | 1992-06-05 | 1997-03-25 | Wirelube Research Company | Predrawing treatment system |
| US5927131A (en) * | 1996-03-26 | 1999-07-27 | Shin-Etsu Handotai Co., Ltd. | Method of manufacturing wire for use in a wire saw and wire for use in a wire saw |
| CN1143903C (en) * | 2001-09-10 | 2004-03-31 | 株式会社神户制钢所 | High-strength steel wire with anti-strain-ageing-brittle and anti-longitudinal-crack and manufacture method thereof |
| CN101965413A (en) * | 2008-03-04 | 2011-02-02 | 贝卡尔特股份有限公司 | The preparation method of cold drawing Mild Steel Wire and described steel wire |
| CN102413983A (en) * | 2009-04-29 | 2012-04-11 | 贝卡尔特公司 | A sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder |
| CN102421538A (en) * | 2009-05-14 | 2012-04-18 | 贝卡尔特公司 | Martensitic wire with thin polymer coating |
| CN101875059A (en) * | 2010-05-20 | 2010-11-03 | 宝钢集团上海二钢有限公司 | Method for manufacturing 1,860MPa ultrahigh strength hotly-galvanized steel wire with diameter of 5.0 millimeters |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6063076B1 (en) * | 2016-03-02 | 2017-01-18 | ジャパンファインスチール株式会社 | Resin bond saw wire and manufacturing method thereof |
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