WO2013187650A1 - Touch panel - Google Patents

Touch panel Download PDF

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Publication number
WO2013187650A1
WO2013187650A1 PCT/KR2013/005105 KR2013005105W WO2013187650A1 WO 2013187650 A1 WO2013187650 A1 WO 2013187650A1 KR 2013005105 W KR2013005105 W KR 2013005105W WO 2013187650 A1 WO2013187650 A1 WO 2013187650A1
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WO
WIPO (PCT)
Prior art keywords
pads
sensing
driving
row
lines
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Application number
PCT/KR2013/005105
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French (fr)
Korean (ko)
Inventor
장영신
최정민
Original Assignee
주식회사 실리콘웍스
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Publication of WO2013187650A1 publication Critical patent/WO2013187650A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0444—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single conductive element covering the whole sensing surface, e.g. by sensing the electrical current flowing at the corners
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a touch panel, and more particularly, to a touch panel that senses a touch by sensing a change in capacitance.
  • the touch panel refers to a transparent switch panel configured in combination with a display panel and having a function of operating a device or executing a program as a user presses text, an image or an icon.
  • the touch panel may be of a capacitive type, and a mutual capacitance touch sensing device has been disclosed in US Patent Publication No. 2009/0091551.
  • Conventional touch panels generally have a two-layer structure in order to implement mutual capacitance sensing.
  • the touch panel includes a first layer including a plurality of driving lines and pads connected thereto and a second layer including a plurality of sensing lines and pads connected thereto.
  • the conventional touch panel has a two-layer structure to implement mutual capacitance sensing, a plurality of processes are required for each layer unit.
  • the conventional touch panel requires a plurality of processes in proportion to the number of layers, it is difficult to reduce the cost and increase the yield required for manufacturing.
  • An object of the present invention is to provide a touch panel implemented in a single layer to sense a change in capacitance corresponding to a touch.
  • another object of the present invention is to provide a touch panel in which a cost required for manufacturing can be reduced and a yield can be improved by improving a layer structure for sensing a change in capacitance.
  • the drive pads are arranged in a matrix shape; Sensing pads alternately arranged with respect to the row of drive pads; Drive lines connecting the drive pads in the same row; And sensing lines drawn out in units of columns of the sensing pads, wherein the driving pads, the sensing pads, the driving lines, and the sensing lines are formed on the same layer substrate.
  • the touch panel according to the present invention includes a plurality of sensing units formed on the same layer substrate, each sensing unit comprising: drive pads arranged in a matrix shape; Sensing pads formed on the same layer as the driving pads and alternately arranged with respect to a row of the driving pads; Drive lines connecting the drive pads in the same row; And sensing lines drawn out in units of columns of the sensing pads to output the sensing signals.
  • the touch panel may be implemented in a single layer having a simple pattern, and there is an effect of sensing a change in capacitance caused by a touch into the single layer.
  • the layer structure for sensing the capacitance change is improved to a single layer, the cost required for manufacturing the touch pad may be reduced and the yield may be improved.
  • FIG. 1 is a layout diagram showing a preferred embodiment of the touch panel according to the present invention.
  • FIGS. 2 to 12 are layout views showing other embodiments of the touch panel according to the present invention.
  • FIG. 13 is a plan view illustrating an example in which a driving pad and a sensing pad are configured.
  • FIGS. 14 and 15 are block diagrams illustrating an implementation example of a touch panel according to the present invention.
  • a single layer is configured to sense a change in capacitance, and driving pads, sensing pads, driving lines, and sensing lines are implemented as the single layer on a substrate.
  • the substrate may be a substrate made of a transparent material including glass and a film.
  • the driving pads, the sensing pads, the driving lines, and the sensing lines may be formed of a conductive pattern forming the same layer on the substrate, and the conductive pattern may be formed of an Indiun TiN Oxide (ITO) pattern or a metal pattern. Can be.
  • ITO Indiun TiN Oxide
  • the driving pads 10 are arranged in a matrix form forming rows and columns, and are connected to the driving line 12 between adjacent driving pads 10 in the same row.
  • the sensing pads 14 and the driving pads 10 are alternately arranged in the row direction.
  • the sensing pads 14 may be configured to be divided into the same number as the rows of the driving pads 10 for each column as shown in FIG. 1, and the sensing pads 14 arranged in each column are adjacent to each other. And configured to be interconnected by sensing lines 16.
  • the driving line 12 is formed in the row direction
  • the sensing line 16 is formed in the column direction.
  • FIG. 1 illustrates a state in which the drive pads 10 are arranged in a 54 matrix structure, and illustrates that a row of the sensing pads 14 is alternately formed with each column of the drive pads 10.
  • the sensing pads 14 have a 44 matrix structure, and each row of the sensing pads 14 is alternately arranged with a column of the driving pads 10.
  • Each row of the sensing pads 14 forms the same row of the driving pads 10.
  • Each of the driving lines 12 connecting the adjacent driving pads 10 is formed to bypass one end in the column direction of the sensing pad 14 disposed between the adjacent driving pads 10.
  • adjacent drive pads 10 are connected to drive lines 12 formed to bypass one end of a row of sensing pads 14 without overlapping each other.
  • the driving line 12 may be configured as a meandering line that bypasses a row of the sensing pads 14 positioned between the driving pads 10.
  • an operation of sensing a change in capacitance due to a touch may be performed.
  • the drive signals Tx1, Tx2, Tx3, and Tx4 are applied to the drive pads 10 in the first and last columns, and the drive signals Tx1, Tx2, Tx3, and Tx4 are included in each row and are connected to each other. 10 is shared.
  • the driving signals Tx1, Tx2, Tx3, and Tx4 may be the same single signal, or may be signals that are sequentially applied with phases different from each other while having the same form.
  • the sensing signals Rx1, Rx2, Rx3, and Rx4 are output to the other end of each column of the sensing pads 14 arranged in series.
  • the capacitances Cm1 and Cm2 between the left and right sensing pads 14 are changed based on the driving pad 10 in the A position, respectively.
  • the sensing signal output to one end of each column of the sensing pads 14 changes according to the change of each of the capacitances Cm1 and Cm2.
  • the exemplary embodiment according to the present invention may recognize the touch and the position where the touch is generated by detecting a change in the sensing signal output to the other end of the column of the sensing pads 14.
  • the sensing shaft and the driving shaft may be changed according to the manufacturer's intention. That is, in FIG. 1, positions at which the driving signals Tx1, Tx2, Tx3, and Tx4 and the sensing signals Rx1, Rx2, Rx3, and Rx4 are input and output may be interchanged.
  • the driving pad 10, the driving line 12, the sensing pad 14, and the sensing line 16 are configured in a single layer (one-layer).
  • the embodiment according to the invention has the effect that the design and manufacturing process can be simplified and the manufacturing cost can be reduced and the yield can be improved compared to fabrication using a plurality of layers.
  • FIG. 1 illustrates that a plurality of sensing pads 14 are arranged for each column, but as illustrated in FIG. 2, one sensing pad 14 may be configured for each column. That is, the embodiment may be modified such that the plurality of driving pads 10 and one sensing pad 14 correspond to each other.
  • the touch and the touch position may be recognized.
  • FIG. 2 other components are identical to each other except for the configuration of the sensing pad 14, compared to the embodiment of FIG. 1, and thus descriptions of overlapping configurations and operations thereof will be omitted.
  • each driving line 12 connecting the driving pads 10 in the adjacent column is changed for each row due to the difference in the bypass path.
  • the drive line 12 of the first row bypasses the furthest from one end of the column of sensing pads 14, and the drive line 12 of the last row bypasses the closest one end of the column of sensing pads 14. 2, the driving line 12 is formed to bypass the sensing pad 14 in the same manner as in FIG. 1.
  • the length of the driving line 12 connecting the adjacent driving pads 10 of the second row is longer than the length of the driving line 12 connecting the adjacent driving pads 10 of the first row, and the second row of the driving lines 12.
  • the length of the drive line 12 connecting the adjacent drive pads 10 in the third row is longer than the length of the drive line 12 connecting the adjacent drive pads 10 in the third row, and the adjacent drive pads in the last row are longer.
  • the length of the drive line 12 connecting the fields 10 is the longest.
  • the resistance value may vary for each driving line 12. Therefore, signal transmission characteristics may vary for each of the driving lines 12.
  • An embodiment according to the present invention may be implemented as shown in FIG. 3 to compensate for the difference in the resistance value of each of the driving lines 12.
  • the embodiment of FIG. 3 illustrates that the drive lines 12 are formed to have different line widths W1, W2, W3, W4 by location (by row).
  • the line width of the shortest drive line 12 in the first row is the smallest
  • the line width of the longest drive line 12 in the last row is the largest
  • the line width of the drive line 12 in the order of the first row to the last row is Gradually grows.
  • W4> W3> W2> W1 is the line width of the drive line 12 in the first row
  • W2 is the line width of the drive line 12 in the second row
  • W3 is of the drive line 12 in the set row.
  • W4 is the line width
  • W4 is the line width of the drive line 12 in the fourth row.
  • FIG. 3 illustrates a configuration in which a difference in resistance value for each driving line 12 may be compensated for by a difference in line width.
  • FIG. 3 is identical to that of FIG. 1 except that the thickness of the driving line 12 is different, and thus, redundant construction and operation thereof will be omitted.
  • the driving lines 12 connecting the adjacent driving pads 10 may be formed so as to bypass end portions in opposite directions in units of rows of the sensing pads 14.
  • the output direction of the sensing signals Rx1, Rx2, Rx3, and Rx4 of the sensing pad 12 may be set in the opposite direction in units of columns.
  • the output direction of the sensing signals in the odd and even columns of the sensing pads 14 may be set in the opposite direction.
  • the driving lines of each row connecting the driving pads 10 may be set to have the same length while minimizing the length difference between the driving lines through a plurality of columns.
  • the components are the same as those of FIG. 1 except that the arrangement of the driving line 12 is different.
  • the exemplary embodiment according to the present invention may be modified to reduce the pitch between the driving pads 10 and the sensing pads 14 as shown in FIG. 5.
  • the drive pads 10 in the first row of each column are connected to a common drive line 12.
  • the driving pads 10 in the remaining rows are connected by driving lines 12 formed to bypass one end of the sensing pad 14 column in the same direction.
  • the number of drive lines disposed between the drive pads 10 and the sensing pads 14 may be reduced by one compared to FIG. 1, and the number of drive lines 10 may be reduced as much as the number of drive lines is reduced.
  • the width, ie, the pitch, between the sensing pads 14 can be reduced.
  • FIG. 5 since the components of FIG. 1 are the same except that the arrangement of the driving lines 12 of the first row of each column is different, descriptions of overlapping configurations and operations thereof are omitted.
  • the present invention may be implemented as shown in FIG. 6.
  • the driving pads 10 TP region
  • the driving signals Tx1, Tx2, Tx3, and Tx4 in the last column are applied.
  • Drive lines may be deleted to ensure the efficiency of the area.
  • the driving pads 10 and the sensing pads 14 of FIGS. 1 to 6 are formed in a rectangular shape. However, according to the manufacturer's intention, it may be formed in a rhombus shape (diamond type) as shown in FIGS. 7 to 12.
  • the shape of the driving pads 10 and the sensing pads 14 according to the embodiment of the present invention may be formed of a polygon of various shapes or circular or oval or various shapes according to the intention of the manufacturer as well as a rectangular shape and a rhombus. .
  • the present invention may configure the layout of the driving pad 10 and the sensing pad 14 in various ways as shown in FIGS. 7 to 12.
  • FIG. 7 illustrates that the driving pads 10 are configured in an even number of columns, and the sensing pads 14 are configured in an odd number of rows, and the driving pads 10 are driven in rows of the first and last columns of the driving pads 10, respectively.
  • signals Tx1, Tx2, Tx3, and Tx4 are applied.
  • the sensing pads 14 are alternately disposed in the row direction between the first column and the last column of the driving pads 10.
  • the driving pads 10 and the sensing pads 14 are configured in even rows. More specifically, in the embodiment of FIG. 8, the driving pads 10 and the sensing pads 14 are configured in the same number of columns, are alternately arranged in a row direction, and the first and last columns of the driving pads 10 are arranged. Drive signals Tx1, Tx2, Tx3, and Tx4 are applied to each row.
  • the driving signals Tx1, Tx2, Tx3, and Tx4 applied to the last column of the driving pads 10 are applied to the driving lines 12 bypassing the sensing pad 14 of the last column.
  • the driving line 12 configured in the embodiments of FIGS. 7 and 8 may be formed in the same shape as that of FIG. 1, and redundant description thereof will be omitted.
  • FIG. 9 illustrates that the driving pads 10 and the sensing pads 14 are configured in an even number of rows, as in the embodiment of FIG. 8, and the rows of the driving pads 10 and the sensing pads are the same.
  • the columns of 14 consist of the same number and are alternately arranged in the row direction.
  • the driving signals Tx1, Tx2, Tx3, and Tx4 are not applied to the last column of the driving pads 10, and the driving line is not extended. That is, the last row of drive pads 10 is in an electrically floating state.
  • the driving pads 10 and the sensing pads 14 are configured in an even number of rows, as in the embodiment of FIG. 8, and the rows of the driving pads 10 and the sensing pads ( It illustrates that the columns of 14) are composed of the same number and arranged alternately in the row direction.
  • the driving line 12 connected to the last column of the driving pad 10 is formed to bypass the last column of the sensing pads 14, but the driving signals Tx1, Tx2, Tx3, and Tx4 are not applied.
  • the driving pads 10 and the sensing pads 14 may be configured such that the rows are alternately arranged with each other.
  • 11 and 12 are modified examples of FIG. 8 and duplicated descriptions and operations thereof will be omitted.
  • the touch panel may be configured with a single layer, and as the single layer is manufactured, the manufacturing cost may be reduced and the yield may be improved.
  • the touch panel according to the present invention has a single layer, the touch panel can directly interface with the outside without forming a metal wire.
  • the driving pads 10 and the sensing pads 14 may be formed in various shapes as shown in FIGS. 13A to 13D.
  • FIG. 13 illustrates a solid type in which a front surface is formed of one panel, (b) illustrates a mesh type in which a pattern is formed in an orthogonal net type, and (c) shows a pattern in which the pattern is inclined net type.
  • the mesh type formed is illustrated, and (d) illustrates a mesh type in which a pattern is formed in a hexagonal net (honey) type.
  • FIG. 13A may be considered when the driving pads 10 and the sensing pads 14 are formed in an ITO pattern.
  • 13B and 13D may be considered when the driving pads 10 and the sensing pads 14 are formed in a metal pattern to improve conductivity.
  • the touch pad may be formed to have good transmittance.
  • Figure 14 is an embodiment of the touch panel according to the present invention is an embodiment divided into a plurality of sensing units (104, 105, 106, 107) in order to prevent the drive line is long.
  • the plurality of sensing units 104, 105, 106, and 107 adopt the structure of the embodiment of FIG. 1, and the sensing units 104, 105, 106, and 107 form a plurality of rows, and each row is the same. It may be formed in a shape.
  • Each sensing unit 104, 105, 106, 107 receives driving signals Tx1-Tx4, Tx5-Tx8, Tx9-Tx12, Tx13-Tx16 and senses the signals Rx1_1-Rx1_4, Rx2_1-Rx2_4, Rx3_1-Rx3_4, respectively. , Rx4_1-Rx4_4).
  • the driving signals are divided into a plurality of groups, that is, Tx 1 to Tx 4, Tx 5 to Tx 8, Tx 9 to Tx 12, and Tx 13 to Tx 16, so that each sensing unit 104, 105, 106, 107 is directly applied to each star, and accordingly, the length of the driving line for transmitting the driving signal to each of the sensing units 104, 105, 106, and 107 is shortened, thereby preventing the resistance from increasing.
  • the embodiment of FIG. 15 may be implemented to prevent the driving line transmitting the driving signal from becoming longer.
  • FIG. 15 illustrates the implementation of each sensing unit 104, 105, 106, 107 in the embodiment of FIG. 2.
  • the sensing units 104, 105, 106, and 107 form a plurality of rows, and each sensing unit is formed in a symmetrical shape for each adjacent row.
  • the present invention may be implemented to include a plurality of sensing units as shown in FIGS. 14 and 15 in order to prevent the driving line from lengthening over a large area, wherein each sensing unit is implemented in FIGS. 1 to 12. Either of the examples may be applied uniformly or mixed.
  • FIGS. 14 and 15 is configured to apply the driving signal for each sensing unit, so that the resistance of the driving line for transmitting the driving signal may be reduced by a maximum of 1 / sensing unit number.

Abstract

Disclosed is a touch panel that implements touch sensing by using capacitance. The touch panel has an improved layered structure so as to sense a change in capacitance corresponding to a touch. With the improved layered structure, costs required for manufacturing can be reduced and yield can be improved.

Description

터치 패널Touch panel
본 발명은 터치 패널에 관한 것으로서, 보다 상세하게는 캐패시턴스의 변화를 센싱하여서 터치를 인식하는 터치 패널에 관한 것이다.The present invention relates to a touch panel, and more particularly, to a touch panel that senses a touch by sensing a change in capacitance.
터치 패널은 디스플레이 패널과 조합하여 구성되며 사용자가 텍스트나 이미지 또는 아이콘 등을 누름에 따라서 기기를 조작하거나 프로그램을 실행하는 기능을 갖는 투명 스위치 패널을 의미한다.The touch panel refers to a transparent switch panel configured in combination with a display panel and having a function of operating a device or executing a program as a user presses text, an image or an icon.
터치 패널은 정전용량식으로 구성될 수 있으며, 그 중 뮤추얼 캐패시턴스 터치 센싱 장치가 미국공개특허 US 2009/0091551호로 공개된 바 있다. The touch panel may be of a capacitive type, and a mutual capacitance touch sensing device has been disclosed in US Patent Publication No. 2009/0091551.
종래의 터치 패널은 뮤추얼 캐패시턴스 센싱(Mutual Capacitance Sensing)을 구현하기 위해서는 2-레이어(2-Layer) 구조를 갖는 것이 일반적이다.Conventional touch panels generally have a two-layer structure in order to implement mutual capacitance sensing.
즉, 터치 패널은 다수의 구동 라인과 이들에 연결되는 패드를 포함하는 제1 레이어와 다수의 센싱 라인과 이들에 연결되는 패드를 포함하는 제2 레이어가 서로 다른 층으로 구성된다.That is, the touch panel includes a first layer including a plurality of driving lines and pads connected thereto and a second layer including a plurality of sensing lines and pads connected thereto.
상기한 종래의 터치 패널은 뮤추얼 캐패시턴스 센싱을 구현하기 위하여 2-레이어 구조를 가짐에 따라 각 레이어 단위로 다수의 공정을 필요로 한다. As the conventional touch panel has a two-layer structure to implement mutual capacitance sensing, a plurality of processes are required for each layer unit.
그러므로, 종래의 터치 패널은 레이어 수에 비례하여 다수의 공정이 필요하므로 그에 대응하여 제조에 필요한 비용의 절감과 수율 향상에 어려움이 있다.Therefore, since the conventional touch panel requires a plurality of processes in proportion to the number of layers, it is difficult to reduce the cost and increase the yield required for manufacturing.
본 발명은 터치에 대응한 캐패시턴스 변화를 센싱하도록 싱글 레이어로 구현된 터치 패널을 제공함을 목적으로 한다.An object of the present invention is to provide a touch panel implemented in a single layer to sense a change in capacitance corresponding to a touch.
또한, 본 발명은 캐패시턴스 변화를 센싱하기 위한 레이어 구조를 개선함으로써 제조에 필요한 비용을 절감할 수 있고 수율이 향상될 수 있는 터치 패널을 제공함을 다른 목적으로 한다.In addition, another object of the present invention is to provide a touch panel in which a cost required for manufacturing can be reduced and a yield can be improved by improving a layer structure for sensing a change in capacitance.
본 발명에 따른 터치 패널은, 매트릭스 형상으로 배치되는 구동 패드들; 상기 구동 패드들의 열에 대하여 교번하여 배치되는 센싱 패드들; 동일한 행의 상기 구동 패드들 간을 연결하는 구동 라인들; 및 상기 센싱 패드들의 열 단위로 인출되는 센싱 라인들;을 포함하며, 상기 구동 패드들, 상기 센싱 패드들, 상기 구동 라인들 및 상기 센싱 라인들은 동일 레이어 기판 상에 형성됨을 특징으로 한다.Touch panel according to the present invention, the drive pads are arranged in a matrix shape; Sensing pads alternately arranged with respect to the row of drive pads; Drive lines connecting the drive pads in the same row; And sensing lines drawn out in units of columns of the sensing pads, wherein the driving pads, the sensing pads, the driving lines, and the sensing lines are formed on the same layer substrate.
또한, 본 발명에 따른 터치 패널은, 동일 레이어 기판 상에 형성된 다수의 센싱 유니트를 포함하며, 각 센싱 유니트는, 매트릭스 형상으로 배치되는 구동 패드들; 상기 구동 패드들과 동일 레이어 상에 형성되고 상기 구동 패드들의 열에 대하여 교번하여 배치되는 센싱 패드들; 동일한 행의 상기 구동 패드들 간을 연결하는 구동 라인들; 및 상기 센싱 패드들의 열 단위로 인출되어 상기 센싱 신호를 출력하는 센싱 라인들;을 포함함을 다른 특징으로 한다.In addition, the touch panel according to the present invention includes a plurality of sensing units formed on the same layer substrate, each sensing unit comprising: drive pads arranged in a matrix shape; Sensing pads formed on the same layer as the driving pads and alternately arranged with respect to a row of the driving pads; Drive lines connecting the drive pads in the same row; And sensing lines drawn out in units of columns of the sensing pads to output the sensing signals.
따라서, 본 발명에 의하면 심플한 패턴을 갖는 싱글 레이어로 터치 패널이 구현될 수 있으며 터치에 의한 캐패시턴스 변화를 상기 싱글 레이어로 센싱할 수 있는 효과가 있다.Therefore, according to the present invention, the touch panel may be implemented in a single layer having a simple pattern, and there is an effect of sensing a change in capacitance caused by a touch into the single layer.
또한, 캐패시턴스 변화를 센싱하기 위한 레이어 구조가 싱글 레이어로 개선됨에 따라서 터치 패드의 제조에 필요한 비용을 절감할 수 있고 수율이 향상되 수 있는 효과가 있다.In addition, since the layer structure for sensing the capacitance change is improved to a single layer, the cost required for manufacturing the touch pad may be reduced and the yield may be improved.
도 1은 본 발명에 따른 터치 패널의 바람직한 실시예를 나타내는 레이아웃 도면.1 is a layout diagram showing a preferred embodiment of the touch panel according to the present invention.
도 2 내지 도 12는 본 발명에 따른 터치 패널의 다른 실시예들을 나타내는 레이아웃 도면.2 to 12 are layout views showing other embodiments of the touch panel according to the present invention.
도 13은 구동 패드와 센싱 패드가 구성되는 일예를 예시한 평면도.13 is a plan view illustrating an example in which a driving pad and a sensing pad are configured.
도 14 및 도 15는 본 발명에 따른 터치 패널의 구현 예를 예시한 블럭도.14 and 15 are block diagrams illustrating an implementation example of a touch panel according to the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세하게 설명한다. 본 명세서 및 특허청구범위에 사용된 용어는 통상적이거나 사전적 의미로 한정되어 해석되지 아니하며, 본 발명의 기술적 사항에 부합하는 의미와 개념으로 해석되어야 한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention. The terms used in the present specification and claims are not to be construed as being limited to ordinary or dictionary meanings, but should be interpreted as meanings and concepts corresponding to the technical matters of the present invention.
본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 바람직한 실시예이며, 본 발명의 기술적 사상을 모두 대변하는 것이 아니므로, 본 출원 시점에서 이들을 대체할 수 있는 다양한 균등물과 변형예들이 있을 수 있다.The embodiments described in the specification and the configuration shown in the drawings are preferred embodiments of the present invention, and do not represent all of the technical idea of the present invention, various equivalents and modifications that can replace them at the time of the present application are There may be.
본 발명에 따른 터치 패널의 실시예는 캐패시턴스 변화를 센싱하기 위하여 싱글 레이어로 구성되며, 기판 상에 구동 패드들, 센싱 패드들, 구동 라인들 및 센싱 라인들이 상기 싱글 레이어로 구현된다. 기판은 글라스(Glass), 필름(Film)을 포함하는 투명 재질의 기판일 수 있다.In an embodiment of the touch panel according to the present invention, a single layer is configured to sense a change in capacitance, and driving pads, sensing pads, driving lines, and sensing lines are implemented as the single layer on a substrate. The substrate may be a substrate made of a transparent material including glass and a film.
상술한 바와 같이 구동 패드들, 센싱 패드들, 구동 라인들 및 센싱 라인들은 기판 상에 동일한 레이어를 이루는 도전성 패턴으로 형성될 수 있으며, 도전성 패턴은 ITO(Indiun TiN Oxide) 패턴이나 메탈 패턴으로 형성될 수 있다.As described above, the driving pads, the sensing pads, the driving lines, and the sensing lines may be formed of a conductive pattern forming the same layer on the substrate, and the conductive pattern may be formed of an Indiun TiN Oxide (ITO) pattern or a metal pattern. Can be.
먼저, 본 발명에 따른 터치 패널의 실시예를 도 1을 참조하여 설명한다.First, an embodiment of a touch panel according to the present invention will be described with reference to FIG. 1.
터치 패널에서, 구동 패드들(10)은 행과 열을 이루는 매트릭스 형상으로 배치되며, 동일한 행의 인접한 구동 패드들(10) 간은 구동 라인(12)으로 연결된다.In the touch panel, the driving pads 10 are arranged in a matrix form forming rows and columns, and are connected to the driving line 12 between adjacent driving pads 10 in the same row.
센싱 패드들(14)과 구동 패드들(10)은 행 방향으로 서로 교번하여 배치된다.The sensing pads 14 and the driving pads 10 are alternately arranged in the row direction.
여기에서, 센싱 패드들(14)은 도 1과 같이 각 열 별로 구동 패드들(10)의 행과 동일한 개수로 분할되도록 구성될 수 있으며, 각 열에 배치되는 센싱 패드들(14)은 인접한 것끼리 센싱 라인(16)으로 상호 연결되도록 구성된다.Here, the sensing pads 14 may be configured to be divided into the same number as the rows of the driving pads 10 for each column as shown in FIG. 1, and the sensing pads 14 arranged in each column are adjacent to each other. And configured to be interconnected by sensing lines 16.
상기한 구성에 의하여 구동 라인(12)은 행 방향으로 형성되고, 센싱 라인(16)은 열 방향으로 형성된다.By the above configuration, the driving line 12 is formed in the row direction, and the sensing line 16 is formed in the column direction.
도 1은 구동 패드들(10)이 54 매트릭스 구조로 배치된 상태를 예시하며, 구동 패드들(10)의 각 열과 교번되게 센싱 패드들(14)의 열이 구성된 것을 예시하고 있다. 도 1의 실시예에서 센싱 패드들(14)은 44 매트릭스 구조로 구성되며, 센싱 패드들(14)의 각 열은 구동 패드들(10)의 열과 교번하여 배치된다. 그리고, 센싱 패드들(14)의 각 행은 구동 패드들(10)의 행은 동일한 행을 형성한다.FIG. 1 illustrates a state in which the drive pads 10 are arranged in a 54 matrix structure, and illustrates that a row of the sensing pads 14 is alternately formed with each column of the drive pads 10. In the embodiment of FIG. 1, the sensing pads 14 have a 44 matrix structure, and each row of the sensing pads 14 is alternately arranged with a column of the driving pads 10. Each row of the sensing pads 14 forms the same row of the driving pads 10.
그리고, 인접한 구동 패드들(10)을 연결하는 각 구동 라인(12)들은 인접한 구동 패드들(10) 사이에 배치된 센싱 패드(14)의 열 방향의 일단을 우회하도록 형성된다.Each of the driving lines 12 connecting the adjacent driving pads 10 is formed to bypass one end in the column direction of the sensing pad 14 disposed between the adjacent driving pads 10.
즉, 인접한 구동 패드들(10)은 서로 겹치지 않으면서 센싱 패드(14)들의 열의 일단을 우회하도록 형성된 구동 라인(12)으로 각각 연결된다. 구동 라인(12)은 구동 패드들(10) 사이에 위치한 센싱 패드(14)들의 열을 우회하는 사행 형상의 배선으로 구성될 수 있다.That is, adjacent drive pads 10 are connected to drive lines 12 formed to bypass one end of a row of sensing pads 14 without overlapping each other. The driving line 12 may be configured as a meandering line that bypasses a row of the sensing pads 14 positioned between the driving pads 10.
상술한 바와 같이 본 발명에 따른 실시예가 구성됨으로써 터치에 의한 캐패시턴스 변화를 센싱하는 동작이 이루어질 수 있다.As described above, since the embodiment of the present invention is configured, an operation of sensing a change in capacitance due to a touch may be performed.
구동 신호들(Tx1, Tx2, Tx3, Tx4)은 첫째 열과 마지막 열의 구동 패드들(10)에 인가되며, 구동 신호들(Tx1, Tx2, Tx3, Tx4)은 각 행에 포함되고 서로 연결된 구동 패드들(10)에 공유된다. 구동 신호들(Tx1, Tx2, Tx3, Tx4)은 동일한 하나의 신호일 수 있으며, 동일한 폼(Form)을 가지면서 서로 위상을 달리하여 순차적으로 인가되는 신호일 수도 있다. The drive signals Tx1, Tx2, Tx3, and Tx4 are applied to the drive pads 10 in the first and last columns, and the drive signals Tx1, Tx2, Tx3, and Tx4 are included in each row and are connected to each other. 10 is shared. The driving signals Tx1, Tx2, Tx3, and Tx4 may be the same single signal, or may be signals that are sequentially applied with phases different from each other while having the same form.
그리고, 센싱 신호들(Rx1, Rx2, Rx3, Rx4)은 직렬로 배열된 센싱 패드들(14)의 각 열의 타단으로 출력된다.The sensing signals Rx1, Rx2, Rx3, and Rx4 are output to the other end of each column of the sensing pads 14 arranged in series.
즉, A 위치의 구동 패드(10)가 터치된 경우, A 위치의 구동 패드(10)와 그의 좌측의 센싱 패드(14) 간의 캐패시턴스(Cm1)와 A 위치의 구동 패드(10)와 그의 우측의 센싱 패드(14) 간의 캐패시턴스(Cm2)가 변화된다.That is, when the driving pad 10 in the A position is touched, the capacitance Cm1 between the driving pad 10 in the A position and the sensing pad 14 on the left side thereof, the driving pad 10 in the A position and the right side thereof The capacitance Cm2 between the sensing pads 14 is changed.
상기와 같이 A 위치의 구동 패드(10)가 터치되면, A 위치의 구동 패드(10)를 기준으로 좌측과 우측의 센싱 패드들(14) 간의 캐패시턴스(Cm1, Cm2)가 각각 변화되고, 그에 따라서 센싱 패드들(14)의 각 열의 일단으로 출력되는 센싱 신호는 각 캐패시턴스(Cm1, Cm2)의 변화에 따라 변화된다.As described above, when the driving pad 10 in the A position is touched, the capacitances Cm1 and Cm2 between the left and right sensing pads 14 are changed based on the driving pad 10 in the A position, respectively. The sensing signal output to one end of each column of the sensing pads 14 changes according to the change of each of the capacitances Cm1 and Cm2.
따라서, 본 발명에 따른 실시예는 센싱 패드들(14)의 열의 타단으로 출력되는 센싱 신호의 변화를 감지하여 터치 및 터치가 발생한 위치를 인식할 수 있다.Therefore, the exemplary embodiment according to the present invention may recognize the touch and the position where the touch is generated by detecting a change in the sensing signal output to the other end of the column of the sensing pads 14.
상술한 구성에서 센싱 축과 구동 축은 제작자의 의도에 따라서 변경될 수 있다. 즉, 도 1에서 구동 신호들(Tx1, Tx2, Tx3, Tx4)과 센싱 신호들(Rx1, Rx2, Rx3, Rx4)이 입출력되는 위치가 상호 변경될 수 있다.In the above-described configuration, the sensing shaft and the driving shaft may be changed according to the manufacturer's intention. That is, in FIG. 1, positions at which the driving signals Tx1, Tx2, Tx3, and Tx4 and the sensing signals Rx1, Rx2, Rx3, and Rx4 are input and output may be interchanged.
상술한 구성과 같이 본 발명에 따른 실시예는 구동 패드(10), 구동 라인(12), 센싱 패드(14) 및 센싱 라인(16)이 싱글 레이어(1-레이어)에 구성되며, 그 결과 본 발명에 따른 실시예는 다수의 레이어를 이용하여 제작하는 것과 비교하여 설계 및 제조 공정이 단순화될 수 있고 제조 비용이 절감되고 수율이 향상될 수 있는 효과가 있다.As described above, in the embodiment of the present invention, the driving pad 10, the driving line 12, the sensing pad 14, and the sensing line 16 are configured in a single layer (one-layer). The embodiment according to the invention has the effect that the design and manufacturing process can be simplified and the manufacturing cost can be reduced and the yield can be improved compared to fabrication using a plurality of layers.
상기한 도 1의 실시예는 센싱 패드들(14)이 열 별로 복수 개가 배치되는 것을 예시하였으나, 도 2와 같이 각 열 별로 하나의 센싱 패드(14)가 구성될 수 있다. 즉, 다수의 구동 패드들(10)과 하나의 센싱 패드(14)가 대응하도록 실시예가 변형될 수 있다.1 illustrates that a plurality of sensing pads 14 are arranged for each column, but as illustrated in FIG. 2, one sensing pad 14 may be configured for each column. That is, the embodiment may be modified such that the plurality of driving pads 10 and one sensing pad 14 correspond to each other.
도 2의 실시예도 구동 패드(10)와 센싱 패드(14) 간의 터치에 의한 캐패시턴스 변화를 센싱할 수 있으며, 그에 따라서 터치 및 터치 위치가 인식될 수 있다.2 may sense a change in capacitance caused by a touch between the driving pad 10 and the sensing pad 14, and thus the touch and the touch position may be recognized.
도 2의 실시예는 도 1의 실시예와 비교하여 센싱 패드(14)의 구성을 제외하고 다른 구성 요소가 서로 동일하므로 이에 대한 중복된 구성 및 동작 설명은 생략한다.In FIG. 2, other components are identical to each other except for the configuration of the sensing pad 14, compared to the embodiment of FIG. 1, and thus descriptions of overlapping configurations and operations thereof will be omitted.
또한, 도 1 및 도 2의 실시예에서 인접한 열의 구동 패드들(10)을 연결하는 각 구동 라인(12)의 길이는 우회 경로의 차이로 인하여 각 행 별로 달라진다. In addition, in the embodiment of FIGS. 1 and 2, the length of each driving line 12 connecting the driving pads 10 in the adjacent column is changed for each row due to the difference in the bypass path.
도 1의 경우, 첫째 행의 구동 라인(12)은 센싱 패드(14) 열의 일단에서 가장 멀리 우회하고, 마지막 행의 구동 라인(12)은 센싱 패드(14) 열의 일단에서 가장 가깝게 우회한다. 도 2의 경우도, 구동 라인(12)은 센싱 패드(14)에 대하여 도 1과 동일한 방법으로 우회하도록 형성된다.In the case of FIG. 1, the drive line 12 of the first row bypasses the furthest from one end of the column of sensing pads 14, and the drive line 12 of the last row bypasses the closest one end of the column of sensing pads 14. 2, the driving line 12 is formed to bypass the sensing pad 14 in the same manner as in FIG. 1.
그리고, 첫째 행의 인접한 구동 패드들(10) 간을 연결하는 구동 라인(12)의 길이보다 둘째 행의 인접한 구동 패드들(10) 간을 연결하는 구동 라인(12)의 길이가 길고, 둘째 행의 인접한 구동 패드들(10) 간을 연결하는 구동 라인(12)의 길이보다 세째 행의 인접한 구동 패드들(10) 간을 연결하는 구동 라인(12)의 길이가 길며, 마지막 행의 인접한 구동 패드들(10) 간을 연결하는 구동 라인(12)의 길이가 가장 길다. The length of the driving line 12 connecting the adjacent driving pads 10 of the second row is longer than the length of the driving line 12 connecting the adjacent driving pads 10 of the first row, and the second row of the driving lines 12. The length of the drive line 12 connecting the adjacent drive pads 10 in the third row is longer than the length of the drive line 12 connecting the adjacent drive pads 10 in the third row, and the adjacent drive pads in the last row are longer. The length of the drive line 12 connecting the fields 10 is the longest.
상기한 바와 같이 행 별로 구동 라인들(12)의 길이가 달라지고 구동 라인들(12)이 균일한 선폭을 갖는 경우, 각 구동 라인(12) 별로 저항 값이 달라질 수 있다. 그러므로, 구동 라인(12) 별로 신호 전달 특성이 달라질 수 있다.As described above, when the lengths of the driving lines 12 are different for each row and the driving lines 12 have a uniform line width, the resistance value may vary for each driving line 12. Therefore, signal transmission characteristics may vary for each of the driving lines 12.
상기한 구동 라인(12) 별 저항 값의 차를 보상하기 위하여 본 발명에 따른 실시예가 도 3과 같이 구현될 수 있다. 도 3의 실시예는 구동 라인들(12)이 위치 별(행 별)로 다른 선폭(W1, W2, W3, W4)을 갖도록 형성된 것을 예시하고 있다.An embodiment according to the present invention may be implemented as shown in FIG. 3 to compensate for the difference in the resistance value of each of the driving lines 12. The embodiment of FIG. 3 illustrates that the drive lines 12 are formed to have different line widths W1, W2, W3, W4 by location (by row).
즉, 첫째 행의 가장 짧은 구동 라인(12)의 선폭이 가장 작고, 마지막 행의 가장 긴 구동 라인(12)의 선폭이 가장 크며, 첫째 행에서 마지막 행의 순서대로 구동 라인(12)의 선폭이 점차 커진다. W4 > W3 > W2 > W1, 여기에서, W1은 첫째 행의 구동 라인(12)의 선폭이고, W2는 둘째 행의 구동 라인(12)의 선폭이며, W3은 셋재 행의 구동 라인(12)의 선폭이고, W4는 넷째 행의 구동 라인(12)의 선폭이다.That is, the line width of the shortest drive line 12 in the first row is the smallest, the line width of the longest drive line 12 in the last row is the largest, and the line width of the drive line 12 in the order of the first row to the last row. Gradually grows. W4> W3> W2> W1, where W1 is the line width of the drive line 12 in the first row, W2 is the line width of the drive line 12 in the second row, and W3 is of the drive line 12 in the set row. W4 is the line width, and W4 is the line width of the drive line 12 in the fourth row.
도 3의 실시예는 길이 차이에 따라 발생할 수 있는 구동 라인(12) 별 저항 값의 차이를 선폭의 차이로 보상하는 구성을 예시한 것이다.3 illustrates a configuration in which a difference in resistance value for each driving line 12 may be compensated for by a difference in line width.
도 3의 실시예는 구동 라인(12)의 두께가 달라지는 것을 제외하고 도 1과 구성 요소가 동일하므로 이에 대한 중복된 구성 및 동작 설명은 생략한다.3 is identical to that of FIG. 1 except that the thickness of the driving line 12 is different, and thus, redundant construction and operation thereof will be omitted.
또한, 본 발명은 도 4와 같이 인접한 구동 패드들(10)을 연결하는 각 구동 라인(12)들이 센싱 패드(14)의 열 단위로 서로 반대 방향의 단부를 우회하도록 형성될 수 있다.In addition, as shown in FIG. 4, the driving lines 12 connecting the adjacent driving pads 10 may be formed so as to bypass end portions in opposite directions in units of rows of the sensing pads 14.
이 경우, 센싱 패드(12)의 센싱 신호(Rx1, Rx2, Rx3, Rx4)의 출력 방향은 열 단위로 반대 방향으로 설정됨이 바람직하다.In this case, the output direction of the sensing signals Rx1, Rx2, Rx3, and Rx4 of the sensing pad 12 may be set in the opposite direction in units of columns.
즉, 센싱 패드들(14)의 홀수 열과 짝수 열의 센싱 신호의 출력 방향이 반대 방향으로 설정될 수 있다.That is, the output direction of the sensing signals in the odd and even columns of the sensing pads 14 may be set in the opposite direction.
도 4의 실시예는 구동 패드들(10)을 연결하는 각 행의 구동 라인이 복수의 열을 거치면서 길이가 동일하도록 또는 구동 라인들의 길이 차이가 최소화 되도록 설정할 수 있는 이점이 있다.4 has the advantage that the driving lines of each row connecting the driving pads 10 may be set to have the same length while minimizing the length difference between the driving lines through a plurality of columns.
도 4의 실시예도 구동 라인(12)의 배치가 달라지는 것을 제외하고 도 1과 구성 요소가 동일하므로 이에 대한 중복된 구성 및 동작 설명은 생략한다.In the embodiment of FIG. 4, the components are the same as those of FIG. 1 except that the arrangement of the driving line 12 is different.
한편, 본 발명에 따른 실시예는 도 5와 같이 구동 패드들(10)과 센싱 패드들(14) 간의 피치(Pitch)를 줄이기 위하여 변형 실시될 수 있다.Meanwhile, the exemplary embodiment according to the present invention may be modified to reduce the pitch between the driving pads 10 and the sensing pads 14 as shown in FIG. 5.
도 5를 참조하면, 각 열의 첫째 행의 구동 패드들(10)은 공통된 구동 라인(12)에 연결된다. 그리고, 나머지 행의 구동 패드들(10)은 센싱 패드(14) 열의 일단을 동일한 방향으로 우회하도록 형성된 구동 라인들(12)에 의하여 연결된다.Referring to FIG. 5, the drive pads 10 in the first row of each column are connected to a common drive line 12. In addition, the driving pads 10 in the remaining rows are connected by driving lines 12 formed to bypass one end of the sensing pad 14 column in the same direction.
도 5의 실시예는 구동 패드들(10)과 센싱 패드들(14) 사이에 배치되는 구동 라인 수를 도 1과 비교하여 하나 줄일 수 있으며, 구동 라인 수를 줄인 만큼 구동 패드들(10)과 센싱 패드들(14) 간의 폭 즉 피치를 줄일 수 있는 이점이 있다.5, the number of drive lines disposed between the drive pads 10 and the sensing pads 14 may be reduced by one compared to FIG. 1, and the number of drive lines 10 may be reduced as much as the number of drive lines is reduced. There is an advantage in that the width, ie, the pitch, between the sensing pads 14 can be reduced.
도 5도 각 열의 첫째 행의 구동 라인(12)의 배치가 달라지는 것을 제외하고 도 1과 구성 요소가 동일하므로 이에 대한 중복된 구성 및 동작 설명은 생략한다.In FIG. 5, since the components of FIG. 1 are the same except that the arrangement of the driving lines 12 of the first row of each column is different, descriptions of overlapping configurations and operations thereof are omitted.
또한, 본 발명은 도 6과 같이 실시될 수 있으며, 도 6의 실시예에 의하면, 마지막 열의 구동 패드들(10)(TP 영역)과 구동 신호들(Tx1, Tx2, Tx3, Tx4)이 인가되는 구동 라인들(TPI 영역)이 면적의 효율성을 확보하기 위하여 삭제될 수 있다.In addition, the present invention may be implemented as shown in FIG. 6. According to the embodiment of FIG. 6, the driving pads 10 (TP region) and the driving signals Tx1, Tx2, Tx3, and Tx4 in the last column are applied. Drive lines (TPI regions) may be deleted to ensure the efficiency of the area.
한편, 도 1 내지 도 6의 구동 패드들(10)과 센싱 패드들(14)은 장방형상으로 형성되는 것을 예시하고 있다. 그러나, 이와 달리 제작자의 의도에 따라 도 7 내지 도 12과 같이 마름모형(다이아몬드형)으로 형성될 수 있다. Meanwhile, the driving pads 10 and the sensing pads 14 of FIGS. 1 to 6 are formed in a rectangular shape. However, according to the manufacturer's intention, it may be formed in a rhombus shape (diamond type) as shown in FIGS. 7 to 12.
본 발명에 따른 실시예로 구성되는 구동 패드들(10)과 센싱 패드들(14)의 형상은 장방형상과 마름모형 뿐만 아니라 제작자의 의도에 따라서 원형 또는 타원형이나 다양한 형상의 다각형으로 구성될 수 있다.The shape of the driving pads 10 and the sensing pads 14 according to the embodiment of the present invention may be formed of a polygon of various shapes or circular or oval or various shapes according to the intention of the manufacturer as well as a rectangular shape and a rhombus. .
그리고, 본 발명은 도 7 내지 도 12과 같이 다양한 방법으로 구동 패드(10) 및 센싱 패드(14)의 레이 아웃을 구성할 수 있다.In addition, the present invention may configure the layout of the driving pad 10 and the sensing pad 14 in various ways as shown in FIGS. 7 to 12.
먼저, 도 7의 실시예는 구동 패드(10)들이 짝수의 열으로 구성되고 센싱 패드들(14)이 홀수의 열으로 구성된 것을 예시하며, 구동 패드(10)들의 첫째 열과 마지막 열의 행 별로 각각 구동 신호(Tx1, Tx2, Tx3, Tx4)가 인가되는 것을 예시한다.First, the embodiment of FIG. 7 illustrates that the driving pads 10 are configured in an even number of columns, and the sensing pads 14 are configured in an odd number of rows, and the driving pads 10 are driven in rows of the first and last columns of the driving pads 10, respectively. For example, signals Tx1, Tx2, Tx3, and Tx4 are applied.
즉, 센싱 패드들(14)은 구동 패드들(10)의 첫째 열과 마지막 열 사이에 행 방향으로 교번하여 배치된다.That is, the sensing pads 14 are alternately disposed in the row direction between the first column and the last column of the driving pads 10.
그리고, 도 8의 실시예는 구동 패드들(10)과 센싱 패드들(14)이 짝수의 열으로 구성된 것을 예시한다. 보다 구체적으로, 도 8의 실시예는 구동 패드들(10)과 센싱 패드들(14)이 동일한 수의 열로 구성되며, 행 방향으로 교번하여 배치되고, 구동 패드들(10)의 첫째 열과 마지막 열의 행 별로 각각 구동 신호(Tx1, Tx2, Tx3, Tx4)가 인가된다.8 illustrates that the driving pads 10 and the sensing pads 14 are configured in even rows. More specifically, in the embodiment of FIG. 8, the driving pads 10 and the sensing pads 14 are configured in the same number of columns, are alternately arranged in a row direction, and the first and last columns of the driving pads 10 are arranged. Drive signals Tx1, Tx2, Tx3, and Tx4 are applied to each row.
여기에서, 구동 패드들(10)의 마지막 열에 인가되는 구동 신호(Tx1, Tx2, Tx3, Tx4)들은 마지막 열의 센싱 패드(14)를 우회한 구동 라인들(12)에 인가된다.Here, the driving signals Tx1, Tx2, Tx3, and Tx4 applied to the last column of the driving pads 10 are applied to the driving lines 12 bypassing the sensing pad 14 of the last column.
도 7 및 도 8의 실시예에 구성된 구동 라인(12)은 도 1과 동일한 형상으로 형성될 수 있으며, 이에 대한 중복된 설명은 생략한다.The driving line 12 configured in the embodiments of FIGS. 7 and 8 may be formed in the same shape as that of FIG. 1, and redundant description thereof will be omitted.
그리고, 도 9의 실시예는 도 8의 실시예와 동일하게 구동 패드들(10)과 센싱 패드들(14)이 짝수의 열으로 구성된 것을 예시하며, 구동 패드들(10)의 열과 센싱 패드들(14)의 열은 동일한 수로 구성되며 행 방향으로 교번하여 배치된다.In addition, the embodiment of FIG. 9 illustrates that the driving pads 10 and the sensing pads 14 are configured in an even number of rows, as in the embodiment of FIG. 8, and the rows of the driving pads 10 and the sensing pads are the same. The columns of 14 consist of the same number and are alternately arranged in the row direction.
도 9에서 구동 패드들(10)의 마지막 열에는 구동 신호(Tx1, Tx2, Tx3, Tx4)가 인가되지 않으며 구동 라인도 연장하여 연결되지 않는다. 즉, 구동 패드들(10)의 마지막 열은 전기적으로 플로팅된 상태이다.In FIG. 9, the driving signals Tx1, Tx2, Tx3, and Tx4 are not applied to the last column of the driving pads 10, and the driving line is not extended. That is, the last row of drive pads 10 is in an electrically floating state.
도 9에서 구동 패드(10)들과 센싱 패드들(14)의 마지막 열들 사이에 구동 라인(12)이 연결되지 않더라도 터치에 따른 캐패시턴스의 변화가 센싱될 수 있다.In FIG. 9, even when the driving line 12 is not connected between the driving pads 10 and the last columns of the sensing pads 14, a change in capacitance according to a touch may be sensed.
그리고, 도 10의 실시예도 도 8의 실시예와 동일하게 구동 패드들(10)과 센싱 패드들(14)이 짝수의 열으로 구성된 것을 예시하며, 구동 패드들(10)의 열과 센싱 패드들(14)의 열이 동일한 수로 구성되며 행 방향으로 교번하여 배치된 것을 예시한다.10 illustrates that the driving pads 10 and the sensing pads 14 are configured in an even number of rows, as in the embodiment of FIG. 8, and the rows of the driving pads 10 and the sensing pads ( It illustrates that the columns of 14) are composed of the same number and arranged alternately in the row direction.
도 10에서 구동 패드(10)의 마지막 열에 연결되는 구동 라인(12)은 센싱 패드들(14)의 마지막 열을 우회하도록 형성될 뿐 구동 신호(Tx1, Tx2, Tx3, Tx4)는 인가되지 않는다.In FIG. 10, the driving line 12 connected to the last column of the driving pad 10 is formed to bypass the last column of the sensing pads 14, but the driving signals Tx1, Tx2, Tx3, and Tx4 are not applied.
또한, 본 발명에 따른 실시예는 도 11 및 도 12과 같이 구동 패드들(10)과 센싱 패드들(14)은 각 행이 서로 엇갈리게 배치되도록 구성될 수 있다. 도 11 및 도 12은 도 8의 변형예로서 이에 대한 중복된 구성 및 동작 설명은 생략한다.11 and 12, the driving pads 10 and the sensing pads 14 may be configured such that the rows are alternately arranged with each other. 11 and 12 are modified examples of FIG. 8 and duplicated descriptions and operations thereof will be omitted.
본 발명은 상술한 바와 같이 싱글 레이어로 터치 패널이 구성될 수 있으며, 싱글 레이어로 제작됨에 따라 제조 비용을 절감하고 수율을 향상할 수 있다.As described above, the touch panel may be configured with a single layer, and as the single layer is manufactured, the manufacturing cost may be reduced and the yield may be improved.
상기한 본 발명에 따른 터치 패널은 싱글 레이어로 구성됨에 따라서 메탈 배선을 형성할 필요없이 외부와 직접 인터페이스를 구현할 수 있다.Since the touch panel according to the present invention has a single layer, the touch panel can directly interface with the outside without forming a metal wire.
한편, 본 발명에 따른 실시예로 구성되는 구동 패드들(10)과 센싱 패드들(14)은 도 13의 (a) 내지 (d)와 같이 다양한 형태로 형성될 수 있다.Meanwhile, the driving pads 10 and the sensing pads 14 according to the exemplary embodiment of the present invention may be formed in various shapes as shown in FIGS. 13A to 13D.
도 13에서, (a)는 전면이 하나의 패널로 형성된 솔리드 타입을 예시한 것이며, (b)는 직교 네트 타입으로 패턴이 형성된 메시 타입을 예시한 것이고, (c)는 경사 네트 타입으로 패턴이 형성된 메시 타입을 예시한 것이며, (d)는 육각 네트(허니) 타입으로 패턴이 형성된 메시 타입을 예시한 것이다.In FIG. 13, (a) illustrates a solid type in which a front surface is formed of one panel, (b) illustrates a mesh type in which a pattern is formed in an orthogonal net type, and (c) shows a pattern in which the pattern is inclined net type. The mesh type formed is illustrated, and (d) illustrates a mesh type in which a pattern is formed in a hexagonal net (honey) type.
도 13의 (a)는 ITO 패턴으로 구동 패드들(10)과 센싱 패드들(14)을 형성하는 경우 고려될 수 있다.FIG. 13A may be considered when the driving pads 10 and the sensing pads 14 are formed in an ITO pattern.
그리고, 도 13의 (b) 내지 (d)는 도전성을 개선하기 위하여 메탈 패턴으로 구동 패드들(10)과 센싱 패드들(14)을 형성하는 경우 고려될 수 있다.13B and 13D may be considered when the driving pads 10 and the sensing pads 14 are formed in a metal pattern to improve conductivity.
도 13의 (b) 내지 (d)와 같은 메시 패턴을 갖는 타입으로 구동 패드들(10)과 센싱 패드들(14)이 형성되는 경우, 터치 패드는 양호한 투과도를 갖도록 형성될 수 있다.When the driving pads 10 and the sensing pads 14 are formed in a type having a mesh pattern as shown in FIGS. 13B to 13D, the touch pad may be formed to have good transmittance.
한편, 도 14는 본 발명에 따른 터치 패널의 실시예이며 구동 라인이 길어지는 것을 방지하기 위하여 다수의 센싱 유니트(104, 105, 106, 107)로 구분한 실시예이다.On the other hand, Figure 14 is an embodiment of the touch panel according to the present invention is an embodiment divided into a plurality of sensing units (104, 105, 106, 107) in order to prevent the drive line is long.
도 14에서 다수의 센싱 유니트(104, 105, 106, 107)은 도 1의 실시예의 구조를 채택하고 있으며, 센싱 유니트(104, 105, 106, 107)는 다수의 행을 이루며, 각 행 별로 동일 형상으로 형성될 수 있다.In FIG. 14, the plurality of sensing units 104, 105, 106, and 107 adopt the structure of the embodiment of FIG. 1, and the sensing units 104, 105, 106, and 107 form a plurality of rows, and each row is the same. It may be formed in a shape.
각 센싱 유니트(104, 105, 106, 107)는 구동 신호(Tx1 - Tx4, Tx5 - Tx8, Tx9 - Tx12, Tx13 - Tx16)를 수신하고 각각 센싱 신호(Rx1_1 - Rx1_4, Rx2_1 - Rx2_4, Rx3_1 -Rx3_4, Rx4_1 - Rx4_4)를 출력하는 구성을 갖는다.Each sensing unit 104, 105, 106, 107 receives driving signals Tx1-Tx4, Tx5-Tx8, Tx9-Tx12, Tx13-Tx16 and senses the signals Rx1_1-Rx1_4, Rx2_1-Rx2_4, Rx3_1-Rx3_4, respectively. , Rx4_1-Rx4_4).
즉, 도 14의 실시예는 구동 신호들이 다수의 그룹 즉 Tx 1 내지 Tx 4, Tx 5 내지 Tx 8, Tx 9 내지 Tx 12, 및 Tx 13 내지 Tx 16으로 분할되어서 각 센싱 유니트(104, 105, 106, 107)로 별로 직접 인가되며, 그에 따라서 구동 신호를 각 센싱 유니트(104, 105, 106, 107) 별로 전달하는 구동 라인의 길이가 짧아져서 저항이 커지는 것을 방지할 수 있다.That is, in the embodiment of FIG. 14, the driving signals are divided into a plurality of groups, that is, Tx 1 to Tx 4, Tx 5 to Tx 8, Tx 9 to Tx 12, and Tx 13 to Tx 16, so that each sensing unit 104, 105, 106, 107 is directly applied to each star, and accordingly, the length of the driving line for transmitting the driving signal to each of the sensing units 104, 105, 106, and 107 is shortened, thereby preventing the resistance from increasing.
또한, 넓은 면적에 대하여 캐패시턴스 센싱을 구현하고자 하는 경우 구동 신호를 전송하는 구동 라인이 길어지는 것을 방지하기 위하여 도 15의 실시예가 실시될 수 있다.In addition, when implementing capacitance sensing over a large area, the embodiment of FIG. 15 may be implemented to prevent the driving line transmitting the driving signal from becoming longer.
도 15의 실시예는 각 센싱 유니트(104, 105, 106, 107)를 도 2의 실시예로 구현한 것을 예시하고 있다. 센싱 유니트(104, 105, 106, 107)은 다수의 행을 이루며, 각 센싱 유니트는 인접한 행 별로 대칭되는 형상으로 형성된다.The embodiment of FIG. 15 illustrates the implementation of each sensing unit 104, 105, 106, 107 in the embodiment of FIG. 2. The sensing units 104, 105, 106, and 107 form a plurality of rows, and each sensing unit is formed in a symmetrical shape for each adjacent row.
이와 같이, 본 발명은 넓은 면적에 대하여 구동 라인이 길어지는 것을 방지하기 위하여 도 14 및 도 15와 같이 복수의 센싱 유니트를 포함하도록 실시될 수 있으며, 이때 각 센싱 유니트는 도 1 내지 도 12의 실시예 중 어느 하나가 균일하게 또는 혼합되어 적용될 수 있다.As described above, the present invention may be implemented to include a plurality of sensing units as shown in FIGS. 14 and 15 in order to prevent the driving line from lengthening over a large area, wherein each sensing unit is implemented in FIGS. 1 to 12. Either of the examples may be applied uniformly or mixed.
따라서, 도 14 및 도 15의 실시예는 센싱 유니트 별로 구동 신호를 인가하도록 구성됨에 따라서 구동 신호를 전달하는 구동 라인의 저항이 최대 1/센싱 유니트 수 만큼 감소할 수 있다.Thus, the embodiment of FIGS. 14 and 15 is configured to apply the driving signal for each sensing unit, so that the resistance of the driving line for transmitting the driving signal may be reduced by a maximum of 1 / sensing unit number.

Claims (19)

  1. 매트릭스 형상으로 배치되는 구동 패드들;Drive pads arranged in a matrix shape;
    상기 구동 패드들의 열과 교번하여 배치되는 센싱 패드들;Sensing pads alternately arranged with the row of drive pads;
    동일한 행의 상기 구동 패드들 간을 연결하는 구동 라인들; 및Drive lines connecting the drive pads in the same row; And
    상기 센싱 패드들의 열 단위로 인출되는 센싱 라인들;을 포함하며,And sensing lines drawn out in units of columns of the sensing pads.
    상기 구동 패드들, 상기 센싱 패드들, 상기 구동 라인들 및 상기 센싱 라인들은 동일 레이어에 형성되는 형성되는 터치 패널.And the driving pads, the sensing pads, the driving lines, and the sensing lines are formed on the same layer.
  2. 제1 항에 있어서,The method of claim 1,
    상기 센싱 패드들은 각 열 별로 상기 구동 패드들의 행과 대응하는 개수로 분할되며 다수로 분할된 각 열 별 상기 센싱 패드들은 상기 센싱 라인에 의하여 상호 연결되는 터치 패널.The sensing pads are divided into a number corresponding to a row of the driving pads for each column, and the sensing pads for each column divided into a plurality of columns are interconnected by the sensing line.
  3. 제2 항에 있어서,The method of claim 2,
    상기 센싱 패드들과 상기 구동 패드들의 각 행은 서로 엇갈리게 배치되는 터치 패널.And each row of the sensing pads and the driving pads is staggered from each other.
  4. 제1 항에 있어서,The method of claim 1,
    상기 센싱 패드들은 각 열 별로 하나의 패드로 구성되는 터치 패널.The sensing pads are configured as one pad for each column.
  5. 제1 항에 있어서,The method of claim 1,
    상기 구동 라인들은 상기 센싱 패드들의 열의 일단을 우회하도록 형성되는 터치 패널.And the driving lines are formed to bypass one end of a row of the sensing pads.
  6. 제1 항에 있어서,The method of claim 1,
    상기 구동 라인들은 상기 센싱 패드들의 열 단위로 상기 센싱 패드의 열의 반대되는 일단을 우회하도록 형성되는 터치 패널.The driving lines are formed to bypass opposite ends of the rows of the sensing pads in units of rows of the sensing pads.
  7. 제5 또는 제6 항에 있어서,The method of claim 5 or 6,
    상기 구동 라인들의 선폭은 상기 센싱 패드들의 열의 일단에서 멀리 우회할수록 좁게 형성되는 터치 패널.The line width of the driving lines is narrower as the line width is diverted farther from one end of the row of sensing pads.
  8. 제5 또는 제6 항에 있어서,The method of claim 5 or 6,
    상기 구동 라인들의 선폭은 상기 구동 패드들 간을 연결하는 길이가 길수록 넓게 형성되는 터치 패널.The line width of the driving lines is wider as the length connecting the driving pads becomes longer.
  9. 제1 항에 있어서,The method of claim 1,
    첫째 행의 상기 구동 패드들은 공통 구동 라인에 연결되며, 나머지 행의 상기 구동 패드들을 연결하는 상기 구동라인은 상기 센싱 패드의 열의 일단을 우회하도록 형성되는 터치 패널.The driving pads of a first row are connected to a common driving line, and the driving line connecting the driving pads of the remaining rows is formed to bypass one end of a column of the sensing pad.
  10. 제1 항에 있어서,The method of claim 1,
    상기 구동 패드는 다각형, 원형 또는 타원형 중 어느 하나로 형성되는 터치 패널.The driving pad is formed of any one of a polygon, a circle, or an oval.
  11. 제1 항에 있어서,The method of claim 1,
    구동 신호는 상기 구동 패드들의 각 행의 양단 중 적어도 일단에 인가되는 터치 패널.And a driving signal is applied to at least one of both ends of each row of the driving pads.
  12. 제1 항에 있어서,The method of claim 1,
    상기 구동 패드들의 마지막 열에서 상기 센싱 패드의 마지막 열을 우회하도록 상기 구동 라인들이 형성되는 터치 패널.And the driving lines are formed to bypass the last row of the sensing pads in the last row of the drive pads.
  13. 제1 항에 있어서,The method of claim 1,
    상기 구동 패드, 상기 센싱 패드, 상기 구동 라인 및 상기 센싱 라인은 도전성 패턴으로 형성되는 터치 패널.The driving pad, the sensing pad, the driving line, and the sensing line are formed in a conductive pattern.
  14. 제13 항에 있어서,The method of claim 13,
    상기 센싱 패드는 솔리드 타입이고, 상기 도전성 패턴은 ITO 패턴으로 형성되는 터치 패널.The sensing pad is a solid type, and the conductive pattern is formed of an ITO pattern.
  15. 제13 항에 있어서,The method of claim 13,
    상기 센싱 패드는 메시 타입이고, 상기 도전성 패턴은 메탈 패턴으로 형성되는 터치 패널.The sensing pad is a mesh type and the conductive pattern is formed of a metal pattern.
  16. 제1 항에 있어서,The method of claim 1,
    상기 구동 패드들에 센싱 신호가 출력되고 상기 센싱 패드들에 구동 신호가 인가되는 터치 패널.And a sensing signal is output to the driving pads and a driving signal is applied to the sensing pads.
  17. 동일 레이어 기판 상에 형성된 다수의 센싱 유니트를 포함하며, It includes a plurality of sensing units formed on the same layer substrate,
    각 센싱 유니트는, Each sensing unit
    매트릭스 형상으로 배치되는 구동 패드들;Drive pads arranged in a matrix shape;
    상기 구동 패드들과 동일 레이어 상에 형성되고 행 방향으로 상기 구동 패드들의 열에 대하여 교번하여 배치되는 센싱 패드들;Sensing pads formed on the same layer as the driving pads and alternately arranged with respect to a column of the driving pads in a row direction;
    동일한 행의 상기 구동 패드들 간을 연결하는 구동 라인들; 및Drive lines connecting the drive pads in the same row; And
    상기 센싱 패드들의 열 단위로 인출되어 센싱 신호를 출력하는 센싱 라인들;을 포함하는 터치 패널.And sensing lines drawn out in units of columns of the sensing pads to output a sensing signal.
  18. 제17 항에 있어서,The method of claim 17,
    각 행의 상기 센싱 유니트는 동상으로 형성되는 터치 패널.The sensing unit of each row is formed in the in-phase touch panel.
  19. 제17 항에 있어서,The method of claim 17,
    상기 센싱 유니트는 인접한 행 별로 대칭되는 형상으로 형성되는 터치 패널.The sensing unit is formed in a shape symmetrical for each adjacent row.
PCT/KR2013/005105 2012-06-15 2013-06-11 Touch panel WO2013187650A1 (en)

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KR102493681B1 (en) * 2018-03-30 2023-01-31 엘지디스플레이 주식회사 Touch display device and touch sensing method
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