Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/04—Coating on selected surface areas, e.g. using masks
  • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/04—Coating on selected surface areas, e.g. using masks
  • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

• Embodiments of the present invention generally relate to a shadow frame for use in a processing chamber.
• Modern semiconductor devices require the formation of features, such as OLEDs, transistors, and low-k dielectric films, by depositing and removing multiple layers of conducting, semiconducting and dielectric materials from a glass substrate.
• Glass substrate processing techniques include plasma-enhanced chemical vapor deposition (PECVD), physical vapor deposition (PVD), etching and the like.
• PECVD plasma-enhanced chemical vapor deposition
• PVD physical vapor deposition
• etching etching and the like.
• Plasma processing is widely used in the production of flat panel devices due to the relatively lower processing temperatures required to deposit a film and good film quality which can result from using plasma processes.
• plasma processing involves positioning a substrate on a support member (often referred to as a susceptor or heater) disposed in a vacuum chamber and forming a plasma adjacent to the upper exposed surface of the substrate.
• the plasma is formed by introducing one or more process gases into the chamber and exciting the gases with an electrical field to cause dissociation of the gases into charged and neutral particles.
• a plasma may be produced inductively, e.g., using an inductive RF coil, and/or capacitively, e.g., using parallel plate electrodes, or by using microwave energy.
• a deposition masking device or shadow frame
• the shadow frame may be positioned in the processing chamber above the support member so that when the support member is moved into a raised processing position, the shadow frame is picked up and contacts an edge portion of the substrate.
• the shadow frame covers several millimeters of the periphery of the upper surface of the substrate, thereby preventing edge and backside deposition on the substrate.
• Prior art shadow frames typically comprise clamping mechanisms that can have sharp corners. Such sharp corners can scratch or fracture substrates when brought into contact therewith such as during the loading and unloading of the substrate from the process chamber. Further, during processing, the substrate and the shadow frame experience expansion and contraction causing mechanical stress there between and often resulting in damage to the substrate. As such, the standard shadow frame may have a gap to separate it from the substrate.
• the present invention generally relates to a shadow frame for use in a processing chamber, such as a PECVD chamber.
• a processing chamber such as a PECVD chamber.
• an apparatus for controlling deposition on a substrate is disclosed.
• the apparatus can include a chamber comprising a shadow frame support, a substrate support comprising a substrate supporting surface, and a shadow frame including a shadow frame body, a detachable lip and a support connection.
• the shadow frame body can have a first support surface facing the substrate supporting surface and a second support surface opposite the first support surface.
• the detachable lip can be connected with the shadow frame body and fixably positioned on the second support surface.
• the detachable lip can have a first lip surface facing the substrate support, a second lip surface opposite the first lip surface, a first edge positioned over the first support surface, and a second edge opposite the first edge.
• the support connection can couple the shadow frame body to the detachable lip.
• an apparatus for controlling deposition on a substrate can include a chamber comprising a shadow frame support, a substrate support comprising a substrate supporting surface, and a shadow frame comprising a shadow frame body and a detachable lip which can rest on the substrate supporting surface.
• the shadow frame body can include a first support surface facing the substrate supporting surface, wherein the first surface rests on the shadow frame support, a second support surface opposite the first surface comprising a recess with a lower recess surface and a recess ledge.
• the detachable lip can be connected with the shadow frame body and fixably positioned in the recess of the second support surface.
• the detachable lip can include a first lip surface facing the substrate, wherein a portion connects with the lower recess surface, a second lip surface opposite the first lip surface, a first edge positioned in connection with the recess ledge, and a second edge opposite the first edge.
• Figure 1 is a schematic cross sectional view of a processing chamber.
• Figure 2A is a schematic illustration of the shadow frame having a detachable lip coupled to the surface of the shadow frame body.
• Figure 2B is a schematic cross-sectional view of the shadow frame described in Figure 2A.
• Figures 3A-3D are schematic cross-sectional views showing various embodiments of the shadow frame.
• Figure 4 is a schematic top view showing the detachable lip that covers a gap between adjacent shadow frame pieces.
• Embodiments of the present invention generally relate to a shadow frame for use in a processing chamber.
• a shadow frame is formed of either a unibody or multi-piece shadow frame body which is connected with either a unibody or multi-piece detachable lip.
• the shadow frame design can permit arcing control by controlling the "gap" or distance between the shadow frame and the substrate during high power operations or for processes that typically result in arcing such as silicon nitride or silicon oxide based deposition processes. In absence of the lip, arcing could otherwise be possible between adjacent shadow frame pieces. Additionally, in absence of the lip, arcing could otherwise occur between the shadow frame and other chamber pieces.
• arcing is due in part to chipping or breaking of the substrate. It is important that a shadow frame make some contact with the substrate to prevent deposition under the shadow frame during processing.
• the weight of prior art shadow frames can lead to chips or cracks in the substrate. A chip or crack in the substrate exposes portions of the susceptor to plasma, thus creating a propensity for arcing.
• the weight of the shadow frame supported on the surface is reduced and contact of the shadow frame with the substrate is controlled which minimizes chipping or breaking of the substrate. Therefore, embodiments described here can control deposition on the substrate while avoiding arcing due to breakage.
• the shadow frame enhances amorphous silicon uniformity because of the narrow edge lip and thus, less shadowing of the substrate.
• the uniform arrangement of the electrically insulating material also assists in amorphous silicon deposition uniformity.
• FIG. 1 is a schematic cross sectional view of an exemplary processing chamber 10 with a shadow frame according to one embodiment.
• a PECVD process chamber available from AKT America, Inc, a subsidiary of Applied Materials, Inc., located in Santa Clara, California. It is contemplated that other plasma processing chambers, including those from other manufacturers, may be adapted to practice the present invention.
• the processing chamber 10 comprises a chamber body 12 and a backing plate 14 disposed thereon.
• the chamber body 12 has a processing region 16.
• the dimensions of the chamber body 12 and related components of the processing chamber 10 are not limited and generally are proportionally larger than the size of a substrate 28 to be processed. Any suitable substrate size may be processed. Examples of suitable substrate sizes include substrate having a surface area of about 5500 centimeter square or more, such as about 25000 centimeter square or more, for example about 50000 centimeter square or more. In one embodiment, a substrate having a surface area of about 90000 centimeter square or more may be processed.
• a gas distribution plate 18 can be mounted to the backing plate 14 and defines the upper boundary of the processing region 16.
• a plurality of holes 20 are formed in the gas distribution plate 18 to allow delivery of processing gases therethrough.
• a gas source 40 can deliver a gas to the plenum formed between the gas distribution plate 18 and the backing plate 14 so as to evenly distribute the processing gas and thus, uniformly deliver the processing gas through the gas distribution plate 18.
• a power source 42 may be electrically coupled to the gas distribution plate 18 so as to create a plasma from the processing gas that flows through the holes 20.
• the power source 42 can be any type of power source used in PECVD chambers, such as an RF power source.
• a shadow frame 22 is shown disposed on a substrate support 32.
• the shadow frame 22 includes a shadow frame body 24 with a detachable lip 26 affixed thereto.
• the chamber body 12 also includes a shadow frame support 44 which is formed annularly around the substrate support 32. When the substrate support 32 is in a lowered position, the shadow frame 22 is supported by the shadow frame support 44.
• the substrate support 32 also referred to as a susceptor or heater, is disposed in the processing chamber 10 and is actuated by a motor 33.
• the substrate support 32 In a raised processing position, the substrate support 32, having the substrate 28 disposed on a substrate supporting surface 34 thereof, supports the shadow frame body 24 of the shadow frame 22 and defines the lower boundary of the processing region 16 such that the substrate 28 is positioned in the processing region 16.
• the detachable lip 26 both extends over and contacts a portion of the substrate 28 while the shadow frame body 24 rests on the substrate supporting surface 34.
• the substrate 28 is introduced into and removed from the processing chamber 10 through an opening 36 formed in the chamber body 12 which is selectively sealed by a slit valve mechanism (not shown).
• Lift pins 38 can be slidably disposed through the substrate support 32 and can be adapted to hold a substrate at an upper end thereof.
• the lift pins 38 can be actuatable by lowering the substrate support 32 using the motor 33.
• FIG. 2A is a schematic illustration of a shadow frame 200 having a detachable lip 202 coupled to a shadow frame body 204 according to one embodiment.
• the shadow frame body 204 can be composed of a plurality of shadow frame body pieces 203A, 203B. Though shown in the figure as a multiple piece structure, the shadow frame body 204 can be a unitary body shaped to accommodate a substrate (rectangular in the case of flat panel glass substrates). Further, the shadow frame 200 can be of any size or shape as user needs demand, such as a shadow frame designed for a 5500 cm 2 substrate.
• the shadow frame body 204 may be fixably connected with the detachable lip 202.
• the detachable lip 202 can be composed of a plurality of detachable lip pieces 205A, 205B, however it is to be understood that the detachable lip 202 may comprise a unitary body.
• the shadow frame body pieces 203A, 203B may each be attached to the detachable lip pieces 205A, 205B.
• the detachable lip pieces 205A, 205B can overlap shadow frame body pieces 203A, 203B, thereby allowing the detachable lip pieces 205A, 205B to be connected with more than one shadow frame body piece 203A, 203B.
• Gaps formed between the shadow frame body pieces 203A, 203B and the detachable lip pieces 205A, 205B can be sealed by one or more gap covers 206A and 206B.
• the gap covers 206A and 206B can be connected to the shadow frame body 204 using one or more support connections, depicted here as support connections 208A and 208B.
• the support connections described here are preferred embodiments. Further embodiments can use support connections which connect to, with or through other components of the shadow frame.
• the support connections used in this embodiment can be a bolt or a screw or other fastening mechanisms.
• gap covers 206A and 206B depicted here as a device covering the gaps, are but one embodiment. Further gap covers can be integrated into the shadow frame body pieces 203A, 203B or the detachable lip pieces 205A, 205B, such as an overhang formed into one shadow frame body piece 203A which fits into a groove formed into a second shadow frame body piece 203B. Combinations of the above embodiments are also envisioned.
• Figure 2B depicts a schematic cross-sectional view of the shadow frame 200 having the detachable lip 202 coupled to the shadow frame body 204 according to one embodiment.
• the shadow frame body 204 can have a first support surface 210, a second support surface 212, inside edges 214A and 214B, an outside edge 216 and a lower edge 218.
• the first support surface 210 can face the substrate supporting surface and in fact rest on the substrate supporting surface during processing.
• the lower edge 218 rests on the shadow frame support when the shadow frame 200 is not supported by the substrate support.
• An example of the shadow frame support is a ledge that extends from a chamber wall.
• the second support surface 212 can be positioned opposite the first support surface 210.
• the surfaces 210 and 212 are substantially parallel.
• the second support surface 212 can have structures formed in the surface, such as a hole 213, which can be used for receiving a fastening mechanism used to connect the detachable lip 202 to the shadow frame body 204.
• the thickness of the shadow frame body 204 assures contact between the detachable lip 202 and the substrate without applying too much stress to either the substrate or the shadow frame body 204.
• the distance between the first support surface 210 and the second support surface 212 on the shadow frame body 204 i.e., the length of inside edge 214A
• the distance is substantially equal to the thickness of the substrate to be processed.
• the distance between the first support surface 210 and the second support surface 212 is between about 6mm and about 15mm, such as a distance of about 10mm.
• the shadow frame body 204 is shown having an "L" shape so as to let the shadow frame body 204 rest on the substrate supporting surface while surrounding both the substrate and the substrate support on all sides.
• the inside edges 214A and 214B can be positioned to provide proper spacing of the shadow frame body 204 from the substrate and the substrate support respectively. Without wishing to be bound by theory, it is believed that the damage caused to the substrate by the shadow frame body 204 can increase the likelihood of arcing between the susceptor and the shadow frame body 204 among other components. However, if the shadow frame body 204 is too far from the substrate, deposition may occur on the substrate under the shadow frame.
• the outside edge 216 and the lower edge 218 can be substantially flat surfaces, as depicted in Figure 2B as flat surfaces which meet at a 90 degree angle. Further embodiments can include different shapes or angles so as to accommodate the shadow frame support needs of the technician.
• the shadow frame body 204 can further be constructed of a metal, such as aluminum, anodized aluminum or ceramic.
• the detachable lip 202 will generally comprise a ceramic. Using aluminum in the detachable lip creates the possibility of warping. In one embodiment, the detachable lip 202 is thinner than the shadow frame body 204. In some embodiments, the detachable lip can be between about 2mm to about 10mm thick, such as about 3mm to about 5mm thick. In one embodiment, the detachable lip 202 is composed of ceramic and is about 3 mm thick.
• the detachable lip 202 extends beyond the shadow frame body 204 and can cover a portion of an edge of the substrate.
• the detachable lip 202 can extend beyond the shadow frame body 204 by between about 25mm and about 40mm.
• the detachable lip 202 can comprise a unitary body.
• the detachable lip 202 can have a first lip surface 222, a second lip surface 224, a first edge 226 and a second edge 228.
• a support connection 229 can be used to couple the detachable lip 202 to the shadow frame body 204.
• the first lip surface 222 is arranged to face the substrate during processing and is in contact with second support surface 212. Further, at least a portion of the first lip surface 222 may be in contact with the substrate when the shadow frame 200 is positioned on the substrate support.
• the first lip surface 222 can be a substantially flat surface. Further embodiments can include surface texturing or other features to reduce the portion of the first lip surface 222 which may contact the substrate.
• the second lip surface 224 is opposite the first lip surface 222.
• the second lip surface 224 can be substantially parallel to the first lip surface 222.
• Further embodiments include a second lip surface 224 which is formed at an angle with respect to the first lip surface 222, so as to create an angle.
• the first lip surface 222 and the second lip surface 224 can create an angle of from about 3 degrees to about 7 degrees, such as an angle of about 5 degrees.
• the first edge 226 connects the first and second lip surfaces 222, 224. Though depicted in Figure 2B as being flat, the first edge 226 can be of a variety of shapes allowing the first edge 226 to fit securely in a groove, such as a curved or v shaped first edge fitting securely into curved or v-shaped recess ledge (not shown).
• the second edge 228 is opposite the first edge 226.
• the second edge 228 connects the first and second lip surfaces 222, 224. Though depicted in Figure 2B as a flat surface, the second edge 228 can be a variety of shapes to provide safer contact with the substrate or to reduce contact points, such as a rounded or tapered second edge.
• the support connection 229 can securely connect the detachable lip 202 to the shadow frame body 204.
• the support connection 229 can be connected at a point where the detachable lip 202 and the shadow frame body 204 meet, such as near the first edge 226.
• the support connection 229 can be a fixed connection, such as a latch, a groove or a screw. In the embodiment shown in Figure 2B, the support connection 229 is depicted as a screw.
• the support connection 229 can comprise materials such as aluminum, anodized aluminum, a ceramic, or other materials.
• the support connection 229 used in one embodiment may comprise the same material as either the shadow frame body 204 or the detachable lip 202.
• Further embodiments of the support connection 229 can include slidable grooves, latches, clasps or other fixed attachments which can securely hold the detachable lip 202 and the shadow frame body 204 together.
• the shadow frame described here need not be composed of a plurality of shadow frame body pieces and detachable lip pieces.
• the detachable lip and the shadow frame body may individually be a single unified structure. Any combination of the above may be used to form an embodiment of a shadow frame in accordance with the invention.
• a unified shadow frame body can connect to a plurality of detachable lip pieces comprising a portion of a shadow frame.
• Figures 3A-3D are schematic cross-sectional views showing various embodiments of a shadow frame using the detachable lip design.
• the portions of the embodiments described below can be used alone or in combination to achieve contact with the surface of the substrate without damaging the substrate during processing.
• FIG. 3A depicts a shadow frame 300 with a tapered detachable lip 302.
• the shadow frame 300 can have a detachable lip 302 with tapered edges 304A and 304B.
• the tapered edges 304A and 304B can create a lower profile for the deposited film.
• the detachable lip 302 in this embodiment is shown with two tapered edges, it is not required that both edges be tapered.
• the detachable lip 302 can be securely connected to an upper surface of a shadow frame body 306.
• the detachable lip 302 can be connected using a support connection, depicted here as a screw 308.
• the support connection can be selected so as to be easily removable.
• Prior art shadow frames have a relatively high critical thickness for the portion of the shadow frame that extends over the substrate, called a lip. This is because if the lip is damaged during operation, the entire shadow frame would need to be replaced, leading to unwanted downtime as well as a high cost for replacement.
• a removable connection can allow for secure positioning of the detachable lip 302 on the substrate as connected to the shadow frame body 306. Further, the detachable lip 302 can be easily removed and replaced in case of damage.
• Figure 3B depicts a shadow frame 310 with a recess 316 supporting a detachable lip 312.
• the detachable lip 312 maintains a substantially similar width as the detachable lip 312 extends out from the shadow frame body 314.
• the detachable lip 312 may be extremely thin, such as between about 1 mm and about 3 mm, so as to produce a desirable film profile.
• the detachable lip 312 can be securely connected to an upper surface of a shadow frame body 314.
• the detachable lip 312 can be connected using a removable means such as a screw or a clamp. Some embodiments can use a permanent or semi-permanent connection, such as welding.
• the detachable lip 312 can have flat edges 318A and 318B.
• the flat edge 318A can be substantially similar to a recess ledge 319 of the recess 316.
• the flat edge 318B can extend out over the substrate (not shown).
• the recess 316 formed in the surface of the shadow frame body 314, as disclosed in this embodiment, can provide both additional support for the detachable lip 312 and an additional measure to prevent flow under the detachable lip 312. As well, by reducing the surface area of the detachable lip 312 available to the plasma, damage to the detachable lip 312 during normal operation can be reduced.
• FIG. 3B depicts a shadow frame 320 with a recess 323 supporting a detachable lip 322 according to a further embodiment.
• the detachable lip 322 maintains a substantially similar width as it extends out from the shadow frame body 324.
• the detachable lip 322 may be extremely thin so as to produce a desirable film profile.
• the detachable lip 322 can be securely connected to an upper surface of a shadow frame body 324.
• the detachable lip 322 can be connected using a removable means such as a screw or a clamp.
• the detachable lip 322 can have a detachable lip body 329 and a flat edge 326.
• the flat edge 326 can be substantially similar to a recess ledge
• the flat edge 326 can rest securely against the recess ledge 327 preventing pivoting movement of the portion of the detachable lip 322 which rests against the shadow frame body 324.
• the detachable lip 322 can also have a rounded edge 328. The rounded edge
• the rounded edge 328 can be completely rounded and be positioned so as to share a bisecting line with the detachable lip body 329. Further embodiments include the rounded edge 328 with only partial rounding, such as the rounded edge 328 with only the surface facing the substrate is rounded. In one embodiment, the rounded edge is either partially or completely rounded with a bisecting line shifted toward the substrate (not shown).
• Figure 3D depicts a shadow frame 330 with a recess 336 supporting a detachable lip 332 according to a further embodiment.
• the detachable lip 332 reduces in width as it extends out from the shadow frame body 324 creating an angled edge 335.
• the angled edge 335 can be a variety of angles based on the needs of the user such as a 2 degree angle formed between the first lip surface and the second lip surface, as measured from the substrate side of the detachable lip 332.
• the detachable lip 332 can be securely connected to an upper surface of a shadow frame body 334.
• Further embodiments can have the angled edge 335 with an angle of 1 degree or less to allow the detachable lip 332 to extend further over the substrate while the detachable lip 332 remains either equal to or less than the height of the top surface of a recess 336 of the shadow frame body 334.
• the detachable lip 332 can have a flat edge 333.
• the flat edge 333 can be substantially similar to a recess ledge 337 of the recess 336. As well, the flat edge 333 can rest securely against the recess ledge 337 preventing pivoting movement of the portion of the detachable lip 332 which rests against the shadow frame body 334.
• the detachable lip 332 can also have multiple support connections, depicted here as a two screws 338A and 338B.
• a detachable lip may extend at a curvature from the shadow frame body to contact the substrate.
• Further embodiments may have one or more bends in the detachable lip so as to allow a first edge of the detachable lip to begin higher than the surface of the substrate. The detachable lip would then have one or more bends in the detachable lip body so as to bring the second edge in contact with the substrate.
• FIG 4 is a schematic top view showing the detachable lip that covers a gap between adjacent shadow frame pieces.
• the shadow frame 400 can have a shadow frame body 402 with one or more shadow frame body pieces 403A, 403B which can be of different lengths and shapes so that the shadow frame body 402 matches the size and shape of the substrate that it circumscribes.
• the detachable lip 404 can comprise a plurality of detachable lip pieces 405A and 405B, which can have dimensions which extend beyond the shadow frame body pieces 403A, 403B. As such, the detachable lip pieces 405A, 405B, when securely attached, may hold the shadow frame body pieces 403A, 403B together and reduce gap width between pieces. [0060]
• the detachable lip 404 can fit into a recess 406.
• the recess 406 can be composed of multiple recesses, such as those formed in the shadow frame body pieces 403A and 403B.
• gaps of some size may exist between the detachable lip pieces 405A, 405B individually and the shadow frame body pieces 403A, 403B individually.
• One or more gap covers 410 may be used to cover the gaps between these pieces. Though only one gap cover 410 is shown in this embodiment, it is envisioned that a gap cover can correspond to each gap formed in the shadow frame 400 from the detachable lip pieces 405A, 405B and the shadow frame body pieces 403A, 403B.
• connection points 408A and 408C can be formed through the shadow frame body pieces 403B and the gap covers 410 allowing support connections, such as screws or bolts, to pass through.
• Connection points 408B and 408D can be can be formed through the detachable lip pieces 405A, 405B and the shadow frame body pieces 403A, 403B so as to connect the detachable lip pieces 405A, 405B with the shadow frame body pieces 403A, 403B.
• connection points 408A-408D of the upper most members can have beveled edges allowing the support connections to be recessed into the upper most piece.
• Embodiments described herein generally relate to a shadow frame for use in a processing chamber.
• the shadow frame is composed of either a single member or multiple member shadow frame body which supports either a single member or multi member detachable lip.
• the detachable lip may include varying shapes and can use light weight materials.
• the multi piece detachable lip or multi piece shadow frame body embodiments include gap covers to seal gaps between pieces.
• the detachable lip is capable of contacting the substrate without cracking or breaking the substrate, thereby allowing the shadow frame to be used in high energy plasma operations without arcing while providing a good profile of deposited film on the substrate. Further, the detachable lip of the shadow frame is easily replaceable allowing for damaged detachable lips to be interchanged at a lower cost and with higher frequency.

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