WO2013143279A1 - 单板冷却装置和信息设备 - Google Patents
单板冷却装置和信息设备 Download PDFInfo
- Publication number
- WO2013143279A1 WO2013143279A1 PCT/CN2012/083666 CN2012083666W WO2013143279A1 WO 2013143279 A1 WO2013143279 A1 WO 2013143279A1 CN 2012083666 W CN2012083666 W CN 2012083666W WO 2013143279 A1 WO2013143279 A1 WO 2013143279A1
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- WO
- WIPO (PCT)
- Prior art keywords
- cooling medium
- cooling
- board
- inlet
- flow guiding
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
Definitions
- the present invention relates to the field of information technology, and in particular, to a single board cooling device and an information device. Background technique
- ICT information and communication technology
- the device for separating the device on the single board inside the closed casing is divided into two parts, and the coolant enters the casing from one side of the partition, and the device on the single board on the side of the partition plate After cooling, it flows into the other side of the separator, and then cools the device on the board on the other side of the separator.
- the coolant enters the other side of the separator, its temperature has risen, thus affecting the heat dissipation of the device on the board on the other side of the separator.
- the embodiment of the invention provides a single board cooling device and an information device, which improves the heat dissipation effect of the device on the single board.
- an embodiment of the present invention provides a single board cooling device, including: a housing and a single board, the single board and the inner wall of the housing form a closed space, and the housing is provided with a cooling medium inlet and cooling a medium outlet, a cooling medium flowing into the closed space formed by the single plate and the inner wall of the casing through the inlet of the cooling medium, flowing through the device on the single board, and flowing out through the outlet of the cooling medium, the board Having multiple devices;
- the board is provided with a partition in a direction perpendicular to the single board, the partition separating the single board into a first part and a second part, between the first part and the second part Having a passage opening; a cooling medium flowing from the inlet of the cooling medium into the first portion, flowing through the device of the first portion, flowing into the second portion through the passage port, flowing through the device of the second portion
- the cooling medium outlet flows out;
- the veneer is further provided with a flow guiding mechanism for diverting the cooling medium flowing from the cooling medium inlet into the first portion, so that a part of the cooling medium is directly introduced into the second portion.
- an embodiment of the present invention provides an information device, including: at least one of the above-described single board cooling devices;
- the single-board cooling device and the information device provided by the embodiments of the present invention are provided with a flow guiding mechanism on the single board, and a part of the cooling medium separated from the inlet of the cooling medium into the partition is directly introduced into the partition to be isolated.
- the second part since the temperature of the cooling medium directly introduced into the second part has not risen, the heat dissipation of the device on the board is facilitated.
- FIG. 1 is a schematic structural view of still another embodiment of a single-plate cooling device according to the present invention
- FIG. 2 is a schematic structural view of another embodiment of a single-plate cooling device provided by the present invention
- FIG. 4 is a top plan view of another embodiment of a single board cooling device provided by the present invention.
- the technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention.
- the embodiments are a part of the embodiments of the invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without departing from the inventive scope are the scope of the present invention.
- An embodiment of the single-board cooling device provided by the present invention includes: a casing and a veneer, the veneer and the inner wall of the casing form a closed space, the casing is provided with a cooling medium inlet and a cooling medium outlet, and the cooling medium passes through the a cooling medium inlet flows into the closed space formed by the single plate and the inner wall of the casing, flows through the device on the single board, and flows out through the cooling medium outlet, and the plurality of devices are disposed on the single board;
- the baffle is provided with a partition plate in a direction perpendicular to the veneer.
- the baffle separates the veneer into a first portion and a second portion, and a passage port is formed between the first portion and the second portion; the cooling medium flows from the inlet of the cooling medium a portion, after flowing through the first portion of the device, flows into the second portion through the through port, flows through the second portion of the device, and then flows out from the cooling medium outlet;
- the veneer is further provided with a flow guiding mechanism for diverting the cooling medium flowing from the inlet of the cooling medium into the first portion so that part of the cooling medium is directly introduced into the second portion.
- the board is usually a printed circuit board (PCB).
- the board is provided with multiple devices, such as various integrated circuit (IC) chips, heat sinks, connectors, and the like.
- the separator may be a flat plate structure or a curved structure.
- the partition plate is disposed on the single board and disposed in a direction perpendicular to the single board (including approximately vertical), and the board is divided into a first part and a second part, and the device included in the first part and the device included in the second part are divided into the partition On both sides.
- the edge of the board may be connected to the inner wall of the housing.
- the edge of the board may be connected to the inner wall of the housing.
- the partition provided on the board may be connected to the housing at the top so that the sides of the partition are completely separated along the extending direction of the partition;
- the board is usually placed horizontally in actual use, and the partition provided on the board may be connected to the housing at the top or not to the housing.
- the cooling medium may specifically be a cooling gas or a cooling liquid.
- the cooling medium inlet may be disposed on the housing adjacent to the first portion such that the cooling medium enters the first portion through the cooling medium inlet to cool and cool the first portion of the device.
- an end of the partition near the inlet of the cooling medium may be connected to the inner wall of the casing, and an end of the partition away from the inlet of the cooling medium may have a gap with the inner wall of the casing, so that the gap is the first part and The passage between the second part.
- the cooling medium flows from the inlet of the cooling medium into the first portion. After passing through the first portion of the device, the cooling medium can flow from the passage to the second portion to cool and cool the second portion of the device.
- both ends of the partition plate and the single plate are connected to the inner wall of the casing, and the passage between the first portion and the second portion may be disposed on the partition and may be located at the partition.
- the cooling medium flows from the inlet of the cooling medium into the first portion. After passing through the first portion of the device, the cooling medium can flow into the second portion through the through port provided on the partition to cool and cool the second portion of the device.
- the cooling medium outlet may be disposed on the housing adjacent to the second portion, and the cooling medium enters the second portion from the passage opening, flows through the second portion of the device, and exits the housing from the cooling medium outlet.
- a flow guiding mechanism may be disposed on the single board, and the flow guiding mechanism is configured to directly introduce a portion of the cooling medium flowing from the cooling medium inlet into the first portion into the second portion.
- the flow guiding mechanism can be vertically disposed with the single board (including approximately vertical) Straight setting), the cooling medium flowing in from the cooling medium inlet is shunted in a direction parallel to the veneer, and a part of the cooling medium is directly introduced into the second portion.
- the flow guiding mechanism can also be disposed at an angle to the veneer in a vertical direction, so that a part of the cooling medium is directly introduced into the second portion.
- the cooling medium for splitting as shown in Fig. 1, the flow guiding mechanism 1 may be provided as a plate-like structure or as a curved structure. One end may be disposed near the inlet 2 of the cooling medium, and the other end may be connected to the partition 4 at a position close to the passage opening 3, and the partition 4 may be provided with one or more spouts 41.
- the cooling medium After the cooling medium enters the inner cavity of the casing 5 from the cooling medium inlet 2, under the action of the flow guiding mechanism 1, the cooling medium is divided into two parts, and a part of the cooling medium enters between the flow guiding mechanism 1 and the partition 4, and can pass through The spout 41 on the plate 4 directly enters the second portion; another portion of the cooling medium flows through the first portion of the device and enters the second portion from the passage port 3.
- a part of the cooling medium first cools and cools the device of the first part, and then enters the second part from the through port 3 to cool and cool the second part of the device;
- the medium enters between the flow guiding mechanism 1 and the partition 4, and directly enters the second portion through the nozzle 41 on the partition 4, and directly cools and cools the device of the second portion, thereby facilitating heat dissipation of the second portion of the device on the single board.
- the second portion of the device is cooled and cooled from the cooling medium entering the second portion through the port 3, and directly entering the second portion of the cooling medium through the spout 41 on the partition 4, and then exiting the casing 5 from the cooling medium outlet 6.
- a spoiler 7 may be disposed on the flow guiding mechanism 1 near one end of the through port 3.
- the spoiler 7 may be a plate structure or a curved structure.
- the baffle 7 can block the flow of the cooling medium passing through the second portion after passing through the device of the first portion and the cooling medium introduced into the second portion through the nozzle 41 on the partition 4, thereby avoiding passage through the partition 4.
- the spout 41 is introduced into the second portion of the cooling medium, and the temperature rises under the action of the cooling medium flowing into the second portion through the port 3, affecting the cooling and cooling effect on the second portion of the device.
- the cooling medium entering from the cooling medium inlet 2 can be effectively branched, and between the flow guiding mechanism 1 and the partition 4, close to the single board 8 at the through opening 3.
- a circulation pump 9 is provided to accelerate the introduction of a portion of the cooling medium between the partition plate 4 and the flow guiding mechanism 1.
- the present invention also provides another embodiment in which the flow guiding mechanism divides the cooling medium flowing from the cooling medium inlet in a direction parallel to the single plate.
- the flow guiding mechanism 1 may include the drainage portion 11 and The flow guiding portion 12, wherein: the drainage portion 11 and the flow guiding portion 12 may be disposed around the periphery of the partition 4, and at least one opening 121 may be disposed on the flow guiding portion 12;
- the bow I flow portion 11 may be disposed on the side of the partition near the first portion, and under the action of the drain portion 11, a portion of the cooling medium flowing from the cooling medium inlet 2 into the first portion is introduced between the partition plate 4 and the flow guiding portion 12, A portion of the cooling medium is introduced into the second portion through the orifice 121.
- the flow guiding portion 12 may be disposed on the side of the partition adjacent to the second portion for introducing a portion of the cooling medium between the partition 4 and itself into the second portion through the orifice 121.
- the drain portion 11 and the flow guiding portion 12 may be a flat plate structure or a curved surface structure. It can be seen that after the cooling medium enters the inner cavity of the casing 5 from the cooling medium inlet 2, under the action of the drainage portion 11, the cooling medium is divided into two parts, and a part of the cooling medium enters between the drainage portion 11 and the partition 4, and further Entering between the flow guiding portion 12 and the partition 4, and directly entering the second portion from the air opening 121 on the flow guiding portion 12, the portion of the cooling medium passes between the flow guiding mechanism 1 and the partition 4, and directly enters the space through the air opening 121. In the second part, the device of the second part is directly cooled and cooled, thereby facilitating heat dissipation of the second part of the device.
- the cooling medium first cools the first part of the device, then enters the second part from the through port 3, and the second part Some of the devices are cooled and cooled.
- a baffle 7 may also be disposed on the flow guiding portion 12 near the end of the through port 3.
- the baffle 7 may block the flow of the first portion of the device and then flow into the second portion of the cooling medium through the port 3, and The cooling medium introduced into the second portion through the orifice 121 merges. Thereby, the introduction of the second portion of the cooling medium through the air port 121 is avoided, and the temperature rises under the action of the cooling medium flowing into the second portion through the port 3, which affects the cooling and cooling effect on the second portion of the device.
- the cooling medium entering from the cooling medium inlet 2 can be effectively branched, and between the flow guiding mechanism 1 and the partition 4 , the single board 8 near the through opening 3 can be A circulation pump 9 is provided to accelerate the introduction of a portion of the cooling medium between the partition plate 4 and the flow guiding portion 12.
- the high-power devices included in the first part and the second part may be optionally disposed on the board 8
- the position near the cooling medium inlet 2 (which can be understood as being placed as far as possible upstream of the cooling medium) is advantageous for cooling and cooling of the high power consumption device.
- the low-power devices included in the first portion and the second portion may be disposed on the single board 8 near the cooling medium outlet 6 (may be disposed as far as possible downstream of the cooling medium).
- the single-plate cooling device provided in this embodiment is provided with a flow guiding mechanism on the single board, and a part of the cooling medium of the first part separated from the inlet of the cooling medium into the partition is directly introduced into the second part separated by the partition.
- the flow guiding mechanism can divert the cooling medium flowing from the cooling medium inlet in a direction parallel to the single board, so that part of the cooling medium entering the inner cavity of the housing is directly introduced into the second part, because the direct introduction is performed. Part of the cooling medium temperature has not risen, thus facilitating heat dissipation from the second part of the board.
- the flow guiding mechanism may be disposed in parallel with the single board (including approximately parallel arrangement), and the cooling medium flowing from the cooling medium inlet may be shunted in a direction perpendicular to the single board to partially cool the medium. Directly import the second part.
- the flow guiding mechanism can also be disposed at an angle with the single plate in a parallel direction, and the cooling medium flowing from the cooling medium inlet can be shunted in the vertical direction of the single plate, and the partial cooling medium can be directly introduced. the second part.
- FIG. 3 is a side view of the single board cooling device in the embodiment.
- 4 is a top view of the single-plate cooling device in the implementation scenario, the flow guiding mechanism 1 is divided into an upper portion 13 and a lower portion 14 in a direction parallel to the single plate 8, the upper portion 13 is connected to the casing 5, and the lower portion 14 is separated from the casing
- the plate 4 is connected, and the partition 4 is provided with an opening 42;
- the upper portion 13 may flow a portion of the cooling medium from the cooling medium inlet 2 into the inner cavity of the casing 5, and introduce a first portion between the upper portion 13 and the top of the casing 5; the lower portion 14 may flow from the cooling medium inlet 2 into the casing.
- a portion of the cooling medium within the interior of the body 5 enters the opening 42 through the lower portion 14 and the bottom of the housing 5 and enters the second portion through the opening 42. It can be seen that after the cooling medium enters the inner cavity of the casing 5 from the cooling medium inlet 2, under the action of the flow guiding mechanism 1, the cooling medium is branched into two parts in a direction parallel to the veneer 8, and a part of the cooling medium passes through A portion 13 is introduced between the portion 13 and the top of the casing 5, and after flowing through the device of the first portion, enters the second portion from the passage port 3, and the portion of the cooling medium first cools and cools the device of the first portion, and then passes through the port 3 Into the second part, the second part of the device is cooled and cooled; another part of the cooling medium enters the opening 42 through the lower part 14 and the bottom of the housing 5, and enters the second part through the opening 42, the part of the cooling medium passes The opening 42 enters the second portion to directly cool and cool the second portion of the device, thereby
- the high-power devices included in the first portion and the second portion may be disposed on the single board 8 corresponding to the lower portion 14 of the flow guiding mechanism 1, or may be in the first portion and the second portion.
- the included high power consumption device is disposed on the single board 8 near the cooling medium inlet 2, thereby facilitating cooling and cooling of the high power consumption device.
- the low-power devices included in the first portion and the second portion can be disposed on the single board 8 at a position close to the cooling medium outlet 6.
- the single-plate cooling device provided in this embodiment is provided with a flow guiding mechanism on the single board, and a part of the cooling medium of the first part separated from the inlet of the cooling medium into the partition is directly introduced into the second part separated by the partition.
- the flow guiding mechanism can divert the cooling medium flowing from the cooling medium inlet in a direction perpendicular to the single board, so that a part of the cooling medium entering the inner cavity of the housing is directly introduced into the second part, because the second direct introduction Part of the cooling medium temperature has not risen, thus facilitating heat dissipation from the second part of the board.
- the embodiment of the present invention further provides an information device, including: at least one single board cooling device; the information device provided by the present invention may be various devices in the field of information and communication, for example: various services And so on.
- the single-board cooling device includes: a casing and a single plate, wherein the inner wall of the single plate and the casing form a closed space, and the casing is provided with a cooling medium inlet and a cooling medium outlet, and a plurality of devices are disposed on the single board;
- the baffle is provided with a partition plate in a direction perpendicular to the veneer.
- the baffle separates the veneer into a first portion and a second portion, and a passage port is formed between the first portion and the second portion; the cooling medium flows from the inlet of the cooling medium a portion, after flowing through the first portion of the device, flows into the second portion through the through port, flows through the second portion of the device, and then flows out from the cooling medium outlet;
- the veneer is further provided with a flow guiding mechanism for diverting the cooling medium flowing from the inlet of the cooling medium into the first portion so that part of the cooling medium is directly introduced into the second portion.
- the information device provided in this embodiment is provided with a flow guiding mechanism on the single board, and a part of the cooling medium of the first part separated from the inlet of the cooling medium into the partition is directly introduced into the second part separated by the partition, because The temperature of the cooling medium introduced directly into the second part has not risen, thus facilitating heat dissipation of the second part of the board.
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Abstract
本发明实施例涉及一种单板冷却装置和信息设备。单板冷却装置包括:壳体(5)和单板(8),单板(8)与壳体(5)内壁形成封闭空间,壳体(5)上设有冷却介质入口(2)和冷却介质出口(6),单板(8)上设有多个器件;单板(8)上在与单板(8)垂直的方向上设有隔板(4),隔板(4)将单板(8)隔离成第一部分和第二部分,第一部分与第二部分之间具有通过口(3);冷却介质从冷却介质入口(2)流入第一部分,流经第一部分的器件后经由通过口(3)流入第二部分,流经第二部分的器件后从冷却介质出口(6)流出;单板(8)上还设有导流机构(1),导流机构(1)用于将从冷却介质入口(2)流入第一部分的冷却介质分流,以使部分冷却介质直接导入第二部分。本发明实施例提供的单板冷却装置和信息设备,利于单板上器件的散热。
Description
单板冷却装置和信息设备
技术领域 本发明实施例涉及信息技术领域, 特别涉及一种单板冷却装置和信息 设备。 背景技术
目前, 信息、通信技术 ( Information Communication Technology, ICT ) 设备主要釆用风冷进行散热。 随着 ICT设备热密度的提高, 水冷技术开始 得到应用。
现有技术中, 釆用隔板将处于封闭壳体内部的单板上的器件分为两部 分, 冷却液从隔板的一侧进入壳体, 对位于隔板该侧的单板上的器件进行 冷却后流入隔板的另一侧, 再对位于隔板另一侧的单板上的器件进行冷 却。 然而, 冷却液进入隔板的另一侧时, 其温度已经升高, 因此, 会影响 位于隔板另一侧的单板上的器件的散热。 发明内容
本发明实施例提供一种单板冷却装置和信息设备, 提高单板上器件的 散热效果。
一方面, 本发明实施例提供了一种单板冷却装置, 包括: 壳体和单板, 所述单板与所述壳体内壁形成封闭空间, 所述壳体上设有冷却介质入口和冷 却介质出口, 冷却介质通过所述冷却介质入口流入所述单板与所述壳体内壁 形成的封闭空间, 流经所述单板上的器件后通过所述冷却介质出口流出, 所 述单板上设有多个器件;
所述单板上在与所述单板垂直的方向上设有隔板, 所述隔板将所述单板 隔离成第一部分和第二部分,所述第一部分与所述第二部分之间具有通过口; 冷却介质从所述冷却介质入口流入所述第一部分, 流经所述第一部分的器件 后经由所述通过口流入所述第二部分, 流经所述第二部分的器件后从所述冷 却介质出口流出;
所述单板上还设有导流机构, 所述导流机构用于将从所述冷却介质入口 流入所述第一部分的冷却介质分流, 以使部分冷却介质直接导入所述第二部 分。
另一方面, 本发明实施例还提供一种信息设备, 包括: 至少一个上述所 述的单板冷却装置;
本发明实施例提供的单板冷却装置和信息设备, 通过在单板上设置导 流机构 , 将从冷却介质入口进入隔板所隔离成的第一部分的一部分冷却介 质, 直接导入隔板所隔离成的第二部分, 由于直接导入第二部分的冷却介 质温度尚未升高, 因此, 利于单板上的器件散热。
附图说明
实施例或现有技术描述中所需要使用的附图作简单地介绍, 显而易见地, 下面描述中的附图仅仅是本发明的一些实施例, 对于本领域普通技术人员 来讲, 在不付出创造性劳动的前提下, 还可以根据这些附图获得其他的附 图。 图 1为本发明提供的单板冷却装置又一个实施例的结构示意图; 图 2为本发明提供的单板冷却装置另一个实施例的结构示意图; 图 3为本发明提供的单板冷却装置另一个实施例的侧视图;
图 4为本发明提供的单板冷却装置另一个实施例的俯视图。
具体实施方式 为使本发明实施例的目的、 技术方案和优点更加清楚, 下面将结合本 发明实施例中的附图, 对本发明实施例中的技术方案进行清楚、 完整地描 述,显然, 所描述的实施例是本发明一部分实施例, 而不是全部的实施例。 基于本发明中的实施例, 本领域普通技术人员在没有做出创造性劳动前提 下所获得的所有其他实施例, 都属于本发明保护的范围。
本发明提供的单板冷却装置一个实施例, 该装置包括: 壳体和单板, 单 板与壳体内壁形成封闭空间, 壳体上设有冷却介质入口和冷却介质出口, 冷 却介质通过所述冷却介质入口流入所述单板与所述壳体内壁形成的封闭空 间, 流经所述单板上的器件后通过所述冷却介质出口流出, 单板上设有多个 器件;
单板上在与单板垂直的方向上设有隔板, 隔板将单板隔离成第一部分和 第二部分, 第一部分与第二部分之间具有通过口; 冷却介质从冷却介质入口 流入第一部分, 流经第一部分的器件后经由通过口流入第二部分, 流经第二 部分的器件后从冷却介质出口流出;
单板上还设有导流机构, 导流机构用于将从冷却介质入口流入第一部分 的冷却介质分流, 以使部分冷却介质直接导入第二部分。
其中, 单板通常为印刷电路板 ( Printed Circuit Board, PCB ) , 单板 上设有多个器件, 例如: 各种集成电路( Integrated Circuit , IC ) 芯片、 散热器、 连接器等器件。 隔板可以为平板结构, 也可以为曲面结构。 隔板设 置在单板上且设置方向与单板垂直(也包括近似垂直) , 将单板分为第一部 分和第二部分, 第一部分包括的器件和第二部分包括的器件分为位于隔板的 两侧。
可选的, 单板的边缘(例如方形单板的四个边)可以与壳体的内壁连接,
以使壳体内壁与单板之间形成封闭空间; 或者, 单板上设置各种器件的表面 可以与壳体的边缘连接, 以使壳体内壁与单板之间形成封闭空间。 如果单板 在实际使用当中通常竖直放置, 那么单板上设置的隔板, 其顶部可以与壳体 连接, 使隔板两侧在沿着隔板的延展方向上完全隔离开来; 如果单板在实际 使用当中通常水平放置, 那么单板上设置的隔板, 其顶部可以与壳体连接, 也可以不与壳体连接。
冷却介质具体可以是冷却气体, 也可以是冷却液体。 冷却介质入口可以 设置在壳体上靠近第一部分的位置, 从而使冷却介质通过冷却介质入口进入 第一部分, 对第一部分的器件进行冷却降温。
作为一种可行的实施方式, 隔板靠近冷却介质入口的一端可以与壳体的 内壁连接, 隔板远离冷却介质入口的一端可以与壳体的内壁之间具有缝隙, 使该缝隙作为第一部分和第二部分之间的通过口。 冷却介质从冷却介质入口 流入第一部分, 在经过第一部分的器件后, 冷却介质可以从该通过口流入第 二部分, 对第二部分的器件进行冷却降温。 作为另一种可行的实施方式, 隔 板与单板平行方向的两端都与壳体的内壁连接, 而第一部分与第二部分之间 的通过口可以设置在隔板上,并且可以位于隔板上远离冷却介质入口的一端。 类似的, 冷却介质从冷却介质入口流入第一部分, 在经过第一部分的器件后, 冷却介质可以通过设置在隔板上的通过口流入第二部分, 对第二部分的器件 进行冷却降温。
冷却介质出口可以设置在壳体上靠近第二部分的位置, 冷却介质从通过 口进入第二部分, 流经第二部分的器件后, 从冷却介质出口流出壳体。
由于从通过口流入第二部分的冷却介质, 已流经单板的第一部分, 冷却 介质的温度会升高, 影响对第二部分器件的冷却降温效果。 本发明实施例中, 可以在单板上设置导流机构, 该导流机构用于将从冷却介质入口流入第一部 分的部分冷却介质直接导入第二部分。
作为一种可行的实施方式, 导流机构可以与单板垂直设置 (包括近似垂
直设置) , 在与单板平行的方向上将从冷却介质入口流入的冷却介质进行分 流, 使部分冷却介质直接导入第二部分。
可以理解的是, 导流机构还可以与单板在垂直方向上成一定角度设置, 流, 从而使部分冷却介质直接导入第二部分。 的冷却介质进行分流的一个实施例, 如图 1所示, 导流机构 1可以设置为板状 结构,也可以设置为曲面结构。其一端可以设置在靠近冷却介质入口 2的位置, 另一端可以在靠近通过口 3的位置与隔板 4连接,隔板 4上可以设置一个或多个 喷口 41。冷却介质从冷却介质入口 2进入壳体 5内腔后,在导流机构 1的作用下, 将冷却介质分流为两部分, 一部分冷却介质进入导流机构 1与隔板 4之间, 可 以通过隔板 4上的喷口 41直接进入第二部分; 另一部分冷却介质流经第一部分 的器件后, 从通过口 3进入第二部分。 可以看出, 在导流机构 1的作用下, 一 部分冷却介质先对第一部分的器件进行冷却降温后 ,再从通过口 3进入第二部 分, 对第二部分的器件进行冷却降温; 另一部分冷却介质进入导流机构 1与隔 板 4之间, 通过隔板 4上的喷口 41直接进入第二部分, 直接对第二部分的器件 进行冷却降温 , 从而利于单板上第二部分的器件散热。
从通过口 3进入第二部分的冷却介质, 以及通过隔板 4上的喷口 41直接进 入第二部分的冷却介质对第二部分器件进行冷却降温后, 从冷却介质出口 6 流出壳体 5。
可选的, 可以在导流机构 1上靠近通过口 3的一端设置阻流板 7, 阻流板 7 可以为板状结构, 也可以为曲面结构。 该阻流板 7可以阻碍流经第一部分的器 件后经由通过口 3流入第二部分的冷却介质与通过隔板 4上的喷口 41导入第二 部分的冷却介质合流,从而避免通过隔板 4上的喷口 41导入第二部分的冷却介 质, 在经由通过口 3流入第二部分的冷却介质的作用下温度升高, 影响对第二 部分器件的冷却降温效果。
可选的, 为了配合导流机构, 实现有效地对从冷却介质入口 2进入的冷却 介质进行分流, 还可以在导流机构 1与隔板 4之间, 靠近通过口 3处的单板 8上 设有循环泵 9, 以使部分冷却介质加速导入隔板 4与导流机构 1之间。
本发明还提供一种导流机构在与单板平行的方向上将从冷却介质入口流 入的冷却介质进行分流的另一个实施例, 如图 2所示, 导流机构 1可以包括引 流部分 11和导流部分 12 , 其中: 引流部分 11和导流部分 12可以围设在隔板 4 的***, 导流部分 12上可以设置至少一个孔口 121 ;
弓 I流部分 11可以设置在靠近第一部分的隔板一侧, 在引流部分 11的作用 下, 将从冷却介质入口 2流入第一部分的部分冷却介质导入隔板 4与导流部分 12之间, 以使部分冷却介质通过孔口 121导入第二部分。
导流部分 12可以设置在靠近第二部分的隔板一侧,用于将隔板 4与其本身 之间的部分冷却介质通过孔口 121导入第二部分。
其中, 引流部分 11和导流部分 12可以为平板结构, 也可以为曲面结构。 可以看出, 冷却介质从冷却介质入口 2进入壳体 5内腔后, 在引流部分 11的作 用下, 将冷却介质分流为两部分, 一部分冷却介质进入引流部分 11与隔板 4 之间, 进而进入导流部分 12与隔板 4之间, 并从导流部分 12上的空口 121直接 进入第二部分, 这部分冷却介质经由导流机构 1与隔板 4之间, 通过空口 121 直接进入第二部分, 从而实现直接对第二部分的器件进行冷却降温, 从而利 于单板上第二部分的器件散热。而另一部分冷却介质流经第一部分的器件后 , 从通过口 3进入第二部分,这部分冷却介质先对第一部分的器件进行冷却降温 后, 再从通过口 3进入第二部分, 对第二部分的器件进行冷却降温。
可选的, 也可以在导流部分 12上靠近通过口 3的一端设置阻流板 7 , 阻流 板 7可以阻碍流经第一部分的器件后经由通过口 3流入第二部分的冷却介质, 与通过孔口 121导入第二部分的冷却介质合流。 从而避免通过空口 121导入第 二部分的冷却介质,在经由通过口 3流入第二部分的冷却介质的作用下温度升 高, 影响对第二部分器件的冷却降温效果。
可选的, 为了配合导流机构 1 , 实现有效地对从冷却介质入口 2进入的冷 却介质进行分流, 还可以在导流机构 1与隔板 4之间, 靠近通过口 3处的单板 8 上设置循环泵 9 , 以使部分冷却介质加速导入隔板 4与导流部分 12之间。
由于冷却介质入口 2处的冷却介质温度通常要低于单板 8的其他位置, 因 此, 可选的, 可以将第一部分和第二部分中所包括的高功耗器件, 设置在单 板 8上靠近冷却介质入口 2的位置(可以理解为尽量设置在冷却介质的上游), 从而有利于高功耗器件的冷却降温。
相应的, 可以将第一部分和第二部分中包括的低功耗器件, 设置在单板 8 上靠近冷却介质出口 6的位置(可以为尽量设置在冷却介质的下游) 。
本实施例提供的单板冷却装置, 通过在单板上设置导流机构, 将从冷却 介质入口进入隔板所隔离成的第一部分的一部分冷却介质, 直接导入隔板所 隔离成的第二部分。 可选的, 可以将导流机构在与单板平行的方向上将从冷 却介质入口流入的冷却介质进行分流, 从而将进入壳体内腔的部分冷却介质 直接导入第二部分, 由于直接导入第二部分的冷却介质温度尚未升高, 因此, 利于单板上第二部分的器件散热。
作为另一种可行的实施方式, 导流机构可以与单板平行设置 (包括近似 平行设置) , 可以在与单板垂直的方向上将从冷却介质入口流入的冷却介质 进行分流, 使部分冷却介质直接导入第二部分。
可以理解的是, 导流机构还可以与单板在平行方向上成一定角度设置, 仍然可以实现在单板垂直的方向上将从冷却介质入口流入的冷却介质进行分 流, 使部分冷却介质直接导入第二部分。
本发明提供一种导流机构在与单板垂直的方向上将从冷却介质入口流入 的冷却介质进行分流的一个实施例,图 3所示为该实施场景下单板冷却装置的 侧视图, 图 4为该实施场景下单板冷却装置的俯视图, 导流机构 1在与单板 8 平行的方向上分为上部分 13和下部分 14 , 上部分 13与壳体 5连接, 下部分 14 与隔板 4连接, 隔板 4上设有开孔 42;
其中,上部分 13可以将从冷却介质入口 2流入壳体 5内腔的部分冷却介质, 通过上部分 13与壳体 5顶部之间导入第一部分;下部分 14可以将从冷却介质入 口 2流入壳体 5内腔的部分冷却介质,通过下部分 14与壳体 5底部之间进入开孔 42 , 并通过开孔 42进入第二部分。 可以看出, 冷却介质从冷却介质入口 2进入 壳体 5内腔后, 在导流机构 1的作用下, 将冷却介质在与单板 8平行的方向上分 流为两部分, 一部分冷却介质通过上部分 13与壳体 5顶部之间导入第一部分, 流经第一部分的器件后, 从通过口 3进入第二部分, 这部分冷却介质先对第一 部分的器件进行冷却降温后, 再从通过口 3进入第二部分, 对第二部分的器件 进行冷却降温; 另一部分冷却介质通过下部分 14与壳体 5底部之间进入开孔 42 , 并通过开孔 42进入第二部分, 这部分冷却介质通过开孔 42进入第二部分 实现直接对第二部分的器件进行冷却降温, 从而利于单板上第二部分的器件 散热。
可选的, 可以将第一部分和第二部分中包括的高功耗器件, 设置在与导 流机构 1的下部分 14对应的单板 8上, 或者, 还可以将第一部分和第二部分中 包括的高功耗器件, 设置在单板 8上靠近冷却介质入口 2的位置上, 从而有利 于高功耗器件的冷却降温。
相应的, 可以将第一部分和第二部分中包括的低功耗器件, 设置在单板 8 上靠近冷却介质出口 6的位置上。
本实施例提供的单板冷却装置, 通过在单板上设置导流机构, 将从冷却 介质入口进入隔板所隔离成的第一部分的一部分冷却介质, 直接导入隔板所 隔离成的第二部分。 可选的, 可以将导流机构在与单板垂直的方向上将从冷 却介质入口流入的冷却介质进行分流, 从而将进入壳体内腔的部分冷却介质 直接导入第二部分, 由于直接导入第二部分的冷却介质温度尚未升高, 因此, 利于单板上第二部分的器件散热。
本发明实施例还提供一种信息设备, 包括: 至少一个单板冷却装置; 本 发明提供的信息设备, 可以是信息和通信领域的各种设备, 例如: 各种服务
器等。
该单板冷却装置包括: 壳体和单板, 单板和壳体的内壁形成封闭空间, 壳体上设有冷却介质入口和冷却介质出口单板上设有多个器件;
单板上在与单板垂直的方向上设有隔板, 隔板将单板隔离成第一部分和 第二部分, 第一部分与第二部分之间具有通过口; 冷却介质从冷却介质入口 流入第一部分, 流经第一部分的器件后经由通过口流入第二部分, 流经第二 部分的器件后从冷却介质出口流出;
单板上还设有导流机构, 导流机构用于将从冷却介质入口流入第一部分 的冷却介质分流, 以使部分冷却介质直接导入第二部分。
另外, 单板冷却装置的具体结构和功能可以参见本发明提供的单本冷却 装置实施例, 在此不再赘述。
本实施例提供的信息设备, 通过在单板上设置导流机构, 将从冷却介质 入口进入隔板所隔离成的第一部分的一部分冷却介质, 直接导入隔板所隔离 成的第二部分, 由于直接导入第二部分的冷却介质温度尚未升高, 因此, 利 于单板上第二部分的器件散热。
最后应说明的是: 以上实施例仅用以说明本发明的技术方案, 而非对 其限制; 尽管参照前述实施例对本发明进行了详细的说明, 本领域的普通 技术人员应当理解: 其依然可以对前述各实施例所记载的技术方案进行修 改, 或者对其中部分技术特征进行等同替换; 而这些修改或者替换, 并不 使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。
Claims
1、 一种单板冷却装置, 其特征在于, 包括: 壳体和单板, 所述单板 与所述壳体内壁形成封闭空间, 所述壳体上设有冷却介质入口和冷却介质 出口, 冷却介质通过所述冷却介质入口流入所述单板与所述壳体内壁形成 的封闭空间, 流经所述单板上的器件后通过所述冷却介质出口流出, 所述 单板上设有多个器件;
所述单板上在与所述单板垂直的方向上设有隔板, 所述隔板将所述单 板隔离成第一部分和第二部分, 所述第一部分与所述第二部分之间具有通 过口; 冷却介质从所述冷却介质入口流入所述第一部分, 流经所述第一部 分的器件后经由所述通过口流入所述第二部分, 流经所述第二部分的器件 后从所述冷却介质出口流出;
所述单板上还设有导流机构, 所述导流机构用于将从所述冷却介质入 口流入所述第一部分的冷却介质分流, 以使部分所述冷却介质直接导入所 述第二部分。
2、 根据权利要求 1 所述的单板冷却装置, 其特征在于, 所述隔板靠 近所述冷却介质入口的一端与所述壳体的内壁连接, 所述隔板远离所述冷 却介质入口的一端与所述壳体的内壁之间具有缝隙, 所述缝隙为所述通过 口;
或者,
所述隔板靠近所述冷却介质入口的一端与所述壳体的内壁连接, 所述 隔板远离所述冷却介质入口的一端与所述壳体的内壁连接, 所述通过口设 置在所述隔板上且位于所述隔板上远离所述冷却介质入口的一端。
3、 根据权利要求 1或 2所述的单板冷却装置, 其特征在于, 所述导 流机构与所述单板垂直设置, 用于在与所述单板平行的方向上将从所述冷 却介质入口流入的冷却介质进行分流, 以使部分冷却介质直接导入所述第 二部分。
4、 根据权利要求 3 所述的单板冷却装置, 其特征在于, 所述导流机 构上靠近所述通过口的一端设有阻流板, 所述阻流板用于阻碍流经所述第 一部分的器件后经由所述通过口流入所述第二部分的冷却介质与通过所 述孔口导入所述第二部分的冷却介质合流。
5、 根据权利要求 3或 4所述的单板冷却装置, 其特征在于, 所述导 流机构的一端设置在靠近所述冷却介质入口的位置, 另一端在靠近所述通 过口处与所述隔板连接; 所述隔板上设有至少一个喷口;
所述导流机构用于将从所述冷却介质入口流入所述第一部分的部分 冷却介质导入所述导流机构与所述隔板之间, 以使所述部分冷却介质通过 所述喷口进入所述第二部分。
6、 根据权利要求 3或 4所述的单板冷却装置, 其特征在于, 所述导 流机构包括引流部分和导流部分, 所述引流部分和所述导流部分围设在所 述隔板的***, 所述导流部分上具有至少一个孔口;
所述引流部分设置在靠近所述第一部分的隔板一侧, 用于将所述从所 述冷却介质入口流入所述第一部分的部分冷却介质导入所述隔板与所述 导流部分之间;
所述导流部分设置在靠近所述第二部分的隔板一侧, 用于将所述隔板 与其本身之间的部分冷却介质通过所述孔口导入所述第二部分。
7、 根据权利要求 3至 6任一项所述的单板冷却装置, 其特征在于, 所述导流机构与所述隔板之间, 靠近所述通过口处的所述单板上设有循环 泵, 以使所述部分冷却介质加速导入所述隔板与所述导流部分之间。
8、 根据权利要求 1或 2所述的单板冷却装置, 其特征在于, 所述导 流机构与所述单板平行设置, 用于在与所述单板垂直的方向上将从所述冷 却介质入口流入的冷却介质进行分流, 以使部分冷却介质直接导入所述第 二部分。
9、 根据权利要求 8 所述的单板冷却装置, 其特征在于, 所述导流机 构在与所述单板垂直的方向上分为上部分和下部分, 所述上部分与所述壳 体连接, 所述下部分与所述隔板连接, 所述隔板上设有开孔;
所述上部分用于将从所述冷却介质入口流入所述壳体内腔的部分冷 却介质, 通过所述上部分与所述壳体顶部之间导入所述第一部分; 所述下 部分用于将从所述冷却介质入口流入所述壳体内腔的部分冷却介质, 通过 所述下部分与所述壳体底部之间进入所述开孔, 并通过所述开孔进入所述 第二部分。
10、 根据权利要求 9所述的单板冷却装置, 其特征在于, 所述第一部 分和所述第二部分中包括的高功耗器件, 设置在与所述导流机构的下部分 对应的单板上。
1 1、 根据权利要求 1-9任一项所述的单板冷却装置, 其特征在于, 所 述第一部分和所述第二部分中包括的高功耗器件, 设置在所述单板上靠近 所述冷却介质入口的位置。
12、 根据权利要求 1-9任一项所述的单板冷却装置, 其特征在于, 所 述第一部分和所述第二部分中包括的低功耗器件, 设置在所述单板上靠近 所述冷却介质出口的位置。
13、 一种信息设备, 其特征在于, 包括至少一个如权利要求 1-12任一 项所述的单板冷却装置。
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TWI662608B (zh) * | 2017-08-31 | 2019-06-11 | 荷蘭商Asm知識產權私人控股有限公司 | 冷卻裝置、氣體供應裝置及基板處理裝置 |
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CN102638957B (zh) * | 2012-03-29 | 2015-04-08 | 华为技术有限公司 | 单板冷却装置和信息设备 |
US8767391B2 (en) | 2012-08-27 | 2014-07-01 | Futurewei Technologies, Inc. | Chassis with adjustable baffle for cooling |
CN105101749B (zh) * | 2015-06-24 | 2017-12-22 | 华为技术有限公司 | 一种通信设备 |
US11326837B2 (en) * | 2018-06-29 | 2022-05-10 | Dana Canada Corporation | Heat exchanger with internal manifold structure |
CN112466827A (zh) * | 2020-12-04 | 2021-03-09 | 西安中车永电捷通电气有限公司 | 冷却装置、控制设备及轨道列车 |
KR20230132124A (ko) * | 2022-03-08 | 2023-09-15 | 엘에스일렉트릭(주) | 유로 모듈 및 이를 포함하는 전력 기기 |
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US3524497A (en) * | 1968-04-04 | 1970-08-18 | Ibm | Heat transfer in a liquid cooling system |
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JP2995590B2 (ja) * | 1991-06-26 | 1999-12-27 | 株式会社日立製作所 | 半導体冷却装置 |
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JPH0494194A (ja) * | 1990-08-09 | 1992-03-26 | Nec Corp | 混成集積回路装置 |
CN101490841A (zh) * | 2006-07-11 | 2009-07-22 | 丰田自动车株式会社 | 冷却装置以及具有该冷却装置的车辆 |
CN102638957A (zh) * | 2012-03-29 | 2012-08-15 | 华为技术有限公司 | 单板冷却装置和信息设备 |
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TWI662608B (zh) * | 2017-08-31 | 2019-06-11 | 荷蘭商Asm知識產權私人控股有限公司 | 冷卻裝置、氣體供應裝置及基板處理裝置 |
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CN102638957A (zh) | 2012-08-15 |
US20130329362A1 (en) | 2013-12-12 |
US9307671B2 (en) | 2016-04-05 |
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