WO2013137517A1 - Solution isolante de dissipation thermique remplie dans un boîtier d'un dispositif d'éclairage à diodes électroluminescentes et dispositif d'éclairage à diodes électroluminescentes qui utilise cette dernière - Google Patents

Solution isolante de dissipation thermique remplie dans un boîtier d'un dispositif d'éclairage à diodes électroluminescentes et dispositif d'éclairage à diodes électroluminescentes qui utilise cette dernière Download PDF

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Publication number
WO2013137517A1
WO2013137517A1 PCT/KR2012/003538 KR2012003538W WO2013137517A1 WO 2013137517 A1 WO2013137517 A1 WO 2013137517A1 KR 2012003538 W KR2012003538 W KR 2012003538W WO 2013137517 A1 WO2013137517 A1 WO 2013137517A1
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WO
WIPO (PCT)
Prior art keywords
lighting device
liquid
silicone oil
led
heat
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Application number
PCT/KR2012/003538
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English (en)
Korean (ko)
Inventor
고정호
신종섭
박미옥
Original Assignee
(주)사람과나눔
주식회사 지앤씨
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Publication date
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Publication of WO2013137517A1 publication Critical patent/WO2013137517A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an insulated heat dissipation liquid filled in a housing of an LED lighting apparatus and an LED lighting apparatus using the same, which is excellent in heat dissipation and can solve the heat problem of the LED lighting apparatus at a low cost.
  • LED incandescent lamps are in the spotlight as low-power light bulbs capable of generating brightness similar to conventional incandescent lamps.
  • LED incandescent lamps which are used in various fields such as home lighting, office lighting, factory lighting, street lamps, picking lamps, landscape lighting, and lighting for leisure facilities, are driven by currents and voltages different from those of conventional incandescent lamps. There is a problem that all power facilities must be replaced. In addition, the LED incandescent lamp has a disadvantage in that the heat generated from the LED must be efficiently radiated.
  • a method has been proposed in which a heat dissipation liquid is filled in an LED lighting device to release heat generated by the LED with the heat dissipation liquid.
  • the heat dissipation liquid reacts with the substrate and rather deteriorates durability of the LED lighting device. Or, there was a problem exploding according to the heat of the LED.
  • transparency may be degraded, thereby preventing a desired luminance from being exhibited.
  • the present invention has been made to solve the above-mentioned problems. It is to provide insulating heat dissipation.
  • Insulating heat dissipation filled in the housing of the LED lighting device for absorbing and dissipating heat generated from the LED package of the LED lighting device is non-toxic and non-reactive with respect to the LED package.
  • a mixture of one or more of dimethyl silicone oil, methyl panyl silicone oil, and poly methyl hydrogen siloxane having a convective heat transfer coefficient of 15000-70000 (W / m 2 K) at 80 ° C. at 80 ° C.
  • the thermal conductivity of the insulating heat dissipating liquid may be 1.9 ⁇ 10 ⁇ 4-4.2 ⁇ 10 ⁇ 1 (Cal / cm ⁇ sec ⁇ ° C.).
  • the specific gravity of the insulating heat dissipating liquid may be 0.76-1.10 at 25 ° C.
  • the viscosity of the insulating heat-dissipating liquid can be from 25 °C, 0.65mm 2 / sec -10 6 mm 2 / sec.
  • the dimethyl silicone oil, methyl phenyl silicone oil, and polysilica may further include a liquid silica, to fill the pores between the molecules of the siloxane.
  • the refractive index of the insulating heat dissipating solution with respect to the sodium D line may be 1.374-1.392 or less at 2.0CS or less and 1.398-1.404 at 10CS or more.
  • the housing of the hollow structure the housing of the hollow structure; A light emitting diode package installed in the housing; A support structure for fixing the light emitting diode package and the power supply module; And a power supply module for supplying external AC power to the LED package. And a light-transmitting insulating heat dissipation liquid filling the housing of the cavity structure to impregnate the LED package and the power supply module in the housing to dissipate heat generated from the light-emitting diode package and the power supply module.
  • the LED lighting device may further include a lens attached to the front surface of the light emitting diode package to diffuse the light emitted from the LED.
  • the thermal conductivity of the insulating heat dissipating liquid may be 1.9 ⁇ 10 ⁇ 4-4.2 ⁇ 10 ⁇ 1 (Cal / cm ⁇ sec ⁇ ° C.).
  • the light-transmitting insulating heat dissipating liquid may further include liquid silica for filling voids between each molecule of the dimethyl silicone oil, methyl panyl silicone oil, and polymethyl hydrogen siloxane. Can be.
  • the manufacturing cost is low, it is non-toxic and environmentally friendly, and the heat dissipation efficiency is excellent because of high thermal conductivity and heat transfer coefficient, and chemically Since it is non-reactive with a board
  • FIG. 1 is a perspective view of a lighting apparatus according to an embodiment of the present invention.
  • the bulb type LED lighting device is described as an example of a lighting device filled with an insulating heat dissipating liquid, which is an embodiment of the present invention.
  • the present invention is not limited thereto, and a cylindrical (fluorescent lamp) LED lighting device or a flat panel is provided.
  • an insulating heat dissipation liquid which is an embodiment of the present invention, may be used in the type lighting device.
  • FIG. 1 is a perspective view showing an embodiment of a light emitting diode lighting apparatus according to the present invention. 1 shows a direct current type LED lighting device.
  • the LED lighting device includes a base 1, a housing 2, an AC power supply line 3, a power supply module 4, a DC power supply line 5, and a light emitting diode package 6. And a lens 7 and a heat dissipation liquid 9.
  • the base 1 has a spiral protrusion structure that can be coupled to a general incandescent lamp socket, and includes a power terminal capable of electrical connection with an external AC power source.
  • the material of the base 1 is an electrically conductive metal.
  • the bulb-shaped housing 2 is sealed to trap the heat dissipation solution 9 in the housing cavity 8, and is made of glass or plastic.
  • the housing 2 made of plastic has an advantage of minimizing damage caused by external impact.
  • the light-diffusing coating is applied to the inside or outside of the bulb-shaped housing 2, or the light-diffusion film is attached to the outside.
  • nano-patterns may be formed on the surface of the housing for light diffusion. Attaching the light diffusing film to the bulb-shaped housing 2 can minimize the scattering of the glass during external impact.
  • an enamel coated copper wire is mainly used as a power supply line for supplying the AC power supply module 4 with AC power supplied from the outside of the lighting apparatus according to the present invention.
  • the power supply module 4 is a device for supplying AC power supplied from the outside of the lighting device with DC power according to the characteristics of the light emitting diode package 6. As shown in FIG. 3, the AC-DC converter 11 and a constant DC power supply are provided. It is composed of a rectifier circuit 12 for supplying a voltage and a dimming circuit 13 for adjusting the brightness of the light by adjusting the current amount of the DC voltage.
  • the DC power lead-in line 5 is a power line for supplying the DC power supplied from the power supply module 4 to the light emitting diode package 6, and an enamel coated copper wire is mainly used.
  • the light emitting diode package 6 may be a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a chip on board (COB) in which one or more light emitting diodes are mounted according to lighting characteristics.
  • PCB printed circuit board
  • FPCB flexible printed circuit board
  • COB chip on board
  • the LED used in the LED package 6 mainly uses a white LED as a light emitting source, but red, blue, and green may be used individually or in combination according to lighting characteristics.
  • the lens 7 is mounted on the front surface of the light emitting diode package 6 and has a function of collecting or diffusing light from the light emitting diode package 6 according to lighting characteristics.
  • the lens 7 is made of plastic and used by attaching an optical film to the lens surface manufactured for light diffusion, or applying a light diffusing agent coating or a light diffusion nano pattern.
  • the support structure 40 fixes the LED package 6 and the power supply module 4. That is, the light emitting diode package 6 serves to prevent shaking of the power supply module 4.
  • the heat radiating solution 9 radiates heat generated from the power supply module 4 and the light emitting diode package 6 to the outside of the housing 2 and emits light emitted from the light emitting diode package 6 out of the housing 2. Has the function. Therefore, the heat radiating solution 9 should be equipped with all of heat dissipation, light transmittance, and electrical insulation.
  • the thermal conductivity as a heat transfer medium should be excellent, 2) the state of molecular transport to transfer the heat energy (that is, the viscosity of the liquid phase must be high in motion with temperature, and 3) the molecular structure at high temperature 4) Excellent chemical resistance, chemical resistance (non-reactive) that does not occur chemical reaction, corrosion, ion exchange, etc. with other devices, 5) Excellent light transmittance, no change in refractive index at high temperature, 6) Refractive index is controlled freely, and there should be no haze phenomenon that gel or foreign substance is generated by self-synthesis or self-crosslinking.
  • the heat dissipating solution 9 used in the present invention is a straight dimethylsilicone (dimetylsilicon oil), methylphenyl silicon oil (methylphenyl silicon oil) or polymethyl hydrogen of the polydimethylsiloxane (Polydemetylsiloxane) type siloxane) or a mixture of two or more thereof.
  • the thermal conductivity is not higher than that of a general metal, but due to the convection effect of doubling the energy transfer of molecular energy, the heat release effect to the external system becomes very high.
  • straight dimethylsilicone dimetylsilicon oil
  • methylphenylsilicone oil methylphenyl silicon oil
  • polymethyl hydrogen siloxane polymethyl hydrogen siloxane
  • the heat radiation solution 9 according to the present invention has a large convection effect (convetion effect) is significantly higher heat dissipation efficiency than other materials.
  • the thermal conductivity of the insulating heat dissipating solution 9 having the above-described configuration which is one embodiment of the present invention, has a range of 1.9 ⁇ 10 ⁇ 4-4.2 ⁇ 10 ⁇ 1 (Cal / cm ⁇ sec ⁇ ° C.).
  • the LED package when the operating temperature of the LED is more than 60 ° C. when the external temperature is 20 ° C., the LED package may be thermally shocked and its durability may be rapidly deteriorated.
  • Thermal conductivity is the ability of energy to move between molecules. The higher the thermal conductivity, the higher the heat generated by the LED package 6 and the power supply module 4. This thermal conductivity has a very close proportionality with the viscosity, and when the thermal conductivity becomes higher than the upper limit, the convective heat transfer coefficient rapidly deteriorates. In addition, when the thermal conductivity is lower than the lower limit, despite the heat transfer effect, the function as the heat medium is so weak that only meaningful convective transfer is achieved.
  • the heat discharge of the LED package 6 and the power supply module 4 is made smooth.
  • liquid silica which is an embodiment of the present invention.
  • Liquid silica is for filling the voids between each molecule of the dimethyl silicone oil, methyl panyl silicone oil, and polymethyl hydrogen siloxane.
  • the liquid silica may be contained in about 1-3% by weight. This is determined in consideration of the change in specific gravity with temperature.
  • Viscosity is related to the convective heat transfer effect and accounts for much more than the heat transfer rate in a liquid phase device, rather than one of the important components of heat transfer media.
  • Viscosity of the insulating heat dissipation solution 9 according to an embodiment of the present invention, the viscosity of the insulating heat dissipation solution 9 may be 0.65mm 2 / sec -10 6 mm 2 / sec at 25 °C. If the viscosity is greater than the upper limit, the convection heat transfer effect is drastically reduced (exactly, the film coefficiency of the membrane effect is reduced) and the heat transfer efficiency is drastically reduced.
  • the viscosity is lower than the lower limit, the intermolecular energy transfer between the liquid phase molecules with Si as the basic structure occurs and the function as a heat transfer medium decreases rapidly (molecular distance-even if the liquid phase is a polymer structure, the binding energy between molecules is very high). Near the weak monomer-(freedom, oscillation distance 1 / r2)) The substantial convective heat transfer effect moves without the medium and drops sharply, reducing overall heat transfer.
  • the specific gravity of the insulating heat dissipation solution 9 may be 0.76 to 1.10 at 25 ° C.
  • This specific gravity is closely related to the volume change with temperature change.
  • the lighting device operates at a room temperature of 20 ° C. in general, when the temperature of the LED package rises to 60 ° C. or more, the life of the product is drastically reduced due to heat damage. That is, in the case of an indoor light, it has a use range of 20 ° C. to 60 ° C. At this time, when the specific gravity is outside the above range, there is a fear that the housing itself is physically damaged due to rapid expansion and contraction.
  • Insulating heat dissipation solution 9 which is an embodiment of the present invention, is a mixture of one or two or more of dimethyl silicone oil, methyl phenyl silicone oil, and polymethyl hydrogen siloxane, and their boiling point is 800 ⁇ ⁇ or higher. Therefore, when 60 °C is viewed as the maximum temperature of the operating temperature, there is no loss due to vaporization during the operation of the LED lighting device, thereby ensuring a semi-permanent life.
  • the insulating heat dissipating solution 9 according to the embodiment of the present invention has no chemical reaction with respect to the substrate, the LED package module, the housing, and the like, there is no haze phenomenon due to the chemical reaction with the substrate, even if used for a long time. Parts life can be ensured.
  • dimethyl silicone oil methyl panyl silicone oil, and poly methyl hydrogen siloxane are easy to handle in that they are non-toxic and have a low cost for disposal.
  • the refractive index of the sodium D line is maintained at 1.374-1.392 at 2.0CS or less and 1.398-1.404 at 10CS or more. Accordingly, the light emitted from the LED package which is the light source is not distorted.
  • the manufacturing cost is low, it is non-toxic and environmentally friendly, and the heat dissipation efficiency is excellent because of high thermal conductivity and heat transfer coefficient, and chemically Since it is non-reactive with a board
  • Insulating heat dissipation filled in the housing of the LED lighting device described above is not limited to the configuration and method of the embodiments described above, the embodiments are all or all of the embodiments so that various modifications can be made Some may be optionally combined.
  • Insulating heat dissipation liquid to be filled in the housing of the LED lighting apparatus according to the present invention and the LED lighting apparatus using the same can be used in various lighting equipment, there is industrial applicability.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention se rapporte à une solution isolante de dissipation thermique qui est remplie dans un boîtier d'un dispositif d'éclairage à diodes électroluminescentes (DEL) et à un dispositif d'éclairage à diodes électroluminescentes (DEL) qui utilise cette solution, la solution isolante de dissipation thermique n'étant pas toxique, ne présentant pas de réaction avec un boîtier de diodes électroluminescentes (DEL) et présentant un coefficient de transfert de chaleur par convection compris entre 15 000 et 70 000 (W/m2 K) à une température comprise entre 20 et 80 °C, comprenant l'un des éléments suivant ou un mélange d'au moins deux éléments suivants choisis parmi l'huile de silicone de diméthyle, l'huile de silicone de phénylméthyle et le siloxane d'hydrogène de polyméthyle afin d'absorber et de dissiper la chaleur générée depuis le boîtier de diodes électroluminescentes (DEL) du dispositif d'éclairage à diodes électroluminescentes (DEL).
PCT/KR2012/003538 2012-03-12 2012-05-04 Solution isolante de dissipation thermique remplie dans un boîtier d'un dispositif d'éclairage à diodes électroluminescentes et dispositif d'éclairage à diodes électroluminescentes qui utilise cette dernière WO2013137517A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120025269A KR101318288B1 (ko) 2012-03-12 2012-03-12 엘이디 조명 장치의 하우징에 채워지는 절연 방열액 및 이를 이용하는 엘이디 조명기기
KR10-2012-0025269 2012-03-12

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WO2013137517A1 true WO2013137517A1 (fr) 2013-09-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015076432A1 (fr) * 2013-11-21 2015-05-28 주식회사 지앤씨 Appareil d'éclairage à diode électroluminescente utilisant une solution de dissipation de chaleur
CN104315372B (zh) * 2014-10-10 2017-02-22 厦门莱肯照明科技有限公司 一种液冷式led灯
CN104613350B (zh) * 2015-02-12 2018-02-16 清华大学 大功率半导体照明光源
KR20160100712A (ko) 2015-02-16 2016-08-24 주식회사 에프에스티 직접 냉각식 발광다이오드 조명기기

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KR970010833A (ko) * 1995-08-28 1997-03-27 뤼디거 드로페, 크누트 샤우에르테 액상 오르가노폴리실록산 수지, 그의 제조 방법, 액상 오르가노폴리실록산 수지를 함유하는 저점도 폴리디오르가노실록산 조성물 및 그의 용도
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KR20060087264A (ko) * 2005-01-28 2006-08-02 삼성전기주식회사 열전달 액체를 포함하는 고출력 발광다이오드 패키지
US20080013316A1 (en) * 2006-07-17 2008-01-17 Kun-Yuan Chiang High power LED lamp with heat dissipation enhancement
KR20110122484A (ko) * 2010-05-04 2011-11-10 주식회사 케이씨씨 방열 성능이 우수한 실리콘 중합체 조성물

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KR970010833A (ko) * 1995-08-28 1997-03-27 뤼디거 드로페, 크누트 샤우에르테 액상 오르가노폴리실록산 수지, 그의 제조 방법, 액상 오르가노폴리실록산 수지를 함유하는 저점도 폴리디오르가노실록산 조성물 및 그의 용도
JP2005026303A (ja) * 2003-06-30 2005-01-27 Shin Etsu Handotai Co Ltd 発光モジュール
KR20060087264A (ko) * 2005-01-28 2006-08-02 삼성전기주식회사 열전달 액체를 포함하는 고출력 발광다이오드 패키지
US20080013316A1 (en) * 2006-07-17 2008-01-17 Kun-Yuan Chiang High power LED lamp with heat dissipation enhancement
KR20110122484A (ko) * 2010-05-04 2011-11-10 주식회사 케이씨씨 방열 성능이 우수한 실리콘 중합체 조성물

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop

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KR101318288B1 (ko) 2013-11-13

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