WO2013133273A1 - Cu-In-Ga-Se太陽電池用ガラス基板およびそれを用いた太陽電池 - Google Patents
Cu-In-Ga-Se太陽電池用ガラス基板およびそれを用いた太陽電池 Download PDFInfo
- Publication number
- WO2013133273A1 WO2013133273A1 PCT/JP2013/056000 JP2013056000W WO2013133273A1 WO 2013133273 A1 WO2013133273 A1 WO 2013133273A1 JP 2013056000 W JP2013056000 W JP 2013056000W WO 2013133273 A1 WO2013133273 A1 WO 2013133273A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- glass substrate
- glass
- solar cell
- less
- cigs
- Prior art date
Links
- 239000011521 glass Substances 0.000 title claims abstract description 196
- 239000000758 substrate Substances 0.000 title claims abstract description 132
- 230000009477 glass transition Effects 0.000 claims abstract description 26
- 239000006059 cover glass Substances 0.000 claims description 25
- 238000004031 devitrification Methods 0.000 claims description 21
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 8
- 229910052708 sodium Inorganic materials 0.000 claims description 8
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 abstract description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 abstract 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 238000010248 power generation Methods 0.000 description 45
- 239000010408 film Substances 0.000 description 27
- 239000011669 selenium Substances 0.000 description 27
- 239000000203 mixture Substances 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 19
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 18
- 238000002844 melting Methods 0.000 description 18
- 230000008018 melting Effects 0.000 description 18
- 238000000034 method Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 230000002829 reductive effect Effects 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 239000002994 raw material Substances 0.000 description 9
- 239000011787 zinc oxide Substances 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 239000005357 flat glass Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 230000001737 promoting effect Effects 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 229910010413 TiO 2 Inorganic materials 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910052711 selenium Inorganic materials 0.000 description 6
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 4
- 238000006124 Pilkington process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000006060 molten glass Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000005361 soda-lime glass Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000224 chemical solution deposition Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000007500 overflow downdraw method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000004151 rapid thermal annealing Methods 0.000 description 2
- SPVXKVOXSXTJOY-UHFFFAOYSA-N selane Chemical compound [SeH2] SPVXKVOXSXTJOY-UHFFFAOYSA-N 0.000 description 2
- 229910000058 selane Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 240000002329 Inga feuillei Species 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- QCUOBSQYDGUHHT-UHFFFAOYSA-L cadmium sulfate Chemical compound [Cd+2].[O-]S([O-])(=O)=O QCUOBSQYDGUHHT-UHFFFAOYSA-L 0.000 description 1
- 229910000331 cadmium sulfate Inorganic materials 0.000 description 1
- 229910052798 chalcogen Inorganic materials 0.000 description 1
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052951 chalcopyrite Inorganic materials 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000006025 fining agent Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
- H01L31/03928—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate including AIBIIICVI compound, e.g. CIS, CIGS deposited on metal or polymer foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
Definitions
- the present invention relates to a glass substrate for a solar cell in which a photoelectric conversion layer is formed between glass substrates, and a solar cell using the same. More specifically, the glass substrate typically includes a glass substrate and a cover glass, and a Cu—In in which a photoelectric conversion layer mainly composed of a group 11, group 16, or group 16 element is formed on the glass substrate.
- the present invention relates to a glass substrate for a -Ga-Se solar cell and a solar cell using the same.
- Group 11-13, 11-16 compound semiconductors having a chalcopyrite crystal structure and cubic or hexagonal 12-16 group compound semiconductors have a large absorption coefficient for light in the visible to near-infrared wavelength range. have. Therefore, it is expected as a material for high-efficiency thin film solar cells.
- Typical examples include Cu (In, Ga) Se 2 (hereinafter referred to as “CIGS” or “Cu—In—Ga—Se”) and CdTe.
- CIGS thin film solar cells (hereinafter also referred to as “CIGS solar cells”) are inexpensive and have an average thermal expansion coefficient close to that of CIGS compound semiconductors, soda lime glass is used as a substrate to obtain a solar cell. ing. In order to obtain an efficient solar cell, a glass material that can withstand a high heat treatment temperature has been proposed (see Patent Documents 1 to 5).
- a CIGS photoelectric conversion layer (hereinafter also referred to as “CIGS layer”) is formed on the glass substrate.
- CIGS layer A CIGS photoelectric conversion layer (hereinafter also referred to as “CIGS layer”) is formed on the glass substrate.
- CIGS layer a solar cell with high power generation efficiency is produced at a higher temperature. Heat treatment is preferable, and the glass substrate is required to withstand heat treatment at a high temperature and to satisfy a predetermined average thermal expansion coefficient.
- Patent Document 1 proposes a glass composition having a relatively high annealing point, but the invention described in Patent Document 1 does not necessarily have high power generation efficiency.
- Patent Documents 2 and 4 solar cell glass having a high strain point and satisfying a predetermined average thermal expansion coefficient is proposed.
- the problem of patent document 2 is ensuring heat resistance and improving productivity
- the problem of patent document 4 is improving surface quality and improving devitrification resistance, both of which solve problems related to power generation efficiency. Not. Therefore, it cannot necessarily be said that the inventions described in Patent Documents 2 and 4 have high power generation efficiency.
- Patent Document 3 there is a proposal of a high strain point glass substrate similar to that of Patent Document 2, but this is mainly intended for plasma display applications and has different problems, and the invention described in Patent Document 3 is high. It cannot be said that it has power generation efficiency.
- Patent Document 4 proposes a glass containing a large amount of boron oxide, having a high strain point and satisfying a predetermined average thermal expansion coefficient.
- boron may diffuse into the CIGS layer, which is a p-type semiconductor, to serve as a donor and reduce power generation efficiency.
- a boron removal facility is required, which tends to increase costs.
- boron in the glass is reduced, but the power generation efficiency is insufficient with the glass composition specifically described, and there is room for improvement in terms of further improvement in power generation efficiency.
- the glass substrate used for the CIGS solar cell has a good balance of high power generation efficiency, high glass transition temperature, predetermined average thermal expansion coefficient, solubility during plate glass production, formability, and devitrification prevention. It was difficult.
- the present invention is for a Cu-In-Ga-Se solar cell having a good balance of high power generation efficiency, high glass transition temperature, predetermined average thermal expansion coefficient, solubility during plate glass production, formability, and devitrification prevention. It aims at providing a glass substrate and a solar cell using the same.
- the inventors of the present application have found that a specific composition of the glass substrate for a Cu—In—Ga—Se solar cell enables high power generation efficiency, high glass transition temperature, predetermined It was found that a glass substrate for a Cu—In—Ga—Se solar cell having a good balance of the average thermal expansion coefficient, solubility during production of sheet glass, formability, and prevention of devitrification can be obtained.
- the present invention is a mass percentage display based on the following oxide, 45 to 70% of SiO 2 Al 2 O 3 11-20%, B 2 O 3 0.5% or less MgO 0-6%, 4-12% CaO, 5-20% SrO, BaO 0-6%, ZrO 2 0-8%, Na 2 O 4.5-10%, K 2 O 3.5-15%, MgO + CaO + SrO + BaO 10-30%, Containing 8-20% Na 2 O + K 2 O, Na 2 O / K 2 O is 0.7 to 2.0, (2 ⁇ Na 2 O (containing mass%) ⁇ 2 ⁇ MgO (containing mass%) ⁇ CaO (containing mass%)) ⁇ (Na 2 O (containing mass%) / K 2 O (containing mass%)) is 3 ⁇ 22, Cu—In—Ga— having a glass transition temperature of 640 to 700 ° C., an average coefficient of thermal expansion of 60 ⁇ 10 ⁇ 7 to 110 ⁇ 10 ⁇ 7 / ° C., and a density of 2.45 to
- Na 2 O / K 2 O is 0.9 to 1.7, and (2 ⁇ Na 2 O (containing mass%) — 2 ⁇ MgO (containing mass%) ⁇ CaO (containing mass%)) ⁇ (Na 2 O (containing mass%) / K 2 O (containing mass%)) is preferably 5 to 12.
- the temperature at which the viscosity becomes 10 4 dPa ⁇ s (T 4 ) is 1230 ° C. or less and the viscosity becomes 10 2 dPa ⁇ s ( T 2 ) is preferably 1620 ° C. or less, and the relationship between T 4 and the devitrification temperature (T L ) is preferably T 4 ⁇ T L ⁇ ⁇ 30 ° C. Furthermore, this invention provides the solar cell using this.
- the glass substrate for Cu—In—Ga—Se solar cell of the present invention has high power generation efficiency, high glass transition temperature, predetermined average thermal expansion coefficient, solubility during plate glass production, formability, and devitrification prevention characteristics. Can be provided in a balanced manner, and a solar cell with high power generation efficiency can be provided by using the glass substrate for CIGS solar cell of the present invention.
- FIG. 1 is sectional drawing which represents typically an example of embodiment of the solar cell using the glass substrate for CIGS solar cells of this invention.
- FIG. 2A shows a solar battery cell produced on a glass substrate for evaluation in the examples.
- FIG. 2B shows a cross-sectional view along the line A-A ′ of the solar battery cell shown in FIG. 2A.
- FIG. 3 shows a CIGS solar cell for evaluation on a glass substrate for evaluation in which eight solar cells shown in FIG. 2A are arranged.
- the glass substrate for a Cu—In—Ga—Se solar cell of the present invention is expressed by a mass percentage based on the following oxide, 45 to 70% of SiO 2 Al 2 O 3 11-20%, B 2 O 3 is 0.5% or less, 0-6% MgO 4-12% CaO, 5-20% SrO, BaO 0-6%, ZrO 2 0-8%, Na 2 O 4.5-10%, K 2 O 3.5-15%, MgO + CaO + SrO + BaO 10-30%, Containing 8-20% Na 2 O + K 2 O, Na 2 O / K 2 O is 0.7 to 2.0, (2 ⁇ Na 2 O (containing mass%) ⁇ 2 ⁇ MgO (containing mass%) ⁇ CaO (containing mass%)) ⁇ (Na 2 O (containing mass%) / K 2 O (containing mass).
- the glass transition temperature (Tg) of the glass substrate for CIGS solar cell of the present invention is 640 ° C. or higher and 700 ° C. or lower, which is higher than the glass transition temperature of soda lime glass.
- the glass transition temperature (Tg) is preferably 645 ° C. or more, more preferably 650 ° C. or more, and further preferably 655 ° C. or more in order to ensure the formation of the CIGS layer at a high temperature.
- the glass transition temperature (Tg) is preferably 690 ° C. or lower so as not to increase the viscosity during melting.
- the glass transition temperature (Tg) is more preferably 685 ° C. or lower, and further preferably 680 ° C. or lower.
- the average thermal expansion coefficient at 50 to 350 ° C. of the glass substrate for CIGS solar cell of the present invention is 60 ⁇ 10 ⁇ 7 to 110 ⁇ 10 ⁇ 7 / ° C. If the average coefficient of thermal expansion is less than 60 ⁇ 10 ⁇ 7 / ° C. or more than 110 ⁇ 10 ⁇ 7 / ° C., the difference in thermal expansion from the CIGS layer becomes too large, and defects such as peeling tend to occur.
- the average thermal expansion coefficient is preferably 65 ⁇ 10 ⁇ 7 / ° C. or more, more preferably 70 ⁇ 10 ⁇ 7 / ° C. or more, and further preferably 75 ⁇ 10 ⁇ 7 / ° C. or more.
- the average thermal expansion coefficient is preferably 100 ⁇ 10 ⁇ 7 / ° C. or less, more preferably 95 ⁇ 10 ⁇ 7 / It is 90 ° C. or less, more preferably 90 ⁇ 10 ⁇ 7 / ° C. or less.
- the relationship between the temperature (T 4 ) at which the viscosity is 10 4 dPa ⁇ s and the devitrification temperature (T L ) is T 4 ⁇ T L ⁇ ⁇ 30 ° C.
- T 4 The -T L is lower than -30 ° C., devitrification is likely to occur at the time of sheet glass forming, there is a possibility that the molding of the glass plate becomes difficult.
- T 4 -T L is preferably -10 ° C. or higher, more preferably 10 ° C. or higher, more preferably 30 ° C. or more, and particularly preferably 50 ° C. or higher.
- the devitrification temperature refers to the maximum temperature at which crystals are not generated on the glass surface and inside when the glass is held at a specific temperature for 17 hours.
- T 4 is 1230 ° C. or less.
- T 4 is preferably 1220 ° C. or less, more preferably 1210 ° C. or less, more preferably 1200 ° C. or less, particularly preferably 1190 ° C. or less.
- the glass substrate for CIGS solar cell of the present invention has a temperature (T 2 ) at which the viscosity becomes 10 2 dPa ⁇ s at 1620 ° C. or less in consideration of glass solubility, that is, improvement in homogeneity and productivity.
- T 2 is preferably 1590 ° C. or lower, more preferably 1570 ° C. or lower, further preferably 1560 ° C. or lower, and particularly preferably 1550 ° C. or lower.
- Young's modulus is preferably 77 GPa or more. If the Young's modulus is less than 77 GPa, the amount of strain under a constant stress increases, which may cause a warp in the manufacturing process, resulting in defects and failure to form a film normally. Moreover, the warpage in the product becomes large, which is not preferable.
- the Young's modulus is more preferably 77.5 GPa or more, further preferably 78 GPa or more, and particularly preferably 78.5 GPa or more.
- the specific modulus (E / d) obtained by dividing Young's modulus (hereinafter also referred to as “E”) by density (hereinafter also referred to as “d”) is preferably 27.5 GPa ⁇ cm 3 / g or more. If the specific elastic modulus (E / d) is less than 27.5 GPa ⁇ cm 3 / g, it may be bent by its own weight during roller conveyance or in the case of partial support, and may not flow normally in the manufacturing process. is there.
- the specific elastic modulus (E / d) is more preferably 28 GPa ⁇ cm 3 / g or more.
- the density is 2.8 g / cm 3 or less and the Young's modulus is 79 GPa. If it is more, the density may be 2.85 g / cm 3 or less.
- a glass substrate for a CIGS solar cell of the present invention has a density of 2.45 g / cm 3 or more and 2.9 g / cm 3 or less. When the density exceeds 2.9 g / cm 3 , the product mass becomes heavy, which is not preferable. Moreover, the glass substrate becomes brittle and easily broken, which is not preferable. Density is more preferably 2.85 g / cm 3 or less, more preferably 2.82 g / cm 3 or less, particularly preferably 2.8 g / cm 3 or less.
- Density is more preferably 2.5 g / cm 3 or more, more preferably 2.55 g / cm 3 or more, and particularly preferably 2.6 g / cm 3 or more.
- the reason for limiting to the said composition (henceforth "mother composition") in the glass substrate for CIGS solar cells of this invention is as follows.
- the percentage (%) in the following shall mean the mass% unless there is particular notice.
- “substantially does not contain” means that it is not contained other than inevitable impurities mixed from raw materials or the like, that is, it is not intentionally contained.
- SiO 2 SiO 2 is a component that forms a glass skeleton. If its content is less than 45% by mass, the heat resistance and chemical durability of the glass substrate may be reduced, and the average thermal expansion coefficient may be increased. The content is preferably 48% or more, more preferably 50% or more, and further preferably 52% or more.
- the content is more than 70%, the high temperature viscosity of the glass is increased, which may cause a problem that the solubility is deteriorated.
- the content is preferably 65% or less, more preferably 60% or less, and still more preferably 58% or less.
- Al 2 O 3 increases the glass transition temperature, improves the weather resistance (solarization), heat resistance and chemical durability, and increases the Young's modulus. If the content is less than 11%, the glass transition temperature may be lowered. Moreover, there exists a possibility that an average thermal expansion coefficient may increase.
- the content is preferably 11.5% or more, more preferably 12% or more, and further preferably 12.5% or more. However, when the content is more than 20%, the high temperature viscosity of the glass is increased, and the solubility may be deteriorated. Further, the devitrification temperature is increased, and the moldability may be deteriorated. In addition, power generation efficiency may be reduced.
- the content is preferably 18% or less, more preferably 16% or less, still more preferably 15% or less, and particularly preferably 14% or less.
- B 2 O 3 may be contained up to 0.5% in order to improve the solubility. If the content exceeds 0.5%, the glass transition temperature may be lowered or the average thermal expansion coefficient may be decreased, which is not preferable for the process of forming the CIGS layer. In addition, the devitrification temperature rises and the glass tends to be devitrified, making it difficult to form the glass sheet. Furthermore, a large-scale removal facility is required, which increases the environmental load, which is not preferable. Further, B (boron) diffuses into the CIGS layer, which is a p-type semiconductor, and acts as a donor, which is not preferable because power generation efficiency may be reduced. Its content is preferably 0.3% or less. More preferably, B 2 O 3 is not substantially contained.
- MgO may be contained because it has the effect of lowering the viscosity at the time of melting the glass and promoting the melting.
- the content is preferably 0.05% or more, more preferably 0.1% or more, and further preferably 0.2% or more. However, if the content exceeds 6%, the devitrification temperature may increase. Furthermore, power generation efficiency may be reduced.
- the content is preferably 4% or less, more preferably 3% or less, still more preferably 2.5% or less, particularly preferably 2.0% or less, more preferably 1.5% or less, and most preferably 1. 0% or less.
- CaO is contained in an amount of 4% or more because it has the effect of lowering the viscosity when glass is melted and promoting the melting.
- the content is preferably 4.5% or more, more preferably 4.8% or more, and further preferably 5% or more. However, if the content exceeds 12%, the average thermal expansion coefficient of the glass substrate may increase. In addition, Na is less likely to move in the glass substrate, which may reduce power generation efficiency.
- the content is preferably 10% or less, more preferably 8% or less, still more preferably 7% or less, and particularly preferably 6% or less.
- SrO has the effect of lowering the viscosity during melting of the glass, maintaining the average thermal expansion coefficient at a desired value, and promoting melting, and further, promoting the diffusion of Na into the CIGS layer. Include 5% or more.
- the content is preferably 5.5% or more, more preferably 6% or more, and still more preferably 6.5% or more.
- the content is preferably 18% or less, more preferably 15% or less, further preferably 13% or less, and particularly preferably 12% or less. More preferably, it is 10% or less, and most preferably 8% or less.
- BaO can be contained because it has the effect of lowering the viscosity at the time of melting the glass and promoting the melting.
- the content is preferably 0.1% or more, more preferably 0.2% or more, and further preferably 0.5% or more. However, if the BaO content exceeds 6%, the power generation efficiency decreases, the average thermal expansion coefficient of the glass substrate increases, the density increases, and the glass may become brittle. In addition, the Young's modulus may be reduced.
- the content is preferably 4% or less, more preferably 3% or less, and even more preferably 2% or less.
- ZrO 2 can be contained because it has the effect of reducing the viscosity at the time of melting the glass and promoting the melting. However, if the content of ZrO 2 exceeds 8%, the average thermal expansion coefficient of the glass substrate is lowered, the power generation efficiency is lowered, the devitrification temperature is increased and the glass is easily devitrified, and it becomes difficult to form a sheet glass.
- the content is preferably 7% or less, more preferably 6% or less, and still more preferably 5.5% or less. Moreover, the content is preferably 0.5% or more, more preferably 1% or more, and further preferably 1.5% or more.
- TiO 2 may be contained up to 2% in order to improve solubility. If the content exceeds 2%, the devitrification temperature rises and the glass tends to be devitrified, making it difficult to form a sheet glass.
- the content is preferably 1% or less, more preferably 0.5% or less.
- MgO, CaO, SrO and BaO are contained in an amount of 10% or more in terms of the total amount (MgO + CaO + SrO + BaO) from the viewpoint of reducing the viscosity at the time of melting the glass and promoting the melting.
- Their total amount is preferably 13% or more, more preferably 15% or more, and further preferably 17% or more.
- the total amount thereof is preferably 26% or less, more preferably 22% or less, and further preferably 20% or less.
- Na 2 O is a component that contributes to improving the power generation efficiency of CIGS solar cells, and is an essential component. Further, it has the effect of lowering the viscosity at the glass melting temperature and facilitating melting, so 4.5 to 10% is contained. Na diffuses into the CIGS layer formed on the glass substrate to increase the power generation efficiency. However, if its content is less than 4.5%, Na diffusion to the CIGS layer on the glass substrate becomes insufficient, and the power generation efficiency is also low. May be insufficient. The content is preferably 5% or more, more preferably 5.5% or more, and even more preferably 5.7% or more. On the other hand, when the Na 2 O content exceeds 10%, the average thermal expansion coefficient tends to increase and the glass transition temperature tends to decrease.
- the content is preferably 9% or less, more preferably 8% or less, and even more preferably 7% or less.
- K 2 O Since K 2 O has the same effect as Na 2 O, and in the crystal growth of CIGS at a high temperature in the CIGS solar cell manufacturing process, there is a function of suppressing the change of the CIGS composition. In order to suppress a decrease in short circuit current, the content is 3.5 to 15%. However, if the content exceeds 15%, the glass transition temperature may be lowered, and the average thermal expansion coefficient may be increased. Alternatively, the Young's modulus may be reduced.
- the content is preferably 3.8% or more, more preferably 4% or more, and still more preferably 4.2% or more. Moreover, the content is preferably 12% or less, more preferably 10% or less, and further preferably 8% or less.
- Na 2 O and K 2 O The total amount of Na 2 O and K 2 O (Na 2 O + K 2 O) in order to sufficiently reduce the viscosity at the glass melting temperature and to improve the power generation efficiency of the CIGS solar cell Is 8-20%.
- Na 2 O + K 2 O is preferably 8.5% or more, more preferably 9% or more, and further preferably 9.5% or more.
- Na 2 O + K 2 O exceeds 20%, the glass transition temperature may be too low.
- the average thermal expansion coefficient may be reduced.
- Na 2 O + K 2 O is preferably 18% or less, more preferably 16% or less, and still more preferably 14% or less.
- Na 2 O / K 2 O of Na 2 O and K 2 O is 0.7 or more. If the amount of Na 2 O is too small relative to the amount of K 2 O, Na diffusion into the CIGS layer on the glass substrate may be insufficient, and power generation efficiency may be insufficient.
- Na 2 O / K 2 O is preferably 0.8 or more, more preferably 0.9 or more, and further preferably 1.0 or more. However, if Na 2 O / K 2 O exceeds 2.0, the glass transition temperature may be too low.
- Na 2 O / K 2 O is preferably 1.7 or less, more preferably 1.5 or less, and further preferably 1.4 or less.
- Na 2 O is effective in improving the characteristics of the CIGS layer
- CaO is a factor that adversely affects the diffusion of Na
- MgO is a factor that affects the diffusion of Ca
- ⁇ 2 ⁇ MgO (containing%) ⁇ CaO (containing%)) ⁇ (Na 2 O (containing%) / K 2 O (containing%)) is 3 or more. If this value is less than 3, sufficient power generation efficiency may not be obtained.
- This value is more preferably 4 or more, further preferably 4.5 or more, particularly preferably 5 or more, and still more preferably 6 or more. Also, if Na 2 O is too large, heat resistance and chemical durability, and reduced weatherability and in CIGS crystal growth at a high temperature in the manufacturing process of K 2 O is CIGS solar cells is less as described above , Since there is a possibility that the effect of suppressing the change in CIGS composition and suppressing the short circuit current may not be obtained, (2 ⁇ Na 2 O (containing%) ⁇ 2 ⁇ MgO (containing%) ⁇ CaO (containing%)) ) ⁇ (Na 2 O (containing%) / K 2 O (containing%)) is 22 or less. This value is more preferably 18 or less, still more preferably 14 or less, particularly preferably 12 or less, and still more preferably 9.5 or less.
- the glass substrate for a Cu—In—Ga—Se solar cell of the present invention is expressed by a mass percentage based on the following oxide, 45 to 70% of SiO 2 Al 2 O 3 11-20%, B 2 O 3 0.5% or less MgO 0-6%, 4-12% CaO, 5-20% SrO, BaO 0-6%, ZrO 2 0-8%, Na 2 O 4.5-10%, K 2 O 3.5-15%, MgO + CaO + SrO + BaO 10-30%, Containing 8-20% Na 2 O + K 2 O, Na 2 O / K 2 O is 0.9 to 1.7, (2 ⁇ Na 2 O (containing%) ⁇ 2 ⁇ MgO (containing%) ⁇ CaO (containing%)) ⁇ (Na 2 O (containing%) / K 2 O (containing%)) is 5 to 12 Is preferred.
- the glass substrate for a Cu—In—Ga—Se solar cell of the present invention has the above composition, the temperature (T 4 ) at which the viscosity becomes 10 4 dPa ⁇ s is 1230 ° C. or less, and the viscosity is 10 2 dPa ⁇ s. More preferably, the temperature (T 2 ) for s is 1620 ° C. or lower, and the relationship between T 4 and devitrification temperature (T L ) is T 4 ⁇ T L ⁇ ⁇ 30 ° C.
- the glass substrate for CIGS solar cell of the present invention consists essentially of the above mother composition, but may contain other components in an amount of 1% or less and a total of 5% or less in a range not impairing the object of the present invention.
- ZnO, Li 2 O, WO 3 , Nb 2 O 5 , V 2 O 5 , Bi 2 O 3 , TiO 2 are used for the purpose of improving weather resistance, solubility, devitrification, ultraviolet shielding, refractive index, and the like.
- MoO 3 , TlO 2 , P 2 O 5 and the like may be contained.
- these raw materials are composed of a matrix so that each glass substrate contains SO 3 , F, Cl, SnO 2 in an amount of 1% or less and a total amount of 2% or less. You may add to a raw material.
- Y 2 O 3 and La 2 O 3 may be contained in the glass substrate in a total amount of 2% or less.
- the glass substrate for a CIGS solar cell of the present invention may contain Fe 2 O 3, TiO 2, etc. colorants in the glass substrate.
- the total content of such colorants is preferably 1% or less.
- the glass substrate for a CIGS solar cell of the present invention considering the environmental burden, it is preferred not to contain As 2 O 3, Sb 2 O 3 substantially. In consideration of stable float forming, it is preferable that ZnO is not substantially contained.
- the glass substrate for CIGS solar cell of the present invention is not limited to being formed by the float method, and may be manufactured by forming by the fusion method.
- the manufacturing method of the glass substrate for CIGS solar cells of this invention is demonstrated.
- molding process are implemented similarly to the time of manufacturing the conventional glass substrate for solar cells.
- SO 3 can be effectively used as a fining agent, Suitable for the float method and fusion method (down draw method) as the molding method.
- a float method capable of easily and stably forming a large-area glass substrate with the enlargement of the solar cell is used. preferable.
- molten glass obtained by melting raw materials is formed into a plate shape.
- raw materials are prepared so that the obtained glass substrate has the above composition, the raw materials are continuously charged into a melting furnace, and heated to 1500 to 1700 ° C. to obtain molten glass.
- the molten glass is formed into a ribbon-like glass plate by applying, for example, a float process.
- After pulling out the ribbon-shaped glass plate from the float forming furnace it is cooled to room temperature by a cooling means, and after cutting, a CIGS solar cell glass substrate is obtained.
- the glass substrate for CIGS solar cells of the present invention is also suitable as a glass substrate for CIGS solar cells and a cover glass.
- the thickness of a glass substrate shall be 3 mm or less, More preferably, it is 2 mm or less, More preferably, it is 1.5 mm or less.
- the method for applying the CIGS layer to the glass substrate is not particularly limited, but the method using a selenization method is particularly preferable.
- the heating temperature when forming the CIGS layer can be set to 500 to 700 ° C., preferably 600 to 650 ° C.
- a cover glass etc. are not restrict
- Other examples of the composition of the cover glass include soda lime glass.
- the thickness of the cover glass is preferably 3 mm or less, more preferably 2 mm or less, and even more preferably 1.5 mm or less.
- the method for assembling the cover glass on the glass substrate having the CIGS layer is not particularly limited.
- the heating temperature can be 500 to 700 ° C., preferably 600 to 650 ° C.
- the CIGS solar cell glass substrate of the present invention in combination with a CIGS solar cell glass substrate and cover glass, since the average thermal expansion coefficient is the same, so that thermal deformation or the like does not occur during solar cell assembly.
- the CIGS solar cell glass substrate of the present invention can be used for other solar cell substrate glasses or cover glasses because of its characteristics of an expansion coefficient close to that of soda lime glass and a high glass transition point.
- Cd—Te compound solar cells and Cu—Zn—Sn—S (S is Se or S) compounds that require a heating temperature of 500 to 700 ° C. when forming the photoelectric conversion layer. It is suitably used for a glass substrate that forms a photoelectric conversion layer of a solar cell.
- the solar cell in the present invention includes a glass substrate, a cover glass, and a CIGS layer disposed as a photoelectric conversion layer between the glass substrate and the cover glass. At least the glass substrate of the glass substrate and the cover glass is the glass substrate for a Cu—In—Ga—Se solar cell of the present invention.
- FIG. 1 is a cross-sectional view schematically showing an example of an embodiment of a solar cell in the present invention.
- the CIGS solar cell 1 in the present invention has a glass substrate 5, a cover glass 19, and a CIGS layer 9 between the glass substrate 5 and the cover glass 19. It is preferable that the glass substrate 5 consists of the glass substrate for CIGS solar cells of this invention demonstrated above.
- the solar cell 1 has the back electrode layer of Mo film which is the plus electrode 7 on the glass substrate 5, and has the CIGS layer 9 on it.
- composition of the CIGS layer is Cu (In 1-x Ga x ) Se 2 .
- x represents the composition ratio of In and Ga, and 0 ⁇ x ⁇ 1.
- a CdS (cadmium sulfide) layer, a ZnS (zinc sulfide) layer, a ZnO (zinc oxide) layer, a Zn (OH) 2 (zinc hydroxide) layer as a buffer layer 11, or a mixture thereof. It has a crystal layer.
- a transparent conductive film 13 such as ZnO, ITO, or Al-doped ZnO (AZO) is provided through a buffer layer, and an extraction electrode such as an Al electrode (aluminum electrode) that is a negative electrode 15 is provided thereon. .
- An antireflection film may be provided at a necessary place between these layers.
- an antireflection film 17 is provided between the transparent conductive film 13 and the negative electrode 15.
- a cover glass 19 may be provided on the minus electrode 15, and if necessary, the minus electrode and the cover glass are sealed with a resin or bonded with a transparent resin for bonding.
- the cover glass the glass substrate for CIGS solar cell of the present invention may be used.
- the end of the CIGS layer or the end of the solar cell may be sealed.
- the same material as the glass substrate for CIGS solar cells of this invention, other glass, and resin are mentioned, for example. Note that the thickness of each layer of the solar cell shown in the accompanying drawings is not limited to the drawings.
- the raw materials of each component are prepared so as to have the compositions shown in Table 1 and Table 2, and the sulfate is converted to 0.1 parts by mass in terms of SO 3 with respect to 100 parts by mass of the mother composition raw material of the glass substrate component.
- the mixture was added and dissolved by heating at a temperature of 1600 ° C. for 3 hours using a platinum crucible. In melting, a platinum stirrer was inserted and stirred for 1 hour to homogenize the glass. Next, the molten glass was poured out, formed into a plate shape, and then cooled to obtain a glass plate.
- the average thermal expansion coefficient (unit: ⁇ 10 ⁇ 7 / ° C.), glass transition temperature Tg (unit: ° C.), density d (unit: g / cm 3 ), Young's modulus E (unit: unit) of the glass plate thus obtained.
- GPa specific elastic modulus E / d (unit: GPa ⁇ cm 3 / g), temperature at which viscosity becomes 10 4 dPa ⁇ s (T 4 ) (unit: ° C), temperature at which viscosity becomes 10 2 dPa ⁇ s
- Table 1 shows (T 2 ) (unit: ° C.), devitrification temperature (T L ) (unit: ° C.), and power generation efficiency.
- the measuring method of each physical property is shown below.
- each physical property is the same value with a glass plate and a glass substrate. By processing and polishing the obtained glass plate, a glass substrate can be obtained.
- Tg is a value measured using a differential thermal dilatometer (TMA), and was determined according to JIS R3103-3 (fiscal 2001).
- TMA differential thermal dilatometer
- Average thermal expansion coefficient at 50 to 350 ° C . measured using a differential thermal dilatometer (TMA) and determined from JIS R3102 (1995).
- Viscosity Measured using a rotational viscometer, temperature T 2 (viscosity of solubility) when viscosity ⁇ is 10 2 dPa ⁇ s, and viscosity ⁇ is 10 4 dPa ⁇ s Temperature T 4 (reference temperature for moldability) was measured.
- Devitrification temperature (T L ) 5 g of glass lump cut out from the glass plate was placed on a platinum dish and kept in an electric furnace at a predetermined temperature for 17 hours. The maximum temperature at which crystals do not precipitate on the surface and inside of the glass lump after being held was defined as the devitrification temperature.
- a solar cell for evaluation was produced as shown below, and the power generation efficiency was evaluated using this.
- the results are shown in Table 1.
- the production of the solar cell for evaluation will be described below with reference to FIGS. 2A, 2B and 3, and the reference numerals thereof.
- the layer configuration of the solar cell for evaluation is substantially the same as the layer configuration of the solar cell shown in FIG. 1 except that it does not have the cover glass 19 and the antireflection film 17 of the solar cell in FIG.
- the obtained glass plate was processed into a size of 3 cm ⁇ 3 cm and a thickness of 1.1 mm to obtain a glass substrate.
- a Mo (molybdenum) film was formed as a plus electrode 7a by a sputtering apparatus. Film formation was performed at room temperature to obtain a Mo film having a thickness of 500 nm.
- a CuGa alloy layer is formed with a CuGa alloy target by a sputtering apparatus, and then an In layer is formed using an In target, whereby an In—CuGa precursor film is formed. A film was formed. Film formation was performed at room temperature. The thickness of each layer was adjusted so that the composition of the precursor film measured by fluorescent X-rays was Cu / (Ga + In) ratio of 0.8 and Ga / (Ga + In) ratio of 0.25. Obtained.
- the precursor film was heat-treated using a RTA (Rapid Thermal Annealing) apparatus in a mixed atmosphere of argon and hydrogen selenide (hydrogen selenide is 5% by volume with respect to argon, referred to as “selenium atmosphere”).
- RTA Rapid Thermal Annealing
- condition A first, the first stage is held at 500 ° C. for 10 minutes in a selenium atmosphere, Cu, In, Ga and Se are reacted, and then the second stage is a hydrogen sulfide atmosphere (hydrogen sulfide is argon Then, the CIGS layer 9a was obtained by growing the CIGS crystal by further holding at 580 ° C. for 30 minutes.
- condition B first, the first stage is maintained at 250 ° C. for 30 minutes in a selenium atmosphere, Cu, In, Ga and Se are reacted, and then the second stage is a hydrogen sulfide atmosphere (hydrogen sulfide is Then, the CIGS layer 9a was obtained by growing the CIGS crystal by holding at 600 ° C. for 30 minutes. The thickness of the obtained CIGS layer 9a was 2 ⁇ m in both conditions A and B.
- a CdS layer was formed as the buffer layer 11a on the CIGS layer 9a by the CBD (Chemical Bath Deposition) method. Specifically, first, cadmium sulfate having a concentration of 0.01M, thiourea having a concentration of 1.0M, ammonia having a concentration of 15M, and pure water were mixed in a beaker. Next, the CIGS layer was immersed in the above mixed solution, and the beaker and the beaker were placed in a constant temperature bath whose water temperature was set to 70 ° C. in advance, to form a 50 to 80 nm CdS layer.
- a transparent conductive film 13a was formed on the CdS layer by a sputtering apparatus by the following method. First, a ZnO layer was formed using a ZnO target, and then an AZO layer was formed using an AZO target (ZnO target containing 1.5 wt% Al 2 O 3 ). Each layer was formed at room temperature to obtain a transparent conductive film 13a having a two-layer structure having a thickness of 480 nm. On the AZO layer of the transparent conductive film 13a, an aluminum film having a thickness of 1 ⁇ m was formed as a U-shaped negative electrode 15a by EB vapor deposition (U-shaped electrode length (vertical 8 mm, horizontal 4 mm), electrode width 0. 5 mm).
- FIGS. 2A and 2B are views of one solar battery cell as viewed from above, and FIG. 2B is a cross-sectional view taken along line AA ′ in FIG. 2A.
- One cell has a width of 0.6 cm and a length of 1 cm, and the area excluding the negative electrode 15a is 0.51 cm 2.
- a total of eight cells are placed on one glass substrate 5a. Obtained.
- CIGS solar cell for evaluation (evaluation glass substrate 5a produced with the above eight cells) was installed in a solar simulator (YSS-T80A, manufactured by Yamashita Denso Co., Ltd.) and added to the positive electrode 7a previously coated with InGa solvent.
- a terminal (not shown) was connected to the voltage generator at the lower end of the U-shape of the negative electrode 15a.
- the temperature in the solar simulator was controlled at a constant temperature of 25 ° C. with a temperature controller. Pseudo sunlight was irradiated, and after 60 seconds, the voltage was changed from -1 V to +1 V at an interval of 0.015 V, and the current values of each of the eight cells were measured.
- the power generation efficiency was calculated by the following formula (1) from the current and voltage characteristics at the time of irradiation. Table 1 shows the value of the most efficient cell among the eight cells as the value of the power generation efficiency of each glass substrate.
- the illuminance of the light source used for the test was 0.1 W / cm 2 .
- Power generation efficiency [%] Voc [V] ⁇ Jsc [A / cm 2 ] ⁇ FF [Dimensionless] ⁇ 100 / Illuminance [W / cm 2 ] of the light source used in the test Equation (1)
- the power generation efficiency is obtained by multiplying the open circuit voltage (Voc), the short circuit current density (Jsc), and the fill factor (FF).
- the open circuit voltage (Voc) is an output when the terminal is opened, and the short circuit current (Isc) is a current when the terminal is short circuited.
- the short circuit current density (Jsc) is Isc divided by the cell area excluding the negative electrode.
- the point that gives the maximum output is called the maximum output point, the voltage at that point is called the maximum voltage value (Vmax), and the current is called the maximum current value (Imax).
- Vmax the voltage at that point
- Imax the current
- a value obtained by dividing the product of the maximum voltage value (Vmax) and the maximum current value (Imax) by the product of the open circuit voltage (Voc) and the short circuit current (Isc) is obtained as a fill factor (FF). Using the above values, the power generation efficiency was determined.
- the residual amount of SO 3 in the glass was 100 to 500 ppm.
- the residual amount of SO 3 in the glass composition was measured by measuring a glass lump cut out from a glass plate in a powder form and evaluating with fluorescent X-rays.
- the glasses of Examples 10 to 16 intentionally did not contain Fe 2 O 3 and TiO 2 , but the amounts inevitably mixed from the raw materials were 100 to 500 ppm.
- the content of Fe 2 O 3 and TiO 2 in the glass composition was measured by measuring a glass lump cut out from a glass plate in a powder form and evaluating with fluorescent X-rays.
- the glass plates of Examples have a high glass transition temperature Tg of 640 ° C. or higher and an average thermal expansion coefficient of 60 ⁇ 10 ⁇ 7.
- the density is ⁇ 110 ⁇ 10 ⁇ 7 / ° C., the density is 2.9 g / cm 3 or less, and the characteristics of the glass substrate for solar cells are well balanced.
- the glass plate of the Example (Example 1) had high power generation efficiency in both Condition A and Condition B.
- the power generation efficiency of the glass plates other than Example 1 is also a high result.
- the CIGS photoelectric conversion layer does not peel from the glass substrate with the Mo film, and when the solar cell in the present invention is further assembled (specifically, the glass substrate having the CIGS photoelectric conversion layer and the cover glass are heated). When bonding), the glass substrate is less likely to deform and has better power generation efficiency.
- the glass plate of the comparative example (Example 7) has a low Tg, and the glass plate is easily deformed during film formation at 600 ° C. or higher. Furthermore, since Na 2 O / K 2 O, (2Na 2 O-2MgO—CaO) ⁇ (Na 2 O / K 2 O) is low, and there is much BaO, the power generation efficiency is inferior.
- the glass plate of the comparative example (Example 8) has poor power generation efficiency because Na 2 O / K 2 O, (2Na 2 O-2MgO—CaO) ⁇ (Na 2 O / K 2 O) is low, and SrO is small. .
- the glass plate of the comparative example is Na 2 O / K 2 O, (2Na 2 O-2MgO—CaO) ⁇ (Na 2 O / K 2 O) is low, SrO is low, and MgO is too much to generate power. Inefficient.
- the glass substrate for a Cu—In—Ga—Se solar cell of the present invention is suitable as a glass substrate for a CIGS solar cell. Moreover, it can also use for the cover glass for CIGS solar cells, the board
- the glass substrate for a Cu—In—Ga—Se solar cell of the present invention has high power generation efficiency, high glass transition temperature, predetermined average thermal expansion coefficient, high glass strength, low glass density, solubility during production of sheet glass, molding Therefore, it is possible to provide a solar cell with high power generation efficiency by using the glass substrate for CIGS solar cell of the present invention.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Photovoltaic Devices (AREA)
- Glass Compositions (AREA)
Abstract
Description
また、効率の良い太陽電池を得るため、高温の熱処理温度に耐えうるガラス材料の提案もされている(特許文献1~5参照)。
また、特許文献3では、特許文献2に近い高歪点ガラス基板の提案があるが、これはプラズマディスプレイ用途を主眼としているもので、課題が異なるものであり、特許文献3記載の発明が高い発電効率を有するとは必ずしも言えない。
特許文献5では、ガラス中のホウ素を低減させているが、具体的に記載されているガラス組成では発電効率は不十分であり、さらなる発電効率の向上という点では改善の余地がある。
SiO2を45~70%、
Al2O3を11~20%、
B2O3を0.5%以下
MgOを0~6%、
CaOを4~12%、
SrOを5~20%、
BaOを0~6%、
ZrO2を0~8%、
Na2Oを4.5~10%、
K2Oを3.5~15%、
MgO+CaO+SrO+BaOを10~30%、
Na2O+K2Oを8~20%含有し、
Na2O/K2Oが0.7~2.0であり、
(2×Na2O(含有質量%)-2×MgO(含有質量%)-CaO(含有質量%))×(Na2O(含有質量%)/K2O(含有質量%))が3~22であり、
ガラス転移点温度が640~700℃、平均熱膨張係数が60×10-7~110×10-7/℃、密度が2.45~2.9g/cm3以下であるCu-In-Ga-Se太陽電池用ガラス基板を提供する。
さらに本発明は、これを用いた太陽電池を提供する。
以下、本発明のCu-In-Ga-Se太陽電池用ガラス基板について説明する。
本発明のCu-In-Ga-Se太陽電池用ガラス基板は、下記酸化物基準の質量百分率表示で、
SiO2を45~70%、
Al2O3を11~20%、
B2O3を0.5%以下、
MgOを0~6%、
CaOを4~12%、
SrOを5~20%、
BaOを0~6%、
ZrO2を0~8%、
Na2Oを4.5~10%、
K2Oを3.5~15%、
MgO+CaO+SrO+BaOを10~30%、
Na2O+K2Oを8~20%含有し、
Na2O/K2Oが0.7~2.0であり、
(2×Na2O(含有質量%)-2×MgO(含有質量%)-CaO(含有質量%))×(Na2O(含有質量%)/K2O(含有質量%))が3~22であり、
ガラス転移点温度が640~700℃、平均熱膨張係数が60×10-7~110×10-7/℃、密度が2.45~2.9g/cm3以下であるCu-In-Ga-Se太陽電池用ガラス基板を提供する。なお、Cu-In-Ga-Seを以下「CIGS」と記載する。
ガラス板の成形性、即ち、平坦性向上や生産性向上を考慮すると、T4は1230℃以下である。T4は1220℃以下が好ましく、1210℃以下がより好ましく、1200℃以下がさらに好ましく、1190℃以下が特に好ましい。
また、密度が2.45g/cm3未満であると、ガラス基板の構成元素として、原子番号の小さい軽元素しか使用することができず、所望の発電効率、ガラス粘度を得られないおそれがある。密度は、より好ましくは2.5g/cm3以上、さらに好ましくは2.55g/cm3以上、特に好ましくは2.6g/cm3以上である。
なお、以下における百分率(%)は、特に断りがない限り、質量%を意味するものとする。
なお、本発明において「実質的に含有しない」とは、原料等から混入する不可避的不純物以外には含有しないこと、すなわち、意図的に含有させないことを意味する。
SiO2:SiO2はガラスの骨格を形成する成分で、その含有量が45質量%未満ではガラス基板の耐熱性および化学的耐久性が低下し、平均熱膨張係数が増大するおそれがある。その含有量は、好ましくは48%以上であり、より好ましくは50%以上であり、さらに好ましくは52%以上である。
しかし、その含有量が70%超であるとガラスの高温粘度が上昇し、溶解性が悪化する問題が生じるおそれがある。その含有量は、好ましくは65%以下であり、より好ましくは60%以下であり、さらに好ましくは58%以下である。
しかし、その含有量が20%超であると、ガラスの高温粘度が上昇し、溶解性が悪くなるおそれがある。また、失透温度が上昇し、成形性が悪くなるおそれがある。また発電効率が低下するおそれがある。その含有量は好ましくは18%以下、より好ましくは16%以下、さらに好ましくは15%以下、特に好ましくは14%以下である。
また、p型半導体であるCIGS層中にB(ホウ素)が拡散してドナーとして働き、発電効率を低下させるおそれがあり好ましくない。その含有量は、好ましくは0.3%以下である。B2O3を実質的に含有しないことがより好ましい。
しかし、その含有量が6%超であると、失透温度が上昇するおそれがある。さらに、発電効率が低下するおそれがある。その含有量は、好ましくは4%以下、より好ましくは3%以下、更に好ましくは2.5%以下、特に好ましくは2.0%以下、一層好ましくは1.5%以下、最も好ましくは1.0%以下である。
一方、Na2O含有量が10%を超えると平均熱膨張係数が大きくなり、ガラス転移点温度が低下する傾向がある。または化学的耐久性が劣化する。または、ヤング率が低下するおそれがある。または、過剰なNaにより、Mo(モリブデン)膜を劣化させて発電効率の低下につながるおそれがある。その含有量が9%以下であると好ましく、8%以下であるとより好ましく、7%以下であるとさらに好ましい。
しかし、その含有量が15%超であるとガラス転移点温度が低下し、平均熱膨張係数が大きくなるおそれがある。または、ヤング率が低下するおそれがある。その含有量は3.8%以上であるのが好ましく、4%以上であるのがより好ましく、4.2%以上であるのがさらに好ましい。また、その含有量は12%以下であることが好ましく、10%以下であることがより好ましく、8%以下であることがさらに好ましい。
しかし、Na2O+K2Oが20%超であるとガラス転移点温度が下がりすぎるおそれがある。また、平均熱膨張係数が小さくなるおそれがある。Na2O+K2Oは18%以下が好ましく、16%以下であることがより好ましく、14%以下がさらに好ましい。
しかし、Na2O/K2Oが2.0超であるとガラス転移点温度が下がりすぎるおそれがある。また、前述のK2Oによる、CIGS太陽電池の製造工程における高温でのCIGSの結晶成長において、CIGS組成の変化を抑えて、短絡電流の低下を抑える効果が得られなくなるおそれがある。そのためNa2O/K2Oは1.7以下が好ましく、1.5以下であることがより好ましく、1.4以下であることがさらに好ましい。
また、Na2Oが多すぎる場合、耐熱性や化学的耐久性、耐候性が低下し、また前述のとおりK2Oが少ない場合もCIGS太陽電池の製造工程における高温でのCIGSの結晶成長において、CIGS組成の変化を抑えて、短絡電流の低下を抑える効果が得られなくなるおそれがあるために、(2×Na2O(含有%)-2×MgO(含有%)-CaO(含有%))×(Na2O(含有%)/K2O(含有%))は22以下とする。この値は、より好ましくは18以下、さらに好ましくは14以下、特に好ましくは12以下、一層好ましくは9.5以下である。
SiO2を45~70%、
Al2O3を11~20%、
B2O3を0.5%以下
MgOを0~6%、
CaOを4~12%、
SrOを5~20%、
BaOを0~6%、
ZrO2を0~8%、
Na2Oを4.5~10%、
K2Oを3.5~15%、
MgO+CaO+SrO+BaOを10~30%、
Na2O+K2Oを8~20%含有し、
Na2O/K2Oが0.9~1.7であり、
(2×Na2O(含有%)-2×MgO(含有%)-CaO(含有%))×(Na2O(含有%)/K2O(含有%))が5~12であることが好ましい。
また、本発明のCu-In-Ga-Se太陽電池用ガラス基板は、上記組成であって、粘度が104dPa・sとなる温度(T4)が1230℃以下、粘度が102dPa・sとなる温度(T2)が1620℃以下、上記T4と失透温度(TL)との関係がT4-TL≧-30℃であることがより好ましい。
また、ガラス基板の化学的耐久性向上のため、ガラス基板中にY2O3、La2O3を合量で2%以下含有させてもよい。
また、本発明のCIGS太陽電池用ガラス基板は、環境負荷を考慮すると、As2O3、Sb2O3を実質的に含有しないことが好ましい。また、安定してフロート成形することを考慮すると、ZnOを実質的に含有しないことが好ましい。しかし、本発明のCIGS太陽電池用ガラス基板は、フロート法による成形に限らず、フュージョン法による成形により製造してもよい。
本発明のCIGS太陽電池用ガラス基板の製造方法について説明する。
本発明のCIGS太陽電池用ガラス基板を製造する場合、従来の太陽電池用ガラス基板を製造する際と同様に、溶解・清澄工程および成形工程を実施する。なお、本発明のCIGS太陽電池用ガラス基板は、アルカリ金属酸化物(Na2O、K2O)を含有するアルカリガラス基板であるため、清澄剤としてSO3を効果的に用いることができ、成形方法としてフロート法およびフュージョン法(ダウンドロー法)に適している。
太陽電池用のガラス基板の製造工程において、ガラスを板状に成形する方法としては、太陽電池の大型化に伴い、大面積のガラス基板を容易に、安定して成形できるフロート法を用いることが好ましい。
次に、リボン状のガラス板をフロート成形炉から引出した後に、冷却手段によって室温状態まで冷却し、切断後、CIGS太陽電池用ガラス基板を得る。
本発明のCIGS太陽電池用ガラス基板は、CIGS太陽電池用のガラス基板、またカバーガラスとしても好適である。
本発明のCIGS太陽電池用ガラス基板をガラス基板に適用する場合、ガラス基板の厚さは3mm以下とするのが好ましく、より好ましくは2mm以下、さらに好ましくは1.5mm以下である。またガラス基板にCIGS層を付与する方法は特に制限されないが、セレン化法による方法が特に好ましい。本発明のCIGS太陽電池用ガラス基板を用いることで、CIGS層を形成する際の加熱温度を500~700℃、好ましくは600~650℃とすることができる。
本発明のCIGS太陽電池用ガラス基板をガラス基板のみに使用する場合、カバーガラス等は特に制限されない。カバーガラスの組成の他の例は、ソーダライムガラス等が挙げられる。
次に、本発明における太陽電池について説明する。
本発明における太陽電池は、ガラス基板と、カバーガラスと、上記ガラス基板と上記カバーガラスとの間に、光電変換層として配置されるCIGS層と、を有する。そして、上記ガラス基板とカバーガラスとの少なくともガラス基板が、本発明のCu-In-Ga-Se太陽電池用ガラス基板である。
図1は本発明における太陽電池の実施形態の一例を模式的に表す断面図である。
図1において、本発明におけるCIGS太陽電池1は、ガラス基板5、カバーガラス19、およびガラス基板5とカバーガラス19との間にCIGS層9を有する。ガラス基板5は、上記で説明した本発明のCIGS太陽電池用ガラス基板からなるのが好ましい。太陽電池1は、ガラス基板5上にプラス電極7であるMo膜の裏面電極層を有し、その上にCIGS層9を有する。CIGS層の組成はCu(In1-xGax)Se2が例示できる。xはInとGaの組成比を示すもので0<x<1である。
CIGS層9上には、バッファ層11としてのCdS(硫化カドミウム)層、ZnS(亜鉛硫化物)層、ZnO(酸化亜鉛)層、Zn(OH)2(水酸化亜鉛)層、またはこれらの混晶層を有する。バッファ層を介して、ZnOまたはITO、またはAlをドープしたZnO(AZO)等の透明導電膜13を有し、さらにその上にマイナス電極15であるAl電極(アルミニウム電極)等の取出し電極を有する。これらの層の間の必要な場所には反射防止膜を設けてもよい。図1においては、透明導電膜13とマイナス電極15との間に反射防止膜17が設けられている。
本発明においてCIGS層の端部または太陽電池の端部は封止されていてもよい。封止するための材料としては、例えば本発明のCIGS太陽電池用ガラス基板と同じ材料、そのほかのガラス、樹脂が挙げられる。
なお添付の図面に示す太陽電池の各層の厚さは図面に限定されない。
本発明のCIGS太陽電池用ガラス基板の実施例(例1~6、10~16)および比較例(例7~9)を示す。なお表1および表2中のかっこは、計算値である。
こうして得られたガラス板の平均熱膨張係数(単位:×10-7/℃)、ガラス転移点温度Tg(単位:℃)、密度d(単位:g/cm3)、ヤング率E(単位:GPa)、比弾性率E/d(単位:GPa・cm3/g)、粘度が104dPa・sとなる温度(T4)(単位:℃)、粘度が102dPa・sとなる温度(T2)(単位:℃)、失透温度(TL)(単位:℃)、発電効率を測定し、表1に示した。以下に各物性の測定方法を示す。
なお、実施例では、ガラス板について各物性を測定しているが、各物性は、ガラス板とガラス基板とで同じ値である。得られたガラス板を加工、研磨を施すことで、ガラス基板とすることができる。
(2)50~350℃の平均熱膨張係数:示差熱膨張計(TMA)を用いて測定し、JIS R3102(1995年度)より求めた。
(4)ヤング率:厚み7~10mmのガラスについて、超音波パルス法により測定した。
(6)失透温度(TL):ガラス板から切り出したガラス塊5gを白金皿に置き、所定温度で17時間電気炉中で保持した。保持した後のガラス塊表面および内部に結晶が析出しない温度の最大値を失透温度とした。
評価用太陽電池の作製について、図2A、図2B及び図3、およびその符号を用いて以下説明している。なお、評価用太陽電池の層構成は、図1の太陽電池のカバーガラス19および反射防止膜17を有さない以外は、図1に示す太陽電池の層構成とほぼ同様である。
得られたガラス板を大きさ3cm×3cm、厚さ1.1mmに加工し、ガラス基板を得た。ガラス基板5aの上に、スパッタ装置にて、プラス電極7aとしてMo(モリブデン)膜を成膜した。成膜は室温にて実施し、厚み500nmのMo膜を得た。
プラス電極7a(Mo膜)上にスパッタ装置にて、CuGa合金ターゲットでCuGa合金層を成膜し、続いてInターゲットを使用してIn層を成膜することで、In-CuGaのプリカーサ膜を成膜した。成膜は室温にて実施した。蛍光X線によって測定したプリカーサ膜の組成が、Cu/(Ga+In)比が0.8、Ga/(Ga+In)比が0.25となるように各層の厚みを調整し、厚み650nmのプリカーサ膜を得た。
また、条件Bとして、まず、第1段階としてセレン雰囲気で250℃で30分保持を行い、CuおよびInおよびGaとSeとを反応させて、その後、第2段階として硫化水素雰囲気(硫化水素はアルゴンに対し5体積%)に置換した後、さらに600℃で30分保持してCIGS結晶を成長させることでCIGS層9aを得た。
得られたCIGS層9aの厚みは条件A、条件Bともに2μmであった。
透明導電膜13aのAZO層上にEB蒸着法により、U字型のマイナス電極15aとして膜厚1μmのアルミ膜を成膜した(U字の電極長(縦8mm、横4mm)、電極幅0.5mm)。
ソーラーシミュレータ(山下電装株式会社製、YSS-T80A)に、評価用CIGS太陽電池(上記8個のセルを作製した評価用ガラス基板5a)を設置し、あらかじめInGa溶剤を塗布したプラス電極7aにプラス端子を(不図示)、マイナス電極15aのU字の下端にマイナス端子16aをそれぞれ電圧発生器に接続した。ソーラーシミュレータ内の温度は25℃一定に温度調節機にて制御した。疑似太陽光を照射し、60秒後に、電圧を-1Vから+1Vまで0.015V間隔で変化させ、8個のセルのそれぞれの電流値を測定した。
発電効率[%]=Voc[V]×Jsc[A/cm2]×FF[無次元]×100/試験に用いる光源の照度[W/cm2] 式(1)
なお、開放電圧(Voc)は端子を開放した時の出力であり、短絡電流(Isc)は短絡した時の電流である。短絡電流密度(Jsc)はIscをマイナス電極を除いたセルの面積で割ったものである。
なお、ガラス組成物中のSO3の残存量は、ガラス板から切り出したガラスの塊を粉末状にして蛍光X線で評価し、測定した。
なお、ガラス組成物中のFe2O3及びTiO2の含有量は、ガラス板から切り出したガラスの塊を粉末状にして蛍光X線で評価し、測定した。
なお、例1以外のガラス板の発電効率も高い結果である。例1~6、10~16のガラスは、SrOが5~20%、Na2Oが4.5~10%、K2Oが3.5~15%、Na2O/K2Oが0.7~2.0であり、(2×Na2O(含有質量%)-2×MgO(含有質量%)-CaO(含有質量%))×(Na2O(含有質量%)/K2O(含有質量%))が3~22であるため、発電効率が高い。
したがって高い発電効率、高いガラス転移点温度、及び所定の平均熱膨張係数をバランスよく有することができる。そのため、CIGS光電変換層がMo膜付ガラス基板から剥離することがなく、さらに本発明における太陽電池を組立てる際(具体的にはCIGSの光電変換層を有するガラス基板とカバーガラスとを加熱してはりあわせる際)、ガラス基板が変形しにくく発電効率により優れる。
比較例(例8)のガラス板はNa2O/K2O、(2Na2O-2MgO-CaO)×(Na2O/K2O)が低いため、またSrOが少ないため発電効率が劣る。
比較例(例9)のガラス板はNa2O/K2O、(2Na2O-2MgO-CaO)×(Na2O/K2O)が低く、SrOが少なく、MgOが多すぎるため発電効率が劣る。
本出願は、2012年3月7日付けで出願された日本特許出願(特願2012-050060)に基づいており、その全体が引用により援用される。
5、5a ガラス基板
7、7a プラス電極
9、9a CIGS層
11、11a バッファ層
13、13a 透明導電膜
15、15a マイナス電極
17 反射防止膜
19 カバーガラス
Claims (8)
- 下記酸化物基準の質量百分率表示で、
SiO2を45~70%、
Al2O3を11~20%、
B2O3を0.5%以下、
MgOを0~6%、
CaOを4~12%、
SrOを5~20%、
BaOを0~6%、
ZrO2を0~8%、
Na2Oを4.5~10%、
K2Oを3.5~15%、
MgO+CaO+SrO+BaOを10~30%、
Na2O+K2Oを8~20%含有し、
Na2O/K2Oが0.7~2.0であり、
(2×Na2O(含有質量%)-2×MgO(含有質量%)-CaO(含有質量%))×(Na2O(含有質量%)/K2O(含有質量%))が3~22であり、
ガラス転移点温度が640~700℃、平均熱膨張係数が60×10-7~110×10-7/℃、密度が2.45~2.9g/cm3以下であるCu-In-Ga-Se太陽電池用ガラス基板。 - Na2O/K2Oが0.9~1.7であり、
(2×Na2O(含有質量%)-2×MgO(含有質量%)-CaO(含有質量%))×(Na2O(含有質量%)/K2O(含有質量%))が5~12である請求項1記載のCu-In-Ga-Se太陽電池用ガラス基板。 - Na2O/K2Oが1.0~1.5であり、
(2×Na2O(含有質量%)-2×MgO(含有質量%)-CaO(含有質量%))×(Na2O(含有質量%)/K2O(含有質量%))が6~9.5である請求項1又は2に記載のCu-In-Ga-Se太陽電池用ガラス基板。 - MgOを0~2.5%、
SrOを5.5~18%、
BaOを0~4%
含有する請求項1~3のいずれか一項に記載のCu-In-Ga-Se太陽電池用ガラス基板。 - Al2O3を11.5~16%、
MgOを0~1.5%、
CaOを4.5~8%
SrOを7~15%、
BaOを0~2%
含有する請求項1~4のいずれか一項に記載のCu-In-Ga-Se太陽電池用ガラス基板。 - ガラス転移点温度が660~690℃、平均熱膨張係数が70×10-7~95×10-7/℃、密度が2.6~2.8g/cm3以下である請求項1~5のいずれか一項に記載のCu-In-Ga-Se太陽電池用ガラス基板。
- 粘度が104dPa・sとなる温度(T4)が1230℃以下、粘度が102dPa・sとなる温度(T2)が1620℃以下、前記T4と失透温度(TL)との関係がT4-TL≧-30℃である請求項1~6のいずれか一項に記載のCu-In-Ga-Se太陽電池用ガラス基板。
- ガラス基板と、カバーガラスと、前記ガラス基板と前記カバーガラスとの間に配置されるCu-In-Ga-Seの光電変換層と、を有し、
前記ガラス基板と前記カバーガラスのうち少なくともガラス基板が、請求項1~7のいずれか一項に記載のCu-In-Ga-Se太陽電池用ガラス基板である太陽電池。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/480,200 US20150068595A1 (en) | 2012-03-07 | 2013-03-05 | GLASS SUBSTRATE FOR Cu-In-Ga-Se SOLAR CELL, AND SOLAR CELL USING SAME |
KR1020147027758A KR20140142271A (ko) | 2012-03-07 | 2013-03-05 | Cu-In-Ga-Se 태양 전지용 유리 기판 및 그것을 사용한 태양 전지 |
JP2014503855A JP6048490B2 (ja) | 2012-03-07 | 2013-03-05 | Cu−In−Ga−Se太陽電池用ガラス基板およびそれを用いた太陽電池 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012050060 | 2012-03-07 | ||
JP2012-050060 | 2012-03-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013133273A1 true WO2013133273A1 (ja) | 2013-09-12 |
Family
ID=49116748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/056000 WO2013133273A1 (ja) | 2012-03-07 | 2013-03-05 | Cu-In-Ga-Se太陽電池用ガラス基板およびそれを用いた太陽電池 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150068595A1 (ja) |
JP (1) | JP6048490B2 (ja) |
KR (1) | KR20140142271A (ja) |
TW (1) | TW201348170A (ja) |
WO (1) | WO2013133273A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015233134A (ja) * | 2014-05-15 | 2015-12-24 | 旭硝子株式会社 | 太陽電池用ガラス基板及びそれを用いた太陽電池 |
JP2016147792A (ja) * | 2015-02-13 | 2016-08-18 | 旭硝子株式会社 | ガラス基板 |
US10683231B2 (en) | 2015-03-26 | 2020-06-16 | Pilkington Group Limited | Glasses |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6742593B2 (ja) * | 2015-01-05 | 2020-08-19 | 日本電気硝子株式会社 | 支持ガラス基板の製造方法及び積層体の製造方法 |
EP3911612A4 (en) * | 2019-01-18 | 2022-11-23 | Corning Incorporated | LOW DIELECTRIC LOSS GLASS FOR ELECTRONIC DEVICES |
CN110342569B (zh) * | 2019-06-24 | 2021-09-21 | 吉林大学 | 一种形貌可控的CuInS2纳米材料的高压制备方法 |
US11951713B2 (en) | 2020-12-10 | 2024-04-09 | Corning Incorporated | Glass with unique fracture behavior for vehicle windshield |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000351649A (ja) * | 1999-06-08 | 2000-12-19 | Asahi Glass Co Ltd | 基板用ガラスおよびガラス基板 |
JP2001058843A (ja) * | 1999-06-08 | 2001-03-06 | Asahi Glass Co Ltd | 基板用ガラスおよびガラス基板 |
JP2001348246A (ja) * | 2000-06-01 | 2001-12-18 | Asahi Glass Co Ltd | 基板用ガラスおよびガラス基板 |
WO2012153634A1 (ja) * | 2011-05-10 | 2012-11-15 | 日本電気硝子株式会社 | 薄膜太陽電池用ガラス板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130100244A (ko) * | 2010-07-26 | 2013-09-10 | 아사히 가라스 가부시키가이샤 | Cu-In-Ga-Se 태양 전지용 유리 기판 및 그것을 사용한 태양 전지 |
JP5915892B2 (ja) * | 2011-05-10 | 2016-05-11 | 日本電気硝子株式会社 | 薄膜太陽電池用ガラス板 |
-
2013
- 2013-03-05 US US14/480,200 patent/US20150068595A1/en not_active Abandoned
- 2013-03-05 KR KR1020147027758A patent/KR20140142271A/ko not_active Application Discontinuation
- 2013-03-05 WO PCT/JP2013/056000 patent/WO2013133273A1/ja active Application Filing
- 2013-03-05 JP JP2014503855A patent/JP6048490B2/ja active Active
- 2013-03-07 TW TW102108122A patent/TW201348170A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000351649A (ja) * | 1999-06-08 | 2000-12-19 | Asahi Glass Co Ltd | 基板用ガラスおよびガラス基板 |
JP2001058843A (ja) * | 1999-06-08 | 2001-03-06 | Asahi Glass Co Ltd | 基板用ガラスおよびガラス基板 |
JP2001348246A (ja) * | 2000-06-01 | 2001-12-18 | Asahi Glass Co Ltd | 基板用ガラスおよびガラス基板 |
WO2012153634A1 (ja) * | 2011-05-10 | 2012-11-15 | 日本電気硝子株式会社 | 薄膜太陽電池用ガラス板 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015233134A (ja) * | 2014-05-15 | 2015-12-24 | 旭硝子株式会社 | 太陽電池用ガラス基板及びそれを用いた太陽電池 |
JP2016102058A (ja) * | 2014-05-15 | 2016-06-02 | 旭硝子株式会社 | 太陽電池用ガラス基板及びそれを用いた太陽電池 |
JP2016147792A (ja) * | 2015-02-13 | 2016-08-18 | 旭硝子株式会社 | ガラス基板 |
US10683231B2 (en) | 2015-03-26 | 2020-06-16 | Pilkington Group Limited | Glasses |
Also Published As
Publication number | Publication date |
---|---|
KR20140142271A (ko) | 2014-12-11 |
US20150068595A1 (en) | 2015-03-12 |
JPWO2013133273A1 (ja) | 2015-07-30 |
TW201348170A (zh) | 2013-12-01 |
JP6048490B2 (ja) | 2016-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2012102346A1 (ja) | Cu-In-Ga-Se太陽電池用ガラス基板およびそれを用いた太陽電池 | |
WO2011049146A1 (ja) | Cu-In-Ga-Se太陽電池用ガラス板およびこれを用いた太陽電池 | |
JP6048490B2 (ja) | Cu−In−Ga−Se太陽電池用ガラス基板およびそれを用いた太陽電池 | |
WO2012053549A1 (ja) | Cu-In-Ga-Se太陽電池用ガラス基板およびそれを用いた太陽電池 | |
JP6003904B2 (ja) | Cu−In−Ga−Se太陽電池用ガラス基板及びそれを用いた太陽電池 | |
JP6210136B2 (ja) | ガラス基板 | |
WO2013047246A1 (ja) | CdTe太陽電池用ガラス基板およびそれを用いた太陽電池 | |
JP6128128B2 (ja) | 太陽電池用ガラス基板およびそれを用いた太陽電池 | |
JP2016102058A (ja) | 太陽電池用ガラス基板及びそれを用いた太陽電池 | |
WO2015076208A1 (ja) | ガラス板 | |
WO2014024850A1 (ja) | Cu-In-Ga-Se太陽電池用ガラス基板およびそれを用いた太陽電池 | |
JP6249033B2 (ja) | ガラス板 | |
JP2016171158A (ja) | Cu−In−Ga−Se太陽電池 | |
JP2014067903A (ja) | 太陽電池用ガラス基板、太陽電池、および太陽電池の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13757143 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 2014503855 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14480200 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 20147027758 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13757143 Country of ref document: EP Kind code of ref document: A1 |