WO2013128769A1 - Dispositif d'entrée, dispositif d'affichage et dispositif électronique - Google Patents

Dispositif d'entrée, dispositif d'affichage et dispositif électronique Download PDF

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Publication number
WO2013128769A1
WO2013128769A1 PCT/JP2012/083481 JP2012083481W WO2013128769A1 WO 2013128769 A1 WO2013128769 A1 WO 2013128769A1 JP 2012083481 W JP2012083481 W JP 2012083481W WO 2013128769 A1 WO2013128769 A1 WO 2013128769A1
Authority
WO
WIPO (PCT)
Prior art keywords
vibrating body
input device
base
main surface
wiring
Prior art date
Application number
PCT/JP2012/083481
Other languages
English (en)
Japanese (ja)
Inventor
横山 良一
中村 真也
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2014501976A priority Critical patent/JP5908969B2/ja
Publication of WO2013128769A1 publication Critical patent/WO2013128769A1/fr

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/016Input arrangements with force or tactile feedback as computer generated output to the user
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer

Definitions

  • Such an input device includes a substrate, a detection electrode provided on the main surface of the substrate, a detection wiring provided on the main surface of the substrate and electrically connected to the detection electrode, and at least detection And a protective layer for protecting the wiring. Further, the input device includes a vibrating body that vibrates the base. Here, the vibrating body is provided on the protective layer. Since the vibrating body is provided on the protective layer, the tactile sensation can be transmitted to the user by the base body bending and vibrating in accordance with the expansion and contraction motion of the vibrating body.
  • FIG. 2 is a cross-sectional view taken along a cutting line II shown in FIG.
  • FIG. 2 is a cross-sectional view taken along a cutting line II-II shown in FIG.
  • FIG. 3 is a cross-sectional view taken along a cutting line III-III shown in FIG. It is the figure which expanded the part of A1 shown in FIG.
  • It is sectional drawing which shows the other example of the input device which concerns on this embodiment.
  • It is a flowchart shows the operation example of the input device which concerns on this embodiment.
  • It is sectional drawing which shows schematic structure of the display apparatus which concerns on this embodiment.
  • It is a perspective view which shows schematic structure of the portable terminal which concerns on this embodiment.
  • the constituent material of the base 2 includes, for example, a material having translucency such as glass or plastic. Among them, glass is preferable from the viewpoint of visibility. Among the glasses, tempered glass is particularly preferable from the viewpoint of improving the strength of the substrate 2. For this reason, in the input device X1, tempered glass chemically strengthened by ion exchange is used as a constituent material of the base 2.
  • FIG. 5 is an enlarged view of the portion A1 shown in FIG.
  • reinforcing layers 21 a and 21 b are provided on the first main surface 2 a and the second main surface 2 b of the base 2. That is, the base 2 is a reinforcing layer 21a from a front surface to a predetermined distance and a reinforcing layer 21b from a back surface to a predetermined distance. That is, the surface of the reinforcing layer 21a forms the first main surface 2a, and the surface of the reinforcing layer 21b forms the second main surface 2b. Since the reinforcing layers 21a and 21b are formed, the strength of the base 2 can be improved.
  • substrate 2 which concerns on this embodiment is produced by the following methods, for example.
  • the first detection electrode pattern 3 generates capacitance between the user's finger F1 approaching the first main surface 2a of the base 2 corresponding to the input area E1, and the input position in the Y direction shown in FIG. It has a role to detect.
  • the Y direction is the short side direction of the base 2 in plan view.
  • a plurality of first detection electrode patterns 3 are provided side by side in the Y direction on the second main surface 2b of the base 2 corresponding to the input region E1.
  • the first detection electrode pattern 3 includes a first detection electrode 3a and a first inter-electrode wiring 3b.
  • the vibrating body 8 is provided in the first cutout portion 71.
  • the 1st notch part 71 is provided in a part of protective layer 7 corresponding to the non-input area
  • the first cutout portion 71 is a portion constituted by cutting out the protective layer 7 or a portion constituted by not forming the protective layer 7. That is, in this specification, a portion where the protective layer 7 is not provided is referred to as a first cutout portion 71.
  • the first notch 71 is an opening. Since the vibrating body 8 is provided in the first cutout portion 71, it is possible to reduce the possibility that a part of the protective layer 7 is peeled off from the second main surface 2b of the base body 2 due to the expansion and contraction of the vibrating body 8.
  • the detection wiring 6 is located in a region that does not overlap with a region where the vibrating body 8 is located in a plan view.
  • the wiring 6 for detection is located in the area
  • a protective sheet 9 is provided on the first main surface 2a of the base 2 corresponding to the input area E1 and the non-input area E2.
  • the protective sheet 9 has a role of protecting the first main surface 2a of the base 2 from being damaged by the contact of the user's finger F1.
  • the protective sheet 9 is provided over the entire surface of the first main surface 2 a of the base 2 via the adhesive member 91.
  • the protective sheet 9 may be provided only on the 1st main surface 2a of the base
  • the protective sheet 9 include polyester film, polypropylene film, polyethylene film, glass, or plastic.
  • the same material as that of the adhesive member 81 can be used as a constituent material of the adhesive member 91.
  • the display device Y1 includes an input device X1, a liquid crystal panel 101, a backlight 102, a circuit board 103, and a first housing 104.
  • the backlight 102 includes a light source 102a and a light guide plate 102b.
  • the light source 102a has a role of emitting light toward the light guide plate 102b.
  • the light source 102 includes, for example, an LED (Light (Emitting Diode). Instead of the LED, a cold cathode fluorescent lamp, a halogen lamp, a xenon lamp, or an EL (Electro-Luminescence) may be used.
  • the light guide plate 102b has a role for guiding light from the light source 102a substantially uniformly over the entire lower surface of the liquid crystal panel 101.
  • the circuit board 103 is a plate-like or film-like board constituting an electronic circuit by mounting components such as an IC (Integrated Circuit), a resistor, and a capacitor on the surface, and connecting the components by wiring.
  • the circuit board 103 is disposed on the back side of the backlight 102.
  • the circuit board 103 is provided with a connector. For example, the flexible board F1 and the flexible board F2 are inserted into this connector.
  • the first housing 104 has a role of accommodating the liquid crystal panel 101, the backlight 102, and the circuit board 103.
  • Examples of the constituent material of the first housing 104 include a resin such as polycarbonate or a metal such as stainless steel or aluminum.
  • the first housing 104 has a support member 104a.
  • the support member 104a is provided so as to surround the input area E1.
  • the support member 104a has a role of supporting the non-input area E2 of the input device X1.
  • the mobile terminal P1 is an electronic device such as a mobile phone, a smartphone, or a PDA (Personal Digital Assistant).
  • the portable terminal P1 includes a display device Y1, an audio input unit 201, an audio output unit 202, a key input unit 203, and a second housing 204.
  • the mobile terminal P1 may include a short-distance wireless communication unit such as a digital camera function unit, a one-segment broadcasting tuner, an infrared communication function unit, and various interfaces, depending on the required functions. The detailed illustration and description thereof will be omitted.
  • a short-distance wireless communication unit such as a digital camera function unit, a one-segment broadcasting tuner, an infrared communication function unit, and various interfaces, depending on the required functions. The detailed illustration and description thereof will be omitted.
  • FIG. 10 is a plan view illustrating a schematic configuration of the input device X2 according to the first modification.
  • FIG. 11 is a cross-sectional view taken along the cutting line IV-IV shown in FIG.
  • FIG. 12 is an enlarged view of the portion B1 shown in FIG. 10 to 12, components having the same functions as those in FIGS. 1, 4 and 5 are given the same reference numerals, and detailed descriptions thereof are omitted.
  • the input device X2 has a second notch 211b in the reinforcing layer 21b corresponding to the first notch 71. That is, the second cutout portion 211b is a portion configured by cutting out the reinforcing layer 21b or a portion configured by not forming the reinforcing layer 21b. In addition, the second cutout portion 211 b is provided in the first cutout portion 71.
  • FIG. 13 is a plan view illustrating a schematic configuration of the input device X3 according to the second modification.
  • FIG. 14 is a cross-sectional view taken along the cutting line VV shown in FIG. 13 and 14, the same reference numerals are given to configurations having the same functions as those in FIGS. 1 and 4, and detailed descriptions thereof are omitted.
  • the vibrating body wiring 61 is provided on the second main surface 2b of the base 2 corresponding to the non-input area E2.
  • the vibrating body wiring 61 has a role of applying a voltage to the vibrating body 8 and a role of detecting a voltage generated by the vibrating body 8 in accordance with the amount of bending of the vibrating body 8.
  • the vibrating body wiring 61 according to the present embodiment is provided in a frame shape so as to surround the input region E1 so as to overlap the vibrating body 8 in plan view.
  • a part of the vibrator wiring 61 is provided on the exposed portion 22.
  • One end and the other end of the vibrator wiring 61 are located in the external conduction region G1.
  • the external conductive region G1 is connected to the flexible substrate F3.
  • a position detection driver for detecting an input position and a tactile sense transmission driver are provided on the flexible substrate F3.
  • the constituent material of the vibrator wiring 61 is the same as that of the detection wiring 6.
  • FIG. 15 is a plan view illustrating a schematic configuration of the input device X4 according to the third modification. 16 is a cross-sectional view taken along the cutting line VI-VI shown in FIG. 15 and 16, the same reference numerals are given to configurations having the same functions as those in FIGS. 1 and 4, and detailed descriptions thereof are omitted.
  • the vibrating body 8 is provided on the exposed portion 22 via an adhesive member 81a.
  • the adhesive member 81a has a light shielding property.
  • an acrylic adhesive member, a silicone adhesive member, a rubber adhesive member, a urethane adhesive member, or the like includes a black material such as carbon, titanium, or chromium. For example.
  • a light shielding film 83 may be provided on at least the upper surface of the vibrating body 8. If the light shielding film 83 is provided on at least the upper surface of the vibrating body 8, the possibility that the vibrating body 8 is visually recognized by the user can be further reduced.
  • the upper surface of the vibrating body 8 refers to a surface on the side close to the second main surface 2b of the base body 2 among the two surfaces of the vibrating body 8 facing the second main surface 2b of the base body 2.
  • FIG. 17 an example in which the light shielding film 83 is provided on the upper surface and side surfaces of the vibrating body 8 is illustrated, but the light shielding film 83 may be provided only on the upper surface of the vibrating body 8.
  • the vibrating body 8 can be visually recognized by the user even when looking into the input device X4 from an oblique direction. This is preferable because the possibility of being lost is further reduced.
  • the present invention can also be applied to, for example, a speaker technique that outputs a sound by bending and vibrating a base, or a bone conduction technique that can listen to sound through bone conduction.
  • a speaker technique that outputs a sound by bending and vibrating a base
  • a bone conduction technique that can listen to sound through bone conduction.
  • it can be applied to the cartilage conduction technique among the bone conduction techniques.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • User Interface Of Digital Computer (AREA)

Abstract

Un dispositif d'entrée équipé d'un substrat ayant une surface principale, une électrode de détection positionnée sur la surface principale du substrat, un fil de détection connecté électriquement à l'électrode de détection et positionné sur la surface principale du substrat, une couche de protection pour protéger au moins le fil de détection et positionnée sur la surface principale du substrat, et un corps vibrant pour faire vibrer le substrat, dans lequel une section de la couche de protection est prévue avec une première encoche, et le corps vibrant est positionné dans la première encoche.
PCT/JP2012/083481 2012-02-27 2012-12-25 Dispositif d'entrée, dispositif d'affichage et dispositif électronique WO2013128769A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014501976A JP5908969B2 (ja) 2012-02-27 2012-12-25 入力装置、表示装置、および電子機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-040251 2012-02-27
JP2012040251 2012-02-27

Publications (1)

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WO2013128769A1 true WO2013128769A1 (fr) 2013-09-06

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Cited By (13)

* Cited by examiner, † Cited by third party
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CN104571496A (zh) * 2013-10-07 2015-04-29 意美森公司 基于静电触觉的用户输入元件
US9806372B2 (en) 2013-10-07 2017-10-31 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US9966630B2 (en) 2016-01-27 2018-05-08 Quantumscape Corporation Annealed garnet electrolyte separators
US9970711B2 (en) 2015-04-16 2018-05-15 Quantumscape Corporation Lithium stuffed garnet setter plates for solid electrolyte fabrication
US10347937B2 (en) 2017-06-23 2019-07-09 Quantumscape Corporation Lithium-stuffed garnet electrolytes with secondary phase inclusions
US10431806B2 (en) 2013-01-07 2019-10-01 Quantumscape Corporation Thin film lithium conducting powder material deposition from flux
WO2021044877A1 (fr) * 2019-09-03 2021-03-11 Agc株式会社 Unité de production d'un substrat en verre, ensemble verre de recouvrement et dispositif d'affichage monté sur véhicule
US11158880B2 (en) 2016-08-05 2021-10-26 Quantumscape Battery, Inc. Translucent and transparent separators
US11450926B2 (en) 2016-05-13 2022-09-20 Quantumscape Battery, Inc. Solid electrolyte separator bonding agent
US11489193B2 (en) 2017-06-23 2022-11-01 Quantumscape Battery, Inc. Lithium-stuffed garnet electrolytes with secondary phase inclusions
US11600850B2 (en) 2017-11-06 2023-03-07 Quantumscape Battery, Inc. Lithium-stuffed garnet thin films and pellets having an oxyfluorinated and/or fluorinated surface and methods of making and using the thin films and pellets
US11916200B2 (en) 2016-10-21 2024-02-27 Quantumscape Battery, Inc. Lithium-stuffed garnet electrolytes with a reduced surface defect density and methods of making and using the same
US12046712B2 (en) 2018-06-06 2024-07-23 Quantumscape Battery, Inc. Solid-state battery

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CN109101111B (zh) * 2018-08-24 2021-01-29 吉林大学 融合静电力、空气压膜和机械振动的触觉再现方法与装置

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JP2011175506A (ja) * 2010-02-25 2011-09-08 Sony Corp 入力装置および電子機器
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WO2012023361A1 (fr) * 2010-08-20 2012-02-23 シャープ株式会社 Dispositif d'entrée de position, dispositif d'affichage, et procédé de fabrication de dispositifs d'entrée de position

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JP2011248851A (ja) * 2010-04-26 2011-12-08 Kyocera Corp 入力装置、およびこれを備えた表示装置
JP2012043362A (ja) * 2010-08-23 2012-03-01 Kyocera Corp 入力機能付き表示装置

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2011175506A (ja) * 2010-02-25 2011-09-08 Sony Corp 入力装置および電子機器
WO2012014745A1 (fr) * 2010-07-29 2012-02-02 京セラ株式会社 Dispositif d'entrée, dispositif d'affichage et machine
WO2012023361A1 (fr) * 2010-08-20 2012-02-23 シャープ株式会社 Dispositif d'entrée de position, dispositif d'affichage, et procédé de fabrication de dispositifs d'entrée de position

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US10431806B2 (en) 2013-01-07 2019-10-01 Quantumscape Corporation Thin film lithium conducting powder material deposition from flux
US11876208B2 (en) 2013-01-07 2024-01-16 Quantumscape Battery, Inc. Thin film lithium conducting powder material deposition from flux
US11158842B2 (en) 2013-01-07 2021-10-26 Quantumscape Battery, Inc. Thin film lithium conducting powder material deposition from flux
US11575153B2 (en) 2013-10-07 2023-02-07 Quantumscape Battery, Inc. Garnet materials for Li secondary batteries and methods of making and using garnet materials
CN104571496B (zh) * 2013-10-07 2019-05-07 意美森公司 基于静电触觉的用户输入元件
US10103405B2 (en) 2013-10-07 2018-10-16 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US11139503B2 (en) 2013-10-07 2021-10-05 Quantumscape Battery, Inc. Garnet materials for Li secondary batteries and methods of making and using garnet materials
US10290895B2 (en) 2013-10-07 2019-05-14 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US10305141B2 (en) 2013-10-07 2019-05-28 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US10347936B2 (en) 2013-10-07 2019-07-09 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US9806372B2 (en) 2013-10-07 2017-10-31 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US11658338B2 (en) 2013-10-07 2023-05-23 Quantumscape Battery, Inc. Garnet materials for li secondary batteries and methods of making and using garnet materials
US10403932B2 (en) 2013-10-07 2019-09-03 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US10403931B2 (en) 2013-10-07 2019-09-03 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US11355779B2 (en) 2013-10-07 2022-06-07 Quantumscape Battery, Inc. Garnet materials for Li secondary batteries and methods of making and using garnet materials
US10431850B2 (en) 2013-10-07 2019-10-01 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US11171358B2 (en) 2013-10-07 2021-11-09 Quantumscape Battery, Inc. Garnet materials for Li secondary batteries and methods of making and using garnet materials
US10439251B2 (en) 2013-10-07 2019-10-08 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US11171357B2 (en) 2013-10-07 2021-11-09 Quantumscape Battery, Inc. Garnet materials for Li secondary batteries and methods of making and using garnet materials
US10651502B2 (en) 2013-10-07 2020-05-12 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US11600857B2 (en) 2013-10-07 2023-03-07 Quantumscape Battery, Inc. Garnet materials for Li secondary batteries and methods of making and using garnet materials
CN104571496A (zh) * 2013-10-07 2015-04-29 意美森公司 基于静电触觉的用户输入元件
US10840544B2 (en) 2013-10-07 2020-11-17 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US10862161B2 (en) 2013-10-07 2020-12-08 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US10008742B2 (en) 2013-10-07 2018-06-26 Quantumscape Corporation Garnet materials for Li secondary batteries and methods of making and using garnet materials
US11367896B2 (en) 2013-10-07 2022-06-21 Quantumscape Battery, Inc. Garnet materials for Li secondary batteries and methods of making and using garnet materials
US11592237B2 (en) 2015-04-16 2023-02-28 Quantumscape Battery, Inc. Lithium stuffed garnet setter plates for solid electrolyte fabrication
US10746468B2 (en) 2015-04-16 2020-08-18 Quantumscape Corporation Lithium stuffed garnet setter plates for solid electrolyte fabrication
US11391514B2 (en) 2015-04-16 2022-07-19 Quantumscape Battery, Inc. Lithium stuffed garnet setter plates for solid electrolyte fabrication
US10563918B2 (en) 2015-04-16 2020-02-18 Quantumscape Corporation Lithium stuffed garnet setter plates for solid electrolyte fabrication
US9970711B2 (en) 2015-04-16 2018-05-15 Quantumscape Corporation Lithium stuffed garnet setter plates for solid electrolyte fabrication
US10422581B2 (en) 2015-04-16 2019-09-24 Quantumscape Corporation Lithium stuffed garnet setter plates for solid electrolyte fabrication
US11581576B2 (en) 2016-01-27 2023-02-14 Quantumscape Battery, Inc. Annealed garnet electrolyte separators
US9966630B2 (en) 2016-01-27 2018-05-08 Quantumscape Corporation Annealed garnet electrolyte separators
US10804564B2 (en) 2016-01-27 2020-10-13 Quantumscape Corporation Annealed garnet electrolyte separators
US11165096B2 (en) 2016-01-27 2021-11-02 Quantumscape Battery, Inc. Annealed garnet electrolycte separators
US10361455B2 (en) 2016-01-27 2019-07-23 Quantumscape Corporation Annealed garnet electrolyte separators
US11881596B2 (en) 2016-05-13 2024-01-23 Quantumscape Battery, Inc. Solid electrolyte separator bonding agent
US11450926B2 (en) 2016-05-13 2022-09-20 Quantumscape Battery, Inc. Solid electrolyte separator bonding agent
US11158880B2 (en) 2016-08-05 2021-10-26 Quantumscape Battery, Inc. Translucent and transparent separators
US11916200B2 (en) 2016-10-21 2024-02-27 Quantumscape Battery, Inc. Lithium-stuffed garnet electrolytes with a reduced surface defect density and methods of making and using the same
US11489193B2 (en) 2017-06-23 2022-11-01 Quantumscape Battery, Inc. Lithium-stuffed garnet electrolytes with secondary phase inclusions
US11901506B2 (en) 2017-06-23 2024-02-13 Quantumscape Battery, Inc. Lithium-stuffed garnet electrolytes with secondary phase inclusions
US10347937B2 (en) 2017-06-23 2019-07-09 Quantumscape Corporation Lithium-stuffed garnet electrolytes with secondary phase inclusions
US11600850B2 (en) 2017-11-06 2023-03-07 Quantumscape Battery, Inc. Lithium-stuffed garnet thin films and pellets having an oxyfluorinated and/or fluorinated surface and methods of making and using the thin films and pellets
US11817551B2 (en) 2017-11-06 2023-11-14 Quantumscape Battery, Inc. Lithium-stuffed garnet thin films and pellets having an oxyfluorinated and/or fluorinated surface and methods of making and using the thin films and pellets
US12046712B2 (en) 2018-06-06 2024-07-23 Quantumscape Battery, Inc. Solid-state battery
WO2021044877A1 (fr) * 2019-09-03 2021-03-11 Agc株式会社 Unité de production d'un substrat en verre, ensemble verre de recouvrement et dispositif d'affichage monté sur véhicule

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