WO2013123105A3 - Method of manufacturing a chemical mechanical planarization pad - Google Patents

Method of manufacturing a chemical mechanical planarization pad Download PDF

Info

Publication number
WO2013123105A3
WO2013123105A3 PCT/US2013/026015 US2013026015W WO2013123105A3 WO 2013123105 A3 WO2013123105 A3 WO 2013123105A3 US 2013026015 W US2013026015 W US 2013026015W WO 2013123105 A3 WO2013123105 A3 WO 2013123105A3
Authority
WO
WIPO (PCT)
Prior art keywords
chemical mechanical
mechanical planarization
planarization pad
manufacturing
temperature
Prior art date
Application number
PCT/US2013/026015
Other languages
French (fr)
Other versions
WO2013123105A2 (en
Inventor
John Erik Aldeborgh
Peter Renteln
Robert P. Dolan
Original Assignee
Innopad, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innopad, Inc. filed Critical Innopad, Inc.
Publication of WO2013123105A2 publication Critical patent/WO2013123105A2/en
Publication of WO2013123105A3 publication Critical patent/WO2013123105A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The present disclosure relates to a process for forming a chemical mechanical planarization pad. The process includes forming a chemical mechanical planarization pad including a polymer matrix and an embedded structure by heating the polymer matrix and the embedded structure at a first temperature T1 and a first pressure P1. The chemical mechanical planarization pad is then allowed to deform at a second temperature T2 and a second pressure P2. The chemical mechanical planarization pad is then compressed at given mold cavity thickness by applying heat at a third temperature T3, wherein T1> T2, P1>P2, T1≤T3.
PCT/US2013/026015 2012-02-14 2013-02-14 Method of manufacturing a chemical mechanical planarization pad WO2013123105A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261598476P 2012-02-14 2012-02-14
US61/598,476 2012-02-14

Publications (2)

Publication Number Publication Date
WO2013123105A2 WO2013123105A2 (en) 2013-08-22
WO2013123105A3 true WO2013123105A3 (en) 2015-06-18

Family

ID=48944458

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2013/026015 WO2013123105A2 (en) 2012-02-14 2013-02-14 Method of manufacturing a chemical mechanical planarization pad

Country Status (3)

Country Link
US (1) US20130205679A1 (en)
TW (1) TW201402272A (en)
WO (1) WO2013123105A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020182867A1 (en) * 2001-06-04 2002-12-05 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
US7048610B1 (en) * 2005-01-26 2006-05-23 Intel Corporation Conditioning polishing pad for chemical-mechanical polishing
US20080085661A1 (en) * 2006-07-19 2008-04-10 Innopad, Inc. Polishing Pad Having Micro-Grooves On The Pad Surface
US20090170413A1 (en) * 2007-12-31 2009-07-02 Innopad, Inc. Chemical-mechanical planarization pad
US20090258588A1 (en) * 2008-04-11 2009-10-15 Innopad, Inc. Chemical Mechanical Planarization Pad With Void Network
US20110171883A1 (en) * 2010-01-13 2011-07-14 Nexplanar Corporation CMP pad with local area transparency

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
US6863774B2 (en) * 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US8758659B2 (en) * 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
SG190249A1 (en) * 2010-11-18 2013-06-28 Cabot Microelectronics Corp Polishing pad comprising transmissive region

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020182867A1 (en) * 2001-06-04 2002-12-05 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
US7048610B1 (en) * 2005-01-26 2006-05-23 Intel Corporation Conditioning polishing pad for chemical-mechanical polishing
US20080085661A1 (en) * 2006-07-19 2008-04-10 Innopad, Inc. Polishing Pad Having Micro-Grooves On The Pad Surface
US20090170413A1 (en) * 2007-12-31 2009-07-02 Innopad, Inc. Chemical-mechanical planarization pad
US20090258588A1 (en) * 2008-04-11 2009-10-15 Innopad, Inc. Chemical Mechanical Planarization Pad With Void Network
US20110171883A1 (en) * 2010-01-13 2011-07-14 Nexplanar Corporation CMP pad with local area transparency

Also Published As

Publication number Publication date
US20130205679A1 (en) 2013-08-15
WO2013123105A2 (en) 2013-08-22
TW201402272A (en) 2014-01-16

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