WO2013101428A8 - Heat exchange assembly and methods of assembling same - Google Patents

Heat exchange assembly and methods of assembling same Download PDF

Info

Publication number
WO2013101428A8
WO2013101428A8 PCT/US2012/068240 US2012068240W WO2013101428A8 WO 2013101428 A8 WO2013101428 A8 WO 2013101428A8 US 2012068240 W US2012068240 W US 2012068240W WO 2013101428 A8 WO2013101428 A8 WO 2013101428A8
Authority
WO
WIPO (PCT)
Prior art keywords
section
condenser
evaporator
channel
heat exchange
Prior art date
Application number
PCT/US2012/068240
Other languages
French (fr)
Other versions
WO2013101428A1 (en
Inventor
Shakti Singh CHAUHAN
Jr. Stanton Earl Weaver
Tao Deng
Christopher Michael EASTMAN
Wenwu Zhang
Original Assignee
General Electric Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Company filed Critical General Electric Company
Priority to CN201280070948.3A priority Critical patent/CN104205326A/en
Priority to EP12809905.8A priority patent/EP2798674B1/en
Publication of WO2013101428A1 publication Critical patent/WO2013101428A1/en
Publication of WO2013101428A8 publication Critical patent/WO2013101428A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.
PCT/US2012/068240 2011-12-29 2012-12-06 Heat exchange assembly and methods of assembling same WO2013101428A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280070948.3A CN104205326A (en) 2011-12-29 2012-12-06 Heat exchange assembly and methods of assembling same
EP12809905.8A EP2798674B1 (en) 2011-12-29 2012-12-06 Heat exchange assembly and methods of assembling same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/340,058 US8811014B2 (en) 2011-12-29 2011-12-29 Heat exchange assembly and methods of assembling same
US13/340,058 2011-12-29

Publications (2)

Publication Number Publication Date
WO2013101428A1 WO2013101428A1 (en) 2013-07-04
WO2013101428A8 true WO2013101428A8 (en) 2014-10-02

Family

ID=47501435

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/068240 WO2013101428A1 (en) 2011-12-29 2012-12-06 Heat exchange assembly and methods of assembling same

Country Status (4)

Country Link
US (1) US8811014B2 (en)
EP (1) EP2798674B1 (en)
CN (1) CN104205326A (en)
WO (1) WO2013101428A1 (en)

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US8780559B2 (en) * 2011-12-29 2014-07-15 General Electric Company Heat exchange assembly for use with electrical devices and methods of assembling an electrical device
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US9685393B2 (en) * 2013-03-04 2017-06-20 The Hong Kong University Of Science And Technology Phase-change chamber with patterned regions of high and low affinity to a phase-change medium for electronic device cooling
US9426932B2 (en) * 2013-03-13 2016-08-23 Silicon Graphics International Corp. Server with heat pipe cooling
US9612920B2 (en) 2013-03-15 2017-04-04 Silicon Graphics International Corp. Hierarchical system manager rollback
JP5857208B2 (en) * 2013-08-29 2016-02-10 パナソニックＩｐマネジメント株式会社 Thermal storage unit and thermal storage module using the same
US10269682B2 (en) * 2015-10-09 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
CN107360695B (en) * 2016-05-09 2019-07-23 鹏鼎控股(深圳)股份有限公司 Radiator structure and preparation method thereof
TWM532046U (en) * 2016-06-02 2016-11-11 Tai Sol Electronics Co Ltd Vapor chamber with liquid-vapor separating structure
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
US11543188B2 (en) 2016-06-15 2023-01-03 Delta Electronics, Inc. Temperature plate device
US11320211B2 (en) * 2017-04-11 2022-05-03 Cooler Master Co., Ltd. Heat transfer device
FR3065279B1 (en) * 2017-04-18 2019-06-07 Euro Heat Pipes EVAPORATOR WITH OPTIMIZED VAPORIZATION INTERFACE
US10453768B2 (en) 2017-06-13 2019-10-22 Microsoft Technology Licensing, Llc Thermal management devices and systems without a separate wicking structure and methods of manufacture and use
CN109285820B (en) 2017-07-20 2021-01-22 京东方科技集团股份有限公司 Heat dissipation structure, manufacturing method thereof and display device
CN108106473B (en) * 2018-01-12 2019-07-05 奇鋐科技股份有限公司 The hot transmission module of phase stream
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
JP7159806B2 (en) * 2018-11-21 2022-10-25 トヨタ自動車株式会社 Heat exchanger
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape

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Also Published As

Publication number Publication date
US8811014B2 (en) 2014-08-19
EP2798674B1 (en) 2019-04-10
WO2013101428A1 (en) 2013-07-04
EP2798674A1 (en) 2014-11-05
US20130168050A1 (en) 2013-07-04
CN104205326A (en) 2014-12-10

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