WO2013091751A3 - Electrically conductive component and method for producing such a component - Google Patents

Electrically conductive component and method for producing such a component Download PDF

Info

Publication number
WO2013091751A3
WO2013091751A3 PCT/EP2012/004540 EP2012004540W WO2013091751A3 WO 2013091751 A3 WO2013091751 A3 WO 2013091751A3 EP 2012004540 W EP2012004540 W EP 2012004540W WO 2013091751 A3 WO2013091751 A3 WO 2013091751A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
producing
electrically conductive
salt solution
metal layer
Prior art date
Application number
PCT/EP2012/004540
Other languages
German (de)
French (fr)
Other versions
WO2013091751A2 (en
Inventor
Wolfgang Winkelmann
Wolfgang Weinhold
Original Assignee
Schoeller-Electronics Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller-Electronics Gmbh filed Critical Schoeller-Electronics Gmbh
Publication of WO2013091751A2 publication Critical patent/WO2013091751A2/en
Publication of WO2013091751A3 publication Critical patent/WO2013091751A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Abstract

The invention relates to a method for producing an electrically conductive component (1), in particular a circuit board, wherein a metal layer is applied to a conductive surface of the component (1) by galvanic deposition from a metal salt solution (2) and carbon nanoparticles (5) are admixed with the metal salt solution (2). The component (1), having the metal layer deposited thereon, has an improved predetermined mechanical characteristic and/or a predetermined electrical characteristic.
PCT/EP2012/004540 2011-12-23 2012-10-30 Electrically conductive component and method for producing such a component WO2013091751A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011122283A DE102011122283A1 (en) 2011-12-23 2011-12-23 Electrically conductive component and method for producing such a component
DE102011122283.2 2011-12-23

Publications (2)

Publication Number Publication Date
WO2013091751A2 WO2013091751A2 (en) 2013-06-27
WO2013091751A3 true WO2013091751A3 (en) 2013-08-15

Family

ID=47215481

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/004540 WO2013091751A2 (en) 2011-12-23 2012-10-30 Electrically conductive component and method for producing such a component

Country Status (2)

Country Link
DE (1) DE102011122283A1 (en)
WO (1) WO2013091751A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102562279B1 (en) * 2018-01-26 2023-07-31 삼성전자주식회사 Plating solution and metal composite and method of manufacturing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005021429A1 (en) * 2003-08-22 2005-03-10 Plansee Aktiengesellschaft Method for producing a layer or a film from a metal nanotube composite material
US20070036978A1 (en) * 2005-05-20 2007-02-15 University Of Central Florida Carbon nanotube reinforced metal composites
DE102007002111A1 (en) * 2007-01-15 2008-07-17 Futurecarbon Gmbh Plating bath for plating component has second liquid component in form of dispersion mixed with first one
US20090256255A1 (en) * 2008-04-10 2009-10-15 Sun Microsystems, Inc. Composite interconnect

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070158619A1 (en) * 2006-01-12 2007-07-12 Yucong Wang Electroplated composite coating
AT9473U1 (en) 2006-05-04 2007-10-15 Austria Tech & System Tech METHOD FOR PRODUCING AT LEAST ONE CONDUCTIVE ELEMENT OF A CONDUCTOR PLATE, AND PCB AND USE OF SUCH A METHOD
KR20090036600A (en) 2006-08-03 2009-04-14 바스프 에스이 Method for applying a metal layer to a substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005021429A1 (en) * 2003-08-22 2005-03-10 Plansee Aktiengesellschaft Method for producing a layer or a film from a metal nanotube composite material
US20070036978A1 (en) * 2005-05-20 2007-02-15 University Of Central Florida Carbon nanotube reinforced metal composites
DE102007002111A1 (en) * 2007-01-15 2008-07-17 Futurecarbon Gmbh Plating bath for plating component has second liquid component in form of dispersion mixed with first one
US20090256255A1 (en) * 2008-04-10 2009-10-15 Sun Microsystems, Inc. Composite interconnect

Also Published As

Publication number Publication date
WO2013091751A2 (en) 2013-06-27
DE102011122283A1 (en) 2013-06-27

Similar Documents

Publication Publication Date Title
PH12016502502A1 (en) Printed circuit board, electronic component, and method for producing printed circuit board
WO2013019541A3 (en) Low-stress vias
IN2014KN01179A (en)
MY184588A (en) Disk having an electrical connection element
MX346351B (en) Method for producing a pane having an electrical connection element.
WO2015069184A8 (en) A guard structure for signal isolation
MX2013005144A (en) Method for reducing creep corrosion.
WO2012094436A3 (en) Electronic components on paper-based substrates
GB2502753A (en) A non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate
WO2011079918A3 (en) Conductor structural element and method for producing a conductor structural element
WO2010149579A3 (en) Method for producing a structured metal coating
WO2011029629A3 (en) Method for producing an electric component and electric component
WO2012175207A3 (en) Electronic assembly and method for the production thereof
JP2013187313A5 (en)
WO2012110875A3 (en) Method of producing displacement plating precursor
WO2010011009A9 (en) Metal substrate for an electronic component module, module comprising same, and method for manufacturing a metal substrate for an electronic component module
WO2012167175A8 (en) Copper nanoparticle application processes for low-temperature printable, flexible or conformal electronics and antennas
WO2013043730A3 (en) Electrical contacts to nanostructured areas
WO2014124773A3 (en) Method for depositing a first metallic layer onto non-conductive polymers
WO2012072070A3 (en) Sensor comprising a preferably multilayered ceramic substrate and method for producing it
WO2014184102A3 (en) Method for depositing thick copper layers onto sintered materials
WO2012091487A3 (en) Electrode, and electronic device comprising same
WO2011112409A3 (en) Wiring substrate with customization layers
MY154122A (en) Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuit
TW201130093A (en) Substrate for mounting element, and method for manufacturing the substrate

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12788118

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 12788118

Country of ref document: EP

Kind code of ref document: A2