WO2013084802A1 - Non-contact rotation angle detection device, manufacturing method therefor and throttle valve control apparatus - Google Patents

Non-contact rotation angle detection device, manufacturing method therefor and throttle valve control apparatus Download PDF

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Publication number
WO2013084802A1
WO2013084802A1 PCT/JP2012/081026 JP2012081026W WO2013084802A1 WO 2013084802 A1 WO2013084802 A1 WO 2013084802A1 JP 2012081026 W JP2012081026 W JP 2012081026W WO 2013084802 A1 WO2013084802 A1 WO 2013084802A1
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WO
WIPO (PCT)
Prior art keywords
gap
rotation angle
resin
angle detection
resin member
Prior art date
Application number
PCT/JP2012/081026
Other languages
French (fr)
Japanese (ja)
Inventor
和生 松本
浩朗 曽山
Original Assignee
株式会社ミクニ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社ミクニ filed Critical 株式会社ミクニ
Priority to CN201280057781.7A priority Critical patent/CN103998898A/en
Priority to MX2014006738A priority patent/MX2014006738A/en
Publication of WO2013084802A1 publication Critical patent/WO2013084802A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02D—CONTROLLING COMBUSTION ENGINES
    • F02D11/00—Arrangements for, or adaptations to, non-automatic engine control initiation means, e.g. operator initiated
    • F02D11/06—Arrangements for, or adaptations to, non-automatic engine control initiation means, e.g. operator initiated characterised by non-mechanical control linkages, e.g. fluid control linkages or by control linkages with power drive or assistance
    • F02D11/10—Arrangements for, or adaptations to, non-automatic engine control initiation means, e.g. operator initiated characterised by non-mechanical control linkages, e.g. fluid control linkages or by control linkages with power drive or assistance of the electric type
    • F02D11/106—Detection of demand or actuation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02D—CONTROLLING COMBUSTION ENGINES
    • F02D9/00—Controlling engines by throttling air or fuel-and-air induction conduits or exhaust conduits
    • F02D9/08—Throttle valves specially adapted therefor; Arrangements of such valves in conduits
    • F02D9/10—Throttle valves specially adapted therefor; Arrangements of such valves in conduits having pivotally-mounted flaps
    • F02D9/1035—Details of the valve housing
    • F02D9/105—Details of the valve housing having a throttle position sensor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02D—CONTROLLING COMBUSTION ENGINES
    • F02D9/00—Controlling engines by throttling air or fuel-and-air induction conduits or exhaust conduits
    • F02D9/08—Throttle valves specially adapted therefor; Arrangements of such valves in conduits
    • F02D9/10—Throttle valves specially adapted therefor; Arrangements of such valves in conduits having pivotally-mounted flaps
    • F02D9/107—Manufacturing or mounting details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02D—CONTROLLING COMBUSTION ENGINES
    • F02D9/00—Controlling engines by throttling air or fuel-and-air induction conduits or exhaust conduits
    • F02D9/08—Throttle valves specially adapted therefor; Arrangements of such valves in conduits
    • F02D9/10—Throttle valves specially adapted therefor; Arrangements of such valves in conduits having pivotally-mounted flaps
    • F02D9/1075—Materials, e.g. composites
    • F02D9/108—Plastics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/30—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/142—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage using Hall-effect devices
    • G01D5/145—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage using Hall-effect devices influenced by the relative movement between the Hall device and magnetic fields

Definitions

  • the present invention relates to a non-contact rotation angle detection device, a manufacturing method thereof, and a throttle valve control device.
  • An electronically controlled throttle valve control device that controls the intake air amount of an engine may be abbreviated as a non-contact rotation angle detection device (hereinafter referred to as a “rotation angle detection sensor”) for detecting the rotation angle of the throttle valve. .) Is provided.
  • a magnetic sensing element provided with a magnetic sensing part hereinafter sometimes abbreviated as “Hall IC” is used at one end of a shaft-like rotational body that rotates a throttle valve. The rotation angle of the rotating body is detected based on a magnetic field generated between a pair of magnets mounted so as to face each other with the rotating shaft of the rotating body therebetween.
  • the magnetic sensing part of the Hall IC and the space where the Hall IC is arranged are sealed with a resin member (see Patent Documents 1 and 2), or the terminal group of the Hall IC is heated.
  • a technique of sealing with a curable resin has been proposed (see Patent Document 3).
  • the technique described in Patent Document 1 reduces the stress applied to the magnetic sensitive part while protecting the magnetic sensitive part from dew condensation and migration. Can be prevented or reduced.
  • the technique described in Patent Document 2 in addition to suppressing adhesion of grease, foreign substances, etc., suppression of short circuit between terminals of the Hall IC, prevention of vibration of the Hall IC caused by vibration, etc., heat generated when the resin hardens.
  • Patent Document 3 When the deformation stress of the resin due to the change acts on the Hall IC, the resin itself deforms and absorbs this stress, and the positional deviation of the Hall IC can be suppressed. Further, the technique described in Patent Document 3 can minimize the movement of the linear expansion coefficient of the internal components sealed with the thermosetting resin, and as a result, the output change characteristics of the Hall IC with respect to the rotation angle of the magnet. The variation in detection accuracy among products can be suppressed.
  • JP 2005-106781 A (Claim 1, paragraph number 0005)
  • Patent No. 4695929 (Claim 1, paragraph numbers 0015, 0099-0101, etc.)
  • JP 2008-64737 A (Claims 3 and 4, paragraph number 0014, etc.)
  • Such a non-contact rotation angle detection device is required to be used in a temperature range of ⁇ 40 ° C. to 120 ° C., and therefore, variations in detection accuracy among individual devices may be small over the entire temperature range. desirable.
  • the output of the Hall IC changes depending on the temperature, output correction is performed by the IC circuit constituting the Hall IC.
  • the resin loses flexibility and becomes very hard when the temperature is low, particularly below the glass transition temperature. If the resin that seals the Hall IC or its magnetic sensing part loses its flexibility, a strong deformation stress is applied to the Hall IC or its magnetic sensing part, which may increase detection accuracy variation.
  • Such variation in detection accuracy is difficult to suppress only by correcting the output of the Hall IC itself. In this case, the yield at the time of manufacturing a non-contact-type rotation angle detection device is reduced.
  • the present invention has been made in view of the above circumstances, and a non-contact rotation angle detection device with little variation in detection accuracy among individuals even in a temperature environment of around -40 degrees, its manufacturing method, and the non-contact rotation angle It is an object to provide a throttle valve control device using a detection device.
  • a non-contact rotation angle detection device of the present invention includes a stator having a gap, a magnetically sensitive element that is disposed in the gap, includes a magnetic sensing portion, and detects a magnetic flux that changes due to rotation of the rotating body, A circuit board electrically connected to the magnetically sensitive element; a holding part that holds the stator; a housing that communicates with the gap of the stator held by the holding part and includes a storage part that stores the circuit board; A resin member filled in the gap and in the housing portion so as to surround the magnetically sensitive element and the circuit board, and at least a resin member surrounding the magnetically sensitive portion has a glass transition temperature of ⁇ 40 ° C. or less. It is characterized by being.
  • the resin member filled in the gap so as to surround at least the magnetically sensitive portion is made of a urethane resin.
  • an epoxy resin and a urethane resin are used as the resin member filled in the gap and in the housing portion so as to surround the magnetically sensitive element and the circuit board, and at least It is preferable that the resin member filled in the gap so as to surround the magnetically sensitive portion is made of urethane resin.
  • the resin member filled in the gap and the housing portion so as to surround the magnetically sensitive element and the circuit board is made of urethane resin.
  • the magnetically sensitive element has an element body part in which a magnetically sensitive part and a sensor IC are integrally formed, and the magnetically sensitive element and the circuit board are provided.
  • the glass transition temperature of at least the resin member surrounding the element main body is ⁇ 40 ° C. or less.
  • a non-contact rotation angle detection device manufacturing method comprising: a stator having a gap; a holding portion that holds the stator; and a stator gap held by the holding portion; An uncured resin material filling step of filling an uncured resin material having a glass transition temperature in the cured state of ⁇ 40 ° C. or less into at least a gap of a housing including Uncured resin material is filled so that at least the magnetically sensitive element that includes a magnetically sensitive part and detects magnetic flux that changes as the rotating body rotates is surrounded by the uncured resin material.
  • a non-contact rotation angle detector of the present invention is produced through at least a magnetic sensitive element arranging step of arranging a magnetic sensitive element in the formed gap and a curing step of curing an uncured resin material. And features.
  • the manufacturing method of the non-contact type rotational angle detecting device of the second aspect of the present invention includes a magnetically sensitive portion and hardens at least the magnetically sensitive portion of the magnetically sensitive element that detects the magnetic flux that changes due to the rotation of the rotating body.
  • the non-contact-type rotation angle detection device of the present invention is manufactured through at least a process and a curing process for curing an uncured resin material.
  • the throttle valve control device includes an intake passage, a shaft-like rotator that is provided so as to cross the radial direction of the intake passage and penetrate the intake passage, and is fixed to the rotator, and the intake passage
  • a throttle body provided at least with a throttle valve rotatably mounted therein, and a pair of magnets mounted on one end of the rotating body so as to face each other with the rotation shaft of the rotating body therebetween, and a pair of It has at least the non-contact type rotational angle detection device of the present invention attached to the throttle body so that the stator is disposed between the magnets.
  • a non-contact type rotational angle detection device having a small variation in detection accuracy among individuals even in a temperature environment near ⁇ 40 degrees, a manufacturing method thereof, and a throttle valve control using the non-contact type rotational angle detection device An apparatus can be provided.
  • FIG. 5A is a diagram showing a state in which the uncured resin material is filled in the gap of the stator, and FIG.
  • FIG. 5B is a diagram in which the uncured resin material is filled in the gap and the storage portion. It is a figure which shows the state made. It is a schematic cross section explaining a magnetic sensitive element arrangement process in a manufacturing method of a non-contact type rotation angle detecting device of a first this embodiment.
  • FIG. 6 (A) is a diagram showing a state in which the main part of the element body portion of the Hall element is buried in the uncured resin material in the gap of the stator
  • FIG. It is a figure which shows the state in which the Hall element and the circuit board are buried in the uncured resin material in the space and the storage part.
  • FIG. 7 is a schematic cross-sectional view for explaining steps performed after the state shown in FIG. 6A in the manufacturing method of the non-contact rotation angle detection device of the first embodiment. It is a schematic cross section explaining a dipping process in the manufacturing method of the non-contact-type rotation angle detection device of the second embodiment.
  • FIG. 1 is an overview perspective view showing an example of a throttle valve control device of the present embodiment.
  • FIG. 2 is a schematic cross-sectional view showing an example of the non-contact type rotational angle detection device of the present embodiment. Specifically, the throttle valve control device shown in FIG. It is an enlarged view shown about the principal part of a detection apparatus.
  • the throttle body 20 includes a hollow cylindrical intake passage 22, a shaft-like rotating body (throttle shaft 24) provided so as to cross the radial direction of the intake passage 22 and penetrate the intake passage 22, and a throttle shaft A throttle valve 26 fixed to 24 and rotatably mounted in the intake passage 22, and a pair of throttle shafts 24 attached to one end of the throttle shaft 24 so as to face each other with the rotation axis A of the throttle shaft 24 therebetween.
  • a magnet 28 and the like are provided.
  • the rotation angle detection sensor 100 is attached to the throttle body 20 so that the stator 110 constituting the rotation angle detection sensor 100 is disposed between the pair of magnets 28.
  • the pair of magnets 28 is fixed to the surface of the plate-like gear 30 attached to one end of the throttle shaft 24 on the side opposite to the side connected to the throttle shaft 24.
  • the rotation angle detection sensor 100A shown in FIG. 2 detects the magnetic flux that is arranged in the stator 110 having the air gap 110S, is provided in the air gap 110S, has a magnetic sensing portion, and changes as the throttle shaft 24 rotates.
  • the magnetically sensitive element (Hall IC 120A (120)), the circuit board 130 electrically connected to the Hall IC 120A, the holding portion 140H holding the stator 110, and the gap 110S of the stator 110 held by the holding portion 140H are communicated.
  • a housing 140 having a housing part 140S for housing the circuit board 130, a resin member 150A (150) filled in the gap 110S and the housing part 140S so as to surround the Hall IC 120 and the circuit board 130, and the like are provided. Yes.
  • the housing 140 is made of, for example, thermoplastic polybutylene terephthalate resin (PBT), thermoplastic polyphenylene sulfide resin (PPS), or the like. Moreover, you may attach a metal magnetic-shield board to the rotation angle detection sensor 100A as needed so that the surface of the resin member 150A with which the accommodating part 140S was filled may be covered.
  • PBT thermoplastic polybutylene terephthalate resin
  • PPS thermoplastic polyphenylene sulfide resin
  • the Hall IC 120A shown in FIG. 2 is an integrated Hall IC having an element main body 122 in which a magnetic sensing portion and a sensor IC are integrally formed, and a terminal 124 is attached to the element main body 122. ing.
  • the Hall IC 120A is electrically connected to the circuit board 130 via the terminal 124.
  • a magnetic sensing part 126A and a sensor IC 126B as illustrated in FIG. 3 are provided separately from the Hall IC 120A illustrated in FIG.
  • the separated Hall IC 120B (120) can also be used.
  • a portion including the magnetic sensing portion 126A, the sensor IC 126B, and the connection line 126C shown in FIG. 3 is a portion having a function corresponding to the element main body portion 122 of the Hall IC 120A shown in FIG.
  • the throttle valve 26 that controls the amount of intake air flowing through the intake passage 22 is opened and closed as follows. First, in accordance with the degree of depression of the accelerator pedal, a control signal issued from a control means (not shown) such as an engine control unit is transmitted to a motor (not shown) arranged in the throttle body 20, and the motor is driven and controlled. The Then, this motor transmits the driving force to the throttle shaft 24 through power transmission means such as the gear 30, and the throttle valve 26 is opened and closed. At this time, the opening / closing degree of the throttle valve 26 is detected by the rotation angle detection sensor 100 as the rotation angle of the throttle shaft 24.
  • the control means for outputting the output signal the rotation angle of the throttle shaft 24, that is, the opening degree of the throttle valve 26 is calculated based on the output signal. Based on the opening degree thus detected and other detection signals such as the engine speed, correction control of the opening degree of the throttle valve 26 is performed by the control means.
  • a resin member 152A that surrounds at least the element body 122 has a glass transition temperature of ⁇ 40 degrees or less.
  • the magnetic sensing part constituting a part of the element body 122 is substantially surrounded by a resin member having a glass transition temperature of ⁇ 40 degrees or less.
  • the glass transition temperature of the resin member 152B surrounding the magnetic part 126A may be ⁇ 40 degrees or less.
  • the separated Hall IC 120B illustrated in FIG. 3 is used instead of the integrated Hall IC 120A. Has substantially the same configuration as the rotation angle detection sensor 100A shown in FIG.
  • the resin member 152A surrounding the element main body 122 shown in FIG. 2 and the magnetic sensing part 126A shown in FIG. 4 are enclosed even in the vicinity of ⁇ 40 degrees which is the lowest temperature range of the rotation temperature detection sensor 100.
  • the resin member 152B does not lose flexibility. For this reason, since the deformation stress accompanying the loss of flexibility of the resin member 152A is not applied to the element main body portion 122 in which the magnetically sensitive portion is integrally formed, the detection accuracy between the individual individuals of the rotation angle detection sensor 100A. Can be suppressed. This also applies to the rotation angle detection sensor 100B shown in FIG.
  • the element main body 122 is surrounded by the resin member 152A filled in the gap 110S, and the magnetic sensitive part 126A is surrounded by the resin member 152B filled in the gap 110S, thereby causing the positional deviation of the Hall ICs 120A and 120B. In addition to preventing it, vibration resistance can be improved.
  • the resin members 152A and 152B known resin members can be used as long as the glass transition temperature is ⁇ 40 ° C. or lower. Specific examples include urethane resins, silicone resins, and liquid fluorine-based elastomers. . However, from the viewpoint of practicality and cost, urethane resin is most preferable among these resin members. If the glass transition temperature of the resin members 152A and 152B is ⁇ 40 ° C. or lower, the lower limit is not particularly limited, but the practical point of view such as the availability of materials and the use temperature on the high temperature side are reduced. From the viewpoint of suppressing this, it is preferably ⁇ 60 ° or more.
  • the same resin member as the resin member 152A may be used, or a different resin member may be used.
  • the same resin member as the resin member 152A is used as the resin member 154A, it becomes easy to further simplify the production process of the rotation angle detection sensor 100A.
  • a resin member different from the resin member 152A is used as the resin member 154A, it is preferable to use an epoxy resin that is excellent in hardness, moisture resistance, heat resistance, chemical resistance, and the like. Thereby, the circuit board 130 and the Hall IC 120A can be more reliably protected from adhesion of moisture, heat, grease, foreign matter, etc., stress applied from the outside of the rotation angle detection sensor 100A, and the like.
  • the urethane resin suitable for use as the resin member 152A is generally inferior in moisture resistance, and has a stickiness, so that foreign matters and the like are likely to adhere to it, and the hardness is low and the mechanical durability tends to be inferior. is there. Therefore, if all of the resin member 150A, that is, both the resin member 152A and the resin member 154B are made of urethane resin, the performance may be insufficient in terms of moisture resistance, foreign matter adhesion, or mechanical durability. is there. In addition, when the resin member 150A is filled with urethane resin in the gap 110S and the storage portion 140S using a two-component curable urethane resin under atmospheric pressure, bubbles easily remain in the urethane resin matrix.
  • urethane resin suitable for use as the resin members 152A and 152B commercially available products can be used.
  • MU-115A / MU-115B manufactured by Pernox Corporation, glass transition temperature: ⁇ 50 degrees
  • MU -102A / MU-102B manufactured by Pernox Co., Ltd., glass transition temperature: -55 degrees
  • UE-921A / UE-921B manufactured by Sanyu Rec Co., Ltd., glass transition temperature: -57 degrees
  • SU-1727A / SU-1727B Sanyu REC Co., Ltd., glass transition temperature: -55 degrees
  • UF-1113A / UF-1113B Sanyu REC Co., Ltd., glass transition temperature: -50 degrees
  • SU-3600A / SU-3600B Sanyu REC Co., Ltd., Glass transition temperature: -56 degrees
  • SU-3001A / SU-3001B Un
  • MU-115A / MU-115B is excellent in moisture resistance and the like, and therefore can be easily used not only as resin members 152A and 152B but also as resin members 154A and 154B. is there. Therefore, when not only the resin members 152A and 152B but also the resin members 154A and 154B are made of urethane resin having excellent moisture resistance as described above, the production process can be further simplified.
  • the urethane resin is rich in flexibility although it is inferior to the epoxy resin in terms of hardness. For this reason, even if the thermal expansion / thermal contraction of the housing 140 occurs due to the rotation angle detection sensor 100 being exposed to a significant temperature change, the resin members 150A, 150B and the housing 140 follow the same. It is easy to more reliably suppress the occurrence of a gap between them.
  • 5 to 7 are schematic cross-sectional views for explaining a method for manufacturing the rotation angle detection sensor 100 of the first embodiment. Specifically, an example of a method for manufacturing the rotation angle detection sensor 100A shown in FIG. It is a figure explaining.
  • an uncured resin material (uncured resin material 200A (200 )) Is carried out by an uncured resin material filling step of filling with a dispenser or the like (FIG. 5).
  • the uncured resin material 200A may be filled only into the gap 110S, and the uncured resin 110A in FIG.
  • the resin material 200A may be filled.
  • the former filling method two-part filling method
  • the latter filling method collective filling method
  • the uncured resin 200 is a two-component curing type, it is filled after the two components are mixed.
  • the element main body 122 of the Hall IC 120A is disposed in the gap 110S filled with the uncured resin material 200A so as to be surrounded by the uncured resin material 200A (magnetic sensitive element disposition process, FIG. 6).
  • the uncured resin material filling step is performed by the two-part filling method, as shown in FIG. 6A
  • the magnetic sensitive element placement step is finished
  • the element body portion 122 of the Hall IC 120A is obtained. Is embedded in the uncured resin material 200A.
  • the uncured resin material filling process is performed in a batch filling method, as shown in FIG. 6B, the entire Hall IC 120A and the circuit board 130 are completely formed when the magnetic sensitive element placement process is finished.
  • the Hall IC 120A used in the magnetic sensitive element arranging step it is usually preferable to use the Hall IC 120A in which the circuit board 130 is previously attached to the terminal 124 as shown in FIG.
  • the circuit board 130 is also disposed in the housing portion 140S at the same time as the element main body portion 122 is disposed in the gap 110S.
  • the magnetic sensitive part 126A of the Hall IC 120B is not surrounded by the uncured resin material 200. What is necessary is just to arrange
  • a curing process for curing the uncured resin material 200A is performed.
  • the curing method in this case can be appropriately selected according to the curing mechanism of the uncured resin material 200A to be used.
  • the curing step for example, when a thermosetting type is used as the uncured resin material 200A, heat treatment is performed, and when a photocuring type is used, UV irradiation is performed.
  • the uncured resin material 200A is a two-component curing type uncured resin material in which curing proceeds spontaneously by a chemical reaction, after the magnetic sensitive element placement step is completed, the curing is simply completed. It may be left alone, but may be heat-treated to accelerate curing.
  • the rotation angle detection sensor 100A shown in FIG. 2 can be obtained by finishing the curing process.
  • the resin member 152A and the resin member 154A are made of the same resin member.
  • the uncured resin material filling step is performed by the two-part filling method
  • the uncured resin material 200B (200) is filled into the storage portion 140S as shown in FIG.
  • a second uncured resin material filling process is performed, and then a second curing process for curing the uncured resin material 200B is performed.
  • the curing method for the uncured resin material 200B can be appropriately selected according to the curing mechanism of the uncured resin material 200B to be used.
  • a second uncured resin material filling step is performed as shown in FIG. 7, followed by a curing step in which the uncured resin materials 200A and 200B are cured together. May be.
  • the rotation angle detection sensor 100A illustrated in FIG. 2 can be obtained.
  • the resin member 152A and the resin member 154A are usually made of different resin members, but may be made of the same resin member.
  • the resin member surrounding the element body 122 in FIG. 7 is a resin member 152A that has been cured by performing the first curing process, and the curing process is performed throughout the entire process. 7 is performed only once, the resin member surrounding the element body 122 in FIG. 7 is the uncured resin member 200A.
  • FIG. 8 is a schematic cross-sectional view illustrating a method for manufacturing the rotation angle detection sensor 100 according to the second embodiment. Specifically, another example of the method for manufacturing the rotation angle detection sensor 100A illustrated in FIG. 2 will be described. It is a figure to do.
  • the uncured resin material 200A is applied to the element body portion 122 of the Hall IC 120A, or the element body portion 122 is immersed in a tank filled with the uncured resin material 200A.
  • a dipping process is performed to surround the element body 122 with the uncured resin material 200A (FIG. 8).
  • the Hall IC 120A used in this dipping process is usually preferably provided with a circuit board 130 attached in advance to the terminal 124 as shown in FIG.
  • the Hall IC 120A in which the element body portion 122 is surrounded by the uncured resin material 200A is arranged in the gap 110S (magnetic sensitive element arranging step).
  • the circuit board 130 attached to the terminal 124 is disposed in the storage portion 140S, and an intermediate product similar to that shown in FIG. 6A is obtained.
  • the rotation angle detection sensor 100A can be obtained by filling the uncured resin material 200B into the storage portion 140S and further performing the second curing step.
  • the uncured resin material 200B is filled in the storage portion 140S, and then the uncured resin materials 200A and 200B are collectively cured to perform a curing step.
  • the detection sensor 100A can be obtained.
  • the rotation angle detection sensor 100B shown in FIG. 4 When the rotation angle detection sensor 100B shown in FIG. 4 is manufactured, in the dipping process, at least the magnetic sensitive part 126A of the Hall IC 120B may be surrounded by the uncured resin material 200A, and the magnetic sensitive part 126A, the sensor IC 126B, and the connection The entire portion made of the line 126C may be surrounded by the uncured resin material 200A. And the process after a dipping process can be implemented like the case where 100 A of rotation angle detection sensors are manufactured.
  • Example 1 In the rotation angle detection sensor 100A shown in FIG. 2, urethane resin (glass transition temperature: ⁇ 50 degrees, manufactured by Pernox Corporation, MU-115A / MU-115B) is used as the resin member 152A, and epoxy resin (glass) is used as the resin member 154A. Fifteen evaluation samples were prepared using a transition temperature: ⁇ 32 degrees, manufactured by Pernox Corporation, XM-2437 / HY-690.
  • the moisture resistance of the resin member 154A on the side in direct contact with the outside world was evaluated. Specifically, the state after leaving a resin block similar to the resin member 154A in a high temperature and high humidity environment (temperature: 80 degrees, humidity: 95%) for two months was evaluated based on the following evaluation criteria. . The results are shown in Table 1.
  • C Compared with before the test, the appearance change such as the resin block surface flowing and deforming and the decrease in hardness are remarkable.
  • Example 2 Used in Example 1 except that urethane resin (glass transition temperature: ⁇ 50 degrees, manufactured by Pernox Co., Ltd., MU-115A / MU-115B) was used as the resin member 150A (that is, the resin member 152A and the resin member 154A). Fifteen evaluation samples similar to the evaluation samples were prepared. Thereafter, these evaluation samples were evaluated in the same manner as in Example 1. The results are shown in Table 1.
  • Example 3 Evaluation sample used in Example 1 except that fluororesin (glass transition temperature: -70 degrees, Shin-Etsu Chemical Co., Ltd., SIFEL 8370A / SIFEL 8370B) was used as resin member 150A (that is, resin member 152A and resin member 154A). Fifteen evaluation samples similar to those described above were prepared. Then, about these evaluation samples, evaluation similar to Example 1 was performed except hardness evaluation. The results are shown in Table 1. In addition, about the hardness, since the resin member 154A is very soft and the hardness measurement similar to Example 1 cannot be performed, it evaluated by the penetration.
  • fluororesin glass transition temperature: -70 degrees, Shin-Etsu Chemical Co., Ltd., SIFEL 8370A / SIFEL 8370B
  • Example 4 Evaluation sample used in Example 1 except that epoxy resin (glass transition temperature: -67 degrees, manufactured by San Yulec Co., Ltd., NR-200C) was used as resin member 150A (that is, resin member 152A and resin member 154A). Fifteen evaluation samples similar to those described above were prepared. Thereafter, these evaluation samples were evaluated in the same manner as in Example 1. The results are shown in Table 1.
  • Example 1 Used in Example 1 except that an epoxy resin (glass transition temperature: ⁇ 32 degrees, manufactured by Pernox Corporation, XM-2437 / HY-690) was used as the resin member 150A (that is, the resin member 152A and the resin member 154A). Fifteen evaluation samples similar to the evaluation samples were prepared. Thereafter, these evaluation samples were evaluated in the same manner as in Example 1. The results are shown in Table 1.
  • an epoxy resin glass transition temperature: ⁇ 32 degrees, manufactured by Pernox Corporation, XM-2437 / HY-690
  • Example 2 Evaluation sample used in Example 1 except that urethane resin (glass transition temperature: ⁇ 30 degrees, manufactured by Pernox, MU-204A / MU204B) was used as resin member 150A (that is, resin member 152A and resin member 154A). Fifteen evaluation samples similar to those described above were prepared. Thereafter, these evaluation samples were evaluated in the same manner as in Example 1 except for the evaluation of variation in detection accuracy. The results are shown in Table 1.
  • urethane resin glass transition temperature: ⁇ 30 degrees, manufactured by Pernox, MU-204A / MU204B
  • Throttle valve control device 20 Throttle body 22 Intake passage 24 Throttle shaft (rotary body) 26 Throttle valve 28 Magnet 30 Gear 100, 100A, 100B Rotation angle detection sensor (non-contact type rotation angle detection device) 110 Stator 110S Gap 120, 120A, 120B Hall IC (Magnetic Sensitive Element) 122 Element main body (a member in which a magnetic sensing part and a sensor IC are integrally formed) 124 Terminal 126A Magnetic Sensing Section 126B Sensor IC 126C Connection line 130 Circuit board 140 Housing 140H Holding part 140S Storage part 150, 150A, 150B Resin member 152A, 152B Resin member 154A, 154B Resin member 200, 200A, 200B Uncured resin material (uncured resin material)

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Abstract

In order to achieve small variations in detection accuracy among individual non-contact rotation angle detection devices even under a temperature environment near -40 degrees, provided are a non-contact rotation angle detection device, a manufacturing method therefor, and a throttle valve control apparatus using the same, the non-contact rotation angle detection device being provided with at least a stator (110), a Hall IC (120A) disposed in a cavity (110S) of the stator (110) and provided with a magneto-sensitive part, a circuit board (130) connected to the Hall IC (120A), a casing (140) provided with a holding part (140H) that holds the stator (110) and a housing part (140S) that communicates with the cavity (110S) and houses the circuit board (130), and a resin member (150A) filled into the cavity (110S) and into the housing part (140S) so as to surround the hall IC (120A) and the circuit board (130), the glass-transition temperature of a resin member (152A) that surrounds at least the magneto-sensitive part in the resin member (150A) being -40 degrees or lower.

Description

非接触式回転角度検出装置、その製造方法およびスロットル弁制御装置Non-contact rotation angle detection device, method for manufacturing the same, and throttle valve control device
　本発明は、非接触式回転角度検出装置、その製造方法およびスロットル弁制御装置に関するものである。 The present invention relates to a non-contact rotation angle detection device, a manufacturing method thereof, and a throttle valve control device.
　エンジンの吸入空気量を制御する電子制御式のスロットル弁制御装置には、スロットル弁の回転角度を検出するための非接触式回転角度検出装置（以下、「回転角度検出センサ」と略す場合がある。）が設けられている。この回転角度検出センサでは、感磁部を備えた磁気感応素子（以下、「ホールＩＣ」と略す場合がある。）を用いて　スロットル弁を回転させるシャフト状の回転体の一端に、当該回転体の回転軸に対して、回転体の回転軸を間にして互いに向き合うように取り付けられた一対の磁石の間に発生する磁界に基づいて回転体の回転角を検出する。 An electronically controlled throttle valve control device that controls the intake air amount of an engine may be abbreviated as a non-contact rotation angle detection device (hereinafter referred to as a “rotation angle detection sensor”) for detecting the rotation angle of the throttle valve. .) Is provided. In this rotational angle detection sensor, a magnetic sensing element provided with a magnetic sensing part (hereinafter sometimes abbreviated as “Hall IC”) is used at one end of a shaft-like rotational body that rotates a throttle valve. The rotation angle of the rotating body is detected based on a magnetic field generated between a pair of magnets mounted so as to face each other with the rotating shaft of the rotating body therebetween.
　このような回転角度検出センサにおいて、ホールＩＣの感磁部や、ホールＩＣが配置された空間を樹脂部材で封止したり（特許文献１、２参照）、あるいは、ホールＩＣの端子群を熱硬化性樹脂により封止する技術が提案されている（特許文献３参照）。このような構成を採用した場合、特許文献１に記載の技術では、感磁部を結露およびマイグレーションから保護しながらも、感磁部に加わる応力を軽減することで、当該応力に起因するセンサ特性の低下を防止あるいは低減することができる。また、特許文献２に記載の技術では、グリースや異物等の付着を抑制、ホールＩＣの端子間のショート抑制、振動に起因するホールＩＣの振れ防止等に加えて、樹脂が硬化する際の熱変化による樹脂の変形応力がホールＩＣに作用するとき、自らが変形してこの応力を吸収し、ホールＩＣの位置ずれを抑制することができる。また、特許文献３に記載の技術では、熱硬化性樹脂により封止される内部部品の線膨張係数移動を最小限に抑えることができ、その結果、磁石の回転角度に対するホールＩＣの出力変化特性の安定化を図り、製品間の検出精度ばらつきを抑制できる。 In such a rotation angle detection sensor, the magnetic sensing part of the Hall IC and the space where the Hall IC is arranged are sealed with a resin member (see Patent Documents 1 and 2), or the terminal group of the Hall IC is heated. A technique of sealing with a curable resin has been proposed (see Patent Document 3). When such a configuration is adopted, the technique described in Patent Document 1 reduces the stress applied to the magnetic sensitive part while protecting the magnetic sensitive part from dew condensation and migration. Can be prevented or reduced. In addition, in the technique described in Patent Document 2, in addition to suppressing adhesion of grease, foreign substances, etc., suppression of short circuit between terminals of the Hall IC, prevention of vibration of the Hall IC caused by vibration, etc., heat generated when the resin hardens. When the deformation stress of the resin due to the change acts on the Hall IC, the resin itself deforms and absorbs this stress, and the positional deviation of the Hall IC can be suppressed. Further, the technique described in Patent Document 3 can minimize the movement of the linear expansion coefficient of the internal components sealed with the thermosetting resin, and as a result, the output change characteristics of the Hall IC with respect to the rotation angle of the magnet. The variation in detection accuracy among products can be suppressed.
特開２００５－１０６７８１号公報（請求項１、段落番号０００５）JP 2005-106781 A (Claim 1, paragraph number 0005) 特許第４６９５９２９号（請求項１、段落番号００１５、００９９－０１０１等）Patent No. 4695929 (Claim 1, paragraph numbers 0015, 0099-0101, etc.) 特開２００８－６４７３７号公報（請求項３、４、段落番号００１４等）JP 2008-64737 A (Claims 3 and 4, paragraph number 0014, etc.)
　このような非接触式回転角度検出装置は、－４０度～１２０度の温度域での使用が要求されるため、このような温度域の全域において個々の装置間の検出精度ばらつきが小さいことが望ましい。一方、ホールＩＣは、温度により出力が変化するため、ホールＩＣを構成するＩＣ回路にて出力補正が行われる。しかしながら、樹脂は、低温になると、特にガラス転移温度以下において柔軟性を喪失し、非常に硬くなってしまう。そして、ホールＩＣやその感磁部を封止している樹脂が柔軟性を喪失すると、ホールＩＣやその感磁部に強い変形応力が加わるため、検出精度ばらつきが大きくなってしまう場合がある。そして、このような検出精度ばらつきは、ホールＩＣ自身の出力補正のみによっては抑制することが困難である。この場合、非接触式回転角度検出装置を製造する際の歩留まりの低下を招くことになる。 Such a non-contact rotation angle detection device is required to be used in a temperature range of −40 ° C. to 120 ° C., and therefore, variations in detection accuracy among individual devices may be small over the entire temperature range. desirable. On the other hand, since the output of the Hall IC changes depending on the temperature, output correction is performed by the IC circuit constituting the Hall IC. However, the resin loses flexibility and becomes very hard when the temperature is low, particularly below the glass transition temperature. If the resin that seals the Hall IC or its magnetic sensing part loses its flexibility, a strong deformation stress is applied to the Hall IC or its magnetic sensing part, which may increase detection accuracy variation. Such variation in detection accuracy is difficult to suppress only by correcting the output of the Hall IC itself. In this case, the yield at the time of manufacturing a non-contact-type rotation angle detection device is reduced.
　本発明は上記事情に鑑みてなされたものであり、－４０度近傍の温度環境下においても個体間の検出精度ばらつきの小さい非接触式回転角度検出装置、その製造方法および当該非接触式回転角度検出装置を用いたスロットル弁制御装置を提供することを課題とする。 The present invention has been made in view of the above circumstances, and a non-contact rotation angle detection device with little variation in detection accuracy among individuals even in a temperature environment of around -40 degrees, its manufacturing method, and the non-contact rotation angle It is an object to provide a throttle valve control device using a detection device.
　上記課題は以下の本発明により達成される。すなわち、
　本発明の非接触式回転角度検出装置は、空隙を備えたステータと、当該空隙内に配置され、感磁部を備え、かつ、回転体の回転によって変化する磁束を検出する磁気感応素子と、当該磁気感応素子と電気的に接続された回路基板と、ステータを保持する保持部および当該保持部に保持されたステータの空隙と連通すると共に回路基板を収納する収納部を備えた筐体と、磁気感応素子および回路基板を囲うように空隙内および収納部内に充填された樹脂部材と、を少なくとも備え、樹脂部材のうち、少なくとも感磁部を囲う樹脂部材のガラス転移温度が－４０度以下であることを特徴とする。 The above-mentioned subject is achieved by the following present invention. That is,
A non-contact rotation angle detection device of the present invention includes a stator having a gap, a magnetically sensitive element that is disposed in the gap, includes a magnetic sensing portion, and detects a magnetic flux that changes due to rotation of the rotating body, A circuit board electrically connected to the magnetically sensitive element; a holding part that holds the stator; a housing that communicates with the gap of the stator held by the holding part and includes a storage part that stores the circuit board; A resin member filled in the gap and in the housing portion so as to surround the magnetically sensitive element and the circuit board, and at least a resin member surrounding the magnetically sensitive portion has a glass transition temperature of −40 ° C. or less. It is characterized by being.
　本発明の非接触式回転角度検出装置の一実施態様は、樹脂部材のうち、少なくとも感磁部を囲うように空隙内に充填された樹脂部材がウレタン樹脂からなることが好ましい。 In one embodiment of the non-contact type rotational angle detection device of the present invention, it is preferable that the resin member filled in the gap so as to surround at least the magnetically sensitive portion is made of a urethane resin.
　本発明の非接触式回転角度検出装置の他の実施態様は、磁気感応素子および回路基板を囲うように空隙内および収納部内に充填された樹脂部材として、エポキシ樹脂およびウレタン樹脂が用いられ、少なくとも感磁部を囲うように空隙内に充填された樹脂部材がウレタン樹脂からなることが好ましい。 In another embodiment of the non-contact rotation angle detection device of the present invention, an epoxy resin and a urethane resin are used as the resin member filled in the gap and in the housing portion so as to surround the magnetically sensitive element and the circuit board, and at least It is preferable that the resin member filled in the gap so as to surround the magnetically sensitive portion is made of urethane resin.
　本発明の非接触式回転角度検出装置の他の実施態様は、磁気感応素子および回路基板を囲うように空隙内および収納部内に充填された樹脂部材が、ウレタン樹脂からなることが好ましい。 In another embodiment of the non-contact type rotational angle detection device of the present invention, it is preferable that the resin member filled in the gap and the housing portion so as to surround the magnetically sensitive element and the circuit board is made of urethane resin.
　本発明の非接触式回転角度検出装置の他の実施態様は、磁気感応素子が、感磁部と、センサＩＣとが一体的に形成された素子本体部を有し、磁気感応素子および回路基板を囲うように空隙内および収納部内に充填された樹脂部材のうち、少なくとも素子本体部を囲う樹脂部材のガラス転移温度が－４０度以下であることが好ましい。 In another embodiment of the non-contact type rotational angle detection device of the present invention, the magnetically sensitive element has an element body part in which a magnetically sensitive part and a sensor IC are integrally formed, and the magnetically sensitive element and the circuit board are provided. Among the resin members filled in the gap and the storage portion so as to surround the substrate, it is preferable that the glass transition temperature of at least the resin member surrounding the element main body is −40 ° C. or less.
　第一の本発明の非接触式回転角度検出装置の製造方法は、空隙を備えたステータと、当該ステータを保持する保持部と、当該保持部に保持されたステータの空隙と連通すると共に回路基板を収納する収納部と、を備えた筐体の少なくとも空隙内に、硬化後の状態におけるガラス転移温度が－４０度以下である未硬化状態の樹脂材料を充填する未硬化樹脂材料充填工程と、感磁部を備え、かつ、回転体の回転によって変化する磁束を検出する磁気感応素子の少なくもとも感磁部を、未硬化状態の樹脂材料によって囲うように、未硬化状態の樹脂材料が充填された空隙内に磁気感応素子を配置する磁気感応素子配置工程と、未硬化状態の樹脂材料を硬化させる硬化工程と、を少なくとも経て、本発明の非接触式回転角度検出装置を製造することを特徴とする。 According to a first aspect of the present invention, there is provided a non-contact rotation angle detection device manufacturing method comprising: a stator having a gap; a holding portion that holds the stator; and a stator gap held by the holding portion; An uncured resin material filling step of filling an uncured resin material having a glass transition temperature in the cured state of −40 ° C. or less into at least a gap of a housing including Uncured resin material is filled so that at least the magnetically sensitive element that includes a magnetically sensitive part and detects magnetic flux that changes as the rotating body rotates is surrounded by the uncured resin material. A non-contact rotation angle detector of the present invention is produced through at least a magnetic sensitive element arranging step of arranging a magnetic sensitive element in the formed gap and a curing step of curing an uncured resin material. And features.
　第二の本発明の非接触式回転角度検出装置の製造方法は、感磁部を備え、かつ、回転体の回転によって変化する磁束を検出する磁気感応素子の少なくもと感磁部を、硬化後の状態におけるガラス転移温度が－４０度以下である未硬化状態の樹脂材料で囲うディップ工程と、空隙を備えたステータと、当該ステータを保持する保持部と、当該保持部に保持されたステータの空隙と連通すると共に回路基板を収納する収納部と、を備えた筐体の少なくとも空隙内に、感磁部が未硬化状態の樹脂材料で囲われた磁気感応素子を配置する磁気感応素子配置工程と、未硬化状態の樹脂材料を硬化させる硬化工程と、を少なくとも経て、本発明の非接触式回転角度検出装置を製造することを特徴とする。 The manufacturing method of the non-contact type rotational angle detecting device of the second aspect of the present invention includes a magnetically sensitive portion and hardens at least the magnetically sensitive portion of the magnetically sensitive element that detects the magnetic flux that changes due to the rotation of the rotating body. A dipping step of enclosing with an uncured resin material having a glass transition temperature of −40 ° C. or lower in a later state, a stator provided with a gap, a holding part for holding the stator, and a stator held by the holding part A magnetic sensitive element arrangement in which a magnetic sensitive element is surrounded by an uncured resin material in at least a gap of a housing having a housing part that communicates with a gap and accommodates a circuit board. The non-contact-type rotation angle detection device of the present invention is manufactured through at least a process and a curing process for curing an uncured resin material.
　本発明のスロットル弁制御装置は、吸気通路と、当該吸気通路の径方向を横切りかつ吸気通路を貫通するように設けられたシャフト状の回転体と、当該回転体に固定され、かつ、吸気通路内に回転可能に取り付けられたスロットル弁と、回転体の一端に、回転体の回転軸を間にして互いに向き合うように取り付けられた一対の磁石と、を少なくとも備えたスロットルボディー、および、一対の磁石の間に、ステータが配置されるようにスロットルボディーに取り付けられた本発明の非接触式回転角度検出装置、を少なくとも有することを特徴とする。 The throttle valve control device according to the present invention includes an intake passage, a shaft-like rotator that is provided so as to cross the radial direction of the intake passage and penetrate the intake passage, and is fixed to the rotator, and the intake passage A throttle body provided at least with a throttle valve rotatably mounted therein, and a pair of magnets mounted on one end of the rotating body so as to face each other with the rotation shaft of the rotating body therebetween, and a pair of It has at least the non-contact type rotational angle detection device of the present invention attached to the throttle body so that the stator is disposed between the magnets.
　本発明によれば、－４０度近傍の温度環境下においても個体間の検出精度ばらつきの小さい非接触式回転角度検出装置、その製造方法および当該非接触式回転角度検出装置を用いたスロットル弁制御装置を提供することができる。 According to the present invention, a non-contact type rotational angle detection device having a small variation in detection accuracy among individuals even in a temperature environment near −40 degrees, a manufacturing method thereof, and a throttle valve control using the non-contact type rotational angle detection device An apparatus can be provided.
本実施形態のスロットル弁制御装置の一例を示す概観斜視図である。It is a general | schematic perspective view which shows an example of the throttle valve control apparatus of this embodiment. 本実施形態の非接触式回転角度検出装置の一例を示す模式断面図である。It is a schematic cross section which shows an example of the non-contact-type rotation angle detection apparatus of this embodiment. 本実施形態の非接触式回転角度検出装置に用いることのできる磁気感応素子（分離型のホールＩＣ）の一例を示す模式図である。It is a schematic diagram which shows an example of the magnetic sensitive element (separate type Hall IC) which can be used for the non-contact-type rotation angle detection apparatus of this embodiment. 本実施形態の非接触式回転角度検出装置の他の例を示す模式断面図である。It is a schematic cross section which shows the other example of the non-contact-type rotation angle detection apparatus of this embodiment. 第一の本実施形態の非接触式回転角度検出装置の製造方法において、未硬化樹脂材料充填工程について説明する模式断面図である。ここで、図５（Ａ）は、ステータの空隙内に未硬化樹脂材料が充填された状態を示す図であり、図５（Ｂ）は、当該空隙内および収納部内に未硬化樹脂材料が充填された状態を示す図である。It is a schematic cross section explaining an uncured resin material filling process in the manufacturing method of the non-contact type rotation angle detection device of the first embodiment. Here, FIG. 5A is a diagram showing a state in which the uncured resin material is filled in the gap of the stator, and FIG. 5B is a diagram in which the uncured resin material is filled in the gap and the storage portion. It is a figure which shows the state made. 第一の本実施形態の非接触式回転角度検出装置の製造方法において、磁気感応素子配置工程について説明する模式断面図である。ここで、図６（Ａ）は、ステータの空隙内において、ホール素子の素子本体部分の主要部が未硬化樹脂材料中に埋没している状態を示す図であり、図６（Ｂ）は、当該空隙内および収納部内において、ホール素子および回路基板が未硬化樹脂材料中に埋没している状態を示す図である。It is a schematic cross section explaining a magnetic sensitive element arrangement process in a manufacturing method of a non-contact type rotation angle detecting device of a first this embodiment. Here, FIG. 6 (A) is a diagram showing a state in which the main part of the element body portion of the Hall element is buried in the uncured resin material in the gap of the stator, and FIG. It is a figure which shows the state in which the Hall element and the circuit board are buried in the uncured resin material in the space and the storage part. 第一の本実施形態の非接触式回転角度検出装置の製造方法において、図６（Ａ）に示した状態以降に実施される工程を説明するための模式断面図である。FIG. 7 is a schematic cross-sectional view for explaining steps performed after the state shown in FIG. 6A in the manufacturing method of the non-contact rotation angle detection device of the first embodiment. 第二の本実施形態の非接触式回転角度検出装置の製造方法において、ディップ工程について説明する模式断面図である。It is a schematic cross section explaining a dipping process in the manufacturing method of the non-contact-type rotation angle detection device of the second embodiment.
　図１は、本実施形態のスロットル弁制御装置の一例を示す概観斜視図である。また、図２は、本実施形態の非接触式回転角度検出装置の一例を示す模式断面図であり、具体的には、図１に示すスロットル弁制御装置のうち、主に非接触式回転角度検出装置の主要部について示す拡大図である。 FIG. 1 is an overview perspective view showing an example of a throttle valve control device of the present embodiment. FIG. 2 is a schematic cross-sectional view showing an example of the non-contact type rotational angle detection device of the present embodiment. Specifically, the throttle valve control device shown in FIG. It is an enlarged view shown about the principal part of a detection apparatus.
　図１に示すスロットル弁制御装置１０は、スロットルボディ２０および非接触式回転角度検出装置（回転角度検出センサ１００Ａ（１００））とを備える。ここでスロットルボディ２０は、中空円筒状の吸気通路２２と、吸気通路２２の径方向を横切りかつ吸気通路２２を貫通するように設けられたシャフト状の回転体（スロットルシャフト２４）と、スロットルシャフト２４に固定され、かつ、吸気通路２２内に回転可能に取り付けられたスロットル弁２６と、スロットルシャフト２４の一端に、スロットルシャフト２４の回転軸Ａを間にして互いに向き合うように取り付けられた一対の磁石２８等を備えている。また、回転角度検出センサ１００は、一対の磁石２８の間に、回転角度検出センサ１００を構成するステータ１１０が配置されるようにスロットルボディー２０に取り付けられている。なお、図２に示す例では、一対の磁石２８は、スロットルシャフト２４の一端に取り付けられた板状のギア３０のスロットルシャフト２４と接続された側と反対側の面に固定されている。 1 includes a throttle body 20 and a non-contact rotation angle detection device (rotation angle detection sensor 100A (100)). Here, the throttle body 20 includes a hollow cylindrical intake passage 22, a shaft-like rotating body (throttle shaft 24) provided so as to cross the radial direction of the intake passage 22 and penetrate the intake passage 22, and a throttle shaft A throttle valve 26 fixed to 24 and rotatably mounted in the intake passage 22, and a pair of throttle shafts 24 attached to one end of the throttle shaft 24 so as to face each other with the rotation axis A of the throttle shaft 24 therebetween. A magnet 28 and the like are provided. The rotation angle detection sensor 100 is attached to the throttle body 20 so that the stator 110 constituting the rotation angle detection sensor 100 is disposed between the pair of magnets 28. In the example shown in FIG. 2, the pair of magnets 28 is fixed to the surface of the plate-like gear 30 attached to one end of the throttle shaft 24 on the side opposite to the side connected to the throttle shaft 24.
　ここで、図２に示す回転角度検出センサ１００Ａは、空隙１１０Ｓを備えたステータ１１０と、空隙１１０Ｓ内に配置され、感磁部を備え、かつ、スロットルシャフト２４の回転によって変化する磁束を検出する磁気感応素子（ホールＩＣ１２０Ａ（１２０））と、ホールＩＣ１２０Ａと電気的に接続された回路基板１３０と、ステータ１１０を保持する保持部１４０Ｈおよび保持部１４０Ｈに保持されたステータ１１０の空隙１１０Ｓと連通すると共に回路基板１３０を収納する収納部１４０Ｓを備えた筐体１４０と、ホールＩＣ１２０および回路基板１３０を囲うように空隙１１０Ｓ内および収納部１４０Ｓ内に充填された樹脂部材１５０Ａ（１５０）等を備えている。なお、筐体１４０は、たとえば、熱可塑性ポリブチレンテレフタレート樹脂（ＰＢＴ）、熱可塑性ポリフェニレンサルファイド樹脂（ＰＰＳ）などから構成される。また、回転角度検出センサ１００Ａには、収納部１４０Ｓ内に充填された樹脂部材１５０Ａの表面を覆うように、必要に応じて金属製の遮磁板を取り付けてもよい。 Here, the rotation angle detection sensor 100A shown in FIG. 2 detects the magnetic flux that is arranged in the stator 110 having the air gap 110S, is provided in the air gap 110S, has a magnetic sensing portion, and changes as the throttle shaft 24 rotates. The magnetically sensitive element (Hall IC 120A (120)), the circuit board 130 electrically connected to the Hall IC 120A, the holding portion 140H holding the stator 110, and the gap 110S of the stator 110 held by the holding portion 140H are communicated. In addition, a housing 140 having a housing part 140S for housing the circuit board 130, a resin member 150A (150) filled in the gap 110S and the housing part 140S so as to surround the Hall IC 120 and the circuit board 130, and the like are provided. Yes. Note that the housing 140 is made of, for example, thermoplastic polybutylene terephthalate resin (PBT), thermoplastic polyphenylene sulfide resin (PPS), or the like. Moreover, you may attach a metal magnetic-shield board to the rotation angle detection sensor 100A as needed so that the surface of the resin member 150A with which the accommodating part 140S was filled may be covered.
　ここで、図２に示すホールＩＣ１２０Ａは、感磁部とセンサＩＣとが一体的に形成された素子本体部１２２を有する一体型のホールＩＣであり、素子本体部１２２には端子１２４が取り付けられている。そして、ホールＩＣ１２０Ａは、端子１２４を介して回路基板１３０に電気的に接続される。なお、本実施形態の回転角度検出センサ１００に用いられるホールＩＣ１２０としては、図２に例示するホールＩＣ１２０Ａの代わりに、図３に例示するような感磁部１２６ＡとセンサＩＣ１２６Ｂとが分離して設けられた分離型のホールＩＣ１２０Ｂ（１２０）を用いることもできる。図３に示すホールＩＣ１２０Ｂは、感磁部１２６Ａと、センサＩＣ１２６Ｂと、感磁部１２６ＡおよびセンサＩＣ１２６Ｂを接続する接続線１２６Ｃと、センサＩＣに接続された端子１２４とを有している。ここで、図３中に示す感磁部１２６Ａ、センサＩＣ１２６Ｂおよび接続線１２６Ｃからなる部分が、図２に示すホールＩＣ１２０Ａの素子本体部１２２に相当する機能を有する部分である。 Here, the Hall IC 120A shown in FIG. 2 is an integrated Hall IC having an element main body 122 in which a magnetic sensing portion and a sensor IC are integrally formed, and a terminal 124 is attached to the element main body 122. ing. The Hall IC 120A is electrically connected to the circuit board 130 via the terminal 124. As the Hall IC 120 used in the rotation angle detection sensor 100 of the present embodiment, a magnetic sensing part 126A and a sensor IC 126B as illustrated in FIG. 3 are provided separately from the Hall IC 120A illustrated in FIG. The separated Hall IC 120B (120) can also be used. The Hall IC 120B shown in FIG. 3 has a magnetic sensing part 126A, a sensor IC 126B, a connection line 126C connecting the magnetic sensing part 126A and the sensor IC 126B, and a terminal 124 connected to the sensor IC. Here, a portion including the magnetic sensing portion 126A, the sensor IC 126B, and the connection line 126C shown in FIG. 3 is a portion having a function corresponding to the element main body portion 122 of the Hall IC 120A shown in FIG.
　図１に示すスロットル弁制御装置１０において、吸気通路２２を流れる吸入空気の空気量を制御するスロットル弁２６の開閉は、以下のように行われる。まず、アクセルペダルの踏み込み度合に応じて、エンジンコントロールユニット等の不図示の制御手段から発せられた制御信号がスロットルボディー２０内に配置された不図示のモータへと伝達され、モータが駆動制御される。そしてこのモータにより、ギア３０等の動力伝達手段を介して、駆動力がスロットルシャフト２４に伝達され、スロットル弁２６が開閉される。この際、スロットル弁２６の開閉度合が、スロットルシャフト２４の回転角度として、回転角度検出センサ１００により検出される。すなわち、スロットルシャフト２４の回転に伴い、一対の磁石２８が回転すると、その回転角に応じて素子本体部１２２に交差する磁界の方向が変化する。これにより、ホールＩＣ１２０Ａの出力信号が変化する。そしてこの出力信号が出力される制御手段において、当該出力信号に基づきスロットルシャフト２４の回転角度、すなわち、スロットル弁２６の開度が算出される。そして、このようにして検出された開度や、エンジン回転数などのその他の検出信号等に基づいて、制御手段により、スロットル弁２６の開度の補正制御が行われる。 In the throttle valve control device 10 shown in FIG. 1, the throttle valve 26 that controls the amount of intake air flowing through the intake passage 22 is opened and closed as follows. First, in accordance with the degree of depression of the accelerator pedal, a control signal issued from a control means (not shown) such as an engine control unit is transmitted to a motor (not shown) arranged in the throttle body 20, and the motor is driven and controlled. The Then, this motor transmits the driving force to the throttle shaft 24 through power transmission means such as the gear 30, and the throttle valve 26 is opened and closed. At this time, the opening / closing degree of the throttle valve 26 is detected by the rotation angle detection sensor 100 as the rotation angle of the throttle shaft 24. That is, when the pair of magnets 28 is rotated along with the rotation of the throttle shaft 24, the direction of the magnetic field intersecting the element main body 122 changes according to the rotation angle. As a result, the output signal of the Hall IC 120A changes. Then, in the control means for outputting the output signal, the rotation angle of the throttle shaft 24, that is, the opening degree of the throttle valve 26 is calculated based on the output signal. Based on the opening degree thus detected and other detection signals such as the engine speed, correction control of the opening degree of the throttle valve 26 is performed by the control means.
　ここで、図２に示す回転角度検出センサ１００Ａでは、樹脂部材１５０Ａのうち、少なくとも素子本体部１２２を囲う樹脂部材１５２Ａとしてそのガラス転移温度が－４０度以下のものが用いられる。この場合、素子本体部１２２の一部を構成する感磁部が、実質的にガラス転移温度が－４０度以下の樹脂部材によって囲まれることになる。また、図２に例示する一体型のホールＩＣ１２０Ａの代わりに、図３に例示する分離型のホールＩＣ１２０Ｂを用いる場合には、図４に例示するように樹脂部材１５０Ｂ（１５０）のうち、少なくとも感磁部１２６Ａを囲う樹脂部材１５２Ｂのガラス転移温度が－４０度以下であればよい。ここで、図４に示す回転角度検出センサ１００Ｂ（１００）、図２に示す回転角度検出センサ１００Ａにおいて、一体型のホールＩＣ１２０Ａの代わりに、図３に例示する分離型のホールＩＣ１２０Ｂを用いた以外は、図２に示す回転角度検出センサ１００Ａと実質的に同様の構成を有するものである。 Here, in the rotation angle detection sensor 100A shown in FIG. 2, of the resin members 150A, a resin member 152A that surrounds at least the element body 122 has a glass transition temperature of −40 degrees or less. In this case, the magnetic sensing part constituting a part of the element body 122 is substantially surrounded by a resin member having a glass transition temperature of −40 degrees or less. Further, in the case of using the separated Hall IC 120B illustrated in FIG. 3 instead of the integrated Hall IC 120A illustrated in FIG. 2, at least the sensitivity of the resin member 150B (150) as illustrated in FIG. The glass transition temperature of the resin member 152B surrounding the magnetic part 126A may be −40 degrees or less. Here, in the rotation angle detection sensor 100B (100) shown in FIG. 4 and the rotation angle detection sensor 100A shown in FIG. 2, the separated Hall IC 120B illustrated in FIG. 3 is used instead of the integrated Hall IC 120A. Has substantially the same configuration as the rotation angle detection sensor 100A shown in FIG.
　この場合、回転角度検出センサ１００の使用温度域の最下限値である－４０度近傍においても、図２に示す素子本体部１２２を囲う樹脂部材１５２Ａや、図４に示す感磁部１２６Ａを囲う樹脂部材１５２Ｂは柔軟性を喪失しない。このため、感磁部が一体的に形成された素子本体部１２２には、樹脂部材１５２Ａの柔軟性の喪失に伴う変形応力が加わらないため、回転角度検出センサ１００Ａの個々の個体間の検出精度のばらつきを抑制することができる。そして、この点は図４に示す回転角度検出センサ１００Ｂについても同様である。さらに、素子本体部１２２が空隙１１０Ｓ内に充填された樹脂部材１５２Ａにより囲まれ、感磁部１２６Ａが空隙１１０Ｓ内に充填された樹脂部材１５２Ｂにより囲まれることによって、ホールＩＣ１２０Ａ，１２０Ｂの位置ずれを防ぐと共に、耐振性を向上させることもできる。 In this case, the resin member 152A surrounding the element main body 122 shown in FIG. 2 and the magnetic sensing part 126A shown in FIG. 4 are enclosed even in the vicinity of −40 degrees which is the lowest temperature range of the rotation temperature detection sensor 100. The resin member 152B does not lose flexibility. For this reason, since the deformation stress accompanying the loss of flexibility of the resin member 152A is not applied to the element main body portion 122 in which the magnetically sensitive portion is integrally formed, the detection accuracy between the individual individuals of the rotation angle detection sensor 100A. Can be suppressed. This also applies to the rotation angle detection sensor 100B shown in FIG. Further, the element main body 122 is surrounded by the resin member 152A filled in the gap 110S, and the magnetic sensitive part 126A is surrounded by the resin member 152B filled in the gap 110S, thereby causing the positional deviation of the Hall ICs 120A and 120B. In addition to preventing it, vibration resistance can be improved.
　ここで、樹脂部材１５２Ａ、１５２Ｂとしては、ガラス転移温度が－４０度以下であれば公知の樹脂部材が利用できるが、具体的には、ウレタン樹脂、シリコーン樹脂、液状フッ素系エラストマーなどが例示できる。しかしながら、実用性やコスト等の観点からは、これらの樹脂部材の中でもウレタン樹脂が最も好ましい。なお、樹脂部材１５２Ａ、１５２Ｂのガラス転移温度は－４０度以下であれば、その下限値は特に限定されないが、材料入手の容易性等の実用上の観点や、高温側での使用温度が低下するのを抑制する観点からは、－６０度以上であることが好ましい。 Here, as the resin members 152A and 152B, known resin members can be used as long as the glass transition temperature is −40 ° C. or lower. Specific examples include urethane resins, silicone resins, and liquid fluorine-based elastomers. . However, from the viewpoint of practicality and cost, urethane resin is most preferable among these resin members. If the glass transition temperature of the resin members 152A and 152B is −40 ° C. or lower, the lower limit is not particularly limited, but the practical point of view such as the availability of materials and the use temperature on the high temperature side are reduced. From the viewpoint of suppressing this, it is preferably −60 ° or more.
　また、樹脂部材１５０Ａのうち樹脂部材１５２Ａ以外の部分を占める樹脂部材１５４Ａとしては、樹脂部材１５２Ａと同一の樹脂部材を用いてもよく、異なる樹脂部材を用いてもよい。樹脂部材１５４Ａとしては、樹脂部材１５２Ａと同一の樹脂部材を用いた場合には、回転角度検出センサ１００Ａの生産工程をより簡略化することが容易となる。一方、樹脂部材１５４Ａとして、樹脂部材１５２Ａと異なる樹脂部材を用いる場合には、硬度、耐湿性、耐熱性、耐薬品性等において優れるエポキシ樹脂を用いることが好ましい。これにより、回路基板１３０や、ホールＩＣ１２０Ａを、水分、熱、グリースや異物等の付着、回転角度検出センサ１００Ａ外部から加わる応力などからより確実に保護することができる。 Further, as the resin member 154A occupying a portion other than the resin member 152A in the resin member 150A, the same resin member as the resin member 152A may be used, or a different resin member may be used. When the same resin member as the resin member 152A is used as the resin member 154A, it becomes easy to further simplify the production process of the rotation angle detection sensor 100A. On the other hand, when a resin member different from the resin member 152A is used as the resin member 154A, it is preferable to use an epoxy resin that is excellent in hardness, moisture resistance, heat resistance, chemical resistance, and the like. Thereby, the circuit board 130 and the Hall IC 120A can be more reliably protected from adhesion of moisture, heat, grease, foreign matter, etc., stress applied from the outside of the rotation angle detection sensor 100A, and the like.
　なお、樹脂部材１５２Ａとして用いることが好適なウレタン樹脂は、通常、耐湿性に劣る上に、粘着性を有するために異物等が付着しやすく、また、硬度が低く機械的耐久性に劣る傾向にある。したがって、樹脂部材１５０Ａの全て、すなわち、樹脂部材１５２Ａおよび樹脂部材１５４Ｂの双方がウレタン樹脂から構成される場合は、耐湿性、異物付着あるいは機械的耐久性の点で性能が不十分となるおそれがある。また、樹脂部材１５０Ａとして、大気圧下にて２液硬化型のウレタン樹脂を用いて空隙１１０Ｓおよび収納部１４０Ｓ内にウレタン樹脂を充填した場合、ウレタン樹脂マトリックス中に気泡が残留し易く、これに伴いウレタン樹脂マトリックスの表面には気泡跡も生じる。このため、回転角度検出センサ１００Ａの外観を損なう場合がある。しかしながら、樹脂部材１５２Ａとしてウレタン樹脂を用い、かつ、樹脂部材１５４Ａとしてエポキシ樹脂を用いれば、上述した諸問題を回避しつつ、回転角度検出センサ１００Ａの個々の個体間の検出精度ばらつきも同時に抑制できる。 In addition, the urethane resin suitable for use as the resin member 152A is generally inferior in moisture resistance, and has a stickiness, so that foreign matters and the like are likely to adhere to it, and the hardness is low and the mechanical durability tends to be inferior. is there. Therefore, if all of the resin member 150A, that is, both the resin member 152A and the resin member 154B are made of urethane resin, the performance may be insufficient in terms of moisture resistance, foreign matter adhesion, or mechanical durability. is there. In addition, when the resin member 150A is filled with urethane resin in the gap 110S and the storage portion 140S using a two-component curable urethane resin under atmospheric pressure, bubbles easily remain in the urethane resin matrix. As a result, bubble marks are also generated on the surface of the urethane resin matrix. For this reason, the external appearance of the rotation angle detection sensor 100A may be impaired. However, if urethane resin is used as the resin member 152A and epoxy resin is used as the resin member 154A, variations in detection accuracy among individual individuals of the rotation angle detection sensor 100A can be suppressed at the same time while avoiding the problems described above. .
　なお、以上に説明した点は、樹脂部材１５０Ｂのうち樹脂部材１５２Ｂ以外の部分を占める樹脂部材１５４Ｂについても同様である。また、樹脂部材１５４Ａ、１５４Ｂのガラス転移温度については特に限定されない。 In addition, the point demonstrated above is the same also about the resin member 154B which occupies parts other than the resin member 152B among the resin members 150B. Moreover, it does not specifically limit about the glass transition temperature of resin member 154A, 154B.
　ここで、樹脂部材１５２Ａ、１５２Ｂとして用いることが好適なウレタン樹脂としては、市販品が利用でき、たとえば、ＭＵ－１１５Ａ／ＭＵ－１１５Ｂ（ペルノックス株式会社製、ガラス転移温度：－５０度）、ＭＵ－１０２Ａ／ＭＵ－１０２Ｂ（ペルノックス株式会社製、ガラス転移温度：－５５度）、ＵＥ－９２１Ａ／ＵＥ－９２１Ｂ（サンユレック株式会社製、ガラス転移温度：－５７度）、ＳＵ－１７２７Ａ／ＳＵ－１７２７Ｂ（サンユレック株式会社製、ガラス転移温度：－５５度）、ＵＦ－１１１３Ａ／ＵＦ－１１１３Ｂ（サンユレック株式会社製、ガラス転移温度：－５０度）、ＳＵ－３６００Ａ／ＳＵ－３６００Ｂ（サンユレック株式会社製、ガラス転移温度：－５６度）、ＳＵ－３００１Ａ／ＳＵ－３００１Ｂ（サンユレック株式会社、ガラス転移温度：－５０度）等を挙げることができる。 Here, as the urethane resin suitable for use as the resin members 152A and 152B, commercially available products can be used. For example, MU-115A / MU-115B (manufactured by Pernox Corporation, glass transition temperature: −50 degrees), MU -102A / MU-102B (manufactured by Pernox Co., Ltd., glass transition temperature: -55 degrees), UE-921A / UE-921B (manufactured by Sanyu Rec Co., Ltd., glass transition temperature: -57 degrees), SU-1727A / SU-1727B (Sanyu REC Co., Ltd., glass transition temperature: -55 degrees), UF-1113A / UF-1113B (Sanyu REC Co., Ltd., glass transition temperature: -50 degrees), SU-3600A / SU-3600B (Sanyu REC Co., Ltd., Glass transition temperature: -56 degrees), SU-3001A / SU-3001B (Sun Rec Co., Ltd., glass transition temperature: mention may be made of -50 degrees), and the like.
　なお、上記に列挙した市販品の中でも、ＭＵ－１１５Ａ／ＭＵ－１１５Ｂは、耐湿性等にも優れるため、樹脂部材１５２Ａ、１５２Ｂのみならず、樹脂部材１５４Ａ、１５４Ｂとしても利用することが容易である。したがって、樹脂部材１５２Ａ、１５２Ｂのみならず、樹脂部材１５４Ａ、１５４Ｂとしても上述したような耐湿性等に優れたウレタン樹脂を用いた場合、生産工程をより簡略化できる。これに加えて、ウレタン樹脂は、硬度の点では、エポキシ樹脂に劣るものの柔軟性に富む。このため、回転角度検出センサ１００が著しい温度変化に曝されるなどにより筐体１４０の熱膨張／熱収縮が生じた場合でも、これに追従して、樹脂部材１５０Ａ、１５０Ｂと筐体１４０との間に隙間が生じるのをより確実に抑制することが容易である。 Of the commercial products listed above, MU-115A / MU-115B is excellent in moisture resistance and the like, and therefore can be easily used not only as resin members 152A and 152B but also as resin members 154A and 154B. is there. Therefore, when not only the resin members 152A and 152B but also the resin members 154A and 154B are made of urethane resin having excellent moisture resistance as described above, the production process can be further simplified. In addition, the urethane resin is rich in flexibility although it is inferior to the epoxy resin in terms of hardness. For this reason, even if the thermal expansion / thermal contraction of the housing 140 occurs due to the rotation angle detection sensor 100 being exposed to a significant temperature change, the resin members 150A, 150B and the housing 140 follow the same. It is easy to more reliably suppress the occurrence of a gap between them.
　次に、本実施形態の回転角度検出センサ１００の製造方法について説明する。図５～図７は、第一の本実施形態の回転角度検出センサ１００の製造方法について説明する模式断面図であり、具体的には図２に示す回転角度検出センサ１００Ａの製造方法の一例について説明する図である。 Next, a method for manufacturing the rotation angle detection sensor 100 of the present embodiment will be described. 5 to 7 are schematic cross-sectional views for explaining a method for manufacturing the rotation angle detection sensor 100 of the first embodiment. Specifically, an example of a method for manufacturing the rotation angle detection sensor 100A shown in FIG. It is a figure explaining.
　回転角度検出センサ１００Ａの製造に際しては、まず筐体１４０の少なくとも空隙１１０Ｓ内に、硬化後の状態におけるガラス転移温度が－４０度以下である未硬化状態の樹脂材料（未硬化樹脂材料２００Ａ（２００））を、ディスペンサー等により充填する未硬化樹脂材料充填工程を実施する（図５）。 When manufacturing the rotation angle detection sensor 100A, first, in the at least the gap 110S of the casing 140, an uncured resin material (uncured resin material 200A (200 )) Is carried out by an uncured resin material filling step of filling with a dispenser or the like (FIG. 5).
　未硬化樹脂材料充填工程では、図５（Ａ）に示すように空隙１１０Ｓ内にのみ未硬化樹脂材料２００Ａを充填してもよく、図５（Ｂ）空隙１１０Ｓ内および収納部１４０Ｓ内に未硬化樹脂材料２００Ａを充填してもよい。前者の充填方式（２分割充填方式）は、樹脂部材１５２Ａと、樹脂部材１５４Ａとが異なる樹脂部材である場合に好適であり、後者の充填方式（一括充填方式）は、樹脂部材１５２Ａと、樹脂部材１５４Ａとが同一の樹脂部材である場合に好適である。なお、未硬化樹脂２００が２液硬化タイプである場合には、２液を混合した後に充填される。 In the uncured resin material filling step, as shown in FIG. 5A, the uncured resin material 200A may be filled only into the gap 110S, and the uncured resin 110A in FIG. The resin material 200A may be filled. The former filling method (two-part filling method) is suitable when the resin member 152A and the resin member 154A are different resin members, and the latter filling method (collective filling method) is the resin member 152A and the resin member. It is suitable when the member 154A is the same resin member. In addition, when the uncured resin 200 is a two-component curing type, it is filled after the two components are mixed.
　続いて、少なくともホールＩＣ１２０Ａの素子本体部１２２を、未硬化樹脂材料２００Ａによって囲うように、未硬化樹脂材料２００Ａが充填された空隙１１０Ｓ内に配置する（磁気感応素子配置工程、図６）。この際、未硬化樹脂材料充填工程が２分割充填方式で実施された場合には、磁気感応素子配置工程を終えた時点で、図６（Ａ）に示すように、ホールＩＣ１２０Ａの素子本体部分１２２の主要部が未硬化樹脂材料２００Ａ中に埋没することになる。また、未硬化樹脂材料充填工程が一括充填方式で実施された場合には、磁気感応素子配置工程を終えた時点で、図６（Ｂ）に示すように、ホールＩＣ１２０Ａおよび回路基板１３０の全体が未硬化樹脂材料２００Ａ中に埋没することになる。ここで、磁気感応素子配置工程において用いるホールＩＣ１２０Ａは、通常、図６に示すように予め端子１２４に回路基板１３０が取り付けられたものを用いることが好ましい。この場合、空隙１１０Ｓ内に素子本体部１２２を配置すると同時に、収納部１４０Ｓ内に回路基板１３０も配置されることになる。 Subsequently, at least the element main body 122 of the Hall IC 120A is disposed in the gap 110S filled with the uncured resin material 200A so as to be surrounded by the uncured resin material 200A (magnetic sensitive element disposition process, FIG. 6). At this time, when the uncured resin material filling step is performed by the two-part filling method, as shown in FIG. 6A, when the magnetic sensitive element placement step is finished, the element body portion 122 of the Hall IC 120A is obtained. Is embedded in the uncured resin material 200A. In addition, when the uncured resin material filling process is performed in a batch filling method, as shown in FIG. 6B, the entire Hall IC 120A and the circuit board 130 are completely formed when the magnetic sensitive element placement process is finished. It will be buried in the uncured resin material 200A. Here, as the Hall IC 120A used in the magnetic sensitive element arranging step, it is usually preferable to use the Hall IC 120A in which the circuit board 130 is previously attached to the terminal 124 as shown in FIG. In this case, the circuit board 130 is also disposed in the housing portion 140S at the same time as the element main body portion 122 is disposed in the gap 110S.
　なお、２分割充填方式にて、図４に示す回転角度検出センサ１００Ｂを製造する場合、磁気感応素子配置工程では、ホールＩＣ１２０Ｂの感磁部１２６Ａを、未硬化樹脂材料２００によって囲うように、未硬化樹脂材料２００Ａが充填された空隙１１０Ｓ内に配置すればよい。 When the rotation angle detection sensor 100B shown in FIG. 4 is manufactured by the two-part filling method, in the magnetic sensitive element placement step, the magnetic sensitive part 126A of the Hall IC 120B is not surrounded by the uncured resin material 200. What is necessary is just to arrange | position in the space | gap 110S filled with 200A of cured resin materials.
　その後、未硬化樹脂材料２００Ａを硬化させる硬化工程を実施する。この場合の硬化方法としては、使用する未硬化樹脂材料２００Ａの硬化メカニズムに応じて適宜選択できる。硬化工程としては、たとえば、未硬化樹脂材料２００Ａとして熱硬化タイプのものをを用いる場合には加熱処理、光硬化タイプのものを用いる場合にはＵＶ照射などを実施する。また、未硬化樹脂材料２００Ａが化学反応により自発的に硬化が進行する２液硬化タイプの未硬化樹脂材料である場合には、磁気感応素子配置工程を終えた後に単に硬化が完了するまでの間、放置しておくだけでもよいが、硬化を促進するために加熱処理してもよい。 Thereafter, a curing process for curing the uncured resin material 200A is performed. The curing method in this case can be appropriately selected according to the curing mechanism of the uncured resin material 200A to be used. As the curing step, for example, when a thermosetting type is used as the uncured resin material 200A, heat treatment is performed, and when a photocuring type is used, UV irradiation is performed. In addition, when the uncured resin material 200A is a two-component curing type uncured resin material in which curing proceeds spontaneously by a chemical reaction, after the magnetic sensitive element placement step is completed, the curing is simply completed. It may be left alone, but may be heat-treated to accelerate curing.
　ここで、未硬化樹脂材料充填工程が一括充填方式で実施された場合には、硬化工程を終えることにより、図２に示す回転角度検出センサ１００Ａを得ることができる。この場合、樹脂部材１５２Ａおよび樹脂部材１５４Ａは同一の樹脂部材から構成されることになる。 Here, when the uncured resin material filling process is performed by the batch filling method, the rotation angle detection sensor 100A shown in FIG. 2 can be obtained by finishing the curing process. In this case, the resin member 152A and the resin member 154A are made of the same resin member.
　一方、未硬化樹脂材料充填工程が２分割充填方式で実施された場合には、硬化工程を終えた後に、図７に示すように収納部１４０Ｓ内に未硬化樹脂材料２００Ｂ（２００）を充填する２回目の未硬化樹脂材料充填工程を実施し、続いて、未硬化樹脂材料２００Ｂを硬化させる２回目の硬化工程を実施する。なお、未硬化樹脂材料２００Ｂの硬化方法としては、使用する未硬化樹脂材料２００Ｂの硬化メカニズムに応じて適宜選択できる。あるいは、磁気感応素子配置工程を終えた後に、図７に示すように２回目の未硬化樹脂材料充填工程を実施し、続いて、未硬化樹脂材料２００Ａ、２００Ｂをまとめて硬化させる硬化工程を実施してもよい。これにより、図２に例示される回転角度検出センサ１００Ａを得ることができる。この場合、樹脂部材１５２Ａおよび樹脂部材１５４Ａは、通常、異なる樹脂部材から構成されるが、同一の樹脂部材から構成されていてもよい。なお、全工程を通して硬化工程を２回実施する場合、図７中、素子本体部１２２を囲う樹脂部材は、１回目の硬化工程の実施により硬化済みの樹脂部材１５２Ａであり、全工程を通して硬化工程を１回のみ実施する場合、図７中、素子本体部１２２を囲う樹脂部材は、未硬化樹脂部材２００Ａである。 On the other hand, when the uncured resin material filling step is performed by the two-part filling method, after the curing step is finished, the uncured resin material 200B (200) is filled into the storage portion 140S as shown in FIG. A second uncured resin material filling process is performed, and then a second curing process for curing the uncured resin material 200B is performed. The curing method for the uncured resin material 200B can be appropriately selected according to the curing mechanism of the uncured resin material 200B to be used. Alternatively, after the magnetic sensitive element placement step is completed, a second uncured resin material filling step is performed as shown in FIG. 7, followed by a curing step in which the uncured resin materials 200A and 200B are cured together. May be. Thereby, the rotation angle detection sensor 100A illustrated in FIG. 2 can be obtained. In this case, the resin member 152A and the resin member 154A are usually made of different resin members, but may be made of the same resin member. When the curing process is performed twice throughout the entire process, the resin member surrounding the element body 122 in FIG. 7 is a resin member 152A that has been cured by performing the first curing process, and the curing process is performed throughout the entire process. 7 is performed only once, the resin member surrounding the element body 122 in FIG. 7 is the uncured resin member 200A.
　図８は、第二の本実施形態の回転角度検出センサ１００の製造方法について説明する模式断面図であり、具体的には図２に示す回転角度検出センサ１００Ａの製造方法の他の例について説明する図である。 FIG. 8 is a schematic cross-sectional view illustrating a method for manufacturing the rotation angle detection sensor 100 according to the second embodiment. Specifically, another example of the method for manufacturing the rotation angle detection sensor 100A illustrated in FIG. 2 will be described. It is a figure to do.
　回転角度検出センサ１００Ａの製造に際しては、まず、ホールＩＣ１２０Ａの素子本体部分１２２に対して未硬化樹脂材料２００Ａを塗り付けたり、未硬化樹脂材料２００Ａを満たした槽中に、素子本体部分１２２を浸漬させるなどによって、素子本体部分１２２を未硬化樹脂材料２００Ａで囲うディップ工程を行う（図８）。なお、このディップ工程で用いるホールＩＣ１２０Ａは、通常、図８に示すように、予め端子１２４に回路基板１３０が取り付けられていることが好ましい。 When manufacturing the rotation angle detection sensor 100A, first, the uncured resin material 200A is applied to the element body portion 122 of the Hall IC 120A, or the element body portion 122 is immersed in a tank filled with the uncured resin material 200A. For example, a dipping process is performed to surround the element body 122 with the uncured resin material 200A (FIG. 8). Note that the Hall IC 120A used in this dipping process is usually preferably provided with a circuit board 130 attached in advance to the terminal 124 as shown in FIG.
　次に、素子本体部分１２２が未硬化樹脂材料２００Ａで囲われたホールＩＣ１２０Ａを、空隙１１０Ｓ内に配置する（磁気感応素子配置工程）。この際、端子１２４に取り付けられた回路基板１３０は、収納部１４０Ｓ内に配置されることになり、図６（Ａ）に示したものと同様の中間製品が得られる。 Next, the Hall IC 120A in which the element body portion 122 is surrounded by the uncured resin material 200A is arranged in the gap 110S (magnetic sensitive element arranging step). At this time, the circuit board 130 attached to the terminal 124 is disposed in the storage portion 140S, and an intermediate product similar to that shown in FIG. 6A is obtained.
　続いて、未硬化樹脂材料２００Ａを硬化させる硬化工程を実施する。その後、未硬化樹脂材料２００Ｂを収納部１４０Ｓ内に充填し、さらに２回目の硬化工程を実施することで、回転角度検出センサ１００Ａを得ることができる。あるいは、磁気感応素子配置工程を実施した後に、未硬化樹脂材料２００Ｂを収納部１４０Ｓ内に充填し、その後、未硬化樹脂材料２００Ａ、２００Ｂをまとめて硬化させる硬化工程を実施することで、回転角度検出センサ１００Ａを得ることができる。 Subsequently, a curing process for curing the uncured resin material 200A is performed. Thereafter, the rotation angle detection sensor 100A can be obtained by filling the uncured resin material 200B into the storage portion 140S and further performing the second curing step. Alternatively, after the magnetic sensitive element placement step is performed, the uncured resin material 200B is filled in the storage portion 140S, and then the uncured resin materials 200A and 200B are collectively cured to perform a curing step. The detection sensor 100A can be obtained.
　なお、図４に示す回転角度検出センサ１００Ｂを製造する場合には、ディップ工程において、ホールＩＣ１２０Ｂの少なくとも感磁部１２６Ａを未硬化樹脂材料２００Ａで囲えばよく、感磁部１２６Ａ、センサＩＣ１２６Ｂおよび接続線１２６Ｃからなる部分全体を未硬化樹脂材料２００Ａで囲ってもよい。そして、ディップ工程以降の工程は、回転角度検出センサ１００Ａを製造する場合と同様にして実施することができる。 When the rotation angle detection sensor 100B shown in FIG. 4 is manufactured, in the dipping process, at least the magnetic sensitive part 126A of the Hall IC 120B may be surrounded by the uncured resin material 200A, and the magnetic sensitive part 126A, the sensor IC 126B, and the connection The entire portion made of the line 126C may be surrounded by the uncured resin material 200A. And the process after a dipping process can be implemented like the case where 100 A of rotation angle detection sensors are manufactured.
　以下に本発明を実施例および比較例を挙げてより詳細に説明する。 Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples.
（実施例１）
　図２に示す回転角度検出センサ１００Ａにおいて、樹脂部材１５２Ａとしてウレタン樹脂（ガラス転移温度：－５０度、ペルノックス株式会社製、ＭＵ－１１５Ａ／ＭＵ－１１５Ｂ）を用い、樹脂部材１５４Ａとしてエポキシ樹脂（ガラス転移温度：－３２度、ペルノックス株式会社製、ＸＭ－２４３７／ＨＹ－６９０）を用いた評価サンプルを１５個準備した。 Example 1
In the rotation angle detection sensor 100A shown in FIG. 2, urethane resin (glass transition temperature: −50 degrees, manufactured by Pernox Corporation, MU-115A / MU-115B) is used as the resin member 152A, and epoxy resin (glass) is used as the resin member 154A. Fifteen evaluation samples were prepared using a transition temperature: −32 degrees, manufactured by Pernox Corporation, XM-2437 / HY-690.
－検出精度ばらつきの評価－
　続いて、個々の評価サンプルについて、２５度および－４０度の温度環境下にてホールＩＣ１２０Ａの出力（ｍＶ）を測定し、温度２５度における出力を基準値（０ｍＶ）とした際の温度－４０度における相対出力Ｘ（ｍＶ）を求めた。そして、個々の評価サンプルの温度－４０度における相対出力Ｘの最大値Ｘｍａｘと最小値Ｘｍｉｎとの差の絶対値ΔＸ（ｍＶ）を、個々の評価サンプル間の検出精度ばらつきとして求めた。結果を表１に示す。 -Evaluation of variation in detection accuracy-
Subsequently, for each evaluation sample, the output (mV) of the Hall IC 120A was measured in a temperature environment of 25 degrees and −40 degrees, and the temperature when the output at the temperature of 25 degrees was set to the reference value (0 mV) was −40. The relative output X (mV) in degrees was determined. Then, the absolute value ΔX (mV) of the difference between the maximum value Xmax and the minimum value Xmin of the relative output X at the temperature of −40 degrees of each evaluation sample was obtained as the detection accuracy variation between the individual evaluation samples. The results are shown in Table 1.
－機械的耐久性（硬度）の評価－
　機械的耐久性については、外界と直接接する側の樹脂部材１５４Ａの硬度を評価した。結果を表１に示す。なお、硬度は、後述する実施例３を除いて、ＪＩＳ　Ｋ　７２１５に基づき、デュロメータ　タイプＡを用いて測定した値である。 -Evaluation of mechanical durability (hardness)-
For mechanical durability, the hardness of the resin member 154A on the side in direct contact with the outside world was evaluated. The results are shown in Table 1. The hardness is a value measured using a durometer type A based on JIS K 7215 except for Example 3 described later.
－耐湿性の評価－
　耐湿性については、外界と直接接する側の樹脂部材１５４Ａの耐湿性を評価した。具体的には、樹脂部材１５４Ａと同様の樹脂ブロックを高温高湿環境下（温度：８０度、湿度：９５％）にて２ヶ月間放置した後の状態を以下の評価基準に基づいて評価した。結果を表１に示す。
Ａ：テスト前と比較して、外観および硬さにおいて特に顕著な変化は見られない。
Ｂ：テスト前と比較して、外観および／または硬さにおいて若干の変化が見られる。
Ｃ：テスト前と比較して、樹脂ブロック表面が流動して変形する等の外観の変質や硬さの低下が顕著である。 -Evaluation of moisture resistance-
As for the moisture resistance, the moisture resistance of the resin member 154A on the side in direct contact with the outside world was evaluated. Specifically, the state after leaving a resin block similar to the resin member 154A in a high temperature and high humidity environment (temperature: 80 degrees, humidity: 95%) for two months was evaluated based on the following evaluation criteria. . The results are shown in Table 1.
A: There is no particularly remarkable change in appearance and hardness compared to before the test.
B: A slight change in appearance and / or hardness is observed as compared to before the test.
C: Compared with before the test, the appearance change such as the resin block surface flowing and deforming and the decrease in hardness are remarkable.
（実施例２）
　樹脂部材１５０Ａ（すなわち樹脂部材１５２Ａおよび樹脂部材１５４Ａ）として、ウレタン樹脂（ガラス転移温度：－５０度、ペルノックス株式会社製、ＭＵ－１１５Ａ／ＭＵ－１１５Ｂ）を用いた以外は、実施例１で用いた評価サンプルと同様の評価サンプルを１５個準備した。その後、これらの評価サンプルについて、実施例１と同様の評価を行った。結果を表１に示す。 (Example 2)
Used in Example 1 except that urethane resin (glass transition temperature: −50 degrees, manufactured by Pernox Co., Ltd., MU-115A / MU-115B) was used as the resin member 150A (that is, the resin member 152A and the resin member 154A). Fifteen evaluation samples similar to the evaluation samples were prepared. Thereafter, these evaluation samples were evaluated in the same manner as in Example 1. The results are shown in Table 1.
（実施例３）
　樹脂部材１５０Ａ（すなわち樹脂部材１５２Ａおよび樹脂部材１５４Ａ）として、フッ素樹脂（ガラス転移温度：－７０度、信越化学工業株式会社、ＳＩＦＥＬ８３７０Ａ／ＳＩＦＥＬ８３７０Ｂ）を用いた以外は、実施例１で用いた評価サンプルと同様の評価サンプルを１５個準備した。その後、これらの評価サンプルについて、硬度の評価を除き実施例１と同様の評価を行った。結果を表１に示す。なお、硬度については、樹脂部材１５４Ａが非常に柔らかく、実施例１と同様の硬度測定ができないため、針入度で評価した。 (Example 3)
Evaluation sample used in Example 1 except that fluororesin (glass transition temperature: -70 degrees, Shin-Etsu Chemical Co., Ltd., SIFEL 8370A / SIFEL 8370B) was used as resin member 150A (that is, resin member 152A and resin member 154A). Fifteen evaluation samples similar to those described above were prepared. Then, about these evaluation samples, evaluation similar to Example 1 was performed except hardness evaluation. The results are shown in Table 1. In addition, about the hardness, since the resin member 154A is very soft and the hardness measurement similar to Example 1 cannot be performed, it evaluated by the penetration.
（実施例４）
　樹脂部材１５０Ａ（すなわち樹脂部材１５２Ａおよび樹脂部材１５４Ａ）として、エポキシ素樹脂（ガラス転移温度：－６７度、サンユレック株式会社製、ＮＲ－２００Ｃ）を用いた以外は、実施例１で用いた評価サンプルと同様の評価サンプルを１５個準備した。その後、これらの評価サンプルについて、実施例１と同様の評価を行った。結果を表１に示す。 (Example 4)
Evaluation sample used in Example 1 except that epoxy resin (glass transition temperature: -67 degrees, manufactured by San Yulec Co., Ltd., NR-200C) was used as resin member 150A (that is, resin member 152A and resin member 154A). Fifteen evaluation samples similar to those described above were prepared. Thereafter, these evaluation samples were evaluated in the same manner as in Example 1. The results are shown in Table 1.
（比較例１）
　樹脂部材１５０Ａ（すなわち樹脂部材１５２Ａおよび樹脂部材１５４Ａ）として、エポキシ樹脂（ガラス転移温度：－３２度、ペルノックス株式会社製、ＸＭ－２４３７／ＨＹ－６９０）を用いた以外は、実施例１で用いた評価サンプルと同様の評価サンプルを１５個準備した。その後、これらの評価サンプルについて、実施例１と同様の評価を行った。結果を表１に示す。 (Comparative Example 1)
Used in Example 1 except that an epoxy resin (glass transition temperature: −32 degrees, manufactured by Pernox Corporation, XM-2437 / HY-690) was used as the resin member 150A (that is, the resin member 152A and the resin member 154A). Fifteen evaluation samples similar to the evaluation samples were prepared. Thereafter, these evaluation samples were evaluated in the same manner as in Example 1. The results are shown in Table 1.
（比較例２）
　樹脂部材１５０Ａ（すなわち樹脂部材１５２Ａおよび樹脂部材１５４Ａ）として、ウレタン樹脂（ガラス転移温度：－３０度、ペルノックス社製、ＭＵ－２０４Ａ／ＭＵ２０４Ｂ）を用いた以外は、実施例１で用いた評価サンプルと同様の評価サンプルを１５個準備した。その後、これらの評価サンプルについて、検出精度ばらつきの評価を除いて実施例１と同様の評価を行った。結果を表１に示す。 (Comparative Example 2)
Evaluation sample used in Example 1 except that urethane resin (glass transition temperature: −30 degrees, manufactured by Pernox, MU-204A / MU204B) was used as resin member 150A (that is, resin member 152A and resin member 154A). Fifteen evaluation samples similar to those described above were prepared. Thereafter, these evaluation samples were evaluated in the same manner as in Example 1 except for the evaluation of variation in detection accuracy. The results are shown in Table 1.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
１０　スロットル弁制御装置
２０　スロットルボディ
２２　吸気通路
２４　スロットルシャフト（回転体）
２６　スロットル弁
２８　磁石
３０　ギア
１００、１００Ａ、１００Ｂ　回転角度検出センサ（非接触式回転角度検出装置）
１１０　ステータ
１１０Ｓ　空隙
１２０、１２０Ａ、１２０Ｂ　ホールＩＣ（磁気感応素子）
１２２　素子本体部（感磁部とセンサＩＣとが一体的に形成された部材）
１２４　端子
１２６Ａ　感磁部
１２６Ｂ　センサＩＣ
１２６Ｃ　接続線
１３０　回路基板
１４０　筐体
１４０Ｈ　保持部
１４０Ｓ　収納部
１５０、１５０Ａ、１５０Ｂ　樹脂部材
１５２Ａ、１５２Ｂ　樹脂部材
１５４Ａ、１５４Ｂ　樹脂部材
２００、２００Ａ、２００Ｂ　未硬化樹脂材料（未硬化状態の樹脂材料）
  10 Throttle valve control device 20 Throttle body 22 Intake passage 24 Throttle shaft (rotary body)
26 Throttle valve 28 Magnet 30 Gear 100, 100A, 100B Rotation angle detection sensor (non-contact type rotation angle detection device)
110 Stator 110S Gap 120, 120A, 120B Hall IC (Magnetic Sensitive Element)
122 Element main body (a member in which a magnetic sensing part and a sensor IC are integrally formed)
124 Terminal 126A Magnetic Sensing Section 126B Sensor IC
126C Connection line 130 Circuit board 140 Housing 140H Holding part 140S Storage part 150, 150A, 150B Resin member 152A, 152B Resin member 154A, 154B Resin member 200, 200A, 200B Uncured resin material (uncured resin material)

Claims (8)

  1. 　空隙を備えたステータと、
    　当該空隙内に配置され、感磁部を備え、かつ、回転体の回転によって変化する磁束を検出する磁気感応素子と、
    　当該磁気感応素子と電気的に接続された回路基板と、
    　前記ステータを保持する保持部および当該保持部に保持された前記ステータの前記空隙と連通すると共に前記回路基板を収納する収納部を備えた筐体と、
    　前記磁気感応素子および前記回路基板を囲うように前記空隙内および前記収納部内に充填された樹脂部材と、を少なくとも備え、
    　前記樹脂部材のうち、少なくとも前記感磁部を囲う樹脂部材のガラス転移温度が－４０度以下であることを特徴とする非接触式回転角度検出装置。     A stator with a gap,
    A magnetically sensitive element that is disposed in the gap, includes a magnetically sensitive portion, and detects a magnetic flux that changes due to rotation of the rotating body;
    A circuit board electrically connected to the magnetically sensitive element;
    A holding section that holds the stator and a housing that communicates with the gap of the stator held in the holding section and includes a storage section that stores the circuit board;
    A resin member filled in the gap and the storage portion so as to surround the magnetic sensitive element and the circuit board,
    A non-contact rotation angle detecting device characterized in that a glass transition temperature of at least a resin member surrounding the magnetically sensitive portion among the resin members is −40 degrees or less.
  2. 　請求項１に記載の非接触式回転角度検出装置において、
    　前記樹脂部材のうち、少なくとも前記感磁部を囲うように前記空隙内に充填された樹脂部材がウレタン樹脂からなることを特徴とする非接触式回転角度検出装置。     In the non-contact-type rotation angle detection device according to claim 1,
    Of the resin members, a resin member filled in the gap so as to surround at least the magnetically sensitive portion is made of urethane resin.
  3. 　請求項１または２に記載の非接触式回転角度検出装置において、
    　前記磁気感応素子および前記回路基板を囲うように前記空隙内および前記収納部内に充填された樹脂部材として、エポキシ樹脂およびウレタン樹脂が用いられ、
    　少なくとも前記感磁部を囲うように前記空隙内に充填された樹脂部材が前記ウレタン樹脂からなることを特徴とする非接触式回転角度検出装置。     In the non-contact-type rotation angle detection device according to claim 1 or 2,
    An epoxy resin and a urethane resin are used as a resin member filled in the gap and the storage portion so as to surround the magnetically sensitive element and the circuit board,
    A non-contact type rotation angle detecting device, wherein a resin member filled in the gap so as to surround at least the magnetically sensitive portion is made of the urethane resin.
  4. 　請求項１または２に記載の非接触式回転角度検出装置において、
    　前記磁気感応素子および前記回路基板を囲うように前記空隙内および前記収納部内に充填された樹脂部材が、ウレタン樹脂からなることを特徴とする非接触式回転角度検出装置。     In the non-contact-type rotation angle detection device according to claim 1 or 2,
    A non-contact rotation angle detecting device, wherein a resin member filled in the gap and in the housing portion so as to surround the magnetically sensitive element and the circuit board is made of urethane resin.
  5. 　請求項１～４のいずれか１つに記載の非接触式回転角度検出装置において、
    　前記磁気感応素子が、前記感磁部と、センサＩＣとが一体的に形成された素子本体部を有し、
    　前記磁気感応素子および前記回路基板を囲うように前記空隙内および前記収納部内に充填された樹脂部材のうち、
    　少なくとも前記素子本体部を囲う樹脂部材のガラス転移温度が－４０度以下であることを特徴とする非接触式回転角度検出装置。     The non-contact type rotational angle detection device according to any one of claims 1 to 4,
    The magnetically sensitive element has an element body part in which the magnetically sensitive part and a sensor IC are integrally formed,
    Among the resin members filled in the gap and the storage portion so as to surround the magnetically sensitive element and the circuit board,
    A non-contact rotation angle detecting device, wherein a glass transition temperature of a resin member surrounding at least the element main body is −40 degrees or less.
  6. 　空隙を備えたステータと、当該ステータを保持する保持部と、当該保持部に保持された前記ステータの前記空隙と連通すると共に回路基板を収納する収納部と、を備えた筐体の少なくとも前記空隙内に、硬化後の状態におけるガラス転移温度が－４０度以下である未硬化状態の樹脂材料を充填する未硬化樹脂材料充填工程と、
    　感磁部を備え、かつ、回転体の回転によって変化する磁束を検出する磁気感応素子の少なくもとも前記感磁部を、前記未硬化状態の樹脂材料によって囲うように、前記未硬化状態の樹脂材料が充填された前記空隙内に前記磁気感応素子を配置する磁気感応素子配置工程と、
    　前記未硬化状態の樹脂材料を硬化させる硬化工程と、を少なくとも経て、
    請求項１～５のいずれか１つに記載の非接触式回転角度検出装置を製造することを特徴とする非接触式回転角度検出装置の製造方法。     At least the gap of a housing having a stator having a gap, a holding portion that holds the stator, and a storage portion that communicates with the gap of the stator held in the holding portion and stores a circuit board. And an uncured resin material filling step of filling an uncured resin material having a glass transition temperature of −40 ° C. or lower in the cured state,
    The uncured resin so as to surround at least the magnetically sensitive part with the uncured resin material, including a magnetically sensitive part and detecting at least the magnetically sensitive element that detects a magnetic flux that changes due to rotation of the rotating body. A magnetic sensitive element arranging step of arranging the magnetic sensitive element in the gap filled with a material;
    Through at least a curing step of curing the uncured resin material,
    6. A method of manufacturing a non-contact type rotational angle detecting device according to claim 1, wherein the non-contact type rotational angle detecting device is manufactured.
  7. 　感磁部を備え、かつ、回転体の回転によって変化する磁束を検出する磁気感応素子の少なくもと前記感磁部を、硬化後の状態におけるガラス転移温度が－４０度以下である未硬化状態の樹脂材料で囲うディップ工程と、
    　空隙を備えたステータと、当該ステータを保持する保持部と、当該保持部に保持された前記ステータの前記空隙と連通すると共に回路基板を収納する収納部と、を備えた筐体の少なくとも前記空隙内に、
    　前記感磁部が前記未硬化状態の樹脂材料で囲われた磁気感応素子を配置する磁気感応素子配置工程と、
    　　前記未硬化状態の樹脂材料を硬化させる硬化工程と、を少なくとも経て、
    請求項１～５のいずれか１つに記載の非接触式回転角度検出装置を製造することを特徴とする非接触式回転角度検出装置の製造方法。     An uncured state in which the glass transition temperature in a state after curing is at least −40 ° C. at least in the magnetically sensitive element provided with the magnetically sensitive portion and detecting a magnetic flux that detects a magnetic flux that changes due to the rotation of the rotating body Dipping process surrounded by resin material,
    At least the gap of a housing having a stator having a gap, a holding portion that holds the stator, and a storage portion that communicates with the gap of the stator held in the holding portion and stores a circuit board. In
    A magnetic sensitive element arranging step of arranging a magnetic sensitive element in which the magnetic sensitive part is surrounded by the uncured resin material;
    Through at least a curing step of curing the uncured resin material,
    6. A method of manufacturing a non-contact type rotational angle detecting device according to claim 1, wherein the non-contact type rotational angle detecting device is manufactured.
  8. 　吸気通路と、当該吸気通路の径方向を横切りかつ前記吸気通路を貫通するように設けられたシャフト状の回転体と、当該回転体に固定され、かつ、前記吸気通路内に回転可能に取り付けられたスロットル弁と、前記回転体の一端に、前記回転体の回転軸を間にして互いに向き合うように取り付けられた一対の磁石と、を少なくとも備えたスロットルボディー、および、
    　前記一対の磁石の間に、前記ステータが配置されるように前記スロットルボディーに取り付けられた請求項１～５のいずれか１つに記載の非接触式回転角度検出装置、を少なくとも有することを特徴とするスロットル弁制御装置。
          An intake passage, a shaft-like rotator provided so as to cross the radial direction of the intake passage and pass through the intake passage, and fixed to the rotator and rotatably mounted in the intake passage. A throttle body comprising at least a throttle valve and a pair of magnets attached to one end of the rotating body so as to face each other with a rotation shaft of the rotating body therebetween, and
    The non-contact rotation angle detection device according to any one of claims 1 to 5, which is attached to the throttle body so that the stator is disposed between the pair of magnets. Throttle valve control device.
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