WO2013084389A1 - Lamp and illumination device - Google Patents

Lamp and illumination device Download PDF

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Publication number
WO2013084389A1
WO2013084389A1 PCT/JP2012/005893 JP2012005893W WO2013084389A1 WO 2013084389 A1 WO2013084389 A1 WO 2013084389A1 JP 2012005893 W JP2012005893 W JP 2012005893W WO 2013084389 A1 WO2013084389 A1 WO 2013084389A1
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WO
WIPO (PCT)
Prior art keywords
bar
container
lamp
lid member
case
Prior art date
Application number
PCT/JP2012/005893
Other languages
French (fr)
Japanese (ja)
Inventor
亨 岡崎
次弘 松田
利雄 森
直紀 田上
考志 大村
堀内　誠
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2013509331A priority Critical patent/JPWO2013084389A1/en
Publication of WO2013084389A1 publication Critical patent/WO2013084389A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/041—Optical design with conical or pyramidal surface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lamp and a lighting device using a semiconductor light emitting element such as an LED (Light Emitting Diode) as a light source.
  • a semiconductor light emitting element such as an LED (Light Emitting Diode) as a light source.
  • an LED lamp a lamp that uses a highly efficient and long-life LED (hereinafter referred to as an LED lamp) has been proposed as a light bulb shaped lamp that can replace an incandescent light bulb.
  • a mounting substrate on which a large number of LEDs are mounted is mounted on the end of the case, and a circuit unit for causing the LED to emit light is housed in the case (Patent Document 1).
  • the electronic components that make up the circuit unit include components that are vulnerable to thermal loads, while LEDs generate heat when they emit light.
  • An electronic component that is weak against heat load may cause the operation of the LED to become unstable or shorten its life because the heat of the LED during LED emission is transmitted to the case and the inside of the case becomes high temperature.
  • a heat radiating groove is provided on the surface of the case (Patent Document 2), or the case is formed of a metal that is a good heat conducting material, whereby the heat of the LED is conducted to the base and heat is accumulated in the case. (See Non-Patent Document 1 (page 12)).
  • An object of the present invention is to provide a lamp having a new configuration that can cope with high brightness without causing an increase in size.
  • the lamp according to the first aspect of the present invention is provided in a container in which a globe opening is closed by a lid member, with a semiconductor light emitting element as a light source supported by a support member.
  • a lamp having a base attached to the opening side of the globe in the container, the container is filled with a fluid having higher thermal conductivity than air, and the support member is A bar that is erected on the lid member; and a support body that is attached to the bar and is provided with the semiconductor light emitting element.
  • the surface area of the support body is greater than the surface area of the bar. It is characterized by being large.
  • the “bars erected on the lid member” includes bar members provided in an orthogonal state or an inclined state with respect to the lid member, and is further erected without penetrating the lid member. And a bar material standing upright in a state of penetrating the lid member, and further a bar material in a combination of these.
  • a lighting device includes a lamp and a lighting fixture that is lit by mounting the lamp, and the lamp is a lamp including the above-described configuration. It is said.
  • the fluid having a higher thermal conductivity than air is sealed in the container, the heat generated from the semiconductor light emitting element can be conducted to the container by the fluid. As a result, the heat at the time of light emission can be radiated outside using the container.
  • the semiconductor light emitting element is supported by the support member, and the support member is attached to the container (lid member), the residual heat that could not be transferred to the container via the fluid is transferred from the support member to the container. I can tell you.
  • fever at the time of light emission of a semiconductor light-emitting device can be effectively transmitted to a container, and it can respond to the high-intensity of a semiconductor light-emitting device, without causing the enlargement of a lamp
  • the surface area of the support body is larger than the surface area of the bar. For this reason, the contact area between the support body and the fluid in the container is larger than when the semiconductor light emitting element is directly supported using, for example, a rod, and the temperature rise during light emission of the semiconductor light emitting element is suppressed. can do.
  • the lid member is made of a glass material
  • the bar is made of a glass sealing metal material. According to this configuration, even when a glass material with poor adhesion to other members is used as the lid member, the connection between the filament and the bulb in the conventional bulb, the arc tube glass and the electrode in the bulb-type fluorescent lamp, etc. By using a glass-sealed metal material, which has a proven record in bonding, as a bar material, the reliability of the bonded portion can be improved.
  • the support body includes a pedestal portion fixed to the bar in a state of being placed on the plurality of bars, and the semiconductor light emitting element extending from the pedestal to the center of the container and extending toward the tip side It has the extending
  • the support portion main body may be integral or separate. That is, the pedestal portion and the extending portion may be configured by separate members, or may be configured by one member in which each is integrated. According to this configuration, the semiconductor light emitting element can be easily disposed in the central portion of the container.
  • the bar is sealed to the lid member in a state of passing through the lid member, and a portion of the bar located outside the container is thermally connected to the case. Yes.
  • heat transmitted from the semiconductor light emitting element to the support member at the time of light emission can be taken out to the case outside the container, and can be released from the case to the atmosphere without depending on the container and to the base. Can also convey heat.
  • a portion located outside the bar is joined to a heat transfer member, and the heat transfer member is attached to the case. According to this configuration, the heat transmitted from the semiconductor light emitting element to the support body at the time of light emission can be transmitted to the heat transfer member via the bar, and the heat of the semiconductor light emitting element at the time of light emission can be smoothly conducted. be able to.
  • the semiconductor light emitting element is mounted on a mounting substrate, the mounting substrate is attached to the tip of the extending portion, and an area defined by a virtual surface including an element mounting surface on the mounting substrate and an inner peripheral surface of the container
  • the present invention is characterized in that a standing portion standing from the mounting substrate exists in a region where the extending portion does not exist. According to this configuration, since there is a standing portion in a region that is partitioned by a virtual surface including an element mounting surface in the mounting substrate and the inner peripheral surface of the container, the extending portion does not exist.
  • the fluid in the region can be effectively used, and the heat generated from the semiconductor light emitting device can be transmitted to the fluid over a wide range in the container.
  • the standing portion is erected from a central portion of the mounting substrate.
  • the upright portion exists in the central portion of the region where the extending portion does not exist, and heat from the semiconductor light emitting element can be efficiently transferred from the upright portion to the fluid in the container.
  • FIG. 2 is a cross-sectional view taken along line BB ′ in FIG. 1.
  • FIG. 5 is a cross-sectional view taken along the line CC ′ of FIG.
  • FIG. 6 is a cross-sectional view taken along the line DD ′ in FIG.
  • FIG. 1 is a perspective view showing the structure of an LED lamp 1 according to the first embodiment.
  • the LED lamp 1 includes a container 3 in which the opening of the globe 35 is closed by a lid member 37, and a case 5 attached to one end of the container 3 (the end on the opening side).
  • a base 7 provided in the case 5, a support member 9 disposed in the container 3, and an LED module 11 supported by the support member 9.
  • a fluid having a higher thermal conductivity than air is enclosed in the container 3.
  • the LED lamp 1 in this embodiment has a circuit unit 13 in the case 5 for receiving power through the base 7 and causing the LED module 11 to emit light, and the overall shape is similar to a conventional incandescent bulb. Yes.
  • each part which comprises the LED lamp 1 is demonstrated.
  • the direction in which the lamp axis of the LED lamp 1 extends is the lower side, and the side with the globe 35 is the upper side.
  • LED module 11 2A and 2B are diagrams showing the structure of the LED module 11, wherein FIG. 2A is a plan view of the LED module 11, and FIG. 2B is a cross-sectional view taken along the line AA ′ in FIG. .
  • the LED module 11 includes a mounting substrate 21, a plurality of LEDs 23 mounted on the upper surface of the mounting substrate 21, and a sealing body 25 that covers the plurality of LEDs 23. Prepare.
  • the mounting substrate 21 has, for example, a rectangular shape in plan view, and a light-transmitting material such as glass or alumina so that light emitted downward from the LED 23 is transmitted. It is comprised by.
  • the mounting board 21 has a connection pattern 27a for connecting a plurality of LEDs 23 (series connection and / or parallel connection) and a terminal pattern 27b for connecting to lead wires 67 and 69 connected to the circuit unit 13. , 27c.
  • the conductive path 27 is also made of a translucent material such as ITO so that light from the LED 23 can be transmitted.
  • the lead wires 67 and 69 are connected to the terminal patterns 27 b and 27 c by solder 31 at the tip portions that pass through the through holes 29 of the mounting substrate 21 from the lower side to the upper side.
  • the LED 23 is mounted on the mounting substrate 21 in the form of a so-called chip. As shown in FIG. 2, the plurality of LEDs 23 are arranged in two rows in parallel with the longitudinal direction of the mounting substrate 21 at intervals (for example, at equal intervals). Note that the number, arrangement, and the like of the LEDs 23 are appropriately determined depending on the luminance required for the LED lamp 1.
  • the sealing body 25 is made of a translucent material such as silicone resin, for example, and covers the LEDs 23 arranged in two rows in a row unit to prevent air and moisture from entering the LEDs 23.
  • the sealing body 25 has a wavelength conversion function when it is necessary to convert the wavelength of the light emitted from the LED 23.
  • a wavelength conversion function can be implemented by mixing wavelength conversion materials, such as fluorescent substance particles, in a translucent material, for example.
  • the LED 23 uses blue light as the emission color
  • a wavelength conversion material that converts the blue light of the LED 23 into yellow light is used.
  • the LED module 11 will emit the white light mixed by the blue light emitted from LED23, and the yellow light wavelength-converted by the wavelength conversion material.
  • the container 3 includes a globe 35 having an opening, and a lid member 37 that hermetically closes the opening of the globe 35 in a state in which the LED module 11 is stored in the approximate center of the globe 35.
  • helium (He) gas having a higher thermal conductivity than air is enclosed.
  • the globe 35 is a so-called A type, and is made of a glass material that is a translucent material. As shown in FIG. 1, the globe 35 includes a hollow spherical portion 35 a and a cylindrical portion 35 b extending downward from the spherical portion 35 a, and a lower end opening of the cylindrical portion 35 b is closed by a lid member 37. It is sealed (sealed).
  • the lid member 37 is a so-called button-type stem, and is made of a glass material that is a translucent material.
  • the lid member 37 has a circular plate shape (that is, a disk shape) in plan view.
  • the lid member 37 is provided with an exhaust pipe 39 used for exhausting the inside of the container 3, and lead wires 67 and 69 for supplying power to the LED module 11 are sealed in a penetrating state.
  • the bar 40 which comprises 9 is attached.
  • FIG. 3 is a perspective view showing the periphery of the lid member of the container by cutting off the opening side end of the globe.
  • FIG. 4 is a cross-sectional view taken along line BB ′ of FIG. 5 is a cross-sectional view taken along the line CC ′ of FIG. 6 is a cross-sectional view taken along line DD ′ in FIG.
  • the support member 9 is attached to the side opposite to the base 7 in the plurality of bar members 40 attached to the lid member 37, and the LED module 11. And a support body 41 for supporting the.
  • the plurality of bar members 40 are made of a material that has a higher contact force with the lid member 37 than a contact force between the support body 41 and the lid member 37.
  • the surface area of the support body 41 is larger than the sum of the surface areas of the plurality of bars 40. That is, the area in contact with the fluid (here, helium gas) sealed in the container 3 in the support body 41 is in contact with the fluid sealed in the container 3 in the plurality of rods 40. It is larger than the total area.
  • the eight rod members 40 are arranged along the circumferential direction on the circumference having the center O as the axis of the circular lid member 37.
  • the bar 40 is arranged at equal intervals.
  • the bar 40 is welded in a state where the upper end portion 40 a is inserted into the hole 45 of the base 42, and the lower end portion 40 b is inserted into the lid member 37 and fixed.
  • the bar 40 is made of a metal material, particularly a jumet material that is the same material as the power supply lead wires 67 and 69 (corresponding to the “glass-sealed metal material” of the present invention).
  • the jumet material is a material in which a core layer of Fe—Ni alloy is coated with a copper layer and a cuprous oxide layer.
  • Jumet materials are used in conventional incandescent bulbs and bulb-type fluorescent lamps, and have a proven track record in glass adhesion. Thereby, the heat of the LED module 11 at the time of lighting can be transmitted to the container 3 through the bar 40.
  • the support portion main body 41 is a flat pedestal (corresponding to the “pedestal portion” of the first invention) 42, and from the pedestal 42 to the inside of the globe 35 (container 3) (to the side opposite to the base 7). )
  • a stretching rod (corresponding to the “stretching portion” of the first invention) 41, and the LED module 11 is attached to the tip of the stretching rod 43.
  • the pedestal 42 has a disk shape, and an extending rod 43 is joined to the center thereof.
  • stretching rod 43 and the base 42 are comprised from a metal material, for example, aluminum material, and both joining is performed by welding, for example.
  • the pedestal 42 has through holes 47 and 49 through which the power supply lead wires 67 and 69 pass, on a virtual line segment passing through the center of the pedestal 42 and sandwiching the center.
  • the stretching rod 43 has a columnar shape with a circular cross section as shown in FIG. 4, and the diameter of the upper portion 43b is larger than that of the other portion 43a as shown in FIG.
  • the area of the cross section of the central portion (other portion 43a) of the extending rod 43 is larger than the total area of the cross sections of the rod members 40, and the surface area of the central portion (other portion 43a) of the extending rod 43 is larger than that of the rod member 40. It is wider than the total surface area.
  • the upper surface of the upper part 43b of the extending rod 43 is a flat surface, and has a fitting convex part 51 fitted into the fitting concave part 33 of the LED module 11 at the center thereof as shown in FIG.
  • the upper surface of the upper portion 43b (which is also the support member 9, the support portion main body 41, and the extending rod 43) is made flat by increasing the contact area with the LED module 11 (mounting substrate 21). This is because the heat of the LED module 11 is easily transferred to the stretching rod 43 (the support member 9 and the support portion main body 41).
  • the diameter of the central portion of the extending rod 43 is 3 [mm] to 29 [mm]
  • the length is 5 [mm] to 45 [mm]
  • the diameter of one bar 40 is 0.5. [Mm] to 3 [mm] and the length is 1 [mm] to 10 [mm].
  • the case 5 has a cylindrical shape, and the half on the globe 35 side in the central axis direction is the large diameter portion 5a and the half on the base 7 side is the small diameter portion 5b.
  • the case 5 is made of a resin material such as polybutylene terephthalate (PBT).
  • the large diameter portion 5 a is attached in a state of being fitted to the lower end portion of the container 3, and the small diameter portion 5 b is joined to the base 7 while being covered with the base 7.
  • a male screw is formed on the outer periphery of the small-diameter portion 5b, and is screwed with the female screw of the Edison type cap 7.
  • a fixing groove 5c for fixing the lead wire 65 connected to the base 7 is formed in the outer periphery of the small diameter portion 5b of the case 5 in parallel with the central axis of the case 5.
  • Fixing means (locking means 53) for fixing the circuit board 55 is provided. The fixing means will be described when the circuit unit 13 is described.
  • Circuit unit 13 As shown in FIG. 1, the circuit unit 13 includes a circuit board 55 and various electronic components 57 and 58 mounted on the circuit board 55. The circuit unit 13 receives power via the base 7 by the various electronic components 57 and 59.
  • Various circuits such as a rectifying circuit that rectifies commercial power (AC) and a smoothing circuit that smoothes the rectified DC power are configured.
  • the rectifier circuit is constituted by a diode bridge 57 on the upper surface side of the circuit board 55, and the smoothing circuit is constituted by a capacitor 59 on the lower surface side of the circuit board 55, and the main body of the capacitor 59 is located inside the base 7.
  • the circuit board 55 is fixed by the locking means 53 inside the case 5. Specifically, the peripheral portion of the lower surface of the circuit board 55 contacts the stepped portion 61 inside the case 5, and the upper surface of the circuit board 55 is locked by the locking portion 62.
  • a plurality of (for example, four) locking portions 62 are formed at intervals (for example, at equal intervals) in the circumferential direction, and project toward the central axis side of the case 5 as approaching the stepped portion 61. .
  • the circuit unit 13 is connected to the base 7 by lead wires 63 and 65 and to the LED module 11 by lead wires 67 and 69.
  • Base 7 The base 7 has a function of attaching the LED lamp 1 to a lighting fixture (see FIG. 12) and also has a function of electrically connecting to a commercial power source.
  • the base 7 is an Edison type used in incandescent bulbs, and includes a shell portion 71 having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 75 attached to the shell portion 71 via an insulating material 73. Become.
  • One lead wire 65 connected to the circuit unit 13 is folded back to the outer peripheral surface side at the opening end of the small diameter portion 5 b of the case 5 and covered with the shell portion 71 in a state of being fitted in the fixing groove 5 c of the case 5. Thus, it is connected to the shell portion 71.
  • the other lead wire 63 is connected to the eyelet part 75 by soldering.
  • the base 7 is attached to the case 5 with the upper end portion of the shell portion 71 being crimped in a state where the shell portion 71 is screwed into the small diameter portion 5 b of the case 5.
  • the LED lamp 1 includes a module cover member manufacturing process for manufacturing a module in which the LED module 11 is supported by a support member 9 attached to a cover member 37 (hereinafter referred to as “module cover member”), and a module.
  • a container manufacturing process for manufacturing the container 3 by sealing the attached lid member to the opening side end of the globe 35, and a helium sealing process for evacuating the container 3 and then sealing the helium gas (the container 3 filled with helium gas) A circuit assembly process for incorporating the circuit unit 13 in the case 5, a valve attachment process for attaching the valve to the case, and a base attachment process for attaching the base 7 to the case 5. Including.
  • Module-equipped lid member production process for example, a thin tube attachment process for attaching the narrow tube for the exhaust pipe 39 to the lid member 37 in an airtight manner, and the support member 9 as the lid member 37
  • a supporting member mounting step for attaching, a module attaching step for attaching the LED module 11 to the supporting member 9, and a connecting step for connecting the LED module 11 and the lead wires 67 and 69 are included.
  • the capillary tube mounting step may be performed after the supporting member mounting step or the bar member mounting step described later, or the supporting member 9 is provided with an LED module. After attaching 11, the support member 9 may be attached to the lid member 37.
  • the support member mounting step includes, for example, a main body attaching step for attaching the support portion main body 41 to the bar 40 and a bar attaching step for attaching the bar 40 to the lid member 37 in an airtight manner.
  • the support body 41 may be attached to the bar 40 after the bar 40 is first attached to the lid member 37.
  • the upper end portion 40a of the bar 40 is attached to the base 42 of the support portion main body 41 by welding.
  • the bar attaching process for example, the lower end 40b of the bar 40 is heated and directly pressed against the lid member 37, which is a glass material, and the glass material at the contact portion with the lower end 40b is melted. 40 b is pushed into the lid member 37.
  • the bar 40 and the support part main body 41 are attached by welding.
  • the support part main body 41 and the bar 40 are joined using an adhesive, It is also possible to attach the support body to the bar after attaching the material to the lid member.
  • the lid member 37 is made of a glass material
  • the bar 40 is made of a jumet material.
  • a material having excellent heat conductivity but poor adhesion to the glass material can be used as the support body 41.
  • a material that is less expensive than the bar 40 and has poor adhesion to the glass material can be used as the support body 41.
  • the support portion main body 41 can be used for other operability such as thermal conductivity, price, workability, etc. Even if a material with an emphasis on function is selected, the support member 9 can be prevented from coming off the lid member 37.
  • (2) Container creation process In the container production process, since the globe 35 and the lid member 37 are made of a glass material, the opening peripheral edge of the globe 35 and the outer peripheral edge of the lid member 37 are in contact with each other. The peripheral part of the contact part including the contact part is heated and melted to weld both.
  • the LED lamp 1 radiates the heat of the LED 23 and the heat of the circuit unit 13 generated during lighting from a plurality of paths.
  • Heat generated in the LED 23 Heat generated in the LED 23 is transmitted from the LED module 11 to the globe 35 via the helium gas in the container 3 (this is the first path), and further supported from the LED module 11. It is transmitted to the globe 35 via the member 9 and the lid member 37 (second route). The heat conducted from both paths to the globe 35 is released from the outer surface of the globe 35 to the atmosphere by conduction, convection, and radiation.
  • the amount of heat transferred when the LED module 11 emits heat from the support member 9 to the container 3 is greater than the sum of the surface areas of the plurality of bar members 40 as the surface area of the support body 41. Therefore, the number is larger than the case where the LED module 11 is directly supported by the bar 40. Thereby, the temperature rise at the time of light emission of the LED module 11 can be suppressed.
  • the heat transfer effect can be significantly improved as compared with the structure in which the heat of the LED 23 is conducted via the air in the globe. it can.
  • the LED module 11 is disposed substantially at the center of the spherical portion 35a of the globe 35, heat can be easily transferred evenly to the helium in the container 3, and heat dissipation characteristics from the globe 35 to the atmosphere can be improved.
  • the globe 35 has a size and shape similar to a glass bulb of an incandescent bulb, the envelope volume of the globe 35 is increased, and the heat radiation characteristics from the globe 35 to the atmosphere can be enhanced.
  • the size and shape of the globe 35 is matched to the incandescent bulb, and the LED module 11 is provided in the approximate center of the globe 35. Therefore, the distance between the LED module 11 and the circuit unit 13 is increased, and the circuit The thermal load that the unit 13 receives from the LED 23 can be reduced.
  • the lower end portion 40b of the bar 40 is joined to the lid member 37 so as not to extend to the outside of the container 3, but the bar is extended from the container to the outside. Then, the extension destination may be thermally joined to the case. 1.
  • an LED lamp 101 in which a bar extends to the outside of the container will be described.
  • FIG. 7 is a partial cross-sectional view of the LED lamp 101.
  • the LED lamp 101 includes a container 103, a case 105, a base 7, a support member 107, an LED module 11, and a circuit unit 13, as shown in FIG.
  • the bar 109 constituting the support member 107 extends from the container 103, and the heat transfer member 111 is joined to the extended tip.
  • the heat transfer member 111 is in contact with the inner peripheral surface of the case 105.
  • the container 103 is comprised from the glove
  • the globe 121 and the lid member 123 are made of a glass material, and the lid member 123 blocks the opening of the globe 121 in an airtight manner. That is, the lid member 123 is sealed to the periphery of the opening of the globe 121.
  • the container 103 is filled with helium gas using the exhaust pipe 124 on the side opposite to the base 7.
  • the support member 107 is composed of two or more members as in the first embodiment. That is, the support member 107 includes the support portion main body 131 and the bar 109.
  • the support portion main body 131 is formed of a single member, and includes a pedestal portion 135 corresponding to the pedestal 42 in the first embodiment and an extending portion 133 corresponding to the extending rod 43 in the first embodiment. .
  • the support body 131 in this embodiment is made of, for example, a metal material (specifically, an aluminum material).
  • the surface area of the support body 131 is larger than the total surface area of each of the plurality of bars 109.
  • the front end of the extending portion 133 is the same as the front end shape of the extending rod 43 in the first embodiment, and comes into contact with the back surface of the mounting substrate 21 of the LED module 11.
  • the lower part of the support body 131 has a shape that gradually increases in diameter as it approaches the pedestal part 135 from the extending part 133, and a through-hole 137 through which the power supply lead wires 67 and 69 are inserted into the expanded part. , 139 are formed.
  • Each bar 109 is attached (sealed) to the lid member 123 in an airtight manner while penetrating the lid member 123.
  • each bar 109 is fixed to the lower surface of the pedestal 135 of the support body 131 by, for example, welding.
  • the lower end 109b of each bar 109 is located outside the container 3, and this part is fixed to the upper surface of the heat transfer member 111 made of a metal material by welding (for example, with the bar 109). Any state may be used as long as it is in contact with the thermal member 111.)
  • the heat transfer member 111 has a disk shape.
  • the area of the cross section of the central portion of the extending portion 133 is wider than the total area of the cross sections of the bar 109, and the surface area of the extending portion 133 is larger than the total surface area of the bar 109. It is getting wider.
  • the case 105 has basically the same configuration as the case 5 in the first embodiment, but the case 105 is a case where the heat transfer member 111 is housed inside while being thermally coupled to the heat transfer member 111. Different from 5.
  • the case 105 has a restricting portion 141 on its inner peripheral surface that restricts the insertion of the heat transfer member 111 when the heat transfer member 111 is inserted from the opening opposite to the base 7.
  • the restricting portion 141 is constituted by a step on the inner peripheral surface of the case 105, and is continuously formed in the circumferential direction. Note that a plurality of restricting portions may be formed at intervals in the circumferential direction.
  • the heat of the LED module 11 at the time of light emission is transmitted from the support member 107 to the case 105 via the heat transfer member 111 existing outside the container 103 and is released from the case 105 to the outside air. Or transmitted from the base 7 to the socket on the lighting device side. 2.
  • Heat dissipation Heat generated in the LED 23 is transmitted from the LED module 11 to the globe 121 via the helium gas in the container 103 (first path), and from the LED module 11 to the support member 107 and the lid member 123. Is transmitted to the globe 121 via (the second route).
  • the LED module 11 is transferred to the case 105 via the support member 107, in particular, the bar 109 and the heat transfer member 111 (this is the third path), and the heat transferred to the case 105 is caused by convection and radiation. It is discharged into the atmosphere or transmitted from the base 7 to the socket on the lighting fixture side (see FIG. 12).
  • FIG. 8 to FIG. 11 are explanatory diagrams of examples of joining of the support portion main body and the bar material and joining examples of the bar material and the heat transfer member.
  • Examples 1 to 3 described below are structures in which the support body is integrated, but the support body may be composed of two or more members as described in the first embodiment. .
  • Example 1 the intermediate portion 201c of the bar 201 is attached to the lid member 203 in an airtight manner.
  • the intermediate portion 201 c of the bar 201 extends perpendicularly to the upper and lower surfaces of the lid member 203.
  • a plurality of bar members 201 are provided on the circumference centering on the center of the disk-shaped base 207 at intervals in the circumferential direction, and a cross section along this circumference is shown in FIG.
  • the upper end portion 201 a of the bar 201 is bent so as to be parallel to the lid member 203, and a portion parallel to the lid member 203 is joined to the upper surface of the base 207 of the support portion main body 205 via a screw 209. .
  • the base 207 has a through hole 211 through which the bar 201 is inserted in accordance with the insertion position of the bar 201 and has a screw hole corresponding to the screw 209.
  • the lower end portion 201b of the bar 201 is bent so as to be parallel to the lid member 203, and a portion parallel to the lid member 203 is joined to the lower surface of the heat transfer member 213 via a screw 215.
  • the heat transfer member 213 has a through hole 217 through which the bar 201 is inserted in accordance with the insertion position of the bar 201, and has a screw hole corresponding to the screw 215.
  • the intermediate portion 231c of the bar 231 is attached to the lid member 233 in an airtight manner.
  • the intermediate portion 231 c of the bar 231 extends perpendicularly to the upper and lower surfaces of the lid member 233.
  • a plurality of bars 231 are provided on two virtual lines that pass through the center of the disk-shaped base 235 and are orthogonal to each other (four bars are provided for one virtual line).
  • FIG. 9 shows a cross section along one imaginary line.
  • the intermediate portion 231c of the bar 231 has a columnar shape with a circular cross section (not shown).
  • the upper end portion 231a of the bar 231 is fixed by the fixing means in a state where it is inserted from below into the recessed portion 237 on the lower surface of the base 235.
  • the fixing means is constituted by a leaf spring 239 having a “U” shape.
  • the leaf spring 239 is disposed in the recessed portion 237, and the upper end portion 231a is fixed by gripping the upper end portion 231a of the bar 231 inserted in the recessed portion 237 in the recessed portion 237.
  • the upper end 231a of the bar 231 has a rectangular cross section, and in order to prevent the upper end 231a from coming off from the leaf spring 239, only the upper end is gripped by the leaf spring 239 (the direction perpendicular to the insertion direction of the rod). )) Is larger. That is, the upper end has a spherical shape.
  • the structure of the leaf spring 239 is the same as that of the leaf spring 245 that fixes the lower end portion 231b of the bar 231.
  • the lower end portion 231b of the bar 231 is fixed by a fixing means in a state of being inserted into the recessed portion 243 on the upper surface of the heat transfer member 241.
  • the fixing means is constituted by a leaf spring 245 having the same configuration as the leaf spring 239 having a “U” shape.
  • the leaf spring 245 is disposed in the recessed portion 243, and fixes the lower end portion 231b by gripping the lower end portion 231b of the bar 231 inserted into the recessed portion 243 in the recessed portion 243.
  • the leaf spring 245 includes a pair of gripping pieces 245a and 245b and a connecting portion 245c that connects one ends of the pair of gripping pieces 245a and 245b, and the distance between the pair of gripping pieces 245a and 245b is close to the connecting portion 245c.
  • the side is smaller.
  • the connecting portion 245c of the leaf spring 245 is fixed inside the recessed portion 243 by, for example, an adhesive (not shown).
  • the lower end portion 231b of the bar 231 has a rectangular cross section, and the dimension in the holding direction by the plate spring 245 is increased only at the lower end in order to prevent the lower end portion 231b from coming off from the plate spring 245. That is, the lower end has a spherical shape.
  • the intermediate portion 251c of the bar 251 is attached to the lid member 253 in an airtight manner.
  • the intermediate portion 251c of the bar 231 extends perpendicularly to the upper and lower surfaces of the lid member 253.
  • a plurality of bars 251 are provided on two virtual lines that pass through the center of the disk-shaped base 255 and are orthogonal to each other (four bars are provided for one virtual line).
  • FIG. 10 shows a cross section along one imaginary line.
  • the intermediate part 251c of the bar 251 has a cylindrical shape with a circular cross section (not shown).
  • the upper end portion 251a of the bar 251 is fixed by the fixing means in a state where it is inserted into the recessed portion 257 on the lower surface of the base 255 from below.
  • the fixing means is constituted by an adhesive 259.
  • the lower end portion 251b of the bar 251 is fixed by a fixing means in a state of being inserted into the recessed portion 263 on the upper surface of the heat transfer member 261.
  • the fixing means is constituted by an adhesive 265.
  • the adhesives 259 and 265 can be used regardless of an organic material (for example, a resin material) or an inorganic material (for example, cement or glass).
  • a resin material for the adhesives 259 and 265
  • both a thermosetting type and a thermoplastic type can be used.
  • the thermoplastic type is used, the concave portions 257 and 263 are filled with adhesive in advance, and then the upper end portion 251a and the lower end portion 251b of the bar 251 are heated and inserted into the concave portions 257 and 263. As the adhesive melts and the temperature drops, it cures and joins as it is.
  • Example 4 In Example 4, the intermediate portion 271c of the bar 271 is attached to the lid member 273 in an airtight manner.
  • the intermediate portion 271c of the bar 271 extends perpendicularly to the upper and lower surfaces of the lid member 273.
  • a plurality of bars 271 are provided on two imaginary lines that pass through the center of the disk-shaped base 275 and are orthogonal to each other (four bars are provided for one imaginary line). 11), a cross section along one imaginary line is shown in FIG.
  • the intermediate portion 271c of the bar 271 has a columnar shape with a circular cross section.
  • the upper end portion 271a of the bar 271 is fixed in a state of being inserted from below into the recessed portion 277 on the lower surface of the base 275.
  • the size of the recessed portion 277 is such that the upper end portion 271a of the bar 271 fits.
  • the fixing method is performed by caulking the pedestal 275 using the caulking jig 279 in a state where the bar 271 is inserted into the recessed portion 277.
  • the pedestal 275 is made of a plastically deformable material, for example, a metal material.
  • the pedestal 275 is deformed so that the opening of the recessed portion 277 becomes small, and the dent The bar 271 in the insertion part 277 is compressed, and the upper end 271a of the bar 271 is fixed.
  • the lower end portion 251b of the bar 251 is fixed in a state of being inserted from above into the recessed portion 283 on the upper surface of the heat transfer member 281.
  • the size of the recessed portion 283 is such that the lower end portion 271b of the bar 271 fits.
  • the fixing method is performed by caulking the heat transfer member 281 using the caulking jig 285 in a state where the bar 271 is inserted into the recessed portion 283. That is, the heat transfer member 281 is made of a plastically deformable material, for example, a metal material, and the heat transfer member 281 is compressed so that the opening side of the recessed portion 283 is reduced by compressing the heat transfer member 281 from the side surface side. Is deformed, the bar 271 in the recessed portion 283 is compressed, and the lower end 271b of the bar 271 is fixed.
  • a plastically deformable material for example, a metal material
  • the bars 201, 231, 251 and 271 are used for the base where the upper end is located in the container and the heat transfer member whose lower end is located outside the container. Although each was connected, the bar may connect the lid member and the support body as in the first embodiment.
  • the technique of Example 1 is used for joining to the pedestal
  • the technique of Example 4 is used to join to the heat transfer member. You may do it. That is, you may combine suitably the form demonstrated in 1st Embodiment, 2nd Embodiment, and 2nd Embodiment.
  • Third Embodiment In the embodiment and the like, the LED lamp has been particularly described. However, the first invention can also be applied to an illumination device using the LED lamp.
  • FIG. 12 is a schematic diagram of a lighting device according to the third embodiment.
  • the lighting device 301 is used by being mounted on the ceiling 303, for example.
  • the lighting device 301 includes an LED lamp 1 (for example, the LED lamp 1 described in the first embodiment) 1 and a lighting fixture 305 that is mounted with the LED lamp 1 to be turned on / off. With.
  • LED lamp 1 for example, the LED lamp 1 described in the first embodiment
  • lighting fixture 305 that is mounted with the LED lamp 1 to be turned on / off.
  • the lighting fixture 305 includes, for example, a fixture main body 307 attached to the ceiling 303 and a cover 309 attached to the fixture main body 307 and covering the LED lamp 1.
  • the cover 309 is an open type here, and has a reflection film 313 on the inner surface that reflects light emitted from the LED lamp 1 in a predetermined direction (here, downward).
  • the appliance body 307 includes a socket 311 to which the base 7 of the LED lamp 1 is attached (screwed), and the LED lamp 1 is supplied with power through the socket 311.
  • the arrangement position of the LED 23 (LED module 11) of the LED lamp 1 mounted on the lighting fixture 305 is close to the arrangement position of the filament of the incandescent bulb, the emission center in the LED lamp 1 and the emission center in the incandescent bulb. Are close to each other.
  • the LED lamp 1 is mounted on the lighting fixture (305) on which the incandescent lamp is mounted, the light distribution center similar to the incandescent lamp can be obtained because the position of the light emission center as the lamp is similar.
  • the lighting fixture here is an example.
  • the lighting fixture may not have the opening-type cover 309 but may have a closed-type cover, or a posture in which the LED lamp faces sideways ( It may be a lighting fixture that is lit in a posture in which the central axis of the lamp is horizontal) or an inclined posture (a posture in which the central axis of the lamp is inclined with respect to the central axis of the lighting fixture).
  • the lighting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall, but it may be an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or the wall. It may be a hanging type that can be hung from the ceiling by an electric cable of a lighting fixture.
  • the lighting fixture is lighting one LED lamp with which it is mounted here, a plurality of, for example, three LED lamps may be mounted.
  • ⁇ Modification ⁇ The configuration of the first invention has been described based on the first to third embodiments.
  • the first invention is not limited to the above embodiment.
  • the LED lamp and the lighting device may be appropriately combined with the partial configuration of the LED lamp and the lighting device according to the first to third embodiments and the configuration according to the following modification.
  • the materials, numerical values, and the like described in the above embodiments are merely preferable examples, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the LED lamp and the lighting device without departing from the scope of the technical idea of the first invention.
  • the globes 35 and 121 and the lid members 37 and 123 are made of a glass material, but other materials can be used as long as the airtightness of the valve (container) can be maintained. Also good.
  • the globe and the lid member can be made of a resin material.
  • a resin material for example, a thermoplastic material can be implemented by heating and melting a joint portion between a glove and a lid member, and a thermosetting resin can be implemented by using an adhesive.
  • a gas barrier resin may be formed on the inner peripheral surface of the container to improve the airtightness.
  • the containers 3 and 103 have an A-type shape, but other types, for example, a G-type and an R-type shape may be used. Also good.
  • the lid members 37 and 123 are formed in a disc shape (a so-called button stem), but may have a shape such as a so-called flare stem or other types of shapes. You may do it. 2.
  • helium gas is used as the fluid sealed in the container.
  • other types of gas (gas) having higher thermal conductivity than air may be sealed. Examples of other gases include hydrogen and neon.
  • liquid can also be utilized other than gas (gas) as a fluid.
  • the liquid having higher thermal conductivity than air include silicone oil and water.
  • Number of bars (1) The number of bars 40 and 109 in the embodiment is 8 or 9, but may be other than this number, for example, 1 or a plurality. However, it is preferable that there are three or more in order to stably support the support body.
  • (2) Cross-sectional shape The cross-sectional shape of the joint portion between the bar members 40 and 109 and the lid members 37 and 123 in the embodiment is circular.
  • the cross-sectional shape of the joint portion is not limited to a circular shape. However, considering the adhesion at the time of sealing to the lid member, a circular shape, an elliptical shape, or an oval shape is preferable.
  • the bars 40 and 109 are made of the jumet material in consideration of the sealing property with the lid members 37 and 123, which are glass materials.
  • the dumet is formed only at the joint portion with the lid member.
  • the material may be used, and other parts may be composed of another material, such as aluminum, steel, tungsten material.
  • the plurality of bar members 40 are arranged on the circumference, and in other joint examples in the second embodiment, the plurality of bar members intersect with each other (for example, orthogonal). Arranged on two virtual lines.
  • the plurality of bar members are not particularly limited as long as the support body can be stably fixed. 4).
  • Support Unit Main Body In the first embodiment, the support unit main body 41 includes a pedestal 42 and an extending rod 43 that are formed of separate members.
  • the extending rod 43 has a function of transmitting heat of the LED module 11 to the pedestal 42 and a fluid (in the embodiment, helium gas). Moreover, it has the function to transmit the heat transmitted to the base 42 to the bar 40.
  • the pedestal may be made of a material having inferior thermal conductivity (specifically, a material having lower thermal conductivity than the stretching rod).
  • the material of each member can be appropriately determined to have various functions. 5. Connection of Container and Case
  • the container 3 and the case 5 are fixed by an adhesive 56. For this reason, the structure is such that the heat of the container 3 is transmitted from the container 3 to the case 5 when the lamp is lit.
  • a fluid with high thermal conductivity is sealed in the container, the temperature of the container rises and the heat is transmitted to the case, which may increase the temperature of the case.
  • a material having low thermal conductivity may be interposed between the valve and the globe, and the two may be joined.
  • the light emitting element is the LED 23, but may be, for example, an LD (laser diode) or an EL element (electric luminescence element).
  • LED23 was mounted on the mounting board by the chip type, LED may be mounted on the mounting board by the surface mounting type (what is called SMD) or a shell type, for example. Further, the plurality of LEDs may be a mixture of a chip type and a surface mount type.
  • SMD surface mounting type
  • the plurality of LEDs may be a mixture of a chip type and a surface mount type.
  • the mounting substrate may have another shape, for example, a square shape (including a regular polygon shape), an elliptical shape, a circular shape, an annular shape, or the like.
  • the number of mounting boards is not limited to one, and may be two or more.
  • the LEDs 23 are mounted on the front surface of the mounting substrate 21, but the LEDs may be mounted on the back surface of the mounting substrate.
  • the sealing body 25 covers the LEDs 23 arranged in two rows in a row unit. However, two rows may be covered together. And you may coat
  • the plurality of LEDs 23 are arranged in two rows.
  • the LEDs 23 are arranged along the four sides of the quadrangle so that when viewed in plan, the quadrangular shape is obtained. It may be arranged, and may be arranged so that it may be located on the circumference of an ellipse (a circle is included). Furthermore, it may be arranged in a matrix. (5) Others The LED module 11 emits white light by using the LED 23 that emits blue light and the phosphor particles that convert the wavelength of the blue light into yellow light. A combination of the semiconductor light emitting element and the phosphor particles of three colors that emit light in the three primary colors (red, green, and blue) may be used.
  • the cases 5 and 105 are made of a resin material, but may be made of other materials.
  • a metal material it is necessary to ensure insulation from the base. Insulation with the base can be ensured by, for example, applying an insulating film to the small-diameter portion of the case or by insulating the small-diameter portion. It can also be ensured by configuring each side with a resin material (two or more members are combined).
  • the surface of the cases 5 and 105 is not particularly described.
  • a heat radiating fin may be provided, or a process for improving the radiation rate may be performed. 8).
  • the Edison type base 7 is used, but other types, for example, a pin type (specifically, G type such as GY, GX, etc.) may be used.
  • die 7 was mounted
  • the case may be joined to the case.
  • Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.
  • a mounting substrate on which a semiconductor light emitting element as a light source is mounted extends from the lid member in a container in which a globe opening is closed by the lid member.
  • a lamp that is supported by a supporting portion, wherein a fluid having higher thermal conductivity than air is sealed in the container, and a virtual surface including an element mounting surface on the mounting substrate and the container It is characterized by having a standing portion standing from the mounting substrate in a region partitioned by an inner peripheral surface and where the support portion does not exist.
  • “Standing” as used herein means that when extending in a direction orthogonal to the mounting substrate, extending in a direction intersecting the mounting substrate, extending linearly, extending linearly, A case where the film is stretched so as to have both a part extending in a shape and a part extending in a curve.
  • “standing from the mounting substrate” includes a case where the mounting substrate is erected without penetrating, a case where the mounting substrate is erected, and a case where the penetrating state and the state of not penetrating are combined. .
  • a lighting device is a lighting device including a lamp and a lighting fixture that is lit by mounting the lamp, and the lamp has the above-described configuration. It is characterized by being a lamp.
  • the fluid having a higher thermal conductivity than air is sealed in the container, a part of the heat generated from the semiconductor light emitting element is part of the semiconductor light emitting element, the mounting substrate, the support portion, and the stand. It can be made to conduct to a container via a fluid from an installation part. As a result, the heat at the time of light emission can be radiated outside using the container.
  • the fluid in this region is effective.
  • the heat generated from the semiconductor light emitting device can be transferred to the fluid over a wide range in the container.
  • the standing portion is characterized in that it stands up from the center portion of the mounting substrate, or there are a plurality of the standing portions, characterized in that it stands up from the peripheral portion of the mounting substrate,
  • the mounting substrate has a through hole, and the support portion and the standing portion are continuous through the through hole.
  • FIG. 13 is a front view of an LED lamp 401 according to the fourth embodiment, and is partially cut away so that the inside can be seen.
  • the LED lamp 401 according to the fourth embodiment is provided with a standing member with respect to the LED lamp 1 described in the first embodiment. For this reason, the code
  • FIG. 1st Embodiment is used with respect to the same thing as the structure of the LED lamp 1.
  • the LED lamp 401 includes a mounting substrate 21 on which an LED, which is a semiconductor light emitting element as a light source, is mounted in a container 3 in which an opening of a globe 35 is closed by a lid member 37. It is supported by a support member 9 which is a support portion extending from the outside.
  • the container 3 is filled with a fluid having higher thermal conductivity than air, and is a region defined by a virtual surface including an element mounting surface on the mounting substrate 21 and an inner peripheral surface of the container, and the support member 9. And a standing member 405 erected from the mounting substrate 21 in a region where there is no existence.
  • the LED lamp 401 includes a case 5 attached to one end of the container 3 and a base 7 provided in the case 5 in addition to the above configuration. Also, an LED module 411 is a module in which LEDs are mounted on the mounting substrate 21.
  • the LED lamp 401 in this embodiment has a circuit unit 13 in the case 5 for receiving power through the base 7 and causing the LED module 411 to emit light, and the overall shape is similar to a conventional incandescent bulb. Yes.
  • each part which comprises the LED lamp 401 is demonstrated.
  • the direction in which the lamp axis X (see FIG. 2) of the LED lamp 401 extends is the lower side
  • the side with the globe is the upper side.
  • LED module 411 14A and 14B are views showing the periphery of the LED module
  • FIG. 14A is a plan view of the periphery of the LED module
  • FIG. 14B is a cross-sectional view taken along the line GG ′ in FIG. .
  • the LED module 411 includes a mounting substrate 21, a plurality of LEDs 23 mounted on the upper surface of the mounting substrate 21, and a sealing body 25 that covers the plurality of LEDs 23. Prepare.
  • the mounting substrate 21 has a rectangular shape in plan view, and a light-transmitting material such as glass or alumina so that light emitted downward from the LED 23 is transmitted. It is comprised by.
  • the mounting board 21 has a connection pattern 27a for connecting a plurality of LEDs 23 (series connection and / or parallel connection) and a terminal pattern 27b for connecting to lead wires 67 and 69 connected to the circuit unit 13. , 27c.
  • the conductive path 27 is also made of a translucent material such as ITO so that light from the LED 23 can be transmitted.
  • the lead wires 67 and 69 are connected to the terminal patterns 27 b and 27 c by solder 31 at the tip portions that pass through the through holes 29 of the mounting substrate 21 from the lower side to the upper side.
  • the LED 23 is mounted on the mounting substrate 21 in the form of a so-called chip. As shown in FIG. 14B, the plurality of LEDs 23 are arranged in two rows in parallel with the longitudinal direction of the mounting substrate 21 at intervals (for example, at equal intervals). Note that the number, arrangement, and the like of the LEDs 23 are appropriately determined depending on the luminance required for the LED lamp 401.
  • the sealing body 25 is made of a translucent material such as silicone resin, for example, and covers the LEDs 23 arranged in two rows in a row unit to prevent air and moisture from entering the LEDs 23.
  • the sealing body 25 has a wavelength conversion function when it is necessary to convert the wavelength of the light emitted from the LED 23.
  • a wavelength conversion function can be implemented by mixing wavelength conversion materials, such as fluorescent substance particles, in a translucent material, for example.
  • the LED 23 uses blue light as the emission color
  • a wavelength conversion material that converts the blue light of the LED 23 into yellow light is used.
  • the LED module 411 emits white light mixed with blue light emitted from the LED 23 and yellow light wavelength-converted by the wavelength conversion material.
  • the LED module 411 has a non-circular through hole 433 formed at the center, and a standing member 405 having a non-circular cross section passes through the through hole 433. That is, the standing member 405 is standing on the LED module 411. In addition, when the standing member 405 having a non-circular cross section is inserted through the through hole 433, the LED module 411 is restricted from rotating around the lamp shaft.
  • the container 3 includes a globe 35 having an opening, and a lid member 37 that hermetically closes the opening of the globe 35 in a state in which the LED module 411 is stored in the approximate center of the globe 35.
  • helium (He) gas having a higher thermal conductivity than air is enclosed. Thereby, the heat of the LED module 411 at the time of lighting can be efficiently transmitted to the globe 35.
  • the globe 35 is a so-called A type, and is made of a glass material that is a translucent material. As shown in FIG. 13, the globe 35 includes a hollow spherical portion 35 a and a cylindrical portion 35 b extending downward from the spherical portion 35 a, and the lower end opening of the cylindrical portion 35 b is closed by a lid member 37. It is sealed (sealed).
  • the lid member 37 is a so-called button-type stem, and is made of a glass material that is a translucent material.
  • the lid member 37 has a circular plate shape (that is, a disk shape) in plan view.
  • the lid member 37 is provided with an exhaust pipe 39 used for exhausting the inside of the container 3, and lead wires 67 and 69 for supplying power to the LED module 411 are sealed in a penetrating state.
  • the bar 40 which comprises 9 is attached.
  • the joint between the globe 35 and the lid member 37 is performed by heating the joint portions of the two and melting the glass material at the portions.
  • Support member 9 The support member 9, the globe 35, the lid member 37, and the like have the same configuration as in the first embodiment. For this reason, it demonstrates using the figure utilized for description of 1st Embodiment as it is. That is, a perspective view showing the periphery of the lid member of the container by cutting out the opening side end of the globe corresponds to FIG. Further, the cross-sectional view taken along the line FF ′ in FIG. 13 corresponds to FIG. A cross-sectional view of the LED lamp 401 taken along the line corresponding to the line CC ′ of FIG. 4 corresponds to FIG. A cross-sectional view of the LED lamp 401 taken along the line corresponding to DD ′ in FIG. 5 corresponds to FIG.
  • the support member 9 is attached to the plurality of bar members 40 attached to the lid member 37, and is attached to the side opposite to the base 7 in the plurality of bar members 40 and supports the LED module 411.
  • the plurality of bar members 40 are made of a material that has a higher contact force with the lid member 37 than a contact force between the support body 41 and the lid member 37.
  • the eight rod members 40 are arranged along the circumferential direction on the circumference having the center O as the axis of the circular lid member 37.
  • the bar 40 is arranged in the circumferential direction at equal intervals.
  • the bar 40 is welded in a state where the upper end portion 40 a is inserted into the hole 45 of the base 42, and the lower end portion 40 b is inserted into the lid member 37 and fixed.
  • the bar 40 is made of a metal material, in particular, a jumet material that is the same material as the power supply lead wires 67 and 69 (used in conventional incandescent bulbs and bulb-type fluorescent lamps, and adheres to glass. Has a track record.) Thereby, the heat of the LED module 411 at the time of lighting can be transmitted to the container 3 through the bar 40.
  • the support body 41 includes a flat base 42 and a stretching bar 43 that extends from the base 42 to the inside of the globe 35 (to the side opposite to the base 7).
  • the LED module 411 is attached to the tip of the stretching bar 43. It is attached.
  • the pedestal 42 has a disk shape, and an extending rod 43 is joined to the center thereof.
  • stretching rod 43 and the base 42 are comprised from a metal material, for example, aluminum material, and both joining is performed by welding, for example.
  • the pedestal 42 has through holes 47 and 49 through which the lead wires 67 and 69 for supplying power pass, on a virtual line segment connecting the centers of the pedestals 42 and sandwiching the center.
  • the stretching rod 43 has a columnar shape with a circular cross section as shown in FIG. As shown in FIG. 13, the upper portion 43b is thicker and flatter than the other portion 43a.
  • the width of the upper portion 43b is substantially the same as the width of the LED module 411 (the dimension in the short direction of the mounting substrate 21), and appears in the length of the upper portion 43b (FIG. 13 and FIG. 14B). Is the size of the part.) Is larger than the width.
  • the area of the cross section of the central portion (other portion 43a) of the extending rod 43 is larger than the total area of the cross sections of the rod members 40, and the surface area of the central portion (other portion 43a) of the extending rod 43 is larger than that of the rod member 40. It is wider than the total surface area.
  • the upper surface of the upper part 43b is a flat surface, and as shown in FIG. 14 (b), has a fitting convex part 51 that fits into a fitting concave part 409 formed on the bottom surface of the standing member 405 at the center. .
  • Standing member 405 The standing member 405 extends upward from the LED module 411.
  • the standing member 405 extends from the upper end surface of the extending rod 43 of the support member 9 through the mounting substrate 21 of the LED module 411.
  • the standing member 405 in the fourth embodiment extends in a direction orthogonal to the LED module 411 (mounting substrate 21). That is, the standing member 405 and the support member 9 are continuous via the through hole 433.
  • the standing member 405 extends in a straight line in a direction orthogonal to the LED module 411.
  • the standing member 405 has a rod shape. With these configurations, the amount of light emitted from the LED module 411 can be reduced.
  • the standing member 405 is attached to the support member 9 using fitting means.
  • fitting means As a specific fitting means, the fitting convex portion 51 at the upper end of the extending rod 43 and the fitting concave portion 409 at the lower end of the standing member 405 are fitted.
  • the cross-sectional shape perpendicular to the extending direction of the extending rod 43 in the fitting convex portion 51 and the cross-sectional shape orthogonal to the extending direction of the extending rod 43 in the fitting concave portion 409 are non-circular. This restricts rotation of the standing member 405 around the extending direction.
  • the cross-sectional shape of the fitting recessed part 409 and the fitting convex part 51 is a square shape (square shape) here.
  • the standing member 405 and the extending rod 43 are made of a metal material, for example, the standing member 405 and the extending rod 43 can be joined by shrink fitting, welding, or bonding. For example, it can be performed by adhesion.
  • the case 5 As shown in FIG. 13, the case 5 has a cylindrical shape, and the half on the globe 35 side in the central axis direction is the large diameter portion 5a, and the half on the base 7 side is the small diameter portion 5b.
  • the case 5 is made of a resin material such as polybutylene terephthalate (PBT).
  • the large diameter portion 5 a is attached in a state of being fitted to the lower end portion of the container 3, and the small diameter portion 5 b is joined to the base 7 while being covered with the base 7.
  • a male screw is formed on the outer periphery of the small-diameter portion 5b, and is screwed with the female screw of the Edison type cap 7.
  • a fixing groove 5c for fixing the lead wire 65 connected to the base 7 is formed in the outer periphery of the small diameter portion 5b of the case 5 in parallel with the central axis of the case 5.
  • Fixing means (locking means 153) for fixing the circuit board 55 is provided. The fixing means will be described when the circuit unit 13 is described.
  • (6) Circuit unit 13 As shown in FIG. 13, the circuit unit 13 includes a circuit board 55 and various electronic components 57 and 59 mounted on the circuit board 55, and receives power via the base 7 by the various electronic components 57 and 59.
  • Various circuits such as a rectifying circuit that rectifies commercial power (AC) and a smoothing circuit that smoothes the rectified DC power are configured.
  • the rectifier circuit is constituted by a diode bridge 57 on the upper surface side of the circuit board 55, and the smoothing circuit is constituted by a capacitor 59 on the lower surface side of the circuit board 55, and the main body of the capacitor 59 is located inside the base 7.
  • the circuit board 55 is fixed by the locking means 53 inside the case 5. Specifically, the peripheral portion of the lower surface of the circuit board 55 contacts the stepped portion 61 inside the case 5, and the upper surface of the circuit board 55 is locked by the locking portion 62.
  • a plurality of (for example, four) locking portions 62 are formed at intervals (for example, at equal intervals) in the circumferential direction, and project toward the central axis side of the case 5 as approaching the stepped portion 61. .
  • the circuit unit 13 is connected to the base 7 by lead wires 63 and 65 and to the LED module 411 by lead wires 67 and 69.
  • Base 7 The base 7 has a function of attaching the LED lamp 401 to a lighting fixture (see FIG. 20) and also has a function of electrically connecting to a commercial power source.
  • the base 7 is an Edison type used in incandescent bulbs, and includes a shell portion 71 having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 75 attached to the shell portion 71 via an insulating material 73. Become.
  • One lead wire 65 connected to the circuit unit 13 is folded back to the outer peripheral surface side at the opening end of the small diameter portion 5 b of the case 5 and covered with the shell portion 71 in a state of being fitted in the fixing groove 5 c of the case 5. Thus, it is connected to the shell portion 71.
  • the other lead wire 63 is connected to the eyelet part 75 by soldering.
  • the base 7 is attached to the case 5 with the upper end portion of the shell portion 71 being crimped in a state where the shell portion 71 is screwed into the small diameter portion 5 b of the case 5.
  • the LED lamp 401 includes a module-attached lid member production process for producing an LED lamp 411 supported by the support member 9 attached to the lid member 37 (hereinafter referred to as a “module lid member”), and a module.
  • a circuit assembly process for incorporating the circuit unit 13 into the case 5, a valve attachment process for attaching the valve to the case, and a base attachment process for attaching the base 7 to the case 5.
  • Module-equipped lid member production process for example, a thin tube attachment process for attaching the narrow tube for the exhaust pipe 39 to the lid member 37 in an airtight manner, and the support member 9 as the lid member 37
  • a supporting member attaching step for attaching, a module attaching step for attaching the LED module 411 to the supporting member 9, and a connecting step for connecting the LED module 411 and the lead wires 67, 69 are included.
  • the thin tube attaching step may be performed after the bar attaching step, or may be supported after attaching the LED module 411 to the supporting member 9.
  • the member 9 may be attached to the lid member 37.
  • the step of attaching the standing member 405 to the support member 9 may be before the support member attachment step, or may be between the support member attachment step and the module attachment step. Furthermore, when the standing member 405 is fixed to the support member 9 with, for example, an adhesive, it may be after the module attaching step or after the connecting step.
  • the support member attaching step includes, for example, a main body attaching step for attaching the supporting portion main body 41 to the rod member 40 and a rod member attaching step for attaching the rod member 40 to the lid member 37 in an airtight manner.
  • the bar 40 may be attached to the lid member 37 after the bar 40 is first attached to the lid member 37.
  • the upper end portion 40a of the bar 40 is attached to the base 42 of the support portion main body 41 by welding.
  • the bar attaching process for example, the lower end 40b of the bar 40 is heated and directly pressed against the lid member 37, which is a glass material, while the glass material at the contact portion with the lower end 40b is melted, 40 b is pushed into the lid member 37.
  • the bar 40 and the support part main body 41 are attached by welding.
  • the support part main body 41 and the bar 40 are joined using an adhesive, It is also possible to attach the support body 41 to the bar 40 after attaching the material 40 to the lid member 37.
  • the lid member 37 is made of a glass material
  • the bar 40 is made of a jumet material.
  • a material having excellent heat conductivity but poor adhesion to the glass material can be used as the support body 41.
  • a material that is less expensive than the bar 40 and has poor adhesion to the glass material can be used as the support body 41.
  • the support portion main body 41 can be used for other operability such as thermal conductivity, price, workability, etc. Even if a material with an emphasis on function is selected, the support member 9 can be prevented from coming off the lid member 37.
  • (2) Container creation process In the container production process, since the globe 35 and the lid member 37 are made of a glass material, the opening peripheral edge of the globe 35 and the outer peripheral edge of the lid member 37 are in contact with each other. The peripheral part of the contact part including the contact part is heated and melted to weld both.
  • the LED lamp 401 radiates the heat of the LED 23 and the heat of the circuit unit 13 generated during lighting from a plurality of paths.
  • Heat generated in the LED 23 Heat generated in the LED 23 is transmitted from the LED module 411 to the globe 35 via the helium gas in the container 3 (first path), and further supported from the LED module 411. It is transmitted to the globe 35 via the member 9 and the lid member 37 (second route). The heat conducted from both paths to the globe 35 is released from the outer surface of the globe 35 to the atmosphere by conduction, convection, and radiation.
  • the heat transfer effect can be significantly improved as compared with the structure in which the heat of the LED 23 is conducted via the air in the globe. it can.
  • the LED module 411 is disposed substantially at the center of the spherical portion 35a of the globe 35, heat can be easily transferred evenly to the helium in the container 3, and the heat dissipation characteristics from the globe 35 to the atmosphere can be improved.
  • the globe 35 has a size and shape similar to a glass bulb of an incandescent bulb, the envelope volume of the globe 35 is increased, and the heat radiation characteristics from the globe 35 to the atmosphere can be enhanced.
  • the standing member 405 is a region defined by a virtual surface including the element mounting surface (the upper surface of the mounting substrate) in the LED module 411 and the inner peripheral surface of the container 3, and the support member 9 does not exist. Since the region extends, the fluid in this region can be used effectively, and the heat generated from the LED 23 can be transmitted to the fluid over a wide range in the container 3.
  • the standing member 405 is erected from the substantially central portion of the mounting substrate 21, heat can be evenly transferred from the erected member 405 to the helium gas, and the temperature is locally localized on the surface of the container 3. Can be prevented.
  • the support member 9 and the standing member 405 are continuous through the through hole 433 of the mounting substrate 21, for example, when the temperature of the standing member 405 is low and the temperature of the support member 9 is high, the support member 9 This heat moves to the standing member 405 side where the temperature is low, and heat can be transferred from the standing member 405 to the helium gas.
  • Heat generated in the circuit unit 13 The heat generated from the circuit unit 13 is transferred to the case 5 by heat transfer, convection, and radiation. Part of the heat transmitted to the case 5 is released from the case 5 to the outside by convection and radiation, and the remaining heat is transmitted from the base 7 to the socket on the lighting fixture side (see FIG. 20).
  • the size and shape of the globe 35 are matched to the incandescent bulb, and the LED module 411 is provided in the approximate center of the globe 35. Therefore, the distance between the LED module 411 and the circuit unit 13 increases, and the circuit The thermal load that the unit 13 receives from the LED 23 can be reduced. 5. Others In the above embodiment, the lower end portion 40b of the bar 40 is joined to the lid member 37 so as not to extend to the outside of the container 3, but the bar is extended from the container to the outside, and the extension destination is It may be thermally bonded to the case.
  • the support portion in the LED lamp 401 according to the fourth embodiment is configured by the support member 9 including the support portion main body 41 and the plurality of bar members 40, and the standing portion is configured by the standing member 405. 9 and the standing member 405 are separate members.
  • the supporting member and the standing member may be configured as one member.
  • the LED module is supported by a plurality of rod members, and the standing portion is configured by the plurality of rod members. Also good. That is, the support portion may be formed below the LED module 511 of the bar member (on the lid member 537 side), and the standing portion may be formed above the LED module 511 (on the top side of the globe 535). .
  • FIG. 15 is a perspective view showing a structure of an LED lamp 501 according to the fifth embodiment.
  • FIG. 16 is a cross-sectional view of the LED lamp 501.
  • the LED lamp 501 includes a container 503, a case 505, a base 7, a bar member 509, an LED module 511, a circuit unit 13, and the like, and the upper part of the bar member 509 is above the LED module 511. (It is the side opposite to the base 7).
  • the LED lamp 501 includes a heat transfer plate 513 in the case 505 that transmits heat from the LED module 511 during light emission to the case 505 side via the LED module 511 and the bar member 509.
  • the LED module 511 As shown in FIGS. 15 and 16, the LED module 511 includes a mounting board 521, a plurality of LEDs (23) mounted on the upper surface of the mounting board 521, and a sealing body 25 that covers the plurality of LEDs. .
  • the mounting substrate 521 has, for example, a rectangular shape in plan view, and is made of a translucent material, as in the fourth embodiment.
  • the mounting substrate 521 includes a conductive path (27) for connecting a plurality of LEDs, and is connected to lead wires 67 and 69 connected to the circuit unit 13.
  • the conductive path 27 is also made of a light-transmitting material as in the fourth embodiment, and the connection method and the like with the lead wires 67 and 69 are the same as in the fourth embodiment.
  • the LEDs are mounted in two rows as in the fourth embodiment, and the sealing body 25 covers a plurality of LEDs for each row as in the fourth embodiment.
  • (2) Container 503 As shown in FIGS. 15 and 16, the container 503 has a globe 535 and a lid member 537 and is filled with helium (He) gas.
  • the globe 535 is made of a glass material as in the fourth embodiment, and includes a spherical portion 535a and a cylindrical portion 535b. A lower end opening of the cylindrical portion 535 b is sealed with a lid member 537.
  • the lid member 537 is a so-called flare type, and is made of a glass material that is a translucent material.
  • the lid member 537 is provided with an exhaust pipe 539 used for exhausting the inside of the container 503.
  • the lid member 537 is sealed with lead wires 67 and 69 for power supply and one or a plurality (four in this case) of rod members 509 functioning as support portions for supporting the LED module 511.
  • the lid member 537 and the globe 535 are joined by heating the portions to be joined together and melting the glass material at the portions.
  • Bar member 509 (supporting portion and standing portion)
  • the bar member 509 extends in the up-down direction (in the lamp axis direction), and an intermediate portion thereof is sealed to the lid member 537, and the lid member 537 is attached to the globe 535, thereby penetrating the container 503.
  • the bar member 509 is made of a metal material, for example, a jumet material.
  • the rod member 509 extends from the lower side to the upper side of the mounting substrate 521 through the through holes 521a provided at the four corners (corners) of the rectangular mounting substrate 521 in the LED module 511. That is, the support portion and the standing portion are continuous through the through hole 521a of the mounting substrate 521, and are configured by one bar member 509. Thereby, for example, when the temperature of the standing portion 509b is low and the temperature of the supporting portion 509a is high, the heat of the supporting portion 509a moves to the standing portion 509b side where the temperature is low, and helium gas from the standing portion 509b Can convey heat to
  • the portion from the LED module 511 located at substantially the center of the container 503 to the tip (on the side opposite to the lid member 537) corresponds to the standing portion 509 b, and the LED module 511 to the lid member 537
  • the portion corresponds to the support portion 509a, and the portion extending from the container 503 to the outside corresponds to the extending portion 509d.
  • the diameter of the standing portion 509b of the bar member 509 is smaller than the diameter of the support portion 509a. That is, the upper part of the step 509c at the approximate center of the bar member 509 is the standing part 509b, and the lower part of the step 509c is the support part 509a.
  • the size of the through hole 521a of the LED module 511 is smaller than the support portion 509a and larger than the standing portion 509b. Accordingly, the LED module 511 is supported by the step 509c which is the back surface of the mounting substrate 521 and the peripheral portion of the through hole 521a is positioned at the upper end of the support portion 509a.
  • the mounting substrate 521 and the rod member 509 are coupled by an adhesive 523 filled in the through hole 521a. Thereby, the LED module 511 is supported and fixed to the support part 509a.
  • the heat in the container 503 can be taken out, for example, helium gas from the support portion 509a and the standing portion 509b.
  • heat can be taken out of the container 503 using the extending portion 509d.
  • the lower end portion of the extending portion 509 d is thermally connected to a heat transfer plate 513 that contacts the case 505.
  • the heat of the LED module 511 at the time of lighting is taken out of the container 503 through the bar member 509, and the taken-out heat is radiated (transferred) from the heat transfer plate 513 to the case 505, the base 7, and the socket of the lighting device. heat.
  • the case 505 is made of a resin material and has a large diameter portion 505a and a small diameter portion 505b.
  • the large-diameter portion 505a is attached with an adhesive (525) in a state of being externally fitted to the lower end portion of the container 503.
  • the small diameter portion 505b is joined to the base 7 by the same method as in the fourth embodiment.
  • the circuit unit 13 is stored therein.
  • Heat transfer plate 513 The heat transfer plate 513 is made of a material having excellent heat conductivity, here, an aluminum material, and has a disk shape corresponding to the inner peripheral shape of the large diameter portion 505a of the case 505. As shown in FIG. 16, the heat transfer plate 513 includes two lead wires 67 and 69 for connecting the LED module 511 and the circuit unit 13 on the circumference around the through hole 527 for the exhaust pipe 539.
  • the through holes 529 and the four through holes (not shown) for the bar member 509 are provided at an equal pitch.
  • the lead wires 67 and 69 pass through the through hole 529 as they are, and the extending portion 509d of the bar member 509 is fixed to the lower surface of the heat transfer plate 513 with an adhesive 531 with its lower end portion slightly protruding from the through hole. .
  • the adhesive 531 has a thermal conductivity equal to or higher than that of the case 505.
  • the heat transfer plate 513 has a small-diameter portion 513a on the upper side and a large-diameter portion 513b on the lower side, the outer peripheral surface of the small-diameter portion 513a is the inner peripheral surface of the lid member 537, and the outer peripheral surface of the large-diameter portion 513b is
  • the case 505 is fixed to the inner peripheral surface of the case 505 via an adhesive (both inorganic and organic) 525.
  • the adhesive 525 has a thermal conductivity equal to or higher than that of the case 505. As a result, a heat conduction path that actively transfers heat from the LED module 511 to the case 505 via the bar member 509 and the heat transfer plate 513 is established.
  • four rod members 509 are used. However, three rod members or five or more rod members may be used. When three or more are used, the LED module may be supported using all the bar members, or the LED module may be supported using a part of the number of bar members (for example, two). Also good.
  • the four standing portions are in a state of extending upward as they are.
  • the four standing portions may be bent in the middle or joined (continuously) to other standing portions. It may be curved like this.
  • FIG. 17 is a perspective view showing a modification of the bar member according to the fifth embodiment.
  • the LED module 511 and the lead wires 67 and 69 shown in FIG. 17 have the same configuration as the LED module 511 and the lead wires 67 and 69 in the fifth embodiment.
  • support portions 561a and 563a for supporting the LED module 511 are configured at a portion below the LED module 511, and standing portions 561b and 563b are configured at a portion above the LED module 511. Has been.
  • the standing portions 561b and 563b extend from the peripheral portion of the rectangular mounting board 521. Thereby, heat can be transmitted to the helium gas in a wide range in the container 503. Further, the standing portions 561b and 563b are continuous with the support portions 561a and 563a through the through holes 521a of the mounting substrate 521. Thereby, for example, the temperature difference between the standing portions 561b and 563b and the support portions 561a and 563a can be reduced.
  • the plurality of rod members 561 and 563 have steps 561c and 563c between the support portions 561a and 563a and the standing portions 561b and 563b.
  • the through hole 521a provided in the mounting substrate 521 of the LED module 511 is smaller than the steps 561c and 563c of the bar members 561 and 563, and the LED module 511 is supported from below by the steps 561c and 563c.
  • the mounting substrate 521 and the bar members 561 and 563 are joined by an adhesive 523 filled in the through hole 521a.
  • the LED module 511 is supported and fixed to the support portions 561a and 563a.
  • the support member 9 is composed of three types of members, that is, the bar 40, the pedestal 42, and the extending bar 43.
  • the support portion of the invention may be configured and joined to the lid member.
  • a lamp in which the support member is constituted by one member and directly joined to the lid member will be described as a sixth embodiment.
  • FIG. 18 is a perspective view showing a structure of an LED lamp 601 according to the sixth embodiment.
  • FIG. 19 is a cross-sectional view of an LED lamp 601 according to the sixth embodiment.
  • the LED lamp 601 includes a container 603, a case 505, a base 7, a support member 605, an LED module 607, a circuit unit 13 (not shown), and the like. And a standing member (corresponding to the standing portion of the second invention) 609 extending to the opposite side.
  • the LED module 607 includes a mounting substrate 611, a plurality of LEDs 23 mounted on the upper surface of the mounting substrate 611, and a sealing body 613 that covers the plurality of LEDs.
  • the mounting substrate 611 has a disk shape as shown in FIG. 18 and is made of a light-transmitting material as in the fourth and fifth embodiments.
  • a fitting hole 611 a that fits with a fitting convex portion 605 c that protrudes upward from a flat surface at the upper end of the support member 605 is provided in the central portion of the mounting substrate 611.
  • the LEDs 23 are arranged on the circumference centered on the center of the disk-shaped mounting substrate 611 at intervals in the circumferential direction (for example, at equal intervals).
  • the sealing body 613 covers all the circumferentially arranged LEDs 23 and has an annular shape in plan view.
  • the container 603 includes a globe 617 and a lid member 619, and helium (He) gas is sealed in the same manner as in the fourth and fifth embodiments.
  • the globe 617 is made of a glass material, and the lower end opening is sealed with a lid member 619.
  • the lid member 619 is a so-called flare type, and is made of a glass material that is a translucent material.
  • the lid member 619 is provided with an exhaust pipe used for exhausting the inside of the container 603 (a communication hole 621 communicating with the exhaust pipe is shown in FIG. 18).
  • the lid member 619 is sealed with power supply lead wires 67 and 69, and a support member 605 is attached to the top of the lid member 619 via an adhesive 623.
  • the support member 605 has a rod shape (columnar shape) and has a small-diameter portion 605a having a small outer diameter and a large-diameter portion 605b having a large outer diameter, and the large-diameter portion 605b is located on the upper side.
  • the upper end surface of the large diameter portion 605b has a fitting convex portion 605c.
  • the LED module 607 has a back surface (temporary surface) of the LED module 607 in a state where the fitting convex portion 605c is fitted (inserted) into the fitting hole 611a of the LED module 607 (mounting substrate 611).
  • the upper surface of the support member 605 is in contact.
  • the cross-sectional shape of the fitting convex part 605c and the fitting hole 611a is non-circular (for example, square shape), and it does not rotate mutually.
  • the contact area between the two can be increased, and the heat of the LED module 607 during light emission can be efficiently transferred to the support member 605.
  • the standing member 609 has an overall shape of a cone, here a cone. As shown in FIGS. 18 and 19, the standing member 609 stands upward from the surface (upper surface) of the LED module 607. Here, the standing member 609 extends in a direction orthogonal to the LED module 607.
  • the standing member 609 has a fitting recess 609a that fits with the fitting protrusion 605c of the support member 605 at the substantially center of the bottom surface.
  • the cross-sectional shape of the fitting recess 609a is non-circular (square shape) corresponding to the fitting projection 605c.
  • the standing member 609 is disposed at the approximate center of a sealing body 613 (also an LED 23) disposed in an annular shape. As shown in FIG. 19, the bottom surface of the standing member 609 is fixed to the LED module 607 with an adhesive (not shown) in contact with the surface (upper surface) of the LED module 607.
  • the standing member 609 has a tapered shape (that is, a conical shape), it is possible to suppress blocking of light emitted upward from the LED 23. Moreover, the light emitted from LED23 can be utilized effectively by forming a reflective film etc. on the surface and having a reflecting function. ⁇ Seventh Embodiment >> In the fourth to sixth embodiments and the like, the LED lamp has been particularly described. However, the second invention can also be applied to a lighting device using the LED lamp.
  • FIG. 20 is a schematic view of a lighting device according to the seventh embodiment.
  • the lighting device 701 is used by being mounted on a ceiling 703, for example.
  • the lighting device 701 includes an LED lamp 401 (for example, the LED lamp described in the fourth embodiment) 401, and a lighting fixture 705 that is mounted on and off the LED lamp 401. Is provided.
  • LED lamp 401 for example, the LED lamp described in the fourth embodiment
  • lighting fixture 705 that is mounted on and off the LED lamp 401. Is provided.
  • the lighting fixture 705 includes, for example, a fixture main body 707 attached to the ceiling 703 and a cover 709 attached to the fixture main body 707 and covering the LED lamp 401.
  • the cover 709 is an open type here, and has a reflection film 713 on the inner surface that reflects light emitted from the LED lamp 401 in a predetermined direction (here, downward).
  • the appliance body 707 includes a socket 711 to which the base 7 of the LED lamp 401 is attached (screwed), and the LED lamp 401 is supplied with power through the socket 711.
  • the arrangement position of the LED 23 (LED module 411) of the LED lamp 401 mounted on the lighting fixture 705 is close to the arrangement position of the filament of the incandescent bulb, the light emission center in the LED lamp 401 and the incandescent bulb The emission center at is close.
  • the LED lamp 401 is mounted on the lighting fixture (705) on which the incandescent lamp is mounted, the light distribution characteristics similar to that of the incandescent lamp can be obtained because the position of the light emission center as the lamp is similar.
  • the lighting fixture here is an example, and for example, the lighting fixture may not have the opening-type cover 709 but may have a closed-type cover, or a posture in which the LED lamp faces sideways ( It may be a lighting fixture that is lit in a posture in which the central axis of the lamp is horizontal) or an inclined posture (a posture in which the central axis of the lamp is inclined with respect to the central axis of the lighting fixture).
  • the lighting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall, but it may be an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or the wall. It may be a hanging type that can be hung from the ceiling by an electric cable of a lighting fixture.
  • the lighting fixture is lighting one LED lamp with which it is mounted here, a plurality of, for example, three LED lamps may be mounted.
  • ⁇ Modification ⁇ The configuration of the second invention has been described based on the fourth to seventh embodiments, but the second invention is not limited to the above embodiment.
  • the LED lamp and the lighting device may be appropriately combined with the partial configuration of the LED lamp and the lighting device according to the fourth to seventh embodiments and the configuration according to the following modification.
  • the materials, numerical values, and the like described in the fourth to seventh embodiments are merely preferable examples, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the LED lamp and the illumination device without departing from the scope of the technical idea of the second invention.
  • the globes 35 and 535 and the lid members 37 and 537 are made of glass material. However, other materials can be used as long as the airtightness of the container can be maintained. May be used.
  • the globe and the lid member can be made of a resin material.
  • a resin material for example, a thermoplastic material can be implemented by heating and melting a joint portion between a glove and a lid member, and a thermosetting resin can be implemented by using an adhesive.
  • a gas barrier resin may be formed on the inner peripheral surface of the container to improve the airtightness.
  • shape (type) In the fourth, fifth and sixth embodiments, the containers 3, 503 and 603 have an A type shape, but other types such as a G type and an R type may be used, and a light bulb or the like may be used. It may be a shape that is completely different from the above shape.
  • the lid member 37 is configured in a disc shape (so-called button stem), and in the fifth embodiment, the lid member 537 is configured in a flare shape (so-called flare stem).
  • a disc shape so-called button stem
  • the lid member 537 is configured in a flare shape (so-called flare stem).
  • other types of shapes may be used.
  • helium gas is used as the fluid sealed in the container.
  • other types of gas (gas) having higher thermal conductivity than air may be sealed. Examples of other gases include hydrogen and neon.
  • the standing portion (standing member 405) extends linearly, and in the fifth embodiment, the standing portions 561b and 563b extend in a straight line and a portion extending linearly. However, it may be extended in a curved line without having a part extending in a straight line. Further, the central axis (extension direction) of the standing portion may be parallel to the lamp axis (in other words, the direction orthogonal to the mounting substrate), or may be inclined rather than parallel. . Further, the standing portion may have a configuration in which the surface is uneven to widen the surface area. 4).
  • the container 3 and the case 5 are fixed by an adhesive 56.
  • the structure is such that the heat of the container 3 is transmitted from the container 3 to the case 5 when the lamp is lit.
  • a fluid having high thermal conductivity is sealed in the container, the temperature of the container rises and the heat is transmitted to the case, which may increase the thermal load on the circuit unit.
  • a material having low thermal conductivity may be interposed between the container and the case, and the two may be joined.
  • the semiconductor light emitting element is the LED 23, but may be, for example, an LD (laser diode) or an EL element (electric luminescence element).
  • LED23 was mounted in the mounting board 21,521,611 by the chip type, LED may be mounted in the mounting board by the surface mounting type (what is called SMD) or a shell type, for example. Further, the plurality of LEDs may be a mixture of a chip type and a surface mount type.
  • SMD surface mounting type
  • the plurality of LEDs may be a mixture of a chip type and a surface mount type.
  • the mounting substrate may have other shapes, for example, a polygon such as a square shape and a pentagon (including a regular polygon shape), an oval shape, an oval shape, an annular shape, and the like.
  • a polygon such as a square shape and a pentagon (including a regular polygon shape), an oval shape, an oval shape, an annular shape, and the like.
  • the number of mounting boards is not limited to one, and may be two or more.
  • the LEDs 23 are mounted on the front surface of the mounting substrate 21, but the LEDs may be mounted on the back surface of the mounting substrate.
  • the sealing body 25 covers the LEDs 23 arranged in two rows in a row unit. However, the two rows may be covered together. And you may coat
  • the plurality of LEDs 23 are arranged in two rows, and in the sixth embodiment, the plurality of LEDs 23 are arranged in an annular shape.
  • the LEDs may be arranged along the four sides of the quadrangular shape as a quadrangular shape and arranged in a quadrangular shape when viewed in plan, or may be arranged in a matrix.
  • the LED modules 11, 511, and 607 are configured to emit white light by using the LED 23 that emits blue light and phosphor particles that convert the wavelength of blue light into yellow light.
  • a combination of an ultraviolet light emitting semiconductor light emitting element and each color phosphor particle emitting three primary colors (red, green, and blue) may be used.
  • the cases 5 and 505 are made of a resin material, but may be made of other materials.
  • a metal material it is necessary to ensure insulation from the base. Insulation with the base can be ensured by, for example, applying an insulating film to the small-diameter portion of the case or by insulating the small-diameter portion. It can also be ensured by configuring each side with a resin material (two or more members are combined).
  • the surface of the case 5 505 is not particularly described.
  • a heat radiating fin may be provided, or a process for improving the radiation rate may be performed. 7).
  • Base in the fourth embodiment, etc. the Edison type base 7 is used, but other types, for example, a pin type (specifically, G type such as GY, GX, etc.) may be used.
  • die 7 was mounted
  • FIG. it may be joined to the case by other methods.
  • Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.
  • the configuration of the first invention has been described based on the first to third embodiments, and the configuration of the second invention has been described based on the fourth to seventh embodiments.
  • the LED lamp 401 according to the fourth embodiment of the second invention is equivalent to the lamp 1 provided with the standing member 405 with respect to the lamp 1 described in the first embodiment of the first invention. Yes (the configuration of the LED module is slightly different to provide the standing member).
  • the configuration of the first invention and the configuration of the second invention may be combined.
  • a member corresponding to a portion opposite to the base side of the mounting substrate 521 in the bar member 509 according to the fifth embodiment may be provided. good.
  • the combination is not limited to this example, and other combinations may be used.

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  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract

Provided is a lamp (1) in which an LED module (11) including a semiconductor light-emitting element as a light source is supported by a supporting member (9) in a housing (3) obtained by closing an opening of a globe (35) with an occluding member (37). A casing (5) equipped with a cap (7) is attached to the opening side of the globe (35) in the housing (3). Helium, which has a higher thermal conductivity than air, is sealed in the housing (3). The supporting member (9) has: rod members (40) attached to the occluding member (37); and a supporting member main body (41) which is attached to the opposite side of the rod members (40) to the occluding member (37), and which has the LED module provided thereto. The surface area of the supporting member main body (41) is greater than the surface area of the rod members (40).

Description

ランプ及び照明装置Lamp and lighting device
　本発明は、ＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）等の半導体発光素子を光源とするランプ及び照明装置に関する。 The present invention relates to a lamp and a lighting device using a semiconductor light emitting element such as an LED (Light Emitting Diode) as a light source.
　近年、省エネルギーの観点から、白熱電球に代替する電球形ランプとして、高効率・長寿命なＬＥＤを利用するランプ（以下、ＬＥＤランプと記載する。）が提案されている。 In recent years, from the viewpoint of energy saving, a lamp that uses a highly efficient and long-life LED (hereinafter referred to as an LED lamp) has been proposed as a light bulb shaped lamp that can replace an incandescent light bulb.
　ＬＥＤランプは、例えば、多数のＬＥＤを実装する実装基板がケースの端部に装着され、ＬＥＤを発光させるための回路ユニットをケース内に収納している（特許文献１）。 In the LED lamp, for example, a mounting substrate on which a large number of LEDs are mounted is mounted on the end of the case, and a circuit unit for causing the LED to emit light is housed in the case (Patent Document 1).
　回路ユニットを構成する電子部品に熱負荷に弱い部品が含まれる一方、ＬＥＤは発光時に熱を発生する。熱負荷に弱い電子部品は、ＬＥＤ発光時のＬＥＤの熱がケースに伝わってケース内が高温となることで、その動作が不安定になったり、寿命が短くなったりするおそれがある。 The electronic components that make up the circuit unit include components that are vulnerable to thermal loads, while LEDs generate heat when they emit light. An electronic component that is weak against heat load may cause the operation of the LED to become unstable or shorten its life because the heat of the LED during LED emission is transmitted to the case and the inside of the case becomes high temperature.
　このようなことから、回路ユニットへの熱負荷を抑制するために、ＬＥＤ発光時の熱をＬＥＤランプの外部へ放熱させるための種々の技術が提案されている。具体的には、ケースの表面に放熱溝を設けたり（特許文献２）、ケースを良熱伝導材料である金属で形成することによりＬＥＤの熱を口金へと伝導してケース内に熱が蓄積しないようにしたり（非特許文献１（第１２頁）参照）等している。 For these reasons, various techniques for dissipating the heat generated during LED emission to the outside of the LED lamp have been proposed in order to suppress the thermal load on the circuit unit. Specifically, a heat radiating groove is provided on the surface of the case (Patent Document 2), or the case is formed of a metal that is a good heat conducting material, whereby the heat of the LED is conducted to the base and heat is accumulated in the case. (See Non-Patent Document 1 (page 12)).
特開２００６－３１３７１７号公報JP 2006-313717 A 特開２０１０－００３５８０号公報JP 2010-003580 A
　近年、ＬＥＤランプへの高輝度化の要望が強くなっており、上記技術ではこの要望に答えることができない。つまり、高輝度化に伴ってＬＥＤの発熱量が増大し、この熱を放出・伝熱するために、ケースが大型化するのである。ケースが大型化すると、ＬＥＤランプの大型化につながり、既存の照明装置に適用できなくなる。 In recent years, there has been a strong demand for LED lamps with higher brightness, and the above technology cannot answer this demand. That is, the amount of heat generated by the LED increases as the brightness increases, and the case becomes larger in order to release and transfer this heat. When the case is enlarged, the LED lamp is enlarged and cannot be applied to an existing lighting device.
　本発明は、大型化を招くことなく、高輝度化に対応し得る新規構成のランプを提供することを目的とする。 An object of the present invention is to provide a lamp having a new configuration that can cope with high brightness without causing an increase in size.
　上記の目的を達成するため、本第１の発明に係るランプは、グローブ開口が蓋部材により塞がれてなる容器内に、光源としての半導体発光素子が支持部材に支持された状態で設けられ、口金を備えるケースが前記容器における前記グローブの開口側に取着されてなるランプであって、前記容器内には、空気よりも高い熱伝導性を有する流体が封入され、前記支持部材は、前記蓋部材に立設された棒材と、前記棒材に取着され且つ前記半導体発光素子が設けられた支持部本体とを有し、前記支持部本体の表面積が前記棒材の表面積よりも大きいことを特徴としている。 In order to achieve the above object, the lamp according to the first aspect of the present invention is provided in a container in which a globe opening is closed by a lid member, with a semiconductor light emitting element as a light source supported by a support member. , A lamp having a base attached to the opening side of the globe in the container, the container is filled with a fluid having higher thermal conductivity than air, and the support member is A bar that is erected on the lid member; and a support body that is attached to the bar and is provided with the semiconductor light emitting element. The surface area of the support body is greater than the surface area of the bar. It is characterized by being large.
　ここでいう「半導体発光素子が支持部材により支持され」には、半導体発光素子が支持部材に直接実装されて支持される場合、半導体発光素子が他部材（例えば実装基板）を介して支持部材により支持される場合を含む。 As used herein, “the semiconductor light emitting element is supported by the support member” means that when the semiconductor light emitting element is directly mounted on and supported by the support member, the semiconductor light emitting element is supported by the support member via another member (for example, a mounting substrate). Including supported cases.
　また、「蓋部材に立設された棒材」には、蓋部材に対して、直交する状態又は傾斜する状態に設けられた棒材を含み、さらに、蓋部材を貫通しない状態で立設された棒材や、蓋部材を貫通する状態で立設された棒材を含み、さらには、これらを組み合わせた状態の棒材も含む。 In addition, the “bars erected on the lid member” includes bar members provided in an orthogonal state or an inclined state with respect to the lid member, and is further erected without penetrating the lid member. And a bar material standing upright in a state of penetrating the lid member, and further a bar material in a combination of these.
　上記の目的を達成するため、本第１の発明に係る照明装置は、ランプと、前記ランプを装着して点灯させる照明器具とを備え、前記ランプは、上記構成を含むランプであることを特徴としている。 In order to achieve the above object, a lighting device according to the first aspect of the present invention includes a lamp and a lighting fixture that is lit by mounting the lamp, and the lamp is a lamp including the above-described configuration. It is said.
　上記の構成によれば、空気よりも高い熱伝導率を有する流体が容器内に封入されているので、半導体発光素子から発生した熱を流体により容器へ伝導させることができる。この結果、容器を利用して発光時の熱を外部へと放熱することができる。 According to the above configuration, since the fluid having a higher thermal conductivity than air is sealed in the container, the heat generated from the semiconductor light emitting element can be conducted to the container by the fluid. As a result, the heat at the time of light emission can be radiated outside using the container.
　また、半導体発光素子は支持部材により支持され、また支持部材は容器（蓋部材）に取着されているので、流体を介して容器へと伝えることができなかった残熱を支持部材から容器に伝えることができる。 Further, since the semiconductor light emitting element is supported by the support member, and the support member is attached to the container (lid member), the residual heat that could not be transferred to the container via the fluid is transferred from the support member to the container. I can tell you.
　このように、上記構成を有することにより、半導体発光素子の発光時の熱を効果的に容器に伝えることができ、ランプの大型化を招くことなく、半導体発光素子の高輝度化に対応し得る。 Thus, by having the said structure, the heat | fever at the time of light emission of a semiconductor light-emitting device can be effectively transmitted to a container, and it can respond to the high-intensity of a semiconductor light-emitting device, without causing the enlargement of a lamp | ramp. .
　さらに、支持部本体の表面積が棒材の表面積よりも大きい構成をしている。このため、支持部本体と容器内の流体との接触面積が、例えば、棒材を利用して半導体発光素子を直接支持する場合よりも、大きくなり、半導体発光素子の発光時の温度上昇を抑制することができる。 Furthermore, the surface area of the support body is larger than the surface area of the bar. For this reason, the contact area between the support body and the fluid in the container is larger than when the semiconductor light emitting element is directly supported using, for example, a rod, and the temperature rise during light emission of the semiconductor light emitting element is suppressed. can do.
　また、前記蓋部材はガラス材料により構成され、前記棒材はガラス封着金属材料により構成されていることを特徴としている。この構成によれば、他部材との密着性が劣るガラス材料を蓋部材に利用しても、従来の電球におけるフィラメントとバルブとの接合、電球形蛍光ランプ等における発光管用のガラスと電極との接合で実績のあるガラス封着金属材料を棒材に利用することにより、接合部分の信頼性を向上させることができる。 Further, the lid member is made of a glass material, and the bar is made of a glass sealing metal material. According to this configuration, even when a glass material with poor adhesion to other members is used as the lid member, the connection between the filament and the bulb in the conventional bulb, the arc tube glass and the electrode in the bulb-type fluorescent lamp, etc. By using a glass-sealed metal material, which has a proven record in bonding, as a bar material, the reliability of the bonded portion can be improved.
　さらに、前記棒材は複数本あることを特徴としている。この構成によれば、発光時に半導体発光素子から支持部本体に伝わった熱を、複数本の棒材により分散して蓋部材へと伝えることができ、発光時の半導体発光素子の熱をスムーズに伝導させることができる。 Furthermore, it is characterized in that there are a plurality of the rods. According to this configuration, heat transmitted from the semiconductor light emitting element to the support main body during light emission can be dispersed by the plurality of rods and transmitted to the lid member, and the heat of the semiconductor light emitting element during light emission can be smoothly performed. Can be conducted.
　また、前記支持部本体は、前記複数の棒材に載置された状態で前記棒材に固着された台座部と、前記台座部から前記容器中央へと延伸して先端側に前記半導体発光素子が設けられる延伸部とを有することを特徴としている。なお、本第１の発明では、支持部本体は、一体であっても良いし、別体であっても良い。つまり、台座部と延伸部とが別部材により構成されても良いし、それぞれが一体になった、１つの部材により構成されても良い。この構成によれば、容器の中央部に半導体発光素子を容易に配置することができる。 The support body includes a pedestal portion fixed to the bar in a state of being placed on the plurality of bars, and the semiconductor light emitting element extending from the pedestal to the center of the container and extending toward the tip side It has the extending | stretching part provided with. In the first invention, the support portion main body may be integral or separate. That is, the pedestal portion and the extending portion may be configured by separate members, or may be configured by one member in which each is integrated. According to this configuration, the semiconductor light emitting element can be easily disposed in the central portion of the container.
　さらに、前記棒材は、前記蓋部材を貫通する状態で前記蓋部材に封着され、前記棒材における前記容器の外側に位置する部分が前記ケースに熱的に接続されていることを特徴としている。この構成によれば、発光時に半導体発光素子から支持部材に伝わった熱を容器外部のケースへと取り出すことができ、容器に依存することなく、ケースから大気へと放出することができると共に口金へも熱を伝えることができる。 Further, the bar is sealed to the lid member in a state of passing through the lid member, and a portion of the bar located outside the container is thermally connected to the case. Yes. According to this configuration, heat transmitted from the semiconductor light emitting element to the support member at the time of light emission can be taken out to the case outside the container, and can be released from the case to the atmosphere without depending on the container and to the base. Can also convey heat.
　しかも、前記棒材の外側に位置する部分が伝熱部材に接合され、前記伝熱部材が前記ケースに取着されていることを特徴としている。この構成によれば、発光時に半導体発光素子から支持部本体に伝わった熱を、棒材を経由して伝熱部材へと伝えることができ、発光時の半導体発光素子の熱をスムーズに伝導させることができる。 Moreover, a portion located outside the bar is joined to a heat transfer member, and the heat transfer member is attached to the case. According to this configuration, the heat transmitted from the semiconductor light emitting element to the support body at the time of light emission can be transmitted to the heat transfer member via the bar, and the heat of the semiconductor light emitting element at the time of light emission can be smoothly conducted. be able to.
　また、前記半導体発光素子は実装基板に実装され、前記実装基板が前記延伸部の先端に装着され、前記実装基板における素子実装面を含む仮想面と前記容器の内周面とで区画される領域であって前記延伸部が存しない領域内に、前記実装基板から立設する立設部が存在することを特徴としている。この構成によれば、前記実装基板における素子実装面を含む仮想面と前記容器の内周面とで区画される領域であって前記延伸部が存しない領域に立設部が存在するため、この領域の流体を有効に利用することができ、半導体発光素子から発生した熱を、容器内の広い範囲にわたって流体に伝えることができる。 The semiconductor light emitting element is mounted on a mounting substrate, the mounting substrate is attached to the tip of the extending portion, and an area defined by a virtual surface including an element mounting surface on the mounting substrate and an inner peripheral surface of the container In addition, the present invention is characterized in that a standing portion standing from the mounting substrate exists in a region where the extending portion does not exist. According to this configuration, since there is a standing portion in a region that is partitioned by a virtual surface including an element mounting surface in the mounting substrate and the inner peripheral surface of the container, the extending portion does not exist. The fluid in the region can be effectively used, and the heat generated from the semiconductor light emitting device can be transmitted to the fluid over a wide range in the container.
　あるいは、前記立設部は、前記実装基板の中央部分から立設することを特徴としている。この構成によれば、前記延伸部が存在しない領域の中央部分に前記立設部が存することとなり、半導体発光素子からの熱を立設部から効率良く容器内の流体へと伝えることができる。 Alternatively, the standing portion is erected from a central portion of the mounting substrate. According to this configuration, the upright portion exists in the central portion of the region where the extending portion does not exist, and heat from the semiconductor light emitting element can be efficiently transferred from the upright portion to the fluid in the container.
第１の実施形態に係るＬＥＤランプの構造を示す斜視図である。It is a perspective view which shows the structure of the LED lamp which concerns on 1st Embodiment. ＬＥＤモジュールの構造を示す図であり、（ａ）はＬＥＤモジュールの平面図であり、（ｂ）は同図の（ａ）におけるＡ－Ａ’線矢視断面図である。It is a figure which shows the structure of an LED module, (a) is a top view of an LED module, (b) is AA 'line sectional view taken on the line in (a) of the figure. グローブの開口側端部を切り欠き、容器の蓋部材周辺を示す斜視図である。It is a perspective view which notches the opening side edge part of a glove | globe and shows the cover member periphery of a container. 図１のＢ－Ｂ'線矢視断面図である。FIG. 2 is a cross-sectional view taken along line BB ′ in FIG. 1. 図４のＣ－Ｃ'線矢視断面図である。FIG. 5 is a cross-sectional view taken along the line CC ′ of FIG. 図５のＤ－Ｄ'線矢視断面図である。FIG. 6 is a cross-sectional view taken along the line DD ′ in FIG. 第２の実施形態に係るＬＥＤランプの一部断面図である。It is a partial cross section figure of the LED lamp which concerns on 2nd Embodiment. 支持部本体と棒材との接合及び棒材と伝熱部材との接合例１についての説明図である。It is explanatory drawing about the joining example 1 of joining of a support part main body and a rod, and a rod and a heat-transfer member. 支持部本体と棒材との接合及び棒材と伝熱部材との接合例２についての説明図である。It is explanatory drawing about the example 2 of joining of a support part main body and a bar, and joining of a bar and a heat transfer member. 支持部本体と棒材との接合及び棒材と伝熱部材との接合例３についての説明図である。It is explanatory drawing about the example 3 of joining of a support part main body and a bar, and joining of a bar and a heat transfer member. 支持部本体と棒材との接合及び棒材と伝熱部材との接合例４についての説明図である。It is explanatory drawing about the example 4 of joining of a support part main body and a bar, and joining of a bar and a heat transfer member. 第３の実施形態に係る照明装置の概略図である。It is the schematic of the illuminating device which concerns on 3rd Embodiment. 第４の実施形態に係るＬＥＤランプの正面図であり、内部の様子が分かるように一部切り欠いている。It is a front view of the LED lamp which concerns on 4th Embodiment, and is partially notched so that the mode of an inside may be understood. ＬＥＤモジュールの周辺を示す図であり、（ａ）はＬＥＤモジュールの周辺の平面図であり、（ｂ）は同図の（ａ）におけるＧ－Ｇ’線矢視断面図である。It is a figure which shows the periphery of an LED module, (a) is a top view of the periphery of an LED module, (b) is G-G 'arrow sectional drawing in (a) of the figure. 第５の実施形態に係るＬＥＤランプの構造を示す斜視図である。It is a perspective view which shows the structure of the LED lamp which concerns on 5th Embodiment. 第５の実施形態に係るＬＥＤランプの断面図である。It is sectional drawing of the LED lamp which concerns on 5th Embodiment. 第５の実施形態に係る棒部材の変形例を示す斜視図である。It is a perspective view which shows the modification of the bar member which concerns on 5th Embodiment. 第６の実施形態に係るＬＥＤランプの構造を示す斜視図である。It is a perspective view which shows the structure of the LED lamp which concerns on 6th Embodiment. 第６の実施形態に係るＬＥＤランプの断面図である。It is sectional drawing of the LED lamp which concerns on 6th Embodiment. 第７の実施形態に係る照明装置の概略図である。It is the schematic of the illuminating device which concerns on 7th Embodiment.
[第１の発明を実施するための形態]
≪第１の実施形態≫
１．全体構成
　図１は、第１の実施形態に係るＬＥＤランプ１の構造を示す斜視図である。 [Mode for carrying out the first invention]
<< First Embodiment >>
1. Overall Configuration FIG. 1 is a perspective view showing the structure of an LED lamp 1 according to the first embodiment.
　ＬＥＤランプ１は、図１に示すように、グローブ３５の開口が蓋部材３７により塞がれてなる容器３と、容器３の一端（開口側の端である。）に装着されたケース５と、ケース５に設けられた口金７と、容器３内に配された支持部材９と、支持部材９により支持されたＬＥＤモジュール１１とを備える。容器３内には、空気よりも熱伝導性の高い流体が封入されている。 As shown in FIG. 1, the LED lamp 1 includes a container 3 in which the opening of the globe 35 is closed by a lid member 37, and a case 5 attached to one end of the container 3 (the end on the opening side). A base 7 provided in the case 5, a support member 9 disposed in the container 3, and an LED module 11 supported by the support member 9. A fluid having a higher thermal conductivity than air is enclosed in the container 3.
　本実施形態におけるＬＥＤランプ１は、口金７を介して受電してＬＥＤモジュール１１を発光させるための回路ユニット１３をケース５内に有し、全体形状が従来の白熱電球に似た形状をしている。 The LED lamp 1 in this embodiment has a circuit unit 13 in the case 5 for receiving power through the base 7 and causing the LED module 11 to emit light, and the overall shape is similar to a conventional incandescent bulb. Yes.
　以下、ＬＥＤランプ１を構成する各部分について説明する。なお、本明細書では、ＬＥＤランプ１のランプ軸の延伸する方向であって、口金７がある側を下側、グローブ３５がある側を上側とする。
２．各部構成
（１）ＬＥＤモジュール１１
　図２は、ＬＥＤモジュール１１の構造を示す図であり、（ａ）はＬＥＤモジュール１１の平面図であり、（ｂ）は同図の（ａ）におけるＡ－Ａ’線矢視断面図である。 Hereinafter, each part which comprises the LED lamp 1 is demonstrated. In the present specification, the direction in which the lamp axis of the LED lamp 1 extends is the lower side, and the side with the globe 35 is the upper side.
2. Configuration of each part (1) LED module 11
2A and 2B are diagrams showing the structure of the LED module 11, wherein FIG. 2A is a plan view of the LED module 11, and FIG. 2B is a cross-sectional view taken along the line AA ′ in FIG. .
　ＬＥＤモジュール１１は、図１及び図２、特に図２に示すように、実装基板２１と、実装基板２１の上面に実装された複数のＬＥＤ２３と、複数のＬＥＤ２３を被覆する封止体２５とを備える。 As shown in FIGS. 1 and 2, particularly FIG. 2, the LED module 11 includes a mounting substrate 21, a plurality of LEDs 23 mounted on the upper surface of the mounting substrate 21, and a sealing body 25 that covers the plurality of LEDs 23. Prepare.
　実装基板２１は、図２の（ａ）に示すように、平面視形状が例えば矩形状をし、ＬＥＤ２３から下方に発せられた光が透過するように、例えばガラスやアルミナ等の透光性材料により構成されている。 As shown in FIG. 2A, the mounting substrate 21 has, for example, a rectangular shape in plan view, and a light-transmitting material such as glass or alumina so that light emitted downward from the LED 23 is transmitted. It is comprised by.
　実装基板２１は、複数のＬＥＤ２３を接続する（直列接続又は／及び並列接続である。）ための接続パターン２７ａと、回路ユニット１３に接続されたリード線６７，６９と接続するための端子パターン２７ｂ，２７ｃとからなる導電路２７を有する。 The mounting board 21 has a connection pattern 27a for connecting a plurality of LEDs 23 (series connection and / or parallel connection) and a terminal pattern 27b for connecting to lead wires 67 and 69 connected to the circuit unit 13. , 27c.
　なお、導電路２７も、ＬＥＤ２３からの光が透過するように、例えばＩＴＯ等の透光性材料が用いられている。 The conductive path 27 is also made of a translucent material such as ITO so that light from the LED 23 can be transmitted.
　リード線６７，６９は、図２の（ｂ）に示すように、実装基板２１の貫通孔２９を下側から上側へと挿通する先端部が端子パターン２７ｂ，２７ｃに半田３１により接続される。 As shown in FIG. 2B, the lead wires 67 and 69 are connected to the terminal patterns 27 b and 27 c by solder 31 at the tip portions that pass through the through holes 29 of the mounting substrate 21 from the lower side to the upper side.
　ＬＥＤ２３は、所謂、チップの形態で実装基板２１に実装されている。複数のＬＥＤ２３は、図２で示すように、間隔（例えば、等間隔である。）をおいて、実装基板２１の長手方向と平行に２列状に配置されている。なお、ＬＥＤ２３の個数、配列等は、ＬＥＤランプ１に要求される輝度等により適宜決定される。 The LED 23 is mounted on the mounting substrate 21 in the form of a so-called chip. As shown in FIG. 2, the plurality of LEDs 23 are arranged in two rows in parallel with the longitudinal direction of the mounting substrate 21 at intervals (for example, at equal intervals). Note that the number, arrangement, and the like of the LEDs 23 are appropriately determined depending on the luminance required for the LED lamp 1.
　封止体２５は、例えばシリコーン樹脂等の透光性材料からなり、２列状に配されたＬＥＤ２３を列単位で被覆し、ＬＥＤ２３への空気・水分の侵入を防止している。 The sealing body 25 is made of a translucent material such as silicone resin, for example, and covers the LEDs 23 arranged in two rows in a row unit to prevent air and moisture from entering the LEDs 23.
　封止体２５は、ＬＥＤ２３から発せられた光の波長を変換する必要がある場合は波長変換機能を有する。波長変換機能は、例えば、蛍光体粒子等の波長変換材料を透光性材料に混入することで実施できる。 The sealing body 25 has a wavelength conversion function when it is necessary to convert the wavelength of the light emitted from the LED 23. A wavelength conversion function can be implemented by mixing wavelength conversion materials, such as fluorescent substance particles, in a translucent material, for example.
　例えば、ＬＥＤ２３は青色光を発光色とする場合、ＬＥＤ２３の青色光を黄色光に変換する波長変換材料が利用される。これにより、ＬＥＤモジュール１１は、ＬＥＤ２３から発せられた青色光と、波長変換材料により波長変換された黄色光とにより混色された白色光を出射することとなる。 For example, when the LED 23 uses blue light as the emission color, a wavelength conversion material that converts the blue light of the LED 23 into yellow light is used. Thereby, the LED module 11 will emit the white light mixed by the blue light emitted from LED23, and the yellow light wavelength-converted by the wavelength conversion material.
　ＬＥＤモジュール１１は、裏面の中央部に支持部材９の嵌合凸部５１と嵌合するための嵌合凹部３３が形成されている。
（２）容器３
　容器３は、図１に示すように、開口を有するグローブ３５と、ＬＥＤモジュール１１をグローブ３５の略中央に格納する状態でグローブ３５の開口を気密状に塞ぐ蓋部材３７とを有し、内部に空気よりも熱伝導率の高いヘリウム（Ｈｅ）ガスが封入されている。これにより、点灯時のＬＥＤモジュール１１の熱を効率良くグローブ３５に伝えることができる。 In the LED module 11, a fitting recess 33 for fitting with the fitting protrusion 51 of the support member 9 is formed at the center of the back surface.
(2) Container 3
As shown in FIG. 1, the container 3 includes a globe 35 having an opening, and a lid member 37 that hermetically closes the opening of the globe 35 in a state in which the LED module 11 is stored in the approximate center of the globe 35. In addition, helium (He) gas having a higher thermal conductivity than air is enclosed. Thereby, the heat of the LED module 11 at the time of lighting can be efficiently transmitted to the globe 35.
　グローブ３５は、所謂、Ａタイプであり、透光性材料であるガラス材料により構成されている。グローブ３５は、図１に示すように、中空状の球状部３５ａと、球状部３５ａから下方に延伸する筒状部３５ｂとを有し、筒状部３５ｂの下端開口が蓋部材３７により塞がれている（封止されている）。 The globe 35 is a so-called A type, and is made of a glass material that is a translucent material. As shown in FIG. 1, the globe 35 includes a hollow spherical portion 35 a and a cylindrical portion 35 b extending downward from the spherical portion 35 a, and a lower end opening of the cylindrical portion 35 b is closed by a lid member 37. It is sealed (sealed).
　蓋部材３７は、所謂、ボタンタイプのステムであり、透光性材料であるガラス材料で構成されている。蓋部材３７は、平面視において円形状をした板状（つまり、円板状である。）をしている。蓋部材３７には、容器３内の排気等に利用された排気管３９が設けられている他、ＬＥＤモジュール１１への電力供給用のリード線６７，６９が貫通状態で封着され、支持部材９を構成する棒材４０が取着されている。 The lid member 37 is a so-called button-type stem, and is made of a glass material that is a translucent material. The lid member 37 has a circular plate shape (that is, a disk shape) in plan view. The lid member 37 is provided with an exhaust pipe 39 used for exhausting the inside of the container 3, and lead wires 67 and 69 for supplying power to the LED module 11 are sealed in a penetrating state. The bar 40 which comprises 9 is attached.
　グローブ３５と蓋部材３７との接合は、両者の接合予定部位を加熱して、当該部位のガラス材料を溶融させることで行われる。
（３）支持部材９
　図３は、グローブの開口側端部を切り欠き、容器の蓋部材周辺を示す斜視図である。 The joint between the globe 35 and the lid member 37 is performed by heating the joint portions of the two and melting the glass material at the portions.
(3) Support member 9
FIG. 3 is a perspective view showing the periphery of the lid member of the container by cutting off the opening side end of the globe.
　図４は、図１のＢ－Ｂ'線矢視断面図である。図５は、図４のＣ－Ｃ'線矢視断面図である。図６は、図５のＤ－Ｄ'線矢視断面図である。 4 is a cross-sectional view taken along line BB ′ of FIG. 5 is a cross-sectional view taken along the line CC ′ of FIG. 6 is a cross-sectional view taken along line DD ′ in FIG.
　支持部材９は、図１に示すように、蓋部材３７に取着（立設）された複数の棒材４０と、複数の棒材４０における口金７と反対側に取着され且つＬＥＤモジュール１１を支持する支持部本体４１とを有する。複数の棒材４０は、蓋部材３７との密着力が支持部本体４１と蓋部材３７との密着力よりも高い材料で構成されている。 As shown in FIG. 1, the support member 9 is attached to the side opposite to the base 7 in the plurality of bar members 40 attached to the lid member 37, and the LED module 11. And a support body 41 for supporting the. The plurality of bar members 40 are made of a material that has a higher contact force with the lid member 37 than a contact force between the support body 41 and the lid member 37.
　ここで、支持部本体４１の表面積は、複数の棒材４０の表面積の合計よりも大きい。つまり、支持部本体４１における容器３内に封入されている流体（ここではヘリウムガスである。）と接触している面積が、複数の棒材４０における容器３内に封入されている流体と接触している面積の合計よりも大きい。 Here, the surface area of the support body 41 is larger than the sum of the surface areas of the plurality of bars 40. That is, the area in contact with the fluid (here, helium gas) sealed in the container 3 in the support body 41 is in contact with the fluid sealed in the container 3 in the plurality of rods 40. It is larger than the total area.
　棒材４０は、複数本あり、本実施形態では８本ある。８本の棒材４０は、図６に示すように、円形状の蓋部材３７の軸心を中心Ｏとする円周上を周方向に沿って配置されている。ここでは、棒材４０は、等間隔をおいて配されている。 There are a plurality of bars 40, and in this embodiment, there are eight bars. As shown in FIG. 6, the eight rod members 40 are arranged along the circumferential direction on the circumference having the center O as the axis of the circular lid member 37. Here, the bar 40 is arranged at equal intervals.
　棒材４０は、図５に示すように、上端部４０ａが台座４２の穴４５に挿入された状態で溶接され、下端部４０ｂが蓋部材３７に挿入されて固着されている。 As shown in FIG. 5, the bar 40 is welded in a state where the upper end portion 40 a is inserted into the hole 45 of the base 42, and the lower end portion 40 b is inserted into the lid member 37 and fixed.
　棒材４０は、金属材料、特に、電力供給用のリード線６７，６９と同じ材料であるジュメット材料により構成されている（本発明の「ガラス封着金属材料」に相当する。）。ジュメット材料は、Ｆｅ－Ｎｉ合金の芯材に銅層と亜酸化銅層を被覆した材料である。ジュメット材料は、従来の白熱電球や電球形蛍光ランプに利用され、ガラスとの密着性に実績がある。これにより、点灯時のＬＥＤモジュール１１の熱を、棒材４０を介して容器３へと伝えることができる。 The bar 40 is made of a metal material, particularly a jumet material that is the same material as the power supply lead wires 67 and 69 (corresponding to the “glass-sealed metal material” of the present invention). The jumet material is a material in which a core layer of Fe—Ni alloy is coated with a copper layer and a cuprous oxide layer. Jumet materials are used in conventional incandescent bulbs and bulb-type fluorescent lamps, and have a proven track record in glass adhesion. Thereby, the heat of the LED module 11 at the time of lighting can be transmitted to the container 3 through the bar 40.
　支持部本体４１は、平板状の台座（本第１の発明の「台座部」に相当する。）４２と、当該台座４２からグローブ３５（容器３）内部へと（口金７と反対側へと）延伸する延伸棒（本第１の発明の「延伸部」に相当する。）４１とを備え、延伸棒４３の先端にＬＥＤモジュール１１が取着されている。 The support portion main body 41 is a flat pedestal (corresponding to the “pedestal portion” of the first invention) 42, and from the pedestal 42 to the inside of the globe 35 (container 3) (to the side opposite to the base 7). ) A stretching rod (corresponding to the “stretching portion” of the first invention) 41, and the LED module 11 is attached to the tip of the stretching rod 43.
　台座４２は、円板状をし、その中央部に延伸棒４３が接合されている。延伸棒４３と台座４２とは、金属材料、例えばアルミニウム材料から構成され、両者の接合は例えば、溶接により行われている。 The pedestal 42 has a disk shape, and an extending rod 43 is joined to the center thereof. The extending | stretching rod 43 and the base 42 are comprised from a metal material, for example, aluminum material, and both joining is performed by welding, for example.
　台座４２は、電力供給用のリード線６７，６９が貫通する貫通孔４７，４９を台座４２の中心を通る仮想線分上であって中心を挟んだ位置に有している。 The pedestal 42 has through holes 47 and 49 through which the power supply lead wires 67 and 69 pass, on a virtual line segment passing through the center of the pedestal 42 and sandwiching the center.
　延伸棒４３は、図４に示すように断面が円形をした柱状であり、図１に示すように上部４３ｂが他部４３ａより径が大きくなっている。延伸棒４３の中央部分（他部４３ａ）の横断面の面積は、棒材４０の横断面の面積の合計よりも広く、延伸棒４３の中央部分（他部４３ａ）の表面積は、棒材４０の表面積の合計よりも広くなっている。 The stretching rod 43 has a columnar shape with a circular cross section as shown in FIG. 4, and the diameter of the upper portion 43b is larger than that of the other portion 43a as shown in FIG. The area of the cross section of the central portion (other portion 43a) of the extending rod 43 is larger than the total area of the cross sections of the rod members 40, and the surface area of the central portion (other portion 43a) of the extending rod 43 is larger than that of the rod member 40. It is wider than the total surface area.
　延伸棒４３の上部４３ｂの上面は平坦面であり、図２の（ｂ）に示すように、その中央にＬＥＤモジュール１１の嵌合凹部３３に嵌合する嵌合凸部５１を有する。なお、上部４３ｂ（支持部材９、支持部本体４１、延伸棒４３でもある。）の上面を平坦にするのは、ＬＥＤモジュール１１（実装基板２１）との接触面積を広くして、発光時のＬＥＤモジュール１１の熱を延伸棒４３（支持部材９、支持部本体４１である。）に伝えやすくするためである。 The upper surface of the upper part 43b of the extending rod 43 is a flat surface, and has a fitting convex part 51 fitted into the fitting concave part 33 of the LED module 11 at the center thereof as shown in FIG. The upper surface of the upper portion 43b (which is also the support member 9, the support portion main body 41, and the extending rod 43) is made flat by increasing the contact area with the LED module 11 (mounting substrate 21). This is because the heat of the LED module 11 is easily transferred to the stretching rod 43 (the support member 9 and the support portion main body 41).
　具体例としては、延伸棒４３の中央部分の直径が３［ｍｍ］～２９［ｍｍ］、長さが５［ｍｍ］～４５［ｍｍ］であり、１つの棒材４０の直径が０．５［ｍｍ］～３［ｍｍ］、長さが１［ｍｍ］～１０［ｍｍ］である。
（４）ケース５
　ケース５は、図１に示すように、筒状をし、中心軸方向におけるグローブ３５側半分が大径部５ａに、口金７側半分が小径部５ｂにそれぞれなっている。ケース５は、樹脂材料、例えばポリブチレンテレフタレート（ＰＢＴ）により構成されている。 As a specific example, the diameter of the central portion of the extending rod 43 is 3 [mm] to 29 [mm], the length is 5 [mm] to 45 [mm], and the diameter of one bar 40 is 0.5. [Mm] to 3 [mm] and the length is 1 [mm] to 10 [mm].
(4) Case 5
As shown in FIG. 1, the case 5 has a cylindrical shape, and the half on the globe 35 side in the central axis direction is the large diameter portion 5a and the half on the base 7 side is the small diameter portion 5b. The case 5 is made of a resin material such as polybutylene terephthalate (PBT).
　大径部５ａは容器３の下端部に対して外嵌する状態で取着され、小径部５ｂは口金７により覆われる状態で口金７と接合している。小径部５ｂの外周には雄ネジが形成され、エジソンタイプの口金７の雌ネジと螺合する。 The large diameter portion 5 a is attached in a state of being fitted to the lower end portion of the container 3, and the small diameter portion 5 b is joined to the base 7 while being covered with the base 7. A male screw is formed on the outer periphery of the small-diameter portion 5b, and is screwed with the female screw of the Edison type cap 7.
　ケース５の小径部５ｂの外周には、口金７と接続するリード線６５を固定するための固定溝５ｃがケース５の中心軸と平行に形成され、ケース５の内部には、回路ユニット１３の回路基板５５を固定するための固定手段（係止手段５３）が設けられている。固定手段については、回路ユニット１３の説明の際に行う。
（５）回路ユニット１３
　回路ユニット１３は、図１に示すように、回路基板５５と、当該回路基板５５に実装された各種の電子部品５７，５８とを備え、各種電子部品５７，５９によって、口金７を介して受電した商業電力（交流）を整流する整流回路、整流された直流電力を平滑化する平滑回路等の各種回路が構成される。 A fixing groove 5c for fixing the lead wire 65 connected to the base 7 is formed in the outer periphery of the small diameter portion 5b of the case 5 in parallel with the central axis of the case 5. Fixing means (locking means 53) for fixing the circuit board 55 is provided. The fixing means will be described when the circuit unit 13 is described.
(5) Circuit unit 13
As shown in FIG. 1, the circuit unit 13 includes a circuit board 55 and various electronic components 57 and 58 mounted on the circuit board 55. The circuit unit 13 receives power via the base 7 by the various electronic components 57 and 59. Various circuits such as a rectifying circuit that rectifies commercial power (AC) and a smoothing circuit that smoothes the rectified DC power are configured.
　整流回路は回路基板５５の上面側のダイオードブリッジ５７により、平滑回路は回路基板５５の下面側のコンデンサ５９によりそれぞれ構成され、コンデンサ５９の本体部が口金７の内部に位置する。 The rectifier circuit is constituted by a diode bridge 57 on the upper surface side of the circuit board 55, and the smoothing circuit is constituted by a capacitor 59 on the lower surface side of the circuit board 55, and the main body of the capacitor 59 is located inside the base 7.
　回路基板５５は、ケース５の内部の係止手段５３により固定される。具体的には、ケース５の内部の段差部６１に回路基板５５の下面の周縁部分が当接し、係止部６２により回路基板の５５の上面が係止されている。係止部６２は、周方向に間隔（例えば、等間隔である。）をおいて複数個（例えば４個である。）形成され、段差部６１に近づくに従ってケース５の中心軸側に張り出す。 The circuit board 55 is fixed by the locking means 53 inside the case 5. Specifically, the peripheral portion of the lower surface of the circuit board 55 contacts the stepped portion 61 inside the case 5, and the upper surface of the circuit board 55 is locked by the locking portion 62. A plurality of (for example, four) locking portions 62 are formed at intervals (for example, at equal intervals) in the circumferential direction, and project toward the central axis side of the case 5 as approaching the stepped portion 61. .
　回路ユニット１３は、口金７とはリード線６３，６５で、ＬＥＤモジュール１１とはリード線６７，６９で接続されている。
（６）口金７
　口金７は、ＬＥＤランプ１の照明器具への取付機能を有する（図１２参照）他、商業電源と電気的に接続する機能を有する。口金７は、白熱電球で利用されているエジソンタイプであり、筒状であって周壁がネジ状をしたシェル部７１と、シェル部７１に絶縁材料７３を介して装着されたアイレット部７５とからなる。 The circuit unit 13 is connected to the base 7 by lead wires 63 and 65 and to the LED module 11 by lead wires 67 and 69.
(6) Base 7
The base 7 has a function of attaching the LED lamp 1 to a lighting fixture (see FIG. 12) and also has a function of electrically connecting to a commercial power source. The base 7 is an Edison type used in incandescent bulbs, and includes a shell portion 71 having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 75 attached to the shell portion 71 via an insulating material 73. Become.
　回路ユニット１３と接続する一方のリード線６５は、ケース５の小径部５ｂの開口端で外周面側へと折り返されて、ケース５の固定溝５ｃに嵌められた状態でシェル部７１に覆われることで、シェル部７１に接続される。他方のリード線６３は、半田付けによりアイレット部７５に接続される。 One lead wire 65 connected to the circuit unit 13 is folded back to the outer peripheral surface side at the opening end of the small diameter portion 5 b of the case 5 and covered with the shell portion 71 in a state of being fitted in the fixing groove 5 c of the case 5. Thus, it is connected to the shell portion 71. The other lead wire 63 is connected to the eyelet part 75 by soldering.
　口金７は、シェル部７１がケース５の小径部５ｂに螺合する状態で、シェル部７１の上端部がカシメられて、ケース５に取り付けられる。
３．製造方法
　本実施形態に係るＬＥＤランプ１の製造方法の一例について説明する。 The base 7 is attached to the case 5 with the upper end portion of the shell portion 71 being crimped in a state where the shell portion 71 is screwed into the small diameter portion 5 b of the case 5.
3. Manufacturing Method An example of a manufacturing method of the LED lamp 1 according to this embodiment will be described.
　ＬＥＤランプ１は、蓋部材３７に取着された支持部材９よりＬＥＤモジュール１１が支持されたもの（以下、「モジュール付蓋部材」とする。）を製作するモジュール付蓋部材製作工程と、モジュール付蓋部材をグローブ３５の開口側端部に封着して容器３を製作する容器製作工程と、容器３内を排気した後ヘリウムガスを封入するヘリウム封入工程（ヘリウムガスが封入された容器３を「バルブ」とする。）と、回路ユニット１３をケース５に組み込む回路組込工程と、バルブをケースに取着するバルブ取着工程と、口金７をケース５に取着する口金取着工程とを含む。 The LED lamp 1 includes a module cover member manufacturing process for manufacturing a module in which the LED module 11 is supported by a support member 9 attached to a cover member 37 (hereinafter referred to as “module cover member”), and a module. A container manufacturing process for manufacturing the container 3 by sealing the attached lid member to the opening side end of the globe 35, and a helium sealing process for evacuating the container 3 and then sealing the helium gas (the container 3 filled with helium gas) , A circuit assembly process for incorporating the circuit unit 13 in the case 5, a valve attachment process for attaching the valve to the case, and a base attachment process for attaching the base 7 to the case 5. Including.
　上記の工程のうち、回路組込工程、バルブ取着工程及び口金取着工程は従来からある公知技術を利用できるため、ここでの説明は省略する。
（１）モジュール付蓋部材製作工程
　モジュール付蓋部材製作工程では、例えば、排気管３９用の細管を蓋部材３７に気密状に取着する細管取着工程と、支持部材９を蓋部材３７に取着する支持部材装着工程と、支持部材９にＬＥＤモジュール１１を取着するモジュール取着工程と、ＬＥＤモジュール１１とリード線６７，６９とを接続する接続工程とを含む。 Among the above steps, the circuit incorporation step, the valve attachment step, and the base attachment step can use conventional well-known techniques, and thus description thereof is omitted here.
(1) Module-equipped lid member production process In the module-equipped lid member production process, for example, a thin tube attachment process for attaching the narrow tube for the exhaust pipe 39 to the lid member 37 in an airtight manner, and the support member 9 as the lid member 37 A supporting member mounting step for attaching, a module attaching step for attaching the LED module 11 to the supporting member 9, and a connecting step for connecting the LED module 11 and the lead wires 67 and 69 are included.
　これらの工程は、上記した順で必ずしも行う必要はなく、例えば、細管取着工程は支持部材装着工程や後述の棒部材取着工程の後に行っても良いし、あるいは、支持部材９にＬＥＤモジュール１１を取着した後に支持部材９を蓋部材３７に装着しても良い。 These steps do not necessarily have to be performed in the order described above. For example, the capillary tube mounting step may be performed after the supporting member mounting step or the bar member mounting step described later, or the supporting member 9 is provided with an LED module. After attaching 11, the support member 9 may be attached to the lid member 37.
　支持部材装着工程は、例えば、棒材４０に支持部本体４１を取着する本体取着工程と、棒材４０を蓋部材３７に気密状に取着する棒材取着工程とを含む。なお、先に棒材４０を蓋部材３７に取着した後に、支持部本体４１を棒材４０に取着するようにしても良い。 The support member mounting step includes, for example, a main body attaching step for attaching the support portion main body 41 to the bar 40 and a bar attaching step for attaching the bar 40 to the lid member 37 in an airtight manner. Alternatively, the support body 41 may be attached to the bar 40 after the bar 40 is first attached to the lid member 37.
　本体取着工程では、例えば、棒材４０の上端部４０ａを支持部本体４１の台座４２に溶接により取着する。棒材取着工程では、例えば、棒材４０の下端部４０ｂを加熱し、そのまま、ガラス材料である蓋部材３７に押当て、下端部４０ｂとの接触部分のガラス材料を溶融させながら、下端部４０ｂを蓋部材３７内に押し込む。 In the main body attachment process, for example, the upper end portion 40a of the bar 40 is attached to the base 42 of the support portion main body 41 by welding. In the bar attaching process, for example, the lower end 40b of the bar 40 is heated and directly pressed against the lid member 37, which is a glass material, and the glass material at the contact portion with the lower end 40b is melted. 40 b is pushed into the lid member 37.
　なお、本体取着工程では、棒材４０と支持部本体４１とを溶接で取着しているが、例えば、接着剤を利用して支持部本体４１と棒材４０とを接合する場合、棒材を蓋部材に取着した後、棒材に支持部本体を取着することも可能である。 In the main body attaching step, the bar 40 and the support part main body 41 are attached by welding. For example, when the support part main body 41 and the bar 40 are joined using an adhesive, It is also possible to attach the support body to the bar after attaching the material to the lid member.
　本実施形態では、蓋部材３７をガラス材料で構成し、棒材４０をジュメット材料で構成している。このため、例えば、支持部本体４１として、熱伝導性の優れるもののガラス材料との密着性が劣るような材料も利用することができる。あるいは、支持部本体４１として、棒材４０よりも安価でガラス材料との密着性が劣るような材料も利用することができる。 In this embodiment, the lid member 37 is made of a glass material, and the bar 40 is made of a jumet material. For this reason, for example, a material having excellent heat conductivity but poor adhesion to the glass material can be used as the support body 41. Alternatively, a material that is less expensive than the bar 40 and has poor adhesion to the glass material can be used as the support body 41.
　このように、蓋部材３７と接合する棒材４０だけを蓋部材３７と密着性の高い材料を用いれば、支持部本体４１として、熱伝導性、価格、加工性等の操作性等の他の機能を重視した材料を選択しても、支持部材９は蓋部材３７から外れるようなことを防ぐことができる。
（２）容器作成工程
　容器製作工程では、グローブ３５と蓋部材３７とがガラス材料で構成されているため、グローブ３５の開口周縁部と蓋部材３７の外周縁とを当接させた状態で、当接部分を含めた当接部周辺部を加熱・溶融して両者を溶着している。
（３）ヘリウム封入工程
　ヘリウム封入工程では、まず、細管（３９）を介して、容器３内の空気を排出し、その後ヘリウムガスを注入し、最後に細管（３９）における容器３の外部に位置する部分をチップオフ封止することで行うことができる。
４．放熱特性
　本実施形態に係るＬＥＤランプ１は、点灯時に発生するＬＥＤ２３の熱と回路ユニット１３の熱を複数経路から放出している。
（１）ＬＥＤ２３で発生した熱
　ＬＥＤ２３で発生した熱は、ＬＥＤモジュール１１から容器３内のヘリウムガスを経由してグローブ３５に伝わり（第１の経路である。）、さらに、ＬＥＤモジュール１１から支持部材９、蓋部材３７を経由してグローブ３５に伝わる（第２の経路である。）。両経路からグローブ３５に伝導された熱は、グローブ３５の外面から伝導・対流・輻射により大気へと放出される。 In this way, if only the bar 40 to be joined to the lid member 37 is made of a material having high adhesion to the lid member 37, the support portion main body 41 can be used for other operability such as thermal conductivity, price, workability, etc. Even if a material with an emphasis on function is selected, the support member 9 can be prevented from coming off the lid member 37.
(2) Container creation process In the container production process, since the globe 35 and the lid member 37 are made of a glass material, the opening peripheral edge of the globe 35 and the outer peripheral edge of the lid member 37 are in contact with each other. The peripheral part of the contact part including the contact part is heated and melted to weld both.
(3) Helium sealing step In the helium sealing step, first, the air in the container 3 is discharged through the thin tube (39), and then helium gas is injected. Finally, the helium gas is placed outside the container 3 in the thin tube (39). This can be done by chip-off sealing the part to be performed.
4). Heat Dissipation Characteristics The LED lamp 1 according to this embodiment radiates the heat of the LED 23 and the heat of the circuit unit 13 generated during lighting from a plurality of paths.
(1) Heat generated in the LED 23 Heat generated in the LED 23 is transmitted from the LED module 11 to the globe 35 via the helium gas in the container 3 (this is the first path), and further supported from the LED module 11. It is transmitted to the globe 35 via the member 9 and the lid member 37 (second route). The heat conducted from both paths to the globe 35 is released from the outer surface of the globe 35 to the atmosphere by conduction, convection, and radiation.
　特に、第２の経路において、ＬＥＤモジュール１１の発光時の熱を支持部材９から容器３に伝熱させる際の伝熱量は、支持部本体４１の表面積が複数の棒材４０の表面積の合計よりも大きいため、棒材４０で直接ＬＥＤモジュール１１を支持する場合に比べて多くなる。これによりＬＥＤモジュール１１の発光時の温度上昇を抑制することができる。 In particular, in the second path, the amount of heat transferred when the LED module 11 emits heat from the support member 9 to the container 3 is greater than the sum of the surface areas of the plurality of bar members 40 as the surface area of the support body 41. Therefore, the number is larger than the case where the LED module 11 is directly supported by the bar 40. Thereby, the temperature rise at the time of light emission of the LED module 11 can be suppressed.
　特に、熱伝導性の優れたヘリウムガスを介して熱をグローブ３５に伝導させる構造としているため、ＬＥＤ２３の熱をグローブ内の空気を介して伝える構造よりも伝熱作用を大幅に向上させることができる。 In particular, since the structure is such that heat is conducted to the globe 35 via helium gas having excellent thermal conductivity, the heat transfer effect can be significantly improved as compared with the structure in which the heat of the LED 23 is conducted via the air in the globe. it can.
　また、ＬＥＤモジュール１１をグローブ３５の球状部３５ａの略中央に配置しているため、容器３内のヘリウムに均等に熱を伝え易くなり、グローブ３５から大気へと放熱特性を高めることができる。 In addition, since the LED module 11 is disposed substantially at the center of the spherical portion 35a of the globe 35, heat can be easily transferred evenly to the helium in the container 3, and heat dissipation characteristics from the globe 35 to the atmosphere can be improved.
　さらに、グローブ３５を白熱電球のガラスバルブに似た大きさ・形状としているため、グローブ３５の包絡体積が大きくなり、グローブ３５から大気へと放熱特性を高めることができる。 Furthermore, since the globe 35 has a size and shape similar to a glass bulb of an incandescent bulb, the envelope volume of the globe 35 is increased, and the heat radiation characteristics from the globe 35 to the atmosphere can be enhanced.
　このように、放熱経路を複数有することで高い放熱特性を得ることができる。このため、一方の放熱経路だけでは不十分な場合でも、ＬＥＤモジュール１１に残る熱をもう一方の放熱経路を利用して、効果的に放出できる。
（２）回路ユニット１３で発生した熱
　回路ユニット１３から発生した熱は、伝熱、対流、輻射によりケース５に伝わる。ケース５に伝わった熱の一部がケース５から外部へと対流・輻射により放出し、残りの熱が口金７から照明器具側のソケットへと伝わる（図１２参照）。 Thus, high heat dissipation characteristics can be obtained by having a plurality of heat dissipation paths. For this reason, even when only one heat dissipation path is insufficient, the heat remaining in the LED module 11 can be effectively released using the other heat dissipation path.
(2) Heat generated in the circuit unit 13 The heat generated from the circuit unit 13 is transferred to the case 5 by heat transfer, convection, and radiation. Part of the heat transferred to the case 5 is released from the case 5 to the outside by convection and radiation, and the remaining heat is transferred from the base 7 to the socket on the lighting fixture side (see FIG. 12).
　ＬＥＤランプ１では、グローブ３５の大きさ・形状を白熱電球に合わせ、グローブ３５の略中央にＬＥＤモジュール１１を備えているため、ＬＥＤモジュール１１と回路ユニット１３との間の距離が大きくなり、回路ユニット１３がＬＥＤ２３から受ける熱負荷を削減することができる。
≪第２の実施形態≫
　第１の実施形態に係るＬＥＤランプ１では、棒材４０の下端部４０ｂが容器３の外部に延出しないように蓋部材３７に接合されていたが、棒材を容器から外部へと延出させて、その延出先をケースに熱的に接合させていても良い。
１．実施形態
　第２の実施形態では、棒材が容器の外部に延出しているＬＥＤランプ１０１について説明する。 In the LED lamp 1, the size and shape of the globe 35 is matched to the incandescent bulb, and the LED module 11 is provided in the approximate center of the globe 35. Therefore, the distance between the LED module 11 and the circuit unit 13 is increased, and the circuit The thermal load that the unit 13 receives from the LED 23 can be reduced.
<< Second Embodiment >>
In the LED lamp 1 according to the first embodiment, the lower end portion 40b of the bar 40 is joined to the lid member 37 so as not to extend to the outside of the container 3, but the bar is extended from the container to the outside. Then, the extension destination may be thermally joined to the case.
1. Embodiment In the second embodiment, an LED lamp 101 in which a bar extends to the outside of the container will be described.
　図７は、ＬＥＤランプ１０１の一部断面図である。 FIG. 7 is a partial cross-sectional view of the LED lamp 101.
　ＬＥＤランプ１０１は、同図に示すように、容器１０３、ケース１０５、口金７、支持部材１０７、ＬＥＤモジュール１１及び回路ユニット１３を備える。支持部材１０７を構成する棒材１０９は、容器１０３から延出し、その延出先端に伝熱部材１１１が接合されている。この伝熱部材１１１はケース１０５の内周面に接触している。 The LED lamp 101 includes a container 103, a case 105, a base 7, a support member 107, an LED module 11, and a circuit unit 13, as shown in FIG. The bar 109 constituting the support member 107 extends from the container 103, and the heat transfer member 111 is joined to the extended tip. The heat transfer member 111 is in contact with the inner peripheral surface of the case 105.
　容器１０３は、第１の実施形態と同様に、グローブ１２１と蓋部材１２３とから構成されている。グローブ１２１及び蓋部材１２３は、ガラス材料から構成され、蓋部材１２３は、グローブ１２１の開口を気密状に塞いでいる。つまり、蓋部材１２３はグローブ１２１の開口周辺部分に封着されている。 The container 103 is comprised from the glove | globe 121 and the cover member 123 similarly to 1st Embodiment. The globe 121 and the lid member 123 are made of a glass material, and the lid member 123 blocks the opening of the globe 121 in an airtight manner. That is, the lid member 123 is sealed to the periphery of the opening of the globe 121.
　なお、容器１０３は、口金７と反対側の排気管１２４を利用して内部にヘリウムガスが封入されている。 The container 103 is filled with helium gas using the exhaust pipe 124 on the side opposite to the base 7.
　支持部材１０７は、第１の実施形態と同様に、２つ以上の部材からなる。つまり、支持部材１０７は、支持部本体１３１と棒材１０９とを備える。本実施形態では、支持部本体１３１は１つの部材からなり、第１の実施形態における台座４２に相当する台座部１３５と、第１の実施形態における延伸棒４３に相当する延伸部１３３とを有する。 The support member 107 is composed of two or more members as in the first embodiment. That is, the support member 107 includes the support portion main body 131 and the bar 109. In the present embodiment, the support portion main body 131 is formed of a single member, and includes a pedestal portion 135 corresponding to the pedestal 42 in the first embodiment and an extending portion 133 corresponding to the extending rod 43 in the first embodiment. .
　本実施形態での支持部本体１３１は、例えば、金属材料（具体的にはアルミニウム材料）により構成されている。支持部本体１３１の表面積は、複数の棒材１０９のそれぞれの表面積の合計よりも大きくなっている。 The support body 131 in this embodiment is made of, for example, a metal material (specifically, an aluminum material). The surface area of the support body 131 is larger than the total surface area of each of the plurality of bars 109.
　延伸部１３３の先端は、第１の実施形態における延伸棒４３の先端形状と同じであり、ＬＥＤモジュール１１の実装基板２１の裏面と当接するようになっている。 The front end of the extending portion 133 is the same as the front end shape of the extending rod 43 in the first embodiment, and comes into contact with the back surface of the mounting substrate 21 of the LED module 11.
　支持部本体１３１の下部側は、延伸部１３３から台座部１３５に近づくに従って徐々に拡径する形状をし、拡径している部分に電力供給用のリード線６７，６９が挿通する貫通孔１３７，１３９が形成されている。 The lower part of the support body 131 has a shape that gradually increases in diameter as it approaches the pedestal part 135 from the extending part 133, and a through-hole 137 through which the power supply lead wires 67 and 69 are inserted into the expanded part. , 139 are formed.
　棒材１０９は、複数本、ここでは、９本ある。第１の実施形態の８本のほか、蓋部材１２３の中央に１本有している。各棒材１０９は、蓋部材１２３を貫通する状態で、蓋部材１２３に気密状に装着（封着）されている。 There are a plurality of rods 109, here nine. In addition to the eight in the first embodiment, there is one in the center of the lid member 123. Each bar 109 is attached (sealed) to the lid member 123 in an airtight manner while penetrating the lid member 123.
　各棒材１０９の上端部１０９ａは支持部本体１３１の台座部１３５の下面に例えば溶接により固着されている。各棒材１０９の下端部１０９ｂは、容器３の外側に位置しており、この部分が、金属材料から構成された伝熱部材１１１の上面に例えば溶接により固着されている（棒材１０９と伝熱部材１１１とが接する状態であれば良い。）。ここでの伝熱部材１１１は円板状をしている。 The upper end 109a of each bar 109 is fixed to the lower surface of the pedestal 135 of the support body 131 by, for example, welding. The lower end 109b of each bar 109 is located outside the container 3, and this part is fixed to the upper surface of the heat transfer member 111 made of a metal material by welding (for example, with the bar 109). Any state may be used as long as it is in contact with the thermal member 111.) Here, the heat transfer member 111 has a disk shape.
　本実施の形態においても、延伸部１３３の中央部分の横断面の面積は、棒材１０９の横断面の面積の合計よりも広く、延伸部１３３の表面積は、棒材１０９の表面積の合計よりも広くなっている。 Also in the present embodiment, the area of the cross section of the central portion of the extending portion 133 is wider than the total area of the cross sections of the bar 109, and the surface area of the extending portion 133 is larger than the total surface area of the bar 109. It is getting wider.
　ケース１０５は、第１の実施形態におけるケース５と基本的に同じ構成を有しているが、伝熱部材１１１と熱的に結合した状態で伝熱部材１１１を内部に格納する点で、ケース５と異なる。ケース１０５は、伝熱部材１１１が口金７と反対側の開口から挿入された際に、その挿入を規制する規制部１４１を内周面に有している。 The case 105 has basically the same configuration as the case 5 in the first embodiment, but the case 105 is a case where the heat transfer member 111 is housed inside while being thermally coupled to the heat transfer member 111. Different from 5. The case 105 has a restricting portion 141 on its inner peripheral surface that restricts the insertion of the heat transfer member 111 when the heat transfer member 111 is inserted from the opening opposite to the base 7.
　規制部１４１は、ケース１０５の内周面の段差により構成され、周方向に連続して形成されている。なお、規制部は、周方向に間隔をおいて複数個形成されていても良い。 The restricting portion 141 is constituted by a step on the inner peripheral surface of the case 105, and is continuously formed in the circumferential direction. Note that a plurality of restricting portions may be formed at intervals in the circumferential direction.
　第２の実施形態の場合、発光時のＬＥＤモジュール１１の熱は、支持部材１０７から容器１０３の外部に存する伝熱部材１１１を経由してケース１０５に伝わり、ケース１０５から外気へと放出されたり、口金７から照明装置側のソケットへ伝わったりする。
２．放熱性
　ＬＥＤ２３で発生した熱は、ＬＥＤモジュール１１から容器１０３内のヘリウムガスを経由してグローブ１２１に伝わり（第１の経路である。）、また、ＬＥＤモジュール１１から支持部材１０７、蓋部材１２３を経由してグローブ１２１に伝わる（第２の経路である。）。 In the case of the second embodiment, the heat of the LED module 11 at the time of light emission is transmitted from the support member 107 to the case 105 via the heat transfer member 111 existing outside the container 103 and is released from the case 105 to the outside air. Or transmitted from the base 7 to the socket on the lighting device side.
2. Heat dissipation Heat generated in the LED 23 is transmitted from the LED module 11 to the globe 121 via the helium gas in the container 103 (first path), and from the LED module 11 to the support member 107 and the lid member 123. Is transmitted to the globe 121 via (the second route).
　さらに、ＬＥＤモジュール１１から支持部材１０７、特に、棒材１０９、伝熱部材１１１を経由してケース１０５に伝わり（第３の経路である。）、ケース１０５に伝わった熱は、対流・輻射により大気へと放出されたり、口金７から照明器具側のソケットへと伝わったりする（図１２参照）。 Further, the LED module 11 is transferred to the case 105 via the support member 107, in particular, the bar 109 and the heat transfer member 111 (this is the third path), and the heat transferred to the case 105 is caused by convection and radiation. It is discharged into the atmosphere or transmitted from the base 7 to the socket on the lighting fixture side (see FIG. 12).
　このように、放熱経路を複数有することで高い放熱特性を得ることができる。例えば、第１及び第２の経路を伝わった熱により容器１０３の温度が上昇し、それ以上、放熱できないような場合でも、ＬＥＤモジュール１１に残る熱を、第３の経路を利用して容器１０３以外の部材であってまだ高温となっていないケース１０５や口金７に伝えることができる。
３．他の接合例
　第１の実施形態及び第２の実施形態ではランプの形態について説明したが、ここでは、支持部本体と棒材との接合及び棒材と伝熱部材との接合例について説明する。 Thus, high heat dissipation characteristics can be obtained by having a plurality of heat dissipation paths. For example, even when the temperature of the container 103 rises due to the heat transmitted through the first and second paths and the heat cannot be radiated any more, the heat remaining in the LED module 11 is transferred to the container 103 using the third path. It is possible to transmit to the case 105 and the base 7 which are members other than the above and have not yet reached a high temperature.
3. Other Joining Examples In the first embodiment and the second embodiment, the form of the lamp has been described, but here, a joining example between the support body and the bar and a joining example between the bar and the heat transfer member will be described. .
　図８～図１１は、支持部本体と棒材との接合及び棒材と伝熱部材との接合例についての説明図である。 FIG. 8 to FIG. 11 are explanatory diagrams of examples of joining of the support portion main body and the bar material and joining examples of the bar material and the heat transfer member.
　なお、図８～図１１では、支持部本体における延伸棒の上部の記載は省略し、支持部本体のリード線６７，６９の貫通孔及び伝熱部材のリード線６７，６９の貫通孔の説明等は第２の実施形態と同じであるため、ここでは省略する。 8 to 11, the description of the upper part of the extending bar in the support body is omitted, and the through holes of the lead wires 67 and 69 of the support body and the through holes of the lead wires 67 and 69 of the heat transfer member are described. Etc. are the same as in the second embodiment, and are omitted here.
　また、以下で説明する例１～３は、支持部本体が一体となった構造であるが、支持部本体は第１の実施形態で説明したように２つ以上の部材から構成しても良い。
（１）例１
　例１では、棒材２０１の中間部２０１ｃが蓋部材２０３に気密状に装着されている。棒材２０１の中間部２０１ｃは、蓋部材２０３の上・下面に対して垂直に延伸する。棒材２０１は、円板状の台座２０７の中央を中心とする円周上を周方向に間隔をおいて複数設けられており、この円周に沿った断面を図８に示している。 Further, Examples 1 to 3 described below are structures in which the support body is integrated, but the support body may be composed of two or more members as described in the first embodiment. .
(1) Example 1
In Example 1, the intermediate portion 201c of the bar 201 is attached to the lid member 203 in an airtight manner. The intermediate portion 201 c of the bar 201 extends perpendicularly to the upper and lower surfaces of the lid member 203. A plurality of bar members 201 are provided on the circumference centering on the center of the disk-shaped base 207 at intervals in the circumferential direction, and a cross section along this circumference is shown in FIG.
　棒材２０１の上端部２０１ａは、蓋部材２０３に対して平行となるように屈曲し、蓋部材２０３と平行な部分が支持部本体２０５の台座２０７の上面にビス２０９を介して接合されている。台座２０７は、棒材２０１が挿通するための貫通孔２１１を棒材２０１の挿通位置に合わせて有し、ビス２０９に対応してビス孔を有している。 The upper end portion 201 a of the bar 201 is bent so as to be parallel to the lid member 203, and a portion parallel to the lid member 203 is joined to the upper surface of the base 207 of the support portion main body 205 via a screw 209. . The base 207 has a through hole 211 through which the bar 201 is inserted in accordance with the insertion position of the bar 201 and has a screw hole corresponding to the screw 209.
　棒材２０１の下端部２０１ｂは、蓋部材２０３に対して平行となるように屈曲し、蓋部材２０３と平行な部分が伝熱部材２１３の下面にビス２１５を介して接合されている。伝熱部材２１３は、棒材２０１が挿通するための貫通孔２１７を棒材２０１の挿通位置に合わせて有し、ビス２１５に対応してビス孔を有している。
（２）例２
　例２では、棒材２３１の中間部２３１ｃが蓋部材２３３に気密状に装着されている。棒材２３１の中間部２３１ｃは、蓋部材２３３の上・下面に対して垂直に延伸する。棒材２３１は、ここでは、円板状の台座２３５の中央を通り、互いに直交する２本の仮想線上に複数個設けられており（１本の仮想線に対して４個の棒材が設けられている）、一方の仮想線に沿った断面を図９に示している。 The lower end portion 201b of the bar 201 is bent so as to be parallel to the lid member 203, and a portion parallel to the lid member 203 is joined to the lower surface of the heat transfer member 213 via a screw 215. The heat transfer member 213 has a through hole 217 through which the bar 201 is inserted in accordance with the insertion position of the bar 201, and has a screw hole corresponding to the screw 215.
(2) Example 2
In Example 2, the intermediate portion 231c of the bar 231 is attached to the lid member 233 in an airtight manner. The intermediate portion 231 c of the bar 231 extends perpendicularly to the upper and lower surfaces of the lid member 233. Here, a plurality of bars 231 are provided on two virtual lines that pass through the center of the disk-shaped base 235 and are orthogonal to each other (four bars are provided for one virtual line). FIG. 9 shows a cross section along one imaginary line.
　棒材２３１の中間部２３１ｃは、横断面が円形をした円柱状をしている（図示省略）。棒材２３１の上端部２３１ａは、台座２３５の下面の凹入部２３７に下方から挿入された状態で固定手段により固定される。固定手段は、ここでは、「Ｕ」字状をした板バネ２３９により構成されている。板バネ２３９は、凹入部２３７内に配され、凹入部２３７内で、凹入部２３７内に挿入された棒材２３１の上端部２３１ａを把持することで上端部２３１ａを固定する。 The intermediate portion 231c of the bar 231 has a columnar shape with a circular cross section (not shown). The upper end portion 231a of the bar 231 is fixed by the fixing means in a state where it is inserted from below into the recessed portion 237 on the lower surface of the base 235. Here, the fixing means is constituted by a leaf spring 239 having a “U” shape. The leaf spring 239 is disposed in the recessed portion 237, and the upper end portion 231a is fixed by gripping the upper end portion 231a of the bar 231 inserted in the recessed portion 237 in the recessed portion 237.
　棒材２３１の上端部２３１ａはその横断面は矩形状をし、板バネ２３９から上端部２３１ａが抜けるのを防止するため、上端だけ板バネ２３９による把持方向（棒材の挿入方向と直交する方向である。）の寸法が大きくなっている。つまり、上端だけ球状に膨らんだ形状をしている。なお、板バネ２３９の構造は、棒材２３１の下端部２３１ｂを固定する板バネ２４５と同じである。 The upper end 231a of the bar 231 has a rectangular cross section, and in order to prevent the upper end 231a from coming off from the leaf spring 239, only the upper end is gripped by the leaf spring 239 (the direction perpendicular to the insertion direction of the rod). )) Is larger. That is, the upper end has a spherical shape. The structure of the leaf spring 239 is the same as that of the leaf spring 245 that fixes the lower end portion 231b of the bar 231.
　棒材２３１の下端部２３１ｂは、伝熱部材２４１の上面の凹入部２４３に挿入された状態で固定手段により固定される。固定手段は、「Ｕ」字状をした上記板バネ２３９と同様の構成を有する板バネ２４５により構成されている。板バネ２４５は、凹入部２４３内に配され、凹入部２４３内で、凹入部２４３内に挿入された棒材２３１の下端部２３１ｂを把持することで下端部２３１ｂを固定する。 The lower end portion 231b of the bar 231 is fixed by a fixing means in a state of being inserted into the recessed portion 243 on the upper surface of the heat transfer member 241. The fixing means is constituted by a leaf spring 245 having the same configuration as the leaf spring 239 having a “U” shape. The leaf spring 245 is disposed in the recessed portion 243, and fixes the lower end portion 231b by gripping the lower end portion 231b of the bar 231 inserted into the recessed portion 243 in the recessed portion 243.
　板バネ２４５は、一対の把持片２４５ａ，２４５ｂと、一対の把持片２４５ａ，２４５ｂの一端同士を連結する連結部２４５ｃとを有し、一対の把持片２４５ａ，２４５ｂの間隔は連結部２４５ｃに近い側の方が小さくなっている。一対の把持片２４５ａ，２４５ｂ間に棒材２３１の下端部２３１ｂが挿入されると、一対の把持片２４５ａ，２４５ｂや連結部２４５ｃが弾性変形し、その復元力を利用して、一対の把持片２４５ａ，２４５ｂ間に挿入された棒材２３１の下端部２３１ｂを保持（把持）している。 The leaf spring 245 includes a pair of gripping pieces 245a and 245b and a connecting portion 245c that connects one ends of the pair of gripping pieces 245a and 245b, and the distance between the pair of gripping pieces 245a and 245b is close to the connecting portion 245c. The side is smaller. When the lower end portion 231b of the bar 231 is inserted between the pair of gripping pieces 245a and 245b, the pair of gripping pieces 245a and 245b and the connecting portion 245c are elastically deformed, and using the restoring force, the pair of gripping pieces The lower end portion 231b of the bar 231 inserted between 245a and 245b is held (gripped).
　板バネ２４５の連結部２４５ｃは、凹入部２４３内で例えば、接着剤（図示省略）により固着されている。棒材２３１の下端部２３１ｂはその横断面が矩形状をし、板バネ２４５から下端部２３１ｂが抜けるのを防止するため、下端だけ板バネ２４５による把持方向の寸法が大きくなっている。つまり、下端だけ球状に膨らんだ形状をしている。
（３）例３
　例３では、棒材２５１の中間部２５１ｃが蓋部材２５３に気密状に装着されている。棒材２３１の中間部２５１ｃは、蓋部材２５３の上・下面に対して垂直に延伸する。棒材２５１は、ここでは、円板状の台座２５５の中央を通り、互いに直交する２本の仮想線上に複数個設けられており（１本の仮想線に対して４個の棒材が設けられている）、一方の仮想線に沿った断面を図１０に示している。 The connecting portion 245c of the leaf spring 245 is fixed inside the recessed portion 243 by, for example, an adhesive (not shown). The lower end portion 231b of the bar 231 has a rectangular cross section, and the dimension in the holding direction by the plate spring 245 is increased only at the lower end in order to prevent the lower end portion 231b from coming off from the plate spring 245. That is, the lower end has a spherical shape.
(3) Example 3
In Example 3, the intermediate portion 251c of the bar 251 is attached to the lid member 253 in an airtight manner. The intermediate portion 251c of the bar 231 extends perpendicularly to the upper and lower surfaces of the lid member 253. Here, a plurality of bars 251 are provided on two virtual lines that pass through the center of the disk-shaped base 255 and are orthogonal to each other (four bars are provided for one virtual line). FIG. 10 shows a cross section along one imaginary line.
　棒材２５１の中間部２５１ｃは、横断面が円形をした円柱状をしている（図示省略）。棒材２５１の上端部２５１ａは、台座２５５の下面の凹入部２５７に下方から挿入された状態で固定手段により固定される。固定手段は、ここでは、接着剤２５９により構成されている。 The intermediate part 251c of the bar 251 has a cylindrical shape with a circular cross section (not shown). The upper end portion 251a of the bar 251 is fixed by the fixing means in a state where it is inserted into the recessed portion 257 on the lower surface of the base 255 from below. Here, the fixing means is constituted by an adhesive 259.
　棒材２５１の下端部２５１ｂは、伝熱部材２６１の上面の凹入部２６３に挿入された状態で固定手段により固定される。固定手段は、ここでは接着剤２６５により構成されている。 The lower end portion 251b of the bar 251 is fixed by a fixing means in a state of being inserted into the recessed portion 263 on the upper surface of the heat transfer member 261. Here, the fixing means is constituted by an adhesive 265.
　接着剤２５９，２６５は、有機材料（例えば、樹脂材料である。）・無機材料（例えばセメントやガラスである。）に関係なく利用できる。接着剤２５９，２６５に樹脂材料を用いる場合は、熱硬化タイプ、熱可塑タイプとも利用できる。熱可塑タイプを用いる場合、凹入部２５７，２６３に予め接着剤を充填しておき、その後、棒材２５１の上端部２５１ａや下端部２５１ｂを加熱して凹入部２５７，２６３内に挿入すると、挿入に合わせて接着剤が溶融し、温度が下がるとそのまま硬化して接合される。
（４）例４
　例４では、棒材２７１の中間部２７１ｃが蓋部材２７３に気密状に装着されている。棒材２７１の中間部２７１ｃは、蓋部材２７３の上・下面に対して垂直に延伸する。棒材２７１は、ここでは、円板状の台座２７５の中央を通り、互いに直交する２本の仮想線上に複数個設けられており（１本の仮想線に対して４個の棒材が設けられている）、一方の仮想線に沿った断面を図１１に示している。 The adhesives 259 and 265 can be used regardless of an organic material (for example, a resin material) or an inorganic material (for example, cement or glass). When a resin material is used for the adhesives 259 and 265, both a thermosetting type and a thermoplastic type can be used. When the thermoplastic type is used, the concave portions 257 and 263 are filled with adhesive in advance, and then the upper end portion 251a and the lower end portion 251b of the bar 251 are heated and inserted into the concave portions 257 and 263. As the adhesive melts and the temperature drops, it cures and joins as it is.
(4) Example 4
In Example 4, the intermediate portion 271c of the bar 271 is attached to the lid member 273 in an airtight manner. The intermediate portion 271c of the bar 271 extends perpendicularly to the upper and lower surfaces of the lid member 273. Here, a plurality of bars 271 are provided on two imaginary lines that pass through the center of the disk-shaped base 275 and are orthogonal to each other (four bars are provided for one imaginary line). 11), a cross section along one imaginary line is shown in FIG.
　棒材２７１の中間部２７１ｃは、横断面が円形をした円柱状をしている。 The intermediate portion 271c of the bar 271 has a columnar shape with a circular cross section.
　棒材２７１の上端部２７１ａは、台座２７５の下面の凹入部２７７に下方から挿入された状態で固定される。なお、凹入部２７７の大きさは、棒材２７１の上端部２７１ａが嵌る程度である。 The upper end portion 271a of the bar 271 is fixed in a state of being inserted from below into the recessed portion 277 on the lower surface of the base 275. The size of the recessed portion 277 is such that the upper end portion 271a of the bar 271 fits.
　固定方法は、凹入部２７７に棒材２７１が挿入された状態で、台座２７５をかしめ治具２７９を利用してかしめることで行われる。つまり、台座２７５は塑性変形可能な材料、例えば、金属材料により構成されており、台座２７５を側面側から圧縮することにより、凹入部２７７の開口が小さくなるように台座２７５が変形して、凹入部２７７内の棒材２７１を圧縮し、棒材２７１の上端部２７１ａが固定される。 The fixing method is performed by caulking the pedestal 275 using the caulking jig 279 in a state where the bar 271 is inserted into the recessed portion 277. That is, the pedestal 275 is made of a plastically deformable material, for example, a metal material. By compressing the pedestal 275 from the side surface, the pedestal 275 is deformed so that the opening of the recessed portion 277 becomes small, and the dent The bar 271 in the insertion part 277 is compressed, and the upper end 271a of the bar 271 is fixed.
　棒材２５１の下端部２５１ｂは、伝熱部材２８１の上面の凹入部２８３に上方から挿入された状態で固定される。なお、凹入部２８３の大きさは、棒材２７１の下端部２７１ｂが嵌る程度である。 The lower end portion 251b of the bar 251 is fixed in a state of being inserted from above into the recessed portion 283 on the upper surface of the heat transfer member 281. The size of the recessed portion 283 is such that the lower end portion 271b of the bar 271 fits.
　固定方法は、凹入部２８３に棒材２７１が挿入された状態で、伝熱部材２８１をかしめ治具２８５を利用してかしめることで行われる。つまり、伝熱部材２８１は塑性変形可能な材料、例えば、金属材料により構成されており、伝熱部材２８１を側面側から圧縮することにより、凹入部２８３の開口側が小さくなるように伝熱部材２８１が変形して、凹入部２８３内の棒材２７１を圧縮し、棒材２７１の下端部２７１ｂが固定される。
（５）その他
　上記の例では、棒材２０１，２３１，２５１，２７１は、上端部が容器内に位置することとなる台座に、下端部が容器外に位置することとなる伝熱部材とにそれぞれ接続されていたが、第１の実施形態のように、棒材は蓋部材と支持部本体とを連結しても良い。 The fixing method is performed by caulking the heat transfer member 281 using the caulking jig 285 in a state where the bar 271 is inserted into the recessed portion 283. That is, the heat transfer member 281 is made of a plastically deformable material, for example, a metal material, and the heat transfer member 281 is compressed so that the opening side of the recessed portion 283 is reduced by compressing the heat transfer member 281 from the side surface side. Is deformed, the bar 271 in the recessed portion 283 is compressed, and the lower end 271b of the bar 271 is fixed.
(5) Others In the above example, the bars 201, 231, 251 and 271 are used for the base where the upper end is located in the container and the heat transfer member whose lower end is located outside the container. Although each was connected, the bar may connect the lid member and the support body as in the first embodiment.
　さらには、棒材が台座と伝熱部材とに結合される場合、例えば、台座との接合には例１の技術を利用して、伝熱部材との接合には例４の技術をそれぞれ利用しても良い。つまり、第１の実施形態、第２の実施形態、第２の実施形態中で説明した形態を適宜組み合わせても良い。
≪第３の実施形態≫
　実施形態等では、特に、ＬＥＤランプについて説明したが、本第１の発明は、上記ＬＥＤランプを利用した照明装置にも適用できる。 Furthermore, when the bar is coupled to the pedestal and the heat transfer member, for example, the technique of Example 1 is used for joining to the pedestal, and the technique of Example 4 is used to join to the heat transfer member. You may do it. That is, you may combine suitably the form demonstrated in 1st Embodiment, 2nd Embodiment, and 2nd Embodiment.
<< Third Embodiment >>
In the embodiment and the like, the LED lamp has been particularly described. However, the first invention can also be applied to an illumination device using the LED lamp.
　第３の実施形態では、第１の実施形態に係るＬＥＤランプ１を照明器具（ダウンライトタイプである。）に装着する場合について説明する。 In the third embodiment, a case where the LED lamp 1 according to the first embodiment is mounted on a lighting fixture (downlight type) will be described.
　図１２は、第３の実施形態に係る照明装置の概略図である。 FIG. 12 is a schematic diagram of a lighting device according to the third embodiment.
　照明装置３０１は、例えば、天井３０３に装着されて使用される。 The lighting device 301 is used by being mounted on the ceiling 303, for example.
　照明装置３０１は、図１２に示すように、ＬＥＤランプ（例えば、第１の実施形態で説明したＬＥＤランプ１である。）１と、ＬＥＤランプ１を装着して点灯・消灯をさせる照明器具３０５とを備える。 As illustrated in FIG. 12, the lighting device 301 includes an LED lamp 1 (for example, the LED lamp 1 described in the first embodiment) 1 and a lighting fixture 305 that is mounted with the LED lamp 1 to be turned on / off. With.
　照明器具３０５は、例えば、天井３０３に取着される器具本体３０７と、器具本体３０７に装着され且つＬＥＤランプ１を覆うカバー３０９とを備える。カバー３０９は、ここでは開口型であり、ＬＥＤランプ１から出射された光を所定方向（ここでは下方である。）に反射させる反射膜３１３を内面に有している。 The lighting fixture 305 includes, for example, a fixture main body 307 attached to the ceiling 303 and a cover 309 attached to the fixture main body 307 and covering the LED lamp 1. The cover 309 is an open type here, and has a reflection film 313 on the inner surface that reflects light emitted from the LED lamp 1 in a predetermined direction (here, downward).
　器具本体３０７には、ＬＥＤランプ１の口金７が取着（螺着）されるソケット３１１を備え、このソケット３１１を介してＬＥＤランプ１に給電される。 The appliance body 307 includes a socket 311 to which the base 7 of the LED lamp 1 is attached (screwed), and the LED lamp 1 is supplied with power through the socket 311.
　本実施形態では、照明器具３０５に装着されるＬＥＤランプ１のＬＥＤ２３（ＬＥＤモジュール１１）の配置位置が白熱電球のフィラメントの配置位置に近いため、ＬＥＤランプ１における発光中心と、白熱電球における発光中心とが近いものとなる。 In the present embodiment, since the arrangement position of the LED 23 (LED module 11) of the LED lamp 1 mounted on the lighting fixture 305 is close to the arrangement position of the filament of the incandescent bulb, the emission center in the LED lamp 1 and the emission center in the incandescent bulb. Are close to each other.
　このため、白熱電球が装着されていた照明器具（３０５）にＬＥＤランプ１を装着しても、ランプとしての発光中心の位置が似ているため、白熱電球に似た配光特性が得られる。 For this reason, even if the LED lamp 1 is mounted on the lighting fixture (305) on which the incandescent lamp is mounted, the light distribution center similar to the incandescent lamp can be obtained because the position of the light emission center as the lamp is similar.
　なお、ここでの照明器具は、一例であり、例えば、開口型のカバー３０９を有さずに、閉塞型のカバーを有するものであっても良いし、ＬＥＤランプが横を向くような姿勢（ランプの中心軸が水平となるような姿勢）や傾斜する姿勢（ランプの中心軸が照明器具の中心軸に対して傾斜する姿勢）で点灯させるような照明器具でも良い。 Note that the lighting fixture here is an example. For example, the lighting fixture may not have the opening-type cover 309 but may have a closed-type cover, or a posture in which the LED lamp faces sideways ( It may be a lighting fixture that is lit in a posture in which the central axis of the lamp is horizontal) or an inclined posture (a posture in which the central axis of the lamp is inclined with respect to the central axis of the lighting fixture).
　また、照明装置は、天井や壁に接触する状態で照明器具が装着される直付タイプであったが、天井や壁に埋め込まれた状態で照明器具が装着される埋込タイプであっても良いし、照明器具の電気ケーブルにより天井から吊り下げられる吊下タイプ等であっても良い。 In addition, the lighting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall, but it may be an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or the wall. It may be a hanging type that can be hung from the ceiling by an electric cable of a lighting fixture.
　さらに、ここでは、照明器具は、装着される１つのＬＥＤランプを点灯させているが、複数、例えば、３個のＬＥＤランプが装着されるようにものであっても良い。
≪変形例≫
　以上、本第１の発明の構成を、第１～第３の実施形態に基づいて説明したが、本第１の発明は上記実施形態に限られない。例えば、第１～第３の実施形態に係るＬＥＤランプや照明装置の部分的な構成および下記の変形例に係る構成を、適宜組み合わせてなるＬＥＤランプや照明装置であっても良い。 Furthermore, although the lighting fixture is lighting one LED lamp with which it is mounted here, a plurality of, for example, three LED lamps may be mounted.
≪Modification≫
The configuration of the first invention has been described based on the first to third embodiments. However, the first invention is not limited to the above embodiment. For example, the LED lamp and the lighting device may be appropriately combined with the partial configuration of the LED lamp and the lighting device according to the first to third embodiments and the configuration according to the following modification.
　また、上記実施形態に記載した材料、数値等は好ましいものを例示しているだけであり、それに限定されることはない。さらに、本第１の発明の技術的思想の範囲を逸脱しない範囲で、ＬＥＤランプや照明装置の構成に適宜変更を加えることは可能である。
１．容器
（１）材料
　実施形態では、グローブ３５，１２１と蓋部材３７，１２３とをガラス材料で構成していたが、バルブ（容器）の気密性を保持することができれば、他の材料を用いても良い。 In addition, the materials, numerical values, and the like described in the above embodiments are merely preferable examples, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the LED lamp and the lighting device without departing from the scope of the technical idea of the first invention.
1. Container (1) Material In the embodiment, the globes 35 and 121 and the lid members 37 and 123 are made of a glass material, but other materials can be used as long as the airtightness of the valve (container) can be maintained. Also good.
　他の材料としては、グローブと蓋部材とを樹脂材料で構成することもできる。樹脂材料の場合、例えば、熱可塑性材料ではグローブと蓋部材との接合部分を加熱溶融させることで実施できるし、熱硬化性樹脂では接着剤を利用することで実施できる。さらに、容器内周面にガスバリアー用の樹脂を形成して気密性を高めても良い。
（２）形状（タイプ）
　実施形態では、容器３，１０３をＡタイプの形状としたが、他のタイプ、例えばＧタイプ、Ｒタイプ等の形状であっても良いし、電球等の形状と全く異なるような形状であっても良い。さらに、蓋部材３７，１２３を円板状（所謂、ボタンステムである。）で構成していたが、例えば、所謂フレアステムのような形状のものであっても良いし、他のタイプの形状をしても良い。
２．流体
　実施形態では、容器内に封入される流体としてヘリウムガスが利用されていたが、空気よりも熱伝導率が高い他の種類のガス（気体）を封入しても良い。他のガスとしては水素、ネオン等がある。 As another material, the globe and the lid member can be made of a resin material. In the case of a resin material, for example, a thermoplastic material can be implemented by heating and melting a joint portion between a glove and a lid member, and a thermosetting resin can be implemented by using an adhesive. Further, a gas barrier resin may be formed on the inner peripheral surface of the container to improve the airtightness.
(2) Shape (type)
In the embodiment, the containers 3 and 103 have an A-type shape, but other types, for example, a G-type and an R-type shape may be used. Also good. Further, the lid members 37 and 123 are formed in a disc shape (a so-called button stem), but may have a shape such as a so-called flare stem or other types of shapes. You may do it.
2. In the fluid embodiment, helium gas is used as the fluid sealed in the container. However, other types of gas (gas) having higher thermal conductivity than air may be sealed. Examples of other gases include hydrogen and neon.
　また、流体として、ガス（気体）以外に液体を利用することもできる。空気よりも熱伝導率が高い液体としては、シリコーンオイル、水等である。
３．棒材
（１）本数
　実施形態での棒材４０，１０９の本数は８本又は９本であったが、この本数以外であっても良く、例えば１本でも良く、また複数本でも良い。ただし、支持部本体を安定して支持するには３本以上あるのが好ましい。
（２）断面形状
　実施形態での棒材４０，１０９における蓋部材３７，１２３との接合部分の断面形状は円形状である。接合部分の断面形状は円形状に限定するものではない。しかしながら、蓋部材への封着時の密着性を考慮すると、円形状、楕円形状や長円形状が好ましい。
（３）材料
　実施形態では、ガラス材料である蓋部材３７，１２３との封着性を考慮してジュメット材料により棒材４０，１０９を構成したが、例えば、蓋部材との接合部分にのみジュメット材料を用い、他の部分を別の材料、例えば、アルミニウム、スチール、タングステン材料で構成しても良い。この場合、複数の材料からなる部材を溶接等で接合して１本の所定の長さの棒材にする必要がある。
（４）配置
　第１の実施形態では複数の棒材４０は円周上に配され、第２の実施の形態での他の接合例では複数の棒材が互いに交差する（例えば、直交する）２本の仮想線上に配されている。しかしながら、複数の棒材は、支持部本体を安定して固定できれば良く、その配置について特に限定するものではない。
４．支持部本体
　第１の実施形態では、支持部本体４１は、台座４２と延伸棒４３とが別部材で構成されている。延伸棒４３は、ＬＥＤモジュール１１の熱を台座４２や流体（実施形態ではヘリウムガスである。）に伝える機能を有する。また、台座４２に伝わった熱を棒材４０に伝える機能を有している。 Moreover, liquid can also be utilized other than gas (gas) as a fluid. Examples of the liquid having higher thermal conductivity than air include silicone oil and water.
3. Number of bars (1) The number of bars 40 and 109 in the embodiment is 8 or 9, but may be other than this number, for example, 1 or a plurality. However, it is preferable that there are three or more in order to stably support the support body.
(2) Cross-sectional shape The cross-sectional shape of the joint portion between the bar members 40 and 109 and the lid members 37 and 123 in the embodiment is circular. The cross-sectional shape of the joint portion is not limited to a circular shape. However, considering the adhesion at the time of sealing to the lid member, a circular shape, an elliptical shape, or an oval shape is preferable.
(3) Material In the embodiment, the bars 40 and 109 are made of the jumet material in consideration of the sealing property with the lid members 37 and 123, which are glass materials. However, for example, the dumet is formed only at the joint portion with the lid member. The material may be used, and other parts may be composed of another material, such as aluminum, steel, tungsten material. In this case, it is necessary to join members made of a plurality of materials by welding or the like to form a single bar having a predetermined length.
(4) Arrangement In the first embodiment, the plurality of bar members 40 are arranged on the circumference, and in other joint examples in the second embodiment, the plurality of bar members intersect with each other (for example, orthogonal). Arranged on two virtual lines. However, the plurality of bar members are not particularly limited as long as the support body can be stably fixed.
4). Support Unit Main Body In the first embodiment, the support unit main body 41 includes a pedestal 42 and an extending rod 43 that are formed of separate members. The extending rod 43 has a function of transmitting heat of the LED module 11 to the pedestal 42 and a fluid (in the embodiment, helium gas). Moreover, it has the function to transmit the heat transmitted to the base 42 to the bar 40.
　しかしながら、例えば、ＬＥＤモジュール１１の熱をケース５側に伝えたくない場合がある。例としては、回路ユニット構成する電子部品の耐熱性が劣るような場合である。このような場合、台座を熱伝導率の劣る材料（具体的には延伸棒よりも熱伝導率が低い材料である。）で構成すれば良い。このように、支持部本体を別材料である台座と延伸棒とで構成する場合、各部材の材料を適宜決定して種々の機能を持たせるようにすることができる。
５．容器とケースの結合
　第１の実施形態では、容器３とケース５とが接着剤５６により固着されている。このため、点灯時に容器３の熱が容器３からケース５にも伝わるような構成となっている。しかしながら、容器内に熱伝導率の高い流体を封入すると、容器の温度が上がり、その熱がケースに伝わりケースの温度が上昇するおそれもある。このような場合、ケース内の回路ユニットへの熱負荷を削減するために、バルブとグローブとの間に熱伝導率の低い材料を介在させて、両者を接合しても良い。 However, for example, there is a case where it is not desired to transfer the heat of the LED module 11 to the case 5 side. As an example, it is a case where the heat resistance of the electronic component which comprises a circuit unit is inferior. In such a case, the pedestal may be made of a material having inferior thermal conductivity (specifically, a material having lower thermal conductivity than the stretching rod). As described above, when the support body is composed of a pedestal and a stretching rod, which are different materials, the material of each member can be appropriately determined to have various functions.
5. Connection of Container and Case In the first embodiment, the container 3 and the case 5 are fixed by an adhesive 56. For this reason, the structure is such that the heat of the container 3 is transmitted from the container 3 to the case 5 when the lamp is lit. However, if a fluid with high thermal conductivity is sealed in the container, the temperature of the container rises and the heat is transmitted to the case, which may increase the temperature of the case. In such a case, in order to reduce the thermal load on the circuit unit in the case, a material having low thermal conductivity may be interposed between the valve and the globe, and the two may be joined.
　逆に、ケース内の回路ユニットの温度に余裕がある場合、容器とケースとの接着剤に金属製フィラーを混入して、容器からグローブへの熱伝導を多くするようにしても良い。
６．ＬＥＤモジュール
（１）発光素子
　実施形態等では、発光素子はＬＥＤ２３であったが、例えば、ＬＤ（レーザダイオード）であっても良く、ＥＬ素子（エレクトリックルミネッセンス素子）であっても良い。 On the contrary, when there is room in the temperature of the circuit unit in the case, a metal filler may be mixed into the adhesive between the container and the case to increase the heat conduction from the container to the globe.
6). LED Module (1) Light Emitting Element In the embodiment and the like, the light emitting element is the LED 23, but may be, for example, an LD (laser diode) or an EL element (electric luminescence element).
　また、ＬＥＤ２３はチップタイプで実装基板に実装されていたが、ＬＥＤは例えば、表面実装タイプ（いわゆる、ＳＭＤである。）や砲弾タイプで実装基板に実装されても良い。さらに、複数のＬＥＤは、チップタイプと表面実装タイプとの混合であっても良い。
（２）実装基板
　第１及び第２の実施形態での実装基板２１は平面視において矩形状をしている。 Moreover, although LED23 was mounted on the mounting board by the chip type, LED may be mounted on the mounting board by the surface mounting type (what is called SMD) or a shell type, for example. Further, the plurality of LEDs may be a mixture of a chip type and a surface mount type.
(2) Mounting Board The mounting board 21 in the first and second embodiments has a rectangular shape in plan view.
　しかしながら、実装基板は、他の形状、例えば、正方形状、５角形等の多角形（正多角形状を含む。）、楕円形状、円形状、環状等であっても良い。 However, the mounting substrate may have another shape, for example, a square shape (including a regular polygon shape), an elliptical shape, a circular shape, an annular shape, or the like.
　また、実装基板数も１個に限定するものでなく、２以上の複数個であっても良い。さらに、実施形態では、実装基板２１の表面にＬＥＤ２３を実装していたが、実装基板の裏面にもＬＥＤを実装するようにしても良い。
（３）封止体
　第１及び第２の実施形態では、封止体２５は２列状に配されたＬＥＤ２３を列単位で被覆していたが、２列分をまとめて被覆しても良いし、複数の一定数のＬＥＤ群に対して１つの封止体で被覆しても良いし、すべてのＬＥＤに対して１つの封止体で被覆しても良い。
（４）ＬＥＤの配置
　第１及び第２実施形態では、複数のＬＥＤ２３は２列状に配されていたが、四角形の４辺に沿って配置し、平面視したときに四角形状になるように配されていても良いし、楕円（円を含む）の円周上に位置するように配されていても良い。さらには、マトリクス状に配されても良い。
（５）その他
　ＬＥＤモジュール１１は、青色光を出射するＬＥＤ２３と、青色光を黄色光に波長変換する蛍光体粒子とを利用することで白色光を出射するようにしていたが、例えば、紫外線発光の半導体発光素子と三原色（赤色、緑色、青色）に発光する各色蛍光体粒子とを組み合わせたものでも良い。 Further, the number of mounting boards is not limited to one, and may be two or more. Furthermore, in the embodiment, the LEDs 23 are mounted on the front surface of the mounting substrate 21, but the LEDs may be mounted on the back surface of the mounting substrate.
(3) Sealing body In the first and second embodiments, the sealing body 25 covers the LEDs 23 arranged in two rows in a row unit. However, two rows may be covered together. And you may coat | cover with one sealing body with respect to several fixed number LED groups, and you may coat | cover with one sealing body with respect to all LED.
(4) Arrangement of LEDs In the first and second embodiments, the plurality of LEDs 23 are arranged in two rows. However, the LEDs 23 are arranged along the four sides of the quadrangle so that when viewed in plan, the quadrangular shape is obtained. It may be arranged, and may be arranged so that it may be located on the circumference of an ellipse (a circle is included). Furthermore, it may be arranged in a matrix.
(5) Others The LED module 11 emits white light by using the LED 23 that emits blue light and the phosphor particles that convert the wavelength of the blue light into yellow light. A combination of the semiconductor light emitting element and the phosphor particles of three colors that emit light in the three primary colors (red, green, and blue) may be used.
　さらに、波長変換材料として半導体、金属錯体、有機染料、顔料など、ある波長の光を吸収し、吸収した光とは異なる波長の光を発する物質を含んでいる材料を利用しても良い。
７．ケース
　第１及び第２の実施形態等では、ケース５，１０５は樹脂材料により構成していたが、他の材料で構成することもできる。他の材料として、金属材料を利用する場合、口金との絶縁性を確保する必要がある。口金との絶縁性は、例えば、ケースの小径部に絶縁膜を塗布したり、小径部に対して絶縁処理をしたりすることで確保できる他、ケースのグローブ側を金属材料により、ケースの口金側を樹脂材料によりそれぞれ構成（２以上の部材を結合する。）することでも確保できる。 Further, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment, may be used as the wavelength conversion material.
7). Case In the first and second embodiments and the like, the cases 5 and 105 are made of a resin material, but may be made of other materials. When using a metal material as another material, it is necessary to ensure insulation from the base. Insulation with the base can be ensured by, for example, applying an insulating film to the small-diameter portion of the case or by insulating the small-diameter portion. It can also be ensured by configuring each side with a resin material (two or more members are combined).
　上記実施形態では、ケース５，１０５の表面について特に説明しなかったが、例えば、放熱フィンを設けても良いし、輻射率を向上させるための処理を行っても良い。
８．口金
　第１の実施形態等では，エジソンタイプの口金７を利用したが、他のタイプ、例えば、ピンタイプ（具体的にはＧＹ、ＧＸ等のＧタイプである。）を利用しても良い。 In the above embodiment, the surface of the cases 5 and 105 is not particularly described. However, for example, a heat radiating fin may be provided, or a process for improving the radiation rate may be performed.
8). In the first embodiment and the like, the Edison type base 7 is used, but other types, for example, a pin type (specifically, G type such as GY, GX, etc.) may be used.
　また、上記実施形態では、口金７は、シェル部７１の雌ネジを利用してケース５，１０５のネジ部に螺合させることで、ケース５，１０５に装着（接合）されていたが、他の方法でケースと接合されても良い。他の方法としては、接着剤による接合、カシメによる接合、圧入による接合等があり、これらの方法を２つ以上組合せても良い。
[第２の発明を実施するための形態]
　上記課題における目的を達成するため、上記第１の発明について説明してきたが、別の発明によっても目的を達成できる。 Moreover, in the said embodiment, the nozzle | cap | die 7 was mounted | worn (joined) to the cases 5 and 105 by screwing in the screw part of the cases 5 and 105 using the internal thread of the shell part 71, but others The case may be joined to the case. Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.
[Mode for carrying out the second invention]
Although the first invention has been described in order to achieve the object in the above problem, the object can be achieved by another invention.
　上記の目的を達成するため、本第２の発明に係るランプは、グローブ開口が蓋部材により塞がれてなる容器内に、光源としての半導体発光素子を実装する実装基板が前記蓋部材から延伸している支持部により支持されてなるランプであって、前記容器内には、空気よりも高い熱伝導性を有する流体が封入され、前記実装基板における素子実装面を含む仮想面と前記容器の内周面とで区画される領域であって前記支持部が存しない領域内に前記実装基板から立設する立設部を有することを特徴としている。 In order to achieve the above object, in the lamp according to the second invention, a mounting substrate on which a semiconductor light emitting element as a light source is mounted extends from the lid member in a container in which a globe opening is closed by the lid member. A lamp that is supported by a supporting portion, wherein a fluid having higher thermal conductivity than air is sealed in the container, and a virtual surface including an element mounting surface on the mounting substrate and the container It is characterized by having a standing portion standing from the mounting substrate in a region partitioned by an inner peripheral surface and where the support portion does not exist.
　ここでいう「立設」は、実装基板に対して直交する方向に延伸する場合、実装基板に対して交差する方向に延伸する場合、直線状に延伸する場合、曲線的に延伸する場合、直線状に延伸する部分と曲線的に延伸する部分との両方を有するように延伸する場合を含む。 “Standing” as used herein means that when extending in a direction orthogonal to the mounting substrate, extending in a direction intersecting the mounting substrate, extending linearly, extending linearly, A case where the film is stretched so as to have both a part extending in a shape and a part extending in a curve.
　さらに、「実装基板から立設する」には、実装基板を貫通しない状態で立設する場合、実装基板を貫通する状態で立設する場合、貫通する状態と貫通しない状態を組み合わせた場合を含む。 Furthermore, “standing from the mounting substrate” includes a case where the mounting substrate is erected without penetrating, a case where the mounting substrate is erected, and a case where the penetrating state and the state of not penetrating are combined. .
　一方、上記の目的を達成するため、本第２の発明に係る照明装置は、ランプと、前記ランプを装着して点灯させる照明器具とを備える照明装置であって、前記ランプは、上記構成のランプであることを特徴としている。 On the other hand, in order to achieve the above object, a lighting device according to the second aspect of the present invention is a lighting device including a lamp and a lighting fixture that is lit by mounting the lamp, and the lamp has the above-described configuration. It is characterized by being a lamp.
　上記の構成によれば、空気よりも高い熱伝導率を有する流体が容器内に封入されているので、半導体発光素子から発生した熱の一部は、半導体発光素子、実装基板、支持部及び立設部から流体を介して容器へ伝導させることができる。この結果、容器を利用して発光時の熱を外部へと放熱することができる。 According to the above configuration, since the fluid having a higher thermal conductivity than air is sealed in the container, a part of the heat generated from the semiconductor light emitting element is part of the semiconductor light emitting element, the mounting substrate, the support portion, and the stand. It can be made to conduct to a container via a fluid from an installation part. As a result, the heat at the time of light emission can be radiated outside using the container.
　特に、前記実装基板における素子実装面を含む仮想面と前記容器の内周面とで区画される領域であって前記支持部が存しない領域に立設部が存するため、この領域の流体を有効に利用することができ、半導体発光素子から発生した熱を、容器内の広い範囲にわたって流体に伝えることができる。 In particular, since a standing portion exists in a region that is partitioned by a virtual surface including an element mounting surface on the mounting substrate and an inner peripheral surface of the container and does not have the support portion, the fluid in this region is effective. The heat generated from the semiconductor light emitting device can be transferred to the fluid over a wide range in the container.
　このように、上記構成を有することにより、半導体発光素子の発光時の熱を容器に広範囲に伝えることができ、ランプの大型化を招くことなく、半導体発光素子の高輝度化に対応し得る。 Thus, by having the above-described configuration, heat at the time of light emission of the semiconductor light-emitting element can be transmitted to the container over a wide range, and it is possible to cope with higher brightness of the semiconductor light-emitting element without causing an increase in size of the lamp.
　また、前記立設部は、前記実装基板の中央部分から立設することを特徴とし、あるいは、前記立設部は複数あり、前記実装基板の周縁部分から立設することを特徴とし、さらに、前記実装基板は貫通孔を有し、前記貫通孔を介して前記支持部と前記立設部とが連続することを特徴としている。 Further, the standing portion is characterized in that it stands up from the center portion of the mounting substrate, or there are a plurality of the standing portions, characterized in that it stands up from the peripheral portion of the mounting substrate, The mounting substrate has a through hole, and the support portion and the standing portion are continuous through the through hole.
　また、前記支持部と前記立設部とが、前記貫通孔を挿通する１つの部材により構成されていることを特徴とし、あるいは、前記部材は、前記容器を貫通して外部へと延伸している延伸部を有することを特徴とし、さらには、前記立設部は棒状をしていることを特徴としている。
≪第４の実施形態≫
１．全体構成
　図１３は、第４の実施形態に係るＬＥＤランプ４０１の正面図であり、内部の様子が分かるように一部切り欠いている。 Further, the support portion and the standing portion are configured by one member that passes through the through hole, or the member extends through the container to the outside. It is characterized by having the extending part which has, and further, it is characterized by the above-mentioned standing part being rod-like.
<< Fourth Embodiment >>
1. Overall Configuration FIG. 13 is a front view of an LED lamp 401 according to the fourth embodiment, and is partially cut away so that the inside can be seen.
　第４の実施形態に係るＬＥＤランプ４０１は、第１の実施形態で説明したＬＥＤランプ１に対して、立設部材を設けたものである。このため、ＬＥＤランプ１の構成と同じものに対しては、第１の実施形態で説明した符号を用いる。 The LED lamp 401 according to the fourth embodiment is provided with a standing member with respect to the LED lamp 1 described in the first embodiment. For this reason, the code | symbol demonstrated in 1st Embodiment is used with respect to the same thing as the structure of the LED lamp 1. FIG.
　ＬＥＤランプ４０１は、図１３に示すように、グローブ３５の開口が蓋部材３７により塞がれてなる容器３内に、光源としての半導体発光素子であるＬＥＤを実装する実装基板２１が蓋部材３７から延伸している支持部である支持部材９により支持されてなる。 As shown in FIG. 13, the LED lamp 401 includes a mounting substrate 21 on which an LED, which is a semiconductor light emitting element as a light source, is mounted in a container 3 in which an opening of a globe 35 is closed by a lid member 37. It is supported by a support member 9 which is a support portion extending from the outside.
　容器３内には、空気よりも高い熱伝導性を有する流体が封入され、実装基板２１における素子実装面を含む仮想面と前記容器の内周面とで区画される領域であって支持部材９が存しない領域内に実装基板２１から立設する立設部材４０５を有する。 The container 3 is filled with a fluid having higher thermal conductivity than air, and is a region defined by a virtual surface including an element mounting surface on the mounting substrate 21 and an inner peripheral surface of the container, and the support member 9. And a standing member 405 erected from the mounting substrate 21 in a region where there is no existence.
　ＬＥＤランプ４０１は、上記構成以外に、容器３の一端に装着されたケース５と、ケース５に設けられた口金７とを備える。また、実装基板２１にＬＥＤが実装されてモジュール化されたものをＬＥＤモジュール４１１とする。 The LED lamp 401 includes a case 5 attached to one end of the container 3 and a base 7 provided in the case 5 in addition to the above configuration. Also, an LED module 411 is a module in which LEDs are mounted on the mounting substrate 21.
　本実施形態におけるＬＥＤランプ４０１は、口金７を介して受電してＬＥＤモジュール４１１を発光させるための回路ユニット１３をケース５内に有し、全体形状が従来の白熱電球に似た形状をしている。 The LED lamp 401 in this embodiment has a circuit unit 13 in the case 5 for receiving power through the base 7 and causing the LED module 411 to emit light, and the overall shape is similar to a conventional incandescent bulb. Yes.
　以下、ＬＥＤランプ４０１を構成する各部分について説明する。なお、ここでも、ＬＥＤランプ４０１のランプ軸Ｘ（図２参照）の延伸する方向であって、口金７がある側を下側、グローブがある側を上側とする。
２．各部構成
（１）ＬＥＤモジュール４１１
　図１４は、ＬＥＤモジュールの周辺を示す図であり、（ａ）はＬＥＤモジュールの周辺の平面図であり、（ｂ）は同図の（ａ）におけるＧ－Ｇ’線矢視断面図である。 Hereinafter, each part which comprises the LED lamp 401 is demonstrated. In this case as well, the direction in which the lamp axis X (see FIG. 2) of the LED lamp 401 extends is the lower side, and the side with the globe is the upper side.
2. Configuration of each part (1) LED module 411
14A and 14B are views showing the periphery of the LED module, FIG. 14A is a plan view of the periphery of the LED module, and FIG. 14B is a cross-sectional view taken along the line GG ′ in FIG. .
　ＬＥＤモジュール４１１は、図１３及び図１４、特に図１４に示すように、実装基板２１と、実装基板２１の上面に実装された複数のＬＥＤ２３と、複数のＬＥＤ２３を被覆する封止体２５とを備える。 As shown in FIGS. 13 and 14, particularly FIG. 14, the LED module 411 includes a mounting substrate 21, a plurality of LEDs 23 mounted on the upper surface of the mounting substrate 21, and a sealing body 25 that covers the plurality of LEDs 23. Prepare.
　実装基板２１は、図１４の（ａ）に示すように、平面視形状が例えば矩形状をし、ＬＥＤ２３から下方に発せられた光が透過するように、例えばガラスやアルミナ等の透光性材料により構成されている。 As shown in FIG. 14A, the mounting substrate 21 has a rectangular shape in plan view, and a light-transmitting material such as glass or alumina so that light emitted downward from the LED 23 is transmitted. It is comprised by.
　実装基板２１は、複数のＬＥＤ２３を接続する（直列接続又は／及び並列接続である。）ための接続パターン２７ａと、回路ユニット１３に接続されたリード線６７，６９と接続するための端子パターン２７ｂ，２７ｃとからなる導電路２７を有する。 The mounting board 21 has a connection pattern 27a for connecting a plurality of LEDs 23 (series connection and / or parallel connection) and a terminal pattern 27b for connecting to lead wires 67 and 69 connected to the circuit unit 13. , 27c.
　なお、導電路２７も、ＬＥＤ２３からの光が透過するように、例えばＩＴＯ等の透光性材料が用いられている。 The conductive path 27 is also made of a translucent material such as ITO so that light from the LED 23 can be transmitted.
　リード線６７，６９は、図１４の（ｂ）に示すように、実装基板２１の貫通孔２９を下側から上側へと挿通する先端部が端子パターン２７ｂ，２７ｃに半田３１により接続される。 As shown in FIG. 14B, the lead wires 67 and 69 are connected to the terminal patterns 27 b and 27 c by solder 31 at the tip portions that pass through the through holes 29 of the mounting substrate 21 from the lower side to the upper side.
　ＬＥＤ２３は、所謂、チップの形態で実装基板２１に実装されている。複数のＬＥＤ２３は、図１４の（ｂ）で示すように、間隔（例えば、等間隔である。）をおいて、実装基板２１の長手方向と平行に２列状に配置されている。なお、ＬＥＤ２３の個数、配列等は、ＬＥＤランプ４０１に要求される輝度等により適宜決定される。 The LED 23 is mounted on the mounting substrate 21 in the form of a so-called chip. As shown in FIG. 14B, the plurality of LEDs 23 are arranged in two rows in parallel with the longitudinal direction of the mounting substrate 21 at intervals (for example, at equal intervals). Note that the number, arrangement, and the like of the LEDs 23 are appropriately determined depending on the luminance required for the LED lamp 401.
　封止体２５は、例えばシリコーン樹脂等の透光性材料からなり、２列状に配されたＬＥＤ２３を列単位で被覆し、ＬＥＤ２３への空気・水分の侵入を防止している。 The sealing body 25 is made of a translucent material such as silicone resin, for example, and covers the LEDs 23 arranged in two rows in a row unit to prevent air and moisture from entering the LEDs 23.
　封止体２５は、ＬＥＤ２３から発せられた光の波長を変換する必要がある場合は波長変換機能を有する。波長変換機能は、例えば、蛍光体粒子等の波長変換材料を透光性材料に混入することで実施できる。 The sealing body 25 has a wavelength conversion function when it is necessary to convert the wavelength of the light emitted from the LED 23. A wavelength conversion function can be implemented by mixing wavelength conversion materials, such as fluorescent substance particles, in a translucent material, for example.
　例えば、ＬＥＤ２３は青色光を発光色とする場合、ＬＥＤ２３の青色光を黄色光に変換する波長変換材料が利用される。これにより、ＬＥＤモジュール４１１は、ＬＥＤ２３から発せられた青色光と、波長変換材料により波長変換された黄色光とにより混色された白色光を出射することとなる。 For example, when the LED 23 uses blue light as the emission color, a wavelength conversion material that converts the blue light of the LED 23 into yellow light is used. As a result, the LED module 411 emits white light mixed with blue light emitted from the LED 23 and yellow light wavelength-converted by the wavelength conversion material.
　ＬＥＤモジュール４１１は、図１４の（ｂ）に示すように、中央部に非円形状の貫通孔４３３が形成されており、断面が非円形の立設部材４０５が前記貫通孔４３３を挿通する。つまり、立設部材４０５がＬＥＤモジュール４１１に立設した構造となる。なお、断面が非円形の立設部材４０５が貫通孔４３３を挿通することで、ＬＥＤモジュール４１１がランプ軸廻りに回転するのを規制される。
（２）容器３
　容器３は、図１３に示すように、開口を有するグローブ３５と、ＬＥＤモジュール４１１をグローブ３５の略中央に格納する状態でグローブ３５の開口を気密状に塞ぐ蓋部材３７とを有し、内部に空気よりも熱伝導率の高いヘリウム（Ｈｅ）ガスが封入されている。これにより、点灯時のＬＥＤモジュール４１１の熱を効率良くグローブ３５に伝えることができる。 As shown in FIG. 14B, the LED module 411 has a non-circular through hole 433 formed at the center, and a standing member 405 having a non-circular cross section passes through the through hole 433. That is, the standing member 405 is standing on the LED module 411. In addition, when the standing member 405 having a non-circular cross section is inserted through the through hole 433, the LED module 411 is restricted from rotating around the lamp shaft.
(2) Container 3
As shown in FIG. 13, the container 3 includes a globe 35 having an opening, and a lid member 37 that hermetically closes the opening of the globe 35 in a state in which the LED module 411 is stored in the approximate center of the globe 35. In addition, helium (He) gas having a higher thermal conductivity than air is enclosed. Thereby, the heat of the LED module 411 at the time of lighting can be efficiently transmitted to the globe 35.
　グローブ３５は、所謂、Ａタイプであり、透光性材料であるガラス材料により構成されている。グローブ３５は、図１３に示すように、中空状の球状部３５ａと、球状部３５ａから下方に延伸する筒状部３５ｂとを有し、筒状部３５ｂの下端開口が蓋部材３７により塞がれている（封止されている）。 The globe 35 is a so-called A type, and is made of a glass material that is a translucent material. As shown in FIG. 13, the globe 35 includes a hollow spherical portion 35 a and a cylindrical portion 35 b extending downward from the spherical portion 35 a, and the lower end opening of the cylindrical portion 35 b is closed by a lid member 37. It is sealed (sealed).
　蓋部材３７は、所謂、ボタンタイプのステムであり、透光性材料であるガラス材料で構成されている。蓋部材３７は、平面視において円形状をした板状（つまり、円板状である。）をしている。蓋部材３７には、容器３内の排気等に利用された排気管３９が設けられている他、ＬＥＤモジュール４１１への電力供給用のリード線６７，６９が貫通状態で封着され、支持部材９を構成する棒材４０が取着されている。 The lid member 37 is a so-called button-type stem, and is made of a glass material that is a translucent material. The lid member 37 has a circular plate shape (that is, a disk shape) in plan view. The lid member 37 is provided with an exhaust pipe 39 used for exhausting the inside of the container 3, and lead wires 67 and 69 for supplying power to the LED module 411 are sealed in a penetrating state. The bar 40 which comprises 9 is attached.
　グローブ３５と蓋部材３７との接合は、両者の接合予定部位を加熱して、当該部位のガラス材料を溶融させることで行われる。
（３）支持部材９
　支持部材９、グローブ３５、蓋部材３７等は第１の実施形態と同じ構成である。このため、第１の実施形態の説明に利用した図をそのまま用いて説明する。つまり、グローブの開口側端部を切り欠き、容器の蓋部材周辺を示す斜視図が図３に相当する。また、図１３のＦ－Ｆ'線矢視断面図は、図４に相当する。図４のＣ－Ｃ'線に対応する線での本ＬＥＤランプ４０１の矢視断面図は図５に相当する。図５のＤ－Ｄ'に対応する線での本ＬＥＤランプ４０１の矢視断面図は図６に相当する。 The joint between the globe 35 and the lid member 37 is performed by heating the joint portions of the two and melting the glass material at the portions.
(3) Support member 9
The support member 9, the globe 35, the lid member 37, and the like have the same configuration as in the first embodiment. For this reason, it demonstrates using the figure utilized for description of 1st Embodiment as it is. That is, a perspective view showing the periphery of the lid member of the container by cutting out the opening side end of the globe corresponds to FIG. Further, the cross-sectional view taken along the line FF ′ in FIG. 13 corresponds to FIG. A cross-sectional view of the LED lamp 401 taken along the line corresponding to the line CC ′ of FIG. 4 corresponds to FIG. A cross-sectional view of the LED lamp 401 taken along the line corresponding to DD ′ in FIG. 5 corresponds to FIG.
　支持部材９は、図１３に示すように、蓋部材３７に取着された複数の棒材４０と、複数の棒材４０における口金７と反対側に取着され且つＬＥＤモジュール４１１を支持する支持部本体４１とを有する。複数の棒材４０は、蓋部材３７との密着力が支持部本体４１と蓋部材３７との密着力よりも高い材料で構成されている。 As shown in FIG. 13, the support member 9 is attached to the plurality of bar members 40 attached to the lid member 37, and is attached to the side opposite to the base 7 in the plurality of bar members 40 and supports the LED module 411. A main body 41. The plurality of bar members 40 are made of a material that has a higher contact force with the lid member 37 than a contact force between the support body 41 and the lid member 37.
　棒材４０は、複数本あり、本第４の実施形態では８本ある。８本の棒材４０は、図６に示すように、円形状の蓋部材３７の軸心を中心Ｏとする円周上を周方向に沿って配置されている。ここでは、棒材４０は、等間隔をおいて周方向に配されている。 There are a plurality of bars 40, and there are eight bars in the fourth embodiment. As shown in FIG. 6, the eight rod members 40 are arranged along the circumferential direction on the circumference having the center O as the axis of the circular lid member 37. Here, the bar 40 is arranged in the circumferential direction at equal intervals.
　棒材４０は、図５に示すように、上端部４０ａが台座４２の穴４５に挿入された状態で溶接され、下端部４０ｂが蓋部材３７に挿入されて固着されている。 As shown in FIG. 5, the bar 40 is welded in a state where the upper end portion 40 a is inserted into the hole 45 of the base 42, and the lower end portion 40 b is inserted into the lid member 37 and fixed.
　棒材４０は、金属材料、特に、電力供給用のリード線６７，６９と同じ材料であるジュメット材料により構成されている（従来の白熱電球や電球形蛍光ランプに利用され、ガラスとの密着性に実績がある。）。これにより、点灯時のＬＥＤモジュール４１１の熱を、棒材４０を介して容器３へと伝えることができる。 The bar 40 is made of a metal material, in particular, a jumet material that is the same material as the power supply lead wires 67 and 69 (used in conventional incandescent bulbs and bulb-type fluorescent lamps, and adheres to glass. Has a track record.) Thereby, the heat of the LED module 411 at the time of lighting can be transmitted to the container 3 through the bar 40.
　支持部本体４１は、平板状の台座４２と、当該台座４２からグローブ３５内部へと（口金７と反対側へと）延伸する延伸棒４３とを備え、延伸棒４３の先端にＬＥＤモジュール４１１が取着されている。 The support body 41 includes a flat base 42 and a stretching bar 43 that extends from the base 42 to the inside of the globe 35 (to the side opposite to the base 7). The LED module 411 is attached to the tip of the stretching bar 43. It is attached.
　台座４２は、円板状をし、その中央部に延伸棒４３が接合されている。延伸棒４３と台座４２とは、金属材料、例えばアルミニウム材料から構成され、両者の接合は例えば、溶接により行われている。 The pedestal 42 has a disk shape, and an extending rod 43 is joined to the center thereof. The extending | stretching rod 43 and the base 42 are comprised from a metal material, for example, aluminum material, and both joining is performed by welding, for example.
　台座４２は、電力供給用のリード線６７，６９が貫通する貫通孔４７，４９を台座４２の中心を結ぶ仮想線分上であって中心を挟んだ位置に有している。 The pedestal 42 has through holes 47 and 49 through which the lead wires 67 and 69 for supplying power pass, on a virtual line segment connecting the centers of the pedestals 42 and sandwiching the center.
　延伸棒４３は、図４に示すように断面が円形をした柱状である。上部４３ｂは、図１３に示すように、他部４３ａより太く扁平状をしている。上部４３ｂの幅は、ＬＥＤモジュール４１１の幅（実装基板２１の短手方向の寸法である。）と略同じであり、上部４３ｂの長さ（図１３及び図１４の（ｂ）で現われている部分の寸法である。）が幅よりも大きくなっている。 The stretching rod 43 has a columnar shape with a circular cross section as shown in FIG. As shown in FIG. 13, the upper portion 43b is thicker and flatter than the other portion 43a. The width of the upper portion 43b is substantially the same as the width of the LED module 411 (the dimension in the short direction of the mounting substrate 21), and appears in the length of the upper portion 43b (FIG. 13 and FIG. 14B). Is the size of the part.) Is larger than the width.
　延伸棒４３の中央部分（他部４３ａ）の横断面の面積は、棒材４０の横断面の面積の合計よりも広く、延伸棒４３の中央部分（他部４３ａ）の表面積は、棒材４０の表面積の合計よりも広くなっている。 The area of the cross section of the central portion (other portion 43a) of the extending rod 43 is larger than the total area of the cross sections of the rod members 40, and the surface area of the central portion (other portion 43a) of the extending rod 43 is larger than that of the rod member 40. It is wider than the total surface area.
　上部４３ｂの上面は平坦面であり、図１４の（ｂ）に示すように、その中央に立設部材４０５の底面に形成されている嵌合凹部４０９に嵌合する嵌合凸部５１を有する。
（４）立設部材４０５
　立設部材４０５は、ＬＥＤモジュール４１１から上方に延伸する。ここでは、立設部材４０５は、支持部材９の延伸棒４３の上端面から、ＬＥＤモジュール４１１の実装基板２１を貫通して延伸する。本第４の実施形態における立設部材４０５は、ＬＥＤモジュール４１１（実装基板２１）に対して直交する方向に延伸する。つまり、立設部材４０５と支持部材９とが貫通孔４３３を介して連続している。 The upper surface of the upper part 43b is a flat surface, and as shown in FIG. 14 (b), has a fitting convex part 51 that fits into a fitting concave part 409 formed on the bottom surface of the standing member 405 at the center. .
(4) Standing member 405
The standing member 405 extends upward from the LED module 411. Here, the standing member 405 extends from the upper end surface of the extending rod 43 of the support member 9 through the mounting substrate 21 of the LED module 411. The standing member 405 in the fourth embodiment extends in a direction orthogonal to the LED module 411 (mounting substrate 21). That is, the standing member 405 and the support member 9 are continuous via the through hole 433.
　立設部材４０５は、図１３に示すように、ＬＥＤモジュール４１１に対して直交する方向であって直線状に延伸している。立設部材４０５は棒状をしている。これらの構成により、ＬＥＤモジュール４１１から発せられた光の遮光量を少なくできる。 As shown in FIG. 13, the standing member 405 extends in a straight line in a direction orthogonal to the LED module 411. The standing member 405 has a rod shape. With these configurations, the amount of light emitted from the LED module 411 can be reduced.
　立設部材４０５は、嵌合手段を利用して支持部材９に装着されている。具体的な嵌合手段は、延伸棒４３の上端の嵌合凸部５１と、立設部材４０５の下端の嵌合凹部４０９とが嵌合する。嵌合凸部５１における延伸棒４３の延伸方向と直交する断面形状と、嵌合凹部４０９における延伸棒４３の延伸方向と直交する断面形状とは、互いに非円形をしている。これにより、延伸方向廻りに立設部材４０５が回転するのを規制している。なお、ここでは、嵌合凹部４０９と嵌合凸部５１との断面形状は、四角形状（正方形状）をしている。 The standing member 405 is attached to the support member 9 using fitting means. As a specific fitting means, the fitting convex portion 51 at the upper end of the extending rod 43 and the fitting concave portion 409 at the lower end of the standing member 405 are fitted. The cross-sectional shape perpendicular to the extending direction of the extending rod 43 in the fitting convex portion 51 and the cross-sectional shape orthogonal to the extending direction of the extending rod 43 in the fitting concave portion 409 are non-circular. This restricts rotation of the standing member 405 around the extending direction. In addition, the cross-sectional shape of the fitting recessed part 409 and the fitting convex part 51 is a square shape (square shape) here.
　立設部材４０５と延伸棒４３との結合は、立設部材４０５と延伸棒４３とが金属材料である場合は、例えば、焼嵌、溶接や接着で行うことができ、樹脂材料である場合は、例えば、接着で行うことができる。
（５）ケース５
　ケース５は、図１３に示すように、筒状をし、中心軸方向におけるグローブ３５側半分が大径部５ａに、口金７側半分が小径部５ｂにそれぞれなっている。ケース５は、樹脂材料、例えばポリブチレンテレフタレート（ＰＢＴ）により構成されている。 When the standing member 405 and the extending rod 43 are made of a metal material, for example, the standing member 405 and the extending rod 43 can be joined by shrink fitting, welding, or bonding. For example, it can be performed by adhesion.
(5) Case 5
As shown in FIG. 13, the case 5 has a cylindrical shape, and the half on the globe 35 side in the central axis direction is the large diameter portion 5a, and the half on the base 7 side is the small diameter portion 5b. The case 5 is made of a resin material such as polybutylene terephthalate (PBT).
　大径部５ａは容器３の下端部に対して外嵌する状態で取着され、小径部５ｂは口金７により覆われる状態で口金７と接合している。小径部５ｂの外周には雄ネジが形成され、エジソンタイプの口金７の雌ネジと螺合する。 The large diameter portion 5 a is attached in a state of being fitted to the lower end portion of the container 3, and the small diameter portion 5 b is joined to the base 7 while being covered with the base 7. A male screw is formed on the outer periphery of the small-diameter portion 5b, and is screwed with the female screw of the Edison type cap 7.
　ケース５の小径部５ｂの外周には、口金７と接続するリード線６５を固定するための固定溝５ｃがケース５の中心軸と平行に形成され、ケース５の内部には、回路ユニット１３の回路基板５５を固定するための固定手段（係止手段1５３）が設けられている。固定手段については、回路ユニット１３の説明の際に行う。
（６）回路ユニット１３
　回路ユニット１３は、図１３に示すように、回路基板５５と、当該回路基板５５に実装された各種の電子部品５７，５９とを備え、各種電子部品５７，５９によって、口金７を介して受電した商業電力（交流）を整流する整流回路、整流された直流電力を平滑化する平滑回路等の各種回路が構成される。 A fixing groove 5c for fixing the lead wire 65 connected to the base 7 is formed in the outer periphery of the small diameter portion 5b of the case 5 in parallel with the central axis of the case 5. Fixing means (locking means 153) for fixing the circuit board 55 is provided. The fixing means will be described when the circuit unit 13 is described.
(6) Circuit unit 13
As shown in FIG. 13, the circuit unit 13 includes a circuit board 55 and various electronic components 57 and 59 mounted on the circuit board 55, and receives power via the base 7 by the various electronic components 57 and 59. Various circuits such as a rectifying circuit that rectifies commercial power (AC) and a smoothing circuit that smoothes the rectified DC power are configured.
　整流回路は回路基板５５の上面側のダイオードブリッジ５７により、平滑回路は回路基板５５の下面側のコンデンサ５９によりそれぞれ構成され、コンデンサ５９の本体部が口金７の内部に位置する。 The rectifier circuit is constituted by a diode bridge 57 on the upper surface side of the circuit board 55, and the smoothing circuit is constituted by a capacitor 59 on the lower surface side of the circuit board 55, and the main body of the capacitor 59 is located inside the base 7.
　回路基板５５は、ケース５の内部の係止手段５３により固定される。具体的には、ケース５の内部の段差部６１に回路基板５５の下面の周縁部分が当接し、係止部６２により回路基板の５５の上面が係止されている。係止部６２は、周方向に間隔（例えば、等間隔である。）をおいて複数個（例えば４個である。）形成され、段差部６１に近づくに従ってケース５の中心軸側に張り出す。 The circuit board 55 is fixed by the locking means 53 inside the case 5. Specifically, the peripheral portion of the lower surface of the circuit board 55 contacts the stepped portion 61 inside the case 5, and the upper surface of the circuit board 55 is locked by the locking portion 62. A plurality of (for example, four) locking portions 62 are formed at intervals (for example, at equal intervals) in the circumferential direction, and project toward the central axis side of the case 5 as approaching the stepped portion 61. .
　回路ユニット１３は、口金７とはリード線６３，６５で、ＬＥＤモジュール４１１とはリード線６７，６９で接続されている。
（７）口金７
　口金７は、ＬＥＤランプ４０１の照明器具への取付機能を有する（図２０参照）他、商業電源と電気的に接続する機能を有する。口金７は、白熱電球で利用されているエジソンタイプであり、筒状であって周壁がネジ状をしたシェル部７１と、シェル部７１に絶縁材料７３を介して装着されたアイレット部７５とからなる。 The circuit unit 13 is connected to the base 7 by lead wires 63 and 65 and to the LED module 411 by lead wires 67 and 69.
(7) Base 7
The base 7 has a function of attaching the LED lamp 401 to a lighting fixture (see FIG. 20) and also has a function of electrically connecting to a commercial power source. The base 7 is an Edison type used in incandescent bulbs, and includes a shell portion 71 having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 75 attached to the shell portion 71 via an insulating material 73. Become.
　回路ユニット１３と接続する一方のリード線６５は、ケース５の小径部５ｂの開口端で外周面側へと折り返されて、ケース５の固定溝５ｃに嵌められた状態でシェル部７１に覆われることで、シェル部７１に接続される。他方のリード線６３は、半田付けによりアイレット部７５に接続される。 One lead wire 65 connected to the circuit unit 13 is folded back to the outer peripheral surface side at the opening end of the small diameter portion 5 b of the case 5 and covered with the shell portion 71 in a state of being fitted in the fixing groove 5 c of the case 5. Thus, it is connected to the shell portion 71. The other lead wire 63 is connected to the eyelet part 75 by soldering.
　口金７は、シェル部７１がケース５の小径部５ｂに螺合する状態で、シェル部７１の上端部がカシメられて、ケース５に取り付けられる。
３．製造方法
　本第４の実施形態に係るＬＥＤランプ４０１の製造方法の一例について説明する。 The base 7 is attached to the case 5 with the upper end portion of the shell portion 71 being crimped in a state where the shell portion 71 is screwed into the small diameter portion 5 b of the case 5.
3. Manufacturing Method An example of a manufacturing method of the LED lamp 401 according to the fourth embodiment will be described.
　ＬＥＤランプ４０１は、蓋部材３７に取着された支持部材９よりＬＥＤモジュール４１１が支持されたもの（以下、「モジュール付蓋部材」とする。）を製作するモジュール付蓋部材製作工程と、モジュール付蓋部材をグローブ３５の開口側端部に封着して容器を製作する容器製作工程と、容器内を排気した後ヘリウムガスを封入するヘリウム封入工程（ヘリウムガスが封入された容器を「バルブ」とする。）と、回路ユニット１３をケース５に組み込む回路組込工程と、バルブをケースに取着するバルブ取着工程と、口金７をケース５に取着する口金取着工程とを含む。 The LED lamp 401 includes a module-attached lid member production process for producing an LED lamp 411 supported by the support member 9 attached to the lid member 37 (hereinafter referred to as a “module lid member”), and a module. A container manufacturing process for manufacturing the container by sealing the attached lid member to the opening side end of the globe 35, and a helium sealing process for sealing the helium gas after exhausting the inside of the container (the valve in which helium gas is sealed And a circuit assembly process for incorporating the circuit unit 13 into the case 5, a valve attachment process for attaching the valve to the case, and a base attachment process for attaching the base 7 to the case 5. .
　上記の工程のうち、回路組込工程、バルブ取着工程及び口金取着工程は従来からある公知技術を利用できるため、ここでの説明は省略する。
（１）モジュール付蓋部材製作工程
　モジュール付蓋部材製作工程では、例えば、排気管３９用の細管を蓋部材３７に気密状に取着する細管取着工程と、支持部材９を蓋部材３７に取着する支持部材取着工程と、支持部材９にＬＥＤモジュール４１１を取着するモジュール取着工程と、ＬＥＤモジュール４１１とリード線６７，６９とを接続する接続工程とを含む。 Among the above steps, the circuit incorporation step, the valve attachment step, and the base attachment step can use conventional well-known techniques, and thus description thereof is omitted here.
(1) Module-equipped lid member production process In the module-equipped lid member production process, for example, a thin tube attachment process for attaching the narrow tube for the exhaust pipe 39 to the lid member 37 in an airtight manner, and the support member 9 as the lid member 37 A supporting member attaching step for attaching, a module attaching step for attaching the LED module 411 to the supporting member 9, and a connecting step for connecting the LED module 411 and the lead wires 67, 69 are included.
　これらの工程は、上記した順で必ずしも行う必要はなく、例えば、細管取着工程は棒材取着工程の後に行っても良いし、あるいは、支持部材９にＬＥＤモジュール４１１を取着した後に支持部材９を蓋部材３７に装着しても良い。 These steps are not necessarily performed in the above-described order. For example, the thin tube attaching step may be performed after the bar attaching step, or may be supported after attaching the LED module 411 to the supporting member 9. The member 9 may be attached to the lid member 37.
　立設部材４０５を支持部材９に取着する工程は、支持部材取着工程の前であっても良いし、支持部材取着工程とモジュール取着工程との間であっても良い。さらに、立設部材４０５を支持部材９に例えば接着剤により固着する場合、モジュール取着工程後であっても良いし、接続工程の後であっても良い。 The step of attaching the standing member 405 to the support member 9 may be before the support member attachment step, or may be between the support member attachment step and the module attachment step. Furthermore, when the standing member 405 is fixed to the support member 9 with, for example, an adhesive, it may be after the module attaching step or after the connecting step.
　支持部材取着工程は、例えば、棒材４０に支持部本体４１を取着する本体取着工程と、棒材４０を蓋部材３７に気密状に取着する棒材取着工程とを含む。なお、先に棒材４０を蓋部材３７に取着した後に、棒材４０を蓋部材３７に取着するようにしても良い。 The support member attaching step includes, for example, a main body attaching step for attaching the supporting portion main body 41 to the rod member 40 and a rod member attaching step for attaching the rod member 40 to the lid member 37 in an airtight manner. The bar 40 may be attached to the lid member 37 after the bar 40 is first attached to the lid member 37.
　本体取着工程では、例えば、棒材４０の上端部４０ａを支持部本体４１の台座４２に溶接により取着する。棒材取着工程では、例えば、棒材４０の下端部４０ｂを加熱し、そのまま、ガラス材料である蓋部材３７に押当て、下端部４０ｂとの接触部分のガラス材料が溶融させながら、下端部４０ｂを蓋部材３７内に押し込む。 In the main body attachment process, for example, the upper end portion 40a of the bar 40 is attached to the base 42 of the support portion main body 41 by welding. In the bar attaching process, for example, the lower end 40b of the bar 40 is heated and directly pressed against the lid member 37, which is a glass material, while the glass material at the contact portion with the lower end 40b is melted, 40 b is pushed into the lid member 37.
　なお、本体取着工程では、棒材４０と支持部本体４１とを溶接で取着しているが、例えば、接着剤を利用して支持部本体４１と棒材４０とを接合する場合、棒材４０を蓋部材３７に取着した後、棒材４０に支持部本体４１を取着することも可能である。 In the main body attaching step, the bar 40 and the support part main body 41 are attached by welding. For example, when the support part main body 41 and the bar 40 are joined using an adhesive, It is also possible to attach the support body 41 to the bar 40 after attaching the material 40 to the lid member 37.
　本第４の実施形態では、蓋部材３７をガラス材料で構成し、棒材４０をジュメット材料で構成している。このため、例えば、支持部本体４１として、熱伝導性の優れるもののガラス材料との密着性が劣るような材料も利用することができる。あるいは、支持部本体４１として、棒材４０よりも安価でガラス材料との密着性が劣るような材料も利用することができる。 In the fourth embodiment, the lid member 37 is made of a glass material, and the bar 40 is made of a jumet material. For this reason, for example, a material having excellent heat conductivity but poor adhesion to the glass material can be used as the support body 41. Alternatively, a material that is less expensive than the bar 40 and has poor adhesion to the glass material can be used as the support body 41.
　このように、蓋部材３７と接合する棒材４０だけを蓋部材３７と密着性の高い材料を用いれば、支持部本体４１として、熱伝導性、価格、加工性等の操作性等の他の機能を重視した材料を選択しても、支持部材９は蓋部材３７から外れるようなことを防ぐことができる。
（２）容器作成工程
　容器製作工程では、グローブ３５と蓋部材３７とがガラス材料で構成されているため、グローブ３５の開口周縁部と蓋部材３７の外周縁とを当接させた状態で、当接部分を含めた当接部周辺部を加熱・溶融して両者を溶着している。
（３）ヘリウム封入工程
　ヘリウム封入工程では、まず、細管（３９）を介して、容器３内の空気を排出し、その後ヘリウムガスを注入し、最後に細管（３９）における容器３の外部に位置する部分をチップオフ封止することで行うことができる。
４．放熱特性
　本第４の実施形態に係るＬＥＤランプ４０１は、点灯時に発生するＬＥＤ２３の熱と回路ユニット１３の熱を複数経路から放出している。
（１）ＬＥＤ２３で発生した熱
　ＬＥＤ２３で発生した熱は、ＬＥＤモジュール４１１から容器３内のヘリウムガスを経由してグローブ３５に伝わり（第１の経路である。）、さらに、ＬＥＤモジュール４１１から支持部材９、蓋部材３７を経由してグローブ３５に伝わる（第２の経路である。）。両経路からグローブ３５に伝導された熱は、グローブ３５の外面から伝導・対流・輻射により大気へと放出される。 In this way, if only the bar 40 to be joined to the lid member 37 is made of a material having high adhesion to the lid member 37, the support portion main body 41 can be used for other operability such as thermal conductivity, price, workability, etc. Even if a material with an emphasis on function is selected, the support member 9 can be prevented from coming off the lid member 37.
(2) Container creation process In the container production process, since the globe 35 and the lid member 37 are made of a glass material, the opening peripheral edge of the globe 35 and the outer peripheral edge of the lid member 37 are in contact with each other. The peripheral part of the contact part including the contact part is heated and melted to weld both.
(3) Helium sealing step In the helium sealing step, first, the air in the container 3 is discharged through the thin tube (39), and then helium gas is injected. Finally, the helium gas is placed outside the container 3 in the thin tube (39). This can be done by chip-off sealing the part to be performed.
4). Heat Dissipation Characteristics The LED lamp 401 according to the fourth embodiment radiates the heat of the LED 23 and the heat of the circuit unit 13 generated during lighting from a plurality of paths.
(1) Heat generated in the LED 23 Heat generated in the LED 23 is transmitted from the LED module 411 to the globe 35 via the helium gas in the container 3 (first path), and further supported from the LED module 411. It is transmitted to the globe 35 via the member 9 and the lid member 37 (second route). The heat conducted from both paths to the globe 35 is released from the outer surface of the globe 35 to the atmosphere by conduction, convection, and radiation.
　特に、熱伝導性の優れたヘリウムガスを介して熱をグローブ３５に伝導させる構造としているため、ＬＥＤ２３の熱をグローブ内の空気を介して伝える構造よりも伝熱作用を大幅に向上させることができる。 In particular, since the structure is such that heat is conducted to the globe 35 via helium gas having excellent thermal conductivity, the heat transfer effect can be significantly improved as compared with the structure in which the heat of the LED 23 is conducted via the air in the globe. it can.
　また、ＬＥＤモジュール４１１をグローブ３５の球状部３５ａの略中央に配置しているため、容器３内のヘリウムに均等に熱を伝え易くなり、グローブ３５から大気へと放熱特性を高めることができる。 In addition, since the LED module 411 is disposed substantially at the center of the spherical portion 35a of the globe 35, heat can be easily transferred evenly to the helium in the container 3, and the heat dissipation characteristics from the globe 35 to the atmosphere can be improved.
　さらに、グローブ３５を白熱電球のガラスバルブに似た大きさ・形状としているため、グローブ３５の包絡体積が大きくなり、グローブ３５から大気へと放熱特性を高めることができる。 Furthermore, since the globe 35 has a size and shape similar to a glass bulb of an incandescent bulb, the envelope volume of the globe 35 is increased, and the heat radiation characteristics from the globe 35 to the atmosphere can be enhanced.
　しかも、立設部材４０５は、ＬＥＤモジュール４１１における素子実装面（実装基板の上面である。）を含む仮想面と容器３の内周面とで区画される領域であって支持部材９が存しない領域に延伸するため、この領域の流体を有効に利用することができ、ＬＥＤ２３から発生した熱を、容器３内の広い範囲にわたって流体に伝えることができる。 Moreover, the standing member 405 is a region defined by a virtual surface including the element mounting surface (the upper surface of the mounting substrate) in the LED module 411 and the inner peripheral surface of the container 3, and the support member 9 does not exist. Since the region extends, the fluid in this region can be used effectively, and the heat generated from the LED 23 can be transmitted to the fluid over a wide range in the container 3.
　特に、立設部材４０５は、実装基板２１の略中央部分から立設しているため、立設部材４０５からヘリウムガスへ均等に熱を伝達することができ、容器３の表面において温度が局部的に高くなるようなことを防ぐことができる。 In particular, since the standing member 405 is erected from the substantially central portion of the mounting substrate 21, heat can be evenly transferred from the erected member 405 to the helium gas, and the temperature is locally localized on the surface of the container 3. Can be prevented.
　また、実装基板２１の貫通孔４３３を介して支持部材９と立設部材４０５とが連続するため、例えば、立設部材４０５の温度が低く、支持部材９の温度が高い場合は、支持部材９の熱が温度の低い立設部材４０５側へと移動し、立設部材４０５からヘリウムガスへと熱を伝えることができる。
（２）回路ユニット１３で発生した熱
　回路ユニット１３から発生した熱は、伝熱、対流、輻射によりケース５に伝わる。ケース５に伝わった熱の一部がケース５から外部へと対流・輻射により放出し、残りの熱が口金７から照明器具側のソケットへと伝わる（図２０参照）。 In addition, since the support member 9 and the standing member 405 are continuous through the through hole 433 of the mounting substrate 21, for example, when the temperature of the standing member 405 is low and the temperature of the support member 9 is high, the support member 9 This heat moves to the standing member 405 side where the temperature is low, and heat can be transferred from the standing member 405 to the helium gas.
(2) Heat generated in the circuit unit 13 The heat generated from the circuit unit 13 is transferred to the case 5 by heat transfer, convection, and radiation. Part of the heat transmitted to the case 5 is released from the case 5 to the outside by convection and radiation, and the remaining heat is transmitted from the base 7 to the socket on the lighting fixture side (see FIG. 20).
　ＬＥＤランプ４０１では、グローブ３５の大きさ・形状を白熱電球に合わせ、グローブ３５の略中央にＬＥＤモジュール４１１を備えているため、ＬＥＤモジュール４１１と回路ユニット１３との間の距離が大きくなり、回路ユニット１３がＬＥＤ２３から受ける熱負荷を削減することができる。
５．その他
　上記形態では、棒材４０の下端部４０ｂが容器３の外部に延出しないように蓋部材３７に接合されていたが、棒材を容器から外部へと延出させて、その延出先をケースに熱的に接合させても良い。
≪第５の実施形態≫
　第４の実施形態に係るＬＥＤランプ４０１での支持部は、支持部本体４１と複数の棒材４０とからなる支持部材９により構成され、立設部は立設部材４０５により構成され、支持部材９と立設部材４０５とが別部材である。 In the LED lamp 401, the size and shape of the globe 35 are matched to the incandescent bulb, and the LED module 411 is provided in the approximate center of the globe 35. Therefore, the distance between the LED module 411 and the circuit unit 13 increases, and the circuit The thermal load that the unit 13 receives from the LED 23 can be reduced.
5. Others In the above embodiment, the lower end portion 40b of the bar 40 is joined to the lid member 37 so as not to extend to the outside of the container 3, but the bar is extended from the container to the outside, and the extension destination is It may be thermally bonded to the case.
<< Fifth Embodiment >>
The support portion in the LED lamp 401 according to the fourth embodiment is configured by the support member 9 including the support portion main body 41 and the plurality of bar members 40, and the standing portion is configured by the standing member 405. 9 and the standing member 405 are separate members.
　しかしながら、支持部材と立設部材とを１つの部材で構成しても良く、例えば、複数の棒部材によりＬＥＤモジュールを支持するようにし、さらに、当該複数の棒部材により立設部を構成しても良い。つまり、棒部材のＬＥＤモジュール５１１より下方（蓋部材５３７側である。）で支持部を、ＬＥＤモジュール５１１より上方（グローブ５３５の頂部側である。）で立設部をそれぞれ構成しても良い。 However, the supporting member and the standing member may be configured as one member. For example, the LED module is supported by a plurality of rod members, and the standing portion is configured by the plurality of rod members. Also good. That is, the support portion may be formed below the LED module 511 of the bar member (on the lid member 537 side), and the standing portion may be formed above the LED module 511 (on the top side of the globe 535). .
　以下、複数の棒部材を立設部及び支持部に利用したランプを第５の実施形態として説明する。
１．構成
　図１５は、第５の実施形態に係るＬＥＤランプ５０１の構造を示す斜視図である。図１６は、ＬＥＤランプ５０１の断面図である。 Hereinafter, a lamp using a plurality of rod members for the standing portion and the support portion will be described as a fifth embodiment.
1. Configuration FIG. 15 is a perspective view showing a structure of an LED lamp 501 according to the fifth embodiment. FIG. 16 is a cross-sectional view of the LED lamp 501.
　ＬＥＤランプ５０１は、図１５及び図１６に示すように、容器５０３、ケース５０５、口金７、棒部材５０９、ＬＥＤモジュール５１１、回路ユニット１３等備え、棒部材５０９の上部がＬＥＤモジュール５１１よりも上方（口金７と反対側である。）へと延伸している。 As shown in FIGS. 15 and 16, the LED lamp 501 includes a container 503, a case 505, a base 7, a bar member 509, an LED module 511, a circuit unit 13, and the like, and the upper part of the bar member 509 is above the LED module 511. (It is the side opposite to the base 7).
　ＬＥＤランプ５０１は、上記構成以外に、発光時のＬＥＤモジュール５１１からの熱をＬＥＤモジュール５１１、棒部材５０９を経由してケース５０５側へと伝える伝熱板５１３をケース５０５内に備える。 In addition to the above configuration, the LED lamp 501 includes a heat transfer plate 513 in the case 505 that transmits heat from the LED module 511 during light emission to the case 505 side via the LED module 511 and the bar member 509.
　以下、第５の実施形態に係るＬＥＤランプ５０１の構成であって、第４の実施形態に係るＬＥＤランプ４０１の構成と異なる構成について説明する。 Hereinafter, the configuration of the LED lamp 501 according to the fifth embodiment, which is different from the configuration of the LED lamp 401 according to the fourth embodiment, will be described.
　なお、第４の実施形態で説明した構成と同じ部材については、第４の実施形態や第１の実施形態と同様の符号を付し、ここでの説明は省略する。また、図面記入されている符号が第４の実施形態や第１の実施形態で用いた図面に記入されている符号と同じ場合は、その構成は第４の実施形態や第１の実施形態で説明した構成と同じである。
（１）ＬＥＤモジュール５１１
　ＬＥＤモジュール５１１は、図１５及び図１６に示すように、実装基板５２１と、実装基板５２１の上面に実装された複数のＬＥＤ（２３）と、複数のＬＥＤを被覆する封止体２５とを備える。 In addition, about the same member as the structure demonstrated in 4th Embodiment, the code | symbol similar to 4th Embodiment or 1st Embodiment is attached | subjected, and description here is abbreviate | omitted. In addition, when the reference numerals entered in the drawings are the same as the reference numerals entered in the drawings used in the fourth embodiment or the first embodiment, the configuration is the same as in the fourth embodiment or the first embodiment. The configuration is the same as described.
(1) LED module 511
As shown in FIGS. 15 and 16, the LED module 511 includes a mounting board 521, a plurality of LEDs (23) mounted on the upper surface of the mounting board 521, and a sealing body 25 that covers the plurality of LEDs. .
　実装基板５２１は、図１５に示すように、第４の実施形態と同様に、平面視形状が例えば矩形状をし、また、透光性材料により構成されている。 As shown in FIG. 15, the mounting substrate 521 has, for example, a rectangular shape in plan view, and is made of a translucent material, as in the fourth embodiment.
　実装基板５２１は、複数のＬＥＤを接続するため等の導電路（２７）を備え、回路ユニット１３に接続されたリード線６７，６９と接続されている。なお、導電路２７も、第４の実施形態と同様に透光性材料により構成され、リード線６７，６９との接続方法等も第４の実施形態と同じである。 The mounting substrate 521 includes a conductive path (27) for connecting a plurality of LEDs, and is connected to lead wires 67 and 69 connected to the circuit unit 13. The conductive path 27 is also made of a light-transmitting material as in the fourth embodiment, and the connection method and the like with the lead wires 67 and 69 are the same as in the fourth embodiment.
　ＬＥＤは、第４の実施形態と同様に２列状に実装され、また、封止体２５も第４の実施形態と同様に、複数のＬＥＤを１列ごとに被覆している。
（２）容器５０３
　容器５０３は、図１５及び図１６に示すように、グローブ５３５と、蓋部材５３７とを有し、ヘリウム（Ｈｅ）ガスが封入されている。 The LEDs are mounted in two rows as in the fourth embodiment, and the sealing body 25 covers a plurality of LEDs for each row as in the fourth embodiment.
(2) Container 503
As shown in FIGS. 15 and 16, the container 503 has a globe 535 and a lid member 537 and is filled with helium (He) gas.
　グローブ５３５は、第４の実施形態と同様に、ガラス材料により構成され、球状部５３５ａと筒状部５３５ｂとを有する。筒状部５３５ｂの下端開口が蓋部材５３７により封止されている。 The globe 535 is made of a glass material as in the fourth embodiment, and includes a spherical portion 535a and a cylindrical portion 535b. A lower end opening of the cylindrical portion 535 b is sealed with a lid member 537.
　蓋部材５３７は、所謂、フレアタイプであり、透光性材料であるガラス材料で構成されている。蓋部材５３７には、容器５０３内を排気等するために利用された排気管５３９が設けられている。 The lid member 537 is a so-called flare type, and is made of a glass material that is a translucent material. The lid member 537 is provided with an exhaust pipe 539 used for exhausting the inside of the container 503.
　蓋部材５３７には、電力供給用のリード線６７，６９、ＬＥＤモジュール５１１を支持する支持部として機能する１または複数（ここでは４本）の棒部材５０９とがそれぞれ封着されている。 The lid member 537 is sealed with lead wires 67 and 69 for power supply and one or a plurality (four in this case) of rod members 509 functioning as support portions for supporting the LED module 511.
　蓋部材５３７とグローブ５３５との接合は、両者の接合予定部位を加熱して、当該部位のガラス材料を溶融させることで行われる。
（３）棒部材５０９（支持部と立設部）
　棒部材５０９は、上下方向（ランプ軸方向である。）に延伸する状態でその中間部が蓋部材５３７に封着され、蓋部材５３７がグローブ５３５に装着されることで、容器５０３を貫通する。棒部材５０９は、金属材料、例えばジュメット材料により構成されている。 The lid member 537 and the globe 535 are joined by heating the portions to be joined together and melting the glass material at the portions.
(3) Bar member 509 (supporting portion and standing portion)
The bar member 509 extends in the up-down direction (in the lamp axis direction), and an intermediate portion thereof is sealed to the lid member 537, and the lid member 537 is attached to the globe 535, thereby penetrating the container 503. . The bar member 509 is made of a metal material, for example, a jumet material.
　棒部材５０９は、ＬＥＤモジュール５１１における矩形状をした実装基板５２１の４隅（角）に設けられた貫通孔５２１ａを通って、実装基板５２１の下方から上方へと延伸する。つまり、支持部と立設部とが実装基板５２１の貫通孔５２１ａを介して連続すると共に、１つの棒部材５０９により構成されている。これにより、例えば、立設部５０９ｂの温度が低く、支持部５０９ａの温度が高い場合は、支持部５０９ａの熱が温度の低い立設部５０９ｂ側へと移動し、立設部５０９ｂからヘリウムガスへと熱を伝えることができる。 The rod member 509 extends from the lower side to the upper side of the mounting substrate 521 through the through holes 521a provided at the four corners (corners) of the rectangular mounting substrate 521 in the LED module 511. That is, the support portion and the standing portion are continuous through the through hole 521a of the mounting substrate 521, and are configured by one bar member 509. Thereby, for example, when the temperature of the standing portion 509b is low and the temperature of the supporting portion 509a is high, the heat of the supporting portion 509a moves to the standing portion 509b side where the temperature is low, and helium gas from the standing portion 509b Can convey heat to
　棒部材５０９は、容器５０３の略中央に位置するＬＥＤモジュール５１１から先端（蓋部材５３７と反対側である。）までの部分が立設部５０９ｂに相当し、ＬＥＤモジュール５１１から蓋部材５３７までの部分が支持部５０９ａに相当し、容器５０３から外部へと延伸している部分が延伸部５０９ｄに相当する。 In the bar member 509, the portion from the LED module 511 located at substantially the center of the container 503 to the tip (on the side opposite to the lid member 537) corresponds to the standing portion 509 b, and the LED module 511 to the lid member 537 The portion corresponds to the support portion 509a, and the portion extending from the container 503 to the outside corresponds to the extending portion 509d.
　棒部材５０９の立設部５０９ｂの直径は、支持部５０９ａの直径より小さくなっている。つまり、棒部材５０９の略中央にある段差５０９ｃよりも上方部分が立設部５０９ｂであり、段差５０９ｃよりも下方部分が支持部５０９ａとなっている。 The diameter of the standing portion 509b of the bar member 509 is smaller than the diameter of the support portion 509a. That is, the upper part of the step 509c at the approximate center of the bar member 509 is the standing part 509b, and the lower part of the step 509c is the support part 509a.
　ＬＥＤモジュール５１１の貫通孔５２１ａの大きさは、支持部５０９ａより小さく、立設部５０９ｂよりも大きくなっている。これにより、ＬＥＤモジュール５１１は、実装基板５２１の裏面であって貫通孔５２１ａの周辺部分が支持部５０９ａの上端に位置する段差５０９ｃにより支持される。 The size of the through hole 521a of the LED module 511 is smaller than the support portion 509a and larger than the standing portion 509b. Accordingly, the LED module 511 is supported by the step 509c which is the back surface of the mounting substrate 521 and the peripheral portion of the through hole 521a is positioned at the upper end of the support portion 509a.
　なお、実装基板５２１と棒部材５０９は、貫通孔５２１ａに充填された接着剤５２３により結合されている。これにより、ＬＥＤモジュール５１１が支持部５０９ａに支持・固定される。 Note that the mounting substrate 521 and the rod member 509 are coupled by an adhesive 523 filled in the through hole 521a. Thereby, the LED module 511 is supported and fixed to the support part 509a.
　棒部材５０９の延伸部５０９ｄは、容器５０３（蓋部材５３７）外部へと延出しているため、容器５０３内の熱を取り出すことができ、例えば、支持部５０９ａや立設部５０９ｂからのヘリウムガスへの伝導に余裕がない場合に、延伸部５０９ｄを利用して容器５０３の外部へと熱を取り出すことができる。 Since the extending portion 509d of the bar member 509 extends to the outside of the container 503 (lid member 537), the heat in the container 503 can be taken out, for example, helium gas from the support portion 509a and the standing portion 509b. When there is no allowance for conduction to the heat, heat can be taken out of the container 503 using the extending portion 509d.
　延伸部５０９ｄの下端部は、図１６に示すように、ケース５０５と接触する伝熱板５１３に熱的に接続されている。これにより、点灯時のＬＥＤモジュール５１１の熱を、棒部材５０９を介して容器５０３外へと取り出し、取り出した熱を伝熱板５１３からケース５０５、口金７、照明装置のソケットへと放熱（伝熱）する。
（４）ケース５０５
　ケース５０５は、第４の実施形態と同様に、樹脂材料からなり、大径部５０５ａと小径部５０５ｂとを有する。大径部５０５ａは容器５０３の下端部に対して外嵌する状態で接着剤（５２５）により装着されている。小径部５０５ｂは、第４の実施形態と同様の方法により口金７と接合する。ケース５０５内には、第４の実施形態と同様に、内部に回路ユニット１３を格納する。
（５）伝熱板５１３
　伝熱板５１３は、熱伝導性の優れた材料、ここでは、アルミニウム材料が用いられ、ケース５０５の大径部５０５ａの内周形状に対応した円板状をしている。伝熱板５１３は、図１６に示すように、排気管５３９用の貫通孔５２７を中心した円周上に、ＬＥＤモジュール５１１と回路ユニット１３とを接続するリード線６７，６９用の２個の貫通孔５２９と棒部材５０９用の４個の貫通孔（図示省略）とを等ピッチで有する。 As shown in FIG. 16, the lower end portion of the extending portion 509 d is thermally connected to a heat transfer plate 513 that contacts the case 505. Thereby, the heat of the LED module 511 at the time of lighting is taken out of the container 503 through the bar member 509, and the taken-out heat is radiated (transferred) from the heat transfer plate 513 to the case 505, the base 7, and the socket of the lighting device. heat.
(4) Case 505
Similar to the fourth embodiment, the case 505 is made of a resin material and has a large diameter portion 505a and a small diameter portion 505b. The large-diameter portion 505a is attached with an adhesive (525) in a state of being externally fitted to the lower end portion of the container 503. The small diameter portion 505b is joined to the base 7 by the same method as in the fourth embodiment. In the case 505, as in the fourth embodiment, the circuit unit 13 is stored therein.
(5) Heat transfer plate 513
The heat transfer plate 513 is made of a material having excellent heat conductivity, here, an aluminum material, and has a disk shape corresponding to the inner peripheral shape of the large diameter portion 505a of the case 505. As shown in FIG. 16, the heat transfer plate 513 includes two lead wires 67 and 69 for connecting the LED module 511 and the circuit unit 13 on the circumference around the through hole 527 for the exhaust pipe 539. The through holes 529 and the four through holes (not shown) for the bar member 509 are provided at an equal pitch.
　リード線６７，６９は貫通孔５２９をそのまま通過し、棒部材５０９の延伸部５０９ｄは、その下端部が貫通孔から少し突出した状態で伝熱板５１３の下面に接着剤５３１で固着されている。接着剤５３１は、ケース５０５の熱伝導率と同等もしくはそれ以上の熱伝導率を有している。 The lead wires 67 and 69 pass through the through hole 529 as they are, and the extending portion 509d of the bar member 509 is fixed to the lower surface of the heat transfer plate 513 with an adhesive 531 with its lower end portion slightly protruding from the through hole. . The adhesive 531 has a thermal conductivity equal to or higher than that of the case 505.
　伝熱板５１３は、上部側に小径部５１３ａを、下部側に大径部５１３ｂをそれぞれ有し、小径部５１３ａの外周面が蓋部材５３７の内周面に、大径部５１３ｂの外周面がケース５０５の内周面にそれぞれ接着剤（無機系・有機系どちらでも良い。）５２５を介して固着されている。 The heat transfer plate 513 has a small-diameter portion 513a on the upper side and a large-diameter portion 513b on the lower side, the outer peripheral surface of the small-diameter portion 513a is the inner peripheral surface of the lid member 537, and the outer peripheral surface of the large-diameter portion 513b is The case 505 is fixed to the inner peripheral surface of the case 505 via an adhesive (both inorganic and organic) 525.
　接着剤５２５は、ケース５０５の熱伝導率と同等もしくはそれ以上の熱伝導率を有している。これにより、ＬＥＤモジュール５１１から棒部材５０９、伝熱板５１３を経由してケース５０５へと積極的に熱を伝える熱伝導路が確立される。
２．その他
　上記の第５の実施形態では、棒部材５０９を４本用いたが、棒部材は３本でも良いし、５本以上あっても良い。３本以上用いる場合、全ての棒部材を利用してＬＥＤモジュールを支持しても良いし、一部の本数の棒部材（例えば、２本である。）を利用してＬＥＤモジュールを支持しても良い。 The adhesive 525 has a thermal conductivity equal to or higher than that of the case 505. As a result, a heat conduction path that actively transfers heat from the LED module 511 to the case 505 via the bar member 509 and the heat transfer plate 513 is established.
2. Others In the fifth embodiment, four rod members 509 are used. However, three rod members or five or more rod members may be used. When three or more are used, the LED module may be supported using all the bar members, or the LED module may be supported using a part of the number of bar members (for example, two). Also good.
　上記の第５の実施形態では、４本の立設部はそのまま上方に延伸した状態であるが、例えば、途中で湾曲するようにしても良いし、他の立設部に接合（連続）するように湾曲しても良い。 In the fifth embodiment described above, the four standing portions are in a state of extending upward as they are. For example, the four standing portions may be bent in the middle or joined (continuously) to other standing portions. It may be curved like this.
　図１７は、第５の実施形態に係る棒部材の変形例を示す斜視図である。 FIG. 17 is a perspective view showing a modification of the bar member according to the fifth embodiment.
　図１７に示すＬＥＤモジュール５１１、リード線６７，６９は、第５の実施形態でのＬＥＤモジュール５１１とリード線６７，６９と同じ構成である。 The LED module 511 and the lead wires 67 and 69 shown in FIG. 17 have the same configuration as the LED module 511 and the lead wires 67 and 69 in the fifth embodiment.
　棒部材は２本あり、それぞれが「Ｕ」状をしている。２本の棒部材５６１，５６３において、ＬＥＤモジュール５１１より下方の部分でＬＥＤモジュール５１１を支持する支持部５６１ａ，５６３ａが構成され、ＬＥＤモジュール５１１よりも上方の部分で立設部５６１ｂ，５６３ｂが構成されている。 There are two bar members, each of which has a “U” shape. In the two rod members 561 and 563, support portions 561a and 563a for supporting the LED module 511 are configured at a portion below the LED module 511, and standing portions 561b and 563b are configured at a portion above the LED module 511. Has been.
　立設部５６１ｂ，５６３ｂは、矩形状の実装基板５２１の周縁部分から延伸する。これにより、容器５０３内の広い範囲でヘリウムガスに熱を伝えることができる。また、立設部５６１ｂ，５６３ｂは、実装基板５２１の貫通孔５２１ａを介して支持部５６１ａ，５６３ａと連続する。これにより、例えば、立設部５６１ｂ，５６３ｂと支持部５６１ａ，５６３ａとの温度差を少なくできる。 The standing portions 561b and 563b extend from the peripheral portion of the rectangular mounting board 521. Thereby, heat can be transmitted to the helium gas in a wide range in the container 503. Further, the standing portions 561b and 563b are continuous with the support portions 561a and 563a through the through holes 521a of the mounting substrate 521. Thereby, for example, the temperature difference between the standing portions 561b and 563b and the support portions 561a and 563a can be reduced.
　複数の棒部材５６１，５６３は、支持部５６１ａ，５６３ａと、立設部５６１ｂ，５６３ｂとの間に段差５６１ｃ，５６３ｃを有する。ＬＥＤモジュール５１１の実装基板５２１に設けられている貫通孔５２１ａは、棒部材５６１，５６３の段差５６１ｃ，５６３ｃより小さく、ＬＥＤモジュール５１１は段差５６１ｃ，５６３ｃによって下方から支持される。 The plurality of rod members 561 and 563 have steps 561c and 563c between the support portions 561a and 563a and the standing portions 561b and 563b. The through hole 521a provided in the mounting substrate 521 of the LED module 511 is smaller than the steps 561c and 563c of the bar members 561 and 563, and the LED module 511 is supported from below by the steps 561c and 563c.
　なお、実装基板５２１と棒部材５６１，５６３は、貫通孔５２１ａに充填された接着剤５２３により結合されている。これにより、ＬＥＤモジュール５１１が支持部５６１ａ，５６３ａに支持・固定される。
≪第６の実施形態≫
　第４の実施形態に係るＬＥＤランプ４０１では、支持部材９を棒材４０、台座４２、延伸棒４３の３つの種類の部材で構成されていたが、１つの部材により支持部材（本第２の発明の支持部である。）を構成し、蓋部材に接合するようにしても良い。以下、支持部材を１つの部材により構成して蓋部材に直接接合したランプを第６の実施形態として説明する。 Note that the mounting substrate 521 and the bar members 561 and 563 are joined by an adhesive 523 filled in the through hole 521a. Thereby, the LED module 511 is supported and fixed to the support portions 561a and 563a.
<< Sixth Embodiment >>
In the LED lamp 401 according to the fourth embodiment, the support member 9 is composed of three types of members, that is, the bar 40, the pedestal 42, and the extending bar 43. The support portion of the invention may be configured and joined to the lid member. Hereinafter, a lamp in which the support member is constituted by one member and directly joined to the lid member will be described as a sixth embodiment.
　図１８は、第６の実施形態に係るＬＥＤランプ６０１の構造を示す斜視図である。図１９は、第６の実施形態に係るＬＥＤランプ６０１の断面図である。 FIG. 18 is a perspective view showing a structure of an LED lamp 601 according to the sixth embodiment. FIG. 19 is a cross-sectional view of an LED lamp 601 according to the sixth embodiment.
　ＬＥＤランプ６０１は、図１８及び図１９に示すように、容器６０３、ケース５０５、口金７、支持部材６０５、ＬＥＤモジュール６０７、回路ユニット１３（図示省略）等備え、ＬＥＤモジュール６０７から上方（口金７と反対側である。）へと延伸する立設部材（本第２の発明の立設部に相当する。）６０９を有する。 As shown in FIGS. 18 and 19, the LED lamp 601 includes a container 603, a case 505, a base 7, a support member 605, an LED module 607, a circuit unit 13 (not shown), and the like. And a standing member (corresponding to the standing portion of the second invention) 609 extending to the opposite side.
　以下、第６の実施形態に係るＬＥＤランプ６０１の構成であって、第４の実施形態に係るＬＥＤランプ４０１の構成と第５の実施形態に係るＬＥＤランプ５０１の構成と異なる構成について主に説明する。 The following mainly describes the configuration of the LED lamp 601 according to the sixth embodiment, which is different from the configuration of the LED lamp 401 according to the fourth embodiment and the configuration of the LED lamp 501 according to the fifth embodiment. To do.
　なお、第４及び第５の実施形態で説明した構成と同じ部材については、第４及び第５の実施形態と同様の符号を付し、ここでの説明は省略する。また、図面記入されている符号が第４及び第５の実施形態で用いた図面に記入されている符号と同じ場合は、その構成は第４及び第５の実施形態で説明した構成と同じである。 In addition, about the same member as the structure demonstrated in 4th and 5th embodiment, the code | symbol similar to 4th and 5th embodiment is attached | subjected, and description here is abbreviate | omitted. In addition, when the reference numerals entered in the drawings are the same as the reference numerals entered in the drawings used in the fourth and fifth embodiments, the configuration is the same as that described in the fourth and fifth embodiments. is there.
　ＬＥＤモジュール６０７は、図１８及び図１９に示すように、実装基板６１１と、実装基板６１１の上面に実装された複数のＬＥＤ２３と、複数のＬＥＤを被覆する封止体６１３とを備える。 18 and 19, the LED module 607 includes a mounting substrate 611, a plurality of LEDs 23 mounted on the upper surface of the mounting substrate 611, and a sealing body 613 that covers the plurality of LEDs.
　実装基板６１１は、図１８に示すように円板状をし、第４及び第５の実施形態と同様に透光性材料により構成されている。実装基板６１１の中央部分には、支持部材６０５の上端の平坦面から上方に突出する嵌合凸部６０５ｃと嵌合する嵌合孔６１１ａが設けられている。 The mounting substrate 611 has a disk shape as shown in FIG. 18 and is made of a light-transmitting material as in the fourth and fifth embodiments. A fitting hole 611 a that fits with a fitting convex portion 605 c that protrudes upward from a flat surface at the upper end of the support member 605 is provided in the central portion of the mounting substrate 611.
　ＬＥＤ２３は、図１８に示すように、円板状の実装基板６１１の中央を中心とする円周上を周方向に間隔（例えば、等間隔である。）をおいて配されている。封止体６１３は、円周状に配されたＬＥＤ２３のすべてを覆い、平面視において円環状をしている。 As shown in FIG. 18, the LEDs 23 are arranged on the circumference centered on the center of the disk-shaped mounting substrate 611 at intervals in the circumferential direction (for example, at equal intervals). The sealing body 613 covers all the circumferentially arranged LEDs 23 and has an annular shape in plan view.
　容器６０３は、図１８及び図１９に示すように、グローブ６１７及び蓋部材６１９を有し、第４及び第５の実施形態と同様に、ヘリウム（Ｈｅ）ガスが封入されている。グローブ６１７は、第５の実施形態と同様に、ガラス材料により構成され、下端開口が蓋部材６１９により封止されている。 18 and 19, the container 603 includes a globe 617 and a lid member 619, and helium (He) gas is sealed in the same manner as in the fourth and fifth embodiments. Similarly to the fifth embodiment, the globe 617 is made of a glass material, and the lower end opening is sealed with a lid member 619.
　蓋部材６１９は、所謂、フレアタイプであり、透光性材料であるガラス材料で構成されている。蓋部材６１９には、容器６０３内を排気等するために利用された排気管が設けられている（図１８では、排気管に連通する連通孔６２１があらわれている。）。 The lid member 619 is a so-called flare type, and is made of a glass material that is a translucent material. The lid member 619 is provided with an exhaust pipe used for exhausting the inside of the container 603 (a communication hole 621 communicating with the exhaust pipe is shown in FIG. 18).
　蓋部材６１９には、電力供給用のリード線６７，６９が封着され、蓋部材６１９の頂部に接着剤６２３を介して支持部材６０５が取着されている。 The lid member 619 is sealed with power supply lead wires 67 and 69, and a support member 605 is attached to the top of the lid member 619 via an adhesive 623.
　支持部材６０５は、棒状（柱状）をし、外径の小さな小径部６０５ａと、外径の大きな大径部６０５ｂとを有し、大径部６０５ｂが上部側に位置する。大径部６０５ｂの上端面には嵌合凸部６０５ｃを有している。ＬＥＤモジュール６０７は、図１９に示すように、ＬＥＤモジュール６０７（実装基板６１１）の嵌合孔６１１ａに嵌合凸部６０５ｃが嵌る（挿入された）状態で、ＬＥＤモジュール６０７の裏面（仮面）と支持部材６０５の上面とが接触している。なお、嵌合凸部６０５ｃ及び嵌合孔６１１ａの断面形状は、非円形状（例えば、正方形状である。）をし、互いに回転しないようになっている。 The support member 605 has a rod shape (columnar shape) and has a small-diameter portion 605a having a small outer diameter and a large-diameter portion 605b having a large outer diameter, and the large-diameter portion 605b is located on the upper side. The upper end surface of the large diameter portion 605b has a fitting convex portion 605c. As shown in FIG. 19, the LED module 607 has a back surface (temporary surface) of the LED module 607 in a state where the fitting convex portion 605c is fitted (inserted) into the fitting hole 611a of the LED module 607 (mounting substrate 611). The upper surface of the support member 605 is in contact. In addition, the cross-sectional shape of the fitting convex part 605c and the fitting hole 611a is non-circular (for example, square shape), and it does not rotate mutually.
　特に、大径部６０５ｂの上端で実装基板６１１の裏面と接触するため、両者の接触面積を大きくでき、発光時のＬＥＤモジュール６０７の熱を効率よく支持部材６０５へと伝熱できる。 Particularly, since the upper end of the large-diameter portion 605b contacts the back surface of the mounting substrate 611, the contact area between the two can be increased, and the heat of the LED module 607 during light emission can be efficiently transferred to the support member 605.
　立設部材６０９は、図１８及び図１９に示すように、全体形状が錐状、ここでは円錐状をしている。立設部材６０９は、図１８及び図１９に示すように、ＬＥＤモジュール６０７の表面（上面）から上方へと立設している。ここでは、立設部材６０９は、ＬＥＤモジュール６０７に対して直交する方向に延伸している。 As shown in FIGS. 18 and 19, the standing member 609 has an overall shape of a cone, here a cone. As shown in FIGS. 18 and 19, the standing member 609 stands upward from the surface (upper surface) of the LED module 607. Here, the standing member 609 extends in a direction orthogonal to the LED module 607.
　立設部材６０９は、支持部材６０５の嵌合凸部６０５ｃと嵌合する嵌合凹部６０９ａを底面の略中央に有する。なお、この嵌合凹部６０９ａの断面形状は、嵌合凸部６０５ｃに対応して非円形（正方形状である。）をしている。 The standing member 609 has a fitting recess 609a that fits with the fitting protrusion 605c of the support member 605 at the substantially center of the bottom surface. The cross-sectional shape of the fitting recess 609a is non-circular (square shape) corresponding to the fitting projection 605c.
　立設部材６０９は、円環状に配された封止体６１３（ＬＥＤ２３でもある。）の略中央に配されている。立設部材６０９の底面は、図１９に示すように、ＬＥＤモジュール６０７の表面（上面）に接触する状態で接着剤（図示省略）によりＬＥＤモジュール６０７に固着されている。 The standing member 609 is disposed at the approximate center of a sealing body 613 (also an LED 23) disposed in an annular shape. As shown in FIG. 19, the bottom surface of the standing member 609 is fixed to the LED module 607 with an adhesive (not shown) in contact with the surface (upper surface) of the LED module 607.
　立設部材６０９は、先細り形状（つまり、円錐形状である。）をしているため、ＬＥＤ２３から上方に発せられた光を遮るのを抑制できる。また、表面に反射膜等を形成して反射機能を持たせることにより、ＬＥＤ２３から発せられた光を有効に利用することができる。
≪第７の実施形態≫
　第４～第６の実施形態等では、特に、ＬＥＤランプについて説明したが、第２の発明は、上記ＬＥＤランプを利用した照明装置にも適用できる。 Since the standing member 609 has a tapered shape (that is, a conical shape), it is possible to suppress blocking of light emitted upward from the LED 23. Moreover, the light emitted from LED23 can be utilized effectively by forming a reflective film etc. on the surface and having a reflecting function.
<< Seventh Embodiment >>
In the fourth to sixth embodiments and the like, the LED lamp has been particularly described. However, the second invention can also be applied to a lighting device using the LED lamp.
　第７の実施形態では、第４の実施形態に係るＬＥＤランプ４０１を照明器具（ダウンライトタイプである。）に装着する場合について説明する。 7th Embodiment demonstrates the case where the LED lamp 401 which concerns on 4th Embodiment is mounted | worn with a lighting fixture (it is a downlight type).
　図２０は、第７の実施形態に係る照明装置の概略図である。 FIG. 20 is a schematic view of a lighting device according to the seventh embodiment.
　照明装置７０１は、例えば、天井７０３に装着されて使用される。 The lighting device 701 is used by being mounted on a ceiling 703, for example.
　照明装置７０１は、図２０に示すように、ＬＥＤランプ（例えば、第４の実施形態で説明したＬＥＤランプである。）４０１と、ＬＥＤランプ４０１を装着して点灯・消灯をさせる照明器具７０５とを備える。 As illustrated in FIG. 20, the lighting device 701 includes an LED lamp 401 (for example, the LED lamp described in the fourth embodiment) 401, and a lighting fixture 705 that is mounted on and off the LED lamp 401. Is provided.
　照明器具７０５は、例えば、天井７０３に取着される器具本体７０７と、器具本体７０７に装着され且つＬＥＤランプ４０１を覆うカバー７０９とを備える。カバー７０９は、ここでは開口型であり、ＬＥＤランプ４０１から出射された光を所定方向（ここでは下方である。）に反射させる反射膜７１３を内面に有している。 The lighting fixture 705 includes, for example, a fixture main body 707 attached to the ceiling 703 and a cover 709 attached to the fixture main body 707 and covering the LED lamp 401. The cover 709 is an open type here, and has a reflection film 713 on the inner surface that reflects light emitted from the LED lamp 401 in a predetermined direction (here, downward).
　器具本体７０７には、ＬＥＤランプ４０１の口金７が取着（螺着）されるソケット７１１を備え、このソケット７１１を介してＬＥＤランプ４０１に給電される。 The appliance body 707 includes a socket 711 to which the base 7 of the LED lamp 401 is attached (screwed), and the LED lamp 401 is supplied with power through the socket 711.
　本第７の実施形態では、照明器具７０５に装着されるＬＥＤランプ４０１のＬＥＤ２３（ＬＥＤモジュール４１１）の配置位置が白熱電球のフィラメントの配置位置に近いため、ＬＥＤランプ４０１における発光中心と、白熱電球における発光中心とが近いものとなる。 In the seventh embodiment, since the arrangement position of the LED 23 (LED module 411) of the LED lamp 401 mounted on the lighting fixture 705 is close to the arrangement position of the filament of the incandescent bulb, the light emission center in the LED lamp 401 and the incandescent bulb The emission center at is close.
　このため、白熱電球が装着されていた照明器具（７０５）にＬＥＤランプ４０１を装着しても、ランプとしての発光中心の位置が似ているため、白熱電球に似た配光特性が得られる。 For this reason, even if the LED lamp 401 is mounted on the lighting fixture (705) on which the incandescent lamp is mounted, the light distribution characteristics similar to that of the incandescent lamp can be obtained because the position of the light emission center as the lamp is similar.
　なお、ここでの照明器具は、一例であり、例えば、開口型のカバー７０９を有さずに、閉塞型のカバーを有するものであっても良いし、ＬＥＤランプが横を向くような姿勢（ランプの中心軸が水平となるような姿勢）や傾斜する姿勢（ランプの中心軸が照明器具の中心軸に対して傾斜する姿勢）で点灯させるような照明器具でも良い。 Note that the lighting fixture here is an example, and for example, the lighting fixture may not have the opening-type cover 709 but may have a closed-type cover, or a posture in which the LED lamp faces sideways ( It may be a lighting fixture that is lit in a posture in which the central axis of the lamp is horizontal) or an inclined posture (a posture in which the central axis of the lamp is inclined with respect to the central axis of the lighting fixture).
　また、照明装置は、天井や壁に接触する状態で照明器具が装着される直付タイプであったが、天井や壁に埋め込まれた状態で照明器具が装着される埋込タイプであっても良いし、照明器具の電気ケーブルにより天井から吊り下げられる吊下タイプ等であっても良い。 In addition, the lighting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall, but it may be an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or the wall. It may be a hanging type that can be hung from the ceiling by an electric cable of a lighting fixture.
　さらに、ここでは、照明器具は、装着される１つのＬＥＤランプを点灯させているが、複数、例えば、３個のＬＥＤランプが装着されるようにものであっても良い。
≪変形例≫
　以上、第２の発明の構成を、第４～第７の実施形態に基づいて説明したが、第２の発明は上記実施形態に限られない。例えば、第４～第７の実施形態に係るＬＥＤランプや照明装置の部分的な構成および下記の変形例に係る構成を、適宜組み合わせてなるＬＥＤランプや照明装置であっても良い。 Furthermore, although the lighting fixture is lighting one LED lamp with which it is mounted here, a plurality of, for example, three LED lamps may be mounted.
≪Modification≫
The configuration of the second invention has been described based on the fourth to seventh embodiments, but the second invention is not limited to the above embodiment. For example, the LED lamp and the lighting device may be appropriately combined with the partial configuration of the LED lamp and the lighting device according to the fourth to seventh embodiments and the configuration according to the following modification.
　また、上記第４～第７の実施形態に記載した材料、数値等は好ましいものを例示しているだけであり、それに限定されることはない。さらに、第２の発明の技術的思想の範囲を逸脱しない範囲で、ＬＥＤランプや照明装置の構成に適宜変更を加えることは可能である。
１．容器
（１）材料
　第４及び第５の実施形態では、グローブ３５，５３５と蓋部材３７，５３７とをガラス材料で構成していたが、容器の気密性を保持することができれば、他の材料を用いても良い。 The materials, numerical values, and the like described in the fourth to seventh embodiments are merely preferable examples, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the LED lamp and the illumination device without departing from the scope of the technical idea of the second invention.
1. Container (1) Material In the fourth and fifth embodiments, the globes 35 and 535 and the lid members 37 and 537 are made of glass material. However, other materials can be used as long as the airtightness of the container can be maintained. May be used.
　他の材料としては、グローブと蓋部材とを樹脂材料で構成することもできる。樹脂材料の場合、例えば、熱可塑性材料ではグローブと蓋部材との接合部分を加熱溶融させることで実施できるし、熱硬化性樹脂では接着剤を利用することで実施できる。さらに、容器内周面にガスバリアー用の樹脂を形成して気密性を高めても良い。
（２）形状（タイプ）
　第４、第５及び第６の実施形態では、容器３，５０３，６０３をＡタイプの形状としたが、他のタイプ、例えばＧタイプ、Ｒタイプ等の形状であっても良いし、電球等の形状と全く異なるような形状であっても良い。さらに、第４の実施形態では蓋部材３７を円板状（所謂、ボタンステムである。）で構成し、第５の実施形態では蓋部材５３７をフレア状（所謂フレアステムである。）で構成していたが、他のタイプの形状をしても良い。
２．流体
　実施形態では、容器内に封入される流体としてヘリウムガスが利用されていたが、空気よりも熱伝導率が高い他の種類のガス（気体）を封入しても良い。他のガスとしては水素、ネオン等がある。 As another material, the globe and the lid member can be made of a resin material. In the case of a resin material, for example, a thermoplastic material can be implemented by heating and melting a joint portion between a glove and a lid member, and a thermosetting resin can be implemented by using an adhesive. Further, a gas barrier resin may be formed on the inner peripheral surface of the container to improve the airtightness.
(2) Shape (type)
In the fourth, fifth and sixth embodiments, the containers 3, 503 and 603 have an A type shape, but other types such as a G type and an R type may be used, and a light bulb or the like may be used. It may be a shape that is completely different from the above shape. Further, in the fourth embodiment, the lid member 37 is configured in a disc shape (so-called button stem), and in the fifth embodiment, the lid member 537 is configured in a flare shape (so-called flare stem). However, other types of shapes may be used.
2. In the fluid embodiment, helium gas is used as the fluid sealed in the container. However, other types of gas (gas) having higher thermal conductivity than air may be sealed. Examples of other gases include hydrogen and neon.
　また、流体として、ガス（気体）以外に液体を利用することもできる。空気よりも熱伝導率が高い液体としては、シリコーンオイル、水等である。
３．立設部
　第４の実施形態等では立設部（立設部材４０５）は直線状に延伸し、第５の実施形態では立設部５６１ｂ，５６３ｂは直線状に延伸する部分と曲線状に延伸する部分とを有しているが、例えば、直線状に延伸する部分を有さずに曲線状に延伸させても良い。また、立設部の中心軸（延伸方向）は、ランプ軸に対して平行（換言すると、実装基板に直交する方向である。）であっても良いし、平行でなく傾斜していても良い。また、立設部は、表面を凹凸状にして表面積を広くするような構成としても良い。
４．容器とケースの結合
　第４の実施形態では、容器３とケース５とが接着剤５６により固着されている。このため、点灯時に容器３の熱が容器３からケース５にも伝わるような構成となっている。しかしながら、容器内に熱伝導率の高い流体を封入すると、容器の温度が上がり、その熱がケースに伝わって回路ユニットの熱負荷が増加するおそれもある。このような場合、ケース内の回路ユニットへの熱負荷を削減するために、容器とケースとの間に熱伝導率の低い材料を介在させて、両者を接合しても良い。 Moreover, liquid can also be utilized other than gas (gas) as a fluid. Examples of the liquid having higher thermal conductivity than air include silicone oil and water.
3. Standing portion In the fourth embodiment and the like, the standing portion (standing member 405) extends linearly, and in the fifth embodiment, the standing portions 561b and 563b extend in a straight line and a portion extending linearly. However, it may be extended in a curved line without having a part extending in a straight line. Further, the central axis (extension direction) of the standing portion may be parallel to the lamp axis (in other words, the direction orthogonal to the mounting substrate), or may be inclined rather than parallel. . Further, the standing portion may have a configuration in which the surface is uneven to widen the surface area.
4). Connection of Container and Case In the fourth embodiment, the container 3 and the case 5 are fixed by an adhesive 56. For this reason, the structure is such that the heat of the container 3 is transmitted from the container 3 to the case 5 when the lamp is lit. However, when a fluid having high thermal conductivity is sealed in the container, the temperature of the container rises and the heat is transmitted to the case, which may increase the thermal load on the circuit unit. In such a case, in order to reduce the thermal load on the circuit unit in the case, a material having low thermal conductivity may be interposed between the container and the case, and the two may be joined.
　逆に、ケース内の回路ユニットの温度に余裕がある場合、容器とケースとの接着剤に金属製フィラーを混入して、容器からグローブへの熱伝導を多くするようにしても良い。
５．ＬＥＤモジュール
（１）半導体発光素子
　実施形態等では、半導体発光素子はＬＥＤ２３であったが、例えば、ＬＤ（レーザダイオード）であっても良く、ＥＬ素子（エレクトリックルミネッセンス素子）であっても良い。 On the contrary, when there is room in the temperature of the circuit unit in the case, a metal filler may be mixed into the adhesive between the container and the case to increase the heat conduction from the container to the globe.
5. LED Module (1) Semiconductor Light Emitting Element In the embodiment and the like, the semiconductor light emitting element is the LED 23, but may be, for example, an LD (laser diode) or an EL element (electric luminescence element).
　また、ＬＥＤ２３はチップタイプで実装基板２１，５２１，６１１に実装されていたが、ＬＥＤは例えば、表面実装タイプ（いわゆる、ＳＭＤである。）や砲弾タイプで実装基板に実装されても良い。さらに、複数のＬＥＤは、チップタイプと表面実装タイプとの混合であっても良い。
（２）実装基板
　第４及び第５の実施形態での実装基板２１，５２１は平面視において矩形状をし、第６の実施形態での実装基板６１１は平面視において円形状をしている。 Moreover, although LED23 was mounted in the mounting board 21,521,611 by the chip type, LED may be mounted in the mounting board by the surface mounting type (what is called SMD) or a shell type, for example. Further, the plurality of LEDs may be a mixture of a chip type and a surface mount type.
(2) Mounting Board The mounting boards 21 and 521 in the fourth and fifth embodiments have a rectangular shape in plan view, and the mounting board 611 in the sixth embodiment has a circular shape in plan view.
　しかしながら、実装基板は、他の形状、例えば、正方形状、５角形等の多角形（正多角形状を含む。）、楕円形状、長円形状、環状等であっても良い。 However, the mounting substrate may have other shapes, for example, a polygon such as a square shape and a pentagon (including a regular polygon shape), an oval shape, an oval shape, an annular shape, and the like.
　また、実装基板数も１個に限定するものでなく、２以上の複数個であっても良い。さらに、実施形態では、実装基板２１の表面にＬＥＤ２３を実装していたが、実装基板の裏面にもＬＥＤを実装するようにしても良い。
（３）封止体
　第４及び第５の実施形態では、封止体２５は２列状に配されたＬＥＤ２３を列単位で被覆していたが、２列分をまとめて被覆しても良いし、複数の一定数のＬＥＤ群に対して１つの封止体で被覆しても良いし、すべてのＬＥＤに対して１つの封止体で被覆しても良い。
（４）ＬＥＤの配置
　第４及び第５の実施形態では複数のＬＥＤ２３は２列状に配され、第６の実施形態では複数のＬＥＤ２３は円環状に配されていたが、例えば、実装基板を四角形状として当該四角形の４辺に沿ってＬＥＤを配置し、平面視したときに四角形状になるように配されても良いし、マトリクス状に配されても良い。
（５）その他
　ＬＥＤモジュール１１，５１１，６０７は、青色光を出射するＬＥＤ２３と、青色光を黄色光に波長変換する蛍光体粒子とを利用することで白色光を出射するようにしていたが、例えば、紫外線発光の半導体発光素子と三原色（赤色、緑色、青色）に発光する各色蛍光体粒子とを組み合わせたものでも良い。 Further, the number of mounting boards is not limited to one, and may be two or more. Furthermore, in the embodiment, the LEDs 23 are mounted on the front surface of the mounting substrate 21, but the LEDs may be mounted on the back surface of the mounting substrate.
(3) Sealing body In the fourth and fifth embodiments, the sealing body 25 covers the LEDs 23 arranged in two rows in a row unit. However, the two rows may be covered together. And you may coat | cover with one sealing body with respect to several fixed number LED groups, and you may coat | cover with one sealing body with respect to all LED.
(4) Arrangement of LEDs In the fourth and fifth embodiments, the plurality of LEDs 23 are arranged in two rows, and in the sixth embodiment, the plurality of LEDs 23 are arranged in an annular shape. The LEDs may be arranged along the four sides of the quadrangular shape as a quadrangular shape and arranged in a quadrangular shape when viewed in plan, or may be arranged in a matrix.
(5) Others The LED modules 11, 511, and 607 are configured to emit white light by using the LED 23 that emits blue light and phosphor particles that convert the wavelength of blue light into yellow light. For example, a combination of an ultraviolet light emitting semiconductor light emitting element and each color phosphor particle emitting three primary colors (red, green, and blue) may be used.
　さらに、波長変換材料として半導体、金属錯体、有機染料、顔料など、ある波長の光を吸収し、吸収した光とは異なる波長の光を発する物質を含んでいる材料を利用しても良い。
６．ケース
　第４及び第５の実施形態等では、ケース５，５０５は樹脂材料により構成していたが、他の材料で構成することもできる。他の材料として、金属材料を利用する場合、口金との絶縁性を確保する必要がある。口金との絶縁性は、例えば、ケースの小径部に絶縁膜を塗布したり、小径部に対して絶縁処理をしたりすることで確保できる他、ケースのグローブ側を金属材料により、ケースの口金側を樹脂材料によりそれぞれ構成（２以上の部材を結合する。）することでも確保できる。 Further, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment, may be used as the wavelength conversion material.
6). Case In the fourth and fifth embodiments and the like, the cases 5 and 505 are made of a resin material, but may be made of other materials. When using a metal material as another material, it is necessary to ensure insulation from the base. Insulation with the base can be ensured by, for example, applying an insulating film to the small-diameter portion of the case or by insulating the small-diameter portion. It can also be ensured by configuring each side with a resin material (two or more members are combined).
　上記第４及び第５の実施形態では、ケース５，５０５の表面について特に説明しなかったが、例えば、放熱フィンを設けても良いし、輻射率を向上させるための処理を行っても良い。
７．口金
　第４の実施形態等では，エジソンタイプの口金７を利用したが、他のタイプ、例えば、ピンタイプ（具体的にはＧＹ、ＧＸ等のＧタイプである。）を利用しても良い。 In the fourth and fifth embodiments, the surface of the case 5 505 is not particularly described. However, for example, a heat radiating fin may be provided, or a process for improving the radiation rate may be performed.
7). Base In the fourth embodiment, etc., the Edison type base 7 is used, but other types, for example, a pin type (specifically, G type such as GY, GX, etc.) may be used.
　また、上記第４の実施形態では、口金７は、シェル部７１の雌ネジを利用してケース５，５０５のネジ部に螺合させることで、ケース５，５０５に装着（接合）されていたが、他の方法でケースと接合されても良い。他の方法としては、接着剤による接合、カシメによる接合、圧入による接合等があり、これらの方法を２つ以上組合せても良い。
［最後に］
　以上、第１の発明の構成について第１～第３の実施形態に基づいて説明し、第２の発明の構成について第４～第７の実施形態に基づいて説明している。なお、例えば、第２の発明における第４の実施形態に係るＬＥＤランプ４０１は、第１の発明の第１の実施形態で説明したランプ１に対して立設部材４０５を設けたものと同等である（立設部材を設けるためにＬＥＤモジュールの構成等が少し異なる。）。 Moreover, in the said 4th Embodiment, the nozzle | cap | die 7 was mounted | worn (joined) to case 5,505 by screwing together with the screw part of case 5,505 using the internal thread of the shell part 71. FIG. However, it may be joined to the case by other methods. Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.
[Finally]
The configuration of the first invention has been described based on the first to third embodiments, and the configuration of the second invention has been described based on the fourth to seventh embodiments. For example, the LED lamp 401 according to the fourth embodiment of the second invention is equivalent to the lamp 1 provided with the standing member 405 with respect to the lamp 1 described in the first embodiment of the first invention. Yes (the configuration of the LED module is slightly different to provide the standing member).
　本発明は、第１の発明の構成と第２の発明の構成とを組み合わせても良い。例えば、第１や第２の実施形態に対して、第５の実施形態（変形例も含む）に係る棒部材５０９における実装基板５２１よりも口金側と反対側部分に相当する部材を設けても良い。なお、組み合わせは本例に限定するものではなく、他の組み合わせであっても良い。 In the present invention, the configuration of the first invention and the configuration of the second invention may be combined. For example, in contrast to the first and second embodiments, a member corresponding to a portion opposite to the base side of the mounting substrate 521 in the bar member 509 according to the fifth embodiment (including modifications) may be provided. good. The combination is not limited to this example, and other combinations may be used.
　　１　　　ＬＥＤランプ
　　３　　　容器
　　５　　　ケース
　　７　　　口金
　　９　　　支持部材
　１１　　　ＬＥＤモジュール
　１３　　　回路ユニット
　２３　　　ＬＥＤ（半導体発光素子）
　４０　　　棒材
　４１　　　支持部本体
　４２　　　台座
　４３　　　延伸棒
４０５　　　立設部材（立設部） DESCRIPTION OF SYMBOLS 1 LED lamp 3 Container 5 Case 7 Base 9 Support member 11 LED module 13 Circuit unit 23 LED (semiconductor light emitting element)
40 Bar material 41 Support part main body 42 Base 43 Stretching bar 405 Standing member (standing part)

Claims (9)

  1. 　グローブ開口が蓋部材により塞がれてなる容器内に、光源としての半導体発光素子が支持部材に支持された状態で設けられ、口金を備えるケースが前記容器における前記グローブの開口側に取着されてなるランプであって、
    　前記容器内には、空気よりも高い熱伝導性を有する流体が封入され、
    　前記支持部材は、前記蓋部材に立設された棒材と、前記棒材に取着され且つ前記半導体発光素子が設けられた支持部本体とを有し、
    　前記支持部本体の表面積が前記棒材の表面積よりも大きい
    　ことを特徴とするランプ。     A semiconductor light emitting device as a light source is provided in a state where the globe opening is closed by a lid member and supported by a support member, and a case including a base is attached to the opening side of the globe in the container. A lamp,
    In the container, a fluid having higher thermal conductivity than air is enclosed,
    The support member has a bar erected on the lid member, and a support body attached to the bar and provided with the semiconductor light emitting element,
    The surface area of the said support part main body is larger than the surface area of the said rod, The lamp | ramp characterized by the above-mentioned.
  2. 　前記蓋部材はガラス材料により構成され、
    　前記棒材はガラス封着金属材料により構成されている
    　ことを特徴とする請求項１に記載のランプ。     The lid member is made of a glass material,
    The lamp according to claim 1, wherein the bar is made of a glass-sealed metal material.
  3. 　前記棒材は複数本ある
    　ことを特徴とする請求項１又は２に記載のランプ。     The lamp according to claim 1 or 2, wherein there are a plurality of the bar members.
  4. 　前記支持部本体は、前記複数の棒材に載置された状態で前記棒材に固着された台座部と、前記台座部から前記容器中央へと延伸して先端側に前記半導体発光素子が設けられる延伸部とを有する
    　ことを特徴とする請求項３に記載のランプ。     The support body has a pedestal portion fixed to the bar in a state of being placed on the plurality of bars, and the semiconductor light emitting element is provided on the tip side extending from the pedestal to the center of the container. The lamp according to claim 3, wherein the lamp has an extending portion.
  5. 　前記棒材は、前記蓋部材を貫通する状態で前記蓋部材に封着され、
    　前記棒材における前記容器の外側に位置する部分が前記ケースに熱的に接続されている
    　ことを特徴とする請求項１～４のいずれか１項に記載のランプ。     The bar is sealed to the lid member in a state of penetrating the lid member,
    The lamp according to any one of claims 1 to 4, wherein a portion of the bar located outside the container is thermally connected to the case.
  6. 　前記棒材の外側に位置する部分が板部材に接合され、前記板部材が前記ケースに取着されている
    　ことを特徴とする請求項５に記載のランプ。     6. The lamp according to claim 5, wherein a portion located outside the bar is joined to a plate member, and the plate member is attached to the case.
  7. 　前記半導体発光素子は実装基板に実装され、
    　前記実装基板が前記延伸部の先端に装着され、
    　前記実装基板における素子実装面を含む仮想面と前記容器の内周面とで区画される領域であって前記延伸部が存しない領域内に、前記実装基板から立設する立設部が存在する
    　ことを特徴とする請求項４に記載のランプ。     The semiconductor light emitting device is mounted on a mounting substrate,
    The mounting substrate is attached to the tip of the extending portion,
    In the region defined by the virtual surface including the element mounting surface of the mounting substrate and the inner peripheral surface of the container, the standing portion standing from the mounting substrate exists in the region where the extending portion does not exist. The lamp according to claim 4.
  8. 　前記立設部は、前記実装基板の中央部分から立設する
    　ことを特徴とする請求項７に記載のランプ。     The lamp according to claim 7, wherein the standing portion is erected from a central portion of the mounting substrate.
  9. 　ランプと、前記ランプを装着して点灯させる照明器具とを備える照明装置であって、
    　前記ランプは、請求項１～８のいずれか１項に記載のランプである
    　ことを特徴とする照明装置。     A lighting device comprising a lamp and a lighting fixture that is lit by mounting the lamp,
    The lighting device according to any one of claims 1 to 8, wherein the lamp is a lamp according to any one of claims 1 to 8.
PCT/JP2012/005893 2011-12-06 2012-09-14 Lamp and illumination device WO2013084389A1 (en)

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JP2011-266678 2011-12-06
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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2016198448A1 (en) * 2015-06-11 2016-12-15 Philips Lighting Holding B.V. Light bulb with solid-state lighting devices

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2008204671A (en) * 2007-02-17 2008-09-04 Nichia Chem Ind Ltd Illumination device
WO2009040703A2 (en) * 2007-09-27 2009-04-02 Philips Intellectual Property & Standards Gmbh Lighting device and method of cooling a lighting device
JP2010118340A (en) * 2008-11-13 2010-05-27 Yeh-Chiang Technology Corp Light-emitting diode downlight

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008204671A (en) * 2007-02-17 2008-09-04 Nichia Chem Ind Ltd Illumination device
WO2009040703A2 (en) * 2007-09-27 2009-04-02 Philips Intellectual Property & Standards Gmbh Lighting device and method of cooling a lighting device
JP2010118340A (en) * 2008-11-13 2010-05-27 Yeh-Chiang Technology Corp Light-emitting diode downlight

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016198448A1 (en) * 2015-06-11 2016-12-15 Philips Lighting Holding B.V. Light bulb with solid-state lighting devices
US10072826B2 (en) 2015-06-11 2018-09-11 Philips Lighting Holding B.V. Light bulb with solid-state lighting devices

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JPWO2013084389A1 (en) 2016-05-26

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