WO2013060211A1 - 灯壳式散热器的制作方法、灯壳式散热器及led照明装置 - Google Patents
灯壳式散热器的制作方法、灯壳式散热器及led照明装置 Download PDFInfo
- Publication number
- WO2013060211A1 WO2013060211A1 PCT/CN2012/081647 CN2012081647W WO2013060211A1 WO 2013060211 A1 WO2013060211 A1 WO 2013060211A1 CN 2012081647 W CN2012081647 W CN 2012081647W WO 2013060211 A1 WO2013060211 A1 WO 2013060211A1
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- WIPO (PCT)
- Prior art keywords
- heat
- lamp
- heat sink
- led
- lighting device
- Prior art date
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D51/00—Making hollow objects
- B21D51/16—Making hollow objects characterised by the use of the objects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Definitions
- the present invention relates to the field of illumination, and in particular to a method for manufacturing a lamp-shell heat sink in an LED lighting device, a lamp-shell heat sink and an LED lighting device.
- the traditional incandescent lamp has a luminous efficacy of only about 10 lm/W, and the halogen lamp has a luminous efficiency of about 30 lm/W. Most of the electric energy is converted into heat, which wastes a lot of electric energy.
- LED is a new type of semiconductor lighting technology. At present, the luminous efficacy of LED lighting bead has reached more than 1201m/W. With excellent power supply and reasonable structural design, the luminous efficacy of LED lamps can reach 901m/W. the above. In this case, a 7W to 9W LED lamp can replace the 60W traditional incandescent lamp, saving a lot of power.
- LED bulbs, LED spotlights, LED PAR lamps, etc. which are commonly used on the market, are generally made of die-cast aluminum heat sinks, semi-spherical translucent covers or lens modules, circuit boards soldered with LED light-emitting bead, LED drive power, and lamp caps. And so on.
- the circuit board is fixed on the die-cast aluminum heat sink and is covered with a transmissive cover or a lens module.
- the die-cast aluminum heat sink has a cavity with an LED driving power supply.
- a LED bulb heat sink and an LED bulb are disclosed in 201020220556.9.
- the LED bulb heat dissipating body comprises a mounting heat transfer portion on the top surface, a heat dissipating portion on the side surface and a mounting positioning portion on the lower end, the heat dissipating portion includes a plurality of longitudinal heat dissipating strips, the upper end of the heat dissipating strip is connected with the mounting heat transfer portion, and the lower end portion is configured Install the positioning part, and leave a gap between adjacent heat dissipation strips. Although it has a certain heat dissipation, the entire heat sink is not made in one piece, and the cost is relatively high.
- a bulb lamp is disclosed in the application number 201020666630.X, comprising a translucent cover and a lamp cap connectable to a power source, and further comprising a heat dissipating device disposed between the lamp cap and the transmissive cover, wherein the air dissipating device is provided with air supply
- the cavity that enters and exits is provided with a space for air in and out at both ends of the heat dissipating device.
- the biggest feature of this patent is that the heat dissipating device is provided with an air flow cavity and an air inlet and outlet air gap, and the heat in and out of the heat dissipating device is accelerated by the air in and out of the heat dissipating device. Cooling speed.
- an LED bulb lamp radiator is disclosed.
- the heat sink is an integrally formed structure having a body and a heat dissipation platform.
- the body is a hollow structure and has a plurality of convection heat dissipation holes.
- the heat sink is used in energy-saving LED bulbs.
- the body is an important part of the appearance of the entire bulb, and it is also an LED heat sink.
- the material is made of high thermal conductivity aluminum, and the passive natural convection heat dissipation design makes the heat dissipation of the whole lamp faster.
- the heat sink disclosed in this patent has a very strong heat dissipation property. However, the heat sink is made of die-cast aluminum, which is very wasteful of material and is heavy in weight and high in cost.
- the thermal conductivity of die-cast aluminum is about 88%, and the heat dissipation is not good.
- it includes an inner wall and an outer wall.
- the outer wall is provided with a heat-dissipating long hole parallel to the radial direction to form a passage with a plurality of holes provided in the heat dissipation platform, and theoretically dissipates heat from the circuit board.
- the heat of the circuit board is first transmitted to the space formed by the inner wall through the compressed aluminum of the heat dissipation platform, and the heat generated by the power supply located in the inner wall space forms a mutual baking, that is, mutual influence. .
- the existing LED lighting devices have the following disadvantages:
- the cost of the lamp housing is relatively high, often accounting for more than 30% of the cost of the entire LED bulb.
- the existing lamp housing is made of a conventional die-cast aluminum lamp housing or a lamp housing made of the aforementioned high thermal conductivity aluminum material, the cost is high, and, in addition, the conventional The die-cast aluminum lamp housing is also made of the above-mentioned profile.
- the aluminum is made of conventional material thickness and the weight is heavier, and the weight of the lamp shell directly determines the weight of the entire LED bulb, thereby causing the weight of the entire LED bulb to drop. High difficulty.
- the power supply of the lamp is often enclosed in a plastic casing, and the plastic casing is sealed in the cavity of the aluminum lamp casing, and the heat of the circuit board is conducted into the cavity of the aluminum lamp casing, which causes the power source and the light source.
- the heat generated by the heat dissipation affects each other, causing the internal temperature of the power supply to be high and easily damaged.
- the measured temperature reaches 80 degrees or more.
- the outer casing includes an inner wall and an outer wall, the entire fabrication is complicated, and the entire heat sink is relatively heavy and costly. Moreover, the housing manufacturing process of the existing LED lighting device is complicated in such a process.
- An object of the present invention is to provide a method for fabricating a lamp-shell heat sink in an LED lighting device, which solves the technical problem that the existing LED lighting device is heavy, has poor heat dissipation, and has high cost.
- a second object of the present invention is to provide a lamp-type heat sink in an LED lighting device, which solves the technical problem that the existing LED lighting device is heavy in weight, poor in heat dissipation, and high in cost.
- a third object of the present invention is to provide an LED lighting device that solves the technical problems of heavy weight, poor heat dissipation, and high cost of the existing LED lighting device.
- a method for manufacturing a lamp-shell heat sink in an LED lighting device comprises the following steps:
- Blanking Take the high-purity aluminum sheet with thickness of 0.5mm to 5mm and more than 95% of aluminum according to the pre-designed size, and punch the outer wheel required for the outer shell;
- the method further comprises: first stamping: stamping a recessed area for contacting the surface of the circuit board in the middle of the sheet, and forming a tightly recessed area Fit the bonding surface of the LED circuit board.
- the second step comprises: forming a second stamping: punching a top convex structure having a narrow bottom and a top in the middle of the sheet.
- the upper convex structure punched out in the middle of the plate material may be a conical plate body or a multi-face pyramidal plate body, and the top surface or the oblique side surface of the table body may be used for accommodating the LED circuit board.
- the upper convex structure punched out in the middle of the plate may also be a hemispherical surface, and a plurality of chambers are further punched out on the hemispherical surface, and preset intervals are arranged between the chambers.
- the step (1) further comprises: punching a whole piece of aluminum plate into a shape of a sun flower, and punching out a plurality of circuit board fixing holes and a plurality of wire holes on the board.
- the step (3) further includes: placing the drawn blank into the shrinking die, the side wall of the die conforming to the shape of the outer wall of the pre-designed lamp-shell heat sink; the top bar from the top to the bottom of the blank When the bottom of the casing is in contact with the bottom of the shrinking die, the shrinkage is completed.
- the method further comprises: (4) post-treatment and surface treatment of at least one of oxidation, painting, and electroplating of the blank.
- the LED lighting device depending on the model size of the LED lighting device, different thicknesses of the high-purity aluminum plate are selected, and the LED lighting device is larger, or the heating power of the LED is larger, and the thickness of the high-purity aluminum plate is thicker.
- a lamp housing type heat sink in a lighting device is high purity with a thickness of 0.5 mm to 5 mm and a content of more than 95% of aluminum
- the aluminum sheet is integrally formed by drawing, and is formed into a hollow portion, which is composed of a heat dissipating surface and a casing body.
- a surface contact structure is formed between the heat dissipating surface and the circuit board, and a heat dissipating through hole capable of forming a heat dissipating passage is disposed on the casing body.
- the heat dissipation through holes provided in the outer casing body are heat dissipation long holes arranged in a radial direction along the outer wall of the outer casing.
- the outer casing body is gradually contracted from the end to the other end of the board, and has a truncated cone shape.
- An LED lighting device comprising: an optical lens, a lamp housing heat sink, a circuit board, and an LED driving device, wherein
- the lamp-shell heat sink is integrally formed by deep drawing of a high-purity aluminum sheet having a thickness of 0.5 mm to 5 mm and containing more than 95% of aluminum, which is a hollow portion, and the lamp-shell heat sink is composed of a heat dissipating surface and a casing a body composition, a surface contact structure is formed between the heat dissipation surface and the circuit board, and a heat dissipation through hole capable of forming a heat dissipation channel is disposed on the housing body;
- the optical lens is disposed at the front end of the lamp housing type heat sink, and the LED driving device is disposed in the lamp housing type heat sink or is provided with a rear end thereof.
- the LED lighting device further includes a power supply housing, wherein the power supply housing is provided with a cavity, the LED driving device is disposed in the cavity of the power supply housing, and the inner cavity of the power supply housing is filled with high thermal conductivity and excellent insulation. Glue.
- the heat dissipation channel is: heat is transmitted to the heat dissipation surface through the contact between the circuit board and the heat dissipation surface, and then radiated from the heat dissipation surface through the heat dissipation through hole; the heat dissipation channel 2: heat is dissipated from the LED driving device through the heat dissipation through hole.
- the heat dissipation channel 1 and the heat dissipation channel 2 are independent of each other.
- the heat is mainly convected by the surface of the casing and the air to dissipate heat, and the existence of the heat dissipation through hole can ensure smooth convection of the air and enhance the heat dissipation effect.
- the heat is transmitted from the LED driving device to the surface of the power supply case through the high thermal conductive adhesive, and then the heat is convected through the surface of the power supply case and the air to dissipate the heat, and the existence of the heat dissipation through hole can ensure the smooth convection of the air and enhance the heat. heat radiation.
- Both channel one and channel two can smoothly transfer heat to the air without accumulating inside the lamp, and the heat dissipation effect is excellent, and the two heat dissipation channels are independent of each other.
- the optical lens adopts a uniform optical lens or a secondary optical lens, which can be fixed on the lamp housing by screw fixing or glue.
- the circuit board is a flat-bottomed module that is in surface contact with the heat dissipating surface.
- the preferred two-sided bonding is coated with a high thermal conductivity silicone grease.
- the manufacturing method of the lamp housing type heat sink in the second type of LED lighting device comprises the following steps:
- Blanking taking high-purity aluminum sheet with thickness of 0.5mm to 5mm and containing more than 95% of aluminum according to the pre-designed size, punching out the outer contour of the sheet into the outer shell;
- the first type of stamping comprises: stamping a recessed area for contacting the surface of the circuit board in the middle of the sheet, and forming a close-fit LED circuit in the recessed area The mating surface of the board.
- the second step comprises: forming a second stamping: punching a top convex structure having a narrow bottom and a top in the middle of the sheet.
- the upper convex structure punched out in the middle of the plate material may be a conical plate body or a multi-face pyramidal plate body, and the top surface or the oblique side surface of the table body may be used for accommodating the LED circuit board.
- the upper convex structure punched out in the middle of the plate may also be a hemispherical surface, and a plurality of chambers are further punched out on the hemispherical surface, and preset intervals are arranged between the chambers, and the chambers can be used for placing LED circuit board.
- the present invention has the following beneficial effects:
- the lamp housing type heat sink in the LED lighting device is integrally formed by drawing a high-purity aluminum sheet having a thickness of 0.5 mm to 5 mm and containing more than 95% of aluminum, so that the lamp shell type heat dissipation of the present invention Only 1/3 to 1/5 of the die-cast aluminum housing can be used to achieve the same or even better heat dissipation effect as die-cast aluminum, and the cost is only 1/2 to 1/3 of the die-cast aluminum housing.
- the high-purity aluminum sheet containing more than 95% aluminum has a thermal conductivity of more than 230 W/(mK), which is much more heat-dissipating than that of die-cast aluminum and profile aluminum, and the weight of the lighting device made of the housing is smaller than that of the die-cast shell. Half of the body made of lights. Moreover, aluminum sheets use less material and also reduce costs. Therefore, the LED lighting product of the present invention is cheaper and lighter in weight, and is suitable for use in various occasions, that is, it is applicable to various types of lighting devices of various models.
- the circuit board and the lamp-type heat sink are in contact with each other through a planar contact with a close plane contact, and the heat generated by the circuit board can be quickly dissipated into the air through the high-purity aluminum shell with high thermal conductivity, and the heat dissipation effect is excellent.
- the LED light bead and the LED drive are separated from each other, and heat accumulation does not occur. That is, the heat dissipation channel 1: the heat is transmitted to the heat dissipation surface through the contact between the circuit board and the heat dissipation surface, and then radiated from the heat dissipation surface through the heat dissipation through hole; the heat dissipation channel 2: the heat is radiated from the LED driving device, and then the heat is dissipated through the heat dissipation through hole.
- the heat dissipation channel 1 and the heat dissipation channel 2 are independent of each other, and there is no problem of mutual influence on heat dissipation.
- the LED light bulb has high luminous efficiency, which is above 100lm/W, and the power conversion efficiency is more than 90%. It saves more energy than ordinary incandescent lamps. It only needs 7 to 9W to reach the traditional incandescent lamp of 50W or more. Brightness.
- Figure 1 is an exploded view of an LED lighting product
- FIG. 2 is a schematic structural view of a lamp housing type heat sink
- Figure 3A is a schematic view of the blank after blanking
- Figure 3B is a schematic view of the blank after the first press forming
- Figure 3C is a schematic view of the blank after drawing
- Figure 3D is a schematic view of the drawing process
- Figure 3E is a schematic view Schematic diagram of the shrinkage process
- Figure 3F is a schematic view of the second blank after stamping
- Figure 3G is a schematic view of the third blank formed by stamping
- Figure 3H is a schematic view of the fourth blank after stamping
- Figure 31 is Figure 3H is a schematic view of the blank member after the second pressing
- Figure 4A is a schematic view of the blank after blanking
- Figure 4B is a schematic view of the blank after stamping
- Figure 4C is a schematic view of the first spinning process
- Figure 4D is a schematic view of the second spinning process
- FIG. 10 is a schematic structural view of a portion of a bulb lamp heat dissipation lamp housing of Application Example 4;
- 11A is a schematic structural view of a portion of a bulb lamp heat dissipation lamp housing of Application Example 5;
- 11B is a schematic overall view of a bulb lamp of Application Example 5;
- Fig. 12A is a structural schematic view showing a portion of a bulb lamp heat sink of the application example 6.
- Fig. 12B is a schematic overall view of a bulb lamp of Application Example 6.
- An LED lighting product including optical lens 1, lamp housing heatsink 2, circuit board 3, LED driver 4, power supply case 5, lamp holder 6.
- the optical lens 1 is preferably made of a material having a high light transmittance such as PC, PMMA, glass, plexiglass or the like. Its role is generally divided into secondary light distribution and hook light according to the different types of lamps.
- the secondary light distribution optical lens functions to redistribute the light emitted from the LED light-emitting bead or the integrated package LED light-emitting module, so that the spot on the receiving surface becomes an arbitrary desired shape such as a circular spot or a rectangular spot.
- the secondary light distribution optics has one or more light distribution units.
- the optical optics lens uniformly disperses the light emitted by the LED light-emitting bead. Generally, the surface of the homo-optical optical lens is roughened or a uniform light substance is added to the lens material.
- the optical lens 1 can be attached to the lamp-type heat sink 2 by screwing or glue.
- the lamp housing type heat sink 2 is made of a whole piece of high-purity aluminum sheet having a thickness of 0.5 mm to 5 mm and containing more than 95% of aluminum.
- Conventional LED bulbs or LED PAR lamps mostly use die-cast aluminum lamp-shell heat sinks, while die-cast aluminum has a thermal conductivity of only about 95W/nvK.
- the invention innovatively proposes a technique for manufacturing a lamp housing type lamp radiator using high-purity aluminum plate drawing.
- the high-purity aluminum has a thermal conductivity of about 237 W/mK, which is 2.5 times that of ordinary compressed aluminum. Therefore, the lamp-shell heat sink of the present invention can be used only by 1/3 to 1/5 of the die-cast aluminum casing. It achieves the same or even better heat dissipation effect as die-cast aluminum, and costs only 1/2 to 1/3 of the die-cast aluminum housing.
- the bulb made with this housing weighs less than half the weight of the lamp made of die cast housing.
- the lighting industry commonly uses three high-purity aluminum plates of 1050, 1060 and 1070.
- the thermal conductivity of pure aluminum is 237 W/m.K
- the aluminum content of 1050 aluminum plate is 99.5%
- the thermal conductivity is 209W/m.K
- the aluminum content of 1060 aluminum plate is 99.6%
- the thermal conductivity should be between 1050 aluminum plate and 1070 aluminum plate.
- the 1070 aluminum plate has an aluminum content of 99.7% and a thermal conductivity of 226 W/m.K.
- the high-purity aluminum plate has a thermal conductivity much higher than that of the profile aluminum of about 209 W/m.K, which is higher than that of the die-cast aluminum of about 95 W/m.K. Therefore, the heat sink of the present invention has an excellent heat dissipation effect.
- the lamp housing type heat sink 2 of the present invention is composed of a heat dissipating surface 21 and a casing body 22, and a surface contact structure is formed between the heat dissipating surface 21 and the circuit board 3.
- the heat dissipating through hole capable of forming a heat dissipating passage is disposed on the casing body 22. .
- the heat dissipation through hole provided in the outer casing body 22 is a heat dissipation long hole 23 which is arranged in the radial direction of the outer wall of the outer casing.
- the outer casing body 22 is gradually contracted from the end of the heat dissipating surface 21 toward the opposite end, and has a truncated cone shape.
- the heat dissipating surface 21 is a flat side, or a flat surface is recessed downward for contact with the circuit board 3.
- a plurality of circuit board fixing holes 25 and one wire hole 24 are provided on the heat radiating surface 21, see FIG.
- the heat dissipating surface 21 of the specification is a flat side, or a flat surface is recessed downward. This design can make the bottom of the flat and smooth circuit board 3 closely fit, and the circuit board 3 and the lamp housing type heat sink 2 can be coated. High thermal grease can also be applied without coating.
- the heat of the circuit board 3 is quickly transmitted to the lamp housing type heat sink 2, which has a good heat dissipation effect.
- a part of the material is cut off around the outer casing body 22 of the lamp-type heat sink 2 to obtain a hollowed-out housing, that is, a heat-dissipating elongated hole 23 is provided.
- the heat of the lamp-type heat sink 2 can form an unobstructed thermal circulation path inside and outside the hollowed-out lamp-type heat sink.
- the lamp housing type heat sink 2 is formed by drawing a metal plate with a large surface area, and fixing the circuit board 3 to the lamp housing type heat sink 2 can fully utilize the larger surface of the housing for effective heat dissipation, and the LED is generated.
- the heat is quickly conducted from the circuit board 3 to the lamp housing heat sink 2 and then conducted to the air.
- the circuit board 3 is a light-emitting module with a flat bottom, and its smooth surface is closely adhered to the fixing surface of the circuit board type heat sink 2.
- the bonding surface of the two surfaces can be coated with high thermal conductivity silicone grease or not. .
- It can be a PCBA board that is soldered with LED light bulbs on a circuit board 3 with excellent thermal conductivity, or it can be a monolithic LED light-emitting module.
- the circuit board 3 is preferably a material having a high thermal conductivity, and the heat generated by the LED chip can be quickly conducted to the circuit board 3 to avoid accumulation of heat in the vicinity of the LED chip.
- the board is in close contact with the larger surface area of the housing, allowing heat to be quickly dissipated into the air. Heat creates a smooth, efficient conduction path from the inside of the lamp to the air.
- the LED drive unit 4 is an efficient drive unit. Its input line is connected to the positive and negative poles of the lamp head 6, and its output line is connected to the positive and negative poles of the circuit board 3. It is placed in the cavity of the power supply case 5, and the inside of the power supply case is filled with a high thermal conductivity and excellent insulation. This glue can quickly conduct heat from the high-heat components inside the power supply to prevent heat from accumulating around the high-heat components. The other end of the power supply housing is used to secure the lamp cap 6.
- the power supply case 5 is made of plastic and is a hollow circular tubular case. It is used to fix the lamp housing radiator 2 and the lamp cap 6.
- An LED driver 4 is placed in its cavity and is filled with a highly thermally conductive, insulating glue.
- Heat dissipation channel 1 The heat is transmitted to the heat dissipation surface through the contact between the circuit board and the heat dissipation surface, and then radiated from the heat dissipation surface through the heat dissipation through hole; the heat dissipation channel 2: heat is dissipated from the LED driving device, and then radiated through the heat dissipation through hole;
- the channel one and the heat dissipation channel two are independent of each other.
- the lamp holder 6 is generally a standard lamp holder, such as an E27 screw, but can also be customized according to actual needs.
- the processing of the lamp-shell radiator (2) is mainly divided into the following steps:
- stamping forming (as shown in Figures 3B, 3F-3I).
- a shape is punched in the middle portion of the sheet by a forming die, and the shape may be a recessed portion in contact with the surface of the board, or an upper convex type or a hemispherical structure having a narrow bottom and a narrow top.
- secondary punching can also be performed.
- the hemispherical structure of Fig. 3H is subjected to secondary punching to form a plurality of chamber structures. ⁇
- Different molding dies can be used to shape the sheet into the various structures required.
- FIG. 4 shrink (as shown in Figure 3E).
- the opening of the straight cylindrical blank is subjected to a necking process to reduce the diameter of the opening and to reduce the opening to a pre-designed curvature.
- the drawn blank member is placed in the concavity die 42, and the side wall of the die 42 is just the shape of the outer wall of the designed lamp housing type heat sink 2.
- the jack 41 tops the blank from top to bottom.
- the bottom of the housing is in contact with the bottom of the concavity die 42 and the constriction is completed.
- the 3 ⁇ 4 parts may be subjected to surface treatment such as oxidation, painting, plating, or the like, or may be left untreated.
- surface treatment such as oxidation, painting, plating, or the like.
- steps 3, 4, and 5 are the main steps, and the order cannot be reversed.
- the processing of the lamp-shell radiator is mainly divided into the following steps:
- the portion of the lamp housing 2 on which the circuit board and the fixed optical lens are fixed is a recessed area, and a shape is required to punch out a desired shape.
- the shape may be a recessed area in contact with the surface of the board, or an upper convex type or a hemispherical structure having a narrow bottom and a narrow top.
- Secondary stamping can also be performed according to specific structural requirements.
- the first spinning (as shown in Figure 4C).
- the metal plate is spun into an open hollow piece.
- the size of the open end of the spun blank is greater than or equal to the size of the closed end.
- the bottom surface of the to-be-spun blank 51 is closely attached to the top surface of the spinning mold 52, and is rotated at a high speed around the A-axis.
- the ejector pin 53 is used to hold the blank member 51 to be pressed, so that the to-be-spun blank member 51 and the spinning mold 52 are all closely attached together.
- the open blank is made by spinning the blank.
- the second spinning (as shown in Figure 4D).
- the blanks processed through the above steps are treated with a special spinning process to make the opening diameter smaller and the opening is spun into a pre-designed curvature.
- the side curvature of the eccentric spinning die 63 is exactly the curvature of the side of the high purity aluminum casing required.
- the blank member 62 is rotated about its central axis P, and the eccentric spinning die 63 is rotated about its central axis Q while also rotating about the other eccentric axis P.
- the side wall of the blank member 62 is then brought into close contact with the side wall of the eccentric spinning die 63 by the ejector pin 61. After the spinning is completed, the product can be taken out.
- This special spinning process is used to allow the product to be smoothly removed from the mold.
- FIG. 5 shows a schematic diagram of an LED bulb.
- This LED bulb is a 220v AC input, E27 screw bulb that can be used to replace a traditional 220V input incandescent lamp.
- the input line of the 220V AC input and DC output LED driver is passed through the power supply case 5, and the input line is soldered to the positive and negative poles of the E27 lamp.
- the LED driving device 4 is inserted into the cavity of the power supply case 5, and the limb water having excellent thermal conductivity is poured, and is left for a while to wait for the glue to solidify.
- the output line of the LED driving device 4 is passed through the wire hole of the lamp housing type heat sink 2, and then the pin 21 of the lamp housing type heat sink 2 is inserted into the corresponding hole outside the power supply case 5, and the glue is used. fixed.
- the circuit board 3 is then screwed to the metal casing, and the output line of the LED driving device 4 is soldered to the circuit board 3.
- the hemispherical, homogenizing optical lens 1 is fixed to the lamp housing type heat sink 2 with glue. The assembly is complete.
- This LED bulb is a 220V, 50Hz home AC input with a standard E27 base that can easily replace existing home incandescent lamps.
- Application example 2
- FIG. 6 and Figure 7 show a schematic diagram of an LED PAR lamp.
- This LED PAR lamp is a 220v AC input, E27 screw PAR lamp.
- the LED driving device 4 is inserted into the cavity of the power supply case 5, and the glue having excellent thermal conductivity is poured, and it is left for a while to wait for the glue to solidify.
- the output line of the LED driving device 4 is passed through the wire hole of the metal lamp housing type heat sink 2, and then the pin 21 of the lamp housing type heat sink 2 is inserted into the corresponding hole outside the power supply case 5, and the glue is used. fixed.
- the circuit board 3 is then screwed to the metal casing, and the output line of the LED driving device 4 is soldered to the circuit board 3.
- the optical lens 1 having the collecting effect is screwed to the lamp housing type heat sink 2. The assembly is complete.
- This LED PAR lamp is a 220V, 50Hz home AC input with a standard E27 base that easily replaces existing PAR lamps.
- Application example 3
- FIG 8 and Figure 9 show the MR16 of an LED.
- This LED MR16 is a 12V input, GU5.3 base that can be used to replace the traditional 12V input MR16 spotlight.
- Six LED light-emitting beads are soldered on the MR16 board, and six secondary light distribution units are arranged on the optical lens 1. These six light distribution units converge on the light emitted by each LED light-emitting bead.
- the input end of the LED driving device 4 is two metal pins with a distance of 5.3 mm. During assembly, the LED driving device 4 is placed in the cavity of the power supply case 5 and the pins are inserted into the power supply case 5 at a distance of 5.3 mm. Inside the hole.
- a glue having excellent heat conductivity is poured into the cavity of the power supply case 5, and left for a while to wait for the glue to solidify.
- the output line of the LED driving device 4 is passed through the wiring hole of the lamp housing 2, and then the pin 21 of the lamp housing 2 is inserted into the corresponding hole outside the power supply case 5, and fixed by glue.
- the circuit board 3 is then screwed to the metal housing lamp housing 2, and the output line of the LED driving device 4 is soldered to the circuit board 3.
- the optical lens 1 having a collecting effect is fixed to the lamp housing 2 with screws or glue. The assembly is complete.
- the LED MR16 is a 12V DC input and has a standard GU10 base that can easily replace the traditional MR16 with a halogen bulb.
- Instruction application example 4
- the housing-type heat sink 2 further includes a chip mount 111 disposed at an upper portion thereof and disposed at The heat sink support 112 is connected to the heat sink support 112.
- the chip mount 111 and the heat sink support 112 can be an integrated structure or a detachable movable connection structure.
- the specific connection manner can be a threaded connection. , buckle connection and other connection methods.
- the chip mount 111 is an upwardly convex tapered body (conical or multi-sided pyramid and the like), the circuit board 3 is disposed on the top of the chip mount 111, and a circuit board 3 is disposed on the circuit board 3
- the phosphor cover 15 has a hemispherical shape, and the inner surface or the outer surface of the phosphor cover 15 is coated with a phosphor, or is internally doped with a phosphor.
- this application example has the same technical features as the application example 4, and the same portions will not be described again, except that the upper chip mount 111' of the shell-type heat sink is a multi-faceted pyramid.
- a plurality of circuit boards 3 are respectively disposed on each side of the chip mount 11 to remove the phosphor cover, and the phosphor particles are directly coated on the LED chip.
- Application example 6
- this application example has the same technical features as the application example 1, and the same portions will not be described again, except that the housing-type heat sink 2 further includes upper and lower portions connected together.
- the upper half of the heat dissipation lamp housing 1 is provided with a plurality of chambers 211, and the upper half portion is disposed along the longitudinal direction of the heat dissipation lamp housing 1 to form a plurality of chambers 211, and all of the plurality of chambers 211 can be enclosed.
- the outer circumference of the upper part is provided with a plurality of chambers 211, and the upper half portion is disposed along the longitudinal direction of the heat dissipation lamp housing 1 to form a plurality of chambers 211, and all of the plurality of chambers 211 can be enclosed.
- a plurality of LED circuit boards 3 are respectively disposed in the plurality of chambers 211, and an outwardly facing opening of each of the chambers 211 is correspondingly provided with a transmissive cover ⁇ (the transmissive cover is a type of optical lens).
- the sidewalls of the plurality of chambers 211 of the housing type heat sink 2 are not in contact with each other, and the plurality of chambers 211 are spaced apart from each other, so that there are multiple heat dissipation channels between the plurality of chambers 211, and
- the chamber 211 of the heat-dissipating lamp housing is made of a metal material, and has a good heat dissipation effect.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US14/354,535 US9810416B2 (en) | 2011-10-26 | 2012-09-20 | Method for manufacturing a lamp-housing-type heat-sink, lamp-housing-type heat-sink, and LED lighting device |
Applications Claiming Priority (4)
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CN2011204134454U CN202328091U (zh) | 2011-10-26 | 2011-10-26 | 灯壳式散热器及led照明装置 |
CN201110329640.3A CN103075718B (zh) | 2011-10-26 | 2011-10-26 | 灯壳式散热器的制作方法、灯壳式散热器及led照明装置 |
CN201120413445.4 | 2011-10-26 | ||
CN201110329640.3 | 2011-10-26 |
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WO2013060211A1 true WO2013060211A1 (zh) | 2013-05-02 |
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PCT/CN2012/081647 WO2013060211A1 (zh) | 2011-10-26 | 2012-09-20 | 灯壳式散热器的制作方法、灯壳式散热器及led照明装置 |
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WO (1) | WO2013060211A1 (zh) |
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CN103177665A (zh) * | 2013-04-08 | 2013-06-26 | 深圳市雷迪奥光电技术有限公司 | 一种led显示屏 |
US20140301088A1 (en) * | 2013-04-08 | 2014-10-09 | Radiant Opto-Elec Technology Co., Ltd. | Led display screen |
KR101407194B1 (ko) * | 2013-05-10 | 2014-06-12 | 현대오트론 주식회사 | 차량의 전자제어장치 |
CN106152078A (zh) * | 2014-10-29 | 2016-11-23 | 黄子晋 | 高效能低成本led灯散热保护机构 |
CN105546496A (zh) * | 2014-10-29 | 2016-05-04 | 黄子晋 | 超耐用低成本安全节能led灯 |
CN104438593B (zh) * | 2014-11-14 | 2016-05-11 | 厦门海莱照明有限公司 | 一种把圆形铝片冲压成壶形led灯散热器的生产线 |
CN104595873A (zh) * | 2015-01-20 | 2015-05-06 | 江苏翠钻照明有限公司 | 一体成型的led散热器及其制备方法 |
CN106152079A (zh) * | 2015-04-09 | 2016-11-23 | 黄子晋 | 高效能低成本led灯散热保护机构的制造方法 |
WO2017091970A1 (zh) * | 2015-12-01 | 2017-06-08 | 袁志贤 | 高散热led模组 |
CN105927875B (zh) * | 2016-06-23 | 2022-10-14 | 刘骁洋 | 具有进、出口散热结构的led灯具 |
CN108591855A (zh) * | 2018-05-17 | 2018-09-28 | 浙江安吉成新照明电器有限公司 | 一种led吊灯的生产工艺 |
CN111853597B (zh) * | 2020-06-29 | 2022-03-11 | 宁波凯耀电器制造有限公司 | 插拔头灯具 |
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US9810416B2 (en) | 2017-11-07 |
US20140247609A1 (en) | 2014-09-04 |
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