WO2013059994A1 - 扩光led灯 - Google Patents

扩光led灯 Download PDF

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Publication number
WO2013059994A1
WO2013059994A1 PCT/CN2011/081298 CN2011081298W WO2013059994A1 WO 2013059994 A1 WO2013059994 A1 WO 2013059994A1 CN 2011081298 W CN2011081298 W CN 2011081298W WO 2013059994 A1 WO2013059994 A1 WO 2013059994A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
led lamp
transparent
layer
reflective
Prior art date
Application number
PCT/CN2011/081298
Other languages
English (en)
French (fr)
Inventor
张利强
Original Assignee
宁波市佰仕电器有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宁波市佰仕电器有限公司 filed Critical 宁波市佰仕电器有限公司
Priority to EP11790847.5A priority Critical patent/EP2770245A4/en
Priority to US13/379,036 priority patent/US8851731B2/en
Publication of WO2013059994A1 publication Critical patent/WO2013059994A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0025—Combination of two or more reflectors for a single light source
    • F21V7/0033—Combination of two or more reflectors for a single light source with successive reflections from one reflector to the next or following
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F21S6/002—Table lamps, e.g. for ambient lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0091—Reflectors for light sources using total internal reflection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lighting device, and more particularly to a light-emitting LED lamp.
  • the LED light is illuminated by a light-emitting diode, which itself is a solid-state semiconductor device that converts electricity directly into light. It has a wide range of applications due to its high luminous efficiency, low power consumption, long life, easy control, maintenance-free, safe and environmentally friendly.
  • the object of the present invention is to provide a light-expanding LED lamp with novel structure, good light-expanding effect and obvious heat-dissipating effect, in view of the above problems existing in the prior art.
  • the light-expanding LED lamp of the present invention is mainly composed of an LED blue light chip and a transparent light guiding column, wherein the substrate of the LED blue light chip is provided with a wall made of a reflective heat conductive material, and the chip is disposed on the chip.
  • the upper surface of the substrate in the surrounding wall is covered with a transparent heat conducting layer
  • the lower part of the transparent light guiding column is provided with a cover plate
  • the bottom surface of the cover plate is provided with a stepped groove matched with the LED blue chip
  • the upper surface of the cover plate is provided with a light reflecting layer
  • the top surface thereof is provided with a fluorescent layer
  • the top of the transparent light guiding column is provided with a reflective structure, and the fluorescent layer is not in contact with the LED blue light chip.
  • the above-mentioned retroreflective structure is a cavity or a reflector of a regular geometry or an irregular geometry disposed at the top of the transparent light guide. So designed, can be expanded according to different It is set with the need of light effect, and has good adaptability and selectivity.
  • the shape of the cavity package includes a cone or a sphere or a regular polyhedron or an irregular polyhedron, and a reflective layer is disposed in the cavity, and the reflective cover has a reflective layer on the bottom surface thereof. This is designed to enable efficient light expansion.
  • the above reflective thermal conductive material is thermally conductive plastic or metal surface plating or
  • UV paint is an ultraviolet curing coating, which is a coating which can be rapidly cured into a film in a few seconds under the irradiation of ultraviolet (UV). This is designed to give it a good reflective effect.
  • the above substrate is made of ceramic or aluminum.
  • the design is such that it has a better heat dissipation effect, and at the same time, the substrate is a plate type, the material is less, and the cost is low.
  • the above transparent heat conductive layer is formed into a concave lens or a plane mirror or a convex lens. So designed to achieve a light distribution.
  • the above transparent light guide column is made of acrylic or polycarbonate. It is designed to have a good light transmission effect.
  • the above fluorescent layer may be overcoated or internally coated or filled on a transparent light guiding column.
  • the above transparent heat conductive layer is made of a silicone rubber or an epoxy resin material.
  • the beneficial effects of the invention are:
  • the shape of the transparent silicone rubber layer can achieve different light distribution effects and solve glare.
  • the chip and the fluorescent layer are not in direct contact, and the chip is protected by a transparent silicone rubber layer and made of a reflective heat-conducting material to make the wall and the phosphor have the characteristics of less heat accumulation and good heat dissipation, thereby improving the luminous flux of the whole system.
  • the method of separating the phosphor and the chip is convenient for the chip to be separated and the transparent cover to make up the powder to more easily control the consistency of the product, so that the color difference of the product is smaller.
  • Embodiment 1 is a schematic diagram of Embodiment 1 of the present invention.
  • FIG. 2 is a perspective view of a transparent light guide column according to an embodiment of the present invention.
  • FIG. 3 is a schematic perspective view showing the structure of an LED blue chip of the present invention.
  • FIG. 4 is a schematic diagram of Embodiment 2 of the present invention.
  • Figure 5 is a perspective view of a transparent light guide column of the second embodiment of the present invention.
  • 1 is an LED blue chip
  • 2 is a transparent light guide column
  • 3 is a substrate
  • 4 is a wall
  • 5 is a chip
  • 6 is a transparent heat conduction layer
  • 7 is a cover plate
  • 8 is a second step groove
  • 9 is a reflective layer.
  • 10 is a fluorescent layer
  • 11 is a cavity
  • 12 is a reflector.
  • the light-expanding LED lamp of the present invention is mainly composed of an LED blue chip 1 and a transparent light guiding column 2, wherein the substrate 3 of the LED blue chip 1 is provided with a surface of a thermally conductive plastic. a wall 4 made of silver, the chip 5 is disposed in the wall 4, and the upper surface of the substrate 3 in the wall 4 is covered with a transparent heat conducting layer 6.
  • the lower portion of the transparent light guiding column 2 is provided with a cover 7 and a bottom surface of the cover 7.
  • a stepped groove matched with the LED blue chip 1 is provided, and a sidewall of the second stepped groove 8 and an upper surface of the cover plate 7 are provided with a light reflecting layer 9, and a top surface thereof is provided with a fluorescent layer 10, and the transparent light guiding column 2 is provided at the top There is a reflective structure, and the fluorescent layer is not in contact with the LED blue chip.
  • the substrate 3 of the present embodiment is made of ceramic, and the reflective structure is a cavity 11 having a tapered shape, and the inner surface of the cavity 11 is provided with a light reflecting layer 9 for reflecting the light excited by the chip 5.
  • the chip 5 of this embodiment is a blue chip 5.
  • the transparent heat conducting layer 6 covering the substrate 3 in the wall 4 is made into a plane mirror, and the light excited by the chip 5 is mirror-reflected.
  • the transparent light guiding column 2 of the present embodiment is made of an acrylic material.
  • the stepped groove disposed on the bottom surface of the cover plate 7 is a two-stage stepped groove, the first stepped groove is matched with the substrate 3, and the second stepped groove 8 is opposite to the outer ring of the surrounding wall 4 disposed on the substrate 3. In cooperation, the depth of the second stepped groove 8 is greater than the height of the surrounding wall 4.
  • the top surface of the second stepped groove 8 is coated with a fluorescent layer 10 of phosphor powder,
  • the blue light-emitting phosphor of the blue chip 5 generates white light, and the white light generated by the reflective layer 9 of the tapered cavity 11 is reflected downward, and then the light-reflecting layer 9 disposed on the upper surface of the cover plate 7 is again diffused and reflected. Achieve the light expansion effect.
  • the light-reflecting layer 9 of the present embodiment is a metal surface plating, and the substrate may be pure copper, copper alloy, iron, stainless steel, zinc alloy die-casting, aluminum or aluminum alloy, etc.
  • the metal of the embodiment is chrome-plated on the surface of pure copper.
  • the reflective heat conductive material may also be a metal of the above substrate, and may be plated with chromium or brushed nickel or the like on its surface.
  • Embodiment 2 As shown in FIG. 3 to FIG. 5, this embodiment is basically the same as Embodiment 1. The difference is that the reflective structure is a reflector 12 disposed on the top of the transparent light guiding column 2, and the bottom surface of the reflector 12 is provided.
  • the light reflecting layer 9 can reflect the light excited by the chip 5 disposed in the middle of the LED blue chip 1.
  • the outer surface of the cover 7 disposed at the lower part of the transparent light guiding column 2 is provided with a curved surface, which is disposed at the bottom of the reflector 12 The light reflected by the reflective layer 9 is diffused and reflected to achieve the effect of light expansion.
  • the transparent heat conducting layer 6 disposed in the upper surface wall 4 of the substrate 3 is formed into a convex lens.
  • the transparent light guiding column 2 is made of polycarbonate, and the cover plate 7 is integrally formed with the transparent light guiding column 2.
  • the wall 4 of the present embodiment is made of brushed nickel on a copper surface.
  • Embodiment 3 This embodiment is basically the same as Embodiment 1. The difference is that the substrate 3 of the LED blue chip 1 matched with the cover 7 is made of aluminum, and the wall 4 disposed on the substrate 3 is used. The copper alloy is plated with brushed nickel to give it a good reflective effect.
  • the retroreflective structure disposed on the top of the transparent light guiding column 2 in this embodiment is a cavity 11 having an irregular geometry, and the cavity 11 is provided with a reflective layer 9 made of brushed nickel on a copper alloy surface.
  • the transparent heat conducting layer 6 disposed in the surrounding wall 4 is formed into a concave mirror to achieve a light distribution function.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种扩光LED灯，其主要由LED蓝光芯片(1)及透明导光柱(2)组成，其中，所述LED蓝光芯片(1)的基板(3)上设有由反光导热材料制成的围墙(4)，其芯片(5)设置在围墙(4)内，其围墙(4)内的基板(3)上表面覆盖有透明导热层(6)，所述透明导光柱(2)下部设有盖板(7)，该盖板(7)底面设有与LED蓝光芯片(1)匹配的阶梯槽，其第二阶梯槽(8)的侧壁及盖板(7)的上表面设有反光层(9)，其顶面设有荧光层(10)，所述透明导光柱(2)顶部设有反光结构。该扩光LED灯可实现不同曲线的配光效果，提升整个***的光通量、色温、电参数的稳定性，同时降低了光衰，提升了光通维持率。

Description

书
扩光 LED灯
技术领域 本发明属于一种照明装置， 特指一种扩光 LED灯。
说
背景技术
LED 灯是釆用发光二极管经行发光， 其本身是一种固态的半导 体器件， 它可将电直接转化成光。 其具有光效高、 耗电少， 寿命长、 易控制、 免维修、 安全环保等特点而被广泛的应用。
现有 LED 灯在扩光时需增加扩光罩经行扩光， 现有扩光罩对 LED 灯进行扩光时效果不佳， 其光通量及色温不稳定， 同时， 现有 LED 灯的散热大多釆用体积较大的铝块进行散热， 用料较多， 成本 较高。 发明内容 本发明的目的是针对现有技术所存在的所述问题，特提供一种结 构新颖， 扩光效果好， 散热效果明显的扩光 LED灯。
为解决所述技术问题， 本发明扩光 LED灯， 其主要由 LED蓝光 芯片及透明导光柱组成， 其中， 上述 LED蓝光芯片的基板上设有由 反光导热材料制成的围墙， 其芯片设置在围墙内， 其围墙内的基板上 表面覆盖有透明导热层， 上述透明导光柱下部设有盖板， 该盖板底面 设有与 LED蓝光芯片匹配的阶梯槽， 其第二阶梯槽的侧壁及盖板的 上表面设有反光层， 其顶面设有荧光层， 上述透明导光柱顶部设有反 光结构， 上述荧光层与上述 LED蓝光芯片不接触。
作为优化，上述反光结构为设置在透明导光柱顶部的规则的几何 体或者不规则的几何体的空腔或者反光罩。 如此设计， 可根据不同扩 光效果的需要而进行设定， 具有较好的适应性和选择性。
作为优化，上述空腔包的形状括有锥形体或者球体或者正多面体 或者不规则多面体， 其空腔内设有反光层， 上述反光罩的底面设有反 光层。 如此设计， 使其能够有效的进行扩光。
作为优化，上述反光导热材料为导热塑料或者金属表面电镀或者
UV漆。 其中， 上述 UV漆（ Ultraviolet Curing Paint )是一种紫外光 固化涂料， 是一种在紫外线 （ultraviolet, 简称 UV ) 的照射下能够在 几秒钟内迅速固化成膜的涂料 。 如此设计， 使其具有良好的反光效 果。
作为优化， 上述基板由陶瓷或者铝制成。 如此设计， 使其具有较 好的散热效果， 同时， 其基板为板型， 用料较少， 成本低。
作为优化， 上述透明导热层制成凹透镜或者平面镜或者凸透镜。 如此设计， 使其达到一次配光的作用。
作为优化， 上述透明导光柱由亚克力或者聚碳酸酯制成。 如此设 计， 使其具有较好的透光效果。
作为优化， 上述荧光层可外涂或者内涂或者填充在透明导光柱 上。
作为优化， 上述透明导热层釆用硅橡胶或者环氧树脂材料制成。 本发明的有益效果是：
1、 实现大于 270度的扩光效果， 根据 "V"字型形状不同， 透明硅 橡胶层的形状不同可以实现不同曲线的配光效果， 解决眩光。
2、 芯片与荧光层不直接接触， 并且芯片通过透明硅橡胶层做保 护及釆用反光导热材料制做围墙达到芯片和荧光粉都具有聚热少，散 热好的特点， 提升了整个***的光通量、 色温、 电参数的稳定性， 同 时降低了光衰提升了光通维持率。
3、 釆用荧光粉和芯片分开的方式， 方便芯片分开及透光罩补粉 更容易控制产品的一致性， 使产品的色差更小。 附图说明
下面结合附图对本发明扩光 LED灯作进一步说明：
图 1是本发明实施例一的原理图；
图 2是本发明实施例一透明导光柱的透视图；
图 3是本发明 LED蓝光芯片的立体结构示意图；
图 4是本发明实施例二的原理图；
图 5是本发明实施例二透明导光柱的透视图。
图中， 1为 LED蓝光芯片， 2为透明导光柱， 3为基板， 4为围 墙， 5为芯片， 6为透明导热层， 7为盖板， 8为第二阶梯槽， 9为反 光层， 10为荧光层， 11为空腔， 12为反光罩。
具体实施方式
实施方式一： 如图 1至 3所示， 本发明扩光 LED灯， 其主要由 LED蓝光芯片 1及透明导光柱 2组成， 其中， 上述 LED蓝光芯片 1 的基板 3上设有由导热塑料表面镀银制成的围墙 4, 其芯片 5设置在 围墙 4内， 其围墙 4内的基板 3上表面覆盖有透明导热层 6, 上述透 明导光柱 2下部设有盖板 7 , 该盖板 7底面设有与 LED蓝光芯片 1 匹配的阶梯槽，其第二阶梯槽 8的侧壁及盖板 7的上表面设有反光层 9, 其顶面设有荧光层 10, 上述透明导光柱 2顶部设有反光结构， 上 述荧光层与上述 LED蓝光芯片不接触。
本实施例基板 3釆用陶瓷制成，上述反光结构为形状是锥形的空 腔 11 , 其空腔 11的内表面设置有反光层 9, 可将芯片 5激发的光线 进行反射。 本实施例芯片 5为蓝光芯片 5。
上述覆盖在围墙 4内基板 3上的透明导热层 6制成平面镜，将芯 片 5激发的光线作镜面的反射。
其本实施例的透明导光柱 2釆用亚克力材料制成。
上述设置在盖板 7底面的阶梯槽为二级阶梯槽，其第一阶梯槽与 基板 3相配合，其第二阶梯槽 8与设置在基板 3上的围墙 4的外圈相 配合， 上述第二阶梯槽 8的深度大于围墙 4的高度。 上述第二阶梯槽 8的顶面涂有荧光粉的荧光层 10,
其蓝光芯片 5的蓝光激发荧光粉产生白光， 通过锥形空腔 11的 反光层 9将产生的白光向下反射，再通过设置在盖板 7上表面的反光 层 9再次进行扩光反射， 最终达到扩光效果。
本实施例上述的反光层 9为金属表面电镀， 其基材可以是纯铜、 铜合金、 铁、 不锈钢、 锌合金压铸件、 铝及铝合金等， 本实施例金属 为纯铜表面镀铬。
其反光导热材料也可以是上述基材的金属，可在其表面镀铬或者 拉丝镍等电镀材料。
实施方式二：如图 3至 5所示，本实施例与实施方式一基本相同， 所不同的是上述的反光结构为设置在透明导光柱 2顶部的反光罩 12, 该反光罩 12的底面设有反光层 9, 可将设置在 LED蓝光芯片 1中部 的芯片 5激发的光进行反射， 同时， 设置在透明导光柱 2下部的盖板 7外圆周设有弧面， 将设置在反光罩 12底部的反光层 9反射的光线 进行扩光反射， 达到扩光的效果。
其中，本实施例设置在基板 3上表面围墙 4内的透明导热层 6制 成凸透镜， 同时， 透明导光柱 2由聚碳酸酯制成， 其盖板 7与透明导 光柱 2制成一体。
本实施例的围墙 4釆用铜表面镀拉丝镍制成。
实施方式三： 本实施例与实施方式一基本相同， 所不同的是上述 与盖板 7相匹配的 LED蓝光芯片 1的基板 3釆用铝制成， 其设置在 基板 3上的围墙 4釆用铜合金表面镀拉丝镍制成，使其具有 好的反 光效果。
本实施例设置在透明导光柱 2顶部的反光结构为形状是不规则 的几何体的空腔 11 , 其空腔 11内设有由铜合金表面镀拉丝镍制成的 反光层 9。 上述设置在围墙 4内的透明导热层 6制成凹面镜，达到一次配光 的作用。
图略。
以上上述仅是本发明的优选实施方式， 应当指出， 对于本技术领 域的普通技术人员来说， 在不脱离本发明技术原理的前提下， 还可以 做出若干改进和润饰， 这些改进和润饰也应视为本发明的保护范围。

Claims

权 利 要 求 书
1、 一种扩光 LED灯， 其主要由 LED蓝光芯片及透明导光柱组 成， 其特征在于： 所述 LED蓝光芯片的基板上设有由反光导热材料 制成的围墙， 其芯片设置在围墙内， 其围墙内的基板上表面覆盖有透 明导热层， 所述透明导光柱下部设有盖板， 该盖板底面设有与 LED 蓝光芯片匹配的阶梯槽，其第二阶梯槽的侧壁及盖板的上表面设有反 光层， 其顶面设有荧光层， 所述透明导光柱顶部设有反光结构， 所述 荧光层与所述 LED蓝光芯片不接触。
2、 根据权利要求 1所述的扩光 LED灯， 其特征在于： 所述反光 结构为设置在透明导光柱顶部的规则的几何体或者不规则的几何体 的空腔或者反光罩。
3、 根据权利要求 2所述的扩光 LED灯， 其特征在于： 所述空腔 的形状包括有锥形体或者球体或者正多面体或者不规则多面体，其空 腔内设有反光层， 所述反光罩的底面设有反光层。
4、 根据权利要求 1所述的扩光 LED灯， 其特征在于： 所述反光 导热材料为导热塑料或者金属表面电镀或者 UV漆。
5、 根据权利要求 1所述的扩光 LED灯， 其特征在于： 所述基板 由陶瓷或者铝制成。
6、 根据权利要求 1所述的扩光 LED灯， 其特征在于： 所述透明 导热层制成凹透镜或者平面镜或者凸透镜。
7、 根据权利要求 1所述的扩光 LED灯， 其特征在于： 所述透明 导光柱由亚克力或者聚碳酸酯制成。
8、 根据权利要求 1所述的扩光 LED灯， 其特征在于： 所述荧光 层可外涂或者内涂或者填充在透明导光柱上。
9、 根据权利要求 1所述的扩光 LED灯， 其特征在于： 所述透明 导热层釆用硅橡胶或者环氧树脂材料制成。
PCT/CN2011/081298 2011-10-24 2011-10-25 扩光led灯 WO2013059994A1 (zh)

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