WO2013038802A1 - Surface light emitting device and liquid crystal display device provided with same - Google Patents

Surface light emitting device and liquid crystal display device provided with same Download PDF

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Publication number
WO2013038802A1
WO2013038802A1 PCT/JP2012/068158 JP2012068158W WO2013038802A1 WO 2013038802 A1 WO2013038802 A1 WO 2013038802A1 JP 2012068158 W JP2012068158 W JP 2012068158W WO 2013038802 A1 WO2013038802 A1 WO 2013038802A1
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WO
WIPO (PCT)
Prior art keywords
region
light emitting
mounting portion
light
substrate mounting
Prior art date
Application number
PCT/JP2012/068158
Other languages
French (fr)
Japanese (ja)
Inventor
信二 住ノ江
Original Assignee
シャープ株式会社
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Publication date
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Publication of WO2013038802A1 publication Critical patent/WO2013038802A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details

Definitions

  • the present invention relates to a surface light emitting device having a plurality of light emitting elements and a liquid crystal display device including the surface light emitting device.
  • FIG. 10 is a cross-sectional view showing a schematic configuration of a conventional liquid crystal display device 100 including a direct type backlight 101.
  • 10 is a horizontal sectional view, and the direction in which the LEDs (light emitting diodes) 102 are arranged in FIG. 10 corresponds to the left-right direction of the liquid crystal display device 100.
  • the backlight 101 includes a plurality of LEDs 102, an LED substrate 103, a diffusion plate 104, a backlight chassis 105, a reflection sheet 106, and a circuit substrate 107.
  • Such a backlight 101 and a liquid crystal panel 108 are fixed to a cabinet 110 via a fixing member 109 to constitute a liquid crystal display device 100.
  • the plurality of LEDs 102 are mounted on and supported by the LED substrate 103.
  • the diffusing plate 104 diffuses the light emitted from each LED 102 to make it uniform and emit it.
  • the backlight chassis 105 includes a flat substrate mounting portion 105a on which the LED substrate 103 is mounted, and a diffusion plate support portion 105b that is connected to the substrate mounting portion 105a and supports the diffusion plate 104 positioned on the light emitting side of each LED 102. And have.
  • the reflection sheet 106 has an opening corresponding to the position of each LED 102, and is formed on the surface of the substrate mounting portion 105 a and the diffusion plate support portion 105 b so as to cover the LED substrate 103.
  • the circuit board 107 includes a circuit board for controlling the light emission of each LED 102 and a circuit board for driving the liquid crystal panel 108.
  • the liquid crystal panel 108 is provided on the light emission side of the diffusion plate 104 via optical sheets (not shown) including a lens sheet and the like.
  • the circuit board 107 is disposed on the opposite side of the diffusion plate 104 with the substrate mounting portion 105a of the backlight chassis 105 and the gap S therebetween.
  • the gap S is provided between the board mounting portion 105a and the circuit board 107 because the heat generated in the LED 102 and the heat generated in the circuit board 107 are mixed with each other and the temperature rises. This is for the purpose of suppressing and ensuring a ventilation path for heat dissipation of the LED 102 and the circuit board 107.
  • the configuration in which the circuit board 107 is arranged via the flat board mounting portion 105a and the gap S is similarly adopted in the liquid crystal display device disclosed in Patent Document 1, for example.
  • JP 2011-134474 A (see FIG. 1 etc.)
  • the thickness of the backlight 101 increases accordingly. That is, in the configuration of FIG. 10, the thickness of the thickest portion of the backlight 101 is the distance from the circuit board 107 to the diffusion plate 104, and the thickness of the backlight 101 includes the gap S and the thickness of the circuit board 107. Therefore, the thickness of the backlight 101 increases accordingly.
  • the present invention has been made to solve the above-described problems, and its purpose is to reduce the thickness of the circuit board and the light emitting element without hindering heat dissipation even when the circuit board is arranged outside the board mounting portion.
  • An object of the present invention is to provide a surface light emitting device capable of performing the above and a liquid crystal display device including the surface light emitting device.
  • the surface light-emitting device of the present invention includes an element mounting substrate on which a plurality of light emitting elements are mounted, a diffusion plate that diffuses and emits light emitted from each of the light emitting elements, and a substrate mounting portion on which the element mounting substrate is mounted
  • a chassis member coupled to the substrate mounting portion and having a diffusion plate support portion for supporting the diffusion plate located on the light emitting side of each light emitting device, and for controlling light emission of each light emitting device
  • a surface light emitting device including a circuit board, wherein the board mounting portion of the chassis member has a distance between the board mounting portion and the diffusion plate being different in at least two regions, and the distance is the same in the same region.
  • the chassis member is formed to be bent and the longest distance among the at least two areas is a first area, and the distance is shorter than the first area.
  • the circuit board is a space formed on the opposite side of the diffuser plate with respect to the substrate mounting portion in the second region, and the circuit board is bent by the substrate mounting portion. It is characterized in that it is arranged in a space corresponding to a step between the first region and the second region with a gap between the substrate mounting portion of the second region and the second region.
  • the circuit board is a space formed on the side opposite to the diffusion plate with respect to the substrate mounting portion in the second region, and the first region and the second region due to the bending of the substrate mounting portion.
  • the thickness of the thickest part of the surface light emitting device is from the substrate mounting part of the first region to the diffusion plate regardless of the thickness of the circuit board. Distance.
  • the circuit board is disposed in the space via the substrate mounting portion in the second region and the gap, the circuit board and the light emitting element can be dissipated by ventilating the gap. Therefore, the surface light emitting device can be thinned without impeding the heat dissipation of the circuit board and the light emitting element.
  • the chassis member has a recess formed by a part of the substrate mounting portion being recessed toward the diffusion plate, and the substrate mounting portion in the second region is The bottom of the recess is formed, and the circuit board is disposed in the recess, and is disposed through a gap with the substrate mounting portion in the second region that forms the bottom of the recess. May be.
  • the thickness of the thickest portion of the surface light emitting device is determined by the board mounting portion.
  • the surface light emitting device can be made thinner as compared with the configuration in which the circuit board protrudes outward from the flat substrate mounting portion.
  • the circuit board and the light emitting element can be dissipated by ventilating the gap. it can. Therefore, even if it is the structure which provides a circuit board in a recessed part, a surface emitting device can be reduced in thickness, without inhibiting heat dissipation of a circuit board and a light emitting element.
  • each light-emitting element is disposed in both the first region and the second region of the chassis member, and the arrangement density of the light-emitting elements in the second region May be higher than the arrangement density of the light emitting elements in the first region.
  • the distance between the light emitting element and the diffusion plate is shorter in the second region than in the first region. For this reason, in the second region, optical luminance unevenness is more likely to occur when each light emitting element emits light than in the first region.
  • the arrangement density of the light emitting elements in the second region higher than the arrangement density of the light emitting elements in the first region, the distance between the light emitting elements in the second region is shortened. Brightness unevenness can be reduced.
  • a light guide plate that guides light incident from an end face and emits the light toward the diffuser plate between the substrate mounting portion in the second region and the diffuser plate.
  • Each light emitting element is disposed in the first region and emits light toward the diffusion plate, and second light emission that emits light toward the end face of the light guide plate. And an element.
  • each light emitting element when each light emitting element is positioned between the substrate mounting portion in the second region and the diffusion plate and each light emitting element emits light toward the diffusion plate, the distance between each light emitting element and the diffusion plate Therefore, optical brightness unevenness is likely to occur when each light emitting element emits light.
  • the edge light method in which light is incident on the end face of the light guide plate and the surface light is emitted, uneven luminance can be reduced by surface light emission, but light loss occurs when light enters the light guide plate. Usage efficiency tends to decrease.
  • a light guide plate is disposed between the substrate mounting portion in the second region and the diffusion plate, and among the light emitting devices, the first light emitting device located in the first region emits light toward the diffusion plate.
  • the luminance unevenness is reduced by surface light emission on the light guide plate,
  • the direct type it is possible to avoid a decrease in light utilization efficiency that occurs in the edge light system.
  • the second region includes a central portion of the substrate mounting portion.
  • the circuit board In the central part of the board mounting part, heat is more likely to accumulate than the peripheral part, and the temperature tends to rise. Therefore, in the second region including the central portion of the substrate mounting portion, the circuit board is positioned in the space opposite to the diffusion plate with respect to the substrate mounting portion via the gap, so that the gap is used for heat dissipation. It is possible to reduce the thickness of the device while securing the ventilation path and improving the heat dissipation at least in the central portion of the substrate mounting portion.
  • the liquid crystal display device of the present invention may include the above-described surface light emitting device of the present invention and a liquid crystal panel that displays an image by modulating light supplied from the surface light emitting device.
  • the circuit board is a space formed on the side opposite to the diffusion plate with respect to the substrate mounting portion in the second region, and the first region and the second region due to the bending of the substrate mounting portion. Since it is arranged in a space corresponding to a step with the region, the thickness of the thickest portion of the surface light emitting device can be the distance from the substrate mounting portion of the first region to the diffusion plate, and surface light emission The apparatus can be thinned. Moreover, since the circuit board is disposed in the space via the substrate mounting portion in the second region and the gap, the circuit board and the light emitting element can be dissipated by ventilating the gap, The surface light emitting device can be thinned without hindering such heat dissipation.
  • FIG. 1 is a cross-sectional view showing a schematic configuration of a liquid crystal display device 1 of the present embodiment.
  • 1 is a horizontal sectional view, and the direction in which the LEDs 11 are arranged in FIG. 1 corresponds to the left-right direction of the liquid crystal display device 1, and the direction perpendicular to the plane of FIG. 1 corresponds to the up-down direction.
  • the cross-sectional views appearing below are also horizontal cross-sectional views unless otherwise specified, and the correspondence between the left, right, and top and bottom directions is the same as that in FIG.
  • the liquid crystal display device 1 is configured by fixing a backlight 2 and a liquid crystal panel 3 to a cabinet 5 via a fixing member 4.
  • the backlight 2 is a surface light emitting device for illuminating the liquid crystal panel 3 in a planar shape.
  • the liquid crystal panel 3 is a liquid crystal display element that displays light by modulating light supplied from the backlight 2.
  • details of the backlight 2 will be described.
  • FIG. 2 is a cross-sectional view showing the configuration of the backlight 2.
  • the backlight 2 includes an LED 11 as a plurality of light emitting elements, an LED substrate 12, a diffusion plate 13, a backlight chassis 14, a reflection sheet 15, and a circuit board 16, and in this embodiment, a direct type This is a surface light emitting device.
  • the plurality of LEDs 11 are mounted and supported in a line shape (left and right direction in FIG. 1) on an LED substrate 12 as a substrate for mounting light emitting elements.
  • Each LED board 12 is arranged side by side so that the plurality of LEDs 11 are two-dimensionally arranged.
  • the diffusion plate 13 diffuses and uniformizes the light emitted from each LED 11 that is a point light source, and emits the light in a planar shape.
  • the diffusion plate 13 is formed in a flat plate shape and disposed on the light emitting side of each LED 11. .
  • the backlight chassis 14 is a chassis member formed by bending one sheet metal into a predetermined shape, and includes a substrate mounting portion 14a on which a plurality of LED substrates 12 are mounted, and a diffusion plate support portion that supports the diffusion plate 13. 14b.
  • the diffusion plate support portion 14b is connected to the end portion of the substrate mounting portion 14a and supports the diffusion plate 13 located on the light emission side of each LED 11. More specifically, the diffusion plate support portion 14b is formed to extend obliquely from the end of the substrate mounting portion 14a toward the diffusion plate 13 and then be bent at an obtuse angle so as to be parallel to the diffusion plate 13. The diffusion plate 13 is supported by the bent end portion.
  • the reflection sheet 15 has an opening corresponding to the position of each LED 11, and is formed on the surface of the substrate mounting portion 14 a and the diffusion plate support portion 14 b so as to cover the LED substrate 12.
  • the circuit board 16 is a circuit board for controlling the light emission of each LED 11.
  • the circuit board 16 may include a circuit board for driving the liquid crystal panel 3 (see FIG. 1) and other boards (power supply board, control board).
  • the liquid crystal panel 3 is provided on the light emission side of the diffusion plate 13 via optical sheets (not shown) including a lens sheet, a prism sheet, a retroreflective sheet, and the like.
  • a recess 21 is formed in the substrate mounting portion 14a of the backlight chassis 14.
  • the recess 21 is formed by a part of the flat substrate mounting portion 14a being recessed toward the diffusion plate 13 side.
  • the concave portion 21 is formed in a groove shape along the vertical direction in the central portion of the substrate mounting portion 14 a corresponding to the central portion in the left-right direction of the backlight 2.
  • the shape in the horizontal cross section of the backlight chassis 14 becomes a substantially W shape as a whole, as shown in FIG.
  • the circuit board 16 described above is disposed in the recess 21, and is disposed via the substrate mounting portion 14 a that forms the bottom of the recess 21 and the gap S.
  • the substrate mounting portion 14 a that forms the bottom of the recess 21 is the substrate mounting portion 14 a that is located on the opposite side of the opening 21 a of the recess 21, and the LED substrate 12 is placed in the formation region of the recess 21.
  • the substrate mounting portion 14a is the substrate mounting portion 14 a that is located on the opposite side of the opening 21 a of the recess 21, and the LED substrate 12 is placed in the formation region of the recess 21.
  • the thickness of the thickest part of the backlight 2 is changed from a portion other than the formation region of the recess 21 in the substrate mounting portion 14 a to the diffusion plate 13.
  • the backlight 2 can be thinned.
  • the thickness of the surface light emitting device is opposite to that of the diffusion plate as in the conventional configuration in which the circuit board is arranged with a gap between the substrate mounting portion and the substrate mounting portion in a flat shape. It is not necessary to consider the distance (including the thickness of the circuit board) of the portion protruding to the side, and the surface light emitting device can be made thinner accordingly.
  • a thin liquid crystal display device 1 that illuminates the liquid crystal panel 3 with a thin surface light emitting device can be realized. Therefore, when the liquid crystal display device 1 is commercialized as, for example, a liquid crystal television, the commercial value can be increased at least in terms of thinness.
  • the circuit board 16 when the circuit board 16 is provided behind the LED 11, the heat generated by the LED 11 and the heat generated by the circuit board 16 are mixed with each other and the temperature is likely to rise.
  • the circuit board 16 is disposed via the substrate mounting portion 14 a that forms the bottom of the recess 21 and the gap S, and there is a gap S between the LED 11 and the circuit board 16. Therefore, by ventilating the gap S, the LED 11 and the circuit board 16 can be dissipated. Therefore, the backlight 2 and thus the liquid crystal display device 1 can be thinned without hindering the heat radiation of the LED 11 and the circuit board 16.
  • the surface area of the substrate mounting portion 14a is increased due to the formation of the recess 21 and the ventilation area is increased, the heat dissipation effect by ventilation can be further enhanced.
  • the gap S can be increased to suppress mutual interference between the heat of the LED 11 and the heat of the circuit board 16.
  • a high-definition liquid crystal television having a resolution of 4000 ⁇ 2000 pixels or more is called 4K2K (K indicates 10 3 ), and has a pixel number four times that of full HD (full high definition).
  • K indicates 10 3
  • full HD full high definition
  • the edge light method using the light guide plate causes loss when entering the light guide plate and lowers the light utilization efficiency as compared with the direct type, so that the power consumption increases. Furthermore, in the edge light system, it is necessary to use a thick light guide plate in consideration of warpage of the light guide plate, but in this case, the weight becomes heavy.
  • the backlight 2 of the present embodiment is a direct type in which the LEDs 11 are two-dimensionally arranged, has high light utilization efficiency, can sufficiently obtain luminance, and has the concave portion 21 as described above. Thinning can be realized without considering the thickness of the circuit board 16, and a light guide plate such as an edge light system is unnecessary (since the weight of the light guide plate need not be considered), the above high-definition liquid crystal It will be suitable for television.
  • the recess 21 is formed in a size that can further accommodate a reinforcing member for securing the overall strength of the liquid crystal display device 1, a speaker, a wall hanging member (wall hanging bracket), and the like. Then, all of these members or at least one of these members may be disposed in the recess 21. Even in this case, the amount of protrusion of the member from the back surface of the backlight chassis 14 is reliably reduced and the thickness of the liquid crystal display device 1 is increased as compared with the configuration in which the reinforcing member is disposed without forming the recess 21. Can be avoided.
  • the substrate mounting portion 14a has different distances between the substrate mounting portion 14a and the diffusion plate 13 in at least two regions and the same region. Then, it can be said that it is bent and formed so that the above-mentioned distance is the same. Therefore, in the backlight chassis 14, in the backlight chassis 14, the region having the longest distance among the above two regions is referred to as a first region R1, and the region other than the first region R1, that is, the distance is the first region. A region shorter than the region R1 is referred to as a second region R2. In this case, the substrate mounting portion 14a in the second region R2 forms the bottom of the recess 21 described above.
  • the above-described circuit board 16 can also be expressed as being disposed in the space T via the board mounting portion 14a and the gap S in the second region R2.
  • the space T is a space formed on the opposite side of the diffusion plate 13 with respect to the substrate mounting portion 14a in the second region R2, and the first region R1 due to the bending of the substrate mounting portion 14a. It refers to a space corresponding to a step with the second region R2.
  • FIG. 3 shows the above-described space T by hatching different from the hatching that shows the substrate mounting portion 14a.
  • the space T is formed by the step d between the first region R1 and the second region R2 due to the bending of the substrate mounting portion 14a. Therefore, when the surface constituting the lowermost part of the space T (the surface farthest from the substrate mounting portion 14a in the second region R2 in the space T) is virtually considered, this virtual surface is the first region R1. It becomes the same surface as the surface opposite to the diffusion plate 13 in the substrate mounting portion 14a. In other words, the space T corresponding to the step d between the first region R1 and the second region R2 is further below the space T from the substrate mounting portion 14a of the first region R1 (on the opposite side to the diffusion plate 13). ) Means that it is formed without jumping out.
  • the circuit board 16 is disposed in the space T (by being disposed closer to the diffusion plate 13 than the virtual surface including the virtual plane), so that Regardless of the thickness of the circuit board 16, the thickness of the thick part can be the distance from the substrate mounting portion 14a to the diffusion plate 13 in the first region R1. Therefore, it can be said that the backlight can be thinned by arranging the circuit board 16 in the space T.
  • the circuit board 16 since the circuit board 16 is disposed in the space T via the board mounting portion 14a in the second region R2 and the gap S, the circuit board 16 inhibits heat radiation of the circuit board and the light emitting element due to the ventilation of the gap S. Therefore, the backlight 2 can be made thinner.
  • the LED substrate 12 is arranged in both the first region R1 and the second region R2, and therefore, the plurality of LEDs 11 are arranged in the first region R1. It is arranged in both the region R1 and the second region R2. At this time, the LEDs 11 are arranged such that the arrangement density of the LEDs 11 in the second region R2 is higher than the arrangement density of the LEDs 11 in the first region R1.
  • the arrangement density of each LED 11 refers to the number of LEDs 11 per unit area.
  • the distance between the LED 11 and the diffusion plate 13 is shorter in the second region R2 than in the first region R1. For this reason, if each LED 11 of 1st area
  • the light can be reliably made uniform by the diffusion by the diffusion plate 13, and the luminance unevenness can be reduced.
  • the arrangement pitch of the LEDs 11 (or the distance between the LEDs 11) and the minimum distance between the LED 11 and the diffusion plate 13 when no optical luminance unevenness occurs are in a proportional relationship, and if the arrangement pitch of the LEDs 11 is shortened. Even if the distance between the LED 11 and the diffusion plate 13 is shortened, no optical luminance unevenness occurs. On the contrary, this means that when the distance is shortened, optical luminance unevenness occurs unless the arrangement pitch of the LEDs 11 is shortened.
  • the recess 21 is formed in the substrate mounting portion 14a, the distance between the LED 11 and the diffusion plate 13 is shorter in the second region R2 than in the first region R1, By shortening the arrangement pitch of the LEDs 11 in the second region R2, it is possible to prevent optical luminance unevenness from occurring. That is, the luminance unevenness caused by forming the concave portion 21 can be easily reduced by changing the arrangement pitch of the LEDs 11 between the first region R1 and the second region R2. As a result, it is possible to realize the backlight 2 in which luminance unevenness does not occur with the minimum number of LEDs 11.
  • the LEDs 11 in the second region R2 higher than the arrangement density of the LEDs 11 in the first region R1, for example, the LEDs 11 in the first region R1 having a lower arrangement density. Can be emitted with a high luminance, and the LEDs 11 in the second region R2 having a higher arrangement density can emit a light with a low luminance to achieve uniform luminance over the entire surface. Thereby, the electric power per LED11 of 2nd area
  • region R2 can be suppressed, and the raise of the temperature of LED11 (LED terminal temperature) and the temperature rise of the solder joint part of LED11 can be suppressed.
  • the arrangement density of the LEDs 11 and the magnitude of the current flowing through the LEDs it is possible to achieve a desired brightness using the minimum number of LEDs 11 while maintaining a uniform temperature distribution. it can.
  • FIG. 4 is a cross-sectional view showing a schematic configuration of the liquid crystal display device 1 of the present embodiment.
  • the liquid crystal display device 1 has the same configuration as that of the first embodiment except that the second region R2 of the backlight 2 is an edge light system. This will be specifically described below.
  • the light guide plate 31 is disposed in the second region R2. More specifically, the light guide plate 31 is disposed between the substrate mounting portion 14 a in the second region R 2, that is, the substrate mounting portion 14 a that forms the bottom of the recess 21, and the diffusion plate 13.
  • the light guide plate 31 guides light incident from the end surface (side surface) inside and emits the light toward the diffusion plate 13 from the surface facing the diffusion plate 13.
  • FIG. 5 is a plan view (front view) when the light guide plate 31 disposed in the second region R2 is viewed from the diffusion plate 13 side.
  • each LED 11 as a point light source includes an LED 11a (see FIG. 4) as a first light emitting element constituting a direct type and an edge light.
  • LED11b (refer FIG. 5) as the 2nd light emitting element which comprises a system is included.
  • the LED 11 a is a light emitting element that is located in the first region R 1, that is, in a region other than the region where the recess 21 is formed, and emits light toward the diffusion plate 13.
  • the LED 11 b is a light emitting element that emits light toward the end face of the light guide plate 31.
  • the LED 11b may emit light toward any of the left, right, top, and bottom end surfaces of the light guide plate 31 that does not face the diffusion plate 13 (opposite any of the four left, right, top, and bottom end surfaces that do not face the diffusion plate 13). May be arranged).
  • each LED 11 When the LED 11 is arranged in the second region R2 where the concave portion 21 is formed and the LED 11 emits light toward the diffusion plate 13, the distance between each LED 11 and the diffusion plate 13 is short, so that each LED 11 As described in the first embodiment, optical luminance unevenness is likely to occur when the light is emitted.
  • the luminance unevenness can be reduced by the surface light emission, but at least about 10% due to the surface reflection when entering the light guide plate. Since light loss occurs, light utilization efficiency decreases. Therefore, in order to obtain the same luminance on the entire surface, it is necessary to increase power consumption.
  • the light guide plate 31 is disposed between the substrate mounting portion 14a and the diffusion plate 13 in the second region R2, and each LED 11a emits light toward the diffusion plate 13, while each LED 11b.
  • the use of the direct type can avoid a decrease in light utilization efficiency that occurs in the edge light system.
  • the edge light system as a part of the backlight 2, it is possible to realize the backlight 2 that is thin and has no luminance unevenness compared to a simple (entire-surface) direct-type structure, and has a thickness limitation. Since the light directing efficiency is better in the direct part (first region R1) than in the edge light system, the backlight 2 with low power consumption and excellent environmental performance can be realized.
  • the LED 11b is disposed at the end of the light guide plate 31, so that the LED is not disposed in a region where the temperature is likely to rise (for example, the central portion of the second region R2), and the temperature rises. It is also possible to avoid deterioration of LED characteristics (for example, luminance reduction).
  • the mounting portion (mounting region) of the LED substrate 12 in the substrate mounting portion 14a is composed of a central portion C and two peripheral portions P.
  • the central portion C of the substrate mounting portion 14a is a region including the center of the substrate mounting portion 14a, and is, for example, a vertically long region in the vertical direction.
  • the peripheral portion P of the substrate mounting portion 14a is a region around the central portion C.
  • the peripheral portion P is located on the left side and the right side of the central portion C and is a vertically long region.
  • the backlight chassis 14 only needs to have at least one space T corresponding to a step between the first region R1 and the second region R2, and the space T It is clear that the position to be formed is not limited to the central portion of the substrate mounting portion 14a.
  • the substrate mounting portion 14 a of the backlight chassis 14 may be formed to be bent so that one of the two peripheral portions P is shifted to the diffusion plate 13 side. Further, as shown in FIG. 7, the substrate mounting portion 14a may be formed to be bent so that the central portion C and the one peripheral portion P are combined and shifted to the diffusion plate 13 side. Further, as shown in FIG. 8, the substrate mounting portion 14a may be formed to be bent so that both peripheral portions P are shifted to the diffusion plate 13 side.
  • the backlight chassis 14 has two second regions R2, and two spaces T corresponding to the step between the first region R1 and the second region R2 are also formed. .
  • substrate mounting part 14a may be bent and formed so that the center part C and a part of both peripheral part P may shift to the diffusion plate 13 side.
  • the backlight chassis 14 has three second regions R2, and three spaces T corresponding to the step between the first region R1 and the second region R2 are also formed. . Although not shown, four or more spaces T may be formed.
  • the circuit board 16 is disposed in the space T corresponding to the step between the first region R1 and the second region R2, and the second region
  • the circuit board 16 does not jump out of the backlight chassis 14, and a gap S for heat dissipation of the LED 11 and the circuit board 16 is also secured. Therefore, similarly to the first and second embodiments, the backlight 2 and thus the liquid crystal display device 1 can be thinned without inhibiting the heat radiation of the LED 11 and the circuit board 16.
  • the second region R2 includes the central portion C of the substrate mounting portion 14a as in the configurations of FIGS.
  • a space T corresponding to a step between the first region R1 and the second region R2 is formed at least on the side opposite to the diffusion plate 13 with respect to the central portion C of the substrate mounting portion 14a.
  • the circuit board 16 By disposing the circuit board 16 in the space T via the substrate mounting portion 14a and the gap S, the heat dissipation at the central portion C of the substrate mounting portion 14a that is likely to rise in temperature due to the ventilation of the gap S is improved.
  • the backlight 2 and thus the liquid crystal display device 1 can be thinned.
  • a recess 21 constituting the space T is formed in the central portion of the substrate mounting portion 14a, and a circuit is formed in the recess 21 via the substrate mounting portion 14a and the gap S. Since the board
  • the backlight 2 and thus the liquid crystal display device 1 by appropriately combining the configurations of the above-described embodiments.
  • the configuration of the first embodiment in which the arrangement density of the LEDs 11 is changed between the first region R1 and the second region R2 can be applied to the configurations of FIGS. 6 to 9 of the third embodiment.
  • the configuration of the second embodiment in which the light guide plate 31 is provided in the second region R2 and the edge light system is used can be applied to the configurations of FIGS. 6 to 9 of the third embodiment.
  • the backlight 2 can also be used alone as a room illuminating device.
  • the surface light-emitting device of the present invention can be used, for example, for a backlight of a liquid crystal display device or a room lighting device.

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Abstract

In the present invention, a backlight chassis (14) of a back light (2) comprises a substrate mounting unit (14a) on which an LED substrate (12) is mounted and a diffuser plate support unit (14b) that is contiguous with the substrate mounting unit (14a) and that supports a diffuser plate (13) disposed on the light-output side of LEDs (11). In the backlight chassis (14), if a region having the greatest distance between the substrate mounting unit (14a) and the diffuser plate (13) is a first region (R1) and a region where this distance is less than in the first region (R1) is a second region (R2), a circuit board (16) is disposed in a space (T), which is a space formed on the side opposite the diffusion plate (13) across the substrate mounting unit (14a) and corresponds to the difference in height between the first region (R1) and the second region (R2), with a gap (S) between the circuit board and the substrate mounting unit (14a) in the second region (R2).

Description

面発光装置およびそれを備えた液晶表示装置Surface light emitting device and liquid crystal display device including the same
　本発明は、複数の発光素子を有する面発光装置と、その面発光装置を備えた液晶表示装置とに関するものである。 The present invention relates to a surface light emitting device having a plurality of light emitting elements and a liquid crystal display device including the surface light emitting device.
　従来から、液晶パネルを照明する面発光装置として、直下型のバックライトを用いた液晶表示装置が提案されている。図１０は、直下型のバックライト１０１を備えた従来の液晶表示装置１００の概略の構成を示す断面図である。なお、図１０の断面図は水平断面図であり、図１０においてＬＥＤ（発光ダイオード）１０２が並ぶ方向は、液晶表示装置１００の左右方向に対応している。バックライト１０１は、複数のＬＥＤ１０２と、ＬＥＤ基板１０３と、拡散板１０４と、バックライトシャーシ１０５と、反射シート１０６と、回路基板１０７とを備えている。このようなバックライト１０１と液晶パネル１０８とが、固定部材１０９を介してキャビネット１１０に固定されて液晶表示装置１００が構成されている。 Conventionally, a liquid crystal display device using a direct backlight has been proposed as a surface emitting device for illuminating a liquid crystal panel. FIG. 10 is a cross-sectional view showing a schematic configuration of a conventional liquid crystal display device 100 including a direct type backlight 101. 10 is a horizontal sectional view, and the direction in which the LEDs (light emitting diodes) 102 are arranged in FIG. 10 corresponds to the left-right direction of the liquid crystal display device 100. The backlight 101 includes a plurality of LEDs 102, an LED substrate 103, a diffusion plate 104, a backlight chassis 105, a reflection sheet 106, and a circuit substrate 107. Such a backlight 101 and a liquid crystal panel 108 are fixed to a cabinet 110 via a fixing member 109 to constitute a liquid crystal display device 100.
　複数のＬＥＤ１０２は、ＬＥＤ基板１０３に搭載され、支持されている。拡散板１０４は、各ＬＥＤ１０２から出射される光を拡散させて均一化して出射する。バックライトシャーシ１０５は、ＬＥＤ基板１０３が搭載される平板状の基板搭載部１０５ａと、基板搭載部１０５ａと連結されて各ＬＥＤ１０２の光出射側に位置する拡散板１０４を支持する拡散板支持部１０５ｂとを有している。 The plurality of LEDs 102 are mounted on and supported by the LED substrate 103. The diffusing plate 104 diffuses the light emitted from each LED 102 to make it uniform and emit it. The backlight chassis 105 includes a flat substrate mounting portion 105a on which the LED substrate 103 is mounted, and a diffusion plate support portion 105b that is connected to the substrate mounting portion 105a and supports the diffusion plate 104 positioned on the light emitting side of each LED 102. And have.
　反射シート１０６は、各ＬＥＤ１０２の位置に対応する開口部を有しており、ＬＥＤ基板１０３を覆うように基板搭載部１０５ａおよび拡散板支持部１０５ｂの表面に形成されている。これにより、各ＬＥＤ１０２から出射されて、拡散板１０４の表面で反射された光や、拡散板１０４で拡散された後にバックライトシャーシ１０５側に戻ってきた光が、反射シート１０６で再度反射されて拡散板１０４側に戻されるので、各ＬＥＤ１０２から出射される光の利用効率が向上する。回路基板１０７は、各ＬＥＤ１０２の発光を制御するための回路基板や、液晶パネル１０８を駆動するための回路基板を含んでいる。液晶パネル１０８は、拡散板１０４の光出射側に、レンズシート等を含む光学シート類（図示せず）を介して設けられている。 The reflection sheet 106 has an opening corresponding to the position of each LED 102, and is formed on the surface of the substrate mounting portion 105 a and the diffusion plate support portion 105 b so as to cover the LED substrate 103. As a result, the light emitted from each LED 102 and reflected on the surface of the diffusion plate 104 or the light returned to the backlight chassis 105 after being diffused by the diffusion plate 104 is reflected again by the reflection sheet 106. Since the light is returned to the diffusion plate 104 side, the utilization efficiency of the light emitted from each LED 102 is improved. The circuit board 107 includes a circuit board for controlling the light emission of each LED 102 and a circuit board for driving the liquid crystal panel 108. The liquid crystal panel 108 is provided on the light emission side of the diffusion plate 104 via optical sheets (not shown) including a lens sheet and the like.
　ここで、上記の回路基板１０７は、バックライトシャーシ１０５の基板搭載部１０５ａと、間隙Ｓを介して、拡散板１０４とは反対側に配置されている。このように、基板搭載部１０５ａと回路基板１０７との間に間隙Ｓを設けているのは、ＬＥＤ１０２で発生する熱および回路基板１０７で発生する熱が相互に炙りあって温度が上昇するのを抑えるためと、ＬＥＤ１０２および回路基板１０７の放熱用の通風路を確保するためである。このように、平板状の基板搭載部１０５ａと間隙Ｓを介して回路基板１０７を配置した構成は、例えば特許文献１の液晶表示装置でも同様に採用されている。 Here, the circuit board 107 is disposed on the opposite side of the diffusion plate 104 with the substrate mounting portion 105a of the backlight chassis 105 and the gap S therebetween. Thus, the gap S is provided between the board mounting portion 105a and the circuit board 107 because the heat generated in the LED 102 and the heat generated in the circuit board 107 are mixed with each other and the temperature rises. This is for the purpose of suppressing and ensuring a ventilation path for heat dissipation of the LED 102 and the circuit board 107. In this way, the configuration in which the circuit board 107 is arranged via the flat board mounting portion 105a and the gap S is similarly adopted in the liquid crystal display device disclosed in Patent Document 1, for example.
特開２０１１－１３４４７４号公報（図１等参照）JP 2011-134474 A (see FIG. 1 etc.)
　ところが、図１０の構成では、回路基板１０７が平板状の基板搭載部１０５ａから外側に飛び出ているため、その分、バックライト１０１の厚さが増大するという問題が生ずる。つまり、図１０の構成では、バックライト１０１の最厚部の厚さは、回路基板１０７から拡散板１０４までの距離となり、バックライト１０１の厚さには、間隙Ｓと回路基板１０７の厚さとが含まれるため、その分だけバックライト１０１の厚さが増大する。 However, in the configuration of FIG. 10, since the circuit board 107 protrudes outward from the flat board mounting portion 105a, there arises a problem that the thickness of the backlight 101 increases accordingly. That is, in the configuration of FIG. 10, the thickness of the thickest portion of the backlight 101 is the distance from the circuit board 107 to the diffusion plate 104, and the thickness of the backlight 101 includes the gap S and the thickness of the circuit board 107. Therefore, the thickness of the backlight 101 increases accordingly.
　本発明は、上記の問題点を解決するためになされたもので、その目的は、基板搭載部の外側に回路基板を配置する場合でも、回路基板および発光素子の放熱を阻害することなく薄型化が可能な面発光装置と、その面発光装置を備えた液晶表示装置とを提供することにある。 The present invention has been made to solve the above-described problems, and its purpose is to reduce the thickness of the circuit board and the light emitting element without hindering heat dissipation even when the circuit board is arranged outside the board mounting portion. An object of the present invention is to provide a surface light emitting device capable of performing the above and a liquid crystal display device including the surface light emitting device.
　本発明の面発光装置は、複数の発光素子を搭載した素子搭載基板と、前記各発光素子から出射される光を拡散して出射する拡散板と、前記素子搭載基板が搭載される基板搭載部と、前記基板搭載部と連結されて、前記各発光素子の光出射側に位置する前記拡散板を支持する拡散板支持部とを有するシャーシ部材と、前記各発光素子の発光を制御するための回路基板とを備えた面発光装置であって、前記シャーシ部材の前記基板搭載部は、該基板搭載部と前記拡散板との距離が少なくとも２つの領域で異なり、かつ、同じ領域では前記距離が同じになるように、折れ曲がって形成されており、前記シャーシ部材において、前記少なくとも２つの領域のうち、前記距離が最も長い領域を第１の領域とし、前記距離が前記第１の領域よりも短い領域を第２の領域とすると、前記回路基板は、前記第２の領域の基板搭載部に対して前記拡散板とは反対側に形成される空間であって、前記基板搭載部の折れ曲がりによる前記第１の領域と前記第２の領域との段差に相当する空間内に、前記第２の領域の基板搭載部と間隙を介して配置されていることを特徴としている。 The surface light-emitting device of the present invention includes an element mounting substrate on which a plurality of light emitting elements are mounted, a diffusion plate that diffuses and emits light emitted from each of the light emitting elements, and a substrate mounting portion on which the element mounting substrate is mounted A chassis member coupled to the substrate mounting portion and having a diffusion plate support portion for supporting the diffusion plate located on the light emitting side of each light emitting device, and for controlling light emission of each light emitting device A surface light emitting device including a circuit board, wherein the board mounting portion of the chassis member has a distance between the board mounting portion and the diffusion plate being different in at least two regions, and the distance is the same in the same region. In the chassis member, the chassis member is formed to be bent and the longest distance among the at least two areas is a first area, and the distance is shorter than the first area. Territory Is the second region, the circuit board is a space formed on the opposite side of the diffuser plate with respect to the substrate mounting portion in the second region, and the circuit board is bent by the substrate mounting portion. It is characterized in that it is arranged in a space corresponding to a step between the first region and the second region with a gap between the substrate mounting portion of the second region and the second region.
　上記の構成によれば、回路基板は、第２の領域の基板搭載部に対して拡散板とは反対側に形成される空間であって、基板搭載部の折れ曲がりによる第１の領域と第２の領域との段差に相当する空間内に配置されているので、面発光装置の最厚部の厚さを、回路基板の厚さに関係なく、第１の領域の基板搭載部から拡散板までの距離とすることができる。その結果、基板搭載部の外側（拡散板とは反対側）に回路基板を配置する構成であっても、回路基板が平板状の基板搭載部から外側に飛び出る構成に比べて、面発光装置を薄型化することができる。 According to the above configuration, the circuit board is a space formed on the side opposite to the diffusion plate with respect to the substrate mounting portion in the second region, and the first region and the second region due to the bending of the substrate mounting portion. The thickness of the thickest part of the surface light emitting device is from the substrate mounting part of the first region to the diffusion plate regardless of the thickness of the circuit board. Distance. As a result, even when the circuit board is arranged outside the board mounting portion (on the side opposite to the diffusion plate), the surface light emitting device is compared with the configuration in which the circuit board protrudes outward from the flat board mounting portion. Thinning can be achieved.
　しかも、回路基板は、上記空間内に、第２の領域の基板搭載部と間隙を介して配置されているので、上記間隙に通風することによって、回路基板および発光素子を放熱させることができる。したがって、回路基板および発光素子の放熱を阻害することなく、面発光装置を薄型化することができる。 In addition, since the circuit board is disposed in the space via the substrate mounting portion in the second region and the gap, the circuit board and the light emitting element can be dissipated by ventilating the gap. Therefore, the surface light emitting device can be thinned without impeding the heat dissipation of the circuit board and the light emitting element.
　本発明の面発光装置において、前記シャーシ部材は、前記基板搭載部の一部が前記拡散板側に窪むことによって形成される凹部を有しており、前記第２の領域の基板搭載部は、前記凹部の底部を形成しており、前記回路基板は、前記凹部内に配置されているとともに、前記凹部の底部を形成する前記第２の領域の基板搭載部と間隙を介して配置されていてもよい。 In the surface light emitting device of the present invention, the chassis member has a recess formed by a part of the substrate mounting portion being recessed toward the diffusion plate, and the substrate mounting portion in the second region is The bottom of the recess is formed, and the circuit board is disposed in the recess, and is disposed through a gap with the substrate mounting portion in the second region that forms the bottom of the recess. May be.
　回路基板が、シャーシ部材の基板搭載部の一部が拡散板側に窪むことによって形成される凹部内に配置されている場合でも、面発光装置の最厚部の厚さを、基板搭載部における凹部以外の領域から拡散板までの距離とすることができ、回路基板が平板状の基板搭載部から外側に飛び出る構成に比べて、面発光装置を薄型化することができる。しかも、回路基板は、上記凹部の底部を形成する第２の領域の基板搭載部と間隙を介して配置されているので、上記間隙に通風することによって、回路基板および発光素子を放熱させることができる。したがって、凹部内に回路基板を設ける構成であっても、回路基板および発光素子の放熱を阻害することなく、面発光装置を薄型化することができる。 Even when the circuit board is disposed in a recess formed by recessing a part of the board mounting portion of the chassis member toward the diffusion plate, the thickness of the thickest portion of the surface light emitting device is determined by the board mounting portion. The surface light emitting device can be made thinner as compared with the configuration in which the circuit board protrudes outward from the flat substrate mounting portion. In addition, since the circuit board is disposed through a gap with the substrate mounting portion in the second region that forms the bottom of the recess, the circuit board and the light emitting element can be dissipated by ventilating the gap. it can. Therefore, even if it is the structure which provides a circuit board in a recessed part, a surface emitting device can be reduced in thickness, without inhibiting heat dissipation of a circuit board and a light emitting element.
　本発明の面発光装置において、前記各発光素子は、前記シャーシ部材の前記第１の領域および前記第２の領域の両方に配置されており、前記第２の領域における前記各発光素子の配置密度は、前記第１の領域における前記各発光素子の配置密度よりも高くてもよい。 In the surface light-emitting device of the present invention, each light-emitting element is disposed in both the first region and the second region of the chassis member, and the arrangement density of the light-emitting elements in the second region May be higher than the arrangement density of the light emitting elements in the first region.
　発光素子と拡散板との距離は、第１の領域よりも第２の領域のほうが短い。このため、第２の領域では、第１の領域よりも、各発光素子の発光時に光学的な輝度ムラが発生しやすくなる。しかし、第２の領域における各発光素子の配置密度を、第１の領域における各発光素子の配置密度よりも高くすることにより、第２の領域では各発光素子間の距離が短くなるので、上記の輝度ムラを低減することができる。 The distance between the light emitting element and the diffusion plate is shorter in the second region than in the first region. For this reason, in the second region, optical luminance unevenness is more likely to occur when each light emitting element emits light than in the first region. However, by making the arrangement density of the light emitting elements in the second region higher than the arrangement density of the light emitting elements in the first region, the distance between the light emitting elements in the second region is shortened. Brightness unevenness can be reduced.
　本発明の面発光装置において、前記第２の領域の基板搭載部と前記拡散板との間には、端面から入射する光を内部で導光して前記拡散板に向けて出射する導光板が配置されており、前記各発光素子は、前記第１の領域に位置して前記拡散板に向けて発光する第１の発光素子と、前記導光板の前記端面に向けて発光する第２の発光素子とを含んでいてもよい。 In the surface light-emitting device of the present invention, a light guide plate that guides light incident from an end face and emits the light toward the diffuser plate between the substrate mounting portion in the second region and the diffuser plate. Each light emitting element is disposed in the first region and emits light toward the diffusion plate, and second light emission that emits light toward the end face of the light guide plate. And an element.
　例えば、第２の領域の基板搭載部と拡散板との間に各発光素子を位置させて、各発光素子が拡散板に向けて発光する構成とした場合、各発光素子と拡散板との距離が短いために、各発光素子の発光時に光学的な輝度ムラが発生しやすくなる。一方、導光板の端面に光を入射させて面発光するエッジライト方式では、面発光によって輝度ムラを低減することはできるが、導光板への入光時に光の損出が発生するため、光利用効率が低下しやすい。 For example, when each light emitting element is positioned between the substrate mounting portion in the second region and the diffusion plate and each light emitting element emits light toward the diffusion plate, the distance between each light emitting element and the diffusion plate Therefore, optical brightness unevenness is likely to occur when each light emitting element emits light. On the other hand, in the edge light method in which light is incident on the end face of the light guide plate and the surface light is emitted, uneven luminance can be reduced by surface light emission, but light loss occurs when light enters the light guide plate. Usage efficiency tends to decrease.
　そこで、第２の領域の基板搭載部と拡散板との間に導光板を配置し、各発光素子のうち、第１の領域に位置する第１の発光素子が拡散板に向けて発光する一方で、第２の発光素子が導光板の端面に向けて発光する構成とすることにより、輝度ムラが生じやすくなった第２の領域では、導光板での面発光によって輝度ムラを低減しつつ、第１の領域では、直下型とすることで、エッジライト方式で生じるような光利用効率の低下を回避することができる。 Therefore, a light guide plate is disposed between the substrate mounting portion in the second region and the diffusion plate, and among the light emitting devices, the first light emitting device located in the first region emits light toward the diffusion plate. In the second region where the luminance unevenness is likely to occur due to the configuration in which the second light emitting element emits light toward the end surface of the light guide plate, the luminance unevenness is reduced by surface light emission on the light guide plate, In the first region, by using the direct type, it is possible to avoid a decrease in light utilization efficiency that occurs in the edge light system.
　本発明の面発光装置において、前記第２の領域は、前記基板搭載部の中央部を含んでいることが望ましい。 In the surface light emitting device of the present invention, it is preferable that the second region includes a central portion of the substrate mounting portion.
　基板搭載部の中央部では、周辺部に比べて熱がこもりやすく、温度が上昇しやすい。したがって、基板搭載部の中央部を含む第２の領域において、基板搭載部に対して拡散板とは反対側の空間内に間隙を介して回路基板を位置させることにより、上記間隙として放熱のための通風路を確保して、少なくとも基板搭載部の中央部での放熱性を高めながら、装置を薄型化することができる。 In the central part of the board mounting part, heat is more likely to accumulate than the peripheral part, and the temperature tends to rise. Therefore, in the second region including the central portion of the substrate mounting portion, the circuit board is positioned in the space opposite to the diffusion plate with respect to the substrate mounting portion via the gap, so that the gap is used for heat dissipation. It is possible to reduce the thickness of the device while securing the ventilation path and improving the heat dissipation at least in the central portion of the substrate mounting portion.
　本発明の液晶表示装置は、上述した本発明の面発光装置と、前記面発光装置から供給される光を変調して映像を表示する液晶パネルとを備えていてもよい。 The liquid crystal display device of the present invention may include the above-described surface light emitting device of the present invention and a liquid crystal panel that displays an image by modulating light supplied from the surface light emitting device.
　この構成では、薄型の面発光装置で液晶パネルを照明する薄型の液晶表示装置を実現することができる。 With this configuration, a thin liquid crystal display device that illuminates the liquid crystal panel with a thin surface light emitting device can be realized.
　本発明によれば、回路基板は、第２の領域の基板搭載部に対して拡散板とは反対側に形成される空間であって、基板搭載部の折れ曲がりによる第１の領域と第２の領域との段差に相当する空間内に配置されているので、面発光装置の最厚部の厚さを、第１の領域の基板搭載部から拡散板までの距離とすることができ、面発光装置を薄型化することができる。しかも、回路基板は、上記空間内に、第２の領域の基板搭載部と間隙を介して配置されているので、上記間隙に通風することによって、回路基板および発光素子を放熱させることができ、そのような放熱を阻害することなく、面発光装置を薄型化することができる。 According to the present invention, the circuit board is a space formed on the side opposite to the diffusion plate with respect to the substrate mounting portion in the second region, and the first region and the second region due to the bending of the substrate mounting portion. Since it is arranged in a space corresponding to a step with the region, the thickness of the thickest portion of the surface light emitting device can be the distance from the substrate mounting portion of the first region to the diffusion plate, and surface light emission The apparatus can be thinned. Moreover, since the circuit board is disposed in the space via the substrate mounting portion in the second region and the gap, the circuit board and the light emitting element can be dissipated by ventilating the gap, The surface light emitting device can be thinned without hindering such heat dissipation.
本発明の実施の一形態の液晶表示装置の概略の構成を示す断面図である。It is sectional drawing which shows the schematic structure of the liquid crystal display device of one Embodiment of this invention. 上記液晶表示装置が備えるバックライトの構成を示す断面図である。It is sectional drawing which shows the structure of the backlight with which the said liquid crystal display device is provided. 上記バックライトの基板搭載部と回路基板の配置空間とを示す断面図である。It is sectional drawing which shows the board | substrate mounting part of the said backlight, and the arrangement | positioning space of a circuit board. 本発明の他の実施の形態の液晶表示装置の概略の構成を示す断面図である。It is sectional drawing which shows the schematic structure of the liquid crystal display device of other embodiment of this invention. 上記液晶表示装置が備えるバックライトの導光板の平面図である。It is a top view of the light-guide plate of the backlight with which the said liquid crystal display device is provided. 本発明のさらに他の実施の形態の液晶表示装置の概略の構成を示す断面図である。It is sectional drawing which shows the schematic structure of the liquid crystal display device of further another embodiment of this invention. 上記液晶表示装置の他の構成を示す断面図である。It is sectional drawing which shows the other structure of the said liquid crystal display device. 上記液晶表示装置のさらに他の構成を示す断面図である。It is sectional drawing which shows other structure of the said liquid crystal display device. 上記液晶表示装置のさらに他の構成を示す断面図である。It is sectional drawing which shows other structure of the said liquid crystal display device. 従来の液晶表示装置の概略の構成を示す断面図である。It is sectional drawing which shows the schematic structure of the conventional liquid crystal display device.
　〔実施の形態１〕
　本発明の実施の一形態について、図面に基づいて説明すれば、以下の通りである。なお、各実施の形態で共通する構成には同一の部材番号を付記して説明を省略することがある。 [Embodiment 1]
An embodiment of the present invention will be described below with reference to the drawings. In addition, the same member number is attached to the common configuration in each embodiment, and the description may be omitted.
　図１は、本実施形態の液晶表示装置１の概略の構成を示す断面図である。なお、図１の断面図は水平断面図であり、図１においてＬＥＤ１１が並ぶ方向は、液晶表示装置１の左右方向に対応しており、図１の紙面に垂直な方向は上下方向に対応している。なお、以下で登場する断面図も、特に断らない限り、水平断面図であり、左右、上下の各方向の対応関係も図１と同様とする。 FIG. 1 is a cross-sectional view showing a schematic configuration of a liquid crystal display device 1 of the present embodiment. 1 is a horizontal sectional view, and the direction in which the LEDs 11 are arranged in FIG. 1 corresponds to the left-right direction of the liquid crystal display device 1, and the direction perpendicular to the plane of FIG. 1 corresponds to the up-down direction. ing. Note that the cross-sectional views appearing below are also horizontal cross-sectional views unless otherwise specified, and the correspondence between the left, right, and top and bottom directions is the same as that in FIG.
　液晶表示装置１は、バックライト２と液晶パネル３とを固定部材４を介してキャビネット５に固定して構成されている。バックライト２は、液晶パネル３を面状に照明するための面発光装置である。液晶パネル３は、バックライト２から供給される光を変調して映像を表示する液晶表示素子である。以下、バックライト２の詳細について説明する。 The liquid crystal display device 1 is configured by fixing a backlight 2 and a liquid crystal panel 3 to a cabinet 5 via a fixing member 4. The backlight 2 is a surface light emitting device for illuminating the liquid crystal panel 3 in a planar shape. The liquid crystal panel 3 is a liquid crystal display element that displays light by modulating light supplied from the backlight 2. Hereinafter, details of the backlight 2 will be described.
　図２は、バックライト２の構成を示す断面図である。バックライト２は、複数の発光素子としてのＬＥＤ１１と、ＬＥＤ基板１２と、拡散板１３と、バックライトシャーシ１４と、反射シート１５と、回路基板１６とを備えており、本実施形態では直下型の面発光装置となっている。 FIG. 2 is a cross-sectional view showing the configuration of the backlight 2. The backlight 2 includes an LED 11 as a plurality of light emitting elements, an LED substrate 12, a diffusion plate 13, a backlight chassis 14, a reflection sheet 15, and a circuit board 16, and in this embodiment, a direct type This is a surface light emitting device.
　複数のＬＥＤ１１は、発光素子搭載用の基板としてのＬＥＤ基板１２にライン状（図１では左右方向）に搭載され、支持されている。各ＬＥＤ基板１２は、複数のＬＥＤ１１が２次元的に配置されるように並べて配置されている。拡散板１３は、点光源である各ＬＥＤ１１から出射される光を拡散させて均一化し、面状に出射するものであり、平板状に形成されて、各ＬＥＤ１１の光出射側に配置されている。 The plurality of LEDs 11 are mounted and supported in a line shape (left and right direction in FIG. 1) on an LED substrate 12 as a substrate for mounting light emitting elements. Each LED board 12 is arranged side by side so that the plurality of LEDs 11 are two-dimensionally arranged. The diffusion plate 13 diffuses and uniformizes the light emitted from each LED 11 that is a point light source, and emits the light in a planar shape. The diffusion plate 13 is formed in a flat plate shape and disposed on the light emitting side of each LED 11. .
　バックライトシャーシ１４は、１枚の板金を所定形状に折り曲げることによって形成されるシャーシ部材であり、複数のＬＥＤ基板１２が搭載される基板搭載部１４ａと、拡散板１３を支持する拡散板支持部１４ｂとを有している。拡散板支持部１４ｂは、基板搭載部１４ａの端部と連結されて、各ＬＥＤ１１の光出射側に位置する拡散板１３を支持している。より詳しくは、拡散板支持部１４ｂは、基板搭載部１４ａの端部から拡散板１３側に向かって斜めに伸びた後、拡散板１３と平行となるように鈍角に折り曲げられて形成されており、その折り曲げられた端部にて、拡散板１３を支持している。 The backlight chassis 14 is a chassis member formed by bending one sheet metal into a predetermined shape, and includes a substrate mounting portion 14a on which a plurality of LED substrates 12 are mounted, and a diffusion plate support portion that supports the diffusion plate 13. 14b. The diffusion plate support portion 14b is connected to the end portion of the substrate mounting portion 14a and supports the diffusion plate 13 located on the light emission side of each LED 11. More specifically, the diffusion plate support portion 14b is formed to extend obliquely from the end of the substrate mounting portion 14a toward the diffusion plate 13 and then be bent at an obtuse angle so as to be parallel to the diffusion plate 13. The diffusion plate 13 is supported by the bent end portion.
　反射シート１５は、各ＬＥＤ１１の位置に対応する開口部を有しており、ＬＥＤ基板１２を覆うように基板搭載部１４ａおよび拡散板支持部１４ｂの表面に形成されている。これにより、各ＬＥＤ１１から出射されて、拡散板１３の表面で反射された光や、拡散板１３で拡散された後にバックライトシャーシ１４側に戻ってきた光が、反射シート１５で再度反射されて拡散板１３側に戻されるので、各ＬＥＤ１１から出射される光の利用効率が向上する。回路基板１６は、各ＬＥＤ１１の発光を制御するための回路基板である。この回路基板１６は、液晶パネル３（図１参照）を駆動するための回路基板やその他の基板（電源基板、制御基板）を含んでいてもよい。上記の液晶パネル３は、拡散板１３の光出射側に、レンズシート、プリズムシート、再帰反射シート等を含む光学シート類（図示せず）を介して設けられている。 The reflection sheet 15 has an opening corresponding to the position of each LED 11, and is formed on the surface of the substrate mounting portion 14 a and the diffusion plate support portion 14 b so as to cover the LED substrate 12. As a result, the light emitted from each LED 11 and reflected by the surface of the diffusion plate 13 or the light returned to the backlight chassis 14 after being diffused by the diffusion plate 13 is reflected again by the reflection sheet 15. Since it returns to the diffusion plate 13 side, the utilization efficiency of the light emitted from each LED 11 is improved. The circuit board 16 is a circuit board for controlling the light emission of each LED 11. The circuit board 16 may include a circuit board for driving the liquid crystal panel 3 (see FIG. 1) and other boards (power supply board, control board). The liquid crystal panel 3 is provided on the light emission side of the diffusion plate 13 via optical sheets (not shown) including a lens sheet, a prism sheet, a retroreflective sheet, and the like.
　本実施形態では、バックライトシャーシ１４の基板搭載部１４ａに凹部２１が形成されている。この凹部２１は、平板状の基板搭載部１４ａの一部が拡散板１３側に窪むことによって形成されている。特に、凹部２１は、バックライト２の左右方向の中央部に相当する基板搭載部１４ａの中央部に、上下方向に沿った溝形状で形成されている。これにより、バックライトシャーシ１４の水平断面での形状は、図２に示すように全体として略Ｗ字形となっている。 In the present embodiment, a recess 21 is formed in the substrate mounting portion 14a of the backlight chassis 14. The recess 21 is formed by a part of the flat substrate mounting portion 14a being recessed toward the diffusion plate 13 side. In particular, the concave portion 21 is formed in a groove shape along the vertical direction in the central portion of the substrate mounting portion 14 a corresponding to the central portion in the left-right direction of the backlight 2. Thereby, the shape in the horizontal cross section of the backlight chassis 14 becomes a substantially W shape as a whole, as shown in FIG.
　上記した回路基板１６は、上記凹部２１内に配置されているとともに、凹部２１の底部を形成する基板搭載部１４ａと間隙Ｓを介して配置されている。なお、凹部２１の底部を形成する基板搭載部１４ａとは、凹部２１の開口部２１ａとは反対側に位置する基板搭載部１４ａであって、凹部２１の形成領域でＬＥＤ基板１２が載置される基板搭載部１４ａを指す。 The circuit board 16 described above is disposed in the recess 21, and is disposed via the substrate mounting portion 14 a that forms the bottom of the recess 21 and the gap S. The substrate mounting portion 14 a that forms the bottom of the recess 21 is the substrate mounting portion 14 a that is located on the opposite side of the opening 21 a of the recess 21, and the LED substrate 12 is placed in the formation region of the recess 21. The substrate mounting portion 14a.
　このように、回路基板１６が上記凹部２１内に配置されていることにより、バックライト２の最厚部の厚さを、基板搭載部１４ａにおける凹部２１の形成領域以外の部分から拡散板１３までの距離とすることができ、これによって、バックライト２を薄型化することができる。つまり、基板搭載部を平板状としたまま、その基板搭載部と間隙を介して回路基板を配置する従来の構成のように、面発光装置の厚さとして、基板搭載部から拡散板とは反対側に飛び出る部分の距離（回路基板の厚さを含む）を考慮しなくても済み、その分、面発光装置を薄型化することができる。この結果、薄型の面発光装置で液晶パネル３を照明する薄型の液晶表示装置１を実現することができる。したがって、液晶表示装置１を例えば液晶テレビとして商品化する場合には、少なくとも薄型という点で商品価値を増大させることができる。 As described above, since the circuit board 16 is disposed in the recess 21, the thickness of the thickest part of the backlight 2 is changed from a portion other than the formation region of the recess 21 in the substrate mounting portion 14 a to the diffusion plate 13. Thus, the backlight 2 can be thinned. In other words, the thickness of the surface light emitting device is opposite to that of the diffusion plate as in the conventional configuration in which the circuit board is arranged with a gap between the substrate mounting portion and the substrate mounting portion in a flat shape. It is not necessary to consider the distance (including the thickness of the circuit board) of the portion protruding to the side, and the surface light emitting device can be made thinner accordingly. As a result, a thin liquid crystal display device 1 that illuminates the liquid crystal panel 3 with a thin surface light emitting device can be realized. Therefore, when the liquid crystal display device 1 is commercialized as, for example, a liquid crystal television, the commercial value can be increased at least in terms of thinness.
　また、ＬＥＤ１１の背後に回路基板１６を設ける場合は、ＬＥＤ１１で発生する熱と回路基板１６で発生する熱とが相互に炙りあって温度が上昇しやすい。しかし、本実施形態では、回路基板１６は、凹部２１の底部を形成する基板搭載部１４ａと間隙Ｓを介して配置されており、ＬＥＤ１１と回路基板１６との間に間隙Ｓが存在しているので、この間隙Ｓに通風することによって、ＬＥＤ１１および回路基板１６を放熱させることができる。したがって、ＬＥＤ１１および回路基板１６の放熱を阻害することなく、バックライト２ひいては液晶表示装置１を薄型化することができる。しかも、凹部２１の形成によって基板搭載部１４ａの表面積が増大し、通風面積が増大することになるため、通風による放熱効果をより高めることができる。また、間隙Ｓを大きくして、ＬＥＤ１１の熱と回路基板１６の熱との相互干渉を抑制することもできる。 Further, when the circuit board 16 is provided behind the LED 11, the heat generated by the LED 11 and the heat generated by the circuit board 16 are mixed with each other and the temperature is likely to rise. However, in the present embodiment, the circuit board 16 is disposed via the substrate mounting portion 14 a that forms the bottom of the recess 21 and the gap S, and there is a gap S between the LED 11 and the circuit board 16. Therefore, by ventilating the gap S, the LED 11 and the circuit board 16 can be dissipated. Therefore, the backlight 2 and thus the liquid crystal display device 1 can be thinned without hindering the heat radiation of the LED 11 and the circuit board 16. In addition, since the surface area of the substrate mounting portion 14a is increased due to the formation of the recess 21 and the ventilation area is increased, the heat dissipation effect by ventilation can be further enhanced. Moreover, the gap S can be increased to suppress mutual interference between the heat of the LED 11 and the heat of the circuit board 16.
　また、４０００×２０００ピクセル以上の解像度を持つ高精細な液晶テレビは、４Ｋ２Ｋ（Ｋは１０３を指す）と呼ばれ、フルＨＤ（full　high　definition）の４倍の画素数を有している。このような高精細な液晶テレビでは、６０インチ以上の大型化を考えた場合に、バックライト全体をエッジライト方式とすることは望ましくない。これは、以下の理由による。すなわち、上記した高精細な液晶テレビでは、液晶パネルの透過率が十分でなく、輝度が低下しやすいが、エッジライト方式では薄型化を実現できても、ＬＥＤを導光板のエッジにしか配置できないため、輝度を十分に稼ぐことができない。また、導光板を使用するエッジライト方式は、直下型に比べて、導光板への入光時に損出が生じ、光利用効率が低いため、消費電力が増大する。さらに、エッジライト方式では、導光板の反り等を考慮すると、厚さのある導光板を用いる必要があるが、この場合は重量が重くなる。 A high-definition liquid crystal television having a resolution of 4000 × 2000 pixels or more is called 4K2K (K indicates 10 3 ), and has a pixel number four times that of full HD (full high definition). In such a high-definition liquid crystal television, it is not desirable to adopt an edge light system for the entire backlight when an increase in size of 60 inches or more is considered. This is due to the following reason. That is, in the above-described high-definition liquid crystal television, the transmittance of the liquid crystal panel is not sufficient, and the luminance is likely to be lowered. Therefore, it is not possible to earn enough brightness. In addition, the edge light method using the light guide plate causes loss when entering the light guide plate and lowers the light utilization efficiency as compared with the direct type, so that the power consumption increases. Furthermore, in the edge light system, it is necessary to use a thick light guide plate in consideration of warpage of the light guide plate, but in this case, the weight becomes heavy.
　この点、本実施形態のバックライト２は、ＬＥＤ１１を２次元的に配置した直下型で光利用効率が高く、輝度を十分稼ぐことができ、しかも、上述したように凹部２１を形成することで回路基板１６の厚さを考慮することなく薄型化を実現でき、また、エッジライト方式のような導光板が不要なので（導光板の重量を考慮しなくて済むので）、上記の高精細な液晶テレビに好適なものとなる。 In this respect, the backlight 2 of the present embodiment is a direct type in which the LEDs 11 are two-dimensionally arranged, has high light utilization efficiency, can sufficiently obtain luminance, and has the concave portion 21 as described above. Thinning can be realized without considering the thickness of the circuit board 16, and a light guide plate such as an edge light system is unnecessary (since the weight of the light guide plate need not be considered), the above high-definition liquid crystal It will be suitable for television.
　なお、上記の凹部２１を、回路基板１６に加えて、液晶表示装置１の全体の強度を確保するための補強部材や、スピーカー、壁掛け部材（壁掛け金具）などをさらに収容可能な大きさで形成し、これらの部材の全て、またはこれらの部材のうちで少なくとも厚みのあるものを凹部２１内に配置してもよい。この場合でも、凹部２１を形成せずに補強部材等を配置する構成に比べて、バックライトシャーシ１４の裏面からの部材の飛び出し量を確実に低減して、液晶表示装置１の厚さの増大を回避することができる。 In addition to the circuit board 16, the recess 21 is formed in a size that can further accommodate a reinforcing member for securing the overall strength of the liquid crystal display device 1, a speaker, a wall hanging member (wall hanging bracket), and the like. Then, all of these members or at least one of these members may be disposed in the recess 21. Even in this case, the amount of protrusion of the member from the back surface of the backlight chassis 14 is reliably reduced and the thickness of the liquid crystal display device 1 is increased as compared with the configuration in which the reinforcing member is disposed without forming the recess 21. Can be avoided.
　ところで、基板搭載部１４ａの一部に上記の凹部２１を形成することにより、基板搭載部１４ａは、該基板搭載部１４ａと拡散板１３との距離が少なくとも２つの領域で異なり、かつ、同じ領域では上記距離が同じになるように、折れ曲がって形成されているとも言える。そこで、以下では、バックライトシャーシ１４において、上記少なくとも２つの領域のうち、上記距離が最も長い領域を第１の領域Ｒ１と称し、第１の領域Ｒ１以外の領域、つまり、上記距離が第１の領域Ｒ１よりも短い領域を第２の領域Ｒ２と称する。この場合、第２の領域Ｒ２の基板搭載部１４ａは、上述した凹部２１の底部を形成することになる。 By the way, by forming the concave portion 21 in a part of the substrate mounting portion 14a, the substrate mounting portion 14a has different distances between the substrate mounting portion 14a and the diffusion plate 13 in at least two regions and the same region. Then, it can be said that it is bent and formed so that the above-mentioned distance is the same. Therefore, in the backlight chassis 14, in the backlight chassis 14, the region having the longest distance among the above two regions is referred to as a first region R1, and the region other than the first region R1, that is, the distance is the first region. A region shorter than the region R1 is referred to as a second region R2. In this case, the substrate mounting portion 14a in the second region R2 forms the bottom of the recess 21 described above.
　したがって、上述した回路基板１６は、空間Ｔ内に、第２の領域Ｒ２の基板搭載部１４ａと間隙Ｓを介して配置されていると表現することもできる。ここで、空間Ｔとは、第２の領域Ｒ２の基板搭載部１４ａに対して拡散板１３とは反対側に形成される空間であって、基板搭載部１４ａの折れ曲がりによる第１の領域Ｒ１と第２の領域Ｒ２との段差に相当する空間を指す。図３は、上記の空間Ｔを、基板搭載部１４ａを示すハッチングとは異なるハッチングで示したものである。 Therefore, the above-described circuit board 16 can also be expressed as being disposed in the space T via the board mounting portion 14a and the gap S in the second region R2. Here, the space T is a space formed on the opposite side of the diffusion plate 13 with respect to the substrate mounting portion 14a in the second region R2, and the first region R1 due to the bending of the substrate mounting portion 14a. It refers to a space corresponding to a step with the second region R2. FIG. 3 shows the above-described space T by hatching different from the hatching that shows the substrate mounting portion 14a.
　このように、空間Ｔは、基板搭載部１４ａの折れ曲がりによる第１の領域Ｒ１と第２の領域Ｒ２との段差ｄによって形成されている。したがって、空間Ｔの最下部を構成する面（空間Ｔにおいて第２の領域Ｒ２の基板搭載部１４ａと最も離れた面）を仮想的に考えると、この仮想的な面は、第１の領域Ｒ１の基板搭載部１４ａにおける拡散板１３とは反対側の面と同一面となる。つまり、第１の領域Ｒ１と第２の領域Ｒ２との段差ｄに相当する空間Ｔとは、空間Ｔが第１の領域Ｒ１の基板搭載部１４ａから、さらに下方（拡散板１３とは反対側）に飛び出ることなく形成されるものであることを意味する。 Thus, the space T is formed by the step d between the first region R1 and the second region R2 due to the bending of the substrate mounting portion 14a. Therefore, when the surface constituting the lowermost part of the space T (the surface farthest from the substrate mounting portion 14a in the second region R2 in the space T) is virtually considered, this virtual surface is the first region R1. It becomes the same surface as the surface opposite to the diffusion plate 13 in the substrate mounting portion 14a. In other words, the space T corresponding to the step d between the first region R1 and the second region R2 is further below the space T from the substrate mounting portion 14a of the first region R1 (on the opposite side to the diffusion plate 13). ) Means that it is formed without jumping out.
　このように、回路基板１６が、上記空間Ｔ内に配置されていることにより（上記仮想的な面を含んでこれよりも拡散板１３側に配置されていることにより）、バックライト２の最厚部の厚さを、回路基板１６の厚さに関係なく、第１の領域Ｒ１の基板搭載部１４ａから拡散板１３までの距離とすることができる。したがって、回路基板１６が上記空間Ｔ内に配置されていることによってバックライトを薄型化できるとも言える。しかも、回路基板１６は、空間Ｔ内に、第２の領域Ｒ２の基板搭載部１４ａと間隙Ｓを介して配置されているので、間隙Ｓへの通風による回路基板および発光素子の放熱を阻害することなく、バックライト２を薄型化できる。 As described above, the circuit board 16 is disposed in the space T (by being disposed closer to the diffusion plate 13 than the virtual surface including the virtual plane), so that Regardless of the thickness of the circuit board 16, the thickness of the thick part can be the distance from the substrate mounting portion 14a to the diffusion plate 13 in the first region R1. Therefore, it can be said that the backlight can be thinned by arranging the circuit board 16 in the space T. In addition, since the circuit board 16 is disposed in the space T via the board mounting portion 14a in the second region R2 and the gap S, the circuit board 16 inhibits heat radiation of the circuit board and the light emitting element due to the ventilation of the gap S. Therefore, the backlight 2 can be made thinner.
　また、本実施形態では、図２に示すように、ＬＥＤ基板１２は、第１の領域Ｒ１と第２の領域Ｒ２との両方に配置されており、それゆえ、複数のＬＥＤ１１が、第１の領域Ｒ１と第２の領域Ｒ２との両方に配置されている。このとき、第２の領域Ｒ２における各ＬＥＤ１１の配置密度が、第１の領域Ｒ１における各ＬＥＤ１１の配置密度よりも高くなるように、各ＬＥＤ１１が配置されている。その理由は以下の通りである。なお、各ＬＥＤ１１の配置密度とは、単位面積あたりのＬＥＤ１１の個数を指す。 In the present embodiment, as shown in FIG. 2, the LED substrate 12 is arranged in both the first region R1 and the second region R2, and therefore, the plurality of LEDs 11 are arranged in the first region R1. It is arranged in both the region R1 and the second region R2. At this time, the LEDs 11 are arranged such that the arrangement density of the LEDs 11 in the second region R2 is higher than the arrangement density of the LEDs 11 in the first region R1. The reason is as follows. The arrangement density of each LED 11 refers to the number of LEDs 11 per unit area.
　上述した第１の領域Ｒ１および第２の領域Ｒ２の定義から、ＬＥＤ１１と拡散板１３との距離は、第１の領域Ｒ１よりも第２の領域Ｒ２のほうが短い。このため、第１の領域Ｒ１および第２の領域Ｒ２の各ＬＥＤ１１を同じ照度で発光させると、第２の領域Ｒ２では、拡散板１３での拡散によって光を均一化しきれず、第１の領域Ｒ１に比べて、光学的な輝度ムラが発生しやすくなる。 From the definition of the first region R1 and the second region R2 described above, the distance between the LED 11 and the diffusion plate 13 is shorter in the second region R2 than in the first region R1. For this reason, if each LED 11 of 1st area | region R1 and 2nd area | region R2 is light-emitted by the same illumination intensity, in 2nd area | region R2, it cannot fully equalize light by the spreading | diffusion in the diffusion plate 13, and 1st area | region Compared to R1, optical luminance unevenness is likely to occur.
　そこで、本実施形態のように、第２の領域Ｒ２における各ＬＥＤ１１の配置密度を、第１の領域Ｒ１における各ＬＥＤ１１の配置密度よりも高くすることにより、第２の領域Ｒ２では、各ＬＥＤ１１間の距離が短くなるため、拡散板１３での拡散によって光を確実に均一化することができ、上記の輝度ムラを低減することができる。 Therefore, as in the present embodiment, by setting the arrangement density of the LEDs 11 in the second region R2 higher than the arrangement density of the LEDs 11 in the first region R1, in the second region R2, between the LEDs 11 Therefore, the light can be reliably made uniform by the diffusion by the diffusion plate 13, and the luminance unevenness can be reduced.
　つまり、ＬＥＤ１１の配置ピッチ（または各ＬＥＤ１１間の距離）と、光学的な輝度ムラが生じないときのＬＥＤ１１と拡散板１３との最小距離とは比例関係にあり、ＬＥＤ１１の配置ピッチを短くすれば、ＬＥＤ１１と拡散板１３との距離を短くしても、光学的な輝度ムラは発生しない。このことは、逆に、上記距離を短くした場合、ＬＥＤ１１の配置ピッチを短くしなければ、光学的な輝度ムラが発生することを意味する。 That is, the arrangement pitch of the LEDs 11 (or the distance between the LEDs 11) and the minimum distance between the LED 11 and the diffusion plate 13 when no optical luminance unevenness occurs are in a proportional relationship, and if the arrangement pitch of the LEDs 11 is shortened. Even if the distance between the LED 11 and the diffusion plate 13 is shortened, no optical luminance unevenness occurs. On the contrary, this means that when the distance is shortened, optical luminance unevenness occurs unless the arrangement pitch of the LEDs 11 is shortened.
　本実施形態では、基板搭載部１４ａに凹部２１を形成していることにより、ＬＥＤ１１と拡散板１３との距離が、第１の領域Ｒ１よりも第２の領域Ｒ２で短い構造となるため、第２の領域Ｒ２におけるＬＥＤ１１の配置ピッチを短くすることで、光学的な輝度ムラを生じさせないようにすることができる。つまり、凹部２１を形成することによって生じる輝度ムラを、ＬＥＤ１１の配置ピッチを第１の領域Ｒ１と第２の領域Ｒ２とで変えることで容易に低減することができる。この結果、ＬＥＤ１１の最小限の個数で輝度ムラの生じないバックライト２を実現することができる。 In the present embodiment, since the recess 21 is formed in the substrate mounting portion 14a, the distance between the LED 11 and the diffusion plate 13 is shorter in the second region R2 than in the first region R1, By shortening the arrangement pitch of the LEDs 11 in the second region R2, it is possible to prevent optical luminance unevenness from occurring. That is, the luminance unevenness caused by forming the concave portion 21 can be easily reduced by changing the arrangement pitch of the LEDs 11 between the first region R1 and the second region R2. As a result, it is possible to realize the backlight 2 in which luminance unevenness does not occur with the minimum number of LEDs 11.
　また、第２の領域Ｒ２での各ＬＥＤ１１の配置密度を、第１の領域Ｒ１での各ＬＥＤ１１の配置密度よりも高くすることにより、例えば、配置密度のより低い第１の領域Ｒ１の各ＬＥＤ１１を高い輝度で発光させる一方、配置密度のより高い第２の領域Ｒ２の各ＬＥＤ１１を低い輝度で発光させて、全面で均一な輝度を実現することも可能となる。これにより、第２の領域Ｒ２のＬＥＤ１１の１個あたりの電力を抑えて、ＬＥＤ１１の温度（ＬＥＤ端子温度）の上昇およびＬＥＤ１１の半田接合部の温度上昇を抑えることができる。つまり、各ＬＥＤ１１の配置密度と各ＬＥＤに流す電流の大きさとを適切に設定することにより、温度分布を均一に保ちつつ、必要最小限の個数のＬＥＤ１１を用いて所望の輝度を実現することができる。 Further, by setting the arrangement density of the LEDs 11 in the second region R2 higher than the arrangement density of the LEDs 11 in the first region R1, for example, the LEDs 11 in the first region R1 having a lower arrangement density. Can be emitted with a high luminance, and the LEDs 11 in the second region R2 having a higher arrangement density can emit a light with a low luminance to achieve uniform luminance over the entire surface. Thereby, the electric power per LED11 of 2nd area | region R2 can be suppressed, and the raise of the temperature of LED11 (LED terminal temperature) and the temperature rise of the solder joint part of LED11 can be suppressed. In other words, by appropriately setting the arrangement density of the LEDs 11 and the magnitude of the current flowing through the LEDs, it is possible to achieve a desired brightness using the minimum number of LEDs 11 while maintaining a uniform temperature distribution. it can.
　〔実施の形態２〕
　本発明の他の実施の形態について、図面に基づいて説明すれば、以下の通りである。 [Embodiment 2]
The following will describe another embodiment of the present invention with reference to the drawings.
　図４は、本実施形態の液晶表示装置１の概略の構成を示す断面図である。この液晶表示装置１は、バックライト２の第２の領域Ｒ２をエッジライト方式とした以外は、実施の形態１と同様の構成である。以下、具体的に説明する。 FIG. 4 is a cross-sectional view showing a schematic configuration of the liquid crystal display device 1 of the present embodiment. The liquid crystal display device 1 has the same configuration as that of the first embodiment except that the second region R2 of the backlight 2 is an edge light system. This will be specifically described below.
　本実施形態のバックライト２では、第２の領域Ｒ２に導光板３１が配置されている。より詳しくは、第２の領域Ｒ２の基板搭載部１４ａ、つまり、凹部２１の底部を形成する基板搭載部１４ａと、拡散板１３との間に、導光板３１が配置されている。導光板３１は、端面（側面）から入射する光を内部で導光し、拡散板１３と対向する面から拡散板１３に向けて出射する。図５は、第２の領域Ｒ２に配置された導光板３１を拡散板１３側から見たときの平面図（正面図）である。 In the backlight 2 of the present embodiment, the light guide plate 31 is disposed in the second region R2. More specifically, the light guide plate 31 is disposed between the substrate mounting portion 14 a in the second region R 2, that is, the substrate mounting portion 14 a that forms the bottom of the recess 21, and the diffusion plate 13. The light guide plate 31 guides light incident from the end surface (side surface) inside and emits the light toward the diffusion plate 13 from the surface facing the diffusion plate 13. FIG. 5 is a plan view (front view) when the light guide plate 31 disposed in the second region R2 is viewed from the diffusion plate 13 side.
　このように、第２の領域Ｒ２に導光板３１を配置しているため、点光源としての各ＬＥＤ１１は、直下型を構成する第１の発光素子としてのＬＥＤ１１ａ（図４参照）と、エッジライト方式を構成する第２の発光素子としてのＬＥＤ１１ｂ（図５参照）とを含んでいると言える。ここで、ＬＥＤ１１ａは、第１の領域Ｒ１、つまり、凹部２１の形成領域以外の領域に位置して、拡散板１３に向けて発光する発光素子である。一方、ＬＥＤ１１ｂは、導光板３１の上記端面に向けて発光する発光素子である。なお、ＬＥＤ１１ｂは、導光板３１における拡散板１３と対向しない端面であれば、左右上下のどの端面に向けて発光してもよい（拡散板１３と対向しない左右上下の４つの端面のいずれと対向して配置されてもよい）。 Thus, since the light guide plate 31 is arranged in the second region R2, each LED 11 as a point light source includes an LED 11a (see FIG. 4) as a first light emitting element constituting a direct type and an edge light. It can be said that LED11b (refer FIG. 5) as the 2nd light emitting element which comprises a system is included. Here, the LED 11 a is a light emitting element that is located in the first region R 1, that is, in a region other than the region where the recess 21 is formed, and emits light toward the diffusion plate 13. On the other hand, the LED 11 b is a light emitting element that emits light toward the end face of the light guide plate 31. Note that the LED 11b may emit light toward any of the left, right, top, and bottom end surfaces of the light guide plate 31 that does not face the diffusion plate 13 (opposite any of the four left, right, top, and bottom end surfaces that do not face the diffusion plate 13). May be arranged).
　凹部２１が形成される第２の領域Ｒ２にＬＥＤ１１を配置して、各ＬＥＤ１１から拡散板１３に向けて発光する構成とした場合、各ＬＥＤ１１と拡散板１３との距離が短いために、各ＬＥＤ１１の発光時に光学的な輝度ムラが発生しやすくなるのは、実施の形態１で述べた通りである。一方、導光板の端面に光を入射させて面発光するエッジライト方式では、面発光によって輝度ムラを低減することはできるが、導光板への入光時に、表面反射により最低でも１０％程度の光の損出が発生するため、光利用効率が低下する。したがって、全面で同一輝度を得るためには、消費電力を増大させる必要がある。 When the LED 11 is arranged in the second region R2 where the concave portion 21 is formed and the LED 11 emits light toward the diffusion plate 13, the distance between each LED 11 and the diffusion plate 13 is short, so that each LED 11 As described in the first embodiment, optical luminance unevenness is likely to occur when the light is emitted. On the other hand, in the edge light method in which light is incident on the end face of the light guide plate and the surface light is emitted, the luminance unevenness can be reduced by the surface light emission, but at least about 10% due to the surface reflection when entering the light guide plate. Since light loss occurs, light utilization efficiency decreases. Therefore, in order to obtain the same luminance on the entire surface, it is necessary to increase power consumption.
　そこで、本実施形態のように、第２の領域Ｒ２の基板搭載部１４ａと拡散板１３との間に導光板３１を配置し、各ＬＥＤ１１ａが拡散板１３に向けて発光する一方で、各ＬＥＤ１１ｂが導光板３１の端面に向けて発光する構成とすることにより、凹部２１の形成によって輝度ムラが生じやすくなった第２の領域Ｒ２では、導光板３１での面発光によって輝度ムラを低減しつつ、第１の領域Ｒ１では、直下型の採用によって、エッジライト方式で生じるような光利用効率の低下を回避することができる。 Therefore, as in the present embodiment, the light guide plate 31 is disposed between the substrate mounting portion 14a and the diffusion plate 13 in the second region R2, and each LED 11a emits light toward the diffusion plate 13, while each LED 11b. Is configured to emit light toward the end face of the light guide plate 31, and in the second region R <b> 2 in which unevenness in brightness is likely to occur due to the formation of the recess 21, the unevenness in brightness is reduced by surface light emission at the light guide plate 31. In the first region R1, the use of the direct type can avoid a decrease in light utilization efficiency that occurs in the edge light system.
　つまり、バックライト２の一部にエッジライト方式を採用することにより、単純な（全面が）直下型の構成に比べて、薄型で輝度ムラのないバックライト２を実現できるとともに、厚みの制約が少ない直下型の部分（第１の領域Ｒ１）では、エッジライト方式に比べて光利用効率がよいため、消費電力の少ない、環境性能に優れたバックライト２を実現できる。 In other words, by adopting the edge light system as a part of the backlight 2, it is possible to realize the backlight 2 that is thin and has no luminance unevenness compared to a simple (entire-surface) direct-type structure, and has a thickness limitation. Since the light directing efficiency is better in the direct part (first region R1) than in the edge light system, the backlight 2 with low power consumption and excellent environmental performance can be realized.
　また、エッジライト方式では、ＬＥＤ１１ｂが導光板３１の端部に配置されるため、温度が上がりやすい領域（例えば第２の領域Ｒ２の中心部分）には、ＬＥＤが配置されない構造となり、温度上昇によるＬＥＤの特性低下（例えば輝度低下）を回避することも可能となる。 Further, in the edge light system, the LED 11b is disposed at the end of the light guide plate 31, so that the LED is not disposed in a region where the temperature is likely to rise (for example, the central portion of the second region R2), and the temperature rises. It is also possible to avoid deterioration of LED characteristics (for example, luminance reduction).
　〔実施の形態３〕
　本発明のさらに他の実施の形態について、図面に基づいて説明すれば、以下の通りである。本実施形態では、バックライトシャーシ１４における上述した第１の領域Ｒ１と第２の領域Ｒ２との段差に相当する空間Ｔの数や位置のバリエーションについて説明する。 [Embodiment 3]
The following will describe still another embodiment of the present invention with reference to the drawings. In the present embodiment, variations in the number and positions of the spaces T corresponding to the steps between the first region R1 and the second region R2 described above in the backlight chassis 14 will be described.
　なお、以下での説明の便宜上、基板搭載部１４ａにおけるＬＥＤ基板１２の搭載部（搭載領域）は、中央部Ｃと２つの周辺部Ｐとで構成されているものとする。ここで、基板搭載部１４ａの中央部Ｃとは、基板搭載部１４ａの中心を含む領域であり、例えば上下方向に縦長の領域となっている。一方、基板搭載部１４ａの周辺部Ｐとは、中央部Ｃの周辺の領域であり、例えば中央部Ｃの左隣および右隣に位置して上下方向に縦長の領域となっている。以下の説明を参照することにより、バックライトシャーシ１４は、第１の領域Ｒ１と第２の領域Ｒ２との段差に相当する空間Ｔを少なくとも１個有していればよく、また、空間Ｔが形成される位置も基板搭載部１４ａの中央部には限定されないことが明らかになる。 For convenience of explanation below, it is assumed that the mounting portion (mounting region) of the LED substrate 12 in the substrate mounting portion 14a is composed of a central portion C and two peripheral portions P. Here, the central portion C of the substrate mounting portion 14a is a region including the center of the substrate mounting portion 14a, and is, for example, a vertically long region in the vertical direction. On the other hand, the peripheral portion P of the substrate mounting portion 14a is a region around the central portion C. For example, the peripheral portion P is located on the left side and the right side of the central portion C and is a vertically long region. By referring to the following description, the backlight chassis 14 only needs to have at least one space T corresponding to a step between the first region R1 and the second region R2, and the space T It is clear that the position to be formed is not limited to the central portion of the substrate mounting portion 14a.
　図６～図９は、本実施形態の液晶表示装置１の構成のバリエーションを示す断面図である。図６に示すように、バックライトシャーシ１４の基板搭載部１４ａは、２つの周辺部Ｐのうちの一方が拡散板１３側にシフトするように折れ曲がって形成されていてもよい。また、図７に示すように、基板搭載部１４ａは、中央部Ｃと一方の周辺部Ｐとが合わせて拡散板１３側にシフトするように折れ曲がって形成されていてもよい。さらに、図８に示すように、基板搭載部１４ａは、両方の周辺部Ｐが拡散板１３側にシフトするように折れ曲がって形成されていてもよい。この場合、バックライトシャーシ１４は、第２の領域Ｒ２を２個有することになり、第１の領域Ｒ１と第２の領域Ｒ２との段差に相当する空間Ｔも２個形成されることになる。また、図９に示すように、基板搭載部１４ａは、中央部Ｃと、両方の周辺部Ｐの一部とが拡散板１３側にシフトするように折れ曲がって形成されていてもよい。この場合、バックライトシャーシ１４は、第２の領域Ｒ２を３個有することになり、第１の領域Ｒ１と第２の領域Ｒ２との段差に相当する空間Ｔも３個形成されることになる。なお、図示はしないが、上記の空間Ｔは４個以上形成されていてもよい。 6 to 9 are cross-sectional views showing variations of the configuration of the liquid crystal display device 1 of the present embodiment. As shown in FIG. 6, the substrate mounting portion 14 a of the backlight chassis 14 may be formed to be bent so that one of the two peripheral portions P is shifted to the diffusion plate 13 side. Further, as shown in FIG. 7, the substrate mounting portion 14a may be formed to be bent so that the central portion C and the one peripheral portion P are combined and shifted to the diffusion plate 13 side. Further, as shown in FIG. 8, the substrate mounting portion 14a may be formed to be bent so that both peripheral portions P are shifted to the diffusion plate 13 side. In this case, the backlight chassis 14 has two second regions R2, and two spaces T corresponding to the step between the first region R1 and the second region R2 are also formed. . Moreover, as shown in FIG. 9, the board | substrate mounting part 14a may be bent and formed so that the center part C and a part of both peripheral part P may shift to the diffusion plate 13 side. In this case, the backlight chassis 14 has three second regions R2, and three spaces T corresponding to the step between the first region R1 and the second region R2 are also formed. . Although not shown, four or more spaces T may be formed.
　図６～図９のように基板搭載部１４ａを形成しても、第１の領域Ｒ１と第２の領域Ｒ２との段差に相当する空間Ｔに回路基板１６を配置するとともに、第２の領域Ｒ２の基板搭載部１４ａと間隙Ｓを介して回路基板１６を配置することにより、回路基板１６がバックライトシャーシ１４から外側に飛び出ず、ＬＥＤ１１および回路基板１６の放熱のための間隙Ｓも確保されているので、実施の形態１および２と同様に、ＬＥＤ１１および回路基板１６の放熱を阻害することなく、バックライト２ひいては液晶表示装置１を薄型化することができる。 Even if the substrate mounting portion 14a is formed as shown in FIGS. 6 to 9, the circuit board 16 is disposed in the space T corresponding to the step between the first region R1 and the second region R2, and the second region By arranging the circuit board 16 via the board mounting portion 14a of R2 and the gap S, the circuit board 16 does not jump out of the backlight chassis 14, and a gap S for heat dissipation of the LED 11 and the circuit board 16 is also secured. Therefore, similarly to the first and second embodiments, the backlight 2 and thus the liquid crystal display device 1 can be thinned without inhibiting the heat radiation of the LED 11 and the circuit board 16.
　ところで、基板搭載部１４ａの中央部Ｃでは、周辺部Ｐに比べて、バックライト２で発生する熱（ＬＥＤ１１の発光による熱や回路基板１６で発生する熱を含む）がこもりやすく、温度が上昇しやすい。このことを考慮すると、図７および図９の構成のように、第２の領域Ｒ２は、基板搭載部１４ａの中央部Ｃを含んでいることが望ましい。この場合、少なくとも、基板搭載部１４ａの中央部Ｃに対して拡散板１３とは反対側に、第１の領域Ｒ１と第２の領域Ｒ２との段差に相当する空間Ｔが形成されるので、その空間Ｔ内に基板搭載部１４ａと間隙Ｓを介して回路基板１６を配置することにより、間隙Ｓへの通風によって、温度が上昇しやすい基板搭載部１４ａの中央部Ｃでの放熱性を高めながら、バックライト２ひいては液晶表示装置１を薄型化することができる。なお、実施の形態１および２の構成についても、基板搭載部１４ａの中央部に、空間Ｔを構成する凹部２１が形成されて、その凹部２１内に基板搭載部１４ａと間隙Ｓを介して回路基板１６が配置されているので、上記と同様の効果を得ることができる。 By the way, in the central part C of the board mounting part 14a, compared with the peripheral part P, the heat generated in the backlight 2 (including the heat generated by the light emission of the LED 11 and the heat generated in the circuit board 16) is easily trapped, and the temperature rises. It's easy to do. In consideration of this, it is desirable that the second region R2 includes the central portion C of the substrate mounting portion 14a as in the configurations of FIGS. In this case, a space T corresponding to a step between the first region R1 and the second region R2 is formed at least on the side opposite to the diffusion plate 13 with respect to the central portion C of the substrate mounting portion 14a. By disposing the circuit board 16 in the space T via the substrate mounting portion 14a and the gap S, the heat dissipation at the central portion C of the substrate mounting portion 14a that is likely to rise in temperature due to the ventilation of the gap S is improved. However, the backlight 2 and thus the liquid crystal display device 1 can be thinned. In the configurations of the first and second embodiments as well, a recess 21 constituting the space T is formed in the central portion of the substrate mounting portion 14a, and a circuit is formed in the recess 21 via the substrate mounting portion 14a and the gap S. Since the board | substrate 16 is arrange | positioned, the effect similar to the above can be acquired.
　なお、上述した各実施の形態の構成を適宜組み合わせて、バックライト２ひいては液晶表示装置１を構成することも勿論可能である。例えば、第１の領域Ｒ１と第２の領域Ｒ２とでＬＥＤ１１の配置密度を変える実施の形態１の構成を、実施の形態３の図６～図９の構成に適用することは可能である。さらに、第２の領域Ｒ２に導光板３１を設けてエッジライト方式とする実施の形態２の構成を、実施の形態３の図６～図９の構成に適用することも可能である。 Of course, it is possible to configure the backlight 2 and thus the liquid crystal display device 1 by appropriately combining the configurations of the above-described embodiments. For example, the configuration of the first embodiment in which the arrangement density of the LEDs 11 is changed between the first region R1 and the second region R2 can be applied to the configurations of FIGS. 6 to 9 of the third embodiment. Further, the configuration of the second embodiment in which the light guide plate 31 is provided in the second region R2 and the edge light system is used can be applied to the configurations of FIGS. 6 to 9 of the third embodiment.
　なお、以上では、バックライト２を液晶パネル３を照明するための照明装置（光源装置）として用いた例について説明したが、バックライト２を部屋の照明装置として単体で用いることも可能である。 In addition, although the example which used the backlight 2 as an illuminating device (light source device) for illuminating the liquid crystal panel 3 was demonstrated above, the backlight 2 can also be used alone as a room illuminating device.
　本発明の面発光装置は、例えば液晶表示装置のバックライトや部屋の照明装置に利用することができる。 The surface light-emitting device of the present invention can be used, for example, for a backlight of a liquid crystal display device or a room lighting device.
　　　１　　　液晶表示装置
　　　２　　　バックライト（面発光装置）
　　　３　　　液晶パネル
　　１１　　　ＬＥＤ（発光素子）
　　１１ａ　　ＬＥＤ（第１の発光素子）
　　１１ｂ　　ＬＥＤ（第２の発光素子）
　　１２　　　ＬＥＤ基板（基板）
　　１３　　　拡散板
　　１４　　　バックライトシャーシ（シャーシ部材）
　　１４ａ　　基板搭載部
　　１４ｂ　　拡散板支持部
　　１６　　　回路基板
　　２１　　　凹部
　　３１　　　導光板
　　　Ｃ　　　中央部
　　　Ｐ　　　周辺部
　　　Ｒ１　　第１の領域
　　　Ｒ２　　第２の領域
　　　Ｓ　　　間隙
　　　Ｔ　　　空間 1 Liquid Crystal Display 2 Backlight (Surface Emitting Device)
3 Liquid crystal panel 11 LED (light emitting element)
11a LED (first light emitting element)
11b LED (second light emitting element)
12 LED substrate (substrate)
13 Diffuser 14 Backlight chassis (chassis member)
14a Substrate mounting portion 14b Diffusion plate support portion 16 Circuit board 21 Recessed portion 31 Light guide plate C Central portion P Peripheral portion R1 First region R2 Second region S Gap T Space

Claims (6)

  1. 　複数の発光素子を搭載した素子搭載基板と、
    　前記各発光素子から出射される光を拡散して出射する拡散板と、
    　前記素子搭載基板が搭載される基板搭載部と、前記基板搭載部と連結されて、前記各発光素子の光出射側に位置する前記拡散板を支持する拡散板支持部とを有するシャーシ部材と、
    　前記各発光素子の発光を制御するための回路基板とを備えた面発光装置であって、
    　前記シャーシ部材の前記基板搭載部は、該基板搭載部と前記拡散板との距離が少なくとも２つの領域で異なり、かつ、同じ領域では前記距離が同じになるように、折れ曲がって形成されており、
    　前記シャーシ部材において、前記少なくとも２つの領域のうち、前記距離が最も長い領域を第１の領域とし、前記距離が前記第１の領域よりも短い領域を第２の領域とすると、
    　前記回路基板は、前記第２の領域の基板搭載部に対して前記拡散板とは反対側に形成される空間であって、前記基板搭載部の折れ曲がりによる前記第１の領域と前記第２の領域との段差に相当する空間内に、前記第２の領域の基板搭載部と間隙を介して配置されていることを特徴とする面発光装置。     An element mounting board on which a plurality of light emitting elements are mounted;
    A diffusion plate that diffuses and emits light emitted from each of the light emitting elements;
    A chassis member having a substrate mounting portion on which the element mounting substrate is mounted; and a diffusion plate support portion that is connected to the substrate mounting portion and supports the diffusion plate located on the light emitting side of each light emitting element;
    A surface light emitting device comprising a circuit board for controlling light emission of each light emitting element,
    The board mounting portion of the chassis member is formed to be bent so that the distance between the board mounting portion and the diffusion plate is different in at least two regions, and the distance is the same in the same region,
    In the chassis member, when the region having the longest distance among the at least two regions is the first region, and the region having the distance shorter than the first region is the second region,
    The circuit board is a space formed on a side opposite to the diffusion plate with respect to the substrate mounting portion in the second region, and the first region and the second region due to the bending of the substrate mounting portion. A surface light-emitting device, wherein the surface light-emitting device is disposed in a space corresponding to a step with respect to a region via a gap between the substrate mounting portion of the second region.
  2. 　前記シャーシ部材は、前記基板搭載部の一部が前記拡散板側に窪むことによって形成される凹部を有しており、
    　前記第２の領域の基板搭載部は、前記凹部の底部を形成しており、
    　前記回路基板は、前記凹部内に配置されているとともに、前記凹部の底部を形成する前記第２の領域の基板搭載部と間隙を介して配置されていることを特徴とする請求項１に記載の面発光装置。     The chassis member has a recess formed by a part of the substrate mounting portion being recessed toward the diffusion plate,
    The substrate mounting portion of the second region forms the bottom of the recess;
    The said circuit board is arrange | positioned through the board | substrate mounting part of the said 2nd area | region which forms the bottom part of the said recessed part while being arrange | positioned in the said recessed part, and is arrange | positioned. Surface light emitting device.
  3. 　前記各発光素子は、前記シャーシ部材の前記第１の領域および前記第２の領域の両方に配置されており、
    　前記第２の領域における前記各発光素子の配置密度は、前記第１の領域における前記各発光素子の配置密度よりも高いことを特徴とする請求項１または２に記載の面発光装置。     Each of the light emitting elements is disposed in both the first region and the second region of the chassis member,
    3. The surface light emitting device according to claim 1, wherein an arrangement density of the light emitting elements in the second region is higher than an arrangement density of the light emitting elements in the first region.
  4. 　前記第２の領域の基板搭載部と前記拡散板との間には、端面から入射する光を内部で導光して前記拡散板に向けて出射する導光板が配置されており、
    　前記各発光素子は、前記第１の領域に位置して前記拡散板に向けて発光する第１の発光素子と、前記導光板の前記端面に向けて発光する第２の発光素子とを含んでいることを特徴とする請求項１または２に記載の面発光装置。     Between the substrate mounting portion of the second region and the diffusion plate, a light guide plate that guides light incident from an end face inside and emits the light toward the diffusion plate is disposed,
    Each of the light emitting elements includes a first light emitting element that is located in the first region and emits light toward the diffusion plate, and a second light emitting element that emits light toward the end surface of the light guide plate. The surface light-emitting device according to claim 1, wherein the surface light-emitting device is provided.
  5. 　前記第２の領域は、前記基板搭載部の中央部を含んでいることを特徴とする請求項１から４のいずれかに記載の面発光装置。 5. The surface light emitting device according to claim 1, wherein the second region includes a central portion of the substrate mounting portion.
  6. 　請求項１から５のいずれかに記載の面発光装置と、
    　前記面発光装置から供給される光を変調して映像を表示する液晶パネルとを備えていることを特徴とする液晶表示装置。     A surface light-emitting device according to any one of claims 1 to 5,
    A liquid crystal display device, comprising: a liquid crystal panel that displays light by modulating light supplied from the surface light emitting device.
PCT/JP2012/068158 2011-09-13 2012-07-18 Surface light emitting device and liquid crystal display device provided with same WO2013038802A1 (en)

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