WO2013032178A3 - Photosensitive resin composition - Google Patents

Photosensitive resin composition Download PDF

Info

Publication number
WO2013032178A3
WO2013032178A3 PCT/KR2012/006733 KR2012006733W WO2013032178A3 WO 2013032178 A3 WO2013032178 A3 WO 2013032178A3 KR 2012006733 W KR2012006733 W KR 2012006733W WO 2013032178 A3 WO2013032178 A3 WO 2013032178A3
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive resin
resin composition
phosphate compound
composition
withstand
Prior art date
Application number
PCT/KR2012/006733
Other languages
French (fr)
Other versions
WO2013032178A2 (en
Inventor
Dong Hoon BONG
Byeong Ll Lee
Original Assignee
Kolon Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolon Industries, Inc. filed Critical Kolon Industries, Inc.
Publication of WO2013032178A2 publication Critical patent/WO2013032178A2/en
Publication of WO2013032178A3 publication Critical patent/WO2013032178A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Abstract

Disclosed herein is a photosensitive resin composition, including: a UV-curable resin which can be developed in an aqueous alkali solution; a photopolymerization initiator; an unsaturated ethylene monomer; a thermocuring agent; and a phosphate compound, wherein the phosphate compound is included in an amount of 1 ~ 40 wt% based on a solid content of the composition. The photosensitive resin composition is advantageous in that its cured product has excellent heat resistance and ability to withstand PCT (pressure cooker test) and has improved resolution and flexibility.
PCT/KR2012/006733 2011-08-26 2012-08-23 Photosensitive resin composition WO2013032178A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110085720A KR20130022801A (en) 2011-08-26 2011-08-26 Photosensitive resin composition
KR10-2011-0085720 2011-08-26

Publications (2)

Publication Number Publication Date
WO2013032178A2 WO2013032178A2 (en) 2013-03-07
WO2013032178A3 true WO2013032178A3 (en) 2013-04-25

Family

ID=47757026

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/006733 WO2013032178A2 (en) 2011-08-26 2012-08-23 Photosensitive resin composition

Country Status (2)

Country Link
KR (1) KR20130022801A (en)
WO (1) WO2013032178A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040009428A1 (en) * 2001-07-04 2004-01-15 Kenji Tamura Resist curable resin composition and cured article thereof
KR20040096131A (en) * 2003-05-07 2004-11-16 주식회사 동진쎄미켐 Photosensitive resin composition and dry film resist using the same
US20050054756A1 (en) * 2002-03-15 2005-03-10 Yuichi Kamayachi Curable resins and curable resin compositions containing the same
KR20050106954A (en) * 2004-05-07 2005-11-11 주식회사 코오롱 Photosensitive resin composition for preventing copper oxidation and scum
US20060141381A1 (en) * 2002-10-08 2006-06-29 Hitachi Chemical Co., Ltd. Photosensitive resin composition, and photosensitive element, method for forming resist pattern and printed wiring board using the composition
KR20110038252A (en) * 2009-10-08 2011-04-14 주식회사 동진쎄미켐 Photosensitive resin composition

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040009428A1 (en) * 2001-07-04 2004-01-15 Kenji Tamura Resist curable resin composition and cured article thereof
US20050054756A1 (en) * 2002-03-15 2005-03-10 Yuichi Kamayachi Curable resins and curable resin compositions containing the same
US20060141381A1 (en) * 2002-10-08 2006-06-29 Hitachi Chemical Co., Ltd. Photosensitive resin composition, and photosensitive element, method for forming resist pattern and printed wiring board using the composition
KR20040096131A (en) * 2003-05-07 2004-11-16 주식회사 동진쎄미켐 Photosensitive resin composition and dry film resist using the same
KR20050106954A (en) * 2004-05-07 2005-11-11 주식회사 코오롱 Photosensitive resin composition for preventing copper oxidation and scum
KR20110038252A (en) * 2009-10-08 2011-04-14 주식회사 동진쎄미켐 Photosensitive resin composition

Also Published As

Publication number Publication date
KR20130022801A (en) 2013-03-07
WO2013032178A2 (en) 2013-03-07

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