WO2013010448A1 - 防腐蚀软胶包裹的电路板 - Google Patents

防腐蚀软胶包裹的电路板 Download PDF

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Publication number
WO2013010448A1
WO2013010448A1 PCT/CN2012/078480 CN2012078480W WO2013010448A1 WO 2013010448 A1 WO2013010448 A1 WO 2013010448A1 CN 2012078480 W CN2012078480 W CN 2012078480W WO 2013010448 A1 WO2013010448 A1 WO 2013010448A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
soft rubber
soft
corrosion
anticorrosive
Prior art date
Application number
PCT/CN2012/078480
Other languages
English (en)
French (fr)
Inventor
陈福年
Original Assignee
深圳市好年华模具有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市好年华模具有限公司 filed Critical 深圳市好年华模具有限公司
Publication of WO2013010448A1 publication Critical patent/WO2013010448A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Definitions

  • the utility model relates to a circuit board, in particular to a circuit board wrapped with anti-corrosion anti-corrosion soft glue.
  • the present invention aims to provide a corrosion-resistant corrosion-resistant soft-coated circuit board.
  • the utility model is realized by the following technical measures, a circuit board wrapped with anti-corrosion soft glue, comprising a circuit board and a soft rubber layer which is injection-sealed to surround the circuit board.
  • the thickness of the surface of the board reaching the surface of the soft layer is substantially equal.
  • the circuit board is preferably a PFC.
  • PFC also known as flexible circuit board, flexible printed circuit board, flexible circuit board, referred to as soft board or FPC
  • FPC soft board
  • the FPC flexible printed circuit is a highly reliable and excellent flexible printed circuit made of polyimide or polyester film.
  • the soft rubber layer is preferably an injection molded TPU layer.
  • TPU is Thermoplastic The abbreviation of Urethane, the Chinese name is a thermoplastic polyurethane elastomer, and the TPU is a polymer material obtained by co-reacting polymerization of diphenylmethane diisocyanate (MDI), toluene diisocyanate (TDI), macromolecular polyol, and chain extender.
  • MDI diphenylmethane diisocyanate
  • TDI toluene diisocyanate
  • macromolecular polyol and chain extender.
  • Its molecular structure is a rigid block obtained by the reaction of diphenylmethane diisocyanate (MDI), toluene diisocyanate (TDI) and a chain extender, as well as diphenylmethane diisocyanate (MDI), toluene diisocyanate (TDI) and macromolecules.
  • TPU is a mature and environmentally friendly material with excellent high tension, high tensile strength, toughness and aging resistance.
  • TPU has been widely used in medical and health, electronic appliances, industry and sports. It has the characteristics of high strength, good toughness, wear resistance, cold resistance, oil resistance, water resistance, aging resistance and weather resistance which are unmatched by other plastic materials.
  • he has many excellent functions such as high water repellency, moisture resistance, cold resistance, antibacterial, mildew proof, warmth, UV resistance and energy release.
  • the utility model relates to a circuit board placed in an injection mold and then injection molded. Before the injection molding, the circuit board is fixed by two points to achieve no sloshing of the circuit board in the mold, and then the soft rubber part is fixed by the complementary end of the tail end to prevent the circuit board from swinging during the injection molding process. Finally, the mold injection molding process is adopted to control the soft rubber moving direction. , to achieve the same thickness of glue around the finished product.
  • the utility model utilizes a soft rubber full-sealing circuit board, thereby protecting the circuit board from corrosion.
  • Figure 1 is a schematic structural view of an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a cross section of an embodiment of the present invention.
  • a watch type U disk includes an FPC flexible printed circuit board 2 electrically connected to the USB interface 3 and a TPU soft rubber layer 1 which is injection-sealed to surround the FPC flexible printed circuit board 2.
  • the FPC soft printed circuit board 2 is used in two points to achieve the FPC soft printed circuit board 2 without shaking in the mold, and then the soft plastic part is fixed by the complementary end of the tail end to prevent the FPC soft printed circuit board. 2 Swing during the injection molding process, and finally adopt the mold injection molding process to control the direction of the soft rubber moving, to achieve the same thickness of the glue around the finished product.
  • circuit board of the anti-corrosion soft rubber package of the present invention which is used to help understand the present invention, but the embodiment of the present invention is not limited by the above embodiments, and any one does not deviate from the principle of the present invention. Changes, modifications, substitutions, combinations, and simplifications are all equivalent substitutions and are included in the scope of the present invention.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

一种防腐蚀软胶（1）包裹的电路板（2），包括电路板（2）以及注塑密封包围电路板（2）的软胶层（1）。该电路板（2）表面到达软胶层（1）表面的厚度大致相等。通过软胶（1）全密封电路板（2），保护了电路板（2）不会被腐蚀。

Description

防腐蚀软胶包裹的电路板
技术领域
本实用新型涉及电路板，尤其是涉及一种防腐蚀的防腐蚀软胶包裹的电路板。
背景技术
随着技术发展和新产品新应用的出现，数码相机、手机、PDA等产品也在成为新兴的消费类电子产品。从二十世纪九十年代后期开始，融合了计算机、信息与通信、消费类电子三大领域的信息家电开始广泛地深入家庭生活，它具有视听、信息处理、双向网络通讯等功能，由嵌入式处理器、相关支撑硬件（如显示卡、存储介质、IC卡或***的读取设备）、嵌入式操作***以及应用层的软件包组成。电子产品的个性化便携式已经成为了消费的潮流，但电子产品中的电路板在与人接触时，会被人体液腐蚀从而失去其功能。
发明内容
为了克服上述缺点，本实用新型目的在于提供一种防腐蚀的防腐蚀软胶包裹的电路板。
本实用新型通过以下技术措施实现的，一种防腐蚀软胶包裹的电路板，包括电路板以及注塑密封包围电路板的软胶层。该电路板表面到达软胶层表面的厚度大至相等。
所述电路板优选PFC。
PFC又称软性线路板、柔性印刷电路板，挠性线路板，简称软板或FPC，具有配线密度高、重量轻、厚度薄的特点。FPC软性印制电路是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路。
所述软胶层优选注塑的TPU层。
TPU是Thermoplastic Urethane的简称，中文名称为热塑性聚氨酯弹性体，TPU是由二苯甲烷二异氰酸酯（MDI）、甲苯二异氰酸酯（TDI）和大分子多元醇、扩链剂共同反应聚合而成的高分子材料。它的分子结构是由二苯甲烷二异氰酸酯（MDI）、甲苯二异氰酸酯（TDI）和扩链剂反应得到的刚性嵌段以及二苯甲烷二异氰酸酯（MDI）、甲苯二异氰酸酯（TDI）和大分子多元醇反应得到的柔性链段交替构成的。TPU具有卓越的高张力、高拉力、强韧和耐老化的特性，是一种成熟的环保材料。目前，TPU已广泛应用与医疗卫生、电子电器、工业及体育等方面，其具有其它塑料材料所无法比拟的强度高、韧性好、耐磨、耐寒、耐油、耐水、耐老化、耐气候等特性，同时他具有高防水性透湿性、防风、防寒、抗菌、防霉、保暖、抗紫外线以及能量释放等许多优异的功能。
本实用新型是一种在注塑模具内放置电路板再注塑。注塑前先用两点方式固定电路板，达到电路板在模具内无晃动，再用尾端互补方式固定软胶部分，防止电路板在注塑过程中摆动，最后采取模具注塑工艺控制软胶走动方向，达到成品四周胶位厚度相等。本实用新型利用软胶全密封电路板，从而保护电路板不会被腐蚀。
附图说明
图1为本实用新型实施例的结构示意图；
图2为本实用新型实施例带剖面的结构示意图。
具体实施方式
下面结合实施例并对照附图对本实用新型作进一步详细说明。
一种手表式U盘，包括电连接USB接口3的FPC软性印制电路板2以及注塑密封包围FPC软性印制电路板2的TPU软胶层1。注塑前先用两点方式FPC软性印制电路板2，达到FPC软性印制电路板2在模具内无晃动，再用尾端互补方式固定软胶部分，防止FPC软性印制电路板2在注塑过程中摆动，最后采取模具注塑工艺控制软胶走动方向，达到成品四周胶位厚度相等。
以上是对本实用新型防腐蚀软胶包裹的电路板进行了阐述，用于帮助理解本实用新型，但本实用新型的实施方式并不受上述实施例的限制，任何未背离本实用新型原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本实用新型的保护范围之内。

Claims (3)

  1. 一种防腐蚀软胶包裹的电路板，其特征在于：包括电路板以及注塑密封包围电路板的软胶层。
  2. 根据权利要求1所述的防腐蚀软胶包裹的电路板，其特征在于：所述电路板为FPC。
  3. 根据权利要求1所述的防腐蚀软胶包裹的电路板，其特征在于：所述软胶层为注塑的TPU层。
PCT/CN2012/078480 2011-07-15 2012-07-11 防腐蚀软胶包裹的电路板 WO2013010448A1 (zh)

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CN201120250013.6 2011-07-15
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Publication number Priority date Publication date Assignee Title
CN202135399U (zh) * 2011-07-15 2012-02-01 深圳市好年华模具有限公司 防腐蚀软胶包裹的电路板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273669A (ja) * 2006-03-31 2007-10-18 Fujikura Ltd 電子部品実装回路基板
CN101513148A (zh) * 2006-09-28 2009-08-19 Nok株式会社 密封结构体
CN201297535Y (zh) * 2008-11-14 2009-08-26 江苏稳润光电有限公司 一种led柔性组合防水灯条
CN202135399U (zh) * 2011-07-15 2012-02-01 深圳市好年华模具有限公司 防腐蚀软胶包裹的电路板
CN202228985U (zh) * 2011-06-03 2012-05-23 田茂福 带有全防水灌胶结构的led灯条

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273669A (ja) * 2006-03-31 2007-10-18 Fujikura Ltd 電子部品実装回路基板
CN101513148A (zh) * 2006-09-28 2009-08-19 Nok株式会社 密封结构体
CN201297535Y (zh) * 2008-11-14 2009-08-26 江苏稳润光电有限公司 一种led柔性组合防水灯条
CN202228985U (zh) * 2011-06-03 2012-05-23 田茂福 带有全防水灌胶结构的led灯条
CN202135399U (zh) * 2011-07-15 2012-02-01 深圳市好年华模具有限公司 防腐蚀软胶包裹的电路板

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