WO2013005155A3 - Apparatus for treating a wafer-shaped article - Google Patents
Apparatus for treating a wafer-shaped article Download PDFInfo
- Publication number
- WO2013005155A3 WO2013005155A3 PCT/IB2012/053350 IB2012053350W WO2013005155A3 WO 2013005155 A3 WO2013005155 A3 WO 2013005155A3 IB 2012053350 W IB2012053350 W IB 2012053350W WO 2013005155 A3 WO2013005155 A3 WO 2013005155A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- process chamber
- shaped article
- closed process
- treating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Abstract
An apparatus for processing wafer-shaped articles comprises a closed process chamber, a chuck located within the closed process chamber, and at least one process liquid dispensing device disposed within the chamber. The closed process chamber comprises a lid that can be opened to position a wafer-shaped article within the closed process chamber. The lid incorporates a heater adapted to heat a wafer-shaped article positioned in the closed process chamber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020147000452A KR102007546B1 (en) | 2011-07-07 | 2012-07-02 | Apparatus for treating a wafer-shaped article |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/178,430 US20130008602A1 (en) | 2011-07-07 | 2011-07-07 | Apparatus for treating a wafer-shaped article |
US13/178,430 | 2011-07-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013005155A2 WO2013005155A2 (en) | 2013-01-10 |
WO2013005155A3 true WO2013005155A3 (en) | 2015-08-06 |
Family
ID=47437509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2012/053350 WO2013005155A2 (en) | 2011-07-07 | 2012-07-02 | Apparatus for treating a wafer-shaped article |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130008602A1 (en) |
KR (1) | KR102007546B1 (en) |
TW (1) | TWI569345B (en) |
WO (1) | WO2013005155A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8926788B2 (en) * | 2010-10-27 | 2015-01-06 | Lam Research Ag | Closed chamber for wafer wet processing |
KR101501362B1 (en) | 2012-08-09 | 2015-03-10 | 가부시키가이샤 스크린 홀딩스 | Substrate processing apparatus and substrate processing method |
KR101512560B1 (en) | 2012-08-31 | 2015-04-15 | 가부시키가이샤 스크린 홀딩스 | Substrate processing apparatus |
KR102091291B1 (en) | 2013-02-14 | 2020-03-19 | 가부시키가이샤 스크린 홀딩스 | Substrate processing apparatus and substrate processing method |
US9719504B2 (en) * | 2013-03-15 | 2017-08-01 | Integrated Designs, L.P. | Pump having an automated gas removal and fluid recovery system and method |
US10043686B2 (en) * | 2013-12-31 | 2018-08-07 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
DE102014105300A1 (en) * | 2014-03-12 | 2015-09-17 | Von Ardenne Gmbh | Processing arrangement and method for operating a processing arrangement |
JP6329428B2 (en) * | 2014-05-09 | 2018-05-23 | 東京エレクトロン株式会社 | Substrate processing apparatus, deposit removal method for substrate processing apparatus, and storage medium |
EP3161715A1 (en) * | 2014-06-24 | 2017-05-03 | Virsec Systems, Inc. | System and methods for automated detection of input and output validation and resource management vulnerability |
KR102415684B1 (en) * | 2014-09-16 | 2022-07-05 | 에이씨엠 리서치 (상하이) 인코포레이티드 | Coater with automatic cleaning function and coater automatic cleaning method |
US20160376702A1 (en) * | 2015-06-26 | 2016-12-29 | Lam Research Ag | Dual mode chamber for processing wafer-shaped articles |
US10534907B2 (en) * | 2016-12-15 | 2020-01-14 | Sap Se | Providing semantic connectivity between a java application server and enterprise threat detection system using a J2EE data |
CN116504702B (en) * | 2023-06-26 | 2023-09-05 | 山东联高智能科技有限公司 | Semiconductor element processing equipment |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5595241A (en) * | 1994-10-07 | 1997-01-21 | Sony Corporation | Wafer heating chuck with dual zone backplane heating and segmented clamping member |
US5861609A (en) * | 1995-10-02 | 1999-01-19 | Kaltenbrunner; Guenter | Method and apparatus for rapid thermal processing |
US6331212B1 (en) * | 2000-04-17 | 2001-12-18 | Avansys, Llc | Methods and apparatus for thermally processing wafers |
US6375746B1 (en) * | 1998-07-10 | 2002-04-23 | Novellus Systems, Inc. | Wafer processing architecture including load locks |
US20020195128A1 (en) * | 2001-06-22 | 2002-12-26 | S.E.S. Company Limited | Single wafer type substrate cleaning method and apparatus |
US6770424B2 (en) * | 2002-12-16 | 2004-08-03 | Asml Holding N.V. | Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms |
WO2004084278A1 (en) * | 2003-03-20 | 2004-09-30 | Sez Ag | Device and method for wet treating disc-shaped articles |
US7187002B2 (en) * | 2004-02-02 | 2007-03-06 | Matsushita Electric Industrial Co., Ltd. | Wafer collective reliability evaluation device and wafer collective reliability evaluation method |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01134932A (en) * | 1987-11-19 | 1989-05-26 | Oki Electric Ind Co Ltd | Cleansing process and clarifier of substrate |
US5464480A (en) * | 1993-07-16 | 1995-11-07 | Legacy Systems, Inc. | Process and apparatus for the treatment of semiconductor wafers in a fluid |
US6232248B1 (en) * | 1998-07-03 | 2001-05-15 | Tokyo Electron Limited | Single-substrate-heat-processing method for performing reformation and crystallization |
KR100887360B1 (en) * | 2001-01-23 | 2009-03-06 | 도쿄엘렉트론가부시키가이샤 | Substrate processing apparatus and substrate processing method |
JP4343022B2 (en) * | 2004-05-10 | 2009-10-14 | 東京エレクトロン株式会社 | Substrate processing method and substrate processing apparatus |
US20070289534A1 (en) * | 2006-05-30 | 2007-12-20 | Applied Materials, Inc. | Process chamber for dielectric gapfill |
WO2009042137A2 (en) * | 2007-09-25 | 2009-04-02 | Lam Research Corporation | Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses |
WO2009117612A2 (en) * | 2008-03-21 | 2009-09-24 | Applied Materials, Inc. | Shielded lid heater assembly |
US8926788B2 (en) * | 2010-10-27 | 2015-01-06 | Lam Research Ag | Closed chamber for wafer wet processing |
-
2011
- 2011-07-07 US US13/178,430 patent/US20130008602A1/en not_active Abandoned
-
2012
- 2012-06-29 TW TW101123580A patent/TWI569345B/en active
- 2012-07-02 KR KR1020147000452A patent/KR102007546B1/en active IP Right Grant
- 2012-07-02 WO PCT/IB2012/053350 patent/WO2013005155A2/en active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5595241A (en) * | 1994-10-07 | 1997-01-21 | Sony Corporation | Wafer heating chuck with dual zone backplane heating and segmented clamping member |
US5861609A (en) * | 1995-10-02 | 1999-01-19 | Kaltenbrunner; Guenter | Method and apparatus for rapid thermal processing |
US6375746B1 (en) * | 1998-07-10 | 2002-04-23 | Novellus Systems, Inc. | Wafer processing architecture including load locks |
US6331212B1 (en) * | 2000-04-17 | 2001-12-18 | Avansys, Llc | Methods and apparatus for thermally processing wafers |
US20020195128A1 (en) * | 2001-06-22 | 2002-12-26 | S.E.S. Company Limited | Single wafer type substrate cleaning method and apparatus |
US6770424B2 (en) * | 2002-12-16 | 2004-08-03 | Asml Holding N.V. | Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms |
WO2004084278A1 (en) * | 2003-03-20 | 2004-09-30 | Sez Ag | Device and method for wet treating disc-shaped articles |
US7187002B2 (en) * | 2004-02-02 | 2007-03-06 | Matsushita Electric Industrial Co., Ltd. | Wafer collective reliability evaluation device and wafer collective reliability evaluation method |
Also Published As
Publication number | Publication date |
---|---|
WO2013005155A2 (en) | 2013-01-10 |
US20130008602A1 (en) | 2013-01-10 |
TW201304041A (en) | 2013-01-16 |
KR20140040208A (en) | 2014-04-02 |
KR102007546B1 (en) | 2019-08-05 |
TWI569345B (en) | 2017-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2013005155A3 (en) | Apparatus for treating a wafer-shaped article | |
MX2014009634A (en) | Beverage forming device and method with activation button. | |
ZA201100063B (en) | Process device for processing in particular stacked processes goods | |
WO2013035019A3 (en) | Apparatus for treating surfaces of wafer-shaped articles | |
WO2012018581A3 (en) | Liquid chemical deposition apparatus and process and products therefrom | |
WO2014090350A3 (en) | Cleaning apparatus with a fluid container and heating system | |
MX354385B (en) | Plastic containers, base configurations for plastic containers, and systems, methods, and base molds thereof. | |
MX2012013654A (en) | Method for sterilisation of used absorbent sanitary products. | |
PL2342378T3 (en) | Method for processing laundry and laundry treatment device suitable for carrying out the method | |
EP2154269A4 (en) | Method for processing silicon base material, article processed by the method, and processing apparatus | |
WO2014163744A3 (en) | Modular substrate heater for efficient thermal cycling | |
SG195294A1 (en) | Machine and method for the automatic preparation of intravenous medication | |
TW200746285A (en) | Device and method for wet treating plate-like substrates | |
PL2167224T3 (en) | Apparatus and method for the wet chemical treatment of products | |
ZA201403476B (en) | Luminescent borates, materials and articles incorporating such borates, and methods and apparatus for their production and use in article authentication | |
WO2013144782A3 (en) | Apparatus and method for liquid treatment of wafer-shaped articles | |
HK1122777A1 (en) | Blank, box, apparatus and process for packaging elongated articles | |
ZA201403475B (en) | Luminescent borates, materials and articles incorporating such borates, and methods and apparatus for their production and use in article authentication | |
PH12014502213A1 (en) | Dispenser with holding system for receptacles of different sizes | |
MX2012013652A (en) | Process for sterilising absorbent sanitary products. | |
WO2013124235A3 (en) | Apparatus for the heat-treatment of food products, having an integrated handling device | |
MX2013009730A (en) | Food product orienting and loading apparatus. | |
AU2013218107A8 (en) | Apparatus for heat shrinking a package and method for heat shrinking a package | |
MY151608A (en) | Sheet handling apparatus | |
TWI346354B (en) | Device and method for liquid treating disc-like articles |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12808142 Country of ref document: EP Kind code of ref document: A2 |
|
ENP | Entry into the national phase |
Ref document number: 20147000452 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12808142 Country of ref document: EP Kind code of ref document: A2 |